USD465772S1 - Printed circuit board - Google Patents

Printed circuit board Download PDF

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Publication number
USD465772S1
USD465772S1 US29/148,797 US14879701F USD465772S US D465772 S1 USD465772 S1 US D465772S1 US 14879701 F US14879701 F US 14879701F US D465772 S USD465772 S US D465772S
Authority
US
United States
Prior art keywords
circuit board
printed circuit
figures
ornamental design
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/148,797
Inventor
Alan R Poulter
Richard N Bayfield
Bryan J Donoghue
Mark A Bobbitt
David J Law
Edward Turner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Hewlett Packard Enterprise Development LP
Original Assignee
3Com Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3Com Corp filed Critical 3Com Corp
Assigned to 3COM CORPORATION reassignment 3COM CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TURNER, EDWARD, BOBBITT, MARK ANTHONY, LAW, DAVID JOHN, BAYFIELD, RICHARD NEIL, DONOGHUE, BRYAN JAMES, POULTER, ALAN ROGER
Application granted granted Critical
Publication of USD465772S1 publication Critical patent/USD465772S1/en
Assigned to HEWLETT-PACKARD COMPANY reassignment HEWLETT-PACKARD COMPANY MERGER (SEE DOCUMENT FOR DETAILS). Assignors: 3COM CORPORATION
Assigned to HEWLETT-PACKARD COMPANY reassignment HEWLETT-PACKARD COMPANY CORRECTIVE ASSIGNMENT TO CORRECT THE SEE ATTACHED Assignors: 3COM CORPORATION
Assigned to HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. reassignment HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HEWLETT-PACKARD COMPANY
Assigned to HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. reassignment HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. CORRECTIVE ASSIGNMENT PREVIUOSLY RECORDED ON REEL 027329 FRAME 0001 AND 0044. Assignors: HEWLETT-PACKARD COMPANY
Assigned to HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP reassignment HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a three-quarter view of the printed circuit board;
FIG. 2 is a plan view from above of the printed circuit board;
FIG. 3 is a plan view from below of the printed circuit board;
FIG. 4 is a first side view of the printed circuit board;
FIG. 5 is a first end view of the printed circuit board;
FIG. 6 is a second end view of the printed circuit board; and,
FIG. 7 is a second side view of the printed circuit board.

Claims (1)

  1. The ornamental design of a printed circuit board, as shown in the Figures.
US29/148,797 2001-04-20 2001-09-28 Printed circuit board Expired - Lifetime USD465772S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB2101258 2001-04-20
GB2101258 2001-04-20

Publications (1)

Publication Number Publication Date
USD465772S1 true USD465772S1 (en) 2002-11-19

Family

ID=27637560

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/148,797 Expired - Lifetime USD465772S1 (en) 2001-04-20 2001-09-28 Printed circuit board

Country Status (1)

Country Link
US (1) USD465772S1 (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD742338S1 (en) * 2014-08-27 2015-11-03 Apple Inc. MLB module for electronic device
USD753073S1 (en) * 2014-12-30 2016-04-05 Altia Systems, Inc. Printed circuit board
USD757666S1 (en) * 2014-10-16 2016-05-31 Japan Aviation Electronics Industry, Limited Flexible printed circuit
USD798251S1 (en) * 2016-11-07 2017-09-26 Transcend Information, Inc. Printed circuit board of solid-state memory
USD821338S1 (en) * 2015-01-20 2018-06-26 Modus Test Automation, Llc. Contact fields for a printed circuit board
USD821337S1 (en) * 2015-01-20 2018-06-26 Modus Test Automation, Llc. Contact field for a printed circuit board
USD821987S1 (en) * 2016-04-27 2018-07-03 Ngk Insulators, Ltd. Flexible printed circuits
USD843334S1 (en) * 2016-05-11 2019-03-19 Ngk Insulators, Ltd. Flexible printed circuits
USD864131S1 (en) * 2017-06-30 2019-10-22 Tenka Inc. Circuit cube
USD875056S1 (en) * 2017-06-08 2020-02-11 Jie Qi Flexible printed circuit board
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD919700S1 (en) 2018-08-09 2021-05-18 Sato Holdings Kabushiki Kaisha Thermal head for a printer
USD936139S1 (en) * 2018-02-28 2021-11-16 Sato Holdings Kabushiki Kaisha Thermal head for a printer
USD955905S1 (en) * 2020-12-08 2022-06-28 Beijing Voyager Technology Co., Ltd. Light detection and ranging (LIDAR) component
USD956705S1 (en) * 2019-11-07 2022-07-05 Lam Research Corporation Cooling plate for a semiconductor processing apparatus

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD742338S1 (en) * 2014-08-27 2015-11-03 Apple Inc. MLB module for electronic device
USD757666S1 (en) * 2014-10-16 2016-05-31 Japan Aviation Electronics Industry, Limited Flexible printed circuit
USD753073S1 (en) * 2014-12-30 2016-04-05 Altia Systems, Inc. Printed circuit board
USD821338S1 (en) * 2015-01-20 2018-06-26 Modus Test Automation, Llc. Contact fields for a printed circuit board
USD821337S1 (en) * 2015-01-20 2018-06-26 Modus Test Automation, Llc. Contact field for a printed circuit board
USD821987S1 (en) * 2016-04-27 2018-07-03 Ngk Insulators, Ltd. Flexible printed circuits
USD843334S1 (en) * 2016-05-11 2019-03-19 Ngk Insulators, Ltd. Flexible printed circuits
USD798251S1 (en) * 2016-11-07 2017-09-26 Transcend Information, Inc. Printed circuit board of solid-state memory
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD875056S1 (en) * 2017-06-08 2020-02-11 Jie Qi Flexible printed circuit board
USD864131S1 (en) * 2017-06-30 2019-10-22 Tenka Inc. Circuit cube
USD882537S1 (en) 2017-06-30 2020-04-28 Tenka, Inc. Circuit cube
USD886072S1 (en) 2017-06-30 2020-06-02 Tenka Inc. Circuit cube
USD882538S1 (en) 2017-06-30 2020-04-28 Tenka Inc. Circuit cube
USD936139S1 (en) * 2018-02-28 2021-11-16 Sato Holdings Kabushiki Kaisha Thermal head for a printer
USD919700S1 (en) 2018-08-09 2021-05-18 Sato Holdings Kabushiki Kaisha Thermal head for a printer
USD956705S1 (en) * 2019-11-07 2022-07-05 Lam Research Corporation Cooling plate for a semiconductor processing apparatus
USD955905S1 (en) * 2020-12-08 2022-06-28 Beijing Voyager Technology Co., Ltd. Light detection and ranging (LIDAR) component

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