US20030166796A1 - Epoxy resin composition and cured object obtained therefrom - Google Patents

Epoxy resin composition and cured object obtained therefrom Download PDF

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Publication number
US20030166796A1
US20030166796A1 US10/312,161 US31216103A US2003166796A1 US 20030166796 A1 US20030166796 A1 US 20030166796A1 US 31216103 A US31216103 A US 31216103A US 2003166796 A1 US2003166796 A1 US 2003166796A1
Authority
US
United States
Prior art keywords
epoxy resin
integer
resin composition
varnish
phenolic hydroxyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/312,161
Other languages
English (en)
Inventor
Masahiro Imaizumi
Toyofumi Asano
Masaki Shinmoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Assigned to NIPPON KAYAKU KABUSHIKI KAISHA reassignment NIPPON KAYAKU KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IMAIZUMI, MASAHIRO, ASANO, TOYOFUMI, SHINMOTO, MASAKI
Publication of US20030166796A1 publication Critical patent/US20030166796A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
US10/312,161 2000-06-28 2001-06-26 Epoxy resin composition and cured object obtained therefrom Abandoned US20030166796A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000193792 2000-06-28
JP2000-193792 2000-06-28
JP2001-122259 2001-04-20
JP2001122259A JP2002080693A (ja) 2000-06-28 2001-04-20 エポキシ樹脂組成物及びその硬化物

Publications (1)

Publication Number Publication Date
US20030166796A1 true US20030166796A1 (en) 2003-09-04

Family

ID=26594823

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/312,161 Abandoned US20030166796A1 (en) 2000-06-28 2001-06-26 Epoxy resin composition and cured object obtained therefrom

Country Status (6)

Country Link
US (1) US20030166796A1 (zh)
EP (1) EP1300444A4 (zh)
JP (1) JP2002080693A (zh)
KR (1) KR20030034106A (zh)
CN (1) CN1439038A (zh)
WO (1) WO2002000791A1 (zh)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060019195A1 (en) * 2003-10-03 2006-01-26 Jun Hatakeyama Photoresist undercoat-forming material and patterning process
US20070251721A1 (en) * 2005-07-28 2007-11-01 Nec Corporation Insulation material, wiring board, and semiconductor device
US20090056982A1 (en) * 2005-04-28 2009-03-05 Yasumasa Akatsuka Process for producing a double-sided flexible printed board and double-sided flexible printed board
US20090081466A1 (en) * 2005-07-21 2009-03-26 Nippon Kayaku Kabushiki Kaisha Polyamide resin, epoxy resin compositions, and cured articles thereof
US20090169808A1 (en) * 2005-04-27 2009-07-02 Hitachi Chemical Company, Ltd. Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof
US20090202831A1 (en) * 2008-02-13 2009-08-13 Hitachi Cable, Ltd. Insulated wire and insulating varnish used therefor
US20090282845A1 (en) * 2005-10-31 2009-11-19 Matsushita Electric Industrial Co., Ltd. Expander and heat pump using the expander
WO2010034805A1 (fr) * 2008-09-26 2010-04-01 Rhodia Operations Polyamide modifie, procede de preparation, article obtenu a partir de ce polyamide
US20100129604A1 (en) * 2007-05-17 2010-05-27 Makoto Uchida Copper foil with resin layer
US20100272899A1 (en) * 2009-04-23 2010-10-28 Shenzhen Futaihong Precision Industry Co., Ltd. Method for printing on housings
US20110003914A1 (en) * 2008-01-31 2011-01-06 Sekisui Chemical Co., Ltd. Resin composition and multilayer resin film employing the same
US8114940B2 (en) 2005-10-31 2012-02-14 Nippon Kayaku Kabushiki Kaisha Rubber-modified polyamide resin, epoxy resin composition and cured product thereof
US8414962B2 (en) 2005-10-28 2013-04-09 The Penn State Research Foundation Microcontact printed thin film capacitors
DE102011118490A1 (de) * 2011-11-11 2013-05-16 Schill + Seilacher "Struktol" Gmbh Halogenfreie, flammfeste Epoxidharz-Zusammensetzungen
US20140273693A1 (en) * 2011-11-29 2014-09-18 Mitsubishi Rayon Co., Ltd. Prepreg, fiber-reinforced composite material, method for producing same, and epoxy resin composition
US11047052B2 (en) * 2014-07-10 2021-06-29 Okuno Chemical Industries Co., Ltd. Resin plating method
US11677031B2 (en) * 2017-04-10 2023-06-13 South China University Of Technology Oxide semiconductor thin-film and thin-film transistor consisted thereof

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7608336B2 (en) 2002-11-28 2009-10-27 Nippon Kayaku Kabushiki Kaisha Flame-retardant epoxy resin composition and cured product obtained therefrom
TWI306867B (en) * 2002-11-28 2009-03-01 Nippon Kayaku Kk Flame-retardant epoxy resin and its cured product
US7517553B2 (en) * 2003-09-26 2009-04-14 Nippon Kayaku Kabushiki Kaisha Adhesive aid composition
JP4765053B2 (ja) * 2004-04-15 2011-09-07 国立大学法人 千葉大学 耐熱性・高強度エポキシ樹脂
JP2005314624A (ja) * 2004-04-28 2005-11-10 Chiba Univ 高強度エポキシ樹脂
JP4743824B2 (ja) * 2004-06-10 2011-08-10 日本化薬株式会社 液状エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
KR100971865B1 (ko) * 2004-06-23 2010-07-22 히다치 가세고교 가부시끼가이샤 인쇄 배선판용 프리프레그, 금속박장 적층판 및 인쇄 배선판, 및 다층 인쇄 배선판의 제조 방법
CN100334926C (zh) * 2004-08-13 2007-08-29 周伟 挠性电路板的层压工艺以及层压用辅助材料
WO2008072630A1 (ja) * 2006-12-13 2008-06-19 Nipponkayaku Kabushikikaisha ポリアミド樹脂、並びにそれを用いるエポキシ樹脂組成物及びその用途
JP5720118B2 (ja) * 2009-06-01 2015-05-20 三菱レイヨン株式会社 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
WO2012165439A1 (ja) * 2011-05-31 2012-12-06 日立化成工業株式会社 めっきプロセス用プライマー層、配線板用積層板及びその製造方法、多層配線板及びその製造方法
CN102504486B (zh) * 2011-10-25 2014-05-21 上海交通大学 一种无卤阻燃环氧树脂及其制备方法
CN102850984A (zh) * 2012-09-19 2013-01-02 江苏华海诚科新材料有限公司 适用于小型表面贴装器件封装的低应力环氧树脂组合物
KR101477353B1 (ko) * 2012-11-09 2014-12-29 주식회사 두산 수지 조성물 및 이를 포함하는 인쇄 회로 기판용 적층체
JP6690356B2 (ja) * 2016-03-29 2020-04-28 味の素株式会社 熱硬化性樹脂組成物
KR101936428B1 (ko) * 2018-08-01 2019-01-08 디에스하이테크 주식회사 Co2 레이저 드릴을 이용하여 가공된 홀을 포함하는 동박적층판
CN114085492B (zh) * 2021-12-07 2023-10-27 苏州生益科技有限公司 一种树脂组合物及其半固化片、层压板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030148107A1 (en) * 2000-07-18 2003-08-07 Kyocera Chemical Corporation Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board, prepreg, copper-clad laminate, printed wiring board, copper foil-attached resin film, carrier-attached resin film, build-up type laminate, and build-up type multi-layer board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5258456A (en) * 1991-03-15 1993-11-02 Tomoegawa Paper Co., Ltd. Epoxy resin with phenolic OH-aramide/ban block copolymer
JP2537736B2 (ja) * 1992-07-03 1996-09-25 株式会社巴川製紙所 エポキシ樹脂組成物
JP2649473B2 (ja) * 1993-04-14 1997-09-03 株式会社巴川製紙所 エポキシ樹脂接着組成物
JP4081184B2 (ja) * 1998-07-23 2008-04-23 株式会社巴川製紙所 硬化性樹脂組成物
KR100842024B1 (ko) * 2000-10-20 2008-06-27 니폰 가야꾸 가부시끼가이샤 폴리아미드 수지 함유 조성물 및 그의 제조방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030148107A1 (en) * 2000-07-18 2003-08-07 Kyocera Chemical Corporation Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board, prepreg, copper-clad laminate, printed wiring board, copper foil-attached resin film, carrier-attached resin film, build-up type laminate, and build-up type multi-layer board

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7303855B2 (en) * 2003-10-03 2007-12-04 Shin-Etsu Chemical Co., Ltd. Photoresist undercoat-forming material and patterning process
US20060019195A1 (en) * 2003-10-03 2006-01-26 Jun Hatakeyama Photoresist undercoat-forming material and patterning process
US20090169808A1 (en) * 2005-04-27 2009-07-02 Hitachi Chemical Company, Ltd. Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof
US20100089626A1 (en) * 2005-04-27 2010-04-15 Hitachi Chemical Company, Ltd. Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof
US8440285B2 (en) 2005-04-27 2013-05-14 Hitachi Chemical Company, Ltd. Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof
US20090056982A1 (en) * 2005-04-28 2009-03-05 Yasumasa Akatsuka Process for producing a double-sided flexible printed board and double-sided flexible printed board
US20090081466A1 (en) * 2005-07-21 2009-03-26 Nippon Kayaku Kabushiki Kaisha Polyamide resin, epoxy resin compositions, and cured articles thereof
US9480154B2 (en) 2005-07-21 2016-10-25 Nippon Kayaku Kabushiki Kaisha Polyamide resin, epoxy resin compositions, and cured articles thereof
US7981963B2 (en) * 2005-07-28 2011-07-19 Nec Corporation Insulation material of reactive elastomer, epoxy resin, curing agent and crosslinked rubber
US20070251721A1 (en) * 2005-07-28 2007-11-01 Nec Corporation Insulation material, wiring board, and semiconductor device
US8828480B2 (en) 2005-10-28 2014-09-09 The Penn State Research Foundation Microcontact printed thin film capacitors
US8414962B2 (en) 2005-10-28 2013-04-09 The Penn State Research Foundation Microcontact printed thin film capacitors
US20090282845A1 (en) * 2005-10-31 2009-11-19 Matsushita Electric Industrial Co., Ltd. Expander and heat pump using the expander
US8114940B2 (en) 2005-10-31 2012-02-14 Nippon Kayaku Kabushiki Kaisha Rubber-modified polyamide resin, epoxy resin composition and cured product thereof
US20100129604A1 (en) * 2007-05-17 2010-05-27 Makoto Uchida Copper foil with resin layer
US20110003914A1 (en) * 2008-01-31 2011-01-06 Sekisui Chemical Co., Ltd. Resin composition and multilayer resin film employing the same
US20090202831A1 (en) * 2008-02-13 2009-08-13 Hitachi Cable, Ltd. Insulated wire and insulating varnish used therefor
US8449978B2 (en) * 2008-02-13 2013-05-28 Hitachi Cable, Ltd. Insulated wire and insulating varnish used therefor
WO2010034805A1 (fr) * 2008-09-26 2010-04-01 Rhodia Operations Polyamide modifie, procede de preparation, article obtenu a partir de ce polyamide
US8334359B2 (en) 2008-09-26 2012-12-18 Rhodia Operations Modified polyamide, method for preparing same, and article obtained from said polyamide
US20100272899A1 (en) * 2009-04-23 2010-10-28 Shenzhen Futaihong Precision Industry Co., Ltd. Method for printing on housings
DE102011118490B4 (de) * 2011-11-11 2014-05-15 Schill + Seilacher "Struktol" Gmbh Halogenfreie, flammfeste Epoxidharz-Zusammensetzungen und deren Verwendung
DE102011118490A1 (de) * 2011-11-11 2013-05-16 Schill + Seilacher "Struktol" Gmbh Halogenfreie, flammfeste Epoxidharz-Zusammensetzungen
US20140273693A1 (en) * 2011-11-29 2014-09-18 Mitsubishi Rayon Co., Ltd. Prepreg, fiber-reinforced composite material, method for producing same, and epoxy resin composition
US9994697B2 (en) 2011-11-29 2018-06-12 Mitsubishi Chemical Corporation Epoxy resin composition, prepreg, fiber-reinforced composite material, and method for producing same
US10227476B2 (en) * 2011-11-29 2019-03-12 Mitsubishi Chemical Corporation Prepreg, fiber-reinforced composite material, method for producing same, and epoxy resin composition
US11047052B2 (en) * 2014-07-10 2021-06-29 Okuno Chemical Industries Co., Ltd. Resin plating method
US11677031B2 (en) * 2017-04-10 2023-06-13 South China University Of Technology Oxide semiconductor thin-film and thin-film transistor consisted thereof

Also Published As

Publication number Publication date
JP2002080693A (ja) 2002-03-19
CN1439038A (zh) 2003-08-27
EP1300444A1 (en) 2003-04-09
EP1300444A4 (en) 2004-04-28
WO2002000791A1 (fr) 2002-01-03
KR20030034106A (ko) 2003-05-01

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Legal Events

Date Code Title Description
AS Assignment

Owner name: NIPPON KAYAKU KABUSHIKI KAISHA, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:IMAIZUMI, MASAHIRO;ASANO, TOYOFUMI;SHINMOTO, MASAKI;REEL/FRAME:013711/0952;SIGNING DATES FROM 20021218 TO 20030106

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION