US20080068567A1 - Exposure Apparatus, Exposure Method, and Method for Producing Device - Google Patents

Exposure Apparatus, Exposure Method, and Method for Producing Device Download PDF

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Publication number
US20080068567A1
US20080068567A1 US11/628,507 US62850705A US2008068567A1 US 20080068567 A1 US20080068567 A1 US 20080068567A1 US 62850705 A US62850705 A US 62850705A US 2008068567 A1 US2008068567 A1 US 2008068567A1
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Prior art keywords
liquid
substrate
exposure apparatus
light beam
exposure
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US11/628,507
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English (en)
Inventor
Hiroyuki Nagasaka
Minoru Onda
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Nikon Corp
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Nikon Corp
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Publication of US20080068567A1 publication Critical patent/US20080068567A1/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70225—Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
    • G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties

Definitions

  • the present invention relates to an exposure apparatus for exposing a substrate through a liquid, an exposure method, and a method for producing a device.
  • Semiconductor devices and liquid crystal display devices are produced by means of the so-called photolithography technique in which a pattern formed on a mask is transferred onto a photosensitive substrate.
  • the exposure apparatus which is used in the photolithography step, includes a mask stage for supporting the mask and a substrate stage for supporting the substrate.
  • the pattern on the mask is transferred onto the substrate via a projection optical system while successively moving the mask stage and the substrate stage.
  • it is demanded to realize the higher resolution of the projection optical system in order to respond to the further advance of the higher integration of the device pattern.
  • the resolution of the projection optical system becomes higher.
  • the numerical aperture of the projection optical system is larger, the resolution of the projection optical system becomes higher.
  • the exposure wavelength which is used for the exposure apparatus, is shortened year by year, and the numerical aperture of the projection optical system is increased as well.
  • the exposure wavelength, which is dominantly used at present, is 248 nm of the KrF excimer laser.
  • the exposure wavelength of 193 nm of the ArF excimer laser which is shorter than the above, is also practically used in some situations.
  • the depth of focus (DOF) is also important in the same manner as the resolution.
  • the resolution R and the depth of focus ⁇ are represented by the following expressions respectively.
  • R k 1 ⁇ /NA (1)
  • ⁇ ⁇ k 2 ⁇ /NA 2 (2)
  • ⁇ represents the exposure wavelength
  • NA represents the numerical aperture of the projection optical system
  • k 1 and k 2 represent the process coefficients.
  • the liquid immersion method has been suggested, which is disclosed, for example, in International Publication No. 99/49504 as a method for substantially shortening the exposure wavelength and widening the depth of focus.
  • the space between the lower surface of the projection optical system and the substrate surface is filled with a liquid such as water or any organic solvent to form a liquid immersion area so that the resolution is improved and the depth of focus is magnified about n times by utilizing the fact that the wavelength of the exposure light beam in the liquid is 1/n as compared with that in the air (n represents the refractive index of the liquid, which is about 1.2 to 1.6 in ordinary cases).
  • the liquid in the liquid immersion area formed on the substrate makes contact with the optical element which is arranged most closely to the image plane among a plurality of elements (optical elements) for constructing the projection optical system.
  • the optical element which is arranged most closely to the image plane, may be polluted with the contaminated liquid in the liquid immersion area.
  • any inconvenience arises, for example, such that the light transmittance of the optical element is lowered and/or any distribution appears in the light transmittance. As a result, there is such a possibility that the exposure accuracy and the measurement accuracy, which are obtained via the projection optical system, are deteriorated.
  • a scanning type exposure apparatus which exposes the substrate with the pattern formed on the mask while synchronously moving the mask and the substrate in the scanning direction, is also disclosed in International Publication No. 99/49504 described above.
  • the scanning type exposure apparatus it is required to realize the high speed for the scanning velocity (scanning speed) in order to improve, for example, the productivity of the device.
  • the high scanning velocity is realized, the following possibility arises. That is, it is difficult to maintain the liquid immersion area to have a desired size.
  • the present invention adopts the following constructions corresponding to FIGS. 1 to 16 as illustrated in embodiments.
  • parenthesized reference numerals affixed to respective elements merely exemplify the elements by way of example, with which it is not intended to limit the respective elements.
  • an exposure apparatus which exposes a substrate (P) by radiating an exposure light beam (EL) onto the substrate (P) through a liquid (LQ 1 );
  • the exposure apparatus comprising a projection optical system (PL) which has a plurality of elements (LS 1 to LS 7 ) including a first element (LS 1 ) closest to an image plane and a second element (LS 2 ) which is second closest to the image plane with respect to the first element (LS 1 ); wherein the first element (LS 1 ) has a first surface (T 1 ) which is arranged opposite to a surface of the substrate (P) and through which the exposure light beam (EL) passes, and a second surface (T 2 ) which is arranged opposite to the second element (LS 2 ) and through which the exposure light beam (EL) passes; the first element (LS 1 ) and the second element (LS 2 ) are supported in a substantially stationary state with respect to an optical axis (AX) of the projection optical system
  • the space between the substrate and the first surface of the first element is filled with the first liquid, and the space between the second element and the second surface of the first element is filled with the second liquid. Accordingly, the substrate can be exposed satisfactorily in a state in which the large image side numerical aperture of the projection optical system PL is secured.
  • the first liquid which is on the side of the first surface, makes contact with the substrate, there is such a high possibility that the side of the first surface of the first element may be polluted.
  • the first element can be constructed to be easily exchangeable, because each of the side of the first surface of the first element and the side of the second surface of the first element is filled with the liquid.
  • the exposure and the measurement can be performed satisfactorily via the liquids and the projection optical system provided with the clean first element.
  • the second liquid locally forms the liquid immersion area in only the partial area, including the area through which the exposure light beam passes, of the second surface of the first element. Accordingly, the second liquid can be prevented from any leakage from the circumference of the second surface of the first element. Therefore, it is possible to avoid the deterioration of any mechanical part or the like disposed around the first element, which would be otherwise caused by the leaked second liquid. Further, it is possible to avoid the inflow of the liquid, for example, into the support section for supporting the first element, by locally forming the liquid immersion area of the second liquid on the second surface of the first element.
  • the second liquid makes no contact, for example, with the support section for supporting the element, because the second liquid locally forms the liquid immersion area on the second surface. Therefore, it is possible to avoid the inconvenience which would be otherwise caused, for example, such that the second liquid for forming the liquid immersion area is mixed with any impurity generated from the support section or the like. Therefore, the exposure process and the measurement process can be performed satisfactorily in a state in which the cleanness of the second liquid is maintained.
  • the first element which is referred to in the present invention, may be a transparent member having no refractive power (for example, a parallel flat plate or plane parallel plate).
  • the transparent member is regarded as the first element.
  • the first element and the second element which are referred to in the present invention, are supported in the substantially stationary state with respect to the optical axis (exposure light beam) of the projection optical system.
  • the element is “supported in the substantially stationary state”.
  • an exposure apparatus which exposes a substrate (P) by radiating an exposure light beam (EL) onto the substrate (P) through a liquid (LQ 1 );
  • the exposure apparatus comprising a projection optical system (PL) which has a plurality of elements (LS 1 to LS 7 ) including a first element (LS 1 ) closest to an image plane and a second element (LS 2 ) which is second closest to the image plane with respect to the first element (LS 1 ); wherein the first element (LS 1 ) has a first surface (T 1 ) which is arranged opposite to a surface of the substrate (P) and through which the exposure light beam (EL) passes, and a second surface (T 2 ) which is arranged opposite to the second element (LS 2 ) and through which the exposure light beam (EL) passes; an outer diameter (D 3 ) of a surface (T 3 ) of the second element (LS 2 ) opposed to the first element (LS 1 ) is smaller than an outer diameter
  • the outer diameter (D 3 ) of the opposing surface of the second element opposed to the first element is smaller than the outer diameter (D 2 ) of the second surface of the first element. Accordingly, the liquid immersion area, which has the size corresponding to the surface of the second element, can be formed locally on the second surface of the first element, while covering the opposing surface with the second liquid. Therefore, the second liquid can be prevented from any leakage from the circumference of the second surface of the first element. It is possible to avoid the deterioration of any mechanical part or the like disposed around the first element, which would be otherwise caused by the leaked second liquid.
  • the inflow of the liquid for example, into the support section for supporting the first element, by locally forming the liquid immersion area of the second liquid on the second surface of the first element. It is possible to avoid the deterioration of the support section.
  • the second liquid makes no contact, for example, with the support section for supporting the element, because the second liquid locally forms the liquid immersion area on the second surface. Therefore, it is possible to avoid the inconvenience which would be otherwise caused, for example, such that the second liquid for forming the liquid immersion area is mixed with any impurity generated from the support section or the like. Therefore, it is possible to maintain the cleanness of the second liquid.
  • the substrate When the exposure light beam is radiated onto the substrate via the second liquid of the liquid immersion area formed locally on the second surface and the first liquid of the liquid immersion area formed on the side of the first surface, the substrate can be exposed satisfactorily in the state in which the large image side numerical aperture of the projection optical system is secured.
  • Each of the side of the first surface of the first element and the side of the second surface of the first element is filled with the liquid. Accordingly, the first element can be constructed to be easily exchangeable. Therefore, only the polluted first element can be exchanged with another clean element. The exposure and the measurement can be performed satisfactorily via the liquids and the projection optical system provided with the clean first element.
  • the first element which is referred to in the present invention, may be a transparent member having no refractive power (for example, a parallel flat plate or plane parallel plate).
  • the transparent member is regarded as the first element and as a part of the projection optical system.
  • the first element and the second element which are referred to in the present invention, are supported in the substantially stationary state with respect to the optical axis (exposure light beam) of the projection optical system.
  • the element is “supported in the substantially stationary state”.
  • an exposure apparatus which exposes a substrate (P) by radiating an exposure light beam (EL) onto the substrate (P) through a first liquid (LQ 1 );
  • the exposure apparatus comprising a projection optical system (PL) which includes a plurality of elements (LS 1 to LS 7 ) and which has a first element (LS 1 ) closest to an image plane and a second element (LS 2 ) which is second closest to the image plane with respect to the first element (LS 1 ); and a first liquid immersion mechanism (for example, 11) which supplies the first liquid (LQ 1 );
  • the first element (LS 1 ) has a first surface (T 1 ) which is arranged opposite to a surface of the substrate (P) and through which the exposure light beam (EL) passes, and a second surface (T 2 ) which is arranged opposite to the second element (LS 2 ) and which is substantially in parallel to the first surface (T 1 ); an outer diameter (D 2 ) of the second surface
  • the outer diameter of the second surface of the first element is greater than the outer diameter of the first surface. Accordingly, when the first element is supported by a support section, the support section, which supports the first element, can be provided at a position (end portion of the second surface) away from the optical axis of the first element. Therefore, it is possible to avoid the interference between the support section and any member or equipment or the like arranged around the first element, and it is possible to improve the degree of freedom of the design and the degree of freedom of the arrangement of the member or the equipment or the like. Further, it is possible to decrease the size of the liquid immersion area formed between the first surface and the substrate by the first liquid immersion mechanism, because the outer diameter of the first surface of the first element is sufficiently smaller than that of the second surface.
  • the first element which is referred to in the present invention, may be a transparent member having no refractive power (for example, a parallel flat plate or plane parallel plate).
  • a transparent member having no refractive power for example, a parallel flat plate or plane parallel plate.
  • an exposure apparatus which exposes a substrate (P) by radiating an exposure light beam (EL) onto the substrate (P) through a first liquid (LQ 1 );
  • the exposure apparatus comprising a first liquid immersion mechanism (for example, 11) which provides the first liquid onto the substrate; and a projection optical system (PL) which has a plurality of elements (LS 1 to LS 7 ) including a first element (LS 1 ) closest to an image plane and a second element (LS 2 ) which is second closest to the image plane with respect to the first element (LS 1 ); wherein the first element (LS 1 ) is arranged so that a first surface (T 1 ) of the first element is opposed to a surface of the substrate (P), and a second surface (T 2 ) of the first element is opposed to the second element (LS 2 ); a distance (H 1 ) between the first surface (T 1 ) and the second surface (T 2 ) of the first element (LS 1 ) on an
  • the distance between the first surface and the second surface of the first element i.e., the thickness of the first element is not less than 15 mm, and thus the first element is thick. Therefore, the degree of freedom of the position is increased for the member and the equipment or the like arranged around the first element. Accordingly, it is possible to avoid the interference between the support section and the member or equipment or the like arranged around the first element. As a result, it is possible to improve the degree of freedom of the design of the member or the equipment or the like. Accordingly, the support section, which supports the first element, can be provided at a position away from the optical axis of the first element.
  • the size of the liquid immersion area of the first liquid can be decreased by improving the degree of freedom of the design and the arrangement of the liquid immersion mechanism for forming the liquid immersion area of the first liquid.
  • the second liquid may be supplied also to the space between the first element and the second element without being limited to the first liquid supplied to the space between the first element and the substrate.
  • the polluted first element can be exchanged with another clean element.
  • the exposure and the measurement can be performed satisfactorily via the liquid and the projection optical system provided with the clean first element.
  • the first element is not less than 15 mm, the change of the shape of the first element, which would be otherwise caused by the force received from the liquid, can be suppressed. Therefore, it is possible to maintain the high image formation performance of the projection optical system.
  • the first element which is referred to in the present invention, may be a transparent member having no refractive power (for example, a parallel flat plate or plane parallel plate).
  • a transparent member having no refractive power for example, a parallel flat plate or plane parallel plate.
  • an exposure apparatus which exposes a substrate by radiating an exposure light beam (EL) onto the substrate (P) through a first liquid (LQ 1 ); the exposure apparatus comprising a first liquid immersion mechanism (for example, 11) which provides the first liquid (LQ 1 ) onto the substrate (P); and a projection optical system (PL) which has a plurality of elements including a first element (LS 1 ) closest to an image plane and a second element (LS 1 ) which is second closest to the image plane with respect to the first element; wherein the first element has a first surface (T 1 ) which is arranged opposite to a surface of the substrate and through which the exposure light beam passes, and a second surface (T 2 ) which is arranged opposite to the second element and through which the exposure light beam passes; a distance between the first surface (T 1 ) and the second surface (T 2 ) of the first element on an optical axis (AX) of the projection optical system is greater than a distance
  • the substrate can be exposed satisfactorily in a state in which the large image side numerical aperture of the projection optical system is secured, by radiating the exposure light beam onto the substrate through the first liquid and the second liquid.
  • the first element is thick, and thus the support section, which supports the first element, can be provided at a position away from the optical axis.
  • the degree of freedom is increased, for example, for the arrangement of the member and the equipment arranged around the first element. Further, it is possible to suppress the change of the shape of the first element, which would be otherwise caused by the force received from the liquid. Therefore, it is possible to maintain the high image formation performance of the projection optical system.
  • an exposure apparatus which exposes a substrate (P) by radiating an exposure light beam (EL) onto the substrate (P) through a first liquid (LQ 1 );
  • the exposure apparatus comprising a first liquid immersion mechanism (for example, 11) which provides the first liquid (LQ 1 ) onto the substrate (P) to form a liquid immersion area (LR 1 ) of the first liquid (LQ 1 ) on a part of the substrate (P); and a projection optical system (PL) which has a plurality of elements including a first element (LS 1 ) closest to an image plane and a second element (LS 2 ) which is second closest to the image plane with respect to the first element; wherein the first element has a first surface (T 1 ) which is arranged opposite to a surface of the substrate and through which the exposure light beam passes, and a second surface (T 2 ) which is arranged opposite to the second element and through which the exposure light beam passes;
  • the first liquid immersion mechanism has a flat liquid contact
  • the substrate can be exposed satisfactorily in a state in which the large image side numerical aperture of the projection optical system is secured, by radiating the exposure light beam onto the substrate through the first liquid and the second liquid.
  • the flat liquid contact surface is arranged opposite to the surface of the substrate around the optical path for the exposure light beam, between the first element and the substrate. Therefore, it is possible to continuously fill the optical path between the first element and the substrate with the first liquid.
  • the space between the first element and the second element can be reliably filled with the second liquid.
  • the exposure light beam is radiated onto the substrate through the first liquid and the second liquid, and thus the substrate can be satisfactorily exposed in a state in which the large image side numerical aperture of the projection optical system is secured.
  • a method for producing a device comprising using the exposure apparatus or the exposure method described above. According to the present invention, it is possible to satisfactorily maintain the exposure accuracy and the measurement accuracy. Therefore, it is possible to produce the device having the desired performance.
  • FIG. 1 shows a schematic arrangement illustrating an exposure apparatus according to an embodiment of the present invention.
  • FIG. 2 shows a schematic perspective view illustrating those disposed in the vicinity of a nozzle member.
  • FIG. 3 shows a perspective view illustrating the nozzle member as viewed from a lower position.
  • FIG. 4 shows a side sectional view illustrating those disposed in the vicinity of the nozzle member.
  • FIGS. 5 ( a ) and 5 ( b ) illustrate a second liquid immersion mechanism.
  • FIG. 6 shows a plan view illustrating a second surface of a first element.
  • FIG. 7 illustrates the operation for recovering the second liquid by the second liquid immersion mechanism.
  • FIGS. 8 ( a ) and 8 ( b ) schematically illustrate the operation for recovering the liquid by a first liquid immersion mechanism according to the present invention.
  • FIGS. 9 ( a ) and 9 ( b ) schematically show a comparative example of the operation for recovering the liquid.
  • FIG. 10 schematically shows a modified embodiment of a first element.
  • FIG. 11 shows a perspective view illustrating a modified embodiment of the nozzle member as viewed from a lower position.
  • FIG. 12 shows a sectional view illustrating major parts to depict another embodiment of the present invention.
  • FIG. 13 shows a sectional view illustrating major parts to depict another embodiment of the present invention.
  • FIG. 14 shows a sectional view illustrating major parts to depict another embodiment of the present invention.
  • FIG. 15 shows a flow chart illustrating exemplary steps of producing a semiconductor device.
  • FIG. 16 illustrates the operation for recovering the liquid by a first liquid recovery mechanism in another embodiment of the present invention.
  • FIG. 1 shows a schematic arrangement illustrating an exposure apparatus according to an embodiment of the present invention.
  • the exposure apparatus EX includes a mask stage MST which is movable while holding a mask M, a substrate stage PST which is movable while holding a substrate P, an illumination optical system IL which illuminates, with an exposure light beam EL, the mask M held by the mask stage MST, a projection optical system PL which performs the projection exposure for the substrate P held by the substrate stage PST with an image of a pattern of the mask M illuminated with the exposure light beam EL, and a control unit CONT which integrally controls the operation of the entire exposure apparatus EX.
  • a mask stage MST which is movable while holding a mask M
  • a substrate stage PST which is movable while holding a substrate P
  • an illumination optical system IL which illuminates, with an exposure light beam EL
  • the mask M held by the mask stage MST the mask M held by the mask stage MST
  • a projection optical system PL which performs the projection
  • the exposure apparatus EX of the embodiment of the present invention is a liquid immersion exposure apparatus to which the liquid immersion method is applied in order that the exposure wavelength is substantially shortened to improve the resolution and the depth of focus is substantially widened.
  • the exposure apparatus EX includes a first liquid immersion mechanism 1 which fills, with the first liquid LQ 1 , the space between the substrate P and a lower surface T 1 of a first optical element LS 1 closest to the image plane of the projection optical system PL, among a plurality of optical elements LS 1 to LS 7 for constructing the projection optical system PL.
  • the substrate P is provided on the side of the image plane of the projection optical system PL.
  • the lower surface T 1 of the first optical element LS 1 is arranged opposite to the surface of the substrate P.
  • the first liquid immersion mechanism 1 includes a first liquid supply mechanism 10 which supplies the first liquid LQ 1 to the space between the substrate P and the lower surface T 1 of the first optical element LS 1 , and a first liquid recovery mechanism 20 which recovers the first liquid LQ 1 supplied by the first liquid supply mechanism 10 .
  • the operation of the first liquid immersion mechanism 1 is controlled by the control unit CONT.
  • the exposure apparatus EX includes a second liquid immersion mechanism 2 which fills, with the second liquid LQ 2 , the space between the first optical element LS 1 and the second optical element LS 2 which is the next closest to the image plane of the projection optical system PL with respect to the first optical element LS 1 .
  • the second optical element LS 2 is arranged over (above) the first optical element LS 1 . That is, the second optical element LS 2 is arranged on the side of the light-incident surface of the first optical element LS 1 .
  • the upper surface T 2 of the first optical element LS 1 is arranged opposite to the lower surface T 3 of the second optical element LS 2 .
  • the second liquid immersion mechanism 2 includes a second liquid supply mechanism 30 which supplies the second liquid LQ 2 to the space between the first optical element LS 1 and the second optical element LS 2 , and a second liquid recovery mechanism 40 which recovers the second liquid LQ 2 supplied by the second liquid supply mechanism 30 .
  • the operation of the second liquid immersion mechanism 2 is controlled by the control unit CONT.
  • the first optical element LS 1 is a parallel flat plate having no refractive power through which the exposure light beam EL is transmissive.
  • the lower surface T 1 and the upper surface T 2 of the first optical element LS 1 are substantially in parallel to each other.
  • the image formation characteristics including, for example, the aberration are set within predetermined allowable ranges for the projection optical system PL including the first optical element LS 1 .
  • the space (first space) K 1 between the first optical element LS 1 and the substrate P and the space (second space) K 2 between the first optical element LS 1 and the second optical element LS 2 are spaces which are independent from each other.
  • the control unit CONT can independently perform the supply operation and the recovery operation for the first liquid LQ 1 with respect to the first space K 1 by the first liquid immersion mechanism 1 and the supply operation and the recovery operation for the second liquid LQ 2 with respect to the second space K 2 by the second liquid immersion mechanism 2 .
  • the liquid (LQ 1 , LQ 2 ) neither comes in nor goes out from one to the other of the first space K 1 and the second space K 2 .
  • the exposure apparatus EX is operated as follows at least during the period in which the image of the pattern of the mask M is projected onto the substrate P. That is, the space between the first optical element LS 1 and the substrate P arranged on the image plane side thereof is filled with the first liquid LQ 1 by using the first liquid immersion mechanism 1 to form the first liquid immersion area LR 1 , and the space between the first optical element LS 1 and the second optical element LS 2 is filled with the second liquid LQ 2 by using the second liquid immersion mechanism 2 to form the second liquid immersion area LR 2 .
  • the exposure apparatus EX adopts the local liquid immersion system wherein the first liquid immersion area LR 1 , which is greater than the projection area AR and which is smaller than the substrate P, is locally formed on a part of the substrate P, the part including the projection area AR of the projection optical system PL.
  • the exposure apparatus EX locally forms the second liquid immersion area LR 2 of the second liquid LQ 2 in only a partial area, including the area AR′, of the upper surface T 2 of the first optical element LS 1 through which the exposure light beam EL passes.
  • the exposure apparatus EX performs the projection exposure for the substrate P with the pattern of the mask M such that the exposure light beam EL, which has passed through the mask M, is radiated onto the substrate P via the projection optical system PL, the second liquid LQ 2 in the second liquid immersion area LR 2 , and the first liquid LQ 1 in the first liquid immersion area LR 1 .
  • a nozzle member 70 which will be described in detail later on, is arranged in the vicinity of the image plane of the projection optical system PL, specifically in the vicinity of the optical element LS 1 disposed at the end on the image plane side of the projection optical system PL.
  • the nozzle member 70 is an annular member which is provided to surround the end portion of the projection optical system PL over (above) the substrate P (substrate stage PST). In this embodiment, the nozzle member 70 constructs a part of the first liquid immersion mechanism 1 .
  • the embodiment of the present invention will be explained as exemplified by a case of the use of the scanning type exposure apparatus (so-called scanning stepper) as the exposure apparatus EX in which the substrate P is exposed with the pattern formed on the mask M while synchronously moving the mask M and the substrate P in mutually different directions (opposite directions) in the scanning directions.
  • scanning stepper the scanning type exposure apparatus
  • the Z axis direction is the direction which is coincident with the optical axis AX of the projection optical system PL
  • the X axis direction is the synchronous movement direction (scanning direction) for the mask M and the substrate P in the plane perpendicular to the Z axis direction
  • the Y axis direction is the direction (non-scanning direction) perpendicular to the Z axis direction and the X axis direction.
  • the directions of rotation (inclination) about the X axis, the Y axis, and the Z axis are designated as ⁇ X, ⁇ Y, and ⁇ Z directions respectively.
  • the exposure apparatus EX includes a base BP which is provided on the floor surface, and a main column 9 which is installed on the base BP.
  • the main column 9 is formed with an upper step 7 and a lower step 8 which protrude inwardly.
  • the illumination optical system IL illuminates, with the exposure light beam EL, the mask M supported by the mask stage MST.
  • the illumination optical system IL is supported by a support frame 3 which is fixed to the upper portion of the main column 9 .
  • the illumination optical system IL includes, for example, an exposure light source which radiates the exposure light beam EL, an optical integrator which uniformizes the illuminance of the exposure light beam EL radiated from the exposure light source, a condenser lens which collects the exposure light beam EL emitted from the optical integrator, a relay lens system, and a variable field diaphragm which sets the illumination area on the mask M formed by the exposure light beam EL to be slit-shaped.
  • the predetermined illumination area on the mask M is illuminated with the exposure light beam EL having a uniform illuminance distribution by the illumination optical system IL.
  • Those usable as the exposure light beam EL radiated from the exposure light source include, for example, emission lines (g-ray, h-ray, i-ray) radiated, for example, from a mercury lamp, far ultraviolet light beams (DUV light beams) such as the KrF excimer laser beam (wavelength: 248 nm), and vacuum ultraviolet light beams (VUV light beams) such as the ArF excimer laser beam (wavelength: 193 nm) and the F 2 laser beam (wavelength: 157 nm).
  • DUV light beams far ultraviolet light beams
  • ArF excimer laser beam wavelength: 193 nm
  • F 2 laser beam wavelength: 157 nm
  • the ArF excimer laser beam is used.
  • pure water is used for the first liquid LQ 1 to be supplied from the first liquid supply mechanism 10 and the second liquid LQ 2 to be supplied from the second liquid supply mechanism 30 . That is, in this embodiment, the first liquid LQ 1 and the second liquid LQ 2 are the same liquid.
  • Those capable of being transmitted through pure water are not limited to the ArF excimer laser beam, and also include the emission line (g-ray, h-ray, i-ray) radiated, for example, from a mercury lamp and the far ultraviolet light beam (DUV light beam) such as the KrF excimer laser beam (wavelength: 248 nm).
  • the mask stage MST is movable while holding the mask M.
  • the mask stage MST holds the mask M by the vacuum attraction (or the electrostatic attraction).
  • a plurality of gas bearings (air bearings) 85 which are non-contact bearings, are provided on the lower surface of the mask stage MST.
  • the mask stage MST is supported in a non-contact manner by the air bearings 85 with respect to the upper surface (guide surface) of a mask surface plate (mask base plate) 4 . Openings MK 1 , MK 2 , through which the image of the pattern of the mask M passes, are formed at central positions of the mask stage MST and the mask surface plate 4 respectively.
  • the mask surface plate 4 is supported by the upper step 7 of the main column 9 via an anti-vibration unit 86 .
  • the mask stage MST is supported by the main column 9 (upper step 7 ) via the anti-vibration unit 86 and the mask surface plate 4 .
  • the mask surface plate 4 and the main column 9 are isolated from each other in terms of the vibration by the anti-vibration unit 86 so that the vibration of the main column 9 is not transmitted to the mask surface plate 4 which supports the mask stage MST.
  • the mask stage MST is movable two-dimensionally in the plane perpendicular to the optical axis AX of the projection optical system PL, i.e., in the XY plane, and it is finely rotatable in the OZ direction on the mask surface plate 4 in a state in which the mask M is held in accordance with the driving of the mask stage-driving unit MSTD including a linear motor or the like controlled by the control unit CONT.
  • the mask stage MST is movable at a designated scanning velocity in the X axis direction.
  • the mask stage MST has a movement stroke in the X axis direction to such an extent that the entire surface of the mask M can traverse at least the optical axis AX of the projection optical system PL.
  • a movement mirror 81 which is movable together with the mask stage MST, is provided on the mask stage MST.
  • a laser interferometer 82 is provided at a position opposed to the movement mirror 81 .
  • the position in the two-dimensional direction and the angle of rotation in the ⁇ Z direction (including the angles of rotation in the ⁇ X and ⁇ Y directions in some cases) of the mask M on the mask stage MST are measured in real-time by the laser interferometer 82 .
  • the result of the measurement performed by the laser interferometer 82 is outputted to the control unit CONT.
  • the control unit CONT drives the mask stage-driving unit MSTD on the basis of the result of the measurement obtained by the laser interferometer 82 to thereby control the position of the mask M held by the mask stage MST.
  • the projection optical system PL projects the pattern on the mask M onto the substrate P at a predetermined projection magnification P to perform the exposure.
  • the projection optical system PL is constructed of the plurality of optical elements LS 1 to LS 7 including the first optical element LS 1 which is provided at the end portion on the side of the substrate P.
  • the plurality of optical elements LS 1 to LS 7 are supported by the barrel PK.
  • the projection optical system PL is the reduction system in which the projection magnification P is, for example, 1 ⁇ 4, 1 ⁇ 5, or 1 ⁇ 8.
  • the projection optical system PL may be any one of the 1 ⁇ magnification system and the magnifying system.
  • the projection optical system PL may be any one of the cata-dioptric system including dioptric and catoptric elements, the dioptric system including no catoptric element, and the catoptric system including no dioptric element.
  • the exposure light beam EL which is radiated from the illumination optical system IL, comes into the projection optical system PL from the side of the object plane, and the exposure light beam passes through the plurality of optical elements LS 7 to LS 1 . After that, the exposure light beam EL outgoes from the side of the image plane of the projection optical system PL, and the exposure light beam EL arrives at the surface of the substrate P.
  • the exposure light beam EL passes through the plurality of optical elements LS 7 to LS 3 respectively, and then the exposure light beam EL passes through the predetermined area of the upper surface T 4 of the second optical element LS 2 . Then, the exposure light beam EL passes through the predetermined area of the lower surface T 3 of the second optical element LS 2 , and then the exposure light beam EL comes into the second liquid immersion area LR 2 .
  • the exposure light beam EL which has passed through the second liquid immersion area LR 2 , passes through the predetermined area of the upper surface T 2 of the first optical element LS 1 , and then the exposure light beam EL passes through the predetermined area of the lower surface T 1 of the first optical element LS 1 . Then, the exposure light beam EL comes into the first liquid immersion area LR 1 , and then the exposure light beam EL arrives at the surface of the substrate P.
  • a flange PF is provided at the outer circumference of the barrel PK which holds the projection optical system PL.
  • the projection optical system PL is supported by a barrel surface plate (barrel base plate) 5 via the flange PF.
  • the barrel surface plate 5 is supported by the lower step 8 of the main column 9 via an anti-vibration unit 87 . That is, in this arrangement, the projection optical system PL is supported by the main column 9 (lower step 8 ) via the anti-vibration unit 87 and the barrel surface plate 5 .
  • the barrel surface plate 5 and the main column 9 are isolated from each other in terms of the vibration by the anti-vibration unit 87 so that the vibration of the main column 9 is not transmitted to the barrel surface plate 5 which supports the projection optical system PL.
  • the substrate stage PST is movable while supporting a substrate holder PH which holds the substrate P.
  • the substrate holder PH holds the substrate P by, for example, the vacuum attraction.
  • a plurality of gas bearings (air bearings) 88 which are non-contact bearings, are provided on the lower surface of the substrate stage PST.
  • the substrate stage PST is supported in a non-contact manner with respect to the upper surface (guide surface) of a substrate surface plate (substrate base plate) 6 by the air bearings 88 .
  • the substrate surface plate 6 is supported on the base BP via an anti-vibration unit 89 .
  • the substrate surface plate 6 , the main column 9 , and the base BP (floor surface) are isolated from one another in terms of the vibration by the anti-vibration unit 89 so that the vibration of the base BP (floor surface) and/or the main column 9 is not transmitted to the substrate surface plate 6 which supports the substrate stage PST.
  • the substrate stage PST is movable two-dimensionally in the XY plane, and it is finely rotatable in the ⁇ Z direction on the substrate surface plate 6 in a state in which the substrate P is held via the substrate holder PH in accordance with the driving of the substrate stage-driving unit PSTD including, for example, a linear motor controlled by the control unit CONT. Further, the substrate stage PST is also movable in the Z axis direction, the ⁇ X direction, and the ⁇ Y direction.
  • a movement mirror 83 which is movable together with the substrate stage PST with respect to the projection optical system PL, is provided on the substrate stage PST.
  • a laser interferometer 84 is provided at a position opposed to the movement mirror 83 .
  • the angle of rotation and the position in the two-dimensional direction of the substrate P on the substrate stage PST are measured in real-time by the laser interferometer 84 .
  • the exposure apparatus EX is provided with a focus/leveling detecting system which detects the information about the position of the surface of the substrate P supported by the substrate stage PST.
  • Those adoptable as the focus/leveling detecting system include, for example, the oblique incidence system in which the detecting light beam is radiated in an oblique direction onto the surface of the substrate P, and the system in which the capacitance type sensor is used.
  • the focus/leveling detecting system detects the information about the position in the Z axis direction of the surface of the substrate P and the information about the inclination in the ⁇ X and ⁇ Y directions of the substrate P through or not through the first liquid LQ 1 .
  • the surface information about the surface of the substrate P may be detected at any position away from the projection optical system PL.
  • An exposure apparatus which detects the surface information about the surface of the substrate P at any position away from the projection optical system PL, is disclosed, for example, in U.S. Pat. No. 6,674,510, contents of which are incorporated herein by reference within a range of permission of the domestic laws and ordinances of the state designated or selected in this international application.
  • the result of the measurement performed by the laser interferometer 84 is outputted to the control unit CONT.
  • the result of the detection performed by the focus/leveling detecting system is also outputted to the control unit CONT.
  • the control unit CONT drives the substrate stage-driving unit PSTD on the basis of the result of the detection performed by the focus/leveling detecting system to control the focus position and the angle of inclination of the substrate P so that the surface of the substrate P is adjusted to match the image plane of the projection optical system PL. Further, the substrate P is subjected to the position control in the X axis direction and the Y axis direction on the basis of the result of the measurement performed by the laser interferometer 84 .
  • a recess 90 is provided on the substrate stage PST.
  • the substrate holder PH for holding the substrate P is arranged in the recess 90 .
  • the upper surface 91 of the substrate stage PST except for the recess 90 is a flat surface (flat portion) which has substantially the same height as that of (is flush with) the surface of the substrate P held by the substrate holder PH.
  • the upper surface of the movement mirror 83 is also provided to be substantially flush with the upper surface 91 of the substrate stage PST.
  • the liquid immersion area LR 1 can be satisfactorily formed by retaining the liquid LQ on the image plane side of the projection optical system PL. It is also allowable that any difference in height is present between the surface of the substrate P and the upper surface 91 of the substrate stage PST provided that the liquid immersion area LR 1 can be maintained.
  • a gap of about 0.1 to 2 mm is provided between the edge portion of the substrate P and the flat surface (upper surface) 91 provided around the substrate P.
  • the liquid LQ scarcely flows into the gap owing to the surface tension of the liquid LQ. Even when the exposure is performed for the portion in the vicinity of the circumferential edge of the substrate P, it is possible to retain the liquid LQ under the projection optical system PL by the aid of the upper surface 91 .
  • the first liquid supply mechanism 10 of the first liquid immersion mechanism 1 is provided to supply the first liquid LQ 1 to the first space K 1 between the substrate P and the first optical element LS 1 of the projection optical system PL.
  • the first liquid supply mechanism 10 includes a first liquid supply section 11 which is capable of feeding the first liquid LQ 1 , and a first supply tube 13 which has one end connected to the first liquid supply section 11 . The other end of the first supply tube 13 is connected to the nozzle member 70 .
  • the first liquid supply mechanism 10 supplies pure water.
  • the first liquid supply section 11 includes, for example, a pure water-producing unit, and a temperature-adjusting unit which adjusts the temperature of the first liquid (pure water) LQ 1 to be supplied.
  • the first liquid supply mechanism 10 (first liquid supply section 11 ) is controlled by the control unit CONT.
  • the first liquid supply mechanism 10 supplies a predetermined amount of the first liquid LQ 1 onto the substrate P arranged on the side of the image plane of the projection optical system PL under the control of the control unit CONT.
  • a flow rate controller 16 called “mass flow controller”, which controls the liquid amount per unit time to be fed from the first liquid supply section 11 and supplied to the image plane side of the projection optical system PL, is provided at an intermediate position of the first supply tube 13 .
  • the control of the liquid supply amount by the flow rate controller 16 is performed in accordance with the instruction signal supplied from the control unit CONT.
  • the first liquid recovery mechanism 20 of the first liquid immersion mechanism 1 recovers the first liquid LQ 1 from the side of the image plane of the projection optical system PL.
  • the first liquid recovery mechanism 20 includes a first liquid recovery section 21 which is capable of recovering the first liquid LQ 1 , and a first recovery tube 23 which has one end connected to the first liquid recovery section 21 . The other end of the first recovery tube 23 is connected to the nozzle member 70 .
  • the first liquid recovery section 21 includes, for example, a vacuum system (suction unit) such as a vacuum pump, and a gas/liquid separator which separates the recovered first liquid LQ 1 from the gas.
  • the first liquid recovery mechanism 20 (first liquid recovery section 21 ) is controlled by the control unit CONT.
  • the first liquid recovery mechanism 20 recovers a predetermined amount of the first liquid LQ 1 from the surface of the substrate P supplied from the first liquid supply mechanism 10 in accordance with the control of the control unit CONT.
  • the second liquid supply mechanism 30 of the second liquid immersion mechanism 2 supplies the second liquid LQ 2 to the second space K 2 between the second optical element LS 2 and the first optical element LS 1 of the projection optical system PL.
  • the second liquid supply mechanism 30 includes a second liquid supply section 31 which is capable of feeding the second liquid LQ 2 , and a second supply tube 33 which has one end connected to the second liquid supply section 31 .
  • the other end of the second supply tube 33 is connected to the second space K 2 disposed between the first optical element LS 1 and the second optical element LS 2 , for example, via the supply flow passage ( 34 ) as described later on.
  • the second liquid supply mechanism 30 supplies pure water in the same manner as the first liquid supply mechanism 10 .
  • the second liquid supply section 31 includes, for example, a pure water-producing unit, and a temperature-adjusting unit which adjusts the temperature of the second liquid (pure water) LQ 2 to be supplied. It is also allowable to use a pure water-producing unit (utility power or power usage) of a factory in which the exposure apparatus EX is installed, instead of providing any pure water-producing unit for the exposure apparatus EX.
  • the operation of the second liquid supply mechanism 30 (second liquid supply section 31 ) is controlled by the control unit CONT.
  • the second liquid supply mechanism 30 supplies a predetermined amount of the second liquid LQ 2 onto the upper surface T 2 of the first optical element LS 1 in accordance with the control of the control unit CONT.
  • the pure water-producing unit may be used commonly for both of the first liquid immersion mechanism 1 and the second liquid immersion mechanism.
  • a mass flow controller which controls the liquid amount per unit time fed from the second liquid supply section 31 and supplied to the second space K 2 , may be also provided at an intermediate position of the second supply tube 33 .
  • the second liquid recovery mechanism 40 of the second liquid immersion mechanism 2 recovers the second liquid LQ 2 from the second space K 2 disposed between the second optical element LS 2 and the first optical element LS 1 of the projection optical system PL.
  • the second liquid recovery mechanism 40 includes a second liquid recovery section 41 which is capable of recovering the second liquid LQ 2 , and a second recovery tube 43 which has one end connected to the second liquid recovery section 41 .
  • the other end of the second recovery tube 43 is connected to the second space K 2 disposed between the first optical element LS 1 and the second optical element LS 2 , for example, via the recovery flow passage ( 44 ) as described later on.
  • the second liquid recovery section 41 includes, for example, a vacuum system (suction unit) such as a vacuum pump, and a gas/liquid separator which separates the recovered second liquid LQ 2 from the gas. It is also allowable that all of the components including, for example, the vacuum system and the gas/liquid separator are not provided for the exposure apparatus EX, but to use the equipment (utility power or power usage) of a factory or the like in which the exposure apparatus EX is arranged, in place of at least a part or parts of the components as described above.
  • the operation of the second liquid recovery mechanism 40 (second liquid recovery section 41 ) is controlled by the control unit CONT.
  • the second liquid recovery mechanism 40 recovers the second liquid LQ 2 , from the upper surface T 2 of the first optical element LS 1 , supplied from the second liquid supply mechanism 30 in accordance with the control of the control unit CONT.
  • the nozzle member 70 is held by a nozzle holder 92 , and the nozzle holder 92 is connected to the lower step 8 of the main column 9 .
  • the main column 9 which supports the nozzle member 70 via the nozzle holder 92 , is isolated via the anti-vibration unit 87 in terms of the vibration, from the barrel surface plate 5 which supports the barrel PK of the projection optical system PL via the flange PF. Therefore, the projection optical system PL is prevented from any transmission of the vibration generated by the nozzle member 70 .
  • the main column 9 which supports the nozzle member 70 via the nozzle holder 92 , is isolated via the anti-vibration unit 89 in terms of the vibration, from the substrate surface plate 6 which supports the substrate stage PST.
  • the substrate stage PST is prevented from any transmission of the vibration generated by the nozzle member 70 via the main column 9 and the base BP. Further, the main column 9 , which supports the nozzle member 70 via the nozzle holder 92 , is isolated via the anti-vibration unit 86 in terms of the vibration, from the mask surface plate 4 which supports the mask stage MST. Therefore, the mask stage MST is prevented from any transmission of the vibration generated by the nozzle member 70 via the main column 9 .
  • FIG. 2 shows, with partial cutout, a schematic perspective view illustrating those disposed in the vicinity of the nozzle member 70 .
  • FIG. 3 shows a perspective view illustrating the nozzle member 70 as viewed from a lower position.
  • FIG. 4 shows a side sectional view.
  • the nozzle member 70 is arranged in the vicinity of the end portion on the image plane side of the projection optical system PL.
  • the nozzle member 70 is an annular member which is provided to surround the circumference of the projection optical system PL over the substrate P (substrate stage PST).
  • the nozzle member 70 constructs a part of the first liquid immersion mechanism 1 .
  • the nozzle member 70 has a hole 70 H disposed at the central portion thereof in which the projection optical system PL can be arranged.
  • the first optical element LS 1 and the second optical element LS 2 are supported by the same barrel (support member) PK.
  • an inner side surface 70 T of the hole 70 H of the nozzle member 70 is provided opposite to a side surface PKT of the barrel PK.
  • a gap is provided between the inner side surface 70 T of the hole 70 H of the nozzle member 70 and the side surface PKT of the barrel PK of the projection optical system PL. The gap is provided in order to isolate the projection optical system PL from the nozzle member 70 in terms of the vibration. Accordingly, the vibration, which is generated in the nozzle member 70 , is prevented from being directly transmitted to the projection optical system PL.
  • the inner side surface of the hole 70 H of the nozzle member 70 is lyophobic or liquid-repellent (water-repellent) with respect to the liquid LQ. This suppresses any inflow of the liquid LQ into the gap between the side surface of the projection optical system PL and the inner side surface of the nozzle member 70 .
  • Those formed on the lower surface of the nozzle member 70 include a liquid supply port 12 for supplying the first liquid LQ 1 , and a liquid recovery port 22 for recovering the first liquid LQ 1 .
  • the liquid supply port 12 of the first liquid immersion mechanism 1 is appropriately referred to as “first supply port 12 ”
  • the liquid recovery port 22 of the first liquid immersion mechanism 1 is appropriately referred to as “first recovery port 22 ”.
  • Those formed in the nozzle member 70 include a first supply flow passage 14 which is connected to the first supply port 12 , and a first recovery flow passage 24 which is connected to the first recovery port 22 .
  • the other end of the first supply tube 13 is connected to the first supply flow passage 14 .
  • the other end of the first recovery tube 23 is connected to the first recovery flow passage 24 .
  • the first supply port 12 , the first supply flow passage 14 , and the first supply tube 13 construct parts of the first liquid supply mechanism 10 (first liquid immersion mechanism 1 ).
  • the first recovery port 22 , the first recovery flow passage 24 , and the first recovery tube 23 construct parts of the first liquid recovery mechanism 20 (first liquid immersion mechanism 1 ).
  • the first supply port 12 is provided, over the substrate P supported by the substrate stage PST, so as to oppose to the surface of the substrate P.
  • the first supply port 12 is separated or away from the surface of the substrate P by a predetermined distance.
  • the first supply port 12 is arranged to surround the projection area AR of the projection optical system PL onto which the exposure light beam EL is radiated.
  • the first supply port 12 is formed to have an annular slit-shaped configuration at the lower surface of the nozzle member 70 to surround the projection area AR as shown in FIG. 3 .
  • the projection area AR is set to have a rectangular shape in which the Y axis direction (non-scanning direction) is the longitudinal direction.
  • the first supply flow passage 14 is provided with a buffer flow passage portion 14 H which has a portion connected to the other end of the first supply port 13 , and an inclined flow passage portion 14 S which has an upper end connected to the buffer flow passage portion 14 H and which has a lower end connected to the first supply port 12 .
  • the inclined flow passage portion 14 S has a shape corresponding to the first supply port 12 , and its cross section taken along the XY plane is formed to have an annular slit-shaped configuration to surround the first optical element LS 1 .
  • the inclined flow passage portion 14 S has an angle of inclination corresponding to the side surface of the first optical element LS 1 arranged inside. As appreciated from FIG. 4 , the inclined flow passage portion 14 S is formed such that the spacing distance with respect to the surface of the substrate P is increased at positions away farther from the optical axis AX of the projection optical system PL as viewed in a side sectional view.
  • the buffer flow passage portion 14 H is a space which is provided outside of the inclined flow passage portion 14 S to surround the upper end portion of the inclined flow passage portion 14 S and which is formed to expand in the XY direction (horizontal direction).
  • the inner side of the buffer flow passage portion 14 H (side on the optical axis AX) is connected to the upper end of the inclined flow passage portion 14 S.
  • the connecting section thereof is an angular corner portion 17 .
  • a bank portion 15 which is formed to surround the upper end of the inclined flow passage portion 14 S, is provided in the vicinity of the connecting section (angular corner section) 17 , specifically in the inner area (on the side of the optical axis AX) of the buffer flow passage portion 14 H.
  • the bank portion 15 is provided to protrude in the +Z direction from the bottom surface of the buffer flow passage portion 14 H.
  • a narrow flow passage portion 14 N which is narrower than the buffer flow passage portion 14 H, is defined between the bank portion 15 and the upper surface (top plate portion 72 B described later on) of the nozzle member.
  • the nozzle member 70 is formed by combining a first member 71 and a second member 72 .
  • Each of the first and second members 71 , 72 can be formed of, for example, aluminum, titanium, stainless steel, duralumin, or any alloy containing at least two of them.
  • the first member 71 has a side plate portion 71 A, a top plate portion 71 B which has its outer end connected at an upper predetermined position of the side plate portion 71 A, an inclined plate portion 71 C which has its upper end connected to an inner end of the top plate portion 71 B, and a bottom plate portion 71 D (see FIG. 3 ) which is connected to a lower end of the inclined plate portion 71 C.
  • the respective plate portions are joined to one another and integrated as one body.
  • the second member 72 has a top plate portion 72 B which has its outer end connected to an upper end of the first member 71 , an inclined plate portion 72 C which has its upper end connected to an inner end of the top plate portion 72 B, and a bottom plate portion (plate portion) 72 D which is connected to a lower end of the inclined plate portion 72 C.
  • the respective plate portions are joined to one another and integrated as one body.
  • the bottom surface of the buffer flow passage portion 14 H is formed by the top plate portion 71 B of the first member 71 .
  • the ceiling surface of the buffer flow passage portion 14 H is formed by the lower surface of the top plate portion 72 B of the second member 72 .
  • the bottom surface of the inclined flow passage portion 14 S is formed by the upper surface of the inclined plate portion 71 C of the first member 71 (surface directed in the direction toward the projection optical system PL).
  • the ceiling surface of the inclined flow passage portion 14 S is formed by the lower surface of the inclined plate portion 72 C of the second member 72 (surface directed in the direction opposite to the projection optical system PL).
  • Each of the inclined plate portion 71 C of the first member 71 and the inclined plate portion 72 C of the second member 72 is formed to be mortar-shaped.
  • the slit-shaped supply flow passage 14 is formed by combining the first and second members 71 , 72 .
  • the outer portion of the buffer flow passage portion 14 H is closed by the upper area of the side plate portion 71 A of the first member 71 .
  • the upper surface of the inclined plate portion 72 C of the second member 72 i.e., the inner side surface 70 T of the nozzle member 70
  • the first recovery port 22 is provided so that the first recovery port 22 is opposed to the surface of the substrate P over (above) the substrate P supported by the substrate stage PST.
  • the first recovery port 22 is away from the surface of the substrate P by predetermined distances.
  • the first recovery port 22 is provided outside the first supply port 12 separately farther from the projection area AR of the projection optical system PL as compared with the first supply port 12 .
  • the first recovery port 22 is formed to surround the first supply port 12 and the projection area AR onto which the exposure light beam EL is radiated.
  • a space 24 which is open downwardly, is formed by the side plate portion 71 A, the top plate portion 71 B, and the inclined plate portion 71 C of the first member 71 .
  • the first recovery port 22 is formed by the opening of the space 24 .
  • the first recovery flow passage 24 is formed by the space 24 .
  • the other end of the first recovery tube 23 is connected to a part of the first recovery flow passage (space) 24 .
  • a porous member or perforated member 25 which has a plurality of pores, is arranged in the first recovery port 22 so that the first recovery port 22 is covered therewith.
  • the porous member 25 is formed of a mesh member having a plurality of pores.
  • the porous member 25 can be constructed, for example, with a mesh member formed with a honeycomb pattern composed of a plurality of substantially hexagonal pores.
  • the porous member 25 is formed to be thin plate-shaped, which has, for example, a thickness of about 100 ⁇ m.
  • the porous member 25 can be formed by performing a perforating processing to a plate member which is to serve as a base member for the porous member formed of, for example, stainless steel (for example, SUS 316 ).
  • a plurality of thin plate-shaped porous members 25 can be laminated and arranged in the first recovery port 22 as well.
  • the porous member 25 may be subjected to a surface treatment to suppress the elution of any impurity to the first liquid LQ 1 or a surface treatment to enhance the lyophilic or liquid-attracting property.
  • Such a surface treatment includes a treatment in which chromium oxide is adhered to the porous member 25 , including, for example, the “GOLDEP WHITE” treatment or the “GOLDEP” treatment provided by Kobelco Eco-Solutions Co., Ltd.
  • the surface treatment as described above it is possible to avoid the inconvenience which would be otherwise caused, for example, such that any impurity is eluted from the porous member 25 to the first liquid LQ 1 .
  • the surface treatment as described above may be also performed to the nozzle member 70 (first and second members 71 , 72 ).
  • the porous member 25 may be formed by using a material (for example, titanium) with which any impurity is hardly eluted to the first liquid LQ 1 .
  • the nozzle member 70 has a rectangular shape as viewed in a plan view.
  • the first recovery port 22 is formed to be frame-shaped (having a shape of “ ⁇ ” (polygon)) as viewed in a plan view to surround the projection area AR and the first supply port 12 on the lower surface of the nozzle member 70 .
  • the thin plate-shaped porous member 25 is arranged in the first recovery port 22 .
  • the bottom plate portion 71 D of the first member 71 is arranged between the first recovery port 22 (porous member 25 ) and the first supply port 12 .
  • the first supply port 12 is formed to be annular slit-shaped as viewed in a plan view between the bottom plate portion 71 D of the first member 71 and the bottom plate portion 72 D of the second member 72 .
  • the surfaces (lower surfaces) of the bottom plate portions 71 D, 72 D of the nozzle member 70 which are opposed to the substrate P respectively, are flat surfaces which are parallel to the XY plane. That is, the nozzle member 70 is provided with the bottom plate portions 71 D, 72 D having the lower surfaces which are formed to be opposed to the surface of the substrate P (XY plane) supported by the substrate stage PST, and substantially in parallel to the surface of the substrate P.
  • the lower surface of the bottom plate portion 71 D is substantially flush with the lower surface of the bottom plate portion 72 D. At this portion, the gap is the smallest with respect to the surface of the substrate P placed on the substrate stage PST.
  • the first liquid LQ 1 can be satisfactorily retained between the substrate P and the bottom surfaces of the bottom plate portions 71 D, 72 D to form the first liquid immersion area LR 1 .
  • the lower surfaces (flat portions) of the bottom plate portions 71 D, 72 D which are formed to be opposed to the surface of the substrate P supported by the substrate stage PST, and substantially in parallel to the surface of the substrate P (XY plane), are appropriately referred to as “land surface 75 ” in combination.
  • the land surface 75 is the surface which is included in the nozzle member 70 and which is arranged at the position nearest to the substrate P supported by the substrate stage PST.
  • the lower surface of the bottom plate portion 71 D and the lower surface of the bottom plate portion 72 D are collectively designated as the land surface 75 , because the lower surface of the bottom plate portion 71 D is substantially flush with the lower surface of the bottom plate portion 72 D.
  • the porous member 25 may be also arranged on the lower surface of the bottom plate portion 71 D to provide a part of the first recovery port 22 . In this arrangement, only the lower surface of the bottom plate portion 72 D is the land surface 75 .
  • the porous member 25 has a lower surface 26 which is opposed to the substrate P supported by the substrate stage PST.
  • the porous member 25 is provided in the first recovery port 22 so that the lower surface 26 is inclined with respect to the surface of the substrate P supported by the substrate stage PST (i.e., the XY plane). That is, the porous member 25 , which is provided in the first recovery port 22 , has the inclined surface (lower surface) 26 which is opposed to the surface of the substrate P supported by the substrate stage PST.
  • the first liquid LQ 1 is recovered via the inclined surface 26 of the porous member 25 arranged in the first recovery port 22 . That is, in this arrangement, the first recovery port 22 is formed on the inclined surface 26 .
  • the first recovery port 22 is formed to surround the projection area AR onto which the exposure light beam EL is radiated. Therefore, in this arrangement, the inclined surface 26 of the porous member 25 arranged in the first recovery port 22 is formed to surround the projection area AR onto which the exposure light beam EL is radiated.
  • the inclined surface 26 of the porous member 25 opposed to the substrate P is formed such that the spacing distance with respect to the surface of the substrate P is increased at positions separated farther from the optical axis AX of the projection optical system PL (exposure light beam EL).
  • the first recovery port 22 is formed to have a shape of “ ⁇ ” (polygon) as viewed in a plan view in this embodiment.
  • Four porous members 25 A to 25 D are combined and arranged in the first recovery port 22 .
  • the porous members 25 A, 25 C which are arranged on the both sides in the X axis direction (scanning direction) with respect to the projection area AR respectively, are arranged so that the spacing distances with respect to the surface of the substrate P are increased at positions separated farther from the optical axis AX, with the surfaces thereof crossing at right angles with respect to the XZ plane.
  • the porous members 25 B, 25 D which are arranged on the both sides in the Y axis direction with respect to the projection area AR respectively, are arranged so that the spacing distances with respect to the surface of the substrate P are increased at positions separated farther from the optical axis AX, with the surfaces thereof crossing at right angles with respect to the YZ plane.
  • the lower surface of the bottom plate portion 71 D connected to the lower end of the inclined plate portion 71 C of the first member 71 and the lower end of the side plate portion 71 A are provided to have approximately the same position (height) in the Z axis direction.
  • the porous member 25 is attached to the first recovery port 22 of the nozzle member 70 so that the inner edge of the inclined surface 26 has approximately the same height as that of the lower surface (land surface 75 ) of the bottom plate portion 71 D, and the inner edge of the inclined surface 26 is continuous to the lower surface (land surface 75 ) of the bottom plate portion 71 D. That is, the land surface 75 is formed continuously to the inclined surface 26 of the porous member 25 .
  • the porous member 25 is arranged so that the spacing distances are increased with respect to the surface of the substrate P at positions separated farther from the optical axis AX.
  • a wall portion 76 which is formed by a partial area of the lower portion of the side plate portion 71 A, is provided outside the outer edge of the inclined surface 26 (porous member 25 ).
  • the wall portion 76 is provided at the circumferential edge of the porous member 25 (inclined surface 26 ) to surround the porous member 25 .
  • the wall portion 76 is provided outside the first recovery port 22 with respect to the projection area AR in order to suppress the leakage of the first liquid LQ 1 .
  • a part of the bottom plate portion 72 D for forming the land surface 75 is arranged between the substrate P and the lower surface T 1 of the first optical element LS 1 of the projection optical system PL in relation to the Z axis direction. That is, a part of the bottom plate portion 72 D for forming the land surface 75 is provided under the lower surface T 1 of the optical element LS 1 of the projection optical system PL.
  • An opening 74 through which the exposure light beam EL passes, is formed at a central portion of the bottom plate portion 72 D which forms the land surface 75 .
  • the opening 74 has a shape corresponding to the projection area AR.
  • the opening 74 is formed to have an elliptical shape in which the Y axis direction (non-scanning direction) is the longitudinal direction.
  • the opening 74 is formed to be larger or greater than the projection area AR.
  • the exposure light beam EL which has passed through the projection optical system PL, can arrive at the surface of the substrate P without being blocked or shielded by the bottom plate portion 72 D. That is, the bottom plate portion 72 D, which forms the land surface 75 , is arranged so that the bottom plate portion 72 D is provided under the lower surface T 1 of the first optical element LS 1 to surround the optical path for the exposure light beam EL at the position at which the optical path for the exposure light beam EL is not disturbed.
  • the land surface 75 is arranged to surround the projection area AR between the substrate P and the lower surface T 1 of the first optical element LS 1 .
  • the bottom plate portion 72 D is arranged opposite to the surface of the substrate P with the lower surface thereof being the land surface 75 .
  • the bottom plate portion 72 D is provided to make no contact with the substrate P and the lower surface T 1 of the first optical element LS 1 .
  • An edge portion 74 E of the opening 74 may be formed to be right-angled, acute-angled, or circular arc-shaped.
  • the land surface 75 is arranged between the projection area AR onto which the exposure light beam EL is radiated and the inclined surface 26 of the porous member 25 which is arranged in the first recovery port 22 .
  • the first recovery port 22 is arranged to surround the land surface 75 in the outside of the land surface 75 with respect to the projection area AR.
  • the first supply port 12 is arranged outside the land surface 75 (bottom plate portion 72 D) with respect to the projection area AR.
  • the first supply port 12 is provided between the first recovery port 22 and the projection area AR of the projection optical system PL.
  • the first liquid LQ 1 for forming the first liquid immersion area LR 1 is supplied, via the first supply port 12 , between the first recovery port 22 and the projection area AR of the projection optical system PL.
  • the first recovery port 22 is formed to have a shape of “ ⁇ ” (polygon) to surround the land surface 75 .
  • the first recovery port 22 may be arranged such that the first recovery port 22 does not surround the land surface 75 , provided that the first recovery port 22 is disposed outside the land surface 75 with respect to the projection area AR.
  • the first recovery port 22 may be arranged in a divided manner in predetermined areas, of the lower surface of the nozzle member 70 , which are disposed outside the land surface 75 on the both sides in the scanning direction (X axis direction) with respect to the projection area AR.
  • the first recovery port 22 may be arranged in a divided manner in predetermined areas, of the lower surface of the nozzle member 70 , which are disposed outside the land surface 75 on the both sides in the non-scanning direction (Y axis direction) with respect to the projection area AR.
  • the first recovery port 22 is arranged to surround the land surface 75 , it is possible to recover the first liquid LQ 1 via the first recovery port 22 more reliably.
  • the land surface 75 is arranged between the substrate P and the lower surface T 1 of the first optical element LS 1 .
  • the distance between the surface of the substrate P and the lower surface T 1 of the first optical element LS 1 is longer than the distance between the land surface 75 and the surface of the substrate P. That is, the lower surface T 1 of the first optical element LS 1 is formed at the position higher than that of the land surface 75 (to be far from the substrate P).
  • At least a part of the first recovery port 22 including the inclined surface 26 formed continuously to the land surface 75 is arranged opposite to the surface of the substrate P between the substrate P and the lower surface T 1 of the first optical element LS 1 in relation to the Z axis direction. That is, at least a part of the first recovery port 22 is provided at the position lower than that of the lower surface T 1 of the first optical element LS 1 (to be near to the substrate P). In this arrangement, the first recovery port 22 including the inclined surface 26 is arranged around the lower surface T 1 of the first optical element LS 1 .
  • the distance between the lower surface T 1 of the first optical element LS 1 and the upper surface T 2 of the first optical element LS 1 is about 4 mm.
  • the distance between the substrate P and the lower surface T 1 of the first optical element LS 1 i.e., the thickness of the liquid LQ 1 in the optical path for the exposure light beam EL is about 3 mm.
  • the distance between the land surface 75 and the substrate P is about 1 mm.
  • the first liquid LQ 1 of the first liquid immersion area LR 1 makes contact with the land surface 75 .
  • the first liquid LQ 1 of the first liquid immersion area LR 1 also makes contact with the lower surface T 1 of the first optical element LS 1 . That is, the land surface 75 and the lower surface T 1 of the first optical element LS 1 serve as the liquid contact surfaces to make contact with the first liquid LQ 1 of the first liquid immersion area LR 1 .
  • the distance between the lower surface T 1 of the first optical element LS 1 and the upper surface T 2 of the first optical element LS 1 is not limited to 4 mm as described above, and can be set within a range of 3 to 10 mm.
  • the distance between the substrate P and the lower surface T 1 of the first optical element LS 1 is not limited to 3 mm as described above, and can be set within a range of 1 to 5 mm, considering the absorption of the exposure light beam EL by the liquid LQ 1 and the flow of the liquid LQ 1 in the first space K 1 .
  • the distance between the land surface 75 and the substrate P is not limited to 1 mm as described above as well, and can be set within a range of 0.5 to 1 mm.
  • the lower surface (liquid contact surface) T 1 of the first optical element LS 1 of the projection optical system PL has the liquid-attracting (hydrophilic) property.
  • the liquid-attracting treatment is performed to the lower surface T 1 .
  • the lower surface T 1 of the first optical element LS 1 is liquid-attractive by the aid of the liquid-attracting treatment.
  • the liquid-attracting treatment is also performed to the land surface 75 to have the liquid-attracting property.
  • the liquid-repelling treatment may be performed to a part of the land surface 75 to have the liquid-repelling property.
  • the liquid-attracting treatment which is applied in order to make a predetermined member such as the lower surface T 1 of the first optical element LS 1 to be liquid-attractive, includes, for example, a treatment for adhering a liquid-attracting material such as MgF 2 , Al 2 O 3 , and SiO 2 .
  • a liquid-attracting material such as MgF 2 , Al 2 O 3 , and SiO 2 .
  • the liquid-attracting property hydrophilic property
  • the first optical element LS 1 is formed of calcium fluorite or silica glass, it is possible to obtain the satisfactory liquid-attracting property even when no liquid-attracting treatment is performed, because calcium fluorite or silica glass has the high affinity for water. It is possible to allow the first liquid LQ 1 to make tight contact with the substantially entire surface of the lower surface T 1 of the first optical element LS 1 . A part of the land surface 75 (for example, the lower surface of the bottom plate portion 71 D) may be liquid-repellent with respect to the first liquid LQ 1 .
  • the liquid-repelling treatment which is adopted in order to make a part of the land surface 75 to be liquid-repellent, includes, for example, a treatment to adhere a liquid-repelling material including, for example, fluorine-based materials such as polytetrafluoroethylene (Teflon (trade name)), acrylic resin materials, and silicon-based resin materials.
  • the upper surface 91 of the substrate stage PST is made to be liquid-repellent, then it is possible to suppress the outflow of the first liquid LQ 1 to the outside of the substrate P (outside of the upper surface 91 ) during the liquid immersion exposure, it is possible to smoothly recover the liquid LQ 1 after the liquid immersion exposure as well, and it is possible to avoid the inconvenience which would be otherwise caused such that the first liquid LQ 1 remains on the upper surface 91 .
  • the control unit CONT drives the first liquid supply section 11 to feed the first liquid LQ 1 from the first liquid supply section 11 .
  • the first liquid LQ 1 which is fed from the first liquid supply section 11 , flows through the first supply tube 13 , and then the first liquid LQ 1 flows into the buffer flow passage portion 14 H of the first supply flow passage 14 of the nozzle member 70 .
  • the buffer flow passage portion 14 H is the space which is expanded in the horizontal direction.
  • the first liquid LQ 1 which has flown into the buffer flow passage portion 14 H, flows to expand in the horizontal direction.
  • the bank portion 15 is formed in the inner area (on the side of the optical axis AX) as the downstream side of the flow passage of the buffer flow passage portion 14 H.
  • the first liquid LQ 1 is expanded over the entire region of the buffer flow passage portion 14 H, and then the first liquid LQ 1 is once pooled. After the first liquid LQ 1 is pooled in an amount not less than a predetermined amount in the buffer flow passage portion 14 H (after the liquid level of the first liquid LQ 1 is not less than the height of the bank portion 15 ), the first liquid LQ 1 flow into the inclined flow passage portion 14 S via the narrow flow passage portion 14 N. The first liquid LQ 1 , which has flown into the inclined flow passage portion 14 S, flows downwardly along the inclined flow passage portion 14 S.
  • the first liquid LQ 1 is supplied from the first supply port 12 onto the substrate P arranged on the image plane side of the projection optical system PL.
  • the first supply port 12 supplies the first liquid LQ 1 onto the substrate P from the position over the substrate P.
  • the first liquid LQ 1 which has flown out from the buffer flow passage portion 14 H, is supplied onto the substrate P substantially uniformly from the entire region of the first supply port 12 formed annularly to surround the projection area AR. That is, if the bank portion 15 (narrow flow passage portion 14 N) is not formed, the flow rate of the first liquid LQ 1 allowed to flow through the inclined flow passage portion 14 S is greater in the area disposed in the vicinity of the connecting section between the first supply tube 13 and the buffer flow passage portion 14 H than in the other areas. Therefore, the liquid supply amount for the surface of the substrate P is sometimes nonuniform at respective positions of the first supply port 12 which is formed annularly.
  • the buffer flow passage portion 14 H is formed to be provided with the narrow flow passage portion 14 N, and the liquid supply to the first supply port 12 is started after the first liquid LQ 1 of the amount not less than the predetermined amount is pooled in the buffer flow passage portion 14 H. Therefore, the first liquid LQ 1 can be supplied onto the substrate P in the state in which the flow rate distribution and the flow velocity distribution are uniformized at the respective positions of the first supply port 12 . Any bubble tends to remain, for example, upon the start of the supply in the vicinity of the angular corner portion 17 of the first supply flow passage 14 .
  • the narrow flow passage portion 14 N is formed by narrowing the first supply flow passage 14 in the vicinity of the angular corner portion 17 .
  • the high velocity is obtained for the flow rate of the first liquid LQ 1 flowing through the narrow flow passage portion 14 N.
  • the bubble can be discharged to the outside of the first supply flow passage 14 via the first supply port 12 in accordance with the flow of the first liquid LQ 1 having the high velocity.
  • the exposure process can be performed in the state in which any bubble is absent in the first liquid immersion area LR 1 .
  • the bank portion 15 may be provided to protrude in the ⁇ Z direction from the ceiling surface of the buffer flow passage portion 14 H. In principle, it is enough that the narrow flow passage portion 14 N, which is narrower than the buffer flow passage portion 14 H, is provided on the downstream side of the flow passage as compared with the buffer flow passage portion 14 H.
  • the height of the bank portion 15 may be partially lowered (raised).
  • the supply of the first liquid LQ 1 from the first supply port 12 can be started at any partially different timing. Therefore, it is possible to avoid the remaining of the gas (bubble) in the liquid for forming the liquid immersion area AR 2 when the supply of first liquid LQ 1 is started.
  • the buffer flow passage portion 14 H may be divided into a plurality of flow passages to successfully supply the liquid LQ in different amounts depending on the positions of the slit-shaped liquid supply port 12 .
  • the control unit CONT drives the first liquid recovery section 21 .
  • the liquid LQ 1 which is disposed on the substrate P, is allowed to flow into the first recovery flow passage 24 via the first recovery port 22 arranged with the porous member 25 .
  • the lower surface (inclined surface) 26 of the porous member 25 makes contact with the first liquid LQ 1 .
  • the first recovery port 22 (porous member 25 ) is provided over (above) the substrate P to oppose to the substrate P.
  • the first recovery port 22 (porous member 25 ) recovers the first liquid LQ 1 from the surface of the substrate P from the position thereover.
  • the first liquid LQ 1 which has flown into the first recovery flow passage 24 , flows through the first recovery tube 23 , and then the first liquid LQ 1 is recovered by the first liquid recovery section 21 .
  • the first optical element LS 1 and the second optical element LS 2 are supported by the same barrel (support member) PK, and they are supported in the substantially stationary state with respect to the optical path for the exposure light beam EL.
  • the first optical element LS 1 is supported by a first support section 91 which is provided at the lower end of the barrel PK.
  • the second optical element LS 2 is supported by a second support section 92 which is provided over (above) the first support section 91 in the barrel PK.
  • a flange portion F 2 which serves as a support objective portion, is provided at an upper portion of the second optical element LS 2 .
  • the second support section 92 supports the second optical element LS 2 by supporting the flange portion F 2 .
  • the first optical element LS 1 is easily attachable/detachable with respect to the first support section 91 of the barrel PK. That is, the first optical element LS 1 is provided exchangeably. It is also allowable that the first support section 91 , which supports the first optical element LS 1 , may be attachable/detachable with respect to the second support section 92 , and the first support section 91 and the first optical element LS 1 may be exchanged together.
  • the first optical element LS 1 is a parallel flat plate, in which the lower surface T 1 and the upper surface T 2 are in parallel to one another.
  • the lower surface T 1 and the upper surface T 2 are substantially in parallel to the XY plane.
  • the surface of the substrate P supported by the substrate stage PST is substantially in parallel to the XY plane. Therefore, the lower surface T 1 and the upper surface T 2 are substantially in parallel to the surface of the substrate P supported by the substrate stage PST.
  • the lower surface T 1 of the first optical element LS 1 supported by the first support section 91 is substantially flush with the lower surface PKA of the barrel PK.
  • the bottom plate portion 72 D which forms the land surface 75 , extends under the lower surface T 1 of the first optical element LS 1 and the lower surface PKA of the barrel PK.
  • the lower surface T 3 of the second optical element LS 2 is formed to be flat surface-shaped.
  • the lower surface T 3 of the second optical element LS 2 supported by the second support section 92 is substantially in parallel to the upper surface T 2 of the first optical element LS 1 supported by the first support section 91 .
  • the upper surface T 4 of the second optical element LS 2 is formed to be convex toward the object plane (toward the mask M), and has a positive refractive index. Accordingly, the reflection loss of the light beam (exposure light beam EL) allowed to come into the upper surface T 4 is reduced. Consequently, the large image side numerical aperture of the projection optical system PL is secured.
  • the second optical element LS 2 which has the refractive index (lens function), is supported by the second support section 92 of the barrel PK in the state of being positioned satisfactorily.
  • the outer diameter D 3 of the lower surface T 3 of the second optical element LS 2 opposed to the first optical element LS 1 is formed to be smaller than the outer diameter D 2 of the upper surface T 2 of the first optical element LS 1 .
  • the exposure light beam EL passes through the respective predetermined areas of the upper surface T 4 and the lower surface T 3 of the second optical element LS 2 . Further, the exposure light beam EL passes through the respective predetermined areas of the upper surface T 2 and the lower surface T 1 of the first optical element LS 1 .
  • the connecting portion between the barrel PK and the first optical element LS 1 is sealed. That is, the first space K 1 disposed on the side of the lower surface T 1 of the first optical element LS 1 and the second space K 2 disposed on the side of the upper surface T 2 of the first optical element LS 1 are the spaces which are independent from each other. The flow of the liquid is prohibited between the first space K 1 and the second space K 2 .
  • the first space K 1 is the space between the first optical element LS 1 and the substrate P.
  • the first liquid immersion area LR 1 of the first liquid LQ 1 is formed in the first space K 1 .
  • the second space K 2 is a part of the internal space of the barrel PK.
  • the second space K 2 is the space disposed between the upper surface T 2 of the first optical element LS 1 and the lower surface T 3 of the second optical element LS 2 arranged thereover.
  • the second liquid immersion area LR 2 of the second liquid LQ 2 is formed in the second space K 2 .
  • a gap is provided between the side surface C 2 of the second optical element LS 2 and the inner side surface PKC of the barrel PK.
  • the other end of a second supply tube 33 is connected to one end of a second supply flow passage 34 formed in the barrel PK.
  • the other end of the second supply flow passage 34 of the barrel PK is connected to a supply member 35 arranged inside (in the internal space of) the barrel PK.
  • the supply member 35 which is arranged inside the barrel PK, has a liquid supply port 32 for supplying the second liquid LQ 2 to the second space K 2 .
  • a supply flow passage 36 through which the second liquid LQ 2 flows, is formed in the supply member 35 .
  • the connecting portion of the second supply flow passage 34 with respect to the supply member 35 (supply flow passage 36 ) is provided in the vicinity of the second space K 2 on the inner side surface PKC of the barrel PK.
  • the other end of the second recovery tube 43 is connected to one end of a second recovery flow passage 44 formed in the barrel PK.
  • the other end of the second recovery flow passage 44 of the barrel PK is connected to a recovery member 45 arranged inside (in the internal space of) the barrel PK.
  • the recovery member 45 which is arranged inside the barrel PK, has liquid recovery ports 42 for recovering the second liquid LQ 2 from the second space K 2 .
  • a recovery flow passage 46 through which the second liquid LQ 2 flows, is formed in the recovery member 45 .
  • the connecting portion of the second recovery flow passage 44 with respect to the recovery member 45 (recovery flow passage 46 ) is provided in the vicinity of the second space K 2 on the inner side surface PKC of the barrel PK.
  • the liquid supply port 32 , the supply member 35 (supply flow passage 36 ), the second supply flow passage 34 , and the second supply tube 33 construct a part of the second liquid supply mechanism 30 (second liquid immersion mechanism 2 ).
  • the liquid recovery ports 42 , the recovery member 45 (recovery flow passage 46 ), the second recovery flow passage 44 , and the second recovery tube 43 construct a part of the second liquid recovery mechanism 40 (second liquid immersion mechanism 2 ).
  • the liquid supply port 32 of the second liquid immersion mechanism 2 is appropriately referred to as “second supply port 32 ”
  • the liquid recovery port 42 of the second liquid immersion mechanism 2 is appropriately referred to as “second recovery port 42 ”.
  • FIG. 5 illustrates the second liquid immersion mechanism 2 for forming the second liquid immersion area LR 2 , wherein FIG. 5 ( a ) shows a side view, and FIG. 5 ( b ) shows a view taken along a line A-A shown in FIG. 5 ( a ).
  • the supply member 35 is constructed of a shaft-shaped member extending in the horizontal direction.
  • the supply member 35 is arranged on the +X side of the predetermined area AR′of the upper surface T 2 of the first optical element LS 1 through which exposure light beam EL passes.
  • the supply member 35 is provided to extend in the X axis direction.
  • One end of the supply flow passage 36 formed in the supply member 35 is connected to the other end of the second supply flow passage 34 (see FIG. 4 ) formed in the barrel PK.
  • the other end of the supply flow passage 36 is connected to the second supply port 32 .
  • the second supply port 32 is formed so that the second supply port 32 is directed toward the ⁇ X side.
  • the second supply port 32 discharges the second liquid LQ 2 substantially in parallel to the upper surface T 2 of the first optical element LS 1 , i.e., substantially in parallel to the XY plane (in the lateral direction).
  • the second supply port 32 of the second liquid immersion mechanism 2 is arranged in the second space K 2 . Therefore, the second liquid supply section 31 is connected to the second space K 2 , for example, via the second supply tube 33 , the second supply flow passage 34 , and the second supply port 32 .
  • Gaps are provided between the supply member 35 and the upper surface T 2 of the first optical element LS 1 and between the supply member 35 and the lower surface T 3 of the second optical element LS 2 respectively. That is, the supply member 35 is supported by the barrel PK or a predetermined support mechanism so that the supply member 35 is in a non-contact state with respect to the first optical element LS 1 and the second optical element LS 2 respectively. Accordingly, the vibration, which is generated in the supply member 35 , is prevented from being directly transmitted to the first and second optical elements LS 1 , LS 2 .
  • the supply member 35 is provided at the position at which the radiation of the exposure light beam EL is not disturbed, i.e., outside the predetermined area AR′of the upper surface T 2 of the first optical element LS 1 through which the exposure light beam EL passes.
  • the second supply port 32 is arranged at the predetermined position between the predetermined area AR′ and the edge portion of the upper surface T 2 of the first optical element LS 1 in the second space K 2 .
  • the control unit CONT When the control unit CONT is operated to feed the second liquid LQ 2 from the second liquid supply section 31 of the second liquid supply mechanism 30 in order to form the second liquid immersion area LR 2 , then the second liquid LQ 2 , which is fed from the second liquid supply section 31 , flows through the second supply tube 33 , and then the second liquid LQ 2 flows into one end of the second supply flow passage 34 formed in the barrel PK.
  • the liquid LQ 2 which has flown into one end of the second supply flow passage 34 , flows through the second supply flow passage 34 , and then the liquid LQ 2 flows into one end of the supply flow passage 36 of the supply member 35 connected to the other end thereof.
  • the second liquid LQ 2 which has flown into one end of the supply flow passage 36 , flows through the supply flow passage 36 , and then the second liquid LQ 2 is supplied to the second space K 2 via the second supply port 32 .
  • the second liquid LQ 2 which has been supplied from the second supply port 32 , locally forms the second liquid immersion area LR 2 in only a partial area of the upper surface T 2 of the first optical element LS 1 , the partial area being smaller than the upper surface T 2 and the partial area being greater than the predetermined area AR′through which the exposure light beam EL passes.
  • the second liquid LQ 2 which has been supplied to the space between the first optical element LS 1 and the second optical element LS 2 , is retained by the surface tension between the upper surface T 2 of the first optical element LS 1 and the lower surface T 3 of the second optical element LS 2 .
  • the second liquid LQ 2 in the second liquid immersion area LR 2 makes contact with the partial area of the upper surface T 2 of the first optical element LS 1
  • the second liquid LQ 2 makes contact with the substantially entire surface of the lower surface T 3 of the second optical element LS 2 .
  • the outer diameter D 3 of the lower surface T 3 of the second optical element LS 2 is smaller than the outer diameter D 2 of the upper surface T 2 of the first optical element LS 1 .
  • the second liquid LQ 2 with which the space between the first optical element LS 1 and the second optical element LS 2 is filled, can form the second liquid immersion area LR 2 which is smaller than the upper surface T 2 of the first optical element LS 1 , below the lower surface T 3 of the second optical element LS 2 (above the upper surface T 2 of the first optical element LS 1 ).
  • the distance between the upper surface T 2 of the first optical element LS 1 and the lower surface T 3 of the second optical element LS 2 i.e., the thickness of the liquid LQ 2 in the optical path for the exposure light beam EL is about 3 mm.
  • the distance between the upper surface T 2 of the first optical element LS 1 and the lower surface T 3 of the second optical element LS 2 is not limited to 3 mm as described above, and can be set within a range of 0.5 to 5 mm considering the absorption of the exposure light beam EL by the liquid LQ 2 and the flow of the liquid LQ 2 in the second space K 2 .
  • the surface of the first area HR 1 which is the partial area to serve as the second liquid immersion area LR 2 and which is included in the upper surface T 2 of the first optical element LS 1 facing the second space K 2 , has the affinity for the second liquid LQ 2 , the affinity being higher than the affinity for the second liquid LQ 2 of the surface of the second area HR 2 as the area around the first area HR 1 . That is, the contact angle of the surface of the first area HR 1 with respect to the second liquid LQ 2 is smaller than the contact angle of the surface of the second area HR 2 with respect to the second liquid LQ 2 .
  • the surface of the second area HR 2 is liquid-repellent with respect to the second liquid LQ 2 .
  • the first area HR 1 includes the predetermined area AR′through which the exposure light beam EL passes.
  • the second liquid LQ 2 can be allowed to make tight contact with the surface of the first area HR 1 satisfactorily.
  • the liquid-repelling property is applied to the surface of the second area HR 2 by performing the liquid-repelling treatment to the surface of the second area HR 2 .
  • the liquid-repelling treatment which is adopted in order to allow the surface of the second area HR 2 to be liquid-repellent, includes, for example, a treatment to coat a liquid-repelling material including, for example, fluorine-based materials such as polytetrafluoroethylene, acrylic resin materials, and silicon-based resin materials, and a treatment to stuck a thin film formed of the liquid-repelling material as described above.
  • the surface of the second area HR 2 is coated with “CYTOP” produced by Asahi Glass Co., Ltd.
  • At least the first and second optical elements LS 1 , LS 2 which make contact with the first and second liquids LQ 1 , LQ 2 and which are included in the plurality of optical elements LS 1 to LS 7 , are formed of silica glass.
  • Silica glass has the high affinity for the first and second liquids LQ 1 , LQ 2 as water. Accordingly, it is possible to allow the first and second liquids LQ 1 , LQ 2 to make tight contact with the substantially entire regions of the first area HR 1 of the upper surface T 2 and the lower surface T 1 as the liquid contact surfaces of the first optical element LS 1 and the lower surface T 3 as the liquid contact surface of the second optical element LS 2 .
  • first and second liquids LQ 1 , LQ 2 it is possible to allow the first and second liquids LQ 1 , LQ 2 to make tight contact with the liquid contact surfaces of the first and second optical elements LS 1 , LS 2 to reliably fill the optical path between the second optical element LS 2 and the first optical element LS 1 with the second liquid LQ 2 and reliably fill the optical path between the first optical element LS 1 and the substrate P with the first liquid LQ 1 .
  • Silica glass is a material having the large refractive index. Therefore, for example, the size of the second optical element LS 2 can be decreased. It is possible to realize compact sizes of the entire projection optical system PL and the entire exposure apparatus EX. Further, silica glass is water-resistant. Therefore, an advantage is obtained, for example, such that it is unnecessary to provide any protective film for the liquid contact surface.
  • At least one of the first and second optical elements LS 1 , LS 2 may be calcium fluorite having the high affinity for water.
  • the optical elements LS 3 to LS 7 may be formed of calcium fluorite, and the optical elements LS 1 , LS 2 may be formed of silica glass. All of the optical elements LS 1 to LS 7 may be formed of silica glass (or calcium fluorite).
  • the water-attracting (liquid-attracting) treatment in which a liquid-attracting material such as MgF 2 , Al 2 O 3 , and SiO 2 is adhered, may be performed to the liquid contact surfaces of the first and second optical elements LS 1 , LS 2 including the first area HR 1 of the upper surface T 2 of the first optical element LS 1 to further enhance the affinity for the first and second liquids LQ 1 , LQ 2 .
  • a liquid-attracting material such as MgF 2 , Al 2 O 3 , and SiO 2
  • the hydrophilic property can be also applied to the liquid contact surfaces of the optical elements LS 1 , LS 2 , for example, by forming a thin film with a substance such as alcohol having a molecular structure with large polarity, because the first and second liquids LQ 1 , LQ 2 are water having large polarity in this embodiment.
  • the second area HR 2 which is disposed around the first area HR 1 including the predetermined area AR′of the upper surface T 2 of the first optical element LS 1 through which the exposure light beam EL passes, is liquid-repellent.
  • an area which is disposed around a partial area including a predetermined area of the lower surface T 3 of the second optical element LS 2 through which the exposure light beam EL passes, may be liquid-repellent.
  • the recovery member 45 includes a shaft portion 45 A, and an annular portion 45 B which is connected to the shaft portion 45 A.
  • the shaft portion 45 A is provided to extend in the horizontal direction.
  • the shaft portion 45 A is arranged on the ⁇ X side in relation to the predetermined area AR′, and the shaft portion 45 A is provided to extend in the X axis direction.
  • the annular portion 45 B is formed to be smaller than the edge portion of the upper surface T 2 of the first optical element LS 1 , and a part of the annular portion 45 B on the ⁇ X side is connected to the shaft portion 45 A.
  • a part of the annular portion 45 B on the +X side is open or discontinuous, and the supply member 35 is arranged at an opening 45 K.
  • the recovery flow passage 46 which corresponds to the shape of the recovery member 45 , is formed in the recovery member 45 .
  • One end of the recovery flow passage 46 which is formed in the shaft portion 45 A of the recovery member 45 , is connected to the other end of the second recovery flow passage 44 (see FIG. 4 ) formed in the barrel PK.
  • the annular recovery flow passage 46 is formed in the annular portion 45 B of the recovery member 45 to surround the predetermined area AR′.
  • the other end of the recovery flow passage 46 formed in the shaft portion 45 A is connected to a part of the annular recovery flow passage 46 formed in the annular portion 45 B.
  • the second recovery ports 42 are formed on the inner side surface of the annular portion 45 B directed to the predetermined area AR′.
  • the second recovery ports 42 are provided to recover the second liquid LQ 2 from the second space K 2 .
  • the plurality of second recovery ports 42 are provided on the inner side surface of the annular portion 45 B to surround the second liquid immersion area LR 2 formed on the upper surface T 2 of the first optical element LS 1 .
  • the plurality of second recovery ports 42 which are provided on the inner side surface of the annular portion 45 B, are connected to the recovery flow passage 46 formed in the annular portion 45 B.
  • the second recovery ports 42 of the second liquid immersion mechanism 2 are arranged in the second space K 2 . Therefore, in this arrangement, the second liquid recovery section 41 is connected to the second space K 2 , via the second recovery tube 43 , the second recovery flow passage 44 , and the second recovery ports 42 or the like.
  • the recovery member 45 (annular portion 45 B) is provided outside the predetermined area AR′at the position at which the radiation of the exposure light beam EL is not disturbed, i.e., at the position to surround the predetermined area AR′of the upper surface T 2 of the first optical element LS 1 through which the exposure light beam EL passes.
  • the second recovery ports 42 are arranged at the predetermined positions between the predetermined area AR′ and the edge portion of the upper surface T 2 in the second space K 2 .
  • Gaps are provided between the recovery member 45 and the upper surface T 2 of the first optical element LS 1 and between the recovery member 45 and the lower surface T 3 of the second optical element LS 2 respectively. That is, the recovery member 45 is supported by the barrel PK or a predetermined support mechanism so that the recovery member 45 is in the non-contact state with respect to the first optical element LS 1 and the second optical element LS 2 respectively. Accordingly, the vibration, which is generated in the recovery member 45 , is prevented from being directly transmitted to the first and second optical elements LS 1 , LS 2 .
  • the control unit CONT drives the second liquid recovery section 41 of the second liquid recovery mechanism 40 .
  • the second liquid recovery section 41 having the vacuum system is driven, the second liquid LQ 2 of the second liquid immersion area LR 2 flows into the recovery flow passage 46 formed in the annular portion 45 B of the recovery member 45 via the second recovery ports 42 .
  • the second recovery ports 42 are arranged to surround the second liquid immersion area LR 2 . Therefore, the second liquid LQ 2 of the second liquid immersion area LR 2 is recovered from the surrounding thereof via the second recovery ports 42 . It is desirable that a porous member is also arranged for the second recovery ports 42 to suppress the vibration generated when the second liquid LQ 2 is recovered.
  • a protruding area HRT which protrudes inwardly (toward the predetermined area AR′), is provided for the second area HR 2 having the liquid-repelling property of the upper surface T 2 of the first optical element LS 1 .
  • the protruding area HRT is provided at the position corresponding to the opening 45 K of the annular portion 45 B of the recovery member 45 .
  • the second liquid LQ 2 of the second liquid immersion area LR 2 is recovered via the second recovery ports 42 arranged around the second liquid immersion area LR 2 so that the second liquid LQ 2 is divided at the protruding area HRT as a base point, as schematically shown in FIG. 7 .
  • the inconvenience which would be otherwise caused for example, such that the second liquid LQ 2 is unsuccessfully recovered and the second liquid LQ 2 remains, for example, at a central portion of the first area HR 1 .
  • the protruding area HRT is provided at the position corresponding to the opening 45 K of the annular portion 45 B of the recovery member 45 .
  • the protruding area HRT may be provided at any position other than the position corresponding to the opening 45 K.
  • the protruding area HRT shown in the drawing is substantially rectangular as viewed in a plan view. However, it is possible to adopt any arbitrary shape including, for example, triangular and semicircular shapes.
  • the second liquid LQ 2 which has flown into the recovery flow passage 46 formed in the annular portion 45 B, is collected in the recovery flow passage 46 formed in the shaft portion 45 A, and then the second liquid LQ 2 flows into the second recovery flow passage 44 formed in the barrel PK.
  • the second liquid LQ 2 which has flown through the second recovery flow passage 44 , is sucked and recovered by the second liquid recovery section 41 via the second recovery tube 43 .
  • the control unit CONT supplies the second liquid LQ 2 from the second liquid supply mechanism 30 to the second space K 2 .
  • the second liquid supply mechanism 30 supplies the second liquid LQ 2
  • the space between the second optical element LS 2 and the upper surface T 2 of the first optical element LS 1 is filled with the second liquid LQ 2 so that only the partial area of the upper surface T 2 of the first optical element LS 1 , which includes the predetermined area AR′through which the exposure light beam EL passes, becomes the second liquid immersion area LR 2 .
  • the second liquid LQ 2 which is supplied from the second liquid supply mechanism 30 , locally forms the second liquid immersion area LR 2 which is greater than the predetermined area AR′ and which is smaller than the upper surface T 2 , on a part of the upper surface T 2 including the predetermined area AR′.
  • the control unit CONT stops the supply of the second liquid LQ 2 by the second liquid supply mechanism 30 .
  • the second liquid LQ 2 between the first optical element LS 1 and the second optical element LS 2 is retained by the surface tension, and the second liquid immersion area LR 2 is maintained.
  • the substrate stage PST which holds the substrate P, is moved by the control unit CONT to the position under the projection optical system PL, i.e., the exposure position.
  • the control unit CONT supplies and recovers the first liquid LQ 1 by using the first liquid supply mechanism 10 and the first liquid recovery mechanism 20 while optimally controlling the supply amount of the first liquid LQ 1 per unit time brought about by the first liquid supply mechanism 10 and the recovery amount of the first liquid LQ 1 per unit time brought about by the first liquid recovery mechanism 20 in the state in which the substrate stage PST is opposed to the first optical element LS 1 of the projection optical system PL.
  • control unit CONT forms the first liquid immersion area LR 1 of the first liquid LQ 1 on at least the optical path for the exposure light beam EL included in the first space K 1 , and fills the optical path for the exposure light beam EL with the first liquid LQ 1 .
  • reference members which are provided with reference marks to be measured, for example, by a substrate alignment system as disclosed in Japanese Patent Application Laid-open No. 4-65603 and a mask alignment system as disclosed in Japanese Patent Application Laid-open No. 7-176468, are provided at predetermined positions on the substrate stage PST.
  • an uneven illuminance sensor as disclosed, for example, in Japanese Patent Application Laid-open No. 57-117238
  • a spatial image-measuring sensor as disclosed, for example, in Japanese Patent Application Laid-open No. 2002-14005
  • a radiation amount sensor as disclosed, for example, in Japanese Patent Application Laid-open No.
  • 11-16816 are provided as optical measuring sections at predetermined positions on the substrate stage PST.
  • the control unit CONT performs the measurement of the marks on the reference members and/or various types of measuring operations by using the optical measuring sections.
  • the control unit CONT performs the alignment process for the substrate P and the process for adjusting (calibrating) the image formation characteristic of the projection optical system PL on the basis of the measurement results.
  • the control unit CONT moves the substrate stage PST relative to the first liquid immersion area LR 1 of the first liquid LQ 1 by moving the substrate stage PST in the XY directions to arrange the first liquid immersion area LR 1 of the first liquid LQ 1 on the optical measuring section so that the measuring operation is performed in this state via the first liquid LQ 1 and the second liquid LQ 2 .
  • the measurement of the reference mark measured by the mask alignment system and/or the various types of the calibration processes using the optical measuring sections may be performed before the substrate P as the exposure objective is placed on the substrate stage PST.
  • the control unit CONT projects the image of the pattern of the mask M onto the substrate P to expose the substrate P therewith by radiating the exposure light beam EL onto the substrate P via the projection optical system PL, the second liquid LQ 2 of the second liquid immersion area LR 2 formed on the side of the upper surface T 2 of the first optical element LS 1 , and the first liquid LQ 1 of the first liquid immersion area LR 1 formed on the side of the lower surface T 1 of the first optical element LS 1 , while moving, in the X axis direction (scanning direction), the substrate stage PST which supports the substrate P, and while performing the recovery of the first liquid LQ 1 from the surface of the substrate P by using the first liquid recovery mechanism 20 concurrently with the supply of the first liquid LQ 1 onto the substrate P by using the first liquid supply mechanism 10 .
  • the first liquid LQ 1 which is supplied from the first liquid supply mechanism 10 , locally forms the first liquid immersion area LR 1 which is greater than the projection area AR and which is smaller than the substrate P, on the part of the substrate P including the projection area AR.
  • the second liquid LQ 2 which is supplied from the second liquid supply mechanism 30 , locally forms the second liquid immersion area LR 2 which is greater than the predetermined area AR′ and which is smaller than the upper surface T 2 , on the part of the upper surface T 2 including the predetermined area AR′of the upper surface T 2 of the first optical element LS 1 .
  • the operation for supplying the first liquid LQ 1 and the operation for recovering the first liquid LQ 1 are continued by the first liquid immersion mechanism 1 .
  • the optical path for the exposure light beam EL between the first element and the substrate P is filled with the first liquid LQ 1 , while maintaining the size and the shape of the first liquid immersion area LR 1 to be in a desired state.
  • the operation for supplying the second liquid LQ 2 and the operation for recovering the second liquid LQ 2 are not performed by the second liquid immersion mechanism 2 . That is, the exposure is performed through the second liquid LQ 2 in the pooled state (retained state by the surface tension) in the second space K 2 .
  • the second liquid LQ 2 locally forms the second liquid immersion area LR 2 in only the partial area including the predetermined area AR′through which the exposure light beam EL passes, of the upper surface T 2 of the first optical element LS 1 . Accordingly, it is possible to avoid the leakage of the second liquid LQ 2 to the outside of the upper surface T 2 of the first optical element LS 1 . Therefore, it is possible to avoid the inflow and the adhesion of the second liquid LQ 2 with respect to the barrel PK (first support section 91 ) for supporting the first optical element LS 1 . It is possible to avoid the deterioration of the barrel PK (first support section 91 ). Further, it is possible to avoid the deterioration of any mechanical part and any electric part disposed around the first optical element LS 1 , which would be otherwise caused by the leaked second liquid LQ 2 .
  • the second liquid LQ 2 makes no contact, for example, with the barrel PK and/or the first support section 91 , because the second liquid LQ 2 locally forms the second liquid immersion area LR 2 on the upper surface T 2 of the first optical element LS 1 . Therefore, it is possible to avoid the inconvenience such as the mixing of any impurity including the metal ion or the like generated, for example, from the barrel PK and the first support section 91 with respect to the second liquid LQ 2 for forming the second liquid immersion area LR 2 . Therefore, the exposure process and the measurement process can be satisfactorily performed in the state in which the cleanness of the second liquid LQ 2 is maintained.
  • the exposure apparatus EX of this embodiment performs the projection exposure onto the substrate P with the image of the pattern of the mask M while moving the mask M and the substrate P in the X axis direction (scanning direction).
  • a part of the image of the pattern of the mask M is projected into the projection area AR via the projection optical system PL and the first and second liquids LQ 1 , LQ 2 of the first and second liquid immersion areas LR 1 , LR 2 .
  • the mask M is moved at the velocity V in the ⁇ X direction (or in the +X direction), in synchronization with which the substrate P is moved at the velocity ⁇ V ( ⁇ represents the projection magnification) in the +X direction (or in the ⁇ X direction) with respect to the projection area AR.
  • a plurality of shot areas are set on the substrate P. After the exposure is completed for one shot area, the next shot area is moved to the scanning start position in accordance with the stepping movement of the substrate P. The scanning exposure process is successively performed thereafter for the respective shot areas while moving the substrate P in the step-and-scan manner.
  • the first optical element LS 1 which is formed of the parallel flat plate, is arranged under the second optical element LS 2 having the lens function.
  • the first space K 1 disposed on the side of the lower surface T 1 of the first optical element LS 1 and the second space K 2 of the first optical element LS 1 disposed on the side of the upper surface T 2 are filled with the first liquid LQ 1 and the second liquid LQ 2 respectively. Accordingly, the reflection loss is reduced on the lower surface T 3 of the second optical element LS 2 and the upper surface T 2 of the first optical element LS 1 .
  • the substrate P can be exposed satisfactorily in the state in which the large image side numerical aperture of the projection optical system PL is secured.
  • the porous member 25 is inclined with respect to the surface of the substrate P.
  • the first liquid LQ 1 is recovered via the inclined surface 26 of the porous member 25 arranged in the first recovery port 22 .
  • the first liquid LQ 1 is recovered via the first recovery port 22 including the inclined surface 26 .
  • the land surface 75 and the inclined surface 26 are formed continuously.
  • FIG. 8 ( a ) (the state in which the first liquid immersion area LR 1 of the first liquid LQ 1 is formed between the land surface 75 and the substrate P), the state as shown in FIG. 8 ( b ) is obtained.
  • the component F 1 to move obliquely in the upward direction along the inclined surface 26 and the component F 2 to move in the horizontal direction are generated in the first liquid LQ 1 of the first liquid immersion area LR 1 in the predetermined state after the scanning movement as shown in FIG. 8 ( b ).
  • the shape of the interface (gas/liquid interface) LG between the first liquid LQ 1 of the first liquid immersion area LR 1 and the space disposed outside is maintained. Even when the substrate P is moved at a high velocity with respect to the first liquid immersion area LR 1 , it is possible to suppress any great change of the shape of the interface LG.
  • the distance between the inclined surface 26 and the substrate P is greater than the distance between the land surface 75 and the substrate P. That is, the space between the inclined surface 26 and the substrate P is greater than the space between the land surface 75 and the substrate P. Therefore, when the substrate P is moved with respect to the first liquid immersion area LR 1 , it is possible to make a distance L between an interface LG′ and the interface LG to be relatively small, the interface LG′ being brought about in the initial state shown in FIG. 8 ( a ) and the interface LG being brought about in the predetermined state after the scanning movement shown in FIG. 8 ( b ). Therefore, it is possible to decrease the size of the first liquid immersion area LR 1 .
  • the lower surface 26 ′ of the porous member 25 is not inclined with respect to the substrate P, and the lower surface 26 ′ of the porous member 25 is substantially in parallel to the surface of the substrate P, in other words, even if the first recovery port 22 including the lower surface 26 ′ is not inclined, then the shape of the interface LG is maintained when the substrate P is moved with respect to the first liquid immersion area LR 1 .
  • the interface LG is moved by approximately the same distance as the movement amount of the substrate P. Therefore, the distance L between the interface LG′ in the initial state and the interface LG in the predetermined state after the scanning movement has a relatively great value. Accordingly, the first liquid immersion area LR 1 is increased in size as well. On this assumption, it is necessary that the nozzle member 70 should be large-sized as well corresponding to the large first liquid immersion area LR 1 .
  • the entire exposure apparatus EX becomes huge in size.
  • the tendency to increase the size of the first liquid immersion area LR 1 is conspicuous as the scanning velocity of the substrate P with respect to the first liquid immersion area LR 1 is highly increased.
  • the shape of the interface LG tends to be collapsed, because the difference in height is provided between the land surface 75 and the lower surface 26 ′, and the land surface 75 and the lower surface 26 ′ are not formed continuously.
  • the shape of the interface LG is collapsed, there is such a high possibility that any inconvenience may be caused, in which the gas is mixed into the first liquid LQ 1 of the first liquid immersion area LR 1 , and any bubble is generated in the first liquid LQ 1 .
  • the substrate P is scanned at a high velocity in the +X direction, then the presence of the difference in height causes the collapse of the shape of the interface LG, and the component F 1 ′ to move in the upward direction is further increased.
  • the thickness is thinned for the first liquid LQ 1 in the area disposed at the position most deviated toward the +X side of the first liquid immersion area LR 1 .
  • the substrate P is moved in the ⁇ X direction (subjected to the reverse scanning) in this state, there is such a high possibility that a phenomenon arises to break the first liquid LQ 1 into portions. If the broken liquid (see the symbol LQ′ in FIG. 9 ( b )) remains, for example, on the substrate P, an inconvenience arises such that any adhesion trace (so-called water mark) is formed on the substrate P due to the vaporization of the liquid LQ′.
  • the first liquid LQ 1 outflows to the outside of the substrate P, and there is such a high possibility to cause any inconvenience including, for example, the rust and/or the electric leakage in relation to the peripheral members and the equipment as well.
  • the possibility of the occurrence of the inconvenience as described above is increased as the scanning velocity is highly increased for the substrate P with respect to the first liquid immersion area LR 1 .
  • the first recovery port 22 of the first liquid immersion mechanism 1 (first liquid recovery mechanism 20 ) is formed on the inclined surface 26 opposed to the surface of the substrate P. Therefore, even when the substrate P and the first liquid immersion area LR 1 formed on the image plane side of the projection optical system PL are relatively moved, then it is possible to maintain the shape of the interface LG between the first liquid LQ 1 of the first liquid immersion area LR 1 and the space disposed outside, and it is possible to maintain the desired state for the shape of the first liquid immersion area LR 1 . Therefore, it is possible to avoid the inconvenience which would be otherwise caused, for example, such that any bubble is generated in the first liquid LQ 1 , the liquid cannot be recovered sufficiently, and the liquid outflows.
  • the first recovery port 22 When the first recovery port 22 is provided on the inclined surface 26 , it is possible to suppress the movement amount of the interface LG. Accordingly, it is possible to decrease the size of the first liquid immersion area LR 1 . Therefore, it is also possible to realize the compact size of the entire exposure apparatus EX.
  • the first liquid LQ 1 of the first liquid immersion area LR 1 outflows to the outside and/or the first liquid LQ 1 of the first liquid immersion area LR 1 is scattered to the surroundings.
  • it is possible to suppress the leakage of the first liquid LQ 1 because the wall portion 76 is provided at the circumferential edge of the inclined surface 26 . That is, when the wall portion 76 is provided at the circumferential edge of the porous member 25 , the buffer space is formed inside the wall portion 76 .
  • the liquid LQ which forms the liquid immersion area AR 2 , is expanded in the buffer space disposed inside the wall portion 76 . Accordingly, it is possible to more reliably avoid the leakage of the liquid LQ to the outside of the wall portion 76 .
  • the part of the land surface 75 (lower surface of the bottom plate portion 72 D) is arranged under the end surface T 1 of the projection optical system PL to surround the projection area AR 1 . Therefore, the small gap, which is formed between the part of the land surface 75 (lower surface of the bottom plate portion 72 D) and the surface of the substrate P, is formed in the vicinity of the projection area to surround the projection area. Accordingly, it is possible to continuously maintain the small liquid immersion area which is necessary and sufficient to cover the projection area AR 1 .
  • the liquid supply port 12 is arranged outside the part of the land surface 75 (lower surface of the bottom plate portion 72 D). Therefore, it is possible to prevent the gas (bubble) from mixing into the liquid LQ which forms the liquid immersion area AR 2 . Even when the substrate P is moved at a high velocity, it is possible to continuously fill the optical path for the exposure light beam EL with the liquid.
  • the inclined surface 26 is formed by attaching the thin plate-shaped porous member 25 obliquely with respect to the substrate P.
  • an inclined surface may be provided on the lower surface of the nozzle member 70 so that the spacing distance with respect to the surface of the substrate P is increased at positions separated farther from the optical axis AX of the exposure light beam EL, and the liquid recovery port 22 may be formed at a predetermined position (in a predetermined area) of the inclined surface.
  • the porous member 25 may be provided for the liquid recovery port 22 .
  • the porous member 25 is arranged in the first recovery port 22 .
  • the porous member 25 is absent or omitted.
  • an inclined surface may be provided on the lower surface of the nozzle member 70 so that the spacing distance with respect to the surface of the substrate P is increased at positions separated farther from the optical axis AX of the exposure light beam EL, and the liquid recovery port may be provided at a predetermined position of the inclined surface. Accordingly, it is possible to maintain the shape of the interface LG, and it is possible to avoid the inconvenience which would be otherwise caused, for example, such that any bubble is generated in the first liquid LQ 1 of the first liquid immersion area LR 1 . Further, it is also possible to decrease the size of the first liquid immersion area LR 1 .
  • the control unit CONT stops the supply of the first liquid LQ 1 having been performed by the first liquid supply mechanism 10 , and the first liquid LQ 1 in the first liquid immersion area LR 1 (first liquid LQ 1 in the first space K 1 ) is recovered by using, for example, the first liquid recovery mechanism 20 . Further, the control unit CONT recovers the first liquid LQ 1 remaining on the substrate P and on the substrate stage PST, by using, for example, the first recovery port 22 of the first liquid recovery mechanism 20 .
  • control unit CONT recovers, via the second recovery ports 42 , the second liquid LQ 2 in the second liquid immersion area LR 2 formed in the second space K 2 after the completion of the exposure for the substrate P.
  • the substrate stage PST which supports the substrate P, is moved to an unload position by the control unit CONT to unload the substrate P.
  • the substrate P which is next to be subjected to the exposure process, is loaded on the substrate stage PST.
  • the control unit CONT supplies the second liquid LQ 2 to the second space K 2 in order to expose the substrate P loaded on the substrate stage PST.
  • the substrate P is exposed in accordance with the same sequence as that described above.
  • This embodiment is constructed such that the second liquid LQ 2 in the second space K 2 is exchanged for every substrate P to be exposed.
  • the second liquid LQ 2 in the second space K 2 may be exchanged at every predetermined time interval, every predetermined number of substrates to be processed, or every lot, for example, provided that the deterioration of the cleanness and the temperature change of the liquid LQ 2 in the second space K 2 are in such an extent that the exposure accuracy is not affected thereby.
  • the supply and the recovery of the second liquid LQ 2 may be performed continuously during the exposure of the substrate P or before or after the exposure as well.
  • the second space K 2 can be always filled with the temperature-managed and clean second liquid LQ 2 .
  • the vibration is not caused by the supply and the recovery of the second liquid LQ 2 during the exposure of the substrate P as described above.
  • the second liquid immersion area LR 2 is enormously expanded, the second liquid LQ 2 is subjected to the outflow or the scattering at the inside of the barrel PK, and the damage is increased. If the supply amount and the recovery amount of the second liquid LQ 2 per unit time are unstable, any inconvenience arises such that the second liquid immersion area LR 2 is exhausted, and the exposure accuracy is deteriorated. Therefore, when the second liquid LQ 2 is exchanged intermittently for the second space K 2 , then it is possible to form the second liquid immersion area LR 2 in a desired state, and it is possible to avoid the occurrence of the inconvenience as described above.
  • the first liquid LQ 1 may be polluted by being contaminated, for example, with any impurity generated from the substrate P, including, for example, any foreign matter resulting, for example, from the photosensitive agent (photoresist), mixing into the first liquid LQ 1 of the first liquid immersion area LR 1 (first space K 1 ).
  • the lower surface T 1 of the first optical element LS 1 may be polluted with the contaminated first liquid LQ 1 , because the first liquid LQ 1 in the first liquid immersion area LR 1 also makes contact with the lower surface T 1 of the first optical element LS 1 .
  • any impurity floating in the air may adhere to the lower surface T 1 of the first optical element LS 1 exposed on the image plane side of the projection optical system PL.
  • the first optical element LS 1 can be easily attached and detached (exchangeable) with respect to the barrel PK. Therefore, the deterioration of the exposure accuracy and the measurement accuracy via the projection optical system PL, which would be otherwise caused by the pollution of the optical element, can be avoided by exchanging only the polluted first optical element LS 1 with the clean first optical element LS 1 .
  • the second liquid LQ 2 in the second space K 2 does not make any contact with the substrate P.
  • the second space K 2 is the substantially closed space surrounded by the first optical element LS 1 , the second optical element LS 2 , and the barrel PK.
  • the impurity floating in the air is hardly mixed into the second liquid LQ 2 in the second space K 2 , and the impurity hardly adheres to the lower surface T 3 of the second optical element LS 2 and the upper surface T 2 of the first optical element LS 1 . Therefore, the cleanness is maintained for the lower surface T 3 of the second optical element LS 2 and the upper surface T 2 of the first optical element LS 1 . Therefore, when only the first optical element LS 1 is exchanged, then it is possible to avoid, for example, the deterioration of the transmittance of the projection optical system PL, and it is possible maintain the exposure accuracy and the measurement accuracy.
  • An arrangement is also conceived, in which the liquid of the first liquid immersion area LR 1 is allowed to make contact with the second optical element LS 2 without providing the first optical element LS 1 formed of the parallel flat plate.
  • the liquid of the first liquid immersion area LR 1 is allowed to make contact with the second optical element LS 2 without providing the first optical element LS 1 formed of the parallel flat plate.
  • the nozzle member 70 as described above and the various types of the measuring units such as the alignment system (although not shown) are arranged around the optical element LS 2 . Therefore, if such a large-sized optical element LS 2 is exchanged, then the operability is lowered, and the operation is difficult to be performed.
  • the optical element LS 2 has the refractive index (lens function). Therefore, it is necessary that the optical element LS 2 should be attached to the barrel PK with the high positioning accuracy in order to maintain the optical characteristic (image formation characteristic) of the entire projection optical system PL. Therefore, it is not preferable to frequently attach and detach (exchange) the optical element LS 2 as described above with respect to the barrel PK in view of the maintenance of the optical characteristic of the projection optical system PL (positioning accuracy of the optical element LS 2 ) as well.
  • This embodiment is constructed such that the relatively small-sized parallel flat plate is provided as the first optical element LS 1 , and the first optical element LS 1 is exchanged. Therefore, the operability is satisfactory, and the exchange operation can be performed with ease.
  • the exposure apparatus EX is provided with the first and second liquid immersion mechanisms 1 , 2 which are capable of independently supplying and recovering the first and second liquid LQ 1 , LQ 2 with respect to the first space K 1 disposed on the side of the lower surface T 1 of the first optical element LS 1 and the second space K 2 disposed on the side of the upper surface T 2 of the first optical element LS 1 respectively. Accordingly, the exposure light beam EL, which is radiated from the illumination optical system IL, is successfully allowed to satisfactorily arrive at the substrate P arranged on the image plane side of the projection optical system. PL while maintaining the cleanness of the first and second liquid LQ 1 , LQ 2 .
  • the space between the substrate P and the lower surface T 1 of the first optical element LS 1 is filled with the first liquid LQ 1
  • the space between the second optical element LS 2 and the upper surface T 2 of the first optical element LS 1 is filled with the second liquid LQ 2 .
  • the exposure light beam EL which has passed through the mask M, can be allowed to satisfactorily arrive at the substrate P, and the substrate P can be exposed satisfactorily.
  • the second liquid immersion area LR 2 of the second liquid LQ 2 is locally formed on the side of the upper surface T 2 of the first optical element LS 1 .
  • the second liquid LQ 2 of the second liquid immersion area LR 2 is polluted due to the contact of the second liquid LQ 2 , for example, with the barrel PK, and the barrel PK including the first support section 91 is deteriorated by the second liquid LQ 2 .
  • the second liquid immersion area LR 2 is formed locally, it is possible to avoid the inconvenience which would be otherwise caused such that the second liquid LQ 2 leaks to the outside of the barrel PK. Therefore, when any seal mechanism is provided in order to avoid the leakage of the second liquid LQ 2 , the seal mechanism can be constructed simply and conveniently. Alternatively, the seal mechanism may be omitted.
  • the outer diameter D 3 of the lower surface T 3 of the second optical element LS 2 opposed to the first optical element LS 1 is smaller than the outer diameter D 2 of the upper surface T 2 of the first optical element LS 1 . Therefore, the second liquid immersion area LR 2 , which has the size corresponding to the lower surface T 3 of the second optical element LS 2 , can be formed locally and satisfactorily on the upper surface T 2 of the first optical element LS 1 . It is possible to further reliably avoid the leakage of the second liquid LQ 2 from the circumference of the upper surface T 2 of the first optical element LS 1 .
  • the upper surface T 2 of the first optical element LS 1 is provided with the second area HR 2 having the liquid repellence in order to avoid, for example, the leakage of the second liquid LQ 2 .
  • a bank portion DR may be provided to surround the first area HR 1 on the upper surface T 2 of the first optical element LS 1 . Also in this way, it is possible to avoid the leakage of the second liquid LQ 2 of the second liquid immersion area LR 2 formed in the first area HR 1 .
  • the optical path for the exposure light beam EL in the second space K 2 may be filled with the second liquid LQ 2 by storing a predetermined amount of the second liquid LQ 2 in the bank portion DR.
  • the second liquid LQ 2 which has overflowed from the bank portion DR or which is likely to overflow, may be recovered.
  • the liquid recovery port is provided on the inclined surface of the lower surface of the nozzle member 70 (lower surface of the porous member).
  • the liquid recovery port may be provided on the surface which is substantially parallel to (flush with) the land surface 75 , without forming the inclined surface on the lower surface of the nozzle member 70 . That is, the first liquid recovery port 22 may be provided as shown in FIGS.
  • the wall portion 76 is provided at the circumferential edge of the inclined surface (lower surface of the porous member) formed on the lower surface of the nozzle member 70 .
  • the wall portion 76 is also possible to omit the wall portion 76 .
  • the part of the land surface (flat portion) 75 of the nozzle member 70 is formed between the projection optical system PL and the substrate P, and the inclined surface (lower surface of the porous member) is formed at the outside thereof.
  • the part of the land surface may be arranged outside (around) the end surface T 1 of the projection optical system PL with respect to the optical axis of the projection optical system PL, instead of being arranged under the projection optical system PL.
  • the land surface 75 may be substantially flush with the end surface T 1 of the projection optical system PL.
  • the position of the land surface 75 in the Z axis direction may be separated in the +Z direction or in the ⁇ Z direction from the end surface T 1 of the projection optical system PL.
  • the liquid supply port 12 is formed to be annular slit-shaped to surround the projection area AR 1 .
  • a plurality of supply ports which are separated from each other, may be provided.
  • the positions of the supply ports are not specifically limited.
  • the supply ports may be provided one by one on the both sides of the projection area AR 1 (on the both sides in the X axis direction or on the both sides in the Y axis direction).
  • the supply ports may be provided one by one (four in total) on the both sides of the projection area AR 1 in the X axis direction and the Y axis direction.
  • the first supply port 12 is provided at the position opposed to the substrate P.
  • the first liquid LQ 1 may be supplied from the space between the first optical element LS 1 and the bottom plate portion 72 D.
  • the supply port may be provided to surround the optical path for the exposure light beam EL.
  • the supply ports may be provided one by one on the both sides of the optical path for the exposure light beam EL.
  • a plurality of fin members 150 may be formed on the inclined surface formed on the lower surface of the nozzle member 70 (lower surface of the porous member 25 ).
  • the fin member 150 is substantially triangular as viewed in a side view. As shown in the side sectional view in FIG. 11 , the fin members 150 are arranged in the buffer space formed on the inner side of the wall portion 76 and on the lower surface of the porous member 25 .
  • the fin member 150 is attached to the inner side surface of the wall portion 76 radially so that the longitudinal direction thereof is directed outwardly. In this arrangement, the plurality of fin members 150 are separated from each other, and the spaces are formed between the respective fin members 150 .
  • the plurality of fin members 150 may be provided at equal intervals. Alternatively, the plurality of fin members 150 may be provided at unequal intervals. For example, the intervals of the fin members 150 arranged on the both sides in the X axis direction with respect to the projection area AR 1 may be set to be smaller than the intervals of the fin members 150 arranged on the both sides in the Y axis direction with respect to the projection area AR 1 .
  • the surface of the fin member 150 is liquid-attractive with respect to the liquid LQ.
  • the fin member 150 may be formed by applying the “GOLDEP” treatment or the “GOLDEP WHITE” treatment to stainless steel (for example, SUS 316 ).
  • the fin member 150 can be formed of, for example, glass (silica glass) as well.
  • each of the first optical element LS 1 and the second optical element LS 2 is supported in the substantially stationary state by the barrel PK with respect to the optical path for the exposure light beam EL.
  • the first optical element LS 1 is a parallel flat plate in which the lower surface T 1 and the upper surface T 2 are in parallel to each other.
  • the lower surface T 1 and the upper surface T 2 are substantially parallel to the XY plane.
  • the first optical element LS 1 is supported by a first support section 91 provided at the lower end of the barrel PK.
  • a flange portion F 1 which serves as a support objective portion, is provided at an upper portion of the first optical element LS 1 .
  • the first support section 91 supports the first optical element LS 1 by supporting the lower surface T 5 of the flange portion F 1 .
  • the lower surface T 5 of the flange portion F 1 is also substantially parallel to the XY plane, and the lower surface T 5 of the flange portion F 1 is formed around the lower surface T 1 of the first optical element LS 1 .
  • the distance (thickness) H 1 between the lower surface T 1 and the upper surface T 2 of the first optical element LS 1 on the optical axis AX of the projection optical system PL is not less than 15 mm.
  • the distance H 1 between the lower surface T 1 and the upper surface T 2 of the first optical element LS 1 on the optical axis AX is greater than the distance between the substrate P and the lower surface T 1 of the first optical element LS 1 . That is, the thickness of the first optical element LS 1 on the optical axis AX is formed to be thicker than the liquid LQ 1 .
  • the thickness of the liquid LQ 1 is about 3 mm.
  • the distance between the land surface 75 and the substrate P is about 1 mm.
  • the thickness H 1 of the first optical element LS 1 is about 15 mm.
  • the thickness H 1 can be set within a range of about 15 mm to 20 mm.
  • the second optical element LS 2 is supported by a second support section 92 which is provided over the first support section 91 in the barrel PK.
  • a flange portion F 2 which serves as a support objective portion, is provided at an upper portion of the second optical element LS 2 .
  • the second support section 92 supports the second optical element LS 2 by supporting the flange portion F 2 .
  • the lower surface T 3 of the second optical element LS 2 is formed to be flat or planar.
  • the lower surface T 3 of the second optical element LS 2 supported by the second support section 92 is substantially parallel to the upper surface T 2 of the first optical element LS 1 supported by the first support section 91 .
  • the upper surface T 4 of the second optical element LS 2 is formed to be convex toward the object plane (toward the mask M), and has a positive refractive index.
  • the first optical element LS 1 can be easily attached and detached with respect to the first support section 91 of the barrel PK. That is, the first optical element LS 1 is provided exchangeably.
  • the second optical element LS 2 which has the refractive index (lens function), is supported by the second support section 92 of the barrel PK in a state of being satisfactorily positioned.
  • the upper surface T 2 of the first optical element LS 1 having the flange portion F 1 is formed to be sufficiently greater than the lower surface T 3 of the second optical element LS 2 .
  • the outer diameter D 3 of the lower surface T 3 of the second optical element LS 2 opposed to the first optical element LS 1 is smaller than the outer diameter D 2 of the upper surface T 2 of the first optical element LS 1 .
  • the second liquid immersion area LR 2 is locally formed by the second liquid LQ 2 on the upper surface T 2 of the first optical element LS 1 .
  • the distance H 1 between the lower surface T 1 and the upper surface T 2 of the first optical element LS 1 is longer than the distance H 2 between the upper surface T 2 of the first optical element LS 1 and the lower surface T 5 of the flange portion F 1 .
  • the outer diameter D 2 of the upper surface T 2 of the first optical element LS 1 having the flange portion F 1 is set to be not less than twice the outer diameter D 1 of the lower surface T 1 of the first optical element LS 1 .
  • the first optical element LS 1 which has the lower surface T 5 of the flange portion F 1 supported by the first support section 91 , has the lower portion which is exposed (which protrudes) downwardly from the lower surface PKA of the barrel PK.
  • At least a part of the nozzle member 70 is arranged in the space formed between the substrate P and the flange portion F 1 of the first optical element LS 1 and the first support section 91 for supporting the flange portion F 1 .
  • the flange portion (support objective portion) F 1 of the first optical element LS 1 and the first support section 91 for supporting the flange portion F 1 are provided over (above) the nozzle member 70 .
  • the upper surface 70 B of the nozzle member 70 is opposed to the lower surface T 5 of the flange portion F 1 of the first optical element LS 1 and the lower surface PKA of the barrel PK.
  • An inner side surface 70 T of the nozzle member 70 is opposed to a side surface C 1 of the first optical element LS 1 .
  • the nozzle member 70 which is arranged under the flange portion F 1 , is arranged closely to the side surface C 1 of the first optical element LS 1 .
  • the first supply port 12 which is provided for the nozzle member 70 , is provided closely to the projection area AR.
  • the first recovery port 22 which is formed to surround the projection area AR, is also provided closely to the projection area AR.
  • the outer diameter D 22 of the first recovery port 22 is provided to be smaller than the outer diameter D 2 of the upper surface T 2 of the first optical element LS 1 .
  • the bottom plate portion 72 D which forms the land surface 75 , is arranged to creep into the space under the lower surface T 1 of the first optical element LS 1 .
  • the outer diameter D 2 of the upper surface T 2 of the first optical element LS 1 is greater than the outer diameter D 1 of the lower surface T 1 . More specifically, the outer diameter D 2 of the upper surface T 2 is not less than twice the outer diameter D 1 of the lower surface T 1 . Therefore, when the first optical element LS 1 is supported by the first support section 91 , the first support section for supporting the first optical element LS 1 can be provided at the position separated far from the optical axis AX of the first optical element LS 1 in relation to the horizontal direction, by allowing the first support section 91 to support the end portion of the upper surface T 2 (flange portion F 1 ).
  • the nozzle member 70 which is provided for the first liquid LQ 1 , can be arranged in the space. This arrangement is not directed to only the nozzle member 70 . It is also possible to improve the degree of freedom of the arrangement, for example, when various measuring units such as the alignment system are arranged. It is also possible to improve the degree of freedom of the design of the measuring unit or the like to be arranged in the space, because the space is sufficiently secured.
  • the outer diameter D 2 of the upper surface T 2 of the first optical element LS 1 is not less than twice the outer diameter D 1 of the lower surface T 1 , and the outer diameter D 1 of the lower surface T 1 of the first optical element LS 1 is sufficiently smaller than the upper surface T 2 . Therefore, the first liquid LQ 1 of the first liquid immersion area LR 1 formed by the first liquid immersion mechanism 1 is made to have a contact with the lower surface T 1 , and thus the size of the first liquid immersion area LR 1 can be decreased depending on the lower surface T 1 . Therefore, it is possible to avoid the inconvenience of the enormous increase in size of the entire exposure apparatus EX which would be otherwise caused by the enormous increase in size of the first liquid immersion area LR 1 .
  • the size (position) of the first recovery port 22 is regarded as one of the factors to determine the size of the first liquid immersion area LR 1 .
  • the outer diameter D 22 of the first recovery port 22 is smaller than the outer diameter D 2 of the upper surface T 2 of the first optical element LS 1 . Therefore, it is possible to decrease the size of the first liquid immersion area LR 1 .
  • the distance H 1 between the lower surface T 1 and the upper surface T 2 of the first optical element LS 1 is greater than the distance between the first optical element LS 1 and the substrate P. More specifically, the distance H 1 is not less than 15 mm, and the first optical element LS 1 is thick.
  • the first support section 91 which supports the first optical element LS 1 , can be provided at the position separated far from the lower surface T 1 of the first optical element LS 1 in relation to the vertical direction, by allowing the first support section 91 to support the portion disposed in the vicinity of the upper surface T 2 of the first optical element LS 1 , i.e., the flange portion F 1 for forming the upper surface T 2 in this embodiment. Therefore, it is possible to secure the space between the substrate P and the lower surface T 5 of the flange portion F 1 of the first optical element LS 1 (space around the first optical element LS 1 ).
  • the nozzle member 70 can be arranged in the space.
  • This arrangement is not directed to only the nozzle member 70 . It is also possible to improve the degree of freedom of the arrangement, for example, when various measuring units such as the alignment system are arranged. It is also possible to improve the degree of freedom of the design.
  • the nozzle member 70 can be arranged closely to the side surface C 1 of the first optical element LS 1 . Accordingly, it is possible to realize the compact size of the nozzle member 70 , and it is possible to decrease the size of the first liquid immersion area LR 1 of the first liquid LQ 1 . Therefore, it is possible to avoid the inconvenience of the enormous increase in size of the entire exposure apparatus EX which would be otherwise caused by the enormous expansion of the first liquid immersion area LR 1 .
  • the thickness (distance H 1 ) of the first optical element LS 1 is thicker than that of the first liquid LQ 1 disposed between the first optical element LS 1 and the substrate P. More specifically, the distance H 1 is not less than 15 mm. Accordingly, it is possible to suppress the change of the shape of the first optical element LS 1 which would be otherwise caused by the force received from the liquid. Therefore, it is possible to maintain the high image formation performance of the projection optical system PL.
  • the first optical element LS 1 satisfies both of the condition in which the distance (thickness) H 1 is not less than 15 mm and the condition in which the outer diameter D 2 of the upper surface T 2 is not less than twice the outer diameter D 1 of the lower surface T 1 .
  • the first optical element LS 1 may be constructed under a condition in which any one of the foregoing conditions is satisfied. Even in the case of the arrangement in which any one of the conditions is satisfied, it is possible to realize the compact size of the nozzle member 70 , and it is possible to avoid the enormous expansion of the first liquid immersion area LR 1 .
  • the first optical element LS 1 has the conical side surface in which the outer diameter is decreased at positions separated farther from the flange portion F 1 toward the lower surface T 1 .
  • the shape of the first optical element LS 1 is not limited to this shape.
  • a columnar first optical element LS 1 may also be adopted, in which the side surface has the outer diameter D 1 while maintaining the flange portion F 1 .
  • the diameter of the exposure light beam EL in the scanning direction (X direction) is smaller than the diameter in the non-scanning direction (Y direction) in the first optical element LS 1 .
  • a first optical element may also be adopted, wherein the cross section, which is taken along the XY plane, is an ellipse having a small diameter in the X direction, wherein the first optical element has a side surface such that the outer diameter is decreased at positions separated farther from the flange portion F 1 toward the lower surface T 1 .
  • the shape and the arrangement of the nozzle member can be changed in conformity therewith.
  • the distance between the substrate P and the lower surface T 1 of the first optical element LS 1 is about 3 mm
  • the distance between the land surface 75 and the substrate P is about 1 mm
  • the distance between the upper surface T 2 of the first optical element LS 1 and the lower surface T 3 of the second optical element LS 2 is about 3 mm.
  • the distance between the substrate P and the lower surface T 1 of the first optical element LS 1 can be set within a range of 1 to 5 mm, considering the absorption of the exposure light beam EL by the liquid LQ 1 and the flow of the liquid LQ 1 in the first space K 1 , in the same manner as in the embodiment described above.
  • the distance between the land surface 75 and the substrate P can be also set within a range of 0.5 to 1 mm.
  • the distance between the upper surface T 2 of the first optical element LS 1 and the lower surface T 3 of the second optical element LS 2 can be also set within a range of 0.5 to 5 mm considering the flow of the liquid LQ 2 .
  • the barrel PK is constructed by combining a plurality of divided barrels (sub-barrels).
  • the sub-barrel which includes the first support section 91 for supporting the first optical element LS 1 , can be attached and detached with respect to the partial barrel for supporting the other optical elements L 2 to L 7 .
  • the first optical element LS 1 having the flange portion F 1 is exchangeable by being detached from the partial barrel together with the sub-barrel.
  • the first optical element LS 1 of the embodiment of the present invention is used, it is also allowable to adopt an arrangement in which no second liquid immersion area LR 2 is formed as shown in FIG. 13 .
  • the first optical element LS 1 shown in FIG. 13 is the optical element which is closest to the image plane of the projection optical system PL.
  • the upper surface T 2 of the first optical element LS 1 is formed to be convex toward the object plane, which has a positive refractive index.
  • the first liquid LQ 1 of the first liquid immersion area LR 1 makes contact with the first optical element LS 1 .
  • the first optical element LS 1 satisfies at least any one of the condition in which the distance H 1 between the lower surface T 1 and the upper surface T 2 on the optical axis AX is not less than 15 mm and the condition in which the outer diameter D 2 of the upper surface T 2 is not less than twice the outer diameter D 1 of the lower surface T 1 , then it is possible to realize the compact size of the nozzle member 70 , and it is possible to avoid the enormous expansion of the first liquid immersion area LR 1 .
  • the second liquid immersion area LR 2 of the second liquid LQ 2 is locally formed on the upper surface T 2 of the first optical element LS 1 .
  • an arrangement is also adoptable, in which the second liquid LQ 2 of the second liquid immersion area LR 2 is arranged in the substantially entire region of the upper surface T 2 .
  • the first optical element LS 1 satisfies at least any one of the condition in which the distance H 1 between the lower surface T 1 and the upper surface T 2 on the optical axis AX is not less than 15 mm and the condition in which the outer diameter D 2 of the upper surface T 2 is not less than twice the outer diameter D 1 of the lower surface T 1 .
  • the first optical element LS 1 is exposed (allowed to protrude) downwardly from the barrel PK, and the nozzle member 70 is arranged closely to the first optical element LS 1 .
  • a second supply port 32 which constructs a part of the second liquid supply mechanism 30 , is provided on the inner side surface PKC of the barrel PK.
  • the second supply port 32 is formed at the position in the vicinity of the second space K 2 on the inner side surface PKC of the barrel PK.
  • the second supply port 32 is provided on the +X side with respect to the optical axis AX of the projection optical system PL.
  • the second liquid LQ 2 which is fed from the second liquid supply section 31 , is discharged by the second supply port 32 substantially in parallel to the upper surface T 2 of the first optical element LS 1 , i.e., substantially in parallel to the XY plane (in the lateral direction).
  • the force, which is exerted by the supplied second liquid LQ 2 , for example, on the first and second optical elements LS 1 , LS 2 , can be reduced, because the second supply port 32 discharges the second liquid LQ 2 substantially in parallel to the upper surface T 2 of the first optical element LS 1 . Therefore, it is possible to avoid the occurrence of the inconvenience which would be otherwise caused, for example, such that the first and second optical elements LS 1 , LS 2 or the like are deformed or displaced due to the supplied second liquid LQ 2 .
  • a second recovery port 42 which constructs a part of the second liquid recovery mechanism 40 , is provided at a predetermined position with respect to the second supply port 32 on the inner side surface PKC of the barrel PK.
  • the second recovery port 42 is formed at the position in the vicinity of the second space K 2 on the inner side surface PKC of the barrel PK.
  • the second recovery port 42 is provided on the ⁇ X side with respect to the optical axis AX of the projection optical system PL. That is, the second supply port 32 and the second recovery port 42 are opposed to each other.
  • the second supply port 32 and the second recovery port 42 are formed to be slit-shaped respectively.
  • the second supply port 32 and the second recovery port 42 may be formed to have arbitrary shapes including, for example, substantially circular, elliptical, and rectangular shapes. In this embodiment, the second supply port 32 and the second recovery port 42 mutually have approximately the same size. However, the second supply port 32 and the second recovery port 42 may have sizes different from each other.
  • the other end of the second supply tube 33 is connected to one end of the second supply flow passage 34 formed in the barrel PK.
  • the other end of the second supply flow passage 34 of the barrel PK is connected to the second supply port 32 formed on the inner side surface PKC of the barrel PK.
  • the second liquid LQ 2 which is fed from the second liquid supply section 31 of the second liquid supply mechanism 30 , flows through the second supply tube 33 , and then the second liquid LQ 2 flows into one end of the second supply flow passage 34 formed in the barrel PK.
  • the second liquid LQ 2 which has flown into one end of the second supply flow passage 34 , is supplied to the second space K 2 between the second optical element LS 2 and the first optical element LS 1 from the second supply port 32 formed on the inner side surface PKC of the barrel PK.
  • the other end of the second recovery tube 43 is connected to one end of the second recovery flow passage 44 formed in the barrel PK.
  • the other end of the second recovery flow passage 44 is connected to the second recovery port 42 formed on the inner side surface PKC of the barrel PK.
  • the barrel PK is provided with an opposing surface 93 which is opposed to the circumferential edge area of the upper surface T 2 of the first optical element LS 1 supported by the first support section 91 .
  • a first seal member 94 is provided between the opposing surface 93 and the circumferential edge area of the upper surface T 2 .
  • the first seal member 94 is formed of, for example, a C-ring or an O-ring (for example, “Kalrez” produced by DuPont Dow). The first seal member 94 avoids the leakage of the second liquid LQ 2 arranged on the upper surface T 2 to the outside of the upper surface T 2 , and consequently the leakage to the outside of the barrel PK.
  • a second seal member 95 is provided between the side surface C 2 of the second optical element LS 2 and the inner side surface PKC of the barrel PK.
  • the second seal member 95 is formed of, for example, a V-ring.
  • the second seal member 95 regulates the flow of the fluid (including the gas, the second liquid LQ 2 , and the humid gas generated from the second liquid LQ 2 ) between the second space K 2 and a third space K 3 disposed upwardly from the second optical element LS 2 in the barrel PK. Accordingly, it is possible to maintain the environment (for example, the temperature and the humidity) in the internal space of the barrel PK including the third space K 3 . Further, it is possible to prevent the gas (bubble), from the third space K 3 , from entering into the second liquid LQ 2 of the second liquid immersion area LR 2 .
  • the distance between the side surface C 2 of the second optical element LS 2 and the inner side surface PKC of the barrel PK may be narrowed, for example, to about 1 to 5 ⁇ m without providing the second seal member 95 . Also in this way, it is possible to prohibit the flow of the fluid between the second space K 2 and the third space K 3 via the gap between the side surface C 2 of the second optical element LS 2 and the inner side surface PKC of the barrel PK.
  • the control unit CONT supplies and recovers the second liquid LQ 2 by using the second liquid supply mechanism 30 and the second liquid recovery mechanism 40 while optimally controlling the supply amount of the second liquid LQ 2 per unit time brought about by the second liquid supply mechanism 30 and the recovery amount of the second liquid LQ 2 per unit time brought about by the second liquid recovery mechanism 40 .
  • the control unit CONT fills at least the optical path for the exposure light beam EL in the second space K 2 with the second liquid LQ 2 .
  • the second liquid supply mechanism 30 supplies the second liquid LQ 2 to the second space K 2 at a flow rate of 0.1 cc/min to 100 cc/min.
  • the supply operation and the recovery operation for the second liquid LQ 2 are continuously performed by the second liquid supply mechanism 30 and the second liquid recovery mechanism 40 during the exposure of the substrate P as well. Further, the supply operation and the recovery operation for the second liquid LQ 2 are continuously performed by the second liquid supply mechanism 30 and the second liquid recovery mechanism 40 before and after the exposure of the substrate P as well.
  • the second liquid LQ 2 in the second space K 2 is always exchanged with the clean and temperature-managed second liquid LQ 2 .
  • the second space K 2 is filled with the clean and temperature-managed second liquid LQ 2 .
  • the supply and the recovery of the second liquid LQ 2 by the second liquid immersion mechanism 2 may be performed intermittently.
  • the supply operation and/or the recovery operation for the liquid by the second liquid immersion mechanism 2 may be stopped during the exposure of the substrate P. Accordingly, any vibration, which is to be caused by the supply and/or the recovery of the second liquid LQ 2 , is not generated during the exposure of the substrate P. It is possible to avoid the deterioration of the exposure accuracy which would be otherwise caused by the vibration.
  • a thin plate-shaped mesh member which is formed with a large number of pores, can be used as a porous member 25 for the first recovery port 22 of the first liquid recovery mechanism 20 .
  • the porous member (mesh member) is formed of titanium.
  • only the liquid LQ is recovered from the pores of the porous member 25 by controlling the pressure difference between the upper surface and the lower surface of the porous member 25 so that a predetermined condition is satisfied as described later on, in a state in which the porous member 25 is wet.
  • the parameters concerning the predetermined condition include, for example, the pore size of the porous member 25 , the contact angle (affinity) of the porous member 25 with respect to the liquid LQ, and the suction force of the first liquid recovery section 21 (pressure at the upper surface of the porous member 25 ).
  • FIG. 16 shows a magnified view illustrating a partial cross section of the porous member 25 , and depicts a specified example of the liquid recovery to be performed by the aid of the porous member 25 .
  • the substrate P is arranged under the porous member 25 .
  • the gas space and the liquid space are formed between the porous member 25 and the substrate P. More specifically, the gas space is formed between the substrate P and the first pore 25 Ha of the porous member 25 , and the liquid space is formed between the substrate P and the second pore 25 Hb of the porous member 25 .
  • a flow passage space which forms a part of the first recovery flow passage 24 , is formed over the porous member 25 .
  • the gas which is disposed in the space on the lower side of the porous member 25 , can be prevented from any movement to (entering into) the space disposed on the upper side of the porous member 25 via the pore 25 Ha. That is, the interface between the liquid LQ and the gas is maintained in the pore 25 Ha of the porous member 25 by optimizing the contact angle ⁇ , the pore size d, the surface tension ⁇ of the liquid LQ, and the pressures Pa, Pb to satisfy the condition represented by the expression (3).
  • the liquid space is formed on the lower side of the second pore 25 Hb of the porous member 25 (on the side of the substrate P). Therefore, it is possible to recover only the liquid LQ via the second pore 25 Hb.
  • the first liquid recovery mechanism 20 controls the suction force of the first liquid recovery section 21 to adjust the pressure of the flow passage space over the porous member 25 so that the expression (3) described above is satisfied, assuming that the pressure Pa of the space under the porous member 25 , the diameter d of the pore 25 H, the contact angle ⁇ of the porous member 25 (inner side surface of the pore 25 H) with respect to the liquid LQ, and the surface tension ⁇ of the liquid (pure water) LQ are constant.
  • the pressure Pb is more easily controlled to satisfy the expression (3). Therefore, it is desirable that the diameter d of the pore 25 Ha, 25 Hb and the contact angle ⁇ of the porous member 25 with respect to the liquid LQ (0° ⁇ 90°) are made as small as possible.
  • the projection optical system PL is provided with the element as the first optical element LS 1 in which the outer diameter of the upper surface T 2 is wider than that of the lower surface T 3 of the second optical element LS 2 .
  • the outer diameter of the lower surface T 3 of the second optical element LS 2 is wider than that of the upper surface T 2 of the first optical element LS 1 .
  • the outer edge portion of the lower surface T 3 of the second optical element LS 2 can be treated to be liquid-repellent, and only the central portion for forming the liquid immersion area can be treated to be liquid-attractive.
  • a bank DR as shown in FIG. 10 may be provided at the outer edge portion of the lower surface T 3 of the second optical element LS 2 .
  • the supply operation and the recovery operation for the second liquid LQ 2 performed by the second liquid supply mechanism 30 and the second liquid recovery mechanism 40 are the same as the supply operation and the recovery operation for the first liquid LQ 1 performed by the first liquid supply mechanism 10 and the first liquid recovery mechanism 20 . It is also allowable that the supply amount and the recovery amount of each of the liquids and/or the flow rate of each of the liquids is different from each other.
  • the supply amount and the recovery amount of the liquid LQ 2 in the second space K 2 may be smaller than the supply amount and the recovery amount of the first liquid LQ 1 in the first space, and the flow rate of the liquid LQ 2 in the second space K 2 may be slower than the flow rate of the liquid LQ 1 in the first space K 1 .
  • the liquid (pure water), which is supplied from the first liquid supply mechanism 10 to the first space K 1 is the same as the liquid (pure water) which is supplied from the second liquid supply mechanism 30 to the second space K 2 (temperature is the same as well).
  • the quality for example, the temperature, the temperature uniformity, and the temperature stability
  • the specific resistance value, the total organic carbon (TOC) value, and the dissolved gas concentration (dissolved oxygen concentration, dissolved nitrogen concentration), the refractive index, and the transmittance may differ, for example, in addition to the temperature, the temperature uniformity, and the temperature stability.
  • pure water is used as the liquid LQ 1 , LQ 2 in the embodiment of the present invention.
  • Pure water is advantageous in that pure water is available in a large amount with ease, for example, in the semiconductor production factory, and pure water exerts no harmful influence, for example, on the optical element (lens) and the photoresist on the substrate P. Further, pure water exerts no harmful influence on the environment, and the content of impurity is extremely low. Therefore, it is also expected to obtain the function to wash (clean) the surface of the substrate P and the surface of the optical element provided at the end surface of the projection optical system PL.
  • the exposure apparatus may posses an ultrapure water-producing unit.
  • the refractive index n of pure water (water) with respect to the exposure light beam EL having a wavelength of about 193 nm is approximately in an extent of 1.44.
  • the ArF excimer laser beam (wavelength: 193 nm) is used as the light source of the exposure light beam EL, then the wavelength is shortened on the substrate P by 1/n, i.e., to about 134 nm, and a high resolution is obtained.
  • the depth of focus is magnified about n times, i.e., about 1.44 times as compared with the value obtained in the air. Therefore, when it is enough to secure an approximately equivalent depth of focus as compared with the case of the use in the air, it is possible to further increase the numerical aperture of the projection optical system PL. Also in this viewpoint, the resolution is improved.
  • the first and second liquid supply mechanisms 10 , 30 supply pure water as the liquids LQ 1 , LQ 2 .
  • mutually different types of liquids may be supplied so that the first liquid LQ 1 , with which the first space K 1 is filled, may be of the type different from that of the second liquid LQ 2 with which the second space K 2 is filled.
  • the refractive index and/or the transmittance with respect to the exposure light beam EL differs between the first liquid and the second liquid.
  • the second space K 2 may be filled with a predetermined liquid other than pure water, which is represented by fluorine-based oil.
  • the oil is such a liquid that the probability of proliferation of microbes such as bacterial is low. Therefore, it is possible to maintain the cleanness of the second space K 2 and the flow passage through which the second liquid LQ 2 (fluorine-based oil) flows.
  • Both of the first and second liquids LQ 1 , LQ 2 may be liquids other than water.
  • the light source of the exposure light beam EL is the F 2 laser
  • the F 2 laser beam is not transmitted through water. Therefore, it is preferable to use a fluorine-based liquid including, for example, perfluoropolyether (PFPE) and fluorine-based oil through which the F 2 laser beam is transmissive, as the first and second liquid LQ 1 , LQ 2 .
  • PFPE perfluoropolyether
  • the portion, which makes contact with the first and second liquid LQ 1 , LQ 2 is subjected to the liquid-attracting treatment, for example, by forming a thin film with a substance having a molecular structure with small polarity including fluorine.
  • first and second liquid LQ 1 , LQ 2 liquids (for example, cedar oil) which have the transmittance with respect to the exposure light beam EL, which have the refractive index as high as possible, and which are stable against the photoresist coated on the surface of the substrate P and the projection optical system PL.
  • the surface treatment is performed depending on the polarity of the first and second liquid LQ 1 , LQ 2 to be used.
  • fluids having desired refractive indexes including, for example, supercritical fluids and gases having high refractive indexes, in place of pure water for the liquids LQ 1 , LQ 2 .
  • the projection optical system PL which includes the first optical element LS 1 as the parallel flat plate having no refractive power, is adjusted to have the predetermined image formation characteristic.
  • the first optical element LS 1 exerts no influence on the image formation characteristic at all, it is also allowable to make the adjustment so that the image formation characteristic of the projection optical system PL is the predetermined image formation characteristic except for the first optical element LS 1 .
  • both of the first optical element LS 1 and the second optical element LS 2 are supported by the barrel PK.
  • the first optical element LS 1 and the second optical element LS 2 may be supported by different support members respectively.
  • both of the first optical element LS 1 and the second optical element LS 2 are supported by the barrel PK in the substantially stationary state.
  • the first optical element LS 1 and the second optical element LS 2 may be supported finely movably in order to adjust the position and the posture of at least one of the first optical element LS 1 and the second optical element LS 2 .
  • the first optical element LS 1 is the parallel flat plate having no refractive power in which the lower surface T 1 and the upper surface T 2 are the flat surfaces respectively, and the lower surface T 1 and the upper surface T 2 are in parallel to each other.
  • the upper surface T 2 of the first optical element LS 1 may have a slight curvature. That is, the first optical element LS 1 may be an optical element having any lens function. In this case, it is preferable that the curvature of the upper surface T 2 of the first optical element LS 1 is smaller than the curvatures of the upper surface T 4 and the lower surface T 3 of the second optical element LS 2 .
  • the second liquid immersion mechanism 2 for performing the supply and the recovery of the second liquid LQ 2 is absent.
  • the exposure is performed without exchanging the second liquid LQ 2 in the second space K 2 in the state in which the space between the first optical element LS 1 and the second optical element LS 2 is filled with the second liquid LQ 2 .
  • the temperature of the second liquid LQ 2 in the second liquid immersion area LR 2 may be varied by the radiation of the exposure light beam EL.
  • a temperature-adjusting unit which adjusts the temperature of the second liquid LQ 2 in the second liquid immersion area LR 2 , may be provided, for example, between the first optical element LS 1 and the second optical element LS 2 to successfully adjust the temperature of the second liquid LQ 2 by using the temperature-adjusting unit.
  • the respective embodiments described above are principally illustrative of the case in which the projection optical system PL and the substrate P are opposed to one another. However, even when the projection optical system PL is opposed to another member (for example, the upper surface 91 of the substrate stage PST), the space between the projection optical system PL and the another member can be filled with the first liquid LQ 1 . In this arrangement, the space on the image plane side of the projection optical system PL may be continuously filled with the first liquid LQ 1 by using the another member when the substrate stage PST is separated from the projection optical system PL, for example, during the operation for exchanging the substrate.
  • the numerical aperture NA of the projection optical system is 0.9 to 1.3 in some cases.
  • the numerical aperture NA of the projection optical system is large as described above, it is desirable to use the polarized illumination, because the image formation performance is deteriorated due to the polarization effect in some cases with the random polarized light which has been hitherto used as the exposure light beam.
  • the linear polarized illumination which is adjusted to the longitudinal direction of the line pattern of the line-and-space pattern of the mask (reticle), is effected so that the diffracted light of the S-polarized light component (TE-polarized light component), i.e., the component in the polarization direction along with the longitudinal direction of the line pattern is dominantly allowed to outgo from the pattern of the mask (reticle).
  • TE-polarized light component the diffracted light of the S-polarized light component
  • the diffracted light of the S-polarized light component (TE-polarized light component), which contributes to the improvement in the contrast, has the high transmittance on the resist surface, as compared with the case in which the space between the projection optical system PL and the resist coated on the surface of the substrate P is filled with the air (gas). Therefore, it is possible to obtain the high image formation performance even when the numerical aperture NA of the projection optical system exceeds 1.0. Further, it is more effective to appropriately combine, for example, the phase shift mask and the oblique incidence illumination method (especially the dipole illumination method) adjusted to the longitudinal direction of the line pattern as disclosed in Japanese Patent Application Laid-open No.
  • the combination of the linear polarized illumination method and the dipole illumination method is effective when the direction of the cycle of the line-and-space pattern is limited to a predetermined certain direction and/or when the hole pattern is clustered in a predetermined certain direction.
  • the mask M acts as a polarizing plate due to the Wave guide effect depending on the structure of the mask M (for example, the pattern fineness and the thickness of chromium), and the diffracted light of the S-polarized light component (TE-polarized light component) outgoes from the mask M in an amount greater than that of the diffracted light of the P-polarized light component (TM-polarized light component) which lowers the contrast.
  • a fine line-and-space pattern for example, line-and-space of about 25 to 50 nm
  • the projection optical system PL having a reduction magnification of about 1 ⁇ 4
  • the mask M acts as a polarizing plate due to the Wave guide effect depending on the structure of the mask M (for example, the pattern fineness and the thickness of chromium), and the diffracted light of the S-polarized light component (TE-polarized light component) outgoes from the mask M in an amount greater than that of the diffracted light of the P-polarized light component (TM-polarized light component
  • the P-polarized light component (TM-polarized light component) is greater than the S-polarized light component (TE-polarized light component) due to the Wire Grid effect.
  • the ArF excimer laser is used as the exposure light beam
  • the substrate P is exposed with a line-and-space pattern greater than 25 nm by using the projection optical system PL having a reduction magnification of about 1 ⁇ 4
  • the diffracted light of the S-polarized light component (TE-polarized light component) outgoes from the mask M in an amount greater than that of the diffracted light of the P-polarized light component (TM-polarized light component). Therefore, it is possible to obtain the high resolution performance even when the numerical aperture NA of the projection optical system PL is large, for example, 0.9 to 1.3.
  • the pattern of the mask includes not only the line pattern extending in one predetermined direction, but the pattern also includes the line patterns extending in a plurality of different directions in a mixed manner (line-and-space patterns having different directions of the cycle are present in a mixed manner), then it is possible to obtain the high image formation performance even when the numerical aperture NA of the projection optical system is large, by using, in combination, the zonal illumination method and the polarized illumination method in which the light is linearly polarized in the tangential direction of the circle having the center of the optical axis, as disclosed in Japanese Patent Application Laid-open No. 6-53120 as well.
  • the depth of focus can be increased by about 100 nm.
  • the substrate P which is usable in the respective embodiments described above, is not limited to the semiconductor wafer for producing the semiconductor device.
  • Substrates applicable include, for example, the glass substrate for the display device, the ceramic wafer for the thin film magnetic head, and the master plate (synthetic silica glass, silicon wafer) for the mask or the reticle to be used for the exposure apparatus.
  • the light-transmissive type mask reticle
  • the predetermined shielding pattern or the phase pattern or the dimming pattern
  • the reticle in place of the reticle, it is also allowable to use an electronic mask for forming a transmissive pattern, a reflective pattern, or a light emission pattern on the basis of the electronic data of the pattern to be subjected to the exposure, as disclosed, for example, in U.S. Pat. No. 6,778,257.
  • the present invention is also applicable to an exposure apparatus (lithography system) in which a line-and-space pattern is formed on a wafer W by forming interference fringes on the wafer W, as disclosed in the pamphlet of International Publication No. 2001/035168.
  • the present invention is also applicable to the scanning type exposure apparatus (scanning stepper) based on the step-and-scan system for performing the scanning exposure for the pattern of the mask M by synchronously moving the mask M and the substrate P as well as the projection exposure apparatus (stepper) based on the step-and-repeat system for performing the full field exposure with the pattern of the mask M in a state in which the mask M and the substrate P are allowed to stand still, while successively step-moving the substrate P.
  • scanning stepper scanning stepper
  • stepper the projection exposure apparatus
  • the present invention is also applicable to the exposure apparatus of the system in which the substrate P is subjected to the full field exposure by using a projection optical system (for example, a dioptric type projection optical system including no catoptric element with a reduction magnification of 1 ⁇ 8) with a reduction image of a first pattern in a state in which the first pattern and the substrate P are allowed to substantially stand still.
  • a projection optical system for example, a dioptric type projection optical system including no catoptric element with a reduction magnification of 1 ⁇ 8
  • the present invention is also applicable to the full field exposure apparatus based on the stitch system in which, subsequent to the exposure operation for the first pattern as described above, the substrate P is subjected to the full field exposure while partially overlaying a reduction image of a second pattern on the first pattern by using the projection optical system in a state in which the second pattern and the substrate P are allowed to substantially stand still thereafter.
  • the exposure apparatus based on the stitch system the present invention is also applicable to the exposure apparatus based on the step-and-stitch system in which at least two patterns are partially overlaid and transferred on the substrate P, and the substrate P is successively moved.
  • the present invention is also applicable to an exposure apparatus provided with a measuring stage which includes members and sensors for the measurement separately from the stage which holds the substrate P.
  • the exposure apparatus provided with the measuring stage is described, for example, in European Patent Publication No. 1,041,357, contents of which are incorporated herein by reference within a range of permission of the domestic laws and ordinances of the state designated or selected in this international application.
  • the present invention is also applicable to the twin-stage type exposure apparatus.
  • the structure and the exposure operation of the twin-stage type exposure apparatus are disclosed, for example, in Japanese Patent Application Laid-open Nos. 10-163099 and 10-214783 (corresponding to U.S. Pat. Nos. 6,341,007, 6,400,441, 6,549,269, and 6,590,634), Published Japanese Translation of PCT International Publication for Patent Application No. 2000-505958 (corresponding to U.S. Pat. No. 5,969,441), and U.S. Pat. No. 6,208,407, contents of which are incorporated herein by reference within a range of permission of the domestic laws and ordinances of the state designated or selected in this international application.
  • the exposure apparatus in which the space between the projection optical system PL and the substrate P is locally filled with the liquid, is adopted.
  • the present invention is also applicable to the liquid immersion exposure apparatus in which the entire surface of the substrate as the exposure objective is covered with the liquid.
  • the structure and the exposure operation of the liquid immersion exposure apparatus in which the entire surface of the substrate as the exposure objective is covered with the liquid are described in detail, for example, in Japanese Patent Application Laid-open Nos. 6-124873 and 10-303114 and U.S. Pat. No. 5,825,043, contents of which are incorporated herein by reference within a range of permission of the domestic laws and ordinances of the state designated or selected in this international application.
  • the present invention is not limited to the exposure apparatus for the semiconductor device production for exposing the substrate P with the semiconductor device pattern.
  • the present invention is also widely applicable, for example, to the exposure apparatus for producing the liquid crystal display device or for producing the display as well as the exposure apparatus for producing, for example, the thin film magnetic head, the image pickup device (CCD), the reticle, or the mask.
  • the linear motor When the linear motor is used for the substrate stage PST and/or the mask stage MST, it is allowable to use any one of those of the air floating type based on the use of the air bearing and those of the magnetic floating type based on the use of the Lorentz's force or the reactance force.
  • Each of the stages PST, MST may be either of the type in which the movement is effected along the guide or of the guideless type in which no guide is provided.
  • An example of the use of the linear motor for the stage is disclosed in U.S. Pat. Nos. 5,623,853 and 5,528,118, contents of which are incorporated herein by reference respectively within a range of permission of the domestic laws and ordinances of the state designated or selected in this international application.
  • the driving mechanism for each of the stages PST, MST it is also allowable to use a plane motor in which a magnet unit provided with two-dimensionally arranged magnets and an armature unit provided with two-dimensionally arranged coils are opposed to one another, and each of the stages PST, MST is driven by the electromagnetic force.
  • any one of the magnet unit and the armature unit is connected to the stage PST, MST, and the other of the magnet unit and the armature unit is provided on the side of the movable surface of the stage PST, MST.
  • the reaction force which is generated in accordance with the movement of the substrate stage PST, may be mechanically released to the floor (ground) by using a frame member so that the reaction force is not transmitted to the projection optical system PL.
  • the method for handling the reaction force is disclosed in detail, for example, in U.S. Pat. No. 5,528,118 (Japanese Patent Application Laid-open No. 8-166475), contents of which are incorporated herein by reference within a range of permission of the domestic laws and ordinances of the state designated or selected in this international application.
  • the reaction force which is generated in accordance with the movement of the mask stage MST, may be mechanically released to the floor (ground) by using a frame member so that the reaction force is not transmitted to the projection optical system PL.
  • the method for handling the reaction force is disclosed in detail, for example, in U.S. Pat. No. 5,874,820 (Japanese Patent Application Laid-open No. 8-330224), contents of which are incorporated herein by reference within a range of permission of the domestic laws and ordinances of the state designated or selected in this international application.
  • the exposure apparatus EX is produced by assembling the various subsystems including the respective constitutive elements as defined in claims so that the predetermined mechanical accuracy, the electric accuracy, and the optical accuracy are maintained.
  • those performed before and after the assembling include the adjustment for achieving the optical accuracy for the various optical systems, the adjustment for achieving the mechanical accuracy for the various mechanical systems, and the adjustment for achieving the electric accuracy for the various electric systems.
  • the steps of assembling the various subsystems into the exposure apparatus include, for example, the mechanical connection, the wiring connection of the electric circuits, and the piping connection of the air pressure circuits in correlation with the various subsystems.
  • the steps of assembling the respective individual subsystems are performed before performing the steps of assembling the various subsystems into the exposure apparatus.
  • the overall adjustment is performed to secure the various accuracies as the entire exposure apparatus. It is desirable that the exposure apparatus is produced in a clean room in which, for example, the temperature and the cleanness are managed.
  • the microdevice such as the semiconductor device is produced by performing, for example, a step 201 of designing the function and the performance of the microdevice, a step 202 of manufacturing a mask (reticle) based on the designing step, a step 203 of producing a substrate as a base material for the device, an exposure process step 204 of exposing the substrate with a pattern of the mask by using the exposure apparatus EX of the embodiment described above, a step 205 of assembling the device (including a dicing step, a bonding step, and a packaging step), and an inspection step 206 .
  • a step 201 of designing the function and the performance of the microdevice a step 202 of manufacturing a mask (reticle) based on the designing step
  • a step 203 of producing a substrate as a base material for the device an exposure process step 204 of exposing the substrate with a pattern of the mask by using the exposure apparatus EX of the embodiment described above
  • a step 205 of assembling the device including a dicing step,
  • the present invention it is possible to avoid the deterioration of the exposure accuracy and the measurement accuracy which would be otherwise caused by the pollution of the element (optical element). Therefore, the exposure process and the measurement process can be performed accurately. Further, according to the present invention, it is possible to realize the compact size of the apparatus itself, because the liquid immersion area can be made small.

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