US8110962B2 - MEMS component and method for production - Google Patents
MEMS component and method for production Download PDFInfo
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- US8110962B2 US8110962B2 US12/642,357 US64235709A US8110962B2 US 8110962 B2 US8110962 B2 US 8110962B2 US 64235709 A US64235709 A US 64235709A US 8110962 B2 US8110962 B2 US 8110962B2
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Images
Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02866—Means for compensation or elimination of undesirable effects of bulk wave excitation and reflections
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14538—Formation
Definitions
- the invention relates to an MEMS component (Micro-Electro Mechanical System), wherein disturbing bulk acoustic waves can occur.
- MEMS component Micro-Electro Mechanical System
- Bulk acoustic waves occur as leaky waves of a surface acoustic wave component, SAW component, constructed on a substrate that promotes leaky waves. These bulk waves concomitantly generated by the component structures can be reflected back, by reflection at the rear side of the chip on which the component is constructed, into the acoustically active component structures, where they can generate interference signals. This problem is intensified in the course of miniaturization, involving transition to thinner chips and thus a smaller component height, or when chips are ground and thus thinned from the rear side in a late fabrication stage. As the chip thickness decreases, a higher proportion of bulk waves are reflected back into the component structures.
- the present invention specifies a MEMS component in which the reflection of bulk waves at the chip rear side is reduced and which can be used even in the case of components which have a layer thickness minimized by a thinning of the chip.
- a MEMS component which has a chip which bears component structures on a front side and which has a smooth rear side having a low roughness.
- the latter can amount to less than one tenth of the wavelength which corresponds to the center frequency of an acoustic wave capable of propagating in the component.
- Structures for scattering bulk acoustic waves are now provided on this rear side.
- the structures are fabricated from a material which is acoustically matched to the material of the chip.
- the structures can also comprise other and, e.g., also electrically non-conductive materials.
- the smooth chip rear side has the advantage that the chips can be thinned to a minimal layer thickness during the production of the components without increased risk of fracture. This permits the production of components having a minimal structural height.
- Acoustic matching is understood within the meaning of the invention as material selection that is optimized to the effect that both materials have acoustic impedances that are as close to one another as possible or even identical. Further acoustic matching and thus properties improved further are obtained if the propagation speed of the bulk acoustic waves in both materials is approximated to one another and as far as possible identical. The better the acoustic matching, the more easily the bulk acoustic wave can couple into the metallic structures, in which it can be either damped or scattered.
- a suitable metallic structure having a high scattering capability is obtained with a metal structure having a random and therefore irregular pattern.
- Irregular patterns have the advantage that even in the case of scattering reflection of the bulk acoustic wave, the arising of constructive interference and thus of harmful reflected bulk wave components is avoided to the greatest possible extent.
- metal structures are distributed on the rear side of the chip, on which surface regions occupied by metal and surface regions free of metal structures then alternate in an irregular order.
- the metal structures have a thickness which corresponds to an acoustic “antireflection” means.
- an antireflection means is obtained if bulk wave components reflected from the top side of the metal structures have a propagation time difference of ⁇ /2 relative to the bulk waves reflected at the phase boundary between chip and metal structures, where ⁇ is the wavelength of the bulk acoustic wave in the chip.
- ⁇ is the wavelength of the bulk acoustic wave in the chip.
- n can represent an integer, which advantageously lies between 0 and 6.
- thicker layers are also possible, such that the following can also hold true for n: 0 ⁇ n ⁇ 15.
- the thickness ⁇ /4+n* ⁇ /2 has the advantage that all bulk acoustic waves of wavelength ⁇ which impinge within a specific angular range can be compensated for by destructive interference.
- the metal structure can have average structure sizes of between 0.2 and 5 ⁇ . Structure sizes in the lower range have the advantage that it is thereby possible to form a maximum roughness of the metal structure or a surface where it is possible to obtain a maximum number of alternating structures per unit length or area.
- the average structure sizes are between 0.25 and 0.5 ⁇ . This has the advantage that wave components reflected at the structure edges of the metal structures lead to negative interference and further wave components can be extinguished in this way. This increases the range of possible impingement angles of the bulk acoustic waves within which reflection is reduced or avoided.
- a metallic surface occupancy on the rear side of the chip of 40% to 60%, and, in particular, of 50% is advantageous. With surface occupancy of exactly 50%, it is possible to realize a maximum number of structures per unit length or area for given average structure sizes.
- the surface regions not covered by metal on the rear side of the chip are covered by an acoustic damping composition, and, in particular, by an acoustically matched material, in particular, by a plastic composition.
- This can be acoustically matched by means of a filler.
- the acoustic damping composition can fill the interspaces between the metal structures. It is also possible, however, to apply the acoustic damping composition with a higher layer thickness, such that it both fills the interspaces and covers the metal structures.
- the MEMS component proposed makes it possible to reduce the layer thickness of the chips to less than 200 ⁇ m, preferably to less than 150 ⁇ m, and in the process to use smooth chip rear sides which minimize the risk of fracture during the thinning of the chip during the processing of the thinned chip, without an increased proportion of bulk acoustic waves reflected from the rear side having to be accepted in the process.
- An acceptable trade-off between increased risk of fracture and thus higher rejects and minimal structure height of the component can also be found at a layer thickness of 130 ⁇ m or less.
- the component structures of the chip can realize an SAW component or a BAW (Bulk Acoustic Wave) component, both of which can generate interfering leaky waves that descend into the chip or substrate.
- BAW Bulk Acoustic Wave
- the MEMS component it is also possible for the MEMS component to have other component structures which can likewise be disturbed by bulk acoustic waves. Therefore, the invention also finds application in the case of components whose electrical component properties are essentially defined by the spatial dimensions and which impermissibly alter the component specifications in the event of dimension fluctuations such as can occur on account of bulk acoustic waves.
- a suitably acoustically matched metal for the metal structures is selected depending on the material of the chip.
- MEMS components including a chip composed of lithium tantalate and a metal structure composed of copper, chromium or nickel or a combination of these metals are advantageous.
- MEMS components can be fixed on supports or carriers with integrated interconnections using a flip-chip design, by way of example.
- the chip has solderable contacts on its underside, which are connected to solderable connection pads on the top side of the carrier by means of suitable connecting structures that effect electrical and mechanical connection, and, in particular, by means of bumps.
- External electrical contacts can be provided on the underside of the carrier, the contacts being electrically conductively connected to the solderable connection pads.
- the flip-chip arrangement has the advantage that, preferably, component structures arranged on the underside of the chip are enclosed between chip and carrier and thus mechanically protected against actions from the outside.
- the bump connections between carrier and chip serve as spacers that ensure a certain distance between carrier and chip.
- the free space between chip and carrier can additionally be closed off at the chip edges.
- One suitable method for this is a frame which is applied to the carrier and on which the chip can bear completely in such a way that its component structures are located within the space enclosed by the frame. It is advantageous, for example, to form such a frame in metallic fashion at least at its top side (bearing area of the chip) and to provide it with a planarized surface, in particular. It is then possible for the metal which is used for the production of the metallic structures on the rear side of the chip to be simultaneously used for sealing the separating joint between frame and chip edge by virtue of a metal closure being structured from the metal.
- the chip with a wetting metallization at the side edge at least in the region of the separating joint, which metallization can form a hermetically tight contact with a metal closure and thus enables a hermetic closure of the component structures embedded within the frame between chip and carrier.
- the MEMS component is preferably applied on a ceramic carrier embodied as a multilayer substrate comprising at least two dielectric ceramic layers and a metallization plane arranged therebetween.
- the multilayer substrate is preferably a low-warpage or warpage-free LTCC material (Low Temperature Co-fired Ceramics) or an HTCC material (High Temperature Co-fired Ceramics).
- An electrical interconnection can be realized in the metallization plane. It is also possible to realize passive components such as resistances, inductances or capacitances by means of one or a plurality of metallization planes interconnected with one another.
- the components can also be connected to form circuits and networks and realize RF filters, for example.
- connection technology By means of the connection technology mentioned, and, in particular, as a result of the bearing of the chip on a frame planarized at the surface, it is possible for a MEMS component also to be applied to a carrier that is warped after sintering and hence no longer planar, without increased forces being able to act on the chip as a result.
- Low-stress chip mounting on the carrier is also achieved if the height of the frame is matched to the bump height, the tensile forces which are produced by the contraction of the bumps during melting and act on the chip being minimized.
- the frame at least at its surface, preferably consists of a metal which can be applied simply and cost-effectively.
- the frame can also be applied as a screen printing structure onto the carrier and subsequently be provided with a thin metal layer.
- a metal which can be applied simply and cost-effectively, e.g., by means of electrolytic methods is copper, for example.
- a chip that is mechanically sensitive on account of a small layer thickness is advantageously applied to a frame having a planarized surface and is additionally supported by supporting elements which are provided within the frame on the carrier and which have the same height as the frame.
- Suitable patterns for the metal structure on the chip rear side can be obtained by an irregular distribution of separate metallization areas. Preferably, these areas have the small dimensions mentioned. Preferably, metalized areas having different sizes and different contours are combined to form an irregular pattern.
- a suitable pattern is obtained by juxtaposing irregular polygons, for example, which, avoiding symmetries, form a type of Penrose pattern.
- the polygon edges depending on the patterning, can be embodied as a grating or as a trench pattern.
- the irregular polygons additionally have the advantage that the polygon sections running in rectilinear fashion form a multiplicity of possible edge angles with respect to one another, with the result that a uniform reflection direction is avoided and maximum scattering of the surface wave is obtained.
- the metal structures can additionally have suitable and preferably varying edge angles. With suitable edge angles, the reflection can be influenced further and with the aim of maximum scattering or directional reflection into a region which lies outside the active component structures or in which penetration of reflected bulk waves is harmless.
- a further possible configuration of the metal structures consists in a pattern, which realizes a Bragg grating.
- a Bragg grating acts like a mirror with adjustable directional reflection and likewise enables bulk waves that impinge on the Bragg pattern to be reflected in a targeted manner in a specific direction that is safe for the component structures.
- One suitable method for producing a metal structure on the rear side of the chip consists in photopatterning.
- a resist is applied on the rear side and patterned to form a negative structure of the desired metal structure.
- a metal is then applied up to the desired layer thickness.
- the resist can subsequently be removed.
- the metallization can be effected in two steps, wherein a basic metallization is firstly applied to the chip and is subsequently reinforced electrolytically or in electroless fashion.
- the basic metallization can be applied after the production of the resist structure, for example, by vapor deposition, sputtering or by applying seeds from a solution, for example, by treatment with an activation solution containing palladium ions.
- the basic metallization it is also possible to apply the basic metallization to the chip rear side over the whole area before the production of the resist structure and subsequently to reinforce it, e.g., electrolytically or in electroless fashion, with the aid of the resist structure only at the locations in which a metal pattern is intended to arise.
- the basic metallization preferably applied with minimal layer thickness, can remain on the rear side in this case.
- the basic metallization can comprise a metal which is not acoustically matched. Up to a minimal layer thickness in the range of a few nanometers, the basic metallization is acoustically irrelevant and is not seen by an impinging bulk wave and therefore has no effect acoustically and therefore with respect to the reflection.
- resist films can be used, in particular, which can be laminated onto the rear side of the chip. It is possible in this case to match the thickness of the resist layer to the thickness of the metal structure to be produced. The metallization process can then be performed until the gaps between the resist structures have been completely filled with metal.
- the resist can be a photoresist, which can be patterned by exposure and development. However, it is also possible to pattern a resist by means of a further photoresist. Furthermore, it is possible to pattern the resist directly by ablation by means of a laser. This is of interest particularly for resist structures and thus metal patterns which, as line patterns, are composed of a multiplicity of rectilinear sections.
- FIG. 1 shows a MEMS component comprising metal structures in schematic cross section
- FIGS. 2 to 4 show possible patterns for the metal structures in plan view
- FIG. 5 shows a further MEMS component in cross section.
- FIG. 1 shows an MEMS component in schematic cross section, this component being embodied here as an SAW component.
- the component comprises a chip CH, which is formed from a piezoelectric material, and, for example, a piezo-crystal, and, for example, of lithium tantalate or lithium niobate.
- Acoustically active component structures BS are arranged on the front side VS of the chip.
- a metal structure MS is arranged on the rear side RS of the chip CH.
- the metal structure constitutes an irregular pattern. The pattern is distinguished, in particular, by the fact that the width b of the structures, the distances a between the structures and also the edge angles of the metal structures MS are chosen differently.
- the metal structure is embodied in such a way that approximately 50% of the rear side RS is occupied by metal structures MS.
- the metal structures MS are composed of an acoustically matched material having an acoustic impedance which is as close as possible to that of the chip CH.
- the MEMS component operates with surface waves that are guided as intended along the front side VS of the chip.
- Part of the energy coupled in via the component structures BS can, however, also be converted into bulk waves BW that descend into the piezo-material of the chip CH and can run as far as the rear side RS of the chip.
- BW bulk wave BW
- the wave can enter into this metal structure.
- the wave is only reflected at the surface or side edges of the metal structure.
- the irregular pattern of the metal structure MS then leads, even in the case of bulk waves completely reflected by the metal structure, to a scattering of the wave, which then produce in the component structures BS noise at best, but no longer, in any event, an interference signal.
- the bulk wave is absorbed within the metal structure or within a damping layer (not illustrated in the figure) that is arranged above and/or between the metal structures.
- the thickness d and the width b of the metal structures are preferably embodied such that reflected bulk waves interfere with the bulk waves which are reflected at the interface between chip CH and metal structure MS and thus extinguish one another.
- FIG. 4 shows a possible pattern for the metal structure MS in plan view.
- the area provided with the metal structure MS is parqueted with triangles, quadrangles, pentagons, hexagons, heptagons and octagons without any gaps. Interior angles exceeding 180° are avoided here.
- the polygons are so irregular that the grid has no symmetry whatsoever.
- the polygons in turn are intrinsically so irregular that they have different interior angles and different edge lengths. The same correspondingly holds true for adjacent polygons respectively distinguished by a common edge.
- the pattern illustrated can be a pattern of depressions or a positive pattern, in which the polygon edges constitute an elevated grating of metal structures.
- FIG. 2 shows a possible configuration of the pattern in the form of a Penrose pattern on the basis of regular pentagons.
- the latter are arranged in such a way that each section of the grid is the side of one of the pentagons.
- the pentagons do not overlap and no further pentagon can be inserted into the interspaces between the pentagons without overlaps.
- the pentagons are linked together in such a way that the midpoints of two respective pentagons can be connected by a continuous curve that runs completely within pentagons and sides. The curve therefore contains only points which belong to a pentagon and are not corner points of a pentagon.
- the arrangement is one in which two respective pentagons are connected to one another by a chain of pentagons without any gaps, wherein each two successive pentagons of this chain have a common side and two adjacent pentagons which have common edge points either have a common edge or touch at a common corner point, wherein a side of one pentagon which is delimited by the corner point and a side of the other pentagon which is delimited by the corner point exist which are oriented at an angle of not equal to 180° with respect to one another. These sides can then simultaneously be the sides of a third pentagon.
- the entire grid is composed of four different polygons, namely the abovementioned pentagons 5 , rhombi 4 , star-shaped decagons 6 and boat-shaped heptagons 7 , which are composed of a trapezoid and an isosceles triangle attached to the longer parallel side.
- Basic elements of further Penrose patterns which can be employed for the configuration of the metal structures according to the invention are two types of rhombi.
- One type has interior angles of 36° and 144°, and the other type has interior angles of 72° and 108°.
- the side lengths are identical in each case. When such rhombi are placed alongside one another to form larger polygons this results in a type of five-fold symmetry.
- Such a grid pattern can be used for an irregularly patterned metal structure. It is advantageous in this case however, if not more than three sides abut at a point.
- FIG. 3 shows one possible arrangement of such a juxtaposition of different rhombi. The pattern illustrated in FIG.
- rhombus 3 is composed, without any gaps, of a rhombus having an interior angle of 72° and twelve hexagons composed of in each case two rhombi with an angle of 36° and/or an angle of 72° (angle 3 , for example, equals 72°).
- angle 3 for example, equals 72°.
- the side lengths (e.g. 1, 2) of each side of each hexagon are equal.
- a plurality of further randomized and therefore irregular patterns are suitable for the metal structure MS, which are distinguished overall by the fact that bulk wave reflections that are possibly effected at structure edges are effected over a wide angular range since a plurality of angles can occur between the edges of adjacent structures.
- FIG. 5 shows an MEMS component illustrated in greater detail, wherein a chip CH is mounted onto a carrier T using flip-chip technology.
- the mechanical and electrical connections between carrier T and chip CH are effected by means of bumps BU which connect solderable contacts LK on the chip front side to connection pads AF on the top side of the carrier T.
- the carrier has external contacts AK which are electrically connected by internal electrical connections through the carrier, preferably in the context of a multilayer metallization, to the connection pads AF and via the bumps BU to the solderable contacts and via further lines (not illustrated) to the component structures BS.
- the chip CH is provided with a minimal layer thickness d c in order overall to achieve a minimal structural height of the MEMS component.
- low-stress mounting on the carrier can be affected with the aid of a frame R, which is arranged on the carrier T in such a way that it encloses a chip installation area and which has a planarized surface, on which the chip CH can bear in planar fashion. If the frame R is closed, then a cavity is enclosed between chip, frame and carrier, the component structures BS being arranged in the cavity.
- the risk of a chip thinned in this way being destroyed by fracture can be reduced by the chip being thinned from the rear side only after flip-chip mounting, for example, by means of grinding, e.g., by means of CMP (Chemical Mechanical Polishing).
- a flip-chip bonded chip preferably bearing on a frame and, if appropriate, further supporting elements is mechanically stabilized, with the result that an increased risk of fracture occurs neither as a result of the grinding nor as a result of the further processing for producing the metal structures MS.
- the joint between the chip and the frame R can additionally be sealed by a suitable sealing material being applied to frame and side edge of the chip at least in the joint region.
- a suitable sealing material being applied to frame and side edge of the chip at least in the joint region.
- One possibility consists in depositing a metal there and producing a metal closure MC in this way.
- a plastic composition GT shown in FIG. 5 shows such a covering GT, also called globtop.
- the invention is not restricted to the exemplary embodiments illustrated.
- the MEMS component can have other electromechanical component structures, which optionally also lie within the chip, but preferably such component structures which are disturbed electrically or mechanically by bulk acoustic waves.
- the pattern of the metal structures can deviate from the patterns illustrated and need not necessarily be composed of sections running in rectilinear fashion.
- the finished component preferably comprises a flip-chip bonded chip CH, but can also be fixed on a support or a carrier in some other way, for example by means of adhesive bonding.
- the chip is thinned to a minimal chip thickness d c .
- the MEMS component may include other features as illustrated with respect to FIG. 5 .
- an acoustic damping composition ADC may be arranged in the area between the metal structures MS on the rear side of the chip CH.
- non-metalized interspaces of the metallic structures MS are occupied by the acoustic damping composition ADC.
- a joint between the frame R and the chip CH may be hermetically sealed by means of the metal closure MC including the same material as the metallic structures MS.
- the chip CH may include a wetting metallization WM at a side edge, at least in a region of the metal closure MC, and the metal closure MC may include tin and produce a hermetic connection between the frame R and the wetting metallization WM.
- the ceramic carrier T may be a multilayer substrate including at least two dielectric ceramic layers DCL and a metallization plane MP arranged therebetween.
- the MEMS component may also include a supporting structure SUS arranged within and having the same height as the frame R, and further supporting the chip CH.
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Micromachines (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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DE102007028288.7 | 2007-06-20 | ||
DE102007028288 | 2007-06-20 | ||
DE102007028288A DE102007028288B4 (de) | 2007-06-20 | 2007-06-20 | Mit akustischen Wellen arbeitendes MEMS Bauelement und Verfahren zur Herstellung |
PCT/EP2008/057502 WO2008155297A2 (de) | 2007-06-20 | 2008-06-13 | Mems bauelement und verfahren zur herstellung |
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PCT/EP2008/057502 Continuation WO2008155297A2 (de) | 2007-06-20 | 2008-06-13 | Mems bauelement und verfahren zur herstellung |
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US20100148285A1 US20100148285A1 (en) | 2010-06-17 |
US8110962B2 true US8110962B2 (en) | 2012-02-07 |
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US12/642,357 Expired - Fee Related US8110962B2 (en) | 2007-06-20 | 2009-12-18 | MEMS component and method for production |
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US (1) | US8110962B2 (de) |
JP (1) | JP5203454B2 (de) |
DE (1) | DE102007028288B4 (de) |
WO (1) | WO2008155297A2 (de) |
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US20130176686A1 (en) * | 2010-07-28 | 2013-07-11 | Epcos Ag | Module and production method |
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Also Published As
Publication number | Publication date |
---|---|
US20100148285A1 (en) | 2010-06-17 |
WO2008155297A2 (de) | 2008-12-24 |
JP2010530686A (ja) | 2010-09-09 |
JP5203454B2 (ja) | 2013-06-05 |
WO2008155297A3 (de) | 2009-03-19 |
DE102007028288B4 (de) | 2013-06-06 |
DE102007028288A1 (de) | 2008-12-24 |
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