US20080170931A1 - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
US20080170931A1
US20080170931A1 US12/013,670 US1367008A US2008170931A1 US 20080170931 A1 US20080170931 A1 US 20080170931A1 US 1367008 A US1367008 A US 1367008A US 2008170931 A1 US2008170931 A1 US 2008170931A1
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Prior art keywords
substrate
processing
reversing mechanism
transport device
transport
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Abandoned
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US12/013,670
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English (en)
Inventor
Koji Hashimoto
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Dainippon Screen Manufacturing Co Ltd
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Individual
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Assigned to DAINIPPON SCREEN MFG. CO., LTD. reassignment DAINIPPON SCREEN MFG. CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HASHIMOTO, KOJI
Publication of US20080170931A1 publication Critical patent/US20080170931A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Definitions

  • the substrate processing apparatus including a substrate reversing mechanism that reverses a top surface and a back surface of the substrate is described in JP 2005-85885 A.
  • a substrate transport robot that transports the substrate is arranged in substantially the center of a rectangular processing region.
  • a plurality of (four, for example) substrate processing units are arranged so as to surround the substrate transport robot in the processing region.
  • the substrate reversing mechanism is arranged in a position where the substrate transport robot can access in the processing region.
  • An indexer unit including a plurality of cassettes that store the substrate is provided on one end of the processing region.
  • An indexer robot that takes the substrate before processing out of the above-mentioned cassette or stores the substrate after the processing in the above-mentioned cassette is provided in the indexer unit.
  • the substrate transport robot receives the substrate before the processing from the indexer robot, and subsequently transfers the received substrate to the substrate reversing mechanism.
  • the substrate reversing mechanism reverses the substrate received from the substrate transport robot so that the top surface thereof is directed downward.
  • the substrate transport robot receives the substrate reversed by the substrate reversing mechanism and carries the substrate into any of the substrate processing units.
  • the substrate transport robot receives the substrate reversed by the substrate reversing mechanism and transfers it to the indexer robot.
  • the substrate, received from the substrate transport robot, after the processing is stored in the cassette by the indexer robot.
  • the substrate transport robot is required to perform four transporting processes for the single substrate, that is, a transporting process from the shuttle transport mechanism to the substrate reversing mechanism, a transporting process from the substrate reversing mechanism to the substrate processing unit, a transporting process from the substrate processing unit to the substrate reversing mechanism and a transporting process from the substrate reversing mechanism to the shuttle transporting mechanism.
  • a substrate processing apparatus that subjects a substrate having one surface and the other surface to processing includes a processing region for processing the substrate, a carrying in and out region for carrying the substrate into and out of the processing region and a transfer portion for transferring the substrate between the processing region and the carrying in and out region, wherein the carrying in and out region includes a container platform where a storing container that stores the substrate is placed and a first transport device that transports the substrate between the storing container that is placed on the container platform and the transfer portion, the processing region includes a processing unit that performs the processing on the substrate and a second transport device that transports the substrate between the transfer portion and the processing unit, and the transfer portion includes a reversing mechanism that reverses the one surface and the other surface of the substrate and a moving mechanism that moves the reversing mechanism so that the substrate can be transferred between the first transport device and the reversing mechanism and transferred between the second transport device and the reversing mechanism.
  • the carrying in and out region includes a container platform where a storing container that stores the substrate is
  • the reversing mechanism is moved by the moving mechanism so that the substrate can be transferred between the second transport device and the reversing mechanism while the one surface and the other surface of the substrate are reversed by the reversing mechanism in the above-mentioned transfer portion.
  • the substrate is subsequently transported by the second transport device between the transfer portion and the processing unit in the processing region.
  • the substrate is reversed and transported between the first transport device and the second transport device when the reversing mechanism linearly moves between the position where the substrate can be transferred to and from the first transport device and the position where the substrate can be transferred to and from the second transport device, so that the number of the transporting processes by the second transport device is reduced. This improves the throughput of the substrate processing.
  • the substrate is reversed and transported between the first transport device and the second transport device when the reversing mechanism rotates to move between the first transfer direction toward the first advance/withdraw direction and the second transfer direction toward the second advance/withdraw direction, so that the number of the transporting processes by the second transport device is reduced. This improves the throughout of the substrate processing.
  • the reversing mechanism can transport the substrate between the first transport device and the second transport device by rotating through 180 degrees when the first transfer direction and the second transfer direction are parallel to each other, that is, the first advance/withdraw direction of the first supporter of the first transport device and the second advance/withdraw direction of the second supporter of the second transport device are parallel to each other.
  • the first transport device may be provided so as to move in parallel to a first axis direction, may store and take the substrate in and out of the storing container that is placed on the container platform in a state where the first transport device faces a second direction perpendicular to the first axis direction, and may transfer and receive the substrate to and from the reversing mechanism in a state where the first transport device faces a third axis direction at an angle of smaller than 180 degrees to the second axis direction.
  • the first transport device transfers and receives the substrate to and from the reversing mechanism in the state where the first transport device faces the third axis direction at an angle of smaller than 180 degrees to the second axis direction, so that the rotation angle of the first transport device becomes smaller.
  • the transport time of the substrate between the storing container and the transfer portion is shortened. This allows the throughput of the substrate processing to be further improved.
  • the first transport device takes the substrate before the processing out of the storing container placed on the container platform, and transfers the taken out substrate before the processing to the transfer portion.
  • the reversing mechanism is moved so that the substrate before the processing can be transferred from the reversing mechanism to the second transport device while the one surface and the other surface of the substrate before the processing are reversed by the reversing mechanism in the transfer portion.
  • the transfer portion has both the function of the transporting mechanism that mediates the substrate transferred between the first transport device and the second transport device and the function of the reversing mechanism that reverses the substrate.
  • the second transport device performs the two transporting processes for the single substrate, that is, the transporting process from the transfer portion to the processing unit and the transporting process from the processing unit to the transfer portion. This reduces the number of the transporting processes by the second transport device, so that the throughput of the substrate processing is improved.
  • the transfer portion having both the function of the transporting mechanism and the function of the reversing mechanism is provided between the first transport device and the second transport device, so that the configuration of the existing substrate processing apparatus (the configuration of the so-called platform) is not required to be changed. This can suppress the increase in the production cost of the substrate processing apparatus.
  • FIG. 1 is a plan view of a substrate processing apparatus according to a first embodiment
  • FIG. 3 is a sectional view showing a configuration of a processing unit
  • FIG. 6 is a perspective view showing the appearance of a part of the substrate reverse moving device
  • FIG. 7 is a plan view showing configurations of an indexer robot and a substrate transport robot in the substrate processing apparatus of FIG. 1 ;
  • FIG. 8 is a flowchart showing transporting processes of a substrate
  • FIG. 9 is a plan view of a substrate processing apparatus according to a second embodiment.
  • FIG. 10 is a schematic structural diagram of a substrate reverse moving device of FIG. 9 ;
  • FIG. 11 is a plan view of a substrate processing apparatus according to a third embodiment.
  • a substrate refers to a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a PDP (plasma display panel), a glass substrate for a photomask, a substrate for an optical disk and the like.
  • examples of a chemical liquid include BHF (buffered hydrofluoric acid), DHF (diluted hydrofluoric acid), hydrofluoric acid, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid, oxalic acid, oxygenated water, an aqueous solution of ammonia and the like or a mixture solution thereof.
  • chemical liquid processing processing by using these chemical liquids is referred to as chemical liquid processing.
  • rinsing processing of the substrate by using a rinse liquid is performed after the chemical liquid processing is finished.
  • the rinse liquid include pure water, carbonated water, ozone water, magnetic water, regenerated water (hydrogen water) and ion water, as well as organic solvent such as IPA (isopropyl alcohol) or the like.
  • FIG. 1 is a plan view of a substrate processing apparatus according to a first embodiment.
  • FIG. 2 is a side view of the substrate processing apparatus of FIG. 1 .
  • a horizontal direction that is perpendicular to a vertical direction is defined as a U direction and a V direction
  • the vertical direction that is perpendicular to the horizontal direction is defined as a T direction in FIG. 1 and FIG. 2 . This also applies to diagrams described later.
  • the substrate processing apparatus 100 includes processing regions A, B, and a transport region C therebetween.
  • a controller 4 , fluid boxes 2 a , 2 b and processing units MP 1 , MP 3 and processing units MP 2 , MP 4 are arranged in the processing region A.
  • the processing units MP 2 , MP 4 are provided above the processing units MP 1 , MP 3 , respectively.
  • Each of the fluid boxes 2 a , 2 b of FIG. 1 stores fluid-related equipment such as pipes, joints, valves, flowmeters, regulators, pumps, temperature controllers, chemical liquid storage tanks or the like involved in supply and drain the chemical liquid and pure water to/from the processing units MP 1 , MP 2 and the processing units MP 3 , MP 4 .
  • fluid-related equipment such as pipes, joints, valves, flowmeters, regulators, pumps, temperature controllers, chemical liquid storage tanks or the like involved in supply and drain the chemical liquid and pure water to/from the processing units MP 1 , MP 2 and the processing units MP 3 , MP 4 .
  • the chemical liquid processing using the above-mentioned chemical liquid is performed in the processing units MP 1 , MP 3 . Also in the processing units MP 2 , MP 4 , the chemical liquid processing using the above-mentioned chemical liquid is performed. Note that the rinsing processing using pure water or the like is performed after the chemical liquid processing.
  • fluid boxes 2 c , 2 d , processing units MP 5 , MP 7 and processing units MP 6 , MP 8 are arranged.
  • the processing units MP 6 , MP 8 are provided above the processing units MP 5 , MP 7 , respectively.
  • Each of the fluid boxes 2 c , 2 d of FIG. 1 stores fluid-related equipment such as pipes, joints, valves, flow meters, regulators, pumps, temperature controllers, chemical liquid storage tanks or the like involved in supply and drain the chemical liquid and pure water to/from the processing units MP 5 , MP 6 and the processing units MP 7 , MP 8 .
  • fluid-related equipment such as pipes, joints, valves, flow meters, regulators, pumps, temperature controllers, chemical liquid storage tanks or the like involved in supply and drain the chemical liquid and pure water to/from the processing units MP 5 , MP 6 and the processing units MP 7 , MP 8 .
  • processing unit in the case of indicating an arbitrary one of the processing units MP 1 , MP 3 , MP 5 , MP 7 and the processing units MP 2 , MP 4 , MP 6 , MP 8 , it is referred to as the processing unit.
  • chemical liquid supply mechanisms that supply hydrofluoric acid, ammonia water, oxygenated water and hydrochloric acid as the chemical liquids to the processing units are provided in the fluid boxes 2 a - 2 d , respectively.
  • a substrate transport robot CR is provided in the transport region C.
  • An indexer ID for carrying in and out the substrate is arranged on one end of the processing regions A, B.
  • the indexer ID includes a plurality of carrier platforms 1 a and an indexer robot IR.
  • Carriers 1 that store the substrates W are placed on the carrier platforms 1 a , respectively.
  • FOUPs Front Opening Unified Pods
  • other carriers including SMIF (Standard Mechanical Inter Face) pods or OCs (Open Cassettes) may also be used as the carriers 1 .
