Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
  • H01G9/004—Details
  • H01G9/04—Electrodes or formation of dielectric layers thereon
  • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/018—Dielectrics
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
  • H01G9/0029—Processes of manufacture
  • H01G9/0036—Formation of the solid electrolyte layer
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
  • H01G9/004—Details
  • H01G9/022—Electrolytes; Absorbents
  • H01G9/025—Solid electrolytes
  • H01G9/028—Organic semiconducting electrolytes, e.g. TCNQ
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
  • H01G9/004—Details
  • H01G9/022—Electrolytes; Absorbents
  • H01G9/025—Solid electrolytes
  • H01G9/032—Inorganic semiconducting electrolytes, e.g. MnO2
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
  • H01G9/004—Details
  • H01G9/04—Electrodes or formation of dielectric layers thereon
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
  • H01G9/15—Solid electrolytic capacitors

Definitions

• the present invention relates to a capacitor having a good capacitance appearance rate and a low equivalent series resistance (ESR), and a method of manufacturing the capacitor.
• ESR equivalent series resistance
• capacitors around CPUs Central Processing Units
• CPUs Central Processing Units
• tantalum solid electrolytic capacitors are used in parallel.
• the above-mentioned solid electrolytic capacitor has an aluminum foil having fine pores in a surface layer, a tantalum sintered body having fine pores inside as one electrode, and a dielectric layer formed on the surface of the electrode. And the other electrode (usually, a semiconductor layer) provided on the dielectric layer.
• the expected capacity of one electrode as a capacitor can be satisfied by 100%. Not only does it take a great deal of time to cover almost 0%, but also because the heat stress is applied to the element by the solder heat when the manufactured capacitor is mounted on the board with solder, the leakage current value of the capacitor (hereinafter, LC May be abbreviated as the value). Disclosure of the invention The present inventors have conducted intensive studies in order to solve the above-mentioned problems, and as a result, the capacity expected from the pore surface area of one of the electrodes has been reduced to nearly 100% in a relatively short time. The present inventors have found a method of forming a semiconductor layer that can maintain and further reduce the LC rise after mounting, and have completed the present invention.
• the present invention relates to the following method of manufacturing a capacitor, a capacitor manufactured by the method, and an electronic device using the capacitor.
• a method for manufacturing a capacitor comprising: forming a semiconductor layer on a dielectric layer by an energization method after manufacturing so that a leakage current value is 500 ⁇ AZm 2 or less.
• the electrical microdefects formed in the dielectric layer are formed by contacting the conductor having the dielectric layer formed on the surface thereof with the corrosive gas or corrosive liquid of the dielectric layer. 3. The method for manufacturing a capacitor according to claim 1.
• the corrosive gas is halogen gas or water containing acid or alkali components.
• the corrosive liquid is a solution obtained by adding a halogen component, an acid, or an alkali component to water or an organic solution.
• microcontact is at least one selected from a metal oxide, a salt, an inorganic compound containing a transition element, an organic compound containing a transition element, and a polymer compound. Production method.
• the organic semiconductor is an organic semiconductor composed of benzopyrroline tetramer and chloranil, an organic semiconductor composed mainly of tetrathiotetracene, an organic semiconductor composed mainly of tetracyanoquinodimethane, and the following general formula (1) ) Or (2)
• 16 and 17 each independently represent a hydrogen atom, a linear or branched saturated or unsaturated alkyl group having 1 to 6 carbon atoms, or the alkyl groups are optional to each other.
• the semiconductor of conductivity is in the range of 10- 2 ⁇ 10 3 S_ cm according to the 1 Manufacturing method of solid electrolytic capacitor.
• Examples of the conductor used in the capacitor of the present invention include a metal, an inorganic semiconductor, an organic semiconductor, carbon, a mixture of at least one of them, and a laminate in which the conductor is laminated on a surface layer.
• Preferred examples of the metal include aluminum, iron, nickel, tantalum, copper, copper, tin, sub-sharp, lead, titanium, zirconium, and manganese.
