TWD175853S - 電漿處理裝置用罩環 - Google Patents

電漿處理裝置用罩環

Info

Publication number
TWD175853S
TWD175853S TW104305549F TW104305549F TWD175853S TW D175853 S TWD175853 S TW D175853S TW 104305549 F TW104305549 F TW 104305549F TW 104305549 F TW104305549 F TW 104305549F TW D175853 S TWD175853 S TW D175853S
Authority
TW
Taiwan
Prior art keywords
plasma processing
sample table
plasma
processing equipment
cover
Prior art date
Application number
TW104305549F
Other languages
English (en)
Chinese (zh)
Inventor
Susumu Tauchi
Takashi Uemura
Kohei Sato
Original Assignee
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Corp filed Critical Hitachi High Tech Corp
Publication of TWD175853S publication Critical patent/TWD175853S/zh

Links

TW104305549F 2015-06-12 2015-10-06 電漿處理裝置用罩環 TWD175853S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-13036F JP1551512S (enrdf_load_stackoverflow) 2015-06-12 2015-06-12

Publications (1)

Publication Number Publication Date
TWD175853S true TWD175853S (zh) 2016-05-21

Family

ID=56105200

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104305549F TWD175853S (zh) 2015-06-12 2015-10-06 電漿處理裝置用罩環

Country Status (3)

Country Link
US (1) USD802790S1 (enrdf_load_stackoverflow)
JP (1) JP1551512S (enrdf_load_stackoverflow)
TW (1) TWD175853S (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD858468S1 (en) 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD859333S1 (en) 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD1038901S1 (en) 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1611626S (enrdf_load_stackoverflow) 2017-01-20 2018-08-20
JP1584146S (enrdf_load_stackoverflow) 2017-01-31 2017-08-21
JP1584784S (enrdf_load_stackoverflow) 2017-01-31 2017-08-28
USD872859S1 (en) * 2017-03-09 2020-01-14 Pieter Van Weenen & Co. Gmbh Part of an apparatus for medical and laboratory diagnosis
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD882536S1 (en) * 2017-04-28 2020-04-28 Applied Materials, Inc. Plasma source liner
JP1640255S (enrdf_load_stackoverflow) * 2018-10-25 2019-09-02
USD881767S1 (en) * 2018-11-30 2020-04-21 Warn Automotive, Llc Latch ring
JP1638504S (enrdf_load_stackoverflow) * 2018-12-06 2019-08-05
USD918273S1 (en) * 2019-05-14 2021-05-04 Dana Gonzalez Shoe and float collar device
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
US12100577B2 (en) 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber
US12080522B2 (en) 2020-04-22 2024-09-03 Applied Materials, Inc. Preclean chamber upper shield with showerhead
USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
JP1724328S (ja) * 2022-02-10 2022-09-08 プラズマ処理装置用アッパーチャンバ
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US6423175B1 (en) * 1999-10-06 2002-07-23 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for reducing particle contamination in an etcher
JP2003100713A (ja) * 2001-09-26 2003-04-04 Kawasaki Microelectronics Kk プラズマ電極用カバー
US7252738B2 (en) * 2002-09-20 2007-08-07 Lam Research Corporation Apparatus for reducing polymer deposition on a substrate and substrate support
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
JP2005340251A (ja) * 2004-05-24 2005-12-08 Shin Etsu Chem Co Ltd プラズマ処理装置用のシャワープレート及びプラズマ処理装置
TWD121115S1 (zh) * 2005-03-30 2008-01-21 東京威力科創股份有限公司 遮護環
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US7186171B2 (en) * 2005-04-22 2007-03-06 Applied Materials, Inc. Composite retaining ring
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20080121620A1 (en) * 2006-11-24 2008-05-29 Guo G X Processing chamber
US8298046B2 (en) * 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
USD638550S1 (en) * 2009-11-13 2011-05-24 3M Innovative Properties Company Sample processing disk cover
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
USD667561S1 (en) * 2009-11-13 2012-09-18 3M Innovative Properties Company Sample processing disk cover
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
JP1546800S (enrdf_load_stackoverflow) * 2015-06-12 2016-03-28

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD858468S1 (en) 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD859333S1 (en) 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1038901S1 (en) 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

Also Published As

Publication number Publication date
USD802790S1 (en) 2017-11-14
JP1551512S (enrdf_load_stackoverflow) 2016-06-13

Similar Documents

Publication Publication Date Title
TWD175853S (zh) 電漿處理裝置用罩環
TWD175854S (zh) 電漿處理裝置用保護環
TWD193612S (zh) Protective ring for plasma processing equipment
TWD186394S (zh) 電漿處理裝置用保護環
TWD175852S (zh) 電漿處理裝置用上腔室
TWD186395S (zh) 電漿處理裝置用保護環
TWD175855S (zh) 電漿處理裝置用下腔室
TWD190344S (zh) Shield ring for plasma processing unit
TWD197753S (zh) 一組安裝裝置
CN301985428S (zh) 工具箱
CN302489529S (zh) 数控机床（hs1066）
CN302383394S (zh) 七轴龙门式复合加工中心
CN302518728S (zh) 加工中心
CN302043992S (zh) 加工中心
CN302490381S (zh) 制氧机
CN302509102S (zh) 复底片(fdp-a)
CN302372927S (zh) 加工中心
CN302532247S (zh) 办公椅扶手(kl302)
CN302423817S (zh) 3d 曲面车削设备
CN302484162S (zh) 数控机床安装实训设备
CN302322178S (zh) 加工工件的机器
CN302333422S (zh) 加工工件的机器
CN302333423S (zh) 加工工件的机器
CN302154306S (zh) 扶手架装饰罩
CN302511361S (zh) 机器人