WO2003105218A1 - 被処理体の収納容器体 - Google Patents
被処理体の収納容器体 Download PDFInfo
- Publication number
- WO2003105218A1 WO2003105218A1 PCT/JP2003/006542 JP0306542W WO03105218A1 WO 2003105218 A1 WO2003105218 A1 WO 2003105218A1 JP 0306542 W JP0306542 W JP 0306542W WO 03105218 A1 WO03105218 A1 WO 03105218A1
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- WO
- WIPO (PCT)
- Prior art keywords
- opening
- cassette
- container
- storage container
- processed
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Definitions
- the present invention relates to a container for storing an object to be processed such as a semiconductor wafer in an airtight state, and a processing system using the same.
- FOUP registered trademark
- This storage container body has a box container in which one side is formed as an opening and the other side is formed in a substantially semi-cylindrical shape.
- support portions are provided in multiple stages at a substantially equal pitch.
- the peripheral portion of the semiconductor wafer is placed and supported on each support. Thereby, semiconductor wafers can be stored in multiple stages at substantially equal pitches.
- about 25 or 13 wafers can be stored in one storage container.
- An opening / closing lid is detachably attached to the opening of the box container.
- the box container can maintain a certain degree of hermeticity.
- the inside of the box container is filled with clean air or an inert gas atmosphere such as N 2 gas. At this time, the stored wafer hardly touches the outside air.
- the opening / closing lid is provided with a lock mechanism. To release this lock mechanism Thus, the opening / closing lid can be detached from the opening.
- a storage container such as the above-mentioned FOUP is generally used for a large-diameter wafer, for example, a wafer having a diameter of 300 mm (12 inches).
- Containers such as FOUPs are not applicable to small diameter wafers, for example, 200 mm (8 inch) or 150 mm (6 inch) wafers.
- open cassettes having no so-called closed structure have been used. In this open type cassette, wafers are stored in multiple stages while being exposed to the atmosphere.
- an auxiliary jig which can support and fix an open-type cassette for a small-diameter wafer in a storage container for a large-diameter wafer.
- a cassette dub AM-304 registered trademark manufactured by Microsoft Corporation is known.
- This auxiliary jig has a semi-elliptical base 2 as shown in FIG. On the periphery of the base 2, four columns 4 stand.
- the upper end of the column 4 supports and fixes, for example, a semicircular ceiling plate 6 having substantially the same diameter as a wafer of 300 mm.
- a positioning projection 8 for positioning a cassette C for a 200 mm wafer, for example, a small-diameter wafer is provided.
- the cassette C is positioned and fixed by positioning protrusions 8.
- an elastic holding wheel 10 made of, for example, polycarbonate resin is provided on the periphery of the base 2 and the ceiling plate 6.
- the holding wheel 10 is adapted to be fitted into a supporting portion for placing and supporting a peripheral portion of a wafer in a 300 mm wafer storage container (not shown).
- the entire auxiliary jig is fixed in the 300 mm wafer storage container. That is, --
- the above-mentioned auxiliary jig has the following problems. That is, the center of the 200 mm wafer when the 200 mm wafer is stored using this auxiliary jig and the 300 mm wafer when the 300 mm wafer is stored without the auxiliary jig.
- the center of the 0 mm wafer is located at approximately the same place in plane. For this reason, when a 200 mm wafer is stored, a large empty space is created between the 200 mm wafer and the closing lid. As a result, the 200-mm wafer may slide largely inside the cassette C in some cases.
- the support when the holding wheel 10 is fitted into the support for the 300 mm wafer, the support may be damaged. If the support is damaged, the wafer itself may be damaged when the wafer is supported on the support. Further, if the support portion is damaged, the thin holding wheel 10 itself may be damaged and become unusable. Summary of the invention
- An object of the present invention is to selectively accommodate large and small workpieces having different diameters without causing a displacement or the like during the storage and damaging a support portion for a large-diameter workpiece. It is an object of the present invention to provide a storage container for a target object which can be properly stored without using the same and a processing system using the same.
- the present invention is capable of accommodating an open-type cassette capable of holding a plurality of first processing objects and a size capable of storing a plurality of second processing objects having a diameter larger than that of the first processing object.
- a container provided on the inner side wall of the box container and supporting the plurality of second processing objects in multiple stages; and an opening / closing lid detachably provided at an opening of the box container.
- the position provided detachably at the bottom of the box container A positioning engagement portion, wherein the opening / closing lid is capable of sealing the box container, and the positioning engagement portion engages with a positioning member provided on a bottom lower surface of the cassette.
- a container for the object to be processed characterized in that the cassette can be positioned.
- the positioning engagement portion for positioning the cassette is detachably provided at the bottom of the box container. Therefore, when storing an object to be processed having a large diameter, for example, a diameter of 30 O mm, the positioning is performed. With the engaging portion removed, the peripheral part of the large-diameter workpiece can be stored in multiple stages supported by the support, while the small-diameter workpiece, for example, having a diameter of 200 mm is stored. With the positioning engagement portion attached, an open cassette is fixed in the box container while being positioned by the positioning engagement portion, and a small-diameter workpiece to be processed can be stored in the cassette. . Further, it is possible to prevent the supporting portion of the large-diameter workpiece from being damaged.
- the position of the peripheral edge on the opening side of the first object to be processed is determined by the second object to be processed. It is preferable that a position of a peripheral edge on the opening side of the second object to be processed when housed in the box container is substantially coincident with the position.
- the first object to be processed is prevented from jumping out of the cassette.
- a first protrusion prevention member is provided.
- the first protrusion prevention member is detachable from the opening / closing lid.
- a second protrusion preventing member for preventing the second object from jumping out of the box container Is preferably provided.
- the second protrusion prevention member is detachable from the opening / closing lid.
- the positioning engagement portion is preferably provided on an upper surface of the cassette base.
- a table fixing jig provided so as to be able to protrude and retract from the peripheral part is provided at a peripheral part of the cassette base table, and the table fixing jig presses and contacts an inner side wall of the box container. By doing so, the cassette base is fixed in the box container.
- the table fixing jigs can be provided at three places on the peripheral edge of the cassette table.
- the present invention provides a box container having a size capable of accommodating an open cassette capable of holding a plurality of objects to be processed, an opening / closing lid detachably provided at an opening of the box container, and the box A positioning engagement portion provided on the bottom of the container, wherein the opening / closing lid is capable of sealing the box container, and the positioning engagement portion is provided on a bottom lower surface of the cassette. And a positioning member that can be engaged with the positioning member to position the cassette.
- a protrusion preventing member for preventing the object to be processed from jumping out of the cassette is preferably provided.
- the present invention provides a container transfer area in which a storage container having any of the above-mentioned features can be transferred, an object transfer area in an inert gas atmosphere or a clean gas atmosphere, and the container A partition wall separating the transfer area and the object transfer area, an opening formed in the partition wall, and an opening of the storage container body facing the opening on the container body transfer area side, A mounting table on which the storage container body is mounted; a load port provided in the container body transfer area, which can communicate with the outside; and a load port provided in the container body transfer area, wherein the storage container body is temporarily stored.
- a container force transfer mechanism for transferring the storage container body between the funnel force, the stop force, and the mounting table, and the storage container body is mounted on the mounting table.
- An opening / closing mechanism for opening and closing the opening / closing lid of the storage container, a processing object boat provided in the processing object transport area and corresponding to the size of the processing object stored in the storage container.
- a processing container provided in the processing object transport area and capable of performing a predetermined heat treatment on the processing object; and elevating and lowering the processing object boat.
- a boat elevating mechanism for loading / unloading the target object boat with respect to the processing container; and transferring the target object between the target object boat and the storage container body mounted on the mounting table.
- a transfer mechanism for transferring an object to be processed.
- FIG. 1 is a perspective view showing a container for accommodating an object to be processed according to an embodiment of the present invention.
- FIG. 2 is a perspective view showing a state of a storage container body in which a large-diameter object to be processed is stored and an opening / closing lid is removed.
- FIG. 3 is a perspective view showing a state of a storage container body which accommodates a cassette accommodating a small-diameter object to be processed and has an opening / closing lid removed.
- FIG. 4 is a perspective view showing a cassette for storing a small-diameter workpiece.
- FIG. 5 is a cross-sectional view showing the storage container body in which a cassette is stored.
- FIG. 6 is a perspective view showing a cassette base provided with a positioning engagement portion.
- FIG. 7 is a diagram showing a state where the positioning member is fitted to the positioning engagement portion.
- FIG. 8 is a diagram showing a protrusion prevention member for a large-diameter wafer.
- FIG. 9 is a perspective view showing a part of the protrusion preventing member shown in FIG.
- FIG. 10 is a diagram showing a protrusion prevention member for a small-diameter wafer.
- FIG. 11 is a perspective view showing a modified example of the storage container body of the present invention.
- FIG. 12 is a schematic configuration diagram showing an example of the processing system of the present invention.
- FIG. 13 is a perspective view showing a main part of the processing system.
- FIG. 14 is a diagram illustrating an example of an object transfer mechanism used in the processing system.
- FIG. 15 is a perspective view showing an example of a conventional auxiliary jig used for a storage container. BEST MODE FOR CARRYING OUT THE INVENTION
- FIG. 1 is a perspective view showing a storage container body for an object to be processed according to the present embodiment.
- Figure 2 FIG. 4 is a perspective view showing a state of a storage container body in which a large-diameter object to be processed is stored and an opening / closing lid is removed.
- FIG. 3 is a perspective view showing a state of the storage container body in which a cassette accommodating a small-diameter object to be processed is stored and the opening / closing lid is removed.
- FIG. 4 is a perspective view showing a cassette for storing a small-diameter workpiece.
- FIG. 5 is a cross-sectional view showing the storage container body in a state in which the cassette is stored.
- FIG. 6 is a perspective view showing a cassette base provided with a positioning engagement portion.
- FIG. 7 is a diagram showing a state where the positioning member is fitted to the positioning engagement portion.
- the storage container body 12 has a box container 16 having one side formed as an opening 14 and the other side formed in a substantially semi-elliptical column shape.
- a plurality of support portions 18 are provided at substantially equal pitches.
- the support portion 18 is formed, for example, in a shelf shape or a groove shape.
- a peripheral portion of, for example, a semiconductor wafer W1 having a diameter of 300 mm as a large-diameter object to be processed is placed and supported on each support portion 18.
- a handle 21 for gripping the entire box container 16 is provided on the ceiling of the box container 16. Usually, about 25 or about 13 large-diameter wafers W1 can be accommodated in one box container 16.
- a rectangular hollow plate-like opening / closing lid 20 is detachably attached to the opening 14 of the box container 16, and the inside of the box container 16 is airtight.
- the inside of the box container 16 is filled with an atmosphere of an inert gas such as N 2 gas or clean air. At this time, the accommodated wafer W1 hardly touches the outside air.
- each lock mechanism 22 has a disk-shaped lock plate 24 rotatably mounted substantially at the center of the opening / closing lid 20 in the height direction.
- the lock plate 24 is formed with an elongated recessed key groove 26.
- the lock plate 24 is provided with a projecting pin 28 in a vertical direction via a crank mechanism (not shown) for converting a circular motion into a linear motion.
- the tip of the protruding pin 28, when locked has pin holes 30 at the upper and lower edges that define the opening 14 of the box container 6, as shown in FIG. (Only hole 30 is shown). This prevents the opening / closing lid 20 from coming off the opening 14 when locked.
- a groove 32 is formed inside the vicinity of the lower edge of the opening 14.
- a protrusion preventing member 34 for preventing the protrusion of the box housed in the box container 16 from protruding is provided along the height direction thereof.
- the protrusion prevention member 34 is a plate-shaped member made of a material having high durability against, for example, halogen, a halogen compound, an acid, and an alkali, such as PEEK (polyetheretherketone).
- the contact surface 36 of the protrusion preventing member 34 with the wafer is formed so as to have a curved surface having substantially the same curvature as the circumference of the large-diameter wafer W1.
- the protrusion preventing member 34 may be formed of synthetic rubber or the like, that is, may have a certain degree of elasticity. Further, the protrusion preventing member 34 may be formed with an arc-shaped groove for accommodating the peripheral portion of the wafer.
- a positioning engagement portion 38 for positioning the cassette C on the bottom of the box container 16 is detachably provided.
- the cassette C includes a small-diameter workpiece, for example, a semiconductor wafer W2 having a diameter of 200 mm (8 inches). It is housed in multiple tiers.
- cassette C is shown with its rear surface in contact with the floor.
- Cassette C has a box shape that is entirely open.
- the cassette C is formed of a material having excellent chemical resistance and heat resistance, for example, Teflon (registered trademark).
- the support shelves 40 are arranged in multiple stages at equal pitch.
- the peripheral portion of the small-diameter wafer W2 is placed and supported on each support shelf 40.
- one cassette C can support, for example, about 25 small-diameter wafers W2.
- the handle 21 is not shown.
- a substantially H-shaped positioning member 42 formed so as to protrude therefrom.
- the protruding positioning member 42 also has a function as a reinforcing member for preventing deformation of the cassette C itself.
- the positioning engagement portion 38 for positioning the cassette C is, specifically, a cassette base table 4 detachably attached to the bottom of the box container 16. 4 is fixed on.
- the positioning engagement portion 38 is composed of two plate members 46 and 48 arranged at a predetermined interval.
- the gap between the two plate members 46 and 48 is a fitting groove 50.
- the length L1 of the two plate members 46 and 48 is set slightly smaller than the width L2 of the H-shaped positioning member 42 on the lower surface of the bottom of the cassette C.
- the width L3 of the fitting groove 50 is set slightly larger than the thickness L4 of the positioning member 42.
- the cassette C is positioned on the cassette base table 44 while being positioned.
- the two plate members 46 and 48 are formed of one plate member, and the fitting groove is formed substantially at the center thereof.
- the plate members 46 and 48 may be attached to the cassette base table 44 such that the positions thereof can be adjusted by screws or the like.
- the cassette base table 44 has a size slightly smaller than the size of the bottom of the box container 16 and is formed in a substantially semi-elliptical shape by, for example, PC (polycarbonate) or the like.
- a total of three table fixing jigs 5 2, 5 4, at each end of the opening 14 side and the back side far from the opening 14 are provided on the peripheral edge of the cassette base table 4 4.
- 56 is attached (see Fig. 5).
- each of the fixtures 52, 54, 56 has a fixed frame 52 A, 54 As 56 A fixed to the cassette base 44. Adjusting screws 52 B, 54 B, 56 B are provided on the fixing frames 52 A, 54 A, 56 A so as to be able to protrude and retract in the horizontal direction. Pressing pieces 52 C, 54 C, 56 C are attached to the adjusting screws 52 B, 54 B, 56 B, respectively. By rotating the adjusting screws 52B, 54B, 56B, the pressing pieces 52C, 54C56C can be moved outside the cassette base 44. By pressing the pressing pieces 52 C, 54 C, and 56 C against the inner wall of the box container 16, the cassette base table 44 becomes a box. It is mounted and fixed in the container 16.
- Each of the pressing pieces 52 C, 54 C, and 56 C has two guide slots 58 formed therein.
- a fixing screw 60 is inserted into each guide slot 58.
- the lower end of the fixing screw 60 is screwed into the cassette base 44. Therefore, each of the pressing pieces 52 C, 54 C, 56 C can move in the direction along the long slot 58 in the state where the fixing screw 60 is loosened.
- the cassette pace table 44 becomes the box container 1. 6 can be firmly and securely attached and fixed.
- the distal end of the pressing piece 56 C located on the back side is formed in a curved shape corresponding to the curved wall surface of the box container 16.
- an engagement projection 62 protruding downward is provided on the lower surface of the distal end side (opening 14 side) of the cassette base table 44.
- the engagement protrusion 62 is adapted to be fitted into a groove member 32 (see FIG. 2) provided on the bottom of the box container 16.
- the positioning position of the positioning engagement portion 38 is such that the front end side of the small-diameter wafer W2 housed in the cassette C housed in the box container 16 protrudes as described above.
- the position is set so as to be substantially in contact with the prevention member 34.
- the opening 14 of the box container 16 is closed by the opening / closing lid 20. Open / close lid 20 is locked. At this time, the protrusion preventing member 34 provided on the opening / closing lid 20 is brought into a state of being substantially in contact with the end of the large-diameter wafer W1. As a result, when the storage container 1 2 is transported, the large-diameter wafer W 1 moves or does not move inside. Can be prevented.
- the cassette base table 44 shown in FIG. 6 is installed at the bottom of the empty box container 16. At the time of installation of the force-set base 44, the cassette base 44 is housed in the bottom of the box container 16. At this time, the engagement projection 62 shown in FIG. 6 is engaged with the groove 32 (see FIG. 2) at the bottom of the container. Then, the adjusting screws 52 B, 54 B, 56 B of the fixing fixtures 52, 54, 56 for each unit move the pressing pieces 52 C, 54 C, 56 C to the outside. It is rotated as you do.
- the open cassette C that can accommodate the wafer W2 having a diameter of 200 mm is mounted on the cassette base table 44.
- the protruding positioning member 42 (see FIG. 4) provided at the bottom of the cassette C is adjusted to the positioning engagement portion 38 (see FIG. 6) on the cassette base 44. (Fig. 7).
- the cassette C is mounted at an appropriate position on the cassette base table 44.
- a small-diameter wafer W2 having a diameter of 200 mm is placed, for example, in multiple stages.
- the small-diameter wafer W 2 is stored and held in the storage container 12.
- the opening 14 of the box container 16 is closed by the opening / closing lid 20.
- the protrusion preventing member 34 provided on the opening / closing lid 20 substantially contacts the end of the wafer W2 in the cassette C. Therefore, when the storage container body 12 is transported, the wafer W2 can be prevented from being displaced or jumping out.
- the cassette base table 44 and the cassette By mounting or removing C, a large-diameter wafer (for example, a wafer W 1 having a diameter of 30 O mm) and a small-diameter wafer (for example, The wafer W 2) having a diameter of 200 mm can be selectively stored.
- the cassette base table 44 on which the cassette C is mounted can be attached and detached simply by operating the table fixing jigs 52, 54, 56 provided thereon. Therefore, this attaching / detaching operation can be easily performed.
- the support portion 18 (see FIG. 2) for supporting the large-diameter wafer W1 is not used. Therefore, the support portion 18 is not damaged.
- the protrusion preventing member 34 is a plate-shaped PEEK material having a curved contact surface with the wafer, but is not limited thereto.
- a structure as shown in FIGS. 8 to 10 can be adopted.
- FIG. 8 is a view showing a protrusion prevention member for a large-diameter wafer.
- FIG. 9 is a perspective view showing a part of the protrusion preventing member shown in FIG.
- FIG. 10 is a diagram showing a protrusion prevention member for a small-diameter wafer.
- the protrusion prevention member 64 for the large-diameter wafer W1 shown in FIGS. 8 and 9 has a pair of elastic support arms 66 that abut on the peripheral edge of the wafer W1.
- the pair of elastic support arms 66 are made of, for example, PEEK (polyetheretherketone). Each arm 66 is bendable, that is, has some elasticity.
- the pair of elastic support arms 66 extend in the horizontal direction, and at a predetermined pitch along the vertical direction (height direction) of the opening / closing lid 20, the number corresponding to the number of stored wafers W 1. Is provided.
- the elastic support arm 66 can prevent the large-diameter wafer W1 from jumping out.
- the protrusion preventing member 68 for the small-diameter wafer W2 shown in FIG. 10 has two thin elastic plate members 70A and 70B made of, for example, PEEK. With the peripheral portions of the two elastic plate members 7 OA 70 B sandwiching the elastic support arm 66, The flexible plate members 70 A and 70 B are attached and fixed with screws 72. As a result, the small-diameter wafer W2 can be prevented from jumping out by the plate members 70A and 70B. In this case, another member may be provided separately instead of the elastic support arm 66.
- a wafer having a diameter of 300 mm (12 inches) is used as the large-diameter wafer W1
- a wafer having a diameter of 200 mm (8 inches) is used as the small-diameter wafer W2.
- a wafer is used, but is not limited to this.
- a wafer having a diameter of 150 mm (6 inches) can be used as the small-diameter wafer W2.
- the positioning engagement portion 38 is provided on the cassette base table 44, but is not limited to this.
- the positioning engagement portion 38 may be directly detachable from the bottom of the box container 16 without using the cassette base 44.
- the positioning engagement portion 38 may be fixed to the bottom of the box container 16 with screws or the like.
- the storage container body 12 of the above embodiment can selectively store the wafer W1 having a diameter of 300 mm and the wafer W2 having a diameter of 200 mm, but is not limited thereto. Not.
- FIG. 11 is a perspective view showing a storage container 80 capable of storing only a small-diameter wafer W2 having a diameter of, for example, 200 mm together with the cassette C.
- the box container 82 may have a size that can accommodate the cassette C. Therefore, the box container 82 is formed about one turn smaller than the box container 16 shown in FIG. 2 and FIG.
- the box container 16 is not provided with the support portion 18 for supporting the large-diameter wafer W1. Further, it is not necessary to make the positioning engagement portion 38 detachable. Therefore, no cassette base 44 (see Fig. 3) is provided. That is, the positioning engagement portion 38 is directly attached and fixed on the bottom in the box container 82. Then, as described above, the cassette C is positioned and attached one by one using the positioning engagement portion 38.
- the opening / closing lid 20 that closes the opening of the box container 82 has the same dimensions as those shown in FIGS. Therefore, the opening / closing lid of the storage container body 80
- the external mechanism for releasing the lock mechanism 22 of FIG. 20 can be the same as the external mechanism for releasing the lock mechanism 22 of the storage container body 12 of FIGS. Note that the handle is not shown in FIG.
- the small-diameter wafer W2 stored in the open-type cassette C can be stored in a closed state.
- FIG. 12 is a schematic configuration diagram illustrating an example of a processing system according to the present embodiment.
- FIG. 13 is a perspective view illustrating a main part of the processing system.
- FIG. 14 is a perspective view illustrating the processing system.
- FIG. 2 is a diagram illustrating an example of a processing target object transfer mechanism used.
- the entire processing system 90 for the object to be processed is surrounded by a casing 92 made of, for example, stainless steel.
- the inside of the housing 92 includes a container transport area 94 for transporting the storage containers 12 and 80 described above, and a processing target for transporting the semiconductor wafers W 1 and W 2 as the workpieces. It is divided into two parts by a wafer transfer area 96 as a body transfer area and a partition wall 98. In the container body transport area 94, a down flow of clean air is flowing. Above wafer transfer area
- the inside of 96 is filled with an atmosphere of an inert gas such as N 2 gas or clean air.
- the processing system 90 mainly includes a port 100 for bringing the storage containers 12 and 80 into and out of the system 90, and a temporary storage container 12 and 80.
- a box carrying-in / out port 112 is formed in the casing 92, and is always open. Outside the box entrance 1 12, an outer mounting table 1 14 for mounting the storage containers 12 and 80 carried from the outside is provided so as to be able to slide inward. I have.
- the storage container body 12 A shelf or the like in which 80 is temporarily placed and stored is provided.
- the partition wall 98 partitioning between the two areas 94 and 96 has a size substantially the same as the opening of the storage container body 12 and 80 1
- One or more openings 1 16 are formed.
- One mounting table 118 is provided horizontally on the container body transport area side of the opening 116.
- the storage container bodies 12, 80 mounted on the mounting table 118 can be fixed by being urged toward the partition wall 98 side.
- the opening 1 16 is provided with an opening / closing door 120 that opens and closes the opening.
- a container transporting mechanism 122 having an elevator function is provided between the mounting table 118 and the load port 100. Thereby, the storage container bodies 12 and 80 can be arbitrarily transferred between the load port 100, the storage force 102 and the mounting table 106.
- the opening / closing mechanism 110 for opening and closing the opening / closing lid 20 and the opening / closing door 120 of the storage containers 12 and 80 is provided immediately below the opening 1 16 on the wafer transfer area side. Is placed.
- the opening / closing mechanism 110 for example, the opening / closing mechanism disclosed in the above-mentioned Japanese Patent Application Laid-Open No. Hei 8-279495 and the opening / closing mechanism disclosed in the Japanese Patent Application Laid-Open No. Hei 11-274746 A mechanism or the like can be used.
- a boat elevating mechanism 124 for elevating and lowering the object boat 104 such as a wafer boat is provided in the wafer transfer area 96. Further, between the boat elevating mechanism 124 and the transfer stage 106, there is provided an object transfer mechanism 126 having an arm 126A capable of turning and bending.
- the processing object transfer mechanism 1 26 can be moved up and down by a lifting elevator 128. Therefore, by bending and extending and turning the arm 1 26 A of the object transfer mechanism 12 2 and raising and lowering the object transfer mechanism 1 26, the storage container 1 2 on the mounting table 1 18 Transfer of the wafers Wl and W2 can be performed between 80 and the object boat 104.
- the object boat 104 is made of, for example, quartz, and can support, for example, about 1 to 150 wafers in multiple stages at a predetermined pitch. Specifically, as the object boat 104, for example, a boat for a large diameter wafer having a diameter of 300 mm, for example, a boat for a small diameter wafer having a diameter of 200 mm, Is prepared. Then, depending on the size of the wafer to be processed, one of the boats is selectively used. You.
- a cylindrical processing container 108 made of quartz is arranged above one side of the wafer transfer area 96.
- the processing container 108 performs a predetermined heat treatment such as film formation or oxidative diffusion on many wafers W1 or W2 at a time.
- the size of the processing container 108 is set to a size that can accommodate the large-diameter wafer W1.
- a cap 13 ° which can be moved up and down by a boat elevating mechanism 124 is arranged.
- the object boat 104 is placed on the cap 130. Then, by raising the cap 130, the object boat 104 can be loaded into the processing container 108 through the lower end opening of the processing container 108.
- the lower end opening of the processing container 108 is air-tightly closed by the cap 130.
- FIG. 14 shows an example of one arm 126A.
- FIG. 14 (A) is a plan view of the arm
- FIG. 14 (B) is a cross-sectional view of the arm.
- the tip of the arm 126A has a two-stepped portion.
- the wider step is formed as a large-diameter step 134A for holding a large-diameter wafer W1.
- the narrow step portion is formed as a small-diameter step portion 134B for holding a small-diameter wafer W2.
- this one kind of arm 12 26 A can handle both the large-diameter wafer W 1 and the small-diameter wafer W 2.
- this arm 126A may be replaced according to the wafer size.
- the opening / closing lid 110 can be opened and closed by one kind of opening / closing mechanism 110, and the wafer W1 or W2 can correspond to its size. Placed in the processing object boat 104 which has been Heat treatment.
- the configuration of the processing system 90 is merely an example, and is not limited to this.
- the present invention is not limited thereto, and the present invention can be applied to a glass substrate, an LSD substrate, and the like.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020047010369A KR100779828B1 (ko) | 2002-06-06 | 2003-05-26 | 피처리체의 수납 용기 부재 |
US10/516,511 US7073999B2 (en) | 2002-06-06 | 2003-05-26 | Receiving container body for object to be processed |
EP03730629A EP1511076A4 (en) | 2002-06-06 | 2003-05-26 | RECEIVING CONTAINER BODY FOR AN OBJECT TO BE PROCESSED |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-165763 | 2002-06-06 | ||
JP2002165763A JP4218260B2 (ja) | 2002-06-06 | 2002-06-06 | 被処理体の収納容器体及びこれを用いた処理システム |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003105218A1 true WO2003105218A1 (ja) | 2003-12-18 |
Family
ID=29727607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/006542 WO2003105218A1 (ja) | 2002-06-06 | 2003-05-26 | 被処理体の収納容器体 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7073999B2 (ja) |
EP (1) | EP1511076A4 (ja) |
JP (1) | JP4218260B2 (ja) |
KR (1) | KR100779828B1 (ja) |
CN (1) | CN1320626C (ja) |
TW (1) | TWI276196B (ja) |
WO (1) | WO2003105218A1 (ja) |
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KR20040011995A (ko) * | 2002-07-31 | 2004-02-11 | 삼성전자주식회사 | 200 ㎜ 및 300 ㎜ 웨이퍼 겸용 웨이퍼 캐리어 |
US7347329B2 (en) * | 2003-10-24 | 2008-03-25 | Entegris, Inc. | Substrate carrier |
US7316325B2 (en) * | 2003-11-07 | 2008-01-08 | Entegris, Inc. | Substrate container |
JP4667769B2 (ja) * | 2004-06-11 | 2011-04-13 | 信越ポリマー株式会社 | 基板収納容器 |
JP4781029B2 (ja) * | 2004-12-03 | 2011-09-28 | アキレス株式会社 | ディスク収納用パッケージ |
US20080041758A1 (en) * | 2006-08-16 | 2008-02-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer carrier |
JP4756372B2 (ja) * | 2006-09-13 | 2011-08-24 | 株式会社ダイフク | 基板処理方法 |
JP4807579B2 (ja) * | 2006-09-13 | 2011-11-02 | 株式会社ダイフク | 基板収納設備及び基板処理設備 |
DE102006051493A1 (de) * | 2006-10-31 | 2008-05-08 | Advanced Micro Devices, Inc., Sunnyvale | System und Verfahren zur vertikalen Scheibenhandhabung in einer Prozesslinie |
KR101150850B1 (ko) * | 2010-01-22 | 2012-06-13 | 주식회사 엘지실트론 | 웨이퍼 세정장비용 카세트 지그 및 이를 구비한 카세트 어셈블리 |
JP5473691B2 (ja) * | 2010-03-16 | 2014-04-16 | 株式会社ディスコ | 収容カセット |
JP5301731B2 (ja) * | 2010-05-24 | 2013-09-25 | ミライアル株式会社 | 基板収納容器 |
CN103250237A (zh) * | 2010-10-20 | 2013-08-14 | 恩特格里公司 | 最小化门挠曲的前开式晶圆容器 |
JP5617708B2 (ja) * | 2011-03-16 | 2014-11-05 | 東京エレクトロン株式会社 | 蓋体開閉装置 |
CN103035559B (zh) * | 2011-09-29 | 2015-04-22 | 中芯国际集成电路制造(北京)有限公司 | 弹性固定轮及包含其的晶圆适配器 |
WO2013069088A1 (ja) * | 2011-11-08 | 2013-05-16 | ミライアル株式会社 | ウェーハ収納容器 |
JP5916508B2 (ja) * | 2012-05-14 | 2016-05-11 | 信越ポリマー株式会社 | 基板収納容器 |
US10190235B2 (en) * | 2013-05-24 | 2019-01-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer supporting structure and method for forming the same |
US9698038B2 (en) * | 2014-08-28 | 2017-07-04 | Infineon Technologies Ag | Adapter tool and wafer handling system |
KR102208275B1 (ko) * | 2016-02-05 | 2021-01-27 | 엔테그리스, 아이엔씨. | 기판 용기용 쿠션 리테이너 |
KR101756743B1 (ko) * | 2016-12-30 | 2017-07-12 | 김태훈 | 웨이퍼 가공 설비용 버퍼 챔버 유닛 |
CN109119369B (zh) * | 2017-06-23 | 2020-07-14 | 上海微电子装备(集团)股份有限公司 | 晶圆传送盒和晶圆自动传送系统 |
JP7082274B2 (ja) * | 2017-11-06 | 2022-06-08 | シンフォニアテクノロジー株式会社 | ロードポート、及びロードポートにおけるマッピング処理方法 |
KR101999485B1 (ko) * | 2018-07-03 | 2019-10-01 | 세양전자 주식회사 | 웨이퍼 이송용기 |
CN109300828B (zh) * | 2018-09-29 | 2022-11-15 | 长春长光圆辰微电子技术有限公司 | 一种晶圆的传输系统及传输方法 |
KR102632741B1 (ko) * | 2018-12-12 | 2024-02-01 | 미라이얼 가부시키가이샤 | 기판수납용기 |
CN110203521B (zh) * | 2019-06-03 | 2020-09-15 | 唐山国芯晶源电子有限公司 | 一种晶片周转盒 |
JP7421991B2 (ja) | 2020-04-09 | 2024-01-25 | 信越ポリマー株式会社 | 基板収納容器 |
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- 2003-05-26 US US10/516,511 patent/US7073999B2/en not_active Expired - Fee Related
- 2003-05-26 EP EP03730629A patent/EP1511076A4/en not_active Withdrawn
- 2003-05-26 KR KR1020047010369A patent/KR100779828B1/ko active IP Right Grant
- 2003-05-26 CN CNB038062208A patent/CN1320626C/zh not_active Expired - Fee Related
- 2003-06-06 TW TW092115433A patent/TWI276196B/zh not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
---|---|
CN1643676A (zh) | 2005-07-20 |
TW200404349A (en) | 2004-03-16 |
JP4218260B2 (ja) | 2009-02-04 |
CN1320626C (zh) | 2007-06-06 |
EP1511076A1 (en) | 2005-03-02 |
US20050173358A1 (en) | 2005-08-11 |
KR100779828B1 (ko) | 2007-11-28 |
TWI276196B (en) | 2007-03-11 |
EP1511076A4 (en) | 2008-08-13 |
JP2004014785A (ja) | 2004-01-15 |
KR20050006124A (ko) | 2005-01-15 |
US7073999B2 (en) | 2006-07-11 |
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