US3762011A - Method of fabricating a capillary heat pipe wick - Google Patents
Method of fabricating a capillary heat pipe wick Download PDFInfo
- Publication number
- US3762011A US3762011A US00208825A US3762011DA US3762011A US 3762011 A US3762011 A US 3762011A US 00208825 A US00208825 A US 00208825A US 3762011D A US3762011D A US 3762011DA US 3762011 A US3762011 A US 3762011A
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- binder
- heat pipe
- particles
- capillary
- wick
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Links
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- 238000000034 method Methods 0.000 claims description 11
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 9
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229940072049 amyl acetate Drugs 0.000 claims description 4
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- QCCDLTOVEPVEJK-UHFFFAOYSA-N phenylacetone Chemical compound CC(=O)CC1=CC=CC=C1 QCCDLTOVEPVEJK-UHFFFAOYSA-N 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
- 229920006397 acrylic thermoplastic Polymers 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
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- 229910052791 calcium Inorganic materials 0.000 claims description 3
- 239000011575 calcium Substances 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
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- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 235000013824 polyphenols Nutrition 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims description 3
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- 239000010937 tungsten Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000012530 fluid Substances 0.000 abstract description 17
- 239000002002 slurry Substances 0.000 abstract description 13
- 239000000725 suspension Substances 0.000 abstract description 4
- 238000001704 evaporation Methods 0.000 abstract description 3
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- 230000032258 transport Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
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- 230000005494 condensation Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
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- 238000005304 joining Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 241001427367 Gardena Species 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
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- 238000009834 vaporization Methods 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/002—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of porous nature
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
Definitions
- ABSTRACT A conformal capillary wick for a heat pipe is fabricated by preparing a slurry composed of an organic solvent containing an organic binder in solution and powder particles of relatively high thermal conductivity in suspension; applying a layer of the slurry to the inner wall surface of the heat pipe casing, evaporating the solvent from the layer to recover the binder and utilize the surface tension forces of the binder to draw the particles together into a highly compacted condition wherein the particles are bonded to one another and to the casing wall by the binder, and the'particles and binder define a myriad of capillary passages extending throughout and opening through the surfaces of the layer; and curing the binder to form a dimensionally stable capillary 3 6/1944 g 62/515 X structure providing a capillary wick for transporting 3 E working fluid condensate from the condenser section e man 3,675,711 7 1972 Bilinski et a1 165/105 x to the evapmator 56c
- a heat pipe is a thermal transport device having a hermetic casing with evaporator and condenser sections and containing a working fluid and a capillary wick structure extending between the evaporator and condenser sections.
- Continuous operation of the heat pipe requires continuous flow of working fluid vapor from the evaporator section to the condenser section and continuous condensate .flow from the condenser section to the evaporator section.
- the vapor pressure differential between the evaporator and condenser sections provides the force for transporting vapor continuously from the evaporator section to the condenser section.
- Capillary force is utilized to transport the working fluid condensate from the condenser section to the evaporator section.
- a heat pipe is equipped with an internal capillary structure extending between the evaporator and condenser sections.
- capillary structures are commonly referred to .as capillary wicks, or simply wicks, and are constructed of .variousporous materials.
- the most widely used wick materials are woven quartz, wire mesh, and sintered metal powders and fibers. Listed below are prior art patents of interest in this connection:
- heat pipe wicks are generally fabricated externally. of the heat pipes and then mounted or secured within the pipe casings in various ways, as by bonding, spot welding, brazing, or sintering orwiththe aid of suitable positioning means.
- the existing wicks and mounting methods possess certain disadvantages which the present disclosure overcomes. Among the foremost of these disadvantagesare the following.
- a bonding agent which is used to secure the wicktothe heat pipe wall often infiltrates and plugs the capillary-passages in the wick, thereby restricting capillary flow of condensate through the wick. It is difficult and often impossible to apply the existing wicks to heatpipes of complex surface geometry. Regulation of the wick porosity, i.e., capillary pore size, is difficult.
- the disclosure provides a heat pipeiwith a novel capillary wick structure or wick applied to the wall of the heat pipe casing.