  • the indexer robot IR is so constructed that it can move in the U direction in the indexer ID.
  • a transfer portion 3 is provided in a position of the transport region C between the indexer ID and the substrate transport robot CR in the present embodiment.
  • the transfer portion 3 includes a substrate reverse moving device 7 that reverses a top surface and a back surface of the substrate W.
  • the top surface of the substrate W refers to a surface on which a variety of patterns such as a circuit pattern or the like are to be formed.
  • This substrate reverse moving device 7 can linearly move back and forth on a pair of transport rails 3 a in the V direction in the transfer portion 3 .
  • the indexer robot IR takes the substrate W before processing out of the carrier 1 and transfers the substrate W to the substrate reverse moving device 7 . Conversely, the indexer robot IR receives the substrate W after the processing from the substrate reverse moving device 7 and returns the substrate W to the carrier 1 .
  • the substrate reverse moving device 7 reverses the substrate W received from the indexer robot IR while moving the reversed substrate W to the vicinity of the substrate transport robot CR along the above-mentioned V direction. Detail will be described later.
  • the substrate transport robot CR transports the substrate W received from the substrate reverse moving device 7 to a specified processing unit, or transports the substrate W received from the processing unit to another processing unit, or transfers the substrate W received from the processing unit to the substrate reverse moving device 7
  • configurations of the processing units MP 1 -MP 8 are described with reference to a drawing. Note that the configuration of the processing unit MP 1 is described as a typical example in the following since the processing units MP 1 -MP 8 have the same configuration.
  • processing for cleaning the substrate processing for etching a film on the substrate, processing for removing polymer residues (resist residues, for example) on the substrate and the like are performed.
  • the processing for cleaning the substrate is described as an example.
  • FIG. 3 is a sectional view showing the configuration of the processing unit MP 1 .
  • the processing unit MP 1 includes a housing 101 , a spin chuck 21 that is provided in the housing 101 and rotates around a vertical axis passing through substantially the center of the substrate W while holding the substrate W almost horizontally and a fan filter unit FFU that is provided so as to close an opening at an upper end of the housing 101 .
  • the fan filter unit FFU forms downflow within the housing 101 .
  • the fan filter unit FFU is composed of a fan and a filter.
  • a first motor 60 is provided outside the spin chuck 21 .
  • a first rotating shaft 61 is connected to the first motor 60 .
  • a first arm 62 is coupled to the first rotating shaft 61 so as to extend in the horizontal direction, and a processing liquid nozzle 50 is provided at the tip of the first arm 62 .
  • the processing liquid nozzle 50 supplies the chemical liquid for cleaning the substrate W onto the substrate W.
  • a second motor 60 a is provided outside the spin chuck 21 .
  • a second rotating shaft 61 a is connected to the second motor 60 a , and a second arm 62 a is coupled to the second rotating shaft 61 a .
  • a pure water nozzle 50 a is provided at the tip of the second arm 62 a .
  • the pure water nozzle 50 a supplies pure water onto the substrate W in the rinsing processing after the cleaning processing. When the cleaning processing is performed by using the processing liquid nozzle 50 , the pure water nozzle 50 a is retracted to a predetermined position.
  • the spin chuck 21 is stored in a processing cup 23 .
  • a cylindrical partition wall 33 is provided inside the processing cup 23 .
  • a drain space 31 for draining the chemical liquid used for the cleaning processing of the substrate W is formed so as to surround the spin chuck 21 .
  • a liquid recovery space 32 for recovering the chemical liquid used for the cleaning processing of the substrate W is formed between the processing cup 23 and the partition wall 33 so as to surround the drain space 31 .
  • a drain pipe 34 for leading the chemical liquid into a drain processing device (not shown) is connected to the drain space 31 .
  • a recovery pipe 35 for leading the chemical liquid into a recovery and reuse device (not shown) is connected to the liquid recovery space 32 .
  • a guard 24 for preventing the chemical liquid from the substrate W from being scattered outward is provided above the processing cup 23 .
  • This guard 24 is shaped to be rotationally-symmetric with respect to the rotating shaft 25 .
  • a drain guide groove 41 with a V-shaped cross section is annularly formed in an inner surface of an upper end of the guard 24
  • the guard lifting mechanism moves the guard 24 upward and downward between a recovery position in which the liquid recovery guide 42 faces an outer circumference of the substrate W held on the spin chuck 21 and a drain position in which the drain guide groove 41 faces the outer circumference of the substrate W held on the spin chuck 21 .
  • the guard 24 When the guard 24 is in the recovery position (the position of the guard 24 shown in FIG. 3 ), the chemical liquid scattered outward from the substrate W is led into the liquid recovery space 32 by the liquid recovery guide 42 , and is then recovered through the recovery pipe 35 .
  • the guard 24 when the guard 24 is in the drain position, the chemical liquid scattered outward from the substrate W is led into the drain space 31 by the drain guide groove 41 , and is then drained through the drain pipe 34 .
  • a disk-shaped shielding plate 22 having an opening at its center is provided above the spin chuck 21 .
  • a supporting shaft 29 is provided so as to extend vertically downward from the vicinity of an end of an arm 28 , and the shielding plate 22 is attached to a lower end of the supporting shaft 29 so as to face an upper surface of the substrate W held on the spin chuck 21 .
  • a shielding plate lifting mechanism 37 and a shielding plate rotation mechanism 38 are connected to the arm 28 .
  • the shielding plate lifting mechanism 37 moves the shielding plate 22 upward and downward between a position in vicinity to the upper surface of the substrate W held on the spin chuck 21 and a position spaced upwardly apart from the spin chuck 21 .
  • the shielding plate rotation mechanism 38 rotates the shielding plate 22 .
  • FIG. 4 is a schematic structural diagram of the substrate reverse moving device 7 of FIG. 1 .
  • FIG. 4( a ) is a side view of the substrate reverse moving device 7
  • FIG. 4( b ) is a top view of the substrate reverse moving device 7 .
  • FIG. 5 is a perspective view showing the appearance of a main part of the substrate reverse moving device 7
  • FIG. 6 is a perspective view showing the appearance of a part of the substrate reverse moving device 7 .
  • the substrate reverse moving device 7 is composed of a reversing mechanism 70 and a moving mechanism 30 .
  • the second supporting member 72 is composed of six bar-shaped members that extend radially. An end portion of each of the six bar-shaped members is provided with a substrate supporting pin 73 b.
  • first and second supporting members 71 , 72 are each composed of the six bar-shaped members in the present embodiment, the first and second supporting members 71 , 72 may be each composed of any number of bar-shaped members or other members having any other shape, including, for example, a disk or polygonal shape with a periphery corresponding to the plurality of supporting pins 73 a , 73 b.
  • the first movable member 74 of FIG. 5 is U-shaped.
  • the first supporting member 71 is fixed to one end of the first movable member 74 .
  • the other end of the first movable member 74 is connected to the link mechanism 77 .
  • the second movable member 75 of FIG. 6 is U-shaped.
  • the second supporting member 72 is fixed to one end of the second movable member 75 .
  • the other end of the second movable member 75 is connected to the link mechanism 77 .
  • the link mechanism 77 is attached to the rotating shaft of the rotating mechanism 78 .
  • the link mechanism 77 and the rotating mechanism 78 are attached to the fixing plate 76 .
  • the link mechanism 77 of FIG. 5 incorporates an air cylinder or the like.
  • the link mechanism 77 can selectively shift the first movable member 74 and the second movable member 75 between a state where they are spaced apart from each other and a state where they are close to each other.
  • the rotating mechanism 78 incorporates a motor or the like. The rotating mechanism 78 can rotate the first movable member 74 and the second movable member 75 through, for example, 180 degrees around the horizontal axis via the link mechanism 77 .
  • the moving mechanism 30 includes a base 31 , a pair of transport rails 3 a , a direct acting mechanism 3 b , a driver 3 c , a link member 3 d and a pair of sliding blocks 3 e . Note that a part of the members such as the link member 3 d and the like are omitted in FIG. 4( b ) for simplification.
  • the pair of transport rails 3 a is fixed on the base 31 in parallel to the V direction.
  • the pair of sliding blocks 3 e is slidably attached to the pair of transport rails 3 a .
  • the floorboard 79 of the reversing mechanism 70 is attached to the sliding blocks 3 e.
  • the direct acting mechanism 3 b is composed of for example, a ball screw mechanism and an electric cylinder that incorporates a motor applying a driving force to the ball screw mechanism.
  • the driver 3 c is provided in the direct acting mechanism 3 b .
  • the driver 3 c is linked to the floorboard 79 by the link member 3 d.
  • the direct acting mechanism 3 b moves the driver 3 c in the horizontal direction to the transport rails 3 a , so that the reversing mechanism 70 is moved back and forth along the transport rails 3 a in the V direction.
  • the substrate W is carried into the substrate reverse moving device 7 by the indexer robot IR ( FIG. 1 ).
  • the reversing mechanism 70 is moved to be positioned at an end of the pair of transport rails 3 a on the indexer robot IR side (hereinafter referred to as a first transfer position).
  • the substrate W is transferred onto the plurality of substrate supporting pins 73 b of the second supporting member 72 by the indexer robot IR in the state where the first movable member 74 and the second movable member 75 are vertically spaced apart from each other.
  • the link mechanism 77 operates to shift the first movable member 74 and the second movable member 75 to the state where they are vertically close to each other. Accordingly, the both sides of the substrate W are supported by the plurality of substrate supporting pins 73 a , 73 b , respectively.
  • the rotating mechanism 78 operates to rotate the first movable member 74 and the second movable member 75 through 180 degrees around an axis in the U direction while the reversing mechanism 70 moves to the substrate transport robot CR ( FIG. 1 ) side on the pair of transport rails 3 a along the V direction as shown in FIG. 4( b ).
  • the substrate W is rotated through 180 degrees together with the first movable member 74 and the second movable member 75 while being held by the plurality of substrate supporting pins 73 a , 73 b provided on the first supporting member 71 and the second supporting member 72 .
  • the substrate W is moved to the vicinity of the substrate transport robot CR while being reversed by the reversing mechanism 70 .
  • the reversing mechanism 70 is moved to be positioned at an end of the pair of transport rails 3 a on the substrate transport robot CR side (hereinafter referred to as a second transfer position).
  • the link mechanism 77 subsequently operates to shift the first movable member 74 and the second movable member 75 to the state where they are vertically spaced apart from each other. In this state, the substrate W is carried out of the substrate reverse moving device 7 by the substrate transport robot CR.
  • the substrate W is carried into the substrate reverse moving device 7 by the substrate transport robot CR, the substrate W is moved to the vicinity of the indexer robot IR while being reversed by the reversing mechanism 70 by operations reverse to the above-mentioned operations.
  • the substrate W is carried out of the substrate reverse moving device 7 by the indexer robot IR.
  • FIG. 7 is a plan view showing configurations of the indexer robot IR and the substrate transport robot CR in the substrate processing apparatus 100 of FIG. 1 .
  • FIG. 7( a ) shows the configuration of a multi-joint arm of the indexer robot IR
  • FIG. 7( b ) shows the configuration of a multi-joint arm of the substrate transport robot CR. Note that as for the ⁇ in FIG. 7( a ) and FIG. 7( b ), a clockwise direction on the paper is defined as a + ⁇ direction and an anticlockwise direction on the paper is defined as a ⁇ direction.
