HK1090603A1 - Mold release composition and process therewith - Google Patents

Mold release composition and process therewith

Info

Publication number
HK1090603A1
HK1090603A1 HK06111295A HK06111295A HK1090603A1 HK 1090603 A1 HK1090603 A1 HK 1090603A1 HK 06111295 A HK06111295 A HK 06111295A HK 06111295 A HK06111295 A HK 06111295A HK 1090603 A1 HK1090603 A1 HK 1090603A1
Authority
HK
Hong Kong
Prior art keywords
mold release
release composition
process therewith
therewith
composition
Prior art date
Application number
HK06111295A
Other languages
English (en)
Inventor
Moffett Robert Harvey
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of HK1090603A1 publication Critical patent/HK1090603A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/60—Releasing, lubricating or separating agents
    • B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers
    • B29C33/64—Silicone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
HK06111295A 2003-05-23 2006-10-13 Mold release composition and process therewith HK1090603A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/444,801 US20040235683A1 (en) 2003-05-23 2003-05-23 Mold release composition and process therewith
PCT/US2004/015266 WO2004106026A1 (en) 2003-05-23 2004-05-14 Mold release composition and process therewith

Publications (1)

Publication Number Publication Date
HK1090603A1 true HK1090603A1 (en) 2006-12-29

Family

ID=33450752

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06111295A HK1090603A1 (en) 2003-05-23 2006-10-13 Mold release composition and process therewith

Country Status (12)

Country Link
US (1) US20040235683A1 (xx)
EP (1) EP1626849B1 (xx)
JP (1) JP4745241B2 (xx)
KR (1) KR101125400B1 (xx)
CN (1) CN100339204C (xx)
AU (1) AU2004242601B2 (xx)
BR (1) BRPI0411147A (xx)
CA (1) CA2523691C (xx)
DE (1) DE602004004267T2 (xx)
HK (1) HK1090603A1 (xx)
MX (1) MXPA05012539A (xx)
WO (1) WO2004106026A1 (xx)

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US7462668B2 (en) * 2003-07-25 2008-12-09 Henkel Corporation Low VOC-solvent based mold release agent and curable mold release compositions based thereon
DE102004036343B4 (de) * 2004-07-27 2007-02-15 Ipgr International Partners In Glass Research Beschichtungsmaterial für eine Glasform und Verfahren zum Beschichten einer Glasform
US7318937B2 (en) * 2005-03-18 2008-01-15 Closure Medical Corporation Liquid coating compositions
US20070141362A1 (en) * 2005-12-19 2007-06-21 Elkins Casey L Composition for coating substrate to prevent sticking
US20070160547A1 (en) * 2006-01-11 2007-07-12 Janet Duffy Method of applying a composition
US20080088051A1 (en) * 2006-10-16 2008-04-17 Robert Harvey Moffett Rotational molding paint-ready polyurethane
US7851535B2 (en) 2007-07-26 2010-12-14 Henkel Corporation Mold release agents employing polyvinyl alcohol
WO2009042227A2 (en) * 2007-09-27 2009-04-02 Henkel Corporation Two-component high gloss semi-permanent water based release agent for polyester substrates
KR101725559B1 (ko) * 2009-10-06 2017-04-10 데쿠세리아루즈 가부시키가이샤 이형제 조성물, 이형 필름 및 이것을 사용한 접착 필름
CN101899779B (zh) * 2010-08-12 2013-04-24 浙江传化股份有限公司 一种100%有机硅涂层整理剂及其应用
CN102010149B (zh) * 2010-10-15 2013-02-13 航天材料及工艺研究所 一种水溶性模具及其制备方法和成型复合材料方法
JP2014148657A (ja) * 2013-01-30 2014-08-21 Dow Corning Corp 表面処理用組成物、表面処理された物品の調製方法及び表面処理された物品
US20160001468A1 (en) * 2013-02-26 2016-01-07 Bennett Precision Tooling Nsw Pty Ltd A method of preparing a mould for injection molding
JP2014210861A (ja) * 2013-04-19 2014-11-13 株式会社きもと 離型性能回復液、離型性能回復方法及びフォトマスク
US10036481B2 (en) * 2014-09-19 2018-07-31 Nibco Inc. Isolation valve with thermoplastic overmolding
CN105799104B (zh) * 2014-12-31 2018-07-24 上海荣信塑料有限公司 一种食品包装用塑料制品脱模剂及其生产方法
CN104608298A (zh) * 2015-01-13 2015-05-13 上海应用技术学院 一种注塑工业用的干性脱模剂及其制备方法
CN104647660A (zh) * 2015-02-09 2015-05-27 上海应用技术学院 一种注塑工业用的干性脱模剂及其制备方法
CN104762057B (zh) * 2015-04-03 2017-03-15 肇庆皓明有机硅材料有限公司 一种有机硅电子封装材料及其制备方法
CN104893562A (zh) * 2015-05-25 2015-09-09 巨化集团技术中心 一种橡胶制品成型模具用不粘涂料及其制备方法
JP2017024271A (ja) * 2015-07-23 2017-02-02 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 ポリウレタンフォーム成形用離型剤組成物および軟質ポリウレタンフォームの製造方法
CN105216179A (zh) * 2015-09-06 2016-01-06 河南平高电气股份有限公司 一种环氧树脂浇注件用离型剂及其制备方法
CN105111031B (zh) * 2015-09-22 2017-08-29 中国工程物理研究院化工材料研究所 大型炸药件的脱模方法
CN105295723B (zh) * 2015-11-27 2017-07-07 怀化学院 一种固化型涂层组合物及其应用
CN106608008B (zh) * 2016-11-28 2018-11-23 西安空间无线电技术研究所 一种脱模剂及其制备方法和在环氧树脂灌封中的应用
CN106985264A (zh) * 2017-03-30 2017-07-28 佛山市蓝海石英石材有限公司 一种石英石水性脱模剂及其制备方法
CN107603704B (zh) * 2017-09-17 2020-09-01 石家庄市长安育才建材有限公司 用于清水混凝土的水性脱模剂及其制备方法
JP7462628B2 (ja) * 2018-11-23 2024-04-05 ビーエーエスエフ コーティングス ゲゼルシャフト ミット ベシュレンクテル ハフツング コーティング部品の射出成型のための手動の方法
US20220064448A1 (en) * 2018-12-07 2022-03-03 Dow Toray Co., Ltd. Curable organopolysiloxane composition for forming film and production method for organopolysiloxane cured product film
KR102247362B1 (ko) * 2019-05-17 2021-04-30 박성철 타이어 블래더용 이형코팅제 조성물 및 그의 제조방법
JP7142163B2 (ja) * 2019-05-24 2022-09-26 信越化学工業株式会社 プラスチック用離型剤
CN111421103B (zh) * 2020-03-04 2021-04-02 东莞市溢美材料科技有限公司 一种一锅法合成水性有机硅金属压铸脱模剂
CN115812027A (zh) * 2020-05-14 2023-03-17 奎克化学公司 水溶性硅基脱模剂
EP4174052A4 (en) * 2020-06-29 2023-11-29 Nitto Kasei Co., Ltd. CURING CATALYST FOR CURING A POLYMER, PRODUCTION PROCESS FOR SAID CURING CATALYST, MOISTURE CURING COMPOSITION AND PRODUCTION PROCESS FOR HARDENED PRODUCT
US11624467B2 (en) 2020-12-09 2023-04-11 Nibco Inc. Fusion outlet isolation valve with thermoplastic overmolding
CN112831053B (zh) * 2021-02-24 2022-04-29 烟台大学 一种反应型有机硅脱模剂及其制备方法
EP4347740A1 (en) * 2021-05-25 2024-04-10 Henkel AG & Co. KGaA Curable compositions for composite and tool release
CN114515815A (zh) * 2022-02-22 2022-05-20 马鞍山中集瑞江润滑油有限公司 一种水基磁咓脱模剂
CN115109490B (zh) * 2022-08-11 2023-03-14 中山永辉化工股份有限公司 一种用于玩具的环保涂料及其制备方法

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US3684756A (en) * 1970-07-07 1972-08-15 Stauffer Wacker Silicone Corp Mold release compositions from mixtures of silicone resins and siloxane fluids
US4244912A (en) * 1979-03-05 1981-01-13 Dow Corning Corporation Molding process using curable silicone release compositions
JPS62275713A (ja) * 1986-05-26 1987-11-30 Daikin Ind Ltd 離型剤
US5052535A (en) * 1987-08-17 1991-10-01 Eaton Corporation Positive clutch structure
JP2590546B2 (ja) * 1987-09-16 1997-03-12 ダイキン工業株式会社 離型剤
US5026813A (en) * 1989-12-27 1991-06-25 General Electric Company Polysilsequioxane and polymethyl-N-hexylsilsesquioxane coating compositions
WO1995033001A1 (fr) * 1994-05-30 1995-12-07 Daikin Industries, Ltd. Compose fluorosilicone et composition le contenant
JPH08319424A (ja) * 1995-05-25 1996-12-03 Toray Dow Corning Silicone Co Ltd 硬化性シリコーン組成物
US6294007B1 (en) * 1998-12-07 2001-09-25 Wacker Silicones Corporation Paintable organopolysiloxane mold release compositions and processes for their use
US6403163B1 (en) * 2000-06-27 2002-06-11 Chemrex, Inc. Method of treating surfaces with organosilicon water repellent compositions
US6593422B2 (en) * 2001-05-29 2003-07-15 Dow Corning Corporation Emulsions containing crosslinked and non-crosslinked silicone polyethers

Also Published As

Publication number Publication date
CN1795082A (zh) 2006-06-28
MXPA05012539A (es) 2006-02-08
DE602004004267D1 (de) 2007-02-22
CA2523691A1 (en) 2004-12-09
US20040235683A1 (en) 2004-11-25
EP1626849A1 (en) 2006-02-22
KR20060012644A (ko) 2006-02-08
AU2004242601A1 (en) 2004-12-09
KR101125400B1 (ko) 2012-03-27
AU2004242601B2 (en) 2009-12-17
EP1626849B1 (en) 2007-01-10
BRPI0411147A (pt) 2006-07-11
WO2004106026A1 (en) 2004-12-09
CA2523691C (en) 2012-07-10
DE602004004267T2 (de) 2007-10-18
CN100339204C (zh) 2007-09-26
JP2007500775A (ja) 2007-01-18
JP4745241B2 (ja) 2011-08-10

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20200514