US20130295219A1 - Injection Mold Having a Simplified Evaporative Cooling System or a Simplified Cooling System with Exotic Cooling Fluids - Google Patents
Injection Mold Having a Simplified Evaporative Cooling System or a Simplified Cooling System with Exotic Cooling Fluids Download PDFInfo
- Publication number
- US20130295219A1 US20130295219A1 US13/601,359 US201213601359A US2013295219A1 US 20130295219 A1 US20130295219 A1 US 20130295219A1 US 201213601359 A US201213601359 A US 201213601359A US 2013295219 A1 US2013295219 A1 US 2013295219A1
- Authority
- US
- United States
- Prior art keywords
- mold
- cooling
- support plate
- assembly
- cooling system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 266
- 239000012809 cooling fluid Substances 0.000 title claims abstract description 68
- 238000002347 injection Methods 0.000 title abstract description 41
- 239000007924 injection Substances 0.000 title abstract description 41
- 238000001746 injection moulding Methods 0.000 claims abstract description 71
- 239000000463 material Substances 0.000 claims description 67
- 238000003754 machining Methods 0.000 claims description 36
- 239000004033 plastic Substances 0.000 claims description 20
- 229920003023 plastic Polymers 0.000 claims description 20
- 238000001704 evaporation Methods 0.000 claims description 12
- 238000003801 milling Methods 0.000 claims description 10
- 238000005553 drilling Methods 0.000 claims description 9
- 239000007921 spray Substances 0.000 claims description 8
- 239000000110 cooling liquid Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 231100001261 hazardous Toxicity 0.000 abstract description 8
- 239000007788 liquid Substances 0.000 description 47
- 238000000429 assembly Methods 0.000 description 39
- 230000000712 assembly Effects 0.000 description 39
- 239000012815 thermoplastic material Substances 0.000 description 35
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 25
- 238000004519 manufacturing process Methods 0.000 description 17
- 238000000465 moulding Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 14
- 239000007789 gas Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 238000007514 turning Methods 0.000 description 10
- 239000010949 copper Substances 0.000 description 9
- 230000008020 evaporation Effects 0.000 description 9
- 239000000155 melt Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 229920001169 thermoplastic Polymers 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 239000012530 fluid Substances 0.000 description 8
- 239000004416 thermosoftening plastic Substances 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 229910002804 graphite Inorganic materials 0.000 description 7
- 239000010439 graphite Substances 0.000 description 7
- 239000002105 nanoparticle Substances 0.000 description 7
- 239000008188 pellet Substances 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 6
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 239000012153 distilled water Substances 0.000 description 6
- 238000009761 sinker EDM Methods 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- -1 polypropylene Polymers 0.000 description 5
- 238000010998 test method Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 239000002826 coolant Substances 0.000 description 4
- 238000009760 electrical discharge machining Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000000088 plastic resin Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000012354 overpressurization Methods 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- 229910000534 SAE 1117 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 230000009969 flowable effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 101100008044 Caenorhabditis elegans cut-1 gene Proteins 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920004449 Halon® Polymers 0.000 description 1
- 229910000997 High-speed steel Inorganic materials 0.000 description 1
- 229910000799 K alloy Inorganic materials 0.000 description 1
- 229910000909 Lead-bismuth eutectic Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- HQMIBHMHKRSUCY-UHFFFAOYSA-N [C].[U] Chemical compound [C].[U] HQMIBHMHKRSUCY-UHFFFAOYSA-N 0.000 description 1
- OISJTQSPFPJHIZ-UHFFFAOYSA-N [Cs].[Na].[K] Chemical compound [Cs].[Na].[K] OISJTQSPFPJHIZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001350 alkyl halides Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229920006125 amorphous polymer Polymers 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- PXBRQCKWGAHEHS-UHFFFAOYSA-N dichlorodifluoromethane Chemical compound FC(F)(Cl)Cl PXBRQCKWGAHEHS-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000002073 nanorod Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000005014 poly(hydroxyalkanoate) Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000903 polyhydroxyalkanoate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 230000000135 prohibitive effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000012508 resin bead Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
- B29C45/7312—Construction of heating or cooling fluid flow channels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
- B29C33/04—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam
- B29C33/046—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam using gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/16—Cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
- B29C45/7306—Control circuits therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
- B29C45/7337—Heating or cooling of the mould using gas or steam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2905/00—Use of metals, their alloys or their compounds, as mould material
- B29K2905/02—Aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
- B29K2995/0013—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/757—Moulds, cores, dies
Definitions
- Injection molding is a technology commonly used for high-volume manufacturing of parts made of meltable material, most commonly of parts made of thermoplastic polymers.
- a plastic resin most often in the form of small beads or pellets, is introduced to an injection molding machine that melts the resin beads under heat, pressure, and shear.
- the now molten resin is forcefully injected into a mold cavity having a particular cavity shape.
- the injected plastic is held under pressure in the mold cavity, cooled, and then removed as a solidified part having a shape that essentially duplicates the cavity shape of the mold.
- the mold itself may have a single cavity or multiple cavities. Each cavity may be connected to a flow channel by a gate, which directs the flow of the molten resin into the cavity.
- High production injection molding machines i.e., class 101 and class 102 molding machines that produce thinwalled consumer products exclusively use molds having a majority of the mold made from the high hardness materials.
- High production injection molding machines typically produce 500,000 parts or more.
- Industrial quality production molds must be designed to produce at least 500,000 parts, preferably more than 1,000,000 parts, more preferably more than 5,000,000 parts, and even more preferably more than 10,000,000 parts.
- These high production injection molding machines have multi cavity molds and complex cooling systems to increase production rates.
- the high hardness materials described above are more capable of withstanding the repeated high pressure clamping and injection operations than lower hardness materials.
- typical high production injection molding machines having molds made of high hardness materials include relatively complex internal cooling systems that circulate cooling fluid within the mold. These cooling systems accelerate cooling of the molded parts, thus allowing the machine to complete more cycles in a given amount of time, which increases production rates and thus the total amount of molded parts produced.
- these cooling systems add complexity and cost to the injection molds.
- Class 101 molds that run in 400 ton or larger presses are sometimes referred to as “400 class” molds within the industry.
- FIG. 2 illustrates one embodiment of a thin-walled part formed in the injection molding machine of FIG. 1 ;
- FIG. 3 is a cavity pressure vs. time graph for a mold cavity in a mold of the injection molding machine of FIG. 1 ;
- FIGS. 5A-5E illustrate different views of various mold assemblies having a plurality of cooling lines machined in a mold support plate
- FIG. 7 illustrates a close-up sectional view of a cooling line including a baffle
- FIG. 9 illustrates a perspective cross-sectional view of a mold assembly having a plurality of terminal cooling lines and a plurality of through bore cooling lines machined along at least two different machining axes;
- FIG. 12 illustrates a perspective view of a mold assembly having at least one cooling line that includes non-linear, non-coaxial, or non-planar cooling channel;
- FIG. 13 illustrates one embodiment of a cube mold that incorporates a mold having a simplified cooling system
- FIG. 14 illustrates one embodiment of a vapor compression evaporative cooling system
- FIG. 15 illustrates another embodiment of an evaporative cooling system
- FIG. 16A illustrates an embodiment of an evaporative cooling system contained, at least partially, within a mold support plate
- FIG. 16B illustrates an alternate embodiment of an evaporative cooling system contained, at least partially, within a mold support plate
- FIG. 17 illustrates one embodiment of an external evaporative cooling system.
- Embodiments of the present invention generally relate to systems, machines, products, and methods of producing products by injection molding and more specifically to systems, products, and methods of producing products by low constant pressure injection molding.
- melt pressure as used herein with respect to melt pressure of a thermoplastic material, means melt pressures in a vicinity of a nozzle of an injection molding machine of 6000 psi and lower.
- substantially constant pressure as used herein with respect to a melt pressure of a thermoplastic material, means that deviations from a baseline melt pressure do not produce meaningful changes in physical properties of the thermoplastic material.
- substantially constant pressure includes, but is not limited to, pressure variations for which viscosity of the melted thermoplastic material do not meaningfully change.
- substantially constant in this respect includes deviations of approximately 30% from a baseline melt pressure.
- a substantially constant pressure of approximately 4600 psi includes pressure fluctuations within the range of about 6000 psi (30% above 4600 psi) to about 3200 psi (30% below 4600 psi).
- a melt pressure is considered substantially constant as long as the melt pressure fluctuates no more than 30% from the recited pressure.
- FIG. 1 illustrates an exemplary low constant pressure injection molding apparatus 10 for producing thin-walled parts in high volumes (e.g., a class 101 or 102 injection mold, or an “ultra high productivity mold”).
- the injection molding apparatus 10 generally includes an injection system 12 and a clamping system 14 .
- a thermoplastic material may be introduced to the injection system 12 in the form of thermoplastic pellets 16 .
- the thermoplastic pellets 16 may be placed into a hopper 18 , which feeds the thermoplastic pellets 16 into a heated barrel 20 of the injection system 12 .
- the thermoplastic pellets 16 after being fed into the heated barrel 20 , may be driven to the end of the heated barrel 20 by a reciprocating screw 22 .
- thermoplastic pellets 16 The heating of the heated barrel 20 and the compression of the thermoplastic pellets 16 by the reciprocating screw 22 causes the thermoplastic pellets 16 to melt, forming a molten thermoplastic material 24 .
- the molten thermoplastic material is typically processed at a temperature of about 130° C. to about 410° C.
- the reciprocating screw 22 forces the molten thermoplastic material 24 , toward a nozzle 26 to form a shot of thermoplastic material, which will be injected into a mold cavity 32 of a mold 28 .
- the molten thermoplastic material 24 may be injected through a gate 30 , which directs the flow of the molten thermoplastic material 24 to the mold cavity 32 .
- the mold cavity 32 is formed between first and second mold parts 25 , 27 of the mold 28 and the first and second mold parts 25 , 27 are held together under pressure by a press or clamping unit 34 .
- the press or clamping unit 34 applies a clamping force in the range of approximately 1000 psi to approximately 6000 psi during the molding process to hold the first and second mold parts 25 , 27 together while the molten thermoplastic material 24 is injected into the mold cavity 32 .
- the clamping system 14 may include a mold frame and a mold base, the mold frame and the mold base being formed from a material having a surface hardness of more than about 165 BHN and preferably less than 260 BHN, although materials having surface hardness BHN values of greater than 260 may be used as long as the material is easily machineable, as discussed further below.
- the reciprocating screw 22 stops traveling forward.
- the molten thermoplastic material 24 takes the form of the mold cavity 32 and the molten thermoplastic material 24 cools inside the mold 28 until the thermoplastic material 24 solidifies.
- the press 34 releases the first and second mold parts 25 , 27 , the first and second mold parts 25 , 27 are separated from one another, and the finished part may be ejected from the mold 28 .
- the mold 28 may include a plurality of mold cavities 32 to increase overall production rates.
- a controller 50 is communicatively connected with a sensor 52 and a screw control 36 .
- the controller 50 may include a microprocessor, a memory, and one or more communication links.
- the controller 50 may be connected to the sensor 52 and the screw control 36 via wired connections 54 , 56 , respectively.
- the controller 50 may be connected to the sensor 52 and screw control 56 via a wireless connection, a mechanical connection, a hydraulic connection, a pneumatic connection, or any other type of communication connection known to those having ordinary skill in the art that will allow the controller 50 to communicate with both the sensor 52 and the screw control 36 .
- the sensor 52 is a pressure sensor that measures (directly or indirectly) melt pressure of the molten thermoplastic material 24 in the nozzle 26 .
- the sensor 52 generates an electrical signal that is transmitted to the controller 50 .
- the controller 50 then commands the screw control 36 to advance the screw 22 at a rate that maintains a substantially constant melt pressure of the molten thermoplastic material 24 in the nozzle 26 .
- the sensor 52 may directly measure the melt pressure, the sensor 52 may measure other characteristics of the molten thermoplastic material 24 , such as temperature, viscosity, flow rate, etc, that are indicative of melt pressure.
- the senor 52 need not be located directly in the nozzle 26 , but rather the sensor 52 may be located at any location within the injection system 12 or mold 28 that is fluidly connected with the nozzle 26 . If the sensor 52 is not located within the nozzle 26 , appropriate correction factors may be applied to the measured characteristic to calculate the melt pressure in the nozzle 26 . In yet other embodiments, the sensor 52 need not be fluidly connected with the nozzle. Rather, the sensor could measure clamping force generated by the clamping system 14 at a mold parting line between the first and second mold parts 25 , 27 .
- FIG. 1 Although an active, closed loop controller 50 is illustrated in FIG. 1 , other pressure regulating devices may be used instead of the closed loop controller 50 .
- a pressure regulating valve (not shown) or a pressure relief valve (not shown) may replace the controller 50 to regulate the melt pressure of the molten thermoplastic material 24 .
- the pressure regulating valve and pressure relief valve can prevent overpressurization of the mold 28 .
- Another alternative mechanism for preventing overpressurization of the mold 28 is an alarm that is activated when an overpressurization condition is detected.
- the molded part 100 is a thin-walled part. Molded parts are generally considered to be thin-walled when a length of a flow channel L divided by a thickness of the flow channel T is greater than 100 (i.e., L/T>100).
- L/T>100 The low constant pressure injection molding systems and molds having simplified cooling that are described herein become increasingly advantageous for molding parts as L/T ratios increase, particularly for parts having L/T>200, or L/T>250 because the molten thermoplastic material includes a continuous flow front that advances through the mold cavity, which fills the mold cavity with thermoplastic material more consistently than high variable pressure injection molding systems.
- the length of the flow channel L is measured from a gate 102 to a flow channel end 104 . Thin-walled parts are especially prevalent in the consumer products industry and healthcare or medical supplies industry.
- Thin-walled parts present certain obstacles in injection molding.
- the thinness of the flow channel tends to cool the molten thermoplastic material before the material reaches the flow channel end 104 .
- the thermoplastic material freezes off and no longer flows, which results in an incomplete part.
- traditional injection molding machines inject the molten thermoplastic material into the mold at very high pressures, typically greater than 15,000 psi, so that the molten thermoplastic material rapidly fills the mold cavity before having a chance to cool and freeze off. This is one reason that manufacturers of the thermoplastic materials teach injecting at very high pressures.
- Another reason traditional injection molding machines inject molten plastic into the mold at high pressures is the increased shear, which increases flow characteristics, as discussed above. These very high injection pressures require the use of very hard materials to form the mold 28 and the feed system.
- shear-thinning thermoplastics even minimally shear-thinning thermoplastics
- these materials include but are not limited to polymers and copolymers comprised of, polyolefins (e.g., polypropylene, polyethylene), thermoplastic elastomers, polyesters (e.g.
- thermoplastic material that advances through the mold from a gate to a farthest part of the mold cavity.
- the thermoplastic material remains liquid and flowable at much lower temperatures and pressures than is otherwise believed to be possible in conventional high pressure injection molding systems.
- FIG. 3 a typical pressure-time curve for a conventional high pressure injection molding process is illustrated by the dashed line 200 .
- a pressure-time curve for the disclosed low constant pressure injection molding machine is illustrated by the solid line 210 .
- melt pressure is rapidly increased to well over 15,000 psi and then held at a relatively high pressure, more than 15,000 psi, for a first period of time 220 .
- the first period of time 220 is the fill time in which molten plastic material flows into the mold cavity.
- the melt pressure is decreased and held at a lower, but still relatively high pressure, 10,000 psi or more, for a second period of time 230 .
- the second period of time 230 is a packing time in which the melt pressure is maintained to ensure that all gaps in the mold cavity are back filled.
- the mold cavity in a conventional high pressure injection molding system is filled from the end of the flow channel back to towards the gate.
- the constant low pressure injection molding system injects the molten plastic material into the mold cavity at a substantially constant low pressure for a single time period 240 .
- the injection pressure is less than 6,000 psi.
- the molten thermoplastic material maintains a continuous melt front that advances through the flow channel from the gate towards the end of the flow channel.
- the plastic material remains relatively uniform at any point along the flow channel, which results in a more uniform and consistent finished product.
- the finished molded parts may form crystalline structures that have better mechanical and/or better optical properties than conventionally molded parts.
- Amorphous polymers may also form structures having superior mechanical and/or optical properties.
- the skin layers of parts molded at low constant pressures exhibit different characteristics than skin layers of conventionally molded parts. As a result, the skin layers of parts molded under low constant pressure can have better optical properties than skin layers of conventionally molded parts.
- the mold 28 illustrated in FIG. 1 may be formed of a material having a milling machining index of greater than 100%, a drilling machining index of greater than 100%, a wire EDM machining index of greater than 100%, a graphite sinker EDM machining index of greater than 200%, or a copper sinker EDM machining index of greater than 150%.
- the machining indexes are based upon milling, drilling, wire EDM, and sinker EDM tests of various materials. The test methods for determining the machining indices are explained in more detail below. Examples of machining indexes for a sample of materials is compiled below in Table 1.
- easily machineable materials having good thermal conductivity properties When forming the mold 28 of these easily machineable materials, it is also advantageous to select easily machineable materials having good thermal conductivity properties. Materials having thermal conductivities of more than 30 BTU/HR FT ° F. are particularly advantageous.
- easily machineable materials having good thermal conductivities include, but are not limited to, Alcoa QC-10, Alcan Duramold 500, and Hokotol (available from Alerts). Materials with good thermal conductivity more efficiently transmit heat from the thermoplastic material out of the mold. As a result, more simple cooling systems may be used.
- Multi-cavity molds generally include a feed manifold 60 that directs molten thermoplastic material from the nozzle 26 to the individual mold cavities 32 .
- the feed manifold 60 includes a sprue 62 , which directs the molten thermoplastic material into one or more runners or feed channels 64 .
- Each runner 64 may feed multiple mold cavities 32 .
- High productivity molds may include four or more mold cavities 32 , sometimes as many as three hundred and eighty four mold cavities 32 , and often also may include heated runners 64 .
- Some embodiments of constant low pressure injecting molding machines may include non-naturally balanced feed systems, such as artificially balanced feed systems, or non-balanced feed systems.
- the machineability index for each material was determined by measuring the spindle load needed to drill or mill a piece of the material with all other machine conditions (e.g., machine table feed rate, spindle rpm, etc.) being held constant between the various materials.
- Spindle load is reported as a ratio of the measured spindle load to the maximum spindle torque load of 75 ft-lb at 1400 rpm for the drilling or milling device.
- the index percentage was calculated as a ratio between the spindle load for 1117 steel to the spindle load for the test material.
- test milling or drilling machine was a Haas VF-3 Machining Center.
- Drilling Conditions Spot Drill 118 degree 0.5′′ diameter, drilled to 0.0693′′ depth Drill Bit 15/32′′ diameter high speed steel uncoated jobber length bit Spindle Speed 1200 rpm Depth of Drill 0.5′′ Drill Rate 3 in/min Other No chip break routine used
- the EDM machineability index for the various materials were determined by measuring the time to burn an area (specifics below) into the various test metals.
- the machineability index percentage was calculated as the ratio of the time to burn into 1117 steel to time required to burn the same area into the other test materials.
- the disclosed low constant pressure injection molding machines advantageously employ molds constructed from easily machineable materials. As a result, the disclosed low constant pressure injection molds (and thus the disclosed low constant pressure injection molding machines) are less expensive and faster to produce. Additionally, the disclosed low constant pressure injection molding machines are capable of employing more flexible support structures and more adaptable delivery structures, such as wider platen widths, increased tie bar spacing, elimination of tie bars, lighter weight construction to facilitate faster movements, and non-naturally balanced feed systems. Thus, the disclosed low constant pressure injection molding machines may be modified to fit delivery needs and are more easily customizable for particular molded parts.
- the disclosed low constant pressure injection molds may include simplified cooling systems relative to cooling systems found in conventional high pressure injection molds.
- the simplified cooling systems are more economical than conventional cooling systems because the simplified cooling systems are more quickly and easily produced. Additionally, the simplified cooling systems use less coolant, which further reduces cooling costs during molding operations.
- the simplified cooling systems may be located solely in the mold support plates, which allows the mold sides to be changed without the need for changing the cooling system.
- the simplified cooling systems of the disclosed low constant pressure injection molding molds are more economical and more effective than conventional complex cooling systems found in conventional high pressure injection molds.
- a mold support plate physically supports and reinforces a mold side. Two or more mold sides (or mold cores) define a mold cavity.
- a mold support plate may support a mold side by continuous contact along a length and width of a mold side.
- a mold support plate may support a mold side by intermittent or partial physical contact with the mold side. Such intermittent or partial physical contact may be used for a variety of reasons such as (i) to focus the load bearing contact on certain locations (e.g., reinforced locations) of the mold side, (ii) to direct the location of portions of the thermal exchange or heat flow between specific parts of the mold side and the mold support plate, or (iii) to accommodate the special needs for a given apparatus.
- the mold support plate may remain in contact with the mold side throughout the molding process, or the mold support plate may completely separate from the mold side for certain periods of time during the molding process. Moreover, the mold support plate may be formed of two or more separate pieces that are fixed to one another.
- the mold support plate may be made of a material with a high thermal conductivity (e.g., 30 BTU/hr Ft ° F.). In some embodiments, the mold support plate may be made of a material having a higher thermal conductivity than the material of the mold side, or vice versa. In yet other embodiments, the mold support plate may have a thermal conductivity that is identical to the thermal conductivity of the mold side.
- the mold support plate may be made of CuBe, or least a portion of the mold support plate may be made of CuBe, which contacts the mold side that may be made of aluminum. While the mold support plates illustrated in the drawings are generally formed from a single piece of material, in other embodiments, the mold support plates may be formed from multiple pieces of similar or different material that are fixed to one another.
- Cooling systems of all sorts may be categorized in a system of cooling complexity levels, with cooling complexity level zero representing the most simple cooling system and higher cooling complexity levels representing progressively more complex cooling systems. This system of cooling system categorization is discussed below in more detail.
- conventional high productivity consumer product injection molding machines e.g., class 101 and 102 molding machines
- high productivity consumer product injection molding machines include complex cooling systems (i.e., cooling systems having a level four cooling system complexity level or higher).
- Level zero to level three cooling complexity level systems generally do not produce cooling capacity that is sufficient for conventional high productivity injection molds, which include molds made of high hardness, low thermal conductivity materials.
- the disclosed low constant pressure injection molds include cooling systems having cooling complexity levels of three or less, preferably cooling complexity level three, two, or one, which lowers production costs and increases efficiency over conventional high pressure injection molding machines.
- a cooling complexity level zero mold assembly is defined as a mold assembly that includes no active cooling system.
- a cooling complexity level zero mold assembly is only passively cooled through the conduction of heat through the mold sides and through the mold support plates, and eventually to the atmosphere surrounding the mold assembly.
- Cooling complexity level zero mold assemblies typically have relatively long cycle times (as it takes a significant amount of time for the plastic within the mold to freeze because of the slow cooling rate).
- high productivity consumer product mold assemblies e.g., mold assemblies used in class 101-102 molding machines
- One or more cooling lines 382 may be formed in one or more of the mold support plates 378 , 380 . Because the first and second sides 372 , 374 are made from a highly thermally conductive material, heat flows through the first and second sides 372 , 374 to the mold support plates 378 , 380 at a rate that is sufficient to cool plastic in the mold cavity 376 in an acceptable amount of time.
- the mold support plates 378 , 380 may include posts or other projections 381 that extend outward, away from the mold support plate 378 , 380 , towards the mold 370 .
- the cooling lines 382 may extend into the projections 381 .
- the mold 370 may include a complementary feature so that the mold may fit around ( FIG. 5B ), within ( FIG. 5C ), or upon ( FIGS. 5D and 5E ) the projections 381 . In this way, the cooling lines 382 may be located closer to the mold cavity without extending the cooling lines 382 into the mold 370 or into the first and second mold sides 372 , 374 .
- the mold support plates 378 , 380 may receive molds having a variety of different mold cavity shapes. The molds may thus be formed without cooling lines integrated into the first and/or second sides 372 , 374 , which reduces manufacturing costs of the molds 370 .
- Cooling complexity level two mold assemblies have not been used in high output consumer product injection molding machines (i.e., class 101-102 injection molding machines) because cooling complexity level two mold assemblies do not have enough flexibility to machine cooling lines close to the mold surfaces of the mold cavity and therefore, cooling complexity level two mold assemblies do not provide adequate cooling for conventional high output mold assemblies having high hardness, low thermal conductivity molds.
- a cooling complexity level three mold assembly 328 is defined by cooling channels 382 having at least two different machining axes. At least one cooling line 382 may include two different machining axes and a terminal end. More particularly, the cooling line 382 may have a bend or turn. For example, the cooling line 382 may include a first machining axis that is substantially parallel to the opening-closing stroke S of the mold assembly 328 and a second machining axis that is angled with respect to the first machining axis.
- cooling complexity level three mold assemblies have not been used in high output consumer product injection molding machines (e.g., class 101-102 injection molding machines) because level three cooling complexity does not have enough flexibility to machine cooling lines close to the mold surfaces of the mold cavity and therefore, cooling complexity level three mold assemblies do not provide adequate cooling for conventional high output mold assemblies having high hardness, low thermal conductivity molds.
- the cooling complexity level four mold assembly 328 includes a plurality of cooling lines 382 , a first cooling line 382 a having a terminal end 384 and a second cooling line 382 b being a through-bore without a terminal end.
- the first cooling line 382 a extends from the mold support plate 378 into the first mold side 372 and the second cooling line 382 b extends through the first mold side 372 .
- a machining axis for the first cooling line 382 a is different from a machining axis for the second cooling line 382 b .
- the cooling lines 382 have at least two different machining axes for formation. Cooling complexity level four mold assemblies have been used in some high output consumer product injection molding machines (e.g., class 101-102 injection molding machines) having mold assemblies with very simple mold cavity geometries.
- the cooling complexity level five mold assembly 328 includes a first cooling line 382 that is a through-bore having two different machining axes. As illustrated in FIG. 10 , the first cooling line 382 includes a first section 390 and a second section 392 that are angled with respect to one another and meet at a junction or turn 394 . Machining the first cooling line 382 with two different axes that must meet at an internal location in the mold part requires great precision and thus more costly equipment, along with a greater manufacturing time.
- cooling complexity level five mold assemblies 328 have been used in high output consumer product injection molding machines (e.g., class 101-102 injection molding machines) because cooling complexity level five mold assemblies allow for greater customization in cooling line placement.
- cooling lines can be placed closer to the mold cavity than in cooling complexity mold assemblies of lesser complexity.
- the more complex cooling complexity mold assembly can at least partially offset the drawback of lower thermal conductivity found in conventional injection molds made of high hardness, low thermal conductivity materials.
- the cooling complexity level six mold assembly 328 is a cooling complexity level one to five mold assembly that also includes at least one actively cooled dynamic molding part 398 . Forming cooling channels in a dynamic molding part 398 requires great precision. Moreover, actively cooled dynamic molding parts 398 require complicated flow mechanisms that move with the dynamic molding part 398 during operation of the mold assembly 328 . Cooling complexity level six mold assemblies have been used in high output consumer product injection molding machines (e.g., class 101-102 injection molding machines).
- the cooling complexity level seven mold assembly 328 is a cooling complexity level two through six mold assembly that includes at least one conformal cooling cavity 399 .
- the conformal cooling cavity 399 at least partially complements the contours of the mold cavity to provide maximum active cooling.
- the conformal cooling cavity 399 is non-linear, non-coaxial, and/or non-planar. Conformal cooling cavities 399 require complex machinery to form. Additionally, conformal cooling cavities 399 take significant amounts of time to form. As a result, cooling complexity level seven mold assemblies are very expensive and are generally reserved for high output consumer product injection molding machines that have very intricate part geometries.
- the simplified cooling systems described herein may be incorporated into virtually any type of conventional injection mold, such as an injection molding machine having a cube mold assembly 428 , as illustrated in FIG. 13 .
- a level one cooling complexity level injection mold assembly may include an evaporative cooling system.
- Evaporative cooling systems are more efficient in removing heat than liquid based cooling systems.
- evaporative cooling systems may be 100 times more efficient, or even 500 times more efficient, at removing heat than liquid based cooling systems.
- the injection mold assemblies described herein are made of materials having high thermal conductivity, these mold assemblies may include more simplified cooling systems (by moving cooling lines farther away from the mold cavity) while increasing heat removal by including evaporative cooling systems. Moving cooling lines away from the mold cavity produces more uniform temperature distributions throughout the mold sides.
- level one cooling complexity mold assemblies having evaporative cooling systems do not need complex dynamic seals between the mold support plates and the mold sides because the cooling fluid lines do not extend into the mold sides.
- the evaporative cooling systems in level one cooling complexity level mold assemblies are more robust and less prone to failure than evaporative cooling systems in prior art mold assemblies that required the cooling fluid to extend into the mold sides.
- evaporative cooling systems exploit a phase change in a cooling fluid to extract more heat from the mold assembly than a conventional all liquid cooling system could extract.
- the circulating fluid alternates between a liquid and a gas phase. Transition from a liquid to a gas phase is highly endothermic.
- the liquid cooling fluid passes through a region of elevated temperature (such as the mold support plate, or an evaporator)
- the cooling fluid absorbs heat from the mold support plate and changes phase to a gas.
- the gas then passes to a region of lower temperature, such as a condenser, where heat is transferred from the gas to the environment.
- Evaporative cooling systems may be ten times more effective, 100 times, or even 500 times more effective at removing heat than conventional all liquid cooling systems.
- a mold support plate may comprise the evaporator 522 .
- the mold support plate may include one or more cooling channels for moving cooling fluid through the mold support plate to remove heat from the mold support plate.
- the evaporator surfaces are relatively warm, compared to the cooling fluid in the evaporator 522 . Thus, heat is transferred from the evaporator (e.g., the mold support plate) to the cooling fluid, which results in vaporization of a majority of the remaining cooling fluid.
- the cooling fluid moves through cooling line 512 d to the compressor 510 and the process is repeated.
- the evaporator 522 , the compressor 510 , the condenser 516 , and the expansion valve 520 are all fluidly connected to one another by the cooling lines 512 a - d .
- the entire cooling circuit 514 may be located within or on the evaporator 522 or mold support plate.
- the mold support plate may comprise the evaporator 522 (having one or more cooling channels located within the mold support plate), while one or more of the compressor 510 , the condenser 516 , and the expansion valve 520 may be physically separated from the mold support plate, while being fluidly connected to the mold support plate via the cooling lines 512 a - d.
- FIG. 15 illustrates one embodiment of an evaporative cooling system 600 that may be used in an injection molding machine.
- the evaporative cooling system 600 includes the same elements as the evaporative cooling system of FIG. 14 , with respective elements having reference numerals increased by 100.
- the evaporative cooling system 600 includes a compressor 610 , a condenser 616 , an expansion valve 620 and an injection mold 622 , all fluidly connected by a plurality of cooling lines 612 a - d to form a closed loop cooling circuit 614 .
- the injection mold 622 itself, and more specifically a mold support plate of the injection mold 622 , forms the evaporator.
- FIG. 16A another example of an evaporative cooling system 700 , which is located in a mold support plate 478 of an injection mold, is illustrated.
- the evaporative cooling system 700 includes a chamber 710 within the mold support plate 478 .
- An evaporative liquid 712 such as water, is disposed within the chamber 710 .
- a percolator tube 714 connects a reservoir portion 716 of the chamber 710 to a condensing portion 718 of the chamber 710 .
- the percolator tube 714 assists in moving water from the bottom of the chamber 710 to the top of the chamber 710 .
- a cooled condenser 720 may be located near the top of the chamber 710 .
- FIG. 16B illustrates an alternate embodiment of an evaporative cooling system 800 .
- Elements of the evaporative cooling system 800 like those of the evaporative cooling system 700 of FIG. 16A have reference numerals that are 100 greater than the elements in FIG. 16A .
- the main difference in the evaporative cooling system 800 of FIG. 16B is that an additional collection portion 830 is located within the chamber 810 vertically between the condensing portion 818 and the reservoir portion 816 .
- the collection portion 830 may facilitate collection and re-evaporation of liquid water for larger (or longer) mold support plates.
- the evaporative (and vapor compression) cooling systems 500 , 600 , 700 , and 800 of FIGS. 14 , 15 , 16 A, and 16 B may include a vacuum system to lower relative pressures of the cooling fluids. Lowering relative pressures of the cooling fluids lowers the evaporation temperature for a given cooling fluid (all other factors being equal).
- the evaporative (and vapor compression) cooling systems 500 , 600 , 700 , and 800 may include a pressurization system to increase relative pressure of the cooling fluid. Raising relative pressure of the cooling fluid raises the evaporation temperature of a given cooling fluid (all other factors being equal). In this way, the evaporation temperature may be tailored to the temperatures typically experienced by a particular mold.
- Evaporative cooling systems may use many different types of cooling fluids, such as refrigerants (e.g., chlorofluorocarbons, chlorofluoroolefins, hydrochlorofluorocarbons, hydrochlorofluoroolefins, hydrofluorocarbons, hydrofluoroolefins, hydrochlorocarbons, hydrochloroolefins, hydrocarbons, hydroolefins, perfluorocarbons, perfluoroolefins, perchlorocarbons, perchloroolefins, and halon/haloalkane, and blends thereof), water, glycol, propylene glycol, alcohol, or mercury.
- refrigerants e.g., chlorofluorocarbons, chlorofluoroolefins, hydrochlorofluorocarbons, hydrochlorofluoroolefins, hydrofluorocarbons, hydrofluoroolefins, hydrochlor
- refrigerants having cooling capacities and/or physical or chemical properties similar to the refrigerants listed above may also be used.
- other cooling fluids that undergo a phase change when exposed to temperatures between about 0° C. and about 200° C. at pressures between 0 psi (i.e., complete vacuum) and about 2000 psi may also be used.
- a surfactant may be added to the cooling fluid.
- Some evaporative cooling systems may utilize a vacuum system to create differential pressure, while other evaporative cooling systems may utilize compressors to create differential pressure.
- the evaporative cooling system may employ atmospheric liquid evaporation to remove heat. Because the disclosed mold assemblies are made of highly thermally conductive materials, in some cooling complexity level zero mold assemblies it is possible to simply spray a cooling liquid on the outer surface of the mold support plates or mold sides, which evaporates as the liquid absorbs heat, thereby cooling the mold support plate or the mold side.
- a cooling liquid that may be advantageously employed in these types of systems is distilled water. Distilled water will completely evaporate without leaving any type of residue on the mold support plate or mold side.
- fins or radiator structures may be used to increase surface area of the mold support plate or mold side to further facilitate evaporation and heat removal.
- the mold 910 may include a first mold side 925 and a second mold side 927 .
- a first mold support plate 978 and a second mold support plate 980 may be located adjacent the first and second mold sides 925 , 927 , respectively.
- a spray bar 911 may be positioned near one of the mold support plates 978 , 980 , and/or near one of the mold sides 925 , 927 .
- the spray bar 910 is fluidly connected to a pump 912 , which pumps liquid (for example water) to the spray bar 910 under pressure.
- the liquid is sprayed out of a nozzle 914 so that the sprayed liquid coats an outer surface of one of the mold support plates 978 , 980 and the mold sides 925 , 927 .
- heat from the mold support plate 978 , 980 , and/or the mold side 925 , 927 causes the liquid to evaporate, thus cooling the mold support plate 978 , 980 and/or the mold side 927 , 927 .
- Liquid that does not evaporate may drip down and collect in a liquid collection area or sump 940 .
- the sump 940 is an area or reservoir for collecting liquid that does not evaporate.
- a return line 942 extends from the sump 940 to the pump 912 to channel water from the sump 940 back to the spray bar 911 .
- the pump 912 may also be connected to a source of liquid 944 so that a supply of liquid is always available to the spray bar 911 , regardless of the level of liquid in the sump 940 .
- evaporated liquid simply vents to the atmosphere and fresh liquid is supplied through the source of liquid 944 to make up for the lost evaporated liquid.
- the entire mold 910 may be located in a closed environment and the evaporated liquid may be condensed and returned to the sump 940 .
- the disclosed mold assemblies may include cooling systems having cooling channels that are completely confined within a mold support plate. As a result, the disclosed systems do not need any dynamic seals (e.g., seals between moving parts) and the risk of cooling fluid escaping to the atmosphere, or being released into the environment is reduced.
- dynamic seals e.g., seals between moving parts
- the cooling systems disclosed herein for a level one cooling complexity mold, include cooling channels only in one or more of the mold support plates. In other words, there are no cooling channels in either the first mold side or the second mold side. As a result, all seals in the cooling systems are static in nature and very robust. Stated another way, there are no seals between components that move relative to one another in the disclosed cooling systems, which would require softer, dynamic seals. Thus, the disclosed cooling systems may use dangerous, hazardous, or expensive cooling fluids (sometimes referred to as “exotic cooling fluids”) as there is little chance of seal breach, which would result in release of the cooling fluid. Some dangerous, hazardous, or expensive cooling fluids may have superior heat absorption properties when compared to traditional cooling fluids.
- cooling fluids have not been previously used in cooling systems for injection molds for fear of seal breach (especially a breach in dynamic seals between moving parts), which would release these cooling fluids to the atmosphere.
- Particularly useful dangerous, hazardous, or expensive cooling fluids that may now be used in the disclosed cooling systems (due to the very low risk of these cooling fluids escaping to the atmosphere) include heating oil, hydraulic fluid, glycols, cesium, mercury, potassium (which has a thermal conductivity of approximately 42 W/mK at 25° C.), lead-bismuth eutectic, sodium potassium alloy, sodium potassium cesium alloy, and lead-bismuth.
- Desirable cooling fluids may have a thermal conductivity of 1 W/mK or more. More desirable cooling fluids may have a thermal conductivity of between about 1 W/mk to about 42 W/mk. Some desirable cooling liquids maintain a flowable viscosity (e.g., a cpi of 100,000 or less) at temperatures between about 5° C. and about 100° C.
- non-hazardous cooling fluids that are relatively expensive may also be used in the disclosed cooling systems.
- One such expensive, but useful, cooling fluid is distilled water, which advantageously dose not corrode internal components of the disclosed cooling systems. Distilled water, however, has not been used in conventional high productivity injection molding systems because of the need to constantly replace distilled water lost through seal breaches. These losses generally required a distillation plant on site to produce make up distilled water, which is cost prohibitive in the highly competitive consumer products injection molding industry.
- Nanofluids may be used as cooling fluids.
- Nanofluids include a carrier liquid, such as water, having tiny nano-scale particles known as nanoparticles dispersed throughout the carrier liquid.
- Nanoparticles of solid materials e.g., copper oxide, alumina, titanium dioxide, carbon nanotubes, silica, or metals, including copper, or silver nanorods
- the enhancement can be theoretically as high as 350%.
- nanofluids have been experimentally shown to have thermal conductivities of 50%-100% greater than the thermal conductivity of the carrier liquid alone. Nanofluids also exhibit a significant increase in heat flux when compared to traditional cooling fluids.
- a nanofluid may comprise ethylene glycol and copper nanoparticles, which has a thermal conductivity of approximately 1.4 W/mK at 25° C.
- silver nanorods of 55 ⁇ 12 nm diameter and 12.8 ⁇ m average length at 0.5 vol. % can increase thermal conductivity of water by 68%, and 0.5 vol. % of silver nanorods increased thermal conductivity of ethylene glycol based coolant by 98%.
- Alumina nanoparticles at 0.1% can increase the critical heat flux of water by as much as 70%.
- the disclosed cooling complexity level one molds may use nanofluids to increase heat transfer rates, which results in more efficient cooling.
- Desirable nanofluids may have thermal conductivities of 1 W/mK or more. Examples of nanoparticles that may be added to a carrier fluid include copper oxide, alumina, titanium oxide, boron nitride nanotubes, carbon nanotubes, carbon uranium nano rods, and silver nano rods.
- these nanofluids have a greater heat capacity than traditional cooling fluids.
- fluid circulation rates may be slowed to allow the nanofluid to remove more heat per unit volume than traditional cooling fluids.
- the overall cooling fluid volume needed for such a system may be reduced, causing a corresponding reduction in overall cost and complexity of the cooling system.
- the mold may be cooled completely by convection/conduction of heat to the atmosphere.
- Radiator fins may be formed on the mold support plates or the mold sides to enhance convection of heat to the atmosphere.
- a gas moving device such as a fan, may move atmospheric gases over the molds and/or over the radiator fins to further enhance heat dissipation though conduction.
- the cooling complexity level three or lower mold assemblies may be used even in ultra high output consumer product injection molding machines (e.g., class 101-102 injection molding machines) where more complex cooling systems were needed for conventional injection molds made from high hardness, low thermal conductivity materials.
- ultra high output consumer product injection molding machines e.g., class 101-102 injection molding machines
- the disclosed low constant pressure injection molds and mold assemblies, and thus the injection molding machines are less costly to manufacture, while decreasing mold cycle times and increasing mold productivity due at least in part to the availability of less complex cooling systems.
- molds made from high thermal conductivity materials are more uniform during the injection molding process than in conventional molds. In other words, there is less temperature variation from point to point within the mold.
- parts manufactured in molds with high thermal conductivity have less internal stress (and a more uniform crystalline structure) than parts manufactured in conventional molds. This lower internal stress and more uniform crystallinity result in lower rates of part warp.
- the mold cavity is often designed to offset part warp due to non-uniform temperature gradients, which adds to the cost and complexity of conventional mold assemblies. Finalizing a particular offset usually requires an iterative and time consuming trial process.
- the terms “substantially,” “about,” and “approximately,” unless otherwise specified, may be utilized herein to represent the inherent degree of uncertainty that may be attributed to any quantitative comparison, value, measurement, or other representation. These terms are also utilized herein to represent the degree by which a quantitative representation may vary from a stated reference without resulting in a change in the basic function of the subject matter at issue. Unless otherwise defined herein, the terms “substantially,” “about,” and “approximately” mean the quantitative comparison, value, measurement, or other representation may fall within 20% of the stated reference.
- the various embodiments of the products illustrated and described herein may be produced by a low constant pressure injection molding process. While particular reference has been made herein to products for containing consumer goods or consumer goods products themselves, it should be apparent that the low constant pressure injection molding method discussed herein may be suitable for use in conjunction with products for use in the consumer goods industry, the food service industry, the transportation industry, the medical industry, the toy industry, and the like. Moreover, one skilled in the art will recognize the teachings disclosed herein may be used in the construction of stack molds, multiple material molds including rotational and core back molds, in combination with in-mold decoration, insert molding, in mold assembly, and the like.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (15)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/601,359 US20130295219A1 (en) | 2012-05-02 | 2012-08-31 | Injection Mold Having a Simplified Evaporative Cooling System or a Simplified Cooling System with Exotic Cooling Fluids |
| US13/682,456 US20130221575A1 (en) | 2012-02-24 | 2012-11-20 | Method for Operating a High Productivity Injection Molding Machine |
| MX2014012871A MX2014012871A (es) | 2012-05-02 | 2013-05-02 | Molde de inyeccion que tiene un sistema de enfriamiento por evaporacion simplificado o un sistema de enfriamiento simplificado con fluidos de enfriamiento exoticos. |
| PCT/US2013/039243 WO2013166272A2 (en) | 2012-05-02 | 2013-05-02 | Injection mold having a simplified evaporative cooling system or a simplified cooling system with exotic cooling fluids |
| IN8887DEN2014 IN2014DN08887A (enExample) | 2012-05-02 | 2013-05-02 | |
| BR112014027424A BR112014027424A2 (pt) | 2012-05-02 | 2013-05-02 | molde para injeção que tem um sistema de resfriamento evaporativo simplificado ou um sistema de resfriamento simplificado com fluidos de resfriamento exóticos |
| CA2871980A CA2871980C (en) | 2012-05-02 | 2013-05-02 | Injection mold having a simplified evaporative cooling system or a simplified cooling system with exotic cooling fluids |
| EP13723615.4A EP2844453B1 (en) | 2012-05-02 | 2013-05-02 | Injection mold having a simplified evaporative cooling system or a simplified cooling system with exotic cooling fluids |
| CN201380022879.3A CN104271329A (zh) | 2012-05-02 | 2013-05-02 | 具有简化的蒸发冷却系统或利用外来冷却流体的简化的冷却系统的注塑模具 |
| AU2013256204A AU2013256204A1 (en) | 2012-05-02 | 2013-05-02 | Injection mold having a simplified evaporative cooling system or a simplified cooling system with exotic cooling fluids |
| TW102115796A TW201406522A (zh) | 2012-05-02 | 2013-05-02 | 具有簡化蒸發冷卻系統或含有特異冷卻流體之簡化冷卻系統之射出模具 |
| JP2015510452A JP5973656B2 (ja) | 2012-05-02 | 2013-05-02 | 簡略型蒸発冷却システム又は新奇な冷却流体を使用する簡略型冷却システムを有するイジェクション成形 |
| RU2014142162A RU2014142162A (ru) | 2012-05-02 | 2013-05-02 | Пресс-форма для инжекционного формования с упрощенной испарительной системой охлаждения или упрощенной системой охлаждения с необычными охлаждающими текучими средами |
| US14/491,257 US9682505B2 (en) | 2012-05-02 | 2014-09-19 | Injection mold having a simplified evaporative cooling system or a simplified cooling system with exotic cooling fluids |
| PH12014502433A PH12014502433A1 (en) | 2012-05-02 | 2014-10-30 | Injection mold having a simplified evaporative cooling system or a simplified cooling system with exotic cooling fluids |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261641349P | 2012-05-02 | 2012-05-02 | |
| US13/601,359 US20130295219A1 (en) | 2012-05-02 | 2012-08-31 | Injection Mold Having a Simplified Evaporative Cooling System or a Simplified Cooling System with Exotic Cooling Fluids |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/476,584 Continuation-In-Part US9272452B2 (en) | 2011-05-20 | 2012-05-21 | Method and apparatus for substantially constant pressure injection molding of thinwall parts |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/476,178 Continuation-In-Part US20120295049A1 (en) | 2011-05-20 | 2012-05-21 | Method for Injection Molding at Low Substantially Constant Pressure |
| US14/491,257 Division US9682505B2 (en) | 2012-05-02 | 2014-09-19 | Injection mold having a simplified evaporative cooling system or a simplified cooling system with exotic cooling fluids |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20130295219A1 true US20130295219A1 (en) | 2013-11-07 |
Family
ID=49512707
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/601,359 Abandoned US20130295219A1 (en) | 2012-02-24 | 2012-08-31 | Injection Mold Having a Simplified Evaporative Cooling System or a Simplified Cooling System with Exotic Cooling Fluids |
| US13/765,428 Active US8591219B1 (en) | 2012-05-02 | 2013-02-12 | Injection mold having a simplified evaporative cooling system |
| US14/491,257 Active US9682505B2 (en) | 2012-05-02 | 2014-09-19 | Injection mold having a simplified evaporative cooling system or a simplified cooling system with exotic cooling fluids |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/765,428 Active US8591219B1 (en) | 2012-05-02 | 2013-02-12 | Injection mold having a simplified evaporative cooling system |
| US14/491,257 Active US9682505B2 (en) | 2012-05-02 | 2014-09-19 | Injection mold having a simplified evaporative cooling system or a simplified cooling system with exotic cooling fluids |
Country Status (13)
| Country | Link |
|---|---|
| US (3) | US20130295219A1 (enExample) |
| EP (1) | EP2844453B1 (enExample) |
| JP (1) | JP5973656B2 (enExample) |
| CN (1) | CN104271329A (enExample) |
| AU (1) | AU2013256204A1 (enExample) |
| BR (1) | BR112014027424A2 (enExample) |
| CA (1) | CA2871980C (enExample) |
| IN (1) | IN2014DN08887A (enExample) |
| MX (1) | MX2014012871A (enExample) |
| PH (1) | PH12014502433A1 (enExample) |
| RU (1) | RU2014142162A (enExample) |
| TW (1) | TW201406522A (enExample) |
| WO (1) | WO2013166272A2 (enExample) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8757999B2 (en) | 2011-05-20 | 2014-06-24 | The Procter & Gamble Company | Alternative pressure control for a low constant pressure injection molding apparatus |
| US8828291B2 (en) | 2011-05-20 | 2014-09-09 | The Procter & Gamble Company | Method for substantially constant pressure injection molding of thinwall parts |
| US8911228B2 (en) | 2011-05-20 | 2014-12-16 | Imflux, Inc. | Non-naturally balanced feed system for an injection molding apparatus |
| US20150174794A1 (en) * | 2012-06-20 | 2015-06-25 | Magna International Inc. | Nanofluid mold cooling |
| US9089998B2 (en) | 2012-02-24 | 2015-07-28 | Imflux, Inc. | Injection mold having a simplified cooling system |
| US20160059304A1 (en) * | 2013-04-15 | 2016-03-03 | Michael Douglas Blow | Liquid cooled die casting mold with heat sinks |
| US9364977B2 (en) | 2013-05-13 | 2016-06-14 | Imflux, Inc. | Low constant pressure injection molding system with variable-position molding cavities |
| US20160229001A1 (en) * | 2015-02-05 | 2016-08-11 | GM Global Technology Operations LLC | Thermal-management systems for controlling temperature of workpieces being joined by welding |
| US9604398B2 (en) | 2012-11-08 | 2017-03-28 | Imflux Inc | Injection mold with fail safe pressure mechanism |
| US9682505B2 (en) | 2012-05-02 | 2017-06-20 | Imflux Inc | Injection mold having a simplified evaporative cooling system or a simplified cooling system with exotic cooling fluids |
| US9707709B2 (en) | 2011-05-20 | 2017-07-18 | Imflux Inc | Method for injection molding at low, substantially constant pressure |
| US20170259481A1 (en) * | 2016-03-10 | 2017-09-14 | Otto Manner Innovation Gmbh | Hot runner system and associated nozzle heating devices |
| US10076861B2 (en) | 2011-05-20 | 2018-09-18 | Imflux Inc | Apparatus for injection molding at low constant pressure |
| CN113276369A (zh) * | 2021-07-12 | 2021-08-20 | 深圳市鸿运沅电子有限公司 | 一种耳机壳体注塑模具及其注塑工艺 |
| CN114603802A (zh) * | 2022-04-15 | 2022-06-10 | 辛集伟博新能源科技有限公司 | 一种温控型注塑模具及制作工艺 |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190118442A9 (en) * | 2010-04-20 | 2019-04-25 | Honda Motor Co., Ltd. | Conforming cooling method and mold |
| JP2013540619A (ja) * | 2010-09-23 | 2013-11-07 | ハスキー インジェクション モールディング システムズ リミテッド | マニホールドアセンブリ用の定温ヒーターアセンブリを備える金型工具アセンブリ |
| BR112015011681A2 (pt) | 2012-11-21 | 2017-07-11 | Imflux Inc | canal de injeção de tamanho reduzido para um sistema de molde para injeção |
| JP5726845B2 (ja) * | 2012-12-13 | 2015-06-03 | 本田技研工業株式会社 | 鋳造金型冷却装置及び鋳造金型冷却方法 |
| CN105431273B (zh) | 2013-08-01 | 2018-06-19 | 艾姆弗勒克斯有限公司 | 考虑注塑运行期间材料特性的变化的注塑机和方法 |
| CN105473304B (zh) | 2013-08-01 | 2018-07-10 | 艾姆弗勒克斯有限公司 | 考虑注塑运行期间材料特性的变化的注塑机和方法 |
| US9216532B2 (en) * | 2014-02-14 | 2015-12-22 | GM Global Technology Operations LLC | Injection mold assembly |
| US9867445B2 (en) | 2014-12-22 | 2018-01-16 | The Procter & Gamble Company | Package for consumer care products |
| US9795206B2 (en) | 2014-12-22 | 2017-10-24 | The Procter & Gamble Company | Package for consumer care products |
| EP3236798A1 (en) | 2014-12-22 | 2017-11-01 | The Procter and Gamble Company | Package for consumer care products |
| CN107658276B (zh) * | 2017-08-23 | 2019-07-02 | 安徽工程大学 | 一种用于微电子芯片表面的散热结构 |
| JP7221066B2 (ja) * | 2019-01-31 | 2023-02-13 | 住友重機械工業株式会社 | 射出成形機用冷却装置及び成形品取出システム |
| EP4045286A4 (en) * | 2019-10-15 | 2023-11-22 | DME Company LLC | COOLING ARRANGEMENT FOR CHILL PLATE |
| JP7581622B2 (ja) | 2020-01-28 | 2024-11-13 | セイコーエプソン株式会社 | 射出成形装置、射出成形装置用冷却プレート、および、カセット型 |
| CN115091681A (zh) * | 2020-05-23 | 2022-09-23 | 侯奥 | 一种多功能发泡模具系统及其使用方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8591219B1 (en) * | 2012-05-02 | 2013-11-26 | The Procter & Gamble Company | Injection mold having a simplified evaporative cooling system |
Family Cites Families (80)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2350348A (en) | 1942-12-21 | 1944-06-06 | Gen Motors Corp | Heat transfer device |
| US3127753A (en) | 1960-01-04 | 1964-04-07 | George A Tinnerman | Method of chilling die elements of molding apparatus |
| DE2427969A1 (de) | 1974-06-10 | 1976-01-02 | Reinhard Colortronic | Verfahren und vorrichtung zum spritzgiessen, insbesondere von kunststoffen |
| US4219322A (en) | 1978-12-20 | 1980-08-26 | Owens-Illinois, Inc. | Apparatus for molding plastic articles |
| JPS60127125A (ja) | 1983-12-14 | 1985-07-06 | Chisso Corp | 射出成形方法 |
| GB8424357D0 (en) | 1984-09-26 | 1984-10-31 | British Telecomm | Injection moulding apparatus |
| JPH0222026A (ja) * | 1988-01-04 | 1990-03-28 | Toshiba Corp | ディスク成形用金型 |
| DE3836875A1 (de) * | 1988-04-07 | 1989-10-26 | Erlenbach Gmbh & Co Kg | Verfahren und vorrichtung zum herstellen von formlingen aus expandierbaren kunststoffpartikeln |
| JP2691581B2 (ja) | 1988-10-03 | 1997-12-17 | 東芝機械株式会社 | 射出成形装置およびこれを用いる射出成形方法 |
| JPH0379317A (ja) | 1989-08-23 | 1991-04-04 | Toshiba Corp | プラスチックの成形品 |
| US5478520A (en) | 1989-10-27 | 1995-12-26 | Mitsubishi Jukogyo Kabushiki Kaisha | Process for injection molding and apparatus therefor |
| JPH04126214A (ja) | 1990-09-17 | 1992-04-27 | Fuji Photo Film Co Ltd | 金型 |
| US5260014A (en) * | 1991-06-13 | 1993-11-09 | Automotive Plastic Technologies | Method of making a multilayer injection mold |
| JPH056914A (ja) | 1991-06-27 | 1993-01-14 | Fujitsu Ltd | 半導体装置の樹脂封止装置およびその樹脂封止方法 |
| JPH0577244A (ja) | 1991-09-19 | 1993-03-30 | Sony Corp | 金 型 |
| CA2079390C (en) | 1991-10-16 | 1996-08-27 | Akira Nonomura | Multi-cavity mold, method of fabricating same and molding control method using said mold |
| JPH0753405B2 (ja) | 1991-11-28 | 1995-06-07 | 花王株式会社 | 射出成形機における樹脂流動物性変動制御方法および装置 |
| JP2559651B2 (ja) | 1991-12-26 | 1996-12-04 | 花王株式会社 | 射出成形の制御方法および装置 |
| US6276656B1 (en) | 1992-07-14 | 2001-08-21 | Thermal Wave Molding Corp. | Mold for optimizing cooling time to form molded article |
| JPH072359B2 (ja) | 1992-10-22 | 1995-01-18 | 大宝工業株式会社 | 射出成形ユニット |
| US5775402A (en) * | 1995-10-31 | 1998-07-07 | Massachusetts Institute Of Technology | Enhancement of thermal properties of tooling made by solid free form fabrication techniques |
| US5407342A (en) | 1993-09-13 | 1995-04-18 | Boucher; Paul Y. | Apparatus for manufacturing a composite product |
| JPH07223242A (ja) | 1994-02-15 | 1995-08-22 | Mitsubishi Materials Corp | 複数個取り金型 |
| US5441680B1 (en) | 1994-05-02 | 1997-04-29 | Milko G Guergov | Method and apparatus for injection molding |
| US5716561A (en) | 1994-05-02 | 1998-02-10 | Guergov; Milko G. | Injection control system |
| JPH08200915A (ja) * | 1995-01-30 | 1996-08-09 | Ikegami Kanagata Kogyo Kk | 冷却装置 |
| US5811494A (en) | 1995-04-06 | 1998-09-22 | The Dow Chemical Company | Impact modified thinwall polymer compositions |
| US5902525A (en) | 1995-06-19 | 1999-05-11 | Hettinga; Siebolt | Method of molding a plastic article including injecting based upon a pressure-dominated control algorithm after detecting an indicia of a decrease in the surface area of the melt front |
| EP0749821B1 (en) | 1995-06-19 | 2003-03-05 | Siebolt Hettinga | A low pressure method for injection molding a plastic article |
| US5939004A (en) * | 1995-11-30 | 1999-08-17 | Harrison; Donald G. | Molding thermosetting polymers onto substrates |
| US6464909B1 (en) | 1998-04-21 | 2002-10-15 | Synventive Molding Solutions, Inc. | Manifold system having flow control |
| CH692383A5 (de) | 1997-09-16 | 2002-05-31 | Kk Holding Ag | Verfahren zur Regelung der Heisskanalheizung eines Mehrkavitäten-Spritzgiesswerkzeugs. |
| WO1999039889A1 (en) * | 1998-02-06 | 1999-08-12 | Express Tool, Inc. | Thermally efficient mold apparatus and method |
| JPH11262936A (ja) | 1998-03-18 | 1999-09-28 | Sekisui Chem Co Ltd | 硬質塩化ビニル樹脂の射出成形方法 |
| US6824379B2 (en) | 1998-04-21 | 2004-11-30 | Synventive Molding Solutions, Inc. | Apparatus for utilizing an actuator for flow control valve gates |
| AUPP403398A0 (en) | 1998-06-11 | 1998-07-02 | James, Malcolm Barry | Temperature control method and apparatus |
| JP2000202863A (ja) * | 1999-01-11 | 2000-07-25 | Sekisui Chem Co Ltd | 射出成形用金型 |
| JP4081201B2 (ja) | 1999-03-29 | 2008-04-23 | 本田技研工業株式会社 | タンデム型射出成形装置およびそれを使用する成形品の製造方法 |
| US6290882B1 (en) * | 1999-06-07 | 2001-09-18 | Galic Maus Ventures Llp | Reduced-knitline thermoplastic injection molding using multi-gated non-sequential-fill method and apparatus, with a heating phase and a cooling phase in each molding cycle |
| JP2001009836A (ja) * | 1999-06-29 | 2001-01-16 | Inoac Corp | プラスチック成形用金型 |
| US6372162B1 (en) | 1999-08-31 | 2002-04-16 | The Gillette Company | Injection molding of oral brush bodies |
| US6719942B1 (en) * | 1999-09-08 | 2004-04-13 | David A. Triplett | Method and apparatus for production of tubing |
| AUPQ307799A0 (en) | 1999-09-24 | 1999-10-21 | Ritemp Pty Ltd | Improvements relating to cooling of dies |
| US6616871B1 (en) | 1999-11-05 | 2003-09-09 | Toshiba Kikai Kabushiki Kaisha | Filling step control method of injection molding machine |
| JP3625166B2 (ja) | 1999-12-20 | 2005-03-02 | 矢崎総業株式会社 | 成形仮係止金型及び成形仮係止方法 |
| JP2002283355A (ja) * | 2001-03-28 | 2002-10-03 | Toray Ind Inc | 樹脂成形金型 |
| JP3636101B2 (ja) * | 2001-06-22 | 2005-04-06 | 三菱電機株式会社 | 金型装置 |
| DE10256036A1 (de) * | 2002-11-30 | 2004-06-17 | Messer Griesheim Gmbh | Verfahren und Vorrichtung zur Werkzeugkühlung |
| CN1741884A (zh) * | 2003-01-24 | 2006-03-01 | 阿尔马包装技术股份有限公司 | 一种转动模制机 |
| MXPA05010511A (es) * | 2003-03-31 | 2005-11-16 | Nissha Printing | Molde para decoracion en molde. |
| US7168942B1 (en) * | 2003-07-31 | 2007-01-30 | Cito Products, Inc. | Method and apparatus for mold temperature control using air |
| JP2005215497A (ja) | 2004-01-30 | 2005-08-11 | Nippon Zeon Co Ltd | 光拡散板及びその製造方法 |
| US8108982B2 (en) * | 2005-01-18 | 2012-02-07 | Floodcooling Technologies, L.L.C. | Compound mold tooling for controlled heat transfer |
| US8501060B2 (en) * | 2005-02-14 | 2013-08-06 | Moldcool International Llc | Method and apparatus for controlling the temperature of molds, dies, and injection barrels using fluid media |
| DE202005020533U1 (de) | 2005-05-12 | 2006-03-16 | Stemke, Gudrun | Kühlsystem für Werkzeuge von Kunststoffverarbeitungsmaschinen |
| US7621739B2 (en) * | 2005-07-25 | 2009-11-24 | Isothermal Systems Research, Inc. | Injection molding apparatus for producing an atomizer |
| MX2008002479A (es) * | 2005-08-30 | 2008-04-07 | Advanced Plastics Technologies | Metodos y sistemas por controlar temperaturas de molde. |
| US20080064805A1 (en) | 2005-10-07 | 2008-03-13 | Mitsui Chemicals, Inc. | Process for producing injection molded product |
| US7794643B2 (en) * | 2006-03-24 | 2010-09-14 | Ricoh Company, Ltd. | Apparatus and method for molding object with enhanced transferability of transfer face and object made by the same |
| EP1925421B1 (en) * | 2006-11-21 | 2011-05-11 | Thermal Cyclic Technologies TCTech i Stockholm AB | Injection-mould with inductive heating and injection moulding method |
| JP4429304B2 (ja) | 2006-12-19 | 2010-03-10 | 本田技研工業株式会社 | 射出成形方法及び射出成形装置 |
| US20090020924A1 (en) * | 2007-02-21 | 2009-01-22 | Iowa State University Research Foundation, Inc. | Drying-mediated self-assembly of ordered or hierarchically ordered micro- and sub-micro scale structures and their uses as multifunctional materials |
| JP4976888B2 (ja) | 2007-03-06 | 2012-07-18 | ソニー株式会社 | 射出制御装置 |
| DE102008000452A1 (de) * | 2008-02-29 | 2009-09-03 | Stemke, Gudrun | Kühlmittelverteilung zur Werkzeugkühlung |
| KR20090114766A (ko) | 2008-04-30 | 2009-11-04 | 엘지디스플레이 주식회사 | 사출성형 금형, 이를 이용하여 제작된 도광판, 이 도광판을갖는 액정표시장치 |
| JP5092927B2 (ja) | 2008-06-20 | 2012-12-05 | ソニー株式会社 | 射出成形の制御方法及び射出成形の制御装置 |
| RU2531352C2 (ru) | 2009-03-23 | 2014-10-20 | Базелль Полиолефин Италия С.Р.Л. | Полиолефиновая маточная смесь и композиция, подходящая для литьевого формования |
| KR101273629B1 (ko) * | 2009-09-07 | 2013-06-14 | 오형종 | 사출금형 장치 |
| DE102009046835A1 (de) | 2009-11-18 | 2011-05-19 | Robert Bosch Gmbh | Spritzgießwerkzeug |
| CN201693719U (zh) * | 2010-06-23 | 2011-01-05 | 百塑企业股份有限公司 | 具有模具冷却功能的射出成型机 |
| CN102294780A (zh) * | 2010-06-25 | 2011-12-28 | 鸿富锦精密工业(深圳)有限公司 | 注塑系统及注塑方法 |
| BR112013028817A2 (pt) | 2011-05-20 | 2017-01-31 | Procter & Gamble | método para a moldagem por injeção a pressão baixa substancialmente constante |
| RU2583394C2 (ru) | 2011-05-20 | 2016-05-10 | иМФЛАКС Инк. | Способ инжекционного формования при низком, в сущности, постоянном давлении |
| EP2709812B1 (en) | 2011-05-20 | 2019-03-06 | iMFLUX, Inc. | Non-naturally balanced feed system for an injection molding apparatus |
| JP5848443B2 (ja) | 2011-05-20 | 2016-01-27 | アイエムフラックス インコーポレイテッド | 薄肉部品の実質的に一定圧力の射出成形のための方法 |
| CA2836903C (en) | 2011-05-20 | 2017-08-29 | The Procter & Gamble Company | Alternative pressure control for a low constant pressure injection molding apparatus |
| CA2836783C (en) | 2011-05-20 | 2017-02-21 | The Procter & Gamble Company | Apparatus and method for injection molding at low constant pressure |
| CA2864907C (en) | 2012-02-24 | 2016-09-27 | The Procter & Gamble Company | High thermal conductivity co-injection molding system |
| KR20140117591A (ko) | 2012-02-24 | 2014-10-07 | 더 프록터 앤드 갬블 캄파니 | 간이화된 냉각 시스템을 갖는 사출 주형 |
| US20130221575A1 (en) | 2012-02-24 | 2013-08-29 | The Procter & Gamble Company | Method for Operating a High Productivity Injection Molding Machine |
-
2012
- 2012-08-31 US US13/601,359 patent/US20130295219A1/en not_active Abandoned
-
2013
- 2013-02-12 US US13/765,428 patent/US8591219B1/en active Active
- 2013-05-02 MX MX2014012871A patent/MX2014012871A/es not_active Application Discontinuation
- 2013-05-02 CA CA2871980A patent/CA2871980C/en active Active
- 2013-05-02 JP JP2015510452A patent/JP5973656B2/ja not_active Expired - Fee Related
- 2013-05-02 CN CN201380022879.3A patent/CN104271329A/zh active Pending
- 2013-05-02 TW TW102115796A patent/TW201406522A/zh unknown
- 2013-05-02 IN IN8887DEN2014 patent/IN2014DN08887A/en unknown
- 2013-05-02 RU RU2014142162A patent/RU2014142162A/ru not_active Application Discontinuation
- 2013-05-02 WO PCT/US2013/039243 patent/WO2013166272A2/en not_active Ceased
- 2013-05-02 EP EP13723615.4A patent/EP2844453B1/en active Active
- 2013-05-02 BR BR112014027424A patent/BR112014027424A2/pt not_active IP Right Cessation
- 2013-05-02 AU AU2013256204A patent/AU2013256204A1/en not_active Abandoned
-
2014
- 2014-09-19 US US14/491,257 patent/US9682505B2/en active Active
- 2014-10-30 PH PH12014502433A patent/PH12014502433A1/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8591219B1 (en) * | 2012-05-02 | 2013-11-26 | The Procter & Gamble Company | Injection mold having a simplified evaporative cooling system |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8828291B2 (en) | 2011-05-20 | 2014-09-09 | The Procter & Gamble Company | Method for substantially constant pressure injection molding of thinwall parts |
| US8911228B2 (en) | 2011-05-20 | 2014-12-16 | Imflux, Inc. | Non-naturally balanced feed system for an injection molding apparatus |
| US9815233B2 (en) | 2011-05-20 | 2017-11-14 | Imflux, Inc. | Method and apparatus for substantially constant pressure injection molding of thinwall parts |
| US9272452B2 (en) | 2011-05-20 | 2016-03-01 | Imflux, Inc. | Method and apparatus for substantially constant pressure injection molding of thinwall parts |
| US10076861B2 (en) | 2011-05-20 | 2018-09-18 | Imflux Inc | Apparatus for injection molding at low constant pressure |
| US9289933B2 (en) | 2011-05-20 | 2016-03-22 | iMFLUX Inc. | Alternative pressure control for an injection molding apparatus |
| US9707709B2 (en) | 2011-05-20 | 2017-07-18 | Imflux Inc | Method for injection molding at low, substantially constant pressure |
| US8757999B2 (en) | 2011-05-20 | 2014-06-24 | The Procter & Gamble Company | Alternative pressure control for a low constant pressure injection molding apparatus |
| US9475211B2 (en) | 2012-02-24 | 2016-10-25 | Imflux Inc | Injection mold having a simplified cooling system |
| US9089998B2 (en) | 2012-02-24 | 2015-07-28 | Imflux, Inc. | Injection mold having a simplified cooling system |
| US9682505B2 (en) | 2012-05-02 | 2017-06-20 | Imflux Inc | Injection mold having a simplified evaporative cooling system or a simplified cooling system with exotic cooling fluids |
| US9339952B2 (en) * | 2012-06-20 | 2016-05-17 | Magna International, Inc. | Nanofluid mold cooling |
| US20150174794A1 (en) * | 2012-06-20 | 2015-06-25 | Magna International Inc. | Nanofluid mold cooling |
| US9604398B2 (en) | 2012-11-08 | 2017-03-28 | Imflux Inc | Injection mold with fail safe pressure mechanism |
| US20180221944A1 (en) * | 2013-04-15 | 2018-08-09 | Kenneth Ray Adams | Liquid cooled die casting mold with heat sinks |
| US20160059304A1 (en) * | 2013-04-15 | 2016-03-03 | Michael Douglas Blow | Liquid cooled die casting mold with heat sinks |
| US9782825B2 (en) * | 2013-04-15 | 2017-10-10 | Magna International Inc. | Liquid cooled die casting mold with heat sinks |
| US9937553B2 (en) * | 2013-04-15 | 2018-04-10 | Magna International Inc. | Liquid cooled die casting mold with heat sinks |
| US9364977B2 (en) | 2013-05-13 | 2016-06-14 | Imflux, Inc. | Low constant pressure injection molding system with variable-position molding cavities |
| US20160229001A1 (en) * | 2015-02-05 | 2016-08-11 | GM Global Technology Operations LLC | Thermal-management systems for controlling temperature of workpieces being joined by welding |
| US20170259481A1 (en) * | 2016-03-10 | 2017-09-14 | Otto Manner Innovation Gmbh | Hot runner system and associated nozzle heating devices |
| CN113276369A (zh) * | 2021-07-12 | 2021-08-20 | 深圳市鸿运沅电子有限公司 | 一种耳机壳体注塑模具及其注塑工艺 |
| CN114603802A (zh) * | 2022-04-15 | 2022-06-10 | 辛集伟博新能源科技有限公司 | 一种温控型注塑模具及制作工艺 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015515404A (ja) | 2015-05-28 |
| CA2871980C (en) | 2017-08-29 |
| EP2844453A2 (en) | 2015-03-11 |
| US20150064303A1 (en) | 2015-03-05 |
| RU2014142162A (ru) | 2016-05-10 |
| CA2871980A1 (en) | 2013-11-07 |
| TW201406522A (zh) | 2014-02-16 |
| EP2844453B1 (en) | 2017-09-27 |
| PH12014502433B1 (en) | 2015-01-12 |
| MX2014012871A (es) | 2015-01-19 |
| IN2014DN08887A (enExample) | 2015-05-22 |
| AU2013256204A1 (en) | 2014-11-13 |
| CN104271329A (zh) | 2015-01-07 |
| US9682505B2 (en) | 2017-06-20 |
| JP5973656B2 (ja) | 2016-08-23 |
| US8591219B1 (en) | 2013-11-26 |
| WO2013166272A2 (en) | 2013-11-07 |
| PH12014502433A1 (en) | 2015-01-12 |
| US20130295220A1 (en) | 2013-11-07 |
| WO2013166272A3 (en) | 2014-03-06 |
| BR112014027424A2 (pt) | 2017-06-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9682505B2 (en) | Injection mold having a simplified evaporative cooling system or a simplified cooling system with exotic cooling fluids | |
| US9089998B2 (en) | Injection mold having a simplified cooling system | |
| US8757999B2 (en) | Alternative pressure control for a low constant pressure injection molding apparatus | |
| US10076861B2 (en) | Apparatus for injection molding at low constant pressure | |
| CA2892032C (en) | Reduced size runner for an injection mold system | |
| EP3344427B1 (en) | 3-d printed mold for injection molding | |
| US20150336311A1 (en) | Method and apparatus for overmolding fragile hollow article | |
| KR20010050413A (ko) | 냉각 장치를 갖는 성형기 | |
| KR20140143433A (ko) | 신종 냉각 유체를 갖는 간이화된 냉각 시스템 또는 간이화된 증발 냉각 시스템을 구비한 사출 주형 | |
| EP3582942B1 (en) | Cooling system for moulds | |
| AU2016200940A1 (en) | Alternative pressure control for a low constant pressure injection molding apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: THE PROCTER & GAMBLE COMPANY, OHIO Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NEUFARTH, RALPH EDWIN;ROBINSON, NIALL D;SCHARRENBERG, RAINER;AND OTHERS;SIGNING DATES FROM 20120503 TO 20120509;REEL/FRAME:032624/0822 |
|
| AS | Assignment |
Owner name: IMFLUX INC, OHIO Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:THE PROCTER & GAMBLE COMPANY;REEL/FRAME:032898/0888 Effective date: 20140402 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |