WO2004011356A1 - 接着材テープ、その接続方法、製造方法、圧着方法、接着材テープリール、接着装置、接着剤テープカセット、これを用いた接着剤の圧着方法並びに異方導電材テープ - Google Patents

接着材テープ、その接続方法、製造方法、圧着方法、接着材テープリール、接着装置、接着剤テープカセット、これを用いた接着剤の圧着方法並びに異方導電材テープ Download PDF

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Publication number
WO2004011356A1
WO2004011356A1 PCT/JP2003/009694 JP0309694W WO2004011356A1 WO 2004011356 A1 WO2004011356 A1 WO 2004011356A1 JP 0309694 W JP0309694 W JP 0309694W WO 2004011356 A1 WO2004011356 A1 WO 2004011356A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
adhesive tape
reel
tape
wound
Prior art date
Application number
PCT/JP2003/009694
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Naoki Fukushima
Takashi Tatsuzawa
Takahiro Fukutomi
Kouji Kobayashi
Toshiyuki Yanagawa
Masami Yusa
Motohiro Arifuku
Yasushi Gotoh
Isao Tsukagoshi
Original Assignee
Hitachi Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002221225A external-priority patent/JP2004059776A/ja
Priority claimed from JP2002370624A external-priority patent/JP4477823B2/ja
Priority claimed from JP2002370622A external-priority patent/JP2004196540A/ja
Priority claimed from JP2002370623A external-priority patent/JP4032961B2/ja
Priority claimed from JP2002371888A external-priority patent/JP4239585B2/ja
Priority claimed from JP2002371887A external-priority patent/JP2004203944A/ja
Priority claimed from JP2002371889A external-priority patent/JP4608839B2/ja
Priority claimed from JP2003002092A external-priority patent/JP2004211017A/ja
Priority claimed from JP2003002093A external-priority patent/JP4333140B2/ja
Priority claimed from JP2003002095A external-priority patent/JP2004210524A/ja
Priority claimed from JP2003002094A external-priority patent/JP2004210523A/ja
Priority claimed from JP2003118286A external-priority patent/JP2004323621A/ja
Priority claimed from JP2003118287A external-priority patent/JP4654566B2/ja
Priority claimed from JP2003130197A external-priority patent/JP4238626B2/ja
Priority claimed from JP2003130196A external-priority patent/JP2004331833A/ja
Priority claimed from JP2003176322A external-priority patent/JP2005330297A/ja
Priority claimed from JP2003176321A external-priority patent/JP2005330296A/ja
Application filed by Hitachi Chemical Co., Ltd. filed Critical Hitachi Chemical Co., Ltd.
Publication of WO2004011356A1 publication Critical patent/WO2004011356A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00—Changing the web roll
    • B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
    • B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
    • B65H19/1842—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact
    • B65H19/1852—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact taking place at a distance from the replacement roll
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
    • B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H21/00—Apparatus for splicing webs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/462—Form of splice
    • B65H2301/4621—Overlapping article or web portions
    • B65H2301/46212—Overlapping article or web portions with C-folded trailing edge for embedding leading edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/37—Tapes
    • B65H2701/377—Adhesive tape
    • B65H2701/3772—Double-sided
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives

Definitions

  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, a connection method thereof, a manufacturing method, and a crimping method.
  • TECHNICAL FIELD The present invention relates to a method, an adhesive tape reel, an adhesive device, an adhesive tape cassette and an adhesive pressure bonding method using the same, and particularly to an adhesive tape wound in a reel shape, a connection method thereof, a manufacturing method, a pressure bonding method, and an adhesive tape. Reel, bonding equipment, adhesive tape
  • the present invention relates to pukaset, an adhesive bonding method using the same, and an anisotropic conductive material tape.
  • a liquid crystal panel a PDP (plasma display panel), an EL (fluorescent display) panel, and a bare-chip mounting
  • a circuit board and a circuit board are adhered and fixed to each other, and both electrodes are electrically connected.
  • Adhesive tape is used as a means for making the connection.
  • Japanese Patent Application Laid-Open Publication No. 2000-2005 discloses a tape in which an adhesive tape in which an adhesive is applied to a base material is wound into a reel. I have.
  • a conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound on a reel is about 50 m.
  • a reel of the adhesive tape (hereinafter, simply referred to as “adhesive reel”) is attached to the adhesive device, and the starting end of the adhesive tape is pulled out. Attach to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive reel by a heating and pressing head, and the remaining base material is wound on a take-up reel. . '
  • the width of the adhesive tape is as narrow as 1 to 3 mm, so if the number of windings is increased, winding collapse may occur. Also, when the number of windings is increased, the pressure acting on the adhesive tape wound in a tape shape is increased, and the adhesive may ooze out from both widths of the tape to cause blocking.
  • the present invention provides a method of connecting an adhesive tape, which enables easy replacement of an adhesive reel and can improve the production efficiency of an electronic device, an adhesive tape, and its production. It is an object of the present invention to provide a method, a crimping method, an adhesive tape, a bonding device, an adhesive tape cassette, a method for crimping an adhesive using the cassette, and an anisotropic conductive material tape.
  • the invention described in claim 1 is characterized in that the adhesive for electrode connection is applied to the base material, and one adhesive tape wound on one reel and one wound on the other reel.
  • the end of the unwound adhesive tape using the adhesive of the adhesive tape and the end of the newly mounted adhesive tape Since the adhesive reel is replaced by bonding to the start end, it is easy to attach a new adhesive tape to the bonding device.
  • there is no need to replace the take-up tape attach the start end of the new adhesive tape to the take-up reel, or set guide bins or the like on the predetermined path each time a new adhesive tape is replaced. Reel replacement time is reduced, and the production efficiency of electronic equipment is increased.
  • connection portion can be rationally used by using the heating and pressurizing head of the bonding device for mounting the adhesive reel.
  • the invention described in claim 2 is characterized in that, in the invention described in claim 1, the end mark of one of the adhesive tapes is provided with an end mark.
  • the adhesive tape having the same effects as the first aspect of the present invention and the unwinding is completed. Can be cut when the endmark is exposed, so the cutting and connecting parts are easy to understand and can be connected at the minimum necessary position, so there is no adhesive tape! : Can be prevented.
  • the invention described in claim 3 is characterized in that an adhesive for electrode connection is applied to a base material, and one adhesive tape wound on one reel and the other reel.
  • Roll A method of connecting an adhesive tape to the other adhesive tape wherein a starting end of the other adhesive tape is attached to a base material surface of an adhesive tape wound around a reel with a lead tape. After turning over the end of one adhesive tape, the adhesive surface of the lead tape is overlapped with the adhesive surface of the end of one adhesive tape, and the overlapped portion is heated and pressed.
  • the third aspect of the present invention it is possible to easily attach a new adhesive tape to the bonding apparatus, similarly to the first aspect of the present invention.
  • the time required to replace new adhesive reels is reduced, and the production efficiency of electronic equipment is increased.
  • the invention described in claim 4 is characterized in that the adhesive for electrode connection is applied to the base material, and one adhesive tape wound on one reel and one wound on the other reel.
  • the invention described in claim 5 is characterized in that the adhesive for electrode connection is applied to the base material, and the one adhesive tape wound on one reel and the other reel are wound on one reel.
  • Roll T / JP2003 / 009694 This is a method of connecting an adhesive tape for connecting the other adhesive tape, wherein an end of one adhesive tape and a start end of the other adhesive tape are overlapped with each other. It is characterized in that a locking pin is inserted into the overlapped portion for connection.
  • the end of the unwound adhesive tape and the start of the newly-attached adhesive tape are fixed with the locking pins. So the connection is easy.
  • there is no need to replace the take-up tape attach the starting end of the new adhesive tape to the take-up reel, and set guide bins or the like in a predetermined path every time a new adhesive reel is replaced. The time required to change the adhesive reel is reduced, and the production efficiency of electronic equipment is increased.
  • the invention described in claim 6 is characterized in that the adhesive for electrode connection is applied to the base material, and one adhesive tape wound on one reel and one wound on the other reel.
  • a method of connecting an adhesive tape for connecting the other adhesive tape to the other adhesive tape using a locking member wherein the locking member is provided with a claw provided at one and the other end.
  • An elastic member is provided between the claws, and the end of one adhesive tape and the start of the other adhesive tape are abutted to each other. It is characterized in that it is locked to the end of the material tape, the claw provided at the other end is locked to the start of the other adhesive tape, and both claws are pulled by an elastic member.
  • one claw portion of the locking member is locked to the end portion of the one adhesive tape, and then the locking member is The other claw portion is locked to the starting end of the other adhesive tape and the two are connected to each other, so that the connection is easy.
  • the elastic member is provided between the one claw portion and the other claw portion, the elastic member is extended, and the other claw portion of the locking member is positioned at an arbitrary position of the starting end of the other adhesive tape. The connection can be locked, so the degree of freedom of connection is high.
  • connection is made in a state where the end of one adhesive tape and the start of the other adhesive tape are abutted, it is not necessary to overlap the tapes with each other. Can be connected, so that the adhesive tape can be prevented from being wasted.
  • the invention described in claim 7 is characterized in that the adhesive for electrode connection is applied to the base material, and one adhesive tape wound on one reel and one wound on the other reel.
  • the overlapping portion of one adhesive tape and the other adhesive tape is formed by combining one adhesive tape with the other adhesive tape. It is characterized in that a portion to be overlapped with the lip is sandwiched by metal holding pieces having a substantially U-shaped cross section, and the holding pieces are crushed from both sides of the overlapping portion to connect the two. According to the invention as set forth in claim 8, since the sandwiching pieces are crushed from both sides of the overlapping portion to connect them, the connection strength of the overlapping portion of the adhesive tape is increased. be able to.
  • the invention described in claim 9 is characterized in that the adhesive for electrode connection is applied to the base material, and one adhesive tape wound on one reel and one wound on the other reel.
  • V A method of connecting an adhesive tape for connecting the other adhesive tape, wherein an end of one adhesive tape and a start end of the other adhesive tape are connected to one of the base surfaces. The other adhesive surface is overlapped, and the overlap length of the two is set in a range of 2 to 50 times the width of the adhesive tape, and the two are connected by heating and pressing.
  • the end of the adhesive tape completed by using the adhesive of the adhesive tape and the start of the adhesive tape to be newly mounted are provided.
  • the adhesive reel is replaced by bonding the new adhesive reel to the new adhesive reel. Also, each time a new adhesive reel is replaced, Since there is no need to replace the tape or attach the beginning of the new adhesive to the take-up reel, the time required to replace the new adhesive reel is reduced, and the production efficiency of electronic equipment is increased.
  • the length of the overlapped portion is set to 2 to 50 times the width of the adhesive tape is that if it is less than 2 times, sufficient connection strength cannot be obtained, and 50 times or more. If it is too large, too much adhesive will be used for the connection, and the adhesive will be wasted.
  • connection portion can be rationally used by using a heating and pressurizing head of the bonding device for mounting the adhesive reel.
  • the adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be only an insulating adhesive, or may be any of those adhesives. It may be one in which insulating spacer particles are dispersed.
  • the invention described in claim 10 is characterized in that the adhesive for electrode connection is applied to the base material, and the one adhesive tape wound on one reel and the other reel are wound on one reel.
  • This is a method of connecting an adhesive tape to connect the other adhesive tape wound, wherein the end of one adhesive tape is bent in a direction facing the adhesive, and the starting end of the other adhesive tape is bent.
  • the method is characterized in that the adhesive is bent in a direction facing each other, the bent portions of the two are overlapped with each other, and the surfaces of the adhesives are opposed to each other, and the overlapped portion is heat-pressed.
  • the same operation and effect as those of the first aspect of the present invention can be obtained, and at the same time, the one end of the adhesive tape and The starting end of the other adhesive tape is hooked to each other and locked, and the two connect the adhesive surfaces to each other, so that the connection strength is high.
  • the invention described in claim 11 is the invention according to claim 9 or claim 10, wherein one end of the adhesive tape is Is characterized by having an end mark.
  • the end of one adhesive tape can be made at the end mark portion, so that the connecting portion is easy to understand and Since the connection can be made at the minimum necessary position, waste of the adhesive tape can be prevented.
  • the end mark can be automatically detected, and the device can be controlled or an alarm can be issued based on the detection signal to improve work efficiency.
  • the method is characterized in that a portion to be overlapped with the mold is sandwiched between one mold having irregularities and the other mold that fits in the mold, and then heat-pressed.
  • connection area can be increased, and the connection strength in the tensile direction (longitudinal direction) of the adhesive tape can be increased by the engagement of the concavo-convex portions.
  • the invention described in claim 5 is the invention according to any one of claims 1 to 3, wherein one of the adhesive tapes and the other is After forming a through hole in the overlapped portion of the above, the overlapped portion is heat-pressed.
  • the invention described in claim 14 is characterized in that an adhesive for electrode connection is applied to a silicone-treated substrate, and one adhesive tape wound on one reel and the other adhesive tape are wound on one reel.
  • the two adhesive tapes are connected to each other by affixing or joining the portions of the two adhesive tapes straddling the surface of the silicone-treated base material with a silicone adhesive tape.
  • the reel for winding one of the adhesive tapes and the winding reel for winding only the base material of the adhesive tape are provided.
  • the end of the completed adhesive tape (one adhesive tape) and the adhesive tape on the newly installed adhesive reel Connect the start end of one tape (the other adhesive tape) with the silicone adhesive tape, and replace the finished adhesive reel with a new adhesive reel and attach it to the bonding machine o
  • the new adhesive reel is mounted on the bonding apparatus. Can be easily done. Also, there is no need to replace the take-up reel every time a new adhesive reel is replaced, attach the start end of the new adhesive tape to the take-up reel, or hang the adhesive tape on the guide. The replacement time is short, and the production efficiency of electronic equipment is increased.
  • the base material of the adhesive tape is surface-treated with silicone, and by using a silicone adhesive also for the adhesive tape to be used, the difference in surface tension between the two is reduced, and the adhesive force is increased. Therefore, the bonding between the two, which has been difficult in the past, can be realized.
  • the adhesive of the adhesive tape may be anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or may be only an insulating adhesive. Insulating spacer particles may be dispersed in the adhesive.
  • the invention described in claim 15 is a silicone adhesive tape according to claim 14, wherein the surface tension of the adhesive surface and the silicone tape of the adhesive tape are reduced. Characterized in that the difference from the surface tension of the coated substrate is 1 OmNZm (10 dyne / cm) or less.
  • claim 1 In addition to providing the same effect as the invention described in Item 4, the difference between the surface tension of the adhesive surface of the silicone adhesive tape and the surface tension of the silicone-treated substrate in the adhesive tape is 1 OmN. By setting it to / m (10 dyne / cm) or less, a strong adhesion can be obtained and both can be securely bonded. Surface tension can be measured by wetting reagent or contact angle.
  • the difference in surface tension between the silicone-treated base material of the adhesive tape and the adhesive surface of the silicone adhesive tape is preferably 0 to 5 mNZm (5 dyne / cm). The reason for this is that the smaller the difference in surface tension, the better. If the difference exceeds 1 OmN / m (10 dyne / cm), sufficient adhesion strength may not be obtained.
  • the invention described in claim 16 is the invention described in claim 2, wherein the silicone adhesive tape has an adhesive force of 100 gZ25 mm or more. There is a feature.
  • the same operation and effect as those of the invention described in claim 2 can be obtained, and the connection of one and the other adhesive tapes can be achieved. Since a silicone pressure-sensitive adhesive tape can be adhered to both surfaces of the adhesive, the adhesive tape can be adhered with high strength by adhering (or adhering) one and the other adhesive tapes from both surfaces.
  • the adhesive force is 100 ⁇ / 25111111 or more, it is possible to more firmly bond the one and the other adhesive tapes to both adhesive surfaces.
  • the adhesive strength is large, a strong adhesive strength can be obtained, but if it is smaller than 100 g / 25 mm, a predetermined strength may not be obtained.
  • the invention described in claim 17 is the invention described in claim 16, wherein the silicone pressure-sensitive adhesive tape described in claim 16 is used for: The end portion of the adhesive tape and the start end of the other adhesive tape are overlapped or abutted, and attached to both sides of both adhesive tapes for connection. According to the invention as set forth in claim 17, the same operation and effect as those of the invention as set forth in claim 16 can be obtained, and one and the other adhesive materials can be used. Since the loops are connected on both sides, a stronger connection can be obtained.
  • the invention described in claim 18 is characterized in that an adhesive for electrode connection is applied to a silicone-treated base material, and one adhesive tape wound on one reel and the other adhesive tape are wound on one reel.
  • the two adhesive tapes are connected by sandwiching a silicone adhesive tape coated on both sides with a silicone adhesive, and the difference between the silicone adhesive on both sides and the surface tension of the silicone substrate is 10 mN / m (10 dyneZcm) or less.
  • the adhesive strength is 100 g / 25 mm or more.
  • a double-sided silicone adhesive tape is provided between one adhesive tape and the other adhesive tape.
  • the two can be bonded (or in close contact) with each other, so that the connection between them is simple and easy.
  • the invention described in claim 19 is characterized in that an adhesive for electrode connection is applied to a base material, and one adhesive tape wound on one reel and the other adhesive tape are wound on one reel.
  • the end of the unwound adhesive tape and the start of the newly-attached adhesive tape are made of a paste-like resin. Connection is easy because it is fixed with adhesive.
  • the take-up tape is replaced and the beginning of the new adhesive tape is attached to the take-up reel. Since there is no need to perform the work of setting the guide pins etc. on the predetermined path, the time required to replace new adhesive reels is reduced, and the production efficiency of electronic equipment is increased.
  • a resin adhesive is applied at a portion where the end of one adhesive tape is overlapped or abutted with the beginning of the other adhesive tape, so that the degree of freedom of connection is high.
  • the invention described in claim 20 is the invention according to claim 19, wherein the resin adhesive is a thermosetting resin, a photocurable resin, or a hot melt resin. It is characterized by being made of at least one material selected from the group of adhesives.
  • thermosetting resin adhesive is used.
  • a suitable resin adhesive for connecting adhesive tapes can be selected from the group of adhesive resins, photo-curing resins, and hot melt adhesives, and the connection strength between adhesive tapes can be increased. it can.
  • the invention described in claim 21 is a bonding apparatus to which an adhesive tape is mounted, wherein the resin according to claim 19 or claim 20 is provided. It is characterized by being provided with a filler for supplying a bonding agent.
  • the resin adhesive according to claim 19 or claim 20 is provided in the bonding apparatus. Since a filling machine is provided, it is not necessary to prepare a separate filling machine, and waste of connection work can be prevented.
  • the bonding apparatus may be provided with a heater for curing the thermosetting resin or an ultraviolet ray for irradiating the photocurable resin with light.
  • the invention set forth in claim 22 is an adhesive tape that is formed by applying an adhesive for electrode connection to a base material and winding an adhesive tape on a reel.
  • the adhesive tape reel has a plurality of adhesive tape windings in the width direction of the tape. It is characterized by.
  • the invention described in claim 23 is the invention according to claim 22, wherein the end of one adhesive tape and the start of the other adhesive tape are provided. And a connecting tape for connecting the two, and when the unwinding of one adhesive tape is completed, the unwinding of the other adhesive tape is started.
  • the same operation and effect as those of the invention described in claim 22 can be obtained, and the end of one of the adhesive tapes can be obtained. Is connected to the start end of the other adhesive tape by the connecting tape, so that after the unwinding of the adhesive tape of one winding part is completed, the adhesive tape of the other winding part is finished. There is no need to attach the reels to the take-up reel, further increasing the production efficiency of electronic equipment. Bureau.
  • the invention described in claim 24 is an adhesive tape reel according to claim 23, a winding reel for an adhesive tape, and an adhesive material.
  • a crimping portion provided between the tape reel and the take-up reel and for crimping the adhesive of the adhesive tape onto the circuit board of the electronic device by a heating and pressing head; and a tape detecting means for detecting the connection tape. And when the tape detecting means detects the connection tape, the connection tape is wound on a take-up reel until the connection tape passes through the pressure bonding portion.
  • the connecting tape is automatically wound on the take-up reel, so that the adhesive tape on one of the winding portions is terminated. After that, the adhesive tape can be sequentially fed out from the next winding portion.
  • the tape detecting means detects the connecting tape
  • the connecting tape is automatically wound on the winding reel until the connecting tape passes through the crimping portion. Can be omitted.
  • the tape detecting means for example, a bonding device is provided with a pair of light emitting units and a light receiving unit, and optically detects the connecting tape.
  • colored (for example, black) marks are provided at both ends of the connecting tape, and the light receiving unit detects the mark at both ends of the connecting tape by the laser beam emitted from the light emitting unit, and judges the connecting tape. are doing.
  • a method of making the width of the connection tape different from the width of the adhesive tape, or a method of forming a plurality of holes in the connection tape may be used.
  • the invention described in claim 25 is an adhesive tape in which the end of one adhesive tape and the start of the other adhesive tape are connected using a fastener.
  • the reel is characterized in that the connecting portion is covered with the adhesive tape by the adhesive tape.
  • the unwinding is completed.
  • the end of the adhesive tape and the beginning of the new adhesive tape are connected using a fastener, and the adhesive tape reel is replaced, so a new adhesive tape to the bonding device is used.
  • Easy installation of prills there is no need to replace the take-up tape, attach the start end of the new adhesive tape to the take-up reel, or set guide bins or the like on a predetermined path every time a new adhesive tape reel is replaced.
  • New adhesive tape reels require less time to change, increasing production efficiency of electronic equipment.
  • Adhesive tapes can be used sequentially, so that the adhesive tape can be used in one exchange without increasing the number of adhesive tapes wound per adhesive tape.
  • the dosage can be greatly increased.
  • the number of windings of the adhesive tape is not increased, it is possible to prevent winding collapse and to prevent so-called blocking, in which the adhesive oozes out in the width direction of the tape and the wound adhesive tapes adhere to each other. Further, it is possible to prevent adverse effects such as elongation of the base material, which are likely to occur due to the longer base material.
  • connection between the end of one adhesive tape and the start of the other adhesive tape covers the locking member with the adhesive tape, so that the appearance is good.
  • fastener at the connection part from being in contact with the adhesive tape and to prevent the adhesive tape from being damaged, or to damage components such as the heating and pressurizing head and the support base of the bonding machine with the fastener. I will not let you.
  • the end of one adhesive tape and the starting end of the other adhesive tape are connected by the locking tool, and then the connection is performed. It is preferable to fold the portion by 180 degrees in the longitudinal direction of the tape so that the locking member is covered with the adhesive tape.
  • connection portion may be wound with another adhesive tape so as to cover the locking member.
  • the invention described in claim 26 is the adhesive tape reel described in claim 1, an adhesive tape take-up reel, and an adhesive tape reel. And a take-up reel, and the adhesive tape is connected by a heating / pressing head.
  • An adhesive device that includes a crimping part for crimping an adhesive to a circuit board of an electronic device and a connection part detecting means for detecting a tape connection part, wherein the connection part detection means detects a tape connection part.
  • the method is characterized in that one adhesive tape is wound on a winding reel until the connection portion passes through the crimping portion.
  • connection portion detecting means detects the connection portion
  • one of the adhesive tapes is applied until the connection portion passes through the crimping portion. Since it is wound on the take-up reel, it is possible to prevent a problem that the connection portion comes to the crimping portion and the crimping operation is performed. Also, one adhesive tape is automatically wound on the winding reel until the connection portion passes through the crimping portion, so that the time and effort for winding can be reduced.
  • connection portion detection means is a CCD camera, a thickness detection sensor, a transmittance detection sensor. Characterized in that:
  • connection portion can be detected with a simple configuration.
  • detection accuracy can be improved by using these means.
  • connection detecting means when a CCD camera is used as the connection detecting means, the connection is detected by capturing the surface of the connection on a monitor screen and comparing the density of pixels.
  • a thickness detection sensor when a thickness detection sensor is used, the thickness of the connection is greater than the thickness of the adhesive tape, so the change in thickness is compared to detect the connection.
  • a transmittance sensor when a transmittance sensor is used, the connection portion becomes thicker, and the transmittance decreases due to the presence of the locking member, and the connection portion is detected by comparing the transmittance values.
  • the method of connecting an adhesive tape according to claim 28 is a method for connecting an end portion of one adhesive tape and a start end portion of the other adhesive tape using a fastener. Contact Subsequently, the connection portion is characterized by covering the locking device with an adhesive tape.
  • the end of the unwound adhesive tape and the start of the newly-attached adhesive tape are locked by using a fastener. Connection, and the adhesive tape reel is replaced, so that a new adhesive tape can be easily attached to the bonding equipment.
  • there is no need to replace the take-up tape attach the start end of the new adhesive tape to the take-up reel, or set guide bins or the like on a predetermined path every time a new adhesive tape reel is replaced.
  • New adhesive tape reels require less time to change, increasing production efficiency of electronic equipment.
  • the connecting portion between the end of one adhesive tape and the beginning of the other adhesive tape covers the locking member with the adhesive tape, so that it has good appearance and In this way, it is possible to prevent the adhesive at the connection part from contacting the adhesive tape and to prevent the adhesive tape from being damaged, or to damage components such as the heating and pressurizing head and the support base of the bonding machine. None.
  • the connecting portion may be wound with another adhesive tape so as to cover the locking member.
  • the invention described in claim 29 is a method in which an adhesive is applied to a base material.
  • the reel on which the adhesive tape has been wound and the empty reel are mounted on an adhesive device, After heating and pressurizing the adhesive on the circuit board, the substrate is mounted so as to be wound up on an empty reel.
  • the amount of adhesive to be used can be greatly increased without increasing the number of windings of the adhesive tape.
