CN104152075B - 粘接材料带及其压接方法 - Google Patents
粘接材料带及其压接方法 Download PDFInfo
- Publication number
- CN104152075B CN104152075B CN201410378540.3A CN201410378540A CN104152075B CN 104152075 B CN104152075 B CN 104152075B CN 201410378540 A CN201410378540 A CN 201410378540A CN 104152075 B CN104152075 B CN 104152075B
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- adhesive material
- bonding agent
- material tape
- spool
- tape
- Prior art date
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- Expired - Lifetime
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- 239000000463 material Substances 0.000 title claims abstract description 1791
- 238000000034 method Methods 0.000 title claims abstract description 237
- 238000002788 crimping Methods 0.000 title claims abstract description 56
- 239000000853 adhesive Substances 0.000 title abstract description 1324
- 230000001070 adhesive effect Effects 0.000 title abstract description 1321
- 230000008859 change Effects 0.000 claims abstract description 13
- 239000007767 bonding agent Substances 0.000 claims description 959
- 239000002245 particle Substances 0.000 claims description 146
- 229920005989 resin Polymers 0.000 claims description 139
- 239000011347 resin Substances 0.000 claims description 139
- 229920001187 thermosetting polymer Polymers 0.000 claims description 67
- 229920001296 polysiloxane Polymers 0.000 claims description 66
- 238000007731 hot pressing Methods 0.000 claims description 56
- 229920005992 thermoplastic resin Polymers 0.000 claims description 56
- 239000000758 substrate Substances 0.000 claims description 55
- 238000007906 compression Methods 0.000 claims description 42
- -1 polypropylene Polymers 0.000 claims description 40
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 34
- 230000006835 compression Effects 0.000 claims description 34
- 239000003292 glue Substances 0.000 claims description 34
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 33
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 33
- 229920002521 macromolecule Polymers 0.000 claims description 27
- 239000003822 epoxy resin Substances 0.000 claims description 24
- 229920000647 polyepoxide Polymers 0.000 claims description 24
- 238000002156 mixing Methods 0.000 claims description 20
- 239000011521 glass Substances 0.000 claims description 19
- 229910052799 carbon Inorganic materials 0.000 claims description 18
- 239000000919 ceramic Substances 0.000 claims description 17
- 229910002804 graphite Inorganic materials 0.000 claims description 17
- 239000010439 graphite Substances 0.000 claims description 17
- 239000004743 Polypropylene Substances 0.000 claims description 16
- 229920001155 polypropylene Polymers 0.000 claims description 16
- 229920001567 vinyl ester resin Polymers 0.000 claims description 11
- 230000004044 response Effects 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 239000012943 hotmelt Substances 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 113
- 238000005096 rolling process Methods 0.000 abstract description 23
- 238000004804 winding Methods 0.000 description 250
- 239000003795 chemical substances by application Substances 0.000 description 89
- 230000008878 coupling Effects 0.000 description 83
- 238000010168 coupling process Methods 0.000 description 83
- 238000005859 coupling reaction Methods 0.000 description 83
- 239000004065 semiconductor Substances 0.000 description 65
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 49
- 229910052718 tin Inorganic materials 0.000 description 49
- 239000004020 conductor Substances 0.000 description 41
- 230000008569 process Effects 0.000 description 36
- 239000010408 film Substances 0.000 description 35
- 238000000576 coating method Methods 0.000 description 33
