JP1551512S - - Google Patents

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Publication number
JP1551512S
JP1551512S JPD2015-13036F JP2015013036F JP1551512S JP 1551512 S JP1551512 S JP 1551512S JP 2015013036 F JP2015013036 F JP 2015013036F JP 1551512 S JP1551512 S JP 1551512S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2015-13036F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2015-13036F priority Critical patent/JP1551512S/ja
Priority to TW104305549F priority patent/TWD175853S/zh
Priority to US29/544,069 priority patent/USD802790S1/en
Application granted granted Critical
Publication of JP1551512S publication Critical patent/JP1551512S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JPD2015-13036F 2015-06-12 2015-06-12 Active JP1551512S (enrdf_load_stackoverflow)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2015-13036F JP1551512S (enrdf_load_stackoverflow) 2015-06-12 2015-06-12
TW104305549F TWD175853S (zh) 2015-06-12 2015-10-06 電漿處理裝置用罩環
US29/544,069 USD802790S1 (en) 2015-06-12 2015-10-30 Cover ring for a plasma processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-13036F JP1551512S (enrdf_load_stackoverflow) 2015-06-12 2015-06-12

Publications (1)

Publication Number Publication Date
JP1551512S true JP1551512S (enrdf_load_stackoverflow) 2016-06-13

Family

ID=56105200

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2015-13036F Active JP1551512S (enrdf_load_stackoverflow) 2015-06-12 2015-06-12

Country Status (3)

Country Link
US (1) USD802790S1 (enrdf_load_stackoverflow)
JP (1) JP1551512S (enrdf_load_stackoverflow)
TW (1) TWD175853S (enrdf_load_stackoverflow)

Cited By (3)

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Publication number Priority date Publication date Assignee Title
USD836573S1 (en) 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD840365S1 (en) 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD907593S1 (en) 2017-01-20 2021-01-12 Hitachi High-Tech Corporation Discharge chamber for a plasma processing apparatus

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USD882536S1 (en) * 2017-04-28 2020-04-28 Applied Materials, Inc. Plasma source liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD859333S1 (en) 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD858468S1 (en) 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
JP1640255S (enrdf_load_stackoverflow) * 2018-10-25 2019-09-02
USD881767S1 (en) * 2018-11-30 2020-04-21 Warn Automotive, Llc Latch ring
JP1638504S (enrdf_load_stackoverflow) * 2018-12-06 2019-08-05
USD918273S1 (en) * 2019-05-14 2021-05-04 Dana Gonzalez Shoe and float collar device
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
US12100577B2 (en) 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
US12080522B2 (en) 2020-04-22 2024-09-03 Applied Materials, Inc. Preclean chamber upper shield with showerhead
USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1038901S1 (en) 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector

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USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
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US7252738B2 (en) * 2002-09-20 2007-08-07 Lam Research Corporation Apparatus for reducing polymer deposition on a substrate and substrate support
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USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US7186171B2 (en) * 2005-04-22 2007-03-06 Applied Materials, Inc. Composite retaining ring
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
US20080121620A1 (en) * 2006-11-24 2008-05-29 Guo G X Processing chamber
US8298046B2 (en) * 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
USD667561S1 (en) * 2009-11-13 2012-09-18 3M Innovative Properties Company Sample processing disk cover
USD638550S1 (en) * 2009-11-13 2011-05-24 3M Innovative Properties Company Sample processing disk cover
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
JP1546800S (enrdf_load_stackoverflow) * 2015-06-12 2016-03-28

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD907593S1 (en) 2017-01-20 2021-01-12 Hitachi High-Tech Corporation Discharge chamber for a plasma processing apparatus
USD836573S1 (en) 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD840365S1 (en) 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus

Also Published As

Publication number Publication date
TWD175853S (zh) 2016-05-21
USD802790S1 (en) 2017-11-14

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