EP3564407A4 - CYANIDE-FREE SUBSTITUTION GOLD PLATING SOLUTION TYPE COMPOSITION - Google Patents

CYANIDE-FREE SUBSTITUTION GOLD PLATING SOLUTION TYPE COMPOSITION Download PDF

Info

Publication number
EP3564407A4
EP3564407A4 EP16925513.0A EP16925513A EP3564407A4 EP 3564407 A4 EP3564407 A4 EP 3564407A4 EP 16925513 A EP16925513 A EP 16925513A EP 3564407 A4 EP3564407 A4 EP 3564407A4
Authority
EP
European Patent Office
Prior art keywords
cyanide
plating solution
gold plating
solution composition
substitution gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16925513.0A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3564407A1 (en
Inventor
Takahiro Tsuda
Tomoaki Tokuhisa
Takuo Ohwada
Kazutaka Senda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanto Chemical Co Inc
Original Assignee
Kanto Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Chemical Co Inc filed Critical Kanto Chemical Co Inc
Publication of EP3564407A1 publication Critical patent/EP3564407A1/en
Publication of EP3564407A4 publication Critical patent/EP3564407A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
EP16925513.0A 2016-12-27 2016-12-27 CYANIDE-FREE SUBSTITUTION GOLD PLATING SOLUTION TYPE COMPOSITION Withdrawn EP3564407A4 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/089007 WO2018122989A1 (ja) 2016-12-27 2016-12-27 シアンフリー置換金めっき液組成物

Publications (2)

Publication Number Publication Date
EP3564407A1 EP3564407A1 (en) 2019-11-06
EP3564407A4 true EP3564407A4 (en) 2020-10-21

Family

ID=62708094

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16925513.0A Withdrawn EP3564407A4 (en) 2016-12-27 2016-12-27 CYANIDE-FREE SUBSTITUTION GOLD PLATING SOLUTION TYPE COMPOSITION

Country Status (6)

Country Link
US (1) US20210095378A1 (zh)
EP (1) EP3564407A4 (zh)
JP (1) JP6842475B2 (zh)
KR (1) KR20190096420A (zh)
CN (1) CN110114507A (zh)
WO (1) WO2018122989A1 (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4978559A (en) * 1989-11-03 1990-12-18 General Electric Company Autocatalytic electroless gold plating composition
US4985076A (en) * 1989-11-03 1991-01-15 General Electric Company Autocatalytic electroless gold plating composition
US5206055A (en) * 1991-09-03 1993-04-27 General Electric Company Method for enhancing the uniform electroless deposition of gold onto a palladium substrate
US20130316082A1 (en) * 2010-03-19 2013-11-28 Enthone Inc. Method for direct metallization of non-conductive substrates
WO2016051667A1 (ja) * 2014-10-02 2016-04-07 日本板硝子株式会社 無電解めっき下地剤及びその製造方法並びに該無電解めっき下地剤を用いためっき積層体

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6350570A (ja) * 1986-08-12 1988-03-03 ニツカン工業株式会社 金属メツキされたチタン酸アルカリおよびその製造方法
JP3227505B2 (ja) * 1993-07-16 2001-11-12 奥野製薬工業株式会社 置換型無電解金めっき液
JP3892730B2 (ja) * 2002-01-30 2007-03-14 関東化学株式会社 無電解金めっき液
JP4603320B2 (ja) * 2003-10-22 2010-12-22 関東化学株式会社 無電解金めっき液
JP5526462B2 (ja) 2006-04-18 2014-06-18 日立化成株式会社 無電解金めっき液及び無電解金めっき方法
JP5026107B2 (ja) * 2007-02-23 2012-09-12 関東化学株式会社 無電解金めっき液およびそれを用いためっき方法
JP4758470B2 (ja) 2008-12-18 2011-08-31 シャープ株式会社 突起電極の形成方法及び置換金めっき液
JP5371465B2 (ja) * 2009-02-09 2013-12-18 メタローテクノロジーズジャパン株式会社 非シアン無電解金めっき液及び導体パターンのめっき方法
JP5370886B2 (ja) 2009-03-10 2013-12-18 関東化学株式会社 金微細構造体形成用無電解金めっき液およびこれを用いた金微細構造体形成方法ならびにこれを用いた金微細構造体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4978559A (en) * 1989-11-03 1990-12-18 General Electric Company Autocatalytic electroless gold plating composition
US4985076A (en) * 1989-11-03 1991-01-15 General Electric Company Autocatalytic electroless gold plating composition
US5206055A (en) * 1991-09-03 1993-04-27 General Electric Company Method for enhancing the uniform electroless deposition of gold onto a palladium substrate
US20130316082A1 (en) * 2010-03-19 2013-11-28 Enthone Inc. Method for direct metallization of non-conductive substrates
WO2016051667A1 (ja) * 2014-10-02 2016-04-07 日本板硝子株式会社 無電解めっき下地剤及びその製造方法並びに該無電解めっき下地剤を用いためっき積層体
JP2017210630A (ja) * 2014-10-02 2017-11-30 日本板硝子株式会社 無電解めっき下地剤及びその製造方法並びに該無電解めっき下地剤を用いためっき積層体

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2018122989A1 *

Also Published As

Publication number Publication date
US20210095378A1 (en) 2021-04-01
KR20190096420A (ko) 2019-08-19
JPWO2018122989A1 (ja) 2019-12-26
CN110114507A (zh) 2019-08-09
JP6842475B2 (ja) 2021-03-17
WO2018122989A1 (ja) 2018-07-05
EP3564407A1 (en) 2019-11-06

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