US6903801B2 - Illumination optical system for use in projection exposure apparatus - Google Patents

Illumination optical system for use in projection exposure apparatus Download PDF

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US6903801B2
US6903801B2 US09/823,973 US82397301A US6903801B2 US 6903801 B2 US6903801 B2 US 6903801B2 US 82397301 A US82397301 A US 82397301A US 6903801 B2 US6903801 B2 US 6903801B2
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light
optical element
optical system
diffractive optical
incident
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US20010043318A1 (en
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Kenichiro Mori
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Canon Inc
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Canon Inc
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/701—Off-axis setting using an aperture
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/7015—Details of optical elements
    • G03F7/70158—Diffractive optical elements

Definitions

  • This invention relates to an illumination optical system, a projection exposure apparatus having the same, and a device manufacturing method using such an exposure apparatus. More particularly, the invention concerns an illumination optical system suitably usable in a projection exposure apparatus for use in a projection exposure process during lithographic processes, for the manufacture of semiconductor devices, liquid crystal devices, image pickup devices (e.g., CCDs), or thin film magnetic heads, for example.
  • an illumination optical system suitably usable in a projection exposure apparatus for use in a projection exposure process during lithographic processes, for the manufacture of semiconductor devices, liquid crystal devices, image pickup devices (e.g., CCDs), or thin film magnetic heads, for example.
  • An example is a modified or deformed illumination method (oblique incidence illumination method), as disclosed in Japanese Laid-Open Patent Application, Laid-Open No. 21312/1993 and Laid-Open NO. 267515/1992, and corresponding U.S. Pat. No. 5,305,054, No. 5,673,102, No. 6,084,655, and No. 6,128,068.
  • the deformed illumination method is that the illumination light for illuminating a mask does not have a uniform angular distribution, and the illumination light is obliquely incident on the mask.
  • the angular distribution of light for illuminating the mask surface corresponds to the position distribution of a pupil plane (Fourier transform plane) with respect to the mask surface (object plane). Therefore, in a projection exposure apparatus having a fly's eye lens as disclosed in Japanese Laid-Open Patent Application, Laid-Open No. 21312/1993, mentioned above, for example, the light intensity distribution at the light exit surface of the fly's eye lens should be low on the optical axis.
  • the light intensity distribution at the light exit surface of the fly's eye lens has a ring-like shape.
  • Laid-Open No. 267515/1992 it has a quadrupole shape.
  • the light intensity distribution at the pupil position with respect to the mask surface is called an “effective light source”.
  • a light intensity transforming optical system is necessary to transform the light intensity distribution on the pupil plane into a ring-like shape or a quadrupole shape.
  • a simplest optical system for transforming the light intensity distribution is placing a ring-like or quadrupole aperture stop at the light exit surface of an optical integrator. With this method, however, only a portion of light from a light source is extracted and, therefore, light is eclipsed. Thus, light from a light source cannot be used efficiently, and the illuminance on the mask surface (surface to be illuminated) is low.
  • Japanese Laid-Open Patent Applications Laid-Open NO. 219358/1997 and No. 54426/1999, show an example which uses a prism, to increase the light utilization efficiency.
  • a prism is disposed at a position which is in pupil relation with the light entrance surface of a fly's eye lens, to thereby transform the light intensity distribution.
  • Japanese Laid-Open Patent Application Laid-Open No.
  • a prism is disposed at a position which is in an optically conjugate relation with the light entrance surface of a fly's eye lens, thereby to transform the light intensity distribution at the light entrance surface of the fly's eye lens and, thus, that upon the exit surface thereof.
  • Japanese Laid-Open Patent Application, Laid-Open No. 201697/1995 proposes a method of transforming a light intensity distribution on the light entrance surface of a fly's eye lens by use of a diffractive optical element.
  • a diffractive optical element for efficient transformation of light intensity distribution, the angular distribution of light incident on the diffractive optical element should not be extended.
  • diffractive optical elements as compared with prisms, since it is a flat plate, enlargement of the diameter thereof does not lead to bulkiness.
  • the intensity of zero-th order light it may be about 59% with a diffractive optical element having a two-level step structure, and it may be about 19% even with a diffractive optical element having a four-level step structure. It is not an intensity that can be neglected.
  • Recent projection exposure apparatuses are arranged so that a few types of deformed illumination modes such as having effective light source shapes of quadrupole (FIG. 3 A), 1 ⁇ 2 ring ( FIG. 3B ) and 2 ⁇ 3 ring (FIG. 3 C), for example, as well as a few types of standard illumination modes such as a large ⁇ ( FIG. 3D ) and a small ⁇ (FIG. 3 E), can be accomplished in one and the same projection exposure apparatus.
  • FIGS. 3A-3E portions painted by black correspond to regions in which the light intensity distribution is zero. If, therefore, the method disclosed in Japanese Laid-Open Patent Application, Laid-Open No. 201697/1995 mentioned above is used to meed this requirement, diffractive optical elements of the same number as of the illumination modes must be prepared, and they must be arranged interchangeably.
  • an illumination optical system for illuminating a surface, to be illuminated, with the use of light from a light source
  • the illunination optical system comprising: a diffractive optical element for forming a desired light intensity distribution upon a predetermined plane; and an angular distribution transforming unit for transforming an angular distribution of light incident or to be incident on said diffractive optical element into a desired distribution.
  • the illumination optical system may further comprise a blocking member for blocking zero-th order diffraction light produced by said diffractive optical element.
  • the illumination optical system may further comprise a multiple beam producing unit and a light projecting element for superposing light rays from said multiple beam producing unit one upon another on the surface to be illuminated, wherein the predetermined plane may be a light entrance surface of said multiple beam producing unit.
  • the illumination optical system may further comprise a blocking member for blocking zero-th order diffraction light produced by said diffractive optical element, wherein said blocking member may be disposed at or adjacent the light entrance surface of said multiple beam producing unit, at or adjacent the light exit surface of said multiple beam producing unit, or at a position optically conjugate with the same.
  • the diffractive optical element may be disposed at a Fourier transform plane with respect to the light entrance surface of said multiple beam producing unit.
  • the illumination optical system may further comprise an optical element disposed between said diffractive optical element and said multiple beam producing unit, said optical element being movable along an optical axis direction.
  • the illumination optical system may further comprise an internal reflection member effective to make, uniform, the light intensity distribution of the light incident on the light entrance surface thereof, wherein the light exit surface of said internal reflection member may be disposed at a position optically conjugate with the light entrance surface of said multiple beam producing unit.
  • the illumination optical system may further comprise an internal reflection member effective to make, uniform, the light intensity distribution of the light incident on the light entrance surface thereof, wherein said diffractive optical element may be disposed at or adjacent the light entrance surface of said internal reflection member or at a position optically conjugate with the same, and wherein said blocking member may be disposed at a Fourier transform plane with respect to the light entrance surface of said internal reflection member.
  • the angular distribution transforming unit may include an optical element movable along an optical axis direction, wherein, with the movement of said optical element, the angular distribution of light incident on the diffractive optical element may be changed.
  • the angular distribution transforming unit may include a plurality of optical elements demountably inserted into an optical path, wherein, with the selection of an optical element among said plurality of optical elements, to be present on the optical path, the angular distribution of light incident on the diffractive optical element may be changed.
  • the diffractive optical element may be demountably inserted into an optical path.
  • the blocking member may be demountably inserted into an optical path.
  • an illumination optical system for illuminating a surface, to be illuminated, with the use of light from a light source, the illumination opitcal system comprising: a diffractive optical element for forming a desired light intensity distribution upon a predetermined plane; and a blocking member for blocking zero-th order diffraction light produced by said diffractive optical element.
  • an exposure apparatus comprising: an illumination optical system for illuminating a mask, to be illuminated, with use of light from a light source, said illumination optical system including (i) a diffractive optical element for forming a desired light intensity distribution upon a predetermined plane, and (ii) an angular distribution transforming unit for transforming an angular distribution of light incident or to be incident on said diffractive optical element into a desired distribution; and a projection optical system for projecting a pattern of the mask, illuminated with light from said illumination optical system, onto a wafer.
  • an exposure apparatus comprising: an illumination optical system for illuminating a surface, to be illuminated, with use of light from a light source, said illumination optical system including (i) a diffractive optical element for forming a desired light intensity distribution upon a predetermined plane, and (ii) a blocking member for blocking zero-th order diffraction light produced by said diffractive optical element; and a projection optical system for projecting a pattern of the mask, illuminated with light from said illumination optical system, onto a wafer.
  • a device manufacturing method comprising the steps of: applying a photosensitive material to a wafer; illuminating a mask surface, to be illuminated, by use of light from an illumination optical system, said illumination optical system including (i) a diffractive optical element for forming a desired light intensity distribution upon a predetermined plane, and (ii) a blocking member for blocking zero-th order diffraction light produced by said diffractive optical element; transferring, by use of a projection optical system, a pattern the mask onto a wafer; and developing the transferred pattern.
  • a device manufacturing method comprising the steps of: applying a photosensitive material to a wafer; illuminating a mask surface, to be illuminated, by use of light from an illumination optical system, said illumination optical system including (i) a diffractive optical element for forming a desired light intensity distribution upon a predetermined plane, and (ii) a blocking member for blocking zero-th order diffraction light produced by said diffractive optical element; transferring, by use of a projection optical system, a pattern of the mask onto a wafer; and developing the transferred pattern.
  • FIGS. 1A and 1B show a first embodiment of the present invention, wherein FIG. 1A is a front view of a zero-th order blocking plate turret and FIG. 1B is a fragmentary view of a structure of a scan type projection exposure apparatus.
  • FIGS. 2A-2E are schematic views for explaining a transform of a light intensity distribution based on a diffractive optical element.
  • FIGS. 3A-3E are schematic views, for explaining the shapes of effective light sources.
  • FIG. 4 is a schematic view of the structure of a second embodiment of the present invention.
  • FIG. 5 is a schematic view of the structure of a third embodiment of the present invention.
  • FIG. 6 is a schematic view of the structure of a fourth embodiment of the present invention.
  • FIG. 7 is a schematic view of the structure of a fifth embodiment of the present invention.
  • FIG. 8 is a flow chart of semiconductor device manufacturing processes, in a sixth embodiment of the present invention.
  • FIG. 9 is a flow chart of a wafer process, in the sixth embodiment of the present invention.
  • the light intensity distribution to be transformed by a diffractive optical element may be magnified or reduced by use of a zoom optical system. This meets to many illumination modes with use of fewer diffractive optical elements, and thus, an inexpensive light intensity distribution transforming optical system is provided.
  • illumination plane refers to the neighborhood of the location where an effective light source is defined.
  • the term “illumination plane” refers to the neighborhood of the location where an effective light source is defined.
  • the light entrance surface of the fly's eye lens corresponds to this.
  • a diffractive optical element (FIG. 2 A), which is effective to produce a ring
  • a light intensity distribution such as shown in FIG. 2C is produced on the illumination plane. Namely, a distribution of zero-th order light at the center and a ring-like light intensity distribution are produced.
  • This is essentially the light intensity distribution transforming method as disclosed in Japanese Laid-Open Patent Application, Laid-Open No. 201697/1995.
  • FIG. 2B shows a case in which light having an angular distribution is projected on a diffractive optical element effective to produce a ring.
  • a diffractive optical element effective to produce a ring.
  • FIG. 2 D since the advancing direction of diffraction light differs with the incidence angle, ring-like light intensity distributions are produced in relation to each of the incidence angles, respectively (FIG. 2 D).
  • a light intensity based on superposition of rings defined in relation to each of the angles is produced on the illumination plane (FIG. 2 E).
  • the width of the ring-like shape of the light intensity distribution can be controlled. Therefore, by use of one diffractive optical element for transforming light into a ring-like light intensity distribution, it is possible to transform light into a 1 ⁇ 2 ring or a 2 ⁇ 3 ring, for example.
  • the same 1 ⁇ 2 ring may be transformed into a 1 ⁇ 2 ring light intensity distribution of a different diameter, and this can be accomplished by use of only one diffractive optical element.
  • light can be transformed into a desired effective light source by means of a blocking member for blocking the zero-th order light.
  • a blocking member for blocking the zero-th order light.
  • a blocking member for blocking zero-th order light produced by a diffractive optical element may be provided, by which a desired effective light source without zero-th order light can be accomplished.
  • the present invention is based on the principle as described above.
  • FIG. 1B shows a general structure of a first embodiment of the present invention.
  • the structure such as described above is applied to a scan type projection exposure apparatus, in which a portion of a mask 12 having a pattern formed thereon is illuminated and in which the mask 12 and a photosensitive substrate 15 are scanned in synchronism with each other while a portion of the pattern of the mask 12 is being projected onto the photosensitive substrate 15 .
  • the pattern of the mask 12 is sequentially transferred to the photosensitive substrate 15 , in this manner.
  • FIG. 1B denoted at 1 is a light source.
  • a light source mainly KrF excimer lasers (wavelength 248 nm) are used. In the future, ArF excimer lasers (wavelength 193 nm) will be used. While this embodiment uses a laser light source, this embodiment is applicable also to a case wherein a divergent light source such as a high pressure Hg lamp, for example, is used.
  • Denoted at 2 is an input optical system for inputting the light from the light source into an internal reflection member 3 at a desired angle, such that, with the internal reflection member 3 , the light intensity is made uniform.
  • the internal reflection member 3 has a function that the light rays incident thereon are reflected plural times by its side wall, by which a light intensity distribution not being uniform on the light entrance surface of the internal reflection member is made uniform at the light exit surface thereof.
  • the internal reflection member 3 may comprise mirrors disposed opposed to each other, for example, or it may simply be a rod-like glass material.
  • a rod-like glass material it should be designed to assure that, as the light rays impinge on the side surface of the rod, they are totally reflected due to the difference in refractive index between the glass material and the ambience (e.g., air).
  • the collimator lens 4 corresponds to an angular distribution transforming unit of the present invention. It comprises a zoom lens, and the focal length is variable. It serves to change the angular distribution of light rays impinging on the diffractive optical element 5 .
  • the diffractive optical element 5 is disposed on a turret to change the angular distribution, so that, through a collimator lens 6 , a ring-like distribution or a quadrupole distribution is formed on the light entrance surface of a fly's eye lens 8 (FIGS. 3 A- 3 E).
  • the diffractive optical element 5 may be a CGH (computer generated hologram), or it may be one having an effect of a fine prism.
  • the turret also has a parallel flat plate or a slot without any optical element.
  • the light exit surface of the internal reflection member 3 can be projected on the light entrance surface of the fly's eye lens 8 , while being magnified or reduced.
  • the collimator lens 6 is a zoom optical system having a variable focal length. It functions to change the size of the light intensity distribution formed by the diffractive optical element on the light entrance surface of the fly's eye lens.
  • Denoted at 7 is a light blocking member provided on a turret. It serves to block zero-th order light produced by the diffractive optical element 5 .
  • this blocking member 7 any shape may be used as long as the zero-th order light can be blocked. It may have an aperture with a shape of a desired effective light source (FIG. 1 A).
  • Denoted at 8 is a fly's eye lens
  • denoted at 9 is a collimator lens.
  • this fly's eye lens 8 many light convergence points are defined on the light exit surface and, through the collimator lens 9 , uniform illumination is accomplished while using the light convergence points produced by the fly's eye lens 8 as secondary light sources.
  • Denoted at 10 is a stop for controlling the illumination region on the surface to be illuminated.
  • the position of the stop 10 is illuminated with a uniform illuminance distribution through the collimator lens 9 , while using the light convergence points of the fly's eye lens as secondary light sources.
  • Denoted at 11 is an imaging optical system which takes the stop 10 position as an object plane and the mask 12 position as an image plane. The uniform illuminance distribution provided at the stop 10 position is projected by the imaging optical system onto the mask 12 , such that the mask 12 is illuminated with a uniform illuminance.
  • Denoted at 13 is a projection optical system for imaging the pattern of the mask 12 on a substrate.
  • Denoted at 14 is a stop for controlling the numerical aperture of the projection optical system.
  • Denoted at 15 is a substrate to which a photosensitive material is applied. It is sensitized by projecting the pattern of the mask 12 on it, and, through a development process and the like, a pattern is produced on the substrate 15 .
  • This embodiment concerns a scan type projection exposure apparatus, and the mask 12 and the substrate 15 are scanned in synchronism with each other. Also, since the mask 12 moves, the illumination region changes with it. Thus, the stop 10 for controlling the illumination region also moves synchronously.
  • Denoted at 16 is a stage for performing a scan motion for scan exposure of the substrate 15 as well as a stepwise motion for moving each shot.
  • FIG. 4 shows a general structure of a second embodiment of the present invention. It differs from the first embodiment in that a light blocking plate 7 for blocking zero-th order light produced by a diffractive optical element 5 is disposed at the light exit surface side of a fly's eye lens 8 , not at the light entrance surface thereof. Since what is required for the blocking plate is that it blocks zero-th order light produced by the diffractive optical element 5 before the same reaches the mask 12 surface, the placement of the blocking plate may be modified further, such as at a position conjugate with the light entrance surface of the fly's eye lens, or a position conjugate with the light exit surface of a fly's eye lens, for example.
  • FIG. 5 shows a general structure of a third embodiment of the present invention. It differs from the second embodiment in that means for changing the angular distribution of light rays incident on the diffractive optical element 5 comprises, in place of the input lens 2 of FIG. 4 , a plurality of input lenses 2 ′ having different local lengths (i.e., angular distribution transforming unit), which are mounted on a turret. As a matter of course, they may be used in combination with a zoom lens.
  • FIG. 6 shows a general structure of a fourth embodiment of the present invention. It differs from the third embodiment in that means for changing the angular distribution of light rays incident on the diffractive optical element comprises, in place of plural input lenses having different local lengths, a plurality of fly's eye lenses 17 of different focal lengths (i.e., angular distribution transforming unit), which are mounted on a turret. As compared with the third embodiment, the uniforming effect of the internal reflection member is high. As a matter of course, they may be used in combination with a zoom lens. Further, the fly's eye lens may be replaced by a diffractive optical element having a similar function.
  • FIG. 7 shows a general structure of a fifth embodiment of the present invention.
  • the invention is applied to a scan type projection exposure apparatus which includes an illumination system wherein the light exit surface of an internal reflection member 18 is projected on the surface of a mask 12 .
  • the angular distribution of illumination light upon the light entrance surface of the internal reflection member 18 corresponds to the angular distribution of illumination light upon the mask 12 . Therefore, a diffractive optical element mounted on a turret 5 should be placed at a position optically conjugate with the light entrance surface of the internal reflection member 18 , and also the blocking plate 7 for blocking zero-th order light should be placed at a position which is in a pupil relation with the light entrance surface of the internal reflection member.
  • the optical system for changing the angular distribution of light rays incident on the diffractive optical element 5 comprises a zoom lens 4 (i.e., angular distribution transforming unit), it may be replaced by a plurality of fly's eye lenses having different focal lengths as described hereinbefore, or a plurality of input lenses having different focal lengths.
  • a zoom lens 4 i.e., angular distribution transforming unit
  • FIGS. 8 and 9 show a sixth embodiment of the present invention, in which a projection exposure apparatus as described above is applied.
  • FIG. 8 is a flow chart of a procedure for manufacture of microdevices such as semiconductor chips (e.g., ICs or LSIs), liquid crystal panels, or CCDs, for example, in this embodiment.
  • semiconductor chips e.g., ICs or LSIs
  • liquid crystal panels e.g., liquid crystal panels, or CCDs, for example, in this embodiment.
  • Step 1 is a design process for designing a circuit of a semiconductor device.
  • Step 2 is a process for making a mask on the basis of the circuit pattern design.
  • Step 3 is a process for preparing a wafer by using a material such as silicon.
  • Step 4 is a wafer process (called a pre-process) wherein, by using the so prepared mask and wafer, circuits are practically formed on the wafer through lithography.
  • Step 5 subsequent to this is an assembling step (called a post-process) wherein the wafer having been processed by step 4 is formed into semiconductor chips.
  • This step includes an assembling (dicing and bonding) process and a packaging (chip sealing) process.
  • Step 6 is an inspection step wherein an operation check, a durability check and so on for the semiconductor devices provided by step 5 , are carried out. With these processes, semiconductor devices are completed and they are shipped (step 7 ).
  • FIG. 9 is a flow chart showing details of the wafer process.
  • Step 11 is an oxidation process for oxidizing the surface of a wafer.
  • Step 12 is a CVD process for forming an insulating film on the wafer surface.
  • Step 13 is an electrode forming process for forming electrodes upon the wafer by vapor deposition.
  • Step 14 is an ion implanting process for implanting ions to the wafer.
  • Step 15 is a resist process for applying a resist (photosensitive material) to the wafer.
  • Step 16 is an exposure process for printing, by exposure, the circuit pattern of the mask on the wafer through the exposure apparatus described above.
  • Step 17 is a developing process for developing the exposed wafer.
  • Step 18 is an etching process for removing portions other than the developed resist image.
  • Step 19 is a resist separation process for separating the resist material remaining on the wafer after being subjected to the etching process. By repeating these processes, circuit patterns are superposedly formed on the wafer.
  • a semiconductor device can be produced in a shorter time and by use of an inexpensive and higher illuminance exposure apparatus.
  • an optical system for transforming an angular distribution of illumination light, for illuminating a surface to be illuminated, into a desired light intensity distribution may be constituted by at least one diffractive optical element and an optical system having at least one blocking member for blocking zero-th order light produced by the diffractive optical element.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Microscoopes, Condenser (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
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US20070258077A1 (en) * 2006-04-17 2007-11-08 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US20080036992A1 (en) * 2006-08-14 2008-02-14 Canon Kabushiki Kaisha Exposure apparatus and device manufacturing method
US20080123055A1 (en) * 2006-07-03 2008-05-29 Canon Kabushiki Kaisha Exposure apparatus
US20080259304A1 (en) * 2007-04-20 2008-10-23 Asml Netherlands B.V. Lithographic apparatus and method
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JP3826047B2 (ja) * 2002-02-13 2006-09-27 キヤノン株式会社 露光装置、露光方法、及びそれを用いたデバイス製造方法
US6784976B2 (en) * 2002-04-23 2004-08-31 Asml Holding N.V. System and method for improving line width control in a lithography device using an illumination system having pre-numerical aperture control
US6888615B2 (en) * 2002-04-23 2005-05-03 Asml Holding N.V. System and method for improving linewidth control in a lithography device by varying the angular distribution of light in an illuminator as a function of field position
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