US20060066702A1 - Ink-jet application method and display device producing method - Google Patents

Ink-jet application method and display device producing method Download PDF

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Publication number
US20060066702A1
US20060066702A1 US11/233,129 US23312905A US2006066702A1 US 20060066702 A1 US20060066702 A1 US 20060066702A1 US 23312905 A US23312905 A US 23312905A US 2006066702 A1 US2006066702 A1 US 2006066702A1
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Prior art keywords
ink
substrate
jet
application solution
drying
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Abandoned
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US11/233,129
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English (en)
Inventor
Naoaki Sakurai
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Toshiba Corp
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Toshiba Corp
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Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAKURAI, NAOAKI
Publication of US20060066702A1 publication Critical patent/US20060066702A1/en
Priority to US12/882,889 priority Critical patent/US8419178B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present invention relates to an ink-jet application method employed in a process for producing a display, a biochip, etc. and a display device producing method to which the ink-jet application method is employed. More specifically, the present invention relates to an ink-jet application method employed in a process for applying an application solution on a substrate to be incorporated into a product such as a semiconductor device, a liquid crystal display panel, an organic EL (electroluminescence) display panel, a field emission display panel, etc. and a display device producing method to which the ink-jet application method is employed.
  • a product such as a semiconductor device, a liquid crystal display panel, an organic EL (electroluminescence) display panel, a field emission display panel, etc.
  • a film e.g. functional layer
  • a substrate to be incorporated into a product such as a semiconductor device, a liquid crystal display panel, an organic EL (electroluminescence) display panel, a field emission display panel, etc. by spraying drops of an application solution containing a water solution, an inorganic solvent or an organic solvent from a ink-jet nozzle and then applying the application solution on the substrate.
  • This ink-jet application method is mainly employed in a process for forming the film (e.g. process for forming a luminous layer or a color filter layer of a display). The process requires a fine patterning.
  • a conventional ink-jet application method is disclosed in Japanese Unexamined Patent Publication No. 2003-266003.
  • the following preprocessing is carried out: (1) an ink-attracting process is carried out in a region where the application solution is to be applied; (2) an ink-shedding process is carried out in a region where the application solution is to be not applied; (3) a bank (structural barrier) is formed around a region where the application solution is to be applied.
  • the bank is in heavy usage at a time of forming a thick film.
  • a film or a patterning is formed on a block surrounded by the bank, after one or a plurality of drops of an application solution is sprayed from an ink-jet nozzle and applied on the block, a solid content (film) of the application solution is generated on the block by drying the application solution with a hot plate, an air-spray, a vacuum processing, etc.
  • a volume of the application solution is restricted to prevent the application solution from escaping from the block surrounded by the bank. Therefore, a thickness of the solid content of the application solution is far smaller than a height of the bank.
  • solute the solid content
  • the concentration cannot be increased without restriction because an application solution property is adjusted to surface tension and flow resistance which allow the application solution to be easily sprayed from the ink-jet nozzle.
  • the height of the bank cannot be increased without restriction in view of a structure of the device into which the substrate is incorporated because a film and a layer are usually formed on the bank in a post-process.
  • An object of the present invention is to provide an ink-jet application method that is capable of easily forming a film having a desired thickness without generating an uneven application at a time of applying an application solution on a substrate by using an ink-jet, and a display device producing method to which the ink-jet application method is employed.
  • the present invention provides an ink-jet application method comprising steps of: spraying and applying drops of an application solution on a substrate; and drying the applied application solution to generate a solid content contained in the application solution, wherein the solid content having a desired thickness is formed in a desired region of the substrate by repeating the applying step and the drying step more than once.
  • the thickness of the solid content increases in comparison with the conventional ink-jet application method. Also, in a case where the solid content having a desired thickness is formed, since a volume of ink to be applied in each applying process can be reduced in comparison with the conventional ink-jet application method, a film is easily formed.
  • the present invention provides an ink-jet application method comprising steps of: spraying and applying drops of an application solution in a block surrounded by a bank formed on a substrate; and drying the applied application solution to generate a solid content contained in the application solution, wherein the solid content having a desired thickness is formed in the block by repeating the applying step and the drying step more than once.
  • the thickness of the solid content increases in comparison with the conventional ink-jet application method. Also, in a case where the solid content having a desired thickness is formed, since a volume of ink to be applied in each applying process can be reduced in comparison with the conventional ink-jet application method, a film is easily formed.
