TWI565569B - Absorbing apparatus, absorbing system and application thereof - Google Patents

Description

Suction device, sorption system and its application

The present invention relates to a sorption device, a sorption system, and an application thereof, and more particularly to a absorbing device, a sorption system, and an application thereof that can prevent sagging deformation of a sorbent.

As the trend of thinner and lighter electronic products, the thickness of substrates (for example, glass substrates) used has become thinner.

Secondly, in the manufacturing process, the substrate is usually transported by means of a sorption device, wherein the absorbing device absorbs the substrate by the attraction generated by the vacuum, and the substrate can be transported to each processing station, thereby being correlated. The processing steps thus make the substrate suitable for different application needs.

However, the conventional absorbing device can absorb the thinned substrate, but the thinned substrate has a small thickness, and the amount of sag deformation when it is sucked becomes large. And as the thickness of the substrate is thinner, the degree of sagging becomes more and more serious. In this way, not only will the accuracy of the process be caused, but the excessive amount of sag deformation may even cause the substrate to rupture.

In view of this, it is not necessary to provide a sorbent device, a sorption system, and applications thereof to improve the deficiencies of conventional sorbent devices, sorption systems, and applications thereof.

Accordingly, an aspect of the present invention provides a absorbing apparatus which suppresses a defect of sag deformation of a sorbent due to a conventional absorbing unevenness by a connection relationship of absorbing means.

Another aspect of the present invention provides a sorbent device that incorporates a sorption unit and an electrostatic disk to suppress defects in sag deformation of the sorbate due to absorbing unevenness.

Still another aspect of the present invention provides a absorbing apparatus that adjusts a relative relationship between a absorbing unit and an electrostatic disk to further suppress sagging deformation of the sorbed object due to absorbing unevenness.

Yet another aspect of the present invention is to provide a sorption system comprising the aforementioned sorbent device.

Yet another aspect of the present invention is to provide a sorption system comprising the sorbent device of the other aspect described above.

Still another aspect of the present invention provides a method of bonding a substrate by absorbing a substrate by the sorption system according to the above aspect, thereby suppressing sagging deformation of the substrate due to uneven absorption.

Still another aspect of the present invention provides a method of bonding a substrate which absorbs a substrate by the sorption system according to still another aspect described above, thereby suppressing sagging deformation of the substrate due to uneven absorption.

According to one aspect of the invention, a sorption device is proposed. The sorption device comprises a plurality of first sorption units and a plurality of second sorption units. The first sorption units are spaced apart and define at least one spaced area. The second absorbing units are disposed on at least one of the first absorbing units and are extended to at least one of the at least one spaced regions.

According to another aspect of the invention, a sorption device is provided. The absorbing device comprises a plurality of first absorbing units, a plurality of second absorbing units and a plurality of electrostatic disks. The first sorption units are spaced apart and define at least one spaced area. The second absorbing units are disposed on at least one of the first absorbing units, and the second absorbing units extend into at least one of the at least one spaced regions. The aforementioned electrostatic disks are respectively disposed in the spacing region, and each of the electrostatic disks has a plurality of recesses corresponding to the second absorbing unit. Wherein each of the second absorbing units is movably passed through the corresponding recess.

According to an embodiment of the invention, at least two of the aforementioned second sorption units are parallel to each other.

According to another embodiment of the invention, the absorbing device further comprises at least one connecting member, and the connecting member is connected to the first absorbing unit.

According to still another embodiment of the present invention, at least one of the second absorbing units is perpendicular to the first absorbing unit.

According to still another embodiment of the present invention, the first absorbing units are parallel to each other.

According to still another embodiment of the present invention, at least one of the first absorbing unit and the second absorbing unit has a connecting member and a absorbing member disposed on the connecting member.

According to still another embodiment of the present invention, the absorbing device further includes at least one connecting member, and the at least one connecting member is coupled to the first absorbing unit.

According to still another aspect of the present invention, a sorption device is proposed. The absorbing device comprises a plurality of first absorbing units, a plurality of second absorbing units and a plurality of electrostatic disks. These first sorption units are separately provided. At least one of the second sorption units is coupled to at least two of the first sorption units. The electrostatic disks are respectively disposed between the first absorbing unit and the second absorbing unit, so that each of the first absorbing units and each of the second absorbing units movably pass through the electrostatic disks.

According to another embodiment of the invention, the first sorption units are parallel to each other.

According to yet another aspect of the invention, a sorption system is presented. The sorption system is disposed on the body, and the sorption system includes an actuation mechanism and the aforementioned sorption device. Each of the first sorption units of the sorption device is coupled to the actuation mechanism.

According to still another aspect of the present invention, a sorption system is proposed. The sorption system includes an actuation mechanism and a sorption device. The connecting member is connected to the actuating mechanism, and the electrostatic disk is disposed on the bottom of the body.

According to still another aspect of the present invention, a method of bonding a substrate is provided. The method first provides a first substrate and a second substrate, as well as the aforementioned sorption system. Then, the first substrate is sucked by the absorbing device of the sorption system, and the absorbing device is lifted by the actuating mechanism. Next, move the absorbing substrate to align A substrate and a second substrate. Thereafter, the absorbing device is moved down to fit the first substrate and the second substrate.

According to still another aspect of the present invention, a method of bonding a substrate is provided. The method first provides a first substrate and a second substrate, as well as the aforementioned sorption system. Then, the first substrate is sucked by the first absorbing unit and the second absorbing unit. Next, the first substrate is lifted by the first absorbing unit and the second absorbing unit. When the first absorbing unit and the second absorbing unit are coplanar with the electrostatic disk, the first substrate is sorbed by the electrostatic disk. The first absorbing unit and the second absorbing unit are movably passed through the electrostatic disk and moved into the receiving portion of the body. Thereafter, the electrostatic disk is moved to align the first substrate with the second substrate. Then, the electrostatic disk is moved down to bond the first substrate and the second substrate.

The absorbing device, the sorption system and the application thereof of the present invention are designed to improve the sorption of the absorbing device by designing the connection relationship between the absorbing units of the absorbing device to avoid sagging deformation of the absorbing material. efficacy.

100/200‧‧‧Sucking system

100a/200a/300a/300b/400a/500a‧‧‧ sorption device

101/201‧‧‧ Ontology

101a/201a‧‧‧ bottom

101b/201b‧‧‧Receipt Department

110/210/310/410/510‧‧‧ first sorption unit

120/220/320/420/520‧‧‧second sorption unit

110a/120a/210a/220a/410a/420a/510a/520a‧‧‧ Connection elements

110b/120b/210b/220b/410b/420b/510b/520b‧‧‧ sorption elements

130/230/430/530‧‧‧Connectors

130a/230a/430a/530a‧‧‧ actuation agency

140/240/540‧‧‧ interval area

250/550‧‧‧Electric disk

250a‧‧‧Depression

600/700‧‧‧ method

601‧‧‧Provide steps for providing the first substrate, the second substrate, and the sorption system

602‧‧‧Steps of absorbing the first substrate by the sorption device of the sorption system

603‧‧‧Steps of using the actuation mechanism to lift the suction device

604‧‧‧ Moving the absorbing device to align the first substrate with the second substrate

605‧‧‧Steps for moving the sorption device down

606‧‧‧Steps of bonding the first substrate and the second substrate

701‧‧‧Procedure for providing the first substrate, the second substrate and the sorption system

702‧‧‧Step of absorbing the first substrate by the first absorbing unit and the second absorbing unit

703‧‧‧Steps of lifting the first absorbing unit and the second absorbing unit by using the actuating mechanism and absorbing the first substrate by using the electrostatic disk

704‧‧‧ Moving the electrostatic disk to align the first substrate and the second substrate

705‧‧‧Steps for moving the electrostatic disk down

706‧‧‧Steps of bonding the first substrate and the second substrate

C-C’/D-D’‧‧‧ cut line

D ₁ /D ₂ /D ₃ /D ₄ ‧‧‧Distance

For a more complete understanding of the embodiments of the invention and the advantages thereof, reference should be made to the description below and the accompanying drawings. It must be emphasized that the various features are not drawn to scale and are for illustrative purposes only. The related drawings are described as follows: [Fig. 1] is a bottom perspective view showing a sorption system according to an embodiment of the present invention.

Fig. 1a is a side elevational view of the sorption system of one embodiment of the invention taken along line C-C' of Fig. 1.

Fig. 1b is a bottom plan view of a sorption device in accordance with an embodiment of the present invention.

FIG. 1c is a flow chart showing a method of bonding a substrate according to an embodiment of the present invention.

2 is a bottom perspective view of a sorption system in accordance with another embodiment of the present invention.

Fig. 2a is a side elevational view of the sorption system of another embodiment of the present invention taken along line D-D' of Fig. 2.

Figure 2b is a bottom plan view of a sorption device in accordance with another embodiment of the present invention.

Fig. 2c is a bottom plan view showing a sorption device according to another embodiment of the present invention enlarged in accordance with a portion A of Fig. 2b.

FIG. 2d is a flow chart showing a method of bonding a substrate according to another embodiment of the present invention.

Figure 3a is a bottom plan view of a sorption device in accordance with yet another embodiment of the present invention.

Fig. 3b is a bottom plan view showing a absorbing device according to still another embodiment of the present invention.

Fig. 4 is a bottom plan view showing a sorption device according to still another embodiment of the present invention.

Fig. 5 is a bottom plan view showing a sorption device according to still another embodiment of the present invention.

Fig. 5a is a bottom plan view showing a sorption device according to still another embodiment of the present invention enlarged in part B of Fig. 5.

The making and using of the embodiments of the invention are discussed in detail below. However, it will be appreciated that the embodiments provide many applicable inventive concepts that can be implemented in a wide variety of specific content. The specific embodiments discussed are illustrative only and are not intended to limit the scope of the invention.

1 and FIG. 1b, FIG. 1 is a bottom perspective view of a sorption system according to an embodiment of the present invention, and FIG. 1a is a cross-sectional view taken along line C-C' of FIG. A side view of a sorption system in accordance with an embodiment of the present invention is shown, and Figure 1b is a bottom plan view of a sorption device in accordance with an embodiment of the present invention. In one embodiment, the sorption system 100 is disposed on the body 101, and the sorption system 100 includes an actuation mechanism 130a and a sorption device 100a. Wherein, the body 101 can be horizontally moved to adjust the position, and the effect of horizontally moving the object can be achieved.

Please refer to Figure 1b. The squeezing device 100a includes a plurality of first absorbing units 110 and a plurality of second absorbing units 120, and at least one connecting member 130. At least one connecting member 130 is respectively connected to the two ends of the first absorbing units 110. . At least one of the first absorbing unit 110 and the second absorbing unit 120 respectively has a connecting element 110a and 120a and a plurality of absorbing elements 110b and 120b respectively disposed on the connecting elements 110a and 120a, and the absorbing element 110b and 120b have a gas flow inlet. The connecting element 110a of the first absorbing unit 110 is connected to the connecting element 120a of the corresponding second absorbing unit 120.

The first absorbing units 110 are spaced apart from each other and define at least one spacing region 140. In other words, the two spaced apart first absorbing units 110 can define a spacing region 140.

The connecting elements 110a and 120a of the first absorbing unit 110 and the second absorbing unit 120 respectively have a conduit (not shown) for gas flow. Each of the absorbing members 110b and 120b is respectively connected to a corresponding pipeline, and the pipeline can be directly or indirectly connected to the negative pressure device. For example, the pipeline of the first connecting component 110a can be directly connected to the negative pressure device, and the pipeline of the second connecting component 120a. It is connected to the pipeline of the first connecting element 110a to indirectly connect the vacuum device. The absorbing elements 110b and 120b of the first absorbing unit 110 and the second absorbing unit 120 can be connected to the negative pressure device by a pipeline, so that the gas is drawn into the pipeline through the gas inlet, so that the absorbing member 110b and the absorbing member 110b The air pressure between 120b and the object to be sucked becomes a negative pressure, thereby making the absorbing members 110b and 120b have a sorption effect.

In an embodiment, the connecting member 130 can also be provided with a pipe and a absorbing member, so that the connecting member can also have the ability to suck.

The absorbing elements 110b and 120b of the first absorbing unit 110 and the second absorbing unit 120 may be uniformly or unevenly distributed on the connecting elements 110a and 120a of the first absorbing unit 110 and the second absorbing unit 120, respectively. . In this embodiment, the first absorbing unit 110 may further include a plurality of covers to adjust and close the partial absorbing members 110b and 120b, in accordance with the shape or area of the object to be sucked, and adjust the absorbing members. The attraction of 110b and 120b. Further, when the vacuum device is connected to a plurality of absorbing devices At the time of the operation, according to the operation requirement, the cover can also close all the absorbing elements in the at least one absorbing device, and the objects are sucked by the remaining absorbing devices.

In an embodiment, the first sorption units 110 may be parallel or non-parallel to each other.

The second absorbing unit 120 is disposed on at least one of the first absorbing units 110 and is extended into at least one of the spacing regions 140. As shown in FIG. 1b, at least one of the second absorbing units 120 is perpendicular to the first absorbing unit 110, at least two of the second absorbing units 120 are parallel to each other, and at least two of the second absorbing units 120 are Is equidistantly distributed on at least one of the first sorption units 110.

In an embodiment, the first absorbing unit 110 and the second absorbing unit 120 may be integrally formed. In another embodiment, the first absorbing unit 110 and the second absorbing unit 120 are assembled. In this embodiment, the second absorbing unit 120 can be coupled to the first absorbing unit 110 by snapping, locking, tight fitting, screwing, other suitable methods, or any combination of the foregoing. It should be particularly noted that when the second absorbing unit 120 is combined with the first absorbing unit 110, the first absorbing unit 110 and the second absorbing unit 120 may have a sealing element to prevent the absorbing device. When the object 100a sucks the object, the outside air is sucked by the combination of the first absorbing unit 110 and the second absorbing unit 120, thereby reducing the absorbing effect and even causing the absorbing device 100a to lose the absorbing effect.

In the foregoing embodiment, when the second absorbing unit 120 is combined with the first absorbing unit 110, if the first absorbing unit 110 and the second absorbing unit 120 have a good airtight effect, the first There is no need to have a sealing element between the absorbing unit 110 and the second absorbing unit 120.

In another embodiment, the second absorbing unit 120 is pivotally disposed on the first absorbing unit 110, and the second absorbing unit 120 is centered on the axis disposed on the first absorbing unit 110. Rotation, in turn, can change the absorbing position of the second sorption unit 120 to match the shape of the object to be sucked.

Please refer to FIG. 1, FIG. 1a and FIG. 1b. The actuating mechanism 130a is connected to the connecting member 130 of the absorbing device 100a to move the absorbing device 100a. In an embodiment, the actuating mechanism 130a can drive the absorbing device 100a to move up and down (in the bottom view of FIG. 1b, the sitting mechanism 130a moves in a direction perpendicular to the page of the drawing), and thereby adjust the absorbing device The height of 100a allows the absorbing device 100a to suck the object, thereby raising the height of the object. Then, by the horizontal movement of the body 101, the object can be moved to another position. In an embodiment, the actuating mechanism 130a is a telescopic rod structure, but is not limited thereto.

In an embodiment, the absorbing device 100a can also be received in the accommodating portion 101b of the body 101. In this embodiment, the bottom surface of the first sorption unit 110 (i.e., the bottom surface of the absorbing device 100a) is coplanar with the bottom portion 101a of the body 101.

Referring to FIG. 1a, FIG. 1b and FIG. 1c, FIG. 1c is a flow chart of a method for bonding a substrate according to an embodiment of the invention. In one embodiment, the method 600 first provides a first substrate (not shown), a second substrate (not shown), and the aforementioned sorption system 100, and is sorbed by the sorption device 100a of the sorption system 100. The first substrate is as shown in steps 601 and 602. The absorbing device 100a sucks the first substrate by the first absorbing unit 110 and the second absorbing unit 120.

Then, the absorbing device 100a is lifted by the actuating mechanism 130a of the sorption system 100, and the horizontal position of the body 101 is moved to align the smoked first substrate and the second substrate, as shown in steps 603 and 604.

In an embodiment, the actuating mechanism 130a is an actuating mechanism that can be arbitrarily moved. Therefore, the body 101 can be fixed, and the horizontal position and/or the level of the first substrate can be adjusted by any active actuation mechanism 130a.

Next, the absorbing device 100a is moved downward by the actuating mechanism 130a to bond the first substrate and the second substrate, as shown in steps 605 and 606.

Please refer to FIG. 2, FIG. 2a and FIG. 2b, wherein FIG. 2 is a bottom perspective view of the sorption system according to another embodiment of the present invention, and FIG. 2a is a cross-sectional view taken along line DD' of FIG. A side view of a sorption system of another embodiment of the present invention is cut away, and Fig. 2b is a bottom plan view of the absorbing device in accordance with another embodiment of the present invention. The configuration of the sorption system 200 and its structure are substantially the same as those of the sorption system 100, and the difference is that the absorbing device 200a of the sorption system 200 further includes an electrostatic disk 250, and the electrostatic disk 250 is disposed on the body. On the bottom 201a of 201.

Referring to FIG. 2b and FIG. 2c, FIG. 2c is a bottom view of the absorbing device according to another embodiment of the present invention enlarged in part A of FIG. 2b. As previously mentioned, the sorbent device 200a further includes a plurality of electrostatic disks 250. The electrostatic disks 250 are respectively disposed in the spacing regions 240 defined by the first absorbing unit 210, and each of the electrostatic disks 250 has a recess 250a corresponding to the second absorbing unit 220, so that each of the second absorbing units 220 movably passes through the corresponding recess 250a.

Referring to FIG. 2c, the electrostatic disk 250 has a distance D ₁ and a D ₂ between the first absorbing unit 210 and the second absorbing unit 220, respectively, thereby allowing the first absorbing unit 210 and the second absorbing unit 220. The electrostatic disk 250 can be moved in a direction perpendicular to the page of the drawing.

Please refer to Figures 2, 2a and 2b. The actuating mechanism 230a is connected to the connecting members 230 of the absorbing device 200a, respectively. In one embodiment, the actuation mechanism 230a adjusts the height of the sorption device 200a to adjust the height of the object being sorbed by the sorption device. Then, by the movement of the body 201, the object can be moved to another position. In an embodiment, the actuation mechanism 230a can also selectively connect each of the first sorption units 210 of the sorption device 200a.

In an embodiment, the absorbing device 200a can also be received in the accommodating portion 201b of the body 201. In this embodiment, the bottom surface of the first sorption unit 210 (i.e., the bottom surface of the absorbing device 200a) is coplanar with the bottom portion 201a of the body 201.

Referring to FIG. 2b and the foregoing description, the absorbing device 200a can be sorbed by the electrostatic disk 250 in addition to the first absorbing unit 210 and the second absorbing unit 220 simultaneously absorbing the object. object.

The actuating mechanism 230a can adjust the height of the absorbing device 200a, so that the absorbing device 200a can suck the object, thereby raising the height of the object. Then, by the movement of the body 201, the object can be moved to another position.

The absorbing device 200a can also be received in the accommodating portion 201b of the body 201. Therefore, when the absorbing device 200a is received in the accommodating portion 201b, as shown in FIG. 2a, the absorbing elements of the first absorbing unit 210 and the second absorbing unit 220 are as shown in FIG. 2a. The level of the pieces 210b and 220b is higher than the level of the bottom surface of the electrostatic disk 250.

Therefore, when the absorbing mechanism 200a is lifted as the moving mechanism 230a, the bottom surface of the absorbing device 200a is first coplanar with the bottom surface of the electrostatic disk 250, so that the object to be sucked is simultaneously sucked by the absorbing device 200a and the electrostatic disk 250. Then, the actuating mechanism 230a continuously raises the absorbing device 200a, so that the absorbing device 200a is housed in the accommodating portion 201b of the body 201. At this time, the object to be sucked is sucked only by the electrostatic disk 250.

Please refer to FIG. 2a, FIG. 2b and FIG. 2d, wherein FIG. 2d is a flow chart of a method for bonding a substrate according to another embodiment of the present invention. The process steps of method 700 are substantially the same as the process steps of method 600, with the difference that method 700 utilizes a sorption system 200 comprising electrostatic disk 250 to sorb the substrate.

Similarly, the method 700 first provides a first substrate (not shown), a second substrate (not shown), and the foregoing sorption system 200 including the electrostatic disk 250, and utilizes the first absorbing unit 210 of the absorbing device 200a and The second absorbing unit 220 sucks the first substrate as shown in steps 701 and 702.

Then, the first absorbing unit 210 and the second absorbing unit 220 are lifted up by the actuating mechanism 230a, and the first substrate is sucked by the electrostatic disk 250, as shown in step 703.

In step 703, when the bottom surfaces of the first absorbing unit 210 and the second absorbing unit 220 are coplanar with the bottom surface of the electrostatic disk 250, the first substrate is simultaneously used by the first absorbing unit 210 and the second absorbing unit 220. The electrostatic disk 250 is sucked. Then, the actuating mechanism 230a continues to lift the first absorbing unit 210 and the second The unit 420 is slid, and the first absorbing unit 210 and the second absorbing unit 220 are movably passed through the electrostatic disk 250 and moved into the accommodating portion 201b of the body 201, so that the first substrate is only sucked by the electrostatic disk 250. With.

After step 703 is performed, the body 201 is moved to move the electrostatic disk 250 to align the first substrate and the second substrate, as shown in step 704. Next, the main body 201 is moved down, and the electrostatic disk 250 is moved downward to bond the first substrate and the second substrate sucked by the electrostatic disk 250, as shown in steps 705 and 706.

Referring to Figures 3a and 3b, there are shown bottom views of a sorption device in accordance with yet another embodiment of the present invention. The arrangement of the absorbing devices 300a and 300b and the structure thereof are substantially the same as those of the absorbing device 200a, and the difference therebetween is that the second absorbing units 320 of the absorbing devices 300a and 300b have different arrangements.

In the absorbing device 300a, each of the second absorbing units 320 is parallel to each other, and the second absorbing unit 320 is not perpendicular to the first absorbing unit 310; in the absorbing device 300b, a portion of the second absorbing unit The units 320 are not parallel to each other, and the second absorbing unit 320 may be perpendicular or non-perpendicular to the first absorbing unit 310. In an embodiment, the second absorbing unit 320 and the first absorbing unit 310 can adjust the configurations of the first absorbing unit 310 and the second absorbing unit 320 according to the shape, area or weight of the sorbed object, and Their respective absorbing forces meet the needs of different sorbents.

Please refer to FIG. 4, which is a bottom view of a sorption device according to still another embodiment of the present invention. In an embodiment, the configuration of the absorbing device 400a and its structure are substantially the same as the configuration of the absorbing device 100a and its structure, and the second absorbing unit 420 is perpendicular to each of the first absorbing units. 410, and the first sorption units 410 are parallel to each other. The difference between the two is that the second sorption unit 420 in the sorption device 400a is connected to each of the first sorption units 410. In another embodiment, the second absorbing unit 420 may also connect two or more of the first absorbing units 410, but not each of the first absorbing units 410.

5 and 5a, wherein FIG. 5 is a bottom view of the absorbing device according to still another embodiment of the present invention, and FIG. 5a is a further enlarged view of the present invention according to Part B of FIG. A bottom view of the sorption device of the embodiment. In one embodiment, the configuration of the absorbing device 500a and its structure are substantially the same as the configuration of the absorbing device 400a and its structure, the difference being that the absorbing device 500a further includes an electrostatic disk 550, and the electrostatic disk 550 is disposed at Between the first absorbing unit 510 and the second absorbing unit 520, each of the first absorbing units 510 and each of the second absorbing units 520 are movably passed through the electrostatic disc 550.

According to the foregoing embodiments of the present invention, the first absorbing unit and the second absorbing unit of the absorbing device of the present invention can be used to suck the sorbed object, and the second absorbing unit is extended by the first absorbing unit. The unit can effectively solve the defects caused by the sag of the sorbent due to the uneven suction.

Secondly, depending on the shape and area of the sorbed object, the position of the second absorbing member, and the number of absorbing members and their arrangement positions can be adjusted to enhance the sorption effect of the absorbing device on the sorbed object. .

Furthermore, the absorbing device of the present invention can effectively avoid the defects of the conventional sag deformation by the absorbing member by using the second absorbing unit and the electrostatic disk.

The present invention has been disclosed in the above embodiments, and is not intended to limit the present invention. Any one of ordinary skill in the art to which the present invention pertains can make various changes without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.

100a‧‧‧Sucking device

110‧‧‧First sorption unit

120‧‧‧second sorption unit

110a/120a‧‧‧Connecting components

110b/120b‧‧‧Sucking components

130‧‧‧Connecting parts

130a‧‧‧ actuation agency

140‧‧‧ interval area

Claims (14)

A absorbing device comprising: a plurality of first absorbing units, wherein the first absorbing units are spaced apart and defines at least one spacing area; and a plurality of second absorbing units are disposed at the first At least one of the absorbing units extends into at least one of the at least one spaced regions. A absorbing device comprising: a plurality of first absorbing units, wherein the first absorbing units are spaced apart and define at least one spacing area; and the plurality of second absorbing units are disposed at the first absorbing units And at least one of the cells extends into at least one of the at least one spacer region; and a plurality of electrostatic disks are respectively disposed in the spacer region, and each of the plurality of electrostatic disks has a corresponding second sorption a plurality of recesses of the unit, such that each of the second absorbing units movably passes through the corresponding recesses. The sorption device of claim 1 or 2, wherein at least two of the second sorption units are parallel to each other. The absorbing device according to claim 1, further comprising at least one connecting member, and the at least one connecting member is connected to the first absorbing unit. The absorbing device of claim 1 or 2, wherein at least one of the second absorbing units is perpendicular to the first absorbing units. The sorption device of claim 1 or 2, wherein the first sorption units are parallel to each other. The absorbing device of claim 1 or 2, wherein at least one of the first absorbing unit and the second absorbing unit has a connecting element and a plurality of locating elements disposed on the connecting element Suck the component. The absorbing device of claim 2, further comprising at least one connecting member, and the at least one connecting member is connected to the first absorbing unit. A absorbing device comprising: a plurality of first absorbing units, wherein the first absorbing units are separately disposed; a plurality of second absorbing units, at least one of the second absorbing units connecting the first At least two of the absorbing units; a plurality of electrostatic disks disposed between the first absorbing unit and the second absorbing units, wherein each of the first absorbing units and each of the second absorbing units are movably Pass through the electrostatic disks. The sorbent device of claim 9, wherein the first sorption units are parallel to each other. A sorption system is disposed on a body, and the sorption system comprises: an actuating mechanism; and a absorbing device according to claim 4, wherein the connecting member of the absorbing device is connected to the absorbing device Actuation mechanism. A sorption system is disposed on a body, and the sorption system comprises: an actuating mechanism; and a absorbing device according to claim 8, wherein the connecting member is connected to the actuating mechanism, and the The electrostatic disk is disposed on a bottom of the body. A method of bonding a substrate, comprising: providing a first substrate and a second substrate; providing a sorption system according to claim 11; absorbing the device by the absorbing device of the sorption system First substrate; Lifting the absorbing device by the actuating mechanism; moving the absorbing device to align the first substrate and the second substrate; and moving the absorbing device downward to fit the first substrate and the second substrate . A method of bonding a substrate, comprising: providing a first substrate and a second substrate; providing a sorption system according to claim 12; wherein the first absorbing unit and the second The first substrate is sucked by the absorbing unit; the first substrate is lifted by the first absorbing unit and the second absorbing units, and the first absorbing unit and the second absorbing unit are When the electrostatic disks are coplanar, the first substrate is sucked by the electrostatic disks, and the first absorbing units and the second absorbing units are movably passed through the electrostatic disks and moved to the body One of the accommodating portions; moving the electrostatic disks to align the first substrate and the second substrate; and moving the electrostatic disks downward to bond the first substrate and the second substrate.