JP7156940B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP7156940B2 JP7156940B2 JP2018247438A JP2018247438A JP7156940B2 JP 7156940 B2 JP7156940 B2 JP 7156940B2 JP 2018247438 A JP2018247438 A JP 2018247438A JP 2018247438 A JP2018247438 A JP 2018247438A JP 7156940 B2 JP7156940 B2 JP 7156940B2
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- 239000000758 substrate Substances 0.000 title claims description 332
- 238000012545 processing Methods 0.000 title claims description 248
- 238000012546 transfer Methods 0.000 claims description 129
- 230000032258 transport Effects 0.000 claims description 88
- 239000007788 liquid Substances 0.000 claims description 64
- 238000010438 heat treatment Methods 0.000 claims description 55
- 238000003860 storage Methods 0.000 claims description 11
- 230000033001 locomotion Effects 0.000 claims description 9
- 239000012530 fluid Substances 0.000 description 73
- 230000007246 mechanism Effects 0.000 description 51
- 230000007723 transport mechanism Effects 0.000 description 27
- 230000003028 elevating effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 239000000969 carrier Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 238000011109 contamination Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- SWXQKHHHCFXQJF-UHFFFAOYSA-N azane;hydrogen peroxide Chemical compound [NH4+].[O-]O SWXQKHHHCFXQJF-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- CABDFQZZWFMZOD-UHFFFAOYSA-N hydrogen peroxide;hydrochloride Chemical compound Cl.OO CABDFQZZWFMZOD-UHFFFAOYSA-N 0.000 description 1
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
図1は、実施形態の基板処理装置1の全体レイアウトを示す概略平面図である。図2は、実施形態の基板処理装置1を示す概略側面図である。基板処理装置1は、半導体の基板Wを1枚ずつ処理する枚葉式の処理装置であり、ここでは、円形のシリコンの基板Wに加熱処理以外の処理を実行することが可能な規定処理を行う規定処理、および加熱処理を行う。本例では、規定処理は流体処理である。流体処理は、液体またはガスを基板Wに供給して基板Wの表面を処理することをいう。
上記実施形態に係る搬送ロボット60,70は、多関節アームで構成された進退駆動機構64を備えることによって、ハンド61a,61bを前後に進退させている。しかしながら、搬送ロボットは、多関節アームを備えるものに限定されない。
12 インデクサロボット
30 流体処理部(規定処理部)
32 流体処理室(規定処理室)
39 ノズル(処理ツール)
40 加熱処理部
42 加熱処理室
45 ヒーター
50 シャトル搬送機構
500 搬送室
501 レール
51 シャトル本体部
52a,52b 基板保持具(第1基板保持具)
53 直動モーター(第1モーター)
57 エア供給ヘッド
60 第1搬送ロボット
61a,61b ハンド(第2基板保持具、第3基板保持具)
62 旋回駆動機構
63 昇降駆動機構
70 第2搬送ロボット
80 パス部
81 ステージ
90 制御部
C キャリア(収納室)
ID インデクサ部(基板供給部)
W 基板
Claims (7)
- 基板を処理する基板処理装置であって、
前記基板を収容して基板に対し液処理を行う液処理室および前記液処理室において前記基板に対しノズルから処理液を供給する液処理部と、
前記基板を収納する収納室からの前記基板を前記液処理部に供給する基板供給部と、
前記基板供給部と前記液処理部との間に設けられ、前記基板を収容する加熱処理室および前記加熱処理室にて前記基板を加熱するヒーターを有する加熱処理部と、
前記基板供給部から供給される前記基板を、順に、前記液処理部、前記加熱処理部、前記基板供給部に搬送する搬送部と、
を備え、
前記基板供給部は、前記収納室と前記基板を搬出入するインデクサロボットおよび該インデクサロボットから前記基板が渡される基板受渡部を含み、
前記搬送部は、
前記基板受渡部から前記基板の授受を行うとともに、前記基板を前記加熱処理部に搬出入する第1搬送ロボットと、
前記第1搬送ロボットと前記基板の授受が行われる第1搬送部と、
前記第1搬送部との間で前記基板の授受が行われるとともに、前記液処理部に前記基板を搬出入する第2搬送ロボットと、
を含み、
前記第1搬送ロボットは、前記インデクサロボットから受け取った前記基板を前記第1搬送部を介して前記第2搬送ロボットに渡し、前記第2搬送ロボットは前記第1搬送部を介して受け取った前記基板を前記液処理部に搬入し、前記液処理部で前記液処理が行われた前記基板を前記液処理部から受け取って、前記第1搬送部を介して前記第1搬送ロボットに渡し、前記第1搬送ロボットは前記第1搬送部を介して受け取った前記基板を前記加熱処理部に搬入し、前記加熱処理部で加熱された前記基板を受け取って前記基板受渡部に渡し、前記インデクサロボットは前記基板受渡部から前記基板を受け取って前記収納室に前記基板を搬入する、基板処理装置。 - 請求項1の基板処理装置であって、
