WO1988008965A3 - Dispositif de mesure de la temperature de corps semi-conducteurs, son procede de fabrication et procede de mesure de la temperature de corps semi-conducteurs lors de processus de malleabilisation - Google Patents

Dispositif de mesure de la temperature de corps semi-conducteurs, son procede de fabrication et procede de mesure de la temperature de corps semi-conducteurs lors de processus de malleabilisation

Info

Publication number
WO1988008965A3
WO1988008965A3 PCT/DE1988/000249 DE8800249W WO8808965A3 WO 1988008965 A3 WO1988008965 A3 WO 1988008965A3 DE 8800249 W DE8800249 W DE 8800249W WO 8808965 A3 WO8808965 A3 WO 8808965A3
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
semiconductors
semiconductor
measuring
manufacture
Prior art date
Application number
PCT/DE1988/000249
Other languages
German (de)
English (en)
Other versions
WO1988008965A2 (fr
Inventor
Spyridon Gisdakis
Helmut Tews
Peter Zwicknagl
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of WO1988008965A2 publication Critical patent/WO1988008965A2/fr
Publication of WO1988008965A3 publication Critical patent/WO1988008965A3/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

Un dispositif de mesure de la température régnant à l'intérieur d'un corps semi-conducteur (1) comprend un élément thermique (5) intégré dans le corps semi-conducteur. Lors de la fabrication de ce dispositif de mesure, on introduit l'élément thermique (5) dans un évidement (6) du corps semi-conducteur (1) et on remplit l'évidement (6) avec un matériau qui correspond à la composition chimique des alentours de l'évidement (6). Un dispositif de mesure de la température de surface d'un corps semi-conducteur comprend un élément thermique métallisé sous vide à la surface d'un corps semi-conducteur ou un élément thermique avec un poids de support posé sur la surface du corps semi-conducteur. Selon un procédé de mesure de la température de corps semi-conducteurs lors de processus de malléabilisation, on détermine avec ces dispositifs de mesure la température de corps semi-conducteurs de référence. A cet effet, un dispositif de mesure associé à un corps semi-conducteur de référence est soumis avec le corps semi-conducteur à un processus de malléabilisation. L'invention s'applique dans le domaine de la fabrication de produits semi-conducteurs.
PCT/DE1988/000249 1987-05-07 1988-04-27 Dispositif de mesure de la temperature de corps semi-conducteurs, son procede de fabrication et procede de mesure de la temperature de corps semi-conducteurs lors de processus de malleabilisation WO1988008965A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19873715231 DE3715231A1 (de) 1987-05-07 1987-05-07 Messvorrichtung zur bestimmung der temperatur von halbleiterkoerpern, verfahren zur herstellung der messvorrichtung und verfahren zur bestimmung der temperatur von halbleiterkoerpern waehrend temperprozessen
DEP3715231.9 1987-05-07

Publications (2)

Publication Number Publication Date
WO1988008965A2 WO1988008965A2 (fr) 1988-11-17
WO1988008965A3 true WO1988008965A3 (fr) 1988-12-29

Family

ID=6327026

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1988/000249 WO1988008965A2 (fr) 1987-05-07 1988-04-27 Dispositif de mesure de la temperature de corps semi-conducteurs, son procede de fabrication et procede de mesure de la temperature de corps semi-conducteurs lors de processus de malleabilisation

Country Status (5)

Country Link
US (1) US5052821A (fr)
EP (1) EP0359748A1 (fr)
JP (1) JPH02503352A (fr)
DE (1) DE3715231A1 (fr)
WO (1) WO1988008965A2 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02284440A (ja) * 1989-04-26 1990-11-21 Mitsubishi Electric Corp 太陽電池溶接温度測定方法及び太陽電池特性確認方法
EP0406751A1 (fr) * 1989-07-07 1991-01-09 Balzers Aktiengesellschaft Méthode et agencement pour la saisie de données de mesure pendant le traitement de disques
CA2073886A1 (fr) * 1991-07-19 1993-01-20 Tatsuya Hashinaga Appareil et methode de rodage
JP3389624B2 (ja) * 1993-01-11 2003-03-24 東レ株式会社 糸継ぎ装置
US5967661A (en) * 1997-06-02 1999-10-19 Sensarray Corporation Temperature calibration substrate
DE19852080C1 (de) * 1998-11-11 2000-08-17 Trw Automotive Electron & Comp Verfahren und Vorrichtung zur Überwachung der Temperatur eines verlustbehafteten elektronischen Bauelements, insbesondere eines Leistungshalbleiters
US6475815B1 (en) * 1998-12-09 2002-11-05 Matsushita Electric Industrial Co., Ltd. Method of measuring temperature, method of taking samples for temperature measurement and method for fabricating semiconductor device
US6504392B2 (en) 1999-03-26 2003-01-07 International Business Machines Corporation Actively controlled heat sink for convective burn-in oven
US6190040B1 (en) * 1999-05-10 2001-02-20 Sensarray Corporation Apparatus for sensing temperature on a substrate in an integrated circuit fabrication tool
US6962437B1 (en) * 1999-12-16 2005-11-08 Lsi Logic Corporation Method and apparatus for thermal profiling of flip-chip packages
WO2001090710A1 (fr) * 2000-05-25 2001-11-29 Kamel Fauzi Razali Thermocouple traversant une matiere d'encapsulation de circuit integre
US20030231698A1 (en) * 2002-03-29 2003-12-18 Takatomo Yamaguchi Apparatus and method for fabricating a semiconductor device and a heat treatment apparatus
JP5451793B2 (ja) * 2012-02-10 2014-03-26 東京エレクトロン株式会社 温度センサ及び熱処理装置
JP6012413B2 (ja) * 2012-11-07 2016-10-25 安立計器株式会社 接触式温度計

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3462317A (en) * 1965-10-12 1969-08-19 Motorola Inc Thermocouple assembly
WO1981002928A1 (fr) * 1980-03-31 1981-10-15 Rosemount Inc Detecteur de temperature de surface a alignement automatique

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2123179B1 (fr) * 1971-01-28 1974-02-15 Commissariat Energie Atomique
DE3212026A1 (de) * 1982-03-31 1983-10-06 Siemens Ag Temperatursensor
JPS5997024A (ja) * 1982-11-25 1984-06-04 Shozo Asano 浸漬熱電対
US4571608A (en) * 1983-01-03 1986-02-18 Honeywell Inc. Integrated voltage-isolation power supply
JPS59155731A (ja) * 1983-02-25 1984-09-04 Mitsubishi Heavy Ind Ltd 測温体の装着方法
JPS6010137A (ja) * 1983-06-30 1985-01-19 Toshiba Corp サ−モパイル
JPS60230026A (ja) * 1984-04-27 1985-11-15 Mitsubishi Electric Corp 半導体検査装置の温度測定装置
US4590507A (en) * 1984-07-31 1986-05-20 At&T Bell Laboratories Variable gap devices
JPS61189657A (ja) * 1985-02-18 1986-08-23 Fuji Photo Film Co Ltd 半導体素子温度制御装置
US4808009A (en) * 1986-06-05 1989-02-28 Rosemount, Inc. Integrated semiconductor resistance temperature sensor and resistive heater
US4820659A (en) * 1986-07-16 1989-04-11 General Electric Company Method of making a semiconductor device assembly
JPH01295500A (ja) * 1988-05-24 1989-11-29 Taiyo Yuden Co Ltd チップ状電子部品マウント方法及びその装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3462317A (en) * 1965-10-12 1969-08-19 Motorola Inc Thermocouple assembly
WO1981002928A1 (fr) * 1980-03-31 1981-10-15 Rosemount Inc Detecteur de temperature de surface a alignement automatique

Also Published As

Publication number Publication date
DE3715231A1 (de) 1988-11-17
JPH02503352A (ja) 1990-10-11
WO1988008965A2 (fr) 1988-11-17
US5052821A (en) 1991-10-01
EP0359748A1 (fr) 1990-03-28

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