- wick is composed of powder particles of relatively high thermal conductivity joined to ,one another and to the casing wall by a'binder.
- the particles are highly compacted and define with the binder a myriad of capillary passages extending throughout and opening through the surfaces of the wick.
- a unique feature of the wick resides in the fact that the binder serves the dual function of joining the particles to one another and joining the wick to the wall of the heat pipe casing.
- a slurry is prepared composed of an or ganic solvent containing an organic binder in solution and powder particles of relatively high thermal conduc- .tivity in suspension. A layer of this slurry is brushed,
- FIG. 1 illustrates a heat pipe with a capillary wick according to the invention
- FIG. 2 is an enlargement of the capillary wick
- FIG. 3 is a diagram of the present method of forming the capillary wick.
- the heat pipe 10 shown in FIG. 1 has a hermeticcasing 12 with evaporator and condenser sections 14 and 145. Applied to the inner wall of the heatpipe casing is a capillary wick structure or wick 18- extending between the evaporator and condenser sections. A working fluid (not shown) is confined within the casing.
- the wick .18 is composed of powder particles 20 bonded to one another and to the inner wall surface of the heat pipe casing 12 by an organic binder 22, which forms fine interconnecting bonds 24 between the particles. These particles and bonds define a myriad of interconnecting capillary passages 26 which extend throughout and open through the surfaces of the wick.
- a unique feature of the wick resides inthe fact that the binder 22 provides both the bonds between the particles 20 and the bond between wick and the casing wall.
- the heat pipe 10 In operation of the heat pipe 10, its evaporator and condenser sections l4, 16 are placed in heat transfer relation to a heat source and a heat sink, respectively. Heat inflow into the evaporator section 14 from the heat source vaporizes the working fluid within the section. The vapor pressure differential between the sections 14, 16 causes flow of the resulting fluid vapor to the condenser section where the vapor is condensed by heat rejection to the heat sink. The resulting condensate then returns to the evaporator section to repeat the process by capillary flow through the wick 18.
- the working fluid transports thermal energy from the heat source to the heat sink by a closed thermodynamic cycle involving continuous evaporation of the fluid in the evaporator section and condensation of the fluid in the condenser section.
- FIG. 3 is a diagram of the present method of forming or fabricating the capillary wick 18.
- the initial step of the method involves preparation of a slurry composed of an organic solvent containing the powder particles in suspension and the organic binder 22 in solution. A layer of this slurry is applied to the inner wall surface of the heat pipe casing 12 by brushing, spraying or any other convenient method of application. After application of the layer, the solvent in the layer is evaporated, leaving the powder particles 20 and the binder 22 in FIG. 2. During this evaporation, the surface tension forces of the binder draw the particles together into the highly compacted state of FIG. 2 to form the capillary passages 26. The binder is then cured to a dimensionally stable state to provide the final capillary wick 18. The binder also bonds the wick to the wall of the heat pipe casing.
- powder particles may be employed in the practice of the disclosure.
- the preferred powders are those of aluminum oxide, silicon carbide, aluminum, copper, magnesium, zinc, calcium, 2
- the preferred binders are methacylates, polyesters, polyimides, phenolics, acrylics, collodion, and Duco cement.
- the preferred solvents are Toulene, methyl ethyl ketone, methyl benzye ketone, amyl acetate, acetone, and dimethyl formamide.
- the powder particles, binder, and solvent used in the practice of the invention will be compatible with one another and with the working fluid and operating requirements and parameters of the heat pipe. That is to say, the solvent used must be appropriate for the powder but not dissolve, degrade, or otherwise adversely affects the binder. Also, the particles and binder must be chemically inert to the heat pipe working fluid, and must be immune to degradation and other adverse affects at temperatures at least up to the maximum operating temperature of the heat pipe. Moreover, in some applications, involving the cooling of electrical components, such as transistors, the particles and binder must produce a wick of high dielectric strength such that the wick will not short out the components when the latter are exposed directly to the heat pipe working fluid.
- thermosetting and thermo plastic binders may be used in the disclosure, the thermoplastic binders, of course, being restricted to heat pipes whose operating temperature is below the softening temperature of the binder. Curing of the thermosetting binders is accomplished by heating. Curing of thermoplastic binders is accomplished by drying and cooling, if necessary.
- Wicks according to the disclosure have been successfully fabricated. These wicks were fabricated from powders of aluminum oxide, silicon carbide, aluminum, copper, and nickel using the following binder/solvent combinations: collodian/amyl acetate, Duco cementlacetone, polyimide/dimethyl formamide. In each case,
- the slurry prepared from the selected particles, binder, and solvent was applied to the heat pipe wall after which the solvetn was allowed to evaporate.
- the binder wws then cured by the application of heat.
- These wicks utilized a binder/solvent solution containing on the order of 10 percent binder and percent solvent by volume and powder particles of a mesh size in the range of 50 200.
- an important advantage of the disclosure is its ability to provide a capillary wick conforming to virtually any heat pipe surface geometry from the most simple to the most complex.
- the wick thickness may be easily controlled by controlling the thickness of the slurry layer which is initially applied to the heat pipe casing.
- the wick porosity may be regulated and controlled by varying the particle size and/or the concentration of solvent to binder used in the slurry.
- said powder particles are particles of a structural metal selected from the class consisting of aluminum oxide, silicon carbide, aluminum, copper, nickel, magnesium, zinc, calcium, silver, gold, titanium, niobium, tungsten, zirconium, vanadium, chromium, iron, and cobalt, or an alloy of the same;
- said binder is selected from the class consisting of methacylates, polyester, polyimides, phenolics, and acrylics;
- said solvent is selected from the class consisting of toluene, methyl ethyl ketone, methyl benzyl ketone, amyl acetate, acetone, and dimethyl formamide.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Chemical & Material Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A conformal capillary wick for a heat pipe is fabricated by preparing a slurry composed of an organic solvent containing an organic binder in solution and powder particles of relatively high thermal conductivity in suspension; applying a layer of the slurry to the inner wall surface of the heat pipe casing, evaporating the solvent from the layer to recover the binder and utilize the surface tension forces of the binder to draw the particles together into a highly compacted condition wherein the particles are bonded to one another and to the casing wall by the binder, and the particles and binder define a myriad of capillary passages extending throughout and opening through the surfaces of the layer; and curing the binder to form a dimensionally stable capillary structure providing a capillary wick for transporting working fluid condensate from the condenser section to the evaporator section of the heat pipe.
Description
United States Patent 1191.
Staudhammer et al.
[ 1 Oct. 2, 1973 METHOD OF FABRICATING A CAPILLARY HEAT PIPE WICK [75 lnvehtorsfKafl 1 1 Staudhamrner, Gardena,
Bruce D. Marcus, Los Angeles, both of Calif.
[73] Assignee: TRW Inc., Redondo Beach, Calif.
22 Filed: Dec. 16,1971
211 Appl.No.:208,825'
[52] US. Cl. 29/1573 R, 165/105 [51] Int. Cl B2ld 53/02, B2lp 15/26 [58] Field of Search 29/1573 R, 157 R;
[56] References Cited UNITED STATES PATENTS 3,666,006 5/1972 Valyi 165/164 Primary ExaminerChar1es W. Lanham Assistant ExaminerD. C. Reiley, 111 Attorney-Daniel T. Anderson et al.
[57] ABSTRACT A conformal capillary wick for a heat pipe is fabricated by preparing a slurry composed of an organic solvent containing an organic binder in solution and powder particles of relatively high thermal conductivity in suspension; applying a layer of the slurry to the inner wall surface of the heat pipe casing, evaporating the solvent from the layer to recover the binder and utilize the surface tension forces of the binder to draw the particles together into a highly compacted condition wherein the particles are bonded to one another and to the casing wall by the binder, and the'particles and binder define a myriad of capillary passages extending throughout and opening through the surfaces of the layer; and curing the binder to form a dimensionally stable capillary 3 6/1944 g 62/515 X structure providing a capillary wick for transporting 3 E working fluid condensate from the condenser section e man 3,675,711 7 1972 Bilinski et a1 165/105 x to the evapmator 56cm" the heat FOREIGN PATENTS OR APPLICATIONS 2 Claims, 3 Drawing Figures 531,112 12/1940 Great Britain 165/180 PREPARE SLURRY OF POWDER BINDER SOLVENT APPLY SLURRY TO HEAT PIPE EVAPORATE SOLVENT COMPACT POWDER PARTICLES CURE BINDER PATENTEDUBT 2 m 3.762.011
HEAT
SOURCE PREPARE SLURRY 4. 3 OF POWDER Q EJfNDER SOLVENT APPLY SLURRY TO HEAT PIPE EVAPORATE SOLVENT- COMPACT POWDER PARTICLES ICURE BINDER] METHOD OF FABRICATING A CAPILLARY HEAT PIPE WICK BACKGROUND OF THE DISCLOSURE 1. Field of the Disclosure This disclosure relates generally to the field of heat transfer and more particularly to a novel heat pipe and method of forming the capillary wick structure of. the heat pipe.
2. Prior Art Essentially, a heat pipe is a thermal transport device having a hermetic casing with evaporator and condenser sections and containing a working fluid and a capillary wick structure extending between the evaporator and condenser sections. When the evaporator and condenser sections are placed in heat transfer relation to a heat source and a heat sink, respectively, thermal energy is transmitted through the heat pipe from heat source to the heat sink by a closed thermodynamic cycle of the working fluid. This thermodynamic cycle involves vaporization of the working fluid witin the evaporator section by heat inflow from the heat source and condensation of the fluid within the condenser section by heat rejection to the ,heat sink.
Continuous operation of the heat pipe requires continuous flow of working fluid vapor from the evaporator section to the condenser section and continuous condensate .flow from the condenser section to the evaporator section. The vapor pressure differential between the evaporator and condenser sections provides the force for transporting vapor continuously from the evaporator section to the condenser section. Capillary force is utilized to transport the working fluid condensate from the condenser section to the evaporator section. 1
To this end, a heat pipe is equipped with an internal capillary structure extending between the evaporator and condenser sections. Such capillary structures are commonly referred to .as capillary wicks, or simply wicks, and are constructed of .variousporous materials. At the present time, the most widely used wick materials are woven quartz, wire mesh, and sintered metal powders and fibers. Listed below are prior art patents of interest in this connection:
l,938,l70 3,lll,396 3,413,239 2,996,389 3,285,873 3,485,296 3,090,094 3,288,615 3.563,309
At the present time, heat pipe wicks are generally fabricated externally. of the heat pipes and then mounted or secured within the pipe casings in various ways, as by bonding, spot welding, brazing, or sintering orwiththe aid of suitable positioning means.
The existing wicks and mounting methods possess certain disadvantages which the present disclosure overcomes. Among the foremost of these disadvantagesare the following. A bonding agent which is used to secure the wicktothe heat pipe wall often infiltrates and plugs the capillary-passages in the wick, thereby restricting capillary flow of condensate through the wick. It is difficult and often impossible to apply the existing wicks to heatpipes of complex surface geometry. Regulation of the wick porosity, i.e., capillary pore size, is difficult.
SUMMARY OFTHE DISCLOSURE According to one of its aspects, the disclosure provides a heat pipeiwith a novel capillary wick structure or wick applied to the wall of the heat pipe casing. The
wick is composed of powder particles of relatively high thermal conductivity joined to ,one another and to the casing wall by a'binder. The particles are highly compacted and define with the binder a myriad of capillary passages extending throughout and opening through the surfaces of the wick. A unique feature of the wick resides in the fact that the binder serves the dual function of joining the particles to one another and joining the wick to the wall of the heat pipe casing.
Another aspect of the disclosure is concerned with a unique method of fabricating the wick. According to this method, a slurry is prepared composed of an or ganic solvent containing an organic binder in solution and powder particles of relatively high thermal conduc- .tivity in suspension. A layer of this slurry is brushed,
BRIEF DESCRIPTION OF THE DRAWINGS In the drawings:
FIG. 1 illustrates a heat pipe with a capillary wick according to the invention;
FIG. 2 is an enlargement of the capillary wick; and
FIG. 3 is a diagram of the present method of forming the capillary wick.
