TW200836993A - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
TW200836993A
TW200836993A TW097100774A TW97100774A TW200836993A TW 200836993 A TW200836993 A TW 200836993A TW 097100774 A TW097100774 A TW 097100774A TW 97100774 A TW97100774 A TW 97100774A TW 200836993 A TW200836993 A TW 200836993A
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Taiwan
Prior art keywords
substrate
transfer
processing
reversing mechanism
unit
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TW097100774A
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Chinese (zh)
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TWI341820B (en
Inventor
Koji Hashimoto
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Dainippon Screen Mfg
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices

Abstract

A substrate reverse moving device is composed of a reversing mechanism and a moving mechanism. A rotating mechanism incorporates a motor or the like, and is capable of rotating a first movable member and a second movable member to which first and second supporting members that support a substrate therebetween are fixed, respectively, around a horizontal axis through, for example, 180 degrees via a link mechanism. Moreover, a pair of transport rails is fixed on a base in parallel to V direction. A pair of sliding blocks is slidably attached to the pair of transport rails. A floorboard of the reversing mechanism is attached to the sliding blocks. A direct acting mechanism moves a driver in a direction parallel to the transport rails, so that the reversing mechanism moves back and forth in the V direction along the transport rails.

Description

200836993 九、發明說明: 【發明所屬之技術領域】 本發明關於一種對基板進行既定處理的基板處理裝置 義 及基板處理方法。 y 【先前技術】 習知為了對半導體晶圓、光罩用玻璃基板、液晶顯示裝 置用玻璃基板、及光碟用玻璃基板等基板施行各種處理,200836993 IX. Description of the Invention: [Technical Field] The present invention relates to a substrate processing apparatus and a substrate processing method for performing predetermined processing on a substrate. [Previously] In order to perform various processes on substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal display devices, and glass substrates for optical disks,

而採用基板處理裝置。 例如,於日本專利特開2005-85882號公報中記載有一 種基板處理裝置,其具備使基板之表面和背面反轉的基板 反轉機構。此種基板處理裝置中,於矩形處理區域之略中 央處配置有搬送基板的基板搬職器人。在處理區域内, 圍繞基板搬送機ϋ人而分別配置有多個(例如4個)基板 地卩更進步,在處理區域内基板搬送機器人可存取 之位置處,配置有基板反轉機構。 ^處理區域之-端部側設有载人機單元,其具備用以收 、、内土板之夕個卡Ε。於該載人機單元中設置有載入機器 二用?:上述卡£取出處理前基板,或將處理後基板收 納於上述卡内。 柘而六’载入機器人從任-卡匣取出處理前基 處理後基板而1^=’。同日禮該基板搬送機器人收取 人收取處理前基板後,將所 。基板反轉機構旋轉從基板 基板搬送機器人從载入機器 收取的基板交給基板反轉機構 97100774 6 200836993 搬送機器人所收取的基板,使其表面朝向下方。基板搬送 機器人收取經基板反轉機構反轉的基板,將該基板搬入於 任一基板處理部。 ‘ 然後,基板搬送機器人於上述任一基板處理部完成基板 V處理後,將該基板從基板處理部搬出而再度交給基板反轉 钱構。基板反轉機構反轉經基板處理部處理之基板,使其 表面朝向上方。 _ “、、:後,基板搬送機态人收取經基板反轉機構反轉的基 板,交給載入機器人。載入機器人將從基板搬送機器人所 收取的處理後基板收納於卡匣。 如此,經收納於卡g的處理前基板,由基板反轉機構反 轉,經基板處理部處理(對基板背面之處理)後,再度由 基板反轉機構反轉,成為處理後基板而收納於卡匣。 在上述習知基板處理裝置中,有時會設置在載入機器人 與基板搬送機器人之間傳遞基板的往返搬送機構。藉由此 _方式,载入機斋人及基板搬送機器人不會受彼此動作之約 束’而可有效率地分别進行搬送動作。 然而,將如上述往返搬送機構及基板反轉機構設置於基 板處理裝置内,會增加基板搬送機器人之搬送步驟。具體 而言,基板搬送機器人對於丨片基板,需要進行從往 •送機構往基板反轉機構之搬送、從基板反轉機構往基板處 ^理部之搬送、從基板處理部往基板反轉機構之搬送ΐ及二 基板反轉機構往往返搬送機構之搬送等4次搬送步驟。 如此,在往返搬送機構、基板反轉機構及多個基板處理 97100774 7 200836993 部之間,基板搬送機器人之搬送步驟會增加。因此,導致 降低基板處理之處理量。 【發明内容】 本發明之目的在於提供一種可提高基板處理之處理量 的基板處理裝置及基板處理方法。 (1)本發明之一態樣的基板處理裝置,用以處理具有一 面及另一面的基板;其具備:處理基板的處理區域;對處 理區域搬入及搬出基板的搬入搬出區域;及在處理區域與 搬入搬出區域之間交接基板的交接部;而搬入搬出區域包 =有.谷态載置部,其載置用以收納基板的收納容器丨及 第1搬送裝置,其在載置於容器載置部之收納容器與交接 4之間搬送基板,處理區域包含有:處理部,其對基板施 以處理丄及第2搬送裝置,其在交接部與處理部之間搬送 基板;交接部包含有:反轉機構,其使基板-面與另-面 相互反轉;及移動機構,其移動反轉機構,而可在第!搬 反轉機構之間交接基板,並可在第2搬送裝置與 反轉機構之間交接基板。 ::基: 反處理裝置中,在交接部t由移動機構移動該反 ίΓ在:可在第1搬送裝置與反轉機構之間交接基板。 ⑼搬出區域中’在載置於容器载置部的收納容 1 乂接部之間,基板由第1搬送農置搬送。 交接部中藉由反轉機構使基板之一 、反軺機構之間交接基板。然後,在處理區域 97100774 200836993 中,在交接部與處理部之間,基板由第2搬送裝置搬送。 如此,交接部兼具在第1搬送裝置與第2搬送裝置之間 交接基板的往返搬送機構之功能,以及反轉基板的反轉機 •構之功能。因此,第2搬送裝置對於1片基板之搬送^驟 V成為:從交接部往處理部之搬送,以及從處理部往交接部 之搬送等2步驟。因此,減少第2搬送裝置之搬送步驟, 故可提兩基板處理之處理量。 又,將包含反轉機構及移動機構的交接部設置於第丨搬 达裝置與第2搬送裝置之間,藉此不需要變更既定之基板 處,裝置的構成(所謂平台構成)。因此,可抑制基板處 理裝置之製造成本之上升。 (2)移動機構中’亦可使反轉機構沿水平方向往復直味 移動,而往返於可在第1搬送裝置與反轉機構之間交接基 板的位置處’以及可在第2搬送裝置與反轉機構之間交接 基板的位置處。 Μ兄下於可在反轉機構與第1搬送裝置間交接基 ’與可在反轉機構與第2搬送裝置間交接基板 1搬送^^=_構在直㈣動時反轉基板,同時在第 9你、、,、衣η弟2搬送裝置之間搬送基板,因此可減少第 2搬送裝置之彳船tr π 11 —、、, 、乂〆。因而,提高基板處理之處理量。 运裝置亦可具有第i支持部,並 且設置為可進银,筮,丄 叉符基扳亚 板時,相料a 支持部在其與反轉機構之間交接基 穿置亦可且:反轉機構而沿第1進退方向進退,第2搬送 、 〃有弟2支持部,其支持基板並且設置為可進 97100774 9 200836993 5魏11支持部在其與反轉機構之間交接基板時,相對於 ==、2進退方!進退,移動機構使旋轉機構圍 向第2進退方6 =向之弟1交接方向大致垂直,且與朝 旋二移Ϊ的弟2交接方向大致垂直之方向上的轴而 此情況下’第1㈣裝置之第丨支持部 =轉移動的反轉機構而沿第!進退方向進退,、藉::: 八舁該反轉機構之間交接基板。 又,第2搬送裝置之第2支持部相對於由移 移動的反轉機構而沿第2進退方 2榦 反轉機構之間交接基板。 k猎此可在其與該 朝=3 =在朝向第1進退方向的第1交接方向與 2向弟進退方向的第2交接方向之間旋其 =,同時在第!搬送裝置與第2搬送裳置之間搬送=基 因此減少第2搬送裝置之搬送步驟。 土 •基板處理之處理量。 八猎由此種方式,提高 ⑷反轉機構亦可配置成第!交接 之間的旋轉角度為18〇度。 弟2又接方向 日士此^兄下,在第1交接方向與第2交接方向互相平行之 2: I第丄搬送裝置中第1支持部之第1進退方向盘第 .Μ达裂置中第2支持部之第2進退方向互相=弟 .J :反轉機構旋轉180度’藉此可在第i搬送“况 搬廷裝置之間搬送基板。 /、弟2 ⑸反轉機構亦可配置成第i交接方向與第2交接方向 97100774 200836993 之間的旋轉角度小於18〇度。 在此情況下’第1交接方向與第2交接方向互相 時,亦即第1支持部之第1進退方向與第2支持部之第2 進退方向互相不平行之情況下,反轉機構旋轉小於18〇 度,藉此可在第1搬送裝置與第2搬送裝置之間搬送基 板。藉由此方式’縮小反轉機構之旋轉角度,可縮短在土 1搬送裝置與第2搬送裝置之間搬送的基板時間。結果, 更加提高基板處理之處理量。 ⑹第1搬送裝置亦可設置成可沿第}軸方向平行移 動’在朝向與第1軸方向正交的第2軸方向之狀態下 載置於容器載置部的收納容器收納及取出基板,在朝向盥 第2軸方向間夾角小於則度之第3軸方向的狀態下,針 反轉機構交接基板。 、 此情況下,第1搬送裝置在朝向與第2軸方向間夹角小 於180度之第3軸方向的狀態下,對反轉機構交接基板, #藉此縮小該第!搬送裝置之旋轉角度。#由此種方式,可 縮紐在,納容器與交接部之間搬送的基板時間。結果,可 更加提南基板處理之處理量。 ⑺本發明另-態樣的基板處理方法,藉由具備下列的 基板處理裝置對基板施以處理:包含容器载置部及第i搬 送裝置的搬入搬出區域;包含處理部及第2搬送裝置的處 理區域;以及在處理區域與搬人搬出區域之間交接基板的 父接部;祕域理方法具财:#由第送裝置,從 載置於容器載置部的收納容器取出處理前基板,將所取出 97100774 11 200836993 基板交給交接部之步驟;在交接部_藉由反轉機 構使處理前基板之—面與另—面相互反轉,㈣移動A substrate processing apparatus is employed. For example, JP-A-2005-85882 discloses a substrate processing apparatus including a substrate inversion mechanism that reverses the surface and the back surface of the substrate. In such a substrate processing apparatus, a substrate transfer person who transports a substrate is disposed at a slight center of the rectangular processing region. In the processing area, a plurality of (for example, four) substrates are disposed around the substrate transporter, and the floor is further improved. The substrate reversing mechanism is disposed at a position accessible by the substrate transfer robot in the processing area. ^ On the end side of the treatment area, there is a manned unit, which is provided with a cassette for receiving and inner soil plates. A loading machine is provided in the man-machine unit. The card is used to take out the pre-processed substrate, or the processed substrate is received in the card. The 载入 六 'loading robot takes the front substrate from the --匣 and processes the substrate to process the substrate 1^=’. On the same day, the substrate transport robot receives the person who receives the pre-processed substrate. The substrate reversing mechanism rotates from the substrate. The substrate transfer robot transfers the substrate from the loading device to the substrate reversing mechanism. 97100774 6 200836993 The substrate received by the transport robot is oriented with the surface facing downward. The substrate transfer robot receives the substrate inverted by the substrate inverting mechanism, and carries the substrate into any of the substrate processing units. Then, after the substrate transfer robot completes the substrate V process in any of the substrate processing units, the substrate is carried out from the substrate processing unit and is again transferred to the substrate inversion structure. The substrate inverting mechanism reverses the substrate processed by the substrate processing unit so that the surface thereof faces upward. _ ",,: After the substrate transporter receives the substrate inverted by the substrate reversing mechanism and delivers it to the loading robot. The loading robot stores the processed substrate received by the substrate transfer robot in the cassette. The substrate before being processed by the card g is reversed by the substrate inverting mechanism, processed by the substrate processing unit (processing on the back surface of the substrate), and then reversed by the substrate inverting mechanism, and then placed in the cassette after being processed. In the above-described conventional substrate processing apparatus, a reciprocating transport mechanism that transfers a substrate between the loading robot and the substrate transport robot may be provided. By this means, the loader and the substrate transport robot are not subject to each other. The transport operation can be performed efficiently. However, when the shuttle transport mechanism and the substrate reversing mechanism are provided in the substrate processing apparatus, the transporting process of the substrate transport robot is increased. Specifically, the substrate transport robot For the cymbal substrate, it is necessary to carry the transfer from the transfer mechanism to the substrate reversing mechanism, and from the substrate reversal mechanism to the substrate. The transfer process from the substrate processing unit to the substrate reversing mechanism and the transfer operation of the second substrate reversing mechanism to the transfer mechanism are performed four times. Thus, the reciprocating mechanism, the substrate reversing mechanism, and the plurality of substrates are processed 97100774 7 The transfer process of the substrate transfer robot is increased between 200836993. Therefore, the amount of processing for the substrate processing is reduced. SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of improving the processing amount of substrate processing. (1) A substrate processing apparatus according to an aspect of the present invention, for processing a substrate having one surface and the other surface; comprising: a processing region for processing the substrate; a loading/unloading region for loading and unloading the substrate into the processing region; and processing The delivery unit of the transfer substrate between the area and the loading/unloading area; and the loading/unloading area package=the valley loading unit, which houses the storage container 用以 for storing the substrate and the first conveying device, and is placed in the container The substrate is transported between the storage container of the placing portion and the delivery 4, and the processing region includes a processing portion that applies the substrate The second transfer device transports the substrate between the delivery unit and the processing unit. The delivery unit includes a reversing mechanism that reverses the substrate-surface and the other surface, and a movement mechanism that reverses the movement. In the mechanism, the substrate can be transferred between the second moving and reversing mechanisms, and the substrate can be transferred between the second conveying device and the reversing mechanism. ::Base: In the reverse processing device, the transfer unit t is moved by the moving mechanism. The substrate can be transferred between the first transfer device and the reversing mechanism. (9) In the carry-out area, the substrate is transported by the first transfer farm between the storage unit 1 and the storage unit. In the delivery unit, the substrate is transferred between the substrate and the reaction mechanism by the inversion mechanism. Then, in the processing region 97100774 200836993, the substrate is transported by the second transfer device between the delivery unit and the processing unit. The delivery unit has a function of a reciprocating transport mechanism that transfers the substrate between the first transport device and the second transport device, and a function of reversing the reversing mechanism of the substrate. Therefore, the transport step V of the second transport apparatus for one substrate is two steps of transporting from the delivery unit to the processing unit and transporting from the processing unit to the delivery unit. Therefore, since the transfer step of the second transfer device is reduced, the amount of processing for the two substrates can be increased. Further, since the delivery unit including the reversing mechanism and the moving mechanism is provided between the second conveying device and the second conveying device, it is not necessary to change the configuration of the predetermined substrate (the so-called platform configuration). Therefore, an increase in the manufacturing cost of the substrate processing apparatus can be suppressed. (2) In the moving mechanism, the reversing mechanism can be moved back and forth in the horizontal direction, and can be moved to and from the position where the substrate can be transferred between the first conveying device and the reversing mechanism, and can be used in the second conveying device. The position where the substrate is transferred between the inversion mechanisms. In the case of the transfer of the base between the reversing mechanism and the first transfer device, and the transfer of the substrate 1 between the reversing mechanism and the second transfer device, the substrate can be reversed, and Since the substrate is transported between the transport devices of the ninth, y, and yin 2, the shovel tr π 11 —, , , 乂〆 of the second transport device can be reduced. Thus, the throughput of the substrate processing is increased. The transport device may also have an i-th support portion, and is arranged to be capable of inserting silver, 筮, 丄 符 扳 扳 扳 , , , , , , , a a a a a a a a a a a a a a a a a The rotation mechanism advances and retreats in the first advance and retreat direction, and the second conveyance and the 弟有弟2 support portion support the substrate and are set to be able to enter the 97100774 9 200836993 5 Wei 11 support portion when the substrate is transferred between the reverse and the reversing mechanism, In the ==, 2 advance and retreat! Advance and retreat, the moving mechanism encloses the rotating mechanism to the second advancing and retracting side 6 = the direction of the transfer to the younger brother 1 is substantially perpendicular, and is in a direction substantially perpendicular to the direction of the transfer of the younger brother 2 Axis and in this case, the 丨 support of the 1st (fourth) device = the reversing mechanism of the movement and the next! Advance and retreat in the direction of advance and retreat, and borrow::: Gossip to transfer the substrate between the reversing mechanisms. Further, the second support portion of the second transfer device transfers the substrate between the second retracting mechanism 2 and the second reversing mechanism with respect to the reversing mechanism. k Hunting this can be rotated between the first and the second direction of the direction of the forward and backward direction of the direction of the direction of the third direction of the forward direction and the second direction of the forward and backward direction, and at the same time! The transfer device and the second transfer device are transported to the base. Therefore, the transport step of the second transfer device is reduced. Soil • The amount of substrate processing. Eight hunting is improved in this way. (4) The reversing mechanism can also be configured as the first! The angle of rotation between the transitions is 18 degrees. The younger brother 2 is connected to the Japanese sergeant, the second transfer direction and the second transfer direction are parallel to each other: 2: I, the first support part of the first support unit, the first forward and backward steering wheel (2) The second advancement and retraction direction of the support unit is mutually = Brother. J: The reversing mechanism is rotated by 180 degrees. This allows the substrate to be transported between the i-th transfer and the transfer device. /, Brother 2 (5) The reversing mechanism can also be configured. The rotation angle between the i-th transfer direction and the second transfer direction 97100774 200836993 is less than 18 degrees. In this case, when the first transfer direction and the second transfer direction are mutually different, that is, the first advance/reverse direction of the first support portion is When the second advancing and retracting directions of the second support portion are not parallel to each other, the reversing mechanism rotates by less than 18 degrees, whereby the substrate can be transported between the first transfer device and the second transfer device. The rotation angle of the rotating mechanism can shorten the substrate time transported between the soil transporting device and the second transporting device. As a result, the processing amount of the substrate processing can be further improved. (6) The first transporting device can also be disposed along the axial direction Parallel movement 'in the direction orthogonal to the first axis direction In the state of the two-axis direction, the substrate is placed in the container of the container mounting portion, and the substrate is taken out, and the needle reversing mechanism delivers the substrate in a state in which the angle between the second axis directions is less than the third axial direction. In the case where the first conveying device is in the third axial direction with an angle of less than 180 degrees with respect to the second axial direction, the substrate is transferred to the reversing mechanism, thereby reducing the rotation angle of the first conveying device. In this way, the substrate time that can be transferred between the nano container and the delivery portion can be reduced. As a result, the processing amount of the south substrate processing can be further improved. (7) The substrate processing method according to another aspect of the present invention has the following The substrate processing apparatus performs processing on the substrate: a loading/unloading area including the container placing unit and the i-th conveying device; a processing area including the processing unit and the second conveying device; and transferring the substrate between the processing area and the carrying-out area The father's joint part; the secret domain method has a wealth: # From the first delivery device, the pre-processed substrate is taken out from the storage container placed in the container mounting portion, and the taken-out 97100774 11 200836993 substrate is handed over to the transfer Step of the part; at the intersection _ by the reversing mechanism, the surface of the front substrate and the other surface are reversed, and (4) moving

