WO2002007236A1 - Detecteur de deplacement et systeme de traitement - Google Patents

Detecteur de deplacement et systeme de traitement Download PDF

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Publication number
WO2002007236A1
WO2002007236A1 PCT/JP2001/005318 JP0105318W WO0207236A1 WO 2002007236 A1 WO2002007236 A1 WO 2002007236A1 JP 0105318 W JP0105318 W JP 0105318W WO 0207236 A1 WO0207236 A1 WO 0207236A1
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WO
WIPO (PCT)
Prior art keywords
processed
contour
detection
displacement
wafer
Prior art date
Application number
PCT/JP2001/005318
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English (en)
Japanese (ja)
Inventor
Masaki Kondo
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Publication of WO2002007236A1 publication Critical patent/WO2002007236A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Definitions

  • the present invention relates to a position shift detecting device for detecting a position shift occurring in the course of conveyance, and a processing system having the position shift detecting device and performing a predetermined process on an object to be processed such as a semiconductor wafer.
  • a processing chamber for each processing is connected to one common transfer chamber and provided as a so-called class tool tool, and the wafer is transported so as to walk between the processing chambers.
  • a series of processes as described above are performed.
  • FIG. 10 is a schematic configuration diagram showing an example of the conventional processing system as described above.
  • the processing system 2 has a plurality of, here three processing chambers 8A to 8C, respectively, which are connected to a common transfer chamber 4 which can be evacuated via gate valves 6A to 6C. It is composed by connecting.
  • a mounting table 10A to 10C on which an electrostatic chuck for adsorbing and holding a wafer by, for example, electrostatic force is disposed on the upper surface is provided.
  • the common transfer chamber 4 is connected to two cassette chambers 14A and 14B for accommodating cassettes containing substantially disc-shaped semiconductor wafers via gate valves 12A and 12B. Is done.
  • a transfer mechanism 16 for example, composed of an articulated arm capable of turning and bending and extending.
  • the transfer mechanism 16 holds the semiconductor wafer W, and transfers the semiconductor wafer W to each other.
  • the paper is transferred between the cassette chambers 14A and 14B and the processing chambers 8A to 8C and between the processing chambers 8A to 8C.
  • the wafer W when receiving the wafer W from the mounting table 10 A to 10 C, the wafer W However, when the charge is insufficient, the wafer may be held up by the transfer mechanism while the wafer is jumped up due to residual charges and a positional shift occurs. Therefore, when the semiconductor wafer W is held and transferred by the transfer mechanism 16, the center of the semiconductor wafer W is allowed to the holding center 18 A at the tip of the arm 18 of the transfer mechanism 16 with high accuracy. It is necessary to transfer the wafer W with almost no misalignment in the condition of matching within the capacity.
  • Japanese Patent Application Laid-Open Publication No. H10-210, etc. has proposed a position shift detecting device.
  • a detection device as shown in FIG. 10 will be described.
  • a predetermined interval is provided in the vicinity of the gate valves 6A to 6C of the processing chambers 8A to 8C.
  • a pair of line sensors 20 and 22 are arranged, and when the wafer W passes there, it is temporarily stopped at a predetermined position to detect two edges of the wafer (positions of peripheral contours). Based on the detected value, the degree of displacement of the wafer center at that time from the reference origin is determined.
  • the position shift detecting device disclosed in Japanese Patent Application Laid-Open No. 10-247681 uses three sensors, one of which is a notch (a V-shaped notch). ), The wafer manufacturing error and heat It is difficult to sufficiently respond to fluctuations in the wafer diameter due to expansion and contraction.
  • the error of the diameter is only allowed to be about ⁇ 0.2 mm, and the amount of the positional deviation is accurately detected. And it needs to be corrected.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to accurately determine the presence / absence of a position shift and the amount of position shift of a target object without being affected by manufacturing errors or thermal expansion and contraction of the target object. It is an object of the present invention to provide a position shift detecting device and a processing system which can be used. Disclosure of the invention
  • a first feature of the present invention is a position shift detecting device for detecting a position shift of a disk-shaped object to be processed having a direction-recognizing cutout portion in a peripheral portion, wherein the processing target excluding the direction-recognition cutout portion is provided.
  • Three contour detection sensors arranged to detect the position of the peripheral contour of the body, and a reference position between the center position of the object to be processed and a reference origin obtained based on each detection value of the three contour detection sensors.
  • a shift amount calculating unit for calculating a shift amount between the two.
  • the three contour detection sensors can detect the peripheral contour of the object to be processed at a position excluding the direction recognition notch such as a notch or an orientation flat.
  • the center position of the object to be processed can be obtained without affecting the manufacturing error of the diameter or the thermal expansion and contraction.
  • the presence or absence of the position shift and the amount of the position shift can be obtained with high accuracy.
  • a second feature of the present invention is that the three contour detection sensors are arranged substantially 120 degrees apart from each other in the circumferential direction around the reference origin. According to this, it is possible to further improve the detection accuracy of the displacement amount.
  • a fourth feature of the present invention is that the contour detection sensor has a light-emitting element that emits inspection light, and a line-shaped light-receiving element that is arranged along a radial direction of the object to be processed.
  • the light receiving element is provided with a slit plate for blocking light entering the end of the linear light receiving element. According to this, the end portion of the strip-shaped inspection light, whose detection characteristics tend to be deteriorated, is blocked by the slit plate, so that it is possible to further improve the detection accuracy of the displacement amount.
  • the deviation amount calculating section obtains coordinates of three wedge portions of the object from the detected values of the three contour position detection sensors, and calculates an arbitrary one of the three points.
  • the center position of the object to be processed is determined from the intersection of the perpendicular bisectors of the line segments connecting the desired two points.
  • the displacement amount detecting device further includes a transport mechanism for transporting the object to be processed
  • the displacement amount calculation unit includes a teaching held at a regular position of the transport mechanism.
  • the reference origin is obtained based on the detection values of the three contour position detection sensors when the object to be processed is stopped at the position detection amount.
  • a seventh feature of the present invention is that a plurality of processing chambers for performing a predetermined process on an object to be processed, a common transfer chamber commonly connected to a loading / unloading port of the plurality of processing chambers, A processing mechanism provided inside the chamber and capable of holding and transporting the object to be processed between the processing chambers, and a transport mechanism capable of turning and bending and extending.
  • a standby position for temporarily holding the object to be processed is provided corresponding to the loading / unloading port of at least one of the processing chambers, and a position of a peripheral contour of the object is set corresponding to the standby position.
  • a device for detecting position deviation is provided for detecting the position of a peripheral contour excluding the direction recognition notch of a disc-shaped object having a direction recognition notch in a peripheral portion.
  • a displacement calculating unit for calculating a displacement between a center position of the object to be processed and a reference origin obtained based on each detection value of the three contour detection sensors;
  • Control means is provided for obtaining a positional shift amount of the object held by the transport mechanism based on a detection value of the apparatus, and controlling the transport mechanism so as to correct the positional shift.
  • An eighth feature of the present invention is that a plurality of processing chambers for performing a predetermined process on an object to be processed, a common transfer chamber commonly connected to a loading / unloading port of the plurality of processing chambers,
  • the processing object is provided in a room and held and transported between the processing chambers.
  • a position detection chamber is connected to the common transfer chamber, and a position of a peripheral contour of the workpiece is set in the position detection chamber.
  • a position shift detecting device for detecting the position shift is provided, and a position shift amount of the object to be processed held by the transport mechanism is obtained based on a detection value of the position shift detecting device, and the position shift is corrected. That is, a control means for controlling the transport mechanism is provided.
  • a ninth feature of the present invention is that the position shift detecting device detects a position shift of a disk-shaped workpiece having a direction recognition cutout portion in a peripheral portion, and the direction recognition cutout portion includes: Three contour detection sensors arranged to detect the positions of peripheral contours of the object to be removed, and the center position of the object determined based on the detection values of the three contour detection sensors. And a shift amount calculation unit for obtaining a shift amount from the reference origin.
  • a tenth feature of the present invention is that the displacement detection chamber is provided with support means for temporarily supporting the object to be processed. According to this, the transport mechanism in the common transport chamber can transport another workpiece in a state where the workpiece is held by the support means and is on standby.
  • An eleventh feature of the present invention is that an opening / closing valve that can be opened and closed so as to be able to carry and shut off the common transfer chamber is provided at the entrance of the displacement detection chamber. According to this, it is possible to perform maintenance only in the displacement detection chamber by closing the on-off valve.
  • FIG. 1 is a schematic plan view showing a processing system according to the present invention.
  • FIG. 2 is an enlarged view showing a positional relationship between the contour detection sensor installed at the standby position and the object to be processed.
  • FIG. 3 is a block diagram showing a control system of the displacement detection device and the transport mechanism.
  • FIG. 4 is a diagram illustrating an example of the contour detection sensor.
  • FIG. 5 is a diagram showing a characteristic curve of the contour detection sensor.
  • FIG. 6 is an explanatory diagram for describing an example of a method of calculating the amount of displacement.
  • FIG. 7 is a schematic plan view showing a processing system according to another embodiment.
  • FIG. 8 is a cross-sectional view showing the displacement detection chamber.
  • FIG. 9 is a configuration diagram showing a displacement detection chamber of a processing system according to still another embodiment of the present invention.
  • FIG. 10 is a schematic configuration diagram showing an example of a conventional processing system. BEST MODE FOR CARRYING OUT THE INVENTION
  • two cassette chambers 14A and 14B for accommodating cassettes accommodating substantially disc-shaped wafers W are connected to the common transfer chamber 4 via gate valves 12A and 12B. ing.
  • a transfer mechanism 16 for example, composed of an articulated arm that can rotate and bend and extend, is provided.
  • two claw portions 18 A are provided, and the semiconductor wafer W is held by the claw portions 18 A. The paper is transferred and transferred between the processing chambers 8 to 8D and between the processing chambers 8A to 8D.
  • a rotary table 26 for holding and rotating a wafer and a line for detecting a positional change in the contour of the peripheral portion of the wafer W at this time are provided.
  • a positioning mechanism 30 including a sensor 28 and the like is provided to perform positioning of the wafer W.
  • Standby positions 32A and 32C are provided corresponding to the installation positions of 6A and 6C to temporarily stop the wafer W during transfer and wait. Although the standby positions 32 A and 32 C are shown in the illustrated example by circles of dashed lines of the same size as the wafer for convenience, they are actually only spaces through which the wafer can pass.
  • the common transfer chamber 4 is provided with a misregistration detecting device 34, which is a feature of the present invention, and the misalignment detecting device 34 sets the center position of each of the standby positions 32A and 32C as a reference origin OA. , 0 C, and the amount of deviation of the wafer center from the reference origin OA, 0 C is determined as the amount of positional deviation as described later.
  • the position shift detecting device 34 includes three contour detection sensors 36-1, 3-6, 3-3 arranged corresponding to the standby positions 32A, 32C. 38-1 to 38-3, which detect the position of the peripheral contour (peripheral edge) of the wafer W.
  • each of the contour detection sensors 36-1 to 36-3 and 38-1 to 38-3 is connected to a shift amount calculation unit 40 such as a microcomputer.
  • a shift amount calculation unit 40 such as a microcomputer.
  • the above-described position shift detecting device 34 is configured.
  • the wafer W is positioned at each of the standby positions 32A and 32C
  • the detected values of the contour detection sensors 3.6-1-3-36-3 and 38-1-3-8-3 are obtained.
  • the amount of misalignment between the center position of the wafer and each of the reference origins OA and OC is calculated based on this.
  • the shift amount output from the shift amount calculating unit 40 is, for example, a micro value.
  • the control means 42 is input to a control means 42 composed of a computer or the like.
  • the control means 42 controls the drive motor system 43 which is a drive source of the transport mechanism 16 so as to offset the shift amount. It has become.
  • Contour detection sensor that forms one set of the above three 3 6— :! 36-3 and 38-1-3-3 are arranged in exactly the same arrangement with respect to the corresponding processing chambers 8A and 8C.
  • the contour detection sensors 36-1 to 36-3 provided at the standby position 32A corresponding to 8A will be described with reference to FIG. 2 as an example.
  • the standby position 32 A and the peripheral contour of the wafer W are overlapped for convenience, and as shown in the figure, the three contour detection sensors 36-1 to 36-3 have the reference origin OA.
  • the line-shaped light receiving element for example, the line sensors 44-1 to 44-3 are arranged toward the reference origin OA so as to be substantially perpendicular to the wafer peripheral contour resting at an appropriate position.
  • the wafer W is generally provided with a direction-recognition notch for recognizing the direction, for example, in the case of an 8-inch wafer, an orientation flat formed by linearly cutting a part of the wafer.
  • a notch is formed in which a part of the wafer is slightly cut out in a V-shape.
  • FIG. 2 the case where the orientation flat OF is formed as the direction recognition notch is shown, and the orientation flat OF is located on the processing chamber 8A side.
  • the important point is that all of the contour detection sensors 36-1 to 36-3 are arranged at positions excluding the portion of the orientation flat OF. In the illustrated example, the contour detection sensor 36-1 is arranged closest to the orientation flat OF.
  • the deflection angle of the contour detection sensor 36-1 with respect to the direction of the processing chamber 8A is determined by the above-described orientation. It is determined in consideration of the circumferential length of the station flat 0F and the maximum deviation allowed for this wafer. For example, in the case of an 8-inch wafer, this deflection angle is set to be 22 degrees or more, and no matter how the wafer W is displaced within the maximum allowable displacement, the orientation flat OF portion is Contour detection sensor 36-1 (line sensor 4 4-1) The position is not shifted to prevent the occurrence of position error.
  • the contour detection sensor 36-1 includes a light emitting element 46-1 supported on a ceiling portion 4 A of the common transfer chamber 4 and a light emitting element 46-1 opposed to the light emitting element 46-1. It mainly comprises the light receiving element, for example, a line sensor 441-1 supported on the bottom 4B, and the light emitting element 461-1 and the line sensor 441-1 for measuring the amount of displacement.
  • the wafer W is positioned between them.
  • the light-emitting element 46-1 is attached to an upper surface of a light-transmitting window 53 made of, for example, quartz, which is provided in an opening formed in a ceiling portion 4 A through a sealing member 51 such as an O-ring.
  • the line sensor 44-1 is provided at the opening formed in the bottom 4B with a sealing member 55 such as an O-ring, for example. Attached to.
  • the light emitting element 46-1 illuminates the strip-shaped inspection light L 1, and is arranged with its length direction facing the reference origin O A (see FIG. 2).
  • the line sensor 44-1 which is opposed to this, is also arranged with its length direction facing the reference origin OA as described above, and the light receiving position of the sensor body 48 that actually detects the inspection light L1, Alternatively, the position of the peripheral contour (edge portion) of the wafer W is detected according to the light shielding position by the wafer W.
  • a slit plate 50 is provided in the vicinity of the line sensor 4411.
  • the slit plate 50 blocks the light at both ends of the strip-shaped inspection light L1 and An elongated slit hole 52 that allows only the light at the center of the strip-shaped inspection light L1 to pass through is formed, so that the detection accuracy can be improved.
  • the improvement of the detection accuracy will be described with reference to FIG.
  • FIG. 5 shows a characteristic curve of the contour detection sensor.
  • the horizontal axis indicates the actual position of the wafer contour, and the vertical axis indicates the calculated position of the wafer contour. Also, the horizontal axis has a slit
  • the plan view of the plate 50 and the sensor body 48 are shown in correspondence. Also, some of the scale positions in FIG. 5 are shown in FIG.
  • a teaching operation is performed to teach the precise values of the standby positions 32A and 32C, which are the references for detecting the positional deviation, to the control system of the apparatus.
  • the electrostatic chucks of the mounting tables 10A and 10C are not used, and they are turned off, and in this state, the appropriate positions on the mounting tables 10A and 10C are used for teaching.
  • the wafer W is placed in a state where the wafers are accurately matched, that is, in a state where there is no displacement. '
  • the processing mechanism 8 A, 8 C and the common transfer chamber 4 are evacuated and the transfer mechanism 16 is driven to transfer each of the wafers from the mounting tables 10 A, 10 C. Stop at the detection positions, specifically, the corresponding standby positions 32A and 32C, and then each contour detection sensor 36-1 to 36-3 and 38-1 to 38 at this time. — Using the detected value of 3 as the zero reference, determine the reference origins OA and OC at this time. Thereafter, the position deviation amount of the wafer W is detected based on this value. This wafer is held at the normal position of the transfer mechanism. In addition, the reference origins OA and OC can be obtained from design data of the common transfer chamber 4 and the contour detection sensors 36-1 to 36-3, etc., but in this case, the detection accuracy of the displacement amount decreases. .
  • the wafer is held by the claw portion 18A in a state where the wafer is properly aligned.
  • This aligned wafer W is directed by the transfer mechanism 16 to a predetermined processing chamber, for example, 8 A. Then, the transfer mechanism 16 is extended and the wafer W is loaded into the processing chamber 8A via the gate valve 6A which is opened, and is placed on the mounting table 1OA, and the electrostatic chuck is suctioned. Fix with force.
  • the transfer mechanism 16 is retracted, the wafer W is temporarily stopped at the standby position 32 A, and the deviation of the center position of the wafer W from the reference origin OA of the standby position 32 A is determined by the contour detection sensor means 3. 6-1-3 c Based on the detected value of 6-3 c.
  • the transfer mechanism 16 is turned to transfer this wafer W to the next processing chamber. Orient to 8 B, for example.
  • the operation of the transfer mechanism 16, that is, the rotation amount of the wafer W is corrected so as to correct and offset the positional deviation amount of the wafer W obtained at the standby position 32 A.
  • the wafer W is placed at an appropriate position on the mounting table 10B.
  • C Next, when a predetermined process is performed on the wafer W in the processing chamber 8B, the wafer W is taken out by the transfer mechanism 16 and is taken into the common transfer chamber 4.
  • the wafer W is temporarily stopped at the standby position 32C immediately before the loading, and is made to stand by.
  • the detection sensors 38-1 to 38-3 the amount of displacement of the center position of the wafer W with respect to the reference origin 0C of the standby position 32C is obtained in the same manner as described above.
  • each standby position 3 2A Or the reference deviation at 32 C between the reference origin ⁇ A or OC and the center of the wafer is determined.
  • the control means 42 outputs a command signal to the drive motor system 43 so as to correct and offset the above-described displacement, and the rotation angle 0 and the bending / stretching of the transport mechanism 16 are controlled. Control the quantity R.
  • the reference origin OA is set as the coordinate origin
  • the coordinate of the actual center WO of the wafer W is set as (X, Y)
  • the coordinates of each detected value of each contour detection sensor 36-1-3-1-6-3 are set as coordinates.
  • (x1, y1), (x2, y2) and (x3, y3) are set as coordinates.
  • the line segment 56 connecting the origin (0, 0) and the coordinates (X, Y) is the amount of misalignment of the misaligned wafer with respect to the properly positioned wafer.
  • control means 42 controls the drive motor system 43 so as to offset the displacement amount 56.
  • three contour detection sensors 36-1 to 36-3 are arranged at one standby position, for example, 32 A, and all of these sensors 36-1 to 36-3 are arranged. It is located out of the direction recognition notch, for example, the position of the orientation flat OF, so it is possible not only to accurately detect the displacement of the wafer W, but also to vary the wafer diameter due to, for example, manufacturing errors. , Or even if the wafer diameter is slightly expanded or contracted due to residual heat during heat treatment, the center position of the wafer W is accurately determined without affecting these factors, and the amount of displacement is calculated. Can be determined appropriately.
  • the wafer diameter is slightly larger than the reference.
  • the wafers of the appropriate size are provided to both line sensors 20 and 22 without displacement.
  • the same detection value is output as when it is installed, and in this case, it may be erroneously determined that there is no displacement.
  • the orientation flat OF section Since the position detection is performed at three points of the wafer contour excluding the part, if the position is misaligned as described above, it can be recognized properly and accurately. In addition, since the position shift amount is detected by using the contour detection sensors 36-1 to 36-3 and 38-1 to 38-3 fixed at a predetermined position in the common transfer chamber 4, the wafer is moved. There is no need to rotate and detect, and the amount of displacement can be detected in a short time.
  • a slit plate 50 is provided near the line sensor, for example, 441-1 to block light at both ends of the strip-shaped inspection light L1 having poor characteristics. Therefore, the detection accuracy can be further improved.
  • the present invention is not limited to this, and one set of three contour detection sensors corresponding to at least one of the four processing chambers is provided. May be provided.
  • FIG. 7 is a schematic plan view showing a processing system according to such another embodiment
  • FIG. 8 is a cross-sectional view showing the displacement detection chamber.
  • each of the contour detection sensors 39-1 to 39-3 is a light emitting element 46-6. 1-4-6-3, line sensor 44-1-4-4-13 and each have a slit plate (not shown).
  • no other contour detection sensors 36-1-3-1-6-3 and 38-1-38-3 are provided in the common transfer chamber 4. You may.
  • the wafer is transferred into the displacement detection chamber 60.
  • the wafer W may be loaded by the mechanism 16 and temporarily stopped, and the amount of displacement of the wafer W may be detected.
  • a support means 70 for temporarily supporting the semiconductor wafer W carried therein may be provided in the displacement detection chamber 60 shown in FIG.
  • the support means 70 has three support pins 72 made of, for example, quartz, which support the back surface of the wafer W.
  • the three support pins 72 are commonly connected to an elevating port 74.
  • the lifting rod 74 is extended downward by penetrating a rod hole 76 provided in the bottom 6 OA of the displacement detection chamber 60 by connecting the lifting rod 74 with the lifting drive mechanism 78. It can be moved up and down. Then, an elongate and contractible metal bellows is provided between the bottom 6OA and the elevating drive mechanism 78 so as to cover the periphery of the elevating rod 74.
  • the lifting rod 74 and the support pin 72 can be moved up and down while maintaining the airtightness of the displacement detection chamber 60.
  • the transfer mechanism 16 (see FIG. 7) Can transfer other semiconductor wafers, and accordingly, the transfer efficiency can be improved and the transfer speed can be increased.
  • the displacement detection device provided therein may be, for example, the position detection device of the present invention described with reference to FIGS.
  • the present invention is not limited to the displacement detecting device, and for example, a conventional displacement detecting device as shown in FIG. 10 may be provided.
  • a semiconductor wafer has been described as an example of an object to be processed.
  • the present invention is not limited to this as long as it has a substantially disk shape.
  • the present invention can be applied to an LCD substrate and a glass substrate. Of course.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

L'invention concerne un détecteur de déplacement permettant de détecter précisément la présence ou l'absence et la longueur du déplacement d'un corps traité de type disque (W) comprenant, sur sa périphérie, une découpe permettant de détecter son orientation (OF). Ce détecteur comprend trois capteurs de détection de profile (36-1 à 36-3, 38-1 à 38-3) disposés de façon à détecter la position du profile périphérique du corps traité, sans tenir compte de la découpe permettant de détecter son orientation, et un élément de calcul de longueur de déplacement (40) destiné au calcul de la longueur du déplacement du disque entre la position centrale du corps traité et le point d'origine de référence, sur la base des valeurs obtenues par l'intermédiaire des trois capteurs de détection de profile. La présence ou l'absence et la longueur du déplacement du corps traité peuvent être obtenues avec précision sans entraîner de vice de fabrication et de télescopage thermique du corps traité.
PCT/JP2001/005318 2000-07-19 2001-06-21 Detecteur de deplacement et systeme de traitement WO2002007236A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000219823A JP2002043394A (ja) 2000-07-19 2000-07-19 位置ずれ検出装置及び処理システム
JP2000-219823 2000-07-19

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JP5024555B2 (ja) * 2008-09-12 2012-09-12 オムロン株式会社 ウエハのアライメント方法及び装置
JP5208800B2 (ja) 2009-02-17 2013-06-12 東京エレクトロン株式会社 基板処理システム及び基板搬送方法
JP6118044B2 (ja) 2012-07-19 2017-04-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6063716B2 (ja) * 2012-11-14 2017-01-18 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
JP2015005682A (ja) * 2013-06-24 2015-01-08 シンフォニアテクノロジー株式会社 搬送ロボット、円盤状搬送対象物の搬送方法
JP6415971B2 (ja) 2014-12-25 2018-10-31 東京エレクトロン株式会社 基板処理装置、基板処理方法及び基板処理プログラムを記録した記録媒体
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