- 229920003023 plastic Polymers 0.000 description 33
- 239000004033 plastic Substances 0.000 description 33
- 239000011248 coating agent Substances 0.000 description 31
- 238000001514 detection method Methods 0.000 description 30
- 238000010586 diagram Methods 0.000 description 30
- 230000009471 action Effects 0.000 description 29
- 230000000694 effects Effects 0.000 description 28
- 241000894007 species Species 0.000 description 27
- 239000013464 silicone adhesive Substances 0.000 description 25
- 238000005253 cladding Methods 0.000 description 24
- 238000010276 construction Methods 0.000 description 24
- 229910052751 metal Inorganic materials 0.000 description 24
- 239000002184 metal Substances 0.000 description 24
- 210000000078 claw Anatomy 0.000 description 22
- 229910052802 copper Inorganic materials 0.000 description 22
- 239000010949 copper Substances 0.000 description 22
- 239000004973 liquid crystal related substance Substances 0.000 description 21
- 125000006850 spacer group Chemical group 0.000 description 21
- 238000009434 installation Methods 0.000 description 20
- 239000007800 oxidant agent Substances 0.000 description 20
- 230000001590 oxidative effect Effects 0.000 description 20
- 230000005611 electricity Effects 0.000 description 18
- 238000005516 engineering process Methods 0.000 description 18
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 18
- 229920000180 alkyd Polymers 0.000 description 17
- 239000002274 desiccant Substances 0.000 description 17
- 229910052737 gold Inorganic materials 0.000 description 17
- 239000010931 gold Substances 0.000 description 17
- 229910052759 nickel Inorganic materials 0.000 description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 17
- 229910052697 platinum Inorganic materials 0.000 description 17
- 229920005990 polystyrene resin Polymers 0.000 description 17
- 229910052787 antimony Inorganic materials 0.000 description 16
- 230000004888 barrier function Effects 0.000 description 16
- 238000001035 drying Methods 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 16
- 229910052709 silver Inorganic materials 0.000 description 16
- 239000010944 silver (metal) Substances 0.000 description 16
- 229910052721 tungsten Inorganic materials 0.000 description 16
- 239000002253 acid Substances 0.000 description 15
- 239000002313 adhesive film Substances 0.000 description 14
- 150000001875 compounds Chemical class 0.000 description 14
- 229950000845 politef Drugs 0.000 description 14
- 238000005520 cutting process Methods 0.000 description 13
- 230000004048 modification Effects 0.000 description 12
- 238000012986 modification Methods 0.000 description 12
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 11
- 238000004026 adhesive bonding Methods 0.000 description 10
- 238000004080 punching Methods 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 239000000155 melt Substances 0.000 description 9
- 230000002035 prolonged effect Effects 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000002372 labelling Methods 0.000 description 8
- 150000002632 lipids Chemical class 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000000284 extract Substances 0.000 description 7
- 238000009950 felting Methods 0.000 description 7
- 239000000835 fiber Substances 0.000 description 7
- JQSHBVHOMNKWFT-DTORHVGOSA-N varenicline Chemical compound C12=CC3=NC=CN=C3C=C2[C@H]2C[C@@H]1CNC2 JQSHBVHOMNKWFT-DTORHVGOSA-N 0.000 description 7
- 239000004760 aramid Substances 0.000 description 6
- 229920003235 aromatic polyamide Polymers 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000002699 waste material Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 235000011837 pasties Nutrition 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000001151 other effect Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000011805 ball Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000002305 electric material Substances 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 150000002221 fluorine Chemical class 0.000 description 2
- 210000004247 hand Anatomy 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 241000271460 Crotalus cerastes Species 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N Octacosancarbonsaeure Natural products CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- KVBYPTUGEKVEIJ-UHFFFAOYSA-N benzene-1,3-diol;formaldehyde Chemical compound O=C.OC1=CC=CC(O)=C1 KVBYPTUGEKVEIJ-UHFFFAOYSA-N 0.000 description 1
- 238000012661 block copolymerization Methods 0.000 description 1
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- LCDFWRDNEPDQBV-UHFFFAOYSA-N formaldehyde;phenol;urea Chemical compound O=C.NC(N)=O.OC1=CC=CC=C1 LCDFWRDNEPDQBV-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 239000011806 microball Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920000768 polyamine Chemical class 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004781 supercooling Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000011345 viscous material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H19/00—Changing the web roll
- B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
- B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
- B65H19/1842—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact
- B65H19/1852—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact taking place at a distance from the replacement roll
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
- B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H21/00—Apparatus for splicing webs
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/40—Type of handling process
- B65H2301/46—Splicing
- B65H2301/462—Form of splice
- B65H2301/4621—Overlapping article or web portions
- B65H2301/46212—Overlapping article or web portions with C-folded trailing edge for embedding leading edge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/37—Tapes
- B65H2701/377—Adhesive tape
- B65H2701/3772—Double-sided
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Storage Of Web-Like Or Filamentary Materials (AREA)
Applications Claiming Priority (34)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002-221225 | 2002-07-30 | ||
| JP2002221225A JP2004059776A (ja) | 2002-07-30 | 2002-07-30 | 異方導電材テープ |
| JP2002370622A JP2004196540A (ja) | 2002-12-20 | 2002-12-20 | 接着材テープの接続方法 |
| JP2002-370622 | 2002-12-20 | ||
| JP2002-370624 | 2002-12-20 | ||
| JP2002370624A JP4477823B2 (ja) | 2002-12-20 | 2002-12-20 | 接着剤テープの接続方法及び接着剤テープ接続体 |
| JP2002-370623 | 2002-12-20 | ||
| JP2002370623A JP4032961B2 (ja) | 2002-12-20 | 2002-12-20 | 接着材テープの接続方法 |
| JP2002371887A JP2004203944A (ja) | 2002-12-24 | 2002-12-24 | 接着材テープの接続方法及び接着装置 |
| JP2002-371887 | 2002-12-24 | ||
| JP2002-371888 | 2002-12-24 | ||
| JP2002371889A JP4608839B2 (ja) | 2002-12-24 | 2002-12-24 | 接着材テープリール及び接着装置 |
| JP2002371888A JP4239585B2 (ja) | 2002-12-24 | 2002-12-24 | 接着剤テープの接続方法及び接着剤テープ接続体 |
| JP2002-371889 | 2002-12-24 | ||
| JP2003002095A JP2004210524A (ja) | 2003-01-08 | 2003-01-08 | 接着具 |
| JP2003002093A JP4333140B2 (ja) | 2003-01-08 | 2003-01-08 | 接着剤テープの製造方法 |
| JP2003002092A JP2004211017A (ja) | 2003-01-08 | 2003-01-08 | 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法 |
| JP2003-002094 | 2003-01-08 | ||
| JP2003-002093 | 2003-01-08 | ||
| JP2003002094A JP2004210523A (ja) | 2003-01-08 | 2003-01-08 | 接着剤テープカセット及び接着剤テープカセットを用いた接着剤の圧着方法 |
| JP2003-002095 | 2003-01-08 | ||
| JP2003-002092 | 2003-01-08 | ||
| JP2003-118286 | 2003-04-23 | ||
| JP2003118287A JP4654566B2 (ja) | 2003-04-23 | 2003-04-23 | 接着剤テープの接続方法及び接着剤テープ接続体 |
| JP2003118286A JP2004323621A (ja) | 2003-04-23 | 2003-04-23 | 接着材テープ |
| JP2003-118287 | 2003-04-23 | ||
| JP2003130197A JP4238626B2 (ja) | 2003-05-08 | 2003-05-08 | 接着剤テープリール、接着装置、接続方法及び接着剤テープ接続体 |
| JP2003130196A JP2004331833A (ja) | 2003-05-08 | 2003-05-08 | 接着材テープリール |
| JP2003-130196 | 2003-05-08 | ||
| JP2003-130197 | 2003-05-08 | ||
| JP2003-176322 | 2003-06-20 | ||
| JP2003-176321 | 2003-06-20 | ||
| JP2003176322A JP2005330297A (ja) | 2003-06-20 | 2003-06-20 | 接着材テープの接着材形成方法 |
| JP2003176321A JP2005330296A (ja) | 2003-06-20 | 2003-06-20 | 接着材テープの接続方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB038180847A Division CN100548840C (zh) | 2002-07-30 | 2003-07-30 | 粘接材料带连接体及粘接材料带的连接方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104152075A CN104152075A (zh) | 2014-11-19 |
| CN104152075B true CN104152075B (zh) | 2017-04-12 |
Family
ID=31192628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410378540.3A Expired - Lifetime CN104152075B (zh) | 2002-07-30 | 2003-07-30 | 粘接材料带及其压接方法 |
Country Status (4)
| Country | Link |
|---|---|
| KR (9) | KR20100041890A (enrdf_load_stackoverflow) |
| CN (1) | CN104152075B (enrdf_load_stackoverflow) |
| TW (5) | TW200913829A (enrdf_load_stackoverflow) |
| WO (1) | WO2004011356A1 (enrdf_load_stackoverflow) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006126761A1 (en) * | 2005-05-25 | 2006-11-30 | Ls Cable Ltd. | Adhesive film for semiconductor |
| KR100947149B1 (ko) * | 2006-09-28 | 2010-03-12 | 파나소닉 주식회사 | 점착 시트 첩부 장치 및 첩부 방법 |
| KR101019755B1 (ko) * | 2009-07-15 | 2011-03-08 | 제일모직주식회사 | 다이접착필름, 다이접착필름 릴 장치 및 이를 포함하는 마운팅 장치 |
| DE102010030815A1 (de) * | 2010-07-01 | 2012-01-05 | Voith Patent Gmbh | Verfahren und Vorrichtung zum Verbinden von zwei Faserstoffbahnen |
| JP5318840B2 (ja) * | 2010-11-08 | 2013-10-16 | デクセリアルズ株式会社 | 異方性導電フィルム、異方性導電フィルムの製造方法、電子部材間の接続方法及び接続構造体 |
| JP5805411B2 (ja) | 2011-03-23 | 2015-11-04 | ファスフォードテクノロジ株式会社 | ダイボンダのピックアップ方法およびダイボンダ |
| WO2013024544A1 (ja) * | 2011-08-18 | 2013-02-21 | 日立化成工業株式会社 | 接着材リール |
| US9102851B2 (en) * | 2011-09-15 | 2015-08-11 | Trillion Science, Inc. | Microcavity carrier belt and method of manufacture |
| DE102012103586A1 (de) * | 2012-04-24 | 2013-10-24 | Leonhard Kurz Stiftung & Co. Kg | Verfahren und Vorrichtung zum Verbinden einer ersten Folienbahn und einer zweiten Folienbahn |
| JP5681911B2 (ja) * | 2013-02-28 | 2015-03-11 | 株式会社ナベル | 粘着テープ、テープの接続方法及び卵パック |
| JP6313575B2 (ja) * | 2013-11-20 | 2018-04-18 | デクセリアルズ株式会社 | 接着テープ構造体及び接着テープ収容体 |
| KR101868033B1 (ko) * | 2016-05-24 | 2018-06-15 | 조경국 | 코로나방전을 이용한 박리 시 소음방지형 접착테이프의 제조방법 |
| US10457512B2 (en) | 2016-09-19 | 2019-10-29 | New Era Converting Machinery, Inc. | Automatic lapless butt material splice |
| TWI624913B (zh) * | 2017-04-11 | 2018-05-21 | 矽品精密工業股份有限公司 | 模封設備 |
| JP7065555B2 (ja) * | 2018-03-27 | 2022-05-12 | 日東電工株式会社 | 粘着テープ接合装置 |
| CN108639816A (zh) * | 2018-06-15 | 2018-10-12 | 鲁班嫡系机器人（深圳）有限公司 | 胶带转接件、送胶装置、送胶系统、控制装置及相关的方法 |
| CN109334024A (zh) * | 2018-11-25 | 2019-02-15 | 四川美立方门业有限公司 | 防火胶带和双面胶快速合成防火条装置 |
| DE102019117180A1 (de) * | 2019-06-26 | 2020-12-31 | Hauni Maschinenbau Gmbh | Vorrichtung und Verfahren zum Verbinden von zwei jeweils von einer Bobine ablaufenden Materialbahnen |
| CN110920083B (zh) * | 2019-11-27 | 2021-08-10 | 湖南春意纺织有限责任公司 | 一种用于生产化纤织物织带的粘接装置 |
| CN112757770A (zh) * | 2021-01-09 | 2021-05-07 | 南京闻煜智能科技有限公司 | 一种丝网印刷机 |
| CN113061398A (zh) * | 2021-03-15 | 2021-07-02 | 零零壹(苏州)检测技术有限公司 | 导电胶带及其制备工艺、及使用该导电胶带的电路构建装置 |
| KR102494716B1 (ko) * | 2021-09-30 | 2023-02-06 | 해성디에스 주식회사 | 릴투릴 회로 기판 제조 장치 |
| CN117858368B (zh) * | 2023-12-05 | 2024-06-07 | 湖南宏仁电子电路制造有限公司 | 一种软性线路板用覆盖膜压合设备 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4071388A (en) * | 1973-11-26 | 1978-01-31 | Sumitomo Electric Industries, Ltd. | Impulse heat joining of wrapping tapes for wire cables |
