WO2003081954A1 - Ecran electroluminescent organique et son procede de production - Google Patents
Ecran electroluminescent organique et son procede de production Download PDFInfo
- Publication number
- WO2003081954A1 WO2003081954A1 PCT/JP2003/003311 JP0303311W WO03081954A1 WO 2003081954 A1 WO2003081954 A1 WO 2003081954A1 JP 0303311 W JP0303311 W JP 0303311W WO 03081954 A1 WO03081954 A1 WO 03081954A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- organic
- display panel
- polymer compound
- film
- substrate
- Prior art date
Links
- 238000005401 electroluminescence Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 150000001875 compounds Chemical class 0.000 claims abstract description 53
- 229920000642 polymer Polymers 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 230000004888 barrier function Effects 0.000 claims abstract description 37
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 25
- 239000002346 layers by function Substances 0.000 claims description 17
- -1 polyparaxylylene Polymers 0.000 claims description 16
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 12
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 12
- 238000006116 polymerization reaction Methods 0.000 claims description 11
- 239000004033 plastic Substances 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 8
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 8
- 238000005229 chemical vapour deposition Methods 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 3
- 229920006254 polymer film Polymers 0.000 claims description 2
- 239000010408 film Substances 0.000 description 84
- 239000007789 gas Substances 0.000 description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 239000000178 monomer Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000005525 hole transport Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VRBFTYUMFJWSJY-UHFFFAOYSA-N 28804-46-8 Chemical compound ClC1CC(C=C2)=CC=C2C(Cl)CC2=CC=C1C=C2 VRBFTYUMFJWSJY-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 230000009545 invasion Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000282693 Cercopithecidae Species 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- FUJCRWPEOMXPAD-UHFFFAOYSA-N lithium oxide Chemical compound [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 1
- 229910001947 lithium oxide Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920005597 polymer membrane Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- MWWATHDPGQKSAR-UHFFFAOYSA-N propyne Chemical group CC#C MWWATHDPGQKSAR-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical class C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
Definitions
- the present invention relates to an organic electroluminescent device (hereinafter, referred to as “organic”) having at least one thin film (hereinafter, referred to as an organic functional layer) including a light emitting layer made of an organic compound material exhibiting electroluminescence that emits light by current injection.
- organic organic electroluminescent device
- organic functional layer thin film
- a light emitting layer made of an organic compound material exhibiting electroluminescence that emits light by current injection.
- organic electroluminescent display panel hereinafter referred to as an organic EL display panel
- An organic EL device basically has an organic functional layer sandwiched between an anode and a cathode, and excitons formed when electrons and holes injected from both electrodes recombine return from the excited state to the ground state and emit light.
- an organic EL element is formed by sequentially laminating a transparent electrode of an anode, an organic functional layer, and a metal electrode of a cathode on a transparent substrate, and emits light from the transparent substrate side.
- the organic functional layer may be a single layer of a light emitting layer, a three-layer structure of an organic hole transport layer, a light-emitting layer and an organic electron transport layer, or a two-layer structure of an organic hole transport layer and a light-emitting layer. This is a laminate in which an electron or hole injection layer or a carrier block layer is inserted between layers.
- organic EL display panel for example, a matrix display type, One having a predetermined light emission pattern is known.
- organic EL elements When exposed to the atmosphere, these organic EL elements are susceptible to degradation by the effects of gases such as moisture and oxygen, and certain other molecules in the environment in which they are used. At the interface of, the characteristics are remarkably deteriorated, and there is a problem that the light emission characteristics such as luminance and color are deteriorated.
- a method of sealing the organic EL element with a protective layer of a single layer of inorganic material such as silicon oxide to suppress its degradation can be considered, but this is a sufficient barrier. Has no property. That is, pinholes cannot be avoided with an inorganic barrier film. If there is a pinhole in the protective film, moisture, oxygen, etc. will intrude from the pinhole, and the dark spot of the organic EL element, which does not emit light, will expand.
- an object of the present invention is to provide an organic EL element and an organic EL display panel that have high shielding properties against oxygen and moisture for an organic functional layer or an electrode, and are not easily deteriorated in light emission characteristics.
- the organic electroluminescent display panel of the present invention comprises at least one organic functional layer comprising an organic compound sandwiched and laminated between the first and second display electrodes, including first and second display electrodes and a light emitting layer.
- An organic electroluminescent display panel comprising: an organic electroluminescent device; and a substrate supporting the organic electroluminescent device.
- An inorganic barrier film that covers the edge of the polymer compound film and the periphery of the surface of the substrate.
- the inorganic barrier film is made of silicon nitride, silicon nitride oxide, or silicon oxide.
- the inorganic barrier film is formed by a plasma enhanced chemical vapor deposition method or a sputtering method.
- the polymer compound film is formed by a plasma polymerization growth method or a chemical vapor deposition method.
- the polymer compound film is made of polyparaxylylene.
- the substrate is a plastic substrate made of a polymer compound.
- the organic is characterized in that it has a substrate-side inorganic barrier film formed in advance so as to cover the surface supporting the electroluminescent element.
- the method for manufacturing an organic electroluminescent display panel according to the present invention includes the method of manufacturing one or more organic electroluminescent elements and the organic electroluminescent element.
- a method for manufacturing an organic electroluminescent display panel comprising a substrate carrying a fluorescent element,
- One or more organic ELs each comprising one or more organic functional layers comprising an organic compound sandwiched and laminated between the first and second display electrodes, each including first and second display electrodes and a light emitting layer on a substrate Forming an element;
- a part of the polymer compound film is formed so that the film thickness gradually decreases.
- the inorganic barrier film is made of silicon nitride, silicon nitride oxide, or silicon oxide.
- the inorganic barrier film is formed by a plasma enhanced chemical vapor deposition method.
- the polymer compound film is formed by a plasma polymerization growth method.
- FIG. 1 is a schematic perspective view of an organic EL device according to an embodiment of the present invention.
- 2 to 4 are schematic perspective views of a substrate in a process of manufacturing an organic EL display panel according to the present invention.
- FIG. 5 is a partially enlarged rear view of an organic EL display panel including a plurality of organic EL elements according to another embodiment of the present invention.
- FIG. 6 is a schematic perspective view of an organic EL device according to another embodiment of the present invention.
- the inventor conducted an experiment using a two-layer sealing structure of a polymer compound film and an inorganic barrier film in an organic EL device because the sealing of the organic EL device using only the inorganic barrier film is insufficient.
- the covering area of the polymer compound film and the inorganic barrier film if the edge of the polymer compound film close to the organic EL element is not covered with the inorganic barrier film, moisture will be generated from the exposed edge of the polymer compound film. It has been found that oxygen and oxygen penetrate and invade, and proceed through the polymer compound film, causing damage to the organic EL device. Therefore, according to the present invention, the organic EL element is protected by covering the polymer compound film wedge with the inorganic barrier film and blocking invasion of moisture and oxygen from the edge.
- FIG. 1 shows the organic EL device of the present embodiment.
- the organic EL element according to the embodiment includes a first display electrode 13 (transparent An anode of an electrode), at least one organic functional layer 14 including a light emitting layer made of an organic compound, and a second display electrode 15 (a cathode of a metal electrode). Further, the organic EL element has a sealing film, ie, a polymer compound film 16P and an inorganic barrier film 16S, which are sequentially stacked so as to cover the back surface of the second display electrode 15.
- the polymer compound film 16 P covers the surface R 1 of the organic EL element D and the surrounding substrate 10.
- the inorganic barrier film 16S covers the polymer compound film 16P, its edge E, and the surface R2 of the substrate around it.
- the edge E of the polymer compound film 16 P is formed so that the film thickness gradually decreases. This is to ensure smooth deposition of the inorganic barrier film 16S.