  • the present invention provides a display device producing method comprising steps of: spraying and applying drops of an application solution on a substrate; and drying the applied application solution to generate a light shield film, wherein the light shield film having a desired thickness is formed in a desired region of the substrate by repeating the applying step and the drying step more than once.
  • the thickness of the light shield film increases in comparison with the conventional display device producing method. Also, in a case where the light shield film having a desired thickness is formed, since a volume of ink to be applied in each applying process can be reduced in comparison with the conventional display device producing method, the light shield film is easily formed.
  • the present invention provides a display device producing method comprising steps of: spraying and applying drops of an application solution in a block surrounded by a bank formed on a substrate; and drying the applied application solution to generate a light shield film, wherein the light shield film having a desired thickness is formed in the block by repeating the applying step and the drying step more than once.
  • the thickness of the light shield film increases in comparison with the conventional display device producing method. Also, in a case where the light shield film having a desired thickness is formed, since a volume of ink to be applied in each applying process can be reduced in comparison with the conventional display device producing method, the light shield film is easily formed.
  • FIG. 1 is a perspective view of an ink-jet application device according to a first embodiment of the present invention.
  • FIG. 2 is an enlarged cross-sectional view in the vicinity of a substrate in a state of applying an application solution on the substrate by using the ink-jet application device according to the first embodiment of the present invention.
  • FIG. 3 is a flowchart of an ink-jet application method by using the ink-jet application device according to the first embodiment of the present invention.
  • FIG. 4 is a flowchart of a display device producing method of the present invention.
  • FIG. 5 is a perspective view of an ink-jet application device according to a second embodiment of the present invention.
  • FIG. 6 is a flowchart of an ink-jet application method by using the ink-jet application device according to the second embodiment of the present invention.
  • an X-axis, a Y-axis and a Z-axis are defined as a longitudinal direction, a width direction and a height direction of an ink-jet application device, respectively.
  • the X-axis, the Y-axis and the Z-axis are orthogonal to one another.
  • an ink-jet application device 1 comprises a mounting 11 , a Y-axis table 12 , an X-axis table 13 , a stage 14 , a supporting body 15 , a lifting member 16 , a supporting tool 17 , an ink-jet head 18 and an air-knife unit 20 .
  • the Y-axis table 12 is fixed on the upper surface of the mounting 11 .
  • the X-axis table 13 is placed on an upper surface of the Y-axis table 12 .
  • the Y-axis table 12 moves the X-axis table 13 in the Y-axis direction on the basis of an order from a controller (not shown).
  • the stage 14 is placed on an upper surface of the X-axis table 13 .
  • the X-axis table 13 moves the stage 14 in the X-axis direction on the basis of an order from the controller.
  • a substrate S is placed on an upper surface of the stage 14 .
  • a plurality of banks 2 are arranged on a surface of the substrate S in a standing manner.
  • the banks 2 are made of a polyimide and have upper surfaces on which an ink-shedding process is carried out. It is noted that a light shielding layer may be formed in a part of the banks 2 or all banks 2 in order to employ the banks 2 as a black matrix of a color filter.
  • the supporting body 15 is substantially inverted U-shaped and arranged on the upper surface of the mounting 11 in a standing manner so as to stride over the Y-axis table 12 , the X-axis table 13 , the stage 14 and the substrate S.
  • the lifting member 16 is movably mounted on a side surface (+Y side) of an upper portion of the supporting body 15 .
  • the supporting tool 17 is substantially L-shaped and mounted on a side surface (+Y side) of the lifting member 16 .
  • the ink-jet head 18 is rotatably mounted on a lower portion of the supporting tool 17 and extends down the lower portion.
  • the ink-jet head 18 has a rotational axis which is in parallel to the Z-axis. An atmosphere suited to an ink application is maintained in the vicinity of the ink-jet head 18 .
  • the air-knife unit 20 is a drying means and comprises a discharge air-knife nozzle 21 , a suction air-knife nozzle 22 , a discharge pipe 23 and a suction pipe 24 .
  • the air-knife unit 20 is located away from the ink-jet head 18 .
  • the discharge air-knife nozzle 21 is attached to a supporting unit (not shown) mounted on the mounting 11 .
