EP3564407A4 - Cyanide-free substitution gold plating solution composition - Google Patents
Cyanide-free substitution gold plating solution composition Download PDFInfo
- Publication number
- EP3564407A4 EP3564407A4 EP16925513.0A EP16925513A EP3564407A4 EP 3564407 A4 EP3564407 A4 EP 3564407A4 EP 16925513 A EP16925513 A EP 16925513A EP 3564407 A4 EP3564407 A4 EP 3564407A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- cyanide
- plating solution
- gold plating
- solution composition
- substitution gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title 1
- 239000010931 gold Substances 0.000 title 1
- 229910052737 gold Inorganic materials 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
- 238000006467 substitution reaction Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2016/089007 WO2018122989A1 (en) | 2016-12-27 | 2016-12-27 | Cyanide-free substitution gold plating solution composition |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3564407A1 EP3564407A1 (en) | 2019-11-06 |
EP3564407A4 true EP3564407A4 (en) | 2020-10-21 |
Family
ID=62708094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16925513.0A Withdrawn EP3564407A4 (en) | 2016-12-27 | 2016-12-27 | Cyanide-free substitution gold plating solution composition |
Country Status (6)
Country | Link |
---|---|
US (1) | US20210095378A1 (en) |
EP (1) | EP3564407A4 (en) |
JP (1) | JP6842475B2 (en) |
KR (1) | KR20190096420A (en) |
CN (1) | CN110114507A (en) |
WO (1) | WO2018122989A1 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4978559A (en) * | 1989-11-03 | 1990-12-18 | General Electric Company | Autocatalytic electroless gold plating composition |
US4985076A (en) * | 1989-11-03 | 1991-01-15 | General Electric Company | Autocatalytic electroless gold plating composition |
US5206055A (en) * | 1991-09-03 | 1993-04-27 | General Electric Company | Method for enhancing the uniform electroless deposition of gold onto a palladium substrate |
US20130316082A1 (en) * | 2010-03-19 | 2013-11-28 | Enthone Inc. | Method for direct metallization of non-conductive substrates |
WO2016051667A1 (en) * | 2014-10-02 | 2016-04-07 | 日本板硝子株式会社 | Electroless plating base agent, method for producing same and plating laminate using electroless plating base agent |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6350570A (en) * | 1986-08-12 | 1988-03-03 | ニツカン工業株式会社 | Metal plated alkali titanate and its production |
JP3227505B2 (en) * | 1993-07-16 | 2001-11-12 | 奥野製薬工業株式会社 | Substitution type electroless gold plating solution |
JP3892730B2 (en) * | 2002-01-30 | 2007-03-14 | 関東化学株式会社 | Electroless gold plating solution |
JP4603320B2 (en) * | 2003-10-22 | 2010-12-22 | 関東化学株式会社 | Electroless gold plating solution |
JP5526462B2 (en) | 2006-04-18 | 2014-06-18 | 日立化成株式会社 | Electroless gold plating solution and electroless gold plating method |
JP5026107B2 (en) * | 2007-02-23 | 2012-09-12 | 関東化学株式会社 | Electroless gold plating solution and plating method using the same |
JP4758470B2 (en) | 2008-12-18 | 2011-08-31 | シャープ株式会社 | Method for forming protruding electrode and displacement gold plating solution |
JP5371465B2 (en) * | 2009-02-09 | 2013-12-18 | メタローテクノロジーズジャパン株式会社 | Non-cyan electroless gold plating solution and conductor pattern plating method |
JP5370886B2 (en) | 2009-03-10 | 2013-12-18 | 関東化学株式会社 | Electroless gold plating solution for forming gold microstructure, method for forming gold microstructure using the same, and gold microstructure using the same |
-
2016
- 2016-12-27 US US16/473,764 patent/US20210095378A1/en not_active Abandoned
- 2016-12-27 JP JP2018558587A patent/JP6842475B2/en active Active
- 2016-12-27 EP EP16925513.0A patent/EP3564407A4/en not_active Withdrawn
- 2016-12-27 KR KR1020197021607A patent/KR20190096420A/en unknown
- 2016-12-27 CN CN201680091924.4A patent/CN110114507A/en active Pending
- 2016-12-27 WO PCT/JP2016/089007 patent/WO2018122989A1/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4978559A (en) * | 1989-11-03 | 1990-12-18 | General Electric Company | Autocatalytic electroless gold plating composition |
US4985076A (en) * | 1989-11-03 | 1991-01-15 | General Electric Company | Autocatalytic electroless gold plating composition |
US5206055A (en) * | 1991-09-03 | 1993-04-27 | General Electric Company | Method for enhancing the uniform electroless deposition of gold onto a palladium substrate |
US20130316082A1 (en) * | 2010-03-19 | 2013-11-28 | Enthone Inc. | Method for direct metallization of non-conductive substrates |
WO2016051667A1 (en) * | 2014-10-02 | 2016-04-07 | 日本板硝子株式会社 | Electroless plating base agent, method for producing same and plating laminate using electroless plating base agent |
JP2017210630A (en) * | 2014-10-02 | 2017-11-30 | 日本板硝子株式会社 | Electroless plating substrate agent, production method thereof, and plated laminate using electroless plating substrate agent |
Non-Patent Citations (1)
Title |
---|
See also references of WO2018122989A1 * |
Also Published As
Publication number | Publication date |
---|---|
US20210095378A1 (en) | 2021-04-01 |
JP6842475B2 (en) | 2021-03-17 |
CN110114507A (en) | 2019-08-09 |
JPWO2018122989A1 (en) | 2019-12-26 |
EP3564407A1 (en) | 2019-11-06 |
KR20190096420A (en) | 2019-08-19 |
WO2018122989A1 (en) | 2018-07-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20190716 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20200921 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C23C 18/42 20060101ALI20200915BHEP Ipc: C23C 18/44 20060101AFI20200915BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20230701 |