Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
  • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
  • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0313—Organic insulating material
  • H05K1/032—Organic insulating material consisting of one material
  • H05K1/0346—Organic insulating material consisting of one material containing N
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0313—Organic insulating material
  • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S428/00—Stock material or miscellaneous articles
  • Y10S428/901—Printed circuit
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
  • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
  • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
  • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
  • Y10T428/2495—Thickness [relative or absolute]
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
  • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
  • Y10T428/2495—Thickness [relative or absolute]
  • Y10T428/24967—Absolute thicknesses specified
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
  • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
  • Y10T428/2495—Thickness [relative or absolute]
  • Y10T428/24967—Absolute thicknesses specified
  • Y10T428/24975—No layer or component greater than 5 mils thick
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/31504—Composite [nonstructural laminate]
  • Y10T428/31511—Of epoxy ether
  • Y10T428/31525—Next to glass or quartz
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/31504—Composite [nonstructural laminate]
  • Y10T428/31511—Of epoxy ether
  • Y10T428/31529—Next to metal
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/31504—Composite [nonstructural laminate]
  • Y10T428/31678—Of metal
  • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/31504—Composite [nonstructural laminate]
  • Y10T428/31721—Of polyimide
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/31504—Composite [nonstructural laminate]
  • Y10T428/31725—Of polyamide

Definitions

• the present invention relates to a substrate for a flexible printed circuit and a method for manufacturing the same.
• the present invention relates to a heat-resistant flexible film manufactured by forming an electrical insulating film directly on a metal foil without using an electrically insulating film or a fibrous base material.
• the present invention relates to a printed circuit board for an lj circuit and a method for manufacturing the same.
• the flexible printed wiring board that can be bent and bent to form a three-dimensional wiring that matches the demands of the printed wiring boards is suitable for these requirements. It is used as a printed wiring board for a wide range of equipment.
• conventional substrates for flexible printed wiring are made of polyester resin film, polyimide resin film, and fluorine resin.
• An electrically insulating film such as a film is bonded to a copper foil through an adhesive, or an epoxy resin or the like is used on a glass substrate such as glass cross or glass nonwoven fabric. ⁇ impregnated with heat resistant resin.
• OMPI Upholstered boards have been used.
• an electrically insulative film is bonded to a metal foil via an adhesive
• the properties of the film itself as well as the properties of the adhesive used for this purpose affect the performance of the product.
• a film that is highly involved in heat resistance and dimensional stability, such as a polyimide film, the heat resistance, etc. of the film
• the performance of the film is reduced by the adhesive, and the original properties of the film cannot be used.
• a fibrous base material is used, the flexibility such as the bending property is insufficient, and when a three-dimensional wiring is used as a printed wiring board, the wiring is broken and often hindered. .
• an insulative resin is applied on the metal foil surface in a wet state and dried to form a film, and the film itself is used as an insulating layer and a support for a flexible printed circuit.
• the obtained laminate will be more
• the properties of the resin itself can be used as it is as the properties of the printed wiring board.
• a solution casting method is conventionally known as a method for producing a laminate.
• a resin such as epoxy, urethane, and alkyd is used.
• paint can be applied to the surface of a metal foil and dried to form a coating film on the surface of the metal foil.
• the mechanical strength is insufficient and the film cannot be used as a support film for the flexible printed circuit, and the mechanical stress during the processing and use of the printed circuit board continues. It is hard to withstand.
• Plastic resins have drawbacks such as insufficient heat resistance during processing of the flexible printed circuit board and mounting of the obtained printed circuit.
• the film has excellent heat resistance, but lacks polar groups, and thus lacks adhesion to a metal foil. Also, when the above resin is applied on the metal foil surface and cured by drying, curing shrinkage occurs, and the substrate curls largely toward the opposite surface of the metal foil, that is, toward the resin film surface. Practicality as a printed wiring board is not satisfied. This tendency becomes greater as higher molecular weight resins are used. If a polymer resin is not used, the film has weak molecular bonds, poor film-forming properties, and low mechanical strength. As described above, when a heat-resistant resin containing a heterocyclic ring is used, it is necessary for a printed wiring board. The film forming properties related to substrate support, the adhesion to metal foil and the adhesive properties All were good, no well-balanced film was obtained, and the laminate lacked practicality.
• heat resistance of a heat-resistant resin having a heterocyclic ring alone is excellent, but adhesion to a metal foil is poor due to a small number of polar groups.
• curls and seals occur due to shrinkage during curing.
