TWI322649B - - Google Patents
Download PDFInfo
- Publication number
- TWI322649B TWI322649B TW097143988A TW97143988A TWI322649B TW I322649 B TWI322649 B TW I322649B TW 097143988 A TW097143988 A TW 097143988A TW 97143988 A TW97143988 A TW 97143988A TW I322649 B TWI322649 B TW I322649B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- adhesive tape
- tape
- substrate
- disk
- Prior art date
Links
- 239000002390 adhesive tape Substances 0.000 claims description 1704
- 239000000853 adhesive Substances 0.000 claims description 1330
- 230000001070 adhesive effect Effects 0.000 claims description 1317
- 239000000758 substrate Substances 0.000 claims description 520
- 239000000463 material Substances 0.000 claims description 237
- 238000003825 pressing Methods 0.000 claims description 154
- 238000001514 detection method Methods 0.000 claims description 14
- 238000002834 transmittance Methods 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 2
- 238000007689 inspection Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 238000001228 spectrum Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 181
- 239000011347 resin Substances 0.000 description 181
- 238000010438 heat treatment Methods 0.000 description 152
- 238000004519 manufacturing process Methods 0.000 description 150
- 239000002245 particle Substances 0.000 description 145
- 238000000034 method Methods 0.000 description 133
- 239000010410 layer Substances 0.000 description 101
- 238000004804 winding Methods 0.000 description 91
- 239000004065 semiconductor Substances 0.000 description 72
- -1 polypropylene Polymers 0.000 description 66
- 229920001187 thermosetting polymer Polymers 0.000 description 65
- 239000004020 conductor Substances 0.000 description 61
- 230000000694 effects Effects 0.000 description 59
- 229920005992 thermoplastic resin Polymers 0.000 description 53
- 239000011162 core material Substances 0.000 description 51
- 239000003795 chemical substances by application Substances 0.000 description 50
- 229910052751 metal Inorganic materials 0.000 description 48
- 239000002184 metal Substances 0.000 description 48
- 229910000679 solder Inorganic materials 0.000 description 47
- 229920000642 polymer Polymers 0.000 description 42
- 229920003023 plastic Polymers 0.000 description 34
- 239000004033 plastic Substances 0.000 description 34
- 239000012943 hotmelt Substances 0.000 description 33
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 32
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 32
- 210000000078 claw Anatomy 0.000 description 32
- 229920000139 polyethylene terephthalate Polymers 0.000 description 32
- 239000005020 polyethylene terephthalate Substances 0.000 description 32
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 31
- 239000004810 polytetrafluoroethylene Substances 0.000 description 31
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 30
- 238000005520 cutting process Methods 0.000 description 27
- 239000011248 coating agent Substances 0.000 description 24
- 238000000576 coating method Methods 0.000 description 24
- 239000003822 epoxy resin Substances 0.000 description 24
- 229920000647 polyepoxide Polymers 0.000 description 24
- 238000010586 diagram Methods 0.000 description 22
- 239000000203 mixture Substances 0.000 description 22
- 229910052802 copper Inorganic materials 0.000 description 21
- 239000010949 copper Substances 0.000 description 21
- 239000004973 liquid crystal related substance Substances 0.000 description 21
- 238000001035 drying Methods 0.000 description 20
- 239000002313 adhesive film Substances 0.000 description 19
- 239000011521 glass Substances 0.000 description 18
- 238000002844 melting Methods 0.000 description 18
- 230000008018 melting Effects 0.000 description 18
- 229910052718 tin Inorganic materials 0.000 description 18
- 239000011135 tin Substances 0.000 description 18
- 239000004743 Polypropylene Substances 0.000 description 17
- 239000000919 ceramic Substances 0.000 description 17
- 239000010931 gold Substances 0.000 description 17
- 238000005304 joining Methods 0.000 description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 17
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 17
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 16
- 229910052787 antimony Inorganic materials 0.000 description 16
- 229910052799 carbon Inorganic materials 0.000 description 16
- 229910002804 graphite Inorganic materials 0.000 description 16
- 239000010439 graphite Substances 0.000 description 16
- 229910052759 nickel Inorganic materials 0.000 description 16
- 229910052697 platinum Inorganic materials 0.000 description 16
- 229920001225 polyester resin Polymers 0.000 description 16
- 239000004645 polyester resin Substances 0.000 description 16
- 229920001155 polypropylene Polymers 0.000 description 16
- 229910052707 ruthenium Inorganic materials 0.000 description 16
- 229910052709 silver Inorganic materials 0.000 description 16
- 229910052721 tungsten Inorganic materials 0.000 description 16
- 229920000178 Acrylic resin Polymers 0.000 description 15
- 239000004925 Acrylic resin Substances 0.000 description 15
- 229910052737 gold Inorganic materials 0.000 description 15
- 239000002923 metal particle Substances 0.000 description 15
- 230000004048 modification Effects 0.000 description 13
- 238000012986 modification Methods 0.000 description 13
- 239000010944 silver (metal) Substances 0.000 description 13
- 238000002156 mixing Methods 0.000 description 12
- 239000004848 polyfunctional curative Substances 0.000 description 12
- 238000004080 punching Methods 0.000 description 11
- 239000002699 waste material Substances 0.000 description 11
- 210000003298 dental enamel Anatomy 0.000 description 10
- 206010040844 Skin exfoliation Diseases 0.000 description 9
- 230000009467 reduction Effects 0.000 description 9
- 239000003566 sealing material Substances 0.000 description 9
- 229920001567 vinyl ester resin Polymers 0.000 description 9
- 229920003235 aromatic polyamide Polymers 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000004760 aramid Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 230000001568 sexual effect Effects 0.000 description 7
- 125000006850 spacer group Chemical group 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N acetic acid Substances CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 6
- 230000005611 electricity Effects 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 238000009434 installation Methods 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 239000011737 fluorine Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- 239000002274 desiccant Substances 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- 238000013518 transcription Methods 0.000 description 4