DESCRIPTION OF THE PREFERRED EMBODIMENTS The heat pipe 10 shown in FIG. 1 has a hermeticcasing 12 with evaporator and condenser sections 14 and 145. Applied to the inner wall of the heatpipe casing is a capillary wick structure or wick 18- extending between the evaporator and condenser sections. A working fluid (not shown) is confined within the casing.
Turning toFIG. 2, the wick .18 is composed of powder particles 20 bonded to one another and to the inner wall surface of the heat pipe casing 12 by an organic binder 22, which forms fine interconnecting bonds 24 between the particles. These particles and bonds define a myriad of interconnecting capillary passages 26 which extend throughout and open through the surfaces of the wick. A unique feature of the wick resides inthe fact that the binder 22 provides both the bonds between the particles 20 and the bond between wick and the casing wall.
In operation of the heat pipe 10, its evaporator and condenser sections l4, 16 are placed in heat transfer relation to a heat source and a heat sink, respectively. Heat inflow into the evaporator section 14 from the heat source vaporizes the working fluid within the section. The vapor pressure differential between the sections 14, 16 causes flow of the resulting fluid vapor to the condenser section where the vapor is condensed by heat rejection to the heat sink. The resulting condensate then returns to the evaporator section to repeat the process by capillary flow through the wick 18. Thus, the working fluid transports thermal energy from the heat source to the heat sink by a closed thermodynamic cycle involving continuous evaporation of the fluid in the evaporator section and condensation of the fluid in the condenser section.
Reference is now made to FIG. 3 which is a diagram of the present method of forming or fabricating the capillary wick 18. The initial step of the method involves preparation of a slurry composed of an organic solvent containing the powder particles in suspension and the organic binder 22 in solution. A layer of this slurry is applied to the inner wall surface of the heat pipe casing 12 by brushing, spraying or any other convenient method of application. After application of the layer, the solvent in the layer is evaporated, leaving the powder particles 20 and the binder 22 in FIG. 2. During this evaporation, the surface tension forces of the binder draw the particles together into the highly compacted state of FIG. 2 to form the capillary passages 26. The binder is then cured to a dimensionally stable state to provide the final capillary wick 18. The binder also bonds the wick to the wall of the heat pipe casing.
A variety of powder particles, binders, and solvents may be employed in the practice of the disclosure. The preferred powders are those of aluminum oxide, silicon carbide, aluminum, copper, magnesium, zinc, calcium, 2
silver, gold, titanium, niobium, tungsten, zirconium, vanadiam, chromium, iron, and cobalt and alloys of the listed materials. The preferred binders are methacylates, polyesters, polyimides, phenolics, acrylics, collodion, and Duco cement. The preferred solvents are Toulene, methyl ethyl ketone, methyl benzye ketone, amyl acetate, acetone, and dimethyl formamide.
It will be understood that the powder particles, binder, and solvent used in the practice of the invention will be compatible with one another and with the working fluid and operating requirements and parameters of the heat pipe. That is to say, the solvent used must be appropriate for the powder but not dissolve, degrade, or otherwise adversely affects the binder. Also, the particles and binder must be chemically inert to the heat pipe working fluid, and must be immune to degradation and other adverse affects at temperatures at least up to the maximum operating temperature of the heat pipe. Moreover, in some applications, involving the cooling of electrical components, such as transistors, the particles and binder must produce a wick of high dielectric strength such that the wick will not short out the components when the latter are exposed directly to the heat pipe working fluid. Both thermosetting and thermo plastic binders may be used in the disclosure, the thermoplastic binders, of course, being restricted to heat pipes whose operating temperature is below the softening temperature of the binder. Curing of the thermosetting binders is accomplished by heating. Curing of thermoplastic binders is accomplished by drying and cooling, if necessary.
Wicks according to the disclosure have been successfully fabricated. These wicks were fabricated from powders of aluminum oxide, silicon carbide, aluminum, copper, and nickel using the following binder/solvent combinations: collodian/amyl acetate, Duco cementlacetone, polyimide/dimethyl formamide. In each case,
the slurry prepared from the selected particles, binder, and solvent was applied to the heat pipe wall after which the solvetn was allowed to evaporate. The binder wws then cured by the application of heat. These wicks utilized a binder/solvent solution containing on the order of 10 percent binder and percent solvent by volume and powder particles of a mesh size in the range of 50 200.