• Inorganic semiconductors include lead dioxide, molybdenum dioxide, tungsten dioxide, and niobium monoxide.
• Metal oxides such as polypyrrole, polythiophene, polyaline, and their conductive polymers such as polypyrrole, polythiophene, polyaline, and substituted and copolymers having a high molecular skeleton; Examples include a complex of cyanoquinodimethane (TCNQ) and tetrathiotetracene, and a low molecular complex such as a TCNQ salt.
• TCNQ cyanoquinodimethane
• TCNQ salt a low molecular complex
• a part of the metal may be used after at least one treatment selected from carbonization, phosphidation, boration, nitridation, and sulfuration.
• Examples of the shape of the conductor include a foil shape, a plate shape, a rod shape, a shape obtained by forming the conductor itself into a powder shape, and sintering after molding.
• the surface of the conductor may be treated by etching or the like so as to have fine pores.
• minute pores can be provided inside the molded body or after sintering. If the conductor is in the form of a compact formed by powdering the conductor itself, or if the compact is sintered after molding, insert a part of the lead wire separately prepared during molding and mold it together with the conductor.
• the location of the lead wire may be used as a lead for one electrode of the capacitor.
• the dielectric layer formed on the conductor surface of the present invention include at least one dielectric selected from metal oxides and high molecules.
• T a 2 0 5, A 1 2 0 3, Z r 2 0 3, N b 2 0 at least selected from a metal oxide such as 5 one principal component (5 0% by mass or more components
• dielectric layers used in ceramic capacitors and film capacitors In the case of a dielectric layer containing at least one selected from the former metal oxides as a main component, when the dielectric layer is formed by forming the conductor having the metal element of the metal oxide, the produced capacitor Has polarity and becomes an electrolytic capacitor.
• dielectric layer used in a ceramic capacitor or a film capacitor examples include, for example, fluorine resin and polyester resin disclosed in Japanese Patent Application Laid-Open No. 63-29919 by the present applicant; As an example, a dielectric layer such as a perovskite compound described in JP-A-34991 can be mentioned. Further, a dielectric layer mainly composed of at least one selected from metal oxides and a plurality of dielectric layers used in ceramic capacitors and film capacitors may be laminated and used. A dielectric layer containing at least one selected from metal oxides as a main component, or a dielectric layer obtained by mixing a conventionally known dielectric such as a ceramic capacitor or a film capacitor may be used.
• the other electrode of the capacitor of the present invention includes at least one compound selected from an organic semiconductor and an inorganic semiconductor.
• the organic semiconductor examples include an organic semiconductor composed of benzopyrroline tetramer and chloranil, an organic semiconductor containing tetrathiotetracene as a main component, and tetracytatetracene.
• An organic semiconductor containing dimethane as a main component, and an organic semiconductor containing a conductive polymer obtained by doping a polymer containing a repeating unit represented by the following general formula (1) or (2) with a dopant as a main component are given.
• ⁇ 1 to! ⁇ 4 represent hydrogen, an alkyl group having 1 to 6 carbon atoms or an alkoxy group having 1 to 6 carbon atoms, which may be the same as or different from each other, and X represents oxygen, y ⁇ or Represents a nitrogen atom, R 5 is present only when X is a nitrogen atom and represents hydrogen or an alkyl group having 1 to 6 carbon atoms, and R 1 and R 2 and R 3 and R 4 are bonded to each other It may be annular.
• the conductive polymer containing the repeating unit represented by the general formula (1) is preferably a conductive polymer containing a structural unit represented by the following general formula (3) as a repeating unit. Molecules.
• R 6 and R 7 each independently represent a hydrogen atom, a linear or branched saturated or unsaturated alkyl group having 1 to 6 carbon atoms, or At any position to form at least one or more 5 containing two oxygen elements
• the cyclic structure includes those having a vinylene bond which may be substituted, and those having a phenylene structure which may be substituted.
• the conductive polymer having such a chemical structure is charged and doped with a dopant.
• dopants can be used without limitation as the dopant.
