US6908293B2 - Resin encapsulation system - Google Patents

Resin encapsulation system Download PDF

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Publication number
US6908293B2
US6908293B2 US10/140,055 US14005502A US6908293B2 US 6908293 B2 US6908293 B2 US 6908293B2 US 14005502 A US14005502 A US 14005502A US 6908293 B2 US6908293 B2 US 6908293B2
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US
United States
Prior art keywords
mold
resin encapsulation
encapsulation system
resin
middle mold
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Expired - Lifetime, expires
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US10/140,055
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English (en)
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US20020180066A1 (en
Inventor
Ichirou Furuta
Akira Kajiwara
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Renesas Electronics Corp
Asahi Engineering Co Ltd Fukuoka
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NEC Electronics Corp
Asahi Engineering Co Ltd Fukuoka
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Assigned to ASAHI ENGINEERING K.K., NEC CORPORATION reassignment ASAHI ENGINEERING K.K. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FURUTA, ICHIROU, KAJIWARA, AKIRA
Publication of US20020180066A1 publication Critical patent/US20020180066A1/en
Assigned to NEC ELECTRONICS CORPORATION reassignment NEC ELECTRONICS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NEC CORPORATION
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Assigned to RENESAS ELECTRONICS CORPORATION reassignment RENESAS ELECTRONICS CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: NEC ELECTRONICS CORPORATION
Assigned to RENESAS ELECTRONICS CORPORATION reassignment RENESAS ELECTRONICS CORPORATION CHANGE OF ADDRESS Assignors: RENESAS ELECTRONICS CORPORATION
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to resin encapsulation systems used for subjecting semiconductor devices to resin encapsulation molding and, more particularly, to a resin encapsulation system using three plastic molds: an upper mold, a middle mold, and a lower mold.
  • This kind of resin encapsulation system is used in a process for encapsulating semiconductor chips, which are cut from wafers in several manufacturing processes for semiconductor devices, in mold resin. In order to manufacture semiconductor devices with high efficiency, the efficiency of the resin encapsulation molding process must be improved.
  • the resin process can be subdivided into a step of releasing an object encapsulated with resin from a mold, a step of releasing a runner and a gate from the mold and a process to clean the middle mold.
  • these steps should be done automatically and rapidly.
  • this kind of resin encapsulation system generally uses an upper mold 602 , a middle mold 601 , and a lower mold 603 . Since, the middle mold 601 is connected with both the upper mold 602 and the lower mold 603 via links 604 , the middle mold 601 moves according to movement of the upper mold 602 and the lower mold 603 .
  • FIGS. 2A and 2B refer to typical views disclosed in Japanese Unexamined Patent Application Publication No. 314717/1994 and the details are described below.
  • FIG. 2A is a perspective view of a mold-releasing load-measuring mold disclosed in Japanese Unexamined Patent Application Publication No. 314717/1994, and FIG. 2B is a sectional view thereof.
  • the mold-releasing load-measuring mold is formed of an upper mold 701 , a middle mold 702 , and a lower mold 703 .
  • a cavity portion 709 , a runner portion 707 , and a gate portion 708 are formed on the middle mold 702 to allow the runner portion 707 to communicate with the cavity portion 709 via the gate portion 708 .
  • a mold-releasing load-measuring method using the mold-releasing load-measuring mold is described in detail below.
  • the mold-releasing load-measuring mold is clamped by, e.g., a pressing force of a cylinder, while laminating the upper mold 701 and the lower mold 703 on the upper and lower faces of the middle mold 702 , and then, is input in this state, a mold resin 716 made of, e.g., thermosetting resin, into the resin input port 706 of the transfer molding machine 705 .
  • a mold resin 716 made of, e.g., thermosetting resin
  • the input mold resin 716 is injected inside the cavity portion 709 via the gate portion 708 while heating the mold resin to melt it.
  • the resin is made to harden by thermal changes such as heating or cooling.
  • the upper mold 701 and the lower mold 703 are opened to remove only the middle mold 702 , as shown in FIG. 3 , and pressure is applied to a pressing part 717 provided in the penetrating hole 712 in a predetermined direction, that is, from an exposed surface of the pressing part 717 toward the cavity portion 709 , as indicated by arrow B in the figure, by a measuring apparatus such as a spring balance.
  • the mold resin 716 which adheres to both side faces 710 and a flat surface 711 of the cavity portion 709 , is released from the middle mold 702 by the load acting on the pressing part 717 .
  • the load when the mold resin 716 is released from the middle mold 702 is measured.
  • a hollow gate is adopted for the middle mold. Therefore, although it is physically possible to mount an eject mechanism for the gate portion inside a molding press, it is not practical considering procedures and efficiency (called the ‘index’) of a series of resin encapsulation processes and equipment costs. In other words, it is inappropriate for mass production facilities.
  • a cleaning mechanism is usually provided in order to remove burrs that remain on the plastic mold after each resin encapsulation.
  • the cleaning mechanism is much too complicated to be practical considering the index and the equipment costs described above and is inappropriate for mass production facilities.
  • the mold-releasing load-measuring mold described in FIGS. 2A and 2B is subdivided into three molds: the upper mold, the middle mold, and the lower mold and the cavity portion is formed in the middle mold.
  • the conveying mechanism cannot easily remove and insert the middle mold from between the upper mold and the lower mold.
  • the resin encapsulation system in a resin encapsulation system including a molding press using an upper mold, a middle mold, and a lower mold, the resin encapsulation system can be provided with a middle mold conveying mechanism adapted to insert/remove the middle mold into/from the molding press.
  • FIG. 1 is a side elevation showing a combination of an upper mold, a middle mold, and a lower mold used for a conventional resin encapsulation system.
  • FIG. 2A is an exploded perspective view of a mold-releasing load-measuring mold disclosed in Japanese Unexamined Patent Application Publication No. 314717/1994.
  • FIG. 2B is a sectional view of the mold-releasing load-measuring mold.
  • FIG. 3 is a sectional view of a state in which the middle mold is filled with mold resin in the mold-releasing load-measuring mold.
  • FIG. 4A is a side elevation view of a molding press according to an embodiment of the resin encapsulation system of the present invention.
  • FIG. 4B is a perspective view of the middle mold in the molding press.
  • FIG. 5 is an upper view to explain a process for the resin encapsulation system according to a first embodiment of the present invention.
  • FIG. 6 is an upper view to explain a process for the resin encapsulation system according to a second embodiment of the present invention.
  • FIG. 7 is a side elevation view to explain processes for the molding press of the resin encapsulation system according to the second embodiment of the present invention, wherein the processes are shown in the order (1), (2), (3) and (4).
  • FIG. 8 is a side elevation view to explain processes for ejecting pressing unit of the resin encapsulation system according to the second embodiment of the present invention, wherein the processes are shown in the order (1), (2), (3) and (4).
  • the resin encapsulation system according to a first embodiment of the present invention comprises a molding press that uses an upper mold, a middle mold and a lower mold.
  • an upper mold 102 and a lower mold 103 are fixed on a molding press 104 while a middle mold 101 remains free without being fixed to either the upper mold 102 or the lower mold 103 .
  • Reference numeral 109 in FIG. 4A indicates a runner portion.
  • FIG. 4B shows a perspective view of the middle mold 101 .
  • a cavity portion 105 forming a resin encapsulating portion, a gate portion 106 for injecting resin and a passing hole 107 for tablet-shaped epoxy resin (hereinafter referred to as a tablet) are provided on the middle mold 101 .
  • the upper mold 102 serves as a lid to cover the cavity portion 105 of the middle mold 101 .
  • a pot 108 into which tablet-shaped epoxy resin, functioning as an encapsulating material, is input, is formed on the lower mold 103 .
  • a machining in the middle mold 101 e.g., a notch adapted for being tightly gripped by a hand of a middle mold conveying mechanism in order that the middle mold conveying mechanism receives and tightly fixes the middle mold 101 in a middle mold conveying mechanism.
  • any machining that allows a nail to get inside the middle mold 101 or a part like a handle attached to the middle mold 101 may be used.
  • the present system comprises a support frame for the whole system, an input magazine buffer unit 201 adapted to set pellets mounted on a lead frame as objects to be encapsulated, a turntable unit 202 adapted to have the objects to be encapsulated arranged thereon, a tablet supplying unit 203 adapted to supply tablets as resin encapsulating material, a loader carrier 204 to receive the objects to be encapsulated on the turntable unit 202 and the tablets supplied from the tablet supplying unit 203 , a middle mold preheating unit 205 for preheating the middle mold 101 , the molding press 104 , a middle-mold off-loader 206 adapted to convey the middle mold 101 , a middle-mold cleaning unit 207 adapted to clean the middle mold 101 , an ejecting pressing unit 208 to separate the encapsulated object from the middle mold 101 and to separate a runner and a gate from the middle mold 101 , a conveyer 209
  • a runner portion is formed on the middle mold according to the present embodiment, it may be formed on the lower mold. It is advantageous if the runner portion is formed on the lower mold while a cavity portion and a gate portion are formed on the middle mold, since the structure of the middle mold can be simplified, thus facilitating fabrication, in that the middle mold need not require a separating mechanism for the runner and the gate mounted on the ejecting pressing unit 208 .
  • a pellet mounted on a lead frame, as an object to be encapsulated is set in the input magazine buffer unit 201 while tablets made of epoxy resin, as the encapsulating material, are set on the tablet supplying unit 203 .
  • the objects to be encapsulated are discharged one-by-one by the input magazine buffer unit 201 , as shown by arrows F 21 and F 22 , to be placed on the turntable unit 202 .
  • the tablets are then distributed for loading into the loader carrier 204 .
  • a pair of the objects to be encapsulated, placed in order on the turntable unit 202 is conveyed/set on the middle mold 101 , which is set previously on the middle preheating unit 205 by the loader carrier 204 , as shown by arrow F 23 .
  • the objects to be encapsulated are removed from the middle mold 101 by the ejecting pressing unit 208 , the objects circulate through each unit while remaining on the middle mold 101 .
  • the middle mold 101 is heated up to around 180° C. by the middle mold preheating unit 205 together with the objects to be encapsulated on the middle mold 101 , which are then conveyed/set on the lower mold 103 of the molding press 104 by the middle-mold off-loader 206 , as shown by arrow F 24 .
  • the tablet is input from an upper part of the middle mold 101 , which is set on the lower mold 103 by the loader carrier 204 .
  • the lower mold 103 and middle mold 101 are lifted in order to clamp them together with upper mold by a fixed pressure.
  • Injection molding is performed by an injection unit (not shown in the drawings) mounted on the lower mold 103 .
  • the middle mold 101 together with the encapsulated object are removed by the middle-mold off-loader 206 from the lower mold 103 as shown by arrow F 25 .
  • the removed middle mold 101 and the encapsulated object are set on the ejecting pressing unit 208 by the middle-mold off-loader 206 as shown by arrow F 27 after they are conveyed by the middle-mold off-loader 206 as shown by arrow F 26 .
  • the encapsulated object is separated from the middle mold 101 by the ejecting pressing unit 208 and picked up by an arm (not shown in the drawings) of the ejecting pressing unit 208 placed on the conveyer 209 then conveyed to the magazine unit 210 as shown by arrows F 28 and F 29 .
  • the middle mold 101 is separated from the runner and the gate.
  • a conveying hand between each unit of the middle mold 101 (a middle mold conveying mechanism) is not shown in the drawings, a variety of types can be used such as a type to scoop up from a lower position like a fork lift, a type to hold the middle mold 101 in an upper position for conveying and a type to form a hole on a side face of the middle mold 101 so that a rod can be inserted into the hole for lifting.
  • the resin encapsulation process is performed.
  • the resin encapsulation system according to a second embodiment of the present invention comprises a molding press that has an upper mold, a lower mold and two middle molds.
  • the upper mold 102 and the lower mold 103 are fixed on the molding press 104 while two middle molds (a first middle mold and a second middle mold) 101 (Only one of the middle molds 101 is shown in FIG. 4A. ) remain free without being fixed on the upper mold 102 and the lower mold 103 .
  • the first middle mold 101 stays at the middle mold preheating unit 205 while the second middle mold 101 is at the ejecting pressing unit 208 .
  • the first middle mold 101 is conveyed to/set on the molding press 104 from the middle preheating unit 205 by the middle-mold off-loader 206 .
  • the second middle mold 101 is moved as shown by arrow F 35 such that it is set on its exclusive middle-mold cleaning unit 207 to be moved back and forth inside the middle-mold cleaning unit 207 for cleaning as shown by arrows F 36 and F 37 .
  • the middle mold 101 is moved as shown by arrow F 38 such that it is conveyed to/set on the middle preheating unit 205 by the middle-mold off-loader 206 to receive an object to be encapsulated which is conveyed by a loader carrier 204 and the middle mold 101 .
  • the first middle mold 101 moves to the ejecting pressing unit 208 after completion of encapsulation process as shown by arrows F 32 to F 34 to have the encapsulated object separated from the first middle mold 101 and to have a runner and a gate separated from the middle mold 101 .
  • the second middle mold 101 is conveyed to/set on the molding press 104 by the middle-mold off-loader 206 as shown by arrow 31 after the first middle mold 101 is removed from the molding press 104 by the middle-mold off-loader 206 to be then delivered to the ejecting pressing unit 208 .
  • the first middle mold 101 is moved as shown by arrow F 35 such that it is set on its exclusive middle-mold cleaning unit 207 for cleaning to be moved back and forth as shown by arrows F 36 and F 37 .
  • the first middle mold 101 is moved as shown by arrow F 38 to stay at the middle mold preheating unit 205 to receive an encapsulating object from the loader carrier 204 .
  • the resin encapsulation process is alternately performed while the first and second middle molds 101 are circulated inside the system.
  • a tablet 401 is inserted into a pot block 402 of the lower mold 103 .
  • the tablet 401 is injected by lifting a plunger 403 to perform filling and curing of the resin (injecting molding) for the cavity portion 404 formed on the middle mold 101 via a runner portion 405 and gate portion 406 formed on the middle mold 101 .
  • the middle mold 101 together with the runner 405 and the gate 406 are removed simultaneously from the lower mold 103 by an ejector mechanism 407 mounted on the lower mold 103 for releasing the plastic mold.
  • a molding operation at the molding press 104 is alternately performed at the first and second middle molds 101 .
  • the middle mold 101 released from the lower mold 103 at the molding press 104 is conveyed to the ejecting pressing unit 208 in a state that the runner 405 and the gate 406 together with an encapsulated object 506 are adhered closely, to be set on a lower ejector die 502 (arrow F 51 ).
  • the gate 406 and the runner 405 formed on the middle mold 101 are pushed out by an ejector die 501 comprising a pin for pushing gate 504 and a punch 503 (arrow F 54 ).
  • processes at the ejecting pressing unit 208 are alternately performed at the first and second middle molds 101 .
  • the present invention is not limited by these embodiments and the encapsulation process can be performed more efficiently by using several molding presses and several middle molds for conveying them by a conveying hand without overlapping.
  • one or more middle molds remain free without being mechanically connected with the upper mold and the lower mold.
  • Resin encapsulation molding is performed while the middle mold is circulated among the molding press, the middle-mold preheating unit, the middle-mold cleaning unit, and the ejecting pressing unit adapted to separate the encapsulated object, the runner, and the gate from the middle mold by the ejector mechanism.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
US10/140,055 2001-05-09 2002-05-08 Resin encapsulation system Expired - Lifetime US6908293B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001139045A JP4574059B2 (ja) 2001-05-09 2001-05-09 樹脂封止システムおよび半導体装置の樹脂封止方法
JP139045/2001 2001-05-09

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US20020180066A1 US20020180066A1 (en) 2002-12-05
US6908293B2 true US6908293B2 (en) 2005-06-21

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US (1) US6908293B2 (ko)
JP (1) JP4574059B2 (ko)
KR (1) KR100480517B1 (ko)
CN (1) CN1224088C (ko)
SG (1) SG113417A1 (ko)
TW (1) TW548754B (ko)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040022884A1 (en) * 2002-07-30 2004-02-05 Renesas Technology Corp. Resin molding apparatus
US20040105909A1 (en) * 2002-11-29 2004-06-03 Shigeyuki Tofukuji Resin molding machine
US20040247722A1 (en) * 2001-11-13 2004-12-09 Acklam Philip J Mould tool and method for resin transfer moulding
US20080075802A1 (en) * 2006-09-22 2008-03-27 Lap Yu Chan Memory card molding apparatus and process
US20110111358A1 (en) * 2007-04-08 2011-05-12 Griffith Richard J Orthodontic apparatus and method
US20120107436A1 (en) * 2010-11-02 2012-05-03 Young-Jin Hwang Semiconductor package molding system and molding method thereof
US20120305180A1 (en) * 2005-01-24 2012-12-06 Mitsui High-Tec, Inc. Method of resin sealing permanent magnets in laminated rotor core

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CN100359419C (zh) * 2004-06-23 2008-01-02 中国科学院长春光学精密机械与物理研究所 一种用于微电子器件后封装加工设备的控制装置
US20070126158A1 (en) * 2005-12-01 2007-06-07 3M Innovative Properties Company Method of cleaning polymeric mold
JP2015144200A (ja) * 2014-01-31 2015-08-06 アピックヤマダ株式会社 モールド金型、樹脂モールド装置及び樹脂モールド方法
JP6527381B2 (ja) * 2015-04-24 2019-06-05 エムテックスマツムラ株式会社 樹脂封止システム及び樹脂封止方法

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JPH11286022A (ja) 1998-04-02 1999-10-19 Yazaki Corp 成形物の成形方法

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040247722A1 (en) * 2001-11-13 2004-12-09 Acklam Philip J Mould tool and method for resin transfer moulding
US7128857B2 (en) * 2001-11-13 2006-10-31 Bae Systems Plc Mould tool and method for resin transfer moulding
US20040022884A1 (en) * 2002-07-30 2004-02-05 Renesas Technology Corp. Resin molding apparatus
US20040105909A1 (en) * 2002-11-29 2004-06-03 Shigeyuki Tofukuji Resin molding machine
US7153116B2 (en) * 2002-11-29 2006-12-26 Apic Yamada Corporation Resin molding machine
US20120305180A1 (en) * 2005-01-24 2012-12-06 Mitsui High-Tec, Inc. Method of resin sealing permanent magnets in laminated rotor core
US8728375B2 (en) * 2005-01-24 2014-05-20 Mitsui High-Tec, Inc. Method of resin sealing permanent magnets in laminated rotor core
US10498203B2 (en) 2005-01-24 2019-12-03 Mitsui High-Tec, Inc. Method of resin sealing permanent magnets in laminated rotor core
US7618249B2 (en) * 2006-09-22 2009-11-17 Asm Technology Singapore Pte Ltd. Memory card molding apparatus and process
US20080075802A1 (en) * 2006-09-22 2008-03-27 Lap Yu Chan Memory card molding apparatus and process
US20110111358A1 (en) * 2007-04-08 2011-05-12 Griffith Richard J Orthodontic apparatus and method
US20120107436A1 (en) * 2010-11-02 2012-05-03 Young-Jin Hwang Semiconductor package molding system and molding method thereof
US8851875B2 (en) * 2010-11-02 2014-10-07 Samsung Electronics Co., Ltd. Semiconductor package molding system and molding method thereof

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KR20020085855A (ko) 2002-11-16
CN1224088C (zh) 2005-10-19
CN1387243A (zh) 2002-12-25
JP2002334893A (ja) 2002-11-22
SG113417A1 (en) 2005-08-29
KR100480517B1 (ko) 2005-04-06
JP4574059B2 (ja) 2010-11-04
TW548754B (en) 2003-08-21
US20020180066A1 (en) 2002-12-05

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