- the material of the substrate 10 is not limited, it can be selected from inorganic substances such as glass and organic substances such as polymer compounds.
- a first display electrode 13 made of indium tin oxide (ITO) is formed on a substrate 10 by vapor deposition or sputtering.
- a hole injection layer composed of copper phthalocyanine, a hole transport layer composed of TPD (triphenylamine derivative), a light emitting layer composed of A 1 q 3 (aluminum chelate complex), and Li 2 ⁇ (lithium oxide) is sequentially deposited to form the organic functional layer 14.
- a second display electrode 15 made of A1 is formed thereon by vapor deposition so as to face the electrode pattern of the transparent electrode 13 via the organic functional layer 14.
- a polyparaxylylene film is formed on the organic EL device as a polymer compound film 16P by CVD (chemical vapor deposition). You. At this time, the polymer compound film 16P is formed using the first opening mask M1 in a range larger than the display area including the pixel or the organic EL element.
- a silicon nitride film is formed on the polymer compound film 16P as an inorganic barrier film 16S by plasma CVD (plasma chemical vapor deposition).
- the inorganic barrier film 16S is formed in a range larger than the polymer compound film 16P using the second opening mask M2, and the organic EL device shown in FIG. 1 is formed.
- the second opening mask M2 has an opening for passing an inorganic substance having an area smaller than that of the first opening mask M1
- an inorganic barrier film 16S is formed so as to cover the edge of the polymer compound film 16P.
- There also c can be formed, deposited repeated similarly in the case of a multilayer structure alternately laminating the polymer membranes 1 6 P and inorganic barrier layer 1 6 S.
- the plasma polymerization method for forming a polymer compound film 16 P is a film formation method in which organic molecules are formed into a plasma state and polymerized by force coupling of generated radical species. According to plasma polymerization, a monomer does not need a special polymerizable group such as a vinyl group as long as it has a vapor pressure, and the obtained polymer compound film becomes a dense thin film.
- plasma polymerization is performed by an AC plasma polymerization apparatus, but polymerization may be performed by a DC plasma method in which a cathode and an anode are distinguished.
- the raw material gas for the polymer compound film is, for example, hydrocarbon-based monomers such as methane, ethane, propane, butane, pentane, ethylene, propylene, butene, butadiene, acetylene, methylacetylene, hexamethyldisiloxane, triethoxyvinylsilane, and polystyrene.
- hydrocarbon-based monomers such as methane, ethane, propane, butane, pentane, ethylene, propylene, butene, butadiene, acetylene, methylacetylene, hexamethyldisiloxane, triethoxyvinylsilane, and polystyrene.
- Dimethylsiloxane, Tet Examples include gay monomer such as lamethoxysilane, and hydrogen fluoride monomer such as tetrafluoroethylene.
- a polymer compound film consisting essentially of carbon and hydrogen is preferred because it has the advantage of forming a hard film having no pinholes on the surface and is preferably represented by the ratio of the number of atoms (atomic composition ratio).
- the HZC is preferably 1.5 or less, a polymer compound film having good properties and three-dimensionally fully crosslinked can be formed.
- Such a polymer compound film can be formed by reducing the amount of hydrocarbon-based monomer gas, lowering the reaction pressure, and increasing the applied power. That is, when the reaction pressure is lowered and the applied power is increased, the decomposition energy per unit amount of the monomer is increased and the decomposition proceeds to form a crosslinked polymer compound film.
- a gas such as hydrogen or an inert gas can be used as a carrier gas.
- Polymer film formed by CVD is polyparaxylene, especially paraxylylene polymerized film or chlorinated paraxylylene polymerized film, which has extremely low gas and water vapor permeability, can suppress contamination of impurities, and has a small pinhole. It is preferable because a uniform film can be formed.
- xylene resins include Parylene N (polyparaxylylene), Parylene C (polymonochloroporous paraxylylene), and Parylene D (polydichloroparaxylylene) manufactured by Union Carbide Co. of the United States.
- Parylene C is preferable in terms of low gas permeability, but Parylene N is sufficient because a SiN film is formed thereon.
- High molecular compound films such as polyparaxylylene can be obtained by thermally decomposing a dimer gas under reduced pressure.
- a predetermined organic functional layer was formed on the ITO anode surface of a glass substrate, and an A1 cathode was further formed to form an organic EL device.
- a polyethylene polymer compound film is formed by plasma polymerization so as to cover the organic EL element.
- an inorganic barrier film of silicon nitride is formed so as to cover the edge of the polymer compound film and the surface of the substrate around it.
- FIG. 5 is a partially enlarged rear view of an organic EL display panel including a plurality of organic EL elements according to another embodiment.
- the organic EL display panel includes a plurality of organic EL elements arranged in a matrix on the substrate 10.
- the substrate 1 includes a row electrode 13 including a transparent electrode layer (a first display electrode as an anode), an organic functional layer, and a column electrode 15 including a metal electrode layer intersecting the row electrode 15 (a second display electrode). 0.
- the row electrodes are each formed in a strip shape, and are arranged so as to be parallel to each other at a predetermined interval, and the same applies to the column electrodes.
- the matrix display type display The panel has an image display array composed of a plurality of organic EL element light emitting pixels formed at intersections of a plurality of rows and columns of electrodes.
- the organic EL display panel may include a plurality of partitions 7 provided in parallel between the organic EL elements on the substrate 10.
- a polymer compound film 16P and an inorganic barrier film 16S are formed on the second display electrodes 15 and the partition walls 7 so as to cover the plurality of organic EL elements.
- the materials for the organic functional layers may be selected and laminated as appropriate to form red, green G, and blue B light emitting portions.
- FIG. 6 shows an organic EL device according to another embodiment.
- This organic EL device was manufactured by using a plastic substrate 10 made of a synthetic resin, and the surface thereof was covered with a substrate-side inorganic barrier film 22 made of an inorganic substance such as silicon nitride, silicon nitride oxide, or silicon oxide. This is the same as the embodiment of FIG.
- the electrode of the organic EL device is formed on the substrate-side inorganic barrier film 22.
- the surface of the plastic substrate covered by the substrate-side inorganic barrier film 22 is at least a surface in contact with the organic EL element, a surface between the organic EL elements, a surface around the organic EL element, and a back side of the surface in contact with the organic EL element. It is preferred to include a surface. This is to prevent intrusion of art gas and the like from the plastic substrate into the organic functional layer. In addition, both sides of the plastic substrate are By covering with a film 22, warpage of the plastic substrate can be prevented.
- plasma CVD is used as a method of manufacturing the inorganic barrier film.
- the present invention is not limited to this, and a vapor phase growth method such as a sputtering method or a vacuum evaporation method can be applied.
- the present invention can also be applied to a substrate of an active matrix display type panel using TFT or the like.
- moisture content and oxygen from a polymer compound film edge can be interrupted
- a high organic EL display panel can be provided. Further, by covering the edge of the polymer compound film portion of the multilayer structure protective film with the inorganic barrier film protective film, a highly reliable organic EL display panel can be provided.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/508,857 US7345420B2 (en) | 2002-03-25 | 2003-03-19 | Organic electroluminescence display panel and method for manufacturing the same |
KR1020047015337A KR100683463B1 (ko) | 2002-03-25 | 2003-03-19 | 유기 전계발광 디스플레이 패널 및 그 제조방법 |
AU2003220921A AU2003220921A1 (en) | 2002-03-25 | 2003-03-19 | Organic electroluminescence display panel and method for manufacturing the same |
EP03744996A EP1489889A4 (en) | 2002-03-25 | 2003-03-19 | ORGANIC ELECTROLUMINESCENT SCREEN AND METHOD FOR PRODUCING THE SAME |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002082512A JP2003282240A (ja) | 2002-03-25 | 2002-03-25 | 有機エレクトロルミネッセンス表示パネル及び製造方法 |
JP2002-082512 | 2002-03-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003081954A1 true WO2003081954A1 (fr) | 2003-10-02 |
Family
ID=28449146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/003311 WO2003081954A1 (fr) | 2002-03-25 | 2003-03-19 | Ecran electroluminescent organique et son procede de production |
Country Status (8)
Country | Link |
---|---|
US (1) | US7345420B2 (ja) |
EP (1) | EP1489889A4 (ja) |
JP (1) | JP2003282240A (ja) |
KR (1) | KR100683463B1 (ja) |
CN (1) | CN100459209C (ja) |
AU (1) | AU2003220921A1 (ja) |
TW (1) | TW200305348A (ja) |
WO (1) | WO2003081954A1 (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7399668B2 (en) * | 2004-09-30 | 2008-07-15 | 3M Innovative Properties Company | Method for making electronic devices having a dielectric layer surface treatment |
JP2007005189A (ja) * | 2005-06-24 | 2007-01-11 | Tokki Corp | 有機膜形成用マスク,封止膜形成装置並びに封止膜の形成方法 |
JP4600254B2 (ja) * | 2005-11-22 | 2010-12-15 | セイコーエプソン株式会社 | 発光装置および電子機器 |
JP4702009B2 (ja) * | 2005-11-22 | 2011-06-15 | セイコーエプソン株式会社 | 発光装置および電子機器 |
KR100683802B1 (ko) * | 2005-12-07 | 2007-02-20 | 삼성에스디아이 주식회사 | 유기 발광 디스플레이 장치의 제조방법 |
JP4776393B2 (ja) * | 2006-02-20 | 2011-09-21 | 株式会社 日立ディスプレイズ | 有機el表示装置 |
JP2007273446A (ja) | 2006-03-06 | 2007-10-18 | Seiko Epson Corp | エレクトロルミネッセンス装置 |
WO2008072148A2 (en) | 2006-12-12 | 2008-06-19 | Philips Intellectual Property & Standards Gmbh | Voltage-operated layered arrangement |
JP2008174816A (ja) * | 2007-01-22 | 2008-07-31 | Sony Corp | 蒸着装置、蒸着方法および有機電界発光素子ならびに表示装置 |
KR101369910B1 (ko) * | 2007-03-30 | 2014-03-05 | 삼성전자주식회사 | 유기전계 발광소자 및 그 제조방법 |
US7936122B2 (en) | 2007-12-14 | 2011-05-03 | Canon Kabushiki Kaisha | Organic EL display apparatus |
JP2009193914A (ja) * | 2008-02-18 | 2009-08-27 | Pioneer Electronic Corp | 電子デバイス |
JPWO2009104241A1 (ja) * | 2008-02-18 | 2011-06-16 | パイオニア株式会社 | パターン形成方法及びシャドウマスク |
JP5424738B2 (ja) | 2009-06-23 | 2014-02-26 | キヤノン株式会社 | 表示装置 |
JP5356532B2 (ja) * | 2009-10-08 | 2013-12-04 | シャープ株式会社 | 発光部を有する複数のパネルを繋げてなる発光パネル装置、それを備えた画像表示装置および照明装置 |
JP2012119338A (ja) * | 2012-02-15 | 2012-06-21 | Pioneer Electronic Corp | 電子デバイス |
TWI492374B (zh) * | 2012-12-03 | 2015-07-11 | Au Optronics Corp | 電激發光顯示面板 |
JP2015184542A (ja) * | 2014-03-25 | 2015-10-22 | ソニー株式会社 | 表示パネルおよび表示パネルの製造方法 |
CN105528116A (zh) * | 2016-01-22 | 2016-04-27 | 昆山维信诺科技有限公司 | 触控显示装置 |
WO2019020391A1 (en) * | 2017-07-27 | 2019-01-31 | Evatec Ag | PERMEATION BARRIER |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04137483A (ja) * | 1990-09-28 | 1992-05-12 | Toshiba Corp | 有機薄膜el素子 |
JPH07211455A (ja) * | 1994-01-19 | 1995-08-11 | Idemitsu Kosan Co Ltd | 有機elデバイス |
JPH09161967A (ja) * | 1995-11-30 | 1997-06-20 | Motorola Inc | 有機デバイスのパッシベーション |
JPH10247587A (ja) * | 1997-02-28 | 1998-09-14 | Tdk Corp | 有機エレクトロルミネッセンス表示装置およびその製造方法 |
JP2000068050A (ja) * | 1998-08-24 | 2000-03-03 | Casio Comput Co Ltd | 電界発光素子及びその製造方法 |
JP2002025765A (ja) * | 2000-07-10 | 2002-01-25 | Kyushu Matsushita Denki Kk | 有機エレクトロルミネッセンス素子及びその製造方法 |
JP2002117973A (ja) * | 2000-05-16 | 2002-04-19 | Toyota Central Res & Dev Lab Inc | 有機電界発光素子及びその製造装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2797905B2 (ja) * | 1993-06-25 | 1998-09-17 | 凸版印刷株式会社 | 有機薄膜el素子 |
EP0717445B1 (en) * | 1994-12-14 | 2009-06-24 | Eastman Kodak Company | An electroluminescent device having an organic electroluminescent layer |
JP3290375B2 (ja) * | 1997-05-12 | 2002-06-10 | 松下電器産業株式会社 | 有機電界発光素子 |
JP2000058256A (ja) * | 1998-08-07 | 2000-02-25 | Canon Inc | 有機発光素子 |
TW480896B (en) * | 1999-07-30 | 2002-03-21 | Sony Corp | Organic electroluminescent device |
JP4712198B2 (ja) * | 2000-02-01 | 2011-06-29 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
JP2001338755A (ja) * | 2000-03-21 | 2001-12-07 | Seiko Epson Corp | 有機el素子およびその製造方法 |
TWI226205B (en) * | 2000-03-27 | 2005-01-01 | Semiconductor Energy Lab | Self-light emitting device and method of manufacturing the same |
JP4004709B2 (ja) * | 2000-03-30 | 2007-11-07 | パイオニア株式会社 | 有機エレクトロルミネッセンス表示パネル及びその製造方法 |
JP2002100469A (ja) * | 2000-09-25 | 2002-04-05 | Pioneer Electronic Corp | 有機エレクトロルミネッセンス表示パネル |
-
2002
- 2002-03-25 JP JP2002082512A patent/JP2003282240A/ja active Pending
-
2003
- 2003-03-19 WO PCT/JP2003/003311 patent/WO2003081954A1/ja active Application Filing
- 2003-03-19 AU AU2003220921A patent/AU2003220921A1/en not_active Abandoned
- 2003-03-19 KR KR1020047015337A patent/KR100683463B1/ko not_active IP Right Cessation
- 2003-03-19 EP EP03744996A patent/EP1489889A4/en not_active Ceased
- 2003-03-19 CN CNB038068427A patent/CN100459209C/zh not_active Expired - Lifetime
- 2003-03-19 US US10/508,857 patent/US7345420B2/en not_active Expired - Lifetime
- 2003-03-21 TW TW092106382A patent/TW200305348A/zh unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04137483A (ja) * | 1990-09-28 | 1992-05-12 | Toshiba Corp | 有機薄膜el素子 |
JPH07211455A (ja) * | 1994-01-19 | 1995-08-11 | Idemitsu Kosan Co Ltd | 有機elデバイス |
JPH09161967A (ja) * | 1995-11-30 | 1997-06-20 | Motorola Inc | 有機デバイスのパッシベーション |
JPH10247587A (ja) * | 1997-02-28 | 1998-09-14 | Tdk Corp | 有機エレクトロルミネッセンス表示装置およびその製造方法 |
JP2000068050A (ja) * | 1998-08-24 | 2000-03-03 | Casio Comput Co Ltd | 電界発光素子及びその製造方法 |
JP2002117973A (ja) * | 2000-05-16 | 2002-04-19 | Toyota Central Res & Dev Lab Inc | 有機電界発光素子及びその製造装置 |
JP2002025765A (ja) * | 2000-07-10 | 2002-01-25 | Kyushu Matsushita Denki Kk | 有機エレクトロルミネッセンス素子及びその製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1489889A4 * |
Also Published As
Publication number | Publication date |
---|---|
CN100459209C (zh) | 2009-02-04 |
AU2003220921A1 (en) | 2003-10-08 |
US7345420B2 (en) | 2008-03-18 |
KR100683463B1 (ko) | 2007-02-20 |
EP1489889A4 (en) | 2010-07-28 |
KR20040098030A (ko) | 2004-11-18 |
EP1489889A1 (en) | 2004-12-22 |
US20050218796A1 (en) | 2005-10-06 |
CN1643987A (zh) | 2005-07-20 |
TW200305348A (en) | 2003-10-16 |
JP2003282240A (ja) | 2003-10-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7102176B2 (en) | Organic electroluminescent display panel and manufacturing method therefor | |
WO2003081954A1 (fr) | Ecran electroluminescent organique et son procede de production | |
US7696683B2 (en) | Organic electroluminescent element and the manufacturing method | |
EP1460697A2 (en) | Organic electroluminescene display panel and fabrication method thereof | |
US7355341B2 (en) | Organic electroluminescence display panel including a gas barrier laminate between a substrate and an organic electroluminescence element | |
US20050023974A1 (en) | Protected organic electronic devices and methods for making the same | |
KR20040014659A (ko) | 유기 광발산 장치용 투명 지지체 | |
KR101502167B1 (ko) | 가스 배리어 필름 및 이것을 사용한 표시 소자 | |
JP2003017244A (ja) | 有機電界発光素子およびその製造方法 | |
WO2007055168A1 (ja) | 有機エレクトロルミネッセンス表示パネル | |
JP4180831B2 (ja) | 有機エレクトロルミネッセンス表示パネル及び製造方法 | |
TWI226026B (en) | Organic electroluminescent display panel and manufacturing method therefor | |
KR101292297B1 (ko) | 유기 전계 발광 소자 및 그 제조 방법 | |
JP2005235743A (ja) | 拡散障壁を有する複合材物品及び該物品を組み込んだ素子 | |
WO2009104241A1 (ja) | パターン形成方法及びシャドウマスク | |
KR20150044723A (ko) | 유기 발광 장치 및 이의 제조 방법 | |
KR100501906B1 (ko) | 유기 발광 소자의 애노드 배리어 층 형성 방법 및 애노드배리어 층이 포함된 유기 발광 소자 | |
JP4974368B2 (ja) | 有機エレクトロルミネッセンス素子及びその製造方法 | |
KR100700007B1 (ko) | 보호막을 가진 유기전계발광표시장치 | |
KR20130073375A (ko) | 유기 발광 다이오드 소자 및 그 제조 방법 | |
JP2009193914A (ja) | 電子デバイス | |
Lee et al. | P‐214: Ultra Thin‐Film Encapsulation for AMOLED Displays | |
KR20020025536A (ko) | 유기 전계 발광소자 및 그의 제조 방법 | |
JP2006269099A (ja) | 有機elパネル製造装置、有機elパネル製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PH PL PT RO RU SC SD SE SG SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2003744996 Country of ref document: EP Ref document number: 20038068427 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020047015337 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 1020047015337 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 2003744996 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10508857 Country of ref document: US |