As noted earlier, an important advantage of the disclosure is its ability to provide a capillary wick conforming to virtually any heat pipe surface geometry from the most simple to the most complex. Moreover, the wick thickness may be easily controlled by controlling the thickness of the slurry layer which is initially applied to the heat pipe casing. The wick porosity may be regulated and controlled by varying the particle size and/or the concentration of solvent to binder used in the slurry.
What is claimed as new in support of Letters Patent 1. The method of forming a capillary wick for a heat pipe, comprising the steps of:
selecting powder particles of relatively high thermal conductivity and an organic binder both compatible with the working fluid and operating requirements of the heat pipe and an organic solvent for the binder;
preparing a slurry composed of said solvent containing said binder in solution and said particles in suspension;
applying to the inner wall surface of the heat pipe casing a layer of said slurry extending from the evaporator section to the condenser section of the casing;
vaporising the solvent from the layer to recover said binder and utilize the surface tension forces of the binder to draw said particles together into a highly compacted condition wherein the particles are bonded to one another and to the casing wall surface by the binder, and the particles and binder define a myriad of interconnecting capillary passages extending throughout and opening through the surface of said layer; and
curing said binder to form a dimensionally stable capillary structure providing said wick.
2. The method according to claim 1 wherein:
said powder particles are particles of a structural metal selected from the class consisting of aluminum oxide, silicon carbide, aluminum, copper, nickel, magnesium, zinc, calcium, silver, gold, titanium, niobium, tungsten, zirconium, vanadium, chromium, iron, and cobalt, or an alloy of the same;
said binder is selected from the class consisting of methacylates, polyester, polyimides, phenolics, and acrylics; and
said solvent is selected from the class consisting of toluene, methyl ethyl ketone, methyl benzyl ketone, amyl acetate, acetone, and dimethyl formamide.
* i t I
Claims (1)
- 2. The method according to claim 1 wherein: said powder particles are particles of a structural metal selected from the class consisting of aluminum oxide, silicon carbide, aluminum, copper, nickel, magnesium, zinc, calcium, silver, gold, titanium, niobium, tungsten, zirconium, vanadium, chromium, iron, and cobalt, or an alloy of the same; said binder is selected from the class consisting of methacylates, polyester, polyimides, phenolics, and acrylics; and said solvent is selected from the class consisting of toluene, methyl ethyl ketone, methyl benzyl ketone, amyl acetate, acetone, and dimethyl formamide.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US20882571A | 1971-12-16 | 1971-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3762011A true US3762011A (en) | 1973-10-02 |
Family
ID=22776203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US00208825A Expired - Lifetime US3762011A (en) | 1971-12-16 | 1971-12-16 | Method of fabricating a capillary heat pipe wick |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US3762011A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4011104A (en) * | 1973-10-05 | 1977-03-08 | Hughes Aircraft Company | Thermoelectric system |
| US4129181A (en) * | 1977-02-16 | 1978-12-12 | Uop Inc. | Heat transfer surface |
| US4313492A (en) * | 1979-12-20 | 1982-02-02 | International Business Machines Corporation | Micro helix thermo capsule |
| US4474170A (en) * | 1981-08-06 | 1984-10-02 | The United States Of America As Represented By The United States Department Of Energy | Glass heat pipe evacuated tube solar collector |
| US4885129A (en) * | 1988-10-24 | 1989-12-05 | The United States Of America As Represented By The Secretary Of The Air Force | Method of manufacturing heat pipe wicks |
| US4929414A (en) * | 1988-10-24 | 1990-05-29 | The United States Of America As Represented By The Secretary Of The Air Force | Method of manufacturing heat pipe wicks and arteries |
| USH971H (en) | 1988-10-24 | 1991-10-01 | The United States Of America As Represented By The Secretary Of The Air Force | Regidized porous material and method |
| US5101560A (en) * | 1988-10-24 | 1992-04-07 | The United States Of America As Represented By The Secretary Of The Air Force | Method for making an anisotropic heat pipe and wick |
| WO2001089745A1 (en) * | 2000-05-22 | 2001-11-29 | Materials Innovation, Inc. | Porous heat sink for forced convective flow and method of making therefore |
| US6524524B1 (en) * | 2001-10-12 | 2003-02-25 | Auras Technology Ltd. | Method for making a heat dissipating tube |
| US20030042006A1 (en) * | 2001-08-28 | 2003-03-06 | Advanced Materials Technologies Pte. Ltd. | Advanced microelectronic heat dissipation package and method for its manufacture |
| US20040163796A1 (en) * | 2003-02-20 | 2004-08-26 | Wu Wei-Fang | Circulative cooling apparatus |
| US20040244951A1 (en) * | 1999-05-12 | 2004-12-09 | Dussinger Peter M. | Integrated circuit heat pipe heat spreader with through mounting holes |
| US20050022975A1 (en) * | 2003-06-26 | 2005-02-03 | Rosenfeld John H. | Brazed wick for a heat transfer device and method of making same |
| US20050022976A1 (en) * | 2003-06-26 | 2005-02-03 | Rosenfeld John H. | Heat transfer device and method of making same |
| WO2005006395A3 (en) * | 2003-06-26 | 2005-04-28 | Thermal Corp | Heat transfer device and method of making same |
| WO2006010541A1 (en) * | 2004-07-23 | 2006-02-02 | BSH Bosch und Siemens Hausgeräte GmbH | Thermosiphon |
| US20060243425A1 (en) * | 1999-05-12 | 2006-11-02 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
| US20080023179A1 (en) * | 2006-07-27 | 2008-01-31 | General Electric Company | Heat transfer enhancing system and method for fabricating heat transfer device |
| US20090236085A1 (en) * | 2008-03-19 | 2009-09-24 | Chin-Wen Wang | Method for manufacturing supporting body within an isothermal plate and product of the same |
| US20100300655A1 (en) * | 2009-05-27 | 2010-12-02 | Furui Precise Component (Kunshan) Co., Ltd. | Heat pipe |
| US8235096B1 (en) * | 2009-04-07 | 2012-08-07 | University Of Central Florida Research Foundation, Inc. | Hydrophilic particle enhanced phase change-based heat exchange |
| US8434225B2 (en) | 2009-04-07 | 2013-05-07 | University Of Central Florida Research Foundation, Inc. | Hydrophilic particle enhanced heat exchange and method of manufacture |
| US20130168052A1 (en) * | 2011-12-30 | 2013-07-04 | Celsia Technologies Taiwan, Inc. | Heat pipe and composition of capillary wick thereof |
| US20170363007A1 (en) * | 2016-06-15 | 2017-12-21 | United Technologies Corporation | Isothermalized cooling of gas turbine engine components |
| RU2653392C1 (en) * | 2017-01-26 | 2018-05-08 | Государственное научное учреждение "Институт порошковой металлургии" | Method of producing the powder capillary structure in long-dimensional tubular elements of thermal pipes |
| CN111684231A (en) * | 2018-03-19 | 2020-09-18 | 保来得株式会社 | Method for making core |
| CN113218224A (en) * | 2020-01-21 | 2021-08-06 | 华为技术有限公司 | Manufacturing method of soaking plate and soaking plate |
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| US4011104A (en) * | 1973-10-05 | 1977-03-08 | Hughes Aircraft Company | Thermoelectric system |
| US4129181A (en) * | 1977-02-16 | 1978-12-12 | Uop Inc. | Heat transfer surface |
| US4313492A (en) * | 1979-12-20 | 1982-02-02 | International Business Machines Corporation | Micro helix thermo capsule |
| US4474170A (en) * | 1981-08-06 | 1984-10-02 | The United States Of America As Represented By The United States Department Of Energy | Glass heat pipe evacuated tube solar collector |
| USH971H (en) | 1988-10-24 | 1991-10-01 | The United States Of America As Represented By The Secretary Of The Air Force | Regidized porous material and method |
| US4929414A (en) * | 1988-10-24 | 1990-05-29 | The United States Of America As Represented By The Secretary Of The Air Force | Method of manufacturing heat pipe wicks and arteries |
| US5101560A (en) * | 1988-10-24 | 1992-04-07 | The United States Of America As Represented By The Secretary Of The Air Force | Method for making an anisotropic heat pipe and wick |
| US5320866A (en) * | 1988-10-24 | 1994-06-14 | The United States Of America As Represented By The Secretary Of The Air Force | Method of wet coating a ceramic substrate with a liquid suspension of metallic particles and binder applying similar dry metallic particles onto the wet surface, then drying and heat treating the article |
| US4885129A (en) * | 1988-10-24 | 1989-12-05 | The United States Of America As Represented By The Secretary Of The Air Force | Method of manufacturing heat pipe wicks |
| US20060243425A1 (en) * | 1999-05-12 | 2006-11-02 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
| US20050217826A1 (en) * | 1999-05-12 | 2005-10-06 | Dussinger Peter M | Integrated circuit heat pipe heat spreader with through mounting holes |
| US6896039B2 (en) * | 1999-05-12 | 2005-05-24 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
| US20040244951A1 (en) * | 1999-05-12 | 2004-12-09 | Dussinger Peter M. | Integrated circuit heat pipe heat spreader with through mounting holes |
| WO2001089745A1 (en) * | 2000-05-22 | 2001-11-29 | Materials Innovation, Inc. | Porous heat sink for forced convective flow and method of making therefore |
| EP1296373A3 (en) * | 2001-08-28 | 2006-10-04 | Advanced Materials Technologies, Pte Ltd. | Advanced microelectronic heat dissipation package and method for its manufacture |
| US6935022B2 (en) * | 2001-08-28 | 2005-08-30 | Advanced Materials Technologies Pte, Ltd. | Advanced microelectronic heat dissipation package and method for its manufacture |
| US20060000584A1 (en) * | 2001-08-28 | 2006-01-05 | Advanced Materials Technology Pte. Ltd. | Advanced microelectronic heat dissipation package and method for its manufacture |
| US20050284616A1 (en) * | 2001-08-28 | 2005-12-29 | Advanced Materials Technology Pte. Ltd. | Advanced microelectronic heat dissipation package and method for its manufacture |
| US20030042006A1 (en) * | 2001-08-28 | 2003-03-06 | Advanced Materials Technologies Pte. Ltd. | Advanced microelectronic heat dissipation package and method for its manufacture |
| US6524524B1 (en) * | 2001-10-12 | 2003-02-25 | Auras Technology Ltd. | Method for making a heat dissipating tube |
| US20040163796A1 (en) * | 2003-02-20 | 2004-08-26 | Wu Wei-Fang | Circulative cooling apparatus |
| US7007746B2 (en) * | 2003-02-20 | 2006-03-07 | Delta Electronics, Inc. | Circulative cooling apparatus |
| US20060124281A1 (en) * | 2003-06-26 | 2006-06-15 | Rosenfeld John H | Heat transfer device and method of making same |
| US20050189091A1 (en) * | 2003-06-26 | 2005-09-01 | Rosenfeld John H. | Brazed wick for a heat transfer device and method of making same |
| WO2005005903A3 (en) * | 2003-06-26 | 2005-07-28 | Thermal Corp | Brazed wick for a heat transfer device and method of making same |
| US20070089865A1 (en) * | 2003-06-26 | 2007-04-26 | Rosenfeld John H | Brazed wick for a heat transfer device and method of making same |
| WO2005006395A3 (en) * | 2003-06-26 | 2005-04-28 | Thermal Corp | Heat transfer device and method of making same |
| US20050022976A1 (en) * | 2003-06-26 | 2005-02-03 | Rosenfeld John H. | Heat transfer device and method of making same |
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| US20050205243A1 (en) * | 2003-06-26 | 2005-09-22 | Rosenfeld John H | Brazed wick for a heat transfer device and method of making same |
| US7028759B2 (en) * | 2003-06-26 | 2006-04-18 | Thermal Corp. | Heat transfer device and method of making same |
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