USD918848S1 - Retainer of ceiling heater for semiconductor fabrication apparatus - Google Patents

Retainer of ceiling heater for semiconductor fabrication apparatus Download PDF

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Publication number
USD918848S1
USD918848S1 US29/718,687 US201929718687F USD918848S US D918848 S1 USD918848 S1 US D918848S1 US 201929718687 F US201929718687 F US 201929718687F US D918848 S USD918848 S US D918848S
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United States
Prior art keywords
retainer
semiconductor fabrication
fabrication apparatus
ceiling heater
ceiling
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US29/718,687
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English (en)
Inventor
Shinobu Sugiura
Tetsuya Kosugi
Takatomo Yamaguchi
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Kokusai Electric Corp
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Kokusai Electric Corp
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Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOSUGI, TETSUYA, SUGIURA, SHINOBU, YAMAGUCHI, TAKATOMO
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US29/718,687 2019-07-18 2019-12-27 Retainer of ceiling heater for semiconductor fabrication apparatus Active USD918848S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-016134 2019-01-31
JPD2019-16134F JP1651623S (enrdf_load_stackoverflow) 2019-07-18 2019-07-18

Publications (1)

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USD918848S1 true USD918848S1 (en) 2021-05-11

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US (1) USD918848S1 (enrdf_load_stackoverflow)
JP (1) JP1651623S (enrdf_load_stackoverflow)
TW (1) TWD206653S (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD940131S1 (en) * 2019-07-29 2022-01-04 Samsung Display Co., Ltd. Display panel
USD954567S1 (en) * 2019-06-25 2022-06-14 Ebara Corporation Measurement jig
USD958094S1 (en) 2019-07-29 2022-07-19 Samsung Display Co., Ltd. Display panel
USD959393S1 (en) * 2020-09-24 2022-08-02 Kokusai Electric Corporation Ceiling heater for substrate processing apparatus
USD962183S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD962184S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD966276S1 (en) 2019-07-29 2022-10-11 Samsung Display Co., Ltd. Display module for wearable device
USD980177S1 (en) * 2020-09-24 2023-03-07 Kokusai Electric Corporation Ceiling heater for substrate processing apparatus
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1021832S1 (en) * 2020-09-17 2024-04-09 Ebara Corporation Elastic membrane

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD223375S (zh) 2021-03-29 2023-02-01 大陸商北京北方華創微電子裝備有限公司 靜電卡盤

Citations (39)

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US5533924A (en) * 1994-09-01 1996-07-09 Micron Technology, Inc. Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafers
USD405427S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
US6030487A (en) * 1997-06-19 2000-02-29 International Business Machines Corporation Wafer carrier assembly
US6179956B1 (en) * 1998-01-09 2001-01-30 Lsi Logic Corporation Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
US6390904B1 (en) * 1998-05-21 2002-05-21 Applied Materials, Inc. Retainers and non-abrasive liners used in chemical mechanical polishing
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6602116B1 (en) * 1997-12-30 2003-08-05 Applied Materials Inc. Substrate retaining ring
US6659850B2 (en) * 2000-03-31 2003-12-09 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6719874B1 (en) * 2001-03-30 2004-04-13 Lam Research Corporation Active retaining ring support
US6733616B2 (en) * 2001-05-25 2004-05-11 Benq Corporation Surface isolation device
US6913669B2 (en) * 2002-10-02 2005-07-05 Ensinger Kunststofftechnologie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
US7326105B2 (en) * 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
US7344434B2 (en) * 2003-11-13 2008-03-18 Applied Materials, Inc. Retaining ring with shaped surface
USD589471S1 (en) * 2006-09-28 2009-03-31 Tokyo Electron Limited Heater for manufacturing semiconductor
USD600220S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD600660S1 (en) * 2008-03-28 2009-09-22 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD601521S1 (en) * 2006-09-28 2009-10-06 Tokyo Electron Limited Heater for manufacturing semiconductor
USD615937S1 (en) * 2009-03-06 2010-05-18 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
US7819723B2 (en) * 2007-03-22 2010-10-26 Nec Electronics Corporation Retainer ring and polishing machine
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
US8298046B2 (en) * 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
US8517803B2 (en) * 2009-09-16 2013-08-27 SPM Technology, Inc. Retaining ring for chemical mechanical polishing
USD732094S1 (en) * 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US20160376701A1 (en) * 2014-03-20 2016-12-29 Hitachi Kokusai Electric Inc. Substrate processing apparatus and ceiling part
US20170009367A1 (en) * 2015-07-09 2017-01-12 Applied Materials, Inc. Wafer electroplating chuck assembly
JP1581406S (enrdf_load_stackoverflow) 2016-10-14 2017-07-18
USD794585S1 (en) * 2015-10-06 2017-08-15 Ebara Corporation Retainer ring for substrate
USD797690S1 (en) * 2015-03-16 2017-09-19 Nuflare Technology, Inc. Heater for semiconductor manufacturing apparatus
USD798250S1 (en) * 2015-12-01 2017-09-26 Nuflare Technology, Inc. Heater
USD814432S1 (en) * 2016-02-09 2018-04-03 Witricity Corporation Resonator coil
USD825503S1 (en) * 2017-06-07 2018-08-14 Witricity Corporation Resonator coil
US20190024232A1 (en) * 2017-07-14 2019-01-24 Hitachi Kokusai Electric Inc. Substrate processing apparatus and substrate retainer
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US20190284696A1 (en) * 2016-12-01 2019-09-19 Kokusai Electric Corporation Substrate processing apparatus and ceiling heater
US10500694B2 (en) * 2013-01-11 2019-12-10 Applied Materials, Inc. Chemical mechanical polishing apparatus and methods
USD881126S1 (en) * 2017-08-04 2020-04-14 Holygo Corporation Coil for wireless charger

Patent Citations (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5533924A (en) * 1994-09-01 1996-07-09 Micron Technology, Inc. Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafers
USD405427S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
US6030487A (en) * 1997-06-19 2000-02-29 International Business Machines Corporation Wafer carrier assembly
US6602116B1 (en) * 1997-12-30 2003-08-05 Applied Materials Inc. Substrate retaining ring
US6179956B1 (en) * 1998-01-09 2001-01-30 Lsi Logic Corporation Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6390904B1 (en) * 1998-05-21 2002-05-21 Applied Materials, Inc. Retainers and non-abrasive liners used in chemical mechanical polishing
US6659850B2 (en) * 2000-03-31 2003-12-09 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6719874B1 (en) * 2001-03-30 2004-04-13 Lam Research Corporation Active retaining ring support
US6733616B2 (en) * 2001-05-25 2004-05-11 Benq Corporation Surface isolation device
US6913669B2 (en) * 2002-10-02 2005-07-05 Ensinger Kunststofftechnologie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
US7344434B2 (en) * 2003-11-13 2008-03-18 Applied Materials, Inc. Retaining ring with shaped surface
US7326105B2 (en) * 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
USD589471S1 (en) * 2006-09-28 2009-03-31 Tokyo Electron Limited Heater for manufacturing semiconductor
USD601521S1 (en) * 2006-09-28 2009-10-06 Tokyo Electron Limited Heater for manufacturing semiconductor
US7819723B2 (en) * 2007-03-22 2010-10-26 Nec Electronics Corporation Retainer ring and polishing machine
USD600220S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD600660S1 (en) * 2008-03-28 2009-09-22 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD615937S1 (en) * 2009-03-06 2010-05-18 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US8517803B2 (en) * 2009-09-16 2013-08-27 SPM Technology, Inc. Retaining ring for chemical mechanical polishing
US8298046B2 (en) * 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
USD732094S1 (en) * 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
US10500694B2 (en) * 2013-01-11 2019-12-10 Applied Materials, Inc. Chemical mechanical polishing apparatus and methods
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US20160376701A1 (en) * 2014-03-20 2016-12-29 Hitachi Kokusai Electric Inc. Substrate processing apparatus and ceiling part
USD797690S1 (en) * 2015-03-16 2017-09-19 Nuflare Technology, Inc. Heater for semiconductor manufacturing apparatus
US20170009367A1 (en) * 2015-07-09 2017-01-12 Applied Materials, Inc. Wafer electroplating chuck assembly
USD794585S1 (en) * 2015-10-06 2017-08-15 Ebara Corporation Retainer ring for substrate
USD798250S1 (en) * 2015-12-01 2017-09-26 Nuflare Technology, Inc. Heater
USD814432S1 (en) * 2016-02-09 2018-04-03 Witricity Corporation Resonator coil
USD826185S1 (en) * 2016-10-14 2018-08-21 Hitachi Kokusai Electric Inc. Ceiling heater for substrate processing apparatus
JP1581406S (enrdf_load_stackoverflow) 2016-10-14 2017-07-18
US20190284696A1 (en) * 2016-12-01 2019-09-19 Kokusai Electric Corporation Substrate processing apparatus and ceiling heater
USD825503S1 (en) * 2017-06-07 2018-08-14 Witricity Corporation Resonator coil
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US20190024232A1 (en) * 2017-07-14 2019-01-24 Hitachi Kokusai Electric Inc. Substrate processing apparatus and substrate retainer
USD881126S1 (en) * 2017-08-04 2020-04-14 Holygo Corporation Coil for wireless charger

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD954567S1 (en) * 2019-06-25 2022-06-14 Ebara Corporation Measurement jig
USD1034248S1 (en) 2019-06-25 2024-07-09 Ebara Corporation Measurement jig
USD1035468S1 (en) 2019-06-25 2024-07-16 Ebara Corporation Measurement jig
USD962183S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD962184S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD940131S1 (en) * 2019-07-29 2022-01-04 Samsung Display Co., Ltd. Display panel
USD958094S1 (en) 2019-07-29 2022-07-19 Samsung Display Co., Ltd. Display panel
USD966276S1 (en) 2019-07-29 2022-10-11 Samsung Display Co., Ltd. Display module for wearable device
USD1021832S1 (en) * 2020-09-17 2024-04-09 Ebara Corporation Elastic membrane
USD959393S1 (en) * 2020-09-24 2022-08-02 Kokusai Electric Corporation Ceiling heater for substrate processing apparatus
USD980177S1 (en) * 2020-09-24 2023-03-07 Kokusai Electric Corporation Ceiling heater for substrate processing apparatus
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication

Also Published As

Publication number Publication date
TWD206653S (zh) 2020-08-21
JP1651623S (enrdf_load_stackoverflow) 2020-01-27

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