| JPS6198784A (ja) * | 1984-10-20 | 1986-05-17 | Kimurashin Kk | ロール状又は積層状の両面接着テープ |
| JPS62123607A (ja) * | 1985-11-25 | 1987-06-04 | シャープ株式会社 | 異方導電性テ−プの製造方法 |
| JPS62169880A (ja) * | 1986-01-22 | 1987-07-27 | Kanzaki Paper Mfg Co Ltd | 粘着シ−トの製造法 |
| JP2745338B2 (ja) * | 1990-10-03 | 1998-04-28 | コニカ株式会社 | ウエブの接合方法 |
| JPH06164115A (ja) * | 1992-11-27 | 1994-06-10 | Casio Comput Co Ltd | 異方導電性接着剤の転写方法 |
| JPH07270742A (ja) * | 1994-03-30 | 1995-10-20 | Matsushita Electric Ind Co Ltd | テープ圧着装置 |
| JPH08301533A (ja) * | 1995-04-28 | 1996-11-19 | Asahi Kogei Kk | テープ巻回体 |
| JPH09111196A (ja) * | 1995-10-16 | 1997-04-28 | Nitto Denko Corp | 両面粘着材 |
| JPH09301533A (ja) * | 1996-05-14 | 1997-11-25 | Toyo Kanetsu Kk | 仕分装置 |
| JP4111574B2 (ja) * | 1997-10-22 | 2008-07-02 | 大日本印刷株式会社 | 巻取ユニットの装着装置 |
| JP3707231B2 (ja) * | 1998-02-26 | 2005-10-19 | ソニーケミカル株式会社 | 異方性導電膜及びその製造方法 |
| US6541089B1 (en) * | 1999-08-24 | 2003-04-01 | 3M Innovative Properties Company | Stretch releasing adhesive tape with integral pull tab |
| JP4465788B2 (ja) * | 2000-03-28 | 2010-05-19 | 日立化成工業株式会社 | 異方導電材テープ及びリール |
| JP4246370B2 (ja) * | 2000-11-08 | 2009-04-02 | 株式会社トンボ鉛筆 | 塗膜転写具 |
| JP2002221905A (ja) * | 2001-01-26 | 2002-08-09 | Oji Tac Hanbai Kk | 表示用透明粘着ラベルシート |
-
2003
- 2003-07-30 KR KR1020107007008A patent/KR20100041890A/ko not_active Ceased
- 2003-07-30 KR KR1020087019045A patent/KR20080075565A/ko not_active Ceased
- 2003-07-30 WO PCT/JP2003/009694 patent/WO2004011356A1/ja active Application Filing
- 2003-07-30 TW TW097143991A patent/TW200913829A/zh not_active IP Right Cessation
- 2003-07-30 KR KR1020067012929A patent/KR100700438B1/ko not_active Expired - Lifetime
- 2003-07-30 TW TW096139425A patent/TW200823137A/zh not_active IP Right Cessation
- 2003-07-30 CN CN201410378540.3A patent/CN104152075B/zh not_active Expired - Lifetime
- 2003-07-30 KR KR1020097017836A patent/KR100970800B1/ko not_active Expired - Fee Related
- 2003-07-30 KR KR1020087005685A patent/KR100981478B1/ko not_active Expired - Fee Related
- 2003-07-30 KR KR1020087012294A patent/KR20080064886A/ko not_active Ceased
- 2003-07-30 TW TW097143987A patent/TW200913827A/zh not_active IP Right Cessation
- 2003-07-30 KR KR1020107001127A patent/KR100953011B1/ko not_active Expired - Fee Related
- 2003-07-30 TW TW097143988A patent/TW200913828A/zh not_active IP Right Cessation
- 2003-07-30 KR KR1020077011959A patent/KR20070063606A/ko not_active Ceased
- 2003-07-30 KR KR1020067012942A patent/KR100690379B1/ko not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| KR100981478B1 (ko) | 2010-09-10 |
| KR100690379B1 (ko) | 2007-03-12 |
| KR100700438B1 (ko) | 2007-03-28 |
| TWI321868B (enrdf_load_stackoverflow) | 2010-03-11 |
| KR20080034028A (ko) | 2008-04-17 |
| CN104152075A (zh) | 2014-11-19 |
| KR100953011B1 (ko) | 2010-04-14 |
| TWI322129B (enrdf_load_stackoverflow) | 2010-03-21 |
| TWI321973B (enrdf_load_stackoverflow) | 2010-03-11 |
| TW200409405A (en) | 2004-06-01 |
| TW200913828A (en) | 2009-03-16 |
| KR20060084453A (ko) | 2006-07-24 |
| TWI322649B (enrdf_load_stackoverflow) | 2010-03-21 |
| KR20100041890A (ko) | 2010-04-22 |
| KR20060084862A (ko) | 2006-07-25 |
| TWI321972B (enrdf_load_stackoverflow) | 2010-03-11 |
| TW200823137A (en) | 2008-06-01 |
| KR100970800B1 (ko) | 2010-07-16 |
| TW200913827A (en) | 2009-03-16 |
| KR20080075565A (ko) | 2008-08-18 |
| KR20080064886A (ko) | 2008-07-09 |
| TW200913829A (en) | 2009-03-16 |
| KR20090099017A (ko) | 2009-09-18 |
| KR20100013350A (ko) | 2010-02-09 |
| WO2004011356A1 (ja) | 2004-02-05 |
| KR20070063606A (ko) | 2007-06-19 |
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