WO2003078988A1 - Procede pour mesurer une conductivite thermique d'une structure en nid d'abeille - Google Patents
Procede pour mesurer une conductivite thermique d'une structure en nid d'abeille Download PDFInfo
- Publication number
- WO2003078988A1 WO2003078988A1 PCT/JP2003/003083 JP0303083W WO03078988A1 WO 2003078988 A1 WO2003078988 A1 WO 2003078988A1 JP 0303083 W JP0303083 W JP 0303083W WO 03078988 A1 WO03078988 A1 WO 03078988A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermal conductivity
- honeycomb structure
- measuring
- contact
- structure according
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
Definitions
- the present invention relates to a method for measuring the thermal conductivity of a honeycomb structure, which makes it possible to measure the thermal conductivity of the honeycomb structure using the shape of the honeycomb structure itself without producing a test piece or the like.
- honeycomb structure made of ceramics (honeycomb filter) is used.
- the honeycomb structure has, for example, a number of flow cells penetrating in the axial direction partitioned by partition walls, and the partition walls of the flow cells have a filtering ability, and one end of a predetermined flow cell is plugged.
- the remaining flow cell is a structure formed by plugging the other end and collecting and removing particulate matter contained in the dust-containing fluid.
- Honeycomb structures made of ceramics are used for purification of various exhaust gases because they have excellent heat resistance and corrosion resistance, and have favorable characteristics as a filter material in a high-temperature, corrosive gas atmosphere.
- honeycomb structure In many cases, high-temperature exhaust gas flows through the honeycomb structure, and the thermal conductivity of the honeycomb structure changes the manner in which the honeycomb structure generates distortion due to heat. Therefore, design the honeycomb structure and grasp its thermal conductivity. There is a need. However, since the honeycomb structure has a special structure, a method for measuring the thermal conductivity of the honeycomb structure itself without producing test pieces or the like has not been established so far.
- the laser flash method is specified in JISR 1611.
- This method is limited in that the material of the object to be measured is limited to a material having a porosity of 10% or less, and the sample shape at the time of measurement is limited to a flat plate such as a quadrilateral having a side of 10 mm or less. . Because of this, honeycomb There was a problem that the above method could not be adopted for the structure in terms of its material and shape. In addition, there was a problem with workability because it had to be processed into test specimens.
- the present invention has been made in view of the above-described problem, and measures the thermal conductivity of a honeycomb structure in the shape of the honeycomb structure itself or a predetermined block shape without producing a test piece having a specific shape. It is an object of the present invention to provide a method for measuring the thermal conductivity of a honeycomb structure, which enables the following. Disclosure of the invention
- the present invention provides the following method for measuring thermal conductivity.
- the thermal conductivity ⁇ (W / mK) of the honeycomb structure is determined by measuring the heat flow rate Ql (W / m 2 ), Q2 (W / m 2 )
- the heat flow QH (W / m 2 ) (Q1 + Q2) / 2 of the 82-cam structure derived by measuring the distance, and the distance L (ra) between both ends of the honeycomb structure And the temperature T 1 (K) and T 2 (K) at both ends of the 82 cam structure in the steady state, calculated from the following equation (1).
- a method for measuring the thermal conductivity of a cam structure is determined by measuring the heat flow rate Ql (W / m 2 ), Q2 (W / m 2 )
- the heat flow QH (W / m 2 ) (Q1 + Q2) / 2 of the 82-cam structure derived by measuring the distance, and the distance L (ra) between both ends of the honeycomb structure
- the high thermal conductivity member is formed by applying a paste containing a substance having a high thermal conductivity to the contact surface of the non-cam structure and / or the contact member. The method for measuring the thermal conductivity of a honeycomb structure according to [4] or [5].
- honeycomb structure contains at least one selected from the group consisting of silicon carbide, a composite of silicon carbide and metal silicon, and silicon nitride.
