WO2001090727A1 - Dispositif automatique d'analyse/commande pour solution composite de galvanoplastie sans courant - Google Patents
Dispositif automatique d'analyse/commande pour solution composite de galvanoplastie sans courant Download PDFInfo
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- WO2001090727A1 WO2001090727A1 PCT/JP2001/004222 JP0104222W WO0190727A1 WO 2001090727 A1 WO2001090727 A1 WO 2001090727A1 JP 0104222 W JP0104222 W JP 0104222W WO 0190727 A1 WO0190727 A1 WO 0190727A1
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- plating solution
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T436/00—Chemistry: analytical and immunological testing
- Y10T436/12—Condition responsive control
Definitions
- the present invention relates to a device for automatically analyzing and managing an electroless composite plating solution.
- the components to be analyzed by the automatic solution management device are extremely limited, for example, components that are used as a guide for replenishment and components that are the most important for securing plating quality. In many cases, only analyzed components are analyzed, and it can be said that there is no analysis of all components.
- the analyzed components are often two components: Ni concentration and pH.
- electroless nickel In plating the control of the Ni concentration is of the utmost importance.
- the Ni component is consumed and the concentration gradually decreases, so the Ni component is replenished sequentially to maintain the Ni concentration at the default value.
- a chelate titration method and an absorption spectrometry method are generally used.
- an absorption spectrometry method has been popularized in an automatic liquid management apparatus equipped with electroless nickel plating.
- Absorption spectroscopy has historically been a very old means of compositional analysis by instrumental analysis. There are various methods up to the spectrophotometric method of measuring the absorbance using the method.
- the electroless nickel plating solution contains various complexing agents.
- the Ni component exists as Ni complex ions, and the Ni complex strongly absorbs light in the green wavelength range. There is a good proportional relationship between the absorbance at and the Ni concentration. Using this feature, quantitative analysis is performed with high accuracy. Although it is necessary to split the light in order to perform measurement in a specific wavelength range, many devices employ a method of selecting light with an interference filter. In addition, there is a method of obtaining a wavelength very close to monochromatic light by using a monochromator using a diffraction grating or a prism, etc., but it is mechanically complicated and relatively expensive.
- the incident light is not only light that travels straight and is transmitted and absorbed, but also light that is reflected by suspended particles and light that is diffracted and scattered. .
- the reflected light, diffracted and scattered light due to the suspended particles apparently reduces transmitted light, and cannot be distinguished from light whose transmitted light has decreased due to absorption by the target component.As a result, a large amount of the target component is present. Misunderstood to do.
- the degree of influence of the suspended particles varies depending on the type, particle size distribution, concentration, etc. of the suspended particles, and can also vary depending on various factors of the plating solution.
- the effect of suspended particles is relatively stable, so the component concentration is measured relatively accurately by assuming a certain value as a decrease in transmittance due to turbidity. It is also possible.
- the composition of the electroless plating solution fluctuates greatly when used, it is necessary to compensate for the effect, and there is a limit to anticipating the effect of turbidity at a constant value.
- the method of measuring fine particles dispersed in the plating solution after separating them by filter ration, sedimentation, centrifugation, etc. is a mechanism for performing separation continuously or intermittently.
- the adjustment of the solution becomes considerably difficult because the plating solution is wasted during the analysis.
- the analytical method is analyzed by chelate titration, but the equipment is considerably complicated, and in addition, a highly accurate and highly reliable sampling apparatus is required to ensure accuracy.
- there are considerably more negative factors compared to P and optical analysis methods such as the generation of a large amount of waste liquid due to analysis, and the necessity of consumable chemicals for analysis such as indicators and titrants.
- the plating solution is processed for analysis and is measured as it is, without wasting it, and is returned to the plating tank as a circulation cycle. This is the ideal method. Disclosure of the invention
- the present invention relates to a method for analyzing the Ni concentration in an electroless composite plating solution, particularly an electroless composite nickel plating solution, using a fluororesin (PTFE, FEP, PFA, TFE oligomer, etc.), a fluorinated graphite (CF) X), graphite, alumina (a 1 2 0 3), carbide Kei element (S i C), accuracy of analysis because the suspended particles are present typified boron nitride (BN) is to solve the problem of lowered It is an object of the present invention to provide an automatic analysis / management apparatus for electroless composite plating liquid which can ensure practically sufficient analysis accuracy and is inexpensive.
