US20040235683A1 - Mold release composition and process therewith - Google Patents

Mold release composition and process therewith Download PDF

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Publication number
US20040235683A1
US20040235683A1 US10/444,801 US44480103A US2004235683A1 US 20040235683 A1 US20040235683 A1 US 20040235683A1 US 44480103 A US44480103 A US 44480103A US 2004235683 A1 US2004235683 A1 US 2004235683A1
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United States
Prior art keywords
solvent
combinations
composition according
gum
fluid
Prior art date
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Abandoned
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US10/444,801
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English (en)
Inventor
Robert Moffett
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EIDP Inc
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Individual
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Filing date
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Priority to US10/444,801 priority Critical patent/US20040235683A1/en
Assigned to E.I. DU PONT DE NEMOURS AND COMPANY reassignment E.I. DU PONT DE NEMOURS AND COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MOFFETT, ROBERT HARVEY
Priority to EP04776012A priority patent/EP1626849B1/en
Priority to JP2006533107A priority patent/JP4745241B2/ja
Priority to CA2523691A priority patent/CA2523691C/en
Priority to AU2004242601A priority patent/AU2004242601B2/en
Priority to CNB2004800142257A priority patent/CN100339204C/zh
Priority to BRPI0411147-8A priority patent/BRPI0411147A/pt
Priority to DE602004004267T priority patent/DE602004004267T2/de
Priority to MXPA05012539A priority patent/MXPA05012539A/es
Priority to KR1020057022294A priority patent/KR101125400B1/ko
Priority to PCT/US2004/015266 priority patent/WO2004106026A1/en
Publication of US20040235683A1 publication Critical patent/US20040235683A1/en
Priority to HK06111295A priority patent/HK1090603A1/xx
Abandoned legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/60—Releasing, lubricating or separating agents
    • B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers
    • B29C33/64—Silicone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds

Definitions

  • This invention relates to a composition that can be used as mold release agent and to a process for applying a thin, continuous film coating of the release agent on a mold.
  • mold release agent generally a polymer or a combination of polymers
  • silicone resins which are often used as release agents, often do not coat surfaces well when dispersed in a typical hydrocarbon solvent. The silicone resins, bead or puddle on the surface to which they have been applied, thus preventing a thin, continuous film from being achieved.
  • a composition comprising a solvent; a silicone resin, gum, or fluid; and optionally a catalyst, a co-solvent, or both in which the solvent is a volatile siloxane.
  • Also provided is a process for applying a thin, continuous film coating on or onto a mold which comprises combining a solvent, a silicone resin or silicone gum or silicone fluid, and optionally a catalyst, a co-solvent, or both to produce a mold release composition; applying the mold release composition on or onto a mold, and optionally curing the composition in which the solvent is a volatile siloxane.
  • the term “mold” means one or more shape-determining surfaces. Any volatile siloxane can be used as the solvent of the invention's composition.
  • volatile siloxane refers to a rapidly evaporating siloxane under the temperature and pressure of use. Typically, it can have an evaporation rate of >0.01 relative to n-butyl acetate which has an assigned value of 1.
  • a suitable solvent can have the formula of R(R 2 SiO) x SiR 3 or (R 2 SiO) y where each R can be the same or different and is preferably, an alkyl group, alkoxy group, a phenyl group, a phenoxy group, or combinations of two or more thereof; having 1 to about 10, preferably 1 to about 8 carbon atoms per group.
  • R can also be a halogen.
  • the most preferred R is a methyl group and can be substituted with a halogen, an amine, or other functional group.
  • Subscript x can be a number from 1 to about 20, preferably 1 to 10.
  • Subscript y can be a number from 3 to about 20, preferably 3 to about 10.
  • a preferred solvent has a molecular weight in the range between about 50 and about 1,000 and a boiling point less than about 300° C., preferably lower than 250° C., more preferably lower than 200° C., and most preferably lower than 150° C.
  • Suitable methyl siloxanes include, but are not limited to, hexamethyldisiloxane, hexamethylcyclotrisiloxane, 2,5-dichloro-1,1,3,3,5,5,-hexamethyltrisiloxane, 1,3-dimethyltetramethoxydisiloxane, 1,1,1,3,5,5,5,-heptamethyltrisiloxane, 3-(heptafluoropropyl)trimethysiloxane, octamethyltrisiloxane, octamethyltetrasiloxane, octamethylcyclotetrasiloxane, decamethyltetrasiloxane, decamethylcyclopentasiloxane, dodecamethylpentasiloxane, and dodecamethylcyclohexasiloxane, and combinations of two or more thereof.
  • Any silicone resin, gum, or fluid that is compatible with a volatile siloxane disclosed above can be used. It is generally a polyorganosiloxane.
  • methoxy-terminated polyakylsiloxanes and hydroxy-terminated polydimethylsiloxane can be used.
  • Suitable silicone resin, gum, or fluid can be a resin, gum or fluid.
  • suitable polyorganosiloxanes include polydimethylsiloxanes, polymethylhydrogensiloxanes, polysilsesquioxanes, polytrimethylsiloxanes, polydimethylcyclosiloxanes, and combinations of two or more thereof.
  • Each silicone resin can also contain function groups such as halide, amine, hydroxy, epoxy, carbinol, carboxylate, acetoxy, alkoxy, acrylate, and combinations of two or more thereof.
  • the molecular weight can be in the range of from about is between about 500 about 1,000,000.
  • a preferred silicone resin is polyorganosiloxane having terminal silicon-bonded hydroxyl groups, which is well known and is commercially available.
  • siloxanes and silicone resins, gums, or fluids are generally available commercially, for example, from Dow Corning Chemicals, Midland, Mich., and General Electric, Fairfield, Conn.
  • Any organic solvent preferably substantially free of water such as, for example, a hydrocarbon or halogenated hydrocarbon, that is inert towards other components of the composition, is compatible with the volatile siloxane and is volatile to evaporate rapidly when applied to the mold surface can be used as co-solvent.
  • a co-solvent can also reduce the viscosity of the composition and promote the release of a polymer from a mold.
  • a co-solvent has a normal boiling point below about 300° C., preferably below 200° C., and most preferably below 150° C., depending on the temperature of the mold release composition to be applied to a mold. The lower the temperature the mold release composition to be allied, the lower the boiling point solvent is preferred and vice versa.
  • suitable co-solvents include, but are not limited to, octane, decane, cyclohexane, toluene, xylene, methylene chloride, methylene dichloride, ethylene dichloride, carbon tetrachloride, chloroform, perchloroethylene, acetone, methylethyl ketone, ethyl acetate, tetrahydrofuran, dioxane, white spirit, mineral spirits, naphtha, and combinations of two or more thereof.
  • the mold release composition can also comprise additional silicone compound such as modified fumed silica, surfactants, fluoropolymers such as polytetrafluoroethylene, waxes, fatty acids such as stearic acid, fatty acid salts such as metal stearates, finely dispersed solids such as talc, emulsifiers, biocides, corrosion inhibitors.
  • additional silicone compound such as modified fumed silica, surfactants, fluoropolymers such as polytetrafluoroethylene, waxes, fatty acids such as stearic acid, fatty acid salts such as metal stearates, finely dispersed solids such as talc, emulsifiers, biocides, corrosion inhibitors.
  • each component disclosed above can be present in the composition in an effective amount sufficient to effect the suitable release of a molded article.
  • the solvent can be present in the composition in the range of from about 10 to about 99%; a silicone resin can be present in the composition in the range of from about 0.1 to about 90%.
  • a co-solvent if used, can be present in the composition in such range that the sum of solvent and co-solvent is about 10 to about 99%, provided that the solvent is present at least about 10%, preferably at least 20%.
  • Other components, if present, can be in the range of from about 0.01 to about 10%.
  • Any catalyst that can catalyze or enhance the curing of a composition comprising a volatile siloxane, a silicone resin, and a solvent can be used herein.
  • a preferred catalyst is an organic titanium compound. Titanium tetrahydrocarbyloxides, also referred to as tetraalkyl titanates herein, are most preferred organic titanium compounds because they are readily available and effective. Examples of suitable titanium compounds include those expressed by the formula Ti(OR) 4 where each R is individually selected from an alkyl, cycloalkyl, alkaryl, hydrocarbyl radical containing from 1 to about 30, preferably 2 to about 18, and most preferably 2 to 12 carbon atoms per radical and each R can be the same or different.
  • Titanium tetrahydrocarbyloxides in which the hydrocarboxyl group contains from 2 to about 12 carbon atoms per radical which is a linear or branched alkyl radical are most preferred because they are relatively inexpensive, more readily available, and effective in curing the composition.
  • Suitable titanium compounds include, but are not limited to, titanium tetraethoxide, titanium tetrapropoxide, titanium tetraisopropoxide, titanium tetra-n-butoxide, titanium tetrahexoxide, titanium tetra 2-ethylhexoxide, titanium tetraoctoxide, and combinations of two or more thereof.
  • Suitable catalysts include a compound or element of VIII group of the periodic table of the elements such as platinum, palladium, iron, zinc, rhodium, and nickel as well as a tin or zirconium compound.
  • suitable catalysts include, but are not limited to, dibutyltin diacetate, dibutyl dilaurate, zinc acetate, zinc octoate, zirconium octoate, and combinations of two or more thereof.
  • dibutyltin diacetate can be used independently or in combination with a titanium compound.
  • TYZOR® TPT and TYZOR® TBT tetra isopropyl titanate and tetra n-butyl titanate, respectively
  • E. I. du Pont de Nemours and Company Wilmington, Del., U.S.A.
  • Each of the catalysts disclosed above can be used in the composition in the range of from about 0.01 to about 10 weight % relative to the silicone polymers.