• the polymer containing the repeating units represented by the formulas (1) to (3) include polyurine, polyoxyphenylene, polyphenylene sulfide, polythiophene, polyfuran, polypyrrole, polymethyl virol, and substituted derivatives thereof. And copolymers. Among them, polypyrrole, polythiophene and substituted derivatives thereof (for example, poly (3,4-ethylenedioxythiophene) and the like) are preferable.
• inorganic semiconductors include molybdenum dioxide, tungsten dioxide, and dioxide! And at least one compound selected from manganese dioxide and the like.
• the method for forming the semiconductor layer on the above-described dielectric layer includes forming an electrically minute defect portion in the dielectric layer, and then forming the semiconductor layer by an energization technique. .
• a gas (corrosive gas) or a liquid (corrosive liquid) which corrodes the dielectric layer during or after forming the dielectric layer preferably This can be achieved by applying a plurality of microcontacts to the force or contacting the corrosive gas or the dielectric layer, or by performing a plurality of these operations.
• the formation of the minute defect portion can be adjusted by the concentration of the substance to be contacted or adhered, the contact time, and the number of times of forming the minute defect portion.
• the LC value after the above operation is By confirming the rise (electrical deterioration), it is considered that an electrically small defect portion was formed.
• the corrosive gas include at least one of a halogen gas, and a gas obtained by adding an acid or alkali component to water vapor, air, nitrogen gas, or argon gas.
• a typical example of the corrosive liquid is a solution in which a halogen component, an acid, or an alkali component is added to an organic solution such as water or alcohol.
• the optimum values for the concentration of corrosive gas or corrosive liquid and the contact time with the dielectric layer depend on the size of the device, the pore diameter, and the pore depth, and are determined by preliminary experiments conducted in advance. Contact with corrosive gasses and corrosive liquids creates electrical microdefects in the dielectric layer.
• Examples of the plurality of microcontacts attached to the dielectric layer include at least one material selected from inorganic or organic materials.
• the inorganic material include metal oxides, salts, and inorganic compounds containing transition elements.
• the organic material include a salt, an organic compound containing a transition element, and a polymer compound.
• No machine or organic material, in order to reduce the ESR value of the capacitor also be 1 produced a well semiconductor or conductor an insulator is conductivity 1 0 one 2 SZ cm ⁇ l 0 3 SZ cm It is preferable that the semiconductor is a semiconductor or a conductor. It is not preferable that the minute contact material covers the entire surface of the dielectric layer because electrical deterioration becomes too large.
• a plurality of minute contacts can be provided on the dielectric.
• the solvent may be brought into contact with the dielectric layer by dissolving in an appropriate solvent, and then the solvent may be dried and scattered.
• a sol in which microcontact substances are dispersed may be used instead of the solution.
• a precursor of an inorganic or organic material may be reacted on a conductor to form a microcontact.
• the size of the microcontact is preferably smaller than the pore diameter of the conductor.
• the LC value by performing electrical degradation of the dielectric layer, 5 0 0 ⁇ ⁇ conductor surface area m 2 below, preferably, 1 0 0 surface area of the AZ conductors m 2 or less, more preferably, If the surface area of the 30 ⁇ AZ conductor is set to m 2 or less, the formation of the semiconductor layer by the electric method described later is performed relatively cleanly, and no local lump of the semiconductor layer is generated. And the LC value of the manufactured capacitor becomes good.
• the dielectric layer may be repaired after the electrical degradation of the dielectric layer is completed in order to keep the LC value of the dielectric layer in a desired range.
• a repair method there is a method in which a conductor having a deteriorated dielectric layer is immersed in a separately prepared electrolytic solution and energized.
• the type of the electrolyte, the temperature of the electrolyte and the recovery time can be determined in advance by preliminary experiments.
• the semiconductor layer is formed on the dielectric layer by a conductive method after forming an electrically minute defect portion on the dielectric layer.
• a conductor in which a dielectric layer in which the electrically small defect portion is formed is immersed in a solution in which a semiconductor precursor that becomes a semiconductor by energization is dissolved, Is used as an electrode, and a voltage is applied between the electrode and a separately prepared electrode to form a semiconductor layer.
