USD956705S1 - Cooling plate for a semiconductor processing apparatus - Google Patents

Cooling plate for a semiconductor processing apparatus Download PDF

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Publication number
USD956705S1
USD956705S1 US29/733,653 US202029733653F USD956705S US D956705 S1 USD956705 S1 US D956705S1 US 202029733653 F US202029733653 F US 202029733653F US D956705 S USD956705 S US D956705S
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Prior art keywords
processing apparatus
cooling plate
semiconductor processing
depicts
view
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US29/733,653
Inventor
Bin Luo
Damien Slevin
Allan Matthew Jones
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Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Assigned to LAM RESEARCH CORPORATION, reassignment LAM RESEARCH CORPORATION, ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LUO, BIN, SLEVIN, DAMIEN, JONES, ALLAN
Assigned to LAM RESEARCH CORPORATION reassignment LAM RESEARCH CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JONES, ALLAN MATTHEW, LUO, BIN, SLEVIN, Damien Martin
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FIG. 1 depicts a perspective view of a first cooling plate for a semiconductor processing apparatus.
FIG. 2 depicts another perspective view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 3 depicts yet another perspective view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 4 depicts another perspective view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 5 depicts yet another perspective view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 6 depicts a top view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 7 depicts a bottom view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 8 depicts a front view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 9 depicts a back view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 10 depicts a right side view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 11 depicts a left side view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 12 depicts a perspective view of a second cooling plate for a semiconductor processing apparatus.
FIG. 13 depicts another perspective view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 14 depicts yet another perspective view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 15 depicts another perspective view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 16 depicts yet another perspective view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 17 depicts a top view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 18 depicts a bottom view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 19 depicts a front view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 20 depicts a back view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 21 depicts a right side view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 22 depicts a left side view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 23 depicts a perspective view of a third cooling plate for a semiconductor processing apparatus.
FIG. 24 depicts another perspective view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
FIG. 25 depicts yet another perspective view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
FIG. 26 depicts another perspective view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
FIG. 27 depicts yet another perspective view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
FIG. 28 depicts a top view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
FIG. 29 depicts a bottom view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
FIG. 30 depicts a front view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
FIG. 31 depicts a back view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
FIG. 32 depicts a right side view of the third cooling plate for a semiconductor processing apparatus of FIG. 23; and,
FIG. 33 depicts a left side view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
Broken, dashed lines are used to represent portions of the article that do not form a part of the design. The broken, dash-dot-dash boundary line is used to represent a boundary between claimed and unclaimed subject matter.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a cooling plate for a semiconductor processing apparatus, as shown and described.
US29/733,653 2019-11-07 2020-05-05 Cooling plate for a semiconductor processing apparatus Active USD956705S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR30-2019-0053204 2019-11-07
KR20190053204 2019-11-07

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USD956705S1 true USD956705S1 (en) 2022-07-05

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JP (1) JP1678672S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD986191S1 (en) * 2023-01-12 2023-05-16 Lincun Wen Circuit board
USD986192S1 (en) * 2023-01-12 2023-05-16 Lincun Wen Circuit board

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USD608354S1 (en) * 2009-07-08 2010-01-19 Cheng Uei Precision Industry Co., Ltd. Double-band antenna
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US20130333768A1 (en) * 2012-06-15 2013-12-19 Ramesh Chandrasekharan Point of use valve manifold for semiconductor fabrication equipment
US9091491B2 (en) * 2008-02-22 2015-07-28 Applied Materials, Inc. Cooling plates and semiconductor apparatus thereof
USD794586S1 (en) * 2015-11-12 2017-08-15 Mitsubishi Electric Corporation Circuit board
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD804437S1 (en) * 2016-09-30 2017-12-05 Norton (Waterford) Limited Circuit board
USD819581S1 (en) * 2014-07-17 2018-06-05 Advantest Corporation Socket for electronic device testing apparatus
USD827588S1 (en) * 2016-12-27 2018-09-04 Sony Corporation Chip connector
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US20190215987A1 (en) * 2018-01-11 2019-07-11 Asia Vital Components Co., Ltd. Water-cooling radiator structure
USD868013S1 (en) * 2017-01-18 2019-11-26 Kokusai Electric Corporation Cassette receiving tool for semiconductor manufacturing apparatus
US10590535B2 (en) * 2017-07-26 2020-03-17 Asm Ip Holdings B.V. Chemical treatment, deposition and/or infiltration apparatus and method for using the same
USD883240S1 (en) * 2008-09-18 2020-05-05 Advanced Powertrain Engineering, Llc Printed circuit for an automatic transmission solenoid module
USD909979S1 (en) * 2017-11-28 2021-02-09 Tai-Sol Electronics Co., Ltd. Vapor chamber
USD930782S1 (en) * 2019-08-22 2021-09-14 Asm Ip Holding B.V. Gas distributor
USD931978S1 (en) * 2019-06-27 2021-09-28 Asm Ip Holding B.V. Showerhead vacuum transport
USD935572S1 (en) * 2019-05-24 2021-11-09 Asm Ip Holding B.V. Gas channel plate
USD940837S1 (en) * 2019-08-22 2022-01-11 Asm Ip Holding B.V. Electrode
US11230766B2 (en) * 2018-03-29 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD465772S1 (en) * 2001-04-20 2002-11-19 3Com Corporation Printed circuit board
US9091491B2 (en) * 2008-02-22 2015-07-28 Applied Materials, Inc. Cooling plates and semiconductor apparatus thereof
USD589011S1 (en) * 2008-02-22 2009-03-24 Centipede Systems, Inc. Tray for semiconductor devices with castellations
USD883240S1 (en) * 2008-09-18 2020-05-05 Advanced Powertrain Engineering, Llc Printed circuit for an automatic transmission solenoid module
USD608354S1 (en) * 2009-07-08 2010-01-19 Cheng Uei Precision Industry Co., Ltd. Double-band antenna
USD649534S1 (en) * 2011-07-12 2011-11-29 Cheng Uei Precision Industry Co., Ltd. Antenna
US20130333768A1 (en) * 2012-06-15 2013-12-19 Ramesh Chandrasekharan Point of use valve manifold for semiconductor fabrication equipment
USD819581S1 (en) * 2014-07-17 2018-06-05 Advantest Corporation Socket for electronic device testing apparatus
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD794586S1 (en) * 2015-11-12 2017-08-15 Mitsubishi Electric Corporation Circuit board
USD804437S1 (en) * 2016-09-30 2017-12-05 Norton (Waterford) Limited Circuit board
USD827588S1 (en) * 2016-12-27 2018-09-04 Sony Corporation Chip connector
USD868013S1 (en) * 2017-01-18 2019-11-26 Kokusai Electric Corporation Cassette receiving tool for semiconductor manufacturing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US10590535B2 (en) * 2017-07-26 2020-03-17 Asm Ip Holdings B.V. Chemical treatment, deposition and/or infiltration apparatus and method for using the same
USD909979S1 (en) * 2017-11-28 2021-02-09 Tai-Sol Electronics Co., Ltd. Vapor chamber
US20190215987A1 (en) * 2018-01-11 2019-07-11 Asia Vital Components Co., Ltd. Water-cooling radiator structure
US11230766B2 (en) * 2018-03-29 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method
USD935572S1 (en) * 2019-05-24 2021-11-09 Asm Ip Holding B.V. Gas channel plate
USD931978S1 (en) * 2019-06-27 2021-09-28 Asm Ip Holding B.V. Showerhead vacuum transport
USD930782S1 (en) * 2019-08-22 2021-09-14 Asm Ip Holding B.V. Gas distributor
USD940837S1 (en) * 2019-08-22 2022-01-11 Asm Ip Holding B.V. Electrode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD986191S1 (en) * 2023-01-12 2023-05-16 Lincun Wen Circuit board
USD986192S1 (en) * 2023-01-12 2023-05-16 Lincun Wen Circuit board

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