WO2019029450A1 - 摄像模组和具有摄像模组的电子设备及摄像模组制备方法 - Google Patents

摄像模组和具有摄像模组的电子设备及摄像模组制备方法 Download PDF

Info

Publication number
WO2019029450A1
WO2019029450A1 PCT/CN2018/098560 CN2018098560W WO2019029450A1 WO 2019029450 A1 WO2019029450 A1 WO 2019029450A1 CN 2018098560 W CN2018098560 W CN 2018098560W WO 2019029450 A1 WO2019029450 A1 WO 2019029450A1
Authority
WO
WIPO (PCT)
Prior art keywords
camera module
circuit board
filter element
focus camera
fixed focus
Prior art date
Application number
PCT/CN2018/098560
Other languages
English (en)
French (fr)
Inventor
王明珠
赵波杰
梅哲文
郭楠
姚立锋
陈振宇
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to KR1020207004560A priority Critical patent/KR102321747B1/ko
Priority to JP2020504414A priority patent/JP6913817B2/ja
Priority to EP18843164.7A priority patent/EP3644596B1/en
Priority to CN201880044841.9A priority patent/CN110832835B/zh
Priority to US16/633,088 priority patent/US11785325B2/en
Publication of WO2019029450A1 publication Critical patent/WO2019029450A1/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/0048—Moulds for lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0016—Lenses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding

Definitions

  • the present invention relates to the field of camera modules, and further, to a camera module, an electronic device having the camera module, and a method for preparing the camera module
  • the screen of the smart device cannot be expanded at will, and the large mobile phone screen will increase the overall size of the mobile phone, thereby affecting the carrying and one-hand operation. That is to say, in the case that the overall size of the existing electronic product, such as a smart phone, is relatively unchanged, the screen ratio is increased, that is, the proportion of the area occupied by the screen occupying the border of the smart device is increased.
  • the electronic components that cannot be removed on the same side of the screen should be miniaturized as much as possible, so that the proportion of the extended screen can be reserved. space.
  • the front camera module is a core electronic component that cannot be removed. Therefore, in the process of increasing the proportion of the smart phone screen, the shape of the front camera module needs to be compressed. It can satisfy the space for the size expansion of the display of the electronic device.
  • a fixed-focus camera module of a relatively large package includes a circuit board 2 , a sensor chip 3 , a lens holder 1 , and an optical lens 6 .
  • the circuit board 2 includes a plurality of electronic components 5 mounted thereon, wherein the photosensitive chip 3 is electrically connected to the corresponding chip of the substrate of the circuit board 2 by a COB (Chip On Board) method. Mounting area, for example by means of a gold thread.
  • the conventional lens holder is that the lens holder 1 is mounted on the circuit board 2, and has a safe distance from the electronic component 5 and the photosensitive chip 3 and the gold wire thereof, and is a lens holder 1, an electronic component 5, and a photosensitive chip 3. There must be a safe distance between each other.
  • the lens holder 1 is mounted on a peripheral non-working area of the substrate of the circuit board 2 and has a certain safety distance from the electronic component 5 assembled on the substrate of the circuit board 2 to prevent the lens holder 1 and the electronic component 5 from being disposed. There was a touch between them. Further, the optical lens 6 is assembled on the top of the lens holder 1 and held on a corresponding photosensitive path of the photosensitive member. Due to the limitations of the COB packaging process of the existing camera module, the overall size of the resulting camera module is difficult to reach.
  • the lens holder 1 when the lens holder 1 is mounted on the substrate of the circuit board 2, it is necessary to reserve a safe space for the electronic component 5 assembled in the circuit board 2 in the horizontal direction and the height direction, so as to be assembled.
  • the camera module has a relatively large thickness.
  • the circuit board 2 since a safe space needs to be reserved in the horizontal direction, the circuit board 2 needs to extend an additional distance to both sides. That is to say, since a safe space needs to be reserved in the horizontal direction, the length and width of the circuit board 2 need to be lengthened to meet the assembly design requirements.
  • the circuit component is less densely mounted on the circuit board 2, that is, the space utilization rate of the electronic component 5 on the circuit board 2 is lower. .
  • the optical lens 6 of the conventional camera module includes an inner lens barrel 62 for fixing a group of optical lenses 63 to the inner peripheral wall of the inner lens barrel 62 in a certain order
  • the optical lens 6 generally includes a fixed lens barrel 61 coaxially disposed outside the inner lens barrel 62 to fix the optical lens 6 to the top of the lens holder 1 through the fixed lens barrel 61.
  • the fixed lens barrel 61 functions as a beam to be installed between the lens holder 1 and the optical lens 6 without the camera module.
  • the optical properties have a substantial impact.
  • the circuit board 2 and the lens holder 1 are correspondingly reduced in size, so that the fixing is no longer required between the optical lens 6 and the lens holder 1.
  • the lens barrel 61 in this case, the fixed lens barrel 61 takes up extra space, which in turn affects the final molding size of the camera module.
  • An object of the present invention is to provide a camera module and an electronic device having the camera module and a method for manufacturing the camera module, wherein the optical lens is directly assembled to the top of the molded base without additional The lens barrel is fixed, so that the space occupied by the fixed lens barrel is released compared to the existing camera module, so as to further reduce the size of the camera module.
  • Another object of the present invention is to provide a camera module, an electronic device having the camera module, and a method for manufacturing the camera module, wherein the molded base of the camera module is integrally molded on the circuit board and the The photosensitive element is such that the camera module has a more compact and compact structure.
  • Another object of the present invention is to provide a camera module, an electronic device having the camera module, and a method for preparing the camera module, wherein the molded base of the camera module is integrally molded and coated by a molding process.
  • the electronic component of the circuit board so that in the process of packaging the camera module, there is no need to reserve a safe space for the electronic component, so that the length dimension and the width dimension of the circuit board are reduced, and The space utilization and density of the electronic components relative to the circuit board are improved.
  • Another object of the present invention is to provide a camera module and an electronic device having the camera module and a method for manufacturing the same, wherein the molded base is integrally formed on the circuit board and covered in the circuit
  • the electronic components of the board are such that the electronic components are isolated from each other, in such a manner as to effectively prevent the electronic components from interfering with each other during operation.
  • Another object of the present invention is to provide a camera module and an electronic device having the camera module and a method for preparing the camera module, wherein when the camera module is disposed in an electronic device, the circuit board is located in the electronic device.
  • the electronic component is not disposed on the side of the edge, in such a manner that the distance between the camera module and the edge of the electronic device is reduced, thereby mounting other components of the electronic device. Reserve ample space.
  • Another object of the present invention is to provide a camera module and an electronic device having the camera module and a method for preparing the camera module, wherein when the camera module is disposed in an electronic device, the circuit board is located in the electronic device.
  • the electronic component is not disposed on the side of the edge, in such a manner that the distance between the camera module and the edge of the electronic device is reduced, and the same size chip can be closer to the edge of the screen.
  • Another object of the present invention is to provide a camera module, an electronic device having the camera module, and a method for manufacturing the camera module, wherein the electronic component is not disposed on the corresponding side of the circuit board that is adjacent to the edge of the electronic device, based on
  • the structural configuration is beneficial to the execution of the molding stencil cutting process of the imposition preparation process of the camera module.
  • Another object of the present invention is to provide a camera module and an electronic device having the camera module and a method for manufacturing the camera module, wherein the photosensitive element is adjacent to the edge of the electronic device along the length of the electronic device The electronic component is not disposed. In this manner, the distance between the camera module and the electronic device in the length direction of the electronic device is reduced, thereby preserving sufficient space for installation of other components of the electronic device, such as Touch screen for electronic devices.
  • Another object of the present invention is to provide a camera module and an electronic device having the camera module and a method for preparing the camera module, wherein the photosensitive element is adjacent to the edge of the electronic device along the width direction of the electronic device
  • the electronic component is not disposed, and in this way, the distance between the camera module and the electronic device in the width direction of the electronic device is reduced, thereby preserving sufficient space for installation of other components of the electronic device, such as Touch screen for electronic devices.
  • Another object of the present invention is to provide a camera module, an electronic device having the camera module, and a method for manufacturing the camera module, wherein the circuit board and the photosensitive element are electrically connected through a set of leads, and The circuit board is not disposed adjacent to the side of the electronic device, and in this way, the distance between the camera module and the edge of the electronic device is further reduced, thereby being the other of the electronic device.
  • Components provide greater assembly space, such as the display of electronic devices.
  • Another object of the present invention is to provide a camera module and an electronic device having the camera module and a method for manufacturing the camera module, wherein the side of the circuit board adjacent to the edge of the electronic device is not provided with a lead wire, thereby In the imposition cutting process of the camera module, there is no need to worry that the lead wire will be cut, and it is said that through such a structural arrangement, the imposition preparation process of the camera module is further optimized, which is beneficial to improving production efficiency. reduce manufacturing cost.
  • Another object of the present invention is to provide a camera module, an electronic device having the camera module, and a method for manufacturing the camera module, wherein the molded base integrally formed on the circuit board and the photosensitive member is The molded pedestal prepared in the imposition process is embossed, and corresponds to one of the stencil-cut sides on the side adjacent to the edge of the electronic device, in such a manner that the side of the edge circuit board adjacent to the electronic device is The distance between the photosensitive elements can be adjusted by adjusting the position of the cutting side on the module base imposition.
  • Another object of the present invention is to provide a camera module and an electronic device having the camera module and a method for manufacturing the camera module, wherein the optical lens of the camera module is directly assembled to the molded base a top portion, and the size of the optical lens is smaller than a size of the molded base to form an extended space between the optical lens and the molded base to mount other components of the electronic device, For example, the display provides more installation space.
  • Another object of the present invention is to provide a camera module, an electronic device having the camera module, and a method for manufacturing the camera module, wherein the optical lens includes a lens barrel unit, and the lens barrel unit is provided with a step portion.
  • the step portion extends inwardly toward the optical lens optical axis to further expand an extension space between the optical lens and the molding base through the step portion, thereby providing more installation for other components of the electronic device Extensive inward extension of space.
  • Another object of the present invention is to provide a camera module and an electronic device having the camera module and a method for preparing the camera module, wherein the camera module includes a filter element lens holder, the filter element lens holder and The molding base of the camera module cooperates to provide support for the filter element.
  • Another object of the present invention is to provide a camera module, an electronic device having the camera module, and a method for manufacturing the camera module, wherein the filter element does not need to be directly mounted on the molding base of the camera module And the filter element lens holder has a support groove having a smaller size than the light window of the molded base, in such a manner, the filter element can be effectively reduced Required area.
  • Another object of the present invention is to provide a camera module, an electronic device having the camera module, and a method for manufacturing the camera module, wherein the filter element is used to relieve the filter element from being directly mounted to the mold. The stress acts on the plastic pedestal to protect the filter element.
  • Another object of the present invention is to provide a camera module, an electronic device having the camera module, and a method for manufacturing the camera module, wherein the filter element lens holder has a support slot, and the filter element is mounted The support groove of the filter element causes the filter element to be relatively depressed.
  • Another object of the present invention is to provide a camera module, an electronic device having the camera module, and a method for manufacturing the camera module, wherein the filter element includes a limiting protrusion, and the limiting protrusion is constrained.
  • the optical lens of the camera module is positioned to optimize an assembly process of the camera module and the optical lens is aligned with an optical axis of the photosensitive element by the limiting protrusion.
  • an aspect of the present invention provides a telephoto camera module that is adapted to be assembled in an electronic device, wherein the fixed focus camera module includes:
  • At least one circuit board At least one circuit board
  • At least one photosensitive element operatively coupled to the circuit board
  • At least one optical lens At least one optical lens
  • At least one molded base wherein the molded base is integrally molded to the circuit board and the photosensitive member, and the molded base forms a light window to provide a light path for the photosensitive member,
  • the optical lens is directly assembled to the top end of the molded base so that there is no need to fix the lens barrel such that the top end of the molded base does not need to provide an area for supporting the fixed lens barrel
  • the circuit board includes a a substrate and a plurality of electronic components disposed on the substrate, wherein the fixed focus camera module is adapted to be assembled adjacent to an edge position of the electronic device, and the circuit board is adjacent to an edge of the electronic device The electronic component is not disposed such that the distance between the fixed focus camera module and the top edge of the electronic device is reduced.
  • the circuit board further includes a flexible board connecting board and a connector, wherein the connector is connected to the soft board connecting board, and the soft board connecting board is electrically connected The opposite side of the electronic component is not disposed on the circuit board.
  • the circuit board has a soft board connecting side, the soft board connecting side is provided with a soft board connecting board, and the other end of the soft board connecting board is provided with a connector, wherein
  • the flexible board connection side is disposed on a side of the circuit board adjacent to an edge of the electronic device.
  • the electronic component is not disposed on the side of the electronic device adjacent to the edge of the electronic device along the length of the electronic device.
  • the electronic component is not disposed on a side of the circuit board adjacent to an edge of the electronic device in a width direction of the electronic device.
  • the electronic component is arranged on at least one side of a remaining side of the side adjacent to the top end of the electronic device.
  • circuit board and the photosensitive member are electrically connected by a set of leads, and the leads are not disposed on a side adjacent to a top end of the electronic device.
  • the circuit board and the photosensitive element are electrically connected by a set of leads, and the lead is not disposed on a side adjacent to a top end of the electronic device, wherein the lead It is disposed on at least two sides of the remaining side except the side adjacent to the top end of the electronic device.
  • the camera module further includes a filter element, wherein the filter element is disposed and held between the optical lens and the photosensitive element.
  • the camera module further includes a filter element, wherein the filter element is disposed and held between the optical lens and the photosensitive element to cause the filter The component is aligned with the photosensitive path such that light transmitted through the optical lens is filtered by the filter element and reaches the photosensitive element.
  • the filter element is assembled to the groove.
  • the camera module further includes a filter element lens holder, wherein the filter element is assembled to the filter element lens holder, and the filter element lens holder is assembled in the The top layer of the susceptor is molded to allow light transmitted through the optical lens to be filtered through the filter element to reach the photosensitive element.
  • the optical lens is supported only by the molding base, or the optical lens is partially supported by the molding base, partially supported by the filter element lens holder .
  • the optical lens of the camera module is directly assembled on the top of the molded base, and the size of the optical lens is smaller than the size of the top of the molded base Forming an extension space between the optical lens and the molded base.
  • the optical lens can be implemented as a unitary lens or as a split lens, comprising at least two lens units, the mirror units being assembled with each other.
  • the optical lens comprises a lens barrel for fixing a set of optical lenses therein, wherein the lens barrel is provided with a step portion, the step portion facing the optics
  • the optical axis direction of the lens extends inwardly to further expand the extended space between the optical lens and the molded base through the step portion.
  • the present invention further provides a method for preparing an imposition of a camera module, wherein the preparation method includes:
  • At least one photosensitive element is correspondingly assembled to a corresponding mounting area of the circuit board imposition.
  • a molding base imposition is formed by a molding process
  • the circuit board imposition in the step of mounting the photosensitive element, comprises a substrate provided with at least two chip mounting areas and a set of electronic components, wherein the substrate has a soft a board connecting side for connecting a soft board connecting board, and the electronic component is disposed on at least one side of a remaining side of the opposite side of the board connecting side of the board
  • the opposite cutting side of the current plate substrate is in the process of assembling the camera module to an electronic device. Corresponds to the side of the edge of the adjacent electronic device.
  • FIG. 1 is a schematic cross-sectional view of a camera module of a conventional COB package.
  • FIG. 2 is a perspective view of a camera module in accordance with a first preferred embodiment of the present invention.
  • FIG 3 is a schematic exploded view of a camera module according to the first preferred embodiment described above.
  • FIG. 4A is a schematic cross-sectional view of the camera module in the A-A direction according to the first preferred embodiment described above.
  • 4B is a schematic cross-sectional view along the A-A direction of a modified embodiment of the camera module according to the first preferred embodiment.
  • 4C is a schematic cross-sectional view along the A-A direction of another modified embodiment of the camera module according to the first preferred embodiment.
  • 4D is a schematic cross-sectional view along the A-A direction of still another modified embodiment of the camera module according to the first preferred embodiment.
  • FIG. 5A is a schematic view showing a molding and molding of a stamping manufacturing diagram of a camera module according to a preferred embodiment of the present invention.
  • FIG. 5A is a schematic view showing a molding and molding of a stamping manufacturing diagram of a camera module according to a preferred embodiment of the present invention.
  • FIG. 5B is a schematic view showing the molding and molding of the imposition manufacturing diagram of the camera module according to the preferred embodiment of the present invention.
  • Figure 6 is a schematic view showing the stencil making of the molded photosensitive member in accordance with the stencil manufacturing diagram of the camera module shown in the preferred embodiment of the present invention.
  • Figure 7 is a schematic view showing the monomer of the molded photosensitive member obtained by the imposition manufacturing of the camera module according to the preferred embodiment of the present invention.
  • FIG. 8 is a perspective view of an electronic device configured with the camera module provided by the present invention.
  • Figure 9A is an enlarged cross-sectional view, partially in section, of the electronic device at B, as shown in Figure 8.
  • Figure 9B is an enlarged cross-sectional view, partially in section, of a modified embodiment of the electronic device at B in accordance with Figure 8.
  • the term “a” is understood to mean “at least one” or “one or more”, that is, in one embodiment, the number of one element may be one, and in other embodiments, the element The number can be multiple, and the term “a” cannot be construed as limiting the quantity.
  • FIG. 4A is a camera module 1 according to a first preferred embodiment of the present invention, wherein the camera module 1 can be applied to various electronic devices 80, such as but not limited to smart phones.
  • the wearable device, the computer device, the television, the vehicle, the camera, the monitoring device, and the like, the camera module 1 cooperates with the electronic device 80 to implement image acquisition and reproduction of the target object.
  • the camera module 1 includes a molded photosensitive member 10 and an optical lens 20, the optical lens 20 is assembled on the top of the molded photosensitive member 10 and held in a corresponding photosensitive path of the molded photosensitive member 10.
  • the molded photosensitive member 10 includes a molded base 11, a circuit board 13, and a photosensitive member 12, wherein the photosensitive member 12 is electrically connected to a corresponding position of the circuit board 13,
  • the plastic base 11 is integrally molded to the circuit board 13 and the photosensitive member 12 by a molding process so that the molded photosensitive member 10 has an integrated compact structure.
  • the molding base 11 has a light window and a base body 111 forming the light window, the light window provides an optical path for the photosensitive element 12, and the module base is integrally packaged in the circuit The plate 13 and at least a portion of the non-photosensitive area of the photosensitive element 12.
  • the light window is a circumferentially closed annular structure to provide a closed interior environment for the optical lens 20.
  • the circuit board 13 includes a circuit board substrate 131.
  • the circuit board substrate 131 is provided with a chip mounting area 1311 and a peripheral area 1312.
  • the chip mounting area 1311 is correspondingly adapted to mount the photosensitive element. 12.
  • the peripheral region 1312 integrally surrounds the chip mounting region 1311.
  • the circuit board 13 further includes a set of electronic components 132, wherein the electronic components 132 are mounted on the peripheral region 1312 of the substrate, such as by SMT process mounting, etc., and the electronic components 132 include, but are not limited to, resistors. , capacitors, drive devices, etc.
  • the molding base 11 is integrally molded to the photosensitive member 12 and the circuit board 13, and integrally covers the electronic component 132 and the photosensitive member 12.
  • the molded photosensitive member 10 Corresponding to at least a portion of the non-photosensitive area to mold the molded photosensitive member 10, the molded photosensitive member 10 has many advantages by such a preparation.
  • the molded base 11 is integrally formed on the photosensitive member 12 and the circuit board 13, so that the process of forming the molded base 11 is not required as compared with the existing image pickup module 1.
  • a space is reserved between the molded base 11 and the photosensitive member 12, so that the molded base 11 and the molded photosensitive member 10 can be effectively reduced in overall molding size.
  • the board 11 is integrally formed on the photosensitive element 12 and the circuit board 13, that is, compared to the conventional camera module 1, the board is mounted on the circuit board 13.
  • the electronic component 132 can be closer to the photosensitive element 12 because the safety distance between the photosensitive element 12 and the electronic component 132 need not be set during the molding process. That is, in the circuit board 13 provided by the present invention, the laying density of the electronic component 132 can be relatively increased, so that on the one hand, the same number of the circuit board substrates occupied by the electronic component 132 are occupied. The space of the 131 can be relatively reduced. On the other hand, the circuit board 13 of the same area can relatively lay a larger number of the electronic components 132 to meet the imaging hardware requirements of the camera module 1.
  • the molded photosensitive member 10 is integrally molded by a molding process, it has a relatively more compact and more compact size structure, so that the mold is compared with the lens holder of the existing camera module 1.
  • the size of the plastic base 11 is relatively small, so that the optical lens 20 can be assembled to the molded photosensitive member 10 in a "naked lens" mounting manner, and the specific definitions of this portion and the bare lens will be described later. In, further elaborate.
  • the molded base 11 is integrally packaged in the photosensitive member 12 and the circuit board 13, and integrally covers the electronic component 132, thereby preventing dust and debris from being similar to the conventional camera module 1. Adhering to the electronic component 132 contaminates the photosensitive element 12 to affect the imaging effect. At the same time, since the molded base 11 after molding integrally covers the electronic component 132, the electronic components 132 can be isolated by the molded photosensitive component 10 to reduce the electronic component 132. Electromagnetic interference between.
  • the molding material has good thermal conductivity, the heat dissipation effect of the camera module 1 can be improved and the temperature drift can be reduced by the molding base 11 to further improve the The imaging quality of the camera module 1.
  • the electronic device 80 is buried in the substrate, that is, the electronic component 132 may not be exposed, and in this way, the device may be further
  • the molded photosensitive member 10 after molding has a more compact and compact structure. It should be noted that in the preferred implementation of the present invention, since the molded base 11 can completely cover the electronic component 132, the electronic component 132 may not be buried in the substrate. . That is, the substrate is only used to form a conduction line, so that the finally molded molded photosensitive member 10 can have a smaller thickness and a smaller horizontal direction dimension (longitudinal direction and width direction).
  • the electronic component 132 is disposed around the photosensitive element 12, and in different embodiments, the arrangement position of the electronic component 132 can be designed according to requirements. For example, focusing on one side or both sides, the position of the photosensitive element 12 and the subsequent position of the set of leads 14 that conduct the photosensitive element 12 and the circuit board substrate 131 may be matched. The spatial position on the substrate is utilized more rationally, and the size of the camera module 1 is reduced as much as possible.
  • the electronic component 132 is not disposed on one side of the circuit board substrate 131.
  • the edge of the side circuit board substrate 131 and the edge can be effectively reduced.
  • the distance between the photosensitive elements 12 is such that the distance between the camera module 1 and the edge of the electronic device 80 is reduced during the subsequent configuration of the camera module 1 in an electronic device 80. Small, thereby providing for the installation of other components of the electronic device 80, for example, a sufficient installation space is reserved for the display interface of the electronic device 80.
  • the side of the circuit board 13 on which the electronic component 132 is not disposed is defined as a blank side 1313 of the circuit board 13.
  • the electronic component 132 is disposed on at least one of the remaining sides of the blank side 1313 of the circuit board substrate 131.
  • the electronic component 132 may be disposed on the other three sides except the blank side 1313, the other two sides, or concentrated on the blank side of the circuit board 13 except the blank side Either side other than 1313, in such a manner that the blank side 1313 is not disposed with any electronic component 132 for design purposes.
  • the arrangement of the electronic component 132 on the remaining side of the circuit board substrate 131 is not a limitation of the present invention, and only needs to be disposed on at least one side of the circuit board 13.
  • the electronic component 132 is not installed.
  • the electronic component 132 is disposed on the two wing sides 1315 of the circuit board substrate 131, and the blank side 1313 extends between the two wing sides 1315.
  • the electronic component 132 on the circuit board substrate 131 has a relatively symmetric and regular structural arrangement to facilitate the preparation and production process of the molded photosensitive component 10, and the content of this part will be
  • the molding photosensitive member 10 described later is more specifically described in the imposition preparation process.
  • the circuit board substrate 131 may be a PC filter element mount 30 hard board, a PC filter element mount 30 soft board, a soft and hard bond board, a ceramic substrate, or the like.
  • the substrate is a soft and hard bonding board, that is, in the preferred embodiment of the invention, the circuit board substrate 131 has a flexible board connection side 1314 for A connector 1316 is connected to the other end of the board.
  • the other end of the board 1316 is provided with a connector 1317 for conducting the camera module 1 and the electronic device 80 through the connector 1317.
  • the flexible board connection side 1314 is disposed relative to the blank side 1313 of the circuit board substrate 131.
  • the flexible board connection side 1314 can also be disposed on the adjacent side (two-wing side 1315) that intersects the blank side 1313, that is, in the present invention, the soft
  • the arrangement position of the board connecting plate 1316 can be freely selected according to the actual required matching position requirement, and it is only required that the soft board connecting side 1314 is not disposed on the blank side 1313.
  • the flexible board connecting plate 1316 can be implemented in a profiled configuration, that is, the soft board connecting board 1316 has an irregular shape to pass the opposite structure of the soft board connecting board 1316.
  • the connector 1317 connected to the flexible board connecting plate 1316 is extended to a position where the connection port of the electronic device 80 is disposed, and the soft board connecting side 1314 of the circuit board substrate 131 can be made in this manner.
  • the setting position is relatively more free.
  • the photosensitive element 12 is correspondingly mounted on the chip mounting area 1311 of the circuit board substrate 131, for example, but not limited to, an SMT process (Surf circuit board substrate 131ce Mount Technology, surface mount process), or The CO filter element lens holder 30 (the Chip On filter element lens holder 30o circuit board substrate 131rd) is electrically connected to the substrate.
  • SMT process Sudf circuit board substrate 131ce Mount Technology, surface mount process
  • the CO filter element lens holder 30 the Chip On filter element lens holder 30o circuit board substrate 131rd
  • the manner in which the photosensitive element 12 is mounted on the substrate may also be by other means, such as embedding, FC (Flip Chip), etc. It is understood that the manner in which the photosensitive element 12 and the circuit board 13 are connected, and the manner in which they are conducted are not limitations of the present invention.
  • the photosensitive element 12 is electrically connected to the substrate through a set of leads 14, wherein the lead 14 extends over the corresponding connection end of the circuit board substrate 131 and the photosensitive element 12. Between and after the molding base 11 is molded, the lead 14 is embedded by the molding base 11 such that the lead 14 and the photosensitive member 12 and the circuit board substrate 131 The connection between the two is more stable.
  • the lead wires 14 include, but are not limited to, gold wires, silver wires, copper wires, aluminum wires or alloy wires (copper aluminum alloy wires) and the like.
  • the lead 14 is not disposed on the blank side 1313 of the circuit board substrate 131, so that the distance between the edge of the blank side 1313 and the photosensitive element 12 can be further reduced, so that the The camera module 1 is mounted in an electronic device 80.
  • the blank side 1313 of the circuit board substrate 131 is disposed adjacent to an edge of the electronic device 80, so that the camera module 1 is closer to the edge of the electronic device 80 as a whole. In this manner, a much wider space is reserved for the installation of other components of the electronic device 80.
  • the camera module 1 is assembled as a front camera of a smart phone to the smart phone, through the blank side 1313 of the circuit board and the arrangement of the leads 14. Providing a wider installation space for the display screen of the smart phone, thereby expanding the display screen of the smart phone without changing the surface size of the smart phone, thereby improving the "screen ratio".
  • the lead wires 14 are disposed on the remaining side of the blank side 1313 of the circuit board substrate 131, that is, in the present invention, the lead wires 14 can be concentrated Provided on any other side of the blank side 1313 of the circuit board substrate 131, or on the other side except the blank side 1313 of the circuit board substrate 131, or in addition to the circuit board All other remaining sides of the blank side 1313 of the substrate 131.
  • the lead wires 14 are disposed on the two wing sides 1315 of the circuit board substrate 131 such that the circuit board 13 has a more regular and symmetrical structure to facilitate
  • the execution of the imposition preparation process of the molded photosensitive member 10 is similarly described in more detail in the preparation process of the molded photosensitive member 10 to be subsequently referred to.
  • the circuit board substrate 131 has a flat plate shape, and the photosensitive element 12 is attached to the top surface of the circuit board substrate 131.
  • the circuit board substrate 131 may have an inner recess 112, and the photosensitive element 12 is received in the inner recess 112 to reduce the photosensitive element 12 from protruding from the circuit.
  • the circuit board substrate 131 may have a through hole communicating with both sides of the circuit board substrate 131, and the photosensitive element 12 is received in the through hole, so that the photosensitive element 12
  • the relative position of the circuit board substrate 131 is adjustable.
  • the circuit board substrate 131 may have a via, the via is a stepped structure, and the photosensitive element 12 is mounted on the via by flip chip mounting.
  • the circuit board substrate 131 may have a reinforcing hole that extends into the reinforcing hole to enhance the structural strength of the integrated base assembly.
  • the circuit board substrate 131 includes a backing plate that is laminated on the bottom of the circuit board substrate 131 to enhance the structural strength of the molded photosensitive member 10 and For heat dissipation performance, the backing plate is exemplified by, but not limited to, a metal plate.
  • the molded photosensitive member 10 includes an electromagnetic shielding layer, and the shielding layer is wrapped around the outer base or around the inner side to enhance the electromagnetic interference resistance of the camera module 1. ability.
  • the circuit board 13 may have various other variations to increase or enhance the different performance of the integrated base assembly, as will be understood by those skilled in the art. The structural deformation of the plate 13 is not a limitation of the present invention.
  • the molding base 11 is integrally formed on the circuit board 13 and the photosensitive member 12 such that the molded base is compared to the lens holder of the existing camera module 1.
  • 11 has a relatively smaller size, especially in the length direction and the width direction, so that the optical lens 20 provided by the present invention can be directly mounted on the molding base without additionally providing a fixed lens barrel.
  • the released space provides installation space for the components of other electronic devices 80.
  • the optical lens 20 includes a barrel unit 21 and a set of optical lenses 22, based on the optical system design of the optical lens 20, the optical lens 22 is A certain order is assembled to the barrel unit 21 to form the optical lens 20.
  • the optical lens 20 can be directly assembled on the top of the molded base 11 without providing an additional fixed lens barrel, that is, in the present
  • the barrel unit 21 of the optical lens 20 may completely span the light window corresponding to the molding base 11 to pass through the barrel unit 21
  • the optical lens 20 is supported on the top of the molded base 11.
  • the optical lens 20 of the camera module 1 is directly assembled on the top of the molding base 11, and the size of the optical lens 20 is smaller than the molding base.
  • the top of the seat 11 is sized to form an extension space 23 between the optical lens 20 and the molded base 11.
  • the extension space 23 provides additional installation space for the installation of components of other electronic devices 80.
  • the camera module 1 is assembled as a front camera of a smart phone to a smart phone, and the display screen of the smart phone can further extend into the extended space 23 so as not to change the surface size of the smart phone.
  • the display screen of the smartphone can be further expanded to improve the "screen ratio".
  • the barrel unit 21 further has a step portion extending inward along an optical axis direction defined by the optical lens 20 to further expand the extension space 23 through the step portion. That is, in the process of assembling the camera module 1 to the smart phone, the display screen of the smart phone can further extend to the shoulder of the step portion of the lens barrel unit 21, in such a manner. The display of the smart phone can be further extended to improve the "screen ratio".
  • the optical lens 20 can be an integrated optical lens 20 or implemented as a split optical lens 20, wherein when the optical lens 20 is implemented as a split type
  • the optical lens 20 includes at least two lens units that are fitted to each other to mold the optical lens 20.
  • the camera module 1 further includes a filter element 40, and the filter element 40 is disposed on the optical lens 20 and the mold. Between the photosensitive photosensitive members 10, light passing through the optical lens 20 is filtered by the filter element 40. More specifically, the filter element 40 is disposed on the molding base 11 and located in a light propagation path formed by the photosensitive element 12 and the optical lens 20, so that the filter element 40 can be passed through the filter element 40. Filters light in the light that affects the image quality, such as light in the infrared.
  • the filter element 40 is exemplified by, but not limited to, an infrared filter, a blue glass filter, a wafer level infrared cut filter, a full transparency, and a visible light filter.
  • a top surface of the molded base 11 is provided with a recess 112, and the filter element 40 is received in the recess 112. The distance between the filter element 40 and the photosensitive element 12 is reduced to fully exert the optical effect of the filter element 40.
  • the filter element 40 such as a blue glass filter
  • the camera module 1 further includes a filter element lens holder 30, and the filter element 40 is mounted on the filter element lens holder 30, the filter The component mirror mount 30 is assembled on top of the molded base 11 to provide a suitable mounting position for the filter element 40 through the filter element mount 30 to achieve protection of the filter element 40. purpose.
  • the molding base 11 is manufactured by a molding process such as an injection molding or molding process, and the filter element lens holder 30 is not limited in material. As long as there is sufficient strength to mount the filter element 40.
  • the filter element holder 30 and the molding base 11 can be manufactured by different manufacturing processes, such as the injection molding process to form the filter element holder 30, and by transfer molding.
  • the molded base 11 can thus be made of different materials such that the filter element holder 30 and the molded base 11 have different hardnesses, and the surface flexibility is different, for example, the filter element can be made
  • the mirror mount 30 has better flexibility to be mounted to the filter when the filter element 40 is mounted to the filter element mount 30 with respect to being mounted to the molded base 11.
  • the light element mirror holder 30 is subjected to less stress, so that the filter element 40 is more suitably mounted, so that the filter element 40 is damaged or chipped. That is, the filter element holder 30 relieves external stresses that the filter element 40 may be subjected to, such as stresses that are directly applied to the molded base 11.
  • the top surface of the molded base 11 extends in a planar manner.
  • the molded base 11 forms a platform structure without stepped projections, and the filter element holder 30 is mounted on the platform structure. It is worth mentioning that, in this manner, The top surface of the molded base 11 extends in a plane without significant bending angle, so that a more flat, burr-free mounting surface can be obtained during molding, as the filter element holder
  • the mounting of the optical lens 20 and the optical lens 20 provides flat mounting conditions.
  • the filter element holder 30 has a size corresponding to the top surface of the molded base 11 and is attached to the top surface of the molded base 11 in an overlapping manner.
  • the optical lens 20 to be subsequently mounted is supported by the filter element holder 30 instead of the molded base 11.
  • the filter element holder 30 has a support groove 31, wherein the support groove 31 is recessedly formed in an intermediate portion of the filter element holder 30, and the support groove 31 is correspondingly connected to the light. a window and for mounting the filter element 40. It is worth mentioning that when the filter element 40 is received in the support slot 31, the relative height between the filter element holder 30 and the filter element 40 is lowered, so that the filter The element 40 does not protrude or less protrudes from the filter element holder 30, so that the height dimension of the finally formed camera module 1 is reduced.
  • FIG. 4B is a schematic view showing another mounting manner of the filter element holder 30, wherein the top of the molding base 11 is provided with a receiving groove, and the receiving groove is recessedly formed on the molding base.
  • the top of the 11 has a size matching the filter element holder 30 so as to fitably fit the filter element holder 30 therein, in such a manner that the molded photosensitive member can be further reduced
  • the filter element lens holder 30 has a height dimension corresponding to the receiving groove, so that when the filter element lens holder 30 is mounted to the receiving groove, the molding base
  • the top surface of the seat 11 is engaged with the top surface of the filter element 40 such that the molded base 11 and the filter element holder 30 are both raised support surfaces for subsequent mounting of the optical lens 20.
  • the optical lens 20 to be subsequently mounted may be supported only by the molding base 11, or the optical lens 20 may be partially supported by the molding base 11, partially supported by the filter.
  • the light element mirror mount 30 is supported only by the filter element mirror mount 30, so that the size and mounting position of the optical lens 20 can have more selection space.
  • the filter element holder 30 is further provided with a limiting protrusion 32 from the top of the filter element holder 30.
  • the face extends at least partially upwardly to facilitate positioning and guiding the mounting of the optical lens 20, and can block dust or light from entering the interior of the camera module 1 after assembly is completed.
  • the position of the positioning protrusion at the filter element 40 can be designed according to the size of the optical lens 20 such that when the optical lens 20 is attached to the molding
  • the limiting protrusions 32 can assist the alignment, facilitate the execution of the mounting operation, and prevent the glue required to mount the optical lens 20 during the application of the optical lens 20 by glue. Overflow to the interior and contamination of the lens or internal components.
  • the limiting protrusion 32 may be an annular protrusion to position the optical lens 20 as a whole. It should be noted that in other embodiments of the present invention, the surface of the limiting protrusion 32 may be provided with a thread to facilitate direct mounting of the optical lens 20, and when the outer side of the limiting protrusion 32 is provided with a thread.
  • the optical lens 20 is adapted to a larger aperture.
  • the limiting protrusion 32 can also be formed at a corresponding position of the molding base 11 to limit the guiding of the optical installation.
  • the lens 20, wherein the limiting protrusion 32 may be integrally formed on the top of the molding base 11, for example, by a secondary molding process or the like, or the limiting protrusion 32 is a separate component and assembled in the same
  • the corresponding position of the molded base 11 is described, for example, by gluing.
  • FIG. 5A to FIG. 7 are schematic views showing the preparation of a molded photosensitive member of the camera module 1, wherein the molded photosensitive member 10 is mass-produced, thereby molding the photosensitive member 10 and the The preparation efficiency of the camera module 1 is greatly improved.
  • a circuit board imposition 200 is provided, wherein the circuit board imposition 200 includes a circuit board substrate 131, and the circuit board substrate 131 is provided with at least two chip mounting areas 1311, and each of the chip mounting areas.
  • the photosensitive member 12 is attached to 1311, respectively.
  • the circuit board imposition 200 is integrally formed by two serial circuit boards 13 and a set of soft board connection boards 1316 are respectively disposed on both sides of the circuit board imposition 200.
  • the circuit board imposition 200 further includes a series of electronic components 132, wherein the electronic component 132 is not disposed on one side of the circuit board substrate 131.
  • the electronic device is not disposed.
  • the side of the circuit board 13 of the component 132 is a blank side 1313 of the circuit board 13.
  • the blank side 1313 of the circuit board 13 is correspondingly disposed on the intermediate intersecting side of the two column circuit boards 13, and the electronic component 132 is disposed in addition to the At least one of the remaining sides of the blank side 1313 of the circuit board substrate 131.
  • the electronic component 132 is disposed on the two wing sides 1315 of the circuit board substrate 131, and the blank side 1313 extends between the two wing sides 1315 such that
  • the electronic component 132 on the circuit board substrate 131 has a relatively symmetrical structural arrangement to facilitate the preparation and production process of the molded photosensitive component 10.
  • the photosensitive element 12 is electrically connected to the circuit board substrate 131 through a set of leads 14, wherein the leads 14 are disposed on the remaining side of the blank side 1313 of the circuit board substrate 131, that is,
  • the lead wires 14 may be collectively disposed on any other side of the blank side 1313 of the circuit board substrate 131 or on the blank side except the circuit board substrate 131.
  • the other sides of 1313 are disposed on all other remaining sides of the blank side 1313 other than the circuit board substrate 131.
  • the leads 14 are also disposed on the two wing sides 1315 of the circuit board substrate 131.
  • the circuit board imposition 200 with the photosensitive elements 12 is placed in a molding. Forming a molding cavity of the molding die 100, and molding a molding pedestal 300 to the photosensitive member 12 and the circuit board substrate 131 after molding, wherein the molding base 11 is integrally wrapped At least a portion of the photosensitive element 12 and the electronic component 132 formed on the circuit board imposition 200.
  • the molded base stencil 300 is further cut to form a plurality of the molded photosensitive member 10 monomers at a time.
  • the blank side 1313 of the circuit board substrate 131 is not provided with the electronic component 132 and the lead 14 so as to be in the process of cutting the molded base imposition 300.
  • the gap between the edge of the blank side 1313 and the photosensitive element 12 can be minimized to Subsequent assembly into an electronic device 80 is closer to the edge of the electronic device 80, thereby providing greater mounting space for other components of the electronic device 80.
  • the cutting side 101 corresponds to the side of the camera module 1 adjacent to the edge of the electronic device 80, and passes through In this manner, the distance between the camera module 1 and the edge of the electronic device 80 is reduced to provide a larger installation space for other components of the electronic device 80, such as a display screen.
  • the filter element 40 is assembled to the filter element holder 30, and the filter element holder 30 is assembled at a corresponding position on the top of the molded base 11. It is worth mentioning that in the preparation process of the camera module 1 of the present invention, the installation sequence between the filter element 40 and the filter element 40 can be adjusted, for example, in some embodiments of the present invention.
  • the filter element 40 may be first assembled to the filter element holder 30, and the filter element holder 30 may be correspondingly assembled to a corresponding position on the top of the molded base 11.
  • the filter element holder 30 may be first mounted to a corresponding position on the top of the molded base 11, and the filter element 40 may be correspondingly attached to the filter.
  • the support groove 31 formed by the photo element mirror holder 30 is not a limitation of the present invention. It should be noted that in other embodiments of the present invention, the filter element 40 can also be directly assembled into a corresponding mounting slot at the top of the molded base 11, that is, in the present invention. In other embodiments, the filter element mount 30 may not be required.
  • the optical lens 20 is assembled on the top of the molded base and held in the photosensitive path of the molded photosensitive member 10. More specifically, in the image forming process of the camera module provided by the present invention, the optical lens 20 is directly assembled on the top of the molded base 11 without providing an additional fixed lens barrel. It is worth mentioning that the size of the optical lens 20 is smaller than the size of the top of the molded base 11, so that an extension space 23 is formed between the optical lens 20 and the molded base 11 to During the assembly of the camera module 1 in an electronic device 80, the extension space 23 provides additional installation space for the installation of components of other electronic devices 80.
  • the camera module 1 is assembled as a front camera of a smart phone to a smart phone, and the display screen of the smart phone can further extend into the extended space 23 so as not to change the surface size of the smart phone.
  • the display screen of the smartphone can be further expanded to improve the "screen ratio".
  • the optical lens 20 can be an integrated optical lens 20 or implemented as a split optical lens 20, wherein when the optical lens 20 is implemented as a split type
  • the optical lens 20 includes at least two lens units that are fitted to each other to mold the optical lens 20. That is, when the optical lens 20 is implemented as a split optical lens 20, the manufacturing process of the present invention may further include a process of assembling the lens units of the split optical lens 20 to each other.
  • the present invention further provides a method for preparing a camera module 1 , wherein the method includes the following steps:
  • At least one photosensitive element is correspondingly assembled to a corresponding mounting area of the circuit board imposition.
  • a molding base imposition is formed by a molding process
  • an electronic device 80 is assembled with the camera module 1 provided by the present invention, wherein the electronic device 80 is exemplified by, but not limited to, a smart phone, a wearable device, a computer device, and a television.
  • the vehicle module 1 cooperates with the electronic device 80 to realize image acquisition and reproduction of a target object.
  • the electronic device 80 is exemplified as a smart phone.
  • the smart phone is only an example.
  • the type of the electronic device 80 is not a limitation of the present invention.
  • the smart phone includes a device body 81 and at least a certain focus camera module 1 assembled to the device body 81, wherein the fixed focus camera module 1 serves as a front camera of the smart phone.
  • a touch screen 811 of the device body 81 is assembled on the same side of the device body 81, that is, in the smart phone, the touch screen 811 and the camera module 1 share the smart phone.
  • the same side area, thereby adjusting the body shape of the camera module 1 and related structural parameters, can free up more space for the purpose of expanding the touch screen 811.
  • the fixed focus camera module 1 includes a circuit board 13, a photosensitive element 12, the photosensitive element 12 is operatively coupled to the circuit board 13, an optical lens 20, and a molding base. a seat 11, wherein the molded base 11 is integrally molded on the circuit board 13 and the photosensitive member 12, and the molded base 11 forms a light window to provide light passage for the photosensitive member 12.
  • the optical lens 20 is directly assembled to the top end of the molding base 11 so that it is not necessary to fix the lens barrel such that the top end of the molding base 11 does not need to provide an area for supporting the fixed lens barrel, so that The space of the fixed barrel is released, so that in the present example, the touch screen 811 can be provided with an expanded space for the purpose of increasing the screen ratio of the smartphone.
  • the circuit board 13 includes a circuit board substrate 131 and a plurality of electronic components 132 disposed on the circuit board substrate, wherein the fixed focus camera module 1 is assembled adjacent to the device body 81.
  • the position of the edge, and the electronic component 132 is not disposed on the side of the circuit board 13 adjacent to the edge of the device body 81, so that the fixed focus camera module 1 and the top edge of the device body 81 The distance is reduced, and in this way, the touch screen 811 of the smartphone can be further provided with a larger expansion space. That is, in the present invention, the electronic component 132 is disposed on at least one side of the remaining side except the side adjacent to the top end of the apparatus main body 81.
  • circuit board 13 and the photosensitive member 12 are electrically connected by a set of leads 14, and are not adjacent to the top end of the apparatus main body 81 in the length direction of the apparatus main body 81.
  • the lead wires 14 are arranged in such a manner that the distance of the camera module 1 at the edge of the device body 81 can be further reduced, so that the touch screen 811 of the smart phone can be further provided with a larger The expansion space.
  • the molding base 11 integrally formed on the circuit board 13 and the photosensitive member 12 is cut from the continuous molding base 11 produced in a panel process, and The side adjacent to the edge of the apparatus body 81 corresponds to one of the cutting sides 101.
  • the fixed focus camera module 1 further includes at least one filter element 40, wherein the filter element 40 is disposed on the molding base 11, and the filter element 40 is held in the Between the optical lens 20 and the photosensitive element 12.
  • the molded base 11 has at least one groove 112 on its top side, and the filter element 40 is assembled to the groove 112.
  • the camera module 1 further includes a filter element lens holder 30. The filter element 40 is assembled to the filter element 40, and the filter element lens holder 30 is The top side of the molded base 11 is assembled at a corresponding position to allow light transmitted through the optical lens 20 to be filtered by the filter element 40 to reach the photosensitive element 12.
  • the optical lens 20 is directly assembled on the top of the molded base 11, and the size of the optical lens 20 is smaller than the size of the top of the molded base 11 to An extension space 23 is formed between the optical lens 20 and the molded base 11.
  • the touch screen 811 of the smart phone can further extend into the extension space 23, so that the surface size of the smart phone can be changed without changing the surface size of the smart phone. Further expanding the display screen of the smart phone and improving the "screen ratio".
  • the barrel unit 21 further has a step portion extending inward along an optical axis direction defined by the optical lens 20 to further expand the extension through the step portion.
  • Space 23 that is, in the process of assembling the camera module 1 to the smart phone, the touch screen 811 of the smart phone can further extend to the shoulder of the step portion of the lens barrel unit 21, by using The way to further expand the display of the smart phone and improve the "screen ratio" purpose,
  • the optical lens 20 may be an integral lens or a split lens, which includes at least two lens units, which are assembled in cooperation with each other to form the optical lens 20,
  • the type of the optical lens 20 is not limited.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Lens Barrels (AREA)
  • Blocking Light For Cameras (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中，所述定焦摄像模组包括一电路板；一感光元件，所述感光元件可导通地连接于所述电路板；一模塑基座，其中，所述模塑基座一体成型于所述电路板和所述感光元件，并且，所述模塑基座形成一光窗，以通过所述光窗为所述感光芯片提供光线通路；以及一光学镜头，其中，所述光学镜头被支持于所述模塑基座，并对应于所述模塑基座形成的所述光窗，其中，所述电路板包括一电路板基板和至少一电子元器件，其中，所述至少一电子元器件电连接于所述电路板基板，其中，所述电路板基板具有一空白侧，其中，在所述电路板基板的所述空白侧没有设置所述至少一电子元器件。