- a fluororesin PTFE, FEP, PFA, TFE oligomer, etc.
- CF fluorinated graphite
- alumina a 1 2 0 3
- carbide Kei element S i C
- accuracy of analysis because the suspended particles are present typified boron nitride (BN)
- the present invention provides an electroless composite material in which fine particles of fluororesin fine particles, graphite fluoride, graphite, alumina, silicon carbide, boron nitride, and the like are dispersed in an electroless plating solution.
- Provide automatic analysis and management equipment that automatically analyzes replenished liquid based on the analysis results and replenishes and adjusts the liquid based on the analysis results, and provides analysis methods and various devices on the equipment to ensure the required analysis accuracy.
- the main factor that hinders the quantitative analysis of the concentration of precipitated metal ions in the electroless composite plating solution by spectrophotometry is that It is turbidity due to fine particles dispersed in the liquid.
- the present invention provides the following automatic analyzer and controller for the electroless composite plating solution.
- An automatic analysis and management device for an electroless composite plating solution comprising:
- the measurement time table must be set so that at least 15 seconds must be left before the transmittance or absorbance measurement starts after the plating solution is automatically introduced into the analysis cell.
- Plating is provided by having a vertically long plating liquid stagnation section with a cross-sectional area that is at least twice the cross-sectional area of the pipe, providing an inlet at the top of the plating stagnation section and an outlet at the bottom.
- the automatic analysis and management device according to any one of (1) to (5), further including a trap mechanism for preventing minute bubbles entrapped in the liquid from being brought into the analysis cell.
- FIG. 1 is a graph showing the relationship between the measured wavelength and the absorbance when the Ni concentration is changed to 0 to 5 gZL in an electroless nickel plating solution containing no PTFE.
- Figure 2 shows the relationship between the measured wavelength and the absorbance when the PTFE concentration is changed from 0 to 10 gZL in an electroless plating solution (Ni concentration OgZL) containing PTFE as composite material particles and containing no metal components.
- Ni concentration OgZL electroless plating solution
- Fig. 3 shows the measured wavelength and absorbance when the Ni concentration was fixed at 5 g and the PTFE concentration was changed from 0 to 10 g / L in an electroless composite nickel plating solution using PTFE as composite material particles.
- 6 is a graph showing the relationship of.
- Figure 4 shows the relationship between the Ni concentration and the absorbance at a wavelength of 400 nm when the PTFE concentration was changed from 0 to L0 g / L in an electroless composite nickel plating solution containing PTFE as composite material particles. It is a graph which shows a relationship.
- Fig. 5 is a graph showing the relationship between the PTFE concentration and the absorbance at a wavelength of 400 nm when the Ni concentration was changed from 0 to 5 gZL in an electroless composite nickel plating solution using PTFE as composite material particles. is there.
- Figure 6 shows the relationship between the Ni concentration and the absorbance at a wavelength of 520 nm when the concentration of the electroless composite nickel plating solution containing PTFE as composite material particles was changed from 0 to 10 gZL. It is a graph.
- Figure 7 shows the PTFE concentration at a wavelength of 520 nm when the Ni concentration was varied from 0 to 5 gZL in the electroless composite Nigel plating solution using PTFE as composite particles.
- 4 is a graph showing a relationship between the absorbance and the absorbance.
- FIG. 8 is a schematic front view of the automatic analysis and management device according to one embodiment of the present invention.
- FIG. 9 is an explanatory diagram of a measurement unit of the same device.
- Fig. 10 shows the relationship between the absorbance at a wavelength of 660 nm and the wavelength of 520 nm measured for an electroless composite nickel plating solution using the same apparatus, with a constant Ni concentration and a varied PTFE concentration. It is a graph.
- FIG. 11 is a graph showing the relationship between the K value and the Ni concentration for the same electroless composite nickel plating solution.
- Fig. 12 shows the relationship between the absorbance at a wavelength of 660 nm and the wavelength of 520 nm measured for another electroless composite nickel plating solution using the same apparatus, with a constant Ni concentration and a varied PTFE concentration.
- FIG. 13 is a graph showing the relationship between the K value and the Ni concentration for the same electroless composite nickel plating solution.
- FIG. 14 is a graph showing the relationship between the number of turns (MTO) and the measured Ni concentration when electroless composite nickel plating is continuously performed.
- FIG. 15 is a graph showing the relationship between the number of turns and the measured PH value when electroless composite nickel plating is performed continuously.
- Fig. 16 is a graph for calculating the evening correction coefficient, and shows the relationship between the number of turns and the Ni concentration standard value-error value.
- FIG. 17 is a graph showing the relationship between the number of turns and the turbidity value measured at 500 nm when electroless composite nickel plating is continuously performed.
- FIG. 18 is a schematic view showing an example of an electroless composite plating apparatus incorporating the apparatus of the present invention.
- FIG. 19 is a schematic view showing another example of the electroless composite plating apparatus incorporating the apparatus of the present invention.
- the automatic analysis and management device for the electroless composite plating solution of the present invention is a method for measuring the concentration of metal components in the plating solution in the solution by an absorption spectrophotometer. It has a mechanism to measure the transmittance or absorbance at least at two or more different wavelengths after being introduced into the inside, and a mechanism to calculate the target concentration from the measured value by arithmetic processing and display the result Things.
- the electroless composite plating liquid to which the present invention is applied is a dispersion of water-insoluble composite material particles in the electroless plating liquid, and the electroless plating liquid is sodium hypophosphite.
- An electroless nickel plating solution, an electroless nickel-cobalt plating solution, an electroless cobalt plating solution, and an electroless copper plating solution using a boron-based reducing agent such as dimethylamine porane as a reducing agent can be exemplified. .
- fluorocarbon resin PTFE, FEP, PFA, TFE oligomer, etc.
- graphite fluoride CF X
- graphite graphite
- alumina A 1 2 0 3
- carbide Kei element S i C
- boron nitride BN
- electroless composite plating liquid a liquid having a known liquid composition or a commercially available bath can be used.
- the present invention is suitably adopted for the measurement of the nickel component in the electroless composite nickel plating solution.
- the composition of the electroless composite nickel plating solution used for the measurement is not limited, but for example, the Ni ion concentration is 1 to 10 gZL, particularly 3 to 7 gZL, fluororesin, etc.
- a composite material particle of 30 g / L or less, particularly 10 g / L or less is preferably used.
- the lower limit of the content of the composite material particles is not particularly limited, but is usually 5 gZL or more, particularly 1 g / L or more.
- the reducing agent is preferably a hypophosphite such as sodium hypophosphite, and its concentration is 5 to 50 g / L, particularly 10 to 30 gZL.
- the method of the present invention can be effectively applied to electroless composite nickel plating solutions in which phosphites such as sodium phosphite generated by the oxidation of sodium are accumulated in a wide range of 0 to 300 / L, especially 0 to 200 gZL. Adopted.
- the pH of the electroless composite nickel plating solution is usually 3 to 9, especially 4 to 8.
- the transmittance or the absorbance at two or more different wavelengths is analyzed.
- the wavelength of the light for measuring the absorbance is the wavelength for measuring the Ni concentration (for example, 660 nm) and the wavelength in a specific range of a shorter wavelength range (for example, 520 nm). (nm).
- electroless composite nickel plating solutions electroless Ni-PZPTFE composite plating solutions
- sodium hypophosphite sodium hypophosphite
- PTFE polytetrafluoroethylene
- Figures 1 to 3 show the use of an electroless Ni-P / PTFE composite plating chemical called Nimflon (trade name) available from Uemura Kogyo Co., Ltd. as an electroless Ni-PZPTFE composite plating solution.
- Figure 1 shows a typical example of the absorption pattern obtained when a sample solution was intentionally changed in i-concentration and PTFE concentration and measured by spectrophotometry.
- the absorption pattern obtained from the plating solution with the Ni concentration changed stepwise in the plating solution without adding the slurry of PTFE solution (solid content: about 66 wt%) called “Nimflon F” It is a thing.
- the absorbance increases proportionally in the wavelength range of 350-450 nm and 550-800 nm with increasing Ni concentration.
- Fig. 2 summarizes the absorption patterns obtained by using Nimflon F (a slurry-like PTFE solution) in a stepwise manner with the Ni concentration being 0 gZL.
- Absorbance is proportionally increased in all wavelength ranges measured with increasing PTFE concentration, and it is particularly characteristic that the absorbance increases at a shorter wavelength at an increasing rate.
- Fig. 3 summarizes the absorption patterns obtained by using Nimflon F (slurry PTFE solution) in a stepwise manner, as in Fig. 2, with a constant Ni concentration of 5 g / L. .
- the absorption due to Ni is observed in the wavelength range of 350-450 nm and 550-800 nm, but the absorbance is proportional in all wavelength ranges measured with increasing PTFE concentration. The characteristic tendency was that the absorbance increased at shorter wavelengths at an accelerated rate.
- the absorption pattern in Fig. 3 can be understood as an absorption pattern obtained by adding the absorption pattern of the electroless plating solution with Ni concentration of 5 gZL to the absorption pattern as shown in Fig. 2 due to the change in PTFE concentration.
- FIGS. 4 to 7 summarize the absorbance measured at 400 nm and 520 nm in relation to the Ni concentration or Nimflon F concentration (or PTFE concentration).
- the change in P and luminous intensity has a very good proportional relationship with both the Ni concentration and the PTFE concentration, and the so-called absorbance at any Ni concentration and particle concentration shows the metal ion concentration and the metal ion concentration in the plating solution. It was confirmed that this could be understood as the sum of turbidity due to the dispersed particles. From this fact, it is suggested that the measurement (calibration curve creation) for grasping both characteristics in advance can avoid the adverse effect of turbidity and measure the desired Ni concentration. Was done.
- the first method to measure at two measurement wavelengths is the first wavelength As having absorption of Ni, a wavelength range of 350 to 45 nm or 55 to 800 nm, more preferably 37 to 40 nm or 600 to 70 nm, Most preferably, measurement at any wavelength within the wavelength range of 390 to 410 nm or 640 to 740 nm, and a second wavelength of 250 to 400 nm that does not overlap with the first wavelength.
- nm or 450-550 nm wavelength range more preferably 275-335 nm or 480-535 nm, most preferably 300-320 nm or It turned out that combining measurements at any wavelength within the wavelength range of 500 to 535 nm is a combination of wavelengths that can reduce the occurrence of errors.
- the concentration of metal ions, for example, nickel ions, of the electroless composite plating solution is kept constant, and a plurality of composite materials, for example, having different PTFE concentrations (preferably, PTFE) are used.
- Ku is 3 or more, more preferably about plated liquid or four)
- the absorbance of the first wavelength WI ⁇ A t and the absorbance A 2 of the second wavelength WL 2 were measured, the relationship between the absorbance and A 2 from obtaining the following relationship (Note, a,> and a 2).
- X Absorbance of the first wavelength
- the absorbance was measured and Alpha 2, obtains the following relationship from the relationship between ⁇ values and metal ion concentration.
- the metal ion concentration can be determined by measuring the absorbance at the first and second wavelengths.
- the concentration of these metal ions can be obtained by previously obtaining a relational expression in which a second metal ion to be alloyed with the first metal ion is added to the first metal ion.
- the third wavelength can be set, and the relation can be obtained as a relational expression in which the influence of the second metal ion on the absorbance is added.
- the metal ion concentration can be increased. Can be accurately analyzed.
- conversion to bivalent copper ions is preferred.
- the half width is 10 O nm or less.
- the half width was preferably 5 O nm or less, most preferably 20 nm or less.
- the lower limit of the half width is suitably 1 nm or more, more preferably 5 nm or more, and most preferably 10 nm or more.
- A is a control unit that performs arithmetic processing and various operation instructions
- B is a concentration measurement unit.
- the analysis value of the electroless composite plating solution measured by this measurement unit B is sent to the control unit A.
- the analysis value is transmitted, and a predetermined operation instruction corresponding to the analysis value is given to the plating apparatus.
- the control unit A has a built-in computer, which performs arithmetic processing and various operation instructions as described above, and has a display mechanism for displaying the analysis results and the operation status of the apparatus as needed.
- the control condition setting including the setting of the operating condition of the apparatus and the manual operation can be performed in this portion.
- connecting a computer to this control unit via a communication port can enable dedicated software to perform all major control such as data processing of analysis results and operation instructions from the operating environment from a personal computer. Yes, it is possible to connect a communication line to control multiple supply units and communication with a temperature controller that controls the plating temperature at the same time.
- the measurement section B includes an absorbance measurement unit 10 and a pH cell 12 as shown in FIG.
- the piping up to the pH cell 12 has an inner diameter of 3 mm, and the inner diameter of the pH cell 12 is 14 mm.
- the pH cell 12 is connected to a column 14 for supplying and storing a saturated solution of KC1 and is provided with a temperature sensor 16.
- the inside diameter of the tube that is piped from the location of this temperature sensor 16 without passing through the absorbance cell 10a should be larger than the inside diameter of the tube to P and the light intensity cell 10a, and the liquid containing bubbles Is difficult to flow to the absorbance cell 10a.
- the absorbance measurement unit 10 has a light-receiving part on one side of the absorbance cell 10a, and a secondary diaphragm on the other side in order from the cell 10a side.
- the interference filter, primary diaphragm, light source and lamp are arranged in this order, and the interference filter is fan-shaped from the axis of the low-speed motor so that two types can be automatically and accurately switched automatically.
- the two filters are fixed with the shortest possible axis, and the motor rotates forward and backward to move one of the filters to a predetermined position in the optical path and stop. Have.
- V1 to V8 are solenoid valves, respectively.
- the solenoid valves are a pure water supply unit for V1, a first sample supply unit for V2, and a solenoid valve for V3. Is connected to the second sample supply unit, V 4 is connected to the pH 4 standard solution supply unit, V 5 is connected to the pH 7 standard solution supply unit, and the solenoid valve V 6 is connected to the drain. , V7 are connected to the first sample discharging unit, and V8 is connected to the second sample discharging unit. Then, the solenoid valves V1 to V5 and V6 to V8 are opened and closed as appropriate, for example, V2 and V7 are opened, the others are closed, and the sampling pump 18 is operated.
- V2 Flow from the plating tank through V2, flow into the pH cell 12 and flow, and measure the pH of the first sample, flow into the P and light measurement unit 10, flow, flow from V7 Distributes into the first plating tank.
- the sampling pump 18 is stopped, the absorbance is measured at 660 ⁇ m, and then the interference filter of the absorbance unit 10 is switched, and the absorbance is measured at 52 O nm.
- V2 is closed and the sampling pump 18 is operated for a predetermined time, and a KCL saturated solution (not shown) flows into and flows into the pH cell 12 and the absorbance measurement unit 10. Close V7 and open V6 to drain to drain. These operations are performed at appropriate intervals. After the above analysis, perform calibration and cleaning periodically.
- V4 To calibrate the pH electrode, after introducing the above KCL saturated solution, open V4, operate the sampling pump 18 to allow the pH4 standard solution to flow through the pH cell 12 and the absorbance measurement unit 10, and discharge it to the drain. Is closed, V5 is opened, and PH 7 standard solution is circulated and discharged in the same manner. After that, the above analysis operation is performed. Also, in the washing step, after introducing the above KCL saturated solution, V5 is closed, VI is opened, pure water flows into and flows through the pH cell 12, pure water flows into the P and photometric measurement unit 10, flows through to the drain. Discharge and measure the absorbance in pure water for the two wavelengths as above.
- the automatic analysis and management equipment of general electroless nickel plating solutions often uses an arbitrary wavelength of 600 to 800 nm.
- the reason for this is that, in the performance of the light source and the light receiving unit, it is easier for a wavelength having a relatively long visible light range to secure a sufficient amount of received light.
- a wavelength of 660 nm was chosen.
- a wavelength of 520 nm having almost no absorption due to the Ni concentration was selected as in the previous basic study, and the study was performed at these two measurement wavelengths.
- Fig. 10 and Fig. 12 show the wavelengths of 660 nm for the samples (Sample Nos. 5 to 9) in which the Ni concentration was constant and the PTFE concentration was changed in Nimflon and Nimflon FUL plating solutions, respectively. It shows the relationship between the absorbance (ABS) and the absorbance (ABS) at a wavelength of 520 nm.
- FIGS. 11 and 13 show the relationship between the K value and the Ni concentration in each sample No .:! To 9 respectively.
- the K value is
- CK Coefficient of the relational expression X obtained from Figs. 10 and 12 above, i.e., 0.7116 for Nimflon in Fig. 10, and 0.6765 for Nimflon FUL in Fig. 12)
- the relational expressions obtained from FIGS. 11 and 13 are obtained when the absorbance is measured at two measurement wavelengths in a sample liquid whose Ni concentration and PTFE concentration are actually unknown in Nimflon and Nimflon FUL, respectively. It is an equation that becomes a calibration curve for calculating the Ni concentration using the values of the two absorbances, the absorbance at 660 nm (ABS 660) and the absorbance at 520 nm (ABS 520). This is the calculation formula used.
- ABS 520 absorbance at 520 nm
- the effect of turbidity is A simulation of whether or not an error would occur showed that a maximum error of about 8 gZL might occur. It is shown that simple calculation using two measurement wavelengths improves the analysis accuracy by about 20 times. The effect was confirmed to be very high.
- Ni-Flon plating solution with Ni / P / PTFE composite plating (PTF E concentration is 4.Og / L, and PTFE content in the obtained electroless plating film is 25 vo 1 ), And continuously supply Ni ions (nickel sulfate), sodium hypophosphite, and PTFE from the bathing bath to keep the concentration of these components almost constant, While maintaining the pH almost constant by replenishing sodium, the MTO (number of turns, one turn and the time when 4.46 g of Ni 2 + was consumed or precipitated per liter of the fitted bath, and This was an index indicating the degree of aging of the dipping solution, and the Ni concentration analysis was performed at appropriate intervals.
- the plating solution volume was 50 L.
- Multiplied by the Ni concentration of the one-turn device can be used as the corrected Ni concentration.
- Hand analysis error device Hand analysis 550nm Error after correction
- Table 3 summarizes the representative numerical values of the analysis results.
- Fig. 14 summarizes the results for Ni concentration and Fig. 15 summarizes the results for pH.
- the error tended to increase to a level that could not be ignored. This is because the electroless composite nickel plating solution is used and the phosphites and sulfates accumulate in the plating solution as aging components. This is an error caused by gradually decreasing.
- the correction coefficient is calculated by calculating the error (that is, the analytical value of the device without correction—the manual analytical value) from the Ni concentration standard value (for example, 4.5 g / l) with respect to the number of turns. There is a proportional relationship in the graph plotting the subtracted values, and the correction coefficient can be derived from the linear equation.
- the results shown in FIG. 17 summarize the transmittance measured at the measurement wavelength of 52 nm, which mainly changes due to turbidity, measured in the apparatus in relation to turns.
- the amount of PTFE particles in the plating solution is gradually increasing by replenishment as the turn progresses. This suggests that the transmittance will gradually decrease, but in practice, the transmittance will gradually increase and the turbidity will tend to decrease. This is also due to the change due to the accumulation of aging as described above. Changes in this value Up to about 2.6 turns, a large change in transmittance of nearly 4% appears.
- the error associated with this variation could lead to an error of about 1.0 g / L.
- the existing various turn correction functions of the conventional electroless plating equipment on the market are common to the electroless plating liquid as the base liquid. It can be understood from this result that the above is always necessary.
- the cross-sectional area of the sampling pipe should be at least twice as large as the cross-sectional area of the sampling pipe at an appropriate place in the equipment pipe until the plating solution reaches the absorption cell.
- a trap portion is provided to facilitate the separation of bubbles formed by a vertically long liquid holding portion having a liquid retention portion.
- an inlet for the plating solution to flow into the PH cell is installed at the top of the pH cell, while an outlet is provided at the bottom. Since the cross-sectional area of the pH cell is much larger than that of the sampling tube, the flow velocity drops extremely, so that in this part, larger bubbles can escape to the upper part of the pH cell. In the lower part, the bubbles are in a relatively reduced state. It becomes easy to supply the liquid with less bubbles to the absorption cell to be placed.
- After stopping sampling means, for example, in the apparatus shown in Fig. 9, after the first or second sample is flowed into the photometric measurement unit 10 by the sampling pump 18, the sampling pump 18 is stopped. It means after a while.
- the extension of the resting time from the stoppage of sampling to the start of the absorbance measurement in the improvement measure (2) is effective. If a resting time of 15 seconds or more is secured, the fluctuation is suppressed to a level where there is almost no problem. It is preferably at least 30 seconds, most preferably at least 60 seconds. Ideally, this standing time should be set as long as possible.However, the need for the analysis frequency of the plating solution should be as short as about 120 seconds. It is not possible.
- a specific problem that is an issue in constructing an automatic analysis and management system for complex plating liquids is adhesion of dispersed particles to the absorption cell.
- Cell contamination is a factor that causes the transmittance or absorbance to fluctuate as well as the dispersed particles in the plating solution.
- the analysis at a plurality of measurement wavelengths according to the present invention has an improvement effect on this problem, the contamination of dispersed particles adheres to the absorption cell at a level that cannot be compared with a general electroless plating solution.
- analysis using a plurality of measurement wavelengths is indispensable because the turbidity of the plating solution to be analyzed may vary from one analysis to another.
- the contamination of the absorption cell often changes relatively slowly, and many of the problems at that time are caused by the change in the reference of 100% transmittance or zero absorbance in pure water as the reference.
- it is corrected by measuring at two or more measurement wavelengths.
- it is necessary to perform measurement using a single absorption cell.For example, assuming that an absorbance measurement unit that provides an absorption cell for each measurement wavelength is designed, the reference value measurement using pure water If a difference in contamination occurs later, a large error will occur in subsequent analysis values. Therefore, it is important to regularly measure the reference value of 100% transmittance or zero absorbance using pure water, and this problem is sufficiently mitigated in the above-mentioned example using one cell. Things.
- the transmittance of pure water / 100 X the transmittance of the analytical sample as the following, the results of the analysis of the plating solution can be calculated to reduce errors caused by contamination of the absorption cell. it can.
- the transmittance in the pure water was not less than a predetermined value (for example, 1 (% Or more), an alarm can be issued to prompt the user to wash or replace the absorption cell.
- Figures 18 and 19 show examples of plating equipment incorporating this equipment.
- Fig. 18 shows an example in which the main component is replenished mainly using a metering pump.
- the merit of the metering pump type is that the equipment cost is relatively inexpensive and the replenishing amount is controlled by operating time. It is possible to automatically adjust the replenishment amount arbitrarily for each analysis result.
- Fig. 19 shows an example in which the main component solution is applied to the column, and the advantage is that the stability of the supply amount is higher than that of the metering pump.
- reference numeral 20 denotes a plating tank, and an overflow tank 22 is provided.
- 24 is a metering pump
- 26 is a replenisher (nickel salt, reducing agent
- Tank is an alkali supply tank
- 30 is a composite material supply column
- a replenisher, alkali, and composite material are supplied to the overflow tank, which flows into the plating solution in the plating tank. Things.
- reference numeral 32 denotes a metering pump
- reference numeral 34 denotes a replenishing column, which is the same as that of FIG. 18 except that the main replenisher is supplied using the column.
- reference numeral 36 denotes a cooling mechanism, which is cooled to room temperature, and is supplied with the liquid to the automatic analyzer / management apparatus 1, where the analysis is performed as described above. is there.
- 38 is a pure water tank
- 40 is a pH 4 standard solution tank
- 42 is a pH 7 standard solution tank.
- the control unit A calculates the analysis result in response to the analysis value of the concentration measurement unit B.
- the control section A controls the operation of the metering pump 24 and the composite material supply column 30. For example, if the analysis result shows that the metal concentration in the plating solution is insufficient, the metering pump 24 of the replenisher tank is operated and stopped for a preset time. Alternatively, the metering pump 24 of the replenisher tank may be operated, and when the subsequent analysis result indicates that the shortage of metal concentration has been resolved, the metering pump 24 may be stopped. The operation of the metering pump 24 of the alkali supply tank for pH adjustment can be similarly performed.
- the composite material supply column is controlled, for example, once when the number of operations of the above-mentioned replenisher metering pump 24 reaches a predetermined number of times, or in the plating solution based on the operation time of the above-mentioned replenisher metering pump 24. Calculates the amount of metal replenished to the tank and activates once when the amount of replenished metal reaches the predetermined amount, thereby replenishing the predetermined amount of liquid into the plating solution.
- the metal ion concentration in the electroless composite plating solution can be easily and reliably analyzed automatically.
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- Chemical & Material Sciences (AREA)
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- Spectroscopy & Molecular Physics (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
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Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
HK03103730.6A HK1051568A1 (en) | 2000-05-22 | 2003-05-27 | Automatic analyzing/ controlling device for electroless composite plating solution |
US11/287,285 US7507587B2 (en) | 2000-05-22 | 2005-11-28 | Automatic analysis and control system for electroless composite plating solution |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-150474 | 2000-05-22 | ||
JP2000150474 | 2000-05-22 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10031461 A-371-Of-International | 2001-05-21 | ||
US11/287,285 Continuation US7507587B2 (en) | 2000-05-22 | 2005-11-28 | Automatic analysis and control system for electroless composite plating solution |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001090727A1 true WO2001090727A1 (fr) | 2001-11-29 |
Family
ID=18656184
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/004222 WO2001090727A1 (fr) | 2000-05-22 | 2001-05-21 | Dispositif automatique d'analyse/commande pour solution composite de galvanoplastie sans courant |
Country Status (6)
Country | Link |
---|---|
US (2) | US20030049169A1 (ja) |
KR (1) | KR100828482B1 (ja) |
CN (1) | CN100399012C (ja) |
HK (1) | HK1051568A1 (ja) |
TW (1) | TWI259215B (ja) |
WO (1) | WO2001090727A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103785314A (zh) * | 2014-03-04 | 2014-05-14 | 厦门大学 | 一种混合器及流通式光度检测自动化分析仪 |
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US20040258848A1 (en) * | 2003-05-23 | 2004-12-23 | Akira Fukunaga | Method and apparatus for processing a substrate |
US20080236619A1 (en) * | 2007-04-02 | 2008-10-02 | Enthone Inc. | Cobalt capping surface preparation in microelectronics manufacture |
CN103498134B (zh) * | 2013-10-18 | 2015-11-18 | 北京吉阳技术股份有限公司 | 一种全自动槽式化学镀设备及化学镀方法 |
US10376426B2 (en) | 2015-06-30 | 2019-08-13 | The Procter & Gamble Company | Low-bulk, closely-fitting disposable absorbent pant for children |
US10206823B2 (en) | 2015-10-06 | 2019-02-19 | The Procter & Gamble Company | Disposable diaper with convenient lay-open features |
KR101678013B1 (ko) | 2016-02-15 | 2016-11-21 | 주식회사 베프스 | 금속성분의 액중 농도 지시체를 포함하는 도금액 및 이를 이용한 도금 방법 |
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- 2001-05-21 TW TW090112120A patent/TWI259215B/zh not_active IP Right Cessation
- 2001-05-21 WO PCT/JP2001/004222 patent/WO2001090727A1/ja active Application Filing
- 2001-05-21 CN CNB018017894A patent/CN100399012C/zh not_active Expired - Lifetime
- 2001-05-21 US US10/031,461 patent/US20030049169A1/en not_active Abandoned
- 2001-05-21 KR KR1020027000929A patent/KR100828482B1/ko active IP Right Grant
-
2003
- 2003-05-27 HK HK03103730.6A patent/HK1051568A1/xx not_active IP Right Cessation
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2005
- 2005-11-28 US US11/287,285 patent/US7507587B2/en not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
KR100828482B1 (ko) | 2008-05-13 |
HK1051568A1 (en) | 2003-08-08 |
KR20020016911A (ko) | 2002-03-06 |
US20030049169A1 (en) | 2003-03-13 |
US20060078465A1 (en) | 2006-04-13 |
CN100399012C (zh) | 2008-07-02 |
US7507587B2 (en) | 2009-03-24 |
TWI259215B (en) | 2006-08-01 |
CN1383484A (zh) | 2002-12-04 |
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