WO2005108897A3 - Heat transfer device and method of making same - Google Patents

Heat transfer device and method of making same Download PDF

Info

Publication number
WO2005108897A3
WO2005108897A3 PCT/US2004/032156 US2004032156W WO2005108897A3 WO 2005108897 A3 WO2005108897 A3 WO 2005108897A3 US 2004032156 W US2004032156 W US 2004032156W WO 2005108897 A3 WO2005108897 A3 WO 2005108897A3
Authority
WO
WIPO (PCT)
Prior art keywords
transfer device
heat transfer
making same
species
diameter
Prior art date
Application number
PCT/US2004/032156
Other languages
French (fr)
Other versions
WO2005108897A2 (en
Inventor
John H Rosenfeld
John W Bilski
James E Lindemuth
Donald M Ernst
Original Assignee
Thermal Corp
John H Rosenfeld
John W Bilski
James E Lindemuth
Donald M Ernst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermal Corp, John H Rosenfeld, John W Bilski, James E Lindemuth, Donald M Ernst filed Critical Thermal Corp
Priority to DE112004002839T priority Critical patent/DE112004002839T5/en
Publication of WO2005108897A2 publication Critical patent/WO2005108897A2/en
Publication of WO2005108897A3 publication Critical patent/WO2005108897A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/04—Fastening; Joining by brazing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A capillary structure (90) for a heat transfer device, such as a heat pipe is provided having a plurality of particles including a first species (71) having a first diameter and a second species (73) having a second diameter that are joined together to form a capillary structure having homogenous layers of particles.
PCT/US2004/032156 2004-04-21 2004-10-01 Heat transfer device and method of making same WO2005108897A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112004002839T DE112004002839T5 (en) 2004-04-21 2004-10-01 Device for heat transport and method for its production

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/829,104 2004-04-21
US10/829,104 US20050022976A1 (en) 2003-06-26 2004-04-21 Heat transfer device and method of making same

Publications (2)

Publication Number Publication Date
WO2005108897A2 WO2005108897A2 (en) 2005-11-17
WO2005108897A3 true WO2005108897A3 (en) 2006-01-05

Family

ID=35320832

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/032156 WO2005108897A2 (en) 2004-04-21 2004-10-01 Heat transfer device and method of making same

Country Status (4)

Country Link
US (1) US20050022976A1 (en)
CN (1) CN1961191A (en)
DE (1) DE112004002839T5 (en)
WO (1) WO2005108897A2 (en)

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US20100294475A1 (en) * 2009-05-22 2010-11-25 General Electric Company High performance heat transfer device, methods of manufacture thereof and articles comprising the same
CN103000595B (en) * 2011-09-08 2015-11-04 北京芯铠电子散热技术有限责任公司 A kind of multidirectional turnover phase change heat-transfer device and preparation method thereof
CN103105084B (en) * 2011-11-10 2015-08-12 索士亚科技股份有限公司 The composition structure of heat pipe and capillary structure thereof
US20170146273A1 (en) * 2015-11-23 2017-05-25 L-3 Communications Corporation Evaporator Assembly
EP3390948B1 (en) * 2015-12-16 2020-08-19 Carrier Corporation Heat transfer tube for heat exchanger
FR3065279B1 (en) 2017-04-18 2019-06-07 Euro Heat Pipes EVAPORATOR WITH OPTIMIZED VAPORIZATION INTERFACE
CN108323099B (en) * 2018-01-16 2024-03-29 南昌大学 Fin type heat pipe coupling radiator
CN110686541A (en) * 2018-07-04 2020-01-14 广州力及热管理科技有限公司 Method for manufacturing capillary structure
US11480394B2 (en) 2018-07-18 2022-10-25 Aavid Thermal Corp. Heat pipes having wick structures with variable permeability
CN111761050B (en) * 2019-04-01 2022-06-03 广州力及热管理科技有限公司 Method for manufacturing capillary structure by using metal slurry
CN111207619B (en) * 2020-01-15 2021-04-06 郑州轻工业大学 Efficient boiling reinforced heat exchange tube and manufacturing method thereof
AT524235B1 (en) * 2020-10-09 2022-04-15 Miba Sinter Austria Gmbh heat transport device
JPWO2022230922A1 (en) * 2021-04-28 2022-11-03
CN113532168A (en) * 2021-07-22 2021-10-22 鑫佰图科技(惠州)有限公司 Novel liquid-cooled vapor chamber sintering process
CN114857967B (en) * 2022-05-17 2024-04-16 中国科学院工程热物理研究所 Ultrathin vapor chamber, preparation method thereof and electronic equipment

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Also Published As

Publication number Publication date
DE112004002839T5 (en) 2008-08-28
CN1961191A (en) 2007-05-09
US20050022976A1 (en) 2005-02-03
WO2005108897A2 (en) 2005-11-17

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