機構,使可從反轉機構對第2搬送裝置交接處理前美板: =’·藉由第2搬送裝置將處理前基板從交接部搬送至處 以ΐ步驟;在處理部中處理處理前基板之步驟;將、經處 里孩理的處理後基板藉由第2搬送裝置從處理部搬送 至交j部之步驟;在交接部中藉由反轉機構使處理後基板 之另一面與一面相互反轉,同時移動反轉機構,使可ς ,部對第1搬送裝置交接處理後基板之步驟;以及,藉由 第/搬送«置’從交接部收取處理後基板,將所收取^處 理後基板收納於收納容器之步驟。 。亥基板處理方法之一連串步驟如下所述。首先,藉由第 1搬送裝置,從載置於容器載置部的收納容器取出處理前 基板,將所取出的處理前基板交給交接部。其次,在交接 邛中it由反轉機構將處理前基板之一面與另一面相互反 轉,同時移動反轉機構,使可從反轉機構對第2搬送裝置 交接處理前基板。 " 然後,藉由第2搬送裝置將處理前基板從交接部搬送至 處理部後,在處理部中處理處理前基板。其次,經處理部 處理之處理後基板由第2搬送裝置從處理部搬送至交接 部。 接著,在交接部中由反轉機構使處理後基板之另一面與 面相互反轉’同時移動反轉機構,使可從交接部對第1 搬送裝置交接處理後基板。其次,藉由第丨搬送裝置,從 97100774 12 200836993 父接部收取處理後基板,將所收取的處理後基板收納於 納容器。 、、 如此,交接部兼具在第丨搬送裝置與第2搬送裝置之間 父接基板的往返搬送機構之功能,以及反轉基板的反轉機 構之功能。因此對^!片基板,f 2搬送裝置之搬送步驟 成為從交接部往處理部搬送,以及從處理部往交接部搬送 ,2步驟。因此,減少第2搬送裝置之搬送步驟,故可= 鬲基板處理之處理量。 又,藉由將兼具搬送機構之功能與反轉機構之功能 接部設置於第1搬送裝置與第2搬送裝置之間,而不 變更既定之基板處理裝置之構成(所謂平台構成)。因:, 可抑制基板處理裝置之製造成本之上升。 根據本發明,由於可減少第2搬送裝置之搬送步驟 以可提高基板處理之處理量。 【實施方式】 以下參照圖式說明本發明之 置及基板處理方法。 置2:::月中所謂基板’是指半導體晶圓、液晶顯示裝 置用玻璃基板、PDP(電_示面板)用玻璃基板 玻璃基板、及光碟用基板等。 皁用 又’所謂藥液是指例如η 酸)、DHF(稀氫氟醅、、,* & 4鼠 、 乳氟k、鹽酸、硫酸、石肖酸、粦酴 醋酸、草酸、過氧化 μ莖 溶液。 '^戎氰水專水溶液、或该4之混合 97100774 13 200836993 以下,將使用該等藥液所為之處理稱為藥液處理。通常 在藥液處理完成後,進行使用沖洗液之基板沖洗處理。所 謂沖洗液是指例如純水、碳酸水、臭氧水、磁性水、還原 •水(氳水)或離子水、或IPA (異丙醇)等有機溶劑。 、(1)第1實施形態 U -1)基板處理裝置之構成 圖1為第1實施形態之基板處理裝置之俯視圖。又,圖 _ 2為圖1之基板處理裝置之側視圖。此外,在圖i及圖2The mechanism allows the second transfer device to be transferred from the reversing mechanism to the front plate: = '· the second transfer device transports the pre-processed substrate from the transfer portion to the transfer step; and the processing portion processes the pre-processed substrate a step of transferring the processed substrate from the processing unit to the j-th portion by the second transfer device; and reversing the other side of the processed substrate with the reversing mechanism by the reversing mechanism And moving the reversing mechanism to transfer the processed substrate to the first conveying device; and receiving the processed substrate from the delivery portion by the first conveying/setting, and collecting the processed substrate after receiving the processing The step of accommodating the container. . One of the series of steps of the substrate processing method is as follows. First, the pre-process substrate is taken out from the storage container placed on the container mounting portion by the first transfer device, and the pre-processed substrate taken out is delivered to the delivery portion. Next, in the transfer port, the one surface of the front substrate and the other surface of the front substrate are reversed by the reversing mechanism, and the reversing mechanism is moved so that the front substrate can be transferred to the second transfer device from the reversing mechanism. " Then, the pre-processed substrate is transferred from the delivery unit to the processing unit by the second transfer device, and the pre-processed substrate is processed in the processing unit. Then, the processed substrate processed by the processing unit is transferred from the processing unit to the delivery unit by the second transfer device. Next, in the delivery unit, the other surface of the processed substrate is reversed from the surface by the reversing mechanism, and the reversing mechanism is moved, so that the processed substrate can be transferred from the delivery unit to the first transfer device. Next, the processed substrate is received from the parent side of the 97100774 12 200836993 by the second transport device, and the collected processed substrate is stored in the nano container. In this way, the delivery unit functions as a reciprocating mechanism for the parent substrate between the second transfer device and the second transfer device, and a function of reversing the substrate reversing mechanism. Therefore, the transfer step of the f 2 transfer device is carried out from the transfer unit to the processing unit and from the processing unit to the delivery unit, in two steps. Therefore, since the transfer step of the second transfer device is reduced, the amount of processing of the substrate processing can be reduced. In addition, the function of the transfer mechanism and the function of the reversing mechanism are provided between the first transfer device and the second transfer device, and the configuration of the predetermined substrate processing device (so-called platform configuration) is not changed. Because: the increase in the manufacturing cost of the substrate processing apparatus can be suppressed. According to the present invention, the transfer step of the second transfer device can be reduced to increase the throughput of the substrate processing. [Embodiment] Hereinafter, the present invention and a substrate processing method will be described with reference to the drawings. In the case of the substrate, the semiconductor substrate, the glass substrate for a liquid crystal display device, the glass substrate for a PDP (electric panel), and the substrate for a disk are used. For soap, 'so-called liquid medicine means, for example, η acid), DHF (dilute hydrogen fluoride, ,, * & 4 mice, milk fluoride k, hydrochloric acid, sulfuric acid, tartaric acid, hydrazine acetic acid, oxalic acid, peroxidation μ Stem solution. '^Cyanide water special aqueous solution, or the mixture of 4, 97100774 13 200836993 Hereinafter, the treatment using these chemical liquids is called chemical liquid treatment. Usually after the chemical liquid treatment is completed, the substrate using the rinse liquid is performed. The rinsing liquid is an organic solvent such as pure water, carbonated water, ozone water, magnetic water, reducing water (hydrophobic) or ionized water, or IPA (isopropyl alcohol). (1) First embodiment Form U-1) Configuration of Substrate Processing Apparatus FIG. 1 is a plan view of a substrate processing apparatus according to the first embodiment. Further, Fig. 2 is a side view of the substrate processing apparatus of Fig. 1. In addition, in Figure i and Figure 2

中,將互相正交的水平方向定義為U方向及v方向,將錯 直方向定義為T方向。在後述之圖中亦同。 D 如圖1所示,基板處理裝置1〇〇具有處理區域A、B, 在處理區域A、B間具有搬送區域c。 在處理區域A配置有控制部4、流體箱部仏、❿、處理 部MP1、MP3及處理部MP2、MP4。 如圖2所示,處理部MP2、MP4分別設置在處 φ MPS之上部。 圖1之流體箱部2a、2b分別收納對處理部肿卜Mp2供 給藥液及純水、對處理部MP3及MP4供給藥液及純水和從 處理部ΜΠ、ΜΡ2及處理部MP3、MP4排放液體等相關的配 二接頭、閥、流量計、調節器、泵、溫度調節器、藥液 • 財存槽等流體相關機器。 .在處理部”中’以上述藥液進行藥液處理。又, =處理部MP2、MP4中,亦以上述藥液進行藥液處理。此 外,於藥液處理後,以純水等進行沖洗處理。 97100774 200836993 於處理區域B配置有流體箱部2c、2d、處理部MP5、MP7 及處理部MP6、MP8。處理部MP6、MP8分別設於處理部MP5、 MP7之上部。 圖1之流體箱部2c、2d分別收納對處理部MP5、MP6供 給藥液及純水、對處理部MP7及MP8供給藥液及純水和從 處理部MP5、MP6及處理部MP7、MP8排放液體等相關的配 管、接頭、閥、流量計、調節器、泵、溫度調節器、藥液 貯存槽等流體相關機器。 在處理部MP5、MP7、MP6、MP8中,進行與上述處理部 MP卜MP3、MP2、MP4同樣之藥液處理。 以下稱處理部者,指處理部MP1、MP3、MP5、MP7及處 理部MP2、MP4、MP6、MP8中之任一者。 本實施形態中,將作為藥液之氫氟酸、氨水、過氧化氫 水及鹽酸分別供給至處理部的藥液供給系統,設於流體箱 部2a〜2d 〇 於搬送區域C設置有基板搬送機器人CR。於處理區域 A、B之一端部侧配置有搬入及搬出基板的載入機id。 載入機ID包含有複數載體載置部ia及載入機器人ir。 於各載體載置部1 a上載置將基板W予以收納的載體1。In the middle, the horizontal directions orthogonal to each other are defined as the U direction and the v direction, and the wrong direction is defined as the T direction. The same applies to the figures described later. D As shown in FIG. 1, the substrate processing apparatus 1A has processing areas A and B, and has a transfer area c between the processing areas A and B. The control unit 4, the fluid tank unit 仏, the cymbal, the processing units MP1 and MP3, and the processing units MP2 and MP4 are disposed in the processing area A. As shown in Fig. 2, the processing units MP2 and MP4 are respectively disposed above the φ MPS. The fluid tank portions 2a and 2b of Fig. 1 respectively supply the chemical solution and the pure water to the treatment portion swollen Mp2, supply the chemical liquid and the pure water to the treatment portions MP3 and MP4, and discharge from the treatment portions ΜΠ, ΜΡ2 and the treatment portions MP3 and MP4. Fluid-related equipment such as liquids and other related joints, valves, flow meters, regulators, pumps, temperature regulators, chemical solutions, and storage tanks. In the treatment unit, the chemical liquid is treated with the chemical liquid. Further, in the treatment units MP2 and MP4, the chemical liquid is also treated with the chemical liquid. Further, after the chemical liquid treatment, the water is washed with pure water or the like. 97100774 200836993 The fluid tanks 2c and 2d, the processing units MP5 and MP7, and the processing units MP6 and MP8 are disposed in the processing area B. The processing units MP6 and MP8 are respectively disposed above the processing units MP5 and MP7. The parts 2c and 2d respectively accommodate the supply of the chemical liquid and the pure water to the processing units MP5 and MP6, the supply of the chemical liquid and the pure water to the processing units MP7 and MP8, and the discharge of the liquid from the processing units MP5 and MP6 and the processing units MP7 and MP8. Fluid-related equipment such as joints, valves, flow meters, regulators, pumps, temperature regulators, and chemical storage tanks. In the processing units MP5, MP7, MP6, and MP8, the processing unit MP MP3, MP2, and MP4 are performed. In the same manner, the treatment unit refers to any of the treatment units MP1, MP3, MP5, MP7 and the treatment units MP2, MP4, MP6, and MP8. In the present embodiment, the hydrofluorocarbon is used as the chemical solution. Acid, ammonia, hydrogen peroxide and hydrochloric acid are separately supplied to the treatment The chemical liquid supply system of the part is provided in the fluid tank parts 2a to 2d, and the substrate transport robot CR is provided in the transport area C. The loader id for loading and unloading the substrate is disposed on one end side of the processing areas A and B. The access ID includes a plurality of carrier mounting portions ia and a loading robot ir. The carrier 1 for storing the substrate W is placed on each of the carrier mounting portions 1a.

在本實施形態中,載體1係使用在密閉狀態下收納基板W 的 F0UP(Front Opening Unified Pod,前開式卡盒),惟 並不限定於此,亦可使用SMIF(Standard Mechanical Inter Face ’ 標準機械介面)盒、〇c(〇pen Cassette,開 放式卡匣)等。又,載入機器人IR構成為可在載入機ID 97100774 15 200836993 内沿u方向移動。 此處,在本實施形態中,在载入 人CR間的搬送區域c之位 二土板搬送機器 包含有使基板f表面與背面相 又接邛3 罟7。ία 立夂軲的基板反轉移動裝 "美:及二反¥表面是指形成電路圖案等各種圖案之 面。該基板反轉移動裝置7可在交接部3内之_對 道如上沿y方向直線往復移動。 、In the present embodiment, the carrier 1 is a FOUP (Front Opening Unified Pod) that accommodates the substrate W in a sealed state. However, the present invention is not limited thereto, and SMIF (Standard Mechanical Inter Face ' standard machine may be used. Interface) box, 〇c (〇pen Cassette, open cassette) and so on. Further, the loading robot IR is configured to be movable in the u direction within the loader ID 97100774 15 200836993. Here, in the present embodiment, the position of the transfer area c between the loaders CR is such that the surface of the substrate f and the back surface are connected to each other. Ία 基板 夂轱 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板The substrate inversion moving device 7 can linearly reciprocate in the y direction as described above in the intersection portion 3. ,

轉移動 於此種構成中’載入機器人U由载體1取出處理前基 板F而父給基板反轉移動裝置7,反之,由基板反 土 裝置7取出處理後基板w返送於載體工。 又土板反轉移動裝置7在反轉由載入機器人W所收 取之基板w的同時,使經反轉的基板w沿上述向移動 至基板搬送機器人CR附近。詳細内容如後述。 夕 更進一步,基板搬送機器人⑶將由基板反轉移動裝置 7所收取的基板w搬送至指定的處理部,或將由處理部所 收取的基& W搬送至其他處理部,或交給基板反轉移動裝 置7 〇 又 控制部4由包含CPU (中央運算處理裝置)的電腦等所 構成,其控制處理區域A、B中各處理部1P1〜MP8之動作、 搬送區域c中基板反轉移動裝置7及基板搬送機器人cR 之動作、及載入機ID中載入機器人ir之動作。 此外,基板處理裝置100設置於形成有垂流(下沈流, downflow)的潔淨室内等。又,於處理部MP1〜MP8及搬送 區域C亦分別形成有垂流。 97100774 16 200836993 (1 -2 )處理部之構成 其次,就處理部MP1〜MP8之構成參照圖式加以說明。其 中,處理部MP1〜MP8之各構成相同,因此以下以處理部 之構成為代表來說明。 * 在該處理部Mp! +,進行基板洗淨處理、基板上膜餘刻 處理或基板上聚合物殘;^查(例如,阻劑殘渣)除去處理 等。以下說明中,以基板洗淨處理為一例說明之。 圖3為表示處理部MP1之構成的剖視圖。如圖3所示, 處,部MP1包含外罩1(n、設於其内部略呈水平狀保持基 =亚使其圍繞大致通過基板W1^之錯直㈣旋轉 =盤二、以及設成封閉外罩m之上端開口的風扇過 濾早兀削。由風扇過遽單元FFU於外| 101㈣成垂济In the configuration, the loading robot U takes out the pre-processing substrate F from the carrier 1 and the parent reversing the moving device 7; otherwise, the substrate backing device 7 takes it out and the substrate w is returned to the carrier. Further, the earth plate reverse moving device 7 reverses the substrate w taken by the loading robot W, and moves the inverted substrate w in the vicinity to the vicinity of the substrate transfer robot CR. The details will be described later. Further, the substrate transfer robot (3) transports the substrate w picked up by the substrate reverse moving device 7 to a designated processing unit, or transports the base & W collected by the processing unit to another processing unit, or hands it over to the substrate. The mobile device 7 further includes a computer including a CPU (Central Processing Unit), and controls the operations of the processing units 1P1 to MP8 in the processing areas A and B, and the substrate inversion moving unit 7 in the transport area c. The operation of the substrate transfer robot cR and the operation of loading the robot ir into the loader ID. Further, the substrate processing apparatus 100 is installed in a clean room or the like in which a downflow (downflow) is formed. Further, a vertical flow is formed in each of the processing units MP1 to MP8 and the transport area C. 97100774 16 200836993 (1 - 2) Configuration of Processing Unit Next, the configuration of the processing units MP1 to MP8 will be described with reference to the drawings. Since the respective configurations of the processing units MP1 to MP8 are the same, the following is a description of the configuration of the processing unit. * In the processing unit Mp! +, the substrate cleaning process, the substrate-on-film process or the polymer residue on the substrate, and the like (for example, a resist residue) removal process are performed. In the following description, the substrate cleaning process will be described as an example. FIG. 3 is a cross-sectional view showing the configuration of the processing unit MP1. As shown in FIG. 3, the portion MP1 includes a cover 1 (n, a horizontally-shaped retaining base disposed inside thereof) so as to surround it substantially through the substrate W1^ (four) rotation = disk 2, and a closed cover The fan above the m end is filtered and boring early. The fan is over the unit FFU outside | 101 (four) into the

(下沈流)。此外,厨戶、、走— ;,L 構成。 羽匕濾早70 FFlJ由風扇及過濾器所 旋轉夾盤21設於難士 | 士a 土圭 軸25之上m 疋轉驅動機構36旋轉的旋轉 _ 土板W在藥液洗淨處理時, 夾盤保持水平的狀態下旋轉。 S猎由凝轉 於旋轉夾盤21之外方机古锿,庄土 連接右繁1方叹有弟1馬達6〇。於第1馬達6〇 τ動軸61。又,於第丨轉動軸6丨延水 延伸而連結有第1臂62,於第lf62 向 液喷嘴50。處理液噴喈 刖鳊汉置有處理 1基板W上。 、將基板W洗淨用之藥液供給至 於旋轉夾盤21之外古μ女μ。 6〇a連接有第2轉動^ ^馬達60a。於第2馬達 la,於第2轉動軸61a連結有第 97100774 17 200836993 2臂62a。又,於第2臂62a之前端設置有純水喷嘴50a。 純水喷嘴50a在洗淨處理後之清洗處理中將純水供給至 基板W上。當使用處理液喷嘴50進行洗淨處理時,純水 喷嘴50a退離至既定位置。 旋轉夾盤21之旋轉轴25由中空軸所構成。於旋轉軸 2 5之内部插通有處理液供給管2 6。於處理液供給管2 6供 給純水或洗淨液等藥液。處理液供給管26延伸至接近由 旋轉夾盤21所保持的基板W之下面的位置處。於處理液 供給管2 6之如端设置有朝基板W之下面中央吐出率液的 下面噴嘴27。(downflow). In addition, the kitchen, the walk, and the L constitute. The feather filter is 70 FFlJ. The fan and the filter are rotated by the chuck 21. The chuck 21 is set on the shovel | 士 a 土圭 axis 25 on the m 疋 rotation drive mechanism 36 rotation rotation _ the soil plate W is washed in the liquid medicine, The chuck is rotated while being horizontal. S hunting is condensed on the outside of the rotating chuck 21, the ancient land, the Zhuang soil connects the right side of the 1 square sigh, there is a brother 1 motor 6 〇. The first motor 6〇 τ moves the shaft 61. Further, the first arm 62 is coupled to the first rotating shaft 6 to extend the water, and the first arm 62 is coupled to the liquid nozzle 50 at the lf62. The treatment liquid squirt is placed on the substrate W. The liquid medicine for washing the substrate W is supplied to the outside of the rotary chuck 21. 6〇a is connected to the second rotation motor 60a. In the second motor la, a 97100774 17 200836993 2 arm 62a is coupled to the second rotating shaft 61a. Further, a pure water nozzle 50a is provided at the front end of the second arm 62a. The pure water nozzle 50a supplies pure water to the substrate W in the cleaning process after the washing process. When the cleaning process is performed using the processing liquid nozzle 50, the pure water nozzle 50a is retracted to a predetermined position. The rotary shaft 25 of the rotary chuck 21 is constituted by a hollow shaft. A processing liquid supply pipe 26 is inserted into the inside of the rotating shaft 25. The treatment liquid supply pipe 26 is supplied with a chemical liquid such as pure water or a washing liquid. The treatment liquid supply pipe 26 extends to a position close to the lower side of the substrate W held by the rotary chuck 21. At the end of the processing liquid supply pipe 26, a lower nozzle 27 for discharging the liquid toward the center of the lower surface of the substrate W is provided.

方疋轉夾盤21收谷在處理杯2 3内。於處理杯2 3之内侧 設置有筒狀分隔壁33。又’圍繞旋轉夾盤21周圍而形成 有排液空間31,以排出用於基板W洗淨處理之藥液。更 進一步,圍繞排液空間31而於處理杯23與分隔壁之 間形成有回收空間32’以回收用於基板w洗淨處理之藥 液0 於排液空間31連接有用以將藥液引導至排液處理裝置 (未圖示)的排液管3 4,於回收液空間3 2連接有用以將 藥液引導至回收再利用裝置(未圖示)的回收管。: 於處理杯23之上方設置有用以防止基板?之藥液向 飛散的護件24。該護件24由對旋轉軸25成旋^對稱之 形狀所構成。於護件24之上端部之内面瑷肚 、冉 . 长狀形成有剖面 呈〈子狀的排液導引溝41。 下方傾斜之傾 於護件24下端部之内面形成有由在外側 97100774 18 200836993 斜面所構成的回收液導引部42。於回收液導弓丨部42 端附近形成有用以收納處理杯23之分隔壁33的分隔辟收 於上述護件24連接有由滾珠螺桿機構等二;成 的濩件升降驅動機構(未圖示)。 護件升降驅動機構在回收液導引部42與由旋轉夾盤21 所保持之基板W外周端面相對向的回收位置,與排液^引The square turn chuck 21 is received in the processing cup 2 3 . A cylindrical partition wall 33 is provided inside the treatment cup 23. Further, a liquid discharge space 31 is formed around the periphery of the rotary chuck 21 to discharge the chemical liquid for the substrate W cleaning treatment. Further, a recovery space 32' is formed between the processing cup 23 and the partition wall around the liquid discharge space 31 to recover the chemical liquid 0 for the substrate w washing treatment, and is connected to the liquid discharge space 31 to guide the liquid medicine to The liquid discharge pipe 34 of the liquid discharge treatment device (not shown) is connected to the recovery liquid space 32 for a recovery pipe for guiding the chemical liquid to a recovery and reuse device (not shown). : Is it useful to prevent the substrate from being placed above the processing cup 23? The liquid medicine is directed to the scattered protective member 24. The protector 24 is formed by a shape that is symmetrical with respect to the rotating shaft 25. The inner surface of the upper end portion of the protector 24 is covered with a belly and a weir. The drain guide groove 41 having a cross section is formed in a long shape. The inner surface of the lower end portion of the guard member 24 is formed with a recovery liquid guiding portion 42 composed of a slope on the outer side 97100774 18 200836993. A partitioning wall 33 for accommodating the processing cup 23 is formed in the vicinity of the end of the recovery liquid guiding portion 42 to be separated from the protecting member 24, and a ball-and-screw mechanism or the like is connected; ). The protective member lifting and lowering drive mechanism is disposed at a recovery position of the recovery liquid guiding portion 42 opposite to the outer peripheral end surface of the substrate W held by the rotating chuck 21, and the liquid discharge guide

溝41與由旋轉夾盤21所保持之基板w外周端面相對向的 排液位置之間,使護件24上下移動。 當護件24位於回收位置(圖3所示護件24之位置)時, 從基板w向外飛散的藥液由回收液導引部42導引至回了 液空間32 ’透過回收管35回收。另一方面,當講件μ 位於排液位置時’從基板W向外飛散的藥液由排:導引溝 41導引至排液空間31,透過排液管34排出。 由以上之構成進行藥液之排出及回收。此外,當往旋 夾盤21搬入基板W時,護件升降驅動機構使護件"μ退= 至排液位置之更下方’移動至使護件24之上端部%位 於較旋轉夾盤21保持基板&高度還低的位置處。 純轉夾盤21之上方設置有於中心部具有開口的圓板 狀遮斷板22。由臂28之前端附近往鉛直下方向設 持軸29’於此支持軸29<下端安褒有遮斷板22,與由旋 轉夹盤21所保持的基板ψ之上面相對向。 产於支持轴29之内部插通有連通於遮斷板22之開口 乳供給路3G。於氮氣供給路3{)供給氮氣(⑹。該氮氣^ 給路30於純水清洗處理後之乾燥處理時’對基板 97100774 200836993 氮氣。又,於氮氣供給路30之内部插通有連通於遮斷板 22之開口的純水供給管39。於純水供給管39供給、純水等。 於臂28連接有遮斷板升降驅動機構37及遮斷板 動機構38。遮斷板升降驅動機構37在接近由旋轉夹般21 所保持的基板w之上面的位置處,與遠離旋轉失盤21上 方的位置處之間,使遮斷板22上下移動。又,遮斷板旋 轉驅動機構38使遮斷板22旋轉。 (1 -3)基板反轉移動裝置之構成及動作 接著,就基板反轉移動裝置7之構成參照圖式說明。 圖4為圖1基板反轉移動裝置7之構成的示意圖。圖 4(約為基板反轉移動裝置7之側視圖,圖4(b)為基板反 轉移動裝置7之俯視圖。又,圖5為表示基板反轉移動裝 =要部分之外觀的立體圖,圖6為表示基板反轉移動 衣置7之部分外觀的立體圖。 如圖4所示,基板反轉移動步 動機構30所構成。 由反轉機構7。及移 反轉機構7°包含第1支持構件7卜第2支持構件79 複數基板支持銷73a、73b、第】π &弟2支持構件72、 構件75、固弟1可動構件74、第2可動 部79。 杯機構77、旋轉機構78及座板 如圖 厂,I不,弟1支持構件71山Μ 狀構件所構成。於6根棒狀料丨由^射狀延伸的6根棒 板支持銷73a。 牛之各蝻端部分別設置有基 同樣地,如圖6所示,第 乐Z支持構件72亦由放射狀延 97100774 20 200836993 伸的6根棒狀構件所構成。於其6 分別設置有基板支持鎖现。 #件之各則端部 此外,在本實施形態中’雖第1及第2支持槿株71 支=籌:牛7卜72亦可由其他任意數目之 任意形狀之構件、例如具有沿複數基板支持銷73a;T 之外周的圓板或多角形等形狀所構成。 # 圖5之第1可動構件74以口字狀構 71固定於第!可動構件74之_端。第1可動構 ::端錢於連桿機構77。同樣地’圖6之第2可動構 以^字狀構成。第2支持構件72固定於第2可 件75之—端。第2可動構件75之另―端連接於連桿機構 77。連桿機構77安裝於旋轉機構78之旋轉軸。該連桿 構77及旋轉機構78安裝於固定板。 於圖5之連桿機構77内置有氣壓缸等,可使第1可動 構件74及第2可動構件75選擇性地在相分離的狀態與相 接近的狀態之間轉換。又,於旋轉機構78内置有馬達等, 透過連桿機構77可使第1可動構件74及第2可動構件 75圍繞水平方向之軸而旋轉例如18〇度。 、,如圖4所示,移動機構3〇包含有基座31、一對搬送執 運3a、直動機構3b、驅動部3c、結合構件3d及一對滑 動塊3e。此外,圖4(1))中,為求簡便省略而未圖示出結 合構件3d等部份構件。 於基座31上與v方向平行而固定有一對搬送軌道3&。 97100774 21 200836993 一對滑動塊3e可滑動自如地安裝於一對搬送執道3a。於 滑動塊3e安裝有反轉機構70之座板部79。 直動機構3b例如由滾珠螺桿機構及内置有賦予其驅動 力之馬達的電動缸所構成。於直動機構3b設有驅動部 3c。驅動部3c由結合構件3d結合於座板部79。 在此種構成中,直動機構3b使驅動部3c沿與搬送執道 3a平行之方向移動,藉此反轉機構7〇沿搬送軌道如在v 方向上往復移動。 此處,就基板反轉移動裝置7之動作參照圖式說明。 首先,由載入機器人IR (圖丨)將基板w搬入基板反轉 移動裝置7。此情況下,反轉機構7〇在搬送執道如上移 動至載入機器人IR側之端部(以下,稱為第丨交接位置 基板W在第1可動構件74及第2可動構件75於垂直方向 上相分離的狀態下,由載入機器人IR移載至第2支持構 件72之複數基板支持銷73b上。 其次,如圖4(a)所示,藉由連桿機構77之作動,第} 可動構件74及第2可動構件75轉換為在垂直方向上相接 近的狀態。藉此,基板W之兩面分別由複數基板支持銷 73a、73b所保持。 然後,如圖4(b)所示,反轉機構7〇在一對搬送執道% 上沿V方向移動至圖1之基板搬送機器人⑶側,並且第 1可動構件74及第2可動構件75隨旋轉機構78之動作 而繞U方向之軸旋轉180度。藉此,基板w與第丨可動 件74及第2可動構件75 —起被料於設在第丨支持構件 97100774 22 200836993 71及第2支持構件72的複數基板支持銷73a、73b,並旋 轉180度。 如此,基板W由反轉機構70反轉之同時,移動至基板 .搬达機器人CR之附近。此情況下,反轉機構70在搬送執 、 道3a上移動至基板搬送機器人CR側之端部(以下,稱為 第2交接位置)。 其次,隨連桿機構77之動作,第1可動構件74及第2 _可動構件75轉換為在垂直方向上相分離的狀態。在此狀 恶下,由基板搬送機器人CR從基板反轉移動裝置7搬出 基板W。 另一方面,在藉由基板搬送機器人CR將基板w搬入基 板反轉移動裝置7時,與上述之動作相反,基板w由反轉 f構7〇+反轉’同時移動至載入機器人IR之附近。在此狀 心下藉由載入機器人IR將基板W從基板反轉移動裝置 7搬出。 _ (1-4)載入機器人及基板搬送機器人各自之構成 圖7為表示圖1基板處理裝置1〇〇之載入機器人⑺及 ^板搬达機器人(^之構成的俯視圖。圖7(a)表示載入機 為人之多關節臂之構成,圖7(b)表示基板搬送機器人 CR之多關節臂之構成。其中,圖7⑷及⑻中之Θ,以在 .紙面上之順時針方向為+ 0方向,以在紙面之 為-Θ方向。 了 τ々π 如圖7(a)所示,载入機器人R具備有:用以保持基板 w的一對搬送臂am4、cm4;用以使該一對搬送臂挪4、cm4 97100774 23 200836993 互相獨立地相對於載入機器人本體IRH而進退 一 動機構-ϋ及用以圍= 之轴而在〜方向上旋轉驅動載入機器人本體咖口 .驅動機構(未圖示);用以在τ方向上升降载 : •體1RH的升降驅動機構(未圖示);以及,用以在 亡移動載入機器人本體IRH的u方向移動機構部 向 示)。 固 心:驅動機構-、am2、am3及㈤、㈤㈤為多關 ,可在維持-對搬送臂am4、cin4的姿勢之下,使 八沿水平方向進退。—搬送臂⑽4在另-搬送臂⑽之上 =搬送臂⑽4,兩者皆退至载入機器人 的初期狀態τ’該等搬送臂—‘在 上下方向上重合。 動本體⑽根據控制部4 (圖D之指示而驅 = 機構㈣,2、am3及㈤㈤㈤。該進 :驅:機構“ am3及如、㈣ 驅動機構由用以使—對搬送臂⑽、^ = =達:鋼絲及帶輪等所構成。藉由如此之機構動 ::::、,4分別被直接職予駆動力,而可沿水平方向 板^的狀^入機$人1R之搬送臂⑽4、Cm4可在支持有基 I::::”方向移動’往〜方向轉動且可伸縮。 ps在太二达臂⑽4、⑽4之上面安裝有複數基板支持部 在本』形態中’對載置於搬送臂affl4、cm4之上面 97100774 24 200836993 :基ί二外周略均等地分別安裝有4個基板支持部 持部Psldl土板支持部PS支持基板w。此外,基板支 持。” S之個數不限定於“固 f之個數即可。 4 %疋地支持基板 置Ξ基動機構7之反轉機構70位於第1交接位 置卢 、為人1!^在與基板反轉移動裝置7對向之位 7 方^臂⑽4、⑽4之任—者朝基板反轉移動裝置 二,向則進,藉此可對反轉機構7〇交接基板?。 以:;圖7(b)所不,基板搬送機器人CR具備有:用 的一對搬送臂bm4、dm4;用以使該等-對 r 、 dm4相互獨立地相對於基板搬送機器人本體 q ·而進退的進退驅動機構w、bm2、bm3及dml、dm2、 哭太棘圍、兀釓直之軸而往方向旋轉驅動基板搬送機 的疑轉驅動機構(未圖示);及用以在τ方 :、升条基板搬送機器人本體C四的升降驅動機構(未圖 不)。 j退驅動機構bna、bm2、bm3及dna、dm2、dm3為多關 :型,可維持一對搬送臂bm4、dm4的姿勢之下,使其 沿水平方向進退。一搬送臂bm4在另一搬送臂如4之上方 在對搬送臂bm4、dm4皆退至基板搬送機器人本 體CRH之上方的初期狀態下,該等搬送臂bm4、dm4在上 下方向上重合。 基板搬送機器人本體CRH根據控制部4 (圖丨)之指示 而驅動進退驅動機構bm!、bm2、bm3及dml、dm2、dm3。 97100774 25 200836993 該進退驅動機構bml、bm2、hm]艿j 1 叙德德^ , bm3及dnU、clin2、dm3具有驅 mu b仙 你设移動一對搬送臂bm4、dm4 的馬達、鋼絲及帶輪等構成。藉 辟u / τ , ㈢χ此尤機構,一對搬送 # dm4分別被直接賦予驅動力, 退移動。 > 丁力Π運 猎此’搬送臂bm4、dm4可在古垃亡贫』 』在支持有基板f的狀態下沿 T方向私動,往±θ方向轉動且可伸縮。 又’於基板搬送機器人⑶之搬送臂bm4、dm4之上面 安裝有複數基板支持部PS。在本實施形態t,對載置於 搬达臂bm4、dm4之上面的基板w ’沿其外周略均等地分 別安裝有4個基板支持部PS。由該4個基板支持部PSjt 持基板W。此夕卜,基板支持部以之個數不限定於4個, 只要為可穩定地支持基板f之個數即可。 在基板反轉移動機構7之反囀機構7〇位於第2交接位 置時,基板搬送機器人CR使搬送臂bm4、dm4之任一者朝 基板反轉移動裝置””方向前進,藉此可對反轉機構 70父接基板w。 此外,在本實施形態中,就載入機器人IR及基板搬送 機器人CR兩者為分別具有一對搬送臂抓4、cm4及、 dm4之雙臂型者之例說明,惟載入機器人R及基板搬送 機器人CR之任一者或兩者亦可為只具備一個搬送臂的 臂型。 (1 - 5)基板搬送步驟之一例 其次,說明基板W之搬送步驟之一例,但基板¥之搬送 97100774 26 200836993 步驟不受限於以下内容。 圖8為表示基板W之搬送步驟的流程圖。如圖8所示, 首先,基板反轉移動機構7之反轉機構70位於载入機哭 人IR侧之第1交接位置。載入機器人IR由載體1取出1 板f,交給基板反轉移動裝置7 (步驟S1 )。The groove 41 moves up and down between the groove 41 and the liquid discharge position facing the outer peripheral end surface of the substrate w held by the rotary chuck 21. When the protector 24 is located at the recovery position (the position of the protector 24 shown in FIG. 3), the chemical liquid scattered outward from the substrate w is guided by the recovered liquid guiding portion 42 to the returning liquid space 32' through the recovery pipe 35. . On the other hand, when the lecture piece μ is located at the liquid discharge position, the liquid medicine which is scattered outward from the substrate W is guided to the discharge space 31 by the discharge groove 41, and is discharged through the discharge pipe 34. The discharge and recovery of the chemical liquid are carried out by the above configuration. Further, when the chuck chuck 21 is carried into the substrate W, the guard lift driving mechanism moves the protector "μ retract=to the lower position of the draining position' to such that the upper end portion of the protector 24 is located at the lower rotating chuck 21 Keep the substrate & height at a low position. Above the purely rotating chuck 21, a disk-shaped blocking plate 22 having an opening at the center portion is provided. The shaft 29' is disposed in the vertical downward direction from the vicinity of the front end of the arm 28 to the support shaft 29<the lower end is provided with a blocking plate 22 opposed to the upper surface of the substrate which is held by the rotating chuck 21. The inside of the support shaft 29 is inserted through an open milk supply path 3G that communicates with the shutter 22. Nitrogen gas is supplied to the nitrogen supply path 3{) ((6). The nitrogen gas is supplied to the substrate 97100774 200836993 when it is subjected to a drying treatment after the pure water cleaning treatment. Further, the inside of the nitrogen supply path 30 is inserted and connected to the cover. The pure water supply pipe 39 of the opening of the breaking plate 22 is supplied to the pure water supply pipe 39, pure water, etc. The blocking plate lifting drive mechanism 37 and the blocking plate moving mechanism 38 are connected to the arm 28. The blocking plate lifting drive mechanism 37, the shutter 22 is moved up and down between a position close to the upper surface of the substrate w held by the rotating clip 21 and a position away from the upper portion of the rotating lost disk 21. Further, the blocking plate rotation driving mechanism 38 makes The blocking plate 22 is rotated. (1 - 3) Configuration and operation of the substrate reversing moving device Next, the configuration of the substrate reversing moving device 7 will be described with reference to the drawings. Fig. 4 is a view showing the configuration of the substrate reversing moving device 7 of Fig. 1. Fig. 4 is a side view of the substrate reverse moving device 7, and Fig. 4(b) is a plan view of the substrate reverse moving device 7. Further, Fig. 5 is a perspective view showing the appearance of the substrate reverse moving device. Figure 6 is a view showing the portion of the substrate reverse moving clothes 7 As shown in Fig. 4, the substrate reversing movement stepping mechanism 30 is formed. The reversing mechanism 7 and the reversing mechanism 7° include the first supporting member 7 and the second supporting member 79. 73a, 73b, π & 2 support member 72, member 75, Gudi 1 movable member 74, second movable portion 79. Cup mechanism 77, rotating mechanism 78 and seat plate as shown in the factory, I do not, brother 1 The supporting member 71 is composed of a haw-shaped member. The six bar-shaped material supports the pin 73a by six rod-shaped extending plates. The respective ends of the cow are respectively provided with a base, as shown in Fig. 6, The first Z support member 72 is also composed of six rod-shaped members extending radially from 97100774 20 200836993. Substrate support locks are provided in the respective 6 pieces. Each of the ends of the parts is further provided in the present embodiment. Although the first and second support strains 71 support: the cow 7 b 72 may be any other number of members of any shape, for example, having a circular plate or a polygonal shape along the periphery of the plurality of substrate support pins 73a; T; The first movable member 74 of Fig. 5 is fixed to the _ end of the movable member 74 by a square structure 71. The first movable structure: the end money is connected to the link mechanism 77. Similarly, the second movable structure of Fig. 6 is formed in a chevron shape. The second support member 72 is fixed to the end of the second movable member 75. The second movable member The other end of the 75 is connected to the link mechanism 77. The link mechanism 77 is attached to the rotating shaft of the rotating mechanism 78. The link mechanism 77 and the rotating mechanism 78 are attached to the fixed plate. The link mechanism 77 of Fig. 5 has a built-in air pressure. In the cylinder or the like, the first movable member 74 and the second movable member 75 can be selectively switched between the phase separated state and the close state. Further, the rotating mechanism 78 has a motor or the like built in, and the transmission link mechanism 77 can be used. The first movable member 74 and the second movable member 75 are rotated about the horizontal axis by, for example, 18 degrees. As shown in Fig. 4, the moving mechanism 3 includes a base 31, a pair of transporting conveyances 3a, a linear motion mechanism 3b, a driving portion 3c, a coupling member 3d, and a pair of sliding blocks 3e. Further, in Fig. 4 (1)), some members such as the joining member 3d are not illustrated for the sake of simplicity. A pair of transport rails 3& are fixed to the base 31 in parallel with the v direction. 97100774 21 200836993 A pair of sliders 3e are slidably attached to a pair of transport lanes 3a. A seat plate portion 79 of the reversing mechanism 70 is attached to the slide block 3e. The linear motion mechanism 3b is composed of, for example, a ball screw mechanism and an electric cylinder in which a motor that gives a driving force is incorporated. A drive unit 3c is provided in the linear motion mechanism 3b. The driving portion 3c is coupled to the seat plate portion 79 by the coupling member 3d. In such a configuration, the linear motion mechanism 3b moves the driving portion 3c in a direction parallel to the transport lane 3a, whereby the reversing mechanism 7b reciprocates in the v direction along the transport rail. Here, the operation of the substrate inversion moving device 7 will be described with reference to the drawings. First, the substrate w is carried into the substrate inversion moving device 7 by the loading robot IR (Fig. In this case, the reversing mechanism 7 moves to the end portion of the loading robot IR side as described above in the transport path (hereinafter referred to as the second transfer position substrate W in the vertical direction of the first movable member 74 and the second movable member 75). In the state in which the upper phase is separated, the loading robot IR transfers to the plurality of substrate supporting pins 73b of the second supporting member 72. Next, as shown in Fig. 4(a), by the action of the link mechanism 77, The movable member 74 and the second movable member 75 are switched to be in a state of being close to each other in the vertical direction. Thereby, both surfaces of the substrate W are held by the plurality of substrate supporting pins 73a and 73b, respectively, and then, as shown in Fig. 4(b), The reversing mechanism 7 is moved in the V direction to the side of the substrate transfer robot (3) of FIG. 1 on the pair of transport lanes %, and the first movable member 74 and the second movable member 75 are wound around the U direction in accordance with the operation of the rotation mechanism 78. The shaft is rotated by 180 degrees. Thereby, the substrate w and the second movable member 74 and the second movable member 75 are taken together by the plurality of substrate supporting pins 73a provided on the second supporting members 97100774 22 200836993 71 and the second supporting member 72, 73b, and rotated by 180 degrees. Thus, the substrate W is reversed by the inversion mechanism 70 At the same time, the reversing mechanism 70 moves to the end portion of the substrate transfer robot CR side (hereinafter referred to as the second transfer position) on the transport path 3a. Next, with the operation of the link mechanism 77, the first movable member 74 and the second movable member 75 are switched into a state of being separated in the vertical direction. In this case, the substrate transfer robot CR is reversely moved from the substrate. The device 7 carries out the substrate W. On the other hand, when the substrate w is carried into the substrate inversion moving device 7 by the substrate transfer robot CR, the substrate w is reversed by the reverse f structure 7 〇 + reversed while moving. In the vicinity of the loading robot IR, the substrate W is carried out from the substrate inversion moving device 7 by the loading robot IR. _ (1-4) The respective configurations of the loading robot and the substrate transfer robot are shown in Fig. 7 Fig. 1 is a plan view showing the configuration of the loading robot (7) and the board moving robot (Fig. 7(a) shows the configuration of the multi-joint arm of the loader, Fig. 7(b) Indicates the structure of the multi-joint arm of the substrate transfer robot CR Among them, in Fig. 7 (4) and (8), the clockwise direction is + 0 direction on the paper surface, and the paper surface is -Θ direction. τ々π is loaded into the robot as shown in Fig. 7(a). R is provided with a pair of transfer arms am4 and cm4 for holding the substrate w, and for moving the pair of transfer arms 4, cm4 97100774 23 200836993 independently and independently with respect to the loading robot body IRH. Rotating and driving the robot body coffee port in the direction of the axis = drive mechanism (not shown); lifting and lowering the load in the τ direction: • lifting and lowering mechanism of the body 1RH (not shown); And, in the u direction moving mechanism portion for loading the robot body IRH in the dead movement. Solid: The drive mechanism -, am2, am3, and (5), (5) (5) are multi-level, and can be advanced and retracted in the horizontal direction under the posture of the transport arm am4 and cin4. - The transfer arm (10) 4 is above the other transfer arm (10) = the transfer arm (10) 4, both of which are retracted to the initial state of the loading robot τ' such transfer arms - "superimposed in the up and down direction. The moving body (10) is driven by the control unit 4 (indicated by Figure D, the mechanism (4), 2, am3, and (5) (5) (5). The drive: the mechanism "am3 and the (4) drive mechanism is used to make the pair of transfer arms (10), ^ = = up to: steel wire and pulleys, etc.. With such an action::::,, 4 are directly assigned to the power, and can be moved along the horizontal direction of the machine ^ person 1R transfer arm (10) 4, Cm4 can be moved in the direction of supporting the base I::::" to rotate in the direction of the ~ and can be stretched. ps is mounted on the top of the two arm (10) 4, (10) 4 with a plurality of substrate support parts in the "form" It is placed on the upper side of the transfer arms affl4 and cm4. 97100774 24 200836993: The four substrate support portions Psldl are supported by the substrate support portion Psldl. The substrate support portion PS is supported. The number of S is supported. It is not limited to the number of "solid f. 4% of the support substrate is provided. The inversion mechanism 70 of the base mechanism 7 is located at the first transfer position, and is a person 1! To the position of the 7-square arm (10) 4, (10) 4 - the reverse moving device 2 toward the substrate, the direction is forward, thereby the reverse machine 7〇交接板?. By: FIG. 7(b), the substrate transfer robot CR includes a pair of transfer arms bm4 and dm4 for mutually opposing the substrates The robot body q is moved forward and backward, and the forward and backward drive mechanisms w, bm2, bm3, and dml, dm2, which are too rigidly twisted and twisted, drive the substrate conveyor to drive the substrate transfer mechanism (not shown); The lifting drive mechanism (not shown) for transporting the robot body C 4 on the τ side: the slab substrate. The j retracting drive mechanisms bna, bm2, bm3, and dna, dm2, and dm3 are multi-close: type, which can maintain a pair When the transfer arms bm4 and dm4 are moved forward and backward in the horizontal direction, the transfer arm bm4 is returned to the upper side of the substrate transfer robot body CRH above the transfer arm bm4 and dm4 above the other transfer arm 4, 4 Then, the transfer arms bm4 and dm4 overlap in the vertical direction. The substrate transfer robot main body CRH drives the advance/retract drive mechanisms bm!, bm2, bm3, and dml, dm2, and dm3 in accordance with the instruction of the control unit 4 (FIG.). 200836993 The drive mechanism bml, bm2, hm] j 1 Sudede ^, bm3 and dnU, clin2, dm3 have the function of driving the mu bxian, you set up a pair of moving arms bm4, dm4 motor, wire and pulley. By u / τ, (c) χ this special institution, A pair of transport # dm4 is directly given the driving force and retreats. > Ding Lijun hunts this 'transport arm bm4, dm4 can be dead in ancient garbage』 』 in the state of supporting the substrate f in the T direction, Rotate in the direction of ±θ and expand and contract. Further, a plurality of substrate supporting portions PS are mounted on the upper surfaces of the transfer arms bm4 and dm4 of the substrate transfer robot (3). In the t-th embodiment, the substrate support portions PS are mounted on the substrate w' placed on the upper surfaces of the transfer arms bm4 and dm4 slightly and evenly on the outer periphery thereof. The substrate W is held by the four substrate supporting portions PSjt. In addition, the number of the substrate supporting portions is not limited to four, and the number of the substrates f can be stably supported. When the reaction mechanism 7 of the substrate inversion moving mechanism 7 is located at the second transfer position, the substrate transfer robot CR advances any of the transfer arms bm4 and dm4 toward the substrate reverse moving device "", thereby counteracting The rotating mechanism 70 is connected to the substrate w. Further, in the present embodiment, the loading robot IR and the substrate transfer robot CR are both examples of a pair of arms having a pair of transfer arm grips 4, cm4, and dm4, but the robot R and the substrate are loaded. Either or both of the transfer robots CR may be an arm type having only one transfer arm. (1 - 5) Example of substrate transfer step Next, an example of the transfer process of the substrate W will be described. However, the substrate transfer is not limited to the following. FIG. 8 is a flow chart showing a procedure of transporting the substrate W. As shown in Fig. 8, first, the reversing mechanism 70 of the substrate reversing moving mechanism 7 is located at the first transfer position on the IR side of the loader. The loading robot IR takes out the 1 plate f from the carrier 1 and delivers it to the substrate reverse moving device 7 (step S1).