  • composition can be produced by any means known to one skilled in the art such as, for example, mixing each component disclosed above. It is preferred that the catalyst be introduced after the silicone resin, solvent, and the optional co-solvent are combined.
  • a process for applying a thin, continuous film coating on or onto a mold which comprises (1) combining a solvent, a silicon resin or silicone gum or silicone fluid, and optionally a co-solvent, a catalyst, or both to produce a mold release composition, (2) applying the mold release composition on or onto a mold, and optionally (3) curing the release composition.
  • the mold release composition can be the same as the composition disclosed above.
  • Application of the mold release composition can be carried out by any means known to one skilled in the art such as, for example, spraying, brushing, wiping, dipping, and combinations of two or more thereof. Any surface of a shape-determining mold can be applied with the release composition.
  • Curing can be carried out by any means known to one skilled in the art such as curing at ambient temperature such as from about 25° C. to about 200° C. under a pressure that accommodates the temperature range such as, for example, atmospheric pressure for about one second to about 2 hours. Generally, curing is carried out at the temperature and pressure at which the molding is being carried out.
  • a molding material or a material to be molded can be introduced into or onto the mold by any means known to one skilled in the art such as, for example, pumping, extruding, blending, or other suitable means known to one skilled in the art. Thereafter, a molded article is produced, which can be removed or released from the mold by any means known to one skilled in the art. Because the means for making a molded article is well known in the art, the description of which is omitted herein for the interest of brevity.
  • the molding material can be any material that can be molded including, but not limited to, plastics, polymers, glass, ceramics, and metals.
  • polymers include a thermosetting resin or a thermoplastic resin. Specific examples include acrylonitrile-butadiene-styrene, acrylonitrile-chlorinated polyethylene-styrene, acrylic-styrene-acrylonitrile, polyacetal homopolymers and copolymers, acrylics, cellulosics, fluoropolymers, polyamides, polyacrylates, polybutylene, polycarbonates, polyesters, polyethylenes, ethylene acid copolymers, ethylene-ethyl acrylates, ethylene-methyl acrylates, polymethyl acrylate, polymethyl methacrylate, polybutyl methacrylate, ethylene-vinyl acetates, ethylene vinyl alcohol copolymers, ionomers, polymethylpentene, polyphenylene oxides, polypropylene,
  • This example demonstrates that thinner continuous silicone resin coatings can be produced when using a volatile methylsiloxane than when using petroleum ether.
  • a release agent composition comprising 80% solvent (either petroleum ether or octamethylcyclotetrasiloxane (volatile methyl)), 20% silicone resins and fluids, and about 0.2% of catalyst (based on total weight of solvent and resin and fluid; TYZOR® TBT and dibutlytin diacetate) were sprayed onto pre-weighed 1 inch by 3 inch (2.54 cm by 7.62 cm) glass microscope slides heated to 65° C. with quantity shown in the table below. After allowing the solvent sufficient time to evaporate in a hood, the release agent was cured for 2 minutes at 65° C. The slides were then re-weighed and visually examined under a microscope to estimate the coverage of the slide's surface with silicone resin. The results are shown in Table 1. TABLE 1 Coating Wt (mg) Petroleum Ether Methyl Siloxane 0.7 100% coverage 0.9 20% coverage 1.9 40% 2.8 65% 100% 3.1 70% 3.5 100% 8.4 95% 19.4 98% 38.2 100%
  • the coating was very irregular and bumpy on the slides coated using petroleum ether as the solvent.
  • the coating using methyl siloxane as the solvent was very smooth. Replacing the petroleum ether with mineral spirits aggravated the beading of the silicone resins on the glass surface.
  • This example serves to demonstrate how the use of various volatile methyl siloxane solvents promote the formation of smooth, continuous coatings of various silicone resins, fluids and functional fluids applied at elevated temperature.
  • Silicone resins, fluids and functional fluids were dispersed in various hydrocarbon solvents and volatile methyl siloxanes at a concentration of 5 wt % polymer solids and 95 wt % solvent.
  • the silicone polymers and solvent were sprayed, using a Preval aerosol sprayer, onto pre-weighed, 1′′ ⁇ 3′′ (2.54 cm ⁇ 7.62 cm) glass microscope slides heated to 65C. After the solvent evaporated, the slides were re-weighed to determine coating weight and visually examined for the smoothness and coverage of the coating, as shown in Table 2.
  • Results show the silicone polymers dispersed in VMS fluids produced a smooth, continuous film whereas the same silicone polymers dispersed in a hydrocarbon solvent produced rough, incomplete film when applied at ambient temperature.
  • This example serves to demonstrate how the use of a volatile methyl siloxane can promote the formation of a smooth, thin coating of a fully formulated silicone release agent.
  • a commercial release agent for plastics, adhesives and elastomeric products was purchased.
  • the manufacturer describes the product as having a 50% active material content comprising trimethylated silica and tetra(trimethylsiloxy) silane and utilizing a hydrocarbon solvent mixture composed of Stoddard solvent, xylene and ethylbenzene.
  • the manufacturer's brochure recommends diluting 10 parts of the release agent with 80 parts isopropanol and 10 parts toluene to improve surface wetting.
  • the release coating was diluted to 5 wt % polymer solids utilizing an 10/80/10 wt % mixture of release agent, isopropanol and toluene.
  • the release coating was then applied using a Preval aerosol sprayer, onto pre-weighed, 1′′ ⁇ 3′′ (2,54 cm ⁇ 7.62 cm) glass microscope slides heated to 65° C. After the solvent evaporated, the slides were re-weighed to determine coating weight and visually examined for the smoothness and coverage of the coating.
  • the release agent was diluted in octamethyltrisiloxane (OMTS), again to 5 weight % polymer solids and applied to a glass slide using the described manner.
  • OMTS octamethyltrisiloxane
  • This example serves to demonstrate how formation of a smooth, continuous coating improves the performance of a release agent.
  • a release coating utilizing a methyl silsesquioxane-dimethyl siloxane copolymer and a polydimethyl siloxane fluid were dispersed in a various solvents at a solids concentration of 5 weight %.
  • the coating was applied using a Preval aerosol sprayer to a pre-weighed 9′′ ⁇ 12′′ ⁇ 3′′ (22.86 cm ⁇ 30.48 cm ⁇ 7.62 cm) aluminum box mold heated to 65 C. After the solvent had evaporated, the mold was cooled to room temperature and re-weighed. The mold was then reheated and filled with toluene diisocyanate based polyurethane flexible foam resin.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
US10/444,801 2003-05-23 2003-05-23 Mold release composition and process therewith Abandoned US20040235683A1 (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
US10/444,801 US20040235683A1 (en) 2003-05-23 2003-05-23 Mold release composition and process therewith
PCT/US2004/015266 WO2004106026A1 (en) 2003-05-23 2004-05-14 Mold release composition and process therewith
BRPI0411147-8A BRPI0411147A (pt) 2003-05-23 2004-05-14 composição e processo
JP2006533107A JP4745241B2 (ja) 2003-05-23 2004-05-14 離型組成物およびその方法
CA2523691A CA2523691C (en) 2003-05-23 2004-05-14 Mold release composition and process therewith
AU2004242601A AU2004242601B2 (en) 2003-05-23 2004-05-14 Mold release composition and process therewith
CNB2004800142257A CN100339204C (zh) 2003-05-23 2004-05-14 脱模剂组合物及其使用方法
EP04776012A EP1626849B1 (en) 2003-05-23 2004-05-14 Mold release composition and process therewith
DE602004004267T DE602004004267T2 (de) 2003-05-23 2004-05-14 Formtrennmittelzusammensetzung und verfahren damit
MXPA05012539A MXPA05012539A (es) 2003-05-23 2004-05-14 Composicion desmoldante y proceso con la misma.
KR1020057022294A KR101125400B1 (ko) 2003-05-23 2004-05-14 이형 조성물 및 그의 사용 방법
HK06111295A HK1090603A1 (en) 2003-05-23 2006-10-13 Mold release composition and process therewith

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/444,801 US20040235683A1 (en) 2003-05-23 2003-05-23 Mold release composition and process therewith

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US20040235683A1 true US20040235683A1 (en) 2004-11-25

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US10/444,801 Abandoned US20040235683A1 (en) 2003-05-23 2003-05-23 Mold release composition and process therewith

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US (1) US20040235683A1 (ja)
EP (1) EP1626849B1 (ja)
JP (1) JP4745241B2 (ja)
KR (1) KR101125400B1 (ja)
CN (1) CN100339204C (ja)
AU (1) AU2004242601B2 (ja)
BR (1) BRPI0411147A (ja)
CA (1) CA2523691C (ja)
DE (1) DE602004004267T2 (ja)
HK (1) HK1090603A1 (ja)
MX (1) MXPA05012539A (ja)
WO (1) WO2004106026A1 (ja)

Cited By (19)

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US20060021384A1 (en) * 2004-07-27 2006-02-02 Manfred Schramm Coating material for a glass mold, method for coating a glass mold as well as a coated glass mold
US20060211820A1 (en) * 2005-03-18 2006-09-21 Jonn Jerry Y Liquid coating compositions
US20060247368A1 (en) * 2003-07-25 2006-11-02 Zheng Lu Low voc-solvent based mold release agent and curable mold release compositions based thereon
US20070141362A1 (en) * 2005-12-19 2007-06-21 Elkins Casey L Composition for coating substrate to prevent sticking
US20070160547A1 (en) * 2006-01-11 2007-07-12 Janet Duffy Method of applying a composition
US20080088051A1 (en) * 2006-10-16 2008-04-17 Robert Harvey Moffett Rotational molding paint-ready polyurethane
EP2197647A2 (en) * 2007-09-27 2010-06-23 Henkel Corporation Two-component high gloss semi-permanent water based release agent for polyester substrates
WO2014120607A1 (en) * 2013-01-30 2014-08-07 Dow Corning Corporation Composition for surface treatment, methods of preparing a surface-treated article and surface-treated article
WO2014131076A1 (en) * 2013-02-26 2014-09-04 Bennett Precision Tooling Nsw Pty Ltd A method of preparing a mould for injection molding
CN104893562A (zh) * 2015-05-25 2015-09-09 巨化集团技术中心 一种橡胶制品成型模具用不粘涂料及其制备方法
CN105216179A (zh) * 2015-09-06 2016-01-06 河南平高电气股份有限公司 一种环氧树脂浇注件用离型剂及其制备方法
US20160084398A1 (en) * 2014-09-19 2016-03-24 Webstone Company, Inc. Isolation valve with thermoplastic overmolding
CN106608008A (zh) * 2016-11-28 2017-05-03 西安空间无线电技术研究所 一种脱模剂及其制备方法和在环氧树脂灌封中的应用
US20220010168A1 (en) * 2018-11-23 2022-01-13 Basf Coatings Gmbh Self-releasing in-mold coating (imc) for coating substrates
EP3892688A4 (en) * 2018-12-07 2022-08-24 Dow Toray Co., Ltd. COMPOSITION OF CURED ORGANOPOLYSILOXANE FOR FORMING A FILM AND METHOD FOR PRODUCING A FILM OF CURED ORGANOPOLYSILOXANE PRODUCT
CN115812027A (zh) * 2020-05-14 2023-03-17 奎克化学公司 水溶性硅基脱模剂
US11624467B2 (en) 2020-12-09 2023-04-11 Nibco Inc. Fusion outlet isolation valve with thermoplastic overmolding
US12037481B2 (en) 2018-12-07 2024-07-16 Dow Toray Co., Ltd. Curable organopolysiloxane composition for forming films, and method for producing organopolysiloxane cured film
US12122935B2 (en) 2018-12-07 2024-10-22 Dow Toray Co., Ltd. Curable organopolysiloxane composition for forming film and production method for organopolysiloxane cured product film

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US7851535B2 (en) 2007-07-26 2010-12-14 Henkel Corporation Mold release agents employing polyvinyl alcohol
WO2011043386A1 (ja) * 2009-10-06 2011-04-14 ソニーケミカル＆インフォメーションデバイス株式会社 離型剤組成物、離型フィルム及びこれを用いた接着フィルム
CN101899779B (zh) * 2010-08-12 2013-04-24 浙江传化股份有限公司 一种100%有机硅涂层整理剂及其应用
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JP2014210861A (ja) * 2013-04-19 2014-11-13 株式会社きもと 離型性能回復液、離型性能回復方法及びフォトマスク
CN105799104B (zh) * 2014-12-31 2018-07-24 上海荣信塑料有限公司 一种食品包装用塑料制品脱模剂及其生产方法
CN104608298A (zh) * 2015-01-13 2015-05-13 上海应用技术学院 一种注塑工业用的干性脱模剂及其制备方法
CN104647660A (zh) * 2015-02-09 2015-05-27 上海应用技术学院 一种注塑工业用的干性脱模剂及其制备方法
CN104762057B (zh) * 2015-04-03 2017-03-15 肇庆皓明有机硅材料有限公司 一种有机硅电子封装材料及其制备方法
JP2017024271A (ja) * 2015-07-23 2017-02-02 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 ポリウレタンフォーム成形用離型剤組成物および軟質ポリウレタンフォームの製造方法
CN105111031B (zh) * 2015-09-22 2017-08-29 中国工程物理研究院化工材料研究所 大型炸药件的脱模方法
CN105295723B (zh) * 2015-11-27 2017-07-07 怀化学院 一种固化型涂层组合物及其应用
CN106985264A (zh) * 2017-03-30 2017-07-28 佛山市蓝海石英石材有限公司 一种石英石水性脱模剂及其制备方法
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CN100339204C (zh) 2007-09-26
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HK1090603A1 (en) 2006-12-29
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AU2004242601B2 (en) 2009-12-17
KR20060012644A (ko) 2006-02-08

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