WO2005095484A1 - Epoxy adhesive composition - Google Patents

Epoxy adhesive composition Download PDF

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Publication number
WO2005095484A1
WO2005095484A1 PCT/EP2005/002361 EP2005002361W WO2005095484A1 WO 2005095484 A1 WO2005095484 A1 WO 2005095484A1 EP 2005002361 W EP2005002361 W EP 2005002361W WO 2005095484 A1 WO2005095484 A1 WO 2005095484A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
composition according
acrylonitrile
epoxy adhesive
adhesive composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2005/002361
Other languages
English (en)
French (fr)
Inventor
Andreas Lutz
Karsten Frick
Cathy Grossnickel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
Original Assignee
Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34814318&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2005095484(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority to DE602004004501.2T priority Critical patent/DE602004004501T3/de
Application filed by Dow Global Technologies LLC filed Critical Dow Global Technologies LLC
Priority to CA002553251A priority patent/CA2553251A1/en
Priority to CN2005800073567A priority patent/CN1930206B/zh
Priority to BRPI0506523-2A priority patent/BRPI0506523B1/pt
Priority to KR1020067018504A priority patent/KR101151092B1/ko
Priority to JP2007502252A priority patent/JP5102018B2/ja
Publication of WO2005095484A1 publication Critical patent/WO2005095484A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C08L9/02—Copolymers with acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils

Definitions

  • the present invention relates to an epoxy adhesive composition according to claim 1, the use of the epoxy adhesive composition for the assembly of parts of a vehicle according to claim 13, and a vehicle according to claim 14.
  • Epoxy adhesive compositions are reaction adhesive compositions comprising an epoxy resin, a curing agent and usually an accelerator. Upon heat-activation, the epoxy groups of the epoxy resin react with the curing agent linking the epoxy resin compounds by a polyaddition reaction to obtain a cured product.
  • Such a cured product is known to have good mechanical properties and a chemical resistance superior to the cured product of other reaction adhesives. These characteristics make epoxy adhesive compositions particularly useful for demanding applications where stringent mechanical requirements must be satisfied, for example in the automotive industry.
  • the cured product of an epoxy adhesive other than a structural epoxy adhesive generally has a relatively high static strength, for example a high tensile and lap shear strength. Its dynamic strength however, i.e. its impact peel strength, is generally low.
  • Adhesives used for the assembly of parts of a vehicle, such as cars, vans, lorries, trucks and trains, are called structural adhesives.
  • the cured product of such a structural adhesive has to bear high static and dynamic loads.
  • additional flexibilizers and/or tougheners are to be added to the epoxy adhesive composition.
  • EP-A-0 197 892 describes a structural adhesive comprising an epoxy resin, a nitrogen comprising toughener and an accelerator.
  • the problem described by this application is to provide a structural adhesive having a good storage stability and a high curing rate.
  • EP-A-0 308 664 describes an epoxy adhesive composition comprising a butadierie-acrylonitrile copolymer in combination with a polyphenol-terminated polyurethane or polyurea.
  • EP-A-0 353 190 describes an epoxy adhesive composition comprising a butadiene-acrylonitrile copolymer in combination with a polyether-, polyester, polythioester or polyamid prepolymer terminated with a functionalized carbocyclic aromatic or araliphatic residue.
  • EP-A-0 308 664 and EP-A-0 353 190 The technology according to EP-A-0 308 664 and EP-A-0 353 190 is called M ⁇ hlhaupt-technology.
  • the problem described by both EP-A-0 308 664 and EP-A-0 353 190 is to improve the impact peel strength of the cured product. At low temperatures however, the impact peel strength is low.
  • WO 00/20483 relates to a composition comprising an epoxide-reactive copolymer having a glastransition- temperature of -30°C or less, and a reaction product of a carboxylic acid anhydride with a di- or polyamine and a polyphenol or aminophenol .
  • the cured product of WO 00/20483 has an impact peel strength of less than 20 N/mm at -40°C.
  • the cured product of a structural adhesive is required to have good mechanical properties at room temperature as well as at low temperatures. Because of their low impact peel strength values at low temperatures, the above known epoxy adhesives do not fully meet this requirement. Vehicles, parts of which are assembled by the above known epoxy adhesives, do consequently not fully comply with safety requirements, for example in a crash test.
  • a further disadvantage of the above known epoxy adhesive compositions is their relatively low impact behaviour on high strength metals both at moderate and at extreme temperatures. Due to this disadvantage, the use of the known epoxy adhesive compositions for assembling the parts of a high strength metal construction is limited.
  • composition according to claim 1 comprising a) a first epoxy resin, b) a second epoxy resin modified with an acrylonitrile-butadiene rubber, the latter comprising on average less than 25 wt% acrylonitrile, and c) a toughener,
  • the total amount of component b) and component c) being more than 30 % based on the total weight of the composition, and the weight ratio of component c) to component b) being greater than 1:1.
  • the epoxy adhesive composition of the present invention results upon curing in a product having an impact peel strength of more than 35 N/mm at room temperature and of more than 25 N/mm at -40 °C.
  • the vastly improved impact strength at low temperatures allows the epoxy adhesive composition to be used as a structural adhesive which upon curing has a high crash resistance at any temperature of use and satisfies the most stringent safety requirements.
  • the cured product of the epoxy adhesive composition of the present invention Due to its improved toughening, the cured product of the epoxy adhesive composition of the present invention has a superior impact peel strength on high strength metals. Assembly of high strength metal parts by the epoxy adhesive composition of the present invention allows the resulting high strength metal construction to be higher loaded than a construction bonded with conventional adhesives. The applicability of the epoxy adhesive compositions of the present invention for the assembly of high strength metal parts is highly desirable, since bonding of high strength metal by welding is often not feasible.
  • the cured epoxy adhesive composition has an excellent static strength in a temperature range of from -40 °C to +80°C.
  • the lap shear strength is higher than 25 Pa and the tensile strength is higher than 30 MPa. It has a young modulus of about 1500 MPa and a tensile elongation at break of more than 10%.
  • the epoxy adhesive composition of the present invention shows an excellent adhesion on coated steels like hot- dipped, electro-galvanized and bonazinc steel, pretreated aluminum, magnesium and composites.
  • the strength values of the epoxy adhesive composition of the present invention are decreased by only 20 to 30%.
  • the first epoxy resin (component a) of claim 1 can be any kind of epoxy resin, such as DER 330 (low viscosity, undiluted, bisphenol A liquid epoxy resin) , DER 331 (standard, undiluted, bisphenol A liquid epoxy resin) or
  • the Dow Chemical Company Preferred examples of the first epoxy resin are polyglycidyl ether of bisphenols, such as
  • component a) is a mixture of at least two different epoxy resins. It is preferred that at least one epoxy resin is liquid at room temperature.
  • the second epoxy resin is modified with an acrylonitrilebutadiene rubber (component b) .
  • component b) comprises at least 30 wt%, preferably at least 40 wt% of acrylonitrile-butadiene rubber.
  • the acrylonitrilebutadiene rubber is preferably X8, X31 or any mixture of X8, X31 and X13 (wherein X stands for a copolymer rubber of the CTBN (carboxy-terminated butadiene-rubber) type and the term "mixture” means a "mixture of two or three of the components") .
  • X8 is a CTBN type acrylonitrile-butadiene-rubber containing 17% acrylonitrile.
  • X13 is a CTBN type acrylonitrile-butadiene-rubber containing 26% acrylonitrile.
  • X31 is a CTBN type acrylonitrile-butadiene-rubber containing 10% acrylonitrile.
  • the epoxy adhesive composition comprises less than 20%, preferably less than 15% of acrylonitrile based on the total weight of the acrylonitrile-butadiene rubber.
  • composition preferably comprises as toughener (component c) a compound of formula I
  • R 1 is an n-valent radical of an elastomeric prepolymer after the removal of the terminal isocyanate, amino or hydroxyl group, the elastomeric prepolymer being soluble or dispersible in epoxy resin
  • W and X are independently -0- or -NR 3 -, at least one of W and X being -NR 3 -
  • R 2 is an m+1-valent radical of a polyphenol or aminophenol after the removal of the phenolic hydroxyl group and optionally of the amino group
  • R 3 is hydrogen, a Ci to C alkyl or phenol.
  • composition comprises as component c) a compound of formula II
  • p is 1 or 2
  • q is 2 to 6
  • Y is -0-, -S- or -NR 6 -
  • Z is a radical selected from the group consisting of -OH, -NHR 6 , -OCN,
  • R 4 is a residue of a hydroxyl-, mercapto- or amino- terminated polyether prepolymer or of a hydroxyl-, ercapto- or amino-terminated prepolymeric, segmented polyester, polyt ioester or polyamid
  • R 5 is a carbocyclic aromatic or araliphatic p+1-valent radical with groups Z bonded directly to the aromatic ring
  • R 6 is hydrogen, Ci to C 6 alkyl or phenyl
  • R 7 is methyl or hydrogen.
  • composition can comprise a mixture of both a compound of formula I and formula II as component c) .
  • RAM A, RAM B or RAM C examples of component c) are RAM A, RAM B or RAM C.
  • RAM A, RAM B and RAM C are compounds of formula I, RAM A being allylphenol-terminated, RAM B being bisphenol A-terminated and RAM C being alkylphenol-terminated.
  • RAM 965 which is known to a skilled person.
  • component b) is in an amount of from 14 to 20 % and component c) is in an amount of from 18 to 28 % based on the total weight of the composition.
  • the epoxy adhesive composition comprises a total amount of component b) and component c) of at least 35 wt%, preferably 38 wt%.
  • the weight ratio of component c) to component b) is greater than 1.3:1, preferably greater than 1.5:1.
  • the epoxy adhesive composition according to the present invention can further include additives, such as fillers and accelerators, which are known to a person skilled in the art.
  • the composition comprises as an accelerator a solid solution of a nitrogen base having a boiling point above 130°C and a phenolic polymer which is an addition polymer of a phenol having an unsaturated substituent.
  • solid solution means the combination of the components in a solid one-phase system.
  • EP-A-0 197 892 page 1 , line 7, to page 10, line 28
  • EP 796 which is known to a skilled person is particularly preferred.
  • the epoxy adhesive composition is preferably used for the assembly of parts of a vehicle, such as cars, vans, lorries, trucks and trains. It can also be used for assembling parts of boats and aircrafts.
  • the epoxy adhesive composition of the present invention is preferably applied at a temperature of 40° to 65°C. It can be applied manually or automatically by a robot as normal beads, by swirling or by jet-streaming. The curing is starting at temperatures above 140°C.
  • the adhesive itself is showing the following standard values after curing at temperatures higher than 140 °C.
  • VDA testings were performed on pretreated aluminum, hot dipped, electro galvanised and bonazinc coated steel and showed a decrease in strength by only 20 to 30%.
  • Other artificial aging tests like KKT, P 1210, 3C and cataplasma showed similar results.
  • Struktol 3604 is a rubber modified epoxy resin consisting of 60% diglycidyl ether of bisphenol A (DGEBA) and 40% X8.
  • Struktol 3614 is a rubber modified epoxy resin consisting of 60% DGEBA and 40% X13.
  • the values of the impact peel strength were determined according to ISO 113 43.
  • the epoxy adhesive compositions according to the present invention have a significantly higher impact peel strength at -40°C than the conventional epoxy adhesive compositions.
  • H300XD Z100, H400TD Z100, RAGAL600DP Z100, DOCOL 1000DP ZE75/75 are high strength steels known to a skilled person.
  • the epoxy adhesive composition according to the present invention shows a significantly higher impact peel strength on high strength steel compared to known structural adhesive compositions.
  • Lap shear strength on high strength steel values in MPa at room temperature
  • Table 3 shows the lap shear strengths values of known structural adhesive compositions being maintained in the epoxy adhesive composition according to the present invention.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
PCT/EP2005/002361 2004-03-12 2005-03-07 Epoxy adhesive composition Ceased WO2005095484A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE602004004501.2T DE602004004501T3 (de) 2004-03-12 2004-03-12 Epoxidharz Klebstoffzusammensetzung
CA002553251A CA2553251A1 (en) 2004-03-12 2005-03-07 Epoxy adhesive composition
CN2005800073567A CN1930206B (zh) 2004-03-12 2005-03-07 环氧粘合剂组合物
BRPI0506523-2A BRPI0506523B1 (pt) 2004-03-12 2005-03-07 Composição adesiva de époxi e uso de uma composição adesiva epóxi
KR1020067018504A KR101151092B1 (ko) 2004-03-12 2005-03-07 에폭시 접착제 조성물
JP2007502252A JP5102018B2 (ja) 2004-03-12 2005-03-07 エポキシ接着剤組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04005984.2 2004-03-12
EP04005984.2A EP1574537B2 (en) 2004-03-12 2004-03-12 Epoxy adhesive composition

Publications (1)

Publication Number Publication Date
WO2005095484A1 true WO2005095484A1 (en) 2005-10-13

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ID=34814318

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/002361 Ceased WO2005095484A1 (en) 2004-03-12 2005-03-07 Epoxy adhesive composition

Country Status (11)

Country Link
US (1) US7910656B2 (https=)
EP (1) EP1574537B2 (https=)
JP (1) JP5102018B2 (https=)
KR (1) KR101151092B1 (https=)
CN (1) CN1930206B (https=)
AT (1) ATE352576T1 (https=)
BR (1) BRPI0506523B1 (https=)
CA (1) CA2553251A1 (https=)
DE (1) DE602004004501T3 (https=)
ES (1) ES2276182T5 (https=)
WO (1) WO2005095484A1 (https=)

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JP2010523800A (ja) * 2007-04-11 2010-07-15 ダウ グローバル テクノロジーズ インコーポレイティド 耐熱性構造用エポキシ樹脂
JP2010529285A (ja) * 2007-06-12 2010-08-26 ゼフィロス インコーポレイテッド 強化接着性材料
US9096039B2 (en) 2010-03-04 2015-08-04 Zephyros, Inc. Structural composite laminates
US9427902B2 (en) 2009-09-15 2016-08-30 Zephyros, Inc. Cavity filling
US10577523B2 (en) 2013-07-26 2020-03-03 Zephyros, Inc. Relating to thermosetting adhesive films
US11028220B2 (en) 2014-10-10 2021-06-08 Zephyros, Inc. Relating to structural adhesives
US11248145B2 (en) 2008-04-09 2022-02-15 Zephyros, Inc. Structural adhesives

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EP1431325A1 (de) * 2002-12-17 2004-06-23 Sika Technology AG Hitze-härtbare Epoxidharzzusammensetzung mit verbesserter Tieftemperatur-Schlagzähigkeit
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US7557169B2 (en) 2003-07-07 2009-07-07 Dow Global Technologies, Inc. Capping isocyanate prepolymer or polyisocyanate/polyether polyol or polyamine mixture
EP1498441A1 (de) * 2003-07-16 2005-01-19 Sika Technology AG Hitzehärtende Zusammensetzungen mit Tieftemperatur-Schlagzähigkeitsmodifikatoren
EP1602702B2 (en) * 2004-06-01 2020-09-16 Dow Global Technologies LLC Epoxy adhesive composition
US8070994B2 (en) 2004-06-18 2011-12-06 Zephyros, Inc. Panel structure
EP1695990A1 (en) * 2005-02-28 2006-08-30 Dow Global Technologies Inc. Two-component epoxy adhesive composition
DE602005020260D1 (de) * 2005-06-02 2010-05-12 Dow Global Technologies Inc Schlagzähmodifizierter Strukturklebstoff auf Epoxid Basis
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KR101303246B1 (ko) * 2005-08-24 2013-09-06 헨켈 아일랜드 리미티드 개선된 내충격성을 갖는 에폭시 조성물
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KR101572276B1 (ko) * 2007-07-23 2015-11-26 다우 글로벌 테크놀로지스 엘엘씨 사용 온도 범위에 걸쳐 실질적으로 일정한 ｇ-계수를 갖는 2 부분 폴리우레탄 경화성 조성물
EP2181156A1 (en) * 2007-08-17 2010-05-05 Dow Global Technologies Inc. Two part crash durable epoxy adhesives
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CN102131839B (zh) * 2008-08-22 2014-06-04 陶氏环球技术公司 适合于将大质量部件粘结到结构体上的粘合剂组合物
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KR101093348B1 (ko) * 2009-08-17 2011-12-14 헨켈테크놀러지스 (유) 접착용 다기능 처리제 및 이를 이용한 신발의 제조방법
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US7910656B2 (en) 2011-03-22
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ATE352576T1 (de) 2007-02-15
EP1574537B1 (en) 2007-01-24
ES2276182T3 (es) 2007-06-16
US20050209401A1 (en) 2005-09-22
KR20070021152A (ko) 2007-02-22
JP5102018B2 (ja) 2012-12-19
CN1930206A (zh) 2007-03-14
BRPI0506523B1 (pt) 2021-10-13
EP1574537B2 (en) 2014-12-24
DE602004004501T2 (de) 2007-11-15
BRPI0506523A (pt) 2007-02-27
KR101151092B1 (ko) 2012-06-01
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CA2553251A1 (en) 2005-10-13
DE602004004501D1 (de) 2007-03-15

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