US11785325B2 - Camera module having circuit board, molded base, and optical lens, electronic device having same and method for manufacturing camera module - Google Patents

Camera module having circuit board, molded base, and optical lens, electronic device having same and method for manufacturing camera module Download PDF

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Publication number
US11785325B2
US11785325B2 US16/633,088 US201816633088A US11785325B2 US 11785325 B2 US11785325 B2 US 11785325B2 US 201816633088 A US201816633088 A US 201816633088A US 11785325 B2 US11785325 B2 US 11785325B2
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Prior art keywords
camera module
circuit board
filter element
molded base
optical lens
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US16/633,088
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US20200162648A1 (en
Inventor
Mingzhu Wang
Bojie ZHAO
Zhewen MEI
Nan Guo
Lifeng YAO
Zhenyu Chen
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Ningbo Sunny Opotech Co Ltd
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Ningbo Sunny Opotech Co Ltd
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Assigned to NINGBO SUNNY OPOTECH CO., LTD. reassignment NINGBO SUNNY OPOTECH CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, ZHENYU, GUO, NAN, MEI, ZHEWEN, WANG, MINGZHU, YAO, Lifeng, ZHAO, Bojie
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/0048—Moulds for lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0016—Lenses
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding

Definitions

  • the present disclosure relates to the field of camera modules, and further relates to a camera module, an electronic device having the same and a method for manufacturing the camera module.
  • the current electronic products such as smart phones
  • the height dimension (thickness dimension) of the camera module is compressed so that it can be completely received in an inner cavity of an electronic product's main body, which is one of necessary factors to be considered during design of a camera module structure.
  • a high imaging quality and high performance camera module means a larger number of camera module components and a larger component size, which will inevitably cause the camera module after being assembled to have a large body size and not to meet the development trend of the current electronic devices.
  • a large screen means that there is more room for video and image presentation, which gives a consumer a wider field of view.
  • the operation experience of the large screen will undoubtedly bring huge experience advantages in terms of smart device hardware.
  • the screen of smart devices cannot be expanded at will, and an oversized mobile phone screen will increase the overall size of the mobile phone, which will in turn affect carrying and one-handed operation.
  • the body size of the electronic components that cannot be removed on the same side of the screen needs to be as small as possible. Only in this way, a sufficient space can be reserved for the expansion of the ratio occupied by the screen.
  • the front camera module is a core electronic component that cannot be removed. Therefore, in the process of increasing the smart phone screen ratio, the body size of the front camera module needs to be compressed, which can provide a space for the size expansion of the display screen of the electronic device.
  • a fixed-focus camera module with a relatively large size package includes a circuit board 2 , a photosensitive chip 3 , a lens holder 1 , and an optical lens 6 .
  • the circuit board 2 includes a plurality of electronic components 5 mounted on the circuit board, wherein the photosensitive chip 3 is conductively attached on a chip attaching area corresponding to the substrate of the circuit board 2 by means of a Chip on Board (COB), for example, by means of a gold wire.
  • COB Chip on Board
  • the lens holder 1 is mounted on the circuit board 2 and must leave a safe distance from the electronic components 5 , the photosensitive chip 3 and their gold wires; and the lens holder 1 , the electronic components 5 and the photosensitive chip 3 must leave a safe distance from each other.
  • MOB camera module it is necessary to leave a safe distance between the photosensitive chip and the lens holder.
  • the lens holder 1 is mounted in a peripheral non-working area of the substrate of the circuit board 2 and a certain safety distance is provided between the lens holder 1 and the electronic components 5 assembled on the substrate of the circuit board 2 , to prevent the occurrence of touch between the lens holder 1 and the electronic components 5 A.
  • the optical lens 6 is assembled on the top of the lens holder 1 and is held on the corresponding photosensitive path of the photosensitive element. Due to the limitation of the existing camera module's COB packaging process, the overall size of the finally produced camera module is difficult to meet the requirements.
  • the circuit board 2 needs to extend an additional distance toward both sides. That is, since a safe space needs to be reserved in the horizontal direction, the length and width dimensions of the circuit board 2 need to be lengthened to meet the assembly design requirements.
  • the circuit components are mounted on the circuit board 2 with a lower degree of intensity, that is, the space utilization ratio of the electronic components 5 on the circuit board 2 is relatively low.
  • the optical lens 6 of the conventional camera module includes an inner lens barrel 62 for fixing a group of optical lens sheets 63 to the inner peripheral wall of the inner lens barrel 62 in a certain order
  • the optical lens 6 generally includes a fixed lens barrel 61 coaxially disposed outside the inner lens barrel 62 , to fix the optical lens 6 to the top of the lens holder 1 by the fixed lens barrel 61 .
  • the light window opening formed by the lens holder 1 is relatively large, and in a case where the fixed lens barrel 61 is not provided, the optical lens 6 cannot be assembled on the top of the holder by its own width.
  • the function of the fixed lens barrel 61 is equivalent to a beam, so as to bridge the lens holder 1 and the optical lens 6 for mounting, and it does not substantially affect the optical performance of the camera module.
  • the circuit board 2 and the lens holder 1 will be reduced in size accordingly, so that the fixed lens barrel 61 is no longer needed between the optical lens 6 and the lens holder 1 .
  • the fixed lens barrel 61 will occupy excess space, but will affect the final molding size of the camera module.
  • An objective of the present disclosure is to provide a camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the optical lens is directly assembled on the top of the molded base without an additional fixed lens barrel, so that compared with the existing camera module, the space occupied by the fixed lens barrel is released, so as to further reduce the size of the camera module.
  • Another objective of the present disclosure is to provide a camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the molded base of the camera module is integrally molded on the circuit board and the photosensitive element so that the camera module has a more compact and smaller structure.
  • Another objective of the present disclosure is to provide a camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the molded base of the camera module is integrally molded by a molding process and covers the electronic components attached to the circuit board, so that in the process of packaging the camera module, there is no need to reserve a safe space for the electronic components.
  • the length and width dimensions of the circuit board are reduced, and the space utilization rate and degree of intensity of the electronic components relative to the circuit board are improved.
  • Another objective of the present disclosure is to provide a camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the molded base is integrally molded on the circuit board and covers the electronic components located on the circuit board so that the electronic components are isolated from each other. In this way, the interference between the electronic components in the working process is effectively avoided.
  • Another objective of the present disclosure is to provide a camera module, an electronic device having a camera module, and a method for manufacturing a camera module, wherein the side of the circuit board located on the edge of an electronic device is free of electronic components when the camera module is configured in the electronic device. In this way, the distance between the camera module and the edge of the electronic device is reduced, thereby reserving a sufficient space for mounting of other components of the electronic device.
  • Another objective of the present disclosure is to provide a camera module, an electronic device having a camera module, and a method for manufacturing a camera module, wherein the side of the circuit board located on the edge of an electronic device is free of electronic components when the camera module is configured in the electronic device. In this way, the distance between the camera module and the edge of the electronic device is reduced, and a chip of the same size can be closer to the edge of the screen.
  • Another objective of the present disclosure is to provide a camera module, an electronic device with a camera module, and a method for manufacturing a camera module, wherein the corresponding side of the circuit board abutting against the edge of the electronic device is free of electronic components. Based on this structure configuration, it is beneficial to the execution of the molded base panel cutting process of the panel manufacturing process of the camera module.
  • Another objective of the present disclosure is to provide a camera module, an electronic device with a camera module, and a method for manufacturing a camera module, wherein along the length direction of the electronic device the side of the photosensitive element adjacent to the edge of the electronic device is free of electronic components. In this way, the distance between the camera module and the electronic device in the length direction of the electronic device is reduced, thereby reserving a sufficient space for mounting of other components of the electronic device, such as a touch screen of an electronic device.