• One object of the present invention is to provide a new flexible printed circuit board that does not have the above-mentioned disadvantages.
• Another object of the present invention is to bond a film while maintaining the properties of a substrate resin without using an adhesive.
• An object of the present invention is to provide a new flexible printed circuit board having high film properties, high mechanical strength of the film, high curl, and extremely excellent properties in practical use.
• the main component is a reaction product of a heat-resistant resin having a heterocyclic ring having a molecular weight of about 500 or more and an epoxy resin containing two or more epoxy groups in the molecule.
• a flexible printed circuit board and a method of manufacturing the same are characterized in that they are directly bonded to each other without using an adhesive. Provided.
• a typical example of the reaction between a heat-resistant resin having a heterocyclic ring and an epoxy resin is modeled as follows.
• the heat-resistant resin reacted with the epoxy resin has a very large number of polar groups, so that a strong adhesion to the metal foil, which cannot be obtained with the heat-resistant resin alone, can be obtained.
• cross-linking occurs due to the three-dimensionalization of the resin, so that linear polymer alone can suppress the large shrinkage due to curing, which results in experimental examples.
• the use of a high-molecular resin is faster than the use of a low-molecular resin, and the mechanical strength of the obtained film is stronger. And knew.
• method (2) corresponds to a step of synthesizing a resin
• method (2) corresponds to a step of casting a resin solution on a metal foil.
• the present inventors have found that the higher the molecular weight of the resin cast on the metal foil, the higher the film having a higher mechanical strength can be obtained.
• the use of a linear high molecular weight compound consisting of only a heat-resistant resin causes greater shrinkage due to curing.
• the resin of the present invention it is possible to make use of the heat resistance of the resin and to solve difficult problems such as the adhesive strength, the curl, and the sea, which are major drawbacks. As a result, a very practical printed wiring board was obtained. Further, by mixing or reacting an epoxy resin having a molecular weight lower than that of the heat-resistant resin, the viscosity of the resin is reduced, so that the resin composition is cast on the metal foil, and the cast surface is reduced. It becomes uniform and the properties as a film are improved, and the thickness accuracy is also improved.
• the metal foil used in the present invention is a metal foil having normal conductivity such as copper foil, aluminum foil, nickel foil, nickel foil, titanium foil and the like.
• the thickness of the metal foil is preferably 1 to 150, and if necessary, gold, nickel, solder, etc. may be plated on the surface.
• the surface of the metal foil may be mechanically roughened by polishing or the like, or a chemical treatment using a chromic acid-sulfuric acid solution or the like may be performed. May be applied to the surface.
• Examples of the heat-resistant resin having a heterocyclic ring include polyimid, polyamidimide, polyester imid, polyester imid, polyimid, and polyimid.
• human da down door Lee down Po Li Yi Mi da non-zero-neck Russia down, Po Li pen Zi Mi da ⁇ Lumpur, Po Li Nono 0 La Bas, phosphate i Mi de, Po Li palapa phosphate, Bo Li Thia, thiol, polypential, polyquinoxaline, polyoxadiazole, and the like and copolymers thereof can be used.
• the above heat-resistant resin has a molecular weight of about 500 or more.
• the heat-resistant tree The heat-resistant tree
• the upper limit of the molecular weight of the fat is not particularly limited, but is preferably about 5,000 to 200,000, and more preferably about 5,000.
• high molecular weight materials are rich in film-forming properties, and when those having a molecular weight of about 500 or more are used, the obtained film has a high tensile strength. Excellent mechanical strength such as About when five 0 0 of less than 0 to is used, full I Le beam is Ri Do anyway.
• Anti-JS polyepoxy compounds or polyglycidyl compounds containing at least two or more epoxy groups in the molecule are used, such as bisphenol , Lysyl ethers, cycloaliphatic polyepoxy compounds, nopolak resin, poly, derived from phenols or halogenated pisphenols Phenol or e.
• a small amount of a low molecular weight monoepoxy compound may be used in combination.
• the epoxy resin described above has a molecular weight of about 800 to about 100,000.
• the epoxy resin described above has a molecular weight of about 800 to about 100,000.
• high-molecular-weight epoxy resins are rich in film-forming properties, especially when more than 800. is used, the resulting film has a high tensile strength. Excellent mechanical strength such as When less than about 800 epoxy resin is used, the film becomes brittle and insufficient as a support for printed wiring boards.
• a small amount of a conventional acid curing agent, an amine curing agent, a polyamide curing agent, and a curing accelerator such as imidal or tertiary amine may be added.
• a flexibility-imparting agent such as polysulfide, polyester, etc., and an antioxidant such as diphenylamine, butyrphenol, etc.
• Fillers such as talc, clay, mai, myritsu, feldspar powder, quartz powder, magnesium oxide, etc., such as carbon black, ferrocyanoluene, etc.
• Flame retardants such as coloring agents, trityl phosphates, tetralomodiphenylmethane, etc .; antimony trioxide; It is permissible to add a small amount of such a flame-retardant aid, and by adding these additives, it can be applied to special applications as printed wiring boards. That.
• the mixing ratio of each resin described above is preferably 100 parts by weight of the heat-resistant resin having a heterocycle, preferably 0.1 to 50 parts by weight of an epoxy resin, and more preferably 0.1 to 50 parts by weight.
• the epoxy resin is 1 to 15 parts by weight based on 100 parts by weight of the heat resistant resin.
• the two resins are not simply mixed, but must be exposed to a temperature of about 15 ° C before casting on the metal foil surface.
• IP "IPO It is preferable to heat and stir at a temperature of 150 ° G for 50 minutes to 10 hours.
• the resin obtained by reacting both resins at a ratio within this range has high film-forming properties, and at the same time, the obtained film is sufficient as a support for a printed wiring board. It has mechanical strength. Further, the above film is excellent in adhesiveness, and the obtained laminate does not have a curl, a sheet, etc. in appearance. Further, since no adhesive is used, heat resistance is high. The performance of the resin is kept as it is, and the resulting laminate is more mechanical, chemical and physical at high temperatures than those obtained using conventional adhesives. In particular, since the thermal degradation of the adhesive strength is very small, the application range of mounting the printed wiring board on various devices is greatly expanded.
• the heat-resistant resin does not crosslink as shown in the reaction formula, and is merely a linear resin. Reams are formed and shrink when cured, producing curls and blemishes, which are serious drawbacks for printed wiring boards. If the amount of the epoxy resin is more than 50 parts by weight, the mixture with the heat-resistant resin is poor, and it is difficult to obtain a uniform mixture. Formability deteriorates.
• the resin composition of the present invention may contain a suitable organic solvent such as dimethyl acetate amide, dimethylformamide, dimethylsulfoxide, ⁇ -methyl Tylpyrrolidon, r-butylylactone, cuff. Loractam, hi. Resin, peri-resin Phenoenole, creel, dichloromethan, dioxan, tetrahydrofuran, toluene, xylene, recrent Ketones such as naphtha, acetone, and methyl ketone-alcohols such as methyl alcohol, alcohol, etc. Soluble in one or more of the following.
• a suitable organic solvent such as dimethyl acetate amide, dimethylformamide, dimethylsulfoxide, ⁇ -methyl Tylpyrrolidon, r-butylylactone, cuff. Loractam, hi. Resin, peri-resin Phenoenole, creel, dichloromethan, dioxan,
• the method of manufacturing a substrate for a printed wiring board is to dissolve the resin composition with a solvent to a concentration of 5 to 70%, and apply this solution on a metal foil surface in a range of 0.5 to 500; Coat or cast to a suitable thickness, and then in a dryer at a temperature of 50-450 ° G for 2 minutes to 2 or more steps as needed. Dry for 5 hours to form a resin film (roll coater, doctor tray, spinner, etc.) , A flow coater or the like is used, and for drying, infrared rays, steam and high frequency waves are used alone or in combination.
• the substrate of the present invention can be used as it is for various flexible printed circuit boards, and the film obtained by removing the metal alone can be used for such a film.
• the film obtained by removing the metal alone can be used for such a film.
• 'I can do it.
• flexible flat cable, flexible surface heater, memory element, Dass / "?, transducer, motor coaxial It can be used in a wide range of fields, such as coils, capacitors, magnetic tapes, footboards, and single-coated films.
• Table 1 shows the performance of the film obtained.
• a solution with a weight of 15% by weight is obtained, and is applied to a thickness of about 5 on a copper foil having a thickness of 55 # using a flow coater. After drying it at 150 ° C for 10 minutes, it was further dried at 220 ° C.
• Table 1 shows the performance of the copper-clad board for a printed wiring board and the performance of a film obtained by etching the copper-clad board in the same manner as in Example 1.
• a 40 weight solution was obtained, and this was applied to a thickness of about 50 ⁇ on aluminum foil having a thickness of 20 using a flow coater,
• Example 1 the performance of the aluminum-clad board as a printed wiring board and the performance of a film obtained by etching the aluminum-clad board in the same manner as in Example 1 are shown.
• Example 2 Using 100 parts by weight of the polyimide resin used in Example 2 and 40 parts by weight of the epoxy resin used in Example 2, copper-clad in the same manner as in Example 2 below. I got a board and made it into a film.
• Table 1 shows the performance of both.
• Example 2 Using the same polyimide resin as in Example 2, but using an epoxy resin with a molecular weight of 590 obtained from the same raw material as in Example 2, the same procedure as in Example 2 was carried out. Lexil copper clad board was obtained, and it was etched to obtain a film.
• Table 2 shows the performance of both.
• Example 1 As the resin, only the polyimide resin used in Example 1 was used, and a flexible copper-clad board was obtained in the same manner as in Example 1 below, and was then etched and processed. To make a film
• Table 1 shows the performance of both.
• Table 1 shows the performance of both.
• Bisphenol A type epoxy resin (Shell's product coating-# 8228) 40 parts by weight, maleic anhydride 30 parts by weight, Lilonitrile-butadiene rubber (50 parts by weight) dissolved in acetate to a concentration of 40 parts by weight is a polyimidifiate with a thickness of 25. To a thickness of approx. 30 ⁇ after drying at 150 C for 5 minutes, and then applying a 55-thick copper foil as described above. Rolled together with the poly-film and passed through the rolls and heat-pressed to make a copper-clad board ⁇ After-working with 150 ° C for 10 hours to completely cure the adhesive was ⁇
• Table 1 shows the performance of this copper-clad board as a printed wiring board and the performance of a film with an adhesive obtained by etching the copper-clad board in the same manner as in Example 1.
• Table 1 shows the performance of both.
• the specimen size of the warp test is 250 x 250 thighs.
• the metal-clad boards obtained according to the present invention have a balanced quality that sufficiently combines the required performance as a printed wiring board. Yes.
• the conventional method using an adhesive Comparative Example 5
• not only the electric greenness but also the tensile strength is more than twice as strong.
• printed wiring boards having a circuit width of 0.1 thigh or less have become possible to be applied with sufficient reliability to applications that often have caused accidents such as circuit wire peeling. This is an epoch-making process, and has a great advantage at the moment when the trend of wiring boards is becoming extremely fine.
• the curing shrinkage is suppressed by the three-dimensional resin, so that the rate of dimensional change only needs to be extremely small, which is an important performance as a printed wiring board. Almost no tools etc. are generated.
• This feature is a necessary condition when processing a metal-clad board into a printed wiring board, and a large improvement in yield is expected.
• the film itself has a strong mechanical strength, and maintains a sufficient strength as a support for a printed wiring board.
• those using the high molecular weight resin of the present invention (Examples 1 to 5) have higher strength.
• the film's motor coil, capacitor, and magnetic tape can be used. It can be applied to such applications.
• the epoxy resin is allowed to react with the heat-resistant resin (Comparative Examples 1 and 2), the peeling strength is remarkable and low, and the warpage is large.
• the epoxy resin is allowed to react with the heat-resistant resin (Comparative Examples 1 and 2)
• the peeling strength is remarkable and low, and the warpage is large.
• the laminate of the metal foil of the present invention and the resin film is applied not only to a conventional use as a substrate for a flexible printed wiring but also to a new field. It has excellent heat resistance, electrical insulation, flexibility, film strength, non-directionality, dimensional stability, adhesiveness, etc. Can be applied, and furthermore, there is very little deterioration in various properties such as electrical insulation, dielectric properties, adhesive strength and the like at a high temperature, and ultra-thin films of about 1 to 10 "can also be used. It is a very useful material in practical use, because it can be made from netokas and industrially at low cost.

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• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Organic Chemistry (AREA)
• Laminated Bodies (AREA)
• Manufacturing Of Printed Wiring (AREA)

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• 1978
  • 1978-06-14 JP JP7089578A patent/JPS54162174A/ja active Granted
• 1979
  • 1979-06-13 US US06/191,215 patent/US4353954A/en not_active Expired - Lifetime
  • 1979-06-13 DE DE7979900652T patent/DE2967245D1/de not_active Expired
  • 1979-06-13 WO PCT/JP1979/000150 patent/WO1980000117A1/ja not_active Ceased
  • 1979-06-14 CA CA329,805A patent/CA1131788A/en not_active Expired
• 1980
  • 1980-01-29 EP EP79900652A patent/EP0016230B1/en not_active Expired

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