USD821338S1 - Contact fields for a printed circuit board - Google Patents
Contact fields for a printed circuit board Download PDFInfo
- Publication number
- USD821338S1 USD821338S1 US29/515,127 US201529515127F USD821338S US D821338 S1 USD821338 S1 US D821338S1 US 201529515127 F US201529515127 F US 201529515127F US D821338 S USD821338 S US D821338S
- Authority
- US
- United States
- Prior art keywords
- circuit board
- printed circuit
- contact fields
- view
- fields
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Images
Description
The broken lines shown represent portions of the contact fields for a printed circuit board that form no part of the claimed design.
Claims (1)
- The ornamental design for a contact fields for a printed circuit board, substantially as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/515,127 USD821338S1 (en) | 2015-01-20 | 2015-01-20 | Contact fields for a printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/515,127 USD821338S1 (en) | 2015-01-20 | 2015-01-20 | Contact fields for a printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
USD821338S1 true USD821338S1 (en) | 2018-06-26 |
Family
ID=62623529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/515,127 Active USD821338S1 (en) | 2015-01-20 | 2015-01-20 | Contact fields for a printed circuit board |
Country Status (1)
Country | Link |
---|---|
US (1) | USD821338S1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD872032S1 (en) * | 2018-09-14 | 2020-01-07 | Telit Communications S.P.A. | Connection module |
USD872033S1 (en) * | 2018-09-14 | 2020-01-07 | Telit Communications S.P.A. | Connection module |
USD927429S1 (en) * | 2019-03-15 | 2021-08-10 | Modus Test, Llc | Plurality of contact fields for a printed circuit board |
USD933016S1 (en) * | 2019-03-15 | 2021-10-12 | Modus Test, Llc | Contact field for a printed circuit board |
USD937233S1 (en) * | 2019-10-24 | 2021-11-30 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD937232S1 (en) * | 2019-10-24 | 2021-11-30 | Nuvoton Technology Corporation Japan | Semiconductor device |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4330684A (en) * | 1977-12-27 | 1982-05-18 | Hayward C Michael | Matrix board |
USD319629S (en) * | 1988-04-13 | 1991-09-03 | Ibiden Co., Ltd. | Semiconductor substrate with conducting pattern |
US5159536A (en) * | 1988-05-13 | 1992-10-27 | Mupac Corporation | Panel board |
USD334175S (en) * | 1991-04-12 | 1993-03-23 | Oz Technologies, Inc. | Probe interface test board |
US5296652A (en) * | 1991-05-03 | 1994-03-22 | Loral Vought Systems Corporation | Apparatus for attaching a circuit component to a printed circuit board |
US6255600B1 (en) * | 1993-03-01 | 2001-07-03 | The Board Of Trustees Of The University Of Arkansas | Electronic interconnection medium having offset electrical mesh plane |
USD457146S1 (en) * | 2000-11-29 | 2002-05-14 | Kabushiki Kaisha Toshiba | Substrate for a semiconductor element |
USD465772S1 (en) * | 2001-04-20 | 2002-11-19 | 3Com Corporation | Printed circuit board |
US7012196B2 (en) * | 2002-06-05 | 2006-03-14 | Swetland Paul A | Apparatus, method and system for interfacing electronic circuits |
-
2015
- 2015-01-20 US US29/515,127 patent/USD821338S1/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4330684A (en) * | 1977-12-27 | 1982-05-18 | Hayward C Michael | Matrix board |
USD319629S (en) * | 1988-04-13 | 1991-09-03 | Ibiden Co., Ltd. | Semiconductor substrate with conducting pattern |
US5159536A (en) * | 1988-05-13 | 1992-10-27 | Mupac Corporation | Panel board |
USD334175S (en) * | 1991-04-12 | 1993-03-23 | Oz Technologies, Inc. | Probe interface test board |
US5296652A (en) * | 1991-05-03 | 1994-03-22 | Loral Vought Systems Corporation | Apparatus for attaching a circuit component to a printed circuit board |
US6255600B1 (en) * | 1993-03-01 | 2001-07-03 | The Board Of Trustees Of The University Of Arkansas | Electronic interconnection medium having offset electrical mesh plane |
USD457146S1 (en) * | 2000-11-29 | 2002-05-14 | Kabushiki Kaisha Toshiba | Substrate for a semiconductor element |
USD465772S1 (en) * | 2001-04-20 | 2002-11-19 | 3Com Corporation | Printed circuit board |
US7012196B2 (en) * | 2002-06-05 | 2006-03-14 | Swetland Paul A | Apparatus, method and system for interfacing electronic circuits |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD872032S1 (en) * | 2018-09-14 | 2020-01-07 | Telit Communications S.P.A. | Connection module |
USD872033S1 (en) * | 2018-09-14 | 2020-01-07 | Telit Communications S.P.A. | Connection module |
USD927429S1 (en) * | 2019-03-15 | 2021-08-10 | Modus Test, Llc | Plurality of contact fields for a printed circuit board |
USD933016S1 (en) * | 2019-03-15 | 2021-10-12 | Modus Test, Llc | Contact field for a printed circuit board |
USD937233S1 (en) * | 2019-10-24 | 2021-11-30 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD937232S1 (en) * | 2019-10-24 | 2021-11-30 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD938925S1 (en) | 2019-10-24 | 2021-12-21 | Nuvoton Technology Corporation Japan | Semiconductor device |
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