WO2002049086B1 - Dispositif de traitement de substrat de transfert - Google Patents

Dispositif de traitement de substrat de transfert

Info

Publication number
WO2002049086B1
WO2002049086B1 PCT/JP2001/010765 JP0110765W WO0249086B1 WO 2002049086 B1 WO2002049086 B1 WO 2002049086B1 JP 0110765 W JP0110765 W JP 0110765W WO 0249086 B1 WO0249086 B1 WO 0249086B1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
processing
type substrate
transfer type
processing unit
Prior art date
Application number
PCT/JP2001/010765
Other languages
English (en)
Japanese (ja)
Other versions
WO2002049086A1 (fr
Inventor
Kyoji Shimoda
Hitoshi Tauchi
Original Assignee
Sumitomo Precision Prod Co
Kyoji Shimoda
Hitoshi Tauchi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Prod Co, Kyoji Shimoda, Hitoshi Tauchi filed Critical Sumitomo Precision Prod Co
Priority to KR1020027010303A priority Critical patent/KR20020084121A/ko
Publication of WO2002049086A1 publication Critical patent/WO2002049086A1/fr
Publication of WO2002049086B1 publication Critical patent/WO2002049086B1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Nozzles (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

La présente invention concerne un dispositif de traitement de substrat de transfert capable de transformer la surface du rebord latéral d'une couche d'aluminium en une surface doucement inclinée convenant aux couches laminées d'une couche suivante en s'adaptant à une attaque chimique de l'aluminium. Ce dispositif comprend une ou plusieurs rangées de gicleurs à jet laminaire (35) déversant latéralement en nappe le fluide de traitement sur la totalité de la surface du substrat en aval du système d'arrosage en déluge (34). De la sorte, un grand nombre de gicleurs d'arrosage (34a) permettent de déverser le fluide de traitement sur la totalité de la surface du substrat (100). Cela permet d'obtenir un effet de spatule faisant que le fluide de traitement se dépose en film fin sur la surface du substrat (100), dans le cas d'un traitement au couteau chimique par utilisation de gicleurs à jet laminaire (35).
PCT/JP2001/010765 2000-12-11 2001-12-07 Dispositif de traitement de substrat de transfert WO2002049086A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020027010303A KR20020084121A (ko) 2000-12-11 2001-12-07 반송식 기판 처리 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000-375993 2000-12-11
JP2000375993A JP3622842B2 (ja) 2000-12-11 2000-12-11 搬送式基板処理装置

Publications (2)

Publication Number Publication Date
WO2002049086A1 WO2002049086A1 (fr) 2002-06-20
WO2002049086B1 true WO2002049086B1 (fr) 2002-08-29

Family

ID=18844917

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/010765 WO2002049086A1 (fr) 2000-12-11 2001-12-07 Dispositif de traitement de substrat de transfert

Country Status (5)

Country Link
JP (1) JP3622842B2 (fr)
KR (1) KR20020084121A (fr)
CN (1) CN1208813C (fr)
TW (1) TW535195B (fr)
WO (1) WO2002049086A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003100842A1 (fr) * 2002-05-23 2003-12-04 Sumitomo Precision Products Co., Ltd Dispositif de traitement de substrats equipe d'un mecanisme de transport
JP4181853B2 (ja) 2002-11-15 2008-11-19 Ｎｅｃ液晶テクノロジー株式会社 積層膜の複合ウェットエッチング方法
JP2005015913A (ja) * 2003-06-03 2005-01-20 Dainippon Screen Mfg Co Ltd 基板のエッチング処理方法およびエッチング処理装置
JP4421956B2 (ja) * 2003-07-18 2010-02-24 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP4969138B2 (ja) * 2006-04-17 2012-07-04 大日本スクリーン製造株式会社 基板処理装置
WO2007129389A1 (fr) * 2006-05-01 2007-11-15 Hitachi Plasma Display Limited Ligne de retrait de resist
JP4747186B2 (ja) * 2008-06-02 2011-08-17 Ｎｅｃ液晶テクノロジー株式会社 積層膜の複合ウェットエッチング方法
CN110113883B (zh) * 2019-05-10 2024-04-02 无锡睿龙新材料科技有限公司 一种双面蚀刻装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148297A (ja) * 1995-11-24 1997-06-06 Hitachi Ltd 基板の乾燥方法およびこれを用いる乾燥装置およびこれを用いる半導体装置の製造方法
JPH11145109A (ja) * 1997-11-07 1999-05-28 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000114221A (ja) * 1998-10-02 2000-04-21 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
WO2002049086A1 (fr) 2002-06-20
CN1398425A (zh) 2003-02-19
JP3622842B2 (ja) 2005-02-23
CN1208813C (zh) 2005-06-29
KR20020084121A (ko) 2002-11-04
JP2002208582A (ja) 2002-07-26
TW535195B (en) 2003-06-01

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