- 230000035897 transcription Effects 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000000740 bleeding effect Effects 0.000 description 3
- 238000005485 electric heating Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- VVJKKWFAADXIJK-UHFFFAOYSA-N Allylamine Chemical compound NCC=C VVJKKWFAADXIJK-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 101700004678 SLIT3 Proteins 0.000 description 2
- 102100025490 Slit homolog 1 protein Human genes 0.000 description 2
- 101710123186 Slit homolog 1 protein Proteins 0.000 description 2
- 102100027339 Slit homolog 3 protein Human genes 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000002305 electric material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- MKXKFYHWDHIYRV-UHFFFAOYSA-N flutamide Chemical compound CC(C)C(=O)NC1=CC=C([N+]([O-])=O)C(C(F)(F)F)=C1 MKXKFYHWDHIYRV-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- SENMPMXZMGNQAG-UHFFFAOYSA-N 3,4-dihydro-2,5-benzodioxocine-1,6-dione Chemical compound O=C1OCCOC(=O)C2=CC=CC=C12 SENMPMXZMGNQAG-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004821 Contact adhesive Substances 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- KVBYPTUGEKVEIJ-UHFFFAOYSA-N benzene-1,3-diol;formaldehyde Chemical compound O=C.OC1=CC=CC(O)=C1 KVBYPTUGEKVEIJ-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000009960 carding Methods 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007791 dehumidification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical group FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- ZDXPYRJPNDTMRX-UHFFFAOYSA-N glutamine Natural products OC(=O)C(N)CCC(N)=O ZDXPYRJPNDTMRX-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000011824 nuclear material Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000012169 petroleum derived wax Substances 0.000 description 1
- 235000019381 petroleum wax Nutrition 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 150000004291 polyenes Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H19/00—Changing the web roll
- B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
- B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
- B65H19/1842—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact
- B65H19/1852—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact taking place at a distance from the replacement roll
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
- B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H21/00—Apparatus for splicing webs
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/40—Type of handling process
- B65H2301/46—Splicing
- B65H2301/462—Form of splice
- B65H2301/4621—Overlapping article or web portions
- B65H2301/46212—Overlapping article or web portions with C-folded trailing edge for embedding leading edge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/37—Tapes
- B65H2701/377—Adhesive tape
- B65H2701/3772—Double-sided
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Storage Of Web-Like Or Filamentary Materials (AREA)
Applications Claiming Priority (17)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002221225A JP2004059776A (ja) | 2002-07-30 | 2002-07-30 | 異方導電材テープ |
| JP2002370623A JP4032961B2 (ja) | 2002-12-20 | 2002-12-20 | 接着材テープの接続方法 |
| JP2002370624A JP4477823B2 (ja) | 2002-12-20 | 2002-12-20 | 接着剤テープの接続方法及び接着剤テープ接続体 |
| JP2002370622A JP2004196540A (ja) | 2002-12-20 | 2002-12-20 | 接着材テープの接続方法 |
| JP2002371888A JP4239585B2 (ja) | 2002-12-24 | 2002-12-24 | 接着剤テープの接続方法及び接着剤テープ接続体 |
| JP2002371889A JP4608839B2 (ja) | 2002-12-24 | 2002-12-24 | 接着材テープリール及び接着装置 |
| JP2002371887A JP2004203944A (ja) | 2002-12-24 | 2002-12-24 | 接着材テープの接続方法及び接着装置 |
| JP2003002093A JP4333140B2 (ja) | 2003-01-08 | 2003-01-08 | 接着剤テープの製造方法 |
| JP2003002092A JP2004211017A (ja) | 2003-01-08 | 2003-01-08 | 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法 |
| JP2003002095A JP2004210524A (ja) | 2003-01-08 | 2003-01-08 | 接着具 |
| JP2003002094A JP2004210523A (ja) | 2003-01-08 | 2003-01-08 | 接着剤テープカセット及び接着剤テープカセットを用いた接着剤の圧着方法 |
| JP2003118287A JP4654566B2 (ja) | 2003-04-23 | 2003-04-23 | 接着剤テープの接続方法及び接着剤テープ接続体 |
| JP2003118286A JP2004323621A (ja) | 2003-04-23 | 2003-04-23 | 接着材テープ |
| JP2003130197A JP4238626B2 (ja) | 2003-05-08 | 2003-05-08 | 接着剤テープリール、接着装置、接続方法及び接着剤テープ接続体 |
| JP2003130196A JP2004331833A (ja) | 2003-05-08 | 2003-05-08 | 接着材テープリール |
| JP2003176321A JP2005330296A (ja) | 2003-06-20 | 2003-06-20 | 接着材テープの接続方法 |
| JP2003176322A JP2005330297A (ja) | 2003-06-20 | 2003-06-20 | 接着材テープの接着材形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200913828A TW200913828A (en) | 2009-03-16 |
| TWI322649B true TWI322649B (enrdf_load_stackoverflow) | 2010-03-21 |
Family
ID=31192628
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097143991A TW200913829A (en) | 2002-07-30 | 2003-07-30 | Adhesive material reel |
| TW096139425A TW200823137A (en) | 2002-07-30 | 2003-07-30 | Joining structure and adhesive material reel |
| TW097143987A TW200913827A (en) | 2002-07-30 | 2003-07-30 | Adhesive material reel |
| TW097143988A TW200913828A (en) | 2002-07-30 | 2003-07-30 | Adhesive material reel |
| TW092120892A TW200409405A (en) | 2002-07-30 | 2003-07-30 | Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material reel, adhering device, adhesive agent-tape cassette, method of press-conducting adhesive agent using same, and anisotropic electroconductive tape |
Family Applications Before (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097143991A TW200913829A (en) | 2002-07-30 | 2003-07-30 | Adhesive material reel |
| TW096139425A TW200823137A (en) | 2002-07-30 | 2003-07-30 | Joining structure and adhesive material reel |
| TW097143987A TW200913827A (en) | 2002-07-30 | 2003-07-30 | Adhesive material reel |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092120892A TW200409405A (en) | 2002-07-30 | 2003-07-30 | Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material reel, adhering device, adhesive agent-tape cassette, method of press-conducting adhesive agent using same, and anisotropic electroconductive tape |
Country Status (4)
| Country | Link |
|---|---|
| KR (9) | KR20100041890A (enrdf_load_stackoverflow) |
| CN (1) | CN104152075B (enrdf_load_stackoverflow) |
| TW (5) | TW200913829A (enrdf_load_stackoverflow) |
| WO (1) | WO2004011356A1 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI855365B (zh) * | 2021-09-30 | 2024-09-11 | 南韓商海成帝愛斯股份有限公司 | 卷軸對卷軸電路板製造設備 |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006126761A1 (en) * | 2005-05-25 | 2006-11-30 | Ls Cable Ltd. | Adhesive film for semiconductor |
| KR100947149B1 (ko) * | 2006-09-28 | 2010-03-12 | 파나소닉 주식회사 | 점착 시트 첩부 장치 및 첩부 방법 |
| KR101019755B1 (ko) * | 2009-07-15 | 2011-03-08 | 제일모직주식회사 | 다이접착필름, 다이접착필름 릴 장치 및 이를 포함하는 마운팅 장치 |
