TW394800B - Surface modification and/or fabrication techniques - Google Patents

Abstract

Laser energy is directed at a substrate to mobilize, vaporize and react a constituent (primary) element (e.g., carbon) contained within the substrate, so as to modify the composition (e.g., crystalline structure) of the constituent element, and to diffuse the modified constituent back into the substrate, as an adjunct to fabricating a coating (e.g., diamond or diamond-like carbon) on the surface of the substrate. This creats a conversion zone immediately beneath the substrate, which transitions metallurgically from the ocmposition of the underlying substrate to a composition of the coating being fabricated on the surface of the substrate, which results in diffusion bonding of the coating to the substrate. Additional (secondary) similar (e.g., carbon) or dissimilar elements may be introduced in a reaction zone on and above the surface of the substrate to augment the fabrication of and to determine the composition of the coating. The laser energy is provided by a combination of an excimer laser, an Nd:YAG laser and a CO2 laser, the output beams of which are preferably directed through a nozzle delivering the secondary element to the reaction zone. The reaction zone is shielded by an inert (non-reactive) shielding gas (e,g,, N2) delivered through the nozzle. A flat plasma is created by the lasers, constituent element and secondary element on the surface of the substrate and the flat plasma optionally extends around the edges of the substrate to fabricate a ocating thereon. Pretreatment and coating fabrication can be performed in conjunction with one another (in-situ). Alternatively, a substrate can be pre-treated to characterize its surface for subsequent coating. In either case, certain advantageous metallurgical changes are included in the substrate due to the pre-treatment. The processes (pre-treatment and coating fabrication) are suitably performed in ambient, without preheating the substrate and without a vacuum. Substrates of numerous geometries, sizes and shapes, such as flat cutting tool inserts as well as round cutting tools, are readily coated in this manner. The lasers are directed at any suitable angle (including coaxial) relative to the substrate and or the plasma.

Description

88-5 α 88-5 α Printed by Zhengong Consumer Cooperative, Central Bureau of Standards, Ministry of Economic Affairs 5. Description of the Invention () —— 5 Inserts ’such as carbonized chips (wc / c) combined with cobalt. There is an error in the matrix, and a problem may arise when diamond plating is applied to the tool insert. The presence of cobalt-bound phases in carbide tools is particularly "poisoning" to the nucleation and growth of diamond and results in the formation of carbon graphite instead of diamond (or ELC). Laser-assisted coating methods: Use of laser-supplied coatings The method of forming a diamond bond layer or hafnium plating on a substrate has recently become well-known. Some of the techniques discussed below using laser energy are typical of such techniques, and will be cited in This article is used as background information. The documents cited here are led by USP "(for US Patent No. Ma), followed by the letters and numbers in parentheses (representing " the first inventor " respectively, the date of certification , Primary / secondary classification), and all are underlined. USP 5,154,945 (" BALDWIN "10/92; 427/596) proposes two techniques for depositing diamond films on a substrate. In an embodiment (" BALDWIN-I "), the thin film is deposited by introducing a mixed gas of CK (methane) and η (hydrogen) into a CVD chamber, and a laser beam is irradiated onto the surface of the substrate. To flow across the entire surface of the substrate to be covered. This embodiment is usually limited by the limitations originally imposed by conventional CVD methods. In another embodiment (" BALDWIN-I), pure carbon is sent to the surface to be coated in the form of soot, and a laser beam is irradiated on the surface in the atmosphere to avoid carbon burning to 〇2. In this _WIN-E, the 0¾ gas laser beam illuminates the surface to be covered at a normal incidence angle. The movement between the substrate and the laser beam will cause a very small area on the surface of the substrate to be generated with the minimum energy input. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling (This page): '(install ----- j-order ---- / silver |

I Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 __B7___ V. Description of the Invention (丄) Field of the Invention: The invention relates to the surface treatment of substrates (such as metal substrates). This surface treatment includes making diamonds on the surface of the substrate, such as diamond Or diamond-like carbon. Background of the invention: The present invention relates to coatings on substrates such as: diamond, diamond-like carbon (DLC), cubic boron nitride (CBN), B4C, SiC, TiC, Cr3C2, TiN TiB2, Si3 N4 and cCN. (Cover Layer In the following, the manufacture of diamond coatings for tungsten carbide cutting tool inserts (substrates) will be discussed, but the invention is not limited thereto. Generally, diamond or diamond-like carbon (DLC) is plated on the substrate It can strengthen the characteristics of the substrate. For example, cutting tool inserts (insert blades) covered with diamond (or DLC) can usually achieve greater tool speeds, infeed rates and cutting depths, and obtain longer tool life. The work piece produces excellent machining results and can be dry-machined (no lubrication required). When coated with diamond (or DLC), round tools such as drills and end mills can also obtain the same advantages. CVD deposition (deposition) methods: 1 There are currently many chemical vapor deposition (CVD) (also known as chemical vapor deposition) deposition methods that can be used to deposit diamond coatings (mirror films). Generally, these process methods include The hydrogen and methane precursor gases are released and ionized, and then transported and deposited (such as precipitated) on a heated substrate. Generally speaking, these processes include the use of plasma, microwave, hot filament, ion beam and electron beam as energy sources, and Use a mixed gas of 0.5% ~ 2.0% methane and balanced hydrogen to -2-

This paper size is applicable to Shikoku i Standard (CNS) A4 specifications (27 ^ 7 ^ iT j-^-I —--- installed! (Please read the precautions on the back before filling out this page) Printed by the Industrial and Commercial Cooperatives 88.lt δ V. Description of the invention (9) When sweeping over the surface of the substrate, the melting area that is not under the laser beam will rapidly solidify due to the heat absorption of the undissolved substrate. Other titanium alloys are also effective. These titanium alloys contain other strong nitride formations in their composition, such as: hafnium, Ho, carbon, and inscriptions. Although the content of forming the bond layer is not indicated in the text, it is well-intentioned and not prejudiced here. Quoting GAVIGAN is essentially a typical example of laser-implemented other methods (ie, methods other than 'plating') on other materials (ie, other than steel). Although its hint seems to be limited to the formation of "Manufacturing Method for Crack Nitriding Hardened Surface" USP 5,236,545 ("PRYOR ";8/93; 156/613), the method mentioned in the article includes: Laser melting using a hexaboron nitride target in a nitrogen-containing atmosphere" Silicon-based Deposit a nitrided cubic boron (CBN) layer on the substrate as the first interface layer 'followed by the use of laser melting of carbon dry material in the presence of atomic hydrogen to deposit a hydrogen-terminated carbon second interface layer , Followed by the traditional chemical vapor deposition (CVD) technique to deposit a layer of heteroepitaxial diamond film. USP 5,098,737 ("COLLINSM;3/92; 427 / 53.1) proposes to irradiate the laser beam to the target with a non-normal incidence angle This patent provides four useful methods for the research of manufacturing diamond-like carbon thin films, namely: ion beam deposition, chemical vapor deposition, plasma enhanced chemical vapor deposition, and clock spray deposition. In summary, this patent proposes to irradiate a laser in a vacuum chamber to impinge on a continuous strip-shaped moving material made of graphite foil placed in a vacuum chamber. The laser beam is focused on the material to be melted and sprayed. A column is obstructed by the vapor, so that the vapor of this column is completed by laser light -10-¥ paper i scale applies Chinese National Standard (CNS) M specification (21〇 > < 297 公 ®) ~~ --- — (Please read the notes on the back before filling this page )

Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (2) As a carbon source (pioneer gas). Generally speaking, one or other forms of processing methods or processes using CVD are inherently limited to the need to use a vacuum chamber (thus making the process complicated and limiting the size of the substrate that can be vaporized), and involve very important Substrate heating and subsequent cooling control (thus limiting the effectiveness of certain types of substrates). The need to heat the substrate to facilitate the coating process is often counterproductive in many respects. This heating to the entire substrate (that is, a large amount of heating at the basic level) may cause deformation of the substrate and damage the tempering (heat treatment) characteristics originally exhibited on the substrate. For example, in the hot filament CVD method, tungsten or a button filament is used to heat the precursor gas to about 2000 ° C. The substrate temperature ranges from 600-1100 ° C. Another disadvantage of the CVD method is that when a limited number of parts are plated, the recovery time usually takes several hours. Generally speaking, its precipitation (sedimentation) rate is very low, about 1-10 A £ m per hour (when using hydrogen and methylbenzene precursor gas). Other Shen Dian methods similar to CVD suffer from the same limitations. In DC electrokinetic CVD, DC galvanic isolation can be used to dissociate the precursor gas, and can provide a higher gas volume and speed than other prior art methods. Microwave (or plasma enhanced microwave) CVD uses microwaves to excite the precursor gas to achieve a Shen Dian rate of several micron per hour. Deposits deposited using this method can easily obtain very high purity. Another method for forming a coating layer that is closely related to CVD is physical vapor deposition (PVD). In PVD, the dry material placed in the vacuum chamber is evaporated, which is the opposite of the CVD method, because the CVD method introduces the outgas into the vacuum chamber from the outside. In the process of CVD and PVD (eg: precipitation type): • The temperature of the substrate must be raised to a considerable degree (Note-3-This paper size applies to Chinese National Standard (CNS) A4 size (210 X 297 mm) ）) Binding (please read the precautions on the back before filling this page) 5. Description of the invention A 'ΙΓ Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 15 Lasers, splitting its output beam' Illuminating the material with the first beam The source (target) is used to evaporate the material, and the second output beam is irradiated to the substrate. The evaporated dry material forms a thin film on the substrate. This film will be placed on a surface to prevent the dry material from flying away (spraying of thermally condensed particles or Is the position where the liquid drips out of the dry material 'and the second output beam is used to anneal the deposited (on the substrate) film (thin film of the concentrated object). [Disadvantages of the foregoing technology] The various methods described above can be referred to as "deposition" Method, the desired material (such as diamond) is formed and deposited on the surface of the substrate. Using these methods' best is only to form a molecular bond between the deposit and the substrate The "adhesion" (mechanical bond) of this molecular bond between the deposit and the substrate is quite limited. In some applications, such as when plating on cutting tool inserts, the adhesion of diamond to the substrate is very Important. In addition, the polishing of the final surface of the deposition and forging requires various post-processing steps to achieve the final ideal surface finishing of the mirror layer portion. The foregoing conventional plating method is also easily limited to A thin ridge (or layer) is formed on the substrate. This is similar to the situation where rain falls on the grass and freezes. The resulting ice layer is quite hard, but it is thin and consists of a thin ice layer (bond layer) to the grass below. (Substrate), the thickness changes very steeply. This will cause a poor distribution of the grinding force. Therefore, when the pressure is applied, the thin ice layer is easy to crack. Generally speaking, the thickness of the coating will reflect the pressure on the coating. Generally speaking, the deposition rate of the conventional method is very low. It requires heating and cooling of the substrate beforehand, and it cannot be completed in the general environment of the garden (so the size of the substrate is strictly limited), and it is not suitable for forging some substrates. (Such as: -16-Λ ^ installed with L, 'line (please read the back: ^ Italian consul before filling out this page) This paper size applies the Chinese National Standard (CNS) A4 size (210X297 mm) Economy Printed by A7 _B7_ in the Consumer Cooperatives of the Ministry of Standards and Standards of the People's Republic of China. 5. Description of the Invention (3) > High temperature is not required to produce DLC-type coatings in PVD. • Residual precursors (gas or evaporated target materials) ) A period of effective cooling time (2 to 5 hours) is required during the snowflake-like deposition on the surface being coated. This will cause the surface of this mirror layer to be much rougher than the surface before evaporation, so it is usually still Post-treatment is required to achieve a smoother surface. 0 • When a diamond (or DLC) coating is deposited, an amorphous coating is usually formed, which contains SP2-bonded carbon with a high concentration of hydrogen, or SP2-bonds. Bonded carbon and SP3-bonded carbon. • Both CVD and PVD methods deposit an & substance on the surface of the substrate and rely on molecular bonds and some kind of mechanical bonding. • PVD coating is more prone to pores. In contrast, CVD coatings have less porosity than PVD coatings. • CVD and PVD methods are generally limited to flat surfaces suitable for plating or simple (non-complex geometry) round surfaces. • The size of the substrate that can be plated is limited by the size of the vacuum chamber in which the operation is performed; the diameter of the substrate is usually less than 8 inches. • Because these methods are mainly based on the type of deposition (that is, generally directional precipitation), the other side of the substrate may appear shaded or unevenly deposited. • The CVD method also requires substrate preparation (before plating), which includes chemical modification of the surface and catalysis. U.S. Patent Gazette USP No. 5,038,661 (" FENG'5 / 94; 427/535), entitled " Diamond-4 which forms a smooth surface on a substrate with a carbon coating-4-This paper size applies to Chinese national standards ( CNS) A4 specification (210X2) 7 mm) This order (please read the notes on the back before filling out this page) Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives 5. Description of the invention () 18 System and cost reduction importance. In addition, these articles clearly point out the limitations of existing systems. In recent two publications, "Manufacturing Engineering" (SME Publishing) November 1993, ρρ · 37-42) and "Success Technology" (January 1994, ρρ. 40-44), both emphasize fast Prototyping and manufacturing systems are important. In other articles, such as the one on laser sintering, the status of rapid prototyping is also pointed out. Generally speaking, the existing rapid prototyping technology method is to selectively cut material layers to CAD To create objects in the shape defined by the data. As mentioned in "Manufacturing Engineering" (November 1993), "The goal of existing gp (rapid prototyping) techniques is to prototype materials that provide higher strength at elevated temperatures . What this industry needs is a complete metal mold (without the use of sintered materials) in order to efficiently analyze objects. In addition, this article also points out that direct manufacturing of parts is the final step in rapid prototyping. In addition, this article also emphasizes the importance of materials' and although some experimental rapid prototyping systems are based on Mingrong Metal And metal powder to work, but they are still not high-strength and full-density metal. The following will introduce the conventional methods of manufacturing objects (such as: rapid prototyping). The following US patents (which have been incorporated herein by reference for reference) (Description) points out the current status of stereolithography and object manufacturing: USP 5,260,009 ("Systems and methods for manufacturing 3D objects and their processes Tyr ~ ~ ~ USP 5,256,340 (" Initial method for manufacturing 3D objects using stereolithography ") ; ~ USP 5, ^ 48,456 ("Methods for the manufacture of three-dimensional lithographic objects-19-This paper is again applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the notes on the back before filling in (This page) -----------, -Order ------- / ί II— ml In 1 ^ 1 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention ( Λ) 4 'front of membrane The physical method is specifically quoted in this article, which refers to the CVD method and discloses that a carbon-containing coating layer is applied on the surface of the substrate, and the carbon-containing coating layer has a sufficient concentration and thickness so that The carbon atoms of the coating layer produced on the surface of the substrate have a uniform density or concentration of at least 10 atoms / # m2. Next, the substrate with the carbon layer is placed in a microwave plasma-enhanced chemical vapor deposition (MECVD) The microwave plasma in the vacuum chamber of the system 'and introduces the A hospital and hydrogen into the system. After these pre-treatment steps' use traditional methods, such as: under high pressure (higher than the pre-treatment pressure), and reduce methane flow (The ratio of methane to hydrogen is 0.15 to 40% methane, preferably 0.5 to 1.0% methane WMECVD method to produce a diamond on the coated substrate. FENG and the method The differences are in particular that the surface treatment process of the present invention does not require a carbon-containing coating layer as the first coating layer on the substrate; the surface treatment technique of the present invention does not require a CVD method, and the surface treatment technique of the present invention. A better laser energy is used to create a coating on the substrate. However, FENG's recommendation for the traditional (ie, recognized) method of applying a diamond coating on the substrate is to use a cVD method. Cobalt poisoning: on the coating Or during vapor deposition, especially in CVD (and related) processes, a diamond (or DLC) coating is often encountered on a tungsten carbide substrate. Carbides (on adhesives) Carbonized particles) has long been used as cutting tools and inserts (inserts), especially for cutting (machining) iron and non-ferrous materials, or abrasive materials, such as aluminum and its alloys, copper, Brass, plastic, ceramic, titanium, reinforced fiber composites and graphite. Various types of carbides have been used as tools and the paper size applies Chinese National Standard (CNS) A4 specifications (210X297 mm) — ^ --- r -------- 丨, 玎 (Please read the back first Please pay attention to this page before filling in this page) 88.lt δ ΙΓ V. Description of the invention () 19 and device "); USP 5,247,180 (" Three-dimensional lithography: brushing device and user &); — _ USP 5,236,637 ( "Method and device for manufacturing 3D objects using stereolithography" ^ " In USP 5,017,317 ("MARCUS"; 5/91; 264/81), the name is "Gas Selective Beam Deposition", which describes the use of lasers Come to the method of parts, which mentioned the use of a computer to control a guided energy beam (such as laser) to irradiate a large amount of laser energy into a room containing a gas phase material, this material is used to deposit the best Can produce gas phase photodecomposition or thermal decomposition, and selectively deposit materials in the cross-sectional area required for the part to be made. For each cross-sectional area, the beam is targeted at the cross-section Material is deposited within the area. Each subsequent layer Joining with the previous layer to make parts containing many connecting layers "[Objective of the Invention] The object of the present invention is to provide an improved technical method for applying (making) a coating layer, especially diamond (or DLC) The coating is plated on a substrate, such as a cutting tool insert, especially a cutting tool insert containing a commercially available name or a circular cutting tool. Another object of the present invention is to provide ambient (non-vacuum) In another aspect, a technical method for placing a mirror layer clock on a substrate. Another object of the present invention is to provide a method for controlling the thermal balance during processing without heating (or preheating) the entire substrate so as not to affect the entire substrate. The technical method of plating the coating on the substrate is as follows: -20-This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) f Jing Maowen reads the a notice on the back of the paper and fills in this ear)-Ding, -· ° Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs •--ί. »--HI--i In IK 1- · [88-5 α 88-5 α Printed by the Zhengong Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs, Invention is described in () - 5 inserts' merger e.g. cobalt carbide chip (wc / c). There is an error in the matrix, and a problem may arise when diamond plating is applied to the tool insert. The presence of cobalt-bound phases in carbide tools is particularly "poisoning" to the nucleation and growth of diamond and results in the formation of carbon graphite instead of diamond (or ELC). Laser-assisted coating methods: Use of laser-supplied coatings The method of forming a diamond bond layer or hafnium plating on a substrate has recently become well-known. Some of the techniques discussed below using laser energy are typical of such techniques, and will be cited in This article is used as background information. The documents cited here are led by USP "(for US Patent No. Ma), followed by the letters and numbers in parentheses (representing " the first inventor " respectively, the date of certification , Primary / secondary classification), and all are underlined. USP 5,154,945 (" BALDWIN "10/92; 427/596) proposes two techniques for depositing diamond films on a substrate. In an embodiment (" BALDWIN-I "), the thin film is deposited by introducing a mixed gas of CK (methane) and η (hydrogen) into a CVD chamber, and a laser beam is irradiated onto the surface of the substrate. To flow across the entire surface of the substrate to be covered. This embodiment is usually limited by the limitations originally imposed by conventional CVD methods. In another embodiment (" BALDWIN-I), pure carbon is sent to the surface to be coated in the form of soot, and a laser beam is irradiated on the surface in the atmosphere to avoid carbon burning to 〇2. In this _WIN-E, the 0¾ gas laser beam illuminates the surface to be covered at a normal incidence angle. The movement between the substrate and the laser beam will cause a very small area on the surface of the substrate to be generated with the minimum energy input. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling (This page): '(install ----- j-order ---- / silver |

I

V. Description of the Invention (20) Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Another objective of the present invention is to provide a technical method for forming a diffusion bonding layer on a substrate *: Another object of the present invention is to provide all steel Alloys include stainless steel and non-ferrous materials or alloys, as well as other materials, such as ceramics and polymers, and substrate processing techniques. Another object of the present invention is to provide a technical method capable of forming a clock layer having a shape, thickness, and composition that can be cut. It is another object of the present invention to provide a technical method for treating a substrate without the need for additional post-treatment fine grinding processing. Another object of the present invention is to provide a method for treating a substrate in a heteroepitaxial manner, such as for artificial diamond, DLC, or other crystalline materials. Another object of the present invention is to provide a technical method for processing a substrate having a complicated geometry. Another object of the present invention is to provide a technical method for making a tool or insert, especially a cutting tool. Another object of the present invention is to provide a technical method for coating (plating) on a substrate (such as a cutting tool or an insert), especially a diamond or diamond-like coating and other materials. Strong toughness method, even if it has a very high cobalt content, is useful for high-speed copper, ceramics, plastic DLC (barrier plating, etc.), and other cutting tool materials, and can be performed at low temperature and low pressure Finished. Another object of the present invention is to provide a method that can improve the adhesion between the coating and the substrate, especially the diamond clock layer (and DI "C). It is -21-a. Table I— (Please read and read (Notes of rain, please fill out this tribute)

-1T This paper size is in accordance with Chinese National Standard (CNS) A4 (210 × 297 mm) Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 B7 V. Description of the invention (6) Instantaneous heating and causing diamond deposition on this surface There is almost no matrix turbulence. The traditional method of using laser energy without affecting the substrate is also mentioned in USP 5,273,7 88 (" YU ";12/93; 427/554), whose name is "Preparation of Diamond and Diamond-Like Films" ; The article mentions that a layer of hydrocarbon molecules is covered on the substrate by the Langmuir-Blodgett technique, and the surface is irradiated with laser light to decompose the molecular layer on the surface without affecting the substrate. USP 4,981,717 (" THALER ";1/1/91; 427 / 53,1), the name is diamond-like mirror layer and its forming method ", the article mentions the plasma (plasma) of the hydrocarbon gas precursor to deposit diamond-like Thin film method. This plasma is generated by a laser pulse that is emitted into the gas and mixed with the "detonator." This explosion produced a plasma of ions, ionic groups, molecular fragments, and electrons. This plasma was propelled to the substrate by the detonation pressure wave and precipitated on it. This technique and similar techniques are like rain (diamond molecules) falling on the pond (the substrate to be plated), and it is easy to produce a coating that does not adhere to the substrate, and it is necessary to trim the grinding rock afterwards to obtain the ideal on the substrate. Surface coating. THALER discusses the use of precursor gases such as hydrocarbons (such as methane, ethane, propane, acetylene), or similar carbohydrates and vapors. This gas is decomposed by intense thermal cracking to form many high-capacity fragments, ions, ionic groups, and free electrons. Cracking is done by placing hydrocarbons under intense laser pulses, for example, using a co2 laser paper with 50 'nanosecond waves' and a power output of 10 "watts / cm2. Standards are applicable to China National Standard (CNS) Α4 specifications (21〇 × 297 mm) ^ -------- installation ----- |, 玎 (please read the precautions on the back before filling in this page) ί Printed by the Bayer Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 88.11. Δ Λ 7 1Γ V. Description of the invention (21) The method of toughening carbides and performing it under low temperature and low pressure are completed. Another object of the present invention is to provide a technical method for treating the surface of a substrate, so as to provide a diffusion-bonded composite material under the surface of the substrate. Another object of the present invention is to provide a technical method for processing and manufacturing the material, so as to produce a material having a desired composite. Objects such as diamonds,

DLC, Nitrided Nitrile (CBN), B * C, SiC, TiC, Cr3C2, TiN, TiB2, Si 3N 4 and cCN, sharp, carbide, post-titanium titanium, broken inscription, etc. Another object of the present invention It is a technical method to provide a "designer" mirror layer on a substrate. Another object of the present invention is to provide a system in which useful metals, ceramics, and composite parts can be produced in the final state without the need for any post-processing (outside the system environment) finishing and enhanced physical properties. It is brought about by the present enhanced fortified compound that cannot be manufactured by other currently known devices. Another object of the present invention is to provide a technical method for pre-treating (preparing) a substrate to facilitate plating after the processing by the present invention or existing techniques. Another object of the present invention is to provide a technical method for treating the surface of a substrate. 'It is not necessary to perform separate and different pre-treatment steps on the surface of the substrate to obtain the required surface of the substrate. (In situ) done. According to the present invention 'will be three different laser light from three different lasers-22-This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ----- Ϊ —I— I. -In nu Λ / Ά .11-I -I- --Γ 4 * τ ί (Please read the notes on the back before filling out this page) Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A 7 B7 ---- --------------------- * ~ V. Description of the invention (7) THALER discusses " Initiator " mixed with carbon disk compound gas or vapor user. The detonator is preferably an output wavelength compound capable of strongly absorbing the laser pulse used. The output wavelength of Co2 laser is 10.6 " m, and sulfur hexafluoride (SFe) is a high-efficiency detonator. When this laser is used, it can provide sulfur and fluorine ions and ionization when exploded together. Yoki. This detonator can store a small amount of (laser pulse) energy for application and release the same explosive force. The fragmented hydrocarbons are highly recoiled ions and radicals, and transfer high transfer energy to the Formed gas. The coatings produced by these bursts will have the characteristics of both diamond and fluorocarbons. USP 4,948,629 (" HACKER "; 8 / 9〇j_427 / 53.1), entitled "Deposition of Diamond Films", which suggests deposition on substrates at temperatures below 400 ° C (preferably less than 150 ° C) Diamond thin film method. This method uses a high-power pulse laser and a chemical vapor deposition method of fatty carboxylic acid or aromatic carboxylic acid vapor. This process must use a high-power pulse laser, such as an excited atom. (Excimer) laser or Nd: YAG laser 0 The preferred excimer laser wavelengths include KrCl at 220nm, KrF at 248nm, XeCl at 308nm, and XeF at 35mn; and the preferred Nd: YAG wavelength includes 266nm. The fourth spectral wave and the third harmonic at 355nm. HACKER discussed the use of a second laser with a longer wavelength (> 400nm) (eg, the second harmonic of Nd: YAG at 532nm) to selectively remove SP Carbon and deposit a more pure diamond film. One example is a 248nm laser beam (KrF excited-state laser) dissociated by the photodissociation of an organic precursor (malonate or pyromellitic anhydride, using helium as a buffer gas). Start this diamond deposition, then use 532 Laser beam (second harmonic Nd: YAG) is ablated to the paper size in the film. The Chinese National Standard (CNS) A4 specification (210X297 mm) I .: -------- ---- 丨 Order (Please read the notes on the back before filling in this page) ___ ς 爻 年 1vv / __

5. Description of the invention (22) I —— ^ —— A J beam of energy is irradiated on the surface of the substrate to treat the surface of the substrate. Control these three laser process parameters and interactions to achieve the desired effect on and / or on the surface of the substrate. The parameters of this manufacturing method include: • the wavelength of each laser; • the operating mode (such as: pulse, super pulse or continuous wave), including: the pulse width and frequency of each laser; • the output of each laser Power; • the energy of each laser; • the angle of incidence of each laser beam on the substrate surface; • the shape and size of the cross-sectional area of each laser beam; and Sequence (time relationship). For example, one or more constituent (natural) elements deposited on the sub-surface area of the substrate may move at one or more flow rates toward the surface of the substrate to produce one or more constituents (concentration of constituent elements) on the sub-surface area. Gradient. In addition, the selected amount of selected elements of the constituent elements can be separated and evaporated in a controlled manner. One or more constituent elements of the matrix can be regarded as the "main" source of materials in the manufacturing method. Staff Consumption of the Central Standards Bureau of the Ministry of Economic Affairs Printed by a cooperative (please read the notes on the back before filling this page) According to the present invention, one or more constituent elements that have evaporated have an immediate effect on the surface of the substrate to improve the physical structure and Properties to produce a composite that can then diffuse back into the matrix. 0 At some point in the process, perhaps at the beginning of the process, one or more secondary sources containing secondary elements can be placed in the reaction that acts immediately on the substrate surface. System, for example, carbon in the matrix can flow, evaporate, and -23-paper size 逋Use Chinese National Standard (CNS) A4 specification (210 × 297 mm) A7 B7 V. Description of invention (.) 〇 Contains non-diamond impurities. Although the CVD method is expanded by the use of laser, HACKER is still limited by the aforementioned CVr) The original limitations of the method (eg, preheating of the substrate, limited substrate size). USP 4,954,365 (" NEIFIELD "; 9/90: 437 / 53.1), named "Method for the preparation of diamond thin films", is mentioned in the article A method for immersing a substrate in a liquid containing carbon and hydrogen, and irradiating the substrate with at least one laser pulse wave to form a diamond film. For example, when a silicon substrate is immersed in a methyl liquid, the container has a quartz window to allow laser light to enter. Wavelength 248nm 9 Excited atomic lasers of about 20 亳 microseconds during pulse waves. Pulse waves are intercepted by this broken matrix. This matrix becomes heated by absorbing laser light. This methyl liquid is pyrolyzed by contact with a heated substrate. Subsequently, the carbon material pyrolyzed from the methyl solution will grow on the substrate, and the high-density hydrogen reacts with carbon without diamond bonds and is removed from the substrate. Repeated use of this laser pulse will result in sustained growth of the diamond film on the substrate. NEIFIELD requires the substrate to be laser absorbing, such as the silicon substrate described above. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs—ill · —price. 'Equipment ------- Order (please read the precautions on the back before filling out this page) USP 5,290,368 (" GAYIGAN, f; 3/94 148/212), the name of which is "Method for making crack-free hardening surface of titanium surface with laser beam". The article proposes to preheat the titanium substrate (using a furnace to increase the temperature of the substrate to 1000 ~ 12 ° F). 〇 degrees), using a laser (such as: 5KW, C02, continuous wave laser operating in the power range 3.1KW to 3.6KW) to melt a small area of the matrix, and a gas mixture (containing at least 70% But no more than 85% of plutonium, the rest is one or more gases that will not react with molten titanium) ° GAVIGAN discussion and other laser uses, including continuous wave YAG lasers, and pulses C02, YAG or Excited atomic laser. Generally speaking, when the paper size of the laser is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 5. Description of the invention (ss.it 5 Λ- Β: Central Government Standards Bureau, Ministry of Economic Affairs Industrial and consumer cooperative printing 24 and optics can be achieved through configuration In the typical embodiment of the present invention at any time and at any time:-the first of the three lasers is an ultraviolet laser, for example, the atomic laser "operates at 192 nm" at 248 nm, or 308 nm, the wheel ψ The rate is tens of hundreds (0-200) Watts (W). The energy of a pulse wave is 500 mJ (one thousandth of a joule), and the length of a pulse wave is up to 26 (e.g., picoseconds). The repetition rate is up to 300Hz (Hertz);. The second of the three lasers is NdL.YAG laser, operating in K06 micron continuous wave (CW) or burst mode or Q-switching, the output of the operation ~ power For hundreds (0-1500) watts, the pulse energy can be up to 15j (Joules), the pulse frequency can be up to 1000Hz, the pulse length can be up to 20 milliseconds, and (in pulse / burst mode) Bottom) The pulse current period is up to 5 seconds; S • The third of the three lasers is a CO laser, which operates at a wavelength of 106 μm, the output power is 500-1000W, and the pulse frequency is up to 25Khz. A pulse is at most 25 microseconds, the frequency of the super pulse is 20Khz, and the width of the super pulse is 500 microseconds at most. In typical applications: • the matrix is carbon steel; • the constituent element is carbon; • the secondary element can also be carbon, which is determined by the treatment, the required coating thickness, and whether the matrix is high carbon steel or low carbon steel; • The depth of the obtained material area " d " is approximately 1.0mm (including the auxiliary material area of approximately 0.25_); and • the thickness of the obtained diamond coating is approximately 3mm (or approximately 25 paper standards are applicable to the country of China) Standard (CNS) A4 specification (210X297 mm) (Please read the notes on the back before filling this page) ------------ 1T ------ m I. I, 1: 1 m

IkHgi Printed by 88.lt δ, Consumer Cooperatives, Central Standards Bureau, Ministry of Economic Affairs. 5. Description of the invention () 9 When the surface of the substrate is swept, due to the heat absorption of the undissolved substrate, the melting area that is not under the laser beam will quickly Solidified GAVIGAN also mentions that this method is also effective for other titanium alloys, which contain other strong nitride formations in their composition, such as: hafnium, Ho, carbon and Ming. Although the text does not indicate the formation of the bond layer, it is here to quote in good faith and without prejudice that GAVIGAN essentially implements other methods (ie, methods other than plating) on other materials (ie, except steel) with lasers. Typical representative. Although its hint seems to be limited to the method of forming a crack-free nitrided hardened surface on the surface of titanium and its alloys "USP 5,236,545 (" PRYOR ";8/93; 156/613), the method mentioned in the article includes: Laser melting of a hexaboron nitride target in the atmosphere 'to deposit a nitrided cubic boron (CBN) layer on a silicon substrate as the first interface layer' followed by the use of atomic hydrogen in the presence of atomic hydrogen Laser melting of carbon dry material to deposit a second interface layer of hydrogen-terminated carbon, followed by traditional chemical vapor deposition (CVD) techniques to deposit a heteroepitaxial diamond film. USP 5,098,737 ("COLLINSM; 3/92 427 / 53.1) proposes a method of irradiating a laser beam to a target with a non-normal incidence angle. The four main methods of this patent in the research of manufacturing diamond-like carbon films are: ion beam deposition, chemical vapor deposition, The plasma-enhanced chemical vapor deposition method and the clock-spray deposition method 'provide useful background information. In summary, this patent proposes irradiating a laser in a vacuum chamber to impinge on a continuous strip of graphite foil placed in a vacuum chamber. shape Moving material. The laser beam is focused on the material to dissolve and spray a column of vapor, so that the vapor of this column is completed by laser light -10-¥ paper i scale applies to China National Standards (CNS) M Specifications (21〇 > < 297Male®) ~~ ----- (Please read the precautions on the back before filling this page)

paper

ψ * D A " In the typical application of Γ ′, and the resulting coating is divided into matrix materials, mixed with 5. Description of the invention (three times the depth of 25 material areas). In the method for processing a substrate according to the present invention, the other constituent element is chin, and the secondary element is nitrogen, carbon or butterfly is titanium nitride, carbide, or dioxin. Other applications of the technical method of the present invention (ie children, secondary sources, etc.) are within the scope and connotation of the present invention according to the feature of the present invention 'the energy irradiated on the substrate can be used to generate (or control) desire The physical pressure on the bell layer is produced, and by inducing such pressure in the book, the growth of the crystal can be controlled (promoted) to increase the growth rate better than the prior art method. According to the features of the present invention, the energy irradiated on the substrate can be used to read to form any desired configuration C structure on the surface of the substrate), which can be used as the final result (ie, after-situ finishing in situ) or for later Preparing the surface of the coating (i.e. pre-treating the surface) According to the features of the present invention, the secondary source includes a doping element as a secondary element. For example, diamond or M coatings can be used in semiconductor applications according to the features of the present invention. An electric bias can be applied to the substrate to press the substrate or the crystal growth direction on the formed coating. One advantage of the present invention is that it is not necessary to perform β under vacuum. However, the area of action of the substrate is most resistant to gas (for example, : Nitrogen or argon) to isolate. However, this does not mean that this method does not have to be completed under vacuum. This method or process can be used in conjunction with existing CVD and CVD-type methods to reduce the system. For example, it is not necessary to heat the entire Substrate to drive the deposition reaction, the paper size of 26 papers applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) {Ϋ-^ Read the meaning on the back (Fill in this page again)

Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs

Isolation part ionization USP 5,094,915 (-SUBRAMANIAM 3/92. £ 28/408) »Consumers' cooperation with the Central Bureau of Standards of the Ministry of Economy Carbon monoxide laser light is used to irradiate a gas containing carbon oxide, but laser light is not used to irradiate a substrate to form a carbon thin film on the substrate. JJSP 5,080,752 ("KABACOFF11;1/92; 156/60 ^^)-a method in which transparent diamond powder particles are bonded with polycrystalline diamond to form an effective diamond structure. Fine non-transparent non-diamond carbon The mutual mixture of powder and transparent diamond powder is pressed together to form a transparent quartz vessel or an immature body coated with a polycrystalline diamond, and a pulse laser is used to quickly melt this non-transparent non-diamond Carbon powder. Then, after cooling the molten body of this carbon, the heteroepitaxial growth of the surface of the diamond particles can be started to form a polycrystalline diamond bonded with the diamond particles. _USP 5,066,515 (" OHSAWA "; 11 / 91; 427/53 ^^^ A method for forming an artificial diamond, which includes irradiating a glass-like beam with a laser beam and irradiating a laser beam onto the glass-like solid moved to form a partially melted part, and then When you move away from that point, each part of the local melting part will cool down. During the local melting part, in the vicinity of the two sides of the local melting part that has been condensed, there is only one person. Diamond. USP 4,987,007 (" WAGAL ";1/91; 42 7/53 out of a vacuum environment, the method of removing ions from the laser dissolution column to form a layer of substance on the substrate. This device includes a Vacuum chamber, which contains —run ---------- f ^ binding. (Please read the precautions on the back before filling this page] -11-This paper size applies to China National Standard (CNS) A4 specifications ( 210X297 mm) Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Consumer Cooperatives, and printed on the invention. (26) Energy is applied (irradiated) on selected areas of the substrate, and can be scanned on the surface of the substrate in any form. Make any desired "round (such as: composition, thickness, shape) or pattern on the substrate. This can avoid many problems related to heating the entire substrate" and can provide these methods (which cannot be obtained without covering the substrate) Results. This article will discuss the design of the collisions (introduction) to introduce secondary elements in the form of gas and nozzles to isolate the gas. According to the present invention, the movement of the substrate (workpiece) and the energy source (such as laser) is in phase. In order to control the depth of the village area and the thickness of the coating made on the substrate by the position across the substrate surface. According to the present invention, the intensity, duration, profile, and incident angle of the laser beam can be selected. Controlling the depth of the material area " d " makes it a selected depth. According to the present invention, this technical method can be controlled to make a multilayer coating on a substrate, where each layer has its own desired composition. According to the present invention This technical method can be controlled to make multiple fabrication areas in the matrix. Advantages of the present invention over existing plating techniques include: • Providing a continuous action system in the matrix selection (discrete) region; • The composition produced can be "real" heteroepitaxial and / or homogeneous epitaxy; for example In other words, the heterogeneous epitaxial structure composition can be developed into a homogeneous epitaxial structure composition (such as: plating, or subsequent plating when the composition is divided into SP carbon bond composition). The method of the present invention allows materials to be used in Grow on another bottom material 'without limiting its crystallographic direction, lattice structure-27-This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) (Fill in this page)-After 3

J A7 B7 V. Description of the invention (U) and laser focused on the target to melt the material and ionize part of the melting column. This device is very suitable for forming diamond-like on a clean unspread silicon substrate. Carbon film. This process can produce a DLC layer with a fairly uniform thickness, less than 3% change, and a rate of 20 // m per hour. The manufacturing method includes concentrating a laser beam on a target, melting a part of the target to eject a plasma of the target material, and using a laser to ionize a part of the plasma, and then relocating the position of the substrate to collect ions to form the substrate. A wide range of materials. USP 4,986,214 (" ZUMOTO ";1/91; 118/722) proposes a thin film forming apparatus capable of forming a thin diamond film. This manufacturing method is a laser CVD method, in which the optical decomposition of the thin film-forming gas is performed by high-energy photons released by an ultraviolet laser beam. USP 4, 874,596 (" LEMELSON ";10/89; 423/446) proposes a method of irradiating a cavity containing a small amount of substance for reaction with a strong radiation beam. Two or more intense beams of radiation, such as those generated by one or more lasers or electron guns, are irradiated by particles or lumps of matter in the opposite direction, causing shock waves to shatter the lumpy matter and convert it into Another form. This mass or particle may also include carbon. This carbon is converted into diamond by strong heat and the oscillating force of the oscillating wave. ^^ _ Binding (please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs -12-This paper size applies to the Chinese National Standard (CNS) A4 (210X 297 mm) sail. 5 25. Description of the invention (Printed by the Consumer Cooperatives of the Central Standards Bureau, Ministry of Economic Affairs 29 The technical method of the present invention can be used to treat substrates, and to make mineral layers of any material on the substrate.; The technical method of the present invention can be used to process any size Or shaped substrates such as: large flat flakes, large shaped pieces, piston rings, cylinder liners, spray nozzles, inner walls of long cylindrical elements, valve seats, etc. The technical method of the present invention can be used to process any material The composition of the substrate, including superconducting (electric) body material. The method of the present invention is a true heteroepitaxial crystal, which allows the coating to be made in any direction on the surface of the substrate or on the previously formed coating, including "£;, _ Shaped plating layer and plating structure extending vertically and then parallel to the surface of the substrate β The technical method of the present invention can manufacture a material area under the surface of the substrate, and the material area It can be used as a gift to strengthen the diffusion bond plating layer made on the substrate. Compared with the method of forming a forged layer on the surface of the substrate, such as a diamond bond, the technical method of the present invention can be used at a rate and thickness that cannot be achieved by the coating method. The bell layer is formed. For example, it can be produced at a rate of more than 10Q ^ m per hour, including more than 1 leg per minute, 3 coffee per minute, and 10 legs per minute. The final thickness (0 more than 100 total m The plating layer includes more than 1 nun, 3 mm, and 10 mm. Compared with the processing of the substrate to form a synthetic material production area, the technical method of the present invention can achieve the rate and depth of 30 #m per hour. A production area, including more than 0.5 mm per minute, lfflm per minute, and 3 coffee per minute. It can also produce production areas with a final depth (d) of more than 30—including more than 0.5 mm, 1 mm, and 3 coffee. The method of the invention is continuous, and it overcomes the conventional paper making method in which 30 papers are processed in batches. The Chinese National Standard (CNS) M specification (21〇297 mm) is applied. ),-&Amp; 12 V. Invention The description (USF 4,849,199 (^ ΡΙΝΝΕΟ ^; 7/89; 423/446) proposes to inhibit the growth of graphite and other non-diamond carbons during the low-pressure deposition of carbon to form diamonds. This graphite and other non-diamond carbons Classes are vaporized using incident radiant energy sufficient to evaporate graphite but not enough to damage the substrate. The growth of graphite and other non-diamond carbon classes is during the deposition of diamonds, exposing the growing surface to selective photodecomposition to grow the diamond surface. The formation of non-diamond carbon-carbon bonding at a wavelength of incident radiation energy is suppressed. As described in this patent, all high pressure manufacturing methods used to synthesize diamond will have the problem of graphite growth, which will eventually cause the diamond to stop growing. . A low-pressure manufacturing method is mentioned in this patent, in which the growth of graphite and other non-diamond carbons is suppressed by evaporation or selective photolysis. In one of the methods mentioned in this patent, graphite or other non-diamond carbons are evaporated using sufficient radiation energy to evaporate graphite but not enough to damage the substrate. In another method mentioned in this patent, graphite or other non-diamond carbons are subjected to selective photodecomposition, for example, by using laser energy of an appropriate wavelength. The method of this patent requires a carbon source gas so that the plasma enhanced chemical vapor deposition method > can produce diamond on the seed crystal. When graphite and other non-diamond carbons are formed on the surface of diamond growth, use laser to evaporate them. The energy of the laser must be small enough to avoid physical or chemical damage to the substrate, especially when the substrate is not Diamond seed. The patent also proposes to control the growth of graphite on large diamond crystals or matrix regions by scanning the entire area with a dense beam of light. ° _usp 4,522,680 (" oGAWA ";1/85; 156 / ^ 9. 、 Central 13

限制 Limitations》 The technology of the present invention can successfully process substrates with dimensions of 6 inches, including more than 8 inches, more than 10 inches, and more than 3 more than 100 inches. ^ ^ Substrates can be protected from intrusion, scaling, and a chemically inert surface can be made on the entire substrate or part of the area. The advantage of the low temperature (not first heating) technical method of the present invention is that the substrate can maintain dimensional stability during processing without losing the hardness of its bottom (such as the elasticity of steel). Generally, diamond or Diamond-like carbon coatings (and coatings of other materials) can be formed on the substrate without adding materials other than the original materials (such as carbon components) in the substrate. The coating formed on the substrate is not only on the substrate surface, but also on the substrate surface. And its characteristics depend on the diffusion bond formed between the plating layer and the substrate. This method can also be used to form a diamond-plated layer 'DLC coating, or another crystalline material coating. This method is the only method that can be performed under ambient pressure, without the need for vacuum or high pressure. In addition, 'this method can also be performed without heating the substrate. The surface treatment method of the present invention can be used to treat any substrate, including metal and non-metal substrates (non-metal substrates include ceramic and polymer substrates). Special materials can also be processed or introduced into the reaction system, including * but not limited to: printed by consumers' cooperatives of the Central Prototype Bureau of the Ministry of Economic Affairs • Metals (B, AL, Ti, Nb, Ta, Cr, Mo, W, Re, etc.); • Graphite and carbides (C, B4C, SiC, TiC, Cr3C2, WC, niobium carbide, carbonized, etc.); • Nitrides (BN, TiN, TaN, Si3N4, hafnium nitride, aluminum nitride, etc.) ); 31 This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) V. Description of the invention (13 A7 B7) The method for manufacturing diamond crystals is provided, which includes providing ~ the pressure-resistant material of the crystallization starting material atomic nucleus This element has a core that can penetrate the pressure-resistant substance in the internal junction and can be absorbed by the starting material family. After heating and melting with this energy, the melt is put under pressure = quantity, and the atomic nucleus is borrowed = Crystals. Laser light or high-frequency money. Heating USP 5,176,788 ("KABACOFF"; i / q .., the name of the laser structure of stone i) to connect the diamond structure together. This method includes two An opaque layer of non-diamond material is formed between the diamonds. The diamond surfaces are pressed together, and pulsed laser light is used to quickly melt all opaque non-diamond carbon materials before a large amount of heat is lost through the diamond surface. Then, the dissolved carbon is cooled and condensed into a homoepitaxial complex crystal growing from the diamond surface. Diamond and bond these surfaces together. 427/34) Name USP 4,892.751 (`` MIYAKE '' 1/90 t1) —Packing ----- j. ^ / Fcv / '(Please read the first Please fill in this page again.) Printed as “Methods and Devices for Forming Thin Films” by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. Among the techniques mentioned, laser beams with high output power (such as KrF excitatory atoms) are used. To irradiate the gas to separate the gas from the condensation layer of the gas and locally generate a plasma, and the above gas contains the elements used to form the desired film as a part of the concentrated solidification layer of the gas; and the plasma The generated reactive molecules are used to irradiate the substrate to obtain a high-precision, high-quality thin germanium (Ge) film used in semiconductor devices. In the case of * ΜΙγΑκΕ, a yarn substrate (1 } So that its surface (plane) is parallel to the optical path of the laser beam. The heater that heats the substrate is at the bottom of the substrate to maintain the temperature of the substrate at 400. (: Like the CVD method. In general, Laser is used to make plasma, but it will not be used for substrate -14-This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) Printed by the Consumers Cooperative of Central Standards Bureau of the Ministry of Economic Affairs 88,1L ' δ V. Description of the invention (31) • Boron and boride (B, TaB, TiB, WB, FeB, NiB, etc.); • Silicon and silicide (different silicides of Si, .. and Mo, Fb, Ni, etc.); • oxides (AL203, SiO, SiOs, etc.); and • organic mixtures (PTFE, Kevlar, Polymides, liquid crystal composites, Polyethyltetrathalate, etc.). According to the features of the present invention, the substrate can be pretreated with a laser. (In order to facilitate the production of plating afterwards). For example, the laser beam of an excimer atom is irradiated on the surface of the broken tungsten substrate to remove grinding marks and contaminants, and to remove the inscription on the surface of the substrate. Other metallurgical changes on the substrate can be easily performed during this prior processing, such as adding reactive gases to change the surface chemistry. According to the features of the present invention, the technical method of the present invention can be used to quickly form an object. Generally, three-dimensional objects are "built" with a series of fabricated coatings. Other objects, features, and advantages of the present invention can be learned from the following description. [Simplified description of the drawings] The accompanying drawings are used to illustrate and describe the embodiments of the present invention to explain the principles of the present invention: 1 is a process flow chart describing the technical method of the present invention. Fig. 2A is a partial cross-sectional view of a substrate treated (bonded) by the technical method of the present invention, in which the formation of main and auxiliary material regions in the substrate is specifically described. Figure 2B is the part of the substrate treated (plated) by the method of the invention

V. Description of the Invention (14) Works. _Hp 4,681,640 ("STANLEY"; 7/87; 148 / 1.5) The laser beam should be chemical vapor deposition method with the name of "recorded and doped germanium thin film", where k to the use of adjustable continuous wave C02 laser to Forming a doped and complex crystal film, this laser can transmit infrared laser radiation in the range of 10.4 or 9.4 " m2 to perform laser-induced chemical vapor deposition of photodecomposition. A starting material, such as: Tetramethylgermanium (TMG), has a high vapor pressure and does not have a vibration frequency that is resonant with the C02 laser output. It can be used when a "sensitizer," ("sensitizer" is A substance that absorbs laser energy and then reacts with the energy transmitted to TMG). A stack of 5,080,753 ("DOLL"; 1/92; 156/609), named "Laser Deposits of Crystalline Boron Carbide Films," in which KrF excitable atomic laser is used to melt boron carbide target material, and it will cause boron carbide to be deposited on the single crystal silicon substrate. This substrate has been preheated to about 4000c in advance, and is melted and deposited. Medium 'is maintained at this temperature. In Doll, the laser did not act directly on the substrate. Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) Order USP 5,096,740 ("NAKAGAMA"; 5/92; 427 / 53,1) > The name is `` Through Laser "Method for the production of tritiated boron thin films by deposition", which mentions irradiating an excimer laser on a material containing atoms (also nitrogen atoms), and depositing tritiated trioxide on a substrate facing the target Boron. In the NAKAGAMA case, the laser does not directly act on the substrate. Generally, the substrate for growing CBN (triboride) must be limited to silicon.

USP 4,701,592 ("CHEUNG"; 10/87; 219 / 121LT), entitled "Laser Assisted Deposition and Annealing", proposes the use of a Q_exchange Nd: YAG -15-This paper standard is applicable to Chinese National Standard (CNS) A4 Specifications (210X297 mm) V. Description of the invention (32 88.11 Λ 'R- Cross-section view printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs' which specifically interpolates the formation of multilayer coatings on the surface of the substrate. Figure 3 is based on this A general perspective view of an embodiment of the system for implementing a base-surface treatment of the invention. FIG. 4 is a general perspective view of another practical example of a system for performing a substrate surface treatment according to the present invention. A cross-sectional view of an embodiment of a nozzle of a substrate processing system of the present invention. FIGS. 5A and 5B are top plan views and cross-sectional views of another embodiment of a nozzle of introducing a secondary element into the substrate processing system of the present invention. 6A is a cross-sectional view of a tungsten carbide substrate according to a conventional method. FIG. 6A is a cross-sectional view of the tungsten carbide substrate of FIG. 6A after pretreatment according to the technical method of the present invention. FIG. 7 is a view according to the present invention. Perspective view of a substrate treatment system in which three lasers illuminate the substrate surface with energy (beams) through a nozzle "Fig. 8 is a cross-sectional view of a substrate supported on a base to be surface-treated according to the present invention, here In particular, a planar plasma can be formed according to the technical method of the present invention. Figure 9 is a schematic illustration of the main parts of a system according to the present invention (such as the system of Figure 7). Figure 10 is an example according to the present invention. A series of operation processes of each part of the system of Fig. 7 are described. Figs. 10A, 10B, 10C, and 10D are diagrams of the operating parameters of the exciter atoms NchYAG and CO laser according to an embodiment of the present invention. Curves.-33-This paper size is in accordance with the Chinese National Standard (CNS) A4 size (210x297 public capital) (Poetry ¾ Please note the items on the back before filling in this I ·) ·-II!-I · 1 I -I ? 1 I-X,-0 丨 · V. Description of the invention A 'ΙΓ Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 15 Lasers, splitting its output beam' Illuminating the material source (target) with the first beam Evaporate this material and take a second output beam Irradiate the dried material evaporated from the substrate 0 to form a thin film on the substrate. This film will be placed in a position where the dry material can be prevented from flying out (spraying of thermally condensed particles or dripping of liquid from the dry material) and the second output beam It is used to anneally deposit (on the substrate) thin film (thin film of concentrated objects). [Disadvantages of the aforementioned technology] The various methods described above can be referred to as "deposition" methods, and the desired material (such as diamond) is formed and deposited by this method. On the surface of the substrate. Using these methods 'the best is to form a molecular bond between the deposition coating and the substrate', and this molecular bond has a relatively limited "adhesion" (mechanical bond) between the deposition coating and the substrate. In some applications, such as when plating on cutting tool inserts, diamond adhesion to the substrate is very important. In addition, the polishing of the final surface of the deposit and forging requires a variety of different post-processing steps to achieve the final ideal surface finishing of the mirror portion. The aforementioned conventional plating methods are also easily limited to being able to form only a thin layer (or layer) on the substrate. This is similar to the situation where rain falls on the grass and freezes. The resulting ice layer is quite hard, but it is thin and the thickness of the ice layer (bond layer) from the bottom to the grass (matrix) is very steep. This will cause a very poor grinding force distribution. Therefore, when the pressure is applied, the thin ice layer is easy to crack. As a result, the thickness of the coating layer reflects the pressure on the coating layer. Generally, the deposition rate of the conventional method is very low. It requires heating and cooling of the substrate beforehand, and it cannot be completed in a general environment of the garden (thus the size of the substrate is strictly limited), and it is not suitable for forging some substrates (such as : Including -16-Λ ^ installed with L, 'line (please read the back of it first: ^ Italian consul and then fill out this page) This paper size applies to China National Standard (CNS) A4 (210X297 mm) 88,11 5 Λ V. Description of the invention (printed by 33) Printed by the Central Laboratories of the Ministry of Economic Affairs and Consumer Cooperatives Figure 11A is a photomicrograph of the surface of the existing tungsten carbide substrate before surface treatment, which shows the traces of grinding and surface contamination. Fig. 11B is a photomicrograph of the surface of the tungsten carbide substrate of Fig. Ha after the pre-treatment of the surface treatment process of the present invention. Fig. 11C is the surface of the tungsten carbide substrate of circle iiB after the bond layer treatment of the surface treatment process of the present invention. Figure 11D is the Raman spectrum of the surface of the tungsten carbide substrate of Figure lie after the surface treatment of the present invention. Figure 11E is the surface of the tungsten carbide substrate of the lie after the surface treatment of the present invention. A cross-sectional micrograph of FIG. 11F is a photomicrograph of a diamond coating made according to the technical method of the present invention, which shows the crystalline direction of 1, 0, 0. FIG. 12A is an example according to the present invention, describing Detailed illustration of beam cross section and intersection "Figure 12B is a side view depicting a substrate being surface treated according to an example of the present invention. Figures 13A to 13H are tailorable coatings on a substrate according to the present invention Figure 131 is a perspective view of a three-dimensional object made using the plating technology method of the present invention, and shows the true heteroepitaxial nature of the method. Figures 14A and 14B are processed according to the technical method of the present invention. A perspective view of a long tubular substrate. Figures 15A and 15B are cross-sectional views of a ball bearing coated with a coating according to the technical method of the present invention. "-34-This paper size applies to Chinese National Standard (CNS) Α4 赖 (21〇 Χ297 public fantasy (please read the back of the page; the accidental matters before filling out this page) ο rn If n · A7 B7 printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (16) Cobalt matrix), And coatings that produce poor adhesion (to the substrate) and require post-processing steps (to get the ideal final surface processing on the substrate that has been plated). These methods also require surface preparation and activation. [RAMAN Spectroscopy] The typical tool for describing (analyzing) the diamond (or DLC) coating (or film) deposited on a substrate is Raman spectroscopy. With the advancement of diamond technology, Raman spectroscopy has gradually become the main tool for analyzing diamond materials. The cubic diamond The center of the Brillouin region has a single Raman acting first-order phonon mode. The single crystal of natural diamond can be identified by a single peak at 1332 cm. Synthetic diamond film usually has another peak at about 1550 cm, but no reasonable explanation has been found. Semi-quantitative analysis of a sample based on Raman spectroscopy alone is difficult. However, in some literatures, it is assumed that the 1550 cm spike is from graphite, because its sensitivity is about 2 times higher than that of diamond. Diamond-like carbon (DLC > almost all have these two peaks (1332 cm and 1550 cm). Due to the sensitivity factor, the 1332 cm peak is generally considered to be evidence of the existence of diamond material in the sample. However, many artificial diamond materials are simply Without this spike, there is a faint broad feature on important background luminescence. Generally speaking, the power (sharpness) of diamond spikes depends on some angle of their particle size, that is, the more the particles Smaller, the lower the sensitivity and the wider the peaks. In addition, the diamond film (such as alumina or carbide) deposited on a hard diamond substrate will cause a 15 cm shift in the peak due to the pressure on the film. Position. Although Raman -17-this paper size applies Chinese National Standard (CNS) M specification (2 丨 0 × 297 mm) I-^^ ----. Fik -----— ΐτ (Please read the note on the back first (Fill in this page again)

I " ---- sail g .A 7 --------- B '-___________ V. Description of the invention ()---~-34 Figure 16A is a typical embodiment according to the present invention, A side view describing the cylindrical tool being processed. Ring 16B is a side view of a cylindrical tool interpolated with a front surface according to another exemplary embodiment of the present invention. FIGS. 16C and 16D are side and top views illustrating a cylindrical tool being surface-treated according to yet another embodiment of the present invention. FIG. 16E is a cylindrical tool according to another exemplary embodiment of the present invention. Side view. Fig. 16F is a side view illustrating a cylindrical tool being surface-treated according to another exemplary embodiment of the present invention. Fig. 17A is a partial cross-sectional view of an apparatus suitable for introducing a minor element into a reaction system. Fig. 17B is a partially cutaway perspective view of a nozzle for introducing gas into a reaction system according to the present invention. Fig. 17C is a partial cross-sectional view of the nozzle similar to Fig. 17B. Fig. 18 is a diagram describing how the manufacturing method of the present invention assists a CVD-like method. Fig. 19 is a partial cross-sectional view of another device suitable for introducing minor elements into the reaction system, ------------------------- line-(Please read the precautions on the back first Refill this page) Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs -35-This paper is applicable to the national standard (CNS) of the country (21 × 297). 5. Description of the invention () 17 Central Standard of the Ministry of Economic Affairs Bureau's consumer cooperative printed spectrum is an effective tool to analyze the diamond or diamond-like coatings produced on the substrate, but it cannot be used to judge the "quality of the coatings. Therefore, in many applications (such as grinding machines, lathes, drilling machines) Or similarly used as a tool for cutting work), for one or more of the specified work materials (such as aluminum alloy, steel alloy, composite materials;), the cutting tool feed rate, tool life, The peeling condition and the finished state of the final work must be tested. A "successful" cutting tool with a layer must also be capable of performing "dry" (no lubricant or cutting oil) machining. [Rapid prototyping] The surface treatment method of the present invention can also be used for rapid prototyping. In the conventional rapid method of making objects, the engineering evaluation provided is limited, and it is not suitable for production or prototyping. Conventional Technique 'In other non-metallic techniques, photopolymers or extruded materials are used to make rapid prototype plastic parts' or laser sintered powder is used to make metal parts. These methods produce rough parts with limited practicality For example, Stereolithography (SIA) is commonly used in rapid prototyping systems. Lithography is a method of making three-dimensional objects from a film of a hardened, cured liquid polymer. Existing rapid prototyping systems are selective Geo-hardened or cut material layers become shapes defined by CAD data to make the desired object. Generally, UV, argon, or other types of lasers can be used to harden this polymer. CAD data represents a series of mathematically A continuous thin layer of the material to represent the shape of the skull to be made. Many publications are Transfer rapid prototyping (RP) techniques in improving manufacturing 18 - the scale of this paper method applicable Chinese National Standard (CNS) A4 size (210X297 mm) (please read the back of the gross poetry; i precautions to fill out this page)

I Central Government Department of the Ministry of Economic Affairs S1 Bureau 2 Consumption Cooperation si 8a 1ί. 5 A7 B7 V. Description of Invention (34-ί) Description of Representative Symbols of Main Part 100220,220 204,224,304,404,1304,1306,1308,1310,1'326 300,400,700,800,900 , BDS 330,430, 500,550,722,1730,1750,1920 506 508 Ε1.Ε2.Ε3 510,520,530,561,580 512,522,532,562,582. 514,524.534,564,584, BG SS SF 552,554,1734 592 602 630,634. 723 804 1201,8081,8101,8101,2061,8101,206 1320, 1324, 1330, 1554, 1566 1156 1202 (1202a, 1202b, 1202c, 1202d) 1252 1262, 1264, 1266-1270 All the planes pass through the plasmid surface to the surface of the beam to the decent base The ground axis body light flow gas source gas flat tungsten is threaded and the physical surface beam is taken from the center of the arm and the mouth-shaped mouth is rushed to eliminate the threat. Then it is made up of four seats. ## (乱 1 肷 积 ^; 1 stream base light selection In the middle of the ring, the lightning in and out of the slow sub-spray ring, the carbon and carbon axons, the true gold, the scattered moment, and the electropolymerized plating.C) The DLCA. -κΐ, back to the cloud --- ¾ ', then fill in the page too) © --- 、-= -35-1-This paper size is applicable to Chinese National Standard (CNS) A4 said (210X297 mm) Ministry of Economic Affairs Bureau of Standards HIGHLAND consumer cooperatives printing equipment V. invention is described in () 18 system and reduce the importance of costs. In addition, these articles clearly point out the limitations of existing systems. In recent two publications, "Manufacturing Engineering" (SME Publishing) November 1993, ρρ · 37-42) and "Success Technology" (January 1994, ρρ. 40-44), both emphasize fast Prototyping and manufacturing systems are important. In other articles, such as the one on laser sintering, the status of rapid prototyping is also pointed out. Generally speaking, the existing rapid prototyping technology method is to selectively cut material layers to CAD To create objects in the shape defined by the data. As mentioned in "Manufacturing Engineering" (November 1993), "The goal of existing gp (rapid prototyping) techniques is to prototype materials that provide higher strength at elevated temperatures . What this industry needs is a complete metal mold (without the use of sintered materials) in order to efficiently analyze objects. In addition, this article also points out that direct manufacturing of parts is the final step in rapid prototyping. In addition, this article also emphasizes the importance of materials' and although some experimental rapid prototyping systems are based on Mingrong Metal And metal powder to work, but they are still not high-strength and full-density metal. The following will introduce the conventional methods of manufacturing objects (such as: rapid prototyping). The following US patents (which have been incorporated herein by reference for reference) (Description) points out the current status of stereolithography and object manufacturing: USP 5,260,009 ("Systems and methods for manufacturing 3D objects and their processes Tyr ~ ~ ~ USP 5,256,340 (" Initial method for manufacturing 3D objects using stereolithography ") ; ~ USP 5, ^ 48,456 ("Methods for the manufacture of three-dimensional lithographic objects-19-This paper is again applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the notes on the back before filling in (This page) -----------, -Order ------- / ί II— ml In 1 ^ 1 mA.i A7 B7 V. Description of the invention (34_2) Central Ministry of Economic Affairs Seal of the Second Men's Consumption Cooperation-1338,1340,1 342,1344 1352,1354,1356,1358,1360,1362 1366 1372a ... 1372i 1380 1384a, 1384b 1392 tl, t2 1402,1412 1404,1806,1928 1406,1416, 1408,1418 1410 1420 1552,1562, 1600 1602,1622,1642,1662.1682 1604 1606 1608 1610,1630,1664,1684 1646 1732 1734 1752 1754 1756 1758,1759, 1760,1770 1762,1772 1764.1774,1775 '1804 1812 1924Plating structure Cylindrical coating, ribbon coating, coating structure, highly plated tubular substrate, energy beam, one (open) end of the tubular substrate, the other end of the tubular substrate, parabolic reflection surface, jet ball sleeve, component plating, round cutter, end mill, one Yang, one knife The selected part of the blade tip plasma (small spots). Nozzle body sleeve extends to the top of the hole. Bottom opening. Central cavity. Nozzle body. First and second inlets. Outer tube. Inner tube. Vacuum environment. Suitable window rake material. Matters need to fill in this page)

35-2 The size of the paper method applies to the Chinese National Standard (CNS) A4 specification (210X297 mm.) 88.lt δ ΙΓ V. Description of the invention () 19 and device "); USP 5,247, 180 (" Stereolithography: brush &Amp;);-_ USP 5,236,637 ("Methods and devices for the production of 3D objects using stereolithography" ^ " In USP 5,017,317 ("MARCUS"; 5/91; 264/81), name Selective Beam Deposition for the Vapor Phase describes the use of lasers to poke parts, which mentions the use of a computer-controlled beam of directed energy (such as a laser) to irradiate a large amount of laser energy to a gas phase In the material room, this material is used to deposit photodegradation or thermal decomposition that is best to produce a gas phase, and to selectively deposit the material in the area of the cross-section required for the part to be made. In the cross-sectional area, the goal of the beam is to deposit material in the area of the cross-sectional area. Each subsequent layer is connected with the previous layer to make a part containing many connected layers. [Objective of the Invention] Object of the Invention Is a change Further technical methods for applying (manufacturing) a coating layer, in particular plating diamond (or DLC) coating on a substrate, such as cutting tool inserts, especially cutting tool inserts coated with commercially available inscriptions Object or a circular cutting tool. Another object of the present invention is to provide a technical method for placing a mirror clock on a substrate in a surrounding (non-vacuum) environment. Another object of the present invention is to provide a non-heating ( (Or preheating) In the case of the entire substrate, the technical method of controlling the thermal balance during processing so that the plating layer is plated on the substrate without affecting the entire substrate. -20-This paper size applies to China National Standard (CNS) A4 specifications (210X297mm) f Jing Maowen read the a on the back of the matter and fill in this ear) -Ding,-· ° Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs •--ί. »--HI--i In IK 1- · [V. Description of the invention (35

Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs [Details] In this article, the term "" surface treatment, "means changing the metallurgical properties of the substrate" includes "making" a shield on the surface of the substrate or on the surface that has been coated Or multi-layer plating (cladding), and the improvement of the matrix composition of the subsurface area ("material" or "transfer" area) under the surface of the substrate. Two surface treatment "systems" are described, one is "pretreatment , 'System, this is a suitable plating technology method to treat the substrate in order to accept subsequent plating operations; the other is a "plating" system, which is the operation of making a coating on the surface of the substrate. The term " matrix " includes a planar or cylindrical cutting tool herein and can be used on a selection of objects that require surface treatment. Generally, the plating method of the present invention includes separating or forming "elements", (or "main") elements from a substrate, or reacting with the "constituent" elements, and then immediately on the surface of the substrate, the " "Reaction zone" to make it react; if necessary, "secondary elements" are selectively introduced from "secondary sources" to increase the reaction; and "synthetic materials" (reacted materials, which have physical properties such as phase) Structure, modified, 'modified', and / or another material or materials added to the material) diffuse back into the matrix. In this way, there will be synthetic artefacts in the transfer area "and / or The produced plating material, and the produced plating layer will be bonded to the substrate by diffusion bonding. Other details can be understood by referring to the description of the preferred embodiment of the present invention in conjunction with the examples shown in the drawings. Although the present invention will be described with reference to preferred embodiments, the embodiments described are not meant to be limiting. On the contrary, the scope of the present invention is defined by the patent application park set forth below, and any changes covered by the meaning and scope of the present invention shall be deemed to be included in the scope of the present invention. In the following, the production of King Kong 36 on tungsten carbide cutting tool inserts will be discussed. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 × 297 cm) 〆Binding〆. V (Please read the precautions on the back before filling in this page)

V. Description of the Invention (20) Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Another objective of the present invention is to provide a technical method for forming a diffusion bonding layer on a substrate *: Another object of the present invention is to provide all steel Alloys include stainless steel and non-ferrous materials or alloys, as well as other materials, such as ceramics and polymers, and substrate processing techniques. Another object of the present invention is to provide a technical method capable of forming a clock layer having a shape, thickness, and composition that can be cut. It is another object of the present invention to provide a technical method for treating a substrate without the need for additional post-treatment fine grinding processing. Another object of the present invention is to provide a method for treating a substrate in a heteroepitaxial manner, such as for artificial diamond, DLC, or other crystalline materials. Another object of the present invention is to provide a technical method for processing a substrate having a complicated geometry. Another object of the present invention is to provide a technical method for making a tool or insert, especially a cutting tool. Another object of the present invention is to provide a technical method for coating (plating) on a substrate (such as a cutting tool or an insert), especially a diamond or diamond-like coating and other materials. Strong toughness method, even if it has a very high cobalt content, is useful for high-speed copper, ceramics, plastic DLC (barrier plating, etc.), and other cutting tool materials, and can be performed at low temperature and low pressure Finished. Another object of the present invention is to provide a method that can improve the adhesion between the coating and the substrate, especially the diamond clock layer (and DI "C). It is -21-a. Table I— (Please read and read (Notes of rain, please fill out this tribute)

-1T This paper size applies to China National Standard (CNS) A4 specification (210 × 297 mm)

V. Description of the Invention (36) The main examples of stone coatings printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs. However, it is obvious that the present invention is not limited to these materials. [,] [Making flow chart (Fig. 1)] Fig. 1 is a flowchart of the entire process 100 of the technical method implemented according to the present invention. Generally speaking, these technical methods include irradiating laser energy (preferably three different lasers) on the surface of the substrate to drive the reaction system built on the composition ~ element (element) and place it at the appropriate junction The secondary components (elements) are introduced into the reaction system. Obviously, this process can be carried out from various directions, or it can be terminated at different points in the manufacturing process. In the first process step (step A), the 'laser energy is used to: • impart mobility to one or more constituents located in a region below the surface of the substrate at one or more rates, and The constituent elements move towards the surface of the substrate to produce a concentration gradient of one or more constituent elements in the subsurface area; • Separated in a controlled manner (separated from other materials in the matrix) and evaporates the selected portion of the one or more constituent elements The amount selected; and "• When the preliminary gas reaction (PGR) occurs on the surface of the substrate, immediately react the evaporated one or more constituent elements to modify the physical structure and characteristics of the evaporated one or more constituent elements "» The combination of the modified and unmodified components is a "synthetic village." This step (step A) is mainly to prepare other further processing of the substrate (as described in step B). This process also It can be terminated at this stage 'as shown in step Η. In process step B, the synthetic substance diffuses to the surface of the substrate to make a " fabrication " that extends from the surface of the substrate to the substrate. This area is mainly a passive diffusion of the higher concentration of PQR synthetic matrix to lower concentrations synthetic -37--

(Please-^ Please ^ -For the legal and Italian matters, fill in the second big shell)

This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) Printed by the Bayer Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 88.11. Δ Λ 7 1Γ V. Description of the invention And can be performed under low temperature and low pressure. : Another object of the present invention is to provide a technical method for treating the surface of a substrate to provide a diffusion-bonded composite material under the surface of the substrate. Another object of the present invention is to provide technical methods for the processing and manufacturing of materials to produce objects with desired composite materials, such as diamond,

DLC, Nitrided Nitrile (CBN), B * C, SiC, TiC, Cr3C2, TiN, TiB2, Si 3N 4 and cCN, sharp, carbide, post-titanium titanium, broken inscription, etc. Another object of the present invention It is a technical method to provide a "designer" mirror layer on a substrate. Another object of the present invention is to provide a system in which useful metals, ceramics, and composite parts can be produced in the final state without the need for any post-processing (outside the system environment) finishing and enhanced physical properties. It is brought about by the present enhanced fortified compound that cannot be manufactured by other currently known devices. Another object of the present invention is to provide a technical method for pre-treating (preparing) a substrate to facilitate plating after the processing by the present invention or existing techniques. Another object of the present invention is to provide a technical method for treating the surface of a substrate. 'It is not necessary to perform separate and different pre-treatment steps on the surface of the substrate to obtain the required surface of the substrate. (In situ) done. According to the present invention 'will be three different laser light from three different lasers-22-This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ----- Ϊ —I— I. -In nu Λ / Ά .11-I -I- --Γ 4 * τ ί (Please read the notes on the back before filling out this page) Paper U. 5 V. Description of Invention () 37 Process. This process can then proceed in two directions (steps C and D described below). 'In process step C, this process may be terminated when a material zone having a controlled concentration of a synthetic substance has been successfully formed. For example, the synthetic material in the material area can be diamond or DLC. In general, the production of synthetic materials and diffusion into the material area do not change the volume of the matrix. On the other hand, compared to step C, in the process step D, the steps of moving, evaporating, and reacting the synthetic material in the material area can be repeated (similar to the method of step A), or the substrate One or more constituent elements are moved, evaporated, and reacted, or both, to reprocess the material area. In the case where synthetic materials are processed again in the material area, this process can achieve synergy and will proceed at a greater rate (eg, exponential increase). This process is repeated to achieve any desired concentration of synthetic material ' on the surface of the substrate and any desired gradient of synthetic material in the material area. At this point in the process, a coating can be made on the surface of the substrate. This coating 'or the material it creates has completely different chemical properties than the coating on the material area. "To make this coating, introduce a secondary source (step E ) Or not imported (step F) into the system. Printed by the Shellfish Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economics {阅读 Read the back: Intentional matter before filling out this page) In process step E, the “secondary” source (the matrix itself is regarded as the “primary source”) The above "secondary" elements (one or more of the constituent elements on the substrate are considered "primary" elements) are introduced into the reaction system. In this case, an energy source is used to make a synthetic plating composition on the substrate surface (for example: Diamond or diamond-like carbon) β-synthetic coating composition is a material made of one or more secondary elements and synthetic materials (which can be the same or different materials) 〇-38-This paper size applies to Chinese national standards (CNS ) Α4 size (21〇χ297 mm) ___ ς 1v said in the following year / __

5. Description of the invention (22) I —— ^ —— A J beam of energy is irradiated on the surface of the substrate to treat the surface of the substrate. Control these three laser process parameters and interactions to achieve the desired effect on and / or on the surface of the substrate. The parameters of this manufacturing method include: • the wavelength of each laser; • the operating mode (such as: pulse, super pulse or continuous wave), including: the pulse width and frequency of each laser; • the output of each laser Power; • the energy of each laser; • the angle of incidence of each laser beam on the substrate surface; • the shape and size of the cross-sectional area of each laser beam; and Sequence (time relationship). For example, one or more constituent (natural) elements deposited on the sub-surface area of the substrate may move at one or more flow rates toward the surface of the substrate to produce one or more constituents (concentration of constituent elements) on the sub-surface area. Gradient. In addition, the selected amount of selected elements of the constituent elements can be separated and evaporated in a controlled manner. One or more constituent elements of the matrix can be regarded as the "main" source of materials in the manufacturing method. Staff Consumption of the Central Standards Bureau of the Ministry of Economic Affairs Printed by a cooperative (please read the notes on the back before filling this page) According to the present invention, one or more constituent elements that have evaporated have an immediate effect on the surface of the substrate to improve the physical structure and Properties to produce a composite that can then diffuse back into the matrix. 0 At some point in the process, perhaps at the beginning of the process, one or more secondary sources containing secondary elements can be placed in the reaction that acts immediately on the substrate surface. System, for example, carbon in the matrix can flow, evaporate, and -23-paper size 逋Use Chinese National Standard (CNS) A4 specification (210 × 297 mm) Printed by the Consumers ’Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs ^, Description of the invention () > 38 As mentioned above (eg: step D) ' It is formed under the surface of the substrate. This material area can include a main material area 'and a secondary material area located between the main material area and the surface of the substrate. In general, the depth of the' secondary material area 'is smaller than the main material area And the concentration of one or more auxiliary material areas will be greater than the main material area. In connection with the main material area, the auxiliary material area provides relative bonding, support and pressure distribution related to subsequent plating on the substrate. Important function. The material area (primary and secondary) has a comprehensive influence on the parameters related to the bonding, support and pressure distribution required to define the subsequent coating (if any) on the substrate. In this way, in Underneath the surface of the substrate, a material zone with a depth of "d" is formed, and a coating material with a thickness of "t" can be made on the surface of the substrate. For example, about 3 sides (mm) thick on a steel or sintered carbide substrate Diamond layer (plated Layer), the main building material area is about 0.75 mm deep, and the secondary building area is about 0.25 mm thick. On the other hand, compared to step E, in process step F, the secondary source is not injected into the system, and It is to move, evaporate and react a small amount of synthetic material in the material area (in a manner similar to step A) to form a secondary material area under the substrate. It can react again (using energy to purge) to form a coating of the substrate. This allows a thinner coating to be made on the substrate than using a secondary source (step E). However, the substrate itself must have sufficient constituents to make a thick coating on the surface of the substrate (step F) is the principle. For example, 'Using tungsten carbide (eg 92%) matrix in cobalt matrix', the energy source will cause tungsten and carbides to dissociate into tungsten and carbon forms, and breaking will become diamond on the substrate. Or DLC coating components (-39-The paper ruler (CNS) A4 size (2iQx297))-(Please read the precautions before filling this page)

Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (23) The reaction is amplified with a carbon dioxide secondary source that can provide additional carbon to the reaction system to form a diamond or diamond-like carbon coating on the substrate. The present invention benefits from metallurgical changes that occur on the surface of the substrate. By diffusing the constituent elements of the reaction back into the matrix and / or diffusing the secondary elements of the reaction back into the matrix, there will be a gradient of material composition in the diffusion region (also referred to herein as the transfer region) within the matrix. It is transferred from pure matrix to pure plating. This not only provides internal diffusion (such as metallurgy) bonding between the plating produced on the substrate and the substrate itself, but also provides a smooth (rather not steep) transfer of physical pressure on the substrate. 0 According to the present invention , Two different diffusion regions made in the matrix: the main material area (transition area) in the matrix, and the secondary material area between the main material area and the surface of the substrate. For example, if a diamond layer (plating layer) of about 3 mm thick is made on a steel or bonded carbon substrate, the main material area is about 0.75 mm deep and the secondary material area is about 0.25 mm thick. Features according to the invention The selected area on the substrate is suitable for processing with three lasers, or a laser and another energy source (such as: electron beam, X-ray beam, etc.) are used to emit a controllable beam. This means that it is only necessary to deal with this area that is smaller than the entire surface area of the matrix, but not other parts. However, it is conceivable that a series of selected regions must be processed in a sequential or parallel manner, even the entire matrix Surface. According to the present invention, the activities performed during each step of the production can be controlled by appropriate devices, such as: CNC control station. Laser operating parameters -24-This paper size applies Chinese National Standard (CNS) A4 specifications (2ΙΟ'〆297mm) --------- 篆-(Please read the notes on the back before filling in this page) 、-= a

8¾ II A ir 5. Description of the invention (printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 39 Inherent source). In addition, 'the technical method of the carbon required for the diamond or DLC coating decomposed in the cobalt matrix is better than the existing process (and PVD) J process', and the use of this method will cause the growth of graphite in the system and therefore "Damage the system 'and inhibit the formation of diamond coatings or DI mirror layers. Any graphite formed using the method of the present invention can be efficiently and continuously converted into diamond in the diamond coating produced. Best of all, all available graphite can be consumed in this process. However, if a small amount of graphite is still not converted to diamond and will not be damaged to this process. In process step G (following step £), when making a coating on a substrate, different side sources with different side elements can be introduced into the reaction. System. This creates a multilayer coating on the substrate. For example, starting with a tungsten carbide matrix and sequentially introducing the secondary elements into the reaction system, a titanium carbide coating can be made on top of it, a titanium nitride layer on top, and a diamond layer on top. According to another example ', a thin coating of triboron nitride (CBN) can be coated with a thick diamond coating. This process can also produce diamond coatings on silicon nitride. This process can also be used to make a composite structure of diamond and OT, and vice versa, or a composite structure of diamond particles mixed with broken silicon or silicon nitride. As shown in process step Η, in some cases it is best to avoid (or reduce) the diffusion of synthetic material back to the substrate (see step B). In this case, the process can be performed on one or more of the substrates in step A The constituent elements stop after moving, evaporating, and reacting. <• This is a very thin plated 40 on the surface of the substrate. This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm). Please fill in this page again) Order ο! 5. Description of the invention (ss.it 5 Λ- Β: Printed by the Central Laboratories Bureau of the Ministry of Economic Affairs, Shelley Consumer Cooperatives, 24 and optics can be configured to achieve any required In a typical embodiment of the invention:-the first of the three lasers is an ultraviolet laser, for example, the atomic laser of the state "operates at 192 nm" 248 nm, or 308 nm, and the wheel ψ rate is several hundreds (0- 200) Watt (W) number, the energy of a pulse wave is the highest H work 500 mJ (one thousandth of a joule), the length of a pulse wave is up to 26 such as kweiseconds, and the repetition rate is up to 300Hz (Hertz); three The second of the lasers is the NdL.YAG laser, at K〇6 microns Continuous wave (CW) or burst mode or Q-switch operation, the output of the operation is ~ hundreds (0-1500) watts, pulse energy up to 15j (Joule), pulse frequency is up to 1000Hz, the pulse length is up to 20 milliseconds), and (in pulse / burst mode) the pulse duration is up to 5 seconds; S • The third of the three lasers is a CO laser, Operating at a wavelength of 10 6 microns, the output power is 500-1000W, the pulse frequency is up to 25Khz, one pulse is up to 25 microseconds, the super pulse frequency is up to 20Khz, and the super pulse width is up to 500 microseconds. In the typical application of the substrate processing technology method of the present invention: • the substrate is carbon steel; • the constituent element is carbon; • the secondary element can also be carbon, which is caused by the treatment, the required coating thickness, and whether the substrate is high Carbon steel or low carbon steel to determine; • the depth of the obtained material area &quot; d &quot; is about 1.0mm (including the secondary material area of about 0.25_); and • the thickness of the obtained diamond coating is about 3mm (or about In order to make 25 paper sizes, the Chinese National Standard (CNS) A4 specification (210X297 mm) is applied (please read the precautions on the back before filling this page) ------------ 1T ---- -m I. I, 1: 1 m

I

V. Description of the invention () 40

The Central Consumers Bureau of the Ministry of Economic Affairs has a favorable point when it comes to the print floor of consumer cooperatives. For example, it is best to form a thin coating of diamond or DLC on the surface of the substrate (eg, copper wire) or under the surface of the substrate without affecting the original volume (eg, dimensions) of the substrate. For example, the material composition of the selection surface or the entire area of the ball or roller bearing raceway or raceway can be strengthened without affecting the original volume. This manufacturing process can also be performed directly from the initial movement, evaporation, and reaction (step A) to the step of introducing a secondary source into the reaction system (step E). (This "branch path" is regarded as a process step, that is, process step I in Fig. 1) »For example, in order to make diamond on a pure titanium substrate, carbon as a secondary element must be introduced into the system (there is no Available carbon can be used as a constituent element). The steps of titanium movement, evaporation, and reaction in the matrix can form a diffusion bond with the diamond or DLC coatings made next. For example, starting with a silicon matrix, carbon is introduced by a secondary source to produce silicon carbide silicon in the material region. Silicon carbide can then be converted into diamond. Or, for example, nitrogen is introduced by a secondary source to produce silicon nitride silicon in the material region, and carbon in the reaction system is sequentially provided by the secondary source to form a diamond or DLC layer on the material region. . [Materials area (Fig. 2A)] Fig. 2A is a cross-sectional view of a typical processing substrate 200 processed according to one or more of the process steps described in Fig. 1 according to the method of the present invention. It shows a substrate 202 with a top surface 204, a secondary material area 206 formed under the substrate surface, and a primary material area 208 -41 formed under the secondary material area 206-(Please read the precautions on the back before filling in this Page) δ clothing. Order 11 j This paper size applies to China National Standard (CNS) A4 size (210X297 mm) paper

ψ * D A &quot; In the typical application of Γ ′, and the resulting coating is divided into matrix materials, mixed with 5. Description of the invention (three times the depth of 25 material areas). In the method for processing a substrate according to the present invention, the other constituent element is chin, and the secondary element is nitrogen, carbon or butterfly is titanium nitride, carbide, or dioxin. Other applications of the technical method of the present invention (ie children, secondary sources, etc.) are within the scope and connotation of the present invention according to the feature of the present invention 'the energy irradiated on the substrate can be used to generate (or control) desire The physical pressure on the bell layer is produced, and by inducing such pressure in the book, the growth of the crystal can be controlled (promoted) to increase the growth rate better than the prior art method. According to the features of the present invention, the energy irradiated on the substrate can be used to read to form any desired configuration C structure on the surface of the substrate), which can be used as the final result (ie, after-situ finishing in situ) or for later Preparing the surface of the coating (i.e. pre-treating the surface) According to the features of the present invention, the secondary source includes a doping element as a secondary element. For example, diamond or M coatings can be used in semiconductor applications according to the features of the present invention. An electric bias can be applied to the substrate to press the substrate or the crystal growth direction on the formed coating. One advantage of the present invention is that it is not necessary to perform β under vacuum. However, the area of action of the substrate is most resistant to gas (for example, : Nitrogen or argon) to isolate. However, this does not mean that this method does not have to be completed under vacuum. This method or process can be used in conjunction with existing CVD and CVD-type methods to reduce the system. For example, it is not necessary to heat the entire Substrate to drive the deposition reaction, the paper size of 26 papers applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) {Ϋ-^ Read the meaning on the back (Fill in this page again)

Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 〇 A H Revision + Month ~ S8.1ir8 —: V. Description of the invention () 41, and a forged layer 210 made on the surface of the substrate. For example, the process steps A'B, D, and rhenium (of FIG. 1) may be performed in private to obtain the processed substrate 200. As described above, the thickness (d2) of the secondary material area 206 is generally smaller than the thickness (dl) 'of the main material area and the concentration of the synthetic substance is greater than the depth (d) of the β material area of the main material area. d2 = d The thickness of the plated layer is “t”. [Multilayer Plating (FIG. 2B)] FIG. 2B is a cross-sectional view of a typical processing substrate 220 processed according to one or more of the process steps described in FIG. 1 according to the technical method of the present invention. A substrate 222 having a top surface 224 is shown, and a first plating layer 226 is formed on the surface of the substrate and has a thickness of “tl” (for ease of illustration, the main material area and the auxiliary material area are omitted in this figure), and are formed in the aforementioned first A second plating layer 228 with a thickness of "1: 2" on the surface of the plating layer, and a third plating layer 230 having a thickness of "t3" formed on the top surface of the second plating layer 228. Such a processing substrate 220 can be obtained by performing process steps A, B, D, E, and G (in FIG. 1). According to the features of the present invention, a multilayer plating layer as shown in Fig. 2B can be easily produced. For example, the first plating layer 226 can be formed by the composition of the constituent elements of the matrix, and the first secondary element can be introduced into the reaction system through the secondary source; the second plating layer 228 can be formed by the composition of the constituent elements of the first plating layer 226 The second secondary element is introduced into the reaction system through a secondary source; the third plating layer 23 ′ may be formed from the composition of the element formed in the second plating layer 228 and the third secondary element is introduced into the reaction system through a secondary source. According to this application, a multilayer coating with a predetermined material composition can be produced β -42-This paper size is applicable to China National Standard (CNS) A4 specifications (210X297 mm) — (Please read the precautions on the back before filling in this page j- Order-Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs, printed by the Central Standards Bureau of the Ministry of Economic Affairs, printed by the Consumers' Cooperatives, and the invention description () 26 Energy is applied (irradiated) on the selected area of the substrate and can be any Scanning on the surface of the substrate to make any desired "round (such as: composition, thickness, shape) or pattern on the substrate. This can avoid many problems related to heating the entire substrate" and can provide these methods ( Results that cannot be obtained without covering the substrate. This article will discuss the design of the nozzles used to introduce the secondary elements in the form of gas and the barrier gas (instance). According to the present invention, the substrate (workpiece) and the energy source (such as · · Laser) movement is relative, in order to control the depth of the village area and the thickness of the plating on the substrate by the position across the substrate surface. According to the present invention, the depth of the material area can be controlled by selecting the intensity, duration, profile, and incident angle of the laser beam to make it a selected depth. According to the present invention, this technical method can be controlled to control the A multi-layer plating layer is made on the surface, each of which has its own desired composition. According to the present invention, this technical method can be controlled to manufacture a plurality of building material regions in the matrix. The advantages of the present invention over the existing plating technology and methods Including: • Provide a continuous action system in the matrix selection (discrete) region; • The composition produced can be "real" heteroepitaxial and / or homoepitaxial; for example, the produced heteroepitaxial structural constituents Can be developed into homogeneous epitaxial constituents (eg, coatings, or subsequent coatings when the composition is divided into SP carbon-bonded constituents) The method of the present invention allows a material to grow on another bottom material without limiting its Crystallization direction, lattice structure-27-This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X 297 mm) (Please read the back of the page first; please fill out this page before filling in this page) -3 Rear

J

Year, month, and fifth, Invention Description () 44 played a leading role in starting the initial gas reaction (PGR). In some cases, the role of an excimer laser can be assisted by another laser (such as 314. • The second 314 (laser 2) of the three lasers is mainly used to drive the diffusion function ( Such as: Step B), and balance the stoichiometry of the hot gas reaction and the gas phase reaction. This laser is best Nd: YAG laser 'and usually plays a supporting role as the leading role of the excimer atomic laser. In this case, Nd: YAG laser can also assist in the evaporation of constituent elements, especially in the case of bright (reflective) materials; in addition, in some cases Nd: YAG laser can also play a leading role, and by Excited atom lasers are used to assist (ie, for some substrates and coating materials, the roles of exciter atoms and Nd: YAG lasers are interchangeable). Generally speaking, exciter atoms and Nd: YAG lasers are used When the evaporation of the constituent materials is initiated to balance the reaction, the interaction between the two lasers will make this reaction technique out of balance. It is advantageous to use two lasers to assist the reaction in any case &quot; for example, To form a diamond film, exciton atoms Larger power and pulse performance are usually more expensive to start this gas phase reaction, and is assisted by Nd: YAG laser. Printed by the Consumer Cooperatives of the Central Bureau of Standards, Ministry of Economic Affairs • The third of the three 316 (laser) 3), preferably C0 laser, is used to balance the thermal, physical, gas and chemical reactions occurring on the surface of the substrate. The basic role of C0 laser is to provide thermal equilibrium and avoid thermal gradients in the reaction gas. C0 laser can also provide the minimum temperature balance in the gas reaction and affect the reaction temperature. ① Laser can also provide a synergy between the reaction that occurs on the substrate surface and the gas reaction that occurs on the substrate surface. In this case (ie using certain matrix materials -45-this paper size applies to Chinese National Standard (CNS) A4 specifications (210X 297 mm) 27 Printed by A7 B7, Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. Growth direction, material, etc. In other words, the material to be produced is not limited by the characteristics of the material or the substrate on which the material is to be made (unrestricted); • When coating on a surface Any lattice structure can be formed by selecting the appropriate nucleation material and generating the appropriate species on the matrix material to enter the initial vapor phase (PVP); • This method can be performed without a CVD process, without a vacuum state, and It is carried out without a target material. The manufacturing method can be completed by sinking in the surrounding atmosphere; The manufacturing method can be performed without sinking the substrate in advance; The manufacturing method is continuous and allows any component of the desired depth It is formed under the surface of the substrate, and allows components of any desired thickness to be formed on the surface of the substrate; • Its bonding is deeper than the existing methods and it can provide greater adhesion; • Its coating can be on substrates of any size and shape The thickness of the composition formed by this method is not limited; the operation of processing the substrate to form a diamond or DLC surface can be completed without affecting the original volume of the substrate. The optical (beam propagation) system can be located between the laser and the surface of the substrate, so that the beam emitted by the laser can be concentrated or diffused or otherwise changed (such as profile or dimension). The secondary elements can be used by many conventional devices, such as: spraying, spreading, deposition, melting, or other conventional devices, and in any suitable form, (please read the precautions on the back before filling this page)

I -28-Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs ----. SB. 11 8. Moving β In order to simplify the operation of the nozzle bodies 552 and 554, the flow channels 562 and 582 are formed by extending the grooves to the lower surfaces of the respective nozzle bodies. The bottom surface of the mouthpiece 554 is in close contact with the groove (flow channel 562) of the upper nozzle body 552 and the annular plane 592 having a central opening is in close contact with the groove (flow channel 582) of the lower nozzle body 554. [Pretreatment (Fig. 6A, 6B)] Generally, it is advantageous for the substrate to prepare the surface to be forged in advance. Removes grind marks and contaminants that appear on the surface.磨光 和 化学 # 刻 is a known method for performing pre-processing. Generally, chemical etching of the substrate must deal with some hazardous chemicals and generate toxic waste, which leads to an increase in the complexity of the substrate plating system. In addition, each substrate composition requires a separate chemical to perform such an etching. According to the present invention, the same laser that is already in place for the coating can be used as a substrate for preparing different types of substrates for the coating. use. According to a feature of the present invention, a surface treatment system (such as 300) can be used not only to perform surface treatment on a substrate surface, but also to perform pretreatment. Generally speaking, relative to gas, this is only a matter of controlling the process parameters of laser. 6A and 6B illustrate how to perform a pretreatment of a substrate in connection with the surface treatment process of the present invention. The previous processing flow may be performed before or simultaneously with the surface processing process described in FIG. 1. According to the present invention, the pretreatment method of the present invention can be used as a "pioneer" for the subsequent plating process (including CVD method) on the substrate surface. -50-This paper size applies to Chinese National Standard (CNS) A4 (210X 297mm) (Please read the precautions on the back before filling this page) V mu fm n ^ — IT--! ------ ---------- A7 B7 printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the Invention (28) For example: liquid, gas, solid, plasma, powder, etc. to be introduced into the reaction system. ~ For example, gaseous secondary elements can be injected into the reaction system using a pressurized nozzle (jet tube). This nozzle is designed to transport gaseous secondary elements in an atmosphere surrounded by another gas (such as Ming gas). It can be concentrated (inducing tritium transmission) by a spiral-controlled vortex of the gas located in the mouthpiece (jet tube). In this way, the secondary elements can be gathered in the matrix selection area where the incident energy is two. = According to the invention Features, gaseous secondary elements and surrounding gas can be used as secondary elements in the reaction. A piece of material (such as graphite source) can be contained inside or outside the mouthpiece (jet tube), and then irradiated by the energy source, and then introduced In the reaction system, the secondary element can also be selected as the "insulator" (for example, steps C, F, and H of the manufacturing process) when the secondary element is not required in the manufacturing process (isolating the environment, and no need to use a vacuum). Element (and surrounding gas) can be clean or productive gas. — According to traditional usage, if the material can still maintain the crystallization of the underlying matrix when it grows on itself, it is called &quot; homogeneous epitaxy &quot; The growth of different materials on the substrate, if the crystallization direction of the substrate is still maintained, is called "heterogeneous crystals". In this article, "true heteroepitaxial" is used to indicate that a material is synthesized on different materials at the bottom, It has nothing to do with the direction of crystallization, and can be used to distinguish the system (such as CVD or PVD system) where the material must be sprayed as seeds or otherwise provide a nucleation site. These cases are called "mass epitaxy". 〇-2 9 1 This paper size applies the Chinese National Standard (CNS) from the specifications (210x297 mm) ------------- |, 玎 (Please read the precautions on the back before filling this page)

I Printed by the Consumer Cooperatives of the Central Procurement Bureau of the Ministry of Economic Affairs if λ thorn: V. Description of invention (ς1) 3 丄 Constant, repeatable characteristics and easier to control. As shown in FIG. 6B, a subcutaneous region extends to a depth d 'and has been cleared. Usually, this is the precursor of the construction area described above. 11A and 11B also illustrate the pre-processing process, which will be described later. Details of other process parameters will be described in detail in the following examples. In addition to exposing and rounding tungsten carbide particles, the pretreatment process of the present invention can achieve metallurgical changes inside the surface of the substrate. For example (recalling sintered carbide), diamonds with a crystal orientation of 1.0.0 (100) can be formed. This diamond will be used as a highly ideal crystal for the subsequent process of forming a diamond (or DLC) coating on the surface of the substrate. Nuclear forming abutment. Again, this is independent of the method used for mirror-coated substrates, but it is very useful for CVD and similar methods. However, the use of the coating formation process of the present invention will obviously result in synergistic effects and exponential results, because the same laser equipment is used for the pretreatment (preparation, characterization) and treatment (making the coating on) the substrate. In addition, (again, in the case of cobalt sintered tungsten carbide matrix), the pretreatment process of the present invention is very advantageous for forming a carbon + halide + cobalt chloride complex or the aforementioned valley alignment orientation between tungsten carbide peaks, and this Will be very suitable for subsequent plating operations (or at the same time forming a coating). [Surface treatment and pre-treatment system (Figure 7)] The above has been the entire manufacturing process (Figure 1), the use of three lasers (Figure 3), the introduction of secondary sources (Figure 4, 5, 5A, 5B) and Pre-processing (Figures 6A, 6B) is explained in detail. Figure 7 describes a complete surface processing system 700, which is used in conjunction with the three laser processes shown in Figure 3, including the introduction of one or -52-as described in Figure 4. The size of this paper is applicable to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling this page)

Is. Order sail. 5 扪 5. Description of the invention (printed by the Consumer Cooperatives of the Central Bureau of Standards, Ministry of Economic Affairs, 29. The technical method of the present invention can be used to treat substrates, and to make mineral layers of any material on the substrate.; Technical method of the present invention Can be used to process substrates of any size or shape, such as: large flat flakes, large shaped pieces, piston rings, cylinder liners, spray nozzles, inner walls of long cylindrical elements, valve seats, etc. Technical method of the present invention It can be used to process any material substrate, including superconducting (electric) bulk materials. The method of the present invention is a true heteroepitaxial crystal, which allows the coating to be made in any direction on the surface of the substrate or on the previously formed coating, including & quot £ ;, _-shaped coating and coating structure extending vertically and then parallel to the surface of the substrate β The technical method of the present invention can manufacture a building material area under the surface of the substrate, and the building material area can be used as a reinforcement made on the substrate Support for diffusion bonding plating. Compared with the method of forming a forged layer on the surface of the substrate, such as a diamond bond, the technical method of the present invention can be applied to the coating method. The clock layer can be formed at a rate and thickness. For example, it can be produced at a rate of more than 10Q ^ m per hour, including more than 1 leg per minute, 3 coffee per minute, and 10 legs per minute. It can also be made final Thickness (0 over 100 total m plating, including more than 1 nun, 3 mm, and 10 mm. Relative to the processing of the substrate to form a synthetic material production area, the technical method of the present invention can be used at a rate of 30 #m per hour. And depth to make this material area, including more than 0.5 mm per minute, lfflm per minute and 3 coffee per minute. It can also produce material areas with a final depth (d) of more than 30-, including more than 0.5 mm, 1 mm and 3 coffees. The method of the present invention is continuous, which overcomes the conventional method of batching 30 papers in accordance with the Chinese National Standard (CNS) M specification (21〇297 mm) (please-read the back) Please fill in the page for the matters needing attention),-&amp;, invention description () '84 Plating the coating by any appropriate technical method. The invention can be applied to various substrates, including metal and non-metal substrates (non-metals) Matrix including ceramic and polymer matrix) One kind of treatment. Specific materials that can be treated or introduced into the reaction system include, but are not limited to: • Metals (B, Al, Ti, Nb, Ta, Cr, Mo, W, Re, Hf, etc.); • Graphite And carbides 034 (:, 3 丨 (:, 1 ^ (:, (:): 3 (: 2, (:, carbonization, etc.); nitrides •, W &amp;, t * (B, TaB2, TiB2, WB, FeB, NiB ,,); • Silicon and silicides (Si, and different silicides of Mo, Fe, Ni, etc.); • Oxides (Al203, Si0, Si02); and 'Organic compounds ( PTFE, Kevlar, polyamide, liquid crystal polymer, polytetraphthalate. As mentioned above, one of the advantages of the technical method of the present invention is that a desired substrate texture can be obtained without post-processing. Ultraviolet laser itself (for example) 'Only by controlling its energy generation and irradiation time, it can be used to melt (burn money) the substrate and obtain substantially various textures ranging from rough to optically smooth β. In addition, the invention is adopted The technical method does not need to select seed crystals for the substrate (generated after plating), and has unprecedented ability to control the direction of crystal arrangement. Moreover, the two steps of pre-processing and post-processing can be performed in situ (as part of the overall process). In the previous technology of the deposition technique, a post-processing step is required to obtain a smoother texture than that obtained by the deposition. For example, an emery abrasive can be used. 5. Description of the invention (30

限制 Limitations》 The technology of the present invention can successfully process substrates with dimensions of 6 inches, including more than 8 inches, more than 10 inches, and more than 3 more than 100 inches. ^ ^ Substrates can be protected from intrusion, scaling, and a chemically inert surface can be made on the entire substrate or part of the area. The advantage of the low temperature (not first heating) technical method of the present invention is that the substrate can maintain dimensional stability during processing without losing the hardness of its bottom (such as the elasticity of steel). Generally, diamond or Diamond-like carbon coatings (and coatings of other materials) can be formed on the substrate without adding materials other than the original materials (such as carbon components) in the substrate. The coating formed on the substrate is not only on the substrate surface, but also on the substrate surface. And its characteristics depend on the diffusion bond formed between the plating layer and the substrate. This method can also be used to form a diamond-plated layer 'DLC coating, or another crystalline material coating. This method is the only method that can be performed under ambient pressure, without the need for vacuum or high pressure. In addition, 'this method can also be performed without heating the substrate. The surface treatment method of the present invention can be used to treat any substrate, including metal and non-metal substrates (non-metal substrates include ceramic and polymer substrates). Special materials can also be processed or introduced into the reaction system, including * but not limited to: printed by consumers' cooperatives of the Central Prototype Bureau of the Ministry of Economic Affairs • Metals (B, AL, Ti, Nb, Ta, Cr, Mo, W, Re, etc.); • Graphite and carbides (C, B4C, SiC, TiC, Cr3C2, WC, niobium carbide, carbonized, etc.); • Nitrides (BN, TiN, TaN, Si3N4, hafnium nitride, aluminum nitride, etc.) ); 31 This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) 1 _ J · -'5? 1-1 1. A7 \-[B7 V. Description of invention (86) Employees of the Central Bureau of Standards, Ministry of Economic Affairs The consumer cooperative print port 1752, a bottom opening 1754, and a central cavity 1756 are located in the body 1758 of the nozzle 175 °. Laser energy (i.e., three beams LI, L2, L3) can be directed through the top opening 1752 of the nozzle, and a substrate (not shown) will be placed under the nozzle. The nozzle 1750 has two gas inlets. The first inlet 1760 is used to contain a gas including a carbon-containing secondary element (ie, CO, co2, etc.), and the second inlet 1770 is used to contain an inert gas (as described above). The first gas inlet 1760 communicates with an outer tube 1212 arranged around the outer periphery of the nozzle 1750 body 1758 (that is, in a ring shape). The carbon-containing gas is introduced into the first gas inlet 176 (at a predetermined pressure) and flows around the nozzle body 1758 through the outer pipe 1762. A plurality of inner tubes 1764 extend from the outer tube 1762 into the cavity 1756 of the nozzle in a generally light shot to introduce a carbonaceous gas into the mouth cavity. The inner tube I764 should be arranged downward to the bottom opening 1754, so as to direct the carbon-containing gas to the bottom opening 1754 of the nozzle 1750, and then to the substrate being manufactured by diamond or DLC coating. The second gas inlet 1770 communicates with a ring 1772 which is placed around the nozzle 1750 body 1758 (that is, in a ring shape). The inert gas (as described above) is introduced into the second gas inlet 1770 (at a predetermined pressure) and flows through the outer tube 1772 to the periphery of the mouth-producing body 1758. Several inner tubes 1774 extend approximately lightly from the outer tube 1772 into the mouth cavity 1756 to introduce a carbon-containing gas into the nozzle cavity. The inner tubes 177 4 may be disposed downwardly toward the bottom opening 1754 so as to direct the inert gas toward the bottom opening of the nozzle 1750 ′ and then to the substrate undergoing diamond or DLC coating manufacture. Generally speaking, the outer tubes 1762 and 1772 are runners similar to transfer molds, while the inner tubes 1764 and 1114 are runners similar to transfer molds. As shown in Figure 17C, the inner tube 1775 (like 1774) is a nozzle. _ 8 7 _ This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling (This page)

88,1L 'δ printed by the Central Standard Bureau of the Ministry of Economic Affairs and Consumer Cooperatives V. Description of the invention () 31 • Boron and boride (B, TaB, TiB, WB, FeB, NiB, etc.); • Silicon and silicide (Si , And different silicides of Mo, Fb, Ni, etc.); • oxides (AL203, SiO, SiOs, etc.); and • organic mixtures (PTFE, Kevlar, Polymides, liquid crystal composites, Polyethyltetrathalate, etc.) 〇 According to the features of the present invention, the substrate can be pre-treated with a laser (for the subsequent coating production). For example, the laser beam of an excimer atom is irradiated on the surface of the broken tungsten substrate to remove grinding marks and contaminants, and to remove the inscription on the surface of the substrate. Other metallurgical changes on the substrate can be easily performed during this prior processing, such as adding reactive gases to change the surface chemistry. According to the features of the present invention, the technical method of the present invention can be used to quickly form an object. Generally, three-dimensional objects are "built" with a series of fabricated coatings. Other objects, features, and advantages of the present invention can be learned from the following description. [Simplified description of the drawings] The accompanying drawings are used to illustrate and describe the embodiments of the present invention to explain the principles of the present invention: 1 is a process flow chart describing the technical method of the present invention. Fig. 2A is a partial cross-sectional view of a substrate treated (bonded) by the technical method of the present invention, in which the formation of main and auxiliary material regions in the substrate is specifically described. Figure 2B is the part of the substrate treated (plated) by the method of the invention

87 Body 1759 (like 1758) shakes down to the bottom of the pout. The 18 series shows how the method of the present invention can be used as a processing method for the two similar CVD methods ... The substrate is placed in a vacuum environment (® shown as a bell-shaped cover) 1804. The entire substrate is not preheated, and an energy beam 1806 from an energy source 1808 is irradiated onto the substrate. Energy 1808 can be set outside the vacuum environment. As a result, as shown in the figure, the energy beam 1806 enters the vacuum environment (ie, enters the bell jar) through an appropriate window 1812. The remaining β is an element that utilizes the present invention as a processing method in the CVD-like method and is not required Figure 18 is well known because it is similar. Fig. 19 shows another embodiment of the present invention. According to this embodiment, a target material 1924 'such as graphite' can be accommodated outside or inside the nozzle 1920 and irradiated by an energy source 1926 having an energy beam 1928. The energy source 1926 can be guided from the energy source 202 by using necessary lenses and forming sufficient parameters. Once it is thus proved how the reaction process can be completed, changed and controlled, it is obvious that the technical method of the present invention can be used on a substrate to produce infinitely variable diamond and DLC coating compositions and geometric shapes (shape, contour, etc.) . The following discussion is intended to be illustrative and not restrictive. According to the recent discovery of the use of lasers to form a diamond or DLC forging layer, it is only known to the general public. It has been briefly discussed above. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the back Note: Please fill out this page again) However, in the present invention, 'the combination of three different lasers is best, but it has amazing results' and it is unprecedented to form diamond, DLC and other materials on the substrate. Carbon coatings, including: • diamond coatings (Cx * where χ is the number of carbon atoms in a crystal); • diamond-like carbon clock layers (Cx) 'shows a Sp / Sp bond structure;-88-this paper size applies China National Standard (CNS) A4 specification (210x297 mm) V. Description of the invention (32 88.11 Λ 'R- Cross-section view printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs' which specifically interpolates the multilayer coating on the surface of the substrate Formed. Fig. 3 is a general perspective view of an embodiment of a system for performing base-surface treatment according to the present invention. Fig. 4 is another practical example of a system for performing substrate surface treatment according to the present invention. Perspective view. Figure 5 is a cross-sectional view of an embodiment of a nozzle for introducing a minor element into a substrate processing system of the present invention. Figures 5A and 5B are another embodiment of a nozzle for introducing a minor element into a substrate processing system of the present invention. Top plan view and cross-sectional view of the example "Fig. 6A is a cross-sectional view of a tungsten carbide substrate according to a conventional method" Fig. 6A is a cross-sectional view of the tungsten carbide substrate of FIG. 6A after pretreatment according to the technical method of the present invention Sectional view. Figure 7 is a perspective view of a substrate processing system according to the present invention, in which three lasers illuminate the surface of the substrate through a nozzle ("beam"). A cross-sectional view of the treated substrate, in particular a planar plasma that can be formed according to the technical method of the present invention is shown here. Figure 9 is a diagram of the main parts of a system according to the present invention (such as the system of Figure 7). Explanation. • Figure 10 is an example of the present invention, describing a series of operation processes of each part of the system of Figure 7. Figures 10A, 10B, 10C, and 10D are examples of the excited state atoms NchYAG and CO, respectively, according to an embodiment of the present invention. Laser operating parameters: diagrams, tables and curves.--33-This paper size applies to China National Standard (CNS) A4 specifications (210x297 public capital) (Poetry ¾ Please note the items on the back before filling in this I · )--II!-I · 1 I -I? 1 I-X, -0 丨 · Β4 1 07 3 58 Μ Town commissioner KJCRH: Whether it will be changed in the future and its substance Α7 Β7 Year of work: Central Bureau of Standards, Ministry of Economic Affairs Printed by the employee's consumer cooperative V. Description of the invention (explained by the main part of the symbol 100 process 220, 220 treatment substrate 204, 224, 304, 404, 1304, 1306, 1308, 1310, 1326 surface of the substrate 300, 400, 700, 800.900, surface treatment system BDS beam delivery system 330, 430, selected area 500, 550, 722, 1730,1750.1920 Nozzle 506 Central axial channel 508 Toroidal body El, E2, E3 Laser beam 510,520,530,561,580 Inlet 512,522,532,562,582, Toroidal flow channel 514,524,534,564,584, Outlet BG Buffer gas SS Deputy source SF Isolate gas 552,554,1734 Nozzle body 592 Toroidal plane 602 tungsten carbide matrix 630,634, tungsten carbide particles 723 axis line 804 support 808 protrusion 810,814 vacuum channel 1150,1206 Materials (diffusion) belts 1154,1204,1314,1316,1320,1324,1330,1554,1566 Diamond (or DLC) coating 1156 Scattered (artificial) 1202 (1202a, 1202b, 1202c, 1202d) Rectangular substrate 1252 Rectangular lens 1262, 1264, 1266 Electron beam 1270 Focusing light into -92-(Please read the precautions on the back before filling this page) This paper uses the Chinese National Standard (CNS) Α4 specification (210X297 mm) 88,11 5 Λ V. Description of the invention (Printed by 33) Printed by the Central Laboratories of the Ministry of Economic Affairs and Consumer Cooperatives Figure 11A is a photomicrograph of the surface of the existing tungsten carbide substrate before surface treatment, which shows the traces of grinding and the surface Defaced. Fig. 11B is a photomicrograph of the surface of the tungsten carbide substrate of Fig. Ha after the pre-treatment of the surface treatment process of the present invention. Fig. 11C is a photomicrograph of the surface of the tungsten carbide substrate of the circle iiB after the bond layer treatment of the surface treatment process of the present invention. Fig. 11D is a Raman spectrum taken on the surface of the tungsten carbide substrate of Fig. Lie after the surface treatment of the present invention. Fig. 11E is a cross-sectional micrograph of a tungsten carbide matrix having a circular lie after the surface treatment of the present invention. Fig. 11F is a photomicrograph of a diamond coating layer made according to the technical method of the present invention, in which the crystalline direction of 1, 0, 0 is shown. Fig. 12A is a detailed diagram depicting a beam cross section and an intersection according to an example of the present invention. "Fig. 12B is a side diagram depicting a substrate being surface-treated according to an example of the present invention. Figures 13A to 13H are diagrams of making a tailorable coating on a substrate according to the present invention. Figure 131 is a perspective view of a three-dimensional object made using the plating technology method of the present invention, and the figure shows the true Heterogeneous epitaxial nature. Figures 14A and 14B are perspective views of a long tubular substrate treated according to the method of the present invention. Figures 15A and 15B are cross-sectional views of a ball bearing coated with a coating according to the technical method of the present invention. "-34-This paper size applies Chinese National Standards (CNS) Α4 赖 (21〇 × 297 公 幻 (please read the back first) (Please fill in this page for any matters you want) ο rn If n · V. Description of invention (92) Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 1338, 1340, 1342, 1344 Coating parts 1352, 1354, 1356, 1358 , 1360,1362 coating structure 1366 serpentine coating 1372a ... 1372i coating section 1380-cylindrical coating 1384a, 1384b strip coating 1392 coating structure tl, t2 height 1402, 1412 coated tubular substrate 1404, 1806, 1928 energy Beams 1406, 1416, One (open) end of the tubular substrate 1408, 1418 The other end of the tubular substrate 1410 Parabolic reflecting surface 1420 Jet 1552, 1562, Components of a steel ball bearing 1600 Coated round tools 1602, 1622, 1642, 1662, 1682 End mill 1604 One shaft part 1606 One sipe part 1608 One tool tip 1610, 1630, 1664, 1684 Plasma 1646 Selected area (small spots) 1732 Nozzle body 1734 Axial extension hole 1752 Top opening 1754 Bottom opening 1756 Center Cavities 1758, 1759, Nozzle body 1760, 1770 First and second inlets 1762, 1772 Outer tubes 1764, 1774, 1775 Inner tubes 1804 Vacuum environment 1812 Appropriate window 1924 Light materials — 93 _ (Please read the precautions on the back before filling this Page) This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) &quot; ---- sail g .A 7 --------- B '一 ___________ 5. Description of the invention ( ) A-one ~-34 Figure 16A is a side view describing a cylindrical tool being processed according to a typical embodiment of the present invention. · Circle 16B is a cylinder according to another exemplary embodiment of the present invention, interpolating a front surface treated cylinder Figs. 16C and 16D are side and top views of a cylindrical tool being surface-treated according to another embodiment of the present invention. Fig. 16E is a further exemplary embodiment of the present invention. Side view of a surface-treated cylindrical tool. Fig. 16F is a side view illustrating a cylindrical tool being surface-treated according to another exemplary embodiment of the present invention. Fig. 17A is a partial cross-sectional view of an apparatus suitable for introducing a minor element into a reaction system. Fig. 17B is a partially cutaway perspective view of a nozzle for introducing gas into a reaction system according to the present invention. Fig. 17C is a partial cross-sectional view of the nozzle similar to Fig. 17B. Fig. 18 is a diagram describing how the manufacturing method of the present invention assists a CVD-like method. Fig. 19 is a partial cross-sectional view of another device suitable for introducing minor elements into the reaction system, ------------------------- line-(Please read the precautions on the back first (Fill in this page again.) Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs -35-This paper is applicable to the national standards (CNS) of the country. (21 × 297) ¾ 8a 1ί. 5 A7 B7 V. Description of the invention (34-ί) Description of the main part of the symbol 100220,220 204,224,304,404,1304,1306,1308,1310,1'326 300,400,700,800,900, BDS 330,430, 500,550,722,1730,1750,1920 506 508 Ε1.Ε2.Ε3 510,520,530,561,580 512,522,532,562,582. 514,524.534,564,584, BG SS SF 552,554,1734 592 602 630,634. 723 804 808 810,814 1150,1206 1154,1204,1314,1316,1320,1320,1320,156 1202a, 1202b, 1202c, 1202d) 1252 1262, 1264, 1266-1270 All the road surface systems pass through the plasmid surface and send the area to the decent body of the beam channel to transmit the ground axis optical flow gas source gas flat tungsten all threads The physical surface beam takes the center of the arm and shoots into the mouth. Starting from $ # (random 1 肷 ^^ 1) The base surface light selective spraying in the base of the stream, the ring in and out of the ring, the slow sub-split ring, the carbon and carbon axons, the true gold, the dispersion of the moment, and the moment of electroplating C) DLCA Road Green Astral Mirror Beam Passing β Stone Zero-Based Remaining Light Band Zone {Poem-κΐ, Behind the Cloud --- ¾ 'item and fill in the page too) © --- 、-= -35-1-This paper size Applicable to the Chinese National Standard (CNS) A4 grid (210X297 mm) mA.i A7 B7 V. Description of the invention (34_2) Seal of male second consumer cooperation of the Central Bureau of the Ministry of Economic Affairs-1338,1340,1342,1344 1352,1354 , 1356,1358,1360,1362 1366 1372a ... 1372i 1380 1384a, 1384b 1392 tl, t2 1402,1412 1404,1806,1928 1406,1416, 1408,1418 1410 1420 1552,1562, 1600 1602,1622,1642, 1662.1682 1604 1606 1608 1610, 1630, 1664, 1684 1646 1732 1734 1752 1754 1756 1758, 1759, 1760, 1770 1762, 1772 1764.1774, 1775 '1804 1812 1924 Plating section coating structure Snake coating Plating section cylindrical coating strip Plating structure Highly plated tubular substrate Energy beam One side (open) end of the tubular substrate Parabolic reflective surface Jet steel ball sleeve sleeve components of the tubular substrate Tool end mill-Yang part, Slot part, Tip tip plasma selected area (small spots) Nozzle body sleeve extends to the top of the hole, bottom opening, central cavity, nozzle body, first and second inlet, outer tube, inner tube, vacuum environment, appropriate window, (Please read Jinyun's notes first and complete this page)

35-2 The size of the paper method is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm.) V. Description of the invention (35

Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs [Details] In this article, the term "" surface treatment, "means changing the metallurgical properties of the substrate" includes "making" a shield on the surface of the substrate or on the surface that has been coated Or multi-layer plating (cladding), and the improvement of the matrix composition of the subsurface area ("material" or "transfer" area) under the surface of the substrate. Two surface treatment "systems" are described, one is "pretreatment , 'System, this is a suitable plating technology method to treat the substrate in order to accept subsequent plating operations; the other is a "plating" system, which is the operation of making a coating on the surface of the substrate. The term &quot; matrix &quot; includes a planar or cylindrical cutting tool herein and can be used on a selection of objects that require surface treatment. Generally, the plating method of the present invention includes separating or forming "elements", (or "main") elements from a substrate, or reacting with the "constituent" elements, and then immediately on the surface of the substrate, the " "Reaction zone" to make it react; if necessary, "secondary elements" are selectively introduced from "secondary sources" to increase the reaction; and "synthetic materials" (reacted materials, which have physical properties such as phase) Structure, modified, 'modified', and / or another material or materials added to the material) diffuse back into the matrix. In this way, there will be synthetic artefacts in the transfer area "and / or The produced plating material, and the produced plating layer will be bonded to the substrate by diffusion bonding. Other details can be understood by referring to the description of the preferred embodiment of the present invention in conjunction with the examples shown in the drawings. Although the present invention will be described with reference to preferred embodiments, the embodiments described are not meant to be limiting. On the contrary, the scope of the present invention is defined by the patent application park set forth below, and any changes covered by the meaning and scope of the present invention shall be deemed to be included in the scope of the present invention. In the following, the production of King Kong 36 on tungsten carbide cutting tool inserts will be discussed. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 × 297 cm) 〆Binding〆. V (Please read the precautions on the back before filling in this page)

V. Description of the Invention (36) The main examples of stone coatings printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs. However, it is obvious that the present invention is not limited to these materials. [,] [Making flow chart (Fig. 1)] Fig. 1 is a flowchart of the entire process 100 of the technical method implemented according to the present invention. Generally speaking, these technical methods include irradiating laser energy (preferably three different lasers) on the surface of the substrate to drive the reaction system built on the composition ~ element (element) and place it at the appropriate junction The secondary components (elements) are introduced into the reaction system. Obviously, this process can be carried out from various directions, or it can be terminated at different points in the manufacturing process. In the first process step (step A), the 'laser energy is used to: • impart mobility to one or more constituents located in a region below the surface of the substrate at one or more rates, and The constituent elements move towards the surface of the substrate to produce a concentration gradient of one or more constituent elements in the subsurface area; • Separated in a controlled manner (separated from other materials in the matrix) and evaporates the selected portion of the one or more constituent elements The amount selected; and "• When the preliminary gas reaction (PGR) occurs on the surface of the substrate, immediately react the evaporated one or more constituent elements to modify the physical structure and characteristics of the evaporated one or more constituent elements "» The combination of the modified and unmodified components is a "synthetic village." This step (step A) is mainly to prepare other further processing of the substrate (as described in step B). This process also It can be terminated at this stage 'as shown in step Η. In process step B, the synthetic substance diffuses to the surface of the substrate to make a &quot; fabrication &quot; that extends from the surface of the substrate to the substrate. This area is mainly a passive diffusion of the higher concentration of PQR synthetic matrix to lower concentrations synthetic -37--

(Please-^ Please ^ -For the legal and Italian matters, fill in the second big shell)

This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) paper U. 5 V. Description of invention () 37 process. This process can then proceed in two directions (steps C and D described below). 'In process step C, this process may be terminated when a material zone having a controlled concentration of a synthetic substance has been successfully formed. For example, the synthetic material in the material area can be diamond or DLC. In general, the production of synthetic materials and diffusion into the material area do not change the volume of the matrix. On the other hand, compared to step C, in the process step D, the steps of moving, evaporating, and reacting the synthetic material in the material area can be repeated (similar to the method of step A), or the substrate One or more constituent elements are moved, evaporated, and reacted, or both, to reprocess the material area. In the case where synthetic materials are processed again in the material area, this process can achieve synergy and will proceed at a greater rate (eg, exponential increase). This process is repeated to achieve any desired concentration of synthetic material &apos; on the surface of the substrate and any desired gradient of synthetic material in the material area. At this point in the process, a coating can be made on the surface of the substrate. This coating 'or the material it creates has completely different chemical properties than the coating on the material area. "To make this coating, introduce a secondary source (step E ) Or not imported (step F) into the system. Printed by the Shellfish Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economics {阅读 Read the back: Intentional matter before filling out this page) In process step E, the “secondary” source (the matrix itself is regarded as the “primary source”) The above "secondary" elements (one or more of the constituent elements on the substrate are considered "primary" elements) are introduced into the reaction system. In this case, an energy source is used to make a synthetic plating composition on the surface of the substrate (for example: Diamond or diamond-like carbon) β-synthetic coating composition is a material made of one or more secondary elements and synthetic materials (which can be the same or different materials) 〇-38-This paper size applies to Chinese national standards (CNS ) Α4 specification (21 × 297 mm) Central Government Bureau of Standards, Ministry of Economic Affairs, Consumer Cooperatives Co., Ltd. ^, Description of Invention () &gt; 38 As described above (eg, step D) ', the material area can be below the surface of the substrate Formed. This building area can include a main building area 'and a secondary building area located between the main building area and the surface of the substrate. Generally, the depth of the' sub building area is smaller than the main building area, and The concentration of one or more auxiliary material areas will be greater than the main material area. Related to the main material area, the auxiliary material area provides important functions such as relative bonding, support and pressure distribution related to subsequent plating on the substrate. The material area (primary and secondary) has a comprehensive influence on the parameters related to the bonding, support and pressure distribution required to define the subsequent coating (if any) on the substrate. In this way, on the substrate surface A depth of “d” will be formed below, and a coating material with a thickness of “t” can be made on the surface of the substrate. For example, approximately 3 sides (mm) of diamond are made on a steel or sintered carbide substrate. Layer (plating), the main material area is about 0.75mm deep, and the secondary village area is about 0.25mm thick. On the other hand, compared with step E, in process step F, the secondary source is not injected into the system. Instead, a small amount of synthetic material in the material area is moved, evaporated, and reacted (in a manner similar to step A) to form a secondary material area under the substrate, which can react again (using energy to poke) to form the substrate's Plating. This allows a thinner coating to be made on the substrate than using a secondary source (step E). However, the substrate itself must have sufficient constituents to make a thick coating on the surface of the substrate (step F) is the principle. For example, 'Using tungsten carbide (eg 92%) matrix in cobalt matrix', the energy source will cause tungsten and carbides to dissociate into tungsten and carbon forms, and breaking will become diamond on the substrate. Or DLC coating components (-39-The paper ruler (CNS) A4 size (2iQx297))-(Please read the precautions before filling this page)

8¾ II A ir 5. Description of the invention (printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 39 Inherent source). In addition, 'the technical method of the carbon required for the diamond or DLC coating decomposed in the cobalt matrix is better than the existing process (and PVD) J process', and the use of this method will cause the growth of graphite in the system and therefore "Damage the system 'and inhibit the formation of diamond coatings or DI mirror layers. Any graphite formed using the method of the present invention can be efficiently and continuously converted into diamond in the diamond coating produced. Best of all, all available graphite can be consumed in this process. However, if a small amount of graphite is still not converted to diamond and will not be damaged to this process. In process step G (following step £), when making a coating on a substrate, different side sources with different side elements can be introduced into the reaction. System. This creates a multilayer coating on the substrate. For example, starting with a tungsten carbide matrix and sequentially introducing the secondary elements into the reaction system, a titanium carbide coating can be made on top of it, a titanium nitride layer on top, and a diamond layer on top. According to another example ', a thin coating of triboron nitride (CBN) can be coated with a thick diamond coating. This process can also produce diamond coatings on silicon nitride. This process can also be used to make a composite structure of diamond and OT, and vice versa, or a composite structure of diamond particles mixed with broken silicon or silicon nitride. As shown in process step Η, in some cases it is best to avoid (or reduce) the diffusion of synthetic material back to the substrate (see step B). In this case, the process can be performed on one or more of the substrates in step A The constituent elements stop after moving, evaporating and reacting. &Lt; • This is a very thin plating on the surface of the substrate. (Please fill in this page again)

V. Description of the invention () 40

The Central Consumers Bureau of the Ministry of Economic Affairs has a favorable point when it comes to the print floor of consumer cooperatives. For example, it is best to form a thin coating of diamond or DLC on the surface of the substrate (eg, copper wire) or under the surface of the substrate without affecting the original volume (eg, dimensions) of the substrate. For example, the material composition of the selection surface or the entire area of the ball or roller bearing raceway or raceway can be strengthened without affecting the original volume. This manufacturing process can also be performed directly from the initial movement, evaporation, and reaction (step A) to the step of introducing a secondary source into the reaction system (step E). (This "branch path" is regarded as a process step, that is, process step I in Fig. 1) »For example, in order to make diamond on a pure titanium substrate, carbon as a secondary element must be introduced into the system (there is no Available carbon can be used as a constituent element). The steps of titanium movement, evaporation, and reaction in the matrix can form a diffusion bond with the diamond or DLC coatings made next. For example, starting with a silicon matrix, carbon is introduced by a secondary source to produce silicon carbide silicon in the material region. Silicon carbide can then be converted into diamond. Or, for example, nitrogen is introduced by a secondary source to produce silicon nitride silicon in the material region, and carbon in the reaction system is sequentially provided by the secondary source to form a diamond or DLC layer on the material region. . [Materials area (Fig. 2A)] Fig. 2A is a cross-sectional view of a typical processing substrate 200 processed according to one or more of the process steps described in Fig. 1 according to the method of the present invention. It shows a substrate 202 with a top surface 204, a secondary material area 206 formed under the substrate surface, and a primary material area 208 -41 formed under the secondary material area 206-(Please read the precautions on the back before filling in this Page) δ. Order 11 j This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) AH Modified + Month ~ S8.1ir8 —: 5. Description of the invention () 41, and on the surface of the substrate The produced forging layer 210. For example, the process steps A'B, D, and rhenium (of FIG. 1) may be performed in private to obtain the processed substrate 200. As described above, the thickness (d2) of the secondary material area 206 is generally smaller than the thickness (dl) 'of the main material area and the concentration of the synthetic substance is greater than the depth (d) of the β material area of the main material area. d2 = d The thickness of the plated layer is “t”. [Multilayer Plating (FIG. 2B)] FIG. 2B is a cross-sectional view of a typical processing substrate 220 processed according to one or more of the process steps described in FIG. 1 according to the technical method of the present invention. A substrate 222 having a top surface 224 is shown, and a first plating layer 226 is formed on the surface of the substrate and has a thickness of “tl” (for ease of illustration, the main material area and the auxiliary material area are omitted in this figure), and are formed in the aforementioned first A second plating layer 228 with a thickness of "1: 2" on the surface of the plating layer, and a third plating layer 230 having a thickness of "t3" formed on the top surface of the second plating layer 228. Such a processing substrate 220 can be obtained by performing process steps A, B, D, E, and G (in FIG. 1). According to the features of the present invention, a multilayer plating layer as shown in Fig. 2B can be easily produced. For example, the first plating layer 226 can be formed by the composition of the constituent elements of the matrix, and the first secondary element can be introduced into the reaction system through the secondary source; the second plating layer 228 can be formed by the composition of the constituent elements of the first plating layer 226 The second secondary element is introduced into the reaction system through a secondary source; the third plating layer 23 ′ may be formed from the composition of the element formed in the second plating layer 228 and the third secondary element is introduced into the reaction system through a secondary source. According to this application, a multilayer coating with a predetermined material composition can be produced β -42-This paper size is applicable to China National Standard (CNS) A4 specifications (210X297 mm) — (Please read the precautions on the back before filling in this page j- Order-Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the Invention () 42 This shows the flexibility and controllability of this reaction system, which means that 'the nature and composition of the produced mineral layer can be light and easy The ground is determined only by introducing a series of different auxiliary elements into the reaction system. It will be clear from the following discussion that many additional features in the technical method of the present invention allow a high degree of control over the strength of the material composition and Selectivity, including the production of bond layers. [Energy Source (Figure 3)] Figure 3 depicts the operation diagram of the surface treatment system 300 according to the present invention. Two separate and different lasers 312, 314, and 316 each pass through their respective The beam transmission system (BDS) 322, 324, and 326 irradiate the surface 304 of the substrate 302. As shown in the figure, the irradiated beam is concentrated on a selected area 330 on the substrate, indicating the base Selectable areas on the surface (each smaller than the entire surface). In order to treat the entire substrate surface, (a) the selection area (33) must be equal to or larger than all surface areas on the substrate surface, or (b) must provide the substrate And the movement between the beams is enough to "scan" the entire surface of the substrate to select the processing area. In this figure, the substrate can be moved with respect to the direction of the beam indicated by arrow 332, so that the selection area where the beam is focused follows arrow 334 The finger moves in the opposite direction to a surface area larger than a selected area of the substrate. Those skilled in the art will understand that a robotic arm / automation / positioning mechanism can be used to cause this relative movement between the substrate and the beam, and its scanning path can be any Appropriate methods to control. For example, the substrate 302 can be held by a positioning mechanism 'for example: at the end of a multi-axis robotic arm (such as: X, y, ζ)' In this case, this mechanism can Moving in any direction of χ, y, and ζ, which is useful for dealing with the complex geometry of a substrate and multiple surfaces. For planes with fairly flat surfaces In terms of matrix, -43-This paper size is applicable to China National Standard (CNS) 8-4 specifications (210X297); (&quot; &gt;: Read the first one; then fill in the ^ -item --- I ' ^ '. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs

nn m ^ —-I 1 I-II 1 —I: I A7 B7 43 V. Description of the invention (--------— (Please read the notes on the back before filling this page) With a simple mechanism Such as: χ-γ positioning table to move the substrate is acceptable. However, this kind of movement is also necessary for some specific applications that need to shape the shape 'including controlling the focus and angle of the beam. Those skilled in this art will understand This scanning of the beam itself can be done under computer control (with an appropriate galvanometer or similar device), and can follow any given path, at any time, on any part of the surface area of the substrate, and the energy intensity and The choice of focus can also be controlled. In some applications it is best to have a device that can scan the beam and a multi-axis substrate positioning mechanism to achieve the desired result. The advantage of using a robotic arm mechanism to move the substrate is the same robotic arm It can be used to retrieve (retrieve) the substrate to be surface treated and to place (transmit) the substrate after the surface treatment. Those skilled in the art can understand that such movement of the substrate can be done under computer control and can make Beam Follow any ideal path, according to any part of the surface area of any substrate. Laser energy sources 312, 3: U and 316 can be controlled by computer numerical control on the beam path by suitable known optical elements. Achieving the functions of focusing, diffusion, focusing, divergence, transportation, etc. Such optical elements are generally represented by a beam delivery system (BDS) 322, 324, 326. Each of the three lasers used in the surface treatment of the substrate will contribute to the entire Response. Generally speaking: The first -312 (secret 1) printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs is the time to evaporate the constituent elements (to create a gas phase) and destroy the chemical bonds of the evaporated constituent elements. -A laser is preferably an excited atomic laser operating at 192, 248, or 308 nm. This type of laser is useful for evaporating any constituent element. In most cases, an excited atomic laser is Evaporation of constituent elements and on the surface of the substrate -44-

Year, month, and fifth, Invention Description () 44 played a leading role in starting the initial gas reaction (PGR). In some cases, the role of an excimer laser can be assisted by another laser (such as 314. • The second 314 (laser 2) of the three lasers is mainly used to drive the diffusion function ( Such as: Step B), and balance the stoichiometry of the hot gas reaction and the gas phase reaction. This laser is best Nd: YAG laser 'and usually plays a supporting role as the leading role of the excimer atomic laser. In this case, Nd: YAG laser can also assist in the evaporation of constituent elements, especially in the case of bright (reflective) materials; in addition, in some cases Nd: YAG laser can also play a leading role, and by Excited atom lasers are used to assist (ie, for some substrates and coating materials, the roles of exciter atoms and Nd: YAG lasers are interchangeable). Generally speaking, exciter atoms and Nd: YAG lasers are used When the evaporation of the constituent materials is initiated to balance the reaction, the interaction between the two lasers will make this reaction technique out of balance. It is advantageous to use two lasers to assist the reaction in any case &quot; for example, To form a diamond film, exciton atoms Larger power and pulse performance are usually more expensive to start this gas phase reaction, and is assisted by Nd: YAG laser. Printed by the Consumer Cooperatives of the Central Bureau of Standards, Ministry of Economic Affairs • The third of the three 316 (laser) 3), preferably C0 laser, is used to balance the thermal, physical, gas and chemical reactions occurring on the surface of the substrate. The basic role of C0 laser is to provide thermal equilibrium and avoid thermal gradients in the reaction gas. C0 laser can also provide the minimum temperature balance in the gas reaction and affect the reaction temperature. ① Laser can also provide a synergy between the reaction that occurs on the substrate surface and the gas reaction that occurs on the substrate surface. In this case (ie using certain matrix materials-45-This paper size is applicable to Chinese National Standard (CNS) A4 specifications (210X 297 mm)> Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 ___ B7_ V. Description of the invention (45 )), (: 02 laser can also be used to start the reaction (that is, take over the role of the excitatory atomic laser in this function). Although the laser shown in Figure 3 irradiates the beam from different angles to The quality selection area is 33 ° (focus point is 33 °), but in the present invention, the light beam can be irradiated onto the reaction area with the same sleeve. Generally, due to the synergy between the three lasers, they should all be irradiated To the same point on the substrate (330). [Sub source (Figure 4)] Figure 4 depicts a surface treatment system 400 that is particularly well-suited for introducing one or more secondary elements. In this figure, three lasers (Eg, the lasers 312, 314, and 316 in Fig. 3) are combined into a component 410, and the light beam is transmitted through a beam delivery system (BDS) 412. These light beams are irradiated on the substrate 402 (relative to 302) The surface 404 (relative to 304) is on the selected area 43 ° (relative to 33 °), and the relative movement between the beam and the substrate 402 is represented by arrows 432 and 434 (relative to 332 and 334). 0 In the surface treatment system 400 of FIG. 4, at least one secondary source (secondary source 1) 42 is provided. There can be many ("N") secondary sources, as shown by the secondary source (secondary source N) 422. One or more secondary sources introduce one or more of its secondary elements into the reaction system (the constituent elements of the matrix are regarded as the main source of the reaction), and the secondary elements can be gas, vapor, powder or other suitable forms to enlarge Reactions that occur directly in the reaction zone on the substrate surface. The secondary element may be provided by a nozzle to irradiate the secondary element stream onto the reaction zone so that the secondary element promotes the reaction driven by the laser beam. It is best to irradiate the secondary elements on the substrate and the same area as the laser beam (43〇) — 4 6 A paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) e) year 袈 — (please first (Please read the notes on the reverse side and fill out this page)--1T consumer printing cooperation with the Central Standards Bureau of the Ministry of Economic Affairs, printed A7 __B7 V. Description of the invention (46) '_ ~-' But you can also take the secondary source on the substrate A selection, or "submerged" the matrix (ie, the entire surface of the matrix) with only secondary elements. In the element introduction reaction, a plating layer can be formed on the surface of the substrate) Step E in the manufacturing method flow. It can be borrowed from any of many known devices, such as spraying, spreading, depositing, dissolving, or known devices, and in any suitable form, such as liquid, gas, solid, plasma, powder, etc. To introduce side elements into the reaction system. For example, a gaseous secondary element can be introduced into the reaction system using a pressurized nozzle (ejector). This nozzle is designed to convey a gaseous secondary element surrounded by another gas (such as an inert gas). The spiral control vortex of the gas in the nozzle (jet tube) gathers and negatively transports the noble elements. In this way, the secondary element can be placed in the same matrix selection area as the incident energy beam. According to the features of the present invention, both the gaseous secondary element (ss) and the surrounding (isolation &gt; gas (SG) can be used as a secondary element in the reaction. To element can also be selected when no secondary element is required in the production (for example : The "isolation" (isolation of the environment, no need to use a vacuum) in steps C, F and Η) of the above manufacturing process, where the secondary element (and surrounding gas) can be a clean gas or an inert gas. The isolation function does not necessarily have to be, [Nozzle Design (Figures 5, 5A and 5B)] Figure 5 depicts an example of a nozzle 500 suitable for introducing gaseous secondary elements (from a secondary source) into the reaction system. In this embodiment, the nozzle 500 is suitable for injecting three different gases: gaseous secondary element (ss), barrier gas (SG) and "buffer, gas (BG). 〇-4 7 _ This paper size applies to China National Standard (CNS) A4 specifications (210X297mm) (Please read the notes on the back before filling this page)-^ ------------------- Order ------ Central of the Ministry of Economic Affairs Imprint A7 B7, Consumer Cooperatives of Standards Bureau V. Description of Invention (47) Nozzle 500 is ring-shaped, with Ring body 508 and central axial channel 506. In use, the nozzle 500 is placed on the surface of the substrate being processed. As shown in the figure, three laser beams El, E2 and E3 can pass through the central channel of the nozzle. The substrate is irradiated. In the embodiment 500 of this nozzle, a barrier gas (SG, such as krypton) is introduced through the lower (close to the substrate surface) inlet 530 of the nozzle, and circulates in the nozzle body through the annular flow channel 532, and It is discharged to the central channel (inner diameter hole) of the mouthpiece through the outlet 534. The secondary source (SS, such as carbon dioxide) is introduced through the middle inlet 52Q of the nozzle, circulates in the nozzle body through the annular flow channel 522, and through the outlet port 524 Discharge to the central channel of the nozzle. Since the element is sprayed above the barrier gas, the secondary elements will be placed in a state that reacts with the laser energy (El, E2, E3), and for this reason the barrier gas is surrounded (surrounded). Buffered Gas Crossbone (BG), similar to a sensitizer, can be introduced together with the secondary source. If necessary, this buffer gas is selected to assist the transfer of energy from the laser beam to the secondary source and serve as the secondary source of destruction The previous buffer. As shown in the figure, the buffer gas is introduced through the upper inlet 510 of the nozzle, circulates in the nozzle body through the annular flow channel 512, and is discharged to the central channel of the nozzle through the outlet 514. Since the buffer gas is It is sprayed from the nozzle above the secondary source, so this gas will absorb the laser energy (E1, E2, E3) to transfer into the secondary source gas. The nozzle 500 is placed at a distance "h" above the substrate so that The gas reaction has sufficient time (eg, transfer rate multiplied by time) to complete between the nozzle and the substrate. Figures 5A and 5B depict the nozzle 55 that can transfer the secondary source (SS) gas and the barrier gas (SG &gt;) to the processing system. (Such as: in tungsten carbide-48-this paper size applies Chinese National Standard (CNS) A4 size (210 X 297 mm) (Please read the precautions on the back before filling out this page)) Order A7 B7 5 2. Description of the invention (48) The embodiment of making a diamond coating on a substrate is substantially similar to the embodiment 500 in FIG. 5, in which the nozzle is ring-shaped and has a central channel for a laser beam (as shown in FIG. SB). It is indicated by a single arrow "beam," via these gases on the surface of the substrate to be treated. In this embodiment, the nozzle mouth 55 is constructed by two flat ring-shaped nozzle bodies 552 and 554 stacked in a "sandwich" manner, in which 552 is placed above the MA. The upper nozzle body 552 has an inlet 561 can receive the secondary source (ss &gt; gas, an annular flow channel 562 can circulate the secondary source gas evenly (in a dynamic fluid manner) in the upper nozzle body, and many are located approximately at the inner aperture (ID) of the nozzle body The outlet 564. As shown in Figure SA, the outlet is in a tangential direction with respect to the axis of the nozzle body, so that the blasted secondary source gas flows in a vortex shape (as shown in clockwise direction in Figure 5A). As shown in Figure SB The secondary source gas is preferably discharged from the plane (coplanar) of the nozzle 552. This allows the secondary source gas to be as close as possible to the incident laser beam energy (BEAMS), so that the reaction of the secondary source gas can occur immediately. It is obvious from the above discussion It can be seen that the nozzle 55 is a considerable distance above the surface of the substrate (such as "h" in Fig. 7) for the purpose of searching for humiliation after the reaction of the secondary source. Under the nozzle body 554 The port 58 is introduced, flows through the flow channel 582 and circulates in the lower nozzle body 554, and is discharged to the channel of the nozzle body through many outlets 4. The channels located between the two nozzle bodies 554 and between them are concentric, and it is best It is the same size. As shown in Figure SB, the direction of the outlet 584 of the isolation gas is directed downward toward the substrate to be treated. The outlet 584 can also make the discharged secondary source gas flow in a vortex relative to the tangential direction of the nozzle body axis. (As shown in clockwise direction in Figure 5A). This will produce a "swirling vortex to isolate the gas, a 4 9 1 paper size applicable to the Chinese national standard) 8 secret (2ΐ〇χ297 public envy) (Please read the precautions on the back first (Fill in this page again) ------------ ot ------- IT ---- Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs-Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs- ---. SB. 11 8. Ir V. Description of the invention () 49 (shown as line 590), and surround the secondary source and move it towards the substrate β In order to simplify the operation of the nozzle bodies 552 and 554, the flow channel 562 And 582 are shaped by extending the grooves to the lower surface of the respective nozzle body The lower surface of the mouthpiece 554 is in close contact with the groove (flow channel 562) of the upper nozzle body 552 and the annular plane 592 with a central opening is in close contact with the groove (flow channel 582) of the lower nozzle body 554. [Pretreatment (Figure 6A, 6B)] Generally, it is better for the substrate to prepare the surface to be forged in advance. It can remove the grinding marks and contaminants that appear on the surface. 磨光 和 化学 # Engraving is performed before Conventional methods of processing. Generally, chemical etching of substrates must deal with some dangerous chemicals and generate toxic waste, which leads to increased complexity of the substrate plating system. In addition, each substrate composition requires a separate chemical to perform such an etching. According to the present invention, the same laser that is already in place for the coating can be used as a substrate for preparing different types of substrates for the coating. use. According to a feature of the present invention, a surface treatment system (such as 300) can be used not only to perform surface treatment on a substrate surface, but also to perform pretreatment. Generally speaking, relative to gas, this is only a matter of controlling the process parameters of laser. 6A and 6B illustrate how to perform a pretreatment of a substrate in connection with the surface treatment process of the present invention. The previous processing flow may be performed before or simultaneously with the surface processing process described in FIG. 1. According to the present invention, the pretreatment method of the present invention can be used as a "pioneer" for the subsequent plating process (including CVD method) on the substrate surface. -50-This paper size is applicable to Chinese National Standard (CNS) A4 (210X 297mm) (Please read the precautions on the back before filling this page) V mu fm n ^ — IT--! ------ ---------- Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (5l Generally speaking, as shown in Figure sA, the tungsten carbide matrix 602 is surrounded by cobalt 632 And covered tungsten carbide particles 63. As mentioned above, the presence of cobalt can cause troubles to the formation of diamond plating on the substrate. This is especially troublesome when it lies on the surface of the substrate. According to the features of the present invention, here This kind of substrate may cause changes in the surface chemical properties. For example, the chemical properties of the tungsten carbide substrate may be changed to have stable nitrogen ^ cobalt. According to the features of the present invention, a laser (such as an excited atomic laser) is used to The substrate is pre-treated to melt the cobalt (and some carbonized ore) on the surface of the substrate ', so that the hafnium carbide particles 634 become visible, and then perform other metallurgical functions described below. In addition, cobalt can also be obtained by reaction. Stable Cobalt Nitride. Meltable Cobalt And make some [react with ⑶ to form stable carbon nitride or cobalt nitride. It can also introduce nitrogen to form cobalt tritide during pre-treatment, change the surface chemical properties of the substrate, and form stable cobalt nitride or Tritium carbon is used to assist the crystallization direction and obtain planar diamonds exceeding 〖_〇_〇. In the existing techniques, CBN is usually produced first to prepare the surface of the substrate, and then 1-0-0 (100) planar diamonds are produced. 6B represents the pre-treated tungsten carbide matrix (602). The figure also shows that the previous treatment process will make the peaks of the condensed tungsten particles into the desired roundness. This method (that is, the surface treatment to be performed / Coated substrate before treatment) will produce a variety of advantages. It can remove cobalt from the surface to a minimum or completely eliminate it, can remove wear marks and impurities from the surface, and can control and modify the exposed tungsten carbide. Structure. In general, before performing a surface treatment (such as plating), this pre-treatment process is performed, and the subsequent surface treatment process can be loaned to the surface of the substrate to be treated (such as- 51 — This paper size applies to China National Standard (CNS) A4 (210X297 mm) ^ ------ IT (Please read the precautions on the back before filling out this page) Printed by the Employees' Cooperatives of the Central Sample Bureau of the Ministry of Economic Affairs Install if λ spine: 5. Description of the invention (ς1) 3 丄 constant, repeatable characteristics and more easily controllable. As shown in Figure 6B, a subcutaneous layer extends to the depth d 'has been removed. Usually, this is the precursor of the material area described above. Figures 11A and 11B are also illustrations of the pretreatment process, which will be described below. The details of the other process parameters will be described in detail in the examples below. In addition to the exposure and rounding of tungsten carbide particles, the pretreatment process of the present invention can still achieve metallurgical changes inside the surface of the substrate. For example (recalling sintered carbide), diamonds with a crystal orientation of 1.0.0 (100) can be formed. This diamond will be used as a highly ideal crystal for the subsequent process of forming a diamond (or DLC) coating on the surface of the substrate. Nuclear forming abutment. Again, this is independent of the method used for mirror-coated substrates, but it is very useful for CVD and similar methods. However, the use of the coating formation process of the present invention will obviously result in synergistic effects and exponential results, because the same laser equipment is used for the pretreatment (preparation, characterization) and treatment (making the coating on) the substrate. In addition, (again, in the case of cobalt sintered tungsten carbide matrix), the pretreatment process of the present invention is very advantageous for forming a carbon + halide + cobalt chloride complex or the aforementioned valley alignment orientation between tungsten carbide peaks, and this Will be very suitable for subsequent plating operations (or at the same time forming a coating). [Surface treatment and pre-treatment system (Figure 7)] The above has been the entire manufacturing process (Figure 1), the use of three lasers (Figure 3), the introduction of secondary sources (Figure 4, 5, 5A, 5B) and Pre-processing (Figures 6A, 6B) is explained in detail. Figure 7 describes a complete surface processing system 700, which is used in conjunction with the three laser processes shown in Figure 3, including the introduction of one or -52-as described in Figure 4. The size of this paper is applicable to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling this page)

Is. To print A7 from the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. _____B7_ V. The secondary source on the description of invention (52), combined with the relatively narrow nozzle design as shown in Figures 5A & 5B, it is suitable for the implementation shown in Figure 1. The entire process steps and are suitable for implementing the pre-processing discussed with respect to Figs. 6A and 6B. This surface treatment system 700 includes three lasers: a UV-excited primary laser (laser 1) 712, an infrared _:? &Amp; 0 laser (laser 2) 714, and an infrared C02 laser (laser 3) 716. Each laser emits a light beam, which is directed through the opening of the nozzle 722 to the surface of the substrate 702. The nozzle 722 has an axis line 72 3 which is preferably perpendicular (90 °) to the surface of the substrate 702. Excited atomic laser 712 is directed at the substrate surface at a first angle “θ 1”, Nd: YAG laser 714 is directed at the substrate surface at a second angle “θ 2”, and C02 laser 716 is directed at a third angle "Θ3" hits the surface of the substrate. In an exemplary embodiment of the present invention, the first angle β 1 = 0 ° (parallel to the concentric line of the nozzle), and the second angle θ 2 = 30. And the third angle θ; B = + 30. . However, the three laser beams can pass through the opening of the nozzle to be coaxial or parallel to each other (that is, θΐ, θ2, θ3 = 0.) The emitters are still within the scope of the present invention. The nozzles &quot; 722 are disposed at a distance "h" above the surface of the substrate 702. A gaseous secondary source (SS) 72 (for example, a carbon-containing gas such as carbon dioxide gas) is supplied through a nozzle 722, and a shielded (isolated) gas (SG) 724 (non-reactive or inert gas such as nitrogen, helium, argon, etc.) Etc.) are also provided via nozzles. Generally, the three laser beams are emitted through a nozzle and focused on a selection area of the substrate 702, as described above with reference to FIG. 3. However, it is still within the scope of the present invention to adjust the size of the three laser lights so that each beam can completely cover the entire surface of the substrate (the selected area includes the entire surface of the substrate). In this embodiment, the substrate is a rectangular substrate with "χ ,, and" γ, "the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page )-} J ^^^ 1 ml ^^^ 1 ι ^ ϋ n ^ i- mu 1 ^ m · m ^ l ^ -r-ejnn 11 _. ^^ 1 n ^ n A7 B7 V. Description of the invention (53 ) Dimensions and are moved along the Y axis during surface treatment. In use, the gas (720, 724) is turned on directly above the surface of the substrate 702 and below the nozzle (as viewed) to form a plasma (not shown in this figure, please refer to Figure 8). As before, the secondary source is converted in the plasma along the vaporized constituent elements to form a coating on the surface of the substrate. In general, the role of the excitatory atom laser 712 is to complete surface melting, destroy secondary sources (SS), and heuristic bond formation and growth (cause) a coating on the surface of the substrate; and Nd: YAG laser 714 assists the excitatory atom Laser 712 destroys the secondary source gas and plays an excellent role in diffusion; while CO2 laser 716 helps maintain the thermal equilibrium of the reaction in the plasma and on the substrate. Keeping this in mind, although all three laser beams preferably penetrate the nozzle, it is also within the scope of the present invention to direct the beam from the C02 laser 716 into the plasma without going through the openings in the nozzle. [Matrix support and flat plasma (Fig. 8)] Fig. 8 shows a preferred form of the supporting device of the substrate 802 to be treated and the plasma generated during the surface treatment process. Printed by J Industry Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). A significant advantage of the present invention is the ability to form a flat plasma that is very close to the surface of the substrate being processed. In addition, this flat Plasma can surround the corners of the substrate, and is beneficial for coatings on round tools such as drills. Plasma “transfers” secondary elements to the surface of the substrate and ensures that the substrate is locally heated in large quantities. In this embodiment, the substrate 802 is placed on a support 804 having a button-like protrusion 808 extending upward from the top surface (as viewed). The protrusion 808 is preferably smaller than the area of the substrate supported, and the substrate is concentrically placed on the protruding -54 — this paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) A7 B7 V. Description of the invention (54) On the top surface. A vacuum channel 810 passing through the support 804 is suitable for "holding" (holding) the substrate on the support, and is very suitable for performing automatic substrate processing operations in a production environment. The plasma shown in Figure 8 is produced by a surface treatment system as described in conjunction with Figure 7. This plasma is a "flat" plasma that is usually coplanar with the surface of the substrate and is controlled to have a minimum vertical ( By observation) stretch. By generating a flat plasma, vaporized constituent elements (from the substrate) and secondary elements (from the secondary source) can be properly controlled and confined to the surface of the substrate to be treated. The morphology of this flat (low) plasma and its direct contact with the substrate surface are conducive to allowing (growth) a coating directly on the substrate surface. In other words, the flat plasma interacts with the surface of the substrate. This is in contrast to the CVD system where the plasma shape is like a high cylinder, and the plating layer is like "falling rain" on the surface of the substrate, and allows the plating layer to be formed at a relatively high plating rate. An extremely significant advantage of the invention produced by the flattened plasma is that such a flattened plasma can be formed, and vacuum holding can subsidize the formation of this flattened plasma. Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). In addition, as shown in Figure 8, the plasma generated by the method of the present invention can cause Every perimeter. This enclosing of the plasma (the peripheral edges of the substrate) can be enhanced by providing a plurality of auxiliary vacuum channels 814 penetrating the support, and the outlets of these channels are located on the top surface of the support outside the protrusion 8 0 but in the area below the substrate. . The same (or additional) vacuum used to maintain the substrate on the support can be used to increase (enhance) the effect of the plasma surrounding the periphery of the substrate. The reaction mechanism achieved by the combination of laser and plasma can be divided into "pyrolysis" and "photolysis". Generally, in the pyrolysis mechanism, the laser has the following functions: (a) locally heating the substrate to cause the coating Induced heat on the surface -55-This paper size applies to China National Standard (CNS) A4 (210X 297 mm)

V. Description of the invention (55) Printing cooperation response of the employees of the quasi bureau of the Ministry of Economic Affairs of the Ministry of Economic Affairs; (b) the laser energy can also be initially stimulated to absorb non-decomposable skin-state reactants; (C) ) The substrate and gas can be heated at the same time; (d) When the laser directly heats the substrate, the gas near the surface is heated and decomposed by the diffusion and convection mechanism. Generally speaking, in the photolysis mechanism (or photochemical process), laser has the effect of decomposing gas-phase or surface adsorption molecules to form deposited atoms or intermediates, and a large amount of heat heats the surface of the gas or substrate. Laser excitation can occur by absorption—UV photons or the absorption of several visible or UV photons to stimulate electron transfer. In the latter case, absorption can occur in a synergistic manner, such as multi-photon absorption, or in a sequential manner, and the fact can include the way in which photons are absorbed by intermediate products. The photolysis products can be further decomposed by the pyrolysis process. Generally, the output of an excimer laser can be effectively absorbed by carbon dioxide (such as from a secondary source), which will cause a photochemical reaction to break the C_〇 bond to form a diamond film or an invalid intermediate. Because the carbon dioxide phase is interrupted by: YAG laser output is essentially transparent, and this Nd: YAG laser output is mainly absorbed by ineffective intermediates and substrates made by an excimer atom laser, or some kind of film covering the substrate. of. [Manipulating the system (Fig. 9)] Fig. 9 roughly illustrates a whole surface treatment system 900 (same as the system 700). In the figure, a substrate 902 is arranged below the nozzle (for convenience of explanation, the (Omitted in the diagram), the energy from the laser 910 is irradiated on the substrate. The paper size applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) -------- W-- (Please read the back first Please pay attention to this page and fill in this page again)-Order A7 B7 printed by the Employees' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs on the description of the invention (56), in the surface of the substrate and immediately above the surface of the substrate (including the formation of flat plasma) Generate a reaction effect, introduce one or more auxiliary elements from one or more auxiliary sources 92 to enhance the reaction on the substrate, and the substrate can be rotated by a multi-axis positioning mechanism 930 (for example: a multi-axis robotic arm) to rotate The operation of these components is controlled by a controller 94 (such as an appropriate programming computer). Importantly, the system can time the timing of each laser 9 10 (for example, the sequence of turning on and off) ) And by The relationship between the pulse waves delivered by the lasers is controlled. [Examples] The following are examples of performing a tungsten carbide (hard alloy) substrate pretreatment and forming a diamond coating using a surface treatment described in conjunction with FIG. "There are many variables in any such method. The" know-how "of this method is different because of the difference between one substrate (such as material, geometry, size, etc.) and another substrate. For example, Kabac〇 In the if patent (No. 5,176,788), it is appropriately noted that in general, with this method, there are many variables, complex and interrelated, making calculations or predictions often difficult. Generally, a better way is Within a reasonable range of parameters, try different process parameters to observe the results obtained and optimize this process empirically. Generally, the device for generating a layer on a substrate according to the present invention consists of three lasers. Structure, each laser has its own beam (beam) output system (BDS). The device uses a nozzle to encapsulate one Shield) The secondary source (SS) in the gas (SG) is ejected, and a flat plasma is generated on the surface of the substrate. In particular, the diamond coating is made on the tungsten carbide substrate (please read the precautions on the back first) (Fill in this page again.) H— — ^ 1 1_1 ^^ 1 I m · ^^ 1 m-—I— I ^^ 1 ^^ 1 n. I--, ejIn n-m --- Central Standard of the Ministry of Economic Affairs Printed by the Consumer Cooperative of the Bureau A7 B7 V. The description of the invention (57) states that the substrate can be pre-treated so that it can be plated by any suitable method, including the method of the present invention, to form a coating on the substrate. Or complete the surface treatment process including a pre-treatment operation and a plating operation. In the following embodiments, a flat carbide cutting tool insert (insert blade) substrate (substrate) is pretreated or treated (ie, pretreated and plated) to form a diamond (or DLC) coating. For simplicity, it is assumed that the entire substrate is processed at once (ie, the beam size is sufficient to "flood" the entire substrate area). A surface treatment device as described in conjunction with Figs. 7 and 9 is used here. Fig. 10 is a processing timing chart illustrating a method of pre-treating a substrate to subsequently form a plating layer (or depositing a plating layer by a method such as CVD). Fig. 10A is a processing timing diagram illustrating a method for simultaneously (in-situ) pre-treating a substrate and forming a coating. FIG. 11A is a photomicrograph illustrating the surface of a carbonized crane cutting tool insert (matrix) before performing such a pretreatment and FIG. 11B is a photomicrograph of the carbonized crane substrate of FIG. 11A after the pretreatment. As shown in Fig. 11A, the surface of the substrate is covered with abrasion marks and impurities. As shown in Fig. 11B, the surface of the substrate is free of any wear marks and impurities, and the tungsten carbide grains are exposed in the cobalt valley (compared with Fig. 6B). As shown in FIG. 10, the pretreatment method of the present invention only involves an excimer atomic laser, and the ablation system is appropriately evacuated with a thorium protective gas, and the thorium protective body is appropriately introduced through a nozzle (550), however, It can also be introduced through another simplified nozzle (not shown) across the surface of the substrate. -58-This paper is again applicable to China National Standards (CNS) A4 specifications (210X297 mm) -------- ίν 衣-(Please read the precautions on the back before filling this page)-Order Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the Invention (58) Figure 10A is a processing sequence diagram illustrating the laser and auxiliary beam sources in a complete surface treatment method including pre-treatment and coating production And the coordination of protective gas. As shown in FIG. 10A, generally, the three types of lasers (excitation atomic laser, Nd: YAG laser and C0 2 laser) and two gases (C0 2 as the secondary source and heart as the protective gas) are consistent. Operate to perform two "jobs", a pre-treatment job and a surface treatment of a plating job. Figure 10 is a diagram illustrating the time when each of these components is turned on and off. The numbers on the timing diagram (for example: "0", "12", "25", etc.) represent seconds. As discussed in conjunction with Figs. 6A and 6B, the surface treatment apparatus of the present invention can be suitably used for substrate pretreatment. Fig. 10 illustrates a pretreatment sinker with a time interval of about 20 seconds between "PO" and "P1", in which only an excimer laser (eg, &quot; 712) is used to pretreat the substrate to Prepare the substrate surface for further processing. As shown in FIG. 10, during the pre-treatment phase, the plutonium (protective) gas is turned on at the same time to discharge the ablation material (cobalt, oxide) from the substrate. It is best to retain the plutonium gas for a short time after the exciter atomic laser is turned off. Time (from "P1" to "P2") to ensure that the ablation material is completely removed from the substrate surface. As shown in FIG. 10A, in general, a surface treatment method that combines pre-treatment and plating manufacture can also be performed. At this point, the surface treatment is started at "to". During the entire surface treatment process, when the time "t0" is extended to the time "t5", the excited atomic laser (for example: 712), the secondary source (for example: 720) and the protective gas (for example: 724) are turned on. In the entire surface treatment process (from "t0" to "t5"), it is usually -59-This paper size applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) -------- © ^ Λ 衣-(Please read the notes on the back before filling in this purchase)-Order printed by the Consumers Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs, printed A7 B7 V. Description of the invention (59) Operate the excited-state atomic laser according to the parameters set above However, during the capping operation, the "fly-over" can be used to adjust the exciter atomic laser output to significantly start the pre-processing operation (at intervals of "to" and "tl ,," and from time t3). Possible disconnected Nd: YAG laser gains "tasson" (discussed below). During this surface treatment process, the excimer atomic laser system operates properly at a pulse frequency of 45 mJ at 28 Hz. As shown in FIG. 10A, it is generally not necessary to turn on the Nd: YAG laser immediately at "t0" (for example, ^ 4). Instead, it can delay its first entry into the method (plating operation) by a short time interval ( For example: 5 seconds). Generally, during this interval ("t0, to" tl ") where only the excitatory state is given, a leading (leading edge) region of the substrate can be pretreated (see, for example, Fig. 12b). Similarly, ' The participation of Nd: YAG laser is unnecessary during the entire mirror coating operation, and this will cause an early exit at "0," which is about 10 seconds before disconnecting the excited atomic laser (for example: 12) . Similarly, as illustrated by FIG. 10A, it is not necessary to turn on the C02 laser (for example, π6) immediately when “t〇” is needed. Instead, it can delay its first appearance into the method by a short time interval ( For example: 12 seconds). Similarly, during the entire processing stage (: 02 laser participation is unnecessary, and this will cause an early exit at "t4", which is about 5 off before the excitatory atomic laser is turned off. Seconds 0 In particular: 1. The first laser: the excimer atomic laser plays a major role in the surface ablation (melting) and destroying the chemical bond in the secondary source (for example: co2), and has the following electron beam transport parameters: _ 6 0 A paper standard common Chinese National Standard (CNS) A4 specification (210 X 297 mm) -----n-n-"Dong-I (Please read the precautions on the back before filling this page)-Order Printed by A7 _____B7 of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (7 ~~~~-a. Wavelength l92nm '248nn ^ 308nm (nm), which belongs to the ultraviolet range of the wavelength, preferably 248nm; b. The power output is up to 200w (watt), especially 100w (a lower For example: 75 W can be used in a circular cutter). C. Pulse energy is up to 500mJ (millijoules), especially 45mJ. D. Pulse sequence frequency (repetition frequency) can be up to 3 〇Hz (Hertz), especially 280 Hz is preferred; e. The energy density is up to 30mj / mm2, especially 25mJ / mm2; ί. The pulse duration is up to 26ns (nanoseconds), especially 18ns is preferred. G. The electron beam pattern is rectangular; and the h · divergence is 3.5 milliradians (1 ^ 3 £ 1). The electron beam output system (BDS) of an excited-state laser includes a shape lens. To output a circular electron beam (focused beam) with a size of 1 mm Xl / 2 inch, the lens is placed approximately 18 inches upstream (toward the laser) of the nozzle aligned with the nozzle axis. Pretreatment only During operation (eg, Fig. 6B), the excited atomic laser is pulsed at 100 Watts at a frequency of 22-50 Hz, and the pulse is turned on at 350-380 mJ for 20 seconds, and the surface is ablated (removing the surface texture Marks and impurities to remove cobalt from a surface area of the substrate.) Complete surface treatment (ie, combining pretreatment and plating operations) , At 100 watts at a frequency of 28 Hz, pulsed at 45 mj, turn on the laser of the excited atom for 45 seconds, and perform (i) to react and break the chemical chain in the secondary source (c0) In the opposite, (ii) triggers synthesis for bonding and growth.

2. The second laser: Nd: YAG -61 which plays a major role in the diffusion function _ This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) -------- k— ( Please read the precautions on the back before filling this page). Order · A7 B7 V. Description of the invention (^) ~~ 〇1 The laser can appropriately have the following electron beam transmission parameters: a. Wavelength is 1.06 microns (E_6 seconds), in the infrared range of each wavelength; b. The power output is up to ^ ⑽ watts (w), preferably 1,000 watts; c. The pulse wave energy is up to 丨 5. Joules, preferably 50 Joules; d. Pulse wave order frequency, continuous wave (cw), pulse balance series, or q exchange up to 1000 Hz (Hertz), preferably 120 Hz; e Pulse duration is up to 20 microseconds, preferably 1 microsecond; f. Electron beam pattern is circular; and g. Diffusion is 55 mrad

The Nd · YAG laser electron beam delivery system (BDS) includes a circular lens to transport a circular electron beam (diffusion type) with a diameter of 1/2 inch. The lens is located approximately 1S inches upstream (toward the mouth) Laser direction) The angle from the nozzle axis is approximately ~ 30 ° (30 ° in one direction). When only the pre-treatment operation is performed, ’Nd: γ AG laser is not operated. In the overall surface treatment method including pre-treatment and plating operation,

Nd: YAG laser is at least part of the process (see Figure 10, for example: tl to "t3") is on. At this time: YAG laser, at 1000 Watts, frequency 12Hz Pulse balancing is turned on 5 seconds after the exciter atomic laser is turned on to: (i) support the exciter atomic laser to break the bond in the secondary source (c0), and (ii) complete diffusion bonding Basic (or sole) role. 3. The third laser: The Co2 laser, which plays a major role in maintaining thermal equilibrium, may suitably have the following electron beam transmission parameters: a. The wavelength is 10.6 microns in the infrared range of each wavelength; -62- This paper size applies to China National Standard (CNS) A4 (210X297 mm) (please read the precautions on the back before filling out this page)-Order printed by the Central Standards Bureau of the Ministry of Economic Affairs and printed by the Bayer Consumer Cooperatives V. Invention Explanation (62) b. Power output is about 500 to 10,000 watts (W), preferably 2000 W; c. Pulse sequence frequency up to 25Hz, pulse up to 25 microseconds; super pulse frequency up to 20 KHz (thousands) Hz), and the duration of the super pulse is up to 500 microseconds; d. The energy density is up to 0.32 J / cm2; e. The electron beam pattern is circular; f. The divergence is 1 1/2 mm / m; and g In the pulse flow mode, the pulse flow lasts for 5 seconds. The CO 2 laser electron beam delivery system (BDS) includes a circular lens to transmit a circular electron beam (diffusion type) with a radius of 1/2 inch. The lens is located approximately 18 inches upstream from the nozzle (toward the mine The direction of the emitter) is about + 30 ° from the nozzle axis (30 ° in the direction opposite to the direction of the Nd: YAG laser). 0 The C02 laser is not running during pre-processing only. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) When performing the pre-treatment and plating process, this C02 laser is about 12 seconds after the excimer laser is turned on. After the clock ("t2"), turn on and perform a pulse action for 2 8 seconds at 2000 watts and a superpulse frequency of 1.5 kHz in order to: (i) in the process (the synergy between the surface reaction and the gas reaction ) Maintaining thermal equilibrium (ii) Transforming changes in absorbance during the process (iii) Controlling substrate temperature in 1 ns (nanosecond) order. The C02 laser can be switched off just before the process is finished (eg at "t4"). In general, the pulses of the excited-state laser and Nd: YAG laser work together to "hammer" the plasma components (generate shock waves, stress, and relaxation), especially to decompose the plasma components. For this purpose, the pulse sent by the above two lasers -63-This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) V. Description of the invention (6 3 A7 B7 Phase relationship between punches It is best to adjust (coordination) for the specific application situation of the machine to maximize the effect of cooperative hammering. These parameters are determined empirically at best. 4. Electron beam delivery system: The electron beam delivery system (BDS) rotates the radio beam Go to the surface treatment "cell" (refer to the area where the surface treatment is performed), determine the cross-section and the focal point of the beam, including the lens of each of the three lasers described above. The beam forms a rectangular (cross-section) electron beam, and it is more appropriate to transmit each electron beam-shaped circular (cross-section) electron beam from the Nd: YAG laser and the 0:02 laser. 5. Protection (shielding) Gas: A protective (inert) gas (SG) that separates the secondary elements (SS) from the surrounding environment (such as air). It is more suitable to use nitrogen delivered by a nozzle (such as 55) in a gaseous form. (N2). Preprocess job only In the meantime, radon gas is introduced during the pretreatment period (0 to 20 seconds) at a flow rate of 40 sccm. Nitrogen can remove ablated cobalt or oxides. At the end of the pretreatment operation, radon gas will still be high. Flow for a few seconds to ensure that unwanted (eg, ablated) elements are completely washed away (guided away) from the surface of the substrate. During a complete integrated surface treatment process, radon is used throughout the treatment period (eg : When the exciter atomic laser is turned on for 45 seconds) is introduced at a flow rate of 25 SCCIU. During this process, radon is always stabilized and protected (for example: not affected by the surrounding environment). This process is usually The purpose of the protective gas (for example: nitrogen) is to prevent the formation of residual gaseous substances (to prevent the combination with atmospheric oxygen). The role of the nitrogen protective gas is to: ⑴ prevent the formation of oxides 烧 keep burned cobalt and / or tungsten carbide away Nitrogen-I is formed on the surface and ⑶ when necessary: ---- P ^ J-I (Please read the precautions on the back before filling this page) Ordered by the Central Consumers Bureau of the Ministry of Economic Affairs and printed by the Consumer Cooperatives -64-

Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of invention (α) 64 compounds (for example: two carbon monoxide or two carbon monoxide records) are used to show 1,0, 〇 plane (see, for example Fig. 11F) to make a better diamond crystal orientation. -6. Secondary element: Carbon-containing secondary source gas (SS), preferably C02 delivered by the nozzle in a gaseous form. As for other carbon-containing gases, although they can be used, they are generally either toxic (for example: CO) or easy to burn (for example: methane). During pre-processing operations only, the introduction of carbon dioxide gas is unnecessary as an unnecessary secondary source. During the integrated surface treatment process, carbon dioxide gas was introduced throughout the treatment period (for example: 45 seconds when the excimer laser was turned on) at a flow rate of 60 seem. During this process, the carbon dioxide gas (by laser) is decomposed into carbon elements, which increase the formation of the coating as a secondary element. 7. Nozzle: The annular nozzle has multiple channels arranged around the inner radius. The nozzle is located about 6 inches above the surface of the substrate. The gap "h" from this nozzle to the surface of the substrate is selected to allow the secondary elements to dissociate and react before diffusion into the substrate and / or to form a coating on the surface of the substrate. 8. Matrix: The matrix is a tungsten carbide, rectangular cutting tool insert (insert edge), 1/2 "x 1/2" in size. Such matrices may contain W% carbonized (W2C) and 6% (Co) adhesives. Due to the tendency to migrate to the surface, it is not appropriate to make a diamond (or diamond-like carbon) coating. The purpose of the present invention is to remove the surface from the surface (and the subsurface area), and this operation takes advantage of the fact that cobalt evaporates faster than tungsten carbide, and is achieved by using an excimer atomic laser during the pretreatment operation. . After the pre-treatment, tungsten carbide crystals (grains) are exposed on the surface of the substrate, and the tungsten carbide crystals below the surface (subcutaneous layer) are combined with the adjacent C 0 adhesive -------- ©, k-- (Please read the precautions on the reverse side before filling out this page) Order-65-This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) 65 A7 B7 V. Description of the invention (form an appropriate W 2C-Co element. The carbide on the surface and the tungsten carbide-cobalt element below the surface provide the nucleation site required for subsequent diamond growth (during the plating operation). The surface treatment method is a 92% WC, 2% Ta (Nb) C and 6% Co, particle size, transverse breaking strength of 2000N / mm2 (Newton / mm2), density of 14.9 9 / (^ 8 (g / cm3), and 111 ^ "Stock" cobalt carbide carbide (Latrobe, PA) "K68" grade cutting tool insert with a hardness of 92.7. At the same time, this surface treatment method is also applicable to, for example: a 93.5% WC, 0.5% Cr8C2 And 6% Co, average particle size is lyu m (micron), transverse fracture strength is 3,000 N / nrn2 (cow / Mm2), density 14.9 g / cm3 (grams per cubic centimeter), and HRA hardness of 93.0 "ready-made, Gu Carbide carbide (Latrobe, PA)" K313, grade cutting tool insert 〇 The integrated surface treatment method of the present invention can be universally applied to any "ready-made substrate" without modifying the substrate (such as grinding, touching, etc.) before the treatment is performed. 9 'Plasma plume ): Plasma plume has a distorted shape around the cross-section of the substrate, and the substrate is preferably spanned by a plasma plume to cover a predetermined area of the substrate (eg, the entire "top," surface). Figure 10B is One at three (several) different power levels (10⑽; 87 · 5μ, 75w), the electron beam power (p (w), vertical axis) of the excited atomic laser is applied to the pulse wave Frequency (i (Hz), horizontal axis) graph. As mentioned above, a power of 100W is suitable for processing flat cutting tool inserts, and (please read the precautions on the back before filling this page)- ------------- © 4 ^ ------ 1T ------ Shoulder of Central Standards Bureau of Ministry of Economic Affairs Fee cooperatives printed -66--

A7 B7 5. Description of the invention (66) The power of 75W is suitable for processing circular cutting tools. Fig. 10C is a chart of program data for Nd: YAG lasers. Each program number (1 to 13) has a set of corresponding pulse frequency, pulse time, pump pulse energy and maximum frequency. FIG. 10D is a detailed power (vertical axis) versus time (horizontal axis) curve of a C02 laser equivalent to the parameters summarized described in FIG. 10A. 10A, 10C and 10D mentioned above: (a) Surface treatment for flat cutting tool inserts. Excited atomic laser system cooperates with Nd: YAG laser operating in accordance with PROGRAM NUMBER 4 on the table of FIG. 10C And the C02 laser operating in accordance with the graph of FIG. 10D is operated with an output power of 100W (watts) and a pulse duration of 400 ms (milliseconds); (b) Surface treatment of a flat-blade tool insert, an excited atomic laser The Nd: YAG laser operating according to the program number (PROGRAM NUMBER) 11 on the table in Fig. 10C and the C02 laser operating according to the graph in Fig. 10D can also output a power of 87.SW (watts), and the pulse continues. Time is 350ms (milliseconds) to run; and printed by I-1 n 1 I #-I (Please read the precautions on the back before filling this page) and π (C) are round type. Tool inserts (as shown below in conjunction with Figure 1 "discussed") for surface treatment. Excited atomic laser systems cooperate with Nd: YAG lasers operating in accordance with the program number (PROGRAM No.) 11 on the table in Figure 10c and according to the figure. l〇D graph of the running CO2 laser to output Rate (Watts), pulse duration is 300 ms (milliseconds) to run. [Photomicrographs and Raman analysis] Figure 11A, 11B, lie, UD and 11E photomicrographs and Raman analysis -67 -Printed by A7 ____B7 of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the invention (67) The example of the method described above is to make a diamond coating on a tungsten carbide substrate. Figure 11A shows a sample before surface treatment. (Prior art) A top-view photomicrograph, as shown in the figure, an "off-the-shelf" cutting tool insert will show a pattern of wear marks (as shown by the diagonal lines in the figure), and at the same time there will be Many impurities (such as the spots in the figure). As indicated above, in addition to ablating cobalt and exposing tungsten carbide fines, it is best to perform a pre-treatment before the plating operation to highlight the characteristics of the substrate surface. Figure 11A, although associated with Figure 6A, shows in more detail the problems inherent in some existing surface treatment substrates. Figure 11B is a top-view photomicrograph of the sample of Figure 11A after pre-treatment according to the present invention, as shown in the figure Show The tungsten carbide "mountain peak" 1134 (equivalent to 634 in Fig.)) Surrounded by the "valley" 1132 (equivalent to 632 in Fig. ΔB). In this way, the substrate surface is pre-applied for subsequent plating operations. And characteristics, in which the tungsten carbide peaks will be the subsequent growth of diamond (or DLC) and serve as a defined nucleation field. Figure 11C is a top-view photomicrograph of the sample after plating according to the present invention, as shown in the figure Yes, a plurality of diamond crystals with substantially uniform sentences have been formed on the surface of the substrate (the exposed part of the diamond crystals in the figure looks like a pyramidal structure). Fig. 11D is a Raman spectrum analysis chart taken from the processed sample. The vertical axis represents the absorption state and the horizontal axis represents the wave number. Shown in the figure is a sharp (narrow) peak at I332 cnr1. This sharp peak provides evidence that the mirror layer in the sp2 crystal phase contains carbon and a significant amount of diamond-like carbon. -68-This paper size is in accordance with Chinese National Standard (CNS) A4 (210X297mm)! -I _---- OPII (Please read the precautions on the back before filling this page) Order the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs Print A7 B7 V. Description of the invention (68) As discussed above, this analysis is only a descriptive nature and does not have any decisive nature for the "quality" of the coating; to make such a decision, some cutting is necessary. Test only. 11E is a side view (cross-section) photomicrograph of a sample after plating according to the present invention. As shown in the figure, a material belt (transfer belt) 1150 extends from the surface of the substrate into the substrate 1152 to a depth "D" and a diamond (or DLC) coating 1154 with a thickness "t" on the surface of the substrate. In the surface-treated samples according to the present invention, the observed depth of the material strip is 10 # microns, and the observed diamond (or DLC) coating thickness is 45 #m. In the case of a plating operation of 45 seconds, this confirms a plating growth rate of approximately 1 yUm / s (micrometers / second). One "unmaskable" sign that the surface treatment process according to the present invention has been completed on the substrate is: some scattered (artificial) 1156 composite carbides (eg, in the case of processing tungsten carbide cutting tool inserts) Carbon nitride and the like appear in the matrix material (diffusion) zone 1150 of the matrix. This material strip 1150 may also be referred to as a "differential composition layer". These (coated) "roots" or an analogous feature (depending on the coating material being manufactured and the underlying substrate material) will be found in almost any product (substrate) that has been treated with the surface treatment method of the present invention Appear and will be used as an artifact to distinguish the (evidence) product made using the method of the present invention from products made using other (eg, CVD) methods, especially if the substrate is a diamond or similar Tungsten carbide substrate with diamond carbon coating. Many of the advantages of the present invention include the fact that a diamond coating can be made on the substrate without the need to "seed" the seed crystals. Due to the nature of local heating, -69-This paper size applies to Chinese National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling this page) Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Preparation A7 B7 5. Description of the invention (69) Total (mass) substrate temperature can be maintained as low as 30 ° c. [Scanning on substrate] As mentioned above, the surface treatment system of the present invention is suitable for the selection of substrate treatment Area (instead of completing the entire surface at one time). Generally speaking, this is a function of the cross-sectional shape (cross-section) of the laser beam. With proper adjustment of the beam size and shape, the selected area can span the surface of the substrate The entire "zone" and the substrate can be advanced during processing so that the entire substrate surface can be processed. As mentioned above, the electron beams from the three lasers can be focused on the substrate being processed A selected area of the laser beam, and the electron beam is transmitted through the respective beam transmission system (see, for example, units 322, 324, and 326 in FIG. 3) (usually transmitted through (A vent hole) to the substrate. It has been determined that the method can be optimized by controlling the cross-sectional shape of each electron beam. Figure 12A illustrates that the electron beams from three lasers are focused on the surface of the substrate 120. Generally, the cross-section of the electron beam is selected and controlled by the size of the substrate being processed. In this embodiment, a rectangular substrate with dimensions of "X" and "Y" in length and width; L202 is being accepted Surface treatment (the nozzle is omitted for clarity of illustration) and is moving along its ¥ _ axis, as indicated by arrow 1232 (compare 332, 432). Excimer laser (for example, ^ 2) is Due to the rectangular lens 1252, a plane (cross-section, cross-sectional shape) electron beam I262 'with a length and width of a and' b 'is generated, where the long side "a" of the electron beam is generally transverse to the substrate "X ,, Alignment, and the broad side "b" of the electron beam is usually aligned with the longitudinal width "γ" of the substrate. Generally, the long side "a" is longer, so the long side "χ ,, _ 70-this Paper size applies to China National Standard (CNS) A4 (210X 297 mm) (please first Read the notes on the back and fill out this page) ------------------- |, 玎 ----------------- --- Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7-B7 V. Description of the invention (70) It is contained to ensure that the electron beam will completely cover a rectangular part of the substrate (from the side edge 1220c to the opposite side) Edge 1202d). Promoting the substrate relative to the electron beam (as indicated by arrow: ^ 32) will cause the excited atomic beam from the "leading edge" 1202a of the substrate 1202 to the trailing edge 1202b of the substrate 1202 to pass ")) The entire surface of the substrate 1202. An electron beam with such a cross-section is often viewed as a focused beam.

Nd: YAG (for example: 714) and (: 02 (for example: 716) lasers pass through spherical lenses I254 and I256 respectively to generate circular cross-section electron beams 1264 and 1266 'keeping the angles Θ 2 and Θ 3 impacting the surface of the substrate ( (See Figure 7). The two electric beams I264 and I266 shown can have the same circular cross section with the radius "r ,," however, this one electron beam is respectively from the two phases and one side of the excited atomic beam 1262. Those who are directed to the substrate. The radius r of the two electron beams ^ and ^ "is at most the maximum value of the length and width dimensions of the substrate (the horizontal length" χ "or the vertical width" γ "). In 12A, the electron beam 1262, 1264, 1266 are represented by dashed lines, and the resulting cross-sectional shape of the three electron beams focusing on the surface of the substrate is represented by dashed line 127. The cross-sectional shape of this electron beam convergence should be 127 °, which should actually be in the matrix. On the surface, it consists of three parts: one includes the first generally semicircular portion 270a from which Nd: YAG and (: 02 laser beams converge), and one includes Nd: YAG and c〇2 The second convergence of the laser beamer is usually semicircular Part III; and (3) a third generally rectangular part Umc that includes the convergent electron beam from an excited atom, Nd: YAG * c02 laser, and this third part is located first Part 1270a and Part 1270] 〇 Between 0 —.111111 ^^. 1- ^ I ---- —Order (Please read the precautions on the back before filling this page) -71-

Printed by the Consumers 'Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (71) The shape of the light beam' as shown in the figure] _2A The person in question was used in the description of the plating operation of tungsten carbide cutting tool inserts Experimental example. Fig. 12B illustrates that the substrate 1220 (in a cross section) moves in the shape of a focused beam 1270 (illustrated in perspective) (as indicated by arrow 1210). When the substrate is advanced (moved) under the electron beam, the substrate is gradually surface-treated from its leading edge to its trailing edge 1220b, just like the front edge 1220a (and a part of Exceedance) Extends to the substrate: The plating layer 1204 in a selected area of the trailing edge of L202 and a building material (transfer) area UO6 are illustrated. According to the procedure parameters set forth above, the method of the present invention can be successfully applied to make diamond coatings on tungsten carbide substrates. [Special coatings (Figs. 13A to 13H)] The technical method of the present invention can be used to make different kinds of coatings on various substrates. For example, as discussed in relation to Fig. 2B, a plurality of coatings can be formed on a substrate surface. The figures provided below describe many of the applications of this industrial technology and examples of products manufactured using this technology. As discussed above, selective surface treatment of selected areas of the substrate is possible. According to one object of the present invention, the surface treatment technique of the present invention can be applied to make "special" coatings on a substrate. Figure 13A shows a substrate 1302 containing four surfaces 1304, 1306, 1308, and 1310 that can be treated in different ways according to the technical method of the present invention. A plating layer 1314 is formed on the surface 1304, a plating layer 1316 is formed on the surface 1306, a plating layer containing two sections (1318a and 1318b &gt;) is formed on the surface 1308, and a plating layer 1320 is formed on the surface 1310. It is assumed that the light beam (not shown) is often It is from the top This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) ------- Θ-C clothing-I (Please read the precautions on the back before filling this page)-Order ·

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(Observed by L) when incident, in order for the light beam to be able to process the surface 1304, it is necessary to move the substrate (for example: scanning along the X-Y plane). As shown in the figure, the coverage of the plating layer 1314 is smaller than the entire area of the surface 1304, but larger than the area of reactive power. Obviously, the substrate needs to be rotated in order to deal with the side surfaces 1: 306 and 1310 parallel to the electron beam 1312, as well as the entire blocked, outward-facing surface 1308 of the surface electron beam. By turning these surfaces into position, they can be treated as easily as the surface 1304-. As shown in the figure, each layer (and section) may be different in thickness and width (covered area) than the other layer. At the same time, each coating (and section) may be different in composition from other coatings, depending on the secondary elements that are selected to be introduced into the reaction system during the formation of the coating. Depending on the process parameters used during the treatment of the specific surface of the substrate, the main material area and the secondary material area (not shown in the figure) for the lower layer of the substrate surface may also be changed from one surface to another One surface is different. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (Please read the precautions on the back before filling this page)

1T FIG. 13B illustrates a feature of the present invention, showing that a mirror layer having regions of different thicknesses and / or plating layers each having a different area and a different size can be formed on the surface of the substrate 1322. (For clarity of illustration, the main material area and auxiliary material area are omitted from the figure). In this embodiment, a first plating layer I324 is formed on the surface 1326. A second plating layer 133 is formed on the top surface U28 of the first plating layer L324, and this second plating layer i33. It is smaller than the surface width (covered area) of the first plating layer U24. The two plating layers I324 and 133 may be the same or different in composition, and their thicknesses may also be the same or different. According to a feature of the present invention, the energy to start the reaction system (for example: from three lasers) can be projected on a selected area of the substrate, and can be based on the Chinese paper standard (CNS) A4- Specifications (210 × 297 mm) Central Bureau of Standards, Ministry of Economics W; A7 B7 printed by Industrial and Consumer Cooperatives V. Description of Invention (73) Scanning on the surface with any graphics and making any desired contour on the substrate (for example: composition Layer, thickness, shape) or graphics. "Figure 13 (a) shows a substrate USO which contains a special" coating made on its surface. (For the sake of clarity of illustration, the main material area and the auxiliary material area are omitted.) A plurality of corrugated portions 2338 are flat. The other parts 1340, 1342, and 1344 have a limited width (coverage area) and are made thicker than the planar part 1338, so that these thicker parts extend (above) the part 1338 above. In addition, this part 1340, 1342, 1344 can be formed with a slope (134〇), or have a flat top surface (134〇, i344), or have a steeply rising side wall (134〇, 1344), or be round (1342) , 1344), or have a convex top surface (1342) or have a concave top surface (744). Each part of the coating shown in Figure I% 'can be formed into a different composition (for example, a different secondary source is used for each part of the coating). In this article, only a few of the composite mirror layer shapes that can be made using the technical method of the present invention are described. For example: the geometry of the chip breaking edge can be made on a flat cutting tool insert as an integral part of the coating. Serving. The inevitable result of this is that the coating technology of the present invention can be applied to substrates having an irregular shape (topology) (eg, a possible situation (for example, using a cutting tool insert substrate with a chip breaking edge feature in the substrate itself) The surface is made with a uniform thickness. Figure 1 illustrates that additional "various" shapes can be made on the surface of a substrate as a plating structure, including: cylindrical 1352, tubular structure 1354, tapered structure 1356, L-shaped structure 1358, and curved structure 1360. , And the tower structure 1362. The tower structure I362 proves an extraordinary feature of the present invention. National Standard (CNS) A4 (2 like 297 mm) of Piton Financial Country ---------- (Please read the precautions on the back before (Fill in this page)-order

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V. Description of the invention (74)-Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs, that is, the true heterogeneous extension (omnidirectional) characteristic of the tower structure. In order to form this coating structure, the base 13623 of the structure is first made to extend from the surface of the substrate, and then the substrate (or energy source / secondary source) is reoriented, and the structure continues to be another-(shown as positive Cross) direction to form the segment l362b. Another significant feature of the present invention is that all the structures shown in this figure can be made on the same surface of the same substrate, and each structure can contain a composition different from other structures. By analogy, the substrate can be regarded as an equilibrium &amp; surface, and any number of useful objects can be placed on this top surface (of course, these objects need to be combined with the equilibrium top surface in a diffuse bonding manner using the technical method of the present invention) . For example, a flat cutting tool insert may not only be plated with a diamond mirror layer, and as such, the diamond plated layer has a geometry (structure) that is tailored to have its own chipbreaking edge. Figure WE illustrates another significant and effective feature of the invention. In this situation, a serpentine plating layer I366 is formed on the surface of the substrate 1368 (^ ⑼), which needs to form different mirror layer components in different sections of the serpentine. For example, The first segment can be made with a first component, the first segment 1366b can be made with a second component, the third segment can be made with a third component, and the fourth segment can be made with a first component Four components. The remaining sections l366e can be made to repeat this sequence (first, second, second, and fourth components). Another option is that each section can represent a code, similar to Store information (binary, ternary, quaternary, etc.) in a snake shape. These techniques are similar to, for example, the formation of diamond (for example) chromosomes. The recognizable distance (size) of each segment is only used The laser wavelength that forms the segment is limited. And the lateral size is the same as each segment of 308 nm, ie -75-This paper size applies to China National Standard (CNS) A4 (210X297 mm) (Please read the back first Please note this page before filling in this page) I-,, ------------ βτ ---- -• ^^ 1 In m In HI · A7 B7 Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. 5. Description of the invention (75) can be easily formed. Can be easily formed. Individual segments can be magnetic or non-magnetic, semi-conductive or non-conductive. The volume diagram US 'illustrates how to form a large number of neatly arranged on the surface of a substrate: 137 (Figure 9 ) Mirror layer section (i372 ^ ..), each section of the arrangement can be formed into a different composition, and each section can be formed into a different thickness. The section 137213 shown in the figure has a higher ratio than the other sections. (772a, l372c ... l372i) are thicker. Also, any or all of the sections can be made into a multi-layer structure (compare with Figure 2B). Figures 1 to 10F illustrate the use of the technology of the present invention Method to make "designer" coatings and components of the technical method of the present invention. Figures 13G and 1 illustrate the technical method of processing cylindrical objects as an example of the ability of the present invention to plate non-planar surfaces. For example, plated jars, perforators will be the Application. In Figure 1: 3G, it is shown that a cylindrical coating 138 is made on a cylindrical substrate M8 ?. The cylindrical substrate can be of any length, which illustrates the continuous characteristics of the technical method of the present invention, for example: The cylindrical substrate can be a very long (thousands of feet) metal wire (such as copper). The metal wire can be used to continuously perform the plating reaction operation along the length of the metal wire through a work station. In Figure 1; 3H , Showing how to apply strip coating 1: 384a * i384b along a cylindrical substrate, such as: metal wires at different length and length positions. The above strip coatings can be segmented and can be magnetic or non-magnetic or It has other characteristics to distinguish one segment from another (compare the snake 1366 of FIG. 13E). ------- ok ------, 玎 (Please read the notes on the back before filling out this page)

Printed by the Consumers' Cooperative of the Central Bureau of Standards, Ministry of Economic Affairs [Quick Model Making (Figure 131)} Figure 131 roughly illustrates the characteristics of the true heteroepitaxial (epitaxial) of the present invention. The plating is started on one or more (j) selected areas on the surface of a substrate 139. It can be seen that the substrate can be a "sacrifice," and the substrate can be cut from the last plated structure (made). A representative plated structure U92 shown in the figure is the substrate 丄 39. The choice of surface is made (built). This can be considered as growing from the z-axis (vertical to the substrate surface). For example, a rising portion UMa of the plated structure η "above the substrate surface along the z_ axis is created Reaching a height "tl," From then on, the substrate (or processing source material) can be reoriented (for example, with energy source and auxiliary source material), so that the other part of the mirror-covered structure I392 UMa can be oriented differently (Example: as shown in the figure, parallel to the matrix and maintained-spaced) Progressive growth (made). The growth of I392] □ in this part can be regarded as the growth along the χ_ axis. This part of the structure. The production of 92! ^ Can proceed to any predetermined degree. In the same way, you can reorient the matrix (or process the source material), so that the growth of the structure a% can continue from any of the above points; ^ 92 ^ any point to continue in different directions. This can be illustrated by a portion 1392c which can be considered here as a structure made along the γ-axis. Obviously, the shape (contour and area) of this structural structure] _392 differs between the surface of the substrate and the height (degree) t2, and the difference between the height U and ^^. '«In a very broad sense, this proves that the present invention is truly heterogeneous -77-This paper size applies to the Chinese National Standard (CNS) A4 specification (2ΐ〇χ297 mm) (Please read the precautions on the back before Fill out this. Page}

Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A7 --B7 _ V. Description of the invention (77) '' ^ ~ —— Extended (omnidirectional) characteristics, that is, any direction can be selected (for example: X, Y and Z axis) to complete the plating (and the plating structure, and the junction, part>). This illustration is used to demonstrate that it can be made-at any &amp; fixed height (for example: above the surface of the substrate) different For those who have a profiled plating structure, the profile at any given height is not restricted by the profile of the previous height. In addition, the area range of the structure at any given height is not subject to the area range of the previous height (for example: The constraint of "footprint ,,". On any given horizontal plane (height) above the surface of the substrate, any popular or area plating structure can be made, and only needs to be borrowed from, for example, an object to be made into a growing structure The appropriate cross-section can be obtained from the computer-generated image of the computer, and the control of the production operation can be properly achieved. In this way, an unconstrained shape or contour can be made on a substrate Three-dimensional structure. After making the three-dimensional structure, the matrix can be cut and discarded, or dissolved, or removed by any means including mechanical or chemical methods. The method of the present invention can be combined with a computer numerical control (CNC) system controlled Device, this computer numerical control system accepts three-dimensional lithographic software (such as stL) to facilitate the manufacture of objects containing complex parts. Using the method claimed in the present invention, the above-mentioned objects can be processed and processed in one way to make (for example, : Model making) The product is made of a simple, flat, or cylindrical substrate. Therefore, the device and method according to the present invention can be used to manufacture a plurality of prototype parts of composite materials from CAD data to become finished workpiece specifications. Not only that, metal, ceramics, and composite parts can be made into the final workpiece state without any post-processing, and show advanced materials — 78 — This paper size applies to Chinese National Standard (CNS) Α4 specifications (210 × 297) (Mm) (Please read the notes on the back before filling out this page} -------------------- ΐτ ----- ^ A 7 B7 V. Description of the invention (78) The enhanced physical properties brought about by the composition of the material can not be manufactured by the conventional methods. [Tubular substrate (Figures 14A and 14B)] The technical method of the present invention can be applied For coating the inner diameter (ID) of a tubular substrate, especially for the inner diameter of a tube with a large ratio of mirror coating length (L) to diameter (D) (greater than 3: 1). Figure 14A illustrates a coated tubular substrate 1402 The technical method of the inner diameter. The energy beam 1404 (for example: from three lasers) is incident on one (open) end 1406 of the tubular substrate 1402. The other end 1408 of the tubular substrate is preferably formed by a concave surface ( Or it may be a convex surface (not shown). The parabolic reflection surface 1410 (for the sake of simplicity in the illustration, this surface is separated from the end portion 1408 by a distance) is closed. In this way, the electron beam 1404 reflects around the interior of the tubular substrate and processes the entire inner diameter of the tubular substrate. With or without the introduction of auxiliary elements in the system when necessary. Fig. 14B illustrates another technique for plating a tubular substrate 1412 ID. An energy beam: U14 (compared to 304 in Fig. 3) is incident on one (open) end of the tubular substrate 1402: U16. The other end 1418 of the tubular matrix can also remain open. At the same time, the secondary element can be introduced as shown by the jet 142 (for example, the gaseous secondary element flow). Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs -------- © &lt; 』------, 玎 (please read the precautions on the back before filling out this page) : High L / D ratio) for a tubular substrate, a simple (eg, flat) reflector can be set in the ID of the tubular substrate to direct the incident energy beam to a selected area on the tubular substrate 10. In this way, the ID selection area (axial, circumferential, spiral) can be processed by the electron beam. In addition, in the same way as in Figures 13E, 13F, and 13H, -79-This paper is a national standard (CNS) A4 · (21GX297 mm) suitable for fiscal countries. Printed by A7 B7 of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. 2. Description of the invention (79) Introduce the secondary source to change the processing operation from one selection area to another selection area in a scheduled order. The invention is applicable to plating any of a number of substrates, several of which have been discussed above. For example, the present invention can perform a processing operation and / or a plating operation on an inner diameter or an outer diameter of a spiral cyclotron tube, and make a window for a cyclotron tube. In addition, the resistance heating element may be processed and / or plated, for example, to promote uniform distribution of heat, and to perform processing and / or plating on the inner and / or outer surfaces of the cooking utensil. The coating can also be made on the replaceable joint joints and the like. In this way, a part of the object under plating can be provided with a low-friction coating (if necessary, with enhanced high load capacity), and Another part of the object can be provided with a porous or rational coating (for example, to promote bonding to bone-like surfaces). According to the technical method of the present invention, the barrel, cylinder liner and the like can be advantageously processed. With the technical method of the present invention, the edges or edges of razors, knives and scalpels can be easily processed. Cutting tools, such as drills, can be improved by making stepped grooves, diamond coatings on the sides of the tool, and chipbreaker geometries in the tool. Very difficult to achieve. For example, diamond can be dissolved with iron. In this case, it may be better to form a silicon nitride coating on the tool (or other substrate). The present invention is capable of extracting and forming a composite material using any constituent (major) element from the matrix and auxiliary elements including silicon, copper, oxygen, nitrogen, boron, and the like. The application of the technical method of the present invention in the field of dry cutting is almost unlimited. 1 80 — This paper size is in accordance with Chinese National Standard (CNS) A4 (210X297 mm) (Please read the notes on the back before filling out this page) Order printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 5. Description of the invention (80) [Plating wear surface (Figures 15A and ΙδB) Figure 15A shows that a component of a steel ball bearing 1552 is treated on the surface of the bearing ring and covered with a rigid (for example: diamond or DLC) ship layer 15 54. In this way, the steel ball bearing can be used to facilitate dry cutting as if the machine tool is treated in accordance with the method of the present invention, and it can be used without (or only a little) lubrication. Figure 15B shows that a steel ball bearing assembly 1562, The entire surface of the component 1562 is treated and covered with a rigid (eg, diamond or DLC :) plating layer 1566. In this way, the plating layer 156 will function as a heat sink to remove heat from the steel balls and the bearing ring, and prevent corrosion [Plating circular cutters (Figures IδA to 1SD)] FIG. 16A illustrates an embodiment 1600 of a plated circular cutter (eg, an end mill, drill, or the like). As shown, one end The knife 1602 has a shaft portion 1604, a sipe portion 1606, and a knife point 1608, which are adjusted so that their tips face upwards toward a laser and a nozzle (not shown). In the manner described above, a plasma 1610 is generated around the knife point, The plasma 1610 will "swivel" down the sipe portion of the end iron blade, resulting in a plating layer formed along the entire length of the sipe portion 1606. Obviously, this embodiment is generally more suitable for forming along the entire length of the sipe portion. A thin-film diamond (or DLC) coating. According to this embodiment, a vacuum clamp similar to the vacuum chuck (804) described above can be used to hold the end mill and assist the plasma coiling in the sipe. Figure 16B shows a circular shape Another embodiment of the plating method on the tool. In this embodiment, a typical end mill 1622 (similar to the end mill 1602) is provided with a side nozzle and a laser (not shown) coming from above, and Duan 81 — This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) --------— (please read the precautions on the back before filling this page) Order the Central Bureau of Standards of the Ministry of Economic Affairs Printed by employees' consumer cooperatives A7 B7 V. Invention Ming (81) A plasma 1630 is formed on the tip of the iron knife, and the plasma is' coiled along the full length of the sipe as described previously (fitting on a large substrate causes relative movement of the selection area). This implementation In the example, the end mill should rotate with the plasma to rotate along the sipe to ensure uniform coverage (the formation of plating) along the entire length of the sipe. Figures 16C and 16D show the end mill 1642 (similar to 1602 or 1622) A side view and an end view of a thin film deposited (plated) along the entire length of the sipe (in the same manner as FIG. 16A or KB). In this example, we want to form a thick film coating in the sipe near the cutting edge. In this way, the thick film helps the cutting operation, while the thin film helps the chip removal operation and reduce the cutting force. The laser represented by arrow I644 and one or more secondary sources are irradiated on a selected area (small shift point) 1646 of the cutting edge. When the thick film coating is being formed, the "shift point" (the selected area being processed) is moved by the rotation of the end iron knife to make the shift point (for example: the left-to-right direction viewed from the illustration) ) Advancing forward along the helical (spiral) cutting edge. As shown in FIG. 16D, the above operation results in an end iron blade with a "felt, thin film diamond (or DLC) plated settlement, and Diamond (or DLC) thick film "edge" on the cutting edge of an end mill. Fig. 1SE shows another embodiment 1660 of a method for forming a coating on a circular cutter. In this embodiment, an exemplary end mill 1662 (similar to the end mill 1602) is provided on its end with a nozzle and a laser (not shown) radiating from above. In this way, this cutter: L662 is formed with a plasma 1664 along the entire length of the sipe, and it is not necessary to swim along the entire length of the cutter to form a plating layer. Figure 16F shows another example of the technical method for making coatings on a circular cutter. -82-This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 public celebration) (Please read the precautions on the back before filling this page) Binding-order A7 B7 V. Description of the invention () 8 2 Example 1680. In this example, an exemplary end iron knife 1682 (similar to the end iron knife 1602) is provided with a nozzle and a laser (not shown) from above on its side. In this way, the cutter 1662 is formed with the plasma 1864 along the entire length of the sipe, and it is not necessary to swim along the entire length of the cutter to complete the plating. It is best to rotate the tool during the plating operation to ensure the uniformity of the coating during the coating process. [Advantages] The technical method of the present invention is very advantageous for making various coatings that can be used for any purpose, for example, forming anti-corrosion and anti-corrosion coatings, and for unsafe working environments (such as steam boilers and the like). Inert plating. An advantage of the present invention is that the entire surface of the substrate can be processed without heating the entire substrate. Prior art methods involve heating the substrate "overall", which can, for example, cause the subcutaneous steel matrix to lose hardness (hardness) when the diamond coating is applied (eg, by CVD, or other similar methods). However, the technical method of the present invention can be used to make a heat-resistant coating on a large surface area, because the technical method of the present invention can be performed in a continuous operation in the surrounding environment. The advantages of the present invention generally include: (a) Obtaining a higher deposition rate, for example: a spectrum of 1 or more indica per hour. (b) Provide a large adhesion of cutting tools (for example: 50kg / mm2) 〇 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs -------- install-(Please read the note on the back first (Please fill in this page for more details) (c) It can be made into a crystal coating, for example, it has a lattice structure and a SP2_ or Sp3_ bonding barrier structure and a controllable mixture if necessary. σ (d) does not require pre-heating or cooling time. (e) This method does not require a vacuum environment, so the theory of the size of the substrate -83-

Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs: It is easier to accommodate the place in the surrounding (for vacuum) environment (the parts can be manipulated, various layer thicknesses can be obtained, and the coating can be applied without masking. (G) Plating layer (eg diamond) adheres well to substrates with a content of more than 10%. Therefore, the need for special substrates is virtually eliminated. (H) Utilizing the technical method of the present invention Stainless steel can be easily plated (i) The steel can be easily plated using the technical method of the present invention, therefore, the requirement that it must be stainless steel (in the beginning) is excluded. (J) The technical method of the present invention includes those having Those with a higher length-to-diameter ratio (L / D ratio) have a good coating effect on the inner diameter (work diameter, caliber) of the pipe. (K) Carving dies and weaving operations can also be completed during the plating process, so (1) The post-trimming processing steps of the conventional technology are eliminated. (L) The technical method of the present invention can also be a heteroepitaxial (epitaxial) type. U) The technical method of the present invention can be effective on all sides of a substrate of any shape. Plating is selectively or selectively applied. (η) When the technical method of the present invention is used to obtain a desired composite material from a matrix containing various components, there is no significant Raman variance. For example, Raman spectroscopy analysis shows that the matrix containing various components does not have any effect on the diamond-coated hafnium produced by the method of the present invention. (〇) The substrate with complex geometry can be processed, and various dopants (such as boron) can be introduced into the surface treatment. (P) The substrate can be pre-treated to give its surface characteristics for further -84-This paper size applies the Chinese national standard (CNS &gt; A4 size (210X297 mm) (Please read the precautions on the back before filling this page) .0Γ Order, description of invention () '84 The plating layer is plated by any appropriate technical method. The present invention can be applied to various substrates, including metal and non-metal substrates (non-metal substrates include ceramics and polymer substrates). Any kind of processing. Specific materials that can be processed or introduced into the reaction system include, but are not limited to: • Metals (B, Al, Ti, Nb, Ta, Cr, Mo, W, Re, Hf, etc.); Graphite and carbides 034 (:, 3 丨 (:, 1 ^ (:, (:): 3 (: 2, (:, carbonization, etc.); nitrides, W &amp;, t * (B, TaB2 , TiB2, WB, FeB, NiB ,,); • Silicon and silicide (Si, and different silicides of Mo, Fe, Ni, etc.); • Oxides (Al203, Si0, Si02); and '• Organic compounds (PTFE, Kevlar, polyamide, liquid crystal polymer, polytetraphthalate. As described above One of the advantages of the Ming technical method is that it can obtain the ideal substrate texture without post-processing. The ultraviolet laser itself (for example) 'can only be used to melt (burn money) the substrate by controlling its energy generation and irradiation time. Various textures β ranging from rough to optically smooth are obtained in addition. By using the technical method of the present invention, it is not necessary to select seed crystals for the substrate (generated after plating), and it has unprecedented ability to control the direction of crystal arrangement. Moreover, The two steps of pre-processing and post-processing can be performed in situ (as part of the overall process). In the previous technology of the deposition technique, a post-processing step is required to obtain a smoother texture than that obtained by deposition, such as You can use an emery abrasive A7 B7 V. Description of the invention (^) 〇〇 Polished surface of the substrate. However, no matter how fine the emery abrasive is used, it will leave scratches on the polished substrate Traces. UV laser, ion beam leveling or polishing processes are still needed. Avoid using emery abrasives or similar in post-processing steps. The obtained substrate (processed product) does not show such scratches and shows non-directional surface polishing. Although the invention has been described in detail in the drawings and the foregoing, it should be understood that this is to illustrate the invention Rather than restricting its characteristics, one should understand that only the best embodiment is illustrated and explained here, all changes and improvements within the gods of the present invention should be protected. Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please (Read the precautions on the back before filling this page) Figure 17A shows that a nozzle (nozzle) 1730 is suitable for directing a controlled secondary element stream (which can be an inert element) into the reaction system, and the secondary vice Elemental flow is directed into the same reaction zone that is being illuminated by energy processing. The nozzle 1730 has a hole 17 3 2 extending in the direction of the nozzle body 17 3 4. In this way, for example, the secondary elemental airflow flowing out through the holes 17 32 can be directed to the reaction zone. However, it may open once the air flows out of the hole. In order to concentrate the airflow more closely and / or surround the airflow in a protected environment, additional holes 1736 (three pairs of additional holes shown) can be provided in the nozzle body to generate an additional gas, such as an inert gas, spiral airflow. Those skilled in the art generally described in the present invention will understand how knowledge of fluid dynamics can make a nozzle or similar device suitable for the desired purpose. 17B-17C show an embodiment of a nozzle for conveying gas (ie, as a secondary element) according to the present invention. As shown in FIG. 17B, the nozzle 1750 is generally cylindrical and has a top opening—8 6 — This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 1 _ J · -'5? 1 1 1 A7 \-[B7 V. Description of the invention (86) Printed port 1752, a bottom opening 1754, and a central cavity 1756 are located in the main body 1758 of the nozzle 1750. Laser energy (i.e., three beams LI, L2, L3) can be directed through the top opening 1752 of the nozzle, and a substrate (not shown) will be placed under the nozzle. The nozzle 1750 has two gas inlets. The first inlet 1760 is used to contain a gas including a carbon-containing secondary element (ie, CO, co2, etc.), and the second inlet 1770 is used to contain an inert gas (as described above). The first gas inlet 1760 communicates with an outer tube 1212 arranged around the outer periphery of the nozzle 1750 body 1758 (that is, in a ring shape). The carbon-containing gas is introduced into the first gas inlet 176 (at a predetermined pressure) and flows around the nozzle body 1758 through the outer pipe 1762. A plurality of inner tubes 1764 extend from the outer tube 1762 into the cavity 1756 of the nozzle in a generally light shot to introduce a carbonaceous gas into the mouth cavity. The inner tube I764 should be arranged downward to the bottom opening 1754, so as to direct the carbon-containing gas to the bottom opening 1754 of the nozzle 1750, and then to the substrate being manufactured by diamond or DLC coating. The second gas inlet 1770 communicates with a ring 1772 which is placed around the nozzle 1750 body 1758 (that is, in a ring shape). The inert gas (as described above) is introduced into the second gas inlet 1770 (at a predetermined pressure) and flows through the outer tube 1772 to the periphery of the mouth-producing body 1758. Several inner tubes 1774 extend approximately lightly from the outer tube 1772 into the mouth cavity 1756 to introduce a carbon-containing gas into the nozzle cavity. The inner tubes 177 4 may be disposed downwardly toward the bottom opening 1754 so as to direct the inert gas toward the bottom opening of the nozzle 1750 ′ and then to the substrate undergoing diamond or DLC coating manufacture. Generally speaking, the outer tubes 1762 and 1772 are runners similar to transfer molds, while the inner tubes 1764 and 1114 are runners similar to transfer molds. As shown in Figure 17C, the inner tube 1775 (like 1774) is a nozzle. _ 8 7 _ This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling (This page)

87 Body 1759 (like 1758) shakes down to the bottom of the pout. The 18 series shows how the method of the present invention can be used as a processing method for the two similar CVD methods ... The substrate is placed in a vacuum environment (® shown as a bell-shaped cover) 1804. The entire substrate is not preheated, and an energy beam 1806 from an energy source 1808 is irradiated onto the substrate. Energy 1808 can be set outside the vacuum environment. As a result, as shown in the figure, the energy beam 1806 enters the vacuum environment (ie, enters the bell jar) through an appropriate window 1812. The remaining β is an element that utilizes the present invention as a processing method in the CVD-like method and is not required Figure 18 is well known because it is similar. Fig. 19 shows another embodiment of the present invention. According to this embodiment, a target material 1924 'such as graphite' can be accommodated outside or inside the nozzle 1920 and irradiated by an energy source 1926 having an energy beam 1928. The energy source 1926 can be guided from the energy source 202 by using necessary lenses and forming sufficient parameters. Once it is thus proved how the reaction process can be completed, changed and controlled, it is obvious that the technical method of the present invention can be used on a substrate to produce infinitely variable diamond and DLC coating compositions and geometric shapes (shape, contour, etc.) . The following discussion is intended to be illustrative and not restrictive. According to the recent discovery of the use of lasers to form a diamond or DLC forging layer, it is only known to the general public. It has been briefly discussed above. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the back Note: Please fill out this page again) However, in the present invention, 'the combination of three different lasers is best, but it has amazing results' and it is unprecedented to form diamond, DLC and other materials on the substrate. Carbon coatings, including: • diamond coatings (Cx * where χ is the number of carbon atoms in a crystal); • diamond-like carbon clock layers (Cx) 'shows a Sp / Sp bond structure;-88-this paper size applies China National Standard (CNS) A4 (210x297 mm) B7 Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (88) • Amorphous carbon mirror layer (Cx) 'shows a sp2 / sp3 bond Structure; • Glass graphite, coating (Cx), showing a sp? / Sp3 bonding structure; • Graphite coating (Cx), showing a sp2 bonding structure; and • Ullerenes (Cx), showing a sp2 bond合 结构。 Structure. Using three laser beams while separating molecular carbon and diffusing carbon from the matrix composition simultaneously provides a high degree of inherent plasticity (workability) to the technique of the present invention and therefore provides several advantages, including: (Already stored in the matrix, such as steel and tungsten carbide) into pure carbon; • The conversion of pure carbon can be carried out under the surface (that is, in the material area) or on the surface, and it is limited to the existence in the matrix The amount of molecular carbon contained; • Depending on the particular application, the laser can be focused (ie, melting of the surface during fast response) or defocused (ie, diffusion during slow response). One of the lasers is an ultraviolet laser, such as a Xecl or KrF excimer laser. This is extremely advantageous for introducing a carbon-containing subsidiary element system such as carbon monoxide (Co). By using an Xecl or krF excited-state laser, the single-photon energy is carried out in the order of the dissociation of the bonds of ordinary carbon-containing molecules. Therefore, this laser can break chemical bonds and neutralize molecules to form a plasma. The bond dissociation energy of carbon monoxide is 1077 kJ / mol, which is a fairly strong (if not the strongest) chemical bond among carbon-containing molecules. After analyzing the single photon energy intensity and the electronic curve of the carbon molecule, it is clear that the triple photon process of either Xecl or KrF laser can break the carbon chemical bond to provide active species such as carbon atoms, carbon ions, etc., which is beneficial as Primary particles of diamond. Infrared (IR) lasers (ie, Nd · YAG and C0 2) are all inverse 8 9 a paper size applies Chinese National Standard (CNS) A4 specification (2! 〇 × 297 mm) (please read the back first) Please note this page, please fill in this page) Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () 8 9 Elements of the application process. The intensity of the single photon energy of these lasers is just enough to move the molecule to its excited state of vibration and rotation. The energy of IR lasers is generally not sufficient to break chemical bonds or knock electrons from neutral molecules. Therefore, they are generally unable to separate molecules by themselves unless they are used in resonance multiphoton interaction or an induced chemical reaction. However, Co2 lasers are usually very energy-intensive, and can provide high photon density for active multiphoton interactions. Such multiphoton interactions can trigger further reactions and depositions. Co2 lasers can produce environments similar to high-pressure, high-temperature (HPHT) effects. As described above, a nozzle may be selectively used to introduce a secondary element into the reaction system, and the secondary element may be in a gaseous form. In addition, a shielding (protective) gas can be used to contain the desired secondary elements. An inert (inert) gas (that is, for all reaction processes that normally occur) can be used to conduct secondary elements. The purpose of inert gas is: (to prevent gasification, (b) to create a "coating layer" for secondary elements, (c) to direct the flow of carbon-containing gas onto the substrate. Depending on the carbon-containing gas selected The inert gas can be selected from the group consisting of: helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe), and krypton (N), among which the first three are the least expensive The gas guided by the nozzle can also be used as an "energy transfer, gas (agent). At this time, the gas can be used to absorb the energy to be guided to the carbides stored in the carbon-containing gas'. This can cause a carbon-containing gas. Internal chemical bond rupture. Depending on the carbon-containing gas used (ie, C0, C02, etc.) and the laser light source used (ie,-infrared laser with low-intensity photon energy, or-high intensity) Photon energy (ultraviolet laser), the energy transfer gas can be selected from the group consisting of: He 'Ne' Ar, Kr, Xe, N, Η, and SFe. —90 — This paper standard is applicable to China National Standard (CNS) ) A4 size (210X297mm) -------- G (k—— (Please read the precautions on the back before filling This page) book

Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs To promote the formation of diamond and DLC coatings on the substrate, a carbon-containing oxide can be introduced into the reaction system as a secondary element. Appropriate choices of secondary elements include: (I) carbon oxides, such as carbon dioxide (c02) and carbon monoxide (co), organic molecules, such as • methane gas (CH4), ethane gas (C2He), ethylene (c2H4 ), Propane (W), butane (CiH hexane (, or 2 (III) polymers, such as materials containing hydrogen and oxygen atoms, and (IV) neutrons (ch8 coch3) the content of the prior art (ie As disclosed in US Pat. No. 4,981,717}, it is generally limited to the use of an infrared (C02) laser combined with sulfur hexafluoride (SFe) to transfer sufficient energy to disconnect methane gas (CH4). Conversely, for example, according to the present invention, the infrared laser (c0) can also use ethylene (C2H4) gas (a secondary element acting on carbon). According to the technique of the present invention, the laser system is sufficient to break Vinyl bond, no other gas or agent (ie, sf6) is needed to transfer energy to break the carbon bond. According to the present invention, a powerful co2 laser can be used (combined with other lasers). The Co2 laser can Provides very high photon density to make multiphoton active. The sub-action can cause further reactions and deposition, and can produce an environment similar to high-pressure, high-temperature effects. (Please read the precautions on the back before filling this page) -------------- ® ------ 1T ----- Μ ___ nn · -91---m II · This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 male shame) Β4 1 07 3 58 Μ Please ask Committee KJCRH: Whether it will be changed in the future and its substantive content Α7 Β7 Years: Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the invention Surface of the substrate 1300, 300, 400, 700, 800.900, Surface treatment system BDS beam delivery system 330, 430, Selected area 500, 550, 722, 1730, 1750. 1920 Nozzle 506 Central axial channel 508 Ring El, EI2, Ε3 Laser beam 510, 520, 530, 561, 580 Inlet 512, 522, 532, 562, 582, Annular flow channel 514, 524 , Outlet BG Buffer gas SS Secondary source SF Barrier gas 552,554,1734 Nozzle body 592 Ring plane 602 Tungsten carbide matrix 630,634, Tungsten carbide particles 723 axis line 804 support 808 protrusion 810,814 vacuum channel 1150,1206 material (diffusion) belt 1154,1204,1314,1316,1320,1324,1330,1554,1566 diamond (or DLC) coating 1156 scattered scattered (artificial 1202 (1202a, 1202b, 1202c, 1202d) Rectangular substrate 1252 Rectangular lens 1262, 1264, 1266 Electron beam 1270 Concentrating light into -92-(Please read the precautions on the back before filling this page) This paper uses China National Standard (CNS) A4 Specification (210X297 mm) V. Description of Invention (92) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 1338, 1340, 1342, 1344 Coating parts 1352, 1354, 1356, 1358, 1360, 1362 Coatings Structure 1366 Serpentine coating 1372a ... 1372i Coating section 1380-Cylindrical coating 1384a, 1384b Strip coating 1392 Coating structure tl, t2 Height 1402, 1412 Plated tubular substrate 1404, 1806, 1928 Energy beam 1406, 1416, One (open) end of the tubular substrate 1408, 1418 The other end of the tubular substrate 1410 Parabolic reflective surface 1420 Jet 1552, 1562, assembly of steel ball bearings 1600 Coated round cutter 1602, 1622, 1642, 1662, 1682 Milling cutter 1604 One shaft part 1606 One sipe part 1608 One tool tip 1610, 1630, 1664, 1684 Plasma 1646 Selected area (small spots) 1732 Nozzle body 1734 Axial extension hole 1752 Top opening 1754 Bottom opening 1756 Central cavity 1758, 1759 , Nozzle body 1760,1770 First and second inlets 1762,1772 Outer tube 1764,1774,1775 Inner tube 1804 Vacuum environment 1812 Appropriate window 1924 Light material—93 _ (Please read the precautions on the back before filling this page) This paper Zhang scale is applicable to China National Standard (CNS) A4 specification (210X297 mm)

Claims (1)

Fan Li specially asked the Chinese ABC to revise in 8 D year 89.1 Printed by the Central Bureau of Standards of the Ministry of Economic Affairs · Industrial and Consumer Cooperatives (Revised) 1. A method for treating a substrate with carbon components, the method includes the steps: Energy directed to the surface of a substrate; using the radioactive energy to activate a selected amount of carbon constituent elements in the substrate, thereby achieving that the carbon constituent elements move toward the surface of the substrate; evaporating a selected amount of carbon constituent elements from the matrix; and The laser energy is used to modify the structure of the evaporated carbon constituent elements to form a diamond or diamond-like carbon substance on the surface of the substrate from the evaporated carbon constituent elements. 2. The method according to item 1 of the scope of patent application, which includes the steps of: continuously directing laser energy to the surface of the substrate, thereby forming the diamond or diamond-like carbon material directly below the surface of the substrate-3. According to the patent application The method of the first item of the scope includes the steps of: inducing physical stress in the diamond or diamond-like carbon coating produced by using the laser energy. 4. The method according to item 1 of the scope of patent application, including the steps of: completing the surface processing of the coating with the laser energy. 5. The method according to item 1 of the scope of patent application, comprising the steps of: continuously directing laser energy to the surface of the substrate, so as to form a multilayer diamond or diamond-like carbon shovel layer on the substrate, and one layer of the multilayer is made of It is formed on the surface of the substrate, and each of the remaining layers is disposed on another layer of the remaining layers in the layer. 6. According to the method of the first patent application scope, the method further includes the steps of: introducing a secondary element into the substrate, wherein the secondary element is a carbonaceous material. (Please read the precautions on the back before filling in this page.) Binding and Threading (Perth Min) Including the back wave f ΓΝς, A4 to find the Gu · ί 21 Ο X 297 public power) Fan Li specially asked ABC 8 D year is correcting 89.1 Printed by the Central Bureau of Standards, Ministry of Economic Affairs, Industrial and Consumer Cooperatives (Revised) 1. A method for treating a substrate with carbon constituent elements, the method includes the steps of: directing laser energy to the surface of a substrate; and using the electricity The radiation energy activates a selected amount of carbon constituent elements in the matrix, thereby achieving the movement of the carbon constituent elements toward the surface of the matrix; evaporating the selected amount of carbon constituent elements from the matrix; and using the laser energy to make the evaporated carbon constituent elements The structure is modified to form a diamond or diamond-like carbon material on the surface of the substrate from the self-evaporated carbon constituent elements. 2. The method according to item 1 of the scope of patent application, which includes the steps of: continuously directing laser energy to the surface of the substrate, thereby forming the diamond or diamond-like carbon material directly below the surface of the substrate-3. According to the patent application The method of the first item of the scope includes the steps of: inducing physical stress in the diamond or diamond-like carbon coating produced by using the laser energy. 4. The method according to item 1 of the scope of patent application, including the steps of: completing the surface processing of the coating with the laser energy. 5. The method according to item 1 of the scope of patent application, comprising the steps of: continuously directing laser energy to the surface of the substrate, so as to form a multilayer diamond or diamond-like carbon shovel layer on the substrate, and one layer of the multilayer is made of It is formed on the surface of the substrate, and each of the remaining layers is disposed on another layer of the remaining layers in the layer. 6. According to the method of the first patent application scope, the method further includes the steps of: introducing a secondary element into the substrate, wherein the secondary element is a carbonaceous material. (Please read the precautions on the back before filling in this page.) Binding and Threading (Perth Min) with back wave f ΓΝς, A4 to find out. Ί 21 Ο X 297 public power) 申请 Application for patent scope ABCD Ministry of Economic Standards Bureau member. Printed by the Industrial and Consumer Cooperatives. 7. According to the method of the scope of patent application, the method includes the following steps: introducing a side element on the substrate, wherein the side element is selected from the group consisting of methane, ethane, ethylene, propane, Carbonaceous material in the group of butane, hexane, carbon monoxide and carbon dioxide. 8. The method according to item 1 of the patent application scope, further comprising the steps of: introducing a secondary element onto the substrate, wherein the secondary element is a carbon-containing polymer material selected from the group consisting of hydrogen and oxygen. 9. The method according to item 1 of the scope of patent application, further comprising the steps of: introducing a side element on the substrate, wherein the side element is a ketone. 10. The method according to item 1 of the scope of patent application, further comprising the steps of: biasing the substrate with electric power. 11. The method according to item 1 of the patent application scope, further comprising the steps of: directing the radioactive energy to a selected area only on the surface of the substrate. 12. The method according to item 1 of the scope of patent application, wherein the substrate is a steel material. 13. The method according to item 12 of the scope of patent application, wherein the steel is stainless steel. 14. The method according to item 12 of the scope of patent application, wherein the steel is carbonized steel "15. The method according to item 1 of the scope of patent application, wherein the laser energy is provided by three obvious lasers, namely: a first Laser, a second laser and a third laser, each laser is directed to the same surface of the substrate and at least one of the three laser systems is subjected to an evaporation step. 16. The method according to item 15 of the patent application, wherein the first laser is an excimer laser. / -2-(Please read the precautions on the back before filling this page) • Installation-Threading Difficulty in using JI · Ding Defeng (CNS) A4 specification (210 X: 297 mm) L Printed by employees' consumer cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs A, 8 B8 C8 D8 6. Scope of patent application 17. The method of claim 15 in which the excimer laser is pulsed. 18. The method according to item 15 of the patent application scope, wherein the second laser is a Nd: YAG laser. 19. The method according to item 15 of the patent application scope, wherein the third laser is a C02 laser. 20. The method according to item 15 of the scope of patent application, wherein the first laser system is an exciton atom laser; the second laser system is an Nd: YAG laser; and the third laser system is a C02 laser. Shooting 21. 21. A method for treating a substrate with carbon constituent elements, the method comprising the steps of: directing laser energy to a surface of a substrate, and using the laser energy (a) to cause a selected amount of carbon in the substrate The mass element generates local heating so that the carbonaceous element moves toward the surface of the substrate and is evaporated by the laser energy: (b) the structure of the evaporated carbonaceous element is modified by the laser energy: and (c) A diamond or diamond-like carbon material is formed from the evaporated carbon constituent elements on at least the surface of the substrate. 22. —A method for treating a substrate with carbon constituent elements, the method comprising the steps of: directing laser energy to a surface of a substrate, and using the laser energy (a) to cause a selected amount of carbon-containing elements in the substrate; Local heating is generated so that the carbon-containing element moves to the surface teeth of the substrate and V ;, 装 装 -------- Order ----- :, line (please read the precautions on the back before filling in this Page) This paper size is in accordance with Chinese national standard (CNS> A4 specification (2! 0〆297 mm). 6. Patent application scope ABCD will be evaporated by the laser energy; (b) the evaporated carbon will be evaporated by the laser energy Structural modification of elements: and (C) forming a diamond or diamond-like carbon material on at least the surface of the substrate from the evaporated carbon-containing element * 23. A method for treating a substrate with a carbon constituent element, the The method includes the steps of: directing laser energy to a surface of a substrate; using the laser energy to activate a selected amount of carbon constituent elements in the matrix, thereby achieving the movement of the carbon constituent elements toward the surface of the substrate; and using the laser Energy steams a selected amount of carbon constituents ; And by using the laser energy to modify the structure of the evaporated carbon constituent elements, at least a diamond or diamond-like carbon substance is formed on the surface of the substrate from the evaporated carbon constituent elements. • n fm I HI · (Please first Read the notes on the back and fill in this 1)-Packing. Thread-Printed by the Consumers' Cooperatives of the China Standards Bureau of the Ministry of Economic Affairs-4-The paper size is applicable to the Chinese national standard (0?) 8 4 specifications (210 parent 297) Mm)