  • the number of windings of the adhesive tape is not increased, it is possible to prevent the collapse of the winding, and to prevent the adhesive from leaking out in the width direction of the tape and blocking the wound tapes from adhering to each other.
  • the amount of adhesive per reel can be increased, so that the amount of reel material / moisture prevention material can be reduced, and the production cost can be reduced.
  • the adhesive tape is wound on an empty reel, and then the adhesive of the next adhesive is used. The two reels mounted on the bonding machine may be exchanged.
  • the adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be an insulating adhesive alone, or may be any of those adhesives. It may be one in which insulating spacer particles are dispersed.
  • the width of the substrate is 5 mn!
  • the thickness is preferably 1000 mm, but is arbitrarily selected depending on the width of one adhesive and the number of adhesives.
  • the width of one line of the adhesive is preferably from 0.5 mm to 1.0 mm.
  • the width of the base material is 5 mm or more: L000 mm is set when the width of the base material is less than 5 mm, the number of the adhesives provided on the base material divided by the adhesion. This is because not only is the width of the agent limited, but if it is larger than 100 mm, it may not be possible to attach it to existing bonding equipment.
  • the invention described in claim 30 is the invention described in claim 29, wherein a plurality of adhesives are arranged such that adjacent adhesives are spaced apart from each other. It is characterized by opening.
  • the invention described in claim 31 is the invention according to claim 29, wherein the adhesive is formed by a slit formed in the longitudinal direction of the tape. It is characterized by being separated into articles.
  • the slit may be formed by making a cut in the adhesive with a cutting blade or the like when the adhesive tape is manufactured.
  • the slit may be formed by a laser, a heating wire, or the like, in addition to the cutting edge.
  • the number of the adhesive strips arranged on the base material can be increased.
  • the invention described in claim 32 is a method of manufacturing an adhesive tape in which an adhesive is applied to a base material and wound in a reel shape, wherein an interval is provided in a width direction of the base material.
  • a plurality of adhesives are applied to the substrate by supplying the adhesive onto the surface of the substrate that is continuously conveyed from the applicator that is disposed.
  • the adhesive tape according to claim 30 can be manufactured using existing equipment.
  • the applicator may be a plurality of rolls provided in the width direction of the base material or a nozzle.
  • the invention described in claim 33 is a method of manufacturing an adhesive tape in which an adhesive is applied to a substrate and wound in a reel shape, wherein the adhesive tape is adhered to one entire surface of one substrate. After applying an adhesive, and then forming a longitudinal slit in the adhesive, the other substrate is placed on the adhesive surface, the adhesive is sandwiched between one and the other substrates, and then the one substrate And the other substrate are separated from each other, and a plurality of adhesives are alternately adhered to each of the one and the other substrates, and the plurality of adhesives are arranged at intervals on the one and the other substrates It is characterized by manufacturing things.
  • two adhesive tapes described in claim 3 can be manufactured at the same time, so that the manufacturing efficiency is excellent.
  • the invention described in claim 34 is a method for crimping an adhesive, in which an adhesive is applied to a base material and the adhesive is pressure-bonded to a circuit board using an adhesive tape wound in a reel shape.
  • the adhesive is applied to the entire surface of the base material, and the adhesive is A portion of the adhesive in the width direction of the tape is heated and pressed in a strip shape along the longitudinal direction of the tape from the base material side, thereby reducing the cohesive force of the adhesive in the heated portion and pressing the adhesive to the circuit board.
  • the remaining adhesive is wound up in a reel shape together with the base material, and the adhesive is heated and pressed onto the circuit board again using the adhesive tape wound up in the reel shape.
  • cohesive strength reduction line by heating a part of the adhesive, the cohesive strength of the part is reduced (hereinafter referred to as “cohesive strength reduction line”). ), The adhesive in the heated area from the cohesive strength reduction line is pressed against the circuit board and separates from the substrate. The remaining adhesive is wound onto an empty reel together with the substrate while remaining on the substrate.
  • the adhesive tape since the width of the adhesive tape is merely wider than in the past, the adhesive tape can be manufactured using existing equipment as it is.
  • the width of the adhesive to be pressed onto the circuit board can be set arbitrarily by changing the heating area, and the degree of freedom of the width of the adhesive to be pressed is high.
  • the tape width is 5 mn! ⁇ 100 mm is preferable, and the adhesive to be crimped to the circuit board is 0.5 mn! ⁇ 1.5 mm is preferred. Tape width from 5 mm to 100 m The reason for m is that if the tape width is less than 5 mm, the number of times the adhesive is crimped per reel will be reduced, and if it is more than 100 mm, it may not be possible to attach it to existing bonding equipment. Because there is.
  • the adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be an insulating adhesive alone, or may be any of these adhesives. It may be one in which insulating spacer particles are dispersed.
  • the invention described in claim 35 is an adhesive tape in which an adhesive is applied to a base material and wound on a reel, wherein the width of the adhesive tape is a circuit board.
  • the length of one side is equal to or longer than that of one side, and a plurality of adhesives are arranged in the width direction of the tape.
  • the adhesive tape is arranged so that the width thereof overlaps one side of the circuit board, and the adhesive tape provided in the width direction of the adhesive tape is provided.
  • One strip is directly heated and pressed along one side of the circuit board.
  • the adhesive tape may be drawn out by the width of the adhesive and used.
  • the circuit board is turned, and the other side is positioned in the width direction of the adhesive tape, and the adhesive strip is heated and pressed to the other side. In this way, if the adhesive is sequentially pressed on the other side of the circuit board, the adhesive can be easily pressed on the four circumferences of the circuit board.
  • the adhesive having the length of one side or more of the circuit board is sequentially used one by one, and the amount of use at one time is only the width of the adhesive strip.
  • the amount of adhesive that can be used on one reel can be greatly increased without increasing the number of windings.
  • the amount of the adhesive per reel can be increased, so that the use amount of the reel material and the moisture prevention material can be reduced, and the production cost can be reduced.
  • the adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be only an insulating adhesive, or may be an insulating adhesive. May be dispersed.
  • the width of the adhesive tape is equal to or greater than the dimension of one side of the circuit board, and is, for example, 5 mm to 3000 mm.
  • the adhesive tape may have the dimension of one side of the circuit board by arranging a plurality of adjacent strips in the width direction of the adhesive tape. In this case, production efficiency can be improved because the circuit board can be easily adapted to circuit boards having different dimensions.
  • the width of one strip of the adhesive is, for example, 0.5 mm to 10.0 mm.
  • the width of the adhesive tape is 5 mn!
  • the reason why it is set to 3000 mm is that the dimension of one side of the circuit board is less than 5 mm in many cases, and if it is larger than 3000 mm, the width of the reel becomes too wide, and it is difficult to mount it on existing bonding equipment. This is because it may not be possible.
  • the plurality of adhesives are such that adhesives adjacent to each other are spaced apart from each other. It is characterized.
  • the invention described in claim 37 is as claimed in claim 35.
  • the adhesive is separated into a plurality of strips by slits formed in a width direction of the tape.
  • the same operation and effect as those in claim 35 can be obtained, and the adhesive tape is applied to the entire surface of one side of the base material. It is preferable that a slit is formed by cutting the adhesive with a cutting blade or the like immediately before the adhesive is pressed onto the circuit board, that is, immediately before the adhesive tape is used, using a dried and coated adhesive.
  • the slit may be formed by making a cut in the adhesive with a cutting blade or the like at the time of manufacturing the adhesive tape, or a laser or a heating wire other than the cutting blade may be used. It may be formed by
  • the invention described in claim 38 is a method for manufacturing an adhesive tape in which an adhesive is applied to a base material and wound in a reel shape, The adhesive is applied to the entire surface, and then a slit is formed in the adhesive along the width direction of the tape. Then, the other substrate is placed on the adhesive surface and the adhesive is applied to one and the other substrates. Then, one substrate and the other substrate are separated from each other, and a plurality of adhesives are alternately attached to those of the one and the other substrates, so that a plurality of adhesives are attached to the one and the other substrates. It is characterized in that it is manufactured by arranging strip adhesives at intervals.
  • two adhesive tapes described in claim 2 can be simultaneously manufactured using existing equipment, so that manufacturing efficiency can be improved. Excellent.
  • the invention described in claim 39 is a method of disposing the adhesive tape according to any one of claims 1 to 3 on a circuit board, and the adhesive tape having a width.
  • the adhesive strip is pressed against one side of the circuit board by applying heat and pressure along the direction.
  • This is a method for crimping an adhesive tape, wherein an adhesive strip is crimped to one side of a circuit board by heating and pressing the tape along the width direction.
  • an adhesive tape is placed on a circuit board, the adhesive tape is heated and pressed along the width direction to press the adhesive strip on one side of the circuit board, and then the position of the circuit board is changed.
  • the next adhesive strip can also be pressed on the other side of the circuit board by heating and pressing the adhesive tape along the width direction on the other side of the circuit board.
  • the effects described in any of claims 35 to 37 can be obtained, and the adhesive can be used.
  • the other side is positioned parallel to the width direction of the adhesive tape, and the adhesive is pressed on the other side of the circuit board.
  • the adhesive can be easily pressed on the four circumferences of the circuit board, thereby improving work efficiency in an electronic component manufacturing plant.
  • the invention described in claim 40 is that at least two adhesive tapes according to any one of claims 35 to 37 are provided on a transport path for moving a circuit board.
  • One adhesive tape is placed in the direction perpendicular to the transport path, and the other adhesive tape is placed in the width direction along the transport path.
  • the adhesive strip is pressed on the two opposing sides of the circuit board by heating and pressing the adhesive tape along the width direction on the two opposing sides of the circuit board, and then the circuit board is bonded to the other adhesive.
  • the adhesive tape is crimped on the four circumferences of the circuit board by moving to the tape and heating and pressing the adhesive tape along the width direction from the base material side on the remaining two sides of the circuit board.
  • the adhesive is applied to the entire surface of one side of the base material, and the adhesive is pressure-bonded to the circuit board using an adhesive tape wound in a reel shape.
  • An adhesive tape crimping method in which the width of the adhesive tape is equal to or greater than the length of one side of the circuit board, and a part of the adhesive in the width direction of the adhesive tape is heated and pressed in the width direction. In this way, the adhesive is pressed onto the circuit board while reducing the cohesive force of the adhesive in the heated portion.
  • the adhesive tape is attached to the bonding device, and the adhesive tape is attached along the width direction.
  • the adhesive tape is heated and pressurized, the cohesive strength of that part is reduced (hereinafter referred to as the “cohesive strength reduction line”), and the adhesive of the heated part from the cohesive strength reduction line separates from the base material. It is crimped to the circuit board. Next, rotate the circuit board by about 90 degrees, position the adjacent side in the width direction of the adhesive tape, and heat and press the next adhesive strip along the width direction to place the adhesive strip next to the adhesive strip. Press the adhesive on the sides. In this way, the adhesive can be sequentially pressed on the four sides of the circuit board, and the working efficiency is good.
  • the adhesive tape may be applied to the entire surface of the adhesive tape, the adhesive tape can be manufactured using existing equipment as it is.
  • the width of the adhesive to be pressed onto the circuit board can be arbitrarily set by changing the heating and pressing area, and the degree of freedom of the width of the adhesive to be pressed is high.
  • the invention described in claim 42 includes one reel, the other reel, and a case for housing these reels while holding them rotatably.
  • One of the reels has an adhesive tape coated with an adhesive applied to a base material, the other reel has one end of the adhesive tape fixed thereto, and the adhesive tape has a longitudinal direction of the tape. Characterized in that at least two lines of adhesive are arranged along the line.
  • the adhesive tape cassette is mounted on the bonding device, and is formed along the longitudinal direction with at least two in the width direction of the adhesive tape.
  • One piece of the adhesive is arranged so as to overlap one side of the circuit board, and the one piece of the adhesive is pressed onto the circuit board by applying heat and pressure from the substrate side.
  • the adhesive is sequentially pressed on the circuit board, the adhesive tape is sequentially fed out from one of the reels, and the adhesive tape on which the other adhesive is applied to the other reel. And wind up. Then, when the adhesive tape wound on one of the reels is completed, the cassette is turned over and mounted on the crimping device again.
  • the pressure bonding can be performed sequentially or at intervals by changing the position in the width direction.
  • At least two lines of the adhesive are arranged in the width direction in the adhesive sheet, and the adhesive is used one by one. It can be used, and the amount of adhesive that can be used on one reel can be more than doubled without increasing the number of turns of adhesive tape.
  • the adhesive tape is used as a cassette, there is no need to attach the adhesive tape to the reel in the bonding device, and it is easy to handle since only the cassette is mounted on the bonding device. Also, the workability of installation and replacement is good.
  • the adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be an insulating adhesive alone, or may be any of those adhesives. It may be one in which insulating spacer particles are dispersed.
  • the invention described in claim 43 is the invention described in claim 42, wherein a plurality of adhesives are arranged such that adjacent adhesives are spaced apart from each other. It is characterized by opening.
  • the invention described in claim 44 is the invention described in claim 42, wherein the adhesive is formed into a plurality of strips by slits formed in the width direction of the tape. It is characterized by being separated.
  • the slit may be formed by making a cut in the adhesive with a cutting blade or the like at the time of manufacturing the adhesive tape, or a slit or a laser or a heating wire may be used. May be formed.
  • the invention described in claim 45 includes one reel, the other reel, and a case for rotatably holding and storing these reels,
  • One reel has an adhesive tape coated with an adhesive applied to a base material
  • the other reel has an adhesive tape cassette in which one end of the adhesive tape is fixed to a crimping device. Attach, pull out the adhesive tape from the adhesive tape cassette onto the circuit board, and apply heat and pressure to a part of the adhesive tape in the width direction to reduce the cohesive force of the adhesive in the heated part and reduce the width in the width direction. It is characterized in that a part of the adhesive is pressed onto the circuit board.
  • cohesive strength reduction line by heating and pressing a part of the adhesive tape in the width direction, the cohesive force of the adhesive in the part is reduced. (Hereinafter referred to as “cohesive strength reduction line”), and the adhesive in the portion heated from the cohesive strength reduction line is separated from the base material and pressed onto the circuit board.
  • the adhesive tape may be applied to the entire surface of the base material, so that the existing equipment can be used as it is to manufacture the adhesive tape.
  • the width of the adhesive to be bonded to the circuit board can be arbitrarily set by changing the heating / pressing area, and the width of the adhesive to be bonded is high.
  • the invention described in claim 46 includes one reel, the other reel, and a case for rotatably holding and storing these reels.
  • One of the reels has an adhesive tape coated with an adhesive applied to a base material
  • the other reel has an adhesive tape cassette in which one end of the adhesive tape is fixed to a crimping device.
  • the tape is pulled out of the adhesive tape cassette onto the circuit board, and a part of the adhesive tape in the width direction is heated and pressurized to reduce the cohesive force of the adhesive in the heated part and reduce the part of the width in the width direction.
  • the adhesive is pressure-bonded to the circuit board, and when the adhesive tape wound around one of the reels is completed, the adhesive tape cassette is turned over and the remaining adhesive is pressure-bonded to the circuit board.
  • the invention described in claim 47 is an adhesive tape applied to a base material and wound in a reel shape, wherein the base material has a hot-melt agent layer and a support layer. It is characterized by having.
  • the reel on which the adhesive tape has been wound and the empty reel are mounted on an adhesive device, and a circuit is mounted. After heating and pressing the adhesive on the substrate, the substrate is mounted so as to be wound up on an empty reel. Then, the end of one adhesive tape wound on one reel where the unwinding is completed and the start end of the other adhesive tape wound on another new reel are overlapped or abutted, and such a portion is heated. Then, after the hot-melt agent layer is melted, the hot-melt agent is solidified by cooling, so that the adhesive tapes are connected to each other.
  • the bonding device can be used rationally by using the heating and pressing head of the bonding device for mounting the adhesive reel.
  • the invention described in claim 48 is characterized in that, in the invention described in claim 1, the support layer is sandwiched between the hot melt layers. .
  • the same function and effect as the invention described in claim 1 can be obtained, and the hot-melt agent layer is formed on the surface of the base material. Therefore, the adhesive surface at the start end is superimposed on the hot-melt agent layer at the end of one adhesive tape, and such a portion can be heated and pressed to connect the two, and the connection is simple. In addition, since the hot-melt agent layer is formed over the entire length of the tape, it is not necessary to strictly determine the overlapping length, and the degree of freedom of connection is high.
  • the invention described in claim 49 is characterized in that, in the invention described in claim 1, the hot-melt agent layer is interposed between the support layers.
  • the adhesive tapes can be connected to each other. Is heated by a heating and pressing head of the bonding apparatus at a position where the end of one adhesive tape and the start of the other adhesive tape are abutted. When heated, the hot melt dissolves and exudes, and upon cooling, the hot melt solidifies, so that the adhesive tapes are connected. In this case, since the hot-melt layer is sandwiched between the support layers, it is possible to prevent the hot-melt layer from being exposed to the outside air and reducing the adhesive strength of the hot-melt layer by adhesion of moisture and dust. it can.
  • the invention described in claim 50 is a bonding material for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel.
  • a method of connecting tapes wherein the adhesive tape includes a base material surface-treated with a release agent and an adhesive, and the release agent at the end of the base material of one of the adhesive tapes is removed. It is characterized in that the adhesive surface of the other adhesive tape is superimposed on the part, and the two superposed parts are connected by thermocompression bonding.
  • the base material surface of one of the adhesive tapes and the adhesive surface of the other adhesive tape are overlapped with each other, Then, the end of the unwound adhesive tape is connected to the start of the newly installed adhesive tape, and the adhesive reel is replaced. Adhesive reel can be easily installed.
  • the bonding device can be used rationally by using the heating and pressurizing head of the bonding device for mounting the adhesive material reel.
  • the invention described in claim 51 is the invention according to claim 50, wherein the release agent is removed by any of plasma discharge, ultraviolet irradiation, and laser irradiation. It is characterized by one or more.
  • the same operation and effect as those of the invention described in claim 50 can be obtained, and plasma discharge, ultraviolet irradiation, laser Since the release agent is removed by using any one of the irradiation methods, the release agent can be removed more accurately and in a shorter time than when the release agent is peeled off by hand.
  • the gas in the plasma state is decomposed, and the gas is discharged to the surface of the base material in a state in which it is easy to react (excitation state).
  • excitation state a state in which it is easy to react
  • To remove the release agent In the case of ultraviolet irradiation, for example, a mercury lamp is used as a light source, and irradiation is performed from the mercury lamp for a certain period of time.
  • laser irradiation the laser irradiated by the laser oscillator 2003/009694 The release agent is heated and melted by the light, and the release agent is removed.
  • the invention described in claim 52 is an adhesive tape reel in which an adhesive tape is wound around a reel, the adhesive for electrode connection being applied to a base material.
  • the adhesive tape reel is characterized in that a plurality of winding portions of the adhesive tape are provided in the width direction of the tape.
  • Adhesive tape wound on multiple winding sections can be used sequentially, so it can be used in one exchange work without increasing the number of adhesive tape turns per adhesive tape reel It is possible to greatly increase the amount of adhesive required. In addition, since the number of windings of the adhesive tape is not increased, it is possible to prevent collapse of the tape and to prevent so-called blocking, in which the adhesive oozes out in the width direction of the tape and the wound adhesive tapes adhere to each other. In addition, it is possible to prevent adverse effects such as elongation of the base material, which are likely to occur when the base material is elongated.
  • the invention described in claim 53 is the invention described in claim 52.
  • the end of one adhesive tape and the start of the other adhesive tape are provided.
  • a connection tape for connecting the two is provided between the first and second parts, and when the unwinding of one adhesive tape is completed, the unwinding of the other adhesive tape is started.
  • claim 5 In addition to providing the same operation and effect as the invention described in paragraph 2, the end end of one adhesive tape and the start end of the other adhesive tape are connected by a connecting tape, so that After the unwinding of the adhesive tape of the winding part is completed, the work of attaching the adhesive tape of the other winding part to the take-up reel becomes unnecessary, and the production efficiency of electronic equipment is further improved.
  • the invention described in claim 54 is the adhesive tape reel described in claim 53, a winding reel of the adhesive tape, and an adhesive tape.
  • a crimping portion provided between the reel and the take-up reel and for crimping the adhesive of the adhesive tape to the circuit board of the electronic device by a heating and pressing head; and a tape detecting means for detecting the coupling tape.
  • the tape detecting means detects the connection tape, the connection tape is wound on a take-up reel until the connection tape passes through the crimping portion.
  • the connecting tape is automatically wound on the take-up reel, so that the adhesive tape on one of the winding portions is terminated. After that, the adhesive tape can be sequentially fed out from the next winding portion.
  • the tape detecting means detects the connecting tape
  • the connecting tape is automatically wound on the winding reel until the connecting tape passes through the crimping portion, so that the time and effort for winding can be reduced. be able to.
  • the tape detecting means for example, an adhesive device is provided with a pair of light emitting portions and a light receiving portion, and the connecting tape is optically detected.
  • colored (for example, black) marks are provided at both ends of the connecting tape, and the light receiving unit detects the marks at both ends of the connecting tape by the laser beam emitted from the light emitting unit to determine the connecting tape.
  • a method of making the width of the connection tape different from the width of the adhesive tape, or a method of forming a plurality of holes in the connection tape may be used.
  • the invention described in claim 59 is one of a reel and the other.
  • Is equipped with an electric heating member that generates heat by the supplied electric power pulls out the adhesive tape wound on one of the reels into the opening of the case, and heats the adhesive tape in the opening with the heating member from the base material side.
  • the adhesive is pressed against the circuit board by pressing, and the base material from which the adhesive has been peeled off is wound up with the other reel.
  • the adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be an insulating adhesive alone, or may be an adhesive. Insulating particles may be dispersed.
  • the invention described in claim 60 is an adhesive tape applied to a substrate, wherein the substrate is made of a metal film or an aromatic polyamide film. JP2003 / 009694.
  • the base material of the adhesive tape is a metal film (or a metal foil) or an aromatic polyamide film, so that the thickness of the base material is reduced. Even in this case, problems such as stretching of the base material and cutting can be prevented. [0206] Therefore, by using an adhesive tape having a small thickness, the number of windings per reel can be increased, and the amount of adhesive usable on one reel can be increased. . Further, if the adhesive tape of the present invention is used, the number of windings per reel is large, so that in an electronic component manufacturing factory, the number of times of replacement of a new adhesive tape can be reduced, and work efficiency can be improved. Furthermore, in the production of the adhesive tape, the number of reels to be produced can be reduced, so that the use amount of the reel material and the moisture prevention material can be reduced, and the production cost can be reduced.
  • the metal film is preferably a metal having high extensibility, and copper, aluminum, stainless steel, iron, tin, or the like is used.
  • aromatic polyamide film specifically, para-aramid film (Microtron; trade name, manufactured by Toray Industries, Inc.) is used.
  • thermoplastic resin a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin
  • a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acrylic resin type and a silicone resin type as a thermosetting resin type.
  • the adhesive may have conductive particles dispersed therein.
  • the conductive particles include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like.
  • the conductive layer may be formed by coating the conductive layer on a polymer nucleus material such as conductive glass, ceramics, or plastic.
  • insulating coating particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • Heat-melted metal such as solder, or polymer nucleus material such as plastic with a conductive layer formed on It is preferable because it has deformability by pressurization, reduces the distance between electrodes after connection, increases the contact area with a circuit at the time of connection, and improves reliability.
  • a polymer when a polymer is used as a core, it is more preferable because a softening state can be widely controlled by a connection temperature because it does not have a melting point unlike solder, and a connection member that can easily cope with variations in electrode thickness and flatness is obtained. .
  • the invention described in claim 61 is the invention described in claim 60, wherein the thickness of the base material is ⁇ ! 225 ⁇ .
  • the reason for setting the thickness to 25 ⁇ is that if the thickness of the substrate is less than 1 ⁇ m, sufficient tensile strength of the substrate cannot be obtained and the substrate is easily cut. Further, when the thickness of the base material exceeds 25 ⁇ , it is difficult to obtain a satisfactory number of windings per reel.
  • the invention described in claim 62 is the invention according to claim 60 or claim 61, wherein the tensile strength of the base material is 25. It is characterized by being at least 300 MPa by mouth.
  • the reason why the tensile strength of the base material is 30 OMPa or more is that if the tensile strength of the base material is less than 30 OMPa, the base material is easily stretched and the adhesive tape is cut. It is because it becomes easy.
  • the invention described in claim 63 is the invention according to any one of claims 60 to 62, wherein the adhesive for the base material is The ratio of the thickness to the thickness is 0.01 to 1.0.
  • the ratio of the thickness of the base material to the adhesive is set to 0.01 to 1.0 when the ratio of the thickness of the base material to the adhesive is less than 0.01. This is because the material is too thin and the strength of the adhesive tape cannot be obtained sufficiently. Also, if the ratio of the thickness of the base material to the adhesive exceeds 1.0, the thickness of the base material becomes too thick, and the number of turns per reel cannot be increased.
  • the invention described in claim 64 is the invention according to any one of claims 60 to 63, wherein the surface roughness of the substrate is R R mA x is 0.5 ⁇ or less.
  • an adhesive is applied to a base material, and the adhesive is formed on the adherend using an adhesive tape wound in a reel shape.
  • An adhesive tape forming method in which an adhesive tape is pulled out from each of a plurality of reels, each adhesive tape is overlapped and integrated, and one of the base materials is peeled off and overlapped to be integrated. The adhesive is formed on the adherend.
  • the bonding between the adhesive surface of the adhesive tape unwound from one reel and the adhesive tape unwound from the other reel is performed.
  • the adhesive surface is integrated with the agent surface.
  • the base material of the other adhesive tape is wound on a winding reel, and the adhesive of the adhesive tape integrated by lamination is pressure-bonded to the adherend by a pressurized heating head.
  • the adherend is an electronic component or a circuit board, such as a lead frame or a lead frame die.
  • the adhesive of one adhesive tape and the adhesive of the other adhesive tape are overlapped with each other to obtain a desired adhesive tape. Since the adhesive is formed on the adherend after the thickness of the adhesive is increased, the winding diameter of the adhesive tape per reel should be reduced even though the number of windings of the adhesive tape is increased. Can be. Therefore, the number of windings of the adhesive tape per reel can be increased, and the amount of adhesive usable in one exchange operation can be greatly increased. Therefore, the replacement work of the new adhesive tape is reduced, and the production efficiency of electronic equipment is improved.
  • Claim 6 In addition to providing the same function and effect as the invention described in Item 5, only the adhesive of one adhesive tape contains a curing agent, so the adhesive of the other adhesive tape does not require a curing agent. Become. Therefore, low-temperature control is not required for adhesive tapes made of adhesives that do not contain a curing agent. Therefore, the number of adhesive tapes requiring low-temperature management can be reduced, and the transport and storage of the adhesive tapes can be efficiently managed.
  • the adhesive of the adhesive tape containing no curing agent and the adhesive tape containing the curing agent include the component reacting with the curing agent as the other adhesive, and the component not reacting with the curing agent as the curing agent. The storage stability of the adhesive can be improved by using one of the adhesives used together with the ligne.
  • the invention described in claim 67 is characterized in that an anisotropic conductive material having a film-like adhesive is wound and laminated many times in the longitudinal direction of the core material. This is a conductive tape.
  • the anisotropic conductive material is a two-layer anisotropic conductive material in which a base film is provided on one surface of a film-like adhesive.
  • the anisotropic conductive material tape according to claim 67 which is a material.
  • the anisotropic conductive material is a film-like adhesive.
  • This is an anisotropic conductive material tape that is a three-layered anisotropic conductive material with a base material film provided on both sides of the agent.
  • the invention described in claim 70 is the anisotropic conductive material tape according to claim 68 or claim 69, wherein the base film is This is an anisotropic conductive material tape in which one or both surfaces of the film are subjected to a peeling treatment.
  • the invention described in claim 71 is the anisotropic conductive material tape according to any one of claims 67 to 70, This is an anisotropic conductive material tape in which the width of the film adhesive is 0.5 to 5 mm.
  • the invention described in claim 72 is the claim 6 In anisotropic conductive material tape according to any one of item 8 to claims 71, wherein the strength of the base film, at 12 kg / mm 2 or more, elongation, from 60 to 200%, Thickness is 10 This is an anisotropic conductive material tape having a thickness of ⁇ or less.
  • the base film is colored to be transparent or colored and opaque, it is easy to distinguish the base film from the adhesive, and the position of the unwinding portion is easy, so that the workability is improved.
  • FIG. 1 is a perspective view showing the connection between the adhesive reels in the method for connecting the adhesive tapes according to the first embodiment.
  • FIGS. 2A and 2B are oblique perspective views showing the connection process of the connection portion in FIG.
  • FIG. 3 is a schematic view showing a pressure bonding step of the adhesive in the bonding apparatus.
  • FIG. 4 is a cross-sectional view showing adhesion between circuit boards.
  • FIG. 5 is a process chart showing a method for manufacturing an adhesive tape.
  • FIG. 6 is a perspective view showing an adhesive tape connection L0 method in the second embodiment of the present invention.
  • FIG. 7 is a perspective view showing a method of connecting an adhesive tape in a modification of the second embodiment of the present invention.
  • FIGS. 8A to 8C are views showing a method of connecting the adhesive tape according to the first embodiment
  • FIG. 8A is a perspective view showing the connection between the adhesive reels
  • 8L5B is a perspective view showing a connection method of the connection portion in FIG. 8A
  • FIG. 8C is a plan view of the connection portion in FIG. 8A.
  • FIG. 9 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the second embodiment of the present invention.
  • FIG. 10 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the third embodiment of the present invention.
  • FIG. 11 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the fourth embodiment of the present invention.
  • FIGS. 12 and 12B are views showing a method of connecting the adhesive tape according to the first embodiment
  • FIG. 12A is a perspective view showing the connection between the adhesive reels
  • FIG. 12B is a perspective view showing a connection method of the connection portion in FIG. 12A.
  • FIGS. 13A and 13B show the adhesive tape in the second embodiment of the present invention. It is sectional drawing which shows a continuation method.
  • Figs. 14A and 14B are cross-sectional views illustrating a method of connecting an adhesive tape according to the third embodiment of the present invention.
  • Fig. 14A illustrates a state before heating and pressing. Indicates the state after heating and pressing.
  • Fig. 15A and Fig. 15B are views showing a method of connecting an adhesive tape in the fourth embodiment of the present invention
  • Fig. 15A is a cross-sectional view
  • Fig. 15B is a plan view. It is.
  • FIGS. 16A and 16B are diagrams showing a method of connecting the adhesive tape according to the first embodiment
  • FIG. 16A is a perspective view showing the connection between the adhesive reels
  • 16B is a perspective view showing a connection portion (b) in FIG. 16A.
  • Fig. 17 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the second embodiment of the present invention.
  • Fig. 18 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the third embodiment of the present invention.
  • Fig. 19 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the fourth embodiment of the present invention.
  • Figs. 20A to 20C are diagrams showing a method of connecting the adhesive tape according to the first embodiment
  • Fig. 2 OA is a perspective view showing the connection between the adhesive reels
  • 20B and 20C are cross-sectional views showing a connection method of a connection portion in FIG. 2 OA.
  • Fig. 21 is a schematic diagram showing a pressure bonding step of the adhesive in the bonding device.
  • FIGS. 22A to 22C are diagrams showing an adhesive tape reel according to the first embodiment
  • FIG. 22A is a perspective view showing an adhesive tape reel
  • FIG. FIG. 22C is a front view of FIG. 22A
  • FIG. 22C is a plan view of the connecting tape of FIG. 22A.
  • Fig. 23 is a schematic diagram showing a pressure bonding step of the adhesive in the bonding apparatus.
  • Fig. 24 is a plan view of the connecting tape according to the second embodiment of the present invention.
  • Fig. 25 is a plan view of a connecting tape according to the third embodiment of the present invention.
  • Fig. 26 is a perspective view showing an adhesive tape reel according to the fourth embodiment of the present invention.
  • FIGs. 27A to 27C are diagrams illustrating an adhesive tape according to the first embodiment, and Fig. 27A is a perspective view illustrating the adhesive tape.
  • FIG. 27B is a front view in FIG. 27A, and
  • FIG. 27C is a cross-sectional view of the connection portion in FIG. 27A.
  • FIG. 28 is a schematic view showing a pressure bonding step of the adhesive in the bonding apparatus.
  • Fig. 29 is a perspective view showing a use state of the adhesive in the PDP.
  • Fig. 30 is a perspective view showing an adhesive tape reel according to the second embodiment of the present invention.
  • FIG. 31A is a cross-sectional view of an adhesive tape in a case where the adhesive tape of the adhesive tape of the present invention is used for a semiconductor device having a LOC structure.
  • FIG. 31B is a cross-sectional view of a semiconductor device having a LOC structure when the adhesive tape of the adhesive tape reel of the present invention is used for a semiconductor device having a LOC structure.
  • FIGs. 32A to 32C are schematic diagrams of a bonding apparatus using the adhesive tape of the present invention.
  • Fig. 32A is a front view
  • Fig. 32B is a side view
  • Figs. FIG. 34 is an enlarged view of a main part of the adhesive tape punching and sticking section 89 in FIG. 32B.
  • FIGS. 33A and 33B are views of an adhesive tape
  • FIG. 33A is a perspective view of a reel on which an adhesive tape is wound
  • Fig. 34 is a perspective view showing a use state of the adhesive in the PDP.
  • Fig. 35 is a cross-sectional view showing a step of applying an adhesive to a base material.
  • Figs. 36A to 36C are cross-sectional views of the adhesive tape according to the second embodiment of the present invention.
  • Figs. 37A to 37C are process diagrams illustrating an adhesive tape and a method for crimping the same, according to the third embodiment of the present invention.
  • Figs. 38A to 38C show an adhesive tape according to a fourth embodiment of the present invention.
  • FIG. 3 is a process chart showing a method for producing a loop.
  • FIG. 39A and Fig. 39B are views of the adhesive tape
  • Fig. 39A is a perspective view of a reel around which the adhesive tape is wound
  • Fig. 39B is the adhesive tape of Fig. 39A.
  • FIG. 3 is a plan view as viewed from an adhesive side.
  • Fig. 40 is a schematic view showing a pressure bonding step of an adhesive in a bonding apparatus.
  • Fig. 41 is a second embodiment of the present invention, and is a schematic view illustrating a pressure bonding step of an adhesive in a bonding apparatus.
  • Figs. 42A to 42C are cross-sectional views of the adhesive tape according to the third embodiment of the present invention.
  • Figs. 43A to 43C are process diagrams illustrating an adhesive tape and a method for crimping the same according to a fourth embodiment of the present invention.
  • Figs. 44A to 44C are process diagrams showing a method of manufacturing an adhesive tape according to the fifth embodiment of the present invention.
  • FIGs. 45A and 45B are views of an adhesive table cassette according to the first embodiment of the present invention
  • Fig. 45A is a perspective view of an adhesive tape cassette
  • Fig. 45B is a view of Fig. 45A.
  • FIG. 4 is a sectional view taken along line A-A.
  • Fig. 46 is a view showing reel removal in the tape cassette shown in Fig. 45A. It is sectional drawing which shows an attachment state.
  • FIG. 47 is a front view showing a pressure bonding step of the adhesive in the bonding apparatus.
  • Fig. 48 is a process diagram showing a method for producing an adhesive tape cassette.
  • Fig. 49 is a second embodiment of the present invention, and is a schematic view showing a pressure bonding step of an adhesive in a bonding apparatus.
  • FIG. 50 is a cross-sectional view of the adhesive tape according to the third embodiment of the present invention.
  • FIGS. 51A and 51B are process diagrams showing an adhesive tape and a method for crimping the same according to a fourth embodiment of the present invention.
  • FIGS. 52A and 52B are views showing the adhesive tape according to the first embodiment, and FIG. 52A is a perspective view showing the connection between the adhesive reels. FIG. 52B is a cross-sectional view showing a connection portion in FIG. 52A.
  • FIG. 53 is a cross-sectional view illustrating an adhesive tape according to the second embodiment.
  • FIGS. 54A to 54C are cross-sectional views showing a connection step of a connection portion in FIG. 55, FIG. 54A shows a state before discharging, and FIG. FIG. 54C is a view showing a thermocompression bonding of a connection portion.
  • Fig. 55 is a perspective view showing the connection between the adhesive reels in the method of connecting the adhesive tape.
  • Fig. 56 is a schematic view showing a pressure bonding step of the adhesive in the bonding apparatus.
  • FIG. 57A to FIG. 57C are views showing an adhesive tape reel according to the first embodiment
  • FIG. 57A is a perspective view showing an adhesive tape reel
  • 57B is a front view in FIG. 57A
  • FIG. 57C is a front view of the cover member in FIG. 57A.
  • Fig. 58 is a process diagram showing a method for manufacturing an adhesive tape reel.
  • Fig. 59 is a side view of the adhesive tape in the second embodiment of the present invention.
  • FIG. 6OA and FIG. 60B are front views of the adhesive tape reel according to the third embodiment of the present invention, and are views illustrating replacement of the adhesive tape.
  • Fig. 61 is a perspective view showing a side plate of a winding portion in the fourth embodiment of the present invention.
  • Figs. 62A and 62B are diagrams of the adhesive tool according to the first embodiment of the present invention, and Fig. 62A is a perspective view of the adhesive tool. B is a sectional view taken along line AA of FIG. 62A.
  • FIG. 63 is a side view for explaining how to use the bonding tool shown in FIG. 62A and FIG. 62B.
  • FIG. 64 is a process diagram illustrating a method for manufacturing an adhesive tool.
  • Fig. 65A and Fig. 65B are diagrams showing an adhesive tape according to the first embodiment.
  • Fig. 65A is a perspective view in which the adhesive tape is wound around a reel.
  • FIG. 65A is a perspective view in which the adhesive tape is wound around a reel.
  • 65A is a sectional view taken along the line AA in FIG. 65A.
  • FIGS. 66A and 66B are diagrams showing an adhesive forming process of the adhesive tape according to the first embodiment
  • FIG. FIG. 66B is a schematic view showing a step of winding one of the base materials onto a winding reel
  • FIG. 66B is a cross-sectional view showing a portion where adhesives are overlapped in FIG. 66A.
  • FIG. 67 is a schematic view showing a step of forming an adhesive on an adherend in the bonding apparatus.
  • FIG. 68 is a perspective view of a reel on which an adhesive tape is wound.
  • FIG. 69A is a cross-sectional view showing a step of forming an adhesive material on an adhesive tape according to the second embodiment.
  • FIG. 69B shows adhesion between circuit boards using the adhesive of FIG. 69A.
  • FIG. 70 is a schematic diagram of a supply form of the two-layer anisotropic conductive material tape of the present invention.
  • FIG. 71 is a schematic diagram of a supply form of the three-layer anisotropic conductive material tape of the present invention.
  • FIG. 1 is a perspective view showing the connection between the adhesive reels in the method for connecting the adhesive tape according to the first embodiment
  • FIGS. 2A and 2B are diagrams in FIG. Fig. 2A is a perspective view showing the cutting of an end tape of a used adhesive tape
  • Fig. 2B is a view showing a used adhesive tape turned upside down to obtain a new adhesive material.
  • FIG. 3 is a schematic view showing an adhesive bonding step in a bonding apparatus
  • FIG. 4 is a cross-sectional view showing bonding between circuit boards
  • FIG. 5 is a method of manufacturing an adhesive tape.
  • the adhesive tape 1 is wound around the reels 3 and 3a, and the reels 3 and 3a are arranged on both sides of the winding core 5 and the adhesive tape 1.
  • a side plate 7 is provided. That is, each of the reels 3, 3 a has a winding core 5 and side plates 7 arranged on both width sides of the adhesive tape 1.
  • the adhesive tape 1 includes a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • the base material 9 is made of ⁇ PP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Evening rate), but are not limited to these.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • resins include styrene resin as thermoplastic resin, and polyester resin.
  • the conductive particles 13 are dispersed in the adhesive 11.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, copper, graphite, and the like.
  • the conductive particles 13 include these and non-conductive glass.
  • a conductive layer made of the material constituting the above-described conductive particles 13 may be formed by coating a polymer nucleus material such as ceramic, plastic, or the like with a coating.
  • insulating coated particles obtained by coating the above-described conductive particles 13 with an insulating layer, a combination of the conductive particles 13 and the insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, etc., it is deformable by heating or pressurizing, and the distance between the electrodes after connection is reduced. This is preferable because the contact area with the circuit is increased and the reliability is improved.
  • the conductive particles 13 do not show a melting point like solder, so that the softening state can be controlled widely by the connection temperature, and the connection can easily cope with variations in electrode thickness and flatness.
  • the reel 3 a of the adhesive tape 1 and the take-up reel 17 are mounted on the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3 a is hung on the guide bin 22 and wound. Attach it to the take-up reel 17 and pay out the adhesive tape 1 (arrow E in Fig. 3). Then, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 placed between the two reels 3 a, 17, and the adhesive 11 To the circuit board 21. Thereafter, the substrate 9 is wound on a take-up reel 17.
  • the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and fully connected.
  • a wiring circuit (or electronic component) 23 is arranged on the adhesive 11 crimped to the circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluorocarbon.
  • Ethylene 24 The ffi wire circuit 23 is heated and pressurized on the circuit board 21 by the heating and pressurizing head 19 via JP2003 / 009694.
  • the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • the PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be crimped over the entire periphery of the PDP, and has many connection parts, and the adhesive 1 1 means that the amount of adhesive 11 used at a time will be much higher than before. Therefore, the amount of the adhesive tape 1 wound on the reel 3a increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time. The end mark 28 of the adhesive tape 1 wound on the reel 3a is exposed.
  • the adhesive tape connecting method of the present invention comprises the steps of: (a) using the take-up reel 17 as it is; When the tape is replaced and a new adhesive tape is connected to the take-up reel 17, and (b) the adhesive tape 1 used as the take-up reel 17 has a small number of used adhesive tapes 1 In some cases, a new adhesive tape is connected to an adhesive tape with less winding.
  • the end mark 28 is used for the adhesive tape 1 from the used reel (reel from which the adhesive tape 1 is completely fed) 3a to the heating and pressurizing mode.
  • the adhesive tape 1 is stretched to a position where the adhesive tape 1 is fixed to the used reel 3a, it is desirable to attach the adhesive tape 1 to a position extending from the fixing position to the heating and pressing head 19.
  • the adhesive tape 1 will be cut at the minimum necessary position, and the waste of the adhesive tape 1 can be prevented, and the used reel 3 a It is possible to prevent the troublesome work of removing the used reel 3a so that the end mark 28 can reach the heating / pressing head 19 by heating.
  • the bonding apparatus 15 has a heating / pressing head 19, and the heating / pressing head 19 is used to remove the used reel 3a.
  • the adhesive 1 1 at the end 30 of the adhesive tape 1 and the adhesive 1 1 at the beginning 3 2 of the adhesive tape 1 on the new adhesive reel 3 are connected.
  • the reels 3 and 3a on which the adhesive tape 1 is wound can be exchanged without using a separate crimping tool for crimping.
  • the overlapped portion of the two is placed on the table 104, and is heated and pressed by the heating and pressing head 19 of the bonding device 15 to bond.
  • the adhesive tape 1 wound on the take-up reel 17 and the adhesive tape 1 wound on the new reel 3 are connected.
  • only the base material 9 is wound on the take-up reel 17, so that several adhesive material reels can be wound, and the number of times of changing the take-up reel 17 can be reduced. Work efficiency is good.
  • a new adhesive material is provided by using the lead tape 41 provided on the start end 32 of the adhesive tape 1 of the new adhesive material reel 3.
  • the connection is made between the adhesive tape 1 of the reel 3 and the adhesive tape 1 wound on the used reel 3a.
  • the lead tape 4 1 consists of the base material 6 3 and the adhesive 4 3 on the back surface, and the beginning 3 2 of the adhesive tape 1 of the new adhesive reel 3 is wound around the reel by the lead tape 4 1
  • the adhesive tape 1 is attached to the base material 9 surface of the adhesive tape 1 and stopped. Then, the lead tape 41 is peeled off from the surface of the base material 9 and superposed on the adhesive 11 surface of the terminal end portion 30 of the adhesive tape 1 turned over.
  • the present invention is not limited to the above-described embodiment, and can be variously modified without departing from the gist of the present invention.
  • the adhesive to be newly mounted as shown in FIG. 7 without turning over the adhesive tape 1 wound around the used reel 3a.
  • the adhesive may be connected to one surface and bonded by heating and pressing with a heating and pressing head 19 of a bonding device 15.
  • the lead tape 41 of the female end portion 32 of the adhesive tape 1 is peeled off from the base material 9 surface, and the lead tape 41 is used as the base material of the used adhesive tape 1. It may be adhered to 9 surfaces.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board or circuit boards to each other, and for electrically connecting both electrodes to each other, and more particularly to an adhesive tape wound in a reel shape.
  • the present invention relates to a method for connecting material tapes.
  • Japanese Patent Application Laid-Open No. 2000-2005 discloses a tape obtained by winding an adhesive tape having a base material coated with an adhesive material in a reel shape. .
  • the conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound up on the reel is about 50 m.
  • adheresive reel When attaching the adhesive tape to the adhesive device, attach a reel of the adhesive tape (hereinafter simply referred to as “adhesive reel”) to the adhesive device, pull out the start end of the adhesive tape, Attach to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive reel using a heating and pressing head, and the remaining base material is wound up on a take-up reel. .
  • the tape width of the adhesive tape is as narrow as 1 to 3 mm, a large number of windings may cause winding collapse. Also, if the number of turns is large, The pressure acting on the adhesive tape wound in a loop may increase, and the adhesive may ooze out from both sides of the tape and cause blocking.
  • the inventions described in claims 5 to 8 are directed to an adhesive material that can easily replace an adhesive material reel and can improve the production efficiency of electronic equipment.
  • the purpose is to provide a method for connecting tapes.
  • FIG. 8A to 8C are views showing a method of connecting the adhesive tape according to the first embodiment
  • FIG. 8A is a perspective view showing the connection between the adhesive reels
  • FIG. FIG. 8C is a perspective view showing a connection method of the connection portion in FIG. 8
  • FIG. 8C is a plan view of the connection portion in FIG. 8A.
  • Adhesive tape 1 is wound around reels 3 and 3a, and each reel has a core 5 and adhesive tape 1 on both width sides.
  • a side plate 7 is provided.
  • the adhesive tape 1 has a length of about 50 m and a width W of about 5 mm.
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • the base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Evening rate), but are not limited to these.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • resins include styrene resin as thermoplastic resin, and polyester resin. Epoxy resin, vinyl ester resin, acrylic resin, and silicone resin.
  • conductive particles 13 are dispersed.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, and graphite.
  • the conductive particles 13 include A conductive layer made of the material constituting the conductive particles 13 described above may be formed by coating a non-conductive glass, ceramic, plastic, or other polymer nucleus material or the like. Further, insulating coated particles obtained by coating the above-described conductive particles 13 with an insulating layer, a combination of the conductive particles 13 and the insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, etc.
  • a hot-melt metal such as solder or a polymer nucleus material such as plastic, etc.
  • the conductive particles 13 do not show a melting point like solder, so that the softening state can be controlled widely by the connection temperature, and it is easy to cope with variations in electrode thickness and flatness More preferable because a connecting member can be obtained
  • the reel 3a of the adhesive tape 1 and the take-up reel 17 are mounted on the adhesive device 15 and the tip of the adhesive tape 1 wound on the reel 3a is inserted into the guide bin 22.
  • the tape is attached to the take-up reel 17 and the adhesive tape 1 is paid out (arrow E in FIG. 3).
  • the adhesive tape 1 is placed on the circuit board 2 1, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 disposed between the reels 3 a and 17.
  • the adhesive 1 1 is crimped to the circuit board 21. Thereafter, the base material 9 is wound on a take-up reel 17.
  • the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and fully connected.
  • a wiring circuit (or electronic component) 23 is arranged on an adhesive 11 crimped on a circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluid. Polyethylene material 2 4
  • the wiring circuit 23 is heated and pressurized to the circuit board 21 by the heating and pressing head 19 through the heating circuit.
  • the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • the PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be crimped over the entire periphery of the PDP, and has many connection parts, and the adhesive 1 1 means that the amount of adhesive 11 used at a time will be much higher than before. Accordingly, the amount of the adhesive tape 1 wound on the reel 3a increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time. End mark 2 8 of adhesive tape 1 wound on a is exposed
  • the adhesive tape connecting method of the present invention comprises the steps of: (a) using the take-up reel 17 as it is; When replacing the tape and connecting a new adhesive tape to the take-up reel 17, and (b) using the adhesive tape 1 with a small number of used adhesive tapes 1 remaining as the take-up reel 17 In some cases, a new adhesive tape and an adhesive tape with few remaining windings may be connected.
  • connection of the adhesive tape 1 is performed by connecting the end portion 30 of the adhesive tape 1 of the adhesive reel 3a to the new adhesive material.
  • the adhesive 11 of the starting end 32 is superimposed on the base 9 surface of the end 30.
  • a substantially U-shaped locking pin 46 is inserted into the overlapped portion, and the end portion 30 of the adhesive tape 1 and the start end portion 32 of the adhesive tape 1 of the new adhesive reel 3 are formed.
  • the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected. In this way, the end 30 of the adhesive tape 1 after the unwinding and the start 32 of the adhesive tape 1 to be newly mounted are fixed by the locking pins 46, so that connection is easy. is there.
  • the elastic members 50 connecting the pawls 48, 49 provided at one end and the other end and the pawls 48, 49 at both ends are provided.
  • the end 30 of one adhesive tape 1 and the start of the other adhesive tape 1 using a locking member 47 provided with 3 and 2 are connected.
  • the end 30 of one adhesive tape 1 and the starting end 32 of the other adhesive tape 1 are abutted, and the claw 48 provided at one end of the locking member 47 is connected to the end 30.
  • the claw portion 49 provided at the other end is engaged with the start end portion 32 so that the one claw portion 48 and the other claw portion 49 are attracted by the elastic member 50.
  • the claw portions 48 and 47 are provided with a plurality of sharpened claws 51 on the back surface of the plate member.
  • the claw portion 48 provided at one end of the locking member 47 is locked to the terminal portion 30 and the claw portion 49 provided at the other end is subsequently locked to the starting end portion 32. Then, both are connected to each other, so that connection is easy.
  • the elastic member 50 is provided between the one claw portion 48 and the other claw portion 49, the elastic member 50 is extended, and the other claw portion 49 of the locking member 47 is connected to the other claw portion 49. Since it can be locked at any position of the starting end 32 of the adhesive tape 1, the degree of freedom of connection is high.
  • the end portion 30 of the adhesive tape 1 wound around the used reel 3a and the new adhesive reel 3 are bonded.
  • the adhesive 1 1 of the start end 3 2 is superimposed on the surface 9 of the base material at the end 30, and the superposed portion has a substantially U-shaped elastic cross section. It is clamped between deformable clips 53 and fixed. Connection can be performed simply by sandwiching the overlapped portion between clips 53, so that connection work is easy.
  • the overlapping portion is covered with a metal holding piece 55 having a substantially U-shaped cross section in the first embodiment.
  • the nip pieces 55 are crushed from both sides to connect them. Since the holding pieces 55 are crushed from both sides of the overlapped portion for connection, a strong connection can be obtained at the overlapped portion.
  • the locking pin 46 may be a single linear pin without being formed in a substantially U-shape. It is desirable to use a plurality of pins to fix the fixing portion.
  • a plurality of locking members 47 may be used according to the width of the adhesive tape 1.
  • a plurality of clips 53 or sandwiching pieces 55 are used, and they are fixed from both sides of the overlapping portion of the adhesive tape 1 respectively. May be.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and more particularly, to an adhesive tape wound in a reel shape.
  • the present invention relates to a method for connecting material tapes.
  • Japanese Patent Application Laid-Open No. 2000-2005 discloses a tape obtained by winding an adhesive tape obtained by applying an adhesive to a base material in a reel shape. I have.
  • the conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound on the reel is about 50 m.
  • [0 3 7 1] When attaching the adhesive tape to the adhesive device, attach a reel of the adhesive tape (hereinafter simply referred to as “adhesive reel”) to the adhesive device, pull out the start end of the adhesive tape, Attach to the take-up reel. And wound from the adhesive reel
  • the adhesive is pressure-bonded to a circuit board or the like from the base material side of the released adhesive tape with a heating and pressing head, and the remaining base material is wound up on a take-up reel.
  • the width of the adhesive tape is as narrow as 1 to 3 mm, so if the number of windings is increased, winding collapse may occur. Also, when the number of windings is increased, the pressure acting on the adhesive tape wound in a tape shape increases, and the adhesive may ooze out from both widths of the tape to cause blocking.
  • the inventions described in claims 9 to 13 are directed to an adhesive tape capable of easily replacing an adhesive reel and improving the production efficiency of electronic equipment.
  • the purpose is to provide a connection method.
  • FIGS. 12A to 12C are views showing a method of connecting the adhesive tape according to the first embodiment
  • FIG. 12A is a perspective view showing the connection between the adhesive reels.
  • FIG. 2 is a perspective view showing a connection method of a connection portion in FIG. 12A.
  • the adhesive tape 1 is wound around each of the reels 3 and 3a, and each reel 3 and 3a has a side plate disposed on both width sides of the winding core 5 and the adhesive tape 1. 7 are provided.
  • the adhesive tape 1 has a length of about 50 m and a width W of about 3 mm.
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • the substrate 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and the releasability of the adhesive constituting the anisotropic conductive material. Rate) etc., but is not limited to these.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, a vinyl ester type resin, and an acrylic resin type as a thermosetting resin type.
  • a silicone resin system is used.
  • the conductive particles 13 are dispersed in the adhesive 11.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like.
  • the conductive layer described above may be formed by coating the above-mentioned conductive layer on a polymer nucleus material such as glass, ceramics and plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic has deformability by heating or pressurizing, and the distance between electrodes after connection decreases, Sometimes the contact surface with the circuit This is preferable because the product increases and the reliability improves.
  • polymers when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred.
  • the reel 3a of the adhesive tape 1 and the take-up reel 17 are attached to the bonding device 15 and the tip of the adhesive tape 1 wound on the reel 3a is attached to the take-up reel 7. Attach and pay out the adhesive tape 1 (arrow E in Fig. 3). Then, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the base material 9 side by the heating and pressing head 19 disposed between the two reels 3 a and 17. Then, the adhesive 11 1 is pressed against the circuit board 21. Thereafter, the base material 9 is wound on a take-up reel 17.
  • the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and fully connected.
  • a wiring circuit (or electronic component) 23 is arranged on an adhesive 11 crimped on a circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluid.
  • the wiring circuit 23 is heated and pressurized to the circuit board 21 by the heating and pressurizing head 19 through the polyethylene material 24.
  • the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • the PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be pressure-bonded to the entire periphery of the PDP. 1 means that the amount of adhesive 11 used at a time will be much higher than before. Accordingly, the amount of the adhesive tape 1 wound on the reel 3a increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time. The end mark 28 of the adhesive tape 1 wound on the reel 3a is exposed.
  • the method for connecting an adhesive tape according to the invention described in claims 9 to 13 includes the steps of: (a) using the take-up reel 17 as it is; Replace the adhesive tape with the remaining winding of 1 and run it with a new adhesive tape When the reel 17 is connected, (b) Use the adhesive tape with the remaining tape of the used adhesive tape 1 remaining as the take-up reel 17 and use the new adhesive tape and the remaining winding. In some cases, a connected adhesive tape is connected.
  • connection of the adhesive tape 1 is performed by connecting the terminal 30 of the adhesive tape 1 of the adhesive reel 3a and the new adhesive reel 3 as shown in Fig. 12B.
  • the adhesive 11 of the starting end 32 is superimposed on the base material 9 surface of the end 30.
  • the overlapping length H of the two is set to about 2.5 of the width W of the adhesive tape 1, placed on the table 36, and bonded by heating and pressing with the heating and pressing head 19 of the bonding device 15 .
  • the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected.
  • the used reel 3 a is replaced with the new reel 3, and the new reel 3 is mounted on the bonding device 15.
  • An adhesive 11 containing resin and conductive particles 13 is applied to the base material (separate resin) unwound from the unwinding machine 25 by a co-exit 27 and dried. After drying in the furnace 29, the web is wound up by the winder 31.
  • the raw material of the wound adhesive tape is cut into a predetermined width by a slit 33 and wound on a winding core, and side plates 7 and 7 are attached to the winding core from both sides. Alternatively, it is wound around a core with a side plate, packed with a dehumidifying material, and preferably shipped at a low temperature ( ⁇ 5 ° C. to 110 ° C.).
  • the overlapping portion 34 of the adhesive tape 1 is replaced with one of the molds 5 6 on which the jaggedness (unevenness) 44 on the surface is fitted. And the other mold 57 to form an unevenness 58 in the overlapped portion 34.
  • the irregularities 58 By forming the irregularities 58 in this manner, the bonding area at the overlapping portion 34 can be increased, and the pulling direction can be increased by the engagement of the irregularities 58 of the overlapping portion 34.
  • a new adhesive material is used.
  • the leading end 3 2 of the reel 3 on which 1 is wound is bent into a substantially V shape, and the end portion 30 of the adhesive tape 1 wound on the used reel 3 a is also bent into a substantially V shape.
  • the hooks are hooked and the adhesives 11 are opposed to each other and locked together (Fig. 14A), and heated and pressed with a heating and pressing head 19 to connect them (Fig. 14B).
  • the terminal end portion 30 and the start end portion 32 are connected in a hook shape, so that they can be connected firmly.
  • the adhesive 11 is overlapped and connected to each other, a stronger connection is obtained. be able to.
  • the adhesive in the overlapped portion flows and is also adhered to the end face, so that a stronger connection can be obtained.
  • the overlapped portions 34 before or simultaneously with the heating and pressurizing are added to the overlapped portions 34.
  • Drill through holes 59 By drilling the through-hole 59, the adhesive 11 leaks out from the periphery of the through-hole 59 at the time of heating and pressurization, and they adhere to each other. Connection can be obtained.
  • the unevenness 58 may be a rounded round shape without forming a mountain shape.
  • the number of through holes 59 is not particularly limited, and may be any number. Further, the diameter of the through hole 59 is not limited. Further, in the second and third embodiments, a through hole 59 may be formed in the overlapping portion 34.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and more particularly to an adhesive tape wound in a reel shape.
  • the present invention relates to a method for connecting material tapes.
  • Japanese Patent Application Laid-Open Publication No. 2001-280405 discloses a tape in which an adhesive tape in which an adhesive is applied to a base material is wound into a reel. .
  • This type of conventional adhesive tape has a width of about 1 to 3 mm, and the length of the tape wound on a reel is about 50 m.
  • adheresive reel When attaching the adhesive tape to the adhesive device, attach a reel of the adhesive tape (hereinafter simply referred to as "adhesive reel") to the adhesive device and pull out the start end of the adhesive tape. And attach it to the take-up reel. After mounting the adhesive reel, the adhesive is pressed against the circuit board, etc. from the base material side of the adhesive tape unwound from the adhesive reel using a heating and pressing head, and the remaining base material is wound. It is wound on a take-up reel.
  • the invention described in claims 14 to 18 may be applied to an adhesive reel even if the adhesive tape is made of a silicone-treated substrate. It is an object of the present invention to provide a method for connecting an adhesive tape, which can easily replace the adhesive tape and improve the production efficiency of electronic equipment.
  • FIGS. 16A and 16B are views showing a method of connecting the adhesive tape according to the first embodiment
  • FIG. 16A is a perspective view showing the connection between the adhesive reels
  • FIG. 16 is a perspective view showing a connection method of a connection portion (b) in FIG. 16A.
  • Adhesive tape 1 is wound on reels 3 and 3a, respectively, and reels 3 and 3a have side plates 7 arranged on both sides of core 5 and adhesive tape 1, respectively. Are provided.
  • the adhesive tape 1 is composed of a siliconized base material 9 and a siliconized base. And an adhesive 11 applied to one side of the material 9.
  • the silicone-treated substrate 9 has a strength and an adhesive that constitutes an anisotropic conductive material is peeled off.] From a raw surface, 0 PP (stretched polypropylene), polytetrafluoroethylene, PET (polyethylene terephthalate), etc. The surface of this substrate is treated with a silicone resin or the like.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, a vinyl ester type resin, and an acrylic resin type as a thermosetting resin type.
  • a silicone tree system is used.
  • conductive particles 13 are dispersed.
  • the conductive particles 13 include metal particles such as Au, A :, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like.
  • the conductive layer described above may be formed by coating a polymer core material such as glass, ceramics, and plastic on the core. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressing, the distance between the electrodes after connection decreases, This is preferable because the contact area with the circuit increases and reliability is improved.
  • polymers when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred.
  • the reel 3a of the adhesive tape 1 and the take-up reel 17 are attached to the bonding apparatus 15 and the tip of the adhesive tape 1 wound on the reel 3a is taken up by the take-up reel 17 , And pay out the adhesive tape 1 (arrow E in Fig. 3). Then, the adhesive tape 1 was placed on the circuit board 2 1 and placed between the two reels 3 a and 17.
  • the adhesive tape 1 is pressed from the side of the silicone-treated base material 9 with the heating and pressing head 19, and the adhesive 11 is pressed onto the circuit board 21. Thereafter, the silicone base material 9 is wound up on a take-up reel 17.
  • the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic part opening) 23 are aligned and permanently connected.
  • a wiring circuit (or electronic component) 23 is arranged on an adhesive 11 crimped on a circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluid.
  • the wiring circuit 23 is heated and pressurized to the circuit board 21 by the heating and pressurizing head 19 through the polyethylene material 24.
  • the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • the PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be crimped over the entire periphery of the PDP, and has many connection parts, and the adhesive 1 1 means that the amount of adhesive 11 used at a time will be much higher than before. Therefore, the amount of the adhesive tape 1 wound on the reel 3a is also increased, and the adhesive tape 1 wound on the reel 3a is wound up on the winding reel 17 in a relatively short time, and is wound on the reel 3a. The end mark 2 8 of the wound adhesive tape 1 is exposed.
  • connection method of the adhesive tape according to the invention described in claims 14 to 18 is as follows: (a) The take-up reel 17 is used as it is, and the used adhesive tape is used. Replace the adhesive tape with the remaining winding of 1 remaining, and connect the new adhesive tape to the take-up reel 17; and (b) the winding of the adhesive tape 1 used as the take-up reel 17 In some cases, a new adhesive tape is used to connect to an adhesive tape with less winding, using an adhesive tape with less remaining adhesive.
  • connection of the adhesive tape 1 is performed by connecting the end portion 30 of the adhesive tape 1 of the adhesive reel 3a and the new adhesive reel. Abut the starting end 3 2 of the adhesive tape 1 of 3 and apply silicone adhesive tape 60 over the surfaces of the silicone-treated base materials 9 and 9 of both adhesive tapes 1 and 1 to attach both adhesive tapes. Connect tapes 1 and 1.
  • the silicone pressure-sensitive adhesive tape 60 includes a base material 63 and a silicone pressure-sensitive adhesive 62 applied to one surface of the base material 63.
  • the material of the base material .63 is not particularly limited, but is a polyimide resin material in the present embodiment.
  • the adhesive portion 11 of the adhesive tape and the adhesive portion 43 of the silicone adhesive tape 60 are indicated by diagonal lines.
  • the silicone-treated substrates 9 and 9 are each coated with silicone, so that it is difficult to bond them with an adhesive.
  • a silicone resin for the adhesive 43 the difference in surface tension between the two silicone-treated substrates 9, 9 is reduced, and the adhesive tape 1 is adhered to the end of one adhesive tape 1. 30 and the start end 32 of the other adhesive tape 1 are connected well.
  • the difference in surface tension between the surface of the silicone adhesive 62 in the silicone adhesive tape 60 and the surface of the silicone-treated base material 9, 9 should be 10 mN / m (10 dyne / cm) or less.
  • the surface tension of both the silicone-treated base materials 9 and 9 of one end of the adhesive tape 1 and the other adhesive tape 1 is 25 mN / m or less. 6 O mN / m (25-60 dyne / cm) .
  • the surface tension of the silicone adhesive 62 on the silicone adhesive tape 60 is 2 O mN / m. Set to not less than m and not more than 4 O mN / m.
  • the silicone-based pressure-sensitive adhesive is mainly composed of a silicone gum and a silicone resin.
  • the silicone-based pressure-sensitive adhesive is slightly condensed to exhibit tackiness, and is further subjected to a hydrosilylation reaction using a peroxidized product and a platinum catalyst. It is general that the glass transition temperature is reduced to 100 ° C. or lower by crosslinking. These are commercially available and can be suitably used.
  • the adhesive tape 1 wound around the used adhesive material reel 3a and the new adhesive material tape 3 are wound around the adhesive tape 1a.
  • the adhesive tape 1 is connected.
  • the used adhesive reel 3a and the new adhesive reel 3 are exchanged, and the new adhesive reel 3 is mounted on the bonding apparatus 15. Therefore, pull out the adhesive tape 1 of the new adhesive reel 3 and attach the adhesive tape to the take-up reel 17 or hang the new adhesive tape 1 on the guide 36 of the bonding device 15. Work is not required, and the work efficiency of exchanging the adhesive reels 3 and 3a is high.
  • the connection is simple.
  • [0 4 3 1] Use the take-up reel 17 in (a) as it is, and replace the used adhesive tape 1 with the remaining tape 1 with the remaining tape with a new adhesive tape.
  • T JP2003 / 009694 In the take-up reel 17, only the base material 9 is taken up, so that several adhesive reels can be taken up. And work efficiency is good.
  • the silicone pressure-sensitive adhesive 62 of the silicone pressure-sensitive adhesive tape 60 in the embodiment has an adhesive force of 100 gZ25 mm or more, and in the present embodiment, 7.00 25 mm to 140 0 25 It is 111111.
  • the surface tension of the silicone adhesive 62 in the silicone adhesive tape 60 is, as in the above-described embodiment, the difference between the surface tension of the silicone base material in one of the adhesive tapes and the surface tension of the silicone base material in the other adhesive tape.
  • the end portion 30 of one adhesive tape 1 and the start end 32 of the other adhesive tape 1 are arranged so as to overlap with each other.
  • the silicone adhesive tape 60 according to the second embodiment is adhered to the side surface of the processing base material 9 and the side surface of the adhesive material 1 1, and according to the third embodiment, The same operation and effect as those of the embodiment can be obtained.
  • the fourth embodiment shown in FIG. 19 is different from the first embodiment in that both ends of the base material are placed between the end 30 of one adhesive tape 1 and the start 32 of the other adhesive tape 1.
  • the end 30 and the start 32 are connected via a silicone adhesive tape 61 coated with a silicone adhesive 62.
  • the use of the double-sided silicone adhesive tape 61 further reduces the connection between the end 30 of one adhesive tape 1 and the start 32 of the other adhesive tape 1. Can be done easily and easily.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board or circuit boards to each other, and for electrically connecting both electrodes, and more particularly to an adhesive tape wound in a reel shape. It relates to a method of connecting a material tape.
  • electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, bare chip mounting, and circuit boards and circuit boards are bonded and fixed, and both electrodes are electrically connected.
  • Adhesive tape is used as a method for making the connection.
  • Japanese Patent Application Laid-Open Publication No. 2000-2005 discloses a structure in which an adhesive tape in which an adhesive is applied to a base material is wound into a reel shape. I have.
  • This type of conventional adhesive tape has a width of about 1 to 3 mm, The length of the tape wound on a roll is about 50 m.
  • adheresive reel When attaching the adhesive tape to the adhesive device, attach the adhesive tape reel (hereinafter simply referred to as “adhesive reel”) to the adhesive device and pull out the start end of the adhesive tape. And attach it to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive reel by a heating and pressing head, and the remaining base material is wound on a take-up reel. ing.
  • adhesive tape reel hereinafter simply referred to as “adhesive reel”
  • the width of the adhesive tape is as narrow as 1 to 3 mm, so if the number of windings is increased, winding collapse may occur.
  • the pressure acting on the adhesive tape wound in a tape shape is increased, and the adhesive may ooze out from both widths of the tape to cause blocking.
  • An object of the present invention is to provide a method for connecting an adhesive tape.
  • FIGS. 20A to 20C are diagrams showing a method of connecting the adhesive tape according to the present embodiment
  • FIG. 2OA is a perspective view showing the connection between the adhesive reels
  • 20C is a cross-sectional view showing a connection method of a connection portion in FIG. 2 OA.
  • Adhesive tape 1 is wound on reels 3 and 3a, respectively, and each reel 3 and 3a is disposed on both width sides of winding core 5 and adhesive tape 1.
  • a side plate 7 is provided.
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • the base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Rate) etc., but is not limited to these.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, a vinyl ester type resin, an acrylic resin type and a silicone type as a thermosetting resin type.
  • One resin system is used.
  • conductive particles 13 are dispersed.
  • the conductive particles 1 3 A u, A g , P t, N i 5 C u, W, S b, S n, include metal particles or carbon, graphite, such as solder, these and non-conductive glass Formed by coating the above-mentioned conductive layer on a polymer nucleus material such as plastic, ceramics, plastic, etc. May be. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressing, the distance between the electrodes after connection decreases, This is preferable because the contact area with the circuit increases and reliability is improved.
  • polymers when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred.
  • the reel 3 a of the adhesive tape 1 and the take-up reel 17 are mounted on the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3 a is connected to the guide bin 22. And attach it to the take-up reel 17 'and pay out the adhesive tape 1 (arrow E in Fig. 21). Then, the adhesive tape 1 is placed on the circuit board 2 1, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 disposed between the reels 3 and 17, The adhesive 1 1 is pressed on the circuit board 21. Thereafter, the substrate 9 is wound on a take-up reel 17.
  • the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic part opening / closing opening) 23 are aligned and permanently connected.
  • a wiring circuit (or electronic component) 23 is arranged on an adhesive 11 crimped on a circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluid.
  • the wiring circuit 23 is heated and pressurized to the circuit board 21 by the heating and pressurizing head 19 through the polyethylene material 24. This connects the electrode 21 a of the circuit board 21 and the electrode 23 a of the spring circuit 23.
  • the PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be crimped over the entire periphery of the PDP, and has many connection parts, and the adhesive 1 1 means that the amount of adhesive 11 used at a time will be much higher than before. Therefore, the amount of the adhesive tape 1 wound on the reel 3a increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time. Then, the end mark 28 of the adhesive tape 1 wound on the reel 3a is exposed (see FIG. 2 OA).
  • the method for connecting an adhesive tape according to the invention described in claims 19 to 21 includes the steps of: (a) using the take-up reel 17 as it is; Replace the adhesive tape with the remaining number of windings 1 remaining, replace the new adhesive tape with the take-up reel 17 and (b) use the adhesive tape 1 used as the take-up reel 17 In some cases, an adhesive tape with less winding is used, and a new adhesive tape is connected to the adhesive tape with less winding.
  • the glue S 4 made of Sumi includes, for example, epoxy finesse, epoxy resin, bismaleimide resin, phenol resin, urea resin, melamine resin, alkyl resin, acryl resin, and unsaturated resin. Polyester resin, diaryl phthalate resin, silicone resin g, resorcinol formaldehyde resin, xylene resin S, furan resin, polyurethane resin, ketone resin, triaryl cyanurate resin, and the like.
  • connection of the adhesive tape 1 is performed by connecting the terminal 30 of the adhesive tape 1 of the adhesive reel 3a and the new adhesive reel 3 to each other.
  • the adhesive 11 surface of the start end 32 is superimposed on the base 9 surface of the end 30.
  • a paste-like resin adhesive 64 is applied to the overlapped portion from a filling machine 65 incorporated in the bonding apparatus 15.
  • the resin adhesive 64 is a thermosetting resin by the heating of the heater 66 incorporated in the bonding apparatus 15
  • the adhesive tape is cured by curing the resin adhesive 64. End of 1 3 009694
  • [0 4 6 5] Use the take-up reel 17 of (a) as it is, and replace the used adhesive tape 1 with the remaining adhesive tape 1 with a small amount of remaining tape with a new adhesive tape and perform new bonding.
  • the adhesive tape is connected to the take-up reel 17, when the end mark 28 of the adhesive tape 1 of the used reel 3 a is exposed, the vicinity of the end mark 28 of the adhesive tape 1 The tape is cut, and the end 30 of the adhesive tape remaining on the take-up reel 17 side and the starting end 32 of the adhesive tape 1 of the new adhesive reel 3 are overlapped. Then, a paste-like resin adhesive 64 is applied to the overlapped portion of both, and heating, ultraviolet irradiation, etc.
  • Adhesive 11 containing resin and conductive particles 13 is applied to base material (separate one night) unwound from unwinding machine 25 by means of one second 27 After drying in the drying oven 29, the web is wound up by the winder 31.
  • the raw material of the wound adhesive tape is cut into a predetermined width by a slit 33 and wound on a winding core.
  • Plates 7, 7 are mounted on both sides or wound on a core with side plates, packed with dehumidifying material, and preferably shipped at a low temperature (-5 ° C to 110 ° C) Is done.
  • thermosetting resin is used as an example of the resin adhesive 64.
  • a light-hardening resin is used, and light such as ultraviolet light is used.
  • the adhesive tapes 1 may be connected to each other by curing the photocurable resin by irradiation.
  • the photocurable resin a composition in which a photopolymerization initiator is blended with a resin having an acrylate group or a methyl acrylate group, an aromatic diazonium salt, a diaryl methacrylate, etc.
  • An epoxy resin containing a photocuring agent such as a donium salt or a sulfonium salt is used.
  • a hot-melt adhesive containing ethylene vinyl acetate resin or polyolefin resin as a main component may be used as the resin adhesive.
  • a sheet-like hot-melt adhesive is wound around the portion where the adhesive tapes 1 overlap, and the hot-melt adhesive is heated and melted by a heater 66 and then solidified by cooling.
  • a plurality of resin adhesives used for connecting the adhesive tape 1 may be used from the group of a thermosetting resin, a photocurable resin, and a hot melt adhesive.
  • the base material 9 surface of the end portion 30 of the adhesive tape 1 of the adhesive reel 3a and the starting end of the adhesive tape 1 of the new adhesive reel 3 The adhesive 1 of the part 35 2 is superimposed on one side, and a thermosetting resin, which is a resin adhesive, is applied and connected.
  • a thermosetting resin which is a resin adhesive
  • the terminal part 30 of the adhesive tape 1 on the adhesive reel 3a is used.
  • the adhesive 11 may be fixed with a thermosetting resin after the surfaces are superimposed and bonded together.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and more particularly, to an adhesive tape wound in a reel shape.
  • the present invention relates to a material tape reel and an adhesive device.
  • Japanese Patent Application Laid-Open Publication No. 2000-2005 discloses a tape obtained by winding an adhesive tape in which an adhesive is applied to a base material in a reel shape. I have.
  • the conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound up on the reel is about 50 m.
  • the adhesive tape reel in which the adhesive tape is wound on a reel is attached to the bonding device, the starting end of the adhesive tape is pulled out, and the take-up reel is taken out. Attach to Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive tape reel by a heating and pressing head, and the remaining base material is wound on a take-up reel. ing.
  • An object of the present invention is to provide an adhesive tape reel and an adhesive device.
  • FIGS. 22A to 22C are views showing the adhesive tape reel according to the first embodiment
  • FIG. 22A is a perspective view showing the adhesive tape reel
  • FIG. 22B is FIG.
  • FIG. 2C is a front view of FIG. 2A
  • FIG. 22C is a plan view of the connecting tape of FIG. 22A
  • FIG. 23 is a schematic view showing a pressure bonding step of an adhesive in an adhesive device.
  • the adhesive tape A includes a plurality of adhesive tape winding portions (hereinafter, winding portions) 2, 2a.
  • the winding portions 2 and 2a have the adhesive tape 1 wound on the reels 3 and 3a, respectively.
  • Each reel 3, 3 a is provided with a winding core 5 and side plates 7 arranged on both width sides of the adhesive tape 1.
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • connection tape 41 is provided between the adhesive tape 1 (hereinafter referred to as the other adhesive tape) 1 wound around the contact portion and the start end 32 of the adhesive tape.
  • the connecting tape 67 is arranged along the inner surface of the side plate 7 of the reel 3 from the terminal end 30 of one of the adhesive tapes 1, and a cutout portion 6 8 formed on the upper portion of the side plate 7. And is connected to the start end 32 of the other adhesive tape 1.
  • Marks 69 and 70 for recognizing the connecting tape 67 are attached to the connecting portions between the adhesive tape 1 and the connecting tape 67 on one side and the other, and the tape is provided.
  • the detection means detects the marks 69, 70, skip the connecting tape 67 and prevent crimping at the connecting tape 67. I have.
  • the substrate 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Rate) etc., but is not limited to these.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • Typical examples of such a resin include a styrene resin type and a polyester resin S type as a thermoplastic resin type, and an epoxy resin type, a vinyl ester type resin, and an acrylic resin as a thermosetting resin type.
  • Ril resin type and silicone resin type are used.
  • conductive particles 13 are dispersed.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, etc., and these and non-conductive glass.
  • the conductive layer may be formed by coating the conductive layer on a polymer core material such as ceramic, plastic, or the like. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressurizing, and the distance between electrodes after connection is reduced. This is preferable because the contact area with the circuit increases and reliability is improved.
  • a polymer is used as the core, the melting point is not exhibited like solder, so that the softened state can be widely controlled by the connection temperature, and it is easy to cope with variations in electrode thickness and flatness. It is more preferable because it can be obtained.
  • the adhesive tape A and the take-up reel 17 are attached to the adhesive device 15, and the starting end 32 of one adhesive tape 1 is attached to the guide pin 22.
  • the tape is attached to the take-up reel 17 and the adhesive tape 1 is fed out (arrow E in FIG. 23).
  • the adhesive tape 1 is arranged on the circuit board 2 1, and the adhesive tape 1 is pressed from the base material 9 side by the heating and pressing head 19 arranged between the two reels 3 and 17.
  • the adhesive 1 1 is crimped to the circuit board 21. Thereafter, the base material 9 is wound on a take-up reel 1 1.
  • the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and fully connected.
  • a wiring circuit (or electronic component) 23 is arranged on an adhesive 11 crimped on a circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluid.
  • the wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via the polyethylene material 24. This connects the electrode 21a of the circuit board 21 to the electrode 23a of the wiring circuit 23c.
  • the PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be pressure-bonded to the entire periphery of the PDP, and has many connection parts, and the adhesive 1 1 means that the amount of adhesive 11 used at a time will be much higher than before. Accordingly, the amount of the adhesive tape 1 wound on the reel 3 increases, and the adhesive tape 1 wound on the reel 3 is wound on the winding reel 1 in a relatively short time.
  • the connecting tape 67 is disengaged from the cutout 68, and then the other adhesive tape 1 is fed out.
  • a connecting tape 67 is provided between the end 30 of one adhesive tape 1 and the start 32 of the other adhesive tape 1 so as to connect them.
  • the bonding device 15 includes a pair of a light-emitting unit 71 and a light-receiving unit 72, and optically detects the connection tape 67. I have. Both the adhesive tape 1 and the other adhesive tape 1 are connected to each other, and black marks 69 and 70 are provided at both ends of the connecting tape 67.
  • the light emitting section 7 1 uses a laser tape for adhesive tape.
  • the light is continuously emitted toward 1, and the reflected light is received by the light receiving section 72, and the detection signal is sent to the control device 79. Then, the light receiving section 72 receives the reflected lights of the marks 69 and 70 on both ends of the connecting tape 67, and the detection signal is sent to the control device 79.
  • the other adhesive tape 1 is automatically fed out to the position of the heating and pressing head 19, so that the starting end 3 2 of the other adhesive tape 1 is heated and pressed. Until the position of the head 19 is reached, it is not necessary to pay out the connecting tape 67.
  • the connecting tape 67 is recognized by making the width T of the connecting tape 67 smaller than the width W of the front and rear adhesive tapes 1. are doing. Further, the bonding device 15 is provided with a light emitting unit and a light receiving unit similar to those of the first embodiment at opposing positions with the adhesive tape 1 interposed therebetween. In this case, the connection tape 67 is recognized by receiving the laser beam transmitted through the narrow portion of the connection tape 67 by the light receiving unit.
  • the connecting tape 67 has many holes.
  • the connecting tape 6 7 is recognized by forming 5 3.
  • the connection tape 67 is recognized by the light receiving portion receiving the laser beam transmitted through the hole 53 of the connection tape 67.
  • connection between the adhesive tapes 1 is not performed by the connecting tape 67, and when the unwinding of one adhesive tape 1 is completed, The adhesive tape 1 is exchanged by winding the other adhesive tape 1 around the unwinding reel 17.
  • the replacement work of a new adhesive tape reel is reduced, and the production efficiency of electronic equipment is increased.
  • the number of the winding portions 2 and 2a is not particularly limited, and may be any number.
  • the connecting tape 67 is optically detected.
  • a magnetic tape may be wound around the connecting tape 67 and detected by a magnetic sensor. You may do it.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board or between circuit boards, and for electrically connecting both electrodes.
  • the present invention relates to an adhesive tape used in a semiconductor device for bonding and fixing a semiconductor element (chip) to a supporting substrate for fixing a lead frame, a die for a lead frame, and a supporting substrate for mounting a semiconductor element.
  • the present invention relates to an adhesive tape reel wound in a reel shape, an adhesive device, and a method of connecting an adhesive tape.
  • Adhesive tape has been used as a method for doing this. Adhesive tapes are also used for lead fixing tapes for lead frames, LOC tapes, die-bonding tapes, adhesive films such as micro BGA and CSP, and are used to improve the overall productivity and reliability of semiconductor devices. Is done.
  • Japanese Patent Laying-Open No. 2001-284005 discloses an adhesive tape in which an adhesive is applied to a base material and wound on a reel.
  • This type of conventional adhesive tape for electrode connection has a width of about 1 to 3 mm, and the length of the tape wound on a reel is about 50 m.
  • the adhesive tape reel on which the adhesive tape is wound around the reel is mounted on the bonding device, the starting end of the adhesive tape is pulled out, and the tape is wound on the take-up reel. Attach. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive tape reel with a heating and pressing head, and the remaining base material is wound on a take-up reel. taking it.
  • claims 25 to 28 can easily replace the adhesive tape reel and improve the production efficiency of electronic devices. It is an object of the present invention to provide an adhesive tape reel, a bonding device and a connection method.
  • FIGS. 27A to 27C are diagrams illustrating an adhesive tape reel according to the first embodiment
  • FIG. 27A is a perspective view illustrating the adhesive tape reel
  • FIG. 27C is a front view
  • FIG. 27C is a cross-sectional view of the connection portion in FIG. 27A
  • FIG. 28 is a schematic view showing a bonding step of the adhesive in the bonding apparatus.
  • FIG. 4 is a perspective view showing a use state of an adhesive in a PDP.
  • the adhesive tape A includes winding portions (hereinafter referred to as winding portions) 2 and 2a of a plurality of adhesive tapes 1. Parts 2 and 2a are provided with reels 3 and 3a on which adhesive tape 1 is wound. Each reel 3, 3 a is provided with a winding core 5 and side plates 7 arranged on both width sides of the adhesive tape 1. As shown in Fig. 28, the adhesive tape 1 is composed of the base material 9 and the adhesive applied to one side of the base material 9.
  • the starting end 32 of the adhesive tape 1 (hereinafter referred to as the other adhesive tape) wound around the portion 2 a is connected using a locking member 76.
  • the locking member 76 is, for example, a locking pin having a substantially U-shaped cross section.
  • the terminal 30 of one adhesive tape 1 and the start 32 of the other adhesive tape 1 are overlapped.
  • a locking pin is inserted into the overlapping portion to connect the two.
  • the connecting portion 74 connects the terminal end portion 30 and the start end portion 32 with the locking member 76,
  • the connecting part 74 is folded back 180 degrees in the longitudinal direction of the tape, so that the locking member 76 is covered with the adhesive tape 1.
  • the base material 9 is made of OPP (rolled ⁇ 3 polypropylene), polytetrafluoroethylene, or silicon-treated PET (PET) in view of the strength and the releasability of the adhesive constituting the anisotropic conductive material.
  • OPP rolled ⁇ 3 polypropylene
  • PET silicon-treated PET
  • Polyethylene terephthalate etc., but are not limited to these
  • thermoplastic resin a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acryl resin type, and a silicon resin type as a thermosetting resin type.
  • the conductive particles 13 may be dispersed in the adhesive 11.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, carbon, graphite, and the like.
  • the conductive layer may be formed by coating the above-mentioned conductive layer on a polymer nucleus material such as glass, ceramics and plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • Heat-melted metal such as solder or polymer nucleus material such as plastic with a conductive layer formed is heated 9694 It is preferable because it has deformability under pressure or pressure, reduces the distance between electrodes after connection, increases the contact area with the circuit at the time of connection, and improves reliability. Particularly when a polymer is used as a nucleus, the melting point is not exhibited unlike solder, so that the softened state can be widely controlled by the connection temperature, and a connection member that can easily cope with variations in electrode thickness and flatness is obtained, which is more preferable. .
  • the adhesive tape A and the take-up reel 17 are attached to the adhesive device 15, and the starting end 32 of one adhesive tape 1 is attached to the guide bin 22. Attach it to the take-up reel 17 and hang out the adhesive tape 1 (arrow E in Fig. 28). Then, the adhesive tape 1 is placed on the circuit board 2 1 and both reels 3,
  • the adhesive tape 1 is pressed from the base material 9 side by the heating and pressing head 19 disposed between 17 and the adhesive 11 is pressed against the circuit board 21. Thereafter, the base material 9 is wound on a winding reel 17.
  • a wiring circuit (or electronic component) 23 is placed on the adhesive 11 crimped on the circuit board 21, and a polytetrafluoroethylene material 2 is used as a cushion material.
  • the wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via 4. Thereby, the electrode 2 la of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • the connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment the adhesive 11 is pressed over the entire periphery of the PDP 26.
  • the amount of the adhesive 11 used at one time is significantly larger than in the past. Accordingly, the amount of the adhesive tape 1 used increases, and the adhesive tape 1 wound on the reels 3 and 3a is wound on the take-up reel 17 in a relatively short time.
  • the bonding device 15 includes a thickness detection sensor as the connection portion detection sensor 47, and optically detects the connection portion 74 to perform connection.
  • the part 74 is to skip the part of the heating and pressing head 19.
  • the connecting portion 74 of one adhesive tape 1 and the other adhesive tape 1 is larger than the thickness of the adhesive tape 1 as shown in Fig. 27C, and the difference in thickness is detected.
  • the thickness detection sensor 47 constantly detects the thickness of the adhesive tape 1 and transmits a detection signal to the control device 79.
  • the control device 79 Upon receiving the detection signal, the control device 79 outputs a control signal to the motor driving the reels 3 and 17 of the bonding device 15 and outputs the control signal to the motor via the motor driver. The output of the drive pulse to is started. Then, the motor rotates according to the number of pulses applied from the motor driver, and while rotating both reels 3 and 17 at a speed higher than the normal speed, the length of the connecting portion 74 in the transport direction is increased. The adhesive tape 1 is moved in the unwinding direction by a predetermined distance corresponding to the distance.
  • the other adhesive tape 1 is transported to the position of the heating and pressing head 19, so that the connection portion 74 of the one and the other adhesive tape 1 is heated and pressed.
  • the problem that the crimping operation is performed at the position of the pad 19 can be prevented.
  • one adhesive tape 1 is automatically wound on the take-up reel 17 until the connection portion 41 passes through the heating / pressing head 19, so that the time and effort for winding can be reduced. it can.
  • the tip 41a of the connection part ⁇ 4 The adhesive tape 1 can be used effectively by recognizing the rear end 4 lb and skipping only the connecting portion 7 4.
  • an adhesive tape reel having one winding portion is used without using an adhesive tape reel A having a plurality of winding portions 2 and 2a. You are using 2c.
  • the adhesive tape 1 is wound on the take-up reel 17 and the end mark 28 is exposed on one adhesive tape 1, one adhesive tape reel 2b is replaced with a new adhesive tape.
  • the end 30 of one adhesive tape 1 and the start 32 of the other adhesive tape 1 are connected to be exchanged with the tape reel 2c.
  • connection portion ⁇ 4 detects the portion of the heating and pressure head 19 by detecting the connection portion ⁇ 4 as a connection portion detection means with the thickness detection sensor ⁇ 7. I try to skip it.
  • the locking tool 76 for connecting the adhesive tapes 1 is not limited to the locking pin, and the overlapping portion of the two can be used.
  • a clip that can be sandwiched and fixed with an elastically deformable clip with a substantially U-shaped cross section, or a metal piece with a substantially U-shaped cross section between the two, and pressing the holding pieces from both sides of the overlapped portion A method may be used in which both are crushed and connected.
  • connection portion 74 is recognized by detecting the thickness of the connection portion 74 by using the thickness detection sensor 47. Not only that, but the connection part can be detected by using the transmittance detection sensor to recognize the connection part 74 or by using a CCD camera to capture the surface of the connection part on the monitor screen and comparing the density of the pixels to detect the connection part You may.
  • Figure 31A, Figure 31B, and Figures 32A to 32C show the supporting substrate for fixing the lead frame, the supporting substrate for mounting the semiconductor element, or the die and the semiconductor element of the lead frame.
  • An example of an L0C (Lead on Chip) structure is shown in which an adhesive tape for connecting a lead frame to a lead frame fixing support substrate and a semiconductor element are bonded and fixed to the lead frame.
  • An adhesive layer 80 such as a 25 ⁇ thick polyamide-imide adhesive layer is attached to both sides of a support film 78 such as a polyimide film having a surface treatment having a thickness of 5 ⁇ .
  • the semiconductor device having the LOC structure shown in FIG. 31B can be obtained by using the adhesive tape having the structure shown in FIG. 31B.
  • the adhesive tape shown in Fig. 31A is stripped using the die 8 7 (male (convex) 95, female (concave) 96) of the bonding machine shown in Figs. 32A to 32C.
  • an inner lead of 0.2 mm width and 0.2 mm width is placed on a 0.2 mm thick iron-nickel alloy lead frame.
  • the semiconductor element was pressed against the adhesive layer surface of the lead frame with the adhesive film for semiconductors at a temperature of 350 ° C. at a pressure of 3 MPa for 3 seconds, and then pressed.
  • the frame and the semiconductor element are wire-bonded with a gold wire and sealed by transfer molding using a sealing material such as an epoxy resin molding material to obtain a semiconductor device as shown in FIG. 31B.
  • 81 is an adhesive film for semiconductor punched from an adhesive tape
  • 82 is a semiconductor element
  • 83 is a lead frame
  • 84 is a sealing material
  • 85 is a sealing material.
  • the bonding wire 86 is a bus bar.
  • Figures 32A, 32B, and 32C are bonding devices.
  • 87 is a punching die
  • 88 is a lead frame transport section
  • 61 is an adhesive tape.
  • Stamping and pasting parts 90 is a part of the heater
  • 91 is an adhesive tape reel (adhesive tape unwinding part)
  • 92 is an adhesive tape (adhesive film for semiconductor)
  • 93 is an adhesive tape It is a one-page unwinder.
  • reference numeral 94 denotes an adhesive tape (adhesive film for semiconductor), 95 denotes a male type (convex portion), 96 denotes a female type (concave portion), and 97 denotes a film holding plate.
  • the adhesive tape 9 2 is unwound continuously from the adhesive tape 9 (adhesive tape unwinding section) 9 1, punches out the adhesive tape, and forms a strip with the shelling sound 9 It is stamped out and adhered to the lead portion of the lead frame, and is conveyed from the lead frame conveyance section as a lead frame with a semiconductor adhesive film. The punched adhesive tape is carried out from the adhesive tape unwinding roller 93.
  • the semiconductor element is connected to the semiconductor element mounting support substrate using an adhesive tape.
  • Adhesive tapes are used simply for bonding and fixing, or when an adhesive that electrically connects electrodes by contact or via conductive particles is used according to the purpose, and when a support film is used. In some cases, it may consist solely of an adhesive.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and in particular, is wound in a reel shape.
  • the present invention relates to an adhesive tape, a method for producing an adhesive tape, and a method for crimping an adhesive tape.
  • Japanese Patent Application Laid-Open No. 2000-2005 discloses a structure in which an adhesive tape in which an adhesive is applied to a base material is wound into a reel shape. I have.
  • the conventional adhesive tape of this type has a width of about 1 to 3 mm, the length of the tape wound up on the reel is about 50 m, and the adhesive tape is Once unwound from the reel and pressure-bonded to the circuit board or the like, it will not be used again.
  • the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased. Also, the use of adhesives has expanded, and the amount of adhesives used has increased.
  • FIG. 33A and FIG. are views of an adhesive tape
  • FIG. 33A is a perspective view of a reel on which an adhesive tape is wound
  • FIG. 34 is a cross-sectional view of A
  • FIG. 34 is a perspective view showing a use state of an adhesive in a PDP
  • FIG. 35 is a cross-sectional view showing a step of applying an adhesive to a base material.
  • the adhesive tape 1 according to the present embodiment is wound on a reel 3.
  • the reel 3 has side plates 7 arranged on both width sides of the core 5 and the adhesive tape 1. And are provided.
  • the adhesive tape 1 has a length of about 50 m and a width W of about 1 Omm.
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied on the base material 9, and the width of one strip is 0.5 mm on the base material 9. Adhesives 11 are arranged at 5 intervals.
  • the base material 9 is made of OPP (polypropylene (PP), polytetrafluoroethylene, silicone-treated PET (PET)) from the viewpoint of the strength and the releasability of the adhesive constituting the anisotropic conductive material.
  • OPP polypropylene
  • PET silicone-treated PET
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • Typical examples of such a resin include styrene resin and polyester resin as thermoplastic resins, and epoxy resin, vinyl ester resin, and acrylic resin S as thermosetting resin resins.
  • the umbrella system and the silicone resin system are used.
  • conductive particles 13 are dispersed.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like.
  • the conductive layer may be formed by coating the conductive layer on a polymer nucleus material such as a ceramic, a plastic, or the like. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressing, the distance between the electrodes after connection decreases, This is preferable because the contact area with the circuit increases and reliability is improved.
  • polymers when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred.
  • the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and fully connected. This connection is crimped to the circuit board 21
  • a wiring circuit (or electronic component) 23 is placed on the adhesive 11 thus obtained, and if necessary, as a cushion material, for example, is heated and pressed through a polytetrafluoroethylene material 24. Heats and presses the wiring circuit 23 onto the circuit board 21.
  • the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment is bonded over the entire periphery of the PDP, and is used at a time.
  • the use amount of the agent 11 is remarkably increased as compared with the conventional method. Accordingly, the amount of the adhesive tape 1 wound on the reel 3 increases, and the adhesive tape 1 wound on the reel 3 is wound up on the empty reel 17 in a relatively short time, and the reel 3 is wound up. Become empty.
  • the adhesive 11 mixed with the resin and the conductive particles 13 is applied to the base material (separation one night) unwound from the unwinding machine 25 by the first one 27 After drying in the drying oven 29, the web is wound up by the winder 31. As shown in Fig. 35, five coaters 27 are placed on the base material 9 for the 10 mm width, and five strips of adhesive 11 are placed on the 10 mm width. Is applied.
  • the raw material of the wound adhesive tape is cut into a predetermined width by a slit 33 and wound around a winding core, and the side plates 7, 7 are attached to the winding core from both sides, or It is wound on a core and packed with a dehumidifying material, and is preferably shipped at a low temperature (15 ° C to 110 ° C).
  • the adhesive tape 1 has an adhesive applied to the entire surface of one side of the base material with a width W.
  • the adhesive is separated into a plurality of strips in the width W direction by slits 35 formed in the longitudinal direction.
  • the slit 35 is preferably formed immediately after the adhesive tape 1 is pressure-bonded to the circuit board 21 after the reel 3 is mounted on the bonding device 15. .
  • a slit 35 is formed in the adhesive 11 of the adhesive tape 1 to be wound by attaching a face to the vicinity of the reel mounting portion of the bonding device 15 (indicated by S in FIG. 3). It may be wound on a reel after forming a slit in the finishing step in the production of the adhesive tape shown in Fig. 5, or after drying in the coating step.
  • a slit may be formed immediately before winding in step 1.
  • the adhesive tape 1 according to the second embodiment is used in the bonding device 15
  • the adhesive tape is separated by slits 35 one by one. Is pressed from the base material 9 side by the heating and pressing head 19 and used sequentially as shown in Fig. 36A, 36B and 36C.
  • a plurality of adhesives 11 can be obtained only by forming slits 35 in the adhesive on the base material obtained by the same process as the conventional method. It is easy to manufacture.
  • the adhesive 11 is applied to the entire surface of the base material 9 (FIG. 37A).
  • the width W of the adhesive 11 is 5 to 100 mm as in the above-described embodiment.
  • the adhesive tape 1 is mounted on the bonding device 15 in the same manner as in the first embodiment, the adhesive tape 1 fed from the reel 3 is placed on the circuit board 21, and the adhesive tape 1 is bonded in the width W direction.
  • the adhesive tape 1 is bonded in the width W direction.
  • Fig. 37B By heating and pressurizing a part (one part) of the agent (Fig. 37B), the cohesive force of that part is reduced.
  • only the adhesive in the heated and pressurized portion is separated from the base material and pressed on the circuit board 21 (FIG. 37C).
  • a cohesive force reduction line is formed along the line around the heating and pressing head 19, and most of the heated and pressurized portion causes the adhesive to flow softly. It is preferable that the curing reaction of the adhesive does not start or is in a low state (the reaction rate is 20% or less as a guide).
  • the heating temperature is selected according to the adhesive system used. I do.
  • the adhesive 11 is pressed into the substrate circuit by fluidizing one line of the width W only at the time of use.
  • the reel 3 of the adhesive tape 1 and the empty reel can be used a plurality of times by rotating forward and reverse.
  • the fourth embodiment shown in Figs. 38A to 38C shows another method of manufacturing the adhesive tape according to the first embodiment.
  • a slit 98 is formed on the applied adhesive 11 (FIG. 38A)
  • the other substrate is placed on the adhesive 11 so that the adhesive 11 is sandwiched between the substrates 9a and 9b.
  • Paste the material 9b Fig. 38B
  • one and the other base materials 9a and 9b are separated so as to be peeled off, and adhesive strips 11a and 1lb are arranged on every other base material 9a and 9b.
  • the adhesive is applied from one side of the base material 9a or 9b so that the adhesive strips 11a and lib are alternately arranged on the base material 9a and 9b.
  • the adhesive strips 11a, 11b may be arranged on every other base material 9a, 9b by heating and pressing every other strip 11a, 11b.
  • the adhesive 11 may be an insulating adhesive in which the conductive particles 13 are not dispersed.
  • the number of the adhesives formed on the base material 9 may be any number, and may be at least two or more.
  • These inventions provide an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and electrically connecting both electrodes, a method for manufacturing an adhesive tape, and a method for manufacturing the same.
  • the present invention relates to a pressure bonding method for an adhesive tape.
  • Japanese Patent Application Publication No. 2000-2005 discloses a tape obtained by winding an adhesive tape having a base material coated with an adhesive in a reel shape. .
  • This type of conventional adhesive tape has a width of about 1 to 3 mm, and the length of the tape wound around a reel is about 50 m.
  • the adhesive tape is pulled out along one side of the circuit board, and the adhesive is pressed on the circuit board.
  • Adhesive is crimped around the four sides of the board.
  • the invention described in claims 35 to 41 is an adhesive tape capable of increasing the amount of adhesive without increasing the number of turns of the adhesive tape. And a method for producing an adhesive tape and a method for pressure-bonding the adhesive tape. [0590]
  • FIG. 39A and FIG. B, FIG. 40, FIG. 34, FIG. 5, and FIG. 41 the first embodiment of the invention described in claims 35 to 41 will be described.
  • Fig. 39A and Fig. 39B are views of the adhesive tape
  • Fig. 39A is a perspective view of a reel around which the adhesive tape is wound
  • Fig. 39B is a view of the adhesive tape of Fig. 39A.
  • FIG. 40 is a plan view seen from the side of the adhesive
  • FIG. 40 is a perspective view showing a pressure bonding step of the adhesive in the bonding apparatus.
  • the adhesive tape 1 according to the present embodiment is wound on a reel 3.
  • the reel 3 includes a winding core 5 and side plates 7 arranged on both sides of the adhesive tape 1. It is set up.
  • the length of the adhesive tape 1 is about 50 m
  • the width W is about 150 O mm, which is almost the same size as one side of the circuit board.
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied on the base material 9, and the width of one strip is 0.5 mm on the base material 9. Adhesives 11 are provided at regular intervals and in the width direction of the tape.
  • the base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. 1), etc., but is not limited to these.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acrylic type, and a vinyl ester type resin as a thermosetting resin.
  • a silicone resin system is used.
  • conductive particles 13 are dispersed.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, carbon, graphite, and the like.
  • a material in which the above-described conductive layer is formed by coating or the like on a polymer core material such as ceramics and plastic may be used. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressurizing, and the distance between electrodes after connection is reduced. This is preferable because the contact area with the circuit increases and reliability is improved.
  • polymers when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred.
  • the circuit board 21 is rotated by about 90 degrees, the side adjacent to the circuit board 21 is positioned in the width direction of the adhesive tape 1, and the heating and pressing head 19
  • the adhesive 11 is pressed to the other side of the circuit board 21 by the above method.
  • the circuit board 21 is rotated by about 90 degrees, the adhesive 11 is pressed, and the adhesive 11 is pressed around the circuit board 21 over four circumferences.
  • the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and permanently connected.
  • the wiring circuit (or electronic component) 23 is placed on the adhesive 11, and if necessary, as a cushioning material, for example, polytetrafluoride.
  • the wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via the ethylene material 24.
  • connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment is bonded over the entire periphery of the PDP, and is used at a time.
  • the use amount of the agent 11 is remarkably increased as compared with the conventional method.
  • the width W of the adhesive tape 1 is substantially equal to the length H of one side of the circuit board 21, the width W of the adhesive tape 1 is increased, but the amount of adhesive is the same even with the same number of windings as before.
  • the number of reel replacements is significantly less than conventional ones.
  • An adhesive 11 mixed with resin and conductive particles 13 is applied to the base material (separate one night) unwound from the unwinding machine 25 by the second one 27 After drying in the drying oven 29, the web is wound up by the winder 31.
  • the adhesive is applied to the base material 9 at regular intervals by moving to the left and right.
  • the material of the wound adhesive tape is After being cut to a predetermined width by the ridge 33 and wound on the winding core, the side plates 7, 7 are attached to the winding core from both sides, or are wound on the winding core with the side plate, Packed with dehumidifier, preferably shipped in a controlled low temperature (15 ° C to 110 ° C)
  • the adhesive tape 1 is mounted at two places in the adhesive device 15, and one adhesive tape 1 and the other adhesive tape are provided. Steps 1 are provided in directions orthogonal to each other. Then, the adhesive 11 is pressure-bonded to the pair of opposed vertical sides N of the circuit board 21 on one adhesive tape 1 (first step), and the pair of horizontal The adhesive 11 is crimped to the side M (second step), and the adhesive is crimped to the four circumferences of the circuit board 21 in two steps.
  • the circuit board 21 placed in the first step is used as it is in the second step without rotating the direction of the circuit board 21 between the first step and the second step. By moving to, automatic bonding of the adhesive becomes possible, and the working efficiency can be further improved. In this case, the circuit S 21 may be placed on a transport belt and automatically transported.
  • the adhesive is applied to the entire surface of one side of the base material with a width W, and the adhesive is formed in the width W direction of the base material.
  • the adhesive is separated into multiple strips in the width W direction by slits 35.
  • the slit 35 is preferably formed immediately after the adhesive tape 1 is pressed onto the circuit board 21 after the reel 3 is mounted on the bonding device 15.
  • a slit 35 is formed on the adhesive 11 of the adhesive tape 1 to be wound out by attaching a face to the vicinity of the reel mounting portion of the bonding device 15 (indicated by S in FIG. 40).
  • a slit may be formed immediately before winding with.
  • the face may reciprocate in the width W direction of the adhesive sheet 1.
  • the adhesive tape 1 according to the third embodiment is used in the bonding device 15, as in the first embodiment, the adhesive tapes 1 separated by the slits 35 are bonded one by one.
  • the agent is pressed from the base material 9 side with a heating and pressurizing head and used sequentially from the tip side.
  • a plurality of adhesives 11 provided in the width direction only by forming slits 35 in the adhesive on the base material obtained by the same process as in the related art It is easy to manufacture.
  • the adhesive 9 is applied to the entire surface of the base material 9 on one side (FIG. 43A).
  • the width W of the adhesive 9 and the adhesive 11 is substantially the same as the length of one side of the circuit board as in the above-described embodiment.
  • it is mounted in the same manner as in the first embodiment, and a part (one strip) of the adhesive is heated and pressed in the width W direction of the adhesive tape 1 (FIG. 43B), whereby the aggregation of the part is performed.
  • a cohesive force reduction line is formed along the line around the heating and pressing head 19, and the adhesive softens and flows in most of the heated and pressed portion, and (1 ° It is preferable that the curing reaction of the adhesive does not start or is in a low state (the reaction rate is 20% or less as a guide).
  • the heating temperature is selected according to the adhesive system to be used.
  • the adhesive 11 can be softened and fluidized one by one in the width W direction only when used, and can be pressure-bonded to the substrate circuit.
  • the slits 3 5 It is not necessary to form or separate multiple strips.
  • the fifth embodiment shown in Figs. 44A to 44C shows another method of manufacturing the adhesive tape 1 according to the first embodiment, and shows the adhesive 1 applied to the base material 9a.
  • the other substrate 9b is attached on the adhesive 11 so that the adhesive 11 is sandwiched between the substrates 9a and 9b (Fig. 44B).
  • the adhesive strips 11a and lib are arranged on every other substrate 9a and 9b.
  • one of the base materials 9a and 9b is adhered from one base material 9a or 9b side so that the adhesive strips 11a and 11b are alternately arranged on the other base material 9a and 9b.
  • the adhesive strips 11a and lib may be sequentially adhered to the base materials 9a and 9b by heating and calorizing every other strip of strips 11a and 11b.
  • the adhesive 11 may be an insulating adhesive in which the conductive particles 13 are dispersed.
  • These inventions provide an adhesive tape cassette and an adhesive using an adhesive tape cassette for bonding and fixing an electronic component and a circuit board or circuit boards to each other, and for electrically connecting both electrodes. To a crimping method.
  • Japanese Patent Application Laid-Open Publication No. 2000-2005 discloses that an adhesive tape having a base material coated with an adhesive is wound into a reel.
  • This type of conventional adhesive tape has a width of about 1 to 3 mm, and the length of the tape wound on a reel is about 50 m.
  • the adhesive tape is pulled out along one side of the circuit board, and the adhesive is pressed on the circuit board.
  • Adhesive is crimped around the four sides of the board.
  • the invention described in claims 42 to 46 can reduce the amount of the adhesive without increasing the number of windings of the adhesive tape, and reduce the amount of the adhesive. It is an object of the present invention to provide an adhesive tape cassette and a method for crimping an adhesive using the adhesive tape cassette, which can easily replace a cell.
  • FIG. 45A and FIG. B, FIG. 46, FIG. 47, FIG. 4, FIG. 34, FIG. 48, the first embodiment of the invention described in claims 42 to 46 will be described. .
  • the adhesive tape is described in the case where two adhesives are arranged, but a plurality of adhesives may be formed.
  • FIG. 45A and 45B are diagrams of the adhesive tape cassette according to the first embodiment of the invention described in claims 42 to 46, and FIG. FIG. 45B is a perspective view of the tape cassette shown in FIG. 45A, and FIG. 46 is a perspective view of the tape cassette, and FIG. 46 is a view of the tape cassette shown in FIGS. 45A and 45B.
  • FIG. 47 is a cross-sectional view showing the state
  • FIG. 47 is a front view showing a pressure bonding step of the adhesive in the bonding apparatus
  • FIG. 48 is a process diagram showing a method for manufacturing an adhesive tape cassette.
  • the adhesive tape cassette 100 mainly includes one reel 3, the other reel 17, and a case 99 for accommodating them.
  • the adhesive tape 1 is wound around one of the reels 3, and the other end 9 a of the adhesive tape 1 is fixed to the other reel 17.
  • An opening 11 is formed in one side of the case 99, and the adhesive tape 1 is drawn out from the opening 11.
  • Guides 13 and 13 for guiding the movement of the adhesive tape 1 are provided on both sides of the opening 11.
  • the case 99 is formed by fitting half cases 99a and 99b, and one and the other reels 3 and 5 are attached to a bonding device 27 (described later).
  • the provided spool 17 (see FIG. 46) is fitted and fitted to each reel 3,5.
  • each of the reels 3 and 5 is formed on its inner peripheral side with a fitting line 19 on which the spool 17 of the bonding device 27 is fitted, and on the outer peripheral side thereof is rotated by a projection 7c of a case 99. Engagement grooves 21 are formed so as to fit as much as possible.
  • the adhesive tape 1 has one side of the base material 9 coated with two adhesives 11a and 11b in a width direction. . The two strips of adhesive 11a, 1lb are spaced apart from each other.
  • the adhesive tape 1 has a length of about 50 m and a width W of about 4 mm.
  • the width of each piece of adhesive 11a, 11 1 is about 1.2 mm.
  • the base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. 1), etc., but is not limited to these.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acrylic type, a vinyl ester type resin type, and a silicone as a thermosetting resin type.
  • a resin system is used.
  • the conductive particles 13 are dispersed in the adhesive 11.
  • the conductive particles 13 include metal particles such as Au, As, Pt, Ni, Cu, W, Sb, Sn, and solder, carbon, graphite, and the like.
  • the conductive layer may be formed by coating a polymer nucleus material such as ceramics, plastic, or the like with a coating. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer When a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it has deformability by heating or pressurizing, and the distance between electrodes after connection decreases, This is preferable because the contact area with the circuit sometimes increases and the reliability is improved.
  • polymers when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred.
  • the adhesive tape cassette 100 is attached to the bonding device 27.
  • the bonding device 27 is provided with spools 17 and 17 (see FIG. 46) for cassettes at intervals, and the spools 17 and 17 are mounted on reels 3 and 5 of the adhesive tape cassette 100, respectively.
  • Engage, 17 Therefore, the adhesive tape cassette 100 can be mounted with a one-touch switch, so that there is no need to attach the other end 9a of the adhesive tape 1 wound on a reel to an empty reel as in the related art.
  • the adhesive tape 1 is pulled out from the adhesive tape force set 100, and is passed over the guides 31 and 31 of the bonding device 27.
  • the spool 17 of the bonding device 27 is driven to feed out the adhesive tape 1 (in the direction of the arrow E in Fig. 47), and the adhesive tape 1 is placed on the circuit board 21. Then, the adhesive tape 1 is pressed from the base material 9 side with the heating and pressing head 19, and one strip of the adhesive 1 la on one side in the width direction is pressed against one side of the circuit board 21. Wind the strip adhesive 1 1b and 9 on the other reel 17. In this way, the adhesive 11a is pressure-bonded over the entire circumference of the circuit board 21.
  • the adhesive tape cassette 100 is once removed, turned upside down and mounted, and the above-described steps are repeated.
  • the adhesive is formed on the adhesive tape in two or more strips, it is possible to change the position in the width direction and perform the pressure bonding sequentially or at intervals.
  • the electrodes 33a of the circuit board 21 and the electrodes 37a of the wiring circuit (electronic parts) 37 are aligned and permanently connected.
  • the wiring circuit 23 is heated and pressurized on the circuit board 21 by the heating and pressing head 19 via the fluoroethylene material 39 (see FIG. 4).
  • the electrode 33a of the circuit board 21 and the electrode 37a of the wiring circuit 23 are connected and fixed.
  • the adhesive tape cassette according to the present embodiment In the present embodiment, the connection portion of the PDP 26 that has been bonded using 100 is bonded over the entire periphery of the PDP 26, and the amount of the adhesive 11 used at one time has conventionally been reduced. It is much higher than in comparison. However, since two strips of adhesive 1 la and 1 lb are placed on the adhesive tape 1 in the width W, the amount of adhesive is doubled even if the number of windings is the same as before, so the number of cassette replacements Need less.
  • the base material (separation) 23 unwound from the unwinding machine 25 is used to apply the adhesive 11 mixed with the resin and the conductive particles 30 to the base material 2 3 After coating and drying in a drying oven 29, the web is wound up by a winder 31.
  • a large number of adhesives are applied to the base material 9.
  • the raw material of the wound adhesive tape is cut into a predetermined width (width of two adhesive strips) by a slit 33 in a finishing process, wound on a reel 3, and then wound on a reel.
  • the adhesive tape cassette 100 is manufactured by fitting the 3 and the empty reel 5 so as to be sandwiched between the half cases 99a and 99.
  • the adhesive tape cassette 100 is packed together with a dehumidifying material, and is preferably shipped at a low temperature (_5 ° C to 110 ° C).
  • the adhesive 11 is pressure-bonded at one time over the entire side of the circuit board 21.
  • a guide 101 for pulling out the adhesive tape 1 from the tape force set 100 and arranging it is provided.
  • the entirety of one side of the circuit board 21 is contacted at one time. Work efficiency is good because the adhesive can be pressed.
  • the adhesive 11 is applied to the entire surface of one side of the base material 9 with a width W, and the adhesive is divided into two by a slit 102. It is separated.
  • the slits 102 are provided immediately after the adhesive tape 1 is mounted on the circuit board 21 after the adhesive tape cassette 100 is mounted on the bonding device 27. It is preferable to form it.
  • a slit 102 is formed on the adhesive 11 of the adhesive tape 1 to be unwound by attaching a face to the vicinity of the cassette mounting portion of the adhesive device 27 (indicated by S in FIG. 47).
  • the adhesive tape may be wound on a reel 3 after forming a slit in the finishing process during the production of the adhesive tape shown in FIG. 48, or may be wound on a winding machine 3 after drying in the coating process.
  • the slit 102 may be formed immediately before winding at 1.
  • the adhesive 11 is applied to the entire surface of the base material 9 on one side (FIG. 51A).
  • the adhesive tape cassette 100 containing the adhesive tape 1 is mounted on the adhesive device 27 in the same manner as in the first embodiment, and a part of the adhesive 11 in the width W direction of the adhesive tape 1 ( By heating and pressurizing the adhesive, the cohesive force of that portion is reduced, and only the adhesive 1 la of the heated and pressurized portion is separated from the base material 9 and pressed against the circuit board 21 (Fig. 5 1). ⁇ ) ⁇
  • a cohesive force reduction line 103 (Fig. 51A) is formed along the periphery of the heating / pressing head 19, and most of the heated / pressed portion is made of an adhesive. It is preferable that the adhesive softens and flows (100 or less voids are a guideline) and the curing reaction of the adhesive does not start or is in a low state (reaction rate is 20% or less as a guideline). Select according to the drug system.
  • the adhesive 11 has a width W only when used.
  • 25 a of one line can be softened and fluidized, and can be pressure-bonded to the substrate circuit.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and more particularly to an adhesive tape wound in a reel shape. Material tape.
  • Japanese Patent Application Laid-Open No. 2000-2005 discloses a tape obtained by winding an adhesive tape having a base material coated with an adhesive material in a reel shape. I have.
  • the conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound on the reel is about 50 m.
  • adheresive reel When attaching the adhesive tape to the adhesive device, attach a reel of adhesive tape (hereinafter simply referred to as “adhesive reel”) to the adhesive device and pull out the start end of the adhesive tape. And attach it to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive reel by a heating and pressing head, and the remaining base material is wound on a take-up reel. ing.
  • adhesive reel hereinafter simply referred to as “adhesive reel”
  • FIGS. 52A and 52B are views showing the connection of the adhesive tape according to the present embodiment
  • FIG. 52A is a perspective view showing the connection between the adhesive reels
  • FIG. 5B is a sectional view showing a connection portion in FIG. 52A.
  • the adhesive tape 1 is wound on the reels 3 and 3a, respectively, and the reels 3 and 3a have side plates disposed on both sides of the winding core 5 and the adhesive tape 1, respectively. 7 are provided. [0666]
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • the base material 9 has a support layer 9 b and a hot-melt layer (a hot-melt layer) 9 a sandwiching the support layer 9 b from both sides.
  • a hot-melt layer a hot-melt layer
  • thermoplastic resin such as polyethylene, SBS (styrene butadiene styrene block copolymer), and nylon.
  • SBS styrene butadiene styrene block copolymer
  • nylon nylon
  • OPP stretched polypropylene
  • polytetrafluoroethylene And reinforcing fibers such as plastic glass fiber such as PET (polyethylene terephthalate), aramide fiber, and carbon fiber.
  • thermoplastic resin a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acryl resin type, and a silicon resin type as a thermosetting resin type.
  • the conductive particles 13 may be dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as An, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, and carbon, graphite, and the like.
  • the conductive layer may be formed by coating the conductive layer on a polymer nucleus material such as glass, ceramics, or plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it has deformability by heating or pressing, the distance between electrodes after connection decreases, This is preferable because the contact area with the circuit is increased and the reliability is improved.
  • connection temperature when a polymer is used as a core, since a melting point is not exhibited unlike solder, the softened state can be controlled widely by the connection temperature, and a connection member which can easily cope with variations in electrode thickness and flatness can be obtained. More preferred.
  • the reel 3a of the adhesive tape 1 and the take-up reel 17 are mounted on the adhesive device 15 and the tip of the adhesive tape 1 wound on the reel 3a is attached to the guide pins 22.
  • the tape is attached to the take-up reel 7 and the adhesive tape 1 is fed out (arrow E in FIG. 3).
  • the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the base material 9 side by the heating and pressing head 19 disposed between the reels 3 a and 17.
  • the adhesive 1 1 is crimped to the circuit board 21.
  • the base material 9 is wound on a take-up reel 17.
  • a wiring circuit (or electronic component) 23 is placed on the adhesive 11 crimped on the circuit board 21, and a polytetrafluoroethylene material 2 is used as a cushion material.
  • the wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via 4.
  • the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • the adhesive 11 is pressed over the entire periphery of the PDP 26.
  • the amount of the adhesive 11 used at one time is significantly larger than in the past. Accordingly, the amount of the adhesive tape 1 wound on the reel 3a is also increased, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time.
  • the end mark 28 of the adhesive tape 1 wound on a is exposed (see FIG. 52A).
  • connection of the adhesive tape 1 is performed by connecting the end portion 30 of the adhesive tape 1 of the adhesive tape 3a and a new adhesive tape.
  • 3 adhesive tape With respect to the starting end 32 of the tape 1, the adhesive 11 surface of the starting end 32 is superimposed on the hot melt layer 9 a of the base material 9 at the end 30, and such a portion is placed on the table 104. Then, the overlapping portion is heated by the heating / pressing head 19 of the bonding device 15 to melt the hot-melt layer 9a, and then the hot-melt is solidified by cooling. 0 and the start end 32 are connected. Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected.
  • Adhesive 11 mixed with resin and conductive particles 13 is applied to base material (separation overnight) unwound from unwinding machine 25 by co-existing 27 After drying in the drying oven 29, the web is wound up by the winder 31.
  • the raw material of the wound adhesive tape 1 is cut into a predetermined width by a slit 33 and wound on a winding core. Then, side plates are attached to the winding core from both sides, and dehumidification is performed. It is packaged together with the materials and shipped at a low temperature (15 ° C to -10 ° C).
  • the hot-melt agent layer 9a is sandwiched between the support layers 9b.
  • the hot-melt agent layer 9 a is heated by the heating and pressurizing head 19 of the adhesive device 15.
  • the hot melt exudes from the hot melt layer 9a, and the hot melt solidifies by cooling, so that the adhesive tapes 1 are connected to each other.
  • the hot-melt agent layer 9a is sandwiched between the support layers 9b, it is possible to prevent the adhesive strength of the hot-melt agent layer 9a from being lowered due to adhesion of moisture and dust due to moisture.
  • the base material 9 is composed of the support layer 9b and the three layers sandwiching the support layer 9b from both sides with the hot-melt agent layer 9a, but is not limited thereto. Four or more layers may be used.
  • the heating and pressurizing head 19 of the bonding device 15 is used for the heat press bonding of the connection portion.
  • the heating and pressurizing head 19 instead of the heating and pressurizing head 19, separate heating is performed.
  • the connection between the adhesive tapes 1 may be performed by heating the connection portion using a container.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board or circuit boards, and for electrically connecting both electrodes.
  • liquid crystal panels PDPs (plasma display panels), E Adhesive tape is used as a method of bonding and fixing electronic components such as L (fluorescent display) panels, pair chip mounting, and circuit boards and circuit boards, and electrically connecting both electrodes.
  • L fluorescent display
  • the adhesive tape is used for the lead fixing tape of the lead frame, the LOC tape, the die bonding tape, the adhesive film such as the micro BGA / CSP, etc., to improve the productivity and reliability of the entire semiconductor device. Used to improve.
  • Japanese Patent Application Publication No. 2000-2005 discloses a tape obtained by winding an adhesive tape having a base material coated with an adhesive material in a reel shape. I have.
  • both sides of the base material are subjected to a silicone treatment so that the adhesive does not adhere to the base material or is easily peeled off.
  • adheresive reel When attaching the adhesive tape to the adhesive device, attach a reel of the adhesive tape (hereinafter simply referred to as “adhesive reel”) to the adhesive device, pull out the start end of the adhesive tape, Attach to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive material reel by a heating and pressing head, and the remaining base material is wound on a take-up reel.
  • adhesive reel a reel of the adhesive tape
  • the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased.
  • the use of adhesives has expanded, and the amount of adhesives used has increased.
  • the number of adhesive tapes wound on the reels is increased to increase the amount of adhesive per reel and to reduce the frequency of reel replacement.
  • the tape width of the adhesive tape is as narrow as 1 to 3 mm, a large number of windings may cause winding collapse.
  • the pressure acting on the adhesive tape wound in a tape shape increases, and the adhesive may ooze out from both widths of the tape and cause blocking.
  • An object of the present invention is to provide a method of connecting an adhesive tape that can be improved.
  • FIGS. 54A to 54C are cross-sectional views showing the connection process of the connection portion in FIG. 55
  • FIG. 54A shows the state of the adhesive tape before discharge
  • FIG. 54B shows the state after discharge
  • FIG. 54C shows the state of the adhesive tape
  • FIG. 54C is a view showing the thermocompression bonding of the connection portion.
  • FIG. 55 is a perspective view showing a connection between the adhesive reels in the method of connecting the adhesive tape
  • FIG. 56 is a schematic view showing a pressure bonding step of the adhesive in the bonding apparatus.
  • Adhesive tape 1 is wound on reels 3 and 3a, respectively, and reels 3 and 3a have side plates 7 arranged on both width sides of core 5 and adhesive tape 1, respectively. Are provided.
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • the base material 9 is made of 0 PP (stretched polypropylene), polytetrafluoroethylene, PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive 11. G), etc., and surface-treated with release agent 9a.
  • the release agent include an olefin release agent, a low melting point wax such as ethylene glycol montanate, carnauba wax, petroleum wax, a low molecular weight fluororesin, a silicone-based or fluorine-based surfactant, an oil, and a wax.
  • Resins, polyester-modified silicone resins and the like are used, and silicone resins are particularly common.
  • thermoplastic resin a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acrylic resin type and a silicone resin type as a thermosetting resin type.
  • the conductive particles 13 may be dispersed in the adhesive 11.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like.
  • the conductive layer may be formed by coating the conductive layer on a polymer nucleus material such as conductive glass, ceramics, or plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressing, the distance between electrodes after connection decreases, This is preferable because the contact area with the circuit is increased and the reliability is improved.
  • a polymer is used as a core, since a melting point is not exhibited unlike solder, the softened state can be controlled widely by the connection temperature, and a connection member which can easily cope with variations in electrode thickness and flatness can be obtained. More preferred.
  • the reel 3a of the adhesive tape 1 and the take-up reel 17 are mounted on the bonding device 15 and the tip of the adhesive tape 1 wound on the reel 3a is guided into the guide bin 22. And attach it to the take-up reel 17 and pay out the adhesive tape 1 (Fig. 5 6 Medium arrow E). Then, the adhesive tape 1 is placed on the circuit board 2 1, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 disposed between the reels 3 and 17, The adhesive 1 1 is pressed on the circuit board 21. Thereafter, the base material 9 is wound on a take-up reel 17.
  • a wiring circuit (or electronic component) 23 is placed on the adhesive 11 crimped to the circuit board 21, and a polytetrafluoroethylene material 2 is used as a cushion material.
  • the wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via 4. Thereby, the electrode 2 la of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • FIG. 29 shows a connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment, and the adhesive 11 is crimped over the entire periphery of the PDP 26.
  • the adhesive tape 1 on the reel 3a is replaced with the adhesive tape 1 on the reel 3a in order to replace the reel 3a with a new adhesive reel 3.
  • the end 30 of the material tape 1 is connected to the beginning 32 of the adhesive tape 1 (the other adhesive tape) wound on a new adhesive reel 3.
  • this adhesive tape 1 is connected by placing the end 30 of the adhesive tape 1 on the used reel 3a at the irradiation position of the electric discharger 105. . Then, the release agent 9 a is removed by discharging the surface of the base material 9.
  • the adhesive 11 surface of the starting end 32 of the other adhesive tape 1 is superimposed on the surface of the base material 9 from which the release agent 9a has been removed (Fig. 54C).
  • the superposed part of both is placed on the table and bonded by heating and pressing with the heating and pressing head 19 of the bonding device 15 I do. Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected.
  • the release agent 9a of the base material 9 of one of the adhesive tapes 1 whose winding has been completed is removed, and a new adhesive tape is applied to such a portion.
  • 1 Adhesive 1 Laminate 1 surface apply heat and pressure with heating and pressurizing 19 and bond, connect both, but remove release agent 9a from substrate 9 of new adhesive tape 1 Then, the adhesive 11 of one of the adhesive tapes 1 whose winding has been completed may be overlapped on such a portion, and the two may be connected.
  • a method for removing the release agent 9a besides plasma discharge, a method using ultraviolet irradiation or laser irradiation may be used.
  • ultraviolet irradiation for example, a mercury lamp is used as a light source. This is performed by irradiating ultraviolet rays from a mercury lamp for a certain period of time.
  • laser irradiation the release agent 9a is decomposed and scattered by the laser light irradiated by the laser oscillator, and the release agent 9a is removed.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component to a circuit board or a circuit board and electrically connecting both electrodes.
  • the present invention relates to an adhesive tape used in a semiconductor device for fixing a semiconductor element (chip) to a support for fixing a lead frame, a die of a lead frame, and a support substrate for mounting a semiconductor element, and particularly to a reel-shaped.
  • the present invention relates to an adhesive tape reel wound around.
  • the adhesive tape is used for a lead frame lead fixing tape, a LOC tape, a die bond tape, and the like.
  • a lead fixing tape is used to fix lead pins of a lead frame. It is used to improve the productivity and reliability of the lead frame itself or the entire semiconductor device.
  • semiconductor elements such as a glass epoxy substrate or polyimide substrate
  • connection part and the top surface or the end surface of the chip are sealed with an epoxy-based sealing material or epoxy-based liquid sealing material, and metal terminals such as solder balls are arranged on the back surface of the wiring board in an array.
  • Adhesive tapes are also used for QFN (Quad i! At Non-leaded Package) and SON (Small Outline Non-leaded Package). Then, a method is adopted in which a plurality of these packages are mounted on the board of an electronic device at high density by a solder reflow method and packaged at a time.
  • the die of the lead frame and the semiconductor element are mounted via an adhesive, and the terminal on the semiconductor element side and the lead frame terminal are connected by wire bonding, and the connection portion and the upper surface or the end surface of the chip are connected. Sealed with epoxy-based sealing material or epoxy-based liquid sealing material. An adhesive tape is also used as an adhesive for such a semiconductor device.
  • Japanese Patent Application Laid-Open No. 2000-2005 discloses a method of electrically connecting electrodes to each other by winding an adhesive tape coated with an adhesive in a reel shape. What was taken is disclosed.
  • the conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound up on the reel is about 50 m.
  • FIGS. 57A to 57C are views showing an adhesive tape reel according to the first embodiment
  • the adhesive tape reel A includes winding portions (hereinafter, winding portions) 2, 2a of a plurality of adhesive tapes 1, and winding portions 2, 2a.
  • 2a is provided with reels 3 and 3a on which an adhesive tape 1 is wound.
  • Each reel 3, 3a is provided with a winding core 5 and side plates 7, 7a, 7b arranged on both width sides of the adhesive tape 1. As shown in FIG.
  • the adhesive tape 1 includes a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • a cover member 8 covering the periphery of the adhesive tape 1 wound on the reel 3a is detachably provided on the reel 3a on the unused winding portion 2a.
  • a storage portion (storage space) 12 for the desiccant 10 is provided in the side plate 7a inside the winding portions 2 and 2a.
  • a desiccant 10 such as a force gel
  • the moisture in the unused winding portion 2a is removed from the inside.
  • the base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, silicon-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Evening rate) is used, but is not limited to these.
  • thermoplastic resin a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acryl resin type, and a silicon resin type as a thermosetting resin type.
  • the conductive particles 13 may be dispersed in the adhesive 11.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like.
  • the conductive layer may be formed by coating the conductive layer on a polymer nucleus material such as conductive glass, ceramics, or plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • Heat-melted metal such as solder or polymer nucleus material such as plastic with a conductive layer formed is heated It is preferable because it has deformability by pressure or pressurization, reduces the distance between electrodes after connection, increases the contact area with a circuit at the time of connection, and improves reliability.
  • a polymer is used as a core, since a melting point is not exhibited unlike solder, the softened state can be controlled widely by the connection temperature, and a connection member which can easily cope with variations in electrode thickness and flatness can be obtained. More preferred.
  • the adhesive tape reel A and the take-up reel 17 are attached to the adhesive device 15, and the base end of one adhesive tape 1 is hung on the guide bin 22. Attach it to the take-up reel 17 and pay out the adhesive tape 1 (arrow E in FIG. 3). Then, the adhesive tape 1 is placed on the circuit board 2 1, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 placed between the reels 3 and 17. Then, the adhesive 1 1 is pressed to the circuit board 21. Thereafter, the base material 9 is wound on a take-up reel 17. Next, as shown in FIG.
  • the wiring circuit (or electronic component) 23 is placed on the adhesive 11 crimped on the circuit board 21, and the polytetrafluoroethylene material 2 is used as the cushioning material.
  • the wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via 4.
  • the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • the adhesive 11 is pressed over the entire periphery of the PDP 26.
  • the amount of the adhesive 11 used at one time is significantly larger than in the past. Therefore, the amount of the adhesive tape 1 used increases, and the adhesive tape 1 wound on the reels 3 and 3a is wound on the take-up reel 17 in a relatively short time.
  • the end mark is exposed on the adhesive tape 1 of the one winding part 2, replace it with the adhesive tape 1 of the new winding part 2a.
  • the unused winding portion 2a is provided with a cover member 8, and after removing the cover member 8, the adhesive tape 1 is fed out to take up the winding reel 17. Attach to 9694
  • the winding portions 2, 2a, and 2b are separately provided, and are provided on the main body of the bonding device 15. Slidably mounted on the shaft 107. Then, when the unwinding of the one winding part 2 is completed, the cap 108 attached to the tip of the shaft 107 is removed, and the one winding part 2 is removed from the bonding device 15. Then, the other winding portion 2a is moved to the bonding position, the cover member 8 is removed, and then the adhesive tape 1 of the other winding portion 2a is wound around the take-up reel 17 and the adhesive tape 1 has been exchanged. In this case, the plurality of winding portions 2, 2a, and 2b are separately provided, so that they are easy to handle.
  • the winding portions 2, 2a, and 2b are separately provided, and the winding portion 2 , 2a, 2b are attached to the bonding device 15 by fitting the side plates 7, 7a of each other.
  • the side plate 7 a of the other winding portion 2 a is provided with a fitted portion 110 having a substantially U-shaped cross section, and the side plate 7 of the one winding portion 2 is provided.
  • the number of winding portions 2 and 2a is not particularly limited and may be any number.
  • the side plates 7, 7a are vertically slid.
  • the one and the other winding portions 2 and 2a are fitted to each other.
  • a fitting hole is formed in one side plate 7 and a fitting projection is provided in the other side plate 7a. The fitting projection may be pushed into the fitting hole in the width direction of the above to fit the two together.
  • Figures 31A and 31B show the supporting substrate for fixing the lead frame, the supporting substrate for mounting the semiconductor element, or the adhesive tape for connecting the die of the lead frame and the semiconductor element.
  • An example of an L 0 C (Lead on Chip) structure for bonding and fixing a semiconductor device to a support frame for fixing a lead frame to a lead frame is shown.
  • the semiconductor device having the LOC structure shown in FIG. 31B can be obtained by using the adhesive tape having the structure shown in FIG.
  • the adhesive tape shown in Fig. 31A is attached to the punching die 87 (male (convex) 95, female (recess) 96) of the bonding machine shown in Figs. 32A to 32C.
  • Punched into strips for example, and placed on a 0.2 mm thick iron-120-kel alloy lead frame so that the inner lead with 0.2 mm spacing and 0.2 mm width is in contact with it.
  • the semiconductor element was pressed against the adhesive layer surface of the lead frame with the adhesive film for semiconductor at a temperature of 350 ° C. at a pressure of 3 MPa for 3 seconds, and then pressed.
  • the frame and the semiconductor element are wire-bonded with a gold wire and sealed by transfer molding using a sealing material such as an epoxy resin molding material to obtain a semiconductor device as shown in FIG. 31B.
  • a sealing material such as an epoxy resin molding material
  • reference numeral 81 denotes an adhesive film for a semiconductor punched from an adhesive tape
  • 54 denotes a semiconductor element
  • 83 denotes a lead frame
  • 84 denotes a sealing material
  • 85 denotes a bonding wire.
  • 86 are bus bars.
  • Fig. 3 2A, 32B and 32C are bonding devices.
  • 87 is a punching die
  • 88 is a lead frame transport section
  • 6 1 is an adhesive tape punching and sticking area
  • 90 is a part of the adhesive tape
  • 91 is an adhesive tape-prill (adhesive tape unwinding part)
  • 92 is an adhesive tape (adhesive film for semiconductor).
  • 93) is an adhesive tape unwinding roller.
  • reference numeral 94 denotes an adhesive tape (adhesive film for semiconductor)
  • 95 denotes a male type (convex portion)
  • 96 denotes a female type (concave portion)
  • 97 denotes a film holding plate.
  • the adhesive tape 9 2 is continuously unwound from an adhesive tape reel (adhesive tape unwinding portion) 9 1, punches out an adhesive tape, and is punched into a strip shape at an attaching portion 8 9. It is adhered to the lead portion of the lead frame and is transported from the lead frame transport section as a lead frame with an adhesive film for semiconductor. The punched adhesive tape is carried out from an adhesive tape unwinding roller 93.
  • the semiconductor element is connected to the semiconductor element mounting support substrate using an adhesive tape.
  • Adhesive tapes are used simply for bonding and fixing, or when an adhesive that electrically connects electrodes by contact or via conductive particles is used according to the purpose, and when a support film is used. In some cases, it may consist solely of an adhesive.
  • the present invention relates to an adhesive tool for bonding and fixing an electronic component and a circuit board or circuit boards to each other, and pressing an adhesive for electrically connecting both electrodes to the circuit board.
  • Japanese Patent Application Laid-Open No. 2001-280405 discloses a reel wound on an adhesive tape having a base material coated with an adhesive.
  • This adhesive tape reel (hereinafter referred to as "adhesive reel") is mounted on an automatic bonding machine for use. It is described.
  • the automatic bonding machine includes a mounting section for an adhesive reel and a mounting section for an empty reel, a heating and pressing member provided between these reels, and a table for mounting a substrate.
  • the adhesive tape is pulled out from the adhesive reel onto the substrate, and the adhesive tape is heated and pressed from the back side of the base material by a heating and pressing member, and the adhesive is pressed onto the substrate.
  • the conventional automatic bonding machine is large, and when it is desired to partially press the adhesive on the substrate, when the area to press the adhesive is small, or when performing temporary pressing, etc. There is a problem that it is rather difficult to operate because of its large size.
  • the invention described in claim 59 is a bonding device that is small in size, can be operated with one hand, and can easily press the adhesive on a part of the substrate.
  • the purpose is to provide.
  • FIGS. 62A and 62B are views of the adhesive tool according to the first embodiment of the invention described in claim 59
  • FIG. 62A is a perspective view of the adhesive tool
  • FIG. 62B is a sectional view taken along the line A--A of FIG. 62A
  • FIG. 63 is a side view for explaining how to use the bonding tool shown in FIGS. 62A and 62B.
  • FIG. 4 is a process chart showing a method for manufacturing an adhesive tool.
  • the adhesive tool 111 includes one reel (supply reel) 3, the other reel (empty reel) 5, and a case 9 for accommodating them.
  • the adhesive tape 1 is wound around one of the reels 3, and one end 9 a of the adhesive tape 1 is fixed to the other reel 5.
  • the case 9 9 is formed in a size that can be gripped with one hand, and is viewed from the side.
  • the shape is substantially triangular with curved corners, so that it is easy to hold.
  • An opening 113 is formed at a corner of the substantially triangular case 99, and the adhesive tape 9 is exposed from the opening 113.
  • a heating member 111 is protruded from the opening 113, and the heating member 114 has a substantially triangular shape in a side view.
  • the adhesive tape 1 pulled out along the lower surface 13b is guided, and an electric heating plate 115 is provided on the lower surface side.
  • the shape of the heating member 1 14 is rod-shaped, and the heating member 1 14 is rotated when the adhesive tape 9 is pulled out by covering the heating member 1 14 with the electric heating plate 1 15.
  • the tape 9 can be pulled out smoothly. It is preferable to provide polytetrafluoroethylene-silicone rubber or both on the outside of the electric heating plate 115 because pressure is uniformly applied when the adhesive 9 is pressed.
  • the case 99 is formed by fitting half cases 99a and 99b, and one and the other reels 3 and 5 are housed in the case.
  • a guide 16 is further provided in the case to guide the movement of the adhesive tape 1.
  • a plate-shaped guide is formed on one of the bottom surfaces of either the case 99a or 7b, and when this adhesive is pressed against the circuit board while pressing the guide against the edge of the circuit board, it follows the circuit board. Adhesive can be pressed with high precision.
  • One gear 3 is fixed coaxially to one reel 3, and the other gear 1 17 is also fixed coaxially to the other reel 17 and one gear 11 6 and the other gear 1 17 mesh with each other, and when one reel 3 rotates and the adhesive tape 1 is pulled out, the other reel 17 pulls out the adhesive tape 1.
  • the substrate 9 is rotated by an amount and wound up.
  • the gear unit 118 is constituted by the one gear 116 and the other gear 117.
  • a case (power supply means) 1 19 for supplying electric power to the heating member 1 14 is provided on the side surface of the case 9 9. Dry electricity A pond is housed, and an adjustment circuit for the power supplied to the heating members 114 is housed.
  • the third case 1 19 is provided with a power switch 120 so that the ON / OFF operation can be performed by the finger of the hand holding the adhesive 1 1 1.
  • the adhesive tape 1 has an adhesive 11 applied to one surface of the substrate 9.
  • the adhesive tape 1 has a length of about 20 m and a width W of about 1.2 mm.
  • the base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Rate) etc., but is not limited to these.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, a vinyl ester type resin, an acryl type resin, and a silicone resin type as a thermosetting resin type. Is used.
  • the conductive particles 13 are dispersed in the adhesive 11.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like.
  • the above-mentioned conductive layer may be formed by coating or the like on a polymer nucleus material such as glass, ceramics and plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressurizing, and the distance between electrodes after connection is reduced. This is preferable because the contact area with the circuit increases and reliability is improved.
  • the core is made of polymers, it does not show a melting point like solder, so the softening state can be widely controlled by the connection temperature, and the electrode thickness This is more preferable because a connection member that can easily cope with variations in brightness and flatness is obtained.
  • a method of using the bonding tool 111 according to the present embodiment will be described.
  • Fig. 63 hold the adhesive tool 1 1 1 with one hand and turn ON the power switch 1 20.
  • the opening 1 13 where the adhesive tape 1 is exposed is pressed against the circuit board 27.
  • the opening 11 is provided with a heating member 1 14 on the base material 9 side of the adhesive tape 1, so that the adhesive tape 1 on the lower surface side of the heating member 1 1 1 is heat-pressed to circuit 27.
  • the adhesive 11 when the adhesive 11 is to be pressed at an arbitrary position on the circuit board 27, the adhesive 11 can be easily held by pushing it with one hand.
  • the adhesive 11 can be pressed. In this way, the adhesive 11 can be easily crimped.
  • the electronic component (wiring circuit) 37 when temporarily crimped on the circuit board 27, or when only a part of the circuit board 27 is When crimping parts (wiring circuit) 37 (This is particularly effective.
  • the electrodes of the circuit board 27 and the electrodes of the electronic component (wiring circuit) 37 are aligned and fully connected.
  • the electronic components (wiring circuit) 37 are placed on the adhesive 11 and, if necessary, polytetrafluoroethylene 3 9 Heating force!]
  • Pressure head 19 heats and presses electronic components (wiring circuit) 37 onto circuit board 27 (see Fig. 4).
  • the electrode 27a of the circuit board 27 and the electrode 37a of the electronic component (wiring circuit) 37 are connected and fixed.
  • the adhesive 1 11 is packed together with a dehumidifying material, and is preferably shipped at a controlled low temperature (15 ° C to 10 ° C).
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and more particularly to an adhesive tape wound in a reel shape. Material tape.
  • the conventional adhesive tape of this type has a width of about 1 to 3 mm, the length of the tape wound around the reel is about 50 m, and the adhesive tape is once applied. After being unwound from the reel and pressure-bonding the adhesive to a circuit board or the like, it is not used again.
  • the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased.
  • the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, in an electronic device manufacturing plant, there is a problem that the frequency of replacement of the adhesive reel is increased, and the replacement of the adhesive reel is troublesome, so that the production efficiency of the electronic device cannot be improved.
  • the invention described in claims 60 to 64 can increase the number of windings per reel and improve the production efficiency of electronic equipment.
  • the purpose is to provide adhesive tape.
  • FIG. 65A, FIG. 65B, FIG. 3, FIG. 4, FIG. 29, and FIG. 5 illustrate the first embodiment of the invention described in claims 60 to 64. Things.
  • FIG. 65A and FIG. 65B are views of the adhesive tape according to the first embodiment,
  • FIG. 65A is a perspective view showing an adhesive reel, and
  • FIG. 4 Fig. 65 is a sectional view taken along line AA in Fig. 5A.
  • the adhesive tape 1 is wound around a reel 3.
  • the reel 3 is provided with a winding core 5 and side plates 7 arranged on both width sides of the adhesive tape 1.
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • the base material 9 was a copper film (copper foil).
  • the thickness of substrate 9 (indicated by S in Fig. 65B) is 10 ⁇ , the tensile strength of substrate 9 at 25 ° C is 500 MPa, the thickness of substrate 9 with respect to adhesive 11 The ratio (S / T) was 0.5, and the thickness of the adhesive 11 was 20 Aim.
  • the surface roughness Rmax of the substrate 9 was 0.25 m.
  • a substrate using an aromatic polyamide film (Miktron) as the substrate 9 was also manufactured.
  • the thickness, the tensile strength, and the ratio (S / T) of the thickness of the base material 9 to the adhesive 11 of the base material 9 were prepared in the same manner as the copper film.
  • the reel 3 of the adhesive tape 1 and the take-up reel 17 are mounted on the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3 is hung on the guide bin 22.
  • the tape was attached to the take-up reel 17 and the adhesive tape 1 was unwound (arrow E in FIG. 3).
  • the adhesive tape 1 is placed on the circuit board 2 1, and the adhesive tape 1 is applied to the base material 9 side by the heating / pressing head 19 placed between both reels 3 and 17.
  • the adhesive 11 was pressure-bonded to the circuit board 21. Thereafter, the substrate 9 was wound on a take-up reel 17.
  • a wiring circuit (or electronic component) 23 is arranged on the adhesive 11 crimped to the circuit board 21, and a polytetrafluoroethylene material 2 is used as a cushioning material.
  • the wiring circuit 23 was heated and pressed on the circuit board 21 by the heating and pressing head 19 through 4.
  • the electrode 21 a of the circuit board 21 was connected to the electrode 23 a of the wiring circuit 23.
  • the connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment the adhesive 11 is pressure-bonded over the entire periphery of the PDP. It is clear that the amount of the adhesive 11 used at one time is significantly higher than in the past. Therefore, the amount of the adhesive tape 1 wound on the reel 3 increases, and the adhesive tape 1 wound on the reel 3 is wound on the winding reel 17 in a relatively short time, and the reel 3 is empty. become.
  • the base material 9 was easy to handle like the conventional adhesive tape 1 and the base material 9 was used. There was no stretching or cutting. Since the thickness of the base material 11 is thinner than that of the conventional product (50 m), the number of windings of the adhesive tape is increased, the frequency of reel replacement is reduced, and productivity is improved.
  • the adhesive tape 1 was prepared. As described above, when actually used, no troubles such as elongation of the base material 9 and cutting occurred.
  • the ratio (S / T) of the thickness of the base material 9 to the adhesive 11 is set to 0.
  • the adhesive tape 1 was produced and actually used as described above. There were no problems such as cutting.
  • These inventions relate to a method for forming an adhesive material of an adhesive tape for bonding and fixing an electronic component and a circuit board or circuit boards to each other and electrically connecting both electrodes. Also, the present invention relates to a method for forming an adhesive tape for an adhesive tape used in a semiconductor device for attaching and fixing a semiconductor element (chip) to a support substrate for fixing a lead frame, a die of a lead frame, and a support substrate for mounting a semiconductor element. The present invention relates to a method for forming an adhesive tape wound on an adhesive tape reel.
  • Adhesive tape has been used as a method for doing this. Adhesive tapes are also used for lead fixing tapes for lead frames, LOC tapes, die-bonding tapes, adhesive films such as micro BGA and CSP, and are used to improve the overall productivity and reliability of semiconductor devices. Is done.
  • Japanese Patent Application Laid-Open No. 2001-284005 discloses an adhesive tape in which an adhesive is applied to a base material and wound on a reel.
  • This type of conventional adhesive tape has a width of about 1 to 3 mm, and the length of the tape wound around a reel is about 50 m.
  • adheresive reel to the adhesive device, and attach the starting end of the adhesive tape. Pull it out and attach it to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive reel using a heating and pressing head, and the remaining winding is wound on a winding reel. I have.
  • the winding diameter the diameter of the tape around which the adhesive tape is wound (hereinafter referred to as the “winding diameter”) becomes large, and it is difficult to mount the tape on an existing bonding apparatus, and the existing bonding apparatus can be used. It may disappear.
  • the invention described in claims 65 to 66 can improve the production efficiency of electronic devices without increasing the winding diameter of the adhesive tape. It is an object of the present invention to provide a method of forming an adhesive tape that can be used.
  • FIGS. 66A and 66B are diagrams showing an adhesive forming step of the adhesive tape according to the first embodiment, and FIG.
  • the process of winding one of the substrates on a reel for winding FIG. 66 is a cross-sectional view showing an overlapped portion of the adhesives in FIG. 66, and FIG. 67 shows a step of forming the adhesive on the adherend in the bonding apparatus.
  • FIG. 68 is a perspective view of a reel around which an adhesive tape is wound
  • Fig. 4 is a cross-sectional view showing the bonding between circuit boards
  • Fig. 29 shows the use state of the adhesive in the PDP.
  • FIG. 5 is a perspective view
  • FIG. 5 is a process chart showing a method for manufacturing an adhesive tape.
  • Adhesive tape 1 is wound around reels 3 and 1 2 1, respectively, and each reel 3 and 1 2 1 has side plates arranged on both width sides of core 5 and adhesive tape 1. 7 are provided.
  • the adhesive tape 1 includes a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • the base material 9 is made of 0 PP (stretched polypropylene), polytetrafluoroethylene, silicon-treated PET (polyethylene terephthalate) or the like from the viewpoint of strength and adhesive releasability. However, it is not limited to these.
  • thermoplastic resin a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acryl resin type, and a silicon resin type as a thermosetting resin type.
  • conductive particles 13 may be dispersed.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like.
  • the conductive layer may be formed by coating the conductive layer on a polymer core material such as non-conductive glass, ceramics, or plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressing, the distance between electrodes after connection decreases, This is preferable because the contact area with the circuit is increased and the reliability is improved.
  • polymers are used as cores, they do not show a melting point like solder, so the state of softening can be widely controlled by the connection temperature This is more preferable because a connection member that can easily cope with variations in electrode thickness and flatness can be obtained.
  • the bonding apparatus 15 is equipped with reels 3 and 12 of two adhesive tapes 1 and reels 17 and 18 for winding, and one of the reels.
  • the tip of the adhesive tape 1 wound on 3 is hung on the guide bin 22 and attached to one of the take-up reels 17 to feed out the adhesive tape 1 (arrow E in FIG. 66A).
  • the tip of the adhesive tape 1 wound on the other reel 12 1 is also attached to the other take-up reel 18, and the adhesive tape 1 is paid out.
  • one adhesive tape 1 is arranged on the circuit board 21, and the adhesive tape 1 is pressed from the base material 9 side by the heating and pressurizing head 19, and the adhesive is applied. 11 is formed by crimping the circuit board 21 as an adherend. Thereafter, the base material 9 is wound on a take-up reel 17.
  • a wiring circuit (or electronic component) 23 is placed on the adhesive 11 crimped on the circuit board 21, and a polytetrafluoroethylene material 2 is used as a cushion material.
  • the wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via 4. Thereby, the electrode 2 la of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • FIG. 29 shows a connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment, and the adhesive 11 is press-bonded over the entire periphery of the PDP 26.
  • the bonding of the adhesive 11 of one adhesive tape 1 and the bonding of the other adhesive tape 1 is performed.
  • the adhesive 1 1 is overlaid to make the desired thickness of the adhesive 1 1, and then the adhesive 1 1 is pressed onto the circuit board 2 1, so that the thickness of each adhesive tape 1 is halved be able to. Therefore, the number of windings of the adhesive tape 1 per reel can be increased, and the amount of adhesive usable in one exchange operation can be greatly increased. Therefore, the replacement work of the new adhesive tape 1 is reduced, and the production efficiency of electronic devices is increased.
  • the adhesive 11 mixed with the resin and conductive particles 13 is applied to the base material (separation material) unwound from the unwinding machine 25 by the co-existing one 27 as shown in the following. It is applied to a half thickness, dried in a drying oven 29, and then wound up by a winder 31.
  • the raw material of the wound adhesive tape 1 is cut into a predetermined width by a slit 33 and wound on a winding core 5, and then the side plates 7, 7 are wound on the winding core 5 from both sides. Attached, packaged with dehumidifying material, and shipped at a controlled low temperature (15 ° C to 110 ° C).
  • the adhesive tape 1 may include a bonding agent described later in the adhesive 11.
  • Both adhesive tapes 1b containing no hardener were manufactured, and adhesive tape 1a containing a hardener and other adhesive tapes 1b were stacked as shown in Fig. 69A.
  • they may be integrated, and the stacked products may be pressure-bonded to the circuit board 21.
  • the adhesive 11a of one adhesive tape 1a contains a curing agent
  • the adhesive 11b of the other adhesive tape 1b does not require a curing agent. Therefore, the adhesive tape 1b of the adhesive 11b containing no stiffener does not require low-temperature management. Therefore, the number of the adhesive tapes 1a that need to be controlled at a low temperature can be reduced, and the transport and storage of the adhesive tape can be efficiently controlled.
  • the adhesive is an epoxy resin
  • imidazole, amide imide, hondium salt, polyamines, polymercapone, and the like can be given as examples of epoxy resin stiffeners.
  • the adhesive 11a of one adhesive tape la containing a curing agent contains conductive particles 13 and has a two-layer structure. Since the conductive particles are not contained on the side to be crimped, the conductive particles do not flow out from between the circuits facing each other with the flow of the resin, and the conductive particles 13 and the electrode 21 a are heated and pressurized. It can be reliably held between the electrode 23a.
  • the adhesive 11 includes the conductive particles 13; however, the adhesive 11 may not include the conductive particles 13.
  • These inventions include, for example, liquid crystal panels, PDP panels, EL panels, An anisotropic conductive material tape for bonding and fixing electronic components such as pair chip mounting to a circuit board and circuit boards, and for supplying an anisotropic conductive material for electrically connecting both electrodes. It relates to the winding form of the material.
  • an anisotropic conductive material which is a film adhesive
  • the connection between electronic components and circuit boards and between circuit boards is performed by applying heat and pressure.
  • the film-like adhesive is mixed with conductive particles for obtaining conduction between the electrodes.
  • the resin a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin, A photocurable resin is used (for example, refer to Japanese Patent Application Laid-Open No. 55-14007).
  • Typical resins include styrene resin and polyester resin as thermoplastic resins, and epoxy resin, silicone resin, and acrylic resin as thermosetting resin.
  • thermoplastic resins include styrene resin and polyester resin as thermoplastic resins, and epoxy resin, silicone resin, and acrylic resin as thermosetting resin.
  • Heating and pressurizing is required to connect both thermoplastic resin type and thermosetting resin type. This is because in the case of a thermoplastic resin system, the resin is allowed to flow to obtain an adhesion to an adherend, and in the case of a thermosetting resin system, the resin is further subjected to a hard reaction.
  • a mixed system of a thermoplastic resin and a thermosetting resin and a thermosetting resin system have become mainstream. Also, photocurable resin systems that can be connected at low temperatures have begun to be used industrially.
  • the anisotropic conductive material has been supplied in the form of a reel in which a film-shaped adhesive is wound on a core material having a circular cross section, and the time required to replace the reel has hindered an improvement in productivity.
  • the width of the anisotropic conductive material has been narrowing along with the narrowing of the frame of the liquid crystal panel, and in the conventional reel shape wound in the same circular core, the winding collapse has occurred.
  • the yield in the process was deteriorating.
  • An object of the present invention is to provide an anisotropic conductive material tape that contributes to an improvement in productivity by eliminating a decrease in productivity.
  • FIG. 70 is a schematic view showing a first embodiment of the invention described in claims 67 to 72.
  • the anisotropic conductive material tape of the present embodiment has two layers of a film-like adhesive 11 and a base film (base material) 9 having both surfaces peeled off. It is formed by winding and laminating an anisotropic conductive material having a structure in a number of turns in the longitudinal direction of the core material 5, and FIG. 70 shows a supply form of the anisotropic conductive material.
  • side plates 7 are provided at both ends of the core material 5.
  • the anisotropic conductive material tape is composed of a base film 9 and a film-like adhesive 11 which is an anisotropic conductive material applied on the base film 9, and in the anisotropic conductive material tape, It is used to connect high-definition electronic components, and prevents inorganic and organic foreign substances and contamination. 9 is outside the adhesive.
  • anisotropic conductive material For connection using an anisotropic conductive material, improvement in tact time is required, and rapid transferability of the anisotropic conductive material is required.
  • the anisotropic conductive material is wound many times in the longitudinal direction of the core material (winding core) 5 with the side plate 7 and laminated and wound into a thread-like shape, so that it does not collapse. It is possible to supply an anisotropic conductive material having a length. For this reason, the time interval for replacing the anisotropic conductive material tape can be lengthened, and productivity can be improved.
  • the tensile strength of the substrate film 9, and 1 2 kg / mm 2 or more, elongation at break of the substrate film 9 to 6 0-2 0 0% Is preferred.
  • the film adhesive 11 constituting the anisotropic conductive material is not transferred to the connection member such as a circuit board in the process of transferring the film adhesive. It is possible to prevent stretch, thinness, and narrow width of 1 1.
  • the thickness of the base film 9 is desirably 100 zm or less from the viewpoint of handling and environment. If the thickness of the base film 9 is thin, the above-described effects are inferior. Therefore, the thickness of the base film 9 is preferably 0.5 ⁇ or more.
  • the base film 9 used for the anisotropic conductive material tape silicon and fluorine were peeled from the surface of the strength and the releasability of the adhesive constituting the anisotropic conductive material.
  • ⁇ polypropylene
  • ⁇ ⁇ ⁇ stretched polypropylene
  • ⁇ ⁇ ⁇ polyethylene terephthalate
  • the peeling treatment of the base film 9 can be easily performed by performing a silicon or fluorine treatment. If the peeling treatment is performed only on one side of the base film 9, the peeling treatment is performed on both sides of the film 9.
  • the film-shaped adhesive 11 is made of epoxy resin, which is a highly reliable thermosetting resin, and is designed to reduce the stress of the adhesive and to improve the compatibility of the adhesive.
  • a certain silicone resin type a radical type that can be connected at a lower temperature and in a shorter time than these, is used, but the film-like adhesive 11 is not limited to these.
  • the radical adhesive 11 an acrylic adhesive is mainly used.
  • FIG. 71 is a schematic diagram illustrating a second embodiment of the invention described in claims 67 to 72.
  • the same components as those in FIG. 70 are denoted by the same reference numerals, and detailed description will be omitted.
  • the anisotropic conductive material tape of the present embodiment has two types of base films and is configured to sandwich an adhesive therebetween. Except for using the material, it has the same configuration as the anisotropic conductor tape of the first embodiment. That is, as shown in FIG. 71, the anisotropic conductive material in the present embodiment is composed of a film-like adhesive 11 and two kinds of base materials 9 a and 9 b obtained by peeling off the surface of the adhesive 11. It has a layer structure. [0861] When the adhesive constituting the anisotropic conductive material is soft, deformation of the adhesive by the next base film on the winding core side can be prevented.
  • the tensile strength of the substrate film 9 a, 9 b is a physical property value of the substrate film 9 a, 9 b and 1 2 k gZmm 2 or more, the substrate film of 9 a, 9 b It is the same as in the first embodiment that the breaking elongation is preferably set to 60 to 200%. Thereby, physical strength is obtained in the base films 9a and 9b, and it is possible to prevent the base film 9a and 9b from becoming thinner and becoming thinner in the width direction due to the elongation of the film-like adhesive. Further, the thickness of the base materials 9a and 9b is preferably set to 100 zm or less, so that handling and environmental measures can be taken.
  • a solution of 30% by weight of ethyl acetate was prepared, and 5% by volume of Ni powder having an average particle size of 2.5 ⁇ m was added thereto. Then, 50 g of a phenoxy resin (high-molecular-weight epoxy resin), 20 g of an epoxy resin and 5 g of imidazole were added as a film-forming material to the above-mentioned ethyl acetate solution to obtain a solution for forming an adhesive.
  • a base film was prepared on both sides of a transparent polyethylene terephthalate film (break strength: 25 kg / mm 2 , elongation at break: 130%) with a transparent blue color and a thickness of 5 ⁇ . Then, the above solution was applied to one surface of the base film using a roll coater and dried at 110 ° C. for 5 minutes to obtain a roll of an anisotropic conductive material film having a thickness of 5 ⁇ .
  • the anisotropic conductive material wound in a thread form that is, the anisotropic conductive material tape is attached to an automatic anisotropic conductive material tape crimping machine, and when the anisotropic conductive material is supplied, the anisotropic conductive material is removed. Good results were obtained in the transferability and elongation tests. Moreover, the number of reel installations was reduced, and the time required for installation, transferability, and repetition of the sticking work due to adhesive elongation were eliminated. Improved.
  • Example 2 In the same manner as in Example 1, a roll of anisotropic conductive material tape was produced. And The laminate of the substrate film and the adhesive, yet the other one of thickness 2 5 ⁇ M Poryechi Renterefu evening rate base film (breaking strength 2 5 kg Roh mm 2, elongation at break 1 3 0%), and two Lamination was carried out so as to sandwich the adhesive between the base films to obtain a roll of anisotropic conductive material film having a three-layer structure. In the same manner as in Example 1, the roll of this film is slit to a width of 1.5 mm, and is wound on a core material (winding core) having a side plate with a diameter of 48 mm and a width of 100 mm. By winding in a square shape, an anisotropic conductive material tape having a length of 300 m was obtained.
  • a core material winding core
  • Example 3 As in Example 1, good productivity was obtained. (Example 3)
  • Example 2 Same as Example 1, except that a polytetrafluoroethylene film (rupture strength: 4.6 kg / mm elongation at break: 350%) with a thickness of 5 ⁇ was used as the base film
  • a roll of an anisotropic conductive material film was obtained, and further, as in Example 1, the roll of this film was slit to a width of 1.5 mm, and a diameter of 48 mm with a side plate was attached.
  • An anisotropic conductive material tape having a length of 300 m was obtained by winding the core material (winding core) having a diameter of 100 mm in a thread form. In this case as well, it could be wound around 3 O O m in length.
  • a roll of an anisotropic conductive material film was obtained in the same manner as in Example 1, and the roll of this film was slit into a width of 1.5 mm as in Example 1 to obtain a conventional film.
  • An anisotropic conductive material tape having a length of 10 Om was wound on the reel in the same circular core shape.
  • the contact T / JP2003 / 009694 The end of the unwound adhesive tape (one adhesive tape) and the newly installed adhesive tape (the other adhesive tape) using the adhesive of the adhesive tape Since the adhesive reel is replaced after bonding to the start end, it is easy to mount a new adhesive tape on the bonding machine.
  • One adhesive tape and the other adhesive tape have high adhesive strength because the adhesive surfaces are overlapped and adhered.
  • the end of the unwound adhesive tape and the start of the newly attached adhesive tape are fixed with the locking pins. Connection is easy.
  • every time a new adhesive reel is replaced there is no need to replace the take-up tape, attach the start end of the new adhesive tape to the take-up reel, and set guide bins or the like on a predetermined path. The replacement time for new adhesive reels is reduced, and the production efficiency of electronic equipment is increased.
  • one claw portion of the locking member is locked to the end of one adhesive tape, and then the other of the locking member is locked. Since the claws are locked to the start end of the other adhesive tape and the two are connected to each other, the connection is easy.
  • connection is made in a state where the end of one adhesive tape and the start of the other adhesive tape are abutted, it is not necessary to overlap the tapes with each other, and the necessary minimum position Can be connected, so that the adhesive tape can be prevented from being wasted.
  • connection can be made only by sandwiching the overlapped portion of the end of one adhesive tape and the start of the other adhesive tape with a clip. Therefore, connection work is easy.
  • the adhesive reel is replaced by bonding the parts, and a new adhesive Easy mounting of reels.
  • the time required to replace a new adhesive reel is reduced. , Increases production efficiency.
  • connection area can be increased by forming the concave and convex portions in the connection portion, and the adhesive material tape pulling direction (longitudinal direction) in the connection portion can be obtained.
  • adhesive material tape pulling direction longitudinal direction
  • connection can be achieved.
  • the adhesive exudes to the inner periphery of the through hole, and the bonding area of the adhesive increases, so that the connection strength can be further increased.
  • the completed adhesive tape (one adhesive tape) and a new adhesive tape (the other adhesive tape) are used. Since it is only necessary to connect and change reels, it is easy to mount a new adhesive reel on the bonding machine. Also, there is no need to replace the take-up reel every time a new adhesive reel is replaced, to attach the start end of the new adhesive tape to the take-up reel, or to attach the adhesive tape to the guide 3i. Reel replacement time is reduced and the production efficiency of electronic equipment is increased. 2003/009694
  • the processing agent used for the base material of the adhesive tape is a silicone resin, and by using a silicone adhesive for the adhesive tape, the difference in surface tension between the two is reduced to increase the adhesion. Because of this, it is possible to realize the bonding between the two, which was difficult in the past.
  • the same effects as those of the invention set forth in claim 14 can be obtained, and the surface of the adhesive surface of the silicone adhesive tape can be obtained.
  • the difference between the tension and the surface tension of the silicone-treated substrate in the adhesive tape to 10 mN / mdOdyne / cm) or less, a strong adhesion can be obtained, and the two can be securely bonded.
  • the same effects as those of the invention described in claim 15 can be obtained, and the adhesive strength can be further reduced to 100 g / 2.
  • the thickness By setting the thickness to 5 mm or more, it is possible to more firmly bond one and the other adhesive tapes to both adhesive surfaces.
  • the same effect as that of the invention described in claim 16 can be obtained, and one and the other adhesive tapes can be used. Since the connection is made on both sides, a stronger connection can be obtained.
  • the double-sided silicone adhesive tape of the double-sided adhesive is used, the double-sided silicone adhesive tape is provided between one adhesive tape and the other adhesive tape.
  • the two can be bonded (or in close contact) with each other, so that the connection between them is simple and easy.
  • the end of the adhesive tape that has been unwound and the start of the adhesive tape to be newly attached are pasted. Connection is easy because it is fixed with resin adhesive. In addition, there is no need to replace the take-up tape, attach the starting end of the new adhesive tape to the take-up reel, or set guide bins or the like on a predetermined path each time a new adhesive reel is replaced. The time required to change the adhesive reel is reduced, and the production efficiency of electronic equipment is increased. [0899] According to the invention set forth in claim 20, the same operation and effect as those of the invention set forth in claim 19 are exhibited, and the thermosetting resin is used as the resin adhesive. In addition, a resin adhesive suitable for connecting the adhesive tapes can be selected from the group of the photocurable resin and the hot melt adhesive, and the connection strength between the adhesive tapes can be increased.
  • the resin adhesive according to claim 19 or claim 20 is supplied into the bonding apparatus. Since a filling machine is provided, there is no need to prepare a separate filling machine, and wasteful connection work can be prevented.
  • the same effect as that of the invention described in claim 22 can be obtained, and the other end of the adhesive tape and the other end can be provided. Since the start end of one adhesive tape is connected with the connecting tape, after the unwinding of the adhesive tape of one adhesive tape reel is completed, the adhesive tape of the other winding part is wound. Eliminating the work of attaching to take-up reels makes the production efficiency of electronic equipment even higher.
  • the connecting tape is automatically wound on the take-up reel. Then, the adhesive tape can be sequentially fed from the next winding portion.
  • the connecting tape is detected by the tape detecting means, the connecting tape is automatically wound on the take-up reel until the connecting tape passes through the crimping portion. Can be.
  • the connecting portion between the terminal end of one adhesive tape and the start end of the other adhesive tape is formed by connecting the stopper with an adhesive. Since the tape is covered with the tape, the appearance is good, and it is possible to prevent the fastener at the connection portion from contacting the adhesive tape and damaging the adhesive tape or the adhesive device.
  • connection portion detecting means detects the connection portion
  • one of the adhesive tapes is wound until the connection portion passes through the crimping portion. Since it is wound on the take-up reel, it is possible to prevent a problem that the connection portion comes to the crimping portion and the crimping operation is performed. Further, one adhesive tape is automatically wound on the winding reel until the connection portion passes through the crimping portion, so that the time and effort for winding can be reduced.
  • connection portion can be detected with a simple configuration.
  • the detection accuracy can be improved by using these means.
  • a plurality of adhesives can be used one by one in sequence, so that it can be used on one reel without increasing the number of tape windings.
  • the amount of adhesive required can be more than doubled.
  • the number of reels to be produced can be reduced, so that the use amount of the reel material and the moisture prevention material can be reduced, and the production cost can be reduced.
  • the adhesive tape as set forth in claim 30 can be easily manufactured.
  • two adhesive tapes can be manufactured at the same time, so that the manufacturing efficiency is excellent.
  • the adhesive is heated. Since the adhesive tape is applied to the entire surface of one side of the base material, adhesive tape can be manufactured using existing equipment as it is.
  • the width of the adhesive to be crimped to the circuit board can be arbitrarily set by changing the heating area, and the degree of freedom of the width of the adhesive to be crimped is high.
  • the number of windings of the tape can be increased.
  • the amount of adhesive that can be used on one reel can be more than doubled.
  • the width of the adhesive tape is equal to or greater than the length of one side of the circuit board. The number of wound adhesive tapes can be reduced.
  • [0 9 2 1] Increase the amount of adhesive used without increasing the number of turns of adhesive tape. 3 009694 Since the width can be increased, it is possible to prevent buckling and prevent blocking, damage and cutting of the base material. Also, in electronic component manufacturing plants, the number of times that new adhesive tape needs to be changed is reduced, thereby increasing manufacturing efficiency.
  • the amount of adhesive per reel can be increased, so that the amount of use of the reel material and the moisture prevention material can be reduced, and the production cost can be reduced.
  • the same effect as the invention described in claim 35 can be obtained, and the adjacent adhesive strips are separated from each other. Therefore, the adhesive can be easily separated from the substrate one by one and pressed.
  • two adhesive tapes according to claim 36 can be simultaneously manufactured using existing equipment. Excellent rate.
  • the effects described in claims 35 to 37 can be obtained, and the circuit board can be rotated. In other words, it can be moved to the position of one adhesive tape and the other adhesive tape, and the adhesive can be easily pressed on the four circumferences of the circuit board, resulting in good work efficiency.
  • the adhesive tape when the adhesive is pressure-bonded to the periphery of the circuit board, the adhesive tape is strip-shaped along the width direction. By applying heat and pressure, pressure bonding of the adhesive to the circuit board can be facilitated, and work efficiency is good. [0992] Also, since the adhesive may be applied to the entire surface of the adhesive tape, the adhesive tape can be manufactured using existing equipment as it is.
  • the width of the adhesive to be press-bonded to the circuit board can be arbitrarily set by changing the heating / pressing region, and the degree of freedom of the pressure-sensitive adhesive width is high.
  • the amount of the adhesive can be increased without increasing the number of windings, so that it is possible to prevent the collapse of the winding and to reduce the amount of the adhesive. Effects such as prevention of blocking due to oozing and prevention of adverse effects due to elongation of the base material can be obtained.
  • the adhesive sheet is formed by arranging at least two adhesives in the width direction and using one adhesive at a time.
  • One reel can be used for at least two reels, and the amount of adhesive that can be used on one reel can be greatly increased without increasing the number of wound adhesive tapes.
  • the same effect as that of the invention described in claim 42 can be obtained, and the adjacent adhesive strips are separated from each other. Therefore, the adhesive can be easily separated from the substrate one by one and pressed.
  • the same effect as that of claim 42 can be obtained, and the adhesive tape is formed by applying an adhesive to the entire surface of one side of It is easy to manufacture because only the slit is formed.
  • the adhesive tape has a base. Adhesive can be applied to the entire surface of the material, and adhesive tape can be manufactured using existing equipment as it is.
  • the width of the adhesive to be bonded to the circuit board can be set arbitrarily by changing the heating and pressing area, and the degree of freedom of the width of the bonded adhesive is high.
  • the same effect as that of claim 45 can be obtained, and further, the same effect as the invention described in claim 1 can be obtained.
  • the amount of the adhesive can be increased without increasing the number of windings, it is possible to prevent the collapse of the winding, to prevent the blocking due to the exudation of the adhesive, and to prevent the adverse effect due to the elongation of the base material. be able to.
  • the cassette is only turned upside down when the use of one reel is completed, so the next installation is easy. Since it is a cassette, it is easy to handle and has good workability for installation and replacement.
  • the end of the unwound adhesive tape is newly mounted by using the adhesive tape base material. Since the adhesive reel is replaced by bonding the adhesive tape to the start end, it is easy to mount a new adhesive reel on the bonding machine. In addition, there is no need to replace the take-up reel and attach the start end of the new adhesive reel to the take-up reel every time a new adhesive reel is replaced. Production efficiency is increased.
  • the portion of the base material which has been subjected to the surface treatment with the release agent is removed, and the base material is wound using the adhesive of the adhesive tape.
  • Adhesive tape is replaced by bonding the end of the adhesive tape that has been dispensed to the start of the adhesive tape to be newly installed, so that a new adhesive reel is mounted on the bonding machine. Can be easily done.
  • the same effects as those of the invention set forth in claim 50 can be obtained, and plasma discharge, ultraviolet irradiation, and laser irradiation can be performed. Since the release agent is removed using any one of the methods, the release agent can be removed accurately and in a short time.
  • the adhesive tape reel has a plurality of winding portions (winding portions) of the adhesive tape obtained by winding the adhesive tape around the reel. The installation of the adhesive tape was completed for one of the winding sections.
  • the side plate of the reel is provided with a storage portion for drying agent. It has the same function and effect as the invention, and reliably removes moisture inside the adhesive tape reel from the inside.
  • the cover member that covers the periphery of the adhesive tape wound on the reel is detachably provided on the reel, the adhesive material is provided.
  • the tape is not directly exposed to the outside air, and the adhesive tape prevents dust and the adverse effects of the humidity of the outside air. Therefore, even when a plurality of winding portions are provided, deterioration of the quality of the adhesive tape can be prevented by providing a cover member on an unused winding portion.
  • the cover member is detachably provided, the adhesive tape can be easily pulled out from the adhesive tape reel by removing the cover member.
  • the adhesive tape can be fed directly from the adhesive tape reel without removing the cover member of the adhesive tape reel.
  • the invention set forth in any one of claims 52 to 56 is defined by the invention set forth in claim 52 or claim 58.
  • the same effect is achieved, especially when the adhesive tape is an adhesive tape in which the adhesive for electrode connection that connects the opposing electrodes is applied to five substrates, or the adhesive tape is used to fix the lead frame.
  • Support substrate or semiconductor device mounting support substrate or lead frame It is particularly useful for an adhesive tape for connecting a die to a semiconductor element.
  • the case is gripped with one hand, the opening where the adhesive tape is exposed is pressed against the circuit board, and the heating member is pressed from the base material side. Since the adhesive is heat-pressed to press the adhesive on the circuit board, it is compact and operable with one hand, and can easily press the adhesive when pressing the adhesive on a part of the substrate.
  • the number of windings per reel can be increased, and the amount of adhesive usable on one reel can be increased. be able to. Further, if the adhesive tape of the present invention is used, the number of windings per reel is large, so that in an electronic component manufacturing factory, the number of times of replacement of a new adhesive tape can be reduced, and work efficiency can be improved. Furthermore, in the production of the adhesive tape, the number of reels to be produced can be reduced, so that the use amount of the reel material and the moisture prevention material can be reduced, and the production cost can be reduced.
  • the claim 60 JP2003 / 009694 and the invention according to any one of claims 63 to 63 have the same effect, and by setting the surface roughness R max of the base material to 0.5 ⁇ or less, the base material The surface becomes smooth, and the adhesive is easily separated from the base material when the adhesive is pressed against the circuit board.
  • the adhesive of one adhesive tape and the adhesive of the other are used in the step immediately before forming the adhesive on the adherend.
  • An adhesive is formed on the adherend after the desired adhesive thickness is formed by superposing the adhesive on the tape, so that the thickness of each adhesive tape can be reduced. Although the number of windings of the tape is increased, the winding diameter of the adhesive tape per reel can be reduced.
  • any one of claims 67 to 72 it has good transferability (sticking property) to a member to be connected, It has good connection reliability, thereby increasing the yield in the process and improving workability. It is possible to supply a longer anisotropic conductive material tape than before, and productivity and workability are improved. Is improved.

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  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
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PCT/JP2003/009694 2002-07-30 2003-07-30 接着材テープ、その接続方法、製造方法、圧着方法、接着材テープリール、接着装置、接着剤テープカセット、これを用いた接着剤の圧着方法並びに異方導電材テープ WO2004011356A1 (ja)

Applications Claiming Priority (34)

Application Number Priority Date Filing Date Title
JP2002-221225 2002-07-30
JP2002221225A JP2004059776A (ja) 2002-07-30 2002-07-30 異方導電材テープ
JP2002-370622 2002-12-20
JP2002370623A JP4032961B2 (ja) 2002-12-20 2002-12-20 接着材テープの接続方法
JP2002-370624 2002-12-20
JP2002370624A JP4477823B2 (ja) 2002-12-20 2002-12-20 接着剤テープの接続方法及び接着剤テープ接続体
JP2002370622A JP2004196540A (ja) 2002-12-20 2002-12-20 接着材テープの接続方法
JP2002-370623 2002-12-20
JP2002371887A JP2004203944A (ja) 2002-12-24 2002-12-24 接着材テープの接続方法及び接着装置
JP2002-371888 2002-12-24
JP2002-371887 2002-12-24
JP2002371889A JP4608839B2 (ja) 2002-12-24 2002-12-24 接着材テープリール及び接着装置
JP2002371888A JP4239585B2 (ja) 2002-12-24 2002-12-24 接着剤テープの接続方法及び接着剤テープ接続体
JP2002-371889 2002-12-24
JP2003002095A JP2004210524A (ja) 2003-01-08 2003-01-08 接着具
JP2003-2094 2003-01-08
JP2003-2092 2003-01-08
JP2003-2093 2003-01-08
JP2003-2095 2003-01-08
JP2003002094A JP2004210523A (ja) 2003-01-08 2003-01-08 接着剤テープカセット及び接着剤テープカセットを用いた接着剤の圧着方法
JP2003002092A JP2004211017A (ja) 2003-01-08 2003-01-08 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法
JP2003002093A JP4333140B2 (ja) 2003-01-08 2003-01-08 接着剤テープの製造方法
JP2003118287A JP4654566B2 (ja) 2003-04-23 2003-04-23 接着剤テープの接続方法及び接着剤テープ接続体
JP2003118286A JP2004323621A (ja) 2003-04-23 2003-04-23 接着材テープ
JP2003-118286 2003-04-23
JP2003-118287 2003-04-23
JP2003130197A JP4238626B2 (ja) 2003-05-08 2003-05-08 接着剤テープリール、接着装置、接続方法及び接着剤テープ接続体
JP2003130196A JP2004331833A (ja) 2003-05-08 2003-05-08 接着材テープリール
JP2003-130197 2003-05-08
JP2003-130196 2003-05-08
JP2003-176322 2003-06-20
JP2003-176321 2003-06-20
JP2003176322A JP2005330297A (ja) 2003-06-20 2003-06-20 接着材テープの接着材形成方法
JP2003176321A JP2005330296A (ja) 2003-06-20 2003-06-20 接着材テープの接続方法

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