| DE102010030815A1 (de) * | 2010-07-01 | 2012-01-05 | Voith Patent Gmbh | Verfahren und Vorrichtung zum Verbinden von zwei Faserstoffbahnen |
| JP5318840B2 (ja) * | 2010-11-08 | 2013-10-16 | デクセリアルズ株式会社 | 異方性導電フィルム、異方性導電フィルムの製造方法、電子部材間の接続方法及び接続構造体 |
| JP5805411B2 (ja) | 2011-03-23 | 2015-11-04 | ファスフォードテクノロジ株式会社 | ダイボンダのピックアップ方法およびダイボンダ |
| WO2013024544A1 (ja) * | 2011-08-18 | 2013-02-21 | 日立化成工業株式会社 | 接着材リール |
| US9102851B2 (en) * | 2011-09-15 | 2015-08-11 | Trillion Science, Inc. | Microcavity carrier belt and method of manufacture |
| DE102012103586A1 (de) * | 2012-04-24 | 2013-10-24 | Leonhard Kurz Stiftung & Co. Kg | Verfahren und Vorrichtung zum Verbinden einer ersten Folienbahn und einer zweiten Folienbahn |
| JP5681911B2 (ja) * | 2013-02-28 | 2015-03-11 | 株式会社ナベル | 粘着テープ、テープの接続方法及び卵パック |
| JP6313575B2 (ja) * | 2013-11-20 | 2018-04-18 | デクセリアルズ株式会社 | 接着テープ構造体及び接着テープ収容体 |
| KR101868033B1 (ko) * | 2016-05-24 | 2018-06-15 | 조경국 | 코로나방전을 이용한 박리 시 소음방지형 접착테이프의 제조방법 |
| US10457512B2 (en) | 2016-09-19 | 2019-10-29 | New Era Converting Machinery, Inc. | Automatic lapless butt material splice |
| TWI624913B (zh) * | 2017-04-11 | 2018-05-21 | 矽品精密工業股份有限公司 | 模封設備 |
| JP7065555B2 (ja) * | 2018-03-27 | 2022-05-12 | 日東電工株式会社 | 粘着テープ接合装置 |
| CN108639816A (zh) * | 2018-06-15 | 2018-10-12 | 鲁班嫡系机器人（深圳）有限公司 | 胶带转接件、送胶装置、送胶系统、控制装置及相关的方法 |
| CN109334024A (zh) * | 2018-11-25 | 2019-02-15 | 四川美立方门业有限公司 | 防火胶带和双面胶快速合成防火条装置 |
| DE102019117180A1 (de) * | 2019-06-26 | 2020-12-31 | Hauni Maschinenbau Gmbh | Vorrichtung und Verfahren zum Verbinden von zwei jeweils von einer Bobine ablaufenden Materialbahnen |
| CN110920083B (zh) * | 2019-11-27 | 2021-08-10 | 湖南春意纺织有限责任公司 | 一种用于生产化纤织物织带的粘接装置 |
| CN112757770A (zh) * | 2021-01-09 | 2021-05-07 | 南京闻煜智能科技有限公司 | 一种丝网印刷机 |
| CN113061398A (zh) * | 2021-03-15 | 2021-07-02 | 零零壹(苏州)检测技术有限公司 | 导电胶带及其制备工艺、及使用该导电胶带的电路构建装置 |
| CN117858368B (zh) * | 2023-12-05 | 2024-06-07 | 湖南宏仁电子电路制造有限公司 | 一种软性线路板用覆盖膜压合设备 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4071388A (en) * | 1973-11-26 | 1978-01-31 | Sumitomo Electric Industries, Ltd. | Impulse heat joining of wrapping tapes for wire cables |
| JPS6198784A (ja) * | 1984-10-20 | 1986-05-17 | Kimurashin Kk | ロール状又は積層状の両面接着テープ |
| JPS62123607A (ja) * | 1985-11-25 | 1987-06-04 | シャープ株式会社 | 異方導電性テ−プの製造方法 |
| JPS62169880A (ja) * | 1986-01-22 | 1987-07-27 | Kanzaki Paper Mfg Co Ltd | 粘着シ−トの製造法 |
| JP2745338B2 (ja) * | 1990-10-03 | 1998-04-28 | コニカ株式会社 | ウエブの接合方法 |
| JPH06164115A (ja) * | 1992-11-27 | 1994-06-10 | Casio Comput Co Ltd | 異方導電性接着剤の転写方法 |
| JPH07270742A (ja) * | 1994-03-30 | 1995-10-20 | Matsushita Electric Ind Co Ltd | テープ圧着装置 |
| JPH08301533A (ja) * | 1995-04-28 | 1996-11-19 | Asahi Kogei Kk | テープ巻回体 |
| JPH09111196A (ja) * | 1995-10-16 | 1997-04-28 | Nitto Denko Corp | 両面粘着材 |
| JPH09301533A (ja) * | 1996-05-14 | 1997-11-25 | Toyo Kanetsu Kk | 仕分装置 |
| JP4111574B2 (ja) * | 1997-10-22 | 2008-07-02 | 大日本印刷株式会社 | 巻取ユニットの装着装置 |
| JP3707231B2 (ja) * | 1998-02-26 | 2005-10-19 | ソニーケミカル株式会社 | 異方性導電膜及びその製造方法 |
| US6541089B1 (en) * | 1999-08-24 | 2003-04-01 | 3M Innovative Properties Company | Stretch releasing adhesive tape with integral pull tab |
| JP4465788B2 (ja) * | 2000-03-28 | 2010-05-19 | 日立化成工業株式会社 | 異方導電材テープ及びリール |
| JP4246370B2 (ja) * | 2000-11-08 | 2009-04-02 | 株式会社トンボ鉛筆 | 塗膜転写具 |
| JP2002221905A (ja) * | 2001-01-26 | 2002-08-09 | Oji Tac Hanbai Kk | 表示用透明粘着ラベルシート |
-
2003
- 2003-07-30 KR KR1020107007008A patent/KR20100041890A/ko not_active Ceased
- 2003-07-30 KR KR1020087019045A patent/KR20080075565A/ko not_active Ceased
- 2003-07-30 WO PCT/JP2003/009694 patent/WO2004011356A1/ja active Application Filing
- 2003-07-30 TW TW097143991A patent/TW200913829A/zh not_active IP Right Cessation
- 2003-07-30 KR KR1020067012929A patent/KR100700438B1/ko not_active Expired - Lifetime
- 2003-07-30 TW TW096139425A patent/TW200823137A/zh not_active IP Right Cessation
- 2003-07-30 CN CN201410378540.3A patent/CN104152075B/zh not_active Expired - Lifetime
- 2003-07-30 KR KR1020097017836A patent/KR100970800B1/ko not_active Expired - Fee Related
- 2003-07-30 KR KR1020087005685A patent/KR100981478B1/ko not_active Expired - Fee Related
- 2003-07-30 KR KR1020087012294A patent/KR20080064886A/ko not_active Ceased
- 2003-07-30 TW TW097143987A patent/TW200913827A/zh not_active IP Right Cessation
- 2003-07-30 KR KR1020107001127A patent/KR100953011B1/ko not_active Expired - Fee Related
- 2003-07-30 TW TW097143988A patent/TW200913828A/zh not_active IP Right Cessation
- 2003-07-30 KR KR1020077011959A patent/KR20070063606A/ko not_active Ceased
- 2003-07-30 KR KR1020067012942A patent/KR100690379B1/ko not_active Expired - Fee Related
- 2003-07-30 TW TW092120892A patent/TW200409405A/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI855365B (zh) * | 2021-09-30 | 2024-09-11 | 南韓商海成帝愛斯股份有限公司 | 卷軸對卷軸電路板製造設備 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100981478B1 (ko) | 2010-09-10 |
| KR100690379B1 (ko) | 2007-03-12 |
| KR100700438B1 (ko) | 2007-03-28 |
| TWI321868B (enrdf_load_stackoverflow) | 2010-03-11 |
| KR20080034028A (ko) | 2008-04-17 |
| CN104152075A (zh) | 2014-11-19 |
| KR100953011B1 (ko) | 2010-04-14 |
| TWI322129B (enrdf_load_stackoverflow) | 2010-03-21 |
| CN104152075B (zh) | 2017-04-12 |
| TWI321973B (enrdf_load_stackoverflow) | 2010-03-11 |
| TW200409405A (en) | 2004-06-01 |
| TW200913828A (en) | 2009-03-16 |
| KR20060084453A (ko) | 2006-07-24 |
| KR20100041890A (ko) | 2010-04-22 |
| KR20060084862A (ko) | 2006-07-25 |
| TWI321972B (enrdf_load_stackoverflow) | 2010-03-11 |
| TW200823137A (en) | 2008-06-01 |
| KR100970800B1 (ko) | 2010-07-16 |
| TW200913827A (en) | 2009-03-16 |
| KR20080075565A (ko) | 2008-08-18 |
| KR20080064886A (ko) | 2008-07-09 |
| TW200913829A (en) | 2009-03-16 |
| KR20090099017A (ko) | 2009-09-18 |
| KR20100013350A (ko) | 2010-02-09 |
| WO2004011356A1 (ja) | 2004-02-05 |
| KR20070063606A (ko) | 2007-06-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI322649B (enrdf_load_stackoverflow) | ||
| CN101417758B (zh) | 粘接材料带卷、粘接装置、粘接剂带盒及粘接器 | |
| CN100548840C (zh) | 粘接材料带连接体及粘接材料带的连接方法 | |
| KR100838880B1 (ko) | 접착재 테이프, 그 접속방법, 제조방법, 압착방법 | |
| CN101920862B (zh) | 粘接剂带的压接方法 | |
| JP2004196540A (ja) | 接着材テープの接続方法 | |
| CN101920863A (zh) | 粘接材料带的粘接材料形成方法 | |
| JP2004211018A (ja) | 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法 | |
| CN101905817B (zh) | 粘接材料带的连接方法 | |
| JP2004211017A (ja) | 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法 | |
| JP2005330296A (ja) | 接着材テープの接続方法 | |
| JP2005330296A5 (enrdf_load_stackoverflow) | ||
| JP2004331330A (ja) | 接着材テープリール、接着装置及び接続方法 | |
| JP2004203944A (ja) | 接着材テープの接続方法及び接着装置 | |
| JP2004331330A5 (enrdf_load_stackoverflow) | ||
| JP2005330297A (ja) | 接着材テープの接着材形成方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |