JPS5636149A - Forming method for resistance region - Google Patents

Forming method for resistance region

Info

Publication number
JPS5636149A
JPS5636149A JP11115579A JP11115579A JPS5636149A JP S5636149 A JPS5636149 A JP S5636149A JP 11115579 A JP11115579 A JP 11115579A JP 11115579 A JP11115579 A JP 11115579A JP S5636149 A JPS5636149 A JP S5636149A
Authority
JP
Japan
Prior art keywords
grooves
resistance
element region
region
filled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11115579A
Other languages
Japanese (ja)
Inventor
Takeyuki Sudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11115579A priority Critical patent/JPS5636149A/en
Publication of JPS5636149A publication Critical patent/JPS5636149A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/8605Resistors with PN junctions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the accuracy of the value of resistance by a method wherein a resistance region is geometrically limited by V-grooves in which a heat resisting insulating material is filled when forming the resistance region of an integrated circuit device. CONSTITUTION:V-grooves 5 are made up on a semiconductor substrate 1 so as to limit an element region 2'. The difference of the speed of etching due to the difference of a surface direction of a substrate crystal is utilized for the formation of the V-grooves. A heat resisting insulating material 6, such as Si3N4, SiO2, Al2O3, etc. is filled in the V-grooves 5 by means of a CVD method. When forming resistance to the element region, ions are successively implanted to the element region, necessary impurities are introduced, and necessary resistance value is obtained. Thus, the element region is limited by the V-grooves, the element region do not vary in a process of heat treatment, and consequently resistance having high accuracy is acquired. Not only resistance but also other elements may similarly be made up in the element region. The V-grooves may be exchanged for U-grooves.
JP11115579A 1979-08-31 1979-08-31 Forming method for resistance region Pending JPS5636149A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11115579A JPS5636149A (en) 1979-08-31 1979-08-31 Forming method for resistance region

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11115579A JPS5636149A (en) 1979-08-31 1979-08-31 Forming method for resistance region

Publications (1)

Publication Number Publication Date
JPS5636149A true JPS5636149A (en) 1981-04-09

Family

ID=14553856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11115579A Pending JPS5636149A (en) 1979-08-31 1979-08-31 Forming method for resistance region

Country Status (1)

Country Link
JP (1) JPS5636149A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63144160A (en) * 1986-12-03 1988-06-16 立見 盛太郎 Manufacture of colored artificial stone
CN110517948A (en) * 2019-07-26 2019-11-29 中国科学院微电子研究所 Extension InP method for semiconductor and semiconductor devices obtained on a kind of silicon substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63144160A (en) * 1986-12-03 1988-06-16 立見 盛太郎 Manufacture of colored artificial stone
CN110517948A (en) * 2019-07-26 2019-11-29 中国科学院微电子研究所 Extension InP method for semiconductor and semiconductor devices obtained on a kind of silicon substrate

Similar Documents

Publication Publication Date Title
JPS52128066A (en) Manufacture of semiconductor device
JPS5636149A (en) Forming method for resistance region
JPS53135263A (en) Production of semiconductor device
JPS5249772A (en) Process for production of semiconductor device
JPS5253658A (en) Method of introducing impurity into semiconductor
JPS5536935A (en) Manufacturing of semiconductor device
JPS52149076A (en) Semiconductor integrated circuit and its preparing method
JPS53109474A (en) Manufacture for silicon water
JPS5230185A (en) Process for producing semiconductor device
JPS57109353A (en) Semiconductor device
JPS5534433A (en) Preparation of semiconductor device
JPS5393788A (en) Production of semiconductor device
JPS5245290A (en) Integrated circuit of semiconductor and method for its fabrication
JPS5285465A (en) Production of semiconductor device
JPS5327376A (en) Forming method of high resistanc e layer
JPS5243369A (en) Flat etching method for silicon
JPS5796546A (en) Semiconductor device
JPS5335375A (en) Heating method
JPS5240070A (en) Process for production of semiconductor device
JPS5227362A (en) Formation method of passivation film
JPS56147474A (en) Manufacture of semiconductor device
JPS5352379A (en) Production of dielectric isolated ic substrate
JPS5283164A (en) Production of thin film semiconductor substrate
JPS5693310A (en) Manufacture of magnetic bubble device
JPS526081A (en) Semiconductor wafer