WO2002011196A1 - Procede de fabrication de plaquette au silicium monocristallin - Google Patents

Procede de fabrication de plaquette au silicium monocristallin Download PDF

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Publication number
WO2002011196A1
WO2002011196A1 PCT/JP2001/006274 JP0106274W WO0211196A1 WO 2002011196 A1 WO2002011196 A1 WO 2002011196A1 JP 0106274 W JP0106274 W JP 0106274W WO 0211196 A1 WO0211196 A1 WO 0211196A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat treatment
crystal silicon
crystal
silicon wafers
manufacturing single
Prior art date
Application number
PCT/JP2001/006274
Other languages
English (en)
French (fr)
Inventor
Norihiro Kobayashi
Masaro Tamatsuka
Takatoshi Nagoya
Original Assignee
Shin-Etsu Handotai Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Handotai Co., Ltd. filed Critical Shin-Etsu Handotai Co., Ltd.
Priority to EP01951934A priority Critical patent/EP1313137A1/en
Priority to US10/333,970 priority patent/US6805743B2/en
Priority to KR1020037001196A priority patent/KR100815625B1/ko
Publication of WO2002011196A1 publication Critical patent/WO2002011196A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
    • H01L21/3225—Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
PCT/JP2001/006274 2000-07-28 2001-07-19 Procede de fabrication de plaquette au silicium monocristallin WO2002011196A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP01951934A EP1313137A1 (en) 2000-07-28 2001-07-19 Method for manufacturing single-crystal silicon wafers
US10/333,970 US6805743B2 (en) 2000-07-28 2001-07-19 Method for manufacturing single-crystal-silicon wafers
KR1020037001196A KR100815625B1 (ko) 2000-07-28 2001-07-19 실리콘단결정 웨이퍼의 제조방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000-229522 2000-07-28
JP2000229522A JP2002043318A (ja) 2000-07-28 2000-07-28 シリコン単結晶ウエーハの製造方法

Publications (1)

Publication Number Publication Date
WO2002011196A1 true WO2002011196A1 (fr) 2002-02-07

Family

ID=18722627

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/006274 WO2002011196A1 (fr) 2000-07-28 2001-07-19 Procede de fabrication de plaquette au silicium monocristallin

Country Status (6)

Country Link
US (1) US6805743B2 (ja)
EP (1) EP1313137A1 (ja)
JP (1) JP2002043318A (ja)
KR (1) KR100815625B1 (ja)
TW (1) TW508701B (ja)
WO (1) WO2002011196A1 (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6663708B1 (en) * 2000-09-22 2003-12-16 Mitsubishi Materials Silicon Corporation Silicon wafer, and manufacturing method and heat treatment method of the same
JP2003077925A (ja) * 2001-08-31 2003-03-14 Sumitomo Mitsubishi Silicon Corp シリコンウェーハの製造方法及びシリコンウェーハ
DE10336271B4 (de) * 2003-08-07 2008-02-07 Siltronic Ag Siliciumscheibe und Verfahren zu deren Herstellung
JP4529416B2 (ja) * 2003-11-07 2010-08-25 信越半導体株式会社 シリコン単結晶ウェーハの製造方法及びシリコン単結晶ウェーハ
DE60336687D1 (de) * 2003-12-03 2011-05-19 Soitec Silicon On Insulator Prozess zum verbessern der oberflächenrauigkeit eines halbleiterwafers
JP2006261632A (ja) * 2005-02-18 2006-09-28 Sumco Corp シリコンウェーハの熱処理方法
JP2007149799A (ja) * 2005-11-25 2007-06-14 Shin Etsu Handotai Co Ltd アニールウェーハの製造方法およびアニールウェーハ
JP4853027B2 (ja) * 2006-01-17 2012-01-11 信越半導体株式会社 シリコン単結晶ウエーハの製造方法
JP4868880B2 (ja) * 2006-02-15 2012-02-01 富士通株式会社 シリコンウェーハの処理方法及びウェーハ処理装置
JP5239155B2 (ja) * 2006-06-20 2013-07-17 信越半導体株式会社 シリコンウエーハの製造方法
EP1928016B1 (en) * 2006-12-01 2010-01-06 Siltronic AG Silicon wafer and method for manufacturing the same
DE102007009281B4 (de) * 2007-02-26 2013-03-14 Infineon Technologies Austria Ag Verfahren zum Erzeugen von Materialausscheidungen und Halbleitermaterialscheibe sowie Halbleiterbauelemente
JP5205810B2 (ja) * 2007-05-24 2013-06-05 株式会社Ｓｕｍｃｏ シリコン単結晶ウェーハの製造方法
JP5276863B2 (ja) * 2008-03-21 2013-08-28 グローバルウェーハズ・ジャパン株式会社 シリコンウェーハ
US8426297B2 (en) 2008-08-08 2013-04-23 Sumco Techxiv Corporation Method for manufacturing semiconductor wafer
CN102934241B (zh) * 2011-02-28 2015-09-02 松下电器产业株式会社 红外发光元件的制造方法
US8907494B2 (en) 2013-03-14 2014-12-09 International Business Machines Corporation Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures
SG11201900068PA (en) * 2016-07-06 2019-02-27 Tokuyama Corp Single crystal silicon plate-shaped body and production method therefor
CN106319635A (zh) * 2016-09-30 2017-01-11 中国电子科技集团公司第二十六研究所 一种铈掺杂铝酸钇镥闪烁晶体光输出增强方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0232535A (ja) * 1988-07-21 1990-02-02 Kyushu Electron Metal Co Ltd 半導体デバイス用シリコン基板の製造方法
JPH1167781A (ja) * 1997-08-08 1999-03-09 Sumitomo Metal Ind Ltd シリコン半導体基板の熱処理方法
JPH11251322A (ja) * 1998-02-27 1999-09-17 Sony Corp エピタキシャルシリコン基板及び固体撮像装置並びにこれらの製造方法
JPH11302099A (ja) * 1998-04-21 1999-11-02 Sumitomo Metal Ind Ltd シリコン単結晶の製造方法
JP2000026196A (ja) * 1998-05-01 2000-01-25 Nippon Steel Corp シリコン半導体基板及びその製造方法
JP2000203999A (ja) * 1999-01-08 2000-07-25 Sumitomo Metal Ind Ltd 半導体シリコンウェ―ハとその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3711199B2 (ja) * 1998-07-07 2005-10-26 信越半導体株式会社 シリコン基板の熱処理方法
US6336968B1 (en) * 1998-09-02 2002-01-08 Memc Electronic Materials, Inc. Non-oxygen precipitating czochralski silicon wafers

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0232535A (ja) * 1988-07-21 1990-02-02 Kyushu Electron Metal Co Ltd 半導体デバイス用シリコン基板の製造方法
JPH1167781A (ja) * 1997-08-08 1999-03-09 Sumitomo Metal Ind Ltd シリコン半導体基板の熱処理方法
JPH11251322A (ja) * 1998-02-27 1999-09-17 Sony Corp エピタキシャルシリコン基板及び固体撮像装置並びにこれらの製造方法
JPH11302099A (ja) * 1998-04-21 1999-11-02 Sumitomo Metal Ind Ltd シリコン単結晶の製造方法
JP2000026196A (ja) * 1998-05-01 2000-01-25 Nippon Steel Corp シリコン半導体基板及びその製造方法
JP2000203999A (ja) * 1999-01-08 2000-07-25 Sumitomo Metal Ind Ltd 半導体シリコンウェ―ハとその製造方法

Also Published As

Publication number Publication date
KR100815625B1 (ko) 2008-03-21
US6805743B2 (en) 2004-10-19
TW508701B (en) 2002-11-01
JP2002043318A (ja) 2002-02-08
KR20030051604A (ko) 2003-06-25
US20030164139A1 (en) 2003-09-04
EP1313137A1 (en) 2003-05-21

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