WO1995020253A2 - Using lasers to fabricate coatings on substrates - Google Patents

Using lasers to fabricate coatings on substrates Download PDF

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Publication number
WO1995020253A2
WO1995020253A2 PCT/US1995/000782 US9500782W WO9520253A2 WO 1995020253 A2 WO1995020253 A2 WO 1995020253A2 US 9500782 W US9500782 W US 9500782W WO 9520253 A2 WO9520253 A2 WO 9520253A2
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
coating
laser
diamond
fabricated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1995/000782
Other languages
English (en)
French (fr)
Other versions
WO1995020253A3 (en
Inventor
Pravin Mistry
Manuel Turchan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
QQC Inc
Original Assignee
QQC Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/182,978 external-priority patent/US5554415A/en
Priority claimed from US08/184,041 external-priority patent/US5620754A/en
Priority to US08/241,930 priority Critical patent/US5731046A/en
Priority to EP95913954A priority patent/EP0739250A4/en
Priority to CZ962112A priority patent/CZ211296A3/cs
Priority to CN95191718A priority patent/CN1141602A/zh
Priority to BR9506560A priority patent/BR9506560A/pt
Priority to PCT/US1995/000782 priority patent/WO1995020253A2/en
Priority to MX9602821A priority patent/MX9602821A/es
Priority to CA002181440A priority patent/CA2181440A1/en
Application filed by QQC Inc filed Critical QQC Inc
Priority to PL95315582A priority patent/PL177873B1/pl
Priority to AU21147/95A priority patent/AU2114795A/en
Priority to TW084107358A priority patent/TW394800B/zh
Priority to IL11465795A priority patent/IL114657A0/xx
Publication of WO1995020253A2 publication Critical patent/WO1995020253A2/en
Publication of WO1995020253A3 publication Critical patent/WO1995020253A3/en
Priority to KR967003928A priority patent/KR970700949A/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0605—Carbon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26—Deposition of carbon only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26—Deposition of carbon only
    • C23C16/27—Diamond only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4418—Methods for making free-standing articles
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02—Epitaxial-layer growth
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/10—Heating of the reaction chamber or the substrate
    • C30B25/105—Heating of the reaction chamber or the substrate by irradiation or electric discharge
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/18—Epitaxial-layer growth characterised by the substrate
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/04—Diamond

Definitions

  • the process includes forming a layer of opaque non-diamond material between the two diamond surfaces to be joined, pressing the diamond surfaces together, using the pulsed laser light to quickly melt all the opaque nondiamond carbon material before a significant amount of heat is lost through the diamond surface, then allowing the resulting carbon melt to cool and solidify as polycrystalline diamond which grows homoepitaxially from the diamond surfaces, bonding those surfaces together.
  • ASSISTED DEPOSITION AND ANNEALING discloses using a Q-switched Nd:YAG laser, splitting its output beam, directing a first output beam to a source (target) of material to evaporate the material, and directing the second output beam to the substrate.
  • the evaporated target material forms a film on the substrate.
  • the substrate is placed at a location to avoid “splashing" (eruptions of hot solid particles or liquid droplets from the target) from the target, and the second output beam is used to anneal the deposited (on the substrate) film (of condensed material) .
  • the process is especially useful for advanced electronic device applications, especially for incorporating films into silicon integrated circuit structures.
  • Figures 16F is a side view, respectively, of a round tool being surface treated, according to another embodiment of the present inventio .
  • the secondary element(s) be directed towards the same area (430) of the substrate whereat the laser beams are directed, but it is also possible to introduce the secondary source at another selected area on the substrate, or to simply "flood" the substrate (i.e., the entire surface of the substrate) with the secondary element(s) .
  • a coating may be fabricated on the surface of the substrate, for example, as described with respect to Step E in the process flow diagram of Figure l.
  • Figure 5 illustrates an embodiment of a nozzle 500 suitable for introducing a gaseous secondary element (from a secondary source) to the reaction system.
  • the nozzle 500 is suitable for introducing three distinct gases - a gaseous secondary element (SS) , a shielding gas (SG) and a "buffer" gas (BG) .
  • SS gaseous secondary element
  • SG shielding gas
  • BG buffer gas
  • the nitrogen (shielding) gas is also turned on to convey ablated material (cobalt, oxides) away from the substrate.
  • the nitrogen is left on for a brief interval (from “pi” to "p2") after the excimer laser is turned off to ensure that the ablated material is completely removed from the surface of the substrate.
  • the surface treatment technique may be performed, combining pre-treatment and coating fabrication, as illustrated by Figure 10A. Therein, at a time “to” the surface treatment commences. During the entire surface treatment process, extending from time “tO" to time “t5", the excimer laser (e.g., 712), the secondary source (e.g., 720) and the shielding gas (e.g., 724) are turned on.
  • the excimer laser e.g., 712
  • the secondary source e.g., 720
  • the shielding gas e.g., 724
  • the Nd:YAG laser is on for at least a portion (e.g., "tl” to "t3", see Figure 10A) of the process.
  • the Nd:YAG laser is turned on 5 seconds after the excimer laser is turned on, for 35 seconds, pulsed at a frequency of 120 Hz, at 1000 watts, to (i) assist the excimer laser in breaking the bonds in the secondary source (C0 2 ) , and to perform a primary (or sole) role in diffusion bonding.
  • the surface treatment process is also suitable, for example, for an "off-the-shelf" Kennametal (Latrobe, PA) "K313" grade cutting tool insert, having 93.5% WC, 0.5% Cr 3 C 2 , and 6% Co, an average grain size of 1 ⁇ m (micron) , a transverse rupture strength of 3000 N/mm 2 (Newtons per millimeter squared) , a density of 14.9 g/cm 3 (grams per centimeter cubed), and an HRA hardness of 93.0.
  • the excimer laser is operated with an output power of 100 W (Watts) , with a pulse duration of 400 ms (milliseconds) , in conjunction with the Nd: YAG laser operating according to PROGRAM NUMBER 4 on the table of Figure 10C and the C0 2 laser operating according to the profile of Figure 10D;
  • the excimer laser may also be operated with an output power of 87.5 W (Watts) , with a pulse duration of 350 ms (milliseconds) , in conjunction with the Nd: YAG laser operating according to PROGRAM NUMBER 11 on the table of Figure IOC and the C0 2 laser operating according to the profile of Figure 10D; and
  • Figure HA is a top view photomicrograph of the specimen (Prior Art) prior to surface treatment.
  • an off-the-shelf cutting tool insert will exhibit a pattern of grinding marks (evident as oblique lines in the figure) and may also have contaminants on the surface (evident as specks in the figure) .
  • pre ⁇ treatment it is preferable to perform pre ⁇ treatment to characterize the surface of the substrate prior to coating, in addition to ablating cobalt and exposing tungsten carbide grains.
  • Figure HA although related to Figure 6A, shows in greater detail some of the challenges inherent in surface treating existing substrates.
  • the technique of the present invention is useful for fabricating a variety of coatings on a variety of substrates.
  • the substrate can be viewed as a countertop, upon which any number of useful objects can be placed. (Of course, these objects will be diffusion bonded to the countertop using the techniques of the present invention.)
  • a flat planar cutting tool insert could be coated to not only have a diamond coating, but so that the diamond coating is tailored to have its own chip- breaking geometry (structure) .
  • Figure 131 illustrates, generally, the truly heteroepitaxial nature of the invention.
  • the fabrication of coatings is commenced on one or more (one shown) selected areas of the surface of a substrate 1390.
  • the substrate may be a "sacrificial" substrate, which can be excised from the resulting built up (fabricated) coating structure(s) .
  • An exemplary coating structure 1392 is shown as being fabricated (built-up) from a selected area of the surface of the substrate 1390. This can be considered to be growth in a z- axis (normal to the surface of the substrate) .
  • any outline or area coating structure can be fabricated, and control over the fabrication is suitably effected simply by taking appropriate cross-sections from a computer-generated representation of the object sought to be fabricated as a growth structure, for example.
  • a three-dimensional structure of unconstrained shape or form can be fabricated on a substrate.
  • the substrate may be cut off and discarded, or dissolved away, or removed by any means including mechanical or chemical means.
  • Figure 16B shows an alternate embodiment 1620 of a technique for fabricating a coating on a round tool.
  • an exemplary end mill 1622 (similar to the end mill 1602) is disposed on its side, with the nozzle and lasers coming from above (not shown) .
  • a plasma 1630 is formed at the tip of the end mill, and is walked along the length of the fluted portion in a manner similar to what has been described above (with respect to causing relative motion of a selected area on a larger substrate) .
  • the end mill should be rotated in concert with walking the plasma along the fluted portion, to ensure uniform coverage (coating fabrication) along the length of the fluted portion.
  • Substrates can be pre-treated to characterize their surfaces for further application of a coating, by any suitable technique.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
  • Carbon And Carbon Compounds (AREA)
PCT/US1995/000782 1994-01-18 1995-01-17 Using lasers to fabricate coatings on substrates Ceased WO1995020253A2 (en)

Priority Applications (13)

Application Number Priority Date Filing Date Title
US08/241,930 US5731046A (en) 1994-01-18 1994-05-12 Fabrication of diamond and diamond-like carbon coatings
PL95315582A PL177873B1 (pl) 1994-01-18 1995-01-17 Sposób obróbki powierzchni podłoża
CZ962112A CZ211296A3 (en) 1994-01-18 1995-01-17 Substrate surface treatment process
AU21147/95A AU2114795A (en) 1994-01-18 1995-01-17 Using lasers to fabricate diamond, diamond-like carbon, and other material coatings on substrates
CN95191718A CN1141602A (zh) 1994-01-18 1995-01-17 利用激光在基体上制备金刚石、类金刚石碳以及其它材料的涂层
BR9506560A BR9506560A (pt) 1994-01-18 1995-01-17 Processo de tratamento superficial de um substrato
PCT/US1995/000782 WO1995020253A2 (en) 1994-01-18 1995-01-17 Using lasers to fabricate coatings on substrates
MX9602821A MX9602821A (es) 1994-01-18 1995-01-17 Uso de laseres para fabricar revestimientos de diamante, carbono tipo diamante y otros revestimientos de materiales sobre substratos.
CA002181440A CA2181440A1 (en) 1994-01-18 1995-01-17 Using lasers to fabricate coatings on substrates
EP95913954A EP0739250A4 (en) 1994-01-18 1995-01-17 USE OF LASERS FOR THE PRODUCTION OF COATINGS ON SUBSTRATES
TW084107358A TW394800B (en) 1995-01-17 1995-07-17 Surface modification and/or fabrication techniques
IL11465795A IL114657A0 (en) 1994-01-18 1995-07-18 Surface modification and/or fabrication techniques
KR967003928A KR970700949A (enExample) 1994-01-18 1996-07-18

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US08/182,978 US5554415A (en) 1994-01-18 1994-01-18 Substrate coating techniques, including fabricating materials on a surface of a substrate
US08/182,978 1994-01-18
US08/184,041 1994-01-21
US08/184,041 US5620754A (en) 1994-01-21 1994-01-21 Method of treating and coating substrates
US08/241,930 1994-05-12
US08/241,930 US5731046A (en) 1994-01-18 1994-05-12 Fabrication of diamond and diamond-like carbon coatings
PCT/US1995/000782 WO1995020253A2 (en) 1994-01-18 1995-01-17 Using lasers to fabricate coatings on substrates

Publications (2)

Publication Number Publication Date
WO1995020253A2 true WO1995020253A2 (en) 1995-07-27
WO1995020253A3 WO1995020253A3 (en) 1995-08-24

Family

ID=98692841

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1995/000782 Ceased WO1995020253A2 (en) 1994-01-18 1995-01-17 Using lasers to fabricate coatings on substrates

Country Status (12)

Country Link
US (1) US5731046A (enExample)
EP (1) EP0739250A4 (enExample)
KR (1) KR970700949A (enExample)
CN (1) CN1141602A (enExample)
AU (1) AU2114795A (enExample)
BR (1) BR9506560A (enExample)
CA (1) CA2181440A1 (enExample)
CZ (1) CZ211296A3 (enExample)
IL (1) IL114657A0 (enExample)
MX (1) MX9602821A (enExample)
PL (1) PL177873B1 (enExample)
WO (1) WO1995020253A2 (enExample)

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* Cited by examiner, † Cited by third party
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US6062679A (en) * 1997-08-28 2000-05-16 Hewlett-Packard Company Printhead for an inkjet cartridge and method for producing the same
US6155675A (en) * 1997-08-28 2000-12-05 Hewlett-Packard Company Printhead structure and method for producing the same
US6315393B1 (en) 1999-04-30 2001-11-13 Hewlett-Packard Company Ink-jet printhead
US6626949B1 (en) 1999-07-14 2003-09-30 Biopro, Inc. Diamond coated joint implant
US7048359B2 (en) 1997-08-28 2006-05-23 Hewlett-Packard Development Company, L.P. Ink-jet printhead and method for producing the same
US7134381B2 (en) 2003-08-21 2006-11-14 Nissan Motor Co., Ltd. Refrigerant compressor and friction control process therefor
US7146956B2 (en) 2003-08-08 2006-12-12 Nissan Motor Co., Ltd. Valve train for internal combustion engine
US7228786B2 (en) 2003-06-06 2007-06-12 Nissan Motor Co., Ltd. Engine piston-pin sliding structure
US7255083B2 (en) 2002-10-16 2007-08-14 Nissan Motor Co., Ltd. Sliding structure for automotive engine
US7273655B2 (en) 1999-04-09 2007-09-25 Shojiro Miyake Slidably movable member and method of producing same
US7284525B2 (en) 2003-08-13 2007-10-23 Nissan Motor Co., Ltd. Structure for connecting piston to crankshaft
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CZ211296A3 (en) 1997-08-13
PL315582A1 (en) 1996-11-12
BR9506560A (pt) 1999-03-23
KR970700949A (enExample) 1997-02-12
AU2114795A (en) 1995-08-08
IL114657A0 (en) 1995-11-27
US5731046A (en) 1998-03-24
MX9602821A (es) 1997-12-31
CA2181440A1 (en) 1995-07-27
PL177873B1 (pl) 2000-01-31

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