• the conductor is pulled up from the solution during energization, washed, dried, and then immersed in an electrolyte solution in which an acid or salt is dissolved. May be measured. Further, the lifting and the restoration may be repeated a plurality of times.
• the external layer is formed on the semiconductor layer formed by the method described above.
• An electrode layer may be provided to improve electrical contact with the lead (for example, a lead frame).
• the electrode layer can be formed by, for example, solidification of a conductive paste, plating, metal deposition, formation of a heat-resistant conductive resin film, and the like.
• a conductive paste a silver paste, a copper paste, an aluminum paste, a carbon paste, an Eckel paste, and the like are preferable, and these may be used alone or in combination of two or more. When two or more kinds are used, they may be mixed or may be stacked as separate layers. After applying the conductive paste, leave it in the air or heat it to solidify it.
• the plating includes nickel plating, copper plating, silver plating, aluminum plating, and the like.
• examples of the metal to be deposited include aluminum, Eckel, copper, and silver.
• a capacitor is formed by sequentially laminating a carbon paste and a silver paste on the other electrode and sealing with a material such as epoxy resin.
• the capacitor may have a lead made of a metal wire connected before or after the conductor.
• the capacitor of the present invention having the above-described configuration can be used as a capacitor product for various applications by, for example, a resin mold, a resin case, a metal outer case, resin dive, and an outer case made of a laminate film.
• the capacitor manufactured by the present invention can be preferably used, for example, in a circuit using a high-capacity capacitor such as a power supply circuit.
• These circuits include a computer, a server, a camera, a game machine, a DVD, an AV It can be used for devices, digital devices such as mobile phones, and electronic devices such as various power supplies. Since the capacitor manufactured according to the present invention has a small rise in leakage current after mounting, an electronic circuit and an electronic device with less initial failure can be obtained by using the capacitor.
• the leakage current (LC) value for judging the degree of electrical deterioration of the dielectric layer is calculated by using a 0.1% phosphoric acid aqueous solution (when the conductor is other than aluminum) for the conductor with the dielectric layer formed on the surface. ) Or immersed in an electrolytic solution consisting of a 20% aqueous solution of ammonium adipate (when the conductor is aluminum), and 16 V (when the conductor is not aluminum) or 7 V (when the conductor is other than aluminum) (When the conductor is aluminum)), and the value is set to 1 minute at room temperature.
• the adhesion amount of the plurality of microcontacts attached to the dielectric layer used in the present invention was calculated from the area ratio between the dielectric layer and the microcontacts in a SEM (Scanning Electron Microscope) photograph.
• the coverage of the semiconductor layer with respect to the dielectric layer is determined by replacing the semiconductor layer with an electrolytic solution (a 30% aqueous sulfuric acid solution (when the conductor is other than aluminum) or a 30% aqueous ammonium adipate solution (when the conductor is aluminum)). ) Is a relative value when the capacitance obtained as the other electrode is 100%.
• the sintered body was immersed in a 10% aqueous solution of lead acetate, the sintered body side was used as the anode, and a voltage of 16 V was applied between the separately prepared negative electrode platinum electrode at room temperature for 24 hours to mainly lead dioxide.
• a semiconductor layer as a component was formed.
• the sintered body was used as an anode in a 0.1% aqueous solution of acid and a platinum electrode was used as a cathode, and a voltage of 16 V was applied at 80 ° C for 30 minutes to obtain a dielectric material.
• the micro defects in the layer were repaired and the LC value was set to 20 / z A / m 2 .
• the semiconductor was washed with water and dried to form a semiconductor layer as the other electrode. Further, a carbon paste and a silver paste were sequentially laminated.
• the lead wire of the sintered body is placed on the anode side of both convex parts of the separately prepared lead frame with tin plating on the surface, the silver paste side of the sintered body is placed on the cathode side, the former is spot welding The latter was connected with silver paste.
• the lead frame is sealed with epoxy resin except for a part of the lead frame (the lead frame is cut at a predetermined place outside the sealed resin and then bent), and the size is 7.3 X 4.3 X 2.8 mm.
• a chip-type capacitor was manufactured. Examples 2 to 6 and Comparative Example 1:
• Example 1 the initial LC value was increased by 40, 80, 100 in the order of Examples 2, 3, 4, 5, 6, and Comparative Example 1 by extending the standing time in steam containing sulfuric acid. 0, 2 0 0, 4 0 0, except that the 6 0 0 mu A_ m 2 to prepare a capacitor in the same manner as in example 1.
• Example 7 the initial LC value was increased by 40, 80, 100 in the order of Examples 2, 3, 4, 5, 6, and Comparative Example 1 by extending the standing time in steam containing sulfuric acid. 0, 2 0 0, 4 0 0, except that the 6 0 0 mu A_ m 2 to prepare a capacitor in the same manner as in example 1.
• Example 7 Example 7:
• Example 8 Instead of the sulfuric acid solution in Example 1, a 1: 1 mixture of sulfuric acid and nitric acid (20% each) And for the use of the aqueous solution) to prepare a capacitor except that the initial LC value in the 1 2/111 2 ⁇ value of the final in 5 ⁇ ⁇ element in the same manner as in Example 1.
• Example 8
• niobium oxide powder of C V65,000 Z g 0.15 g was used to produce a sintered body of 4.1 X3.4X 1.8 mm (sintering temperature 1620 ° C, sintering time 30 minutes, sintering Body density 6.0 gZ cm 3 , Nb lead wire 0.29mm ⁇ ).
• This sintered body was immersed in a 0.1% phosphoric acid aqueous solution except for a part of the lead wire, 20 V was applied between the electrode and the Ta plate electrode of the negative electrode, and formed at 80 for 3 hours.
• a dielectric layer made of b 2 O 5 was formed.
• This sintered body was allowed to stand in a chlorine gas diluted to 10% with nitrogen gas at 20 for 7 hours to produce an electrically minute defect portion in the dielectric layer.
• the LC value of the dielectric layer having a minute defect was' 9 ⁇ A / m 2 .
• the sintered body was immersed in an aqueous solution containing 0.2% ethylenedioxythiophene and 0.1 M anthoraquinone sulfonic acid, and a voltage of 16 V was applied between the negative electrode and the platinum electrode at room temperature. This was applied for a time to form a semiconductor layer mainly composed of an ethylenedioxythiophene polymer.
• the sintered body After pulling up, washing and drying, the sintered body is used as an anode in a 0.1% acetic acid aqueous solution, and a platinum electrode is used as a cathode, by applying a voltage of 16 V at 80 ° C for 30 minutes to form a dielectric layer. welfare a minute defect Osamu, was 1 ⁇ Ji value to 9 / / / 111 2. After the semiconductor formation and repair work were repeated six times (the sixth time, a voltage was applied until the LC value became 1 O / XAZ element), water washing and drying were performed to form a semiconductor layer as the other electrode. . Thereafter, as described in Example 1, a carbon paste and a silver paste were sequentially laminated to produce a chip capacitor.
• Example 9 Example 9:
• the chemical conversion foil was immersed in an aqueous solution containing 0.2% ethylenedioxythiophene and 0.1M anthoraquinone sulfonic acid, and a voltage of 7 V was applied between the negative electrode platinum electrode at room temperature for 24 hours.
• a semiconductor layer mainly composed of a dioxythiophene polymer was formed. After pulling up, washing, and drying, a minute defect in the dielectric layer is applied in a 0.1% acetic acid aqueous solution by applying a voltage of 5.5 V at 80 ° C for 1.5 hours using the formed foil as the anode and the platinum electrode as the cathode. repaired and the LC value in 4 / iA / m 2.
• the semiconductor was washed with water and dried to form a semiconductor layer as the other electrode. Thereafter, as described in the examples, a carbon paste and a silver paste are sequentially laminated on the semiconductor layer.Six such elements are prepared in a line up, and the silver paste side is solidified with silver paste and integrated. did. Further, it was mounted on a lead frame and sealed with an epoxy resin in the same manner as in Example 1 to produce a chip capacitor.
• a sintered body with a size of 4.0X3.4X1.7mm was fabricated using 0.08 g of partially nitrided niobium powder (nitrogen content: 10,000 ppm) of V82,000 nog (sintering temperature 1320 ° C , Sintering time 30 minutes, sintered body density 3.5g / cm 3 , Nb lead wire 0 ⁇ 29 ⁇ ). Sintered was immersed except some re one lead wire in 0.1% phosphoric acid aqueous solution, a 20 V was applied between the T a plate electrode of the negative electrode, and conversion 3 hours at 80, N b 2 consisting O 5 to form a dielectric layer.
• This sintered body was alternately immersed in a 20% aqueous sodium molybdate solution and a 10% aqueous sodium borohydride solution 30 times.
• a plurality of microcontacts containing molybdenum dioxide as a main component were adhered on the dielectric layer.
• the microcontacts covered about 15% of the dielectric layer.
• an electrically small defect portion was formed on the dielectric layer.
• the LC value of the dielectric layer having the microdefects was 1.
• the sintered body is immersed in a 10% alcohol aqueous solution containing 0.5% pyrrole and 0.1M ansolaquinone sulfonic acid, and a voltage of 16 V is applied between the negative electrode and the platinum electrode at room temperature for 24 hours. Then, a semiconductor layer mainly composed of a pixel polymer was formed. After lifting, washing and drying, minute defects in the dielectric layer were repaired in a 0.1% aqueous acetic acid solution, and the LC value was adjusted to 15 / z A / m 2 .
• Example 11 After repeating the above-mentioned semiconductor formation and repair work six times (the sixth time, voltage was applied until the LC value became 8 A / element), the semiconductor was washed with water and dried to form a semiconductor layer as the other electrode. Thereafter, as described in Example 1, a carbon paste and a silver paste were sequentially laminated to produce a chip capacitor.
• Example 11
• Example 10 instead of molybdenum dioxide as a plurality of microcontacts to be attached to the dielectric layer, the sintered body was alternately replaced with a 0.2% aqueous solution of ethylenedioxythiophene and a 30% aqueous solution of hydrogen peroxide.
• a capacitor was produced in the same manner as in Example 10, except that an ethylenedioxythiophene polymer obtained by repeating immersion was used. According to SEM observation, the microcontacts covered about 20% of the dielectric layer. In this example, the final LC value after repeating the semiconductor formation and repair work six times was 12 ⁇ _ element. Comparative Example 2:
• a capacitor was manufactured in the same manner as in Example 1 except that the treatment was not performed with the steam containing sulfuric acid.
• the formation time of the semiconductor layer was the same as in the first embodiment. It was 96 hours in the department.
• a capacitor was manufactured in the same manner as in Comparative Example 2 except that the formation time of the semiconductor layer was set to 200 hours in total in Comparative Example 2.
• Example 1 Comparing Example 1 and Comparative Example 1-6, the surface area of 5 0 0 / AZ conductor the LC value by performing electrical degradation of the dielectric layer: If m 2 keep the following semiconductor layer coverage It can be seen that the LC value of the manufactured capacitor becomes good.
• Example 1 and Comparative Example 2 it was found that after forming an electrically minute defect portion in the dielectric layer, the semiconductor layer was formed on the dielectric layer by an energization method, so that the semiconductor layer was relatively short-lived. It can be seen that the coverage of the semiconductor layer increases.
• Example 1 comparing Example 1 and Comparative Example 3, it is found that the method of the present application, in which after forming an electrically small defect portion in the dielectric layer, the semiconductor layer is formed on the dielectric layer by an energization method, is adopted. It can be seen that as the semiconductor layer formation time becomes shorter, the absolute value of LC after mounting becomes smaller. Industrial applicability
• the present invention provides a method for manufacturing a capacitor in which after forming an electrical micro-defect portion on a dielectric layer on one electrode surface, a semiconductor layer serving as the other electrode is formed thereon. According to the method (1), a capacitor with good capacitance appearance rate and low ESR can be obtained.

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