JP2008159644A - Bonding apparatus, and method of suction for circuit board in bonding apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bonding apparatus capable of simultaneously suction-fixing and heating a bent circuit board. <P>SOLUTION: A heat block 10 for sucking/holding a transported circuit board 12 on an upper board suction surface 15 for heating is provided between transport guides 13. Holes 19 are provided on the board suction surface 15 of the heat block 10, in order to attach vacuum suction pads 16 including vacuum suction bellows 18, and the vacuum suction pads 16 are connected to a vacuum apparatus. The heat block 10 is made to lift toward the circuit board 12, while allowing the vacuum apparatus to suck the air in the vacuum suction pads 16, thereby sucking the circuit board 12 by the vacuum suction bellows 18 to heat the circuit board 12, and simultaneously suction-fixing the circuit board 12 on the board suction surface 15. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a structure of a heat block used for a die bonder and a wire bonder, and a method for adsorbing a circuit board with the heat block.

  A die bonder for mounting a semiconductor die on a circuit board on which an electric circuit is printed, or a wire bonder for connecting a semiconductor die mounted on a circuit board and a circuit board with a wire, attaches the REIT frame being conveyed to the suction stage. A bonding process or a dispensing process is performed in a state where the upper surface is fixed by vacuum suction. On the other hand, due to the recent demand for thinning, demand for high functionality, and demand for higher manufacturing efficiency, circuit boards have become thinner and larger, and die multi-layer mounting, so-called stacking, has been frequently used. In the case of such a thin circuit board, the circuit board is curved or warped, and the circuit board cannot be sucked and fixed in vacuum by the suction stage, and semiconductor die can be mounted, dispensed, or wire bonded. There was a case that disappeared.

  As a method for reliably sucking and fixing a curved circuit board mounted with a semiconductor die to the suction stage, it is attached to a support member 68 that moves up and down by a vertical cylinder 70 in a through hole 64 of the suction stage 100 as shown in FIG. There is a device for passing the bellows type vacuum gripper 62 and moving the vacuum gripper 62 up and down. The vacuum gripper 62 is stored in the lower part of the suction stage 100 until the circuit board 12 is transported in the same manner as the prior art described in Patent Document 1, and when the circuit board 12 is transported to the suction stage 100, the vacuum gripper 62 is moved. It is raised by the vertical cylinder 70 until it hits the curved circuit board 12. The valve 66 is opened, the inside of the vacuum gripper 62 is evacuated, the bellows of the vacuum gripper 62 is compressed by the pressure difference from the atmospheric pressure, and the circuit board 12 is drawn into the board suction surface 15. There is a method in which the circuit board 12 is fixed by vacuum suction with a plurality of vacuum suction holes 76 formed in the substrate suction surface 15 (see, for example, Patent Document 1).

  Further, as shown in FIG. 7, a suction stage 140 for sucking the circuit board and a vertical movement means 141 for moving the suction stage 140 up and down are provided, and a suction pad made of an elastic material is provided in an opening 143 formed in the suction stage 140. The suction stage 140 of the circuit board 101 is proposed in which a vacuum suction means 147 for vacuum suction of the suction pad 144 is provided, with the upper surface of 144 being disposed with the upper surface protruding upward from the upper surface of the suction stage (for example, Patent Literature 1). 2). In the suction stage 140, when the circuit board 101 conveyed is sucked, the rod 142 of the cylinder 141 is protruded until the upper surface of the suction pad 144 is brought into contact with the lower surface of the circuit board 101. Increase 140. Therefore, when the vacuum suction means 147 is driven and the circuit board 101 is vacuum-sucked, the suction pad 144 makes the circuit board 101 abut on the upper surface of the suction stage 140 while being deformed flat by its own elasticity, and the circuit board 101 is warped. It corrects and adsorbs the circuit board 101. Then, bond coating and chip mounting are performed on the circuit board 101.

JP 2001-203222 A JP-A-11-17397

  When a semiconductor die is mounted on a circuit board by a die bonder, it is necessary to heat the circuit board in order to fix the adhesive. Conventionally, this heating process is a separate process from the bonding process. The conventional techniques described in Documents 1 and 2 correspond to a semiconductor manufacturing apparatus in which the bonding process and the heating process are thus separate processes. However, due to recent demands for increasing the efficiency of manufacturing semiconductor devices, it has been required to perform bonding and heating simultaneously. However, the prior art circuit board suction mechanisms disclosed in Patent Documents 1 and 2 have a problem that bonding and heating cannot be performed at the same time, and the semiconductor device cannot be efficiently manufactured.

  Accordingly, an object of the present invention is to simultaneously perform adsorption fixing and heating of a curved circuit board.

  The bonding apparatus of the present invention is a bonding apparatus comprising a vacuum suction hole for vacuum-sucking a conveyed circuit board on a substrate suction surface, and a heat block for heating the vacuum-sucked circuit board. Is attached to the heat block so that the suction port of the expansion / contraction part protrudes, and vacuum-adsorbs the central region of the curved circuit board conveyed on the heat block, and the expansion / contraction part is caused by a pressure difference from the atmospheric pressure. A suction mechanism including a retractable vacuum suction pad that compresses and vacuum-sucks the circuit board onto the board suction surface, and advances and retracts the heat block toward the curved circuit board conveyed on the heat block. And a heat block driving mechanism. In the bonding apparatus of the present invention, the expansion / contraction part of the vacuum suction pad is preferably made of a heat-resistant rubber material, and the heat-resistant rubber material is made of Teflon rubber, silicon rubber or fluorine. It is also suitable as being rubber.

  The method for vacuum suction fixing of a curved circuit board according to the present invention includes vacuum suction of a curved circuit board conveyed on a heat block of a bonding apparatus having a vacuum suction pad having an expansion / contraction part having a suction port and a vacuum suction hole. A method of fixing, a heat block advancing step of advancing the heat block toward the curved circuit board conveyed on the heat block, and a vacuum inside the expansion / contraction part of the vacuum suction pad and the vacuum suction hole Vacuum suction step of vacuum-sucking the circuit board on the board suction surface of the heat block by vacuum-sucking the central region of the circuit board and compressing the expansion / contraction part of the vacuum suction pad with a pressure difference from the atmospheric pressure And vacuum fixing the circuit board on the substrate suction surface of the heat block by the vacuum suction pad and the vacuum suction hole. A fixing step, characterized in that it comprises a heating step of heating the circuit board which is vacuum fixed on the substrate attracting surface of the heat block by the heat block. Further, in the method of vacuum-fixing a curved circuit board according to the present invention, the vacuum-fixing step is performed after the circuit board is vacuum-fixed on the substrate suction surface of the heat block by the vacuum suction pad and the vacuum suction hole. It is also preferable to release the vacuum of the vacuum suction pad and hold the circuit board on the substrate suction surface of the heat block by the vacuum suction hole.

  The present invention has an effect that adsorption and fixing of a curved circuit board can be performed simultaneously.

  Hereinafter, a preferred embodiment for carrying out the present invention will be described with reference to FIGS. 1 is a cross-sectional view of a heat block of a die bonder, FIG. 2 is a plan view of the heat block of a die bonder, FIG. 3 is a cross-sectional view of a vacuum suction pad, and FIG. 4 is shown in FIGS. FIG. 5 is a diagram illustrating a vacuum system of a die bonder, and FIG. 5 is a diagram illustrating a suction process of a curved circuit board.

  As shown in FIG. 1, the die bonder includes two parallel conveyance guides 13 that guide both sides of the circuit board 12 in the conveyance direction. A curved circuit board 12 is conveyed between the conveyance guides 13. In the previous step, the circuit board 12 is curved upward because the semiconductor die 14 is mounted on the upper surface of the circuit board 12. Between the conveyance guides 13, there is provided a heat block 10 that adsorbs and holds the conveyed circuit board 12 on the upper substrate adsorption surface 15 and heats the adsorbed circuit board 12. A heating device 42 is provided in the heat block 10 to heat the entire heat block 10 and heat the adsorbed circuit board 12.

  A hole 19 is provided in the substrate suction surface 15 of the heat block 10, and a vacuum suction bellows 18 that is an expansion / contraction part of the vacuum suction pad 16 is disposed therein. It is fixed to the heat block 10. A vacuum pipe 20 is connected to the fixing portion 17 of the vacuum suction pad 16, the vacuum pipe 20 is connected to a header 21 fixed to the heat block 10, and a vacuum pipe 22 is connected to the header 21.

  As shown in FIG. 3, the vacuum suction bellows 18 is connected to the lower fixing portion 17 in a bellows tube structure having a suction port 18a for vacuum suction of the circuit board 12 at the upper end. The vacuum suction bellows 18 is a thin heat-resistant rubber such as Teflon rubber, silicon rubber, fluorine rubber, acrylic rubber, etc. so as to withstand the heating of the heat block 10, and a bellows of 3 to 5 stages is formed. Any material that can be compressed by a differential pressure between vacuum and atmospheric pressure may be used. It is also preferable to increase or decrease the number of bellows depending on the degree of curvature of the circuit board 12. Further, the vacuum suction bellows 18 may be a conical shape instead of a bellows tube as long as it can be compressed and deformed in the axial direction. The vacuum suction pad 16 can be finely adjusted with an adjustment screw or the like, and the protrusion height of the vacuum suction bellows 18 from the substrate suction surface 15 can be adjusted according to the degree of curvature of the circuit board 12. Is also suitable. Thus, the vacuum suction pad 16 has the lower fixing portion 17 fixed to the heat block 10, and the vacuum suction bellows 18 of the upper expansion / contraction portion can be expanded and contracted.

  Below the heat block 10, a heat block drive mechanism 30 that moves the substrate suction surface 15 of the heat block 10 forward and backward toward the circuit board 12 is provided. The heat block driving mechanism 30 may be configured to perform vertical movement and position control by a servo motor, or may perform vertical driving and position control by a normal motor and position sensor. Alternatively, it may be configured to be driven in the vertical direction by a cam or the like. The heat block driving mechanism 30 is configured to be connected to the heat block 10 by a shaft 32 so as to drive the heat block 10.

  FIG. 2 is a plan view of the heat block, and the curved circuit board 12 and the semiconductor die 14 are indicated by a two-dot chain line. As shown in FIG. 2, the heat block 10 forms a cavity with the circuit board 12 on the bonding center line 34 that performs the bonding operation of the semiconductor die 14 by attracting and fixing the circuit board 12 on the line. An X-shaped groove 11a is provided, and a vacuum suction hole 11 is formed at the center of the groove 11a. When the groove 11 a is evacuated by the vacuum suction hole 11, the cavity between the groove 11 a and the circuit board 12 is evacuated, and the circuit board 12 is vacuum fixed to the substrate suction surface 15. In FIG. 2, the vacuum suction pads 16 are disposed on both sides of the transport center line 36 and upstream of the bonding center line 34 by a half of the mounting pitch of the semiconductor die 14 in the transport direction. This position is close to the groove 11a for holding and holding the circuit board 12 by vacuum suction and the vacuum suction hole 11 and does not interfere with the circuit board 12 sucked by the vacuum suction pad 16 so that the groove 11a and the vacuum suction hole 11 smoothly. The position is such that suction can be performed in the vacuum cavity to be formed. Further, this position is a position where the circuit board 12 can be effectively sucked by the vacuum suction pad 16 at a position where the circuit board 12 is not provided with through holes for wiring. Of course, the position of the vacuum suction pad 16 is not limited to the position of the embodiment described above as long as it can be effectively sucked by the vacuum suction pad 16 as described above.

  FIG. 4 shows the vacuum piping system of this embodiment. As shown in FIG. 4, the vacuum suction bellows 18 and the fixing portion 17 of the vacuum suction pad 16 are connected to an electromagnetic valve 26 via vacuum pipes 20 and 22. The electromagnetic valve 26 is connected to a vacuum device 29 by a vacuum pipe 28. On the other hand, the vacuum suction hole 11 of the heat block 10 is connected to a vacuum pipe 25 via a vacuum pipe 23 and is connected to another electromagnetic valve 27. Another electromagnetic valve 27 is connected to a vacuum device 29 through a vacuum pipe 28 in the same manner as the electromagnetic valve 26. The vacuum device 29 may be directly connected to the vacuum pump, or may be a vacuum tank connected to the vacuum pump. When the solenoid valves 26 and 27 are opened, the air is sucked from the vacuum suction bellows 18 and the vacuum suction hole 11, thereby adsorbing the circuit board 12. In this embodiment, the suction from the vacuum suction bellows 18 and the vacuum suction hole 11 is opened and closed by the separate solenoid valves 26 and 27, but it is also preferable that the suction is performed by the same solenoid valve.

The operation of this embodiment will be described with reference to FIG. As shown in FIG. 5A, the circuit board 12 having the semiconductor die 14 mounted thereon and curved in the previous process is transported onto the heat block 10 by the transport guide 13, and the center position of the semiconductor die 14 is the bonding center line. It has stopped at position 34. The width of the circuit board is W, and the bending height of the central region is D. As shown in FIG. 5 (a), the suction port 18a is in a state of protruding by a height H ₁ from the substrate attracting surface 15, the heat block 10, vacuum suction bellows 18 upper suction protruding on the substrate attracting surface 15 mouth position 18a is adapted to be lower by H ₂ than the height of the guide surface of the conveying guide 13. Here, the distance A between the substrate suction surface 15 and the guide surface of the transport guide 13 is larger than H ₁ , and H ₂ = A−H ₁ . In this way, the suction port 18a is positioned below the guide surface of the transport guide 13 so that the vacuum suction bellows 18 and the transport can be transported regardless of the curved height of the circuit board 12 transported by the transport guide 13. Interference with the circuit board 12 inside can be prevented.

Next, as shown in FIG. 5 (b), the electromagnetic valves 26 and 27 are opened, and the suction of the air in the vacuum suction bellows 18 and the vacuum suction hole 11 to the vacuum device 29 is started. At the initial position of the heat block 10, the distance L between the suction port 18 a and the circuit board 12 is L = D + A−H ₁ , and the vacuum suction bellows 18 and the vacuum suction hole 11 are sucked by the vacuum device 29. Even so, air is sucked into the suction port 18 a from the gap between the suction port 18 a and the circuit board 12, and the vacuum suction bellows 18 is a distance at which the circuit board 12 cannot be sucked. When the heat block driving mechanism 30 is operated while sucking air from the vacuum suction bellows 18 and the vacuum suction hole 11, the heat block 10 is raised toward the lower surface of the circuit board 12. As the heat block 10 rises toward the circuit board 12, the suction port 18 a of the vacuum suction bellows 18 attached to the heat block 10 approaches the lower surface of the circuit board 12.

  When the gap between the suction port 18a and the lower surface of the circuit board 12 is reduced and the air flow rate sucked into the suction port 18a is increased, the air pressure between the suction port 18a and the lower surface of the circuit board 12 is decreased. . When the difference between the atmospheric pressure applied to the upper surface of the circuit board 12 and the pressure on the lower surface of the circuit board 12 facing the suction port 18a is increased, the upper surface of the circuit board 12 is moved to the lower surface side of the circuit board 12 by atmospheric pressure. The heat block 10 starts to be pushed toward the substrate suction surface 15. When the pressing force due to this pressure difference becomes larger than the bending elastic force of the curved circuit board 12, the circuit board 12 starts to move downward toward the suction port 18a. When the circuit board 12 starts moving toward the suction port 18a, the distance between the circuit board 12 and the suction port 18a is the sum of the moving distances due to the upward movement of the heat block 10 and the downward movement of the circuit board 12 toward the heat block 10. Shorten by minutes. As a result, the suction port 18a and the lower surface of the circuit board 12 quickly approach each other. Then, due to the rapid approach between the suction port 18a and the circuit board 12, the air flow velocity between the suction port 18a and the lower surface of the circuit board 12 is rapidly increased, and the pressure is rapidly decreased. Due to this sudden drop in pressure, the pressing force that pushes down the circuit board 12 toward the board suction surface 15 of the heat block 10 rises rapidly, and the circuit board 12 is sucked into the suction port 18 a of the vacuum suction bellows 18. When the circuit board 12 is sucked by the vacuum suction bellows 18, the raising operation of the heat block 10 is stopped.

  As shown in FIG. 5C, when the lower surface of the circuit board 12 is adsorbed to the suction port 18a of the vacuum suction bellows 18 by the rising of the heat block 10 and the suction of the air of the vacuum suction bellows 18, the vacuum suction bellows 18 The internal pressure further decreases to the suction vacuum pressure of the vacuum device. The vacuum suction bellows 18 receives a compression force from the outside due to a pressure difference between the vacuum internal pressure and the atmospheric pressure. As shown in FIG. 3, the vacuum suction bellows 18 has a structure that is easily compressed in the axial direction while maintaining the shape in the diametrical direction. To be compressed. Since the lower part of the vacuum suction bellows 18 is connected and fixed to the fixing part 17, the suction port 18 a that sucks the circuit board 12 descends toward the board suction surface 15 of the heat block 10 by compression. When the circuit board 12 descends to the vicinity of the board suction surface 15 and the distance between the vacuum suction hole 11 and the groove 11a provided on the lower surface of the circuit board 12 and the board suction surface 18 becomes smaller, the vacuum suction hole 11 and the pressure around the groove 11a decrease. Then, the circuit board 12 is pressed against the substrate suction surface 15 by the atmospheric pressure applied to the upper surface and the pressure difference around the vacuum suction hole 11 and the groove 11a, and is sucked and fixed to the substrate suction surface 15 by the vacuum suction bellows 18 and the groove 11a. .

  In this way, the curved circuit board 12 is sucked and fixed to the board suction surface 15 of the heat block 10 by the raising operation of the heat block 10 and the suction of air from the vacuum suction bellows 18 and the vacuum suction hole 11. When the curved height D of the circuit board 12 is large, it is necessary to raise the heat block 10 further to bring the suction port 18a closer to the lower surface of the circuit board 12, so that when the circuit board 12 is adsorbed The height of the substrate suction surface 15 of the heat block 10 is above the guide surface of the transport guide 13.

  The amount by which the substrate suction surface 15 of the heat block 10 rises from the guide surface is determined by detecting the state in which the inner surface of the vacuum suction bellows 18 is evacuated by suction and stopping the lifting operation of the heat block 10. Alternatively, the curved height D of the curved circuit board 12 that has been conveyed on the heat block 10 in advance may be measured, and may be raised by a predetermined amount corresponding to the curved height. For example, it is also preferable to raise the heat block 10 so that the substrate suction surface 15 is on the upper side from the guide surface by ½ of the curved height D. When the circuit board 12 is adsorbed by raising the board adsorbing surface 15 of the heat block 10 upward from the guide surface, the circuit board 12 is in the state of adsorbing and fixing the circuit board 12 and the conveyance guides 13 on both side surfaces. It is in a state of floating upward from the guide surface.

When the curved height D of the circuit board 12 is smaller than the protruding length H _{1 of the} suction port 18 a from the board suction surface 15, the board suction surface 15 of the heat block 10 is larger than the guide surface of the transport guide 13. Since the suction port 18 a can suck the circuit board 12 at a low position, the height of the board suction surface 15 of the heat block 10 is lower than the guide surface of the transport guide 13.

  Thus, even if there is a difference between the height of the substrate suction surface 15 of the heat block 10 and the height of the guide surface of the conveyance guide 13, there is no particular problem because bonding is performed on the heat block 10. . Accordingly, the height of the substrate suction surface 15 due to the rising of the heat block 10 may be a position protruding slightly upward from the guide surface of the transport guide 13 or may be substantially the same as the guide surface of the transport guide 13. However, the position may be lower than the guide surface.

  Once the circuit board 12 is sucked and fixed to the board suction surface 15, the circuit board 12 is sucked to the heat block 10 by the vacuum suction holes 11 and the grooves 11a even if the pressure in the vacuum suction bellows 18 is released to atmospheric pressure. Therefore, the vacuum of the vacuum suction bellows 18 may be released by closing the electromagnetic valve 26.

  When the circuit board 12 is attracted and fixed to the heat block 10, the circuit board 12 is heated by the heat block 10. Since the heating of the heat block 10 is started with the start of the operation of the bonding apparatus, a circuit is formed by the substrate suction surface 15 of the heat block 10 whose temperature rises at the same time that the circuit board 12 is suctioned to the substrate suction surface 15. Heating of the substrate 12 is started. Since the circuit board 12 is usually very thin, such as several tens of microns, it can be heated to a predetermined temperature in a very short time by the heat capacity of the heat block 10, and the bonding process is started immediately.

  When the mounting of the semiconductor dies 14 to the mounting positions of the semiconductor dies 14 on the circuit board 12 at the bonding center line 34 is completed, the pressure of the vacuum suction bellows 18, the vacuum suction hole 11, and the groove 11 a is released to atmospheric pressure, and the heat block Lower 10 to its original position. Then, the circuit board 12 returns to the curved state shown in FIG. 5A, and the suction port 18a of the vacuum suction bellows 18 also protrudes upward from the board suction surface 15. Since the circuit board 12 has a clearance with the suction port 18 a at the upper end of the vacuum suction bellows, the circuit board 12 can be transported without interfering with the vacuum suction bellows 18. Then, the circuit board 12 is transported by a transport mechanism (not shown) until the center of the semiconductor die 14 in the next row comes to the bonding center line 34. This completes one cycle of mounting the semiconductor die 14 to the curved circuit board 12 by the die bonder.

  As described above, in the die bonder of the present embodiment, the heat block 10 to which the vacuum suction bellows 18 is attached is raised toward the circuit board 18, so that the circuit board 12 having various curved heights is sucked and sucked and fixed. be able to. Since the circuit board 12 is fixed to the heat block 10 by suction, the circuit board 12 can be heated simultaneously with the suction fixing, and the bonding process and the heating process of the die bonder can be performed at the same time, thereby improving the efficiency of the semiconductor device. There is an effect that can be achieved.

  As mentioned above, although embodiment of this invention demonstrated the case where the semiconductor substrate 14 was mounted | worn and the circuit board 12 which is curving is adsorbed and fixed, thin and large-sized and curving circuit board 12 is adsorbing and fixing from the beginning. Can also be used. In the above embodiment, the vacuum suction of the circuit board 12 in the bonding process for mounting the semiconductor die 14 of the die bonder has been described. However, the present invention is also applicable to the case where the circuit board 12 is fixed by suction in the dispenser process of the die bonder. It can also be used when the circuit board 12 is vacuum-sucked in the wire bonding process of the wire bonder.

It is sectional drawing of the heat block of the die bonder which is embodiment of this invention. It is a top view which shows the heat block of the die bonder which is embodiment of this invention. It is sectional drawing of a vacuum suction pad. It is a vacuum system diagram of the die bonder which is an embodiment of the present invention. It is explanatory drawing which shows the adsorption | suction process of the curved circuit board. It is sectional drawing which shows the adsorption fixing apparatus which raises / lowers the bellows type vacuum gripper by a prior art. It is sectional drawing which shows the suction fixing apparatus which raises and lowers the suction stage by a prior art.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Heat block, 11 Vacuum suction hole, 11a Groove, 12, 101 Circuit board, 13 Transport guide, 14 Semiconductor die, 15 Substrate adsorption surface, 16 Vacuum suction pad, 17 Fixing part, 18 Vacuum suction bellows, 18a Suction port, 19 Hole, 20, 22, 24, 25, 28 vacuum piping, 21 frame, 23 vacuum pipe, 26, 27 solenoid valve, 29 vacuum device, 30 heat block drive mechanism, 32 shaft, 34 bonding center line, 36 transport center line, 42 heating device, 50 suction cylinder, 52 vacuum suction hole, 62 vacuum gripper, 64 through hole, 66 valve, 68 support member, 70 vertical cylinder, 76 vacuum suction hole, 78 valve, 100, 140 suction stage, 141 cylinder, 141 Vertical movement means, 142 Rod, 143, Opening, 144 Suction pad , 147 vacuum suction means.

Claims (5)

In a bonding apparatus including a vacuum suction hole for vacuum-sucking the conveyed circuit board on the substrate suction surface, and a heat block for heating the vacuum-sucked circuit board,
Attached to the heat block so that the suction port of the expansion / contraction part protrudes from the board adsorption surface of the heat block, and vacuum-sucks the central area of the curved circuit board conveyed on the heat block and with atmospheric pressure. A suction mechanism including a retractable vacuum suction pad for compressing the expansion and contraction portion by a pressure difference and vacuum-sucking the circuit board onto the substrate suction surface;
A heat block drive mechanism for moving the heat block forward and backward toward the curved circuit board conveyed on the heat block;
A bonding apparatus comprising: The bonding apparatus according to claim 1,
The stretchable part of the vacuum suction pad is made of a heat-resistant rubber material;
A bonding apparatus characterized by the above. The bonding apparatus according to claim 2,
The heat-resistant rubber material is Teflon rubber, silicon rubber, or fluorine rubber,
A bonding apparatus characterized by the above. A method for vacuum suction fixing a curved circuit board conveyed on a heat block of a bonding apparatus having a vacuum suction pad having a stretchable part with a suction port and a vacuum suction hole,
A heat block advancing step of advancing the heat block toward the curved circuit board conveyed on the heat block;
The circuit board is formed by vacuum-sucking the inside of the expansion / contraction part of the vacuum suction pad and the central region of the circuit board by using the vacuum suction hole as a vacuum and compressing the expansion / contraction part of the vacuum suction pad with a pressure difference from the atmospheric pressure. A vacuum suction step for vacuum suction on the substrate suction surface of the heat block;
A vacuum fixing step of vacuum fixing the circuit board on the substrate suction surface of the heat block by the vacuum suction pad and the vacuum suction hole;
A heating step of heating the circuit board vacuum-fixed on the substrate adsorption surface of the heat block by the heat block;
A method of vacuum-fixing and fixing a curved circuit board, comprising: A method of vacuum-adsorbing and fixing the curved circuit board according to claim 4,
In the vacuum fixing step, after the circuit board is vacuum fixed on the substrate suction surface of the heat block by the vacuum suction pad and the vacuum suction hole, the vacuum of the vacuum suction pad is released, and the vacuum suction hole Holding the circuit board in a vacuum fixed state on the substrate adsorption surface of the heat block;
A method of vacuum-fixing a curved circuit board characterized by

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