CN113532168A - Novel liquid-cooled vapor chamber sintering process - Google Patents
Novel liquid-cooled vapor chamber sintering process Download PDFInfo
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- CN113532168A CN113532168A CN202110827944.6A CN202110827944A CN113532168A CN 113532168 A CN113532168 A CN 113532168A CN 202110827944 A CN202110827944 A CN 202110827944A CN 113532168 A CN113532168 A CN 113532168A
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- vapor chamber
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- 238000005245 sintering Methods 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000003466 welding Methods 0.000 claims abstract description 29
- 238000005219 brazing Methods 0.000 claims abstract description 26
- 239000007789 gas Substances 0.000 claims abstract description 23
- 238000003825 pressing Methods 0.000 claims abstract description 21
- 238000001816 cooling Methods 0.000 claims abstract description 18
- 239000001257 hydrogen Substances 0.000 claims abstract description 16
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 16
- 238000003754 machining Methods 0.000 claims abstract description 16
- 238000007731 hot pressing Methods 0.000 claims abstract description 14
- 238000009792 diffusion process Methods 0.000 claims abstract description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 8
- 238000011049 filling Methods 0.000 claims abstract description 8
- 239000010959 steel Substances 0.000 claims abstract description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 14
- 238000001035 drying Methods 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 230000004907 flux Effects 0.000 claims description 7
- 238000000227 grinding Methods 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- 238000007788 roughening Methods 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 238000002791 soaking Methods 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0283—Means for filling or sealing heat pipes
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Powder Metallurgy (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention relates to the technical field of vapor chambers, and discloses a novel liquid-cooled vapor chamber sintering process, which comprises the following steps: s1, stamping (machining) upper and lower plates of the temperature-equalizing plate; s2, filling a novel liquid cooling sheet on the molded temperature-uniforming plate; and S3, sintering the temperature equalizing plate integrally. The step S3 of performing integral sintering on the uniform temperature plate can be friction welding, diffusion welding or brazing, wherein in the step S1 of stamping (machining) and forming of the upper plate and the lower plate of the uniform temperature plate, the upper plate and the lower plate are cold-pressed together by a cold-pressing die, a cold-pressed workpiece is preheated for 20-40 min under the protection of nitrogen-hydrogen mixed gas at the temperature of 400-550 ℃, and the preheated workpiece is hot-pressed for 8-15 min under the protection of nitrogen-hydrogen mixed gas at the temperature of 600-650 ℃ by a hot-pressing steel die. In the invention, besides the traditional brazing and diffusion welding, the friction welding which is mature at present can be used. The novel liquid-cooled temperature-equalizing plate has the advantages of few and simple processes, no copper powder and aluminum powder sintering, direct adoption of liquid-cooled plates, simple process and high yield.
Description
Technical Field
The invention relates to the technical field of vapor chambers, in particular to a novel liquid-cooled vapor chamber sintering process.
Background
The sintering process of the traditional VC temperature-uniforming plate comprises the following steps: upper and lower plate punch forming, lower plate sintering (copper mesh, copper column and copper powder) and whole plate sintering (diffusion welding and brazing).
The traditional VC temperature-uniforming plate sintering process mainly comprises brazing and diffusion welding, has multiple and complex processes, mainly uses copper powder as a material at present, uses few aluminum powder, and has high sintering cost and low yield at present. Therefore, a novel liquid-cooling temperature-equalizing plate sintering process is provided.
Disclosure of Invention
The invention mainly solves the technical problems in the prior art and provides a novel liquid-cooled vapor chamber sintering process.
In order to achieve the purpose, the invention adopts the following technical scheme that the novel liquid-cooling temperature-equalizing plate sintering process comprises the following steps:
s1, stamping (machining) upper and lower plates of the temperature-equalizing plate;
s2, filling a novel liquid cooling sheet on the molded temperature-uniforming plate;
and S3, sintering the temperature equalizing plate integrally.
Preferably, in the step S3, friction welding, diffusion welding or brazing may be used for the integral sintering of the isothermal plate.
Preferably, in the step S1, in the stamping (machining) molding of the upper and lower plates of the uniform temperature plate, the upper and lower plates are cold-pressed together by using a cold-pressing die, the cold-pressed workpiece is preheated for 20-40 min at 400-550 ℃ under the protection of a nitrogen-hydrogen mixed gas, and the preheated workpiece is hot-pressed for 8-15 min at 600-650 ℃ under the protection of a nitrogen-hydrogen mixed gas by using a hot-pressing steel die, so that the upper and lower plates are sintered together to form the uniform temperature plate.
Preferably, before the cold pressing, a step of grinding and roughening the corresponding surfaces of the upper and lower plates by using a 60-200 mesh abrasive belt is adopted, so as to increase the contact area between the upper and lower plates.
Preferably, the uniform temperature plate body is subjected to aluminum brazing flux spraying or soaking treatment, then taken out and dried in a drying tunnel, the upper plate and the lower plate are subjected to one-time sealing welding in a brazing furnace under the protection of nitrogen at the temperature of 450-650 ℃, and the upper plate and the lower plate are cooled to be below 40 ℃ under the protection of gas.
Preferably, in the step S3 of sintering the temperature-equalizing plate integrally, the process tube is used for vacuumizing the cavity, so that the pressure in the cavity is 5.0 x 10 < -3 > Pa-1.3 x 10 < -2 > Pa.
Advantageous effects
The invention provides a novel liquid-cooled vapor chamber sintering process. The method has the following beneficial effects:
the novel liquid cooling temperature equalizing plate sintering process can use traditional brazing and diffusion welding, and can also use the existing mature friction welding. The novel liquid-cooled temperature-equalizing plate has the advantages of few and simple processes, no copper powder and aluminum powder sintering, direct adoption of liquid-cooled plates, simple process and high yield.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.
FIG. 1 is a schematic view of a vapor chamber according to the present invention;
FIG. 2 is a schematic structural diagram of a vapor chamber according to the present invention;
FIG. 3 is a schematic view of the back side of the vapor chamber of the present invention;
FIG. 4 is a schematic view of the interior of the vapor chamber of the present invention;
FIG. 5 is an overall view of the vapor chamber of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-5:
example 1: a novel liquid-cooled vapor chamber sintering process comprises the following steps:
s1, stamping (machining) upper and lower plates of the temperature-equalizing plate;
s2, filling a novel liquid cooling sheet on the molded temperature-uniforming plate;
and S3, sintering the temperature equalizing plate integrally.
The step S3 may be friction welding, diffusion welding or brazing.
And S1, in the stamping (machining) molding of the upper plate and the lower plate of the uniform temperature plate, cold pressing the upper plate and the lower plate together by using a cold pressing die, preheating the cold-pressed workpiece for 20min under the protection of the nitrogen-hydrogen mixed gas at 400 ℃, and hot pressing the preheated workpiece for 8min under the protection of the nitrogen-hydrogen mixed gas at 600 ℃ by using a hot pressing steel die, so that the upper plate and the lower plate are sintered together to form the uniform temperature plate.
Before the cold pressing, a step of grinding and roughening the corresponding surfaces of the upper plate and the lower plate by using a 60-mesh abrasive belt is adopted so as to increase the contact area between the upper plate and the lower plate.
And (2) carrying out aluminum brazing flux spraying or soaking treatment on the uniform temperature plate body, taking out the uniform temperature plate body, drying the uniform temperature plate body in a drying tunnel, carrying out one-time sealing welding on the upper plate and the lower plate in a brazing furnace under the protection of nitrogen at 450 ℃, and cooling the uniform temperature plate body to be below 40 ℃ under the protection of gas.
And in the step S3 of integrally sintering the temperature-equalizing plate, the cavity is vacuumized by using the process tube, so that the pressure in the cavity is 5.0 multiplied by 10 < -3 > Pa.
Example 2: a novel liquid-cooled vapor chamber sintering process comprises the following steps:
s1, stamping (machining) upper and lower plates of the temperature-equalizing plate;
s2, filling a novel liquid cooling sheet on the molded temperature-uniforming plate;
and S3, sintering the temperature equalizing plate integrally.
The step S3 may be friction welding, diffusion welding or brazing.
And S1, in the stamping (machining) molding of the upper plate and the lower plate of the uniform temperature plate, cold pressing the upper plate and the lower plate together by using a cold pressing die, preheating the cold-pressed workpiece for 25min under the protection of nitrogen-hydrogen mixed gas at 450 ℃, and hot pressing the preheated workpiece for 9min under the protection of nitrogen-hydrogen mixed gas at 650 ℃ by using a hot pressing steel die, so that the upper plate and the lower plate are sintered together to form the uniform temperature plate.
Before the cold pressing, a step of grinding and roughening the corresponding surfaces of the upper and lower plates by using a 70-mesh abrasive belt is adopted so as to increase the contact area between the upper and lower plates.
And (2) carrying out aluminum brazing flux spraying or soaking treatment on the uniform temperature plate body, taking out the uniform temperature plate body, drying the uniform temperature plate body in a drying tunnel, carrying out one-time sealing welding on the upper plate and the lower plate in a brazing furnace under the protection of nitrogen at 500 ℃, and cooling the uniform temperature plate body to be below 40 ℃ under the protection of gas.
In the step of S3 integral sintering of the temperature-equalizing plate, the process tube is used for vacuumizing the cavity, so that the pressure in the cavity is 5.0 x 10 < -3 > Pa-1.3 x 10 < -2 > Pa
Example 3: a novel liquid-cooled vapor chamber sintering process comprises the following steps:
s1, stamping (machining) upper and lower plates of the temperature-equalizing plate;
s2, filling a novel liquid cooling sheet on the molded temperature-uniforming plate;
and S3, sintering the temperature equalizing plate integrally.
The step S3 may be friction welding, diffusion welding or brazing.
And S1, in the stamping (machining) molding of the upper plate and the lower plate of the uniform temperature plate, cold pressing the upper plate and the lower plate together by using a cold pressing die, preheating the cold-pressed workpiece for 30min under the protection of nitrogen-hydrogen mixed gas at 500 ℃, and hot pressing the preheated workpiece for 10min under the protection of nitrogen-hydrogen mixed gas at 650 ℃ by using a hot pressing steel die, so that the upper plate and the lower plate are sintered together to form the uniform temperature plate.
Before the cold pressing, the corresponding surfaces of the upper and lower plates are subjected to grinding and roughening treatment by using an 80-mesh abrasive belt so as to increase the contact area between the upper and lower plates.
And (2) carrying out aluminum brazing flux spraying or soaking treatment on the uniform temperature plate body, taking out the uniform temperature plate body, drying the uniform temperature plate body in a drying tunnel, carrying out one-time sealing welding on the upper plate and the lower plate in a brazing furnace under the protection of nitrogen at 550 ℃, and cooling the uniform temperature plate body to be below 40 ℃ under the protection of gas.
In the step of S3 integral sintering of the temperature-equalizing plate, the process tube is used for vacuumizing the cavity, so that the pressure in the cavity is 5.0 x 10 < -3 > Pa-1.3 x 10 < -2 > Pa
Example 4: a novel liquid-cooled vapor chamber sintering process comprises the following steps:
s1, stamping (machining) upper and lower plates of the temperature-equalizing plate;
s2, filling a novel liquid cooling sheet on the molded temperature-uniforming plate;
and S3, sintering the temperature equalizing plate integrally.
The step S3 may be friction welding, diffusion welding or brazing.
And S1, in the stamping (machining) molding of the upper plate and the lower plate of the uniform temperature plate, cold pressing the upper plate and the lower plate together by using a cold pressing die, preheating the cold-pressed workpiece for 35min under the protection of the nitrogen-hydrogen mixed gas at 550 ℃, and hot pressing the preheated workpiece for 11min under the protection of the nitrogen-hydrogen mixed gas at 650 ℃ by using a hot pressing steel die, so that the upper plate and the lower plate are sintered together to form the uniform temperature plate.
Before the cold pressing, a step of grinding and roughening the corresponding surfaces of the upper plate and the lower plate by using a 100-mesh abrasive belt is adopted so as to increase the contact area between the upper plate and the lower plate.
And (3) carrying out aluminum brazing flux spraying or soaking treatment on the uniform temperature plate body, taking out the uniform temperature plate body, drying the uniform temperature plate body in a drying tunnel, carrying out one-time sealing welding on the upper plate and the lower plate in a brazing furnace under the protection of nitrogen at 650 ℃, and cooling the uniform temperature plate body to be below 40 ℃ under the protection of gas.
In the step of S3 integral sintering of the temperature-equalizing plate, the process tube is used for vacuumizing the cavity, so that the pressure in the cavity is 5.0 x 10 < -3 > Pa-1.3 x 10 < -2 > Pa
Example 5: a novel liquid-cooled vapor chamber sintering process comprises the following steps:
s1, stamping (machining) upper and lower plates of the temperature-equalizing plate;
s2, filling a novel liquid cooling sheet on the molded temperature-uniforming plate;
and S3, sintering the temperature equalizing plate integrally.
The step S3 may be friction welding, diffusion welding or brazing.
And S1, in the stamping (machining) molding of the upper plate and the lower plate of the uniform temperature plate, cold pressing the upper plate and the lower plate together by using a cold pressing die, preheating the cold-pressed workpiece for 20min under the protection of nitrogen-hydrogen mixed gas at 400 ℃, and hot pressing the preheated workpiece for 15min under the protection of nitrogen-hydrogen mixed gas at 650 ℃ by using a hot pressing steel die, so that the upper plate and the lower plate are sintered together to form the uniform temperature plate.
Before the cold pressing, a 120-mesh abrasive belt is adopted to carry out grinding and roughening treatment on the corresponding surfaces of the upper plate and the lower plate so as to increase the contact area between the upper plate and the lower plate.
And (3) carrying out aluminum brazing flux spraying or soaking treatment on the uniform temperature plate body, taking out the uniform temperature plate body, drying the uniform temperature plate body in a drying tunnel, carrying out one-time sealing welding on the upper plate and the lower plate in a brazing furnace under the protection of nitrogen at 650 ℃, and cooling the uniform temperature plate body to be below 40 ℃ under the protection of gas.
And in the step S3 of integrally sintering the temperature-equalizing plate, the process tube is utilized to vacuumize the cavity, so that the pressure in the cavity is 5.0 x 10 < -3 > Pa-1.3 x 10 < -2 > Pa.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A novel liquid cooling vapor chamber sintering process is characterized in that: the method comprises the following steps:
s1, stamping (machining) upper and lower plates of the temperature-equalizing plate;
s2, filling a novel liquid cooling sheet on the molded temperature-uniforming plate;
and S3, sintering the temperature equalizing plate integrally.
2. The novel liquid-cooled vapor chamber sintering process of claim 1, wherein: the step S3 may be friction welding, diffusion welding or brazing.
3. The novel liquid-cooled vapor chamber sintering process of claim 1, wherein: and S1, in the stamping (machining) molding of the upper and lower plates of the temperature-equalizing plate, cold pressing the upper and lower plates together by using a cold pressing die, preheating the cold-pressed workpiece for 20-40 min under the protection of nitrogen-hydrogen mixed gas at 400-550 ℃, and hot pressing the preheated workpiece for 8-15 min under the protection of nitrogen-hydrogen mixed gas at 600-650 ℃ by using a hot pressing steel die, so that the upper and lower plates are sintered together to form the temperature-equalizing plate.
4. The novel liquid-cooled vapor chamber sintering process of claim 3, wherein: and before the cold pressing, a step of grinding and roughening the corresponding surfaces of the upper plate and the lower plate by using a 60-200-mesh abrasive belt so as to increase the contact area between the upper plate and the lower plate.
5. The novel liquid-cooled vapor chamber sintering process of claim 1, wherein: and (3) carrying out aluminum brazing flux spraying or soaking treatment on the uniform temperature plate body, taking out the uniform temperature plate body, drying the uniform temperature plate body in a drying tunnel, carrying out one-time sealing welding on the upper plate and the lower plate in a brazing furnace under the protection of nitrogen at 450-650 ℃, and cooling to below 40 ℃ under the protection of gas.
6. The novel liquid-cooled vapor chamber sintering process of claim 1, wherein: and in the step S3 of integrally sintering the temperature-equalizing plate, the process tube is utilized to vacuumize the cavity, so that the pressure in the cavity is 5.0 x 10 < -3 > Pa-1.3 x 10 < -2 > Pa.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110827944.6A CN113532168A (en) | 2021-07-22 | 2021-07-22 | Novel liquid-cooled vapor chamber sintering process |
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| CN202110827944.6A CN113532168A (en) | 2021-07-22 | 2021-07-22 | Novel liquid-cooled vapor chamber sintering process |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050022976A1 (en) * | 2003-06-26 | 2005-02-03 | Rosenfeld John H. | Heat transfer device and method of making same |
| CN103157964A (en) * | 2011-12-13 | 2013-06-19 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Manufacture method for aluminum-sintered temperature-equalizing board |
| CN105277032A (en) * | 2015-10-21 | 2016-01-27 | 上海利正卫星应用技术有限公司 | High-power and low-heat-resistance temperature evening plate |
| CN111842528A (en) * | 2020-06-28 | 2020-10-30 | 得意精密电子(苏州)有限公司 | Manufacturing method of temperature-equalizing plate |
-
2021
- 2021-07-22 CN CN202110827944.6A patent/CN113532168A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050022976A1 (en) * | 2003-06-26 | 2005-02-03 | Rosenfeld John H. | Heat transfer device and method of making same |
| CN103157964A (en) * | 2011-12-13 | 2013-06-19 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Manufacture method for aluminum-sintered temperature-equalizing board |
| CN105277032A (en) * | 2015-10-21 | 2016-01-27 | 上海利正卫星应用技术有限公司 | High-power and low-heat-resistance temperature evening plate |
| CN111842528A (en) * | 2020-06-28 | 2020-10-30 | 得意精密电子(苏州)有限公司 | Manufacturing method of temperature-equalizing plate |
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Application publication date: 20211022 |
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