USD840365S1 - Cover ring for a plasma processing apparatus - Google Patents

Cover ring for a plasma processing apparatus Download PDF

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Publication number
USD840365S1
USD840365S1 US29/610,999 US201729610999F USD840365S US D840365 S1 USD840365 S1 US D840365S1 US 201729610999 F US201729610999 F US 201729610999F US D840365 S USD840365 S US D840365S
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United States
Prior art keywords
processing apparatus
plasma processing
cover ring
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entitled
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US29/610,999
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Inventor
Takamasa ICHINO
Kohei Sato
Kazunori Nakamoto
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Assigned to HITACHI HIGH-TECHNOLOGIES CORPORATION reassignment HITACHI HIGH-TECHNOLOGIES CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ICHINO, TAKAMASA, NAKAMOTO, KAZUNORI, SATO, KOHEI
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Assigned to HITACHI HIGH-TECH CORPORATION reassignment HITACHI HIGH-TECH CORPORATION CHANGE OF NAME AND ADDRESS Assignors: HITACHI HIGH-TECHNOLOGIES CORPORATION
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US29/610,999 2017-01-31 2017-07-18 Cover ring for a plasma processing apparatus Active USD840365S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2017-1755F JP1584146S (enrdf_load_stackoverflow) 2017-01-31 2017-01-31
JP2017-001755 2017-01-31

Publications (1)

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USD840365S1 true USD840365S1 (en) 2019-02-12

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US29/610,999 Active USD840365S1 (en) 2017-01-31 2017-07-18 Cover ring for a plasma processing apparatus

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US (1) USD840365S1 (enrdf_load_stackoverflow)
JP (1) JP1584146S (enrdf_load_stackoverflow)
TW (1) TWD190344S (enrdf_load_stackoverflow)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD882536S1 (en) * 2017-04-28 2020-04-28 Applied Materials, Inc. Plasma source liner
USD891636S1 (en) * 2018-10-25 2020-07-28 Hitachi High-Tech Corporation Ring for a plasma processing apparatus
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD918273S1 (en) * 2019-05-14 2021-05-04 Dana Gonzalez Shoe and float collar device
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD953986S1 (en) * 2020-08-11 2022-06-07 Neturen Co., Ltd. Rectifier
USD953985S1 (en) * 2020-08-11 2022-06-07 Neturen Co., Ltd. Rectifier
USD954649S1 (en) * 2020-08-11 2022-06-14 Neturen Co., Ltd. Rectifier
USD954648S1 (en) * 2020-08-11 2022-06-14 Neturen Co., Ltd. Rectifier
USD956705S1 (en) * 2019-11-07 2022-07-05 Lam Research Corporation Cooling plate for a semiconductor processing apparatus
USD1003243S1 (en) * 2021-06-28 2023-10-31 Kokusai Electric Corporation Heat insulator cover of semiconductor manufacturing apparatus
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector
US12100577B2 (en) 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US20030066484A1 (en) * 2001-09-26 2003-04-10 Kawasaki Microelectronics, Inc. Electrode cover, plasma apparatus utilizing the cover, and method of fitting the cover onto the plasma electrode
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
USD494551S1 (en) 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
US20050258280A1 (en) * 2004-05-24 2005-11-24 Shin-Etsu Chemical Co., Ltd. Shower plate for plasma processing apparatus and plasma processing apparatus
US7186171B2 (en) * 2005-04-22 2007-03-06 Applied Materials, Inc. Composite retaining ring
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD557425S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US20080121620A1 (en) * 2006-11-24 2008-05-29 Guo G X Processing chamber
USD638550S1 (en) * 2009-11-13 2011-05-24 3M Innovative Properties Company Sample processing disk cover
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
USD667561S1 (en) * 2009-11-13 2012-09-18 3M Innovative Properties Company Sample processing disk cover
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
JP1551512S (enrdf_load_stackoverflow) 2015-06-12 2016-06-13
USD770992S1 (en) 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD802545S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Lower chamber for a plasma processing apparatus

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US20030066484A1 (en) * 2001-09-26 2003-04-10 Kawasaki Microelectronics, Inc. Electrode cover, plasma apparatus utilizing the cover, and method of fitting the cover onto the plasma electrode
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
USD494551S1 (en) 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
US20050258280A1 (en) * 2004-05-24 2005-11-24 Shin-Etsu Chemical Co., Ltd. Shower plate for plasma processing apparatus and plasma processing apparatus
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US7186171B2 (en) * 2005-04-22 2007-03-06 Applied Materials, Inc. Composite retaining ring
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD557425S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US20080121620A1 (en) * 2006-11-24 2008-05-29 Guo G X Processing chamber
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
USD638550S1 (en) * 2009-11-13 2011-05-24 3M Innovative Properties Company Sample processing disk cover
USD667561S1 (en) * 2009-11-13 2012-09-18 3M Innovative Properties Company Sample processing disk cover
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
JP1551512S (enrdf_load_stackoverflow) 2015-06-12 2016-06-13
USD770992S1 (en) 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD802545S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Lower chamber for a plasma processing apparatus

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
Ichino et al., Design U.S. Appl. No. 29/610,995, filed Jul. 18, 2017.
Ichino et al., Design U.S. Appl. No. 29/610,996, filed Jul. 18, 2017.
Ichino et al., Design U.S. Appl. No. 29/610,998, filed Jul. 18, 2017.
Nunomura et al., Design U.S. Appl. No. 29/611,001, filed Jul. 18, 2017.

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD882536S1 (en) * 2017-04-28 2020-04-28 Applied Materials, Inc. Plasma source liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD891636S1 (en) * 2018-10-25 2020-07-28 Hitachi High-Tech Corporation Ring for a plasma processing apparatus
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD918273S1 (en) * 2019-05-14 2021-05-04 Dana Gonzalez Shoe and float collar device
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD971167S1 (en) * 2019-08-28 2022-11-29 Applied Materials, Inc. Lower shield for a substrate processing chamber
US12100577B2 (en) 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber
USD956705S1 (en) * 2019-11-07 2022-07-05 Lam Research Corporation Cooling plate for a semiconductor processing apparatus
USD953986S1 (en) * 2020-08-11 2022-06-07 Neturen Co., Ltd. Rectifier
USD953985S1 (en) * 2020-08-11 2022-06-07 Neturen Co., Ltd. Rectifier
USD954649S1 (en) * 2020-08-11 2022-06-14 Neturen Co., Ltd. Rectifier
USD954648S1 (en) * 2020-08-11 2022-06-14 Neturen Co., Ltd. Rectifier
USD1003243S1 (en) * 2021-06-28 2023-10-31 Kokusai Electric Corporation Heat insulator cover of semiconductor manufacturing apparatus
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector

Also Published As

Publication number Publication date
TWD190344S (zh) 2018-05-11
JP1584146S (enrdf_load_stackoverflow) 2017-08-21

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