  • the indexer robot IR includes a pair of transport arms am 4 , cm 4 for holding the substrate W, advance/withdrawing members am 1 , am 2 , am 3 and cm 1 , cm 2 , cm 3 for allowing the pair of transport arms am 4 , cm 4 to advance and withdraw with respect to a main body IRH of the indexer robot independently from each other, a rotating mechanism (not shown) for rotating the main body IRH of the indexer robot in the ⁇ direction around and a U direction movement mechanism (not shown) for moving the main body IRH of the indexer robot in the U direction.
  • the advance/withdrawing members am 1 , am 2 , am 3 and cm 1 , cm 2 , cm 3 are of a multi-joint arm type and allow the pair of transport arms am 4 , cm 4 to advance and withdraw in the horizontal direction while maintaining their postures.
  • One transport arm am 4 is designed to advance and withdraw at an upper level than the other transport arm cm 4 , and these transport arms am 4 , cm 4 vertically overlap with each other in an initial state where both the pair of transport arms am 4 , cm 4 are retracted above the main body IRH of the indexer robot.
  • the main body IRH of the indexer robot drives the advance/withdrawing members am 1 , am 2 , am 3 and cm 1 , cm 2 , cm 3 in accordance with an instruction from the controller 4 ( FIG. 1 ).
  • the advance/withdrawing members am 1 , am 2 , am 3 and cm 1 , cm 2 , cm 3 have driving devices that are composed of motors, wires, pulleys and the like for moving the pair of transport arms am 4 , cm 4 back and forth.
  • the foregoing members allow the driving force to be directly applied to each of the pair of transport arms am 4 , cm 4 , so that the pair of transport arms am 4 , cm 4 can advance and withdraw in the horizontal direction.
  • a plurality of substrate supporters PS are attached to an upper surface of each of the transport arms am 4 , cm 4 .
  • four substrate supporters PS are attached at substantially equal spacings along the periphery of the substrate W that is placed on the upper surface of each of the transport arms am 4 , cm 4 .
  • the substrate W is supported by these four substrate supporters PS.
  • the number of the substrate supporters PS is not limited to four, and the substrate supporters may be used in any number with which the substrate W can be stably supported.
  • the indexer robot IR advances either one of the transport arms am 4 , cm 4 toward the substrate reverse moving device 7 in the V direction in the position facing the substrate reverse moving device 7 , so that the substrate W can be transferred and received to and from the reversing mechanism 70 .
  • the substrate transport robot CR includes a pair of transport arms bm 4 , dm 4 for holding the substrate W, advance/withdrawing members bm 1 , bm 2 , bm 3 and dm 1 , dm 2 , dm 3 for allowing the pair of transport arms bm 4 , dm 4 to advance and withdraw with respect to a main body CRH of the substrate transport robot independently from each other, a rotating mechanism (not shown) for rotating the main body CRH of the substrate transport robot in the ⁇ direction around the vertical axis and a lifting mechanism (not shown) for lifting the main body CRH of the substrate transport robot in the T direction.
  • the advance/withdrawing members bm 1 , bm 2 , bm 3 and dm 1 , dm 2 , dm 3 are of the multi-joint arm type and allow the pair of transport arms bm 4 , dm 4 to advance and withdraw in the horizontal direction while maintaining their postures.
  • One transport arm bm 4 is designed to advance and withdraw at an upper level than the other transport arm dm 4 , and these transport arms bm 4 , dm 4 vertically overlap with each other in an initial state where both the pair of transport arms bm 4 , dm 4 are retracted above the main body CRH of the substrate transport robot.
  • the main body CRH of the substrate transport robot drives the advance/withdrawing members bm 1 , bm 2 , bm 3 and dm 1 , dm 2 , dm 3 in accordance with an instruction from the controller 4 ( FIG. 1 ).
  • the advance/withdrawing members bm 1 , bm 2 , bm 3 and dm 1 , dm 2 , dm 3 have driving devices that are composed of motors, wires, pulleys and the like for moving the pair of transport arms bm 4 , dm 4 back and forth.
  • the foregoing mechanisms allow the driving force to be directly applied to each of the pair of transport arms bm 4 , dm 4 , so that the pair of transport arms bm 4 , dm 4 can advance and withdraw in the horizontal direction.
  • a plurality of substrate supporters PS are attached to an upper surface of each of the transport arms bm 4 , dm 4 of the substrate transport robot CR.
  • four substrate supporters PS are attached at substantially equal spacings along the periphery of the substrate W that is placed on the upper surface of each of the transport arms bm 4 , dm 4 .
  • the substrate W is supported by the four substrate supporters PS.
  • the number of the substrate supporters PS is not limited to four, and the substrate supporters may be used in any number with which the substrate W can be stably supported.
  • the substrate transport robot CR advances either one of the transport arms bm 4 , dm 4 toward the substrate reverse moving device 7 in the V direction, so that the substrate W can be transferred and received to and from the reversing mechanism 70 .
  • both the indexer robot IR and substrate transport robot CR are of a double-arm type having the respective pairs of transport arms am 4 , cm 4 and bm 4 , dm 4 , however, either or both of the indexer robot IR and the substrate transport robot CR may be of a single-arm type with only one transport arm.
  • transporting processes of the substrate W are not limited to the following description.
  • FIG. 8 is a flowchart showing the transporting processes of the substrate W.
  • the reversing mechanism 70 of the substrate reverse moving device 7 moves to the first transfer position on the indexer robot IR side as shown in FIG. 8 .
  • the indexer robot IR takes the substrate W out of the carrier 1 and transfers the substrate W to the substrate reverse moving device 7 (step S 1 ).
  • the reversing mechanism 70 of the substrate reverse moving device 7 moves to the second transfer position on the substrate transport robot CR side along the V direction while reversing the substrate W received from the indexer robot IR (step S 2 ).
  • the substrate transport robot CR receives the substrate W from the substrate reverse moving device 7 (step S 3 ).
  • the substrate transport robot CR subsequently carries the substrate W into any of the processing units MP 1 -MP 8 (step S 4 ).
  • the substrate W is subjected to the processing by any of the processing units described above (step S 5 ).
  • the substrate transport robot CR subsequently carries the substrate W after the processing out of any of the processing units described above (step S 6 ). Then, the substrate transport robot CR transfers the substrate W to the substrate reverse moving device 7 (step S 7 ).
  • the substrate reverse moving device 7 subsequently moves to the first transfer position on the indexer robot IR side along the above-described V direction while reversing the substrate W received from the substrate transport robot CR (step S 8 ). Then, the indexer robot IR receives the substrate W from the substrate reverse moving device 7 (step S 9 ). After this, the indexer robot IR stores the substrate W in a predetermined carrier 1 .
  • the substrate reverse moving device 7 in the transfer portion 3 has both the function of a shuttle transporting mechanism that mediates the substrate W transferred between the indexer robot IR and the substrate transport robot CR and the function of a substrate reversing mechanism that reverses the substrate W. That is, the moving mechanism 30 of the substrate reverse moving device 7 moves the reversing mechanism 70 back and forth in a straight line between the first transfer position and the second transfer position, so that the substrate W is transferred between the indexer robot IR and the substrate transport robot CR and is reversed.
  • the substrate transport robot CR performs the two transporting processes for the single substrate W, that is, a transporting process from the substrate reverse moving device 7 to the processing unit and a transporting process from the processing unit to the substrate reverse moving device 7 .
  • the number of the transporting processes by the substrate transport robot CR is reduced, so that the throughput of the processing of the substrate W is improved.
  • the transfer portion 3 including the substrate reverse moving device 7 is provided in the position of the transport region C between the indexer robot IR and the substrate transport robot CR, so that the configuration of the existing substrate processing apparatus (a configuration of a so-called platform) is not required to be changed. This can suppress an increase in production cost of the substrate processing apparatus 100 .
  • a configuration of the substrate processing apparatus 100 a according to the second embodiment is different from the configuration of the substrate processing apparatus 100 according to the first embodiment in that the transfer portion 3 includes a substrate reverse moving device 7 a instead of the substrate reverse moving device 7 .
  • the difference is described in the following with reference to drawings.
  • the configuration of the substrate reverse moving device 7 a is different from the configuration of the above-described substrate reverse moving device 7 ( FIG. 4) in that a moving mechanism 30 a is provided instead of the moving mechanism 30 .
  • the moving mechanism 30 a includes a base 31 , a rotating shaft 3 g and a motor 3 f.
  • the substrate W can be transferred to and from a transfer side S on the opposite side of the rotating mechanism 78 in the reversing mechanism 70 of this substrate reverse moving device 7 a.
  • the substrate reverse moving device 7 a is arranged on a line connecting a position of the indexer robot IR in transferring and receiving the substrate W and a position of the substrate transport robot CR in transferring and receiving the substrate W.
  • one transport arm of the substrate transport robot CR advances in an advance/withdraw direction V 2 parallel to the V direction, so that the substrate W is carried out of the substrate reverse moving device 7 a.
  • the substrate reverse moving device 7 a has both the function of the shuttle transporting mechanism that mediates the substrate W transferred between the indexer robot IR and the substrate transport robot CR and the function of the substrate reversing mechanism that reverses the substrate W. That is, the moving mechanism 30 a of the substrate reverse moving device 7 a rotates the reversing mechanism 70 through 180 degrees so that the reversing mechanism 70 faces the first transfer direction toward the advance/withdraw direction V 1 or a second transfer direction toward the advance/withdraw direction V 2 , thereby allowing the substrate W to be transferred between the indexer robot IR and the substrate transport robot CR and to be reversed.
  • the substrate transport robot CR performs the two transporting processes for the single substrate W, that is, a transporting process from the substrate reverse moving device 7 a to the processing unit and a transporting process from the processing unit to the substrate reverse moving device 7 a.
  • the transfer portion 3 including the substrate reverse moving device 7 a is provided in the position of the transport region C between the indexer robot IR and the substrate transport robot CR, so that the configuration of the existing substrate processing apparatus (the configuration of the so-called platform) is not required to be changed. This can suppress the increase in the production cost of the substrate processing apparatus 100 a.
  • FIG. 11 is a plan view of a substrate processing apparatus according to a third embodiment.
  • a configuration of the substrate processing apparatus 100 b according to the third embodiment is different from the configuration of the substrate processing apparatus 100 a according to the second embodiment in that the fluid boxes 2 a , 2 c and the processing units MP 1 , MP 2 , MP 5 , MP 6 are not provided, and the substrate reverse moving device 7 a of the transfer portion 3 is provided in a different arrangement.
  • the substrate processing apparatus 100 b according to the present embodiment is composed of the four processing units MP 3 , MP 4 , MP 7 , MP 8 .
  • the arrangement of the substrate reverse moving device 7 a is described with reference to drawings.
  • FIG. 12 is an explanatory view showing an arrangement of the substrate reverse moving device 7 a in the third embodiment.
  • the substrate reverse moving device 7 a is arranged in a position where the indexer robot IR can transfer and receive the substrate W to and from the substrate reverse moving device 7 a when the indexer robot IR is rotated so that the advance/withdraw direction of the transport arm rotates through, for example, 120 degrees in the ⁇ direction from the V direction toward the carrier 1 .
  • the indexer robot IR rotates the advance/withdraw direction of the transport arm through, for example, 120 degrees from the V direction toward the carrier 1 to the ⁇ direction while moving to a central portion of the indexer ID. Moreover, the reversing mechanism 70 is rotated by the moving mechanism 30 a ( FIG. 10 ), so that the transfer side S ( FIG. 10 ) faces the indexer robot IR.
  • one transport arm of the indexer robot IR advances in the advance/withdraw direction V 1 , so that the substrate W is carried into the substrate reverse moving device 7 a.
  • the reversing mechanism 70 reverses the substrate W while rotating through, for example, 120 degrees in the + ⁇ direction. Accordingly, the transfer side S ( FIG. 10 ) of the reversing mechanism 70 faces the substrate transport robot CR as indicated by the dotted line. In this state, one transport arm of the substrate transport robot CR advances in the advance/withdraw direction V 2 at, for example, 120 degrees to the V direction, so that the substrate W is carried out of the substrate reverse moving device 7 a.
  • the reversing mechanism 70 rotates through, for example, 120 degrees so that the transfer side S ( FIG. 10 ) faces the indexer robot IR while the substrate W is reversed by the reversing mechanism 70 by operations reverse to the above-mentioned operations.
  • the substrate W is carried out of the substrate reverse moving device 7 a by the indexer robot IR.
  • the substrate reverse moving device 7 a has both the function of the shuttle transporting mechanism that mediates the substrate W transferred between the indexer robot IR and the substrate transport robot CR and the function of the substrate reversing mechanism that reverses the substrate W. That is, the moving mechanism 30 a of the substrate reverse moving device 7 a rotates the reversing mechanism 70 through, for example, 120 degrees so that the reversing mechanism faces the first transfer direction toward the advance/withdraw direction V 1 or the second transfer direction toward the advance/withdraw direction V 2 , thereby allowing the substrate W to be transferred between the indexer robot IR and the substrate transport robot CR and to be reversed.
  • the present invention is not limited to this and the substrate W after the above-described processing may be carried into another processing unit by the substrate transport robot CR and subsequently subjected to the processing by the processing unit.
  • the first transfer position is an example of a position where the substrate can be transferred between the first transport device and the reversing device
  • the second transfer position is an example of a position where the substrate can be transferred between the second transport device and the reversing device
  • the transport arms am 4 , cm 4 are examples of a first supporter
  • the transport arms bm 4 , dm 4 are examples of a second supporter in the above-described embodiments.
  • the advance/withdraw direction V 1 is an example of a first advance/withdraw direction
  • the advance/withdraw direction V 2 is an example of a second advance/withdraw direction
  • the ⁇ direction (around the axis in the T direction) is an example of a circumferential direction centered around an axis in a substantially vertical direction
  • the U direction is an example of a first axis direction
  • the V direction is an example of a second axis direction
  • the advance/withdraw direction V 1 is an example of a third axis direction in the above-described embodiments.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
US12/013,670 2007-01-15 2008-01-14 Substrate processing apparatus and substrate processing method Abandoned US20080170931A1 (en)

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JP2007006135A JP2008172160A (ja) 2007-01-15 2007-01-15 基板処理装置および基板処理方法

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100249993A1 (en) * 2009-03-30 2010-09-30 Ichiro Mitsuyoshi Substrate processing apparatus and substrate transport method
CN109072077A (zh) * 2016-03-30 2018-12-21 东京毅力科创株式会社 胶体二氧化硅生长抑制剂以及相关的方法和系统
EP3503220A3 (en) * 2017-12-22 2019-08-28 Beijing Juntai Innovation Technology Co., Ltd Device and method for turning cell over
US10515820B2 (en) 2016-03-30 2019-12-24 Tokyo Electron Limited Process and apparatus for processing a nitride structure without silica deposition
US11069546B2 (en) * 2015-04-08 2021-07-20 Tokyo Electron Limited Substrate processing system
US11443972B2 (en) * 2016-03-09 2022-09-13 SCREEN Holdings Co., Ltd. Substrate processing apparatus

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JP6280332B2 (ja) * 2013-09-09 2018-02-14 三星ダイヤモンド工業株式会社 基板反転搬送装置
JP6260461B2 (ja) * 2014-06-06 2018-01-17 トヨタ自動車株式会社 半導体製造装置
JP6086254B2 (ja) * 2014-09-19 2017-03-01 日新イオン機器株式会社 基板処理装置
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JP7007948B2 (ja) * 2018-02-28 2022-01-25 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板搬送方法
JP7156940B2 (ja) * 2018-12-28 2022-10-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
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Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4985722A (en) * 1988-02-12 1991-01-15 Tokyo Electron Limited Apparatus for coating a photo-resist film and/or developing it after being exposed
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
US5743374A (en) * 1995-08-25 1998-04-28 Monsees; Claude E. Stack turner and replenisher and method
US6318951B1 (en) * 1999-07-09 2001-11-20 Semitool, Inc. Robots for microelectronic workpiece handling
US6361422B1 (en) * 1999-06-15 2002-03-26 Applied Materials, Inc. Method and apparatus for transferring semiconductor substrates using an input module
US6397883B1 (en) * 1999-12-16 2002-06-04 The Boc Group, Inc. Equipment skid
US6413037B1 (en) * 2000-03-14 2002-07-02 Applied Materials, Inc. Flexibly mounted contact cup
US6475279B1 (en) * 1999-07-19 2002-11-05 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
US6527621B1 (en) * 1999-10-28 2003-03-04 Strasbaugh Pad retrieval apparatus for chemical mechanical planarization
US6632281B2 (en) * 2000-02-01 2003-10-14 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
US6695572B2 (en) * 2001-09-28 2004-02-24 Agere Systems Inc. Method and apparatus for minimizing semiconductor wafer contamination
US20040177917A1 (en) * 2001-11-13 2004-09-16 Dainippon Screen Mfg. Co., Ltd. Thin film forming apparatus, film supplier, film cassette, transport mechanism and transport method
US20060045722A1 (en) * 2004-06-22 2006-03-02 Dainippon Screen Mfg. Co., Ltd. Substrate reversing device, substrate transporting device, substrate processing device, substrate reversing method, substrate transporting method and substrate processing method
US20060245853A1 (en) * 2005-03-28 2006-11-02 Dainippon Screen Mfg. Co., Ltd. Substrate transport apparatus and substrate transport method
US7270510B2 (en) * 2002-10-16 2007-09-18 Sez Ag Device and method for transporting wafer-shaped articles
US7300524B2 (en) * 2001-08-08 2007-11-27 Dainippon Screen Mfg. Co., Ltd. Substrate cleaning method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004052108A (ja) * 2002-05-30 2004-02-19 Ebara Corp 基板処理装置
JP2004119628A (ja) * 2002-09-25 2004-04-15 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2004327674A (ja) * 2003-04-24 2004-11-18 Dainippon Screen Mfg Co Ltd 基板反転装置およびそれを備えた基板処理装置

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
US4985722A (en) * 1988-02-12 1991-01-15 Tokyo Electron Limited Apparatus for coating a photo-resist film and/or developing it after being exposed
US5743374A (en) * 1995-08-25 1998-04-28 Monsees; Claude E. Stack turner and replenisher and method
US6361422B1 (en) * 1999-06-15 2002-03-26 Applied Materials, Inc. Method and apparatus for transferring semiconductor substrates using an input module
US6318951B1 (en) * 1999-07-09 2001-11-20 Semitool, Inc. Robots for microelectronic workpiece handling
US6475279B1 (en) * 1999-07-19 2002-11-05 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
US6527621B1 (en) * 1999-10-28 2003-03-04 Strasbaugh Pad retrieval apparatus for chemical mechanical planarization
US6397883B1 (en) * 1999-12-16 2002-06-04 The Boc Group, Inc. Equipment skid
US6632281B2 (en) * 2000-02-01 2003-10-14 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
US6413037B1 (en) * 2000-03-14 2002-07-02 Applied Materials, Inc. Flexibly mounted contact cup
US7300524B2 (en) * 2001-08-08 2007-11-27 Dainippon Screen Mfg. Co., Ltd. Substrate cleaning method
US6695572B2 (en) * 2001-09-28 2004-02-24 Agere Systems Inc. Method and apparatus for minimizing semiconductor wafer contamination
US20040177917A1 (en) * 2001-11-13 2004-09-16 Dainippon Screen Mfg. Co., Ltd. Thin film forming apparatus, film supplier, film cassette, transport mechanism and transport method
US20050150450A1 (en) * 2001-11-13 2005-07-14 Dainippon Screen Mfg. Co., Ltd. Thin film forming apparatus, film supplier, film cassette, transport mechanism and transport method
US7270510B2 (en) * 2002-10-16 2007-09-18 Sez Ag Device and method for transporting wafer-shaped articles
US20060045722A1 (en) * 2004-06-22 2006-03-02 Dainippon Screen Mfg. Co., Ltd. Substrate reversing device, substrate transporting device, substrate processing device, substrate reversing method, substrate transporting method and substrate processing method
US7322787B2 (en) * 2004-06-22 2008-01-29 Dainippon Screen Mfg. Co., Ltd. Devices and methods for reversing, transporting, and processing substrates
US20060245853A1 (en) * 2005-03-28 2006-11-02 Dainippon Screen Mfg. Co., Ltd. Substrate transport apparatus and substrate transport method

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100249993A1 (en) * 2009-03-30 2010-09-30 Ichiro Mitsuyoshi Substrate processing apparatus and substrate transport method
US8504194B2 (en) 2009-03-30 2013-08-06 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and substrate transport method
US11069546B2 (en) * 2015-04-08 2021-07-20 Tokyo Electron Limited Substrate processing system
US11443972B2 (en) * 2016-03-09 2022-09-13 SCREEN Holdings Co., Ltd. Substrate processing apparatus
CN109072077A (zh) * 2016-03-30 2018-12-21 东京毅力科创株式会社 胶体二氧化硅生长抑制剂以及相关的方法和系统
US10325779B2 (en) * 2016-03-30 2019-06-18 Tokyo Electron Limited Colloidal silica growth inhibitor and associated method and system
US10515820B2 (en) 2016-03-30 2019-12-24 Tokyo Electron Limited Process and apparatus for processing a nitride structure without silica deposition
US10763120B2 (en) 2016-03-30 2020-09-01 Tokyo Electron Limited Colloidal silica growth inhibitor and associated method and system
US10916440B2 (en) 2016-03-30 2021-02-09 Tokyo Electron Limited Process and apparatus for processing a nitride structure without silica deposition
EP3503220A3 (en) * 2017-12-22 2019-08-28 Beijing Juntai Innovation Technology Co., Ltd Device and method for turning cell over

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TWI341820B (en) 2011-05-11
CN101226878B (zh) 2010-11-17
TW200836993A (en) 2008-09-16
JP2008172160A (ja) 2008-07-24
KR100953010B1 (ko) 2010-04-14
CN101226878A (zh) 2008-07-23

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