其次,基板反轉移動裝置7之反轉機構7〇將從載入機 器人IR所收取的基板W反轉,同時沿v方向移動至基 搬送機态人CR侧之第2交接位置(步驟S2)。 接著,基板搬送機器Λ CR從基板反轉移動褒置了收取 基板W (步驟S3)。然後,基板搬送機器人⑶將基板請 入處理部MP1〜MP8之任一者(步驟S4)。 其次,由上述任-處理部對基板^以處理(步驟⑹。 然後,基板搬送機器人„上述任―處理部搬出處理後 然後,基板搬送機器人CR將此基板w 乂、、、β基板反轉移動裝置7 (步驟)。 其次’基板㈣移動裝置7將録板 收取的基板W反轉,同時沿上述v IR側之弟1父接位置處(步驟S8)。然後,载入機哭人 IR從基板反轉移動裝i 7收取基板?( : 載入機器人R將基板w收納於 9)°之後’ (卜6)第1實施形態之效果 戰體 根據本實施形態之基板處縣置⑽ 反轉移動裝置7兼具在载入機器人iR 乂接。口之基板 CR之間傳遞基板W的往返搬 ^板搬送機器人 戍稱之功能,以及用以反 97100774 27 200836993 轉基板w的基板反轉機構之功能。亦即,藉由基板反轉移 動裝置7之移動機構30,使反轉機構7〇在第丨交接位置 與第2交接位置之間往復直線移動,在載入機器人❹ 基板搬送機器人CR之間進行基板w之交接及基板Next, the inversion mechanism 7 of the substrate inversion moving device 7 reverses the substrate W received from the loading robot IR, and moves in the v direction to the second transfer position on the base transfer state CR side (step S2). . Next, the substrate transfer apparatus Λ CR is reversely moved from the substrate and the substrate W is picked up (step S3). Then, the substrate transfer robot (3) invites the substrate to any of the processing units MP1 to MP8 (step S4). Then, the substrate is processed by the above-described processing unit (step (6). Then, the substrate transfer robot „the above-described processing unit carries out the processing, and then the substrate transport robot CR reverses the substrate w 乂 and the β substrate. Device 7 (step) Next, the 'substrate (four) moving device 7 inverts the substrate W received by the recording board while being along the parent side of the v IR side (step S8). Then, the loader is crying IR from The substrate reversal moving device 7 receives the substrate? ( : The loading robot R stores the substrate w at 9)° (B 6) The effect of the first embodiment is based on the substrate at the substrate (10) inversion according to the present embodiment. The mobile device 7 has a function of transferring the substrate W between the substrate CR of the loading robot iR, and a substrate reversing mechanism for transposing the substrate w of 97100774 27 200836993 In other words, the reversing mechanism 7 is reciprocally moved linearly between the second transfer position and the second transfer position by the moving mechanism 30 of the substrate reverse moving device 7, and is loaded into the robot 基板 substrate transfer robot CR. Substrate w And a substrate transfer

藉此,對基板搬送機器人CR就!片基板w之搬送步驟 成為:從基板反轉移動裝置7往處理部之搬送,以及從處 理部往基板反轉移動裝置7之搬送等2步驟。 如此,由於可減少基板搬送機器人⑶之搬送步驟,因 此提高基板W處理之處理量。 又,由於將包含基板反轉移動裝置7之交接部3設置於 載入機器人IR與基板搬送機器人CR之間的搬送區域c之 位置,因而不需要變更既定基板處理裝置之構成(所謂平 台之構成)。因此,可抑制基板處理裝置1〇〇製造成本之 上升。 響(2)第2實施形態 (2 -1)基板處理裝置之構成 圖9為弟2貫施形悲之基板處理裝置之俯視圖。 如圖9所示,第2實施形態之基板處理裝置i〇〇a的構 成,與第1實施形態之基板處理裝置1〇0的構成,其不同 •之處在於交接部3包含有基板反轉移動裝置7a,而非基 板反轉移動裝置7。以下,參照圖式說明該點。 (2-2)基板反轉移動裝置之構成及動作 圖10為圖9之基板反轉移動裝置7a之構成的示意圖。 97100774 28 200836993 圖10(a)為基板反轉移動裝置7a之侧視圖 板反轉移動裝置7a之俯視圖。 )為基 如圖10(a)所示,基板反轉移動裝置?a之構成鱼上述 •基板反轉移動裝置7(圖4)之構成,其不同之處在於設有 ,移動機構3〇a而非移動機構3〇。移動機構3〇&包含有基 座31、旋轉轴3g及馬達3f。 馬達3f固定於基座31上。馬達3f之轴透過旋轉轴^ •連接於座板部79之下面。藉由此種構成,如圖^⑻所 示,反轉機構70可往土θ方向(繞τ方向之轴)旋轉。 對於該基板反轉移動裝置7a之反轉機構7〇,可從位於 旋轉機構78相反側之交接側s交接基板w。 本實施形態中,基板反轉移動裝置化配置在交接基板 W時載人機ϋ人IR之位置與交接基板w時基板搬送機器 人CR之位置的連結線上。 其次,說明本實施形態之基板反轉移動裝置之動作。 • 首先,載入機器人1R移動至與基板反轉移動裝置7a相 對向之位置處。又,藉由移動機構3〇a旋轉反轉機構7〇, 藉此使交接侧S與載入機器人I R相對向。 此狀悲下,載入機器人I R之一搬送臂沿與v方向平行 的進退方向VI前進,藉此將基板w搬入基板反轉移動裝 置7a 〇 然後,反轉機構70繞旋轉軸3g往0方向旋轉18〇产, 並且該反轉機構70之第1可動構件74及第2可動構二 75隨旋轉機構78之動作而繞水平方向之軸旋轉18〇度。 97100774 29 200836993 因此,在反轉基板w之同時,使反轉機構70之交接侧s 與基板搬送機器人CR相對向。 於此狀態下,基板搬送機器人CR之一搬送臂沿與V方 .向平行之進退方向V2前進,藉此從基板反轉移動裝置7a 搬出基板W。 另一方面,在藉由基板搬送機器人CR將基板f搬入基 板反轉移動裝置7a時,依與上述相反之動作,藉由反轉 機構70反轉基板W之同時,隨反轉機構7〇之旋轉,交接 $ S與載人機器人IR相對向。於此狀態下,藉由載入機 器人IR從基板反轉移動裝置7a搬出基板w。 (2 - 3 )第2實施形態之效果 士根據本實施形態之基板處理裝置黯,基板反轉移動 衣置7a兼具在載入機器人IR與基板搬送機器人⑶之間 傳遞基板w的往返搬送機構之功能,以及用以反轉基板w 的基板反轉機構之魏。亦即,藉由基板反轉移動裝置 # =之移動機構30a’使反轉機構70在朝向進退方向^的 第1交接方向與朝向進退方向V2的第2交接方向之間旋 轉移動180度,在載入機器人IR與基板搬送機器人⑶之 間進行基板W之交接及基板w之反轉。 藉此,基板搬送機ϋ人㈣丨片基板w之搬送步驟成 -為.從基板反轉移動裝置以往處理部之搬送,以及從處 理部在基板反轉移動裝置7 a之搬送等2步驟。 '減,由於可減少基板搬送機!^搬送步驟,因 此提南基板W處理之處理量。 97100774 30 200836993 又,由於將包含基板反轉移動裝置7a之交接部3設置 於載入機器人IR與基板搬送機器人CR之間的搬送區域c 之位置’因而不需要變更既定基板處理裝置之構成(所謂 、平台之構成)。因此,可抑制基板處理裝置l〇〇a製造成本 . 之上升。 (3)弟3實施形態 (3-1)基板處理裝置之構成 _ 圖11為弟3實施形悲之基板處理裝置之俯視圖。 如圖11所示,第3實施形態之基板處理裝置i〇〇b的構 成與第2實施形態之基板處理裝置i00a的構成,其不同 之處在於未設有流體箱部2a、2c及處理部MP1、MP2、MP5、 MP6,以及交接部3之基板反轉移動裝置7a在配置上的差 ’、因此’本實細*形恶之基板處理裝置10 〇b由4個處理 部MP3、MP4、MP7、MP8構成。以下,參照圖式說明基板 反轉移動裝置7a之配置。 _ 如圖11所示,相對於交接基板W時載入機器人IR之位 置與交接基板W時基板搬送機器人CR之位置的連結線, 基板反轉移動裝置7a設於由該連結線往侧向分離之位置 處。藉此,在載入機器人IR對載體1收納或取出基板w 時搬送臂的進退方向,與載入機器人丨!^對基板反轉移動 • 衣置7 a父接基板w時搬送臂的進退方向之間,载入機哭 人IR之旋轉角度小於180度。 圖12為表示第3實施形態之基板反轉移動裝置7a之配 置的說明圖。 97100774 31 200836993 如圖12所示,例如在旋轉載入機器人ir,而使搬送臂 之進退方向從朝向載體i的V方向往-Θ方向例如12〇度 方疋轉之情況下,將基板反轉移動裝置7a配置於載入機哭 人IR可對基板反轉移動裝置7a交接基板W的位置處。 其次,說明本實施形態之基板反轉移動裝置之動作。 首先,載入機器人IR移動至載入機ID之中央部,並且 使搬迗臂之進退方向從朝向載體1的V方向往方向例 如120度旋轉。又,藉由移動機構3〇a (圖1〇)旋轉反轉 機構70,藉此使交接侧s (圖1〇)與載入機器人R相對 向。 於此狀態下,藉由載入機器人IR之一搬送臂沿進退方 向VI岫進,而將基板w搬入基板反轉移動裝置。 然後,反轉機構70往+ 0方向旋轉例如12〇度並反轉基 板w。藉此,如虛線所示,反轉機構7〇之交接侧s (圖 1〇)與基板搬送機器人CR相對向。於此狀態下,基板搬 运機器人CR之一搬送臂往與v方向例如成12〇度的進退 方向V2蝻進,藉此將基板w從基板反轉移動裝置化搬出。 另一方面,在藉由基板搬送機器人CR將基板f搬入基 板反轉移動裝置7a時,依與上述相反之動作,在藉由反 轉機構70反轉基板w之同時,反轉機構7〇旋轉例如12〇 度以使父接侧S (圖1〇)與載入機器人IR相對向。於此 狀態下,由載入機器人IR將基板f從基板反轉移動裝置 7 a搬出。 (3-2)苐3實施形態之效果 97100774 32 200836993 根據本實施形態之基板 裝置7a兼具在载入機哭人f::f嶋’基板反轉移動 傳遞基板W的往返搬C搬送機器人CR之間 =轉機構之功能。亦即,在朝向進退方= 板/ 方向與朝向進退方向V2的第2交接方 :基板反轉移動裝置7a之移動機構 反; R之間進订基板w之交接及基板反轉。 A藉此,基板搬送機器人⑶就1片基板W之搬送步驟成 為.從基板反轉移動裝置〜往處理部之搬送,以及從處 理部在基板反轉移動裝置以之搬送等2步驟。 如,,由於可減少基板搬送機器人CR之搬送步驟,因 此提高基板W處理之處理量。 又,相對於交接基板W時載入機器人IR之位置與交接 基板W時基板搬送機器人邙之位置的連結線,基板反轉 ⑩移動裝置7a設於由該連結線往侧向分離之位置處。藉 此,載入機斋人IR藉由往—Θ方向以小於18〇度之角度旋 轉而可在載體1與基板反轉移動裝置7a之間搬送基板w。 又,基板反轉移動裝置7a之反轉機構70藉由往+ 0方向 以小於180度之角度旋轉而可在載入機器人”與基板搬 ,送機器人CR之間交接基板W。藉此,可縮短載入機器人 IR搬送基板W時間及基板反轉移動裝置7a交接基板财之 日守間。結果’可更加南基板W處理之處理量。 (4)其他實施形態 97100774 33 200836993 在上述實施形態中,反轉機構70具有在從兩面側夾持 並保持基板W之狀態下使基板w反轉的構成,但反轉機構 70亦可具有其他構成。例如,反轉機構亦可具有在保 • 持基板W之周緣上相反侧兩處之狀態下使基板ψ反轉的構 成。 在上述實施形態中,說明在任一處理部處理基板W之 後,由基板搬送機器人CR將處理後基板w交給基板反轉 移動裝置7、7a之例,惟不限定於此,亦可藉由基板搬送 機器人CR將上述處理後基板ψ搬入其他處理部,然後進 行該處理部之處理。 在上述第3實施形態中,將基板反轉移動裝置7a配置 於由V方向觀祭以載入機器人I r之旋轉軸為中心之逆時 針位置處,但並不限定於此,亦可配置在以上述旋轉軸為 中心之順時針位置處。 (5)申請專利範圍之各構成元件與實施形態之各元件之對 g 應關係 _以下’說明申請專利範圍之各構成元件與實施形態之各 凡件之對應例,惟本發明並不限定於下述例子。 、在上述實施形態中,搬送區域c為搬人搬出區域之例, 載體1為收納容器之例,载體载置部1&為容器載置部之 .[I ft人機$人IR為第1搬送裝置之例,基板搬送機器 .人CR為第2搬送裝置之例’基板反轉移動裝置7、7a為 父接部之例,反轉機才冓70為反轉機構之例,移動機構3〇、 3 0 a為移動機構之例。 97100774 34 200836993 又,上述實施形態中,第丨交接位置為可在 =㈣裝置之間交接基板的位置之例,第位^ ^在第2搬送裝置與反轉裝置之間交接基板的位接^置為 列’搬送臂⑽4、cra4為第】支持部之例 指4為第2支持部之例。 ’加4、 f進一步,上述實施形態中,進退方向n為第丨 方向之例’钱料V2為帛2料 T方向軸)為婊虼奶古士心从土 方向(繞Thereby, the substrate transfer robot CR is on! The transport step of the sheet substrate w is a two-step process from the substrate reversal moving device 7 to the processing unit and the transfer from the processing unit to the substrate reversal moving device 7. Thus, since the transfer step of the substrate transfer robot (3) can be reduced, the throughput of the substrate W processing is increased. Further, since the delivery unit 3 including the substrate inversion moving device 7 is disposed at the position of the transfer region c between the loading robot IR and the substrate transfer robot CR, it is not necessary to change the configuration of the predetermined substrate processing device (the so-called platform configuration) ). Therefore, an increase in the manufacturing cost of the substrate processing apparatus 1 can be suppressed. (2) Second Embodiment (2 - 1) Configuration of Substrate Processing Apparatus Fig. 9 is a plan view of a substrate processing apparatus in which the second embodiment is applied. As shown in FIG. 9, the configuration of the substrate processing apparatus i〇〇a of the second embodiment differs from the configuration of the substrate processing apparatus 1〇0 of the first embodiment in that the interface 3 includes a substrate inversion. The mobile device 7a, instead of the substrate, reverses the mobile device 7. Hereinafter, this point will be described with reference to the drawings. (2-2) Configuration and Operation of Substrate Reversal Moving Device FIG. 10 is a schematic view showing the configuration of the substrate reversing moving device 7a of FIG. 97100774 28 200836993 Fig. 10(a) is a plan view showing a side view of the substrate reverse moving device 7a. As a base, as shown in Fig. 10(a), the substrate reverses the moving device? The constituent fish of a is as described above. The configuration of the substrate reverse moving device 7 (Fig. 4) differs in that the moving mechanism 3〇a is provided instead of the moving mechanism 3〇. The moving mechanism 3〇& includes a base 31, a rotating shaft 3g, and a motor 3f. The motor 3f is fixed to the base 31. The shaft of the motor 3f is connected to the lower surface of the seat plate portion 79 through the rotating shaft. With such a configuration, as shown in Fig. (8), the reversing mechanism 70 is rotatable in the direction of the soil θ (the axis about the τ direction). With respect to the reversing mechanism 7 of the substrate reversing moving device 7a, the substrate w can be transferred from the delivery side s on the opposite side of the rotating mechanism 78. In the present embodiment, the substrate reversal moving device is disposed on the connecting line between the position of the human-mounted device IR when the substrate W is delivered and the position at which the substrate CR is transferred when the substrate w is transferred. Next, the operation of the substrate reversal moving device of the present embodiment will be described. • First, the loading robot 1R moves to a position opposite to the substrate reverse moving device 7a. Further, the moving mechanism 3〇a rotates the reversing mechanism 7〇, thereby causing the delivery side S to face the loading robot 110. In this case, one of the loading arms of the loading robot IR advances in the advancing and retracting direction VI parallel to the v direction, thereby moving the substrate w into the substrate reversal moving device 7a. Then, the reversing mechanism 70 is rotated in the 0 direction around the rotating shaft 3g. When the rotation is 18 inches, the first movable member 74 and the second movable structure 75 of the reversing mechanism 70 are rotated by 18 degrees around the axis of the horizontal direction in accordance with the operation of the rotating mechanism 78. 97100774 29 200836993 Therefore, while the substrate w is reversed, the delivery side s of the reversing mechanism 70 is opposed to the substrate transfer robot CR. In this state, the transfer arm of one of the substrate transfer robots CR advances in the advancing and retreating direction V2 in the parallel direction with respect to the V side, whereby the substrate W is carried out from the substrate inversion moving device 7a. On the other hand, when the substrate f is carried into the substrate reverse moving device 7a by the substrate transfer robot CR, the substrate W is reversed by the inversion mechanism 70 while the reverse mechanism 7 is being used. Rotate, hand over $S opposite the manned robot IR. In this state, the substrate w is carried out from the substrate inversion moving device 7a by the loading robot IR. (2 - 3) The effect of the second embodiment is the substrate processing apparatus according to the present embodiment, the substrate reverse moving clothes 7a, and the reciprocating mechanism for transferring the substrate w between the loading robot IR and the substrate transfer robot (3). The function, and the substrate inversion mechanism used to invert the substrate w. In other words, the reversing mechanism 70 is rotationally moved by 180 degrees between the first transfer direction in the advancing and retracting direction and the second transfer direction in the advancing and retracting direction V2 by the moving mechanism 30a' of the substrate inversion moving device #=. The transfer of the substrate W and the inversion of the substrate w are performed between the loading robot IR and the substrate transfer robot (3). Thereby, the substrate transporter (4) transport step of the cymbal substrate w is carried out in two steps: transport from the substrate processing reverse processing unit to the conventional processing unit, and transfer from the processing unit to the substrate reverse transport unit 7a. 'Reduce, because the substrate conveyor can be reduced! ^Transfer step, so the processing capacity of the substrate W processing. 97100774 30 200836993 Further, since the delivery unit 3 including the substrate inversion moving device 7a is disposed at the position of the transfer region c between the loading robot IR and the substrate transfer robot CR, it is not necessary to change the configuration of the predetermined substrate processing device (so-called , the composition of the platform). Therefore, it is possible to suppress an increase in the manufacturing cost of the substrate processing apparatus 10a. (3) Younger Embodiment 3 (3-1) Configuration of Substrate Processing Apparatus FIG. 11 is a plan view of a substrate processing apparatus in which the third embodiment is implemented. As shown in FIG. 11, the configuration of the substrate processing apparatus i〇〇b according to the third embodiment differs from the configuration of the substrate processing apparatus i00a of the second embodiment in that the fluid tank portions 2a and 2c and the processing unit are not provided. MP1, MP2, MP5, MP6, and the substrate inversion moving device 7a of the delivery unit 3 have a difference in arrangement, so the substrate processing apparatus 10b of the actual thin surface is composed of four processing units MP3 and MP4. MP7, MP8 constitutes. Hereinafter, the arrangement of the substrate inversion moving device 7a will be described with reference to the drawings. As shown in FIG. 11, the substrate reverse moving device 7a is disposed laterally separated by the connecting line with respect to the connecting line where the position of the robot IR is loaded when the substrate W is transferred and the position of the substrate transfer robot CR when the substrate W is transferred. The location. Thereby, when the loading robot IR stores or takes out the substrate w on the carrier 1, the direction of advancement and retreat of the transport arm, and the loading robot 反转!^ reverse the movement of the substrate. Between the loader crying IR rotation angle is less than 180 degrees. Fig. 12 is an explanatory view showing the arrangement of the substrate reverse moving device 7a of the third embodiment. 97100774 31 200836993 As shown in FIG. 12, for example, when the robot ir is rotated, and the forward/backward direction of the transfer arm is rotated from the V direction toward the carrier i toward the −Θ direction, for example, 12 degrees, the substrate is reversed. The moving device 7a is disposed at a position where the loader crying IR can transfer the substrate W to the substrate reverse moving device 7a. Next, the operation of the substrate reversal moving device of the present embodiment will be described. First, the loading robot IR moves to the center of the loader ID, and the direction of advancement and retraction of the carrying arm is rotated from the V direction toward the carrier 1 by, for example, 120 degrees. Further, the reversing mechanism 70 is rotated by the moving mechanism 3A (Fig. 1A), whereby the delivery side s (Fig. 1A) is opposed to the loading robot R. In this state, the substrate w is carried into the substrate inversion moving device by the loading arm of the loading robot IR in the advancing and retracting direction VI. Then, the reversing mechanism 70 is rotated by, for example, 12 degrees in the +0 direction and the substrate w is reversed. Thereby, as shown by the broken line, the delivery side s (Fig. 1A) of the reversing mechanism 7 is opposed to the substrate transfer robot CR. In this state, the transfer arm of one of the substrate transfer robots CR advances in the advancing and retracting direction V2 of, for example, 12 degrees in the v direction, whereby the substrate w is moved out of the substrate reversing device. On the other hand, when the substrate f is carried into the substrate reverse moving device 7a by the substrate transfer robot CR, the reverse mechanism 7 is rotated while the substrate w is reversed by the reversing mechanism 70 in accordance with the reverse operation. For example, 12 degrees to make the parent side S (Fig. 1A) face the loading robot IR. In this state, the substrate f is carried out from the substrate inversion moving device 7a by the loading robot IR. (3-2) Effect of Embodiment 3 97100774 32 200836993 The substrate device 7a according to the present embodiment also has a reciprocating C transport robot CR that reverses the movement of the transfer substrate W in the loader's crying f::f嶋' substrate Between = the function of the transfer mechanism. That is, the second transfer side toward the advancing and retracting side = plate/direction and toward the advancing and retreating direction V2: the moving mechanism of the substrate reversal moving device 7a is reversed; the transfer of the substrate w is reversed between R and the substrate is reversed. In this way, the substrate transfer robot (3) transports the one substrate W to two steps: from the substrate reverse moving device to the processing unit, and from the processing unit to the substrate reverse moving device. For example, since the transfer step of the substrate transfer robot CR can be reduced, the amount of processing for the substrate W processing is increased. Further, the substrate reversal 10 moving device 7a is provided at a position separated laterally by the connecting line with respect to the connecting line at the position where the robot IR is loaded when the substrate W is transferred and the position at which the substrate transfer robot W is transferred. By this, the loader's IR can transfer the substrate w between the carrier 1 and the substrate reverse moving device 7a by rotating at an angle of less than 18 degrees in the direction of the Θ. Further, the inversion mechanism 70 of the substrate inversion moving device 7a can transfer the substrate W between the loading robot and the substrate transfer robot CR by rotating at an angle of less than 180 degrees in the +0 direction. The time for loading the robot IR transport substrate W and the time when the substrate reverse moving device 7a delivers the substrate is shortened. As a result, the processing amount of the south substrate W processing can be further improved. (4) Other Embodiments 97100774 33 200836993 In the above embodiment The reversing mechanism 70 has a configuration in which the substrate w is reversed while sandwiching and holding the substrate W from both sides, but the reversing mechanism 70 may have another configuration. For example, the reversing mechanism may also have a guarantee In the above-described embodiment, after the substrate W is processed by any of the processing units, the substrate transfer robot CR transfers the processed substrate w to the substrate in the reverse state in which the substrate W is reversed on the opposite side of the substrate W. The example of the transfer device 7 and 7a is not limited thereto, and the processed substrate may be carried into another processing unit by the substrate transfer robot CR, and then the processing unit may be processed. In the third embodiment, the substrate reversal moving device 7a is disposed at a counterclockwise position centered on the rotation axis of the loading robot Ir in the V direction. However, the present invention is not limited thereto, and may be disposed in the above-described rotation. The axis is centered at the clockwise position. (5) The relationship between each component of the patent application and the components of the embodiment is as follows: _ The following describes the correspondence between each component of the patent application scope and the embodiment. For example, the present invention is not limited to the following examples. In the above embodiment, the transporting area c is an example of a carrying-out area, the carrier 1 is an example of a storage container, and the carrier placing unit 1& [I ft human machine $ human IR is an example of a first transport device, a substrate transport device. A case where a person CR is a second transport device.] The substrate reverse moving devices 7 and 7a are examples of a parent connection portion, and are reversed. The machine 70 is an example of a reversing mechanism, and the moving mechanism 3〇, 30 a is an example of a moving mechanism. 97100774 34 200836993 In the above embodiment, the second delivery position is a substrate that can be transferred between the devices (=4). Example of location, the first place ^ ^ in the second transport The position of the transfer substrate between the inverting device and the inverting device is set to be the column 'transport arm (10) 4, and the cra4 is the first support portion. The reference finger 4 is an example of the second support portion. 'Add 4, f further, in the above embodiment, The direction of advance and retreat n is the direction of the third direction. 'The material V2 is the T-axis of the material 2'. The direction of the earth is from the earth direction.

為、%略鉛直方向的軸之例,ϋ方向為第}轴 方向為第2軸方向之例,進退 軸方向之例。 ~d 此外ΐ 4專利範圍之各構成元件亦可使 利範圍所記載之構成或功能之其他各心件。申5月專 【圖式簡單說明】 圖1為第1實施形態之基板處理裝置之俯視圖。 圖2為圖1基板處理裝置之侧視圖。 圖3為表示處理部構成之剖視圖。 圖4(a)及(b)為基板反轉移動裝置之構成的示意圖。 圖5為表示基板反轉移動裝置之主要部分之外觀的立 體圖。 圖6為表示基板反轉移動裝置之—部分外觀的立體圖。 圖7⑷及(b)為表示圖!基板處理裝置之載入機器人及 土板搬送機器人之構成的俯視圖。 圖8為表示基板搬送步驟之流程圖。 图9為第2只施形恶之基板處理裝置之俯視圖。 97100774 35 200836993 圖10(a)及(b)為圖9基板反轉移動裝置之構成的示意 圖。 圖11為第3實施形態之基板處理裝置之俯視圖。 圖12為表示第3實施形態之基板反轉移動裝置之配置 的說明圖。For example, the axis is slightly perpendicular to the axis, and the ϋ direction is the example in which the θ-axis direction is the second-axis direction, and the advancing and retracting axis direction is an example. ~d Other components of the patent range are also applicable to other components of the structure or function described in the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view of a substrate processing apparatus according to a first embodiment. Figure 2 is a side elevational view of the substrate processing apparatus of Figure 1. Fig. 3 is a cross-sectional view showing the configuration of a processing unit. 4(a) and 4(b) are schematic views showing the configuration of a substrate reverse moving device. Fig. 5 is a perspective view showing the appearance of a main portion of a substrate reverse moving device. Fig. 6 is a perspective view showing a part of the appearance of the substrate reverse moving device. Figures 7 (4) and (b) are diagrams! A plan view of the configuration of the loading robot and the earth-moving robot of the substrate processing apparatus. Fig. 8 is a flow chart showing a substrate transfer step. Fig. 9 is a plan view showing a second substrate processing apparatus for forming a shape. 97100774 35 200836993 FIGS. 10(a) and (b) are schematic views showing the configuration of the substrate reverse moving device of FIG. 9. Fig. 11 is a plan view showing a substrate processing apparatus according to a third embodiment. Fig. 12 is an explanatory view showing the arrangement of the substrate reverse moving device of the third embodiment.

【主要元件符號說明】 1 載體 la 載體載置部 2a 〜2d 流體箱部 3 交接部 3a 搬送執道 3b 直動機構 3c 驅動部 3d 結合構件 3e 滑動塊 3f 馬達 3g 旋轉軸 4 控制部 7、7 a 基板反轉移動裝置 21 旋轉爽盤 22 遮斷板 23 處理杯 24 護件 24a 上端部 97100774 36 200836993[Description of main component symbols] 1 carrier la carrier mounting portion 2a to 2d fluid tank portion 3 delivery portion 3a transport lane 3b linear motion mechanism 3c driving portion 3d coupling member 3e sliding block 3f motor 3g rotary shaft 4 control portion 7, 7 a Substrate reverse moving device 21 Rotating plate 22 Blocking plate 23 Processing cup 24 Protector 24a Upper end 97100774 36 200836993

25 旋轉轴 26 處理液供給管 27 下面喷嘴 28 臂 29 支持軸 30 氮氣供給路 30a 移動機構 31 排液空間 32 回收空間 33 分隔壁 34 排液管 35 回收管 36 夾盤旋轉驅動機構 37 遮斷板升降驅動機構 38 遮斷板旋轉驅動機構 39 純水供給管 41 排液導引溝 42 回收液導引部 43 分隔壁收納溝 50 處理液喷嘴 50 a 純水喷嘴 60 第1馬達 60a 第2馬達 61 第1轉動軸 97100774 37 78 79 100 、 100a 、 100b 200836993 61a 62 62a 70 71 72 73a 、 73b 74 •75 76 77 10125 Rotary shaft 26 Treatment liquid supply pipe 27 Lower nozzle 28 Arm 29 Support shaft 30 Nitrogen supply path 30a Movement mechanism 31 Discharge space 32 Recovery space 33 Partition wall 34 Drain pipe 35 Recovery pipe 36 Clamp rotary drive mechanism 37 Breaker Lifting drive mechanism 38 Blocking plate rotation drive mechanism 39 Pure water supply pipe 41 Drainage guide groove 42 Recovery liquid guide portion 43 Partition wall storage groove 50 Process liquid nozzle 50 a Pure water nozzle 60 First motor 60a Second motor 61 First rotation shaft 97100774 37 78 79 100 , 100a , 100b 200836993 61a 62 62a 70 71 72 73a , 73b 74 • 75 76 77 101

ami〜am3 bml〜bm3 cml〜cm3 dml〜dm3 am4 、 bm4 cm4 、 dm4 A B C 97100774 第2轉動軸 第1臂 第2臂 反轉機構 第1支持構件 第2支持構件 基板支持鎖 第1可動構件 第2可動構件 固定板 連桿機構 旋轉機構 座板部 基板處理裝置 外罩 進退驅動機構 進退驅動機構 進退驅動機構 進退驅動機構 搬送臂 搬送臂 處理區域 處理區域 搬送區域 200836993 CR 基板搬送機器人 CRH 基板搬送機器人本體 FFU 風扇過濾單元 _ ID 載入機 IR 載入機器人 IRH 載入機器人本體 MP1〜MP8 處理部 PS 基板支持部 • S 交接侧 T 方向 U 方向 V 方向 VI 進退方向 V2 進退方向 W 基板 • 97100774 39Ami~am3 bml~bm3 cml~cm3 dml~dm3 am4, bm4 cm4, dm4 ABC 97100774 Second rotation axis first arm second arm reversing mechanism first support member second support member substrate support lock first movable member second Movable member fixing plate link mechanism rotation mechanism seat plate portion substrate processing device housing advance and retreat drive mechanism advancing and retracting drive mechanism advancing and retracting drive mechanism advancing and retracting drive mechanism transfer arm transfer arm processing area processing area transfer area 200836993 CR substrate transfer robot CRH substrate transfer robot body FFU fan Filter unit_ ID Loader IR Load robot IRH Load robot body MP1~MP8 Processing unit PS Substrate support unit S S Handover side T direction U direction V direction VI Advance and retreat direction V2 Advance and retreat direction W Substrate • 97100774 39

Claims (1)

200836993 十、申請專利範圍: 1· 一種基板處理裝置,用以處理具有一面及另一面的基 板;其具備有: 處理基板的處理區域; 對上述處理區域搬入及搬出基板的搬入搬出區域;以及 在上述處理區域與上述搬入搬出區域之間交接基板的 交接部; 而上述搬入搬出區域包含有: 谷益載置部,其載置用以收納基板的收納容器;及 第1搬送裝置,其在載置於上述容器載置部之收納容器 與上述交接部之間搬送基板; 上述處理區域包含有: 處理部’其對基板施以處理;及 第2搬送I置,其在上述交接部與上述處理部之間搬送 基板; 上述交接部包含有: 反轉機構,其使基板一面與另一面相互反轉;及 壯移動機構,其移動上述反轉機構,而可在上述第丨搬送 裝置與上述反轉機構之間交接基板,並可在上述第2搬送 裝置與上述反轉機構之間交接基板。 2.如申請專利範圍第丨項之基板處理裝置,豆中,上述 移動機構中,上述反轉機構沿水平方向往復直線移動,而 =返於可在上述第!搬送裝置與上述反轉機構之間交接 土板的位置處,以及可在上述第2搬送裝置與上述反轉機 97100774 200836993 構之間交接基板的位置處。 3.如申睛專利㈣第〗項之基板處理裝置,其中, 詈二!、1搬送裝置具有第1支持部,其支持基板並且設 1芙i ΐ’而上述第1支持部在其與上述反轉機構心 接基板I相對於上述反轉機構沿著第!進退方向進 上述第2搬送裝置具有帛2支持 置為可進退,而上述第2支持部在其與上== ς接基板時,相對於上述反轉機構沿著第2進退方向進· 、上述移動機構使上述旋轉機構圍繞與朝向上 退方向之第1交接方向及朝向上述第2進退方向之” 接方向大致垂直之方向的軸而旋轉移動。 乂 4. 如申請專利範圍第3項之基板處理裝置,其 反轉機構被配置成上述第!交接方向與上述第2、交接2 之間的旋轉角度為180度。 " 5. 如申請專利範圍第3項之基板處理裝置,其 反轉機構被配置成上述第i交接方向與上述第2方: 之間的旋轉角度小於18〇度。 " 6·如申請專利範圍第5項之基板處理裝置,盆 第1搬送裝置設置成可沿第丨軸方向平 述 上述第1軸方向正交的第2軸方向之狀態下,對戴== t器载置部的收納容器收納及取出基板,在朝向愈上述 弟2軸方向之間夹角小於18〇度之第3軸方向的狀離下 97100774 200836993 對上述反轉機構交接基板。 7· —種基板處理 # 基板施以處理.自〜’猎由具備下列的基板處理裝置對 出區域·包人卢器载置部及第1搬送裝置的搬入搬 == 部及第2搬送裝置的處理區域;以及在 部^=與上34搬人搬出區域之間交接基板的交接 邛,該基板處理方法具備有: 藉由上述第1搬送裝置,從載置於上述衮哭恭¥卹沾价 納容器取出處理前^ ^ 述μ載置部的收 交接部之步驟; 將所取出的處理前基板交給上述 j上述又接部中藉由反轉機構使處理前基板之一面與 另一面相互反轉,同時移動上述反轉機構,使可從上述反 轉,構對上述第2搬送裝置交接處理前基板之步驟; ,藉由上述第2搬送裝置將處理前基板從上述交接部搬 送至上述處理部之步驟; 在上述處理部中處理處理前基板之步驟; • 將經上述處理部處理的處理後基板藉由上述第2搬送 衣置攸上述處理部搬送至上述交接部之步驟; 在上述交接部中藉由上述反轉機構使處理後基板之另 一面與一面相互反轉,同時移動上述反轉機構,使可從交 接部對上述第1搬送裝置交接處理後基板之步驟;以及 _ 藉由上述第1搬送裝置,從上述交接部收取處理後基 板,將所收取的處理後基板收納於上述收納容器之步驟。 97100774 42200836993 X. Patent Application Range: 1. A substrate processing apparatus for processing a substrate having one surface and the other surface; comprising: a processing region for processing the substrate; a loading/unloading region for loading and unloading the substrate into the processing region; The processing area and the loading/unloading area are transferred to a delivery portion of the substrate; and the loading/unloading area includes a gusset mounting unit on which a storage container for accommodating the substrate is placed, and a first conveying device placed on the substrate The storage container of the container placing portion and the transfer portion transport the substrate; the processing region includes: a processing portion that performs a process on the substrate; and a second transfer I that is disposed between the transfer portion and the processing portion The transfer unit includes: a reversing mechanism that reverses one surface of the substrate and the other surface; and a strong moving mechanism that moves the reversing mechanism to the first and second reversing mechanisms The substrate is transferred between the substrates, and the substrate can be transferred between the second transfer device and the reversing mechanism. 2. The substrate processing apparatus according to claim 2, wherein in the moving mechanism, the reversing mechanism reciprocates linearly in a horizontal direction, and = returns to the above-mentioned first! A position where the earthing plate is transferred between the conveying device and the reversing mechanism, and a position at which the substrate can be transferred between the second conveying device and the reversing machine 97100774 200836993. 3. The substrate processing apparatus according to claim 4, wherein the transfer device has a first support portion that supports the substrate and is provided with a first support portion and the first support portion The reversing mechanism is connected to the substrate I with respect to the above-mentioned reversing mechanism! In the advancing and retracting direction, the second conveying device has a 帛2 support to be advanced and retractable, and the second supporting portion advances along the second advancing and retracting direction with respect to the reversing mechanism when the substrate is connected to the upper== The moving mechanism rotationally moves the rotating mechanism about an axis that is substantially perpendicular to a direction in which the first transfer direction is in the upward direction and a direction in which the second advancing and retracting directions are perpendicular to each other. In the processing apparatus, the reversing mechanism is disposed such that the rotation angle between the first delivery direction and the second and second delivery 2 is 180 degrees. 5. The substrate processing apparatus of claim 3 is reversed. The mechanism is configured such that the rotation angle between the ith intersection direction and the second party: is less than 18 degrees. " 6. According to the substrate processing apparatus of claim 5, the first conveyor of the basin is set to be along In the state in which the second axis direction of the first axis direction is orthogonal to the second axis direction of the first axis direction, the storage container of the wearer==t device mounting portion is housed and taken out, and the substrate is sandwiched between the two axes. Angle less than 18 In the direction of the third axis of the degree, the lower side of the 97100774 200836993 is the substrate for the above-mentioned reversing mechanism. 7·---------------------------------------------------------------------------------------------------------------------- The processing unit of the loading and unloading unit of the first transport unit and the second transport unit, and the transfer of the substrate between the unit and the upper and lower loading and unloading areas, the substrate processing method includes : the step of transferring the receiving portion of the μ mounting portion before the processing of the squeezing and squeezing container is carried out by the first conveying device; and the pre-processed substrate taken out is delivered to the above In the above-mentioned joint portion, the one surface and the other surface of the front substrate are reversed by the reversing mechanism, and the reversing mechanism is moved so that the second transfer device can be transferred from the front substrate to the front substrate. a step of transferring the pre-processed substrate from the delivery unit to the processing unit by the second transfer device; a step of processing the pre-processed substrate in the processing unit; • processing by the processing unit a step of transporting the processed substrate to the transfer unit by the second transfer device, wherein the transfer unit rotates the other surface of the processed substrate and the surface thereof by the reversing mechanism a reversing mechanism for transferring the processed substrate to the first conveying device from the delivery portion; and ??? receiving, by the first conveying device, the processed substrate from the delivery portion, and storing the processed substrate after the processing The above steps of accommodating the container. 97100774 42
TW097100774A 2007-01-15 2008-01-09 Substrate processing apparatus and substrate processing method TWI341820B (en)

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US20080170931A1 (en) 2008-07-17
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