  • Another objective of the present disclosure is to provide a camera module, an electronic device with a camera module, and a method for manufacturing a camera module, wherein along the width direction of the electronic device the side of the photosensitive element adjacent to the edge of the electronic device is free of electronic components. In this way, the distance between the camera module and the electronic device in the width direction of the electronic device is reduced, thereby reserving a sufficient space for mounting of other components of the electronic device, such as a touch screen of an electronic device.
  • Another objective of the present disclosure is to provide a camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the circuit board and the photosensitive element is conductively connected by a group of lead wires, and the side of the circuit board adjacent to the electronic device is free of lead wires. In this way, the distance between the camera module and the edge of the electronic device is further reduced, thereby providing a larger assembling space for other components of the electronic device, such as a touch screen of an electronic device.
  • Another objective of the present disclosure is to provide a camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the side of the circuit board adjacent to the edge of the electronic device is free of lead wires, so that there is no need to worry about the lead wires being cut in the panel cutting process of the camera module. That is to say, with such a structural arrangement, the panel manufacturing process of the camera module is further optimized, which is beneficial to improving the production efficiency and reducing the manufacturing cost.
  • Another objective of the present disclosure is to provide a camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the molded base integrally molded on the circuit board and the photosensitive element is cut from a molded base panel prepared in an panelization process, and the side near the edge of the electronic device corresponds to one of the panel cutting sides. In this way, the distance between the side of the circuit board near the edge of the electronic device and the photosensitive element can be adjusted by adjusting the position of the cutting side on the module base panel.
  • Another objective of the present disclosure is to provide a camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the optical lens of the camera module is directly assembled on the top of the molded base, and the size of the optical lens is smaller than the size of the molded base to form an extension space between the optical lens and the molded base, thereby providing a larger mounting space for mounting other components of the electronic device, for example, a display screen.
  • Another objective of the present disclosure is to provide a camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the optical lens comprises a lens barrel unit, the lens barrel unit is provided with a stepped portion, and the stepped portion extends inwardly toward the optical axis of the optical lens, so as to further expand the extension space between the optical lens and the molded base by the stepped portion, thereby providing a wider inward extension space for mounting of other components of the electronic device.
  • Another objective of the present disclosure is to provide a camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the camera module comprises a filter element lens holder, the filter element lens holder and the molded base of the camera module cooperates with each other to provide support for the filter element.
  • Another objective of the present disclosure is to provide a camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the filter element does not need to be directly mounted on the molded base of the camera module, and the filter element lens holder has a support groove, the support groove having a smaller size than the light window of the molded base. In this way, the area required by the filter element can be effectively reduced.
  • Another objective of the present disclosure is to provide a camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the stress effect when the filter element is directly mounted on the molding base is relieved by the filter element lens holder to protect the filter element.
  • Another objective of the present disclosure is to provide a camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the filter element lens holder has a support groove, and the filter element is mounted in the support groove of the filter element, so that the position of the filter element is relatively sunk.
  • Another objective of the present disclosure is to provide a camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the filter element comprises a limit protrusion, and the limit protrusion restrains and limits the optical lens of the camera module to optimize the assembly process of the camera module and make the optical lens coincide with the optical axis of the photosensitive element through the limit protrusion.
  • an aspect of the present disclosure provides a fixed-focus camera module, which is suitable for assembly in an electronic device, wherein the fixed-focus camera module comprises:
  • At least one photosensitive element which can be operatively connected to the circuit board
  • the molded base is integrally molded on the circuit board and the photosensitive element, and the molded base forms a light window, so as to provide a light passage for the photosensitive element, wherein the optical lens is directly assembled on the top end of the molded base without a fixed lens barrel so that the top end of the molded base does not need to provide an area for supporting the fixed lens barrel, wherein the circuit board comprises a substrate and a plurality of electronic components disposed on the substrate, and wherein the fixed-focus camera module is suitable for being assembled near an edge position of the electronic device, and the side of the circuit board adjacent to the edge of the electronic device is free of electronic components, so that a distance between the fixed-focus camera module and the top end edge of the electronic device is reduced.
  • the circuit board further comprises a flexible board connection board and a connector, wherein the connector is connected to the flexible board connection board, and the flexible board connection board is conductively connected to the opposite side of the circuit board from the side on which the electronic components are not arranged.
  • the circuit board has a flexible board connection side, the flexible board connection side is provided with a flexible board connection board, and the other end of the flexible board connection board is provided with a connector, wherein the flexible board connection side is disposed opposite to the side of the circuit board adjacent to the edge of the electronic device.
  • the side of the circuit board adjacent to the edge of the electronic device is free of electronic components.
  • the side of the circuit board adjacent to the edge of the electronic device is free of electronic component.
  • the electronic components are arranged on at least one side of the remaining sides other than the side adjacent to the top end of the electronic device.
  • the circuit board and the photosensitive element is conductively connected through a group of lead wires, and the side adjacent to the top end of the electronic device is free of lead wires.
  • the circuit board and the photosensitive element is conductively connected through a group of lead wires, and the side adjacent to the top end of the electronic device is free of lead wires, wherein the lead wires are arranged on at least two side of the remaining sides other than the side adjacent to the top end of the electronic device.
  • the camera module further comprises a filter element, wherein the filter element is disposed and held between the optical lens and the photosensitive element.
  • the camera module further comprises a filter element, wherein the filter element is disposed and held between the optical lens and the photosensitive element, so that the filter element is aligned with the photosensitive path, so that light transmitting through the optical lens is filtered by the filter element and then reaches the photosensitive element.
  • the top layer of the molded base has at least one groove, and the filter element is assembled in the groove.
  • the camera module further comprises a filter element lens holder, wherein the filter element is assembled on the filter element lens holder, and the filter element lens holder is assembled on the top layer of the molded base to allow the light transmitting through the optical lens to be filtered by the filter element and then reach the photosensitive element.
  • the optical lens is supported only by the molded base, or the optical lens is partially supported by the molded base and partially supported by the filter element lens holder.
  • the optical lens of the camera module is directly assembled on the top of the molded base, and the size of the optical lens is smaller than the size of the top of the molded base to form an extension space between the optical lens and the molded base.
  • the optical lens may be implemented as a one-piece lens or a split lens, which comprises at least two lens units, the lens units being assembled in cooperation with each other.
  • the optical lens comprises a lens barrel for fixing a group of optical lens sheets therein, wherein the lens barrel is provided with a stepped portion, and the stepped portion extends inwardly toward the optical axis of the optical lens to further expand the extension space between the optical lens and the molded base by means of the stepped portion.
  • the present disclosure further provides a panel manufacturing method for a camera module, wherein the manufacturing method comprises:
  • the circuit board panel in the step of attaching the photosensitive element, comprises a substrate provided with at least two chip attaching areas and a group of electronic components, wherein the substrate has a flexible board connection side to connect a flexible board connection board, and the electronic components are arranged on at least one side of the remaining sides other than the opposite side of the flexible board connection side of the substrate.
  • the corresponding cutting side of the circuit board substrate corresponds to the side near the edge of the electronic device in a subsequent process of assembling the camera module in an electronic device.
  • FIG. 1 is a schematic cross-sectional view of a camera module of an existing COB package.
  • FIG. 2 is a schematic perspective view of a camera module in accordance with a first preferred embodiment of the present disclosure.
  • FIG. 3 is a schematic exploded view of the camera module in accordance with the above first preferred embodiment.
  • FIG. 4 A is a schematic cross-sectional view along an A-A direction of the camera module in accordance with the above first preferred embodiment.
  • FIG. 4 B is a schematic cross-sectional view along an A-A direction of a modified embodiment of the camera module in accordance with the above first preferred embodiment.
  • FIG. 4 C is a schematic cross-sectional view along an A-A direction of another modified embodiment of the camera module in accordance with the above first preferred embodiment.
  • FIG. 4 D is a schematic cross-sectional view along an A-A direction of further another modified embodiment of the camera module in accordance with the above first preferred embodiment.
  • FIG. 5 A is a schematic molding-and-clamping view of a schematic panel manufacturing view of a camera module shown according to a preferred embodiment of the present disclosure.
  • FIG. 5 B is a schematic molding-and-drafting view of the schematic panel manufacturing view of the camera module shown according to the preferred embodiment of the present disclosure.
  • FIG. 6 is a schematic view of cutting the molded photosensitive assembly of the schematic panel manufacturing view of the camera module shown according to the preferred embodiment of the present disclosure.
  • FIG. 7 is a schematic view of obtaining individual molded photosensitive assemblies of the schematic panel manufacturing view of the camera module shown according to the preferred embodiment of the present disclosure.
  • FIG. 8 is a schematic perspective view of an electronic device configured with a camera module provided by the present disclosure.
  • FIG. 9 A is an enlarged cross-sectional view of a partial area at B according to the electronic device shown in FIG. 8 .
  • FIG. 9 B is an enlarged cross-sectional view of a partial area at B in a modified embodiment according to the electronic device shown in FIG. 8 .
  • the term “a” should be understood to mean “at least one” or “one or more”, that is, in one embodiment, the number of “a element” may be one, whereas in other embodiments, the number of the element may be multiple, and the term “a” cannot be construed as limiting the number.
  • a camera module 1 in accordance with a first preferred embodiment of the present disclosure is schematically shown, wherein the camera module 1 can be applied to various electronic devices 80 , such as but not limited to smart phones, wearable devices, computer devices, television sets, vehicles, cameras, monitoring apparatuses.
  • the camera module 1 cooperates with the electronic device 80 to achieve image acquisition and reproduction of a target object.
  • a camera module 1 in accordance with the first preferred embodiment of the present disclosure is shown, wherein the camera module 1 includes a molded photosensitive assembly 10 and an optical lens 20 , and the optical lens 20 is assembled on the top of the molded photosensitive assembly 10 and held on the photosensitive path corresponding to the molded photosensitive assembly 10 .
  • the molded photosensitive assembly 10 includes a molded base 11 , a circuit board 13 , and a photosensitive element 12 , wherein the photosensitive element 12 is conductively assembled in a corresponding position on the circuit board 13 , and the molded base 11 is integrally packaged and molded on the circuit board 13 and the photosensitive element 12 by a molding process, so that the molded photosensitive assembly 10 has an integrated compact structure.
  • the molded base 11 has a light window and a base main body 111 forming the light window, the light window provides an optical passage for the photosensitive element 12 , and the module base is integrally packaged to the circuit board 13 and at least a part of the non-photosensitive area of the photosensitive element 12 .
  • the light window is a ring structure with a closed periphery, so as to provide a closed inner environment for the optical lens 20 .
  • the circuit board 13 includes a circuit board substrate 131 , and the circuit board substrate 131 is provided with a chip attaching area 1311 and a peripheral area 1312 , wherein the chip attaching area 1311 is correspondingly suitable for attaching the photosensitive element 12 , and the peripheral area 1312 integrally surrounds the chip mounting area 1311 .
  • the circuit board 13 further includes a group of electronic components 132 , wherein the electronic components 132 are mounted on the peripheral area 1312 of the substrate, for example, being mounted by SMT process.
  • the electronic components 132 include but are not limited to, a resistor, a capacitor, a driving device, etc.
  • the molded base 11 is integrally molded on the photosensitive element 12 and the circuit board 13 , and integrally covers the electronic components 132 and at least a part of the corresponding non-photosensitive area of the photosensitive element 12 to form the molded photosensitive assembly 10 .
  • the molded photosensitive assembly 10 has many advantages.
  • the molded base 11 is integrally molded on the photosensitive element 12 and the circuit board 13 , compared with the existing camera module 1 , there is no need to reserve a safe space between the molded base 11 and the photosensitive element 12 in the process of forming the molded base 11 , so that the overall molding size of the molded base 11 and the molded photosensitive assembly 10 can be effectively reduced.
  • the electronic components 132 attached to the circuit board 13 can be closer to the photosensitive element 12 because there is no need to set a safe distance between the photosensitive element 12 and the electronic components 132 while performing the molding process. That is, in the circuit board 13 provided by the present disclosure, the laying density of the electronic components 132 can be relatively increased. Consequently, on the one hand, the space of the circuit board substrate 131 occupied by the same number of the electronic components 132 can be relatively reduced. On the other hand, the circuit board 13 of the same area allows a relatively larger number of the electronic components 132 to be laid, to meet the imaging hardware requirements of the camera module 1 .
  • the molded photosensitive assembly 10 is integrally molded by a molding process, and it has a relatively more compact and smaller size structure, compared with the lens holder of the existing camera module 1 , the size of the molded base 11 is relatively smaller, so that the optical lens 20 can be assembled on the molded photosensitive assembly 10 in a “bare lens” mounting manner.
  • the content regarding this part and a specific definition of “bare lens” will be further set forth in the subsequent description.
  • the molded base 11 is integrally packaged on the photosensitive element 12 and the circuit board 13 , and integrally covers the electronic components 132 , thereby preventing that dust and debris are adhered to the electronic components 132 to contaminate the photosensitive element 12 and affect the imaging effect similarly to the conventional camera module 1 .
  • the molded base 11 after molding integrally covers the electronic components 132 , the respective electronic components 132 can be isolated by the molded photosensitive assembly 10 to reduce the electromagnetic interference between the electronic components 132 .
  • the molding material has good thermal conductivity, the heat dissipation effect of the camera module 1 can be improved by the molded base 11 , and the temperature drift can be reduced to further improve the imaging quality of the camera module 1 .
  • the electronic device 80 is buried in the substrate, that is, the electronic components 132 may not be exposed to the outside.
  • the molded photosensitive assembly 10 can further have a more compact and smaller structure.
  • the molded base 11 can completely cover the electronic components 132 , the electronic components 132 may not be embedded in the substrate. That is, the substrate is only used to form conductive lines, so that the molded photosensitive assembly 10 that is finally formed can have a smaller thickness and a smaller horizontal dimension (the length direction and the width direction).
  • the electronic components 132 are disposed around the photosensitive element 12 , whereas in different embodiments, the arrangement positions of the electronic components 132 can be designed according to needs, for example, concentrated on one side or both sides, and can be matched with the setting position of the photosensitive element 12 and the subsequent setting positions of a group of lead wires 14 conducting the photosensitive element 12 to the circuit board substrate 131 , to use the space positions on the substrate more reasonably, and reduce the size of the camera module 1 as much as possible.
  • one side of the circuit board substrate 131 is free of electronic components 132 .
  • the distance between the edge of the circuit board substrate 131 on this side and the photosensitive elements 12 can be effectively reduced, so that the distance between the camera module 1 and the edge of the electronic device 80 is reduced during the subsequent configuration process of mounting the camera module 1 on an electronic device 80 , thereby reserving a sufficient mounting space for mounting of other components of the electronic device 80 , for example, a display interface of the electronic device 80 .
  • the side of the circuit board 13 not provided with the electronic components 132 is defined as a blank side 1313 of the circuit board 13 .
  • the electronic components 132 are disposed on at least one of the remaining sides other than the blank side 1313 of the circuit board substrate 131 .
  • the electronic components 132 may be disposed on three sides or two sides other than the blank side 1313 , or concentratedly arranged on any side of the circuit board 13 other than the blank side 1313 . In this way, any electronic component 132 is not arranged on the blank side 1313 to achieve the design purpose.
  • the arrangement of the electronic components 132 on the remaining sides of the circuit board substrate 131 is not a limitation of the present disclosure, as long as the electronic components 132 are not mounted on at least one side of the circuit board 13 .
  • the electronic components 132 are disposed on two wing sides 1315 of the circuit board substrate 131 , and the blank side 1313 extends between the two wing sides 1315 .
  • the electronic components 132 on the circuit board substrate 131 have a relatively symmetrical and regular structural arrangement, which is beneficial to the execution of the manufacture and production processes of the molded photosensitive assembly 10 .
  • the content regarding this part will be described in more detail in the panel manufacturing process of the molded photosensitive assembly 10 mentioned later.
  • the circuit board substrate 131 may be a rigid board of a PC filter element lens holder 30 , a flexible board of the PC filter element lens holder 30 , a Rigid-Flex board, a ceramic substrate, and the like.
  • the substrate is a Rigid-Flex board. That is, in the preferred embodiment of the present disclosure, the circuit board substrate 131 has a flexible board connection side 1314 for connecting a flexible board connection board 1316 , wherein the other end of the flexible board connection board 1316 is provided with a connector 1317 to connect the camera module 1 and the electronic device 80 through the connector 1317 .
  • the flexible board connection side 1314 is disposed opposite to the blank side 1313 of the circuit board substrate 131 .
  • the flexible board connection side 1314 can also be disposed on adjacent sides (two wing sides 1315 ) that intersects with the blank side 1313 . That is, in the present disclosure, the arrangement position of the flexible board connection board 1316 can be freely selected according to the actually required fitting position requirements, as long as the flexible board connection side 1314 is not disposed on the blank side 1313 .
  • the flexible board connecting board 1316 may be implemented as an abnormal structure. That is, the flexible board connecting board 1316 has an irregular shape, so that with the abnormal structure of the flexible board connecting board 1316 , the connector 1317 connected to the flexible board connection board 1316 extends to a position of the connection port of the electronic device 80 . In this way, the flexible board connection side 1314 of the circuit board substrate 131 can be caused to have a relatively free setting position.
  • the photosensitive element 12 is correspondingly mounted on the chip attaching area 1311 of the circuit board substrate 131 , such as, but not limited to, a SMT process (Surf circuit board substrate 131 ce Mount Technology, surface mount process), or is electrically connected to the substrate by means of a CO filter element lens holder 30 (Chip On filter element lens holder 30 o circuit board substrate 131 rd ).
  • a SMT process Silicon circuit board substrate 131 ce Mount Technology, surface mount process
  • CO filter element lens holder 30 Chip On filter element lens holder 30 o circuit board substrate 131 rd
  • the manner in which the photosensitive element 12 is mounted on the substrate can also be achieved by other manners, such as in-line and FC (flip chip). It should be understood by those skilled in the art that the connection manner and the conduction manner of the photosensitive element 12 and the circuit board 13 are not a limitation of the present disclosure.
  • the photosensitive element 12 is electrically connected to the substrate through a group of lead wires 14 , wherein the lead wires 14 extend between corresponding connection ends of the circuit board substrate 131 and the photosensitive element 12 , and after the molded base 11 is molded, the lead wires 14 are embedded by the molded base 11 so that the connection between the lead wires 14 and the photosensitive element 12 and the circuit board substrate 131 is more stable.
  • the lead wires 14 include but are not limited to gold wires, silver wires, copper wires, aluminum wires or alloy wires (copper-aluminum alloy wires), and the like.
  • the blank side 1313 of the circuit board substrate 131 is free of lead wires 14 , so that the distance between the edge of the blank side 1313 and the photosensitive element 12 can be further reduced. Consequently, during the subsequent process of mounting the camera module 1 in an electronic device 80 , the blank side 1313 of the circuit board substrate 131 is disposed adjacent to the edge of the electronic device 80 , so that the camera module 1 as a whole is closer to the edge of the electronic device 80 . In this way, a wider space is reserved for mounting of other components of the electronic device 80 .
  • the camera module 1 is assembled in a smart phone as a front camera of the smart phone, and by the arrangement of the blank side 1313 of the circuit board and the lead wires 14 , a wider mounting space is provided for a display screen of the smart phone, so that the display screen of the smart phone can be expanded without changing the surface size of the smart phone, improving the “screen ratio”.
  • the lead wires 14 are arranged on the remaining sides other than the blank side 1313 of the circuit board substrate 131 . That is, in the present disclosure, the lead wires 14 may be concentratedly disposed on any side other than the blank side 1313 of the circuit board substrate 131 , or is arranged on two sides other than the blank side 1313 of the circuit board substrate 131 , or is arranged on all the remaining sides other than the blank side 1313 of the circuit board substrate 131 .
  • the lead wires 14 are disposed on two wing sides 1315 of the circuit board substrate 131 , so that the circuit board 13 has a more regular and symmetrical structure to facilitate the execution of the panel manufacturing process of the molded photosensitive assembly 10 .
  • the content regarding this part will be described in more detail in the manufacturing process of the molded photosensitive assembly 10 mentioned later.
  • the circuit board substrate 131 has a flat board shape, and the photosensitive element 12 is attached to the top surface of the circuit board substrate 131 .
  • the circuit board substrate 131 may have an inner groove 112 , and the photosensitive element 12 is received in the inner groove 112 to reduce the height of the photosensitive element 12 protruded from the circuit board substrate 131 .
  • the circuit board substrate 131 may have a through hole communicating with both sides of the circuit board substrate 131 , and the photosensitive element 12 is received in the through hole so that the relative position of the photosensitive element 12 and the circuit board substrate 131 is adjustable.
  • the circuit board substrate 131 may have a passage, the passage has a stepped structure, and the photosensitive element 12 is mounted on the passage in a flip-chip manner.
  • the circuit board substrate 131 may have a reinforcing hole, and the integrated base extends into the reinforcing hole to enhance the structural strength of the integrated base assembly.
  • the circuit board substrate 131 includes a back plate, and the back plate is stacked on the bottom of the circuit board substrate 131 to enhance the structural strength and heat dissipation performance of the molded photosensitive assembly 10 .
  • the back plate is exemplified by but not limited to a metal plate.
  • the molded photosensitive assembly 10 includes an electromagnetic shielding layer, and the electromagnetic shielding layer is wrapped on the outside of the integrated base or surrounds the inside to enhance the anti-electromagnetic interference ability of the camera module 1 .
  • the circuit board 13 may also have various other modifications to increase or enhance different performances of the integrated base assembly. It should be understood by those skilled in the art hat the structural modification of the circuit board 13 described above is not a limitation of the present disclosure.
  • the molded base 11 is integrally molded on the circuit board 13 and the photosensitive element 12 , so that compared with the lens holder of the existing camera module 1 , the molded base 11 has a relatively smaller size, especially in the length and width directions. Consequently, the optical lens 20 provided by the present disclosure can be directly mounted on the top of the molded base 11 without an additional fixed lens barrel 11 . That is, in the present disclosure, compared with the optical lens 20 of the existing camera module 1 , the space occupied by the fixed lens barrel is effectively released. On the one hand, the size of the optical lens 20 can be further reduced. On the other hand, the released space provides a mounting space for other components of the electronic device 80 .
  • the optical lens 20 includes a lens barrel unit 21 and a group of optical lens sheets 22 .
  • the optical lens sheets 22 are assembled to the lens barrel unit 21 in a certain order to form the optical lens 20 .
  • the optical lens 20 can be directly assembled on the top of the molded base 11 without providing an additional fixed lens barrel. That is, in the preferred embodiment of the present disclosure, the lens barrel unit 21 of the optical lens 20 may completely be disposed across the light window corresponding to the molded base 11 , so that the optical lens 20 is supported on the top of the molded base 11 by the lens barrel unit 21 .
  • the optical lens 20 of the camera module 1 is directly assembled on the top of the molded base 11 , and the size of the optical lens 20 is smaller than that of the top of the molded base 11 to form an extension space 23 between the optical lens 20 and the molded base 11 .
  • the extension space 23 provides an additional mounting space for the mounting of other components of the electronic device 80 .
  • the camera module 1 is assembled in a smart phone as a front camera of the smart phone, and a display screen of the smart phone can be further extended into the extension space 23 , so that the purpose of expanding the display screen of the smart phone and improving the “screen ratio” may be further achieved without changing the surface size of the smart phone.
  • the lens barrel unit 21 further has a stepped portion, and the stepped portion extends inwardly along the optical axis direction defined by the optical lens 20 to further expand the extension space 23 by the stepped portion. That is, in the process of assembling the camera module 1 to the smart phone, the display screen of the smart phone can be further extended to the shoulder of the stepped portion of the lens barrel unit 21 . In this way, the purpose of expanding the display screen of the smart phone and improving the “screen ratio” may be further achieved.
  • the optical lens 20 may be an integrated optical lens 20 or be implemented as a split optical lens 20 , wherein when the optical lens 20 is implemented as a split optical lens 20 , the optical lens 20 includes at least two lens units, and the lens units in cooperation with each other are assembled to form the optical lens 20 .
  • the camera module 1 further includes a filter element 40 , and the filter element 40 is disposed between the optical lens 20 and the molded photosensitive assembly 10 to filter the light passing through the optical lens 20 by the filter element 40 .
  • the filter element 40 is disposed on the molded base 11 and is located in the light propagation path formed by the photosensitive element 12 and the optical lens 20 , so that light in the wavebands affecting the imaging quality, such as light waves in the infrared band, can be filtered by the filter element 40 .
  • the filter element 40 is exemplified by but not limited to, an infrared filter, a blue glass filter, a wafer-level infrared cut-off filter, a whole transparent sheet, and a visible light filter.
  • a groove 112 is provided on the top of the molded base 11 , and the filter element 40 is received in the groove 112 . In this way, the distance between the filter element 40 and the photosensitive element 12 can be reduced, so that the optical function of the filter element 40 is brought into full play.
  • the filter element 40 such as a blue glass filter
  • the filter element 40 is a relatively fragile and relatively expensive element, and it is easy to break. Therefore, the filter element 40 is protected during the manufacturing process of the camera module, which is also an extremely important aspect.
  • the camera module 1 further includes a filter element lens holder 30 , the filter element 40 is mounted on the filter element lens holder 30 , and the filter element lens holder 30 is assembled on the top of the molded base 11 to provide a suitable mounting position for the filter element 40 by the filter element lens holder 30 , achieving the purpose of protecting the filter element 40 .
  • the molded base 11 is made by using a molding process, such as an injection molding or compression molding process, and the material of the filter element lens holder 30 is not limited as long as it has sufficient strength to mount the filter element 40 .
  • the filter element lens holder 30 and the molded base 11 can be manufactured by using different manufacturing processes.
  • the filter element lens holder 30 is manufactured by an injection molding process
  • the molded base 11 is manufactured by using transfer compression molding. Therefore, different materials can be used so that the filter element lens base 30 and the molded base 11 have different hardnesses and different surface flexibility.
  • the filter element lens base 30 may be caused to have better flexibility, so that when the filter element 40 is mounted on the filter element lens holder 30 , the stress received when it is mounted to the optical element lens base 30 is smaller relative to the case where it is mounted on the molded base 11 .
  • the filter element lens holder 30 relieves the external stress that the filter element 40 may receive, such as the stress received when it is directly adhered to the molded base 11 .
  • the top surface of the molded base 11 extends flatly.
  • the molded base 11 forms a platform structure without stepped protrusions, and the filter element lens holder 30 is mounted on the platform structure. It is worth mentioning that in this way, the top surface of the molded base 11 extends flatly without any obvious bending angle. Therefore, during the molding process, a flatter and burr-free mounting surface can be obtained, providing a flat mounting condition for mounting of the filter element lens holder 30 and the optical lens 20 .
  • the filter element lens holder 30 has a size corresponding to the top surface of the molded base 11 and is superimposedly attached on the top surface of the molded base 11 to support the filter element 40 .
  • the subsequently mounted optical lens 20 is supported by the filter element lens holder 30 instead of the molded base 11 .
  • the filter element lens holder 30 has a support groove 31 , wherein the support groove 31 is concavely formed in the middle area of the filter element lens holder 30 , and the support groove 31 correspondingly communicates with the light window and is used to mount the filter element 40 . It is worth mentioning that when the filter element 40 is received in the support groove 31 , the relative height between the filter element lens holder 30 and the filter element 40 is reduced, so that the filter element 40 does not or less protrude from the filter element lens holder 30 . Thus, the height dimension of the finally formed camera module 1 is reduced.
  • FIG. 4 B a schematic view of another mounting manner of the filter element lens holder 30 is shown, wherein the top of the molded base 11 is provided with a receiving groove, and the receiving groove is concavely formed on the top of the molded base 11 and has a size matched with the filter element lens holder 30 , so that the filter element lens holder 30 can be coincidently received therein.
  • the overall height of the molded photosensitive assembly 10 can be further reduced. That is, preferably, the filter element lens holder 30 has a height dimension corresponding to the receiving groove, so that when the filter element lens holder 30 is mounted in the receiving groove, the top surface of the molded base 11 coincides with the top surface of the filter element 40 .
  • the molded base 11 and the filter element lens base 30 both provide supporting surfaces for the subsequent mounting of the optical lens 20 . That is, the subsequently mounted optical lens 20 may be supported only by the molded base 11 , or the optical lens 20 may be partially supported by the molded base 11 and partially supported by the filter element lens holder 30 , or may be supported only by the filter element lens holder 30 , so that the size and mounting position of the optical lens 20 can have more options.
  • the filter element lens holder 30 is further provided with a limit protrusion 32 , and the limit protrusion 32 at least partially convexly extends upwardly from the top surface of the filter element lens holder 30 , so as to limit and guide the mounting of the optical lens 20 , and to block dust or light from entering into the interior of the camera module 1 after the assembly is completed.
  • the arrangement position of the limit protrusion in relation to the filter element 40 can be designed according to the size of the optical lens 20 , so that when the optical lens 20 is attached to the top of the molded base 11 , the limit protrusion 32 can assist in alignment to facilitate the execution of the mounting operation, and prevent glue required by mounting the optical lens 20 from overflowing to the inside to contaminate the lens or the internal elements during the process of attaching the optical lens 20 with the glue.
  • the limit protrusion 32 may be an annular protrusion, so as to position the optical lens 20 as a whole. It is worth mentioning that, in other embodiments of the present disclosure, the surface of the limit protrusion 32 may be provided with screw threads, so as to directly mount the optical lens 20 , and when screw threads are provided on the outside of the limit protrusion 32 , it is suitable for the optical lens 20 with a larger aperture.
  • the limit protrusion 32 may also be formed at a corresponding position of the molded base 11 to limit and guide the mounting of the optical lens 20 , wherein the limit protrusion 32 may be integrally molded on the top of the molded base 11 , for example, by a secondary molding process, or the limit protrusion 32 is a separate component and is assembled at a corresponding position of the molded base 11 , for example, by means of gluing.
  • FIGS. 5 A to 7 it is a schematic view of manufacture for a molded photosensitive assembly panel of the camera module 1 , wherein the molded photosensitive assembly 10 is manufactured in batches, so that the manufacture efficiency of the molded photosensitive assembly 10 and the camera module 1 is greatly improved.
  • a circuit board panel 200 is provided, wherein the circuit board panel 200 includes a circuit board substrate 131 , the circuit board substrate 131 is provided with at least two chip attaching areas 1311 , and the chip attaching areas 1311 are each attached with a photosensitive element 12 .
  • the circuit board panel 200 is integrally formed by two columns of individual circuit boards 13 , and a group of flexible board connection boards 1316 are provided on both sides of the circuit board panel 200 , respectively.
  • the circuit board panel 200 also includes a series of electronic components 132 , wherein one side of the circuit board substrate 131 is free of electronic components 132 .
  • the side of the circuit board 13 not provided with the electronic components 132 is defined as a blank side 1313 of the circuit board 13 .
  • the blank side 1313 of the circuit board 13 is correspondingly disposed on the middle intersection side of the two columns of individual circuit boards 13 , and the electronic components 132 are disposed on at least one of the remaining sides other than the blank side 1313 of the circuit board substrate 131 .
  • the electronic components 132 are disposed on both wing sides 1315 of the circuit board substrate 131 , and the blank side 1313 extends between the two wing sides 1315 , so that the electronic components 132 on the circuit board substrate 131 have a relatively symmetrical and regular structural arrangement, which is beneficial to the execution of the manufacture and production processes of the molded photosensitive assembly 10 .
  • the photosensitive element 12 is electrically connected to the circuit board substrate 131 by a group of lead wires 14 , wherein the lead wires 14 are arranged on the remaining sides other than the blank side 1313 of the circuit board substrate 131 .
  • the lead wires 14 may be concentratedly disposed on any side other than the blank side 1313 of the circuit board substrate 131 or may be arranged on two sides other than the blank side 1313 of the circuit board substrate 131 or arranged on all the remaining sides other than the blank side 1313 of the circuit board substrate 131 .
  • the lead wires 14 are also disposed on both wing sides 1315 of the circuit board substrate 131 .
  • the circuit board panel 200 with the photosensitive elements 12 is placed in a molding cavity of a molding die 100 , and a molded base panel 300 is formed on the photosensitive element 12 and the circuit board substrate 131 after molding, wherein an panel of the molded base 11 integrally covers at least a part of the photosensitive element 12 and the electronic components 132 formed on the circuit board panel 200 .
  • the molded base panel 300 is further cut to form a plurality of individual molded photosensitive assemblies 10 at a time. It is worth mentioning that in the present disclosure, the blank side 1313 of the circuit board substrate 131 is not provided with the electronic components 132 and the lead wires 14 .
  • the filter element 40 is assembled on the filter element lens holder 30 , and the filter element lens holder 30 is assembled at a corresponding position on the top of the molded base 11 . It is worth mentioning that in the manufacturing process for the camera module 1 of the present disclosure, the mounting order between the filter element 40 and the filter element 40 can be adjusted. For example, in some embodiments of the present disclosure, the filter element 40 may be assembled on the filter element lens holder 30 , and then the filter element lens holder 30 is correspondingly assembled at a corresponding position on the top of the molded base 11 .
  • the filter element lens holder 30 may be firstly mounted at a corresponding position on the top of the molded base 11 , and then the filter element 40 may be correspondingly attached to a support groove 31 formed by the filter element lens holder 30 . That is, in the manufacturing method for the camera module 1 provided by the present disclosure, the mounting order between the filter element lens holder 30 and the filter element 40 is not a limitation of the present disclosure. It is worth mentioning that, in other embodiments of the present disclosure, the filter element 40 may also be directly assembled in a corresponding mounting groove on the top of the molded base 11 . That is, in other embodiments of the present disclosure, the filter element lens holder 30 may not be required.
  • the optical lens 20 is assembled on the top of the molded base and held in the photosensitive path of the molded photosensitive assembly 10 . More specifically, in the panel manufacturing process for a camera module provided by the present disclosure, the optical lens 20 is directly assembled on the top of the molded base 11 without an additional fixed lens barrel. It is worth mentioning that the size of the optical lens 20 is smaller than the size of the top of the molded base 11 , so that an extension space 23 is formed between the optical lens 20 and the molded base 11 . Thus, in the process of assembling the camera module 1 in an electronic device 80 , the extension space 23 provides an additional mounting space for mounting of other components of the electronic device 80 .
  • the camera module 1 is assembled in a smart phone as a front camera of the smart phone, and a display screen of the smart phone can be further extended into the extension space 23 , so that the purpose of expanding the display screen of the smart phone and improving the “screen ratio” may be further achieved without changing the surface size of the smart phone.
  • the optical lens 20 may be an integrated optical lens 20 or be implemented as a split optical lens 20 , wherein when the optical lens 20 is implemented as a split optical lens 20 , the optical lens 20 includes at least two lens units, and the lens units cooperate with each other and are assembled to form the optical lens 20 . That is, when the optical lens 20 is implemented as a split optical lens 20 , the manufacturing process of the present disclosure may further include a process of assembling the lens units of the split optical lens 20 in cooperation with each other.
  • the present disclosure also provides a manufacturing method for a fixed-focus camera module 1 , wherein the method comprises steps of:
  • an electronic device 80 assembled with the camera module 1 provided by the present disclosure is shown, wherein the electronic device 80 is exemplified but not limited to a smart phone, a wearable device, a computer device, and a television set, a vehicle, a camera, a monitoring device, etc., and the camera module 1 cooperates with the electronic device 80 to realize image acquisition and reproduction of a target object.
  • the electronic device 80 is a smart phone as an example.
  • the smart phone is to only taken an example to explain the cooperation relationship and technical features between the camera module 1 and the electronic device 80 . That is, in the present disclosure, the type of the electronic device 80 is not a limitation of the present disclosure.
  • the smart phone includes a device main body 81 and at least a fixed-focus camera module 1 assembled in the device main body 81 , wherein the fixed-focus camera module 1 serves as a front camera of the smart phone, and is assembled on the same side of the device main body 81 as the touch screen 811 of the device main body 81 . That is, in the smart phone, the touch screen 811 and the camera module 1 share the same side area of the smart phone, so that by adjusting the body size and related structural parameters of the camera module 1 , more room can be released to achieve the purpose of expanding the touch screen 811 .
  • the fixed-focus camera module 1 includes a circuit board 13 , a photosensitive element 12 operatively connected to the circuit board 13 , an optical lens 20 , and a molded base 11 , wherein the molded base 11 is integrally molded on the circuit board 13 and the photosensitive element 12 , and the molded base 11 forms a light window to provide a light passage for the photosensitive element 12 ; and wherein the optical lens 20 is directly assembled on the top of the molded base 11 without a fixed lens barrel, so that the top of the molded base 11 does not need to provide an area for supporting the fixed lens barrel, and thereby the space for the fixed lens barrel is released.
  • an expanded space can be provided for the touch screen 811 to achieve the purpose of increasing the screen ratio of the smart phone.
  • the circuit board 13 includes a circuit board substrate 131 and a plurality of electronic components 132 disposed on the circuit board substrate, wherein the fixed-focus camera module 1 is assembled at a position adjacent to the edge of the device main body 81 , and the side of the circuit board 13 adjacent to the edge of the device main body 81 is not provided with the electronic components 132 , so that the distance between the fixed-focus camera module 1 and the top end edge of the device main body 81 is reduced. In this way, a larger expansion space can be further provided for the touch screen 811 of the smart phone. That is, in the present disclosure, the electronic components 132 are arranged on at least one of the remaining sides other than the side adjacent to the top end of the device main body 81 .
  • circuit board 13 and the photosensitive element 12 are conductively connected by a group of lead wires 14 , and the side adjacent to the top end of the device main body 81 along the length direction of the device main body 81 is not provided with the lead wires 14 . In this way, the distance between the camera module 1 and the edge of the device main body 81 can be further reduced, so that a larger expansion space can be further provided for the touch screen 811 of the smart phone.
  • the molded base 11 integrally molded on the circuit board 13 and the photosensitive element 12 is cut from the one-piece molded base 11 manufactured in a panelization process, and the side adjacent to the edge of the device main body 81 corresponds to one of the cutting sides 101 .
  • the fixed-focus camera module 1 further includes at least one filter element 40 , wherein the filter element 40 is disposed on the molded base 11 , and the filter element 40 is held between the optical lens 20 and the photosensitive element 12 .
  • the molded base 11 has at least one groove 112 on the top side, and the filter element 40 is assembled in the groove 112 .
  • the camera module 1 further includes a filter element lens holder 30 , the filter element 40 is assembled on the filter element 40 , and the filter element lens holder 30 is assembled at a corresponding position on the top side of the molded base 11 to allow the light transmitting through the optical lens 20 to be filtered by the filter element 40 and then reach the photosensitive element 12 .
  • the optical lens 20 is directly assembled on the top of the molded base 11 , and the size of the optical lens 20 is smaller than that of the top of the molded base 11 to form an extension space 23 between the optical lens 20 and the molded base 11 .
  • the touch screen 811 of the smart phone can further extend into the extension space 23 , so that without changing the surface size of the smart phone, the purpose of expanding the display screen of the smart phone and increasing the “screen ratio” may be further achieved.
  • the lens barrel unit 21 further has a stepped portion, and the stepped portion extends inwardly along the optical axis direction defined by the optical lens 20 to further expand the extension space 23 by the stepped portion. That is, in the process of assembling the camera module 1 to the smart phone, the display screen 811 of the smart phone can be further extended to the shoulder of the stepped portion of the lens barrel unit 21 . In this way, the purpose of expanding the display screen of the smart phone and improving the “screen ratio” may be further achieved.
  • the optical lens 20 may be an integral lens or a split lens, which includes at least two lens units, the lens units being assembled in cooperation with each other to form the optical lens 20 .
  • the type of the optical lens 20 is not limited.

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US16/633,088 2017-08-05 2018-08-03 Camera module having circuit board, molded base, and optical lens, electronic device having same and method for manufacturing camera module Active 2039-08-30 US11785325B2 (en)

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PCT/CN2018/098560 WO2019029450A1 (zh) 2017-08-05 2018-08-03 摄像模组和具有摄像模组的电子设备及摄像模组制备方法

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Families Citing this family (14)

* Cited by examiner, † Cited by third party
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RU2737388C1 (ru) * 2018-07-05 2020-11-30 Бейдзин Сяоми Мобайл Софтвэр Ко., Лтд. Узел объектива, способ изготовления узла объектива, модуль камеры и электронное устройство
CN111988496A (zh) * 2019-05-24 2020-11-24 宁波舜宇光电信息有限公司 摄像模组及其制造方法
CN111190258A (zh) * 2018-11-15 2020-05-22 三营超精密光电(晋城)有限公司 光学镜头、应用该光学镜头的镜头模组及电子装置
JP7460537B2 (ja) * 2018-11-15 2024-04-02 ソニーセミコンダクタソリューションズ株式会社 車載カメラ
CN111665602A (zh) * 2019-03-05 2020-09-15 三赢科技（深圳）有限公司 镜头模组及电子装置
US20220181369A1 (en) * 2019-03-08 2022-06-09 Dexerials Corporation Method of manufacturing connection structure, connection structure, film structure, and method of manufacturing film structure
CN111726484A (zh) * 2019-03-22 2020-09-29 宁波舜宇光电信息有限公司 摄像模组和其镜头组件及带有摄像模组的电子设备
CN111726485A (zh) * 2019-03-22 2020-09-29 宁波舜宇光电信息有限公司 摄像模组及其镜头组件和组装方法
CN112666776B (zh) * 2019-09-29 2022-09-02 宁波舜宇光电信息有限公司 发射模组及其制造方法、深度信息获取模组以及电子设备
CN115086507B (zh) * 2021-03-10 2023-08-22 宁波舜宇光电信息有限公司 可伸缩式摄像模组和电子设备
CN115480327A (zh) * 2021-05-31 2022-12-16 宁波舜宇光电信息有限公司 摄像模组及其光学镜头和变焦方法
CN116170674A (zh) * 2021-11-22 2023-05-26 余姚舜宇智能光学技术有限公司 镜座、镜头组件和摄像模组
CN115348371A (zh) * 2022-07-28 2022-11-15 诚瑞光学(南宁)有限公司 摄像头模组及其支架的制作方法
TWI819941B (zh) * 2022-12-30 2023-10-21 新煒科技有限公司 相機模組

Citations (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004032141A (ja) 2002-06-24 2004-01-29 Toko Inc カメラモジュール
JP2006148473A (ja) 2004-11-18 2006-06-08 Shinko Electric Ind Co Ltd カメラモジュール及びその製造方法
KR20090116479A (ko) 2008-05-07 2009-11-11 삼성테크윈 주식회사 이미지 센서 모듈 및 그 제조 방법
JP2013100573A (ja) 2011-11-08 2013-05-23 Fukui Megane Kogyo Kk 白色系Ａｕ合金
KR20130061539A (ko) 2011-12-01 2013-06-11 주식회사 팬택 카메라 모듈을 포함하는 이동통신 단말기
CN103296043A (zh) 2013-05-31 2013-09-11 格科微电子（上海）有限公司 图像传感器封装方法及结构、图像传感器模组及形成方法
US20140036218A1 (en) 2012-08-06 2014-02-06 Yun-Kai Yu Camera module and method for making same
US20140041214A1 (en) * 2012-08-07 2014-02-13 Excelitas Technologies Singapore Pte. Ltd. Panelized process for smt sensor devices
CN203674205U (zh) 2013-12-30 2014-06-25 湖北三赢兴电子科技有限公司 高端摄像模组的晶元封装结构
CN104469106A (zh) 2013-09-13 2015-03-25 Lg伊诺特有限公司 摄像模块
CN104836943A (zh) 2015-01-30 2015-08-12 中国科学技术大学 一种平面分布的多摄像头全景图拍摄系统及其实现方法
CN105187697A (zh) 2015-08-04 2015-12-23 宁波舜宇光电信息有限公司 多镜头摄像模组连体支架和多镜头摄像模组及其应用
CN105467550A (zh) 2015-12-16 2016-04-06 宁波舜宇光电信息有限公司 集成对焦机构的可调光学镜头和摄像模组及其组装方法
CN105516565A (zh) 2015-12-31 2016-04-20 杭州雄迈信息技术有限公司 一种安防摄像头模组及其封装工艺
CN205176454U (zh) 2015-10-28 2016-04-20 南昌欧菲光电技术有限公司 双摄像头模组及具有其的摄像装置
CN105611135A (zh) 2015-11-13 2016-05-25 宁波舜宇光电信息有限公司 系统级摄像模组及其电气支架和制造方法
US20160150133A1 (en) 2014-11-26 2016-05-26 Kabushiki Kaisha Toshiba Electronic device module having an imaging unit
CN105721749A (zh) 2016-02-24 2016-06-29 宁波舜宇光电信息有限公司 摄像模组及其电气支架和线路板组件及制造方法
CN105847645A (zh) 2016-05-11 2016-08-10 宁波舜宇光电信息有限公司 基于一体封装工艺的摄像模组及其一体基座组件及制造方法
CN105898120A (zh) 2016-04-21 2016-08-24 宁波舜宇光电信息有限公司 基于模塑工艺的摄像模组
US20160313520A1 (en) 2013-12-12 2016-10-27 Hitachi Maxell, Ltd. Lens member, method of manufacturing the same, communication module, lens array, and light-source module
CN106131386A (zh) 2016-08-10 2016-11-16 北京小米移动软件有限公司 摄像头模组和电子设备
US20160353029A1 (en) 2013-08-19 2016-12-01 Samsung Electronics Co., Ltd. Camera module
CN205792874U (zh) 2016-03-12 2016-12-07 宁波舜宇光电信息有限公司 摄像模组及其感光组件
CN206074975U (zh) 2016-08-29 2017-04-05 昆山丘钛微电子科技有限公司 摄像头模组用滤光片与基座一体成型结构
CN206302476U (zh) 2016-08-01 2017-07-04 宁波舜宇光电信息有限公司 摄像模组及其模塑电路板组件和成型模具及电子设备
CN106973210A (zh) 2017-05-16 2017-07-21 昆山丘钛微电子科技有限公司 塑封加支架式小型化摄像头装置及其制作方法
US20170353646A1 (en) * 2016-04-21 2017-12-07 Ningbo Sunny Opotech Co., Ltd. Camera Module and Array Camera Module Based on Integral Packaging Technology
US20180035021A1 (en) 2016-08-01 2018-02-01 Ningbo Sunny Opotech Co., Ltd. Camera Module and Molded Circuit Board Assembly and Manufacturing Method Thereof
CN108322574A (zh) * 2018-03-30 2018-07-24 广东欧珀移动通信有限公司 显示屏、终端显示屏组件及移动终端

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100884962B1 (ko) * 2007-07-30 2009-02-23 자화전자 주식회사 휴대폰용 카메라 렌즈 어셈블리
JP2014103458A (ja) * 2012-11-16 2014-06-05 Sharp Corp カメラモジュールおよび表示装置
TWI650016B (zh) * 2013-08-22 2019-02-01 新力股份有限公司 成像裝置、製造方法及電子設備

Patent Citations (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004032141A (ja) 2002-06-24 2004-01-29 Toko Inc カメラモジュール
JP2006148473A (ja) 2004-11-18 2006-06-08 Shinko Electric Ind Co Ltd カメラモジュール及びその製造方法
KR20090116479A (ko) 2008-05-07 2009-11-11 삼성테크윈 주식회사 이미지 센서 모듈 및 그 제조 방법
JP2013100573A (ja) 2011-11-08 2013-05-23 Fukui Megane Kogyo Kk 白色系Ａｕ合金
KR20130061539A (ko) 2011-12-01 2013-06-11 주식회사 팬택 카메라 모듈을 포함하는 이동통신 단말기
TW201408060A (zh) 2012-08-06 2014-02-16 Hon Hai Prec Ind Co Ltd 相機模組及相機模組的製造方法
US20140036218A1 (en) 2012-08-06 2014-02-06 Yun-Kai Yu Camera module and method for making same
US20140041214A1 (en) * 2012-08-07 2014-02-13 Excelitas Technologies Singapore Pte. Ltd. Panelized process for smt sensor devices
CN103296043A (zh) 2013-05-31 2013-09-11 格科微电子（上海）有限公司 图像传感器封装方法及结构、图像传感器模组及形成方法
US20160353029A1 (en) 2013-08-19 2016-12-01 Samsung Electronics Co., Ltd. Camera module
CN104469106A (zh) 2013-09-13 2015-03-25 Lg伊诺特有限公司 摄像模块
US20160313520A1 (en) 2013-12-12 2016-10-27 Hitachi Maxell, Ltd. Lens member, method of manufacturing the same, communication module, lens array, and light-source module
CN203674205U (zh) 2013-12-30 2014-06-25 湖北三赢兴电子科技有限公司 高端摄像模组的晶元封装结构
US20160150133A1 (en) 2014-11-26 2016-05-26 Kabushiki Kaisha Toshiba Electronic device module having an imaging unit
CN104836943A (zh) 2015-01-30 2015-08-12 中国科学技术大学 一种平面分布的多摄像头全景图拍摄系统及其实现方法
CN105187697A (zh) 2015-08-04 2015-12-23 宁波舜宇光电信息有限公司 多镜头摄像模组连体支架和多镜头摄像模组及其应用
WO2017020751A1 (zh) 2015-08-04 2017-02-09 宁波舜宇光电信息有限公司 多镜头摄像模组连体支架和多镜头摄像模组及其应用
US20210329149A1 (en) * 2015-08-04 2021-10-21 Ningbo Sunny Opotech Co., Ltd. Multi-Lens Camera Module Conjoined Stand, Multi-Lens Camera Module and Application Thereof
CN205176454U (zh) 2015-10-28 2016-04-20 南昌欧菲光电技术有限公司 双摄像头模组及具有其的摄像装置
CN105611135A (zh) 2015-11-13 2016-05-25 宁波舜宇光电信息有限公司 系统级摄像模组及其电气支架和制造方法
US20170142303A1 (en) 2015-11-13 2017-05-18 Ningbo Sunny Opotech Co., Ltd. System-Level Camera Module with Electrical Support and Manufacturing Method Thereof
CN105467550A (zh) 2015-12-16 2016-04-06 宁波舜宇光电信息有限公司 集成对焦机构的可调光学镜头和摄像模组及其组装方法
CN105516565A (zh) 2015-12-31 2016-04-20 杭州雄迈信息技术有限公司 一种安防摄像头模组及其封装工艺
WO2017113549A1 (zh) 2015-12-31 2017-07-06 杭州雄迈信息技术有限公司 一种安防摄像头模组及其封装工艺
CN105721749A (zh) 2016-02-24 2016-06-29 宁波舜宇光电信息有限公司 摄像模组及其电气支架和线路板组件及制造方法
CN205792874U (zh) 2016-03-12 2016-12-07 宁波舜宇光电信息有限公司 摄像模组及其感光组件
CN105898120A (zh) 2016-04-21 2016-08-24 宁波舜宇光电信息有限公司 基于模塑工艺的摄像模组
US20170353646A1 (en) * 2016-04-21 2017-12-07 Ningbo Sunny Opotech Co., Ltd. Camera Module and Array Camera Module Based on Integral Packaging Technology
CN105847645A (zh) 2016-05-11 2016-08-10 宁波舜宇光电信息有限公司 基于一体封装工艺的摄像模组及其一体基座组件及制造方法
CN206302476U (zh) 2016-08-01 2017-07-04 宁波舜宇光电信息有限公司 摄像模组及其模塑电路板组件和成型模具及电子设备
US20180035021A1 (en) 2016-08-01 2018-02-01 Ningbo Sunny Opotech Co., Ltd. Camera Module and Molded Circuit Board Assembly and Manufacturing Method Thereof
CN106131386A (zh) 2016-08-10 2016-11-16 北京小米移动软件有限公司 摄像头模组和电子设备
CN206074975U (zh) 2016-08-29 2017-04-05 昆山丘钛微电子科技有限公司 摄像头模组用滤光片与基座一体成型结构
CN106973210A (zh) 2017-05-16 2017-07-21 昆山丘钛微电子科技有限公司 塑封加支架式小型化摄像头装置及其制作方法
CN108322574A (zh) * 2018-03-30 2018-07-24 广东欧珀移动通信有限公司 显示屏、终端显示屏组件及移动终端

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
Chinese Office Action and Search Report, dated Sep. 28, 2020, for Chinese Application No. 201880044841.9, with an English translation.
European Communication pursuant to Article 94(3) EPC for European Application No. 18843164.7, dated Dec. 20, 2021.
Extended European Search Report for European Application No. 18843164.7, dated Mar. 7, 2020.
International Search Report (PCT/ISA/210) issued in PCT/CN2018/098560, dated Nov. 1, 2018.

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