WO2004032320A1 - Microresonateur, microfiltre, micro-oscillateur et dispositif de communication sans fil - Google Patents

Microresonateur, microfiltre, micro-oscillateur et dispositif de communication sans fil Download PDF

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Publication number
WO2004032320A1
WO2004032320A1 PCT/JP2003/012665 JP0312665W WO2004032320A1 WO 2004032320 A1 WO2004032320 A1 WO 2004032320A1 JP 0312665 W JP0312665 W JP 0312665W WO 2004032320 A1 WO2004032320 A1 WO 2004032320A1
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WO
WIPO (PCT)
Prior art keywords
micro
resonator
microphone
microresonator
electrode
Prior art date
Application number
PCT/JP2003/012665
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English (en)
Japanese (ja)
Inventor
Satoshi Morishita
Original Assignee
Sharp Kabushiki Kaisha
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Publication date
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Priority to JP2004541277A priority Critical patent/JP4121502B2/ja
Priority to AU2003271082A priority patent/AU2003271082A1/en
Publication of WO2004032320A1 publication Critical patent/WO2004032320A1/fr

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H9/02393—Post-fabrication trimming of parameters, e.g. resonance frequency, Q factor
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2447—Beam resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/462—Microelectro-mechanical filters
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02488—Vibration modes
    • H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02488—Vibration modes
    • H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
    • H03H2009/02503—Breath-like, e.g. Lam? mode, wine-glass mode
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02488—Vibration modes
    • H03H2009/02511—Vertical, i.e. perpendicular to the substrate plane

Definitions

  • the present invention relates to a microresonator that can be incorporated as a part of an integrated circuit on a substrate, and more particularly to a microfilter device and a microoscillator using a micro-elect.mechanical system, and a wireless communication device.
  • Micro-elect resonators using a micro 'elect port' mechanics system are described in, for example, Reference 1 (FDBann, III, JR CIark, and CT-C. Nguyen, I As shown in EEE J. S o 1 idState Circuits, vol. 35, No. 4, p. 51 2—526, A ril 2000), its natural frequency (resonance frequency) is It can be used to accurately pass only signals of that frequency and attenuate other frequency signals and noise.
  • an ultra-small size and extremely narrow band filter that can be incorporated into an integrated circuit can be realized. Is being promoted.
  • FIG. 30 shows an example of a microfilter including a microresonator 300 formed of a polysilicon film on a silicon substrate according to a conventional technique.
  • the frequency of the AC signal is similar to the resonance frequency of the microresonator 300 due to the AC signal applied to the input electrode 301, the microresonator 300 vibrates, and the selected AC signal is transmitted from the output terminal 302 to the output terminal 302. Is done.
  • the resonance frequency of the resonator as shown in FIG. 30 is almost expressed by the following equation as shown in the above-mentioned document 1.
  • k is a constant
  • p is the density of the resonator material
  • E is the Young's modulus of the resonator material
  • L r is the effective length of the resonator
  • h is the thickness of the resonator.
  • the finished dimensions can be checked with a certain degree of accuracy using the high-performance length measurement technology used in the LSI manufacturing process.
  • the resonator in a surface MEMS formed by laminating on the substrate surface, the resonator has a corner portion 303 with a curvature (curvature) and a depression due to the influence of the support portion and the lower electrode of the resonator. 304 and convex portions 305 are formed. Since these shapes differ depending on the deviation of the mask alignment in the manufacturing process, the variation in the processed shape and the thickness of the deposited film, etc., they cause a variation in the resonance frequency. Japanese Patent Application Laid-Open No.
  • 2001-94062 discloses that a silicon “on” insulator (SOI) substrate is used to form a single-crystal silicon resonator, and that the film thickness variation and mechanical properties caused by the polycrystalline nature of polysilicon are increased. Although a technique for solving the problem of variation in the precision is disclosed, it does not essentially solve the inaccuracy of the resonance frequency due to the variation in processing accuracy.
  • SOI silicon “on” insulator
  • Japanese Patent Application Laid-Open No. 2001-94062 discloses a method of controlling the resonance frequency of the resonator by changing the density of the resonator by ion implantation in the manufacturing process. If the mechanical properties cannot be accurately measured and the resonance frequency before injection cannot be estimated accurately, the dose for achieving the desired resonance frequency cannot be determined. In other words, it is necessary to completely understand the measurement error of the inspection device used for measuring the dimensions of the resonator and the concentration distribution after ion implantation in a resonator having a thickness of about 2 ⁇ and a length of several ⁇ or more. In view of the difficulties in the fabrication, it is difficult to accurately predict variations in the mechanical properties of the implanted resonator, and this technique essentially eliminates the inaccuracy of the resonance frequency due to the manufacturing process. It is difficult to solve.
  • the resonance frequency of the resonator and the amplitude amplification factor (Q value) of the resonance peak are determined as described in Reference 2 (YT Chengeta 1., Proceedings of MEMS Conf. 18, 2001). Since the resonance characteristics depend strongly on the pressure in the cavity in which the resonator is sealed, even if the resonance characteristics of the resonator are adjusted during manufacture, the final resonance characteristics will fluctuate due to variations in the sealing pressure. Even if the pressure in the vacuum device for sealing in the sealing process is adjusted with high precision, there is a pressure distribution depending on the position of the exhaust system and the structure in the device.
  • the pressure gauge can actually measure the pressure by performing the sealing process.
  • the vacuum equipment it must be a peripheral part that does not hinder the sealing work.
  • the stability of the exhaust capacity of the exhaust system must be considered.
  • the resonance frequency fluctuates due to the use environment, that is, the fluctuation or deterioration of the external temperature or the sealing pressure. Temperature changes cause fluctuations in the resonance frequency due to degassing from inside the seal, pressure fluctuations, and thermal expansion of the resonator itself. In other words, even if there is a fluctuation due to the use environment or deterioration over time, it cannot be used unless there is a function that can optimally adjust the resonance frequency.
  • Reference 1 discloses a method of changing the resonance frequency by the bias potential applied to the resonator (resonance frequency of about 1 MHz). In this method, however, the potential difference between the input electrode and the resonator is changed. The resulting electrostatic force draws the resonator toward the input electrode, changing the resonance frequency of the resonator. Therefore, by increasing the strength of the electrostatic force relatively to the force of the panel of the resonator, the resonator is closer to the input electrode, and the change of the resonance frequency can be increased. However, if it is applied to a device with a higher resonance frequency, the length of the resonator becomes shorter, and the size of the input electrode becomes smaller accordingly, so that the electrostatic force necessarily becomes smaller.
  • the method using the bias potential enables control that only compensates for the inaccuracy of the resonance frequency due to the above-mentioned variation in the processing accuracy and the variation in the sealing pressure for the resonator having the resonance frequency in the high frequency range. It is hard to say what to do.
  • the resonance frequency is reduced, and the amplitude amplification factor (Q value) at the resonance peak is also reduced.
  • deterioration of sealing pressure in any case, such as a temperature rise, the resonance frequency drops, so it is necessary to control the resonance frequency to a higher side.
  • the bias voltage is proportional to the output of the MEMs, the noise potential cannot be lowered unnecessarily, and the frequency is basically reduced. There is a problem that it is not a method that can control the number to be increased.
  • the CMOS circuit normally uses a voltage of about 3 to 5 V, so even if the control voltage for MEMS is increased, the limit is considered to be about 40 V. . This is because, even in this case, there are about three types of gate insulation film structures for MEMS control circuits: low voltage, medium voltage, and high voltage for scaling according to voltage. This necessitates the proper use of different components, complicating the manufacturing process and increasing the cost. In the method using the bias voltage, the upper limit of the controllable voltage is actually low, and the control range is narrow. Disclosure of the invention
  • the present invention has been made to solve the above-described problems of the related art, and is a microresonator which can be incorporated as a part of an integrated circuit on a substrate, wherein a resonator is provided.
  • a microresonator which can adjust the resonance frequency by compensating for fluctuations in processing accuracy of the resonator and fluctuations in the sealing pressure even after sealing, and in particular, provide variable frequency micro-filters and micro-oscillators, and wireless communication devices Is to do.
  • a microresonator according to the present invention includes: a substrate;
  • a microphone mouth resonator provided on the substrate,
  • At least one micro movable portion that mechanically acts on the microphone opening resonator; and a micro movable portion that drives the micro movable portion to change a mechanical operation state of the micro movable portion with respect to the micro resonator.
  • the micro-resonator oscillates in response to a change in a selected parameter, and the micro-movable part mechanically or mechanically applies a predetermined force to the microphone mouth resonator by an external operation.
  • the amplitude amplification factor at the resonance peak, or the inputtable signal strength is changed.
  • the micro movable portion changes a vibration region or a distribution shape of amplitude of the microresonator.
  • the resonance frequency of the microphone opening resonator, the amplitude amplification factor (Q value) of the resonance peak, or the inputtable signal strength can be changed.
  • the micro movable portion controls the absorption of vibration near a support end of the micro resonator.
  • the resonance frequency of the microphone opening resonator, the amplitude amplification factor (Q value) of the resonance peak, or the inputtable signal strength can be changed.
  • the microphone opening movable section driving mechanism causes the micro movable section to come into contact with the microresonator or to be separated from the microresonator.
  • the micro movable portion driving mechanism contacts the microphone opening movable portion with a force of a predetermined magnitude to the microphone opening resonator, or Changes the magnitude of the force in contact with the microresonator.
  • the resonance frequency of the microphone opening resonator, the amplitude amplification factor (Q value) of the resonance peak, or the inputtable signal strength can be changed.
  • the microphone opening movable section driving mechanism changes a position or a direction in which the microphone opening movable section contacts the microphone opening resonator.
  • the resonance frequency of the microresonator, the amplitude amplification factor (Q value) of the resonance peak, or the inputtable signal strength can be changed by an external operation. .
  • the micro movable portion is provided with a mechanical action on the microphone mouth resonator by the micro movable portion.
  • the position at which the micro movable portion comes into contact with the micro resonator is near the support end of the micro resonator or near the node of vibration.
  • the microphone opening resonator of this embodiment it is possible to suppress the resonance frequency of the microphone opening resonator from becoming unstable.
  • the mechanical action of the micro movable portion on the microphone opening resonator causes the microphone opening movable portion to contact the microphone opening resonator, and the micro movable portion is The position in contact with the microresonator is a region where the amplitude is smaller than the amplitude peak position of the vibration of the microresonator.
  • the resonance frequency of the microphone-mouth resonator can be suppressed from becoming unstable.
  • the micro movable portion contacts the micro resonator by a mechanical action of the micro movable portion on the microphone opening resonator, and the microphone opening movable portion and the microphone Of the crossing lines formed by contact with the mouth resonator, the crossing line formed on the side where the main vibration of the microresonator occurs is the effective value of the dimension related to the main resonance frequency of the microphone mouth resonator. It is configured to be positioned almost perpendicularly to the direction of the line segment indicating.
  • the microphone-mouth resonator of this embodiment it is possible to change the resonance frequency while suppressing the deterioration of the amplitude amplification factor (Q value) at the resonance peak of the microphone mouth resonator.
  • the micro movable portion comes into contact with the micro resonator by a mechanical action of the micro movable portion on the microphone mouth resonator, and the micro resonator has a micro resonance.
  • a micro-resonator support portion and is formed on a side of the micro-resonator where main vibration occurs, of the intersections formed by the contact between the microphone-port movable portion and the microphone-port resonator.
  • the crossing line is almost on the side where the main vibration of the microphone mouth resonator occurs in the crossing line formed by the microphone mouth resonator and the microresonator support portion, or the crossing line formed at the farthest place. It is configured to be substantially parallel.
  • the microphone-mouth resonator of this embodiment it is possible to change the resonance frequency while suppressing the deterioration of the amplitude amplification factor (Q value) at the resonance peak of the microphone mouth resonator.
  • the microphone of the micro movable section Due to the mechanical action on the mouth resonator, the micro movable portion comes into contact with the micro resonator, the micro resonator includes a micro resonator and a micro resonator support portion, and the microphone mouth movable portion and the microphone Of the lines of intersection formed by contact with the mouth resonator, the lines of intersection formed on the side of the microresonator where main vibration occurs are formed by the microresonator and the microresonator support. Of the intersecting lines, from the intersecting position formed on the side where the main vibration of the microphone opening resonator occurs most, to the end position of the line segment indicating the effective value of the dimension related to the main resonance frequency of the microphone opening resonator. It is configured to be located on the side where the main vibration of the microphone mouth resonator occurs from the position where the distance is doubled.
  • the microphone-mouth resonator of this embodiment it is possible to change the resonance frequency while suppressing the deterioration of the amplitude / width ratio (Q value) at the resonance peak of the microphone mouth resonator.
  • the mechanical action of the micro movable portion on the microphone opening resonator causes the microphone opening movable portion to come into contact with the microphone opening resonator
  • the micro resonator includes: A micro-resonator and a micro-resonator supporting portion, wherein, of the intersections formed by the contact between the microphone opening movable portion and the microphone opening resonator, Is an intersection line formed on the side where the main vibration of the microphone mouth resonator occurs most among the intersection lines formed by the microphone mouth resonator and the microphone mouth resonator support portion.
  • the microphone resonator is configured to be located on the side opposite to the side where main vibration occurs.
  • the microresonator of this embodiment it is possible to change the resonance frequency while suppressing the deterioration of the amplitude amplification factor (Q value) at the resonance peak of the microresonator.
  • microresonator there are a plurality of micro movable parts having different sizes, shapes, or materials, and the different micro movable parts are caused to mechanically act on the micro resonator.
  • the resonance frequency is changed without significantly lowering the resonance peak intensity and the amplitude amplification factor (Q value) of the resonance peak, and the resonance peak intensity and the amplitude of the resonance peak are changed.
  • the resonance frequency is changed by lowering the amplification factor (Q value) to some extent, it is possible to use different controls.
  • micro movable parts are prepared for both ends of the micro resonator, One is near the end of the spring indicating the effective length of the microphone mouth resonator, and the other is near the end of the line indicating the effective length of the microphone mouth resonator.
  • the mechanical action of the micro movable portion on the microphone opening resonator causes the microphone opening movable portion to come into contact with the microphone opening resonator, and at least to the micro resonator.
  • the resonance frequency of the distal end of the micro movable portion that is in contact with the micro movable portion is higher than the resonance frequency of the microphone mouth resonator.
  • the microphone-mouth resonator of this embodiment even when the micro movable portion is brought into contact with the microphone mouth resonator, the vibration peak intensity is less reduced compared to the case where it is not contacted, and the amplitude amplification factor (Q Value) can be adjusted while suppressing the deterioration of the resonance frequency.
  • the mechanical action of the micro movable portion on the microphone opening resonator causes the microphone opening movable portion to contact the microphone opening resonator, and the micro movable portion and the micro movable portion
  • Each of the micro-resonators has a contact portion that comes into contact with each other, and in this contact portion, an anti-sticking layer is formed on at least one of the surface of the micro movable portion side and the surface of the microphone opening resonator side. ing. According to the microresonator of this embodiment, it is possible to repeatedly adjust the resonance frequency by contact while preventing sticking at the time of contact.
  • the mechanical action of the micro movable portion on the microphone opening resonator causes the microphone opening movable portion to come into contact with the microphone opening resonator,
  • the length of the contact portion with the microphone opening resonator in the direction indicating the effective dimension of the micro resonator is longer than the thickness of the microphone opening resonator.
  • the resonance frequency can be effectively changed.
  • the microphone of the micro movable section Due to the mechanical action on the mouth resonator, the micro movable portion comes into contact with the micro resonator, and the direction of the force with which the microphone mouth movable portion and the microphone mouth resonator are pressed relatively is the micro resonance. It is almost perpendicular to the direction of the line indicating the effective value of the dimension related to the main resonance frequency of the body.
  • the effective length of the microresonator can be effectively changed.
  • the mechanical action of the micro movable portion on the microphone opening resonator causes the microphone opening movable portion to come into contact with the microphone opening resonator;
  • the direction of the force with which the microphone mouth resonator is pressed relatively is substantially parallel or substantially perpendicular to the amplitude direction of the main vibration of the microresonator.
  • the pressing force is applied perpendicular to the contact surface of the micro-resonator, and the effective length can be changed effectively.
  • the micro movable portion driving mechanism includes a flexible plate-shaped piezoelectric member.
  • a drive mechanism with a small occupied area can be manufactured on a substrate.
  • the micro movable portion driving mechanism includes a thickness-deformable piezoelectric member.
  • a drive mechanism capable of changing the pressing position of the micro movable portion can be manufactured on a substrate with a small occupied area.
  • the micro movable portion driving mechanism includes a slip deformation type piezoelectric member.
  • microresonator of this embodiment it is possible to change the pressing position with higher reproducibility and higher accuracy.
  • the micro movable unit driving mechanism includes an electrostatic actuated actuator.
  • the substrate is manufactured on a substrate using a material used in a normal MEMS process or a CMOS process without using a piezoelectric material. This makes it possible to easily and vertically generate a driving force in the vertical and horizontal directions of the substrate.
  • the electrostatically-driven actuator is formed with a first electrode fixed to the substrate and at a fixed distance from the first electrode, and A second electrode that moves to move toward or away from the first electrode to move the microphone opening movable portion by a potential difference between the first electrode and the second electrode, the second electrode being moved by a potential difference between the first electrode and the second electrode caused by an externally applied voltage; And an elastic body electrically connected to the second electrode and supporting the second electrode and a structure connected to the second electrode.
  • the control range of the resonance frequency can be widened, and control at a low voltage of several tens V or less is also possible. Furthermore, it is possible to use different micro movable parts at both ends of the micro resonator to make contact with the micro resonator, or to use the micro movable part for coarse adjustment and the micro movable part for fine adjustment to make contact with the micro resonator. .
  • the present invention is easily applied to a microresonator vibrating in a direction perpendicular and parallel to the substrate and a microresonator vibrating in a vertical vibration mode in a direction parallel to the substrate. Applicable.
  • the elastic body when the second electrode approaches the first electrode up to a predetermined distance from the first electrode, the elastic body changes its fulcrum position, The elastic coefficient of the elastic body increases.
  • the microphone opening resonator of this embodiment when moving the microphone opening movable portion until it comes into contact with the micro-resonator, a long distance can be moved with a low voltage due to a small elastic constant. After contact with the body, the elastic constant becomes high, so that the moving distance of the second electrode can be suppressed, and the pushing force of the micro movable portion can be increased while preventing pull-in.
  • the electrostatically-driven actuator is configured such that when the second electrode approaches the first electrode up to a predetermined distance from the first electrode, And a second elastic body that supports the second electrode and a structure connected to the second electrode.
  • the elastic coefficient of the structure supporting the second electrode can be increased from the stage where the micro movable portion comes into contact with and pushes the micro resonator, and the micro movable portion is When moving before contacting the microphone mouth resonator, it has a small elastic constant, so it can move a large distance at low voltage, and after the micro movable part comes into contact with the micro resonator, it has a high elastic constant. It is possible to increase the pushing force of the micro movable part while suppressing the moving distance of the second electrode and preventing punolein.
  • the predetermined distance is equal to or less than the first distance in a balanced state when no potential difference is applied to the first electrode and the second electrode.
  • the distance is set to be larger than two-thirds of the distance between the electrode and the second electrode.
  • the second electrode approaches the first electrode.
  • the microphone-mouth movable portion is brought into contact with the microphone-mouth resonator before being too close to cause pull-in. be able to.
  • the predetermined distance is equal to the distance between the first electrode and the second electrode in a balanced state in which a potential difference is not applied to the first electrode and the second electrode.
  • the distance is set near the distance obtained by subtracting the distance between the microphone opening movable section and the micro-resonator from the distance between the electrode and the microphone.
  • the micro movable portion can be brought into contact with the micro-resonator before the second electrode is too close to the first electrode to cause pull-in.
  • the structure connected to the elastic body and the second electrode may be configured such that the first electrode approaches the first electrode when the second electrode approaches the first electrode.
  • a bent portion is provided to keep the position of the electrode and the second electrode substantially parallel.
  • the microphone opening resonance device of this embodiment when the microphone opening movable portion is pressed, the direction of the pressing force is prevented from deviating from the vertical direction, and the second electrode is prevented from being inclined from the horizontal. Can be.
  • the electrostatically driven actuator is provided in the microphone mouth resonance device. Is formed at a certain distance from the second electrode, on the opposite side to the first electrode, and the second electrode and the second electrode are formed by a potential difference from the second electrode caused by a voltage applied from the outside. A third electrode for applying a driving force to the micro movable unit is provided. According to the microphone opening resonator of this embodiment, even if the micro movable portion and the microphone opening resonator are fixed and cannot return to the original position of the balance, the micro resonance device is disassembled by an external input. Without this, the function as a microresonator can be restored.
  • the electrostatically-driven actuator is orthogonal to a direction in which the first electrode and the second electrode face each other from a structure interlocking with the microphone opening movable unit.
  • the first electrode and the second electrode face the microphone opening movable portion due to a potential difference from the structure portion caused by a voltage applied from the outside while being formed at a constant distance in the direction.
  • a fourth electrode for providing a driving force in a direction orthogonal to the direction is provided.
  • the process can be simplified and the cost can be reduced, and the operation of removing the sticking can be performed as compared with the method using the third electrode described above.
  • the microresonator and the microphone opening movable section are made of a material whose composition contains at least two elements, and one of these elements has a high melting point. It is a metal element.
  • the film composition and the film quality can be easily controlled even when the film is deposited at a low temperature of about room temperature, and the film is prevented from being broken or the like at the time of film deposition.
  • the resistance to deformation and destruction of the microstructure due to a load such as stress can be improved.
  • the high-melting-point metal element is one of tungsten, tantalum, and molybdenum.
  • a microphone opening structural member having a high Young's ratio can be obtained even when nitrogen or the like is contained.
  • the microresonator and the microport movable portion are made of a material whose composition contains at least two elements. At least nitrogen, oxygen, or carbon Including.
  • the film composition and the film quality can be easily controlled even when the film is deposited at a low temperature of about room temperature, and it is possible to prevent the rupture such as the peeling of the film during the film deposition, In addition, resistance to deformation and destruction of the microstructure due to a load such as stress can be improved.
  • the microresonator and the movable part of the microphone opening are made of a material whose composition includes at least two elemental forces S.
  • This material has a composition or an internal residual stress. Consists of at least two different layers. According to the microresonator of this embodiment, it is possible to prevent rupture such as peeling of the film at the time of film deposition, and to improve resistance to deformation or breakage of the microstructure due to a load such as stress.
  • the microfilter device of the present invention includes: the microresonator; an input electrode capacitively coupled to the microphone mouth resonator; an output electrode for extracting a frequency signal selected by the microphone mouth resonator; And an input electrode for driving the micro movable portion drive mechanism.
  • the resonance frequency of the microresonator (the center frequency of the microfilter device) can be adjusted over a wide range by controlling the movable portion of the microphone opening after the manufacturing, so that the conventional method cannot perform the manufacturing. Uncertainties in the resonance frequency of the microresonator (the center frequency of the microfilter device) due to variations in processing and sealing pressure at the time can be adjusted and adjusted to the desired (design) value. Furthermore, the yield can be increased even when using a manufacturing apparatus and a manufacturing process with a processing accuracy in a range where the yield cannot be obtained by the conventional method.
  • the deviation of the center frequency of the microphone opening filter device can be corrected by controlling the microphone opening movable part after encapsulation, changes in the external environment (temperature) during use and deterioration with time of the microresonator itself (sealing).
  • the filter output can also be corrected and optimized for pressure degradation and mechanical properties of the microphone mouth resonator material, etc.), extending the range of environmental conditions that can be used as a filter and extending the product life. be able to.
  • the microphone opening movable section control connected to the output of the microresonator and the input driving the microphone opening movable section driving mechanism.
  • the micro movable unit control circuit when there is a difference between a desired frequency to be selected and a frequency of a signal selected and output by the microphone mouth resonance device, a desired frequency from the microphone mouth resonance device.
  • the micro movable unit is adjusted so that a signal is output.
  • the microfilter device of this embodiment it is possible to adjust the frequency output of the microphone port filter device on the spot according to a change in the actual use environment and the state of the microphone port resonator device at the time of use, Even if the resonator is stuck, the function of the microphone mouth resonator can be restored by an external input without dismantling the microfilter.
  • the microfilter device further includes a storage element connected to the micro movable unit control circuit, and the storage element is configured to adjust the microphone port adjusted to correct a difference between the selected frequency and the desired frequency.
  • the micro movable section control circuit stores a control value of the movable section driving mechanism based on the control value of the microphone opening movable section driving mechanism stored in the storage element during a start-up operation. Section to adjust the output frequency signal.
  • the time can be significantly reduced as compared with the case where the adjustment is made from the initial value.
  • control value of the micro movable portion driving mechanism stored in the storage element is a voltage applied to an electrode of the microphone opening movable portion driving mechanism or a mark applied between the electrodes. Includes a set value that gives any of the voltage differences that are adjusted.
  • the time can be significantly reduced as compared with the case where the adjustment is made from the initial value.
  • the micro movable portion control circuit adjusts a deviation existing in a frequency of the signal to be selectively output to a desired frequency, and the microphone stored in advance in the storage element. Stepwise adjustment is performed using the optimal control step of the control voltage of the mouth movable section drive mechanism.
  • microfilter device of this embodiment it is easy to predict the adjustment width and easily adjust the frequency for various microresonance devices or microfilter devices.
  • the deviation can be adjusted.
  • control steps stepwise it is possible to accurately check and control the steady-state frequency output, adjust the frequency accurately, and obtain the final result in a short time.
  • the micro-oscillator of the present invention may further include: the micro-resonator; an input electrode capacitively coupled to the micro-resonator; an output electrode for extracting a frequency signal output by the microphone-port resonator; And an input electrode for driving the movable portion drive mechanism.
  • the frequency output by the microphone-mouth resonator can be largely adjusted by controlling the microphone-mouth movable section after manufacturing, and therefore, processing variations during manufacturing that could not be achieved by the conventional method. It is also possible to adjust the deviation to the desired value (design value) with respect to the uncertainty of the resonance frequency of the microresonator or the output frequency of the microoscillator due to the variation of the sealing pressure or the fluctuation of the sealing pressure. Since the adjustment range after manufacturing is greatly improved as compared with the conventional method, the yield can be obtained even when using a manufacturing apparatus and a manufacturing process with the same processing accuracy that cannot be obtained with the conventional method.
  • the fluctuation of the output frequency of the microphone mouth oscillator can be corrected on the spot by controlling the movable part of the microphone mouth after enclosing, the change of the external environment (temperature) during use and the aging of the microresonator itself can be achieved.
  • the output frequency characteristics can be corrected and optimized for deterioration (such as deterioration of sealing pressure and deterioration of mechanical characteristics of microresonator material), and the range of environmental conditions that can be used as an oscillator is expanded. The product life can be extended.
  • micro movable portion can be formed on the substrate together with the micro resonator, it becomes possible to arrange micro resonators having various frequency characteristics side by side, and a microphone opening resonator having various frequency characteristics and a micro movable device can be manufactured.
  • the controllable range of the frequency characteristics of the entire micro-oscillator is expanded, and the micro-oscillator can be used properly according to the purpose and environment of use. It is also possible to obtain a mixed output by combining a plurality of microresonators.
  • the micro oscillator includes a microphone opening movable section control circuit connected to an output of the microresonator and an input for driving the micro movable section driving mechanism. While detecting the output so as to correct or optimize the fluctuation of the frequency output by the microresonator, Adjust the black moving parts.
  • the frequency output of the microphone oscillator can be adjusted on the spot according to the actual use environment and the state of the microphone resonator at the time of use.
  • the function of the microresonator can be restored by an external input without dismantling the micro oscillator.
  • the micro oscillator includes a storage element connected to the micro movable unit control circuit, and the storage element corrects or optimizes a difference between a desired frequency to be output and an actual frequency.
  • the control value of the microphone opening movable section driving mechanism adjusted as described above is stored, and the micro movable section control circuit, based on the control value of the microphone opening movable section driving mechanism stored in the storage element at the time of the starting operation. And controlling the movable part of the microphone opening.
  • the control value of the micro movable unit at the time of shipment or adjustment performed in a normal use environment of the user, or the control value of the micro movable unit adjusted at the last use is stored.
  • the time can be greatly reduced compared to the adjustment from the initial value.
  • control value of the microphone opening movable portion driving mechanism stored in the storage element is a voltage applied to an electrode of the microphone opening movable portion driving mechanism or applied between electrodes. Includes the setting value that gives the! / Of the voltage difference.
  • the time can be greatly reduced as compared with the case where the initial value is completely adjusted.
  • the micro movable unit control circuit when correcting or optimizing the fluctuation in the output frequency, stores the microphone opening movable stored in advance in the storage element.
  • the voltage is adjusted stepwise by using the optimal control step for the control voltage of the unit drive mechanism.
  • the microphone-mouth oscillator of this embodiment it is possible to easily adjust the frequency deviation with a predicted control width even for various microphone-mouth resonators or microphone-mouth oscillators. Also, by performing the control steps in stages, Since the output frequency in the normal state can be checked and controlled, the frequency can be adjusted accurately and in a short time.
  • the wireless communication device of the present invention includes a transmitting unit, a receiving unit, a duplexer for separating a transmission signal from the transmission unit and a reception signal to the reception unit, and transmitting the transmission signal as a radio wave.
  • the micro filter device since the micro filter device is provided, even if the frequency characteristics of the microphone port filter device fluctuate due to the external environment fluctuation or the internal fluctuation of the microphone port resonator device itself, the communication state is not changed.
  • the micro movable unit By controlling the micro movable unit while comparing with the above, the frequency characteristics can be adjusted, and the communication state can be kept optimal.
  • the wireless communication device of the present invention includes a transmitting unit, a receiving unit, a duplexer for separating a transmission signal from the transmission unit and a reception signal to the reception unit, and transmitting the transmission signal as a radio wave.
  • the micro-oscillator since the micro-oscillator is provided, even if the frequency characteristic of the microphone-oscillator fluctuates due to a fluctuation of an external environment or an internal fluctuation of the microphone-oscillator itself, the micro movable device The frequency characteristic change can be corrected or optimized by adjusting the section.
  • FIG. 1 is a configuration diagram illustrating a microphone-mouth resonance device according to a first embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of a microphone mouth resonator in the microphone mouth resonator according to the first embodiment of the present invention.
  • FIG. 3 is a schematic cross-sectional view of the microphone mouth resonator in the microphone mouth resonator according to the first embodiment of the present invention.
  • FIG. 4 shows another micro-sharing in the microphone-mouth resonator according to the first embodiment of the present invention. It is a schematic cross section of a vibration body.
  • FIG. 5 is a schematic sectional view of another micro-resonator in the microphone-mouth resonator according to the first embodiment of the present invention.
  • FIG. 6 is a diagram showing the relationship between the frequency and the amplitude of the microphone mouth resonator in the microphone mouth resonator according to the first embodiment of the present invention.
  • FIG. 7 is a configuration diagram of a contact surface of a microphone opening movable portion in the microphone opening resonance device according to the first embodiment of the present invention.
  • FIG. 8 is a plan view of a contact surface of a microphone opening movable section in the microphone opening resonance device according to the first embodiment of the present invention.
  • FIG. 9 is a schematic cross-sectional view of a microphone opening movable section in the microphone opening resonance device according to the first embodiment of the present invention.
  • FIG. 10 is a schematic cross-sectional view of another movable part of the microphone opening in the microresonator according to the first embodiment of the present invention.
  • FIG. 11 is a configuration diagram showing a micro movable unit driving mechanism in the micro resonance device according to the first embodiment of the present invention.
  • FIG. 12 is a schematic cross-sectional view taken along line A 1 — ⁇ 2 of FIG. 11 showing a micro movable unit driving mechanism (balance position) in the microphone-mouth resonance device according to the first embodiment of the present invention.
  • FIG. 13 is a schematic cross-sectional view taken along the line A 1 —A 2 of FIG. 11 showing a micro movable unit driving mechanism (pressing position) in the micro resonance device according to the first embodiment of the present invention.
  • FIG. 14 is a configuration diagram showing another microphone opening movable unit driving mechanism in the microresonator according to the first embodiment of the present invention.
  • FIG. 15 is a schematic cross-sectional view taken along the line B 1 -B 2 of FIG. 14 showing another microphone mouth movable portion driving mechanism (balance position) in the microphone mouth resonance device according to the first embodiment of the present invention.
  • FIG. 16 is a diagram illustrating a relationship between a voltage applied to an electrode and a moving distance in the microresonator according to the first embodiment of the present invention.
  • FIG. 17 is a diagram showing the relationship between the voltage applied to the electrodes and the fixed force (the magnitude of the acting force) in the microresonator according to the first embodiment of the present invention.
  • FIG. 18 is a schematic cross-sectional view of a sticking prevention mechanism in the microresonator according to the first embodiment of the present invention.
  • FIG. 19 is a schematic cross-sectional view of another sticking prevention mechanism in the microresonator according to the first embodiment of the present invention.
  • FIG. 20 is a configuration diagram illustrating a microphone-mouth resonance device according to the second embodiment of the present invention.
  • FIG. 21 is a plan view of a microresonator in the microphone-mouth resonator according to the second embodiment of the present invention.
  • FIG. 22 is a plan view of a microresonator in the microresonator of the second embodiment of the present invention.
  • FIG. 23 is a configuration diagram showing a micro movable unit driving mechanism in the micro resonance device according to the second embodiment of the present invention.
  • FIG. 24 is a configuration diagram illustrating a micro movable unit structure in the micro resonance device according to the second embodiment of the present invention.
  • FIG. 25 is a configuration diagram illustrating another movable structure of the microphone opening in the microresonator according to the second embodiment of the present invention.
  • FIG. 26 is a configuration diagram illustrating a microphone-mouth resonance device according to the third embodiment of the present invention.
  • FIG. 27 is a schematic cross-sectional view of a microresonator in the microresonator of the third embodiment of the present invention.
  • FIG. 28 is a schematic sectional view of a microphone mouth resonator in the microresonator according to the third embodiment of the present invention.
  • FIG. 29 is a plan view of the contact surface of the micro movable section when the resonator shape is circular.
  • FIG. 30 is a configuration diagram showing a conventional microphone mouth resonance device.
  • FIG. 31 is a configuration diagram showing another microphone opening movable portion driving mechanism in the microphone opening resonance device according to the first embodiment of the present invention.
  • FIGS. 32A to 32B are configuration diagrams showing another microphone opening movable portion driving mechanism in the microphone opening resonance device according to the first embodiment of the present invention.
  • FIG. 33 is a plan view of another microphone mouth resonator in the microphone mouth resonator according to the second embodiment of the present invention.
  • FIG. 34 is a configuration diagram showing another microphone opening movable portion driving mechanism in the microphone opening resonance device according to the second embodiment of the present invention.
  • FIG. 35A to FIG. 35F are diagrams of the microphone opening resonator according to the first embodiment of the present invention.
  • FIG. 3 is a process chart showing a manufacturing method according to the present invention.
  • FIGS. 36A to 36C are process diagrams showing another method of manufacturing the microphone-mouth resonator according to the first embodiment of the present invention.
  • FIG. 37A to FIG. 37C are step diagrams showing a manufacturing method in the microresonator according to the third embodiment of the present invention.
  • FIGS. 38A to 38F are process diagrams showing a method for manufacturing the microphone-mouth resonator according to the second embodiment of the present invention.
  • FIG. 39 is a configuration diagram showing a microfilter device according to the fourth embodiment of the present invention or a microphone-mouth oscillator according to the fifth embodiment.
  • FIG. 40 is a diagram illustrating a relationship between a control voltage and a frequency for explaining a control value in the microfilter device according to the fourth embodiment of the present invention or the micro oscillator according to the fifth embodiment.
  • FIG. 41 is a timing chart for explaining a control operation in the microfilter device according to the fourth embodiment of the present invention or the micro oscillator according to the fifth embodiment.
  • FIG. 42 is a simplified configuration diagram showing a wireless communication device according to the sixth embodiment of the present invention.
  • FIG. 43 is a simplified configuration diagram showing a wireless communication device according to the seventh embodiment of the present invention.
  • FIG. 1 is a configuration diagram showing a first embodiment of a microphone-mouth resonance device according to the present invention.
  • a microresonator 13 formed on the substrate 10 and configured to vibrate in response to a change in a selected parameter and comprising a microresonator 11 and a support portion 12 thereof, and a microresonator 1 formed by an external operation 3 is provided with a micro movable part 16 that can change the resonance frequency of the microresonator, or the amplitude amplification factor at the resonance peak, or the inputtable signal strength by mechanically or mechanically acting on the microresonator.
  • an SOI substrate is used for the substrate 10
  • impurity-doped single-crystal silicon is used for the microphone mouth resonator 11.
  • the material and form of the open-ended resonator are not limited, and a silicon single crystal substrate, a GaAs substrate, a glass substrate, or the like may be used instead of the SOI substrate.
  • a silicon single crystal substrate instead of single-crystal silicon doped with impurities, polycrystalline silicon film or amorphous silicon doped with impurities, SiGe film, SiC film, Ni, tungsten, and tungsten nitride
  • SiGe film, SiC film, Ni, tungsten, and tungsten nitride instead of single-crystal silicon doped with impurities, SiGe film, SiC film, Ni, tungsten, and tungsten nitride.
  • a high-melting-point metal nitride such as tantalum nitride and use a microresonator having a form as in the conventional example shown in FIG.
  • the micro-resonator 11 vibrates selectively according to a change in a frequency signal near the resonance frequency of the micro-resonator 11.
  • the force input method and input signal are not limited to this, and a design may be made so that the resonance frequency of the microresonator 11 may be a desired frequency, even if low-frequency pressure fluctuation, acoustic signal, or mechanical vibration may be applied. By doing so, it is also possible to selectively respond.
  • the micro movable section 16 can be moved mechanically or mechanically into contact with the micro resonator 13 during operation from the outside, or can be moved away from the micro resonator 13.
  • a drive mechanism 17 that allows the micro movable portion 16 to contact the micro resonator 13 with a predetermined force, changes the magnitude of the contact force, and changes the contact position. It has.
  • Reference numeral 18 denotes a contact surface between the microphone opening movable section 16 and the microresonator 13.
  • FIG. 2 shows a longitudinal section of the microresonator 11 of the first embodiment shown in FIG.
  • the microphone mouth resonator 11 has a higher degree of freedom of the resonator compared to the lower part in contact with the microphone mouth resonator support part 12, and the upper part has an effective length related to the resonance frequency of the micro resonator.
  • 21 is slightly longer than the actual length 20 of the microphone mouth resonator that can be measured. The effective length related to the resonance frequency used here will be described.
  • any form of resonator it is necessary to support the resonator at least in order to vibrate the resonator, but it is practically difficult to ideally support or fix the resonator at points or planes .
  • three-dimensional three-dimensional
  • the ratio of the contact area of the support structure becomes relatively large, so that the structural contribution of the support to vibration cannot be ignored. Therefore, the actual resonant frequency of the microresonator deviates from the value determined by the external dimensions of the microresonator.
  • the size related to the resonance frequency of the microphone mouth resonator taking the deviation of the resonance frequency into consideration is defined as the effective size.
  • the difference in resonance frequency is regarded as the difference between the length of the microphone mouth resonator and the external dimensions, and the value obtained from the obtained resonance frequency is used as the effective length of the microresonator. Used as
  • the micro movable portion 16 when the micro movable portion 16 is brought into contact with a relatively high degree of freedom near the support end of the microresonator 11, the degree of freedom near the support end of the microresonator 11 is increased. Then, the vibration region and the amplitude distribution shape of the microresonator 11 change. As a result, the resonance frequency of the microresonator 11 can be changed. In most cases, the effective length 22 of the microresonator after changing the resonance frequency is located between the lower length 20 of the microresonator and the length 23 between the micro movable parts 16 .
  • a microresonator such as the conventional example shown in FIG. 30, as shown in FIG. 4, there is a certain degree of freedom with respect to vibration near the support end, so that the effective length of the microphone mouth resonator 24 is 25 Is longer than the lower dimension 26 of the resonator.
  • the vibration region of the microphone opening resonator 24 and the amplitude are reduced.
  • the distribution shape changes. Thereby, the resonance frequency can be changed.
  • the position where the micro movable portion 30 is brought into contact with the micro resonator 24 is not limited to the upper surface 36 of the micro resonator 24.
  • the microphone mouth resonator 24 and the side surface 35 of the support portion 34 may be used.
  • the vibration of the microphone mouth resonator tends to spread to the support part side, so the microphone mouth is placed somewhere near the support end.
  • Resonance characteristics such as the resonance frequency of the mouth resonator can be controlled by contacting the movable part to suppress vibration energy to the support part side, that is, by controlling the absorption of vibration energy to the support side.
  • the resonance frequency of the microresonator can be adjusted according to the first embodiment.
  • FIG. 6 shows the results of the response of the resonator when the microphone aperture resonator of the form shown in Fig. 4 is subjected to vibrations of various frequencies at the center of the microphone aperture resonator.
  • a polysilicon film is used for the resonator.
  • the dimensions of the resonator were 5.0 im in the lower part, 7.4 111 in the upper part, 1.0 ⁇ m in height, and 1.0 ⁇ m in width.
  • the size of the contact surface of the micro movable part is 1. ⁇ ⁇ ⁇ . ⁇ .
  • the horizontal axis represents the frequency and the vertical axis represents the response (amplitude) of the resonator.
  • the curve ⁇ in the graph is the result when the micro movable part is not in contact with the micro-mouth resonator, and the curves B and C are shown on the top of the micro resonator (only one side) as shown in Fig. 5. This is the result of changing the position of and making contact.
  • B and C correspond to the case where the micro-resonator is contacted at a position shifted from the lower end (cross position) by 0.1 ⁇ m from the center of the resonator and 0.5 ⁇ m from the support side. I do.
  • the micro-resonator is very hard and the deformation of the micro-resonator caused by the contact of the micro movable part is negligible.
  • the body is slightly deformed and can change the resonance frequency of the microresonator by causing local stress generation, strain, and density changes, as well as dimensional changes such as thickness and curvature.
  • the vibration of the contact part of the micro movable part with the microphone mouth resonator is restrained. And the amount of change in the resonance frequency can be reduced.
  • the micro-resonator is made of a material with low hardness such as metal or plastic instead of silicon, and the micro movable part is made of silicon, silicon oxide, or a material with higher hardness than the mouth resonator Depending on the case, the effect of the deformation increases.
  • Silicon or polysilicon with a thickness of 2 ⁇ which is usually used for MEMS resonators, is applied using the microfabrication technology used in today's most advanced LSI processes. It is assumed that dimensions can be machined.
  • the mask used to process silicon or polysilicon with a thickness of 2 ⁇ uses a thick resist that is 2-3 times thicker than the resist used for normal gate polysilicon processing. Since it is necessary to use a hard mask such as that described above, an error is included as a processing margin depending on the dimensions of the resonator. Even if the best case is assumed, the amount of error is ⁇ 0.03 ⁇ when the dimension of the resonator is about a few // m, and when the resonator size is about 10 jum, it is 0.005 zm and the number 100 If it is about // m, it will be about 0.1 ⁇ m.
  • the control voltage will be 0.2V or less. Although the range of variation is narrow, considering the voltage drop due to the resonator size of 100 ⁇ , the control voltage is too low and control becomes difficult.
  • the design dimension of the resonator is 10 / m, the processing frequency is 0.12.If // m is included, the resonance frequency is from 162.483 MHz to 166.6.
  • the control method by the conventional Baiasu potential, practically controllable range, around a few 1 0 mu m resonator dimensions, the resonance frequency becomes several 1 0 MH Z band limited are regions of
  • the control as shown in the first embodiment cannot be realized.
  • the method in which the resonance frequency is controlled by controlling the potential of the resonator or controlling the resonance frequency with an external electric field or an electrically controlled magnetic field has a very narrow applicable frequency band. It helps to be limited to the range.
  • the frequency required to compensate for the uncertainty of at least several% or more due to the variation in processing accuracy as described above is used.
  • the amount of injection must be distributed so that the desired resonance frequency can be obtained according to the accuracy, and the microphone mouth resonator must be prepared on the substrate according to the number. Since the exact resonance frequency is not known at the stage before injection, it is necessary to allocate at least Equation 10 and Equation 100.
  • FIG. 7 shows a preferred form of contact between the microphone opening movable section 16 and the microresonator 13. It is desirable that the contact surface 18 where the microphone opening movable portion 16 and the microphone opening resonator 13 come into contact is near the supporting end of the microphone opening resonator 11 or near the vibrating end.
  • Adhesion between the mouth resonator 13 and the micro movable section 16 can be improved, and the resonance frequency of the microphone resonator 11 can be prevented from fluctuating due to the instability of the contact section. Furthermore, of the lines of intersection between the micro movable part 16 and the micro resonator 13, the intersection 40 on the side where the microphone mouth resonator 11 vibrates most is the dimension related to the main resonance frequency of the micro resonator 11.
  • the cross line is formed on the side where the main vibration of the micro resonator 11 occurs most.
  • Intersecting line 4 3 force Almost parallel to the intersecting line 4 2 formed on the side where the main vibration of the microphone mouth resonator 11 occurs most of the intersecting lines formed by the microresonator 11 and the microresonator support portion 12 It is desirable to be configured to be located at By making the intersection line 43 almost parallel to the intersection line 42 that the micro movable part 16 related to the distribution of the effective length in the plane direction of the microresonator 11 before contact, When the micro movable part 16 is brought into contact with the micro-resonator 11, the vibration mode in the plane direction which is significantly different from that before the contact is suppressed, and the amplitude amplification factor at the resonance peak of the micro-resonator 11 ( It is possible to change the resonance frequency while suppressing the deterioration of the Q value.
  • the microphone mouth resonator 11 shown in FIG. 3 is shown as an example, but in the case of the microphone mouth resonator 24 shown in FIG. 5, as shown in FIG.
  • the intersection 33 formed on the side where the main vibration of the micro-resonator 24 occurs most is the microphone mouth resonator 24 and the micro-mouth resonator 24.
  • the same effect can be obtained by making the cross section of the cross section formed by the support portion of the resonator almost parallel to the cross line 32 that is farthest from the side where the main vibration of the microphone mouth resonator 24 occurs most. You. This is because, in the case of the microresonator 24, the intersection line 32 between the upper surface and the support portion of the microresonator is stronger than the lower side of the microresonator rather than the effective length of the microresonator 24. Because it is affecting.
  • an intersection line 43 formed by the contact between the micro movable portion 16 and the microresonator 13 is an intersection formed by the microresonator 11 and the microresonator support portion 12. From the position 46, which is twice the distance from the position of the line 42 to the end position 45 of the line segment 44 indicating the effective value of the dimension related to the main resonance frequency of the microresonator, from the position of the microphone mouth resonator 1 It is desirable to be located on the side where 1 main vibration occurs. In the microresonator 11 as shown in FIG. 3, at a position farther from the side where the main vibration of the microresonator 11 occurs further, even if the micro movable part 16 is brought into contact with the microresonator 11, the resonance frequency of the microresonator 11 does not increase. The contribution is small.
  • an intersection line 47 formed by the contact between the micro movable portion 16 and the microresonator 11 is positioned at a position of the intersection line 42 formed by the microphone mouth resonator 11 and the microphone mouth resonator support portion 12.
  • the microresonator 11 be located on the side opposite to the side where the main vibration occurs. If the micro-resonator 11 is brought into contact with the side where the main vibration occurs, the overlapping part with the microphone-port resonator support part 12 is eliminated. Vibration energy is transmitted too much from the child 11 to the micro movable section 16, the vibration energy loss increases, and the amplitude amplification factor at the resonance peak decreases significantly.
  • the fixing force of the micro movable portion 16 fluctuates due to the vibration of the microresonator 11, and there is a danger that the contact surface may slightly rise, and the resonance frequency becomes unstable.
  • the results are the same for the micro resonator 24 as shown in FIG.
  • the width of the microphone mouth resonator support portion 12 is wider than the width of the microresonator 11, which is the same as the microphone mouth resonator 11. It is configured to have a natural value of vibration. As a result, the width of the contact surface 18 when the micro movable portion 16 comes into contact also becomes wider on the microphone mouth resonator support portion 12 side, and the contact surface on the microphone mouth resonator support portion 12 side also increases. Inside, vibration can be efficiently absorbed and suppressed.
  • the width is the same, that is, if the microphone vibrates easily in the same vibration mode, the vibration of the microphone mouth resonator is transmitted too much to the support part side, and the microphone mouth resonator as shown in Fig. 5
  • the effective length of the micro-resonator is increased toward the end of the micro-resonator support. Therefore, in the microresonator as shown in FIG. 5, it is desirable that the microresonator support portion has at least a width different from that of the microresonator.
  • the dimensions of the resonator are lower length 5.0 ⁇ , upper length 7.41 111, height 1.0 ⁇ m, width 1
  • the width of the support is the same as that of the microresonator. 1.
  • the support is expanded to 4.0. In this case, the resonance frequency was increased by about 10%.
  • At least the resonance frequency of the micro movable portion that directly contacts the micro-resonator is higher than the resonance frequency of the micro-resonator.
  • the width 52 of the tip 51 of the micro movable portion 50 is reduced, and the local resonance frequency of the tip 51 directly in contact with the microphone mouth resonator is reduced. It was made to be higher than the resonance frequency of the child.
  • the tip 51 also has a large intrinsic constant, making it very difficult to vibrate. As a result, as shown in Fig.
  • the dimensions of the resonator are lower length 2.0 ⁇ m, upper length 4.4 ⁇ , high
  • a micro movable part of length 1.0 ⁇ m, width 4.0 ⁇ m, and height 2.0 / xm is brought into contact with 1.1.0 ⁇ , width 1.0; um
  • the micro movable part also vibrated, and the amplitude of the resonance peak decreased and the sub-resonance peak increased, but as shown in Fig. 9, the tip of the micro movable part was moved over a height of 1. ⁇ / ⁇ .
  • the local resonance frequency (eigenvalue) at the tip By setting the local resonance frequency (eigenvalue) at the tip to be 1.0 / X m in length and 1.0 / X m in width and smaller than that of the microphone mouth resonator, as shown in Fig. 6, In addition, it was possible to prevent the increase of the sub resonance peak.
  • a plurality of micro movable portions having different resonance frequencies (eigenvalues) are provided by changing the size and shape of the tip portion of the micro movable portion, for example, having two types of resonance frequencies with respect to the microresonator.
  • Micro movable parts one end and By arranging it so that it can be in contact with the other end and using the micro movable part with the higher resonance frequency and the micro movable part that is not so large in contact, the resonance peak intensity and the amplitude amplification factor (Q value) of the resonance peak can be reduced. Different control can be used when changing the resonance frequency without significantly lowering it, and when changing the resonance frequency by lowering the resonance peak intensity and the amplitude amplification factor (Q value) of the resonance peak to some extent.
  • a preferred embodiment for changing the resonance frequency of the tip can be easily achieved by reducing the width 52 of the tip and changing only the width 52 of the tip as shown in FIG.
  • the method of changing the resonance frequency of the tip is not limited to this, but by selecting and contacting the micro movable parts having different resonance frequencies in this way, the vibration of the microphone mouth resonator from the contact surface can be absorbed.
  • the degree of interference change it is possible to change not only the resonance frequency but also the magnitude of the amplitude, that is, the signal strength range that can be input to the microresonator.
  • Micro movable parts are prepared for both ends of the microresonator.
  • One is near the end position of the line segment indicating the effective length of the microresonator, and the other is the effective length of the microresonator.
  • the resonance frequency of the microphone mouth resonator can be precisely adjusted over a wide range with less decrease in the vibration peak intensity and the deterioration of the amplitude amplification factor (Q value) of the vibration peak. It becomes.
  • an adhesion prevention layer is formed on the surface of the movable part of the microphone, which is the movable side, at the contact part between the micro movable part and the microresonator.
  • An example is shown in FIG. 10, in which an anti-sticking layer 61 is formed so as to cover the tip of the micro movable portion 60.
  • the anti-sticking layer is made of a material different from at least the upper surface 62 of the microresonator 63, and it is necessary to select a material that is difficult to be pressed against even if pressure is applied at the time of contact.
  • the hardness of the material of the anti-sticking layer is selected to be different from the hardness of the core portion 64 of the micro mouth resonator or the micro movable portion.
  • single crystal silicon is used for the microresonator, and a silicon nitride film is used for the anti-sticking layer of the micro movable part.
  • the surface of the microresonator and the surface of the anti-sticking layer are desirably different in smoothness. In this case, the silicon surface of the microresonator is monotonous and flat, whereas the surface of the anti-sticking layer is nitrided.
  • the surface of the silicon film has a gentle curve, so that even if it is pressed during contact, the entire contact surface does not completely adhere, leaving a space or gap with a very small area to prevent sticking. It has become.
  • the surface of the microresonator is gradual and has large irregularities. It is preferable to form a sticking prevention layer on the microresonator side surface by performing a smoothing process on the silicon surface using, for example, isotropic etching conditions. At this time, it is preferable that the processing range of the smoothing includes at least the range in which the movable portion of the microphone can be pressed, as in 66.
  • the method of smoothing is not limited to this, and the surface may be smoothed, for example, by coating a silicon nitride film.
  • the silicon nitride film side of the anti-sticking layer on the micro movable portion side may be configured to have a monotonous and flat surface than the polysilicon film surface on the micro resonator side.
  • the anti-sticking layer is composed of crystals having a smaller particle size as the surface is closer to the surface, the irregularities dependent on the particle size of the surface layer are small, and a flat or monotonous curved surface is formed. It has become so.
  • the film thickness of the anti-sticking layer is sufficient to ensure that the micro movable portion and the micro resonator are insulated in a DC manner even when in contact with the micro resonator.
  • the potential of the movable part and the potential of the micro-resonator can be controlled independently, and the potential of the micro-resonator can be adjusted so that the output from the micro-resonator is optimized. On the part side, the potential can be fixed at OV, for example.
  • the length 65 of the micro movable portion 60 in the direction indicating the effective dimension of the micro resonator 63 is the thickness of the micro resonator 63, or However, the length of the microresonator in the main vibration direction is longer.
  • the length 65 indicating the effective dimension of the microphone mouth resonator 63 is shorter than the thickness of the microphone mouth resonator 63, the vibration energy transmitted from the side where the main vibration of the micro resonator occurs.
  • the direction of the pressing force of the contact part between the movable part of the microphone and the resonator of the microphone opening is almost perpendicular to the direction of the line indicating the effective value of the dimension related to the main resonance frequency of the microresonator.
  • the micro movable section 16 is pressed almost perpendicularly to the direction of a line segment 22 indicating the effective value of the dimension related to the main resonance frequency of the micro resonator 11, This is because the degree of freedom at the top of the microresonator 11 can be effectively restricted, and the effective length of the microresonator 11 can be effectively changed.
  • This is not limited to the micro-resonator shown in FIG. 3, but the same effects can be obtained for the micro-resonators shown in FIGS. 5, 22, and 28.
  • the direction of the pressing force of the contact portion between the micro movable portion and the microphone mouth resonator is given substantially parallel to the main vibration direction of the micro resonator.
  • the contact surface between the microphone opening movable part 16 and the micro-resonator 13 is almost perpendicular to the vibration direction 37 of the micro-resonator 11. It is desirable that the micro-resonator 11 is connected to the micro-movable part 16 and the micro-resonator 13. This is because it is effective in restricting the degree of freedom and changing the effective length. This is not limited to the microresonator shown in FIG. 3, but the same effects can be obtained for the microresonators shown in FIGS. 5 and 22.
  • the drive mechanism of the micro movable part is to press at least the micro movable part.
  • a bimorph piezoelectric element 129 having a piezoelectric member 120 having flexibility can be used.
  • One end of the piezoelectric element 128 is fixed on the substrate by a bimorph element fixing part 130, and the other end has a micro movable part 128 contacting a microresonator (not shown). It is provided.
  • a bimorph type piezoelectric element includes an internal electrode layer 125 serving as a first electrode and an external electrode layer serving as a second electrode.
  • the bimorph-type piezoelectric element 1 29 bends, and the tip provided with the micro movable section 128 moves as indicated by an arrow 124. As a result, a driving force in the pressing direction can be generated on the micro movable portion 128.
  • a plate-like bimorph type piezoelectric element parallel to the substrate is used as in the present embodiment, fabrication on the substrate is easy, and only wiring to the electrodes of the piezoelectric element is required, so that the occupied area is reduced.
  • the microphone opening drive mechanism can be manufactured on the substrate. In order to be able to press the movable part of the microphone opening on both ends of the microphone opening resonator as shown in Figs. 3 and 5, an additional micro movable part driving mechanism as shown in Fig. Just fine.
  • a thickness-deformable piezoelectric member is provided. As shown in FIG. 31, when the thickness-deformable piezoelectric member 13 1 is used for the bimorph-type piezoelectric element fixing portion 130, a potential difference is applied to the control electrodes 13 2 and 13 3 of the thickness-deformed piezoelectric element. As a result, the bimorph-type piezoelectric element 129 provided with the micro movable portion 128 can be deformed in the thickness direction as indicated by an arrow 136, and can be moved. The micro movable section 128 can be moved in the pressing direction only by this operation.
  • the bimorph piezoelectric element 128 can be moved. By operating in combination with, the pressing position of the micro movable portion 128 can be changed. According to the present embodiment, since the thickness-deformable piezoelectric element can be formed only by laminating the electrode layer and the piezoelectric layer, it can be easily formed on the substrate and the occupied area can be suppressed.
  • a slip deformation type piezoelectric member is provided. As shown in FIG. 32A, if the slip-deformable piezoelectric member 141 is provided in the bimorph-type piezoelectric element fixing part 130, the potential is applied to the electrode layers 144 and 147 on both sides. By giving the difference, the slip-deformable piezoelectric member 14 1 is deformed as shown by the arrow 14 9 as shown in FIG. 32B, and the bimorph-type piezoelectric element 12 9 can be moved. .
  • the pressing position of the micro movable part 128 can be changed only by this operation, the reproducibility is higher by combining it with the thickness deformable piezoelectric element 140 and the bimorph type piezoelectric element 129. It is possible to change the pressing position with high precision.
  • FIG. 11 the drive mechanism of the micro movable part is formed with a first electrode 70 fixed on the substrate and a fixed distance from the electrode, and is connected to the micro movable part 71 and externally. Due to the potential difference between the first electrode 70 and the first electrode 70 caused by the applied voltage 72, the micro movable part 71 can be moved toward or away from the first electrode 70, thereby moving the micro movable part 71.
  • An electrode 73 and an elastic body 74 electrically connected to a side surface of the second electrode 73 and supporting the second electrode 73 and a structure connected to the electrode are provided.
  • the electrode size is controlled by using the electrostatic force generated by the potential difference between the voltage applied to the input electrode and the voltage applied to the resonator.
  • the size is automatically limited by the size of the resonator, which is determined by the frequency of the element.
  • the electrode area must be reduced, so that a large electrostatic attraction cannot be obtained and the frequency control is limited. there were.
  • the elastic constant of the resonator increases, so that the effect of electrostatic force becomes relatively small, and it becomes more difficult to control the resonance frequency.
  • the size of the first electrode 70 and the second electrode 73 can be set freely, regardless of the size (frequency) of the microresonator, to obtain the force to press the micro movable part for controlling the frequency.
  • the size (elastic constant) of the elastic body connected to and supported by the micro movable portion 71 and the second electrode 73 can be freely set, the control range of the resonance frequency can be widened. .
  • the thickness is 1.0 Om, the width is 3.0 Aim, and the length is 77.0.
  • the panel constant can be reduced to about 0.9 NZm by supporting it with a folded structure by connecting ⁇ m springs.
  • the second Assuming that the area of the pole 73 is 100 000 ⁇ 2 and the distance between the first electrode 70 and the second electrode when no voltage is applied is 1.0 O / xm, micro movable When the second electrode is OV, the voltage required to press the part 71 against the microphone resonator is only required to apply about 1.5 V to the first electrode.
  • FIGS. 11 and 12 show two sets of microphone opening movable unit driving mechanisms connected to each other, and both ends of the microphone opening resonator as shown in FIG.
  • the micro movable parts can be equally contacted.
  • the micro movable portion 71 contacts the microresonator 80 (shown only in FIG. 12), and from this distance, the fulcrum position Is changed to a form that supports the original fulcrum 79 and the microphone opening movable part 71 and two places each, a total of four places (panel form 1 of the second stage). Then, from the stage where the microphone opening movable portion 71 comes into contact with and pushes the microphone opening resonator 80, it is possible to increase the elastic modulus of the structure supporting the second electrode 73 and the structure connected to the electrode. it can.
  • the micro movable portion 71 when the micro movable portion 71 is moved until it comes into contact with the microresonator 80, it has a small elastic constant determined by the length 81 and the structure connected to the micro movable portion 81. After the micro movable portion 71 comes into contact with the micro-resonator 80, the length is determined by the length 82 and the structure connected thereto, so that at least the length 81 and the structure connected thereto Since the elastic constant becomes higher than that of the elastic body determined by the above, the moving distance of the second electrode 73 can be suppressed.
  • the distance from the first electrode 70 is equal to the distance 8 between the first electrode 70 and the second electrode 73 at a balanced position where no potential difference is given.
  • the second electrode 73 is close to the first electrode 70
  • the micro movable portion 71 comes into contact with the micro resonator before the next step. Thereby, the micro movable portion 71 can be brought into contact with the microphone mouth resonator before the second electrode 73 approaches the first electrode 70 too much to cause pull-in.
  • the bullet 1 "living body supporting the second electrode 73 and the structure connected to the second electrode 73 include a bent portion.
  • a concave portion 76 is formed in the upper part of the micro movable portion 71, and as shown in FIG. 13,
  • FIG. 14 a preferred embodiment of the micro movable portion driving mechanism in the case where the microphone movable portion is brought into contact with only one side of the microphone opening resonator instead of both sides will be described with reference to FIGS. 14 and 15.
  • FIG. 14 a preferred embodiment of the micro movable portion driving mechanism in the case where the microphone movable portion is brought into contact with only one side of the microphone opening resonator instead of both sides will be described with reference to FIGS. 14 and 15.
  • FIG. 14 different micro movable portions are selectively used at both ends of the micro resonator to make contact with the micro resonator, or the coarse adjustment micro movable portion and the fine adjustment microphone opening movable. The part can be used properly to make contact with the microphone mouth resonator.
  • the micro movable portion driving mechanism is formed with a first electrode 90 fixed on a substrate and a fixed distance from the electrode, connected to the micro movable portion 91, and externally.
  • the second electrode 93 that can move the micro movable part 91 by moving toward or away from the first electrode 90 by the potential difference between the first electrode 90 and the potential caused by the applied voltage 92
  • an elastic member 94 electrically connected to the side surface of the second electrode 93 and supporting the second electrode 93 and the structure connected to the electrode (a first-stage panel form 2).
  • the second electrode 93 and the electrode A second support portion 95 is formed on the elastic body 94 that supports the structure connected to the elastic member 94.
  • the second support portion 95 and the microphone opening movable portion 91 respectively move to the second position on the substrate.
  • the support part touches the contact surface 96 and the micro-resonator 100 (only shown in Fig. 15). From this distance, the fulcrum position is the original fulcrum 97, the second support part 95 and the micro movable part.
  • 9 Changed to the form of support at 3 places (1) (panel form 2 of the second stage). Then, from the stage where the micro movable portion 91 comes into contact with the microphone opening resonator 100 and pushes it into the microphone opening portion, the intrinsic coefficient of the structure supporting the second electrode 93 can be increased.
  • the position of the second support portion 95 can be arbitrarily formed anywhere in the elastic body 94, the length of the micro movable portion 91 after the micro movable portion 91 comes into contact with the microresonator 100 can be reduced.
  • the high elastic constant determined by 102 can be set arbitrarily.
  • the distance from the first electrode 90 is equal to the distance 1 between the first electrode 90 and the second electrode 93 at a balanced position where no potential difference is applied.
  • the micro movable part 91 contacts the micro resonator or the second support part 9 5 is in contact with the second support contact surface 96 on the substrate.
  • the microphone opening movable section 91 can be brought into contact with the microphone opening resonator before the second electrode 93 comes too close to the first electrode 90 to cause pull-in.
  • the distance from the first electrode 90 is equal to the distance 1 between the first electrode 90 and the second electrode 93 at a balanced position where no potential difference is applied.
  • the second electrode 93 is connected to the first electrode 93 until the dynamic distance 104 or the distance until the second support 95 contacts the second support contact surface 96 on the substrate.
  • the micro movable portion 91 comes into contact with the micro resonator, or the second support portion 95 comes into contact with the second support portion contact surface 96 on the substrate.
  • the microphone opening movable section 91 can be brought into contact with the microphone opening resonator before the second electrode 93 approaches the first electrode 90 too much to cause pull-in.
  • the second support portion 95 and the microphone opening movable portion 91 are provided with concave portions 99, 98 at the upper portions, respectively.
  • the microphone opening movable portion 91 is pressed, a small amount of bending occurs at a portion connected to the microphone opening movable portion, so that the lower surfaces of the micro movable portion 91 and the second support portion 95 become horizontal.
  • Prevents further tilting suppresses the direction of the pressing force from deviating from the vertical direction, and prevents the second electrode 93 from tilting from the horizontal direction, thereby suppressing the moving direction from deviating from the vertical direction. be able to.
  • FIG. 16 shows the relationship between the control voltage applied to the first electrode and the movement distance (z) of the micro movable part (Fig. 16) and Fig. 16 when the micro movable part as shown in Fig. 14 is used.
  • the relationship between the control voltage applied to the first electrode and the fixing force of the micro movable part (Fig. 17) is shown.
  • the microphone opening movable part is designed to contact the microphone opening resonator at a control voltage of 20 V.
  • the movement of the micro movable part is caused by the potential difference between the first electrode and the second electrode.
  • OV is applied as a fixed potential to the second electrode, and the control voltage applied to the first electrode Only the micro movable part is operated.
  • the dashed line in Fig. 16 shows the result without the second support (only the first-stage panel form 2).
  • the contact distance with the micro-resonator rapidly increased, and the pull-in You can see that the danger is increasing.
  • the embodiment of the present invention indicated by the solid line the distance hardly increases after contact with the microresonator, and it can be seen that pull-in is completely suppressed.
  • the first-stage form 2 panel after contact with the microresonator, the first-stage form 2 panel hardly changes, and after the contact, the second-stage form panel, which has almost a large elastic constant, in the indentation stage. Shows that the fixing force is determined.
  • the panel form 2 of the first stage with a low elastic constant is used so that movement can be performed with a weak force.
  • the pushing stage after contact the movement is suppressed and a high fixing force is applied.
  • the second stage Panel Form 2 with a higher elastic constant.
  • the micro movable portion is in a position where the first electrode 110 and the second electrode 111 are in a balanced position where no potential difference is given.
  • a third electrode 112 capable of giving a driving force to the second electrode 111 and the movable microphone opening connected to the electrode is provided.
  • the micro movable part connected to the second electrode can be separated from the micro resonator by rocking it while applying a force in the vertical direction, so that the function as the microphone opening resonator can be restored without dismantling the micro resonator.
  • the voltage 113 applied from the outside to the third electrode is a force that is effective even if the voltage is gradually increased.
  • a periodic voltage such as a pulse signal or an RF signal is applied. It is desirable that the fluctuation be given by an input including lifting and lowering, or an input including periodic on-off control. Further, when a periodic voltage change is alternately applied in conjunction with the first electrode, a further effect can be obtained.
  • the first electrode 1 15 and the second electrode 1 A second electrode is formed at a fixed distance from the second electrode connected to the micro movable section in a direction orthogonal to the direction in which the opposite faces, and is generated by an externally applied voltage. Due to the potential difference between the first electrode 115 and the second electrode 116, the micro movable portion connected to the second electrode is shaken in a direction orthogonal to the direction in which the first electrode 115 and the second electrode 116 face each other. It has a fourth electrode 117 capable of providing a driving force for powering.
  • the second electrode is opposed to the fourth electrode 117 at a certain distance, but is connected to the movable portion of the microphone, and is electrically connected to the second electrode.
  • the degree of freedom in electrode placement is high, and the fourth electrode can be formed in the same layer as the second electrode or in a different layer. Also, cost can be reduced by simplifying the process.
  • the fourth electrode 117 can be installed in a direction facing the second electrode 116 or both sides of the structure connected to the micro movable portion. Even if the first electrode 115 is not used, the same operation as the above and the method using the third electrode 112 and the first electrode 110 can be performed to remove the adherence.
  • a micro movable portion 216 that can change the resonance frequency of the microresonator, the amplitude amplification factor at the resonance peak, or the inputtable signal strength by acting on the microresonator 213 is provided.
  • a silicon substrate is used for the substrate 210, and polysilicon doped with impurities is used for the microresonator 211.
  • the micro-resonator 2 11 vibrates selectively in response to a change in a frequency signal near the resonance frequency of the micro-resonator 2 11.
  • the input electrode 2 15 be disposed on the same side as the micro movable section 2 16 with respect to the micro resonator 2 11. Due to the potential difference between the microresonator 2 1 1 and the input electrode 2 15, the center of vibration of the microphone mouth resonator 2 11
  • the microphone opening movable section 2 1 16 is arranged so that the microphone opening movable section 2 16 contacts or separates from the micro-resonator 2 13 when operated from the outside. 6 can be powered, and the micro movable portion 2 16 can be brought into contact with the microphone mouth resonator 2 13 with a predetermined force, or the micro movable portion 2 A drive mechanism 2 17 is provided.
  • Reference numeral 218 denotes a contact surface between the microphone opening movable portion 216 and the microresonator 213.
  • FIG. 21 is a plan view of the microresonator 211 of the second embodiment shown in FIG. 20 in a direction showing a dimension related to a main resonance frequency, that is, an effective value of the length of the resonator.
  • the supporting end of the microresonator 2 1 1 has a high degree of freedom, so the effective length 2 2 5 of the micro resonator 2 1 1 is smaller than the lower dimension 2 2 6 of the resonator. , Which is close to the dimension 2 27 on the upper side of the resonator. Such a place In this case, as shown in FIG.
  • the micro movable part 2 16 is brought into contact with a place having a high degree of freedom near the support end of the micro resonator 221 so that the effective effect of the microphone mouth resonator 2 1 1 is obtained.
  • the length changes, and the resonance frequency can change.
  • the resonance frequency of the microresonator can be easily changed.
  • the effective length 2 25 of the microresonator 2 1 1 is located between the lower length 2 2 6 of the microresonator and the length 2 2 9 between the micro movable part 2 16 .
  • the microresonator 241 When the support portion 242 of the microresonator 241 is long as in the microresonator 243 shown in FIG. 33, or when the microresonator is bent, the microresonator is Since the vibrating region of the micro-movable part 246 spreads like 249, it is effective that the micro movable portion 246 is brought into contact with, for example, the side surface 250 near the vibrating end.
  • the driving mechanism includes a first electrode 270 fixed on a substrate, a fixed distance from the first electrode 270, a micro movable portion (not shown), and a connecting portion 280. 6, and the micro movable part can be moved by moving toward or away from the first electrode 270 by a potential difference from the first electrode 270 generated by a voltage applied from the outside.
  • a second electrode 273 that can be electrically connected to a side surface of the second electrode 273 and an elastic body 274 that supports the second electrode 273 and a structure connected to the electrode; And As shown in FIG.
  • the first electrode 270 and the second electrode 273 have a comb shape, and each comb portion is formed at a fixed distance 287. I have. Then, the comb portion of the second electrode 273 moves toward or away from the comb portion of the first electrode 270. This makes it possible to easily bring the micro movable portion into contact with the micro resonator vibrating in a direction parallel to the substrate, and to move the micro movable portion in a direction in which the micro movable portion is pressed or released.
  • the case where the electrode of the comb portion moves in the direction perpendicular to the length direction of the comb is shown, but a tuning fork type comb electrode in which the electrode moves in the direction parallel to the length direction of the comb is used.
  • the first electrode 270, the second electrode 273, the structure connected to the electrode, and the elastic body 274 supporting the electrode are all micro-resonators.
  • the process is further simplified compared to the drive mechanism of the micro movable section shown in Figs. 11 and 14 formed on the microphone mouth resonator vibrating in the direction perpendicular to the substrate. And cost reduction.
  • the comb size and the number of the first electrode 270 and the second electrode 273 are determined by the size (frequency) of the microresonator.
  • the size (elastic constant) of the elastic body 274 supported by being connected to the micro movable part and the second electrode 273 can be freely set. Can be widened.
  • the drive mechanism shown in Fig. 23 is made of polysilicon, the thickness of the comb is 1. 1 ⁇ , the length is 50. ⁇ , the number of combs is 100, and no voltage is applied.
  • the distance 287 between the first electrode 270 and the second electrode 273 is 2.0 m, the thickness of the elastic body 274 is 1.0 O / xm, and the length is 100 Assuming that 0 ⁇ and width 3.0 ⁇ , the micro movable part can be pressed with a voltage of about 2 OV.
  • the elastic constant of the elastic body For example, if the length of the elastic body is doubled, the voltage for pressing the micro movable part can be reduced to 7 V.
  • the drive mechanism of the microphone opening movable part is formed at a fixed distance from the second electrode 273 and on the opposite side to the first electrode 270.
  • the second electrode 273 and a micro movable portion (not shown) connected to the second electrode 273 and the connecting portion 286 by a potential difference between the second electrode 273 and the second electrode 273 generated by an externally applied voltage.
  • a third electrode 290 capable of applying a driving force to the third electrode.
  • the third electrode 290 has a comb shape, and the comb portion is formed at a constant distance 2888 from the comb portion of the second electrode 273. I have.
  • the comb portion of the second electrode 273 moves so as to approach or separate from the comb portion of the third electrode 290.
  • the second input is performed by an external input.
  • the electrode 273 can be shaken in the horizontal direction to separate the micro movable part, thereby applying power to the micro movable part connected to the second electrode 273 in the horizontal direction.
  • Micro moving part Since the microphone can be separated from the microphone mouth resonator, the function as the microresonator can be restored without dismantling the microphone mouth resonator.
  • the voltage externally applied to the third electrode 290 is effective even if the voltage is gradually increased.
  • the voltage be periodically raised and lowered such as a pulse signal or an RF signal. It is desirable that the fluctuation be given by an input that includes or an input that includes periodic on / off control. Further, when the periodic voltage change is alternately applied in conjunction with the first electrode 270, more effect can be obtained.
  • the first electrode 270, the second electrode 273, the structure connected to the electrode, and the elastic body 274 supporting the third electrode 279 together with the structure. Since 0 can also be formed in the same layer as the microresonator, the process can be simplified and costs can be reduced.
  • the size of the third electrode 290 and the second electrode 273 can be freely set regardless of the size (frequency) of the microphone mouth resonator, and the micro movable portion
  • the size (elastic constant) of the elastic member 274 supported by being connected to the second electrode 273 can be freely set, so that it can be applied to microphone mouth resonators having various resonance frequencies.
  • the case where the electrode of the comb portion moves in the direction perpendicular to the length direction of the comb is shown, but a tuning fork type comb electrode in which the electrode moves in the direction parallel to the length direction of the comb is used. It is apparent that a driving force can be similarly applied to the micro movable portion. Further, by connecting the drive mechanism shown in FIG.
  • the thickness of the comb is 1.0 O / i in, the length is 40.0 ⁇ m, the number of combs is 30, and the first electrode 270 and the second electrode 2 with no voltage applied If the distance 2 87 of 7 3 is 1.0 / m, the thickness of the elastic body 2 74 is 1.0 ⁇ , the length is 100.0 ⁇ m, and the width is 3.0 Aim, about 2 With a voltage of V, the pressing position of the micro movable part can be changed by about 1 nm.
  • the microphone opening movable portion drive mechanism drives the microphone opening in a direction orthogonal to the direction in which the first electrode 260 and the second electrode 263 face each other. It has a fourth electrode 26 2 that can be powered.
  • the second electrode 26 3 and the elastic body 26 4 supporting the structure connected thereto move in the direction in which the first electrode 260 and the second electrode 26 Place them so that It is.
  • the micro movable portion when the micro movable portion does not return to the original position after the micro movable portion is fixed, a force is applied laterally to the micro movable portion connected to the second electrode 263 by an external input. By shaking while adding, the fixed micro movable part can be easily separated from the micro resonator.
  • an electrode in which comb electrodes having different moving directions are combined is used for the micro movable portion driving mechanism, but the arrangement and combination of the comb electrodes are not limited thereto. However, by arranging as shown in FIG. 34, the comb-shaped electrodes can be formed in a small space with good balance.
  • a connecting portion 286 or 266 at the tip of the microphone opening movable portion driving mechanism shown in FIGS. 23 and 34 is connected to a connecting portion 275 as shown in FIG.
  • the two sets of micro movable parts 2 71 are connected, and as shown in the micro resonator shown in FIG. 2, the both ends of the microphone mouth resonator 280 can be simultaneously and equally contacted with the both ends of the microphone mouth resonator.
  • Such a structure is formed integrally with the micro movable portion drive mechanism shown in FIG. 23, and a structure supported by the elastic body 274 or 264 makes it possible to move the second electrode in the horizontal direction. However, the lateral displacement can be suppressed.
  • the second electrode 27 3 and the active body 27 4 (the first-stage panel form 3) supporting the structure connected to the electrode include a first electrode 27 0 and a second electrode 27 3 Approaching a predetermined distance, the micro movable portion 271 comes into contact with the microresonator 280, and from this distance, the fulcrum position is changed from the original elastic body 274 to the two micro movable portions 271. It is changed to the form supported by (Panel form 3 in the second stage).
  • the elastic modulus of the structure supporting the second electrode 273 and the structure connected to the electrode is increased from the stage where the microphone opening movable portion 271 contacts and presses the microresonator 280. Can be.
  • the small elastic constant of the panel form 3 in the first stage enables a large distance to be moved at low voltage, and the micro movable Part 2 7 1 is in contact with microresonator 2 After touching, the elastic constant of the second-stage panel form 3 becomes high, so that the moving distance of the second electrode 273 is suppressed, and the force of the elastic body supporting the second electrode 273 is reduced.
  • the second electrode 273 cannot withstand the electrostatic force acting between the second electrode 273 and the first electrode 270, and the second electrode 273 penetrates the first electrode 270 ( Punolein) can be prevented, and the pushing force of the micro movable part 27 1 can be increased.
  • a preferred embodiment of the micro movable portion driving mechanism in the case where the micro movable portion is brought into contact with only one side of the micro resonator will be described with reference to FIG. As shown in Fig. 24, using a connected body 2 95 where two sets of micro movable parts are connected, one micro movable part 29 1 is brought into contact with the micro resonator 29 3 and the other microphone opening movable.
  • the part 292 is brought into contact with a dummy 294 formed separately from the microresonator.
  • a dummy 294 formed separately from the microresonator.
  • different micro movable parts are used at both ends of the microresonator to make contact with the microresonator.
  • the micro movable portion for coarse adjustment and the movable portion of the microphone opening for fine adjustment can be selectively used to make contact with the microphone opening resonator.
  • the predetermined distance is a distance from the first electrode 270, and a balanced position where no potential difference is applied to the first electrode 270 and the second electrode 273.
  • the micro movable portion contacts the microresonator before the second electrode 273 approaches the first electrode 270 up to two thirds of the distance 287 between the electrodes in the above. Thereby, the micro movable portion can be brought into contact with the microphone mouth resonator before the second electrode 273 approaches the first electrode 270 too much to cause pull-in.
  • the present invention can be easily applied to the microphone mouth resonator shown in FIG. 27 that vibrates in a vertical or Balta vibration mode in a direction parallel to the substrate. This will be described with reference to 26.
  • a microresonator 313 composed of a microresonator 311 formed on a substrate 310 and oscillating in response to selected parameter variations and its support 312 By acting on the microresonator 3 1 3 It has a micro movable section 316 that can change the resonance frequency of the resonator 311 or the amplitude amplification factor at the resonance peak or the inputtable signal strength.
  • a silicon substrate is used for the substrate 310, and a tungsten nitride film is used for the microresonator 311. Then, among the high-frequency electric signals supplied from the input electrode 3 15, the micro-resonator 3 11 vibrates selectively according to the fluctuation in the frequency signal near the resonance frequency of the microphone-port resonator 3 11.
  • the micro movable portion 3 16 can be powered by an external operation so as to contact or separate from the microphone mouth resonator 3 13, and the micro movable portion 3 16
  • a micro movable unit driving mechanism 317 is provided that can contact the microresonator 3 13, or change the magnitude of a predetermined force that is in contact with the micro resonator 3, and the position of the contact.
  • FIG. 27 is a cross-sectional view of the microresonator 311 of the third embodiment shown in FIG. 26 in a direction showing a dimension related to a main resonance frequency, that is, an effective value of a length of the resonator.
  • a dimension related to a main resonance frequency that is, an effective value of a length of the resonator.
  • the vibration region of the microresonator 311 is wider than the lower dimension of the resonator, and the The effective length 325 is close to the dimension 327 on the upper side of the resonator. Even in such a case, as shown in FIG.
  • the micro movable section 316 is brought into contact with a place having a high degree of freedom near the support end of the microresonator 311 so that the micro resonance
  • the effective length 3 28 of the element 3 1 1 changes to be located between the length 3 2 9 of the upper surface of the resonator and the length 3 2 6 of the lower part of the microphone mouth resonator, thereby changing the resonance frequency. You can change it.
  • the resonance frequency can be easily changed as in the first and second embodiments.
  • a micro movable portion driving mechanism as shown in FIG. 11 can be used.
  • the micro movable portion is configured to be concentrically annularly in contact with the micro resonator.
  • 3 38 indicates a contact surface.
  • the dimension related to the main resonance frequency that is, the effective length of the resonator in the radial direction
  • the line segment direction 3300 is the radial direction, so as shown in the figure, by making annular contact near the support end, the effective length can be effectively changed in all radial directions, Wave number can be changed.
  • the micro movable section drive mechanism as shown in FIG. 14 is connected to each of the four divided micro movable sections as shown in the figure, the pressing position of the microphone opening movable section can be changed in the radial direction.
  • the direction of the pressing force of the contact part between the micro movable part and the micro resonator is in the direction of the main vibration of the micro resonator (radial direction) with respect to the substrate plane.
  • the direction is almost perpendicular to the direction.
  • the main vibration direction and the line direction 330 indicating the dimension related to the main resonance frequency are aligned, so it is effective to press it perpendicularly to the substrate plane. Can change the resonance frequency.
  • a microphone opening resonator 402 is formed by a normal dry etching technique using a photoresist on a silicon layer on the surface of an SOI substrate 400, and then, A first conductive layer 403 including a first electrode made of polysilicon doped with an impurity having a thickness of 200 nm is formed. At this time, the silicon oxide layer of the SOI substrate below the microresonator 402 can be used as the first sacrificial layer 401.
  • the microresonator 402 is formed on the first sacrificial layer 401, and a resist is formed thereon by a lithography method.
  • the first conductive layer 403 including the first electrode is formed by a lift-off method.
  • a silicon oxide film 404 as a second sacrificial layer was formed on the microresonator 402 and the first conductive layer 403 as 2.0 ⁇ ⁇ ⁇ ⁇ .
  • the silicon oxide film is deposited, and a part of the silicon oxide film is processed using a dry etching method to expose a part of the microresonator.
  • the gap between the micro movable part and the micro resonator After depositing a silicon oxide film 100 nm as the third sacrificial layer 406 and removing unnecessary parts, as shown in Fig. 35D, silicon nitride as the anti-sticking layer 409 Deposit 100 nm of film and remove unnecessary parts.
  • the second conductive layer 4 10 including the micro movable section 4 12, the second electrode and the structure 4 13 connected to the electrode has a thickness of 2.0 ⁇ m. It is formed of a polysilicon film doped with an impurity of ⁇ .
  • FIG. 35F a structure in which the second and third sacrificial layers are removed to connect the microresonator 402, the micro movable portion 412, the second electrode, and the electrode Exposing 4 13 to form a microresonator.
  • a micro-resonator formed by digging a substrate as shown in FIGS. 1 and 2 is formed on a micro-resonator, and then laminated on the micro-resonator to drive the micro movable portion and the microphone opening movable portion. Since it is possible to easily form the microphone opening, there is an effect that the microphone opening movable portion can be formed as a completely separate process later without changing the process of forming the microresonator.
  • the gap between the first electrode and the second electrode, the gap between the micro movable portion and the micro resonator, and the gap having different widths must be formed with high accuracy. Therefore, as shown in FIG. 35, when the second sacrificial layer 404 is applied, processing is performed until the microresonator is exposed. It is processed until the layer bonded to is exposed. Then, a third sacrificial layer 406 is deposited on the exposed conductive layer.
  • the gap 416 between the first electrode and the second electrode is determined by the total thickness of the second sacrificial layer 404 and the third sacrificial layer 406, and Regarding the gap 415 of the micro-resonator, the gap width can be controlled only by the deposited film thickness of the third sacrificial layer 406, so that two types of highly accurate gaps with little variation can be formed.
  • the third sacrificial layer deposited on the upper layer 8 must be removed, in a preferred embodiment, in the step of forming the third sacrificial layer 406, the first conductive layer 40 A step of removing the third sacrificial layer 406 formed on 8 to expose the first conductive layer 408, and a position where the second conductive layer 410 becomes a bent portion Hollow 4 0 In order to form 7, the step of processing the third sacrificial layer 406 is performed simultaneously. As a result, the patterning for forming a bent portion in the second conductive layer 410 and the patterning for exposing the first conductive layer can be performed using the same mask, thereby simplifying the process. it can.
  • the first layer sacrificial film removing step performed to form a space below the microphone mouth resonator 402 and the second layer 3 Since the step of removing the sacrificial film of the layer can be performed at the same time, an increase in the number of steps can be suppressed.
  • the configuration of the micro movable unit is not limited to this. As shown in FIG. 14, even when the microphone opening movable portion is configured to be able to contact only one side of the microphone opening resonator, since the layer configuration is the same, it can be easily manufactured according to the present embodiment.
  • an impurity-doped polysilicon layer as a first conductive layer 424 including a first electrode was formed on a silicon substrate 420 as a conductive layer.
  • an oxidized silicon film 200 nm is formed thereon as the first sacrificial layer 422. Then, after processing the first sacrificial layer 422 to expose the first conductive layer 424, a polysilicon film 2 doped with impurities is formed on the first sacrificial layer. Deposit 0 ⁇ m and perform patterning by anisotropic dry etching to form a microphone mouth resonator 423 as shown in FIG. 36B. Next, as shown in FIG. 36C, a second sacrificial layer is formed on the microresonator 42 3.
  • a silicon oxide film 2. . ⁇ is deposited as 4 27, and the second sacrificial layer 4 27 is processed by anisotropic dry etching to expose a part of the microresonator 4 23. Let it. Although the following is not shown, the microphone mouth resonator can be manufactured by the steps shown in FIGS. 35C to 35F.
  • the microresonator 423 it is necessary to form the microresonator 423 on the substrate.
  • the first conductive layer 4 2 4 including the first electrode is formed in the same layer (in the same process),
  • a first sacrificial layer 422 for forming a space below the microphone opening resonator is formed on the first conductive layer 424. This simplifies the manufacturing process of the micro-resonator and the micro-movable part, and allows the first electrode to be fixed on the substrate even if the first sacrificial layer 422 is removed.
  • the first electrode and the second electrode can be formed in parallel at equal distances. Further, since the step when the second conductive layer is formed can be reduced, the subsequent steps can be performed in the same manner as the step shown in FIG. After the second sacrificial layer is formed, a CMP process (Chemical Mechanical Polishing System) can be used to make it even flatter. This increases the number of process steps and increases the cost.
  • CMP process Chemical Mechanical Polishing System
  • the configuration of the micro movable section is not limited to this. As shown in FIG. 14, even if the micro movable portion is configured to be able to contact only one side of the microphone opening resonator, since the layer configuration is the same, it can be easily manufactured according to the present embodiment.
  • the micro-resonator is not limited to this.
  • the microresonators shown in FIGS. 26 to 28 can be formed similarly.
  • a first conductive layer 436 including a first electrode is formed on a substrate 430 by a polysilicon film 200 m doped with an impurity.
  • a silicon oxide film of 200 nm is deposited as a first sacrificial layer 432.
  • the first sacrificial layer 432 is processed to expose the first conductive layer 436, and an impurity-doped polysilicon layer 2.O / Xm is deposited and puttering is performed by a dry etching method to form a microresonator 433 as shown in FIG. 37B.
  • an oxidized silicon film 2. . ⁇ is deposited on the microresonator 433 as a second eyebrow sacrificial layer 438 by anisotropic etching.
  • the second sacrificial layer 438 is processed to expose a part of the microphone opening resonator 433.
  • the microphone mouth resonator can be manufactured by the steps shown in FIGS. 35C to 35F.
  • the first sacrificial layer 432 can be processed to form the input electrode 4334 together with the microphone opening resonator 433. Further, in the present embodiment, when forming the electrode 431 electrically coupled to the microresonator 433, the first electrode and the electrode electrically coupled to the input electrode 4334 are formed.
  • the first conductive layer 436 is formed in the same layer (in the same process), and the first conductive layer 436 is formed on the first conductive layer 436 to form a space below the microresonator.
  • the sacrificial layer 4 32 of the eyebrows is formed.
  • the first electrode is fixed on the substrate, and the second electrode includes the second electrode because the first electrode can secure the flatness of the first electrode.
  • the second conductive layer is formed, the first electrode and the second electrode can be formed in parallel at equal distances.
  • the subsequent steps can be performed in the same manner as the step shown in FIG. 35.
  • the second sacrificial layer is formed, it can be made even flatter by using a CMP machine (chemical mechanical polishing machine), but there is a problem that the number of steps increases and the cost increases.
  • a preferred embodiment of a microphone mouth resonator vibrating on a substrate in a direction parallel to the substrate will be described with reference to FIG. 38 as an example.
  • a polysilicon film in which impurities are doped in the conductive layer can be used.
  • the conductive material of the present invention is not limited to this.
  • amorphous silicon, SiGe film, A metal material such as a SiC film, Ni, or tungsten can be applied to the conductive layer.
  • a case where a material in which nitrogen is contained in a high melting point metal such as tungsten is applied will be described as an example. As shown in FIG.
  • tungsten containing nitrogen was deposited to a thickness of 200 nm on a substrate 440 by a reactive sputtering method, and the electrodes 441 and 411 electrically connected to the micro-port resonator.
  • a first conductive layer including an electrode 442 connected to the first electrode of the fixed electrode, an electrode 443 connected to the second electrode, and a structure connected to the second electrode is formed.
  • the deposition conditions were a sputtering pressure of 2 Pa, RF power of 30 OW, Ar flow rate of 33.6 sccm, N2 flow rate of 8.4 sccm, and a substrate temperature of room temperature.
  • a silicon oxide film 2.0 Ozm is deposited on the first conductive layer to form a first sacrificial layer 447, and the first sacrificial layer is formed.
  • the film 447 is processed to expose the first conductive layer.
  • a tungsten layer containing nitrogen was first applied as a second conductive layer to a sputtering pressure of 2%. Pa, RF power 30 OW, Ar flow rate 33.6 sccm, N2 flow rate 8.4 sccm, 0.5 ⁇ m deposition at substrate temperature room temperature.
  • the nitrogen-containing tungsten film formed by the plurality of layers is patterned by anisotropic dry etching to form a second conductive layer including the micro-resonator 448 and the micro movable portion 449.
  • anisotropic dry etching to form a second conductive layer including the micro-resonator 448 and the micro movable portion 449.
  • a resist layer 455 having a thickness of about 5 // m is applied on the conductive layer at the second eyebrow, and then the resist layer is formed by photolithography. An opening is formed, and an anti-sticking layer 457 is deposited by a sputtering method. Next, as shown in FIG. 38E, the anti-sticking layer 456 deposited on unnecessary portions together with the resist layer 455 is removed by a lift-off method. As a result, the anti-sticking layer 457 is formed only at the tip of the micro-resonator 448 and the movable part of the microphone opening 449, and the anti-sticking layer adheres to other areas, and the micro-movable part is stressed. It is possible to prevent distortion or an error in the elastic constant of the elastic body or the gap between the electrodes.
  • the anti-sticking layer 457 remaining on the side wall of the second conductive layer after lift-off is etched back by anisotropic dry etching, whereby the side wall of the second conductive layer is formed.
  • the surface of the anti-sticking layer can be made flat and smooth, and the degree of adhesion of the contact surface with the microresonator can be increased.
  • the first-layer sacrificial film 461 is removed to expose the microresonator 448 and the micro movable portion 449 as shown in FIG. 38F. Dry etching using hydrogen fluoride gas can be applied to remove the sacrificial layer.
  • the micro movable portion can be formed with only two conductive layers simultaneously with the micro resonator, and the micro movable portion can be formed without increasing the number of conductive layers.
  • the details of the structure of the electrodes and the micro movable portion are omitted in FIG. 38, in the present embodiment, the shapes of the first, second, and third electrodes of the micro movable portion driving mechanism are combed.
  • a planar structure can be realized by a parallel plate type or a tuning fork type.
  • the form of the elastic body supporting the second electrode is not limited to the form of the return panel, but may be another form such as a panel panel.
  • U.S. Pat.No. 6,210,988 uses a SiGe film formed by the LPC VD method to control residual stress at about 550 ° C, which is lower than that of a polysilicon film. It is disclosed that a microstructure can be formed as described above. However, in the case of the tungsten containing nitrogen used here, since the sputtering method is used, the temperature can be as low as about room temperature? It is possible to use not only LSIs fabricated by the CMOS process on Si substrates but also processes with low heat resistance, such as glass substrates and resin substrates, such as Cu wiring and low dielectric constant organic insulating films. Adaptation is also possible on substrates that have passed.
  • the composition and quality of the deposited film can be easily changed at a low temperature of about room temperature by N2 partial pressure / sputtering pressure. For example, by changing the sputtering pressure from 1.5 Pa to about 3 Pa, the residual stress in the film could be changed from tensile stress to compressive stress.
  • the input electrode including the microresonator 550 of the present invention shown in the first, second, and third embodiments and capacitively coupled to the microresonator is provided.
  • an output electrode 552 for extracting a frequency signal selected by the microresonator and an input electrode 5553 for a first drive mechanism for powering the first microphone opening movable portion, It has an input electrode 554 to a second drive mechanism for powering the second microphone opening movable part.
  • two micro movable parts are provided, but the number is not limited to this, and one micro movable part may be used.
  • the resonance frequency (the center frequency of the microfilter device) of the microphone mouth resonator 550 can be adjusted over a wide range by applying a control voltage to the input electrode of the microphone mouth movable portion driving mechanism after manufacturing.
  • the uncertainty of the resonant frequency of the microresonator (the center frequency of the microfilter device) due to processing variations during manufacturing and variations in the sealing pressure, which was not possible with the conventional method, is the desired (design) It is possible to use it after adjusting to the value. Since the adjustment range after manufacturing is greatly improved compared to the conventional method, the yield can be obtained even when using a manufacturing apparatus and a manufacturing process with a processing accuracy in a range where the yield cannot be obtained by the conventional method.
  • the deviation of the center frequency of the micro filter device can be detected on the spot by controlling the micro movable part after encapsulation, changes in the external environment (temperature) during use and deterioration over time of the micro resonator device (sealing).
  • the filter output can be corrected and optimized, even for the deterioration of the stop pressure and the deterioration of the mechanical properties of the microphone mouth resonator material, etc., and the range of environmental conditions that can be used as a filter can be expanded to extend the product life. Can be extended.
  • a microphone opening movable portion control circuit 555 for controlling the operation of the microphone opening movable portion is provided.
  • the microphone opening movable section control circuit 555 is configured such that the output is connected to the input electrodes 553 and 554 to the micro movable section driving mechanism, and the output from the microresonator 550 is input. Connected to output electrode 552 of micro-resonator. This makes it possible to select with the micro filter device.
  • the microphone opening movable part control circuit 555 adjusts By providing a control knob or switch, it is possible to control the output voltage to the micro movable portion driving mechanism and adjust the frequency deviation so that a desired frequency signal is output from the microresonator 550.
  • the micro movable section drive mechanism is driven by the potential difference between the first electrode and the second electrode. Two or only one of the electrodes is selected.
  • the second electrode is set to a fixed potential, and the voltage of the first electrode is adjusted.
  • the micro movable portion is fixed, it is adjusted by the input voltage to the third electrode.
  • the function of the microresonator can be restored by an external input without disassembling the microfilter device.
  • the driving mechanism of the micro movable unit and the microphone opening movable unit can be formed on the substrate together with the microresonator, so that it is possible to arrange the microphone opening resonance devices having various frequency characteristics side by side.
  • Providing a plurality of microphone opening resonators with various frequency characteristics and a plurality of micro movable parts can expand the controllable range of the frequency characteristics of the entire microfilter device, and can use the microfilter device properly according to the purpose of use and environment of use. Also, by combining a plurality of microresonators, it is possible to obtain a mixed output.
  • the microfilter device includes a storage element 557, which is adjusted at the time of shipment or at the time of previous adjustment so as to correct a deviation from a desired (designed) frequency to be selected.
  • a control value (output voltage or set value for voltage output) of the microphone port movable section control circuit is stored in the storage element 557, and the control value stored in the storage element when the microphone port filter device is started up.
  • the micro movable unit is controlled based on the control value of the micro movable unit control circuit, and is adjusted to the desired center frequency to be selected.
  • the frequency output must be adjusted by controlling the micro movable part, but the relationship between the control voltage and output frequency of the microphone movable part, and the control voltage and the amplitude amplification factor at the resonance peak (or Q Is not a simple linear relationship as shown below, and it is difficult to make adjustments with the expected adjustment range.
  • the relationship between the control voltage of the micro movable unit and the force with which the micro movable unit presses the microresonator, that is, the fixed force usually does not have a linear relationship.
  • the force that improves the nonlinearity of the fixing force in the practical region of the pressing stage cannot obtain a completely linear relationship. Furthermore, the relationship between the magnitude of the fixing force and the resonance frequency of the microphone mouth resonator, or the relationship between the magnitude of the fixing force and the amplitude amplification factor (or Q value) at the resonance peak is not a linear relationship. Because it depends on the structure of the mouth resonator, the structure of the micro movable part, and the contact position of the movable part of the microphone, a unique control pattern corresponding to each unique correlation is required for each. It is. Therefore, as shown in Fig.
  • the control value of the microphone opening movable part control circuit when connected to the memory element 557, the control value of the microphone opening movable part control circuit at the time of shipment or adjustment performed in the normal use environment of the user, or at the time of previous use
  • the adjusted control value of the micro movable part control circuit is recorded in the storage element, and based on the value, the selected movable part of the microphone opening is adjusted at the time of starting, so that it is possible to adjust from the initial value rather than from the initial value. The time can be greatly reduced.
  • the control voltage when adjusting the deviation existing in the frequency to be selectively output to a desired frequency, is pre-stored in the storage element and connected to the storage element. It is adjusted step by step using the optimal control step. This makes it possible to easily adjust the frequency deviation for various microresonators or microfilters. Details of a further preferred embodiment will be described with reference to FIG.
  • the relationship between the control voltage applied to the micro movable unit and the force of the micro movable unit pressing the micro resonator that is, the magnitude of the fixed force, and the magnitude of the fixed force and the resonance frequency of the micro resonator Is not a simple linear relationship, and the relationship between the magnitude of the fixed force and the amplitude amplification factor (or Q value) at the resonance peak is not a simple linear relationship.
  • the control pattern for optimizing ⁇ ⁇ with correction is a unique pattern with different characteristics. Therefore, for a selected micro-resonator and micro-movable part, the relationship between the control value of the micro-movable part and the frequency characteristic of the output of the microphone-port resonance device or the microphone-port filter device is measured in advance. Assuming that a solid line 560 as shown in FIG. 40 is obtained, preferably, a desired frequency f to be selected.
  • a control step for controlling the control value of the microphone opening movable part necessary for changing the frequency at a predetermined step size is determined, and the step is recorded in the storage element. That is, as shown in Fig. 40, the frequency is' ⁇ ⁇ f 0 — 2 x, f at predetermined intervals X around f 0 .
  • One x, f os f. + x, fo + 2 x- ⁇ The value of the control voltage corresponding to the point at which 'changes. ⁇ ⁇ -V 0 — d _ 2 , V 0 — d V 0 , V 0 + d V 0 + d
  • the frequency step size X depends on the desired frequency accuracy of the microfilter device, but is preferably at least one-half or less of the desired frequency accuracy or frequency margin. Here, it is set to about 1/10.
  • the control step ' ⁇ ⁇ ⁇ ⁇ ' V recorded in the storage element.
  • V 0 _ d- There V 0, V 0 + d V 0 + d 2 - ⁇
  • the force can be changed as if a linear relationship is obtained, and it is possible to construct an optimal adjustment algorithm that predicts the adjustment range, and it is possible to make adjustments efficiently and in a short time.
  • the timing chart of the control operation shown in FIG. As described above, the control steps are performed stepwise. This is because the micro movable part is moved from the setting of the control voltage of the micro movable part, the vibration of the micro resonator reaches a steady state, and a stable frequency output is obtained from the microphone opening resonator or the microphone opening filter device. This is because a slight time delay occurs before the operation is performed. As shown in FIG. 41, the control time can be reduced by providing a margin for the delay time, forming an optimal sequence, and controlling the voltage stepwise.
  • the control can also be performed by gradually changing the control voltage little by little.However, if the micro movable part is moved before the vibration of the microresonator enters the steady state, the output remains unstable. Since the adjustment is advanced and the control is performed without confirming the frequency output in the steady state accurately, it takes much time to adjust the frequency accurately and obtain the final result. Further, according to the present embodiment, the micro-resonance is caused by the change of the external environment such as the temperature at which the micro-filter device is used and the deterioration over time of the microphone mouth resonator itself (deterioration of the mechanical properties of the microphone mouth resonator and fluctuation of the sealing pressure). Even when the resonance frequency of the device or the center frequency of the microfilter device is shifted, the adjustment can be performed effectively.
  • the correlation between the control voltage and the frequency of the micro movable part, which initially had the relationship shown by the solid line 560, is changed with the external environment or the microphone mouth resonator itself over time. It is assumed that the frequency selected and output from the microfilter device is shifted due to the change as shown by the dotted line 561 due to the deterioration. The cause of the deviation is the same control voltage as the initial (previous) V. Even if it is set to, the frequency of the output frequency diagram is not point A but point B. However, according to the control step or adjustment algorithm of the control voltage determined by the original real, ⁇ 560, V 0 — d _ V. One d— 2 , V.
  • the adjustment width of 5 6 2 frequencies do not perfectly match the X, unless every other significant structural changes in the micro resonator and microphone port movable portion of the micro-resonator, a solid line 5 6 Since there is no great difference in the rate of change between 0 and the point and the line 561, the frequency output from the microphone port filter device can be changed at substantially equal intervals according to the changed correlation 561. This makes it possible to construct an optimal adjustment algorithm that predicts the adjustment range.
  • the frequency adjustment width 562 after the occurrence of the deviation is originally slightly different from the adjustment width X, the frequency after the optimal adjustment does not completely coincide with the desired frequency, and the deviation 563 becomes the same. Arise Sometimes.
  • the adjustment width X is set to a value sufficiently smaller than one-half of the desired frequency accuracy, it can be adjusted within the frequency margin.
  • a shift occurs in the resonance frequency (the center frequency of the microfilter device) of the microphone port resonator device due to the deterioration of the external environment using the microfilter device due to the deterioration with time of the microphone port resonator device itself.
  • the deviation can be easily and effectively adjusted by adjusting the control voltage of the microphone opening movable portion in advance in the storage element in advance using the optimal control step of the control voltage.
  • V Denotes the frequency of the control voltage of the first electrode, V 2 control voltage of the second electrode, the signal f is outputted from the micro-filter device.
  • V based on the initial value stored in the storage element at time t. Is given and the micro movable part is pushed with a predetermined force to obtain the first output.
  • the output frequency is the desired center frequency f. In the case of deviation from V, the output frequency is detected according to the control step stored in the storage element and is compared with f 0 at a predetermined time interval.
  • the micro movable portion when adjusting the deviation existing in the frequency to be selectively output to a desired frequency, which is connected to the storage element, as shown in FIG.
  • V 0 the initial value (or the previous control value) V 0 , that is, before bringing the micro movable portion into contact with the micro resonator with a predetermined force, the micro movable portion is moved from the balanced position to the micro resonator.
  • the micro movable part is moved to such a degree that the micro movable part is brought into contact with the microphone open resonator, but hardly presses the micro resonator.
  • a control sequence of the micro movable unit is assembled, and the control voltage of the micro movable unit is pushed into the microphone mouth resonator.
  • the input signal strength to the microresonator or the microfilter device is reduced slightly. More specifically, for example, assuming that the following high-frequency signal is input to a microphone-port filter device having a micro-port resonator as shown in FIG.
  • Vi is amplitude
  • ⁇ is frequency
  • t time.
  • the force F received by the microresonator of the microfilter device at the frequency of ⁇ depends almost on Vi, and F increases as Vi increases.
  • the amplitude Ar of the microresonator depends on the force F received by the microresonator, which also increases as F increases. Therefore, if, for example, V i among the variables of the input signal to the microfilter is reduced, the resonance amplitude of the microresonator can be reduced. That is, as shown in Fig. 41, when the control voltage of the micro movable part is changed and the micro movable part is pressed, the time from the change of the control voltage to the time when the pressing force changes and stabilizes is d.
  • the microphone opening movable part is moved from the balanced position to the micro-resonator, that is, the micro-movable part is almost brought into contact with the micro-resonator, and almost The input to the microfilter device is turned off or the signal strength is zeroed when a displacement step is performed that does not push the body. This makes it possible to smoothly contact the micro-resonator at the position where the micro-movable part should be in contact, and to adjust the micro-movable part with high reproducibility.
  • the input electrode 5 includes the microphone-port resonance device 550 of the present invention shown in the first, second, and third embodiments, and is capacitively coupled to the microphone-port resonator. 5 1, an output electrode 55 2 for extracting a frequency signal selected by the micro-resonator, and input electrodes 55 3 and 55 4 for a drive mechanism for moving the micro movable section.
  • the invention is not limited to this, and one micro movable part may be used.
  • the resonance frequency of the microresonator 550 can be adjusted over a wide range by applying a control voltage to the input electrode of the microphone opening movable portion driving mechanism after manufacturing, so that the conventional method cannot do so. Uncertainties in the resonance frequency of the microresonator due to variations in processing during fabrication and variations in the sealing pressure can be adjusted to the desired (design) value and used. Since the adjustment range after manufacturing is greatly improved compared to the conventional method, the yield can be obtained even when using a manufacturing apparatus and a manufacturing process with a processing accuracy in a range where the yield cannot be obtained by the conventional method.
  • the deviation of the output frequency of the micro-oscillator can be corrected on the spot by controlling the micro movable part after encapsulation, changes in the external environment (temperature) during use and aging of the micro-resonator itself (sealing pressure) Output can be corrected and optimized for the degradation of the micro-resonator material and the mechanical characteristics of the micro-resonator material, etc., and the range of environmental conditions that can be used as an oscillator can be extended, and the product life can be extended. .
  • the microphone-port oscillator according to the present embodiment has the same basic configuration of the micro-resonator as the micro-filter device according to the fourth embodiment. It is clear that a similar effect can be obtained by connecting the movable part control circuit and the storage element.
  • a wireless communication device using the micro finoletor device of the present invention as shown in the fourth embodiment and the micro oscillator of the present invention as shown in the fifth embodiment Will be described.
  • this wireless communication device includes a transmitting section 65, a receiving section 651, a transmission signal from the transmitting section 650, and a reception signal to the receiving section 651.
  • a duplexer 652 for transmitting the transmission signal as a radio wave and the reception signal An antenna 653 that receives the signal as a radio wave, and the microfilter device 600 and the microoscillator 6001, which are connected to the transmitting unit 650 and the receiving unit 651, respectively.
  • the transmitting unit 650 includes a mixer 602, an amplifier 603, and a PA (Power Amplifier 1) (power amplification circuit) 604 in order from the upstream side to the downstream side where the transmission signal flows.
  • the amplifier 603 and the PA 604 The micro-filter device 600 is connected between them.
  • the receiving section 651 includes an LNA (Low Noise Amplifier) 605, a mixer 606, and an amplifier 607 in order from the upstream side to the downstream side where the received signal flows.
  • the microphone-mouth oscillator 601 is connected to both the mixer 602 of the transmitting unit 650 and the mixer 606 of the receiving unit 651.
  • the microphone oscillator 601 is connected to, for example, a VCO (Voltage Alignment Oscillator); an oscillation circuit.
  • VCO Voltage Alignment Oscillator
  • the microfilter device 600 having a high Q value as a band-pass filter of the transmission / reception units 650 and 651 of the wireless communication device, it is possible to remove a nonlinear component which is a noise and to remove only a desired frequency signal. It is possible to select a channel that passes and removes all other frequency signals. Further, by using the microphone oscillator 601 having a high Q value as a local (local) oscillator of the transmission / reception units 650 and 651 of a wireless communication device, effects such as reduction of phase noise can be obtained.
  • the micro-filter device 600 and a micro-oscillator 601 that can be adjusted after manufacture on a wireless communication device, and the micro-filter device may be changed due to fluctuations in the external environment and internal fluctuations in the micro-resonator itself. Even if the frequency characteristics of the filter device 600 and the micro-oscillator 601 fluctuate, the frequency characteristics of the micro-filter can be adjusted by controlling the micro movable part while comparing with the communication state, and the communication state can be kept optimal. .
  • the micro-filter device and the microphone mouth oscillator that precisely adjust the center frequency to the design value due to variations in processing accuracy and sealing pressure accuracy
  • the yield cannot be improved, and the adjustment range after manufacturing is narrow even when mounted on wireless devices. There is a problem that cannot be addressed.
  • this wireless communication device includes a channel selector H 60 connected between the duplexer 652 and the antenna 653.
  • the channel selection unit 600 includes a plurality of microfilter devices 600 arranged in parallel, and passes only a desired frequency signal.
  • the other structure is the same as in the sixth embodiment, and a description thereof will not be repeated.
  • any one of the micro-filter device 600 and the micro-oscillator 600 may be used as the wireless communication device of the present invention.

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Abstract

L'invention concerne un microrésonateur comprenant un substrat (10), un micro-corps résonant (13) placé sur le substrat (10), deux micro-unités amovibles (16, 16), et un mécanisme de commande (17) de micro-unités amovibles conçu pour commander ces micro-unités amovibles (16, 16). Ces deux micro-unités amovibles (16, 16) sont commandées par le mécanisme de commande (17) de manière à agir sur le micro-corps résonant (13), ce qui entraîne le changement de la fréquence de résonance dudit micro-corps résonant (13)
PCT/JP2003/012665 2002-10-03 2003-10-02 Microresonateur, microfiltre, micro-oscillateur et dispositif de communication sans fil WO2004032320A1 (fr)

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JP2004541277A JP4121502B2 (ja) 2002-10-03 2003-10-02 マイクロ共振装置、マイクロフィルタ装置、マイクロ発振器および無線通信機器
AU2003271082A AU2003271082A1 (en) 2002-10-03 2003-10-02 Microresonator, microfilter, micro-oscillator, and wireless communication device

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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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JP2007288321A (ja) * 2006-04-13 2007-11-01 Toshiba Corp 共振回路、フィルタ回路および発振回路
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JP2010162629A (ja) * 2009-01-14 2010-07-29 Seiko Epson Corp Ｍｅｍｓデバイスの製造方法
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WO2010107618A3 (fr) * 2009-03-19 2011-03-10 Robert Bosch Gmbh Procédé d'espacement précis d'une électrode à axe z
JP2011209751A (ja) * 2006-06-01 2011-10-20 Qualcomm Mems Technologies Inc 静電気動作と解放を備えたアナログ光干渉変調器デバイス
JP4838149B2 (ja) * 2005-01-13 2011-12-14 パナソニック株式会社 捩り共振器およびこれを用いたフィルタ
JP4885714B2 (ja) * 2004-04-27 2012-02-29 日本碍子株式会社 弾性体の検査方法、検査装置、及び寸法予測プログラム
US8368473B2 (en) 2009-06-09 2013-02-05 Panasonic Corporation Resonator and oscillator using same
WO2016063863A1 (fr) * 2014-10-22 2016-04-28 株式会社村田製作所 Résonateur et appareil à résonance
US10741205B2 (en) 2016-11-29 2020-08-11 Nec Platform, Ltd. Brake device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05251977A (ja) * 1992-03-03 1993-09-28 Fujitsu Ltd 圧電デバイス
JPH11508418A (ja) * 1995-06-23 1999-07-21 コーネル・リサーチ・ファンデーション・インコーポレイテッド キャパシタンスに基づくチューニング可能な超小型機械共振器
JP2000030595A (ja) * 1998-06-02 2000-01-28 Nokia Mobile Phones Ltd 共振器の構造
JP2002094351A (ja) * 2000-09-19 2002-03-29 Tdk Corp 圧電共振部品
JP2003532323A (ja) * 2000-04-20 2003-10-28 ザ リージェンツ オブ ザ ユニバーシティ オブ ミシガン 振動マイクロメカニカル装置列を利用して電力増幅器を有するサブシステムの信号を濾過するための方法及び装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61194325A (ja) * 1985-02-25 1986-08-28 Shinko Denshi Kk 力変換機構
US5550516A (en) * 1994-12-16 1996-08-27 Honeywell Inc. Integrated resonant microbeam sensor and transistor oscillator

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05251977A (ja) * 1992-03-03 1993-09-28 Fujitsu Ltd 圧電デバイス
JPH11508418A (ja) * 1995-06-23 1999-07-21 コーネル・リサーチ・ファンデーション・インコーポレイテッド キャパシタンスに基づくチューニング可能な超小型機械共振器
JP2000030595A (ja) * 1998-06-02 2000-01-28 Nokia Mobile Phones Ltd 共振器の構造
JP2003532323A (ja) * 2000-04-20 2003-10-28 ザ リージェンツ オブ ザ ユニバーシティ オブ ミシガン 振動マイクロメカニカル装置列を利用して電力増幅器を有するサブシステムの信号を濾過するための方法及び装置
JP2002094351A (ja) * 2000-09-19 2002-03-29 Tdk Corp 圧電共振部品

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4885714B2 (ja) * 2004-04-27 2012-02-29 日本碍子株式会社 弾性体の検査方法、検査装置、及び寸法予測プログラム
JP4838149B2 (ja) * 2005-01-13 2011-12-14 パナソニック株式会社 捩り共振器およびこれを用いたフィルタ
JP2006238265A (ja) * 2005-02-28 2006-09-07 Seiko Epson Corp 振動子構造体及びその製造方法
JP4645227B2 (ja) * 2005-02-28 2011-03-09 セイコーエプソン株式会社 振動子構造体及びその製造方法
JP2007288321A (ja) * 2006-04-13 2007-11-01 Toshiba Corp 共振回路、フィルタ回路および発振回路
JP4728866B2 (ja) * 2006-04-13 2011-07-20 株式会社東芝 共振回路、フィルタ回路および発振回路
JP2011209751A (ja) * 2006-06-01 2011-10-20 Qualcomm Mems Technologies Inc 静電気動作と解放を備えたアナログ光干渉変調器デバイス
JP2008099020A (ja) * 2006-10-12 2008-04-24 Sanyo Electric Co Ltd マイクロメカニカル共振器
JP2008099042A (ja) * 2006-10-13 2008-04-24 Ritsumeikan マイクロメカニカル共振器
JP2009088854A (ja) * 2007-09-28 2009-04-23 Sanyo Electric Co Ltd マイクロメカニカル共振器およびその製造方法
JP2009111810A (ja) * 2007-10-31 2009-05-21 Seiko Instruments Inc 静電振動子および発振器
JP2009171483A (ja) * 2008-01-21 2009-07-30 Seiko Instruments Inc 静電振動子および発振器
JP2010162629A (ja) * 2009-01-14 2010-07-29 Seiko Epson Corp Ｍｅｍｓデバイスの製造方法
WO2010107618A3 (fr) * 2009-03-19 2011-03-10 Robert Bosch Gmbh Procédé d'espacement précis d'une électrode à axe z
US8430255B2 (en) 2009-03-19 2013-04-30 Robert Bosch Gmbh Method of accurately spacing Z-axis electrode
US8368473B2 (en) 2009-06-09 2013-02-05 Panasonic Corporation Resonator and oscillator using same
JP2011041179A (ja) * 2009-08-18 2011-02-24 Nippon Telegr & Teleph Corp <Ntt> 微小共振子およびその製造方法
WO2016063863A1 (fr) * 2014-10-22 2016-04-28 株式会社村田製作所 Résonateur et appareil à résonance
JPWO2016063863A1 (ja) * 2014-10-22 2017-04-27 株式会社村田製作所 共振子及び共振装置
US10530332B2 (en) 2014-10-22 2020-01-07 Murata Manufacturing Co., Ltd. Resonator and resonating device
US10741205B2 (en) 2016-11-29 2020-08-11 Nec Platform, Ltd. Brake device

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