USD796459S1 - Packaged semiconductor circuit module - Google Patents

Packaged semiconductor circuit module Download PDF

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Publication number
USD796459S1
USD796459S1 US29/579,204 US201629579204F USD796459S US D796459 S1 USD796459 S1 US D796459S1 US 201629579204 F US201629579204 F US 201629579204F US D796459 S USD796459 S US D796459S
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United States
Prior art keywords
circuit module
semiconductor circuit
packaged semiconductor
packaged
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US29/579,204
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English (en)
Inventor
Katsuhiro IWAI
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Rohm Co Ltd
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Rohm Co Ltd
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Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IWAI, KATSUHIRO
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US29/579,204 2016-04-11 2016-09-28 Packaged semiconductor circuit module Active USD796459S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2016-7974F JP1563812S (de) 2016-04-11 2016-04-11
JP2016-007974 2016-04-11

Publications (1)

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USD796459S1 true USD796459S1 (en) 2017-09-05

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US (1) USD796459S1 (de)
JP (1) JP1563812S (de)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD837752S1 (en) * 2017-01-31 2019-01-08 Dylan James Sievers Heatsink
USD839244S1 (en) * 2016-04-29 2019-01-29 Laird Technologies, Inc. Antenna housing
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD864135S1 (en) * 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD920265S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD920266S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD924952S1 (en) * 2020-01-07 2021-07-13 Worthington Cylinders Corporation Electronic module for a tank lid
USD928722S1 (en) * 2019-10-02 2021-08-24 Johann Kok Electrical circuit component
USD929477S1 (en) * 2020-01-07 2021-08-31 Worthington Cylinders Corporation Electronic module for a tank lid
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1665773S (de) 2018-11-07 2020-08-11
JP1633578S (de) 2018-11-07 2019-06-10

Citations (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD259560S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259559S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259783S (en) * 1978-08-25 1981-07-07 Hitachi, Ltd. Semiconductor
USD259782S (en) * 1978-07-28 1981-07-07 Hitachi, Ltd. Semiconductor
USD260091S (en) * 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
USD260986S (en) * 1978-08-25 1981-09-29 Hitachi, Ltd. Semiconductor
US4441119A (en) * 1981-01-15 1984-04-03 Mostek Corporation Integrated circuit package
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
US5105257A (en) * 1990-08-08 1992-04-14 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device and semiconductor device packaging element
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD397092S (en) * 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
US6093957A (en) * 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
US6238953B1 (en) * 1999-01-12 2001-05-29 Sony Corporation Lead frame, resin-encapsulated semiconductor device and fabrication process for the device
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6330165B1 (en) * 1998-07-06 2001-12-11 Hitachi, Ltd. Semiconductor device
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
US20030042584A1 (en) * 2001-09-05 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
US6555899B1 (en) * 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
USD475028S1 (en) * 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD480371S1 (en) * 2001-11-30 2003-10-07 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD509810S1 (en) * 2003-07-30 2005-09-20 Delta Electronics Inc. Molding structure of electric element
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module

Patent Citations (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD259560S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259559S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259782S (en) * 1978-07-28 1981-07-07 Hitachi, Ltd. Semiconductor
USD259783S (en) * 1978-08-25 1981-07-07 Hitachi, Ltd. Semiconductor
USD260091S (en) * 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
USD260986S (en) * 1978-08-25 1981-09-29 Hitachi, Ltd. Semiconductor
US4441119A (en) * 1981-01-15 1984-04-03 Mostek Corporation Integrated circuit package
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
US5105257A (en) * 1990-08-08 1992-04-14 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device and semiconductor device packaging element
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD397092S (en) * 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6093957A (en) * 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6330165B1 (en) * 1998-07-06 2001-12-11 Hitachi, Ltd. Semiconductor device
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
US6238953B1 (en) * 1999-01-12 2001-05-29 Sony Corporation Lead frame, resin-encapsulated semiconductor device and fabrication process for the device
US6555899B1 (en) * 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
US20030042584A1 (en) * 2001-09-05 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD480371S1 (en) * 2001-11-30 2003-10-07 Kabushiki Kaisha Toshiba Semiconductor device
USD475028S1 (en) * 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD509810S1 (en) * 2003-07-30 2005-09-20 Delta Electronics Inc. Molding structure of electric element
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD839244S1 (en) * 2016-04-29 2019-01-29 Laird Technologies, Inc. Antenna housing
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD837752S1 (en) * 2017-01-31 2019-01-08 Dylan James Sievers Heatsink
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD864135S1 (en) * 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD920265S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD920266S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD928722S1 (en) * 2019-10-02 2021-08-24 Johann Kok Electrical circuit component
USD924952S1 (en) * 2020-01-07 2021-07-13 Worthington Cylinders Corporation Electronic module for a tank lid
USD929477S1 (en) * 2020-01-07 2021-08-31 Worthington Cylinders Corporation Electronic module for a tank lid
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module

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Publication number Publication date
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