前記加熱処理部と前記液処理部とが第1方向に離間して配置されており、
前記第1搬送部は、
前記第1搬送ロボットと前記第2搬送ロボットの間に配置され、
前記基板を保持する基板保持具、および前記基板保持具を第1方向に移動させる第1モーターを有し、
前記基板保持具は、第1授受位置で前記第1搬送ロボットと前記基板の授受を行うとともに第2授受位置で前記第2搬送ロボットと前記基板の授受を行い、
前記第1モーターは、前記第1授受位置と前記第2授受位置との間で前記基板保持具を前記第1方向に沿って移動させる、基板処理装置。 - 請求項2の基板処理装置であって、
前記第1搬送ロボットは、前記基板を保持するハンドと、前記ハンドを鉛直方向の旋回軸線まわりに旋回させる旋回モーターと、をさらに有する、基板処理装置。 - 請求項2の基板処理装置であって、
前記加熱処理部は、鉛直方向に重なる複数の前記加熱処理室を含み、
前記液処理部は、鉛直方向に重なる複数の前記液処理室を含み、
前記第1搬送ロボットおよび前記第2搬送ロボットの各々は、前記基板を保持するハンドと、前記ハンドを鉛直方向に移動させる移動モーターと、を有する、基板処理装置。 - 請求項4の基板処理装置であって、
前記第1搬送ロボットが前記加熱処理部における最も高い前記加熱処理室に前記基板を搬送するときの前記基板の鉛直位置、および前記第2搬送ロボットが前記液処理部における最も高い前記液処理室に前記基板を搬送するときの前記基板の鉛直位置が同一である、基板処理装置。 - 請求項1から請求項5のいずれか1項の基板処理装置であって、
前記第1搬送ロボットは、前記基板受渡部および前記第1搬送部に対して同一の高さで前記基板を搬送する、基板処理装置。 - 請求項2から請求項5のいずれか1項の基板処理装置であって、
前記基板保持具よりも上方の位置から下方に向けてエアを供給するエア供給部、
をさらに備える、基板処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018247438A JP7156940B2 (ja) | 2018-12-28 | 2018-12-28 | 基板処理装置 |
TW108140188A TWI747074B (zh) | 2018-12-28 | 2019-11-06 | 基板處理裝置 |
CN201980086960.5A CN113228239A (zh) | 2018-12-28 | 2019-12-16 | 基板处理装置 |
KR1020217017368A KR102500916B1 (ko) | 2018-12-28 | 2019-12-16 | 기판 처리 장치 |
PCT/JP2019/049110 WO2020137646A1 (ja) | 2018-12-28 | 2019-12-16 | 基板処理装置 |
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JP2018247438A JP7156940B2 (ja) | 2018-12-28 | 2018-12-28 | 基板処理装置 |
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JP2020107804A JP2020107804A (ja) | 2020-07-09 |
JP7156940B2 true JP7156940B2 (ja) | 2022-10-19 |
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JP (1) | JP7156940B2 (ja) |
KR (1) | KR102500916B1 (ja) |
CN (1) | CN113228239A (ja) |
TW (1) | TWI747074B (ja) |
WO (1) | WO2020137646A1 (ja) |
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JP2023140751A (ja) * | 2022-03-23 | 2023-10-05 | 株式会社Screenホールディングス | レンズ検査装置 |
US20240213078A1 (en) * | 2022-12-22 | 2024-06-27 | Applied Materials, Inc. | Substrate supports and transfer apparatus for substrate deformation |
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JP2003179025A (ja) | 2001-09-27 | 2003-06-27 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2008172160A (ja) * | 2007-01-15 | 2008-07-24 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP2011071169A (ja) * | 2009-09-24 | 2011-04-07 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
JP6407609B2 (ja) * | 2014-08-01 | 2018-10-17 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
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JP2010225935A (ja) | 2009-03-24 | 2010-10-07 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2016103597A (ja) | 2014-11-28 | 2016-06-02 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
JP2016219471A (ja) | 2015-05-15 | 2016-12-22 | 株式会社Screenホールディングス | 液充填方法 |
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