  • the discharge air-knife nozzle 21 can move in a plane which is substantially in parallel to the upper surface of the mounting 11 .
  • the suction air-knife nozzle 22 is attached to the supporting unit mounted on the mounting 11 .
  • the suction air-knife nozzle 22 can move in a plane which is substantially in parallel to the upper surface of the mounting 11 .
  • a nozzle orifice of the discharge air-knife nozzle 21 is located adjacent to a nozzle orifice of the suction air-knife nozzle 22 .
  • the discharge pipe 23 has one end connected to a blower (not shown) and the other end connected to the discharge air-knife nozzle 21 .
  • the suction pipe 24 has one end connected to a pump (not shown) and the other end connected to the suction air-knife nozzle 22 .
  • the substrate S is placed on the upper surf ace of the stage 14 (step S 1 ), and is located below the ink-jet head 18 by moving the Y-axis table 12 and the X-axis table 13 on the basis of an order from the controller (step S 2 ).
  • the ink-jet head 18 applies ink on a block surrounded by the bank 2 formed on the surface of the substrate S (step S 3 ).
  • the substrate S is located below the air-knife unit 20 by moving the Y-axis table 12 and the X-axis table 13 on the basis of an order from the controller (step S 4 ).
  • the substrate S is located below the ink-jet head 18 again by moving the Y-axis table 12 and the X-axis table 13 on the basis of an order from the controller (step S 6 ).
  • the controller determines whether or not ink is applied on the block up to the set number of times (step S 7 ). If ink is applied on the block up to the set number of times, another block adjacent to the block is located below the ink-jet head 18 by moving the Y-axis table 12 and the X-axis table 13 , or movement of the Y-axis table 12 and the X-axis table 13 is stopped (step S 8 ). If ink is not applied on the block up to the set number of times, the flow returns to the step S 3 . In the second or later ink application process, the ink-jet head 18 applies ink on the block from above the solid content 3 a.
  • a film (several layers of the solid content) 3 having a desired thickness is obtained by repeating the applying process and the drying process up to the set number of times (more than once) in the block. It is noted that the film 3 may be a color film or a black matrix film when the substrate 3 is a color filter substrate of a display device.
  • the ink-jet application method has the following advantages.
  • the applying process and the drying process are repeated up to the set number of times (more than once), after forming the solid content (solute) 3 a contained in the ink in concentrations of about 20-30% by volatilizing and evaporating a solvent contained in the ink in concentrations of about 70-80% in the first applying process and drying process. Therefore, the thickness of the film 3 increases in comparison with the conventional ink-jet application method for carrying out an applying process and drying process only once.
  • the ink is prevented from escaping from the bank 2 .
  • the film can be stably formed because a desired portion of the ink is dried by using the Y-axis table 12 , the X-axis table 13 , the discharge air-knife nozzle 21 and the suction air-knife nozzle 22 .
  • this ink-jet application method is advantage.
  • a film thickness, a film shape, a solute concentration and a bank height may be arbitrarily changed according to the number of repeating the applying process and the drying process.
  • the drying is not limited to the air blasting by the air-knife unit. It may use a heating by a hot plate, a vacuuming by a decompressor, etc.
  • a color filter and a black matrix are formed on one glass substrate (step S 1 ).
  • a color filter substrate is produced by forming a light shielding film in a non-display region located around a display region, in which luminescent spots (sub-pixels) of the color filter layer are formed, or a region between the luminescent spots to shield light in the non-display region or the region between the luminescent spots (step S 2 ).
  • a thin-film transistor (TFT) is regularly arranged on the other glass substrate to produce a TFT array substrate (step S 3 ).
  • a panel substrate is produced by pasting the color filter substrate and the TFT array substrate together and then injecting a liquid crystal material into a clearance between the color filter substrate and the TFT array substrate (step S 4 ). It is noted that the color filter and the black matrix may be on the other glass substrate at the time of producing the TFT array substrate as well as the steps S 2 and S 3 .
  • this ink-jet application method is suitable for forming the light shielding film.
  • the ink-jet application method may be employed to not only forming the light shield film but also applying a color resist in a process for producing the color filter.
  • a black resist film black matrix
  • a plurality of banks are formed by selectively removing one part of the black resist film on the substrate by means of a PEP (photo-engraving-process) method.
  • a block surrounded by one bank has 3 ⁇ m in height and 150 ⁇ m angle.
  • a green color resist having solute concentrations of 20% is applied on the block by means of the conventional ink-jet application method. More specifically, six drops (total volumes 120 pl) of the color resist having volumes of 20 pl per one drop is applied on the block.
  • the color resist semi-circularly rises by surface tension above an upper portion of the bank. When such operation is carried out in 10000 blocks on the substrate, the color resist escapes from 32 blocks. Then, a solid content of the color resist has 1.5 ⁇ m in thickness by heating the substrate with a hot plate in 150° C. and then drying the heated color resist.
  • the color resist when the color resist is applied on 10000 blocks on the substrate after a CF4/O2 plasma process (ink-shedding process) is carried out on the upper portions of the banks, the color resist escapes form 4 blocks.
  • a green color resist having solute concentrations of 20% is applied on the block by means of the ink-jet application method according to the present invention. More specifically, three drops (total volumes 60 pl) of the color resist having volumes of 20 pl per one drop is applied on the block in the first applying process. Then, after the substrate is heated with a hot plate in 150° C. and then the heated color resist is dried in the drying process, three drops of the color resist is applied on the blocks from above a solid content of the color resist in the second applying process. When such operation is carried out in 10000 blocks on the substrate, there is not a block from which the color resist escapes without carrying out the ink-shedding process on the upper portions of the banks.
  • an ink-jet application device 1 ′ comprises a mounting 11 , a Y-axis table 12 , an X-axis table 13 , a stage 14 , a supporting body 15 , a lifting member 16 , a supporting tool 17 , an ink-jet head 18 , an air-knife unit 20 ′ and shield plates 33 , 34 .
  • the Y-axis table 12 is fixed on an upper surface of the mounting 11 .
  • the X-axis table 13 is placed on an upper surface of the Y-axis table 12 .
  • the Y-axis table 12 moves the X-axis table 13 in the Y-axis direction on the basis of an order from a controller (not shown).
  • the stage 14 is placed on an upper surface of the X-axis table 13 .
  • the X-axis table 13 moves the stage 14 in the X-axis direction on the basis of an order from the controller.
  • a substrate S is placed on an upper surface of the stage 14 .
  • a plurality of banks 2 are arranged on a surface of the substrate S in a standing manner.
  • the banks 2 are made of a polyimide and have upper surfaces on which an ink-shedding process is carried out. It is noted that a light shielding layer may be formed in a part of the banks 2 or all banks 2 in order to employ the banks 2 as a black matrix of a color filter.
  • the supporting body 15 is substantially inverted U-shaped and arranged on the upper surface of the mounting 11 in a standing manner so as to stride over the Y-axis table 12 , the X-axis table 13 , the stage 14 and the substrate S.
  • the lifting member 16 is movably mounted on a side surface (+Y side) of an upper portion of the supporting body 15 .
  • the supporting tool 17 is substantially L-shaped and mounted on a side surface (+Y side) of the lifting member 16 .
  • the ink-jet head 18 is rotatably mounted on a lower portion of the supporting tool 17 and extends down the lower portion.
  • the ink-jet head 18 has a rotational axis which is in parallel to the Z-axis. An atmosphere suited to an ink application is maintained in the vicinity of the ink-jet head 18 .
  • the air-knife unit 20 ′ is a drying means and comprises pipes 23 , 24 and air-knife nozzles 31 , 32 .
  • the air-knife unit 20 ′ is located in the vicinity of the ink-jet head 18 .
  • the air-knife nozzle 31 is attached to a supporting unit (not shown) mounted on the mounting 11 or the supporting body 15 so as to locate in a +X side of the ink-jet head 18 .
  • the air-knife nozzle 31 can move in a plane which is substantially in parallel to the upper surface of the mounting 11 .
  • a nozzle orifice of the air-knife nozzle 31 is formed in a tapered shape and is away from the ink-jet head 18 as moving downward (that is the nozzle orifice extends in the +X direction as moving in the ⁇ Z direction).
  • the air-knife nozzle 32 is attached to the supporting unit mounted on the mounting 11 or the supporting body 15 so as to locate in a ⁇ X side of the ink-jet head 18 .
  • the air-knife nozzle 32 can move in a plane which is substantially in parallel to the upper surface of the mounting 11 .
  • a nozzle orifice of the air-knife nozzle 32 is formed in a tapered shape and is away from the ink-jet head 18 as moving downward (that is the nozzle orifice extends in the ⁇ X direction as moving in the ⁇ Z direction).
  • the pipe 23 has one end connected to a blower (not shown) and the other end connected to the air-knife nozzle 31 .
  • the pipe 24 has one end connected to the blower and the other end connected to the air-knife nozzle 32 .
  • air is supplied to the air-knife nozzles 31 , 32 through the pipes 23 , 24 , the air is discharged from the nozzle orifices of the air-knife nozzles 31 , 32 to generate airflow above the substrate S.
  • the generated airflow dries ink applied on the substrate S. It is noted that air may be suctioned from the nozzle orifices of the air-knife nozzles 31 , 32 by using an air displacement pump instead of the blower to generate airflow above the substrate S.
  • the shield plate 33 is placed between the ink-jet head 18 and the air-knife nozzle 31 .
  • the shield plate 34 is placed between the ink-jet head 18 and the air-knife nozzle 32 .
  • the shield plates 33 , 34 are supported by a moving unit (not shown) mounted on the mounting 11 or the supporting body 15 so as to move independent of the air-knife nozzles.
  • the shield plates 33 , 34 prevents ink applied on the substrate S from drying until the ink is located in the vicinity of the nozzle orifice of the air-knife nozzle 31 or 32 .
  • the substrate S is placed on the upper surface of the stage 14 (step S 11 ), and is located below the ink-jet head 18 by moving the Y-axis table 12 and the X-axis table 13 on the basis of an order from the controller (step S 12 ).
  • the ink-jet head 18 applies ink on a block surrounded by the bank 2 formed on the surface of the substrate S (step S 13 ).
  • the substrate S is located below the air-knife unit 20 ′ (air-knife nozzle 31 or 32 ) by moving the X-axis table 13 on the basis of an order from the controller (step S 14 ).
  • airflow is locally generated above the block by discharging air from the nozzle orifices of the air-knife nozzles 31 , 32 (or suctioning air from the nozzle orifices of the air-knife nozzles 31 , 32 ).
  • the applied ink is dried by the airflow and then a solid content 3 a of the ink is formed on the block (step S 15 ).
  • the substrate S is located below the ink-jet head 18 again by moving the X-axis table 13 on the basis of an order from the controller (step S 16 ).
  • the controller determines whether or not ink is applied on the block up to the set number of times (step S 17 ). If ink is applied on the block up to the set number of times, another block adjacent to the block is located below the ink-jet head 18 by moving the Y-axis table 12 and the X-axis table 13 , or movement of the Y-axis table 12 and the X-axis table 13 is stopped (step S 18 ). If ink is not applied on the block up to the set number of times, the flow returns to the step S 13 . In the second or later ink application process, the ink-jet head 18 applies ink on the block from above the solid content 3 a.
  • a film (several layers of the solid content) 3 having a desired thickness is obtained by repeating the applying process and the drying process up to the set number of times (more than once) in the block.
  • the ink-jet application method has the following advantages in addition to the advantages of the ink-jet application method using the ink-jet application device 1 .
  • the air-knife nozzles 31 , 32 are located in both sides ( ⁇ X sides) of the ink-jet head 18 , a time when the substrate S is moved by using the Y-axis table 12 and the X-axis table 13 can be shortened. This shortens a time required in an ink-jet application method.
  • the shield plates 33 , 34 are located between the ink-jet head 18 and the air-knife nozzles 31 , 32 , an atmosphere suited to apply ink on the substrate S is maintained in the vicinity of the ink-jet head 18 . This prevents ink applied on the substrate S from drying beyond necessity.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
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  • Electroluminescent Light Sources (AREA)
US11/233,129 2004-09-24 2005-09-23 Ink-jet application method and display device producing method Abandoned US20060066702A1 (en)

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JP2004278327A JP2006088070A (ja) 2004-09-24 2004-09-24 インクジェット塗布方法及び表示デバイスの製造方法

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Cited By (2)

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US20090203285A1 (en) * 2008-02-07 2009-08-13 Seiko Epson Corporation Method for producing light-emitting device
US20110317429A1 (en) * 2009-03-03 2011-12-29 Satoshi Aiba Method for producing light-emitting display device, light-emitting display device and light-emitting display

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