Description

摄像模组和具有摄像模组的电子设备及摄像模组制备方法 技术领域
本发明涉及摄像模组领域，更进一步，涉及一摄像模组和具有摄像模组的电子设备及摄像模组制备方法
背景技术
随着科技的发展，电子产品、智能设备产生了突飞猛进的发展，主流趋势在于：电子设备日益趋向轻薄化发展的同时，对于其综合性能和用户体验要求也在不断更新迭代。作为电子产品、智能设备的不可或缺的部件之一的摄像模组，对其也越来越要求多功能化、轻薄化、小型化，以适应电子设备、智能产品的发展趋势。
更具体地说，当下电子产品，例如智能手机，朝着薄型化的方向发展，在此技术潮流中，压缩摄像模组的高度尺寸(厚度尺寸)，使其能够被完全地收容于电子产品主体的内腔中，是摄像模组结构尺寸设计过程中所需考虑的必要因素之一。然而，本领域的技术人员应知晓，高成像质量、高性能的摄像模组，意味着更多的摄像模组元器件数量，以及更大的元器件尺寸，这必然会使得组装之后的摄像模组具有较大的体型，无法适应当下电子设备的发展趋势。
另一方面，在电子设备，例如智能手机，的用户体验中，拥有更大的屏幕会带来诸多用户体验的友好感。大屏幕意味着有更大的视频图像呈现空间，其赋予消费者更宽阔的视野，举例来说，当使用者在体验手机应用端游戏时，大屏幕的操作体验无疑在智能设备硬件方面带来巨大的体验优势。然而，智能设备的屏幕却不能随意扩张，过大的手机屏幕会增加手机整体的尺寸，进而影响携带和单手操作。也就是说，在维持现有的电子产品，例如智能手机，的整体尺寸相对不发生改变的情况下，提高其屏占比，即提高屏幕占据智能设备边框所围成的面积的比例，是电子产品满足消费者体验的优选技术手段。
然而，在满足提高电子设备屏占比的前提下，位于屏幕同一侧的无法移除的 电子元器件，其体型需尽量小型化，只有这样，方能为扩展屏幕所占的比例预留充分的空间。举例来说，对于某些智能手机而言，前置摄像模组为不可移除的核心电子元器件，因此在提高智能手机屏占比的过程中，需压缩前置摄像模组的体型，方能满足为该电子设备的显示屏的尺寸扩展提供空间。
如图1所示的是相对较大尺寸封装的定焦摄像模组，其包括一电路板2，一感光芯片3，一镜座1，以及一光学镜头6。该电路板2包括一系列安装于其上的多个电子元器件5，其中该感光芯片3通过COB(Chip On Board)方式可导通地贴装于所述电路板2的该基板对应的芯片贴装区域，例如通过打金线的方式。传统的镜座，是镜座1安装于线路板2，并与电子元器件5和感光芯片3及其金线都要留有安全距离，并且是镜座1、电子元器件5、感光芯片3相互之间都要留有安全距离。而对于MOB摄像模组而言，是需要给感光芯片和镜座之间留有安全距离。该镜座1安装于该电路板2基板的周边非工作区并与组装于该电路板2基板的电子元器件5之间设有一定的安全距离，以防止镜座1与电子元器件5之间发生触碰。进一步地，该光学镜头6组装于该镜座1的顶部并使其保持于感光元件的对应感光路径上。由于现有摄像模组的COB封装工艺的局限，最终制得的摄像模组的整体尺寸难以到达要求。
举例来说，在将镜座1贴装于该电路板2的基板时，需在水平面方向上和高度方向上，同时为组装于电路板2的电子元器件5预留安全空间，以使得组装而成的该摄像模组的厚度尺寸相对较大。其次，由于在水平面方向上需预留安全空间，导致电路板2需往两侧额外延伸一段距离。也就是说，由于水平面方向上需预留安全空间，从而该电路板2的长宽尺寸都需加长，以满足组装设计要求。从另一角度来说，在现有的摄像模组中，该电路元器件于该电路板2的安装密集程度较低，即该电子元器件5在该电路板2上的空间利用率较低。
进一步地，传统的摄像模组的光学镜头6包括一内镜筒62，该内镜筒62用于将一组光学镜片63按照一定次序固定于该内镜筒62的内周壁，并且该光学镜头6通常包括一固定镜筒61，该固定镜筒61同轴地设置于该内镜筒62的外侧，以通过该固定镜筒61将该光学镜头6固定于该镜座1的顶部。本领域的技术人员应知晓，在现有的摄像模组中，镜座1所形成的光窗开口较大，在没有设有该固定镜筒61的情况下，该光学镜头6无法通过自身的宽度组装于 所该座的顶部。换句话说，在现有的摄像模组中，该固定镜筒61的作用相当于一架梁，以在该镜座1和该光学镜头6之间搭建实现安装，其并未对摄像模组的光学性能产生实质性的影响。然而，随着电子设备、智能设备的轻薄化发展，该电路板2，该镜座1都会在尺寸上得到相应的缩减，以使得在光学镜头6和该镜座1之间不再需要该固定镜筒61，在这种情况下，该固定镜筒61会占用多余的空间，反而会影响该摄像模组的最终成型尺寸。
发明内容
本发明的一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中所述光学镜头被直接组装于所述模塑基座的顶端，而不需要额外的固定镜筒，从而相较于现有的摄像模组，固定镜筒所占据的空间被释放，以利于进一步缩小所述摄像模组的尺寸。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中所述摄像模组的模塑基座一体模塑成型于所述电路板和所述感光元件，从而所述摄像模组具有更为紧凑，且小型的结构。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中所述摄像模组的模塑基座通过模塑工艺一体成型并包覆贴装于电路板的所述电子元器件，以使得在所述摄像模组封装的过程中，无需再为电子元器件预留安全空间，从而所述电路板的长度尺寸和宽度尺寸被缩减，且所述电子元器件相对于所述电路板的空间利用率和密集程度得以提升。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中所述模塑基座一体地成型于所述电路板并包覆位于所述电路板的所述电子元器件，，以使得所述电子元器件之间相互隔离，通过这样的方式有效地避免所述电子元器件在工作过程中相互之间发生干扰。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中当所述摄像模组配置于一电子设备时，所述电路板的位于电子设备边缘的那一侧没有设置所述电子元器件，通过这样的方式，以使得所述摄像模组与该电子设备的的边缘之间的距离被减小，从而为该电子设备的其他部件的安装预留充分的空间。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中当所述摄像模组配置于一电子设备时，所述电路板的位于电子设备边缘的那一侧没有设置所述电子元器件，通过这样的方式，以使得所述摄像模组与该电子设备的的边缘之间的距离被减小，相同尺寸芯片能够更加靠近屏幕边缘。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中贴靠于电子设备边缘的电路板对应侧没有设置所述电子元器件，基于此种结构配置，有利于所述摄像模组的拼版制备工艺的模塑基座拼版切割工艺的执行。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中沿电子设备长度方向上，所述感光元件在邻近电子设备的边缘的那一侧没有布置所述电子元器件，通过这样的方式，减少所述摄像模组与所述电子设备在电子设备长度方向上的距离，从而为该电子设备的其他部件的安装预留充分的空间，比如电子设备的触摸屏。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中沿电子设备宽度方向上，所述感光元件在邻近电子设备的边缘的那一侧没有布置所述电子元器件，通过这样的方式，减少所述摄像模组与所述电子设备在电子设备宽度方向上的距离，从而为该电子设备的其他部件的安装预留充分的空间，比如电子设备的触摸屏。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中所述电路板和所述感光元件通过一组引线可导通地连接，并且于所述电路板邻近电子设备的一侧没有布置所述引线，通过这样的方式，进一步地减少所述所述摄像模组与该电子设备的的边缘之间的距离，从而为该电子设备的其他部件提供更大的组装空间，比如电子设备的显示屏。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中所述电路板的邻近于该电子设备边缘的那侧没有设置引线，从而在所述摄像模组的拼版切割工艺中，无需担心所述引线会被切割，也就会说，通过这样的结构布置，进一步地优化了所述摄像模组的拼版制备工艺，有利于提高生产效率，降低生产成本。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中一体成型于所述电路板和所述感光元件的所述模塑基座从一拼版工艺中制得的模塑基座拼版切割得到，并且在临近该电子设备的边缘的那侧对应于其中一拼版切割侧，通过这样的方式，使得临近该电子设备的边缘电路板那侧与所述感光元件之间的距离，可通过调整所述切割侧于所述模组基座拼版的位置以进行调整。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中所述摄像模组的所述光学镜头直接地组装于所述模塑基座的顶部，并且所述光学镜头的尺寸小于所述模塑基座的尺寸，以在所述光学镜头和所述模塑基座之间形成一延伸空间，从而为该电子设备的其他部件的安装，例如显示屏，提供更大的安装空间。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中所述光学镜头包括一镜筒单元，所述镜筒单元设有一台阶部，所述台阶部朝向所述光学镜头光轴往内延伸，以通过所述台阶部进一步地扩展所述光学镜头和模塑基座之间的延伸空间，从而为该电子设备的其他部件的安装提供更广阔的向内延伸空间。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中所述摄像模组包括一滤光元件镜座，所述滤光元件镜座和所述摄像模组的所述模塑基座相配合，为所述滤光元件提供支撑。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中所述滤光元件不需要直接安装于所述摄像模组的所述模塑基座，且所述滤光元件镜座具有一支撑槽，所述支撑槽具有较小于所述模塑基座的所述光窗的尺寸，通过这样的方式，能有效减少所述滤光元件所需面积。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中通过所述滤光元件镜座缓解所述滤光元件被直接安装于所述模塑基座时的应力作用，以保护所述滤光元件。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中所述滤光元件镜座具有一支撑槽，所述滤光元件被安装所述滤光元件的支撑槽，从而使得所述滤光元件位置相对下沉。
本发明的另一发明目的在于提供一摄像模组和具有摄像模组的电子设备及摄像模组制备方法，其中所述滤光元件包括一限位凸起，所述限位凸起约束，限位所述摄像模组的所述光学镜头，以优化所述摄像模组的组装过程并通过所述限位凸起使得所述光学镜头与所述感光元件的光轴一致。
为了实现本发明的以上至少一目的，本发明的一方面提供一定焦摄像模组，其适于组装于一电子设备，其中定焦摄像模组包括：
至少一电路板；
至少一感光元件，其可工作地连接于所述电路板；
至少一光学镜头；以及
至少一模塑基座，其中所述模塑基座一体模塑成型于所述电路板和所述感光元件，并且所述模塑基座形成一光窗，以为所述感光元件提供光线通路，其中所述光学镜头被直接组装于所述模塑基座的顶端从而不需要固定镜筒以使所述模塑基座顶端不需要提供支撑该固定镜筒的面积，其中所述电路板包括一基板和设置于所述基板的多个电子元器件，其中所述定焦摄像模组适于组装于邻近该电子设备的边缘位置，并且所述电路板在邻近该电子设备的边缘的那一侧没有布置所述电子元器件，以使所述定焦摄像模组与该电子设备的顶端边缘的距离减小。
根据本发明的一实施例，其中所述电路板还包括一软板连接板和一连接器，其中所述连接器连接于所述软板连接板，所述软板连接板可导通地连接于所述电路板的没有布置所述电子元件器的相对侧。
根据本发明的一实施例，其中所述电路板具有一软板连接侧，所述软板连接侧设有一软板连接板，所述软板连接板的另一端设有一连接器，其中所述软板连接侧相对所述电路板邻近该电子设备的边缘的那一侧设置。
根据本发明的一实施例，其中在沿所述电子设备长度方向上，所述电路板在邻近该电子设备的边缘的那一侧没有布置所述电子元器件。
根据本发明的一实施例，其中在沿所述电子设备的宽度方向上，所述电路板在邻近该电子设备的边缘的那一侧没有布置所述电子元器件。
根据本发明的一实施例，其中所述电子元器件被布置在除了邻近该电子设备的顶端的那一侧的剩余侧面的至少一侧。
根据本发明的一实施例，其中所述电路板和所述感光元件通过一组引线可导 通地连接，并且于邻近该电子设备的顶端的那一侧没有布置所述引线。
根据本发明的一实施例，其中所述电路板和所述感光元件通过一组引线可导通地连接，并且于邻近该电子设备的顶端的那一侧没有布置所述引线，其中所述引线被布置在除了邻近该电子设备的顶端的那一侧的剩余侧面的至少两侧。
根据本发明的一实施例，其中所述摄像模组还包括一滤光元件，其中所述滤光元件被设置于并被保持于所述光学镜头和所述感光元件之间。
根据本发明的一实施例，其中所述摄像模组还包括一滤光元件，其中所述滤光元件被设置并保持于所述光学镜头和所述感光元件之间，以使得所述滤光元件对齐于感光路径，从而透过所述光学镜头的光线被所述滤光元件过滤后到达所述感光元件。
根据本发明的一实施例，其中所述模塑基座顶层具有至少一凹槽，所述滤光元件被组装于所述凹槽。
根据本发明的一实施例，其中所述摄像模组还包括一滤光元件镜座，其中所述滤光元件组装于所述滤光元件镜座，所述滤光元件镜座被组装于所述模塑基座的顶层，以允许透过所述光学镜头的光线经所述滤光元件过滤后到达所述感光元件。
根据本发明的一实施例，其中所述光学镜头只被所述模塑基座支撑，或所述光学镜头部分地支持于所述模塑基座，部分地支持于所述滤光元件镜座。
根据本发明的一实施例，其中所述摄像模组的所述光学镜头被直接地组装于所述模塑基座的顶部，并且所述光学镜头的尺寸小于所述模塑基座顶部的尺寸，以在所述光学镜头和所述模塑基座之间形成一延伸空间。
根据本发明的一实施例，其中所述光学镜头可被实施为一整体的镜头，或者是分体式镜头，其包括至少两镜头单元，所述镜单元相互配合的组装。
根据本发明的一实施例，其中所述光学镜头包括一镜筒，所述镜筒用于固定一组光学镜片于其中，其中所述镜筒设有一台阶部，所述台阶部朝向所述光学镜头的光轴方向往内延伸，以通过所述台阶部进一步地扩展所述光学镜头和模塑基座之间的所述延伸空间。
根据本发明的另一方面，本发明还提供一摄像模组的拼版制备方法，其中所述制备方法，包括：
将至少一感光元件分别对应地组装于所述电路板拼版的对应贴装区域。
将所述带有感光元件的电路板拼版放置于一成型模具之后，通过模塑工艺成型一模塑基座拼版；
切割所述模塑基座拼版，以形成模塑感光组件单体；以及
将光学镜头直接组装于所述模塑基座的顶部，以成型所述摄像模组；
根据本发明的一实施例，其中在贴装所述感光元件的步骤中，所述电路板拼版包括一基板设有至少二芯片贴装区域和一组电子元器件，其中所述基板具有一软板连接侧供以连接一软板连接板，并且所述电子元器件布置于除了所述基板的所述软板连接侧的相对侧的剩余侧面的至少一侧
根据本发明的一实施例，其中在切割所述模组基座拼版的步骤中，所述电流板基板的相对的切割侧在后续的将所述摄像模组组装于一电子设备的过程中，对应于邻近电子设备边缘的那一侧。
附图说明
图1是现有COB封装的摄像模组横剖面示意图。
图2是根据本发明的第一个优选实施例的摄像模组的立体示意图。
图3是根据上述第一优选实施例的摄像模组的爆炸示意图。
图4A是根据上述第一优选实施例的摄像模组沿A-A方向的横剖面示意图。
图4B是根据上述第一优选实施例的摄像模组的一变形实施例的沿A-A方向的横剖面示意图。
图4C是根据上述第一优选实施例的摄像模组的另一变形实施例的沿A-A方向的横剖面示意图。
图4D是根据上述第一优选实施例的摄像模组的又一变形实施例的沿A-A方向的横剖面示意图。
图5A是依据本发明的优选实施例所示的摄像模组的拼版制造示意图之成型模塑合模示意图。
图5B是依据本发明的优选实施例所示的摄像模组的拼版制造示意图之成型模塑拔模示意图。
图6是依据本发明的优选实施例所示的摄像模组的拼版制造示意图之切割 所述模塑感光组件拼版示意图。
图7是依据本发明的优选实施例所示的摄像模组的拼版制造示意图之获得模塑感光组件单体示意图。
图8是配置有本发明所提供的摄像模组的一电子设备立体示意图。
图9A是依据如图8中所示的所述电子设备在B处的局部区域放大剖视图。
图9B是依据如图8中所示的所述电子设备在B处的一变形实施中的局部区域放大剖视图。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例，本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
本领域技术人员应理解的是，在本发明的揭露中，术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系，其仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此上述术语不能理解为对本发明的限制。
可以理解的是，术语“一”应理解为“至少一”或“一个或多个”，即在一个实施例中，一个元件的数量可以为一个，而在另外的实施例中，该元件的数量可以为多个，术语“一”不能理解为对数量的限制。
如图2至如图4A是依据本发明的一第一优选实施例所示意的一摄像模组1，其中所述摄像模组1可被应用于各种电子设备80，举例但不限于智能手机、可穿戴设备、电脑设备、电视机、交通工具、照相机、监控装置等，所述摄像模组1配合所述电子设备80实现对目标对象的图像采集和再现。
如图2至如图4A所示的是依据本发明的第一优选实施例的摄像模组1，其中所述摄像模组1包括一模塑感光组件10和一光学镜头20，所述光学镜头20组装于所述模塑感光组件10的顶部并保持于所述模塑感光组件10对应的感光路径。所述模塑感光组件10包括一模塑基座11，一电路板13，以及一感光元件12，其中所述感光元件12可导通地组装于所述电路板13的对应位置，所述 模塑基座11通过模塑成型工艺一体封装成型于所述电路板13和所述感光元件12，以使得所述模塑感光组件10具有一体式紧凑结构。
所述模塑基座11具有一光窗和形成所述光窗的一基座主体111，所述光窗为所述感光元件12提供光学通路，所述模组基座一体封装于所述电路板13和所述感光元件12的非感光区域的至少一部分。特别地，在本发明的该优选实施例中，所述光窗为一周围闭合的环状结构，以便于为所述光学镜头20提供封闭的内环境。
所述电路板13包括一电路板基板131，所述电路板基板131设有一芯片贴装区域1311和一周边区域1312，其中，所述芯片贴装区域1311对应地适于贴装所述感光元件12，所述周边区域1312一体包围所述芯片贴装区域1311。所述电路板13还包括一组电子元器件132，其中所述电子元器件132安装于所述基板的周边区域1312，如通过SMT工艺贴装等，所述电子元器件132包括但不限于电阻、电容、驱动器件等。在本发明的该实施例中，所述模塑基座11一体地成型于所述感光元件12和所述电路板13，并且一体地包覆所述电子元器件132和所述感光元件12的对应非感光区域的至少一部分，以成型所述模塑感光组件10，通过这样的制备方式，使得所述模塑感光组件10具有诸多优势。
首选，由于所述模塑基座11一体成型于所述感光元件12和所述电路板13，以使得相较于现有的摄像模组1，无需在形成所述模塑基座11的过程中在所述模塑基座11和所述感光元件12之间预留安全空间，从而可有效地减小所述模塑基座11以及所述模塑感光组件10的整体成型尺寸。
其次，由于所述模塑基座11一体成型于所述感光元件12和所述电路板13，也就是说，相较于现有的摄像模组1，贴装于所述电路板13的所述电子元器件132可更邻近于所述感光元件12靠近，其原因在于进行模塑成型工艺过程中无需再为所述感光元件12和所述电子元器件132之间设置安全距离。也就是说，在本发明所提供的所述电路板13中，所述电子元器件132的铺设密度可相对增加，从而一方面相同数量的所述电子元器件132所占据的所述电路板基板131的空间可相对减少，另一方面，相同面积的所述电路板13可相对铺设更多数量的所述电子元器件132，以满足所述摄像模组1的成像硬件要求。
进一步地，由于所述模塑感光组件10通过模塑工艺一体成型，其具有相对 更为紧凑且更多小型的尺寸结构，从而相较于现有的摄像模组1的镜座，所述模塑基座11的尺寸相对较小，从而导致所述光学镜头20可以“裸镜头”安装的方式组装于所述模塑感光组件10，关于这部分内容和裸镜头的具体定义会在后续的描述中，进一步阐述。
还有，所述模塑基座11一体封装于所述感光元件12和所述电路板13，并且一体地包覆所述电子元器件132，从而防止类似传统摄像模组1中灰尘、杂物粘附在所述电子元器件132上污染所述感光元件12而影响成像效果。同时，由于成型后的所述模塑基座11一体地包覆所述电子元器件132，从而通过所述模塑感光组件10可隔离各个所述电子元器件132，以减少电子元器件132之间的电磁干扰。
另外值得一提的是，由于模塑成型材料具有良好的导热性，从而通过所述模塑基座11可提高所述摄像模组1的散热效果，减小温飘，以进一步地提高所述摄像模组1的成像品质。
可以理解的是，在本发明的另外变形实施例中，也有可能所述电子设备80内埋于所述基板，即所述电子元器件132可不暴露于外，通过这样的方式可进一步地使得所述成型后的模塑感光组件10具有更为紧凑且小巧的结构。值得一提的是，在本发明的该优选实施中，由于所述模塑基座11可完全地包覆所述电子元器件132，因此所述电子元器件132可以不内埋于所述基板。也就是说所述基板只用于形成导通线路，从而使得最终成型的所述模塑感光组件10可以具有更小的厚度以及更小的水平面方向尺寸(长度方向和宽度方向)。
进一步地，在本发明的一些实施例中，所述电子元器件132被设置于感光元件12的周围，而在不同的实施例中，所述电子元器件132的布置位置可以根据需要设计布局，比如集中于一侧或者和两侧，可以和所述感光元件12的的设置位置以及后续的导通所述感光元件12和所述电路板基板131的一组引线14的设置位置相配合，以更加合理地利用所述基板上的空间位置，尽可能减少所述摄像模组1的尺寸。
优选地，在本发明的该优选实施中，所述电路板基板131的其中一侧没有设置所述电子元器件132，通过这样的布置，可有效地减少该侧电路板基板131边缘与所述感光元件12之间的距离，以使得在后续地将所述摄像模组1装于一 电子设备80的配置过程中，所述摄像模组1与该电子设备80的边缘之间的距离被减小，从而为该电子设备80的其他部件的安装，例如，该电子设备80的显示界面预留充分的安装空间。
如图3所示，为了方便后续的描述，定义该没有设置电子元器件132的电路板13侧为电路板13的一空白侧1313。进一步地，在本发明的该优选实施例中，所述电子元器件132被设置于除了所述电路板基板131的所述空白侧1313的剩余侧面的其中至少一侧。例如，在本发明的一些实施例中，所述电子元器件132可设置于除了所述空白侧1313的其他三侧，其他二侧，或集中布置于所述电路板13的除了所述空白侧1313之外的任意一侧，以通过这样的方式，使得所述空白侧1313没有布置任何电子元器件132，以实现设计目的。本领域的技术人员应理解，所述电子元器件132于所述电路板基板131的剩余侧的布置方式，并不为本发明的局限，仅需设置于所述电路板13的其中至少一侧没有安装所述电子元器件132即可。
优选地，在本发明的该优选实施例中，所述电子元器件132被设置于所述电路板基板131的两翼侧1315，所述空白侧1313延伸于所述两翼侧1315之间通过这样的方式，使得所述电路板基板131上的所述电子元器件132具有相对较为对称规整的结构设置，以利于所述模塑感光组件10的制备与生产工艺的执行，关于这部分的内容会在后续涉及的所述模塑感光组件10拼版制备工艺中更为具体地介绍。
进一步地，在本发明中，所述电路板基板131可以是PC滤光元件镜座30硬板，PC滤光元件镜座30软板，软硬结合板、陶瓷基板等。在本发明的该优选实施例中，所述基板为软硬结合板，也就是说，在本发明的该优选实施例中，所述电路板基板131具有一软板连接侧1314，以用于连接一软板连接板1316，其中所述软板连接板1316的另一端设有一连接器1317，以通过所述连接器1317将所述摄像模组1与电子设备80导通。优选地，在本发明的该优选实施例中，所述软板连接侧1314相对所述电路板基板131的空白侧1313设置。当然，本领域的技术人员应知晓，所述软板连接侧1314同样可设置于与所述空白侧1313相交接的邻侧(两翼侧1315)，也就是说，在本发明中，所述软板连接板1316的布置位置可根据实际所需的配合位置需求自由地选择，只需满足不将 所述软板连接侧1314设置于所述空白侧1313即可。
值得一提的是，在本发明中，所述软板连接板1316可被实施为异形构造，即所述软板连接板1316具有不规则形状，以通过所述软板连接板1316的异性构造，将连接于所述软板连接板1316的所述连接器1317延伸至电子设备80的连接端口所设的位置，通过这样的方式可使得所述电路板基板131的所述软板连接侧1314的设置位置相对更为自由。
进一步地，所述感光元件12对应地安装于所述电路板基板131的所述芯片贴装区域1311，举例但不限于SMT工艺(Surf电路板基板131ce Mount Technology,表面贴装工艺)，或者通过CO滤光元件镜座30(Chip On滤光元件镜座30o电路板基板131rd)方式电连接于所述基板。当然，在本发明的其他实施例中，所述感光元件12被安装于所述基板的方式还可以通过其他方式，比如内嵌，FC(Flip Chip，芯片倒装)等，本领域的技术应理解的是，所述感光元件12和所述电路板13的连接方式，导通方式并不是本发明的局限。
在本发明的该优选实施例中，所述感光元件12通过一组引线14电连接于所述基板，其中所述引线14延伸于所述电路板基板131和所述感光元件12对应的连接端之间，并且于所述模塑基座11成型后，所述引线14被所述模塑基座11所包埋，以使得所述引线14与所述感光元件12和所述电路板基板131之间的连接更为稳固。值得一提的是，所述引线14包括但不限于金线，银线，铜线，铝线或者合金线(铜铝合金线)等。
优选地，于所述电路板基板131的所述空白侧1313没有设置所述引线14，以使得所述空白侧1313边缘与所述感光元件12的距离可进一步缩减，从而在后续地将所述摄像模组1装于一电子设备80中，所述电路板基板131的空白侧1313被设置邻近该电子设备80的边缘，以使得所述摄像模组1整体更靠近所述电子设备80边缘，通过这样的方式，为该电子设备80的其他部件的安装预留更为广阔的空间。例如，在本发明的一些实施例中，所述摄像模组1作为一智能手机的前置摄像头被组装于该智能手机，通过所述线路板的空白侧1313和所述引线14的布置方式，为所述智能手机的显示屏提供更为广阔的安装空间，从而在不改变该智能手机表面尺寸的情况下，可实现扩展该智能手机的显示屏，提高“屏占比”的目的。
更具体地说，在本发明中，所述引线14被布置于除了所述电路板基板131的所述空白侧1313的剩余侧，也就是说，在本发明中，所述引线14可被集中地设置于除了所述电路板基板131的所述空白侧1313其他任意一侧，或布置于除了所述电路板基板131的所述空白侧1313的其他两侧，或布置于除了所述电路板基板131的所述空白侧1313的所有其他剩余侧。优选地，在本发明的该优选实施例中，所述引线14被设置于所述电路板基板131的两翼侧1315，以使得所述电路板13具有更为规整且对称的结构，以利于所述模塑感光组件10的拼版制备工艺的执行，同样地，关于这部分的内容会在后续涉及的所述模塑感光组件10制备工艺中更为具体地介绍。
值得一提的是，在本发明的该优选实施例中，所述电路板基板131为平整的板状，所述感光元件12被贴附于所述电路板基板131的顶表面。在另一实施例中，所述电路板基板131可以具有一内凹槽112，所述感光元件12被容纳于所述内凹槽112，以减小所述感光元件12凸出于所述电路板基板131的高度。在另一实施例中，所述电路板基板131可以具有一通孔，连通于所述电路板基板131的两侧，所述感光元件12被容纳于所述通孔，以使得所述感光元件12和所述电路板基板131的相对位置可调。在另一实施例中，所述电路板基板131可以具有一通路，所述通路呈阶梯状结构，所述感光元件12通过芯片倒装的方式被安装于所述通路。在另一实施例中，所述电路板基板131可以具有一加固孔，所述一体基座延伸进入所述加固孔，增强所述一体基座组件的结构强度。在另一实施例中，所述电路板基板131包括一背板，所述背板被叠层地设置于所述电路板基板131的底部，以增强所述模塑感光组件10的结构强度和散热性能，所述背板举例地但不限于一金属板。在另一实施例中，所述模塑感光组件10包括一电磁屏蔽层，所述屏蔽层被包裹于所述一体基座外部或环绕于内侧，以增强所述摄像模组1的抗电磁干扰能力。在本发明的其他实施例中，所述电路板13还可以有其他各种变形，以增加或增强所述一体基座组件的不同性能，本领域的技术人员应当理解的是，以上所述电路板13的结构变形并不是本发明的限制。
如前所述，所述模塑基座11一体成型于所述电路板13和所述感光元件12，以使得相较于现有的摄像模组1的该镜座，所述模塑基座11具有相对更小的尺寸，尤其是长度方向和宽度方向上的尺寸，从而本发明所提供的所述光学镜头20 不再需要额外设置一固定镜筒，便能直接安装于所述模塑基座11的顶部。也就是说，在本发明中，相较于现有摄像模组1的该光学镜头20，该固定镜筒所占据的空间被有效地释放，一方面可进一步地缩减所述光学镜头20的尺寸，另一方面被释放的空间为其他电子设备80的部件提供安装空间。
更具体地说，在本发明的该优选实施例中，所述光学镜头20包括一镜筒单元21和一组光学镜片22，基于所述光学镜头20的光学系统设计，所述光学镜片22按照一定的次序被组装于所述镜筒单元21，以形成所述光学镜头20。进一步地，在本发明所提供的的摄像模组1中，所述光学镜头20没有设置额外的固定镜筒便可直接地组装于所述模塑基座11的顶部，也就是说，在本发明的该优选实施例中，所述光学镜头20的所述镜筒单元21可完全地横跨于所述模塑基座11对应的所述光窗，以通过所述镜筒单元21将所述光学镜头20支持于所述模塑基座11的顶部。
进一步地，如图4A所示，所述摄像模组1的所述光学镜头20被直接地组装于所述模塑基座11的顶部，并且所述光学镜头20的尺寸小于所述模塑基座11顶部的尺寸，以在所述光学镜头20和所述模塑基座11之间形成一延伸空间23。在组装所述摄像模组1于一电子设备80的过程中，所述延伸空间23为其他电子设备80部件的安装提供额外的安装空间。例如，所述摄像模组1作为一智能手机的前置摄像头被组装于一智能手机，所述智能手机的显示屏能进一步地延伸进入所述延伸空间23，从而在不改变该智能手机表面尺寸的情况下，可进一步地实现扩展该智能手机的显示屏，提高“屏占比”的目的。
进一步地，所述镜筒单元21还具有一台阶部，所述台阶部沿着所述光学镜头20定义的光轴方向往内延伸，以通过所述台阶部进一步地扩展所述延伸空间23。也就是说，在组装所述摄像模组1于所述智能手机的工艺中，所述智能手机的显示屏能进一步地延伸至所述镜筒单元21的台阶部的肩部，通过这样的方式，可进一步地实现扩展该智能手机的显示屏，提高“屏占比”的目的。
值得一提的是，在本发明的该优选实施例中，所述光学镜头20可为一体式光学镜头20或者被实施为分体式光学镜头20，其中当所述光学镜头20被实施为分体式光学镜头20时，所述光学镜头20包括至少两镜头单元，所述镜头单元相互配合组装以成型所述光学镜头20。
进一步地，在本发明该优选实施例所提供的摄像模组1中，所述摄像模组1还包括一滤光元件40，所述滤光元件40设置于所述光学镜头20和所述模塑感光组件10之间，以通过所述滤光元件40过滤穿过所述光学镜头20的光线。更具体地说，所述滤光元件40设置于所述模塑基座11，并位于所述感光元件12和所述光学镜头20形成的光线传播路径中，从而通过所述滤光元件40可过滤光线中影响成像质量的波段的光，例如红外波段的光波。所述滤光元件40举例但不限于红外滤光片、蓝玻璃滤光片、晶圆级红外截止滤光片、全透片、可见光过滤片。
如图4C所示，在本发明的一些实施例中，所述模塑基座11顶部设有一凹槽112，所述滤光元件40被收容于所述凹槽112，通过这样的方式，可减少所述滤光元件40和所述感光元件12之间的距离，以充分发挥所述滤光元件40的光学作用。
值得一提的是，所述滤光元件40，比如蓝玻璃滤光片，是比较脆弱、且相对较为昂贵的元件，容易破裂，因此保护所述滤光元件40在摄像模塑的制造过程中也是极其重要的一个方面。相应地，在本发明的该优选实施例中，所述摄像模组1还包括一滤光元件镜座30，所述滤光元件40安装于所述滤光元件镜座30，所述滤光元件镜座30被组装于所述模塑基座11的顶部，以通过所述滤光元件镜座30为所述滤光元件40提供适宜的安装位置，以实现保护所述滤光元件40的目的。
值得一提的是，在本发明的该优选实施例中，所述模塑基座11采用模塑工艺，如注塑或模压工艺，制得，所述滤光元件镜座30材质不限，其只要有足够的强度以搭载所述滤光元件40即可。优选地，所述滤光元件镜座30和所述模塑基座11可以采用不同的制造工艺进行制造，如注塑工艺制成所述滤光元件镜座30，和利用传递模压模塑制成所述模塑基座11，因此可以采用不同的材料，从而使得所述滤光元件镜座30和所述模塑基座11具有不同的硬度，表面柔性不同，比如可以使得所述滤光元件镜座30具有更好的柔性，从而当所述滤光元件40被安装于所述滤光元件镜座30时，相对于被安装于所述模塑基座11的情形，安装于所述滤光元件镜座30时受到的应力作用更小，从而更适宜安装所述滤光元件40，使得滤光元件40被损伤或出现碎裂现象。也就是说，所述滤 光元件镜座30缓解了所述滤光元件40可能受到的外部应力作用，比如被直接粘接于所述模塑基座11时受到的应力。
在本发明的该优选实施例中，所述模塑基座11的顶表面平面地延伸。换句话说，所述模塑基座11一形成一平台结构，无台阶凸起，所述滤光元件镜座30被安装于所述平台结构，值得一提的是，在这种方式中，所述模塑基座11的顶表面平面地延伸，而无明显的弯折角，因此在模塑成型的过程中，可以获得更加平整地、无毛刺的安装面，为所述滤光元件镜座30和所述光学镜头20的安装提供平整的安装条件。
在本发明的该优选实施例中，所述滤光元件镜座30具有与所述模塑基座11顶表面相对应的尺寸，并重叠地附着于所述模塑基座11的顶表面，以用于支撑所述滤光元件40，此种情况下，后续安装的所述光学镜头20被所述滤光元件镜座30所支撑，而非所述模塑基座11。
进一步，所述滤光元件镜座30具有一支撑槽31，其中所述支撑槽31凹陷地形成于所述滤光元件镜座30的中间区域，所述支撑槽31对应地连通于所述光窗，并用于安装所述滤光元件40。值得一提的是，当所述滤光元件40被收容于所述支撑槽31时，所述滤光元件镜座30与所述滤光元件40之间的相对高度降低，从而所述滤光元件40不会或较少凸出于所述滤光元件镜座30，从而最终成型的所述摄像模组1的高度尺寸得以降低。
如图4B所示是所述滤光元件镜座30的另一安装方式示意图，其中所述模塑基座11的顶部设有一收容槽，所述收容槽凹陷地形成于所述模塑基座11的顶部并且具有与所述滤光元件镜座30相匹配的尺寸，从而可契合地收容所述滤光元件镜座30于其中，通过这样的方式，可进一步地降低所述模塑感光组件10的整体高度。也就是说，优选地，所述滤光元件镜座30具有与所述收容槽相对应的高度尺寸，从而当所述滤光元件镜座30安装于所述收容槽时，所述模塑基座11的顶表面与所述滤光元件40的顶表面相契合，从而所述模塑基座11和所述滤光元件镜座30皆为后续光学镜头20的安装提高支撑面。也就是说，后续安装的所述光学镜头20可只被所述模塑基座11所支持，或所述光学镜头20部分地支撑于所述模塑基座11，部分地支撑于所述滤光元件镜座30，或只被所述滤光元件镜座30所支撑，从而所述光学镜头20的尺寸和安装位置可有更多 的选择空间。
如图4D所示，在本发明的一些实施例中，所述滤光元件镜座30还设有一限位凸起32，所述限位凸起32自所述滤光元件镜座30的顶面至少部分地，凸起地向上延伸，以便于限位并引导安装所述光学镜头20，而且在组装完成之后能阻挡灰尘或光线进入所述摄像模组1内部。特别地，在本发明中，所述定位凸起于所述滤光元件40的布置位置，可根据所述光学镜头20的尺寸所设计，以使得当所述光学镜头20附着于所述模塑基座11顶部时，所述限位凸起32可辅助对齐，便于安装操作的执行，并且在通过胶水贴赋所述光学镜头20的过程中，可防止安装所述光学镜头20所需的胶水溢流到内部而沾染镜头或内部元件。
特别地，所述限位凸起32可以是一环形凸起，从而整体上定位所述光学镜头20。值得一提的是，在本发明的其他实施例中，所述限位凸起32表面可以设置螺纹，以便于直接安装所述光学镜头20，且当所述限位凸起32外侧设置螺纹时，适于较大孔径的所述光学镜头20。
本领域的技术人员应容易想到，在本发明的另外的实施例中，所述限位凸起32同样可形成于所述模塑基座11的对应位置，以限位，引导安装所述光学镜头20，其中所述限位凸起32可一体成型于所述模塑基座11的顶部，例如通过二次模塑工艺等，或者所述限位凸起32为独立的部件并组装于所述模塑基座11的对应位置，例如通过胶粘的方式。
如图5A至如图7所示的是所述摄像模组1的一模塑感光组件拼版制备示意图，其中所述模塑感光组件10被批量制造，从而所述模塑感光组件10和所述摄像模组1的制备效率被大幅度提高。
如图5A所示，提供一电路板拼版200，其中所述电路板拼版200包括一电路板基板131，所述电路板基板131至少设有二芯片贴装区域1311，各所述芯片贴装区域1311分别地被贴装所述感光元件12。在本发明的该优选实施例中，所述电路板拼版200由两纵列电路板13单体一体成型，并且于所述电路板拼版200的两侧分别设有一组软板连接板1316。
值得一提的是，所述电路板拼版200还包括一系列电子元器件132，其中所述电路板基板131的其中一侧没有设置所述电子元器件132，为了便于描述， 定义该没有设置电子元器件132的电路板13侧为电路板13的一空白侧1313。在本发明的该优选实施例中，所述电路板13空白侧1313对应地设于所述两纵列电路板13单体的中间相交侧，并且所述电子元器件132被设置于除了所述电路板基板131的所述空白侧1313的剩余侧面的其中至少一侧。优选地，在本发明的该优选实施例中，所述电子元器件132被设置于所述电路板基板131的两翼侧1315，所述空白侧1313延伸于所述两翼侧1315之间，使得所述电路板基板131上的所述电子元器件132具有相对较为对称规整的结构设置，以利于所述模塑感光组件10的制备与生产工艺的执行。
进一步地，所述感光元件12通过一组引线14电连接于所述电路板基板131，其中所述引线14被布置于除了所述电路板基板131的所述空白侧1313的剩余侧，也就是说，在本发明中，所述引线14可被集中地设置于除了所述电路板基板131的所述空白侧1313其他任意一侧，或布置于除了所述电路板基板131的所述空白侧1313的其他两侧，或布置于除了所述电路板基板131的所述空白侧1313的所有其他剩余侧。优选地，在本发明的该优选实施例中，所述引线14被同样设置于所述电路板基板131的两翼侧1315。
如图5B所示，在将所述感光元件12分别对应地可导通地组装于所述电路板拼版200之后，将所述带有所述感光元件12的电路板拼版200放置于一模塑成型模具100的成型模腔中，并于模塑成型之后成型一模塑基座拼版300于所述感光元件12和所述电路板基板131，其中所述模塑基座11拼版一体地包覆所述感光元件12的至少一部分和形成于所述电路板拼版200的所述电子元器件132。
如图6所示，进一步地切割所述模塑基座拼版300以一次性成型多个所述模塑感光组件10单体。值得一提的是，在本发明中所述电路板基板131的所述空白侧1313没有设置所述电子元器件132和所述引线14，从而在切割所述模塑基座拼版300的过程中，一方面无需担心误切所述电子元器件132和所述引线14，另一方面，通过这样的方式所述空白侧1313的边缘与所述感光元件12之间的间隙可尽量减少，以在后续的组装于一电子设备80的过程中，所述模组更邻近于该电子设备80的边缘，从而为电子设备80的其他部件提供更大的安装空间。也就是说，在后续的将所述摄像模组1组装于一电子设备80的过程中， 所述切割侧101对应于所述摄像模组1的邻近该电子设备80边缘的那一侧，通过这样方式，以使所述摄像模组1与该电子设备80的边缘之间的距离减小，为该电子设备80的其他部件，例如显示屏，提供更大的安装空间。
进一步地，将所述滤光元件40组装于所述滤光元件镜座30，并将所述滤光元件镜座30组装于所述模塑基座11顶部的对应位置。值得一提的是在本发明的所述摄像模组1的制备工艺中，所述滤光元件40和所述滤光元件40之间的安装顺序可调整，例如，在本发明的一些实施例中，可先将所述滤光元件40组装于所述滤光元件镜座30，再将所述滤光元件镜座30对应地组装于所述模塑基座11顶部的对应位置。或者，在本发明的另一些实施中，可先将所述滤光元件镜座30安装于所述模塑基座11顶部对应位置，再将所述滤光元件40对应地附着于所述滤光元件镜座30形成的支撑槽31。也就是说，在本发明所提供的所述摄像模组1的制备方法中，所述滤光元件镜座30和所述滤光元件40之间的安装顺序并不为本发明的限制。值得一提的是，在本发明的另一些实施例中，所述滤光元件40也可直接组装于所述模塑基座11顶部的对应一安装槽中，也就是说，在本发明的另一些实施例中，所述滤光元件镜座30可不被需要。
进一步地，将所述光学镜头20组装于所述模塑基座顶部并保持于所述模塑感光组件10的感光路径。更具体的说，在本发明所提供的的摄像模组拼版制备工艺中，所述光学镜头20没有设置额外的固定镜筒，便直接被组装于所述模塑基座11的顶部。值得一提的是，所述光学镜头20的尺寸小于所述模塑基座11顶部的尺寸，从而在所述光学镜头20和所述模塑基座11之间形成一延伸空间23，以在组装所述摄像模组1于一电子设备80的过程中，所述延伸空间23为其他电子设备80部件的安装提供额外的安装空间。例如，所述摄像模组1作为一智能手机的前置摄像头被组装于一智能手机，所述智能手机的显示屏能进一步地延伸进入所述延伸空间23，从而在不改变该智能手机表面尺寸的情况下，可进一步地实现扩展该智能手机的显示屏，提高“屏占比”的目的。
值得一提的是，在本发明的该优选实施例中，所述光学镜头20可为一体式光学镜头20或者被实施为分体式光学镜头20，其中当所述光学镜头20被实施为分体式光学镜头20时，所述光学镜头20包括至少两镜头单元，所述镜头单元相互配合组装以成型所述光学镜头20。也就是说，当所述光学镜头20被实 施为一分体式光学镜头20时，本发明的制备工艺还可能包括将所述分体式光学镜头20的所述镜头单元相互配合组装的过程。
根据上述关于所述摄像模组1的制备方法，本发明还提供了一定焦摄像模组1制备方法，其中所述方法包括步骤：
将至少一感光元件分别对应地组装于所述电路板拼版的对应贴装区域。
将所述带有感光元件的电路板拼版放置于一成型模具100之后，通过模塑工艺成型一模塑基座拼版；
切割所述模塑基座拼版，以形成模塑感光组件单体；以及
将光学镜头直接组装于所述模塑基座的顶部，以成型所述摄像模组；
进一步地，如图8所示的，是组装有本发明所提供的摄像模组1的一电子设备80，其中所述电子设备80举例但不限于智能手机、可穿戴设备、电脑设备、电视机、交通工具、照相机、监控装置等，所述摄像模组1配合所述电子设备80实现对目标对象的图像采集和再现。为了更清楚地阐述所述摄像模组1配合该电子设备80所产生的技术优势，以所述电子设备80为智能手机为举例，然而本领域的技术人员应理解，所述智能手机仅为举例以阐述所述摄像模组1与所述电子设备80之间的配合关系和技术特征，也就是说，在本发明中，所述电子设备80的类型不为本发明的局限。
更具体地说，所述智能手机包括一设备主体81和组装于所述设备主体81的至少一定焦摄像模组1，其中所述定焦摄像模组1作为所述智能手机的前置摄像头，并与所述设备主体81的一触摸屏811组装于所述设备主体81的同一侧，也就是说，在所述智能手机中，所述触摸屏811与所述摄像模组1共享所述智能手机的同侧区域，从而通过调整所述摄像模组1的体型以及相关结构参数，可腾出更多的空间以实现扩展所述触摸屏811的目的。
更具体地说，所述定焦摄像模组1包括一电路板13，一感光元件12，所述感光元件12可工作地连接于所述电路板13，一光学镜头20；以及一模塑基座11，其中所述模塑基座11一体模塑成型于所述电路板13和所述感光元件12，并且所述模塑基座11形成一光窗，以为所述感光元件12提供光线通路，其中所述光学镜头20被直接组装于所述模塑基座11的顶端从而不需要固定镜筒以使所述模塑基座11顶端不需要提供支撑该固定镜筒的面积，从而所述固定 镜筒的空间被释放，以在本例子中，可为所述触摸屏811提供扩张的空间，以实现提高该智能手机屏幕占比的目的。
值得一提的是，所述电路板13包括一电路板基板131和设置于所述电路板基板的多个电子元器件132，其中所述定焦摄像模组1组装于邻近所述设备主体81边缘的位置，并且所述电路板13在邻近所述设备主体81的边缘那一侧没有布置所述电子元器件132，以使所述定焦摄像模组1与所述设备主体81的顶端边缘的距离减小，通过这样的方式，可进一步地为所述智能手机的所述触摸屏811提供更大的扩展空间。也就是说，在本发明中，所述电子元器件132被布置在除了邻近所述设备主体81的顶端的那一侧的剩余侧面的至少一侧。
进一步地，所述电路板13和所述感光元件12通过一组引线14可导通地连接，并且在沿所述设备主体81长度方向上，邻近所述设备主体81的顶端的那一侧没有布置所述引线14，通过这样的方式，可使得所述摄像模组1于所述设备主体81边缘的距离进一步地减少，从而可更进一步地为所述智能手机的所述触摸屏811提供更大的扩展空间。
值得一提的是，一体成型于所述电路板13和所述感光元件12的所述模塑基座11从一拼板工艺中制得的连体模塑基座11中切割得到，并且在邻近所述设备主体81的边缘的那一侧对应其中一切割侧101。
进一步地，所述定焦摄像模组1还包括至少一滤光元件40，其中所述滤光元件40被设置于所述模塑基座11，并且所述滤光元件40被保持在所述光学镜头20和所述感光元件12之间。在本发明的一些实施例中，所述模塑基座11顶侧具有至少一凹槽112，所述滤光元件40被组装于所述凹槽112。在本发明的另一些实施例中，所述摄像模组1还包括一滤光元件镜座30，所述滤光元件40组装于所述滤光元件40，所述滤光元件镜座30被组装于所述模塑基座11的顶侧对应位置，以允许透过所述光学镜头20的光线经所述滤光元件40过滤后到达所述感光元件12。
如图9A所示，所述光学镜头20被直接地组装于所述模塑基座11的顶部，并且所述光学镜头20的尺寸小于所述模塑基座11顶部的尺寸，以在所述光学镜头20和所述模塑基座11之间形成一延伸空间23。在组装所述摄像模组1于该智能手机的过程中，所述智能手机的所述触摸屏811能进一步地延伸进入 所述延伸空间23，从而在不改变该智能手机表面尺寸的情况下，可进一步地实现扩展该智能手机的显示屏，提高“屏占比”的目的。
如图9B所示，所述镜筒单元21还具有一台阶部，所述台阶部沿着所述光学镜头20定义的光轴方向往内延伸，以通过所述台阶部进一步地扩展所述延伸空间23。也就是说，在组装所述摄像模组1于所述智能手机的工艺中，所述智能手机的所述触摸屏811能进一步地延伸至所述镜筒单元21的台阶部的肩部，通过这样的方式，可进一步地实现扩展该智能手机的显示屏，提高“屏占比”的目的，
另外值得一提的是，所述光学镜头20可以是一整体的镜头，或者是分体式的镜头，其包括至少两镜头单元，所述镜头单元相互配合地组装，以成型所述光学镜头20，在本发明中，所述光学镜头20的类型不受限制。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (25)

  1. 一定焦摄像模组，所述定焦摄像模组适于被组装于一电子设备，其特征在于，包括：
    一电路板；
    一感光元件，所述感光元件可导通地连接于所述电路板；
    一模塑基座，其中，所述模塑基座一体成型于所述电路板和所述感光元件，并且，所述模塑基座形成一光窗，以通过所述光窗为所述感光芯片提供光线通路；以及
    一光学镜头，其中，所述光学镜头被支持于所述模塑基座的顶侧，并对应于所述模塑基座形成的所述光窗，其中，所述电路板包括一电路板基板和至少一电子元器件，其中，所述至少一电子元器件电连接于所述电路板基板，其中，所述电路板基板具有一空白侧，当所述定焦摄像模组组装于该电子设备时，所述电路板基板的所述空白侧邻近于所述电子设备的边缘，其中，在所述电路板基板的所述空白侧没有设置所述至少一电子元器件。
  2. 如权利要求1所述的定焦摄像模组，其中，所述电路板基板还具有一软板连接侧和两个翼侧，其中，所述软板连接侧相对于所述空白侧，以及，两所述翼侧分别延伸于所述软板连接侧和所述空白侧之间，其中，所述至少一电子元器件设置于所述电路板基板的两个所述翼侧。
  3. 如权利要求1所述的定焦摄像模组，其中，所述电路板基板还具有一软板连接侧和两个翼侧，其中，所述软板连接侧相对于所述空白侧，以及，两所述翼侧分别延伸于所述软板连接侧和所述空白侧之间，其中，所述至少一电子元器件被设置于所述电路板基板的两个所述翼侧和所述软板连接侧。
  4. 如权利要求1所述的定焦摄像模组，其中，所述电路板基板还具有一软板连接侧和两个翼侧，其中，所述软板连接侧相对于所述空白侧，以及，两所述翼侧分别延伸于所述软板连接侧和所述空白侧之间，其中，所述至少一电子元器件被设置于所述电路板基板的两个所述翼侧的其中之一和所述软板连接侧。
  5. 如权利要求2-4任一所述的定焦摄像模组，其中，所述电路板基板的所述空白侧的宽度小于与所述空白侧相对的所述软板连接侧的宽度。
  6. 如权利要求5所述的定焦摄像模组，其中，所述模塑基座一体成型于所述电路板和所述感光元件，并包覆所述电路板的至少一部分，所述感光元件的至少一部分和所述至少一电子元器件。
  7. 如权利要求6所述的定焦摄像模组，还包括一组引线，所述引线延伸于所述电路板基板和所述至少一电子元器件之间，用于导通所述至少一电子元器件至所述电路板基板，其中，所述模塑基座一体成型于所述电路板和所述感光元件，并包覆所述引线的至少一部分。
  8. 如权利要求7所述的定焦摄像模组，还包括一组引线，所述引线延伸于所述电路板基板和所述至少一电子元器件之间，用于导通所述至少一电子元器件至所述电路板基板，其中，所述模塑基座一体成型于所述电路板和所述感光元件，并完全地包覆所述引线。
  9. 如权利要求6-8任一所述的定焦摄像模组，其中，一体成型于所述电路板和所述感光元件的所述模塑基座从一模塑基座拼板工艺中制得的连体模塑基座中切割得到，并且邻近该电子设备的边缘的所述空白侧对应该连体模塑基座中的一切割侧。
  10. 如权利要求1,5或9所述的定焦摄像模组，其中，所述光学镜头包括一镜筒单元和一组光学镜片，所述光学镜片被支持于所述镜筒单元，其中，所述镜筒单元的宽度大于所述模塑基座的所述光窗的宽度，其中，所述镜筒单元跨设于所述光窗，并被支持于所述模组基座的顶侧。
  11. 如权利要求10所述的定焦摄像模组，其中，所述镜筒单元的宽度小于所述模塑基座的宽度，以通过所述光学镜头和所述模塑基座界定出一延伸空间， 其中，当所述定焦摄像模组组装于该电子设备时，所述延伸空间用于收容该电子设备的显示屏幕。
  12. 如权利要求11所述的定焦摄像模组，其中，所述镜筒单元具有一台阶部，所述台阶部以朝向所述光学镜头所设定的光轴方向向内延伸，以藉由所述台阶部增大所述延伸空间。
  13. 如权利要求11或12所述的定焦摄像模组，其中，所述镜筒单元位于所述电路板基板的所述空白侧的边缘对齐于所述电路板基板的所述空白侧的边缘。
  14. 如权利要求13所述的定焦摄像模组，其中，位于所述镜筒单元最顶侧的所述光学镜片为玻璃镜片。
  15. 如权利要求1所述的定焦摄像模组，其中，所述定焦摄像模组进一步包括一滤光元件，所述滤光元件被保持于所述感光元件的光线通路。
  16. 如权利要求15所述的定焦摄像模组，其中，所述模塑基座顶侧具有一凹槽，所述滤光元件组装于所述凹槽，以使得所述滤光元件被保持于所述感光元件的光线通路。
  17. 如权利要求15所述的定焦摄像模组，其中，所述定焦摄像模组还包括一滤光元件镜座，所述滤光元件镜座组装于所述模塑基座，用于安装所述滤光元件，以使得所述滤光元件被保持于所述感光元件的光线通路。
  18. 如权利要求15所述的定焦摄像模组，其中，所述模塑基座顶侧具有一凹槽，所述定焦摄像模组还包括一滤光元件镜座，所述滤光元件镜座安装于所述模塑基座的所述凹槽以用于安装所述滤光元件于其上。
  19. 如权利要求17所述的定焦摄像模组，其中，所述光学镜头贴装于所述 滤光元件镜座，以被保持于所述模塑基座的顶侧并对应于所述模塑基座形成的所述光窗。
  20. 如权利要求18所述的定焦摄像模组，其中，所述凹槽的深度与所述滤光元件镜座的高度相一致，以使得所述滤光元件镜座的顶表面与所述模塑基座的顶表面齐平。
  21. 如权利要求20所述的定焦摄像模组，其中，所述光学镜头同时贴装于所述滤光元件镜座和所述模塑基座，以使得所述光学镜头被保持于所述模塑基座的顶侧并对应于所述模塑基座形成的所述光窗。
  22. 如权利要求21所述的定焦摄像模组，其中，一半所述光学镜头贴装于所述滤光元件镜座以及另一半所述光学镜头贴装于所述模塑基座，以使得所述光学镜头被保持于所述模塑基座的顶侧并对应于所述模塑基座形成的所述光窗
  23. 如权利要求15-22任一所述的定焦摄像模组，还包括一限位凸起，其中，所述限位凸起自所述滤光元件镜座周向地且凸起地向上延伸，以用于限位所述光学镜头于所述限位凸起内。
  24. 一电子设备，其特征在于，包括：
    一电子设备本体；以及
    如权利要求1-23任一所述的定焦摄像模组，其中，所述定焦摄像模组被组装与所述电子设备本体，其中，当所述定焦摄像模组组装于该电子设备时，所述电路板基板的所述空白侧邻近于所述电子设备的边缘，其中，在所述电路板基板的所述空白侧没有设置所述至少一电子元器件。
  25. 如权利要求24所述的电子设备，其中，所述电子设备本体还包括一屏幕，所述屏幕延伸至所述定焦摄像模组的所述延伸空间。
PCT/CN2018/098560 2017-08-05 2018-08-03 摄像模组和具有摄像模组的电子设备及摄像模组制备方法 WO2019029450A1 (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020207004560A KR102321747B1 (ko) 2017-08-05 2018-08-03 카메라 모듈과 카메라 모듈을 갖는 전자설비 및 카메라 모듈 제조방법
JP2020504414A JP6913817B2 (ja) 2017-08-05 2018-08-03 撮像モジュールと撮像モジュールを備える電子機器、及び撮像モジュールの製造方法
EP18843164.7A EP3644596B1 (en) 2017-08-05 2018-08-03 Camera module and electronic device having same, and method for manufacturing camera module
CN201880044841.9A CN110832835B (zh) 2017-08-05 2018-08-03 定焦摄像模组及电子设备
US16/633,088 US11785325B2 (en) 2017-08-05 2018-08-03 Camera module having circuit board, molded base, and optical lens, electronic device having same and method for manufacturing camera module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710663413.1A CN109391750B (zh) 2017-08-05 2017-08-05 一定焦摄像模组
CN201710663413.1 2017-08-05

Publications (1)

Publication Number Publication Date
WO2019029450A1 true WO2019029450A1 (zh) 2019-02-14

Family

ID=65273331

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/098560 WO2019029450A1 (zh) 2017-08-05 2018-08-03 摄像模组和具有摄像模组的电子设备及摄像模组制备方法

Country Status (6)

Country Link
US (1) US11785325B2 (zh)
EP (1) EP3644596B1 (zh)
JP (2) JP6913817B2 (zh)
KR (1) KR102321747B1 (zh)
CN (2) CN109391750B (zh)
WO (1) WO2019029450A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111665602A (zh) * 2019-03-05 2020-09-15 三赢科技（深圳）有限公司 镜头模组及电子装置

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2737388C1 (ru) * 2018-07-05 2020-11-30 Бейдзин Сяоми Мобайл Софтвэр Ко., Лтд. Узел объектива, способ изготовления узла объектива, модуль камеры и электронное устройство
CN111988496A (zh) * 2019-05-24 2020-11-24 宁波舜宇光电信息有限公司 摄像模组及其制造方法
CN111190258A (zh) * 2018-11-15 2020-05-22 三营超精密光电(晋城)有限公司 光学镜头、应用该光学镜头的镜头模组及电子装置
JP7460537B2 (ja) * 2018-11-15 2024-04-02 ソニーセミコンダクタソリューションズ株式会社 車載カメラ
US20220181369A1 (en) * 2019-03-08 2022-06-09 Dexerials Corporation Method of manufacturing connection structure, connection structure, film structure, and method of manufacturing film structure
CN111726484A (zh) * 2019-