- a method for measuring the thermal conductivity of a honeycomb structure BRIEF DESCRIPTION OF THE FIGURES
- FIG. 1 is a side view showing an 82-cam structure and contact members brought into contact with both ends thereof in one embodiment of the method for measuring the thermal conductivity of a honeycomb structure of the present invention.
- FIG. 2 is a cross-sectional view of a honeycomb structure, a contact member, and the like cut along a plane including a shaft in another embodiment of the method for measuring the thermal conductivity of an 82-cam structure of the present invention.
- the method for measuring the thermal conductivity of the honeycomb structure of the present invention is as follows.
- the temperature condition of the entire 82-cam structure is set to a steady state, and the thermal conductivity is measured, regardless of the shape of the honeycomb structure.
- the thermal conductivity can be easily measured as the honeycomb structure itself having a shape or a block shape cut out from the honeycomb structure at a predetermined size (without preparing a test piece having a specific shape).
- FIG. 1 is a side view showing a honeycomb structure and contact members brought into contact with both ends of the 82-cam structure in one embodiment of the method for measuring the thermal conductivity of the present invention.
- the temperatures at both ends in the axial direction of the honeycomb structure are controlled to different predetermined temperatures.
- contact members 2 (21, 22) controlled at a constant temperature are brought into contact with both axial end portions 11, 12 of the honeycomb structure 1.
- the temperatures of both ends 11 and 12 are set to the different predetermined temperatures. Accordingly, the temperature state of the entire honeycomb structure 1 can be set to a steady state.
- the heat flow QH of the honeycomb structure 1 in the steady state is obtained.
- the heat flow QH is measured by the heat flow meters 3 (31, 32) which are connected in advance to the contact members 21 and 22 which are in contact with both ends 11 and 12 of the steady-state 82 cam structure 1, respectively.
- the temperature state of the entire honeycomb structure is set to a steady state and the thermal conductivity is measured, for example, a cylindrical honeycomb structure itself or a predetermined size is cut therefrom regardless of the shape of the honeycomb structure.
- the thermal conductivity can be easily measured as a block shape (without preparing a test piece of a specific shape).
- thermo conductivity in order to measure the thermal conductivity by setting the temperature state of the entire honeycomb structure to a steady state, regardless of the shape of the honeycomb structure, for example, a cylindrical honeycomb structure itself or a predetermined size was cut out therefrom.
- a block shape specifically shape
- the thermal conductivity can be easily measured (without preparing a test piece).
- Such a method of measuring the thermal conductivity is called a stationary method (JISA 1412), and has not been applied to a honeycomb structure until now.
- the thermal contact between both end portions 11 and 12 of the honeycomb structure 1 and the contact members 21 and 22 is made as good as possible, and the contact member 21 and the end portion 1 of the 82-cam structure are improved. It is preferable that heat be transmitted between the contact member 1 and the end portion 12 of the honeycomb structure and the contact member 22 with as little loss as possible. Since the loss of the heat flow in this portion is measured as the difficulty of heat conduction of the honeycomb structure itself, there is a possibility that the measurement accuracy of the thermal conductivity of the honeycomb structure may be reduced. For example, the state of contact between the end surface of the end portion 11 of the honeycomb structure and the contact surface 21 1 of the contact member 21 has many (wide) gaps due to the fine irregularities of each surface. In such a case, heat transfer may be difficult. Furthermore, in the case of a honeycomb structure made of a material having a high thermal conductivity, the accuracy may be greatly reduced.
- heat radiation from the exposed portion of the side surface of the honeycomb structure 1 is as small as possible.
- FIG. 2 is a cross-sectional view of a honeycomb structure, a contact member, and the like cut along a plane including a shaft in another embodiment of the method for measuring the thermal conductivity of an 82-cam structure according to the present invention.
- the thermal contact between both end portions 11 and 12 of the honeycomb structure 1 and the contact members 21 and 22 is improved, and the contact member 21 and the end portion 11 of the honeycomb structure 11 and the honeycomb structure 1 are formed.
- the contact member 21 and the end 1 1 of the honeycomb structure are used to transfer heat between the end 12 of the structure and the contact member 2 2 with as little loss as possible.
- the conductivity member 4 Since the conductivity member 4 has a high thermal conductivity, it is interposed between the end portions 11 and 12 of the 82-cam structure and the contact members 21 and 22 to reduce the thermal conductivity of the 82-cam structure. Measurement does not increase the measurement error.
- the high thermal conductivity member 4 is preferably a sheet having flexibility. By forming the sheet having flexibility, the sheet is deformed into the shape of the gap formed between the contact surfaces as described above, and the gap can be filled, so that the heat transfer can be further improved.
- a material of the high thermal conductivity member 4 formed of a flexible sheet a metal foil such as aluminum, aluminum, and copper is preferable.
- the thickness of the high thermal conductivity member 4 is preferably as thin as possible with respect to the sample in order to suppress the influence on the measured value.
- the thermal conductivity ⁇ 2 (W / m K ) And the thickness L 2 (m) are used to calculate the corrected thermal conductivity ⁇ 1 (W / mK) of the sample (82-cam structure 1) according to the following equation (2).
- the high thermal conductivity member 4 is made of a paste containing a substance (powder) having a high thermal conductivity such as carbon or silver (for example, in a state where the powder is kneaded with an organic solvent represented by acetone). It may be a coating film formed by applying to each contact surface of the end portions 11 and 12.
- the paste may be applied to any one of the contact surfaces of the end portions 11 and 12 of the honeycomb structure or the contact surfaces 21 1 and 22 of the contact members 21 and 22. , Or both. By applying the paste, the gap formed between the contact surfaces described above can be filled, and the heat transfer can be improved.
- the 1 to 10 kg / cm 2 the contact pressure when the contact member 2 is in contact with eighty-two cam structure 1 or the high thermal conductivity member 4, good heat transfer to fill the gaps between the contact surfaces Can be
- the thermal conductivity in the case of a honeycomb structure made of a material having a thermal conductivity of 1 (W / mK) or more, the thermal conductivity can be suitably measured.
- the thermal conductivity of the honeycomb structure having a high thermal conductivity is high. The rate can be measured accurately.
- Preferred examples of the material of the honeycomb structure include silicon carbide, a composite of silicon carbide and metal silicon, silicon nitride, and other non-oxides having relatively high thermal conductivity.
- the thermal conductivity of the material is 1 W / mK or more, it can be applied to oxides.
- the thermal conductivity of the honeycomb structure when measuring the thermal conductivity of the honeycomb structure, it is preferable to cover the exposed portion 13 on the side surface of the honeycomb structure 1 with the heat insulating material 5.
- the heat insulating material include urethane mats and styrofoam.
- the range covered with the heat insulating material may be not only the exposed portion 13 but also the whole including the contact member 2. Surrounding with a honeycomb of the same material instead of a heat insulating material has an effect of homogenizing the heat flow in the honeycomb structure, and is another preferred example.
- honeycomb structures made of metal silicon-bonded silicon carbide in which silicon carbide is bonded with metal silicon, with a common rib thickness of 15m i 1 and different cell density of 200 cpsi (cellpers qu areinch) and 300 cpsi It was produced by a typical extrusion molding method.
- a 35 x 35 x 25 mm block was cut out from the obtained two types of honeycomb structures, and as shown in Fig. 1, without using either a high thermal conductivity member or a heat insulating material, Thermal conductivity was measured by the steady-state method. Then, as shown in FIG. 2, the thermal conductivity was measured by the steady-state method using both the high thermal conductivity member and the heat insulating member, or using one of them. Table 1 shows the results.
- Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 No thermal conductivity member None Ash Int None Aluminum foil Ash Int None Ash? Heat insulation material None None iS Styrol none Styrol none Styrene cell density (cps i) 200 200 200 200 200 300 300 Opening ratio (%) 62 62 62 62 55 55 Effective area ratio (%) 38 38 38 38 38 45 45 Thermal conductivityConverted value (W / mK) 11 11 11 11 11 14 14 Thermal conductivityMeasured value (W / mK) 4 12 8 8 12 6 15
- the thermal conductivity ⁇ converted value refers to the thermal conductivity of the test piece obtained by processing the honeycomb structure into a specific shape by the laser flash method in accordance with JISR 1611, and The value is obtained by multiplying the effective area ratio, which indicates the effective area obtained by subtracting the area corresponding to the opening from the area of the end face, by the measured thermal conductivity, and converting it to the thermal conductivity of the honeycomb structure itself.
- the honeycomb structure was measured by the laser flash method, it included errors due to porosity problems, etc., but there is a certain degree of certainty.In this example, the evaluation was made in comparison with the laser flash method. .
- Table 1 the thermal conductivity of the honeycomb structure can be measured by the steady-state method.
- the thermal conductivity can be measured even when the high thermal conductivity member and the heat insulating material are not used, but by using the aluminum foil / carbon sheet as the high thermal conductivity member, In addition, by using styrofoam as a heat insulating material, a value closer to the laser-flash method can be obtained (Examples 2 to 5, 7).
- the thermal conductivity of the honeycomb structure can be measured without using a specific shape of a test piece or the like. It can be measured in shape or in a predetermined block shape. This improves the workability of thermal conductivity measurement and reduces the time required to prepare (process) the sample.
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Laminated Bodies (AREA)
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03708618A EP1486774B1 (en) | 2002-03-20 | 2003-03-14 | Method of measuring thermal conductivity of honeycomb structure |
US10/505,334 US7682072B2 (en) | 2002-03-20 | 2003-03-14 | Method of measuring thermal conductivity of honeycomb structure |
KR10-2004-7014620A KR20040094813A (ko) | 2002-03-20 | 2003-03-14 | 허니콤 구조체의 열전도율 측정 방법 |
AU2003213376A AU2003213376A1 (en) | 2002-03-20 | 2003-03-14 | Method of measuring thermal conductivity of honeycomb structure |
PL374057A PL210071B1 (pl) | 2002-03-20 | 2003-03-14 | Sposób mierzenia przewodności cieplnej struktury komórkowej podobnej do plastra pszczelego |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002077557A JP4155749B2 (ja) | 2002-03-20 | 2002-03-20 | ハニカム構造体の熱伝導率の測定方法 |
JP2002-077557 | 2002-03-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003078988A1 true WO2003078988A1 (fr) | 2003-09-25 |
Family
ID=28035527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/003083 WO2003078988A1 (fr) | 2002-03-20 | 2003-03-14 | Procede pour mesurer une conductivite thermique d'une structure en nid d'abeille |
Country Status (7)
Country | Link |
---|---|
US (1) | US7682072B2 (ja) |
EP (1) | EP1486774B1 (ja) |
JP (1) | JP4155749B2 (ja) |
KR (1) | KR20040094813A (ja) |
AU (1) | AU2003213376A1 (ja) |
PL (1) | PL210071B1 (ja) |
WO (1) | WO2003078988A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101713443B1 (ko) * | 2015-10-19 | 2017-03-07 | 울산대학교 산학협력단 | 발열체 평가장치 및 방법 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002131257A (ja) * | 2000-10-26 | 2002-05-09 | Nisshinbo Ind Inc | 熱伝導率測定方法、測定装置及び断熱材の製造方法 |
US7077563B2 (en) * | 2003-11-19 | 2006-07-18 | General Electric Company | Deposition sensor based on differential heat flux measurement |
US7226206B2 (en) * | 2005-05-12 | 2007-06-05 | Guardian Building Products, Inc. | Dynamic heat flow meter for measuring thermal properties of insulation or the like, and corresponding method |
JP5251882B2 (ja) * | 2007-10-26 | 2013-07-31 | 凸版印刷株式会社 | 反応チップ及び反応方法、遺伝子処理装置用温度調節機構及び遺伝子処理装置 |
CN102024977B (zh) * | 2009-09-22 | 2013-12-11 | 鸿富锦精密工业(深圳)有限公司 | 手机电池 |
US8517600B2 (en) * | 2009-10-27 | 2013-08-27 | General Electric Company | Deposition sensor based on differential heat transfer resistance |
JP5827097B2 (ja) * | 2011-10-17 | 2015-12-02 | ニチアス株式会社 | 熱伝導率測定方法 |
JP5990095B2 (ja) * | 2012-12-18 | 2016-09-07 | 日本碍子株式会社 | 微粒子捕集フィルタ |
WO2014199532A1 (ja) * | 2013-06-10 | 2014-12-18 | 三菱電機株式会社 | ハニカムサンドイッチ構造体およびハニカムサンドイッチ構造体の製造方法 |
CN103499604A (zh) * | 2013-09-30 | 2014-01-08 | 中国航天科工集团第六研究院二一○所 | 蜂窝复合板导热系数测试装置及方法 |
CN105572163B (zh) * | 2016-01-23 | 2018-08-21 | 太原理工大学 | 混凝土干燥状态下导热系数测定装置 |
US11137362B2 (en) | 2019-12-10 | 2021-10-05 | Covestro Llc | Method for assessing the long-term thermal resistance of closed-cell thermal insulating foams at multiple mean temperatures |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000329718A (ja) | 1999-05-20 | 2000-11-30 | Nippon Light Metal Co Ltd | 発泡体試料の熱伝導率測定方法及び測定装置 |
JP2001021512A (ja) | 1999-07-08 | 2001-01-26 | Fuji Electric Co Ltd | 熱伝導率測定装置 |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3238775A (en) * | 1962-01-02 | 1966-03-08 | Lockheed Aircraft Corp | Heat flux responsive device |
US4155244A (en) * | 1977-12-30 | 1979-05-22 | Owens-Corning Fiberglas Corporation | Apparatus for determining thermal conductivity of materials |
JPS54123082A (en) * | 1978-03-17 | 1979-09-25 | Toshiba Corp | Thermal conductivity meter |
PL139300B1 (en) * | 1983-04-27 | 1987-01-31 | Pan Ct Badan Molekularnych I M | Method of determination of thermal conductivity and heat storage capacity of materials and apparatus therefor |
US4553852A (en) * | 1983-12-07 | 1985-11-19 | W. R. Grace & Co. | Apparatus and method for heat flow measurement |
JPS60201224A (ja) * | 1984-03-27 | 1985-10-11 | Kyushu Daigaku | 多層薄膜熱伝達ゲ−ジ |
FR2598803B1 (fr) * | 1986-05-16 | 1988-09-02 | Anvar | Dispositif pour mesurer l'intensite d'un flux radiatif |
US5270092A (en) * | 1991-08-08 | 1993-12-14 | The Regents, University Of California | Gas filled panel insulation |
US5297868A (en) * | 1993-06-23 | 1994-03-29 | At&T Bell Laboratories | Measuring thermal conductivity and apparatus therefor |
DE69419464T2 (de) * | 1993-08-10 | 1999-11-18 | Matsushita Electric Industrial Co., Ltd. | Thermischer Isolator und Herstellungsverfahren |
JPH0760116A (ja) | 1993-08-24 | 1995-03-07 | Sharp Corp | 脱臭素子及びその脱臭素子を用いた脱臭装置 |
US5846276A (en) * | 1995-07-05 | 1998-12-08 | Matsushita Electric Industrial Co., Ltd. | Exhaust gas filter |
JP3477940B2 (ja) | 1995-09-05 | 2003-12-10 | 松下電器産業株式会社 | 排ガスフィルターの製造方法 |
CA2248135A1 (en) * | 1996-03-08 | 1997-09-12 | Hani A. El-Husayni | Heat flow meter instruments |
US6331075B1 (en) * | 1998-05-01 | 2001-12-18 | Administrator, National Aeronautics And Space Administration | Device and method for measuring thermal conductivity of thin films |
US6142662A (en) * | 1998-06-16 | 2000-11-07 | New Jersey Institute Of Technology | Apparatus and method for simultaneously determining thermal conductivity and thermal contact resistance |
US6183128B1 (en) * | 1999-05-03 | 2001-02-06 | Westvaco Corporation | Apparatus and method for determining paperboard thermal conductivity |
AU4431100A (en) * | 1999-05-11 | 2000-11-21 | Hitachi Maxell, Ltd. | Magnetic recording medium and its production method, and magnetic recorder |
EP1219672B1 (en) * | 1999-08-09 | 2005-12-14 | Sekisui Chemical Co., Ltd. | Thermoplastic resin foam and process for producing the same |
US6408256B1 (en) * | 1999-10-01 | 2002-06-18 | Colorado State University Research Foundation | Apparatus and method for thermal evaluation of any thin material |
JP3756721B2 (ja) * | 2000-03-24 | 2006-03-15 | 日本碍子株式会社 | 排ガス浄化用フィルター |
JP2001316188A (ja) * | 2000-04-28 | 2001-11-13 | Asahi Glass Co Ltd | 窒化ケイ素質多孔体およびその製造方法 |
JP2002131257A (ja) * | 2000-10-26 | 2002-05-09 | Nisshinbo Ind Inc | 熱伝導率測定方法、測定装置及び断熱材の製造方法 |
JP3858660B2 (ja) * | 2001-10-10 | 2006-12-20 | 株式会社日立製作所 | 樹脂の熱抵抗測定方法 |
JP4246425B2 (ja) * | 2001-10-15 | 2009-04-02 | 日本碍子株式会社 | ハニカムフィルター |
WO2003036024A2 (en) * | 2001-10-24 | 2003-05-01 | Shell Internationale Research Maatschappij B.V. | Method and system for in situ heating a hydrocarbon containing formation by a u-shaped opening |
JP4293753B2 (ja) * | 2002-03-19 | 2009-07-08 | 日本碍子株式会社 | ハニカムフィルター |
DE10234500A1 (de) * | 2002-07-23 | 2004-02-19 | Siemens Ag | Verfahren zur Wärmeableitung in Mobilfunkgeräten und ein entsprechendes Mobilfunkgerät |
US6945691B2 (en) * | 2002-11-27 | 2005-09-20 | Delphi Technologies, Inc. | Method and apparatus for inferring a temperature |
CO5310581A1 (es) * | 2003-02-10 | 2003-08-29 | Inst Capacitacion E Invest Plastico Y Caucho | Metodo y celda de medicion para la determinacion de la difu- sividad termica de materiales durante el proceso de transfe- rencia de calor por conduccion con rapidos cambios de tempe- ratura que pueden incluir cambio de fase. |
US20060051556A1 (en) * | 2003-09-12 | 2006-03-09 | Ibiden Co., Ltd. | Sintered ceramic compact and ceramic filter |
CN100526615C (zh) * | 2003-12-25 | 2009-08-12 | 揖斐电株式会社 | 排气净化装置及排气净化装置的再生方法 |
-
2002
- 2002-03-20 JP JP2002077557A patent/JP4155749B2/ja not_active Expired - Lifetime
-
2003
- 2003-03-14 KR KR10-2004-7014620A patent/KR20040094813A/ko active Search and Examination
- 2003-03-14 PL PL374057A patent/PL210071B1/pl unknown
- 2003-03-14 WO PCT/JP2003/003083 patent/WO2003078988A1/ja active Application Filing
- 2003-03-14 AU AU2003213376A patent/AU2003213376A1/en not_active Abandoned
- 2003-03-14 US US10/505,334 patent/US7682072B2/en active Active
- 2003-03-14 EP EP03708618A patent/EP1486774B1/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000329718A (ja) | 1999-05-20 | 2000-11-30 | Nippon Light Metal Co Ltd | 発泡体試料の熱伝導率測定方法及び測定装置 |
JP2001021512A (ja) | 1999-07-08 | 2001-01-26 | Fuji Electric Co Ltd | 熱伝導率測定装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1486774A4 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101713443B1 (ko) * | 2015-10-19 | 2017-03-07 | 울산대학교 산학협력단 | 발열체 평가장치 및 방법 |
Also Published As
Publication number | Publication date |
---|---|
PL374057A1 (en) | 2005-09-19 |
EP1486774A1 (en) | 2004-12-15 |
PL210071B1 (pl) | 2011-11-30 |
EP1486774A4 (en) | 2008-03-05 |
JP2003270180A (ja) | 2003-09-25 |
EP1486774B1 (en) | 2011-11-09 |
US20050105584A1 (en) | 2005-05-19 |
AU2003213376A1 (en) | 2003-09-29 |
US7682072B2 (en) | 2010-03-23 |
KR20040094813A (ko) | 2004-11-10 |
JP4155749B2 (ja) | 2008-09-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2003078988A1 (fr) | Procede pour mesurer une conductivite thermique d'une structure en nid d'abeille | |
US7520178B2 (en) | Method for inspecting honeycomb fired body and method for manufacturing honeycomb structured body | |
WO2007086143A1 (ja) | ハニカム構造体の検査方法、及び、ハニカム構造体の製造方法 | |
US9789467B2 (en) | Composite material, electrode film and method for producing the same, electrode terminal and method for producing the same, substrate and method for producing the same, and bonding material and method for producing substrate by bonding split parts together with bonding material | |
US5209525A (en) | Bonded ceramic structure | |
JPWO2007066462A1 (ja) | ハニカム構造体及びその製造方法 | |
WO2007125667A1 (ja) | ハニカム構造体 | |
WO2017090587A1 (ja) | 粒子状物質の測定装置用部品およびその製造方法 | |
JP3683348B2 (ja) | セラミック構造体の製造方法 | |
JP2008223495A (ja) | 温度測定ハニカム構造体 | |
TW202043176A (zh) | 燒成夾具 | |
Bau et al. | Ceramic tape-based meso systems technology | |
EP0594290B1 (en) | Ceramic body and method and apparatus for detecting change thereof | |
JP7166198B2 (ja) | ハニカム構造体 | |
JP4610716B2 (ja) | ハニカムフィルタ及びその製造方法 | |
JPH0579922A (ja) | 温度センサ | |
JP5282034B2 (ja) | スペーサ付ハニカムセグメントの製造方法 | |
JPH1187021A (ja) | セラミックヒータ及び酸素センサ | |
JP2005315861A (ja) | 多孔質構造体の検査方法 | |
JP5183070B2 (ja) | ハニカム構造体の検査方法、及び、ハニカム構造体の製造方法 | |
JP2000120973A (ja) | セラミックス管の接合方法及び接合構造 | |
EP3778399B1 (en) | Method of manufacture of a thermal sensor | |
JP4803433B2 (ja) | 中空セラミック構造体及びその製造方法 | |
JPS5950082A (ja) | 炭化珪素材料より本質的に構成された熱交換器 | |
JPH01146624A (ja) | セラミック熱交換器の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PH PL PT RO RU SC SD SE SG SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 10505334 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2003708618 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 374057 Country of ref document: PL |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020047014620 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 1020047014620 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 2003708618 Country of ref document: EP |