TWI588927B - Substrate transferring apparatus, processing equipment and method for picking and desposing substrate - Google Patents

Description

Transfer substrate device, process equipment and method for picking and placing substrates

The present invention relates to a substrate transfer device, a process device, and a method for picking and placing a substrate, and more particularly to a transfer substrate capable of eliminating air between the substrate and the platform and damaging the substrate and the platform. Device, process equipment, and method of picking up and placing a substrate.

In the manufacturing process of the modern high-tech industry, the substrate needs to go through multiple processing procedures, such as cleaning, etching, coating, development, etc., so a substrate transfer device is used to transport the substrate to different processing places for processing.

In the exposure process, due to the process relationship, the substrate must be closely attached to the platform of the exposure machine to avoid the difference in exposure caused by the distance between the substrate and the reticle being affected by the air. In addition, if holes or grooves cannot be provided on the platform of the exposure machine to extract air between the platform and the substrate, only the side between the substrate and the platform can be evacuated, so that the substrate is closely attached to the exposure machine. platform.

Compared with the conventional rigid substrate, when the flexible substrate is placed on the platform, the flexible substrate and the platform tend to leave more air. Then, on the side between the flexible substrate and the platform After pumping, the air between the edge of the flexible substrate and the platform is expelled, causing the edge of the flexible substrate to fit snugly against the platform. However, the air between the center of the flexible substrate and the platform cannot be evacuated, so that the substrate is unevenly exposed. In addition, when the exposure process is completed, the flexible substrate and the platform of the exposure machine are in a vacuum-like emergency bonding state, so when the flexible substrate is taken up on the platform, it takes a large amount of force and a long time, thus Increase process difficulty and extend process time. In addition, when the platform is urgently attached to the flexible substrate, it takes a lot of effort to take up the flexible substrate, which easily causes the soft substrate to rupture and reduces the process yield.

The object of the present invention is to effectively improve the catching effect between the substrate and the platform, thereby reducing the air content between the substrate and the platform.

Another object of the present invention is to eliminate the vacuum state between the substrate and the platform to achieve a vacuum-destroying state, thereby reducing the time for picking up and dropping the substrate.

A further object of the present invention is to reduce the time required for subsequent pumping between the substrate and the platform, and to substantially reduce the time for picking up the substrate after the end of the process, which not only shortens the station operation time, but also A large number of improved overall production of the process.

The invention provides a transfer substrate device for picking up and placing a substrate on a platform. The transfer substrate device comprises a first adsorption assembly, a second adsorption assembly, a rod body and a link assembly. The first adsorption component and the second adsorption component are respectively located on opposite sides of the platform, and the first adsorption component and the second adsorption component respectively adsorb a first side and a second side of the substrate, the first side and the first side The two side edges are opposite side edges of the substrate, and the first adsorption component and the second adsorption component each comprise at least one adsorption component, and each adsorption component is separated from the platform by a first distance. The rod is located in the first adsorption Between the component and the second adsorption component, the rod end is separated from the platform by a second distance, the rod body has a moving path, the rod body approaches or moves away from the platform along the moving path, and the rod body abuts on the platform along the moving path At a center of the substrate, and bringing the substrate closer to or away from the platform, wherein the center on the substrate is between the first side and the second side. The connecting rod assembly is located between the rod body, the first adsorption assembly and the second adsorption assembly, the connecting rod assembly is connected to the first adsorption assembly and the second adsorption assembly, and is linked with the rod body, wherein the connecting rod assembly is used to make opposite sides of the substrate Presenting a warp, the link assembly has a first position and a second position according to the moving path of the rod body. When the link assembly is in the first position, the link assembly drives the first adsorption assembly and the second adsorption assembly to The first distance is greater than the second distance, and when the link assembly is in the second position, the link assembly drives the first adsorption assembly and the second adsorption assembly such that the first distance is equal to the second distance.

An embodiment of the invention provides a process apparatus including a platform, a negative pressure source, and a transfer substrate device. The platform is provided with a fluid passageway around the platform and communicating the gap between the platform and the substrate. The negative pressure source provides a fluid passage that is negatively pressed to the platform to closely conform the platform to the substrate. The transfer substrate device is used for picking up and placing a substrate on the platform. The transfer substrate device comprises a first adsorption assembly, a second adsorption assembly, a rod body and a link assembly. The first adsorption component and the second adsorption component are respectively located on opposite sides of the platform, and the first adsorption component and the second adsorption component respectively adsorb a first side and a second side of the substrate, the first side and the first side The two side edges are opposite side edges of the substrate, and the first adsorption component and the second adsorption component each comprise at least one adsorption component, and each adsorption component is separated from the platform by a first distance. The rod body is located between the first adsorption assembly and the second adsorption assembly, the rod end is separated from the platform by a second distance, the rod body has a moving path, and the rod body approaches or moves away from the platform along the moving path, and the rod body moves along the moving path And abutting at a center of the substrate on the platform, and bringing the substrate closer to or away from the platform, the center of the substrate is located at the first side and the first Between the two sides. The connecting rod assembly is located between the rod body, the first adsorption assembly and the second adsorption assembly, the connecting rod assembly is connected to the first adsorption assembly and the second adsorption assembly, and is linked with the rod body, wherein the connecting rod assembly is used to make opposite sides of the substrate Presenting a warp, the link assembly has a first position and a second position according to the moving path of the rod body. When the link assembly is in the first position, the link assembly drives the first adsorption assembly and the second adsorption assembly to The first distance is greater than the second distance, and when the link assembly is in the second position, the link assembly drives the first adsorption assembly and the second adsorption assembly such that the first distance is equal to the second distance.

An embodiment of the present invention provides a method for picking up and placing a substrate, which is suitable for picking up or placing a substrate on a platform. The method for picking and placing a substrate includes the following steps. Adsorbing a first side and a second side of the substrate, and applying a force to a center on the substrate, the first side and the second side are respectively located on opposite sides of the substrate, and the center of the substrate is at the first Between the side and the second side. Continuously applying force to the center of the substrate, and warping the first side and the second side of the substrate relative to the center, wherein the first and second sides of the substrate are respectively separated from the platform by a third distance, and the substrate The central portion is separated from the platform by a fourth distance, and the third distance is greater than the fourth distance.

Based on the above, in the method for transferring a substrate and the method for picking and placing a substrate according to the present invention, the first side of the substrate is respectively adsorbed by the first adsorption unit and the second adsorption unit, and the rod body is continuously applied to the center of the substrate. Where the opposite side edges of the substrate are warped relative to the center. In this way, in the process of placing the substrate on the platform, the center of the substrate is first connected to the platform, and then the rod body is linked to the connecting rod assembly to make the substrate gradually horizontal until the platform is attached. The air between the substrate and the platform is gradually ejected from the center of the substrate to the opposite sides of the substrate, thereby effectively improving the catching effect between the substrate and the platform, thereby reducing the air content between the substrate and the platform. On the other hand, in the process of picking and placing the substrate on the platform, the substrate is continuously applied The center of the substrate is such that the opposite sides of the substrate are warped with respect to the center and the center of the substrate is continuously connected to the platform, and the air is allowed to enter from the gap between the platform and the first side and the second side. The vacuum state between the substrate and the platform is eliminated to reach a vacuum state, thereby reducing the time for picking up the substrate.

Furthermore, in the process equipment, by transferring the substrate device and the method of picking and placing the substrate, the air content between the substrate and the platform when the substrate is placed on the platform can be greatly reduced, and the time required for subsequent pumping can be reduced. In turn, the station operation time can be shortened, and the production can be increased in a large amount. On the other hand, by transferring the substrate device and the method of picking up and dropping the substrate, the vacuum state between the substrate surfaces can be first removed, so that the time for picking up the substrate is shortened, and the process can be reduced after the process processing (such as exposure). Substrate transfer time for the next process.

10‧‧‧Processing equipment

20‧‧‧Substrate

22‧‧‧ first side

24‧‧‧Second side

26‧‧‧Central Office

28‧‧‧ third side

29‧‧‧ fourth side

30‧‧‧Exposure source

40‧‧‧Negative pressure source

50‧‧‧ platform

52‧‧‧ fluid passage

100‧‧‧Transfer substrate device

110‧‧‧First adsorption assembly

112, 122‧‧‧ adsorbing parts

120‧‧‧Second adsorption assembly

130‧‧‧plate

140, 240‧‧‧ rods

150, 250‧‧‧ linkage components

252‧‧‧Fixed housing

254‧‧‧Active bearing housing

256‧‧‧ Connecting rod

160‧‧‧Flexible components

170‧‧‧ linkage structure

180‧‧‧Limiting components

190‧‧‧Roller

280‧‧‧Power source

D1‧‧‧first distance

D2‧‧‧Second distance

P‧‧‧Moving path

S100, S200‧‧‧ pick and place substrate method

S110~S140, S230‧‧‧ steps

1 to FIG. 3 are schematic diagrams showing the process of picking up and dropping a substrate of a substrate transfer device in a process device of the present invention.

4 is a top plan view of the substrate placed on the platform.

5 to FIG. 8 are schematic diagrams showing the flow of placing a substrate on a platform in a process substrate device in the process device of the present invention.

9 to FIG. 13 are schematic diagrams showing the flow of the substrate transfer device on the platform in the process device of the present invention.

FIG. 14 is a schematic diagram of a process device according to another embodiment of the present invention.

FIG. 15 is a schematic diagram of a process device according to another embodiment of the present invention.

FIG. 16 is a flow chart of placing a substrate on a platform in the method for picking and placing substrates according to the present invention.

17 is a flow chart of picking up a substrate on a platform in the method for picking and placing substrates according to the present invention.

Fig. 18 is a plan view showing an application example of a configuration of a transfer substrate device of the present invention.

Fig. 19 is a plan view showing another configuration example of the transfer substrate device of the present invention.

Fig. 20 is a plan view showing still another application example of the transfer substrate device of the present invention.

The specific embodiments of the present invention are further described below in conjunction with the drawings and embodiments. The following examples are only used to more clearly illustrate the technical solutions of the present invention, and are not intended to limit the scope of the present invention.

1 to FIG. 3 are schematic diagrams showing the process of picking up and dropping a substrate of a substrate transfer device in a process device of the present invention.

Referring to FIG. 1 , the process device 10 of the embodiment is, for example, an exposure machine or a coater.

In the present embodiment, the process device 10 includes a transfer substrate device 100, a platform 50, and a negative pressure source 40.

The transfer substrate device 100 includes a first adsorption assembly 110, a second adsorption assembly 120, a rod 140 and a link assembly 150. The first adsorption component 110 and the second adsorption component 120 are respectively located on opposite sides of the platform 50. The first adsorption component 110 and the second adsorption component 120 are respectively configured to respectively adsorb a first side 22 and a second side of the substrate 20. Side 24, wherein first side 22 and second side 24 are opposite side edges of substrate 20.

The first adsorption assembly 110 includes at least one first adsorption member 112, and the second adsorption assembly 120 includes at least one second adsorption member 122, and each of the first and second adsorption members 112, 122 respectively The platform 50 is separated by a first distance d1. In this embodiment, the first and second adsorbing members 112, 122 are, for example, one or more suction cups. However, the present invention is not limited thereto. In other embodiments, the adsorbing member is, for example, one or more magnetic components (a attracting magnet or a magnet and an object that can be magnetized). The magnetic components are disposed on opposite planes of the substrate 20 for sandwiching the substrate 20.

The rod body 140 is located between the first adsorption assembly 110 and the second adsorption assembly 120. The rod body 140 is separated from the platform 50 by a second distance d2. The rod body 140 has a moving path P, and the rod body 140 moves along the movement path P. Approaching or moving away from the platform 54. The end of the rod 140 can be connected to a power source (not shown). The power source is, for example, a cylinder or a servo motor, and the power source drives the rod body 140 to move along the moving path P. In the present embodiment, the rod body 140 abuts a central portion 26 of the substrate 20 above the platform 50 along the moving path P, and brings the substrate 20 close to the platform 50 or away from the platform 50, wherein the center portion 26 on the substrate 20 is located at the center Between one side 22 and the second side 24.

The connecting rod assembly 150 is located between the rod body 140, the first adsorption assembly 110 and the second adsorption assembly 120. The connecting rod assembly 150 connects the first adsorption assembly 110 and the second adsorption assembly 120, and is coupled with the rod 140, and the connecting rod assembly 150 is used to cause warping of opposite sides of the substrate 20.

This embodiment does not limit the type of the link assembly 150. For example, the type of the link assembly 150 is, for example, a rod member, and the number of the rod members is, for example, two, and one end of the two rod members is respectively connected to the rod body. 140, and the other ends of the two rods are respectively connected to the first adsorption assembly 110 and the second adsorption assembly 120. In addition, the manner in which the link assembly 150 is coupled to the rod body 140 is not limited. For example, the rod body 140 and the link assembly 150 are moved in such a manner that the slide rail and the chute cooperate.

The link assembly 150 has a first position and a second position according to the moving path P of the rod 140. When the connecting rod assembly 150 is in the first position as shown in FIG. 1 , the connecting rod assembly 150 drives the first adsorption assembly 110 and the second adsorption assembly 120 such that the first distance d1 is greater than the second distance d2. That is, the link assembly 150 serves to warp the opposite sides of the substrate 20. As shown in FIG. 2, when the link assembly 150 is in the second position, the substrate 20 is laid flat on the platform 50, and the link assembly 150 drives the first adsorption assembly 110 and the second adsorption assembly 120 such that the first distance d1 is equal to the second The distance d2, that is, when the link assembly 150 is in the second position, the opposite sides of the substrate 20 assume a parallel state.

Under the above configuration, in the process of placing the substrate 20 to the platform 50 as shown in FIG. 1 to FIG. 2, the rod body 140 first abuts the center of the substrate 20 above the platform 50 along the moving path P as shown in FIG. At 26, and the substrate 20 is brought close to the platform 50, then the link assembly 150 drives the first adsorption assembly 110 and the second adsorption assembly 120 to bring the opposite sides of the substrate 20 into a parallel state as shown in FIG. 2, and the air is supported by the substrate. The central portion 26 of the 20 is gradually discharged from the first and second side edges 22, 24, so that the air between the substrate 20 and the stage 50 can be effectively eliminated.

Please refer to FIG. 2 and refer to FIG. 4 at the same time. FIG. 4 is a schematic top view of the substrate placed on the platform. In the present embodiment, the material of the platform 50 is, for example, quartz, metal or marble material. The platform 50 is provided with a fluid passage 52 that is located around the platform 50 and that communicates the gap between the platform 50 and the substrate 20.

When the link assembly 150 is in the second position and the substrate 20 is placed flat on the platform 50 as shown in FIG. 2, the negative pressure source 40 provides a fluid passage 52 that is negatively pressed against the platform 50 to bring the platform 50 into close contact with the substrate 20. Due to the placement of the substrate 20 into the platform 50 as shown in FIGS. 1 to 2, air is gradually discharged from the central portion 26 of the substrate 20 from the first side 22 and the second side 24, thereby lowering the substrate 20 and the platform. The air content between 50, which in turn reduces the time required for the subsequent source of negative pressure 40 to pump the substrate 50.

After the substrate 20 is closely attached to the platform 50, the substrate 20 is subjected to, for example, an exposure process. Next, as shown in FIG. 3, the link assembly 150 drives the first adsorption assembly 110 and the second adsorption assembly. 120, the opposite sides of the substrate 20 are warped, thereby breaking the close contact between the substrate 20 and the platform 30, thereby eliminating the vacuum state between the substrate 20 and the surface of the platform 50, thereby shortening the time for picking up the substrate 20.

5 to FIG. 8 are schematic diagrams showing another embodiment of a substrate on which a substrate is transferred on a platform in a process device of the present invention. It should be noted that the process device 10 of FIG. 5 to FIG. 8 is similar to the process device 10 of FIGS. 1 to 5, wherein the same components are denoted by the same reference numerals and have the same functions and will not be repeatedly described. At the office.

In the case of FIG. 5, the transfer substrate device 100 further includes a plate member 130, a resilient member 160, a linkage structure 170 or a stop member 180. However, the present invention is not limited thereto, and the transfer substrate device 100 can selectively configure the plate member 130, the elastic member 160, the interlocking structure 170, or the limiting member 180. In other words, the user may consider setting one or a combination of the above-mentioned selectively configurable objects, depending on the actual process equipment.

The rod body 140 is disposed through the plate member 130.

The connecting rod assembly 250 is located between the plate member 130, the rod body 140, the first adsorption assembly 110 and the second adsorption assembly 120, the plate member 130 is coupled to the connecting rod assembly 250, and the connecting rod assembly 250 is coupled to the first adsorption assembly 110 and the first The second adsorption assembly 120 is coupled to the rod 140.

In detail, the linkage assembly 250 of FIG. 5 differs from the linkage assembly 150 of FIGS. 1-3 in that the linkage assembly 250 includes a fixed bearing housing 252, a movable bearing housing 254, and a connecting rod 256. The fixed bearing housing 252 is coupled to the plate member 130. The movable bearing housing 254 is disposed between the first adsorption assembly 110 and the second adsorption assembly 120, and the connecting rod 256 is disposed between the fixed bearing housing 252 and the movable bearing housing 254.

The elastic member 160 is disposed on the rod body 140. The elastic member 160 is used to buffer the force applied by the rod body 140 on the substrate 20, and the force required to provide the rod body 140 to be reset.

The interlocking structure 170 is, for example, a resilient metal piece, and the interlocking structure 170 is coupled to the first adsorption assembly 110 and the second adsorption assembly 120. In this embodiment, as shown in FIG. 5, the interlocking structure 170 and the substrate 20 are in contact with each other, and the interlocking structure 170 drives the angle between the first adsorption assembly 110 and the rod 140, which is equal to the second adsorption assembly 120 and the rod 140. The angle between the two.

The limiting element 180 is disposed on the rod body 140, and the limiting element 180 is used to restrict the moving path P of the rod body 140.

9 to FIG. 13 are schematic diagrams showing the flow of the substrate transfer device on the platform in the process device of the present invention. 9 to FIG. 13 is a process device 10 similar to the process device 10 of FIGS. 5 to 8, wherein the same elements are denoted by the same reference numerals and have the same functions and will not be repeatedly described. At the office. Referring to FIG. 9, after an exposure source 30 performs an exposure process on the substrate 20, FIGS. 10 to 13 illustrate a process of picking up the substrate 20 on the stage 50 by the transfer substrate device 100 of the present embodiment, wherein FIG. 11 to FIG. The process of picking up the substrate 20 from the platform 50, the link assembly 150 drives the first adsorption assembly 110 and the second adsorption assembly 120 to gradually warp the opposite sides of the substrate 20, thereby breaking between the substrate 20 and the platform 30. The film is tightly bonded to eliminate the vacuum state between the substrate 20 and the surface of the platform 50, thereby shortening the time for picking up the substrate 20.

Please refer to FIG. 14, which is a schematic diagram of a process device according to another embodiment of the present invention. It should be noted that the process device 10 of FIG. 14 is similar to the process device 10 of FIGS. 5 to 13, wherein the same elements are denoted by the same reference numerals and have the same functions and will not be repeatedly described. Only the differences will be described below. In the case of FIG. 14, the transfer substrate device 100 further includes a roller 190. The linkage structure 170 is located between the roller 190 and the rod 140, and the roller 190 is coupled to the rod 140. In this configuration, the first adsorption component 110 and the second adsorption component 120 respectively adsorb the first side 22 and the second side 24 of the substrate 20, and the roller 190 abuts the center 26 of the substrate 20 to avoid the rod 140. Apply to force The case where the substrate 20 is destroyed at the center 26 on the substrate 20.

Please refer to FIG. 15. FIG. 15 is a schematic diagram of a process device according to another embodiment of the present invention. It should be noted that the process device 10 of FIG. 15 is similar to the process device 10 of FIGS. 5 to 13, wherein the same components are denoted by the same reference numerals and have the same functions and will not be repeatedly described. Only the differences will be described below. In the case of FIG. 15, the transfer substrate device 100 includes a power source 280, and the rod 240 is a screw, and the power source 280 is coupled to the rod 240. The power source 280 is, for example, a cylinder or a servo motor, and the power source 280 drives the rod body 240 to move along the movement path P.

FIG. 16 is a flow chart of placing a substrate on a platform in the method for picking and placing substrates according to the present invention. Please refer to Figure 16. The pick-and-place substrate method S100 of the present embodiment is suitable for placing the substrate 20 as shown in FIG. 1 or FIG. 5 on the platform 50.

The pick-and-place substrate method S100 includes the following steps S110 to S140.

In step S110, the first side 22 and the second side 24 of the substrate 20 are adsorbed and applied to the center 26 on the substrate 20, wherein the first side 22 and the second side 24 are respectively located at the opposite side of the substrate 20. On both sides, the center portion 26 of the substrate 20 is located between the first side 22 and the second side 24.

For example, as shown in FIG. 1 or FIG. 5, the first adsorption component 110 and the second adsorption component 120 respectively adsorb the first side 22 and the second side 24 of the substrate 20, and can be moved along the rod 140. The path P is applied to the center 26 on the substrate 20.

In another implementation, as shown in FIG. 15, the rod 240 is a screw, and the power source 280 drives the rod 240 to move along the moving path P.

Step S120 is performed, as shown in FIG. 1 , continuously applying force to the center 26 of the substrate 20 , and warping the first side 22 and the second side 24 of the substrate 20 relative to the center 26 , wherein the substrate 20 The one side 22 and the second side 24 are respectively separated from the platform 50 by a third distance, and the substrate 20 The central portion 26 is spaced apart from the platform 50 by a fourth distance, the third distance being greater than the fourth distance.

In various embodiments, as shown in FIG. 5, when the rod 140 is applied to the center 26 on the substrate 20 along the moving path P, the elastic member 160 is continuously stretched until the limiting member 180 is pressed by the plate member 130. Blocked, at the same time, the link assembly 150 will interlock with the rod 140 such that the movable bearing block 154 and the connecting rod 156 are retracted toward the rod 140, so that the first side 22 and the second side of the substrate 20 24 is bent relative to the central portion 26 to assume a curved state, and the interlocking structure 170 drives the angle between the first adsorption assembly 110 and the rod 140, which is equal to the angle between the second adsorption assembly 120 and the rod 140, that is, the substrate 20 The angle at which the first side edge 22 and the second side edge 24 are warped relative to the center portion 26 is the same.

It should be noted that, the first distance d1 and the third distance shown in FIG. 1 or FIG. 5 differ only in the thickness of the substrate 20, and similarly, the difference between the second distance d2 and the fourth distance is only in the substrate 20. thickness of.

Moreover, in a further embodiment, in the case of FIG. 14, the roller 190 can be designed to contact the center 26 of the substrate 20.

Step S130 is performed, as shown in FIG. 3 or FIG. 6, the center portion 26 of the substrate 20 is spliced to the platform 50.

Step S140 is performed to gradually adhere the substrate 20 along the center portion 26 to the first side edge 22 and the second side edge 24 to the platform 50.

In the process of FIGS. 6-8, when the center portion 26 of the substrate 20 is spliced to the platform 50, the elastic member 160 is used to buffer the force exerted on the substrate 20 by the rod 140, and the link assembly 150 is coupled with The rod body 140 is interlocked, so that the movable bearing seat 154 and the connecting rod 156 are outwardly expanded toward the rod body 140, so that the substrate 20 is gradually horizontally applied until it is attached to the platform 50 as shown in FIG. The air between the substrate 20 and the platform 50 is also gradually ejected from the central portion 26 of the substrate 20 toward the first side 22 and the second side 24, thereby effectively enhancing the catching effect between the substrate 20 and the platform 50.

Next, the negative pressure source 40 provides a negative pressure to the fluid passage 52 of the platform 50 to bring a vacuum between the platform 50 and the substrate 20 to enable the substrate 20 to be closely attached to the platform for subsequent processing (such as exposure).

As shown in FIG. 9, after the exposure source 30 performs an exposure process on the substrate 20, the substrate 20 can be taken up on the stage 50 by the transfer substrate device 100. A method of taking up the substrate 20 on the stage 50 will be described below with reference to FIG.

17 is a flow chart of picking up a substrate on a platform in the method for picking and placing substrates according to the present invention. Please refer to Figure 17. The pick-and-place substrate method S200 of the present embodiment is suitable for picking up the substrate 20 as shown in FIG. 7 on the platform 50. It should be noted that the method of picking and placing the substrate of FIG. 17 is similar to the method of picking and placing the substrate of FIG. 16 , wherein the same steps are denoted by the same reference numerals and have the same functions, and the description is not repeated, and only the differences will be described below.

In step S110, as shown in FIG. 10, the first side 22 and the second side 24 of the substrate 20 are adsorbed and applied to the center 26 on the substrate 20.

In the step S120, as shown in FIGS. 11 to 12, the center 26 of the substrate 20 is continuously applied, and the first side 22 and the second side 24 of the substrate 20 are warped with respect to the center 26. Since the center portion 26 of the substrate 20 is still continuously spliced to the platform 50 at this time, air is allowed to enter from the gap between the platform 50 and the first side 22 and the second side 24 to eliminate the gap between the substrate 20 and the platform 50. The vacuum state, thereby reducing the suction time of the substrate 20. Next, step S230 is performed to move the substrate 20 away from the platform 50 as shown in FIG.

It should be noted that the composition of the transfer substrate device 100 of the embodiment does not have to be For this reason, various numbers and types of transfer substrate devices 100 are used in accordance with the requirements of different processes, the tension of the substrate 20, and the weight of the substrate 20, and the substrate for picking and placing the substrate of the present embodiment is achieved in an appropriate arrangement.

The following is illustrated by way of example in FIGS. 18 to 20.

Fig. 18 is a plan view showing an application example of a configuration of a transfer substrate device of the present invention. Please refer to Figure 18.

The substrate 20 has a first side 22, a second side 24, a third side 28 and a fourth side 29, wherein the first side 22 and the second side 24 are opposite sides of the substrate 20, and The three side edges 28 and the fourth side edges 29 are opposite sides of the substrate 20. In FIG. 18, the first and second side edges 22 and 24 are the upper and lower sides of the substrate 20, and the third and the third sides are The four side edges 28, 29 are the left and right side edges of the substrate 20.

For example, with respect to the transfer substrate device 100 of FIGS. 1 to 3, the transfer substrate device 100 is disposed on the substrate 20, and the rod body 140 and the link assembly 150 are located in the middle of the substrate 20, and the first adsorption assembly 110 and the second adsorption component 120 are respectively located on the first side 22 and the second side 24 of the substrate 20, and the first adsorption members 112 of the first adsorption component 110 adsorb the first side 22 of the substrate 20, and the second adsorption Each of the second adsorbing members 122 of the assembly 110 adsorbs the second side 24 of the substrate 20.

Of course, the transfer substrate device 100 can further be used in the form of the link assembly 250 as shown in FIGS. 5 to 15. In addition, the transfer substrate device 100 can be selectively selected by one or a combination of the configuration plate member 130, the elastic member 160, the interlocking structure 170, or the limiting member 180, depending on the actual process equipment.

The above is a single transfer substrate device 100 as an example.

Fig. 19 is a plan view showing another configuration example of the transfer substrate device of the present invention. please See Figure 19. It is to be noted that FIG. 19 is similar to FIG. 18, in which the same elements are denoted by the same reference numerals and the same functions are not repeated, and only the differences will be described below.

The transfer substrate device 100 is used in two groups, and the transfer substrate device 100 is disposed on the third side 28 and the fourth side 29 of the substrate 20, respectively, and the first adsorption members 112 of the first adsorption assembly 110 are adsorbed. The first side 22 of the substrate 20 and the second adsorbing members 122 of the second adsorption assembly 110 adsorb the second side 24 of the substrate 20.

Fig. 20 is a plan view showing still another application example of the transfer substrate device of the present invention. Please refer to Figure 20. It is to be noted that FIG. 20 is similar to FIG. 19, in which the same elements are denoted by the same reference numerals and the same functions are not repeated, and only the differences will be described below.

The transfer substrate device 100 is used in a plurality of groups, wherein the two transfer substrate devices 100 are respectively disposed on the third side 28 and the fourth side 29 of the substrate 20, and the set of transfer substrate devices 100 are disposed on the substrate. In the middle of 20, each of the first adsorption members 112 of the first adsorption assembly 110 adsorbs the first side 22 of the substrate 20, and each of the second adsorption members 122 of the second adsorption assembly 110 adsorbs the second side 24 of the substrate 20. However, in the embodiment not shown, the plurality of sets of transfer substrate devices 100 may be selectively disposed inside the substrate 20, and the substrate 20 tension and the substrate 20 weight may be selected to select different numbers of transfer substrates. Device 100.

In addition, the size of the substrate also affects the configuration of the transfer substrate device 100. In the actual process, the size of the substrate can be selectively used according to the actual substrate 20 tension or the weight of the substrate 20. The configuration of 19 is to absorb small-sized substrates. In the case of a medium-sized substrate, the arrangement of FIG. 19 can be used. Moreover, in the case of a large-sized substrate, in order to avoid the intermediate portion (or internal region) of the large-sized substrate, the substrate is adsorbed in comparison with the medium-sized substrate. When the time is broken, it is necessary to use the configuration of Figure 20 (such as one or more sets of transfer substrate devices) 100) to adsorb the middle portion (or inner region) of the large-sized substrate, thereby improving the adsorption force of the entire substrate 20.

In the above, in the method of transferring the substrate and the method of picking and placing the substrate, the first adsorption component and the second adsorption component respectively adsorb the opposite sides of the substrate, and the substrate is continuously applied to the substrate. At the center of the substrate, the opposite side edges of the substrate are warped relative to the center. In this way, in the process of placing the substrate on the platform, the center of the substrate is first connected to the platform, and then the rod body is linked to the connecting rod assembly to make the substrate gradually horizontal until the platform is attached. The air between the substrate and the platform is gradually ejected from the center of the substrate to the opposite sides of the substrate, thereby effectively improving the catching effect between the substrate and the platform, thereby reducing the air content between the substrate and the platform.

On the other hand, during the process of picking up and placing the substrate on the platform, the air is continuously spliced relative to the center due to the continuous application of the center of the substrate, and the center of the substrate is continuously connected to the platform. The platform enters the gap between the first side and the second side to eliminate the vacuum between the substrate and the platform to achieve a vacuum-breaking state, thereby reducing the time for picking up and dropping the substrate.

Furthermore, the interlocking structure of the transfer substrate device is connected to the adsorption assembly, so that the interlocking structure drives the angle between the two adsorption assemblies and the rod body to be the same, thereby ensuring that the opposite sides of the substrate are warped to the same extent with respect to the center. This is to avoid the difference in the degree of vacuum pumping from the center of the substrate to the opposite sides of the substrate during the process of placing the substrate, or to avoid the vacuum on both sides of the substrate, or to avoid the air being used by the platform during the process of picking and placing the substrate. The gap between the first side and the second side enters to a different extent, causing a difference in vacuum on both sides of the substrate.

Further, the transfer substrate device is provided with a limiting component by adjusting the limiting component The position of the rod is limited to the movement path of the rod body, so that the degree of warpage of the substrate can be driven according to different processes, thereby achieving different catching effects.

In the process equipment, by transferring the substrate device and the method of picking and placing the substrate, the air content between the substrate and the platform when the substrate is placed on the platform can be greatly reduced, and the time required for subsequent pumping can be reduced, thereby being shortened. The station is active and can increase production in large quantities. On the other hand, by transferring the substrate device and the method of picking up and dropping the substrate, the vacuum state between the substrate surfaces can be first removed, so that the time for picking up the substrate is shortened, and the process can be reduced after the process processing (such as exposure). Substrate transfer time for the next process.

The above description is only intended to describe the preferred embodiments or embodiments of the present invention, which are not intended to limit the scope of the present invention. That is, the equivalent changes and modifications made in accordance with the scope of the patent application of the present invention or the scope of the invention are covered by the scope of the invention.

10‧‧‧Processing equipment

20‧‧‧Substrate

22‧‧‧ first side

24‧‧‧Second side

26‧‧‧Central Office

40‧‧‧Negative pressure source

50‧‧‧ platform

52‧‧‧ fluid passage

100‧‧‧Transfer substrate device

110‧‧‧First adsorption assembly

112, 122‧‧‧ adsorbing parts

120‧‧‧Second adsorption assembly

140‧‧‧ rod body

150‧‧‧ linkage assembly

D1‧‧‧first distance

D2‧‧‧Second distance

P‧‧‧Moving path

Claims (18)

A substrate transfer device for picking up a substrate on a platform, the transfer substrate device comprising: a first adsorption component and a second adsorption component, wherein the first adsorption component and the second adsorption component are respectively located on the platform On the opposite sides, the first adsorption component and the second adsorption component are respectively configured to respectively adsorb a first side and a second side of the substrate, wherein the first side and the second side are opposite to the substrate The first adsorption component and the second adsorption component each comprise at least one adsorption component, and each of the adsorption components is separated from the platform by a first distance; a rod body located at the first adsorption component and the second Between the adsorption components, the end of the rod body is separated from the platform by a second distance, the rod body has a moving path along the moving path to approach or away from the platform, the rod body along the moving path Abutting a center of the substrate on the platform and bringing the substrate closer to or away from the platform, wherein the center on the substrate is between the first side and the second side; and two rods, Corresponding to the rod body, the first Between the adsorption component and the second adsorption component, one end of each of the rods is connected to the rod body, and the other end of each rod is correspondingly connected to the first adsorption component and the second adsorption component, and The rods are interlocked, and each of the rods is configured to warp opposite sides of the substrate, and each of the rods has a first position and a second position according to the moving path of the rod, wherein each of the rods When the member is in the first position, each of the rods drives the first adsorption assembly and the second adsorption assembly such that the first distance is greater than the second distance, and each rod is located in the second position. The second adsorption component of the first adsorption component is driven to make the first distance equal to the second distance. The transfer substrate device of claim 1, wherein the transfer substrate device comprises: a plate member, the rod body is disposed on the plate member, and the plate member is coupled to each of the rod members. The transfer substrate device of claim 2, wherein each of the rod members comprises a fixed bearing seat, a movable bearing seat and a connecting rod, the fixed bearing seat being connected to the plate member, each of the The movable bearing seat is disposed on the corresponding first adsorption assembly and the second adsorption assembly, and the connecting rod is located between the fixed bearing seat and the movable bearing seat. The transfer substrate device of claim 1, wherein the adsorption member is a suction cup or a magnetic pickup assembly. The transfer substrate device of claim 1, wherein the transfer substrate device comprises: a limiting component, the limiting component is disposed on the rod body, and the limiting component is used to limit the rod body The path of the move. The transfer substrate device of claim 5, wherein the transfer substrate device comprises: an elastic member disposed on the rod, the elastic member for applying pressure to the rod body The force on the substrate. The transfer substrate device of claim 1, wherein the transfer substrate device comprises: a linkage structure connected to the first adsorption assembly and the second adsorption assembly, and driving the first adsorption The angle between the component and the rod is equal to the angle between the second adsorption assembly and the rod. The transfer substrate device of claim 1, wherein the transfer substrate device comprises: a power source coupled to the rod, the power source driving the rod to move along the movement path. The transfer substrate device of claim 8, wherein the power source is a cylinder or a servo motor. The transfer substrate device of claim 8, wherein the rod body is a screw. A process equipment includes: a platform, a fluid passageway disposed around the platform and communicating with a gap between the platform and the substrate; and a negative pressure source providing a negative pressure to the fluid passage of the platform , the platform is closely attached to the substrate; Transferring the substrate device to the substrate, the transfer substrate device comprising a first adsorption assembly and a second adsorption assembly, a rod and two rods; the first adsorption assembly and the second The first adsorption component and the second adsorption component are respectively configured to respectively adsorb a first side and a second side of the substrate, the first side and the second side. The first adsorption assembly and the second adsorption assembly each comprise at least one adsorption member, and each of the adsorption members is separated from the platform by a first distance; the rod is located at the first adsorption Between the assembly and the second adsorption assembly, the rod end is separated from the platform by a second distance, the rod body has a moving path along the moving path to approach or away from the platform, the rod body along the rod body The moving path abuts a center of the substrate on the platform, and the substrate is near or away from the platform, wherein the center of the substrate is located between the first side and the second side; And corresponding to each of the rods disposed on the rod body Between the first adsorption assembly and the second adsorption assembly, one end of each of the rods is connected to the rod body, and one end of each rod member is correspondingly connected to the first adsorption assembly and the second adsorption assembly. And engaging with the rod body, each of the rod members is configured to warp opposite sides of the substrate, and each of the rod members has a first position and a second position according to the moving path of the rod body, wherein each of the rod members has a first position and a second position When the rod is in the first position, each of the rods drives the first adsorption assembly and the second adsorption assembly such that the first distance is greater than the second distance, and each of the rods is located at the second position The rod drives the first adsorption assembly and the second adsorption assembly such that the first distance is equal to the second distance. The process equipment of claim 11, wherein the process equipment is an exposure machine or a coater. The process equipment of claim 11, wherein the platform is made of quartz or gold. Genus or marble material. The process equipment of claim 11, wherein the process equipment comprises: a linkage structure, the linkage structure is coupled to the first adsorption component and the second adsorption component, and drives the first adsorption component and the rod The angle between the bodies is equal to the angle between the second adsorption assembly and the rod. The method for picking up and placing a substrate is suitable for picking up or placing a substrate on a platform. The method for picking up and dropping a substrate comprises: adsorbing a first side and a second side of the substrate, and applying a force to a center on the substrate Wherein the first side edge and the second side edge are respectively located on opposite sides of the substrate, the center of the substrate is located between the first side edge and the second side edge; and the continuous application of the The first side of the substrate and the second side are warped relative to the center, wherein the first side and the second side of the substrate are respectively separated from the platform Three distances, and the center of the substrate is separated from the platform by a fourth distance, the third distance being greater than the fourth distance. The method of picking and placing a substrate according to claim 15, wherein the applying is continuously applied to the center of the substrate, and the first side and the second side of the substrate are opposite to the center After the step of warping, the method includes the steps of: splicing the center of the substrate to the platform. The method for picking and placing a substrate according to claim 16, comprising the step of gradually fitting the substrate along the center to the first side and the second side. The method for picking and placing a substrate as described in claim 15 includes the step of moving the substrate away from the platform.