US20210095378A1 - Cyanide-free liquid composition for immersion gold plating - Google Patents
Cyanide-free liquid composition for immersion gold plating Download PDFInfo
- Publication number
- US20210095378A1 US20210095378A1 US16/473,764 US201616473764A US2021095378A1 US 20210095378 A1 US20210095378 A1 US 20210095378A1 US 201616473764 A US201616473764 A US 201616473764A US 2021095378 A1 US2021095378 A1 US 2021095378A1
- Authority
- US
- United States
- Prior art keywords
- compound
- gold
- alkali metal
- gold plating
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2016/089007 WO2018122989A1 (ja) | 2016-12-27 | 2016-12-27 | シアンフリー置換金めっき液組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20210095378A1 true US20210095378A1 (en) | 2021-04-01 |
Family
ID=62708094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/473,764 Abandoned US20210095378A1 (en) | 2016-12-27 | 2016-12-27 | Cyanide-free liquid composition for immersion gold plating |
Country Status (6)
Country | Link |
---|---|
US (1) | US20210095378A1 (zh) |
EP (1) | EP3564407A4 (zh) |
JP (1) | JP6842475B2 (zh) |
KR (1) | KR20190096420A (zh) |
CN (1) | CN110114507A (zh) |
WO (1) | WO2018122989A1 (zh) |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6350570A (ja) * | 1986-08-12 | 1988-03-03 | ニツカン工業株式会社 | 金属メツキされたチタン酸アルカリおよびその製造方法 |
US4985076A (en) * | 1989-11-03 | 1991-01-15 | General Electric Company | Autocatalytic electroless gold plating composition |
US4978559A (en) * | 1989-11-03 | 1990-12-18 | General Electric Company | Autocatalytic electroless gold plating composition |
US5206055A (en) * | 1991-09-03 | 1993-04-27 | General Electric Company | Method for enhancing the uniform electroless deposition of gold onto a palladium substrate |
JP3227505B2 (ja) * | 1993-07-16 | 2001-11-12 | 奥野製薬工業株式会社 | 置換型無電解金めっき液 |
JP3892730B2 (ja) * | 2002-01-30 | 2007-03-14 | 関東化学株式会社 | 無電解金めっき液 |
JP4603320B2 (ja) * | 2003-10-22 | 2010-12-22 | 関東化学株式会社 | 無電解金めっき液 |
JP5526462B2 (ja) | 2006-04-18 | 2014-06-18 | 日立化成株式会社 | 無電解金めっき液及び無電解金めっき方法 |
JP5026107B2 (ja) * | 2007-02-23 | 2012-09-12 | 関東化学株式会社 | 無電解金めっき液およびそれを用いためっき方法 |
JP4758470B2 (ja) | 2008-12-18 | 2011-08-31 | シャープ株式会社 | 突起電極の形成方法及び置換金めっき液 |
JP5371465B2 (ja) * | 2009-02-09 | 2013-12-18 | メタローテクノロジーズジャパン株式会社 | 非シアン無電解金めっき液及び導体パターンのめっき方法 |
JP5370886B2 (ja) | 2009-03-10 | 2013-12-18 | 関東化学株式会社 | 金微細構造体形成用無電解金めっき液およびこれを用いた金微細構造体形成方法ならびにこれを用いた金微細構造体 |
DE102010012204B4 (de) * | 2010-03-19 | 2019-01-24 | MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) | Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten |
JP2017210630A (ja) * | 2014-10-02 | 2017-11-30 | 日本板硝子株式会社 | 無電解めっき下地剤及びその製造方法並びに該無電解めっき下地剤を用いためっき積層体 |
-
2016
- 2016-12-27 WO PCT/JP2016/089007 patent/WO2018122989A1/ja unknown
- 2016-12-27 US US16/473,764 patent/US20210095378A1/en not_active Abandoned
- 2016-12-27 CN CN201680091924.4A patent/CN110114507A/zh active Pending
- 2016-12-27 JP JP2018558587A patent/JP6842475B2/ja active Active
- 2016-12-27 KR KR1020197021607A patent/KR20190096420A/ko unknown
- 2016-12-27 EP EP16925513.0A patent/EP3564407A4/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP3564407A4 (en) | 2020-10-21 |
KR20190096420A (ko) | 2019-08-19 |
JPWO2018122989A1 (ja) | 2019-12-26 |
CN110114507A (zh) | 2019-08-09 |
JP6842475B2 (ja) | 2021-03-17 |
WO2018122989A1 (ja) | 2018-07-05 |
EP3564407A1 (en) | 2019-11-06 |
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Legal Events
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AS | Assignment |
Owner name: KANTO KAGAKU KABUSHIKI KAISHA, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:OHWADA, TAKUO;TOKUHISA, TOMOAKI;TSUDA, TAKAHIRO;AND OTHERS;SIGNING DATES FROM 20190910 TO 20190913;REEL/FRAME:050715/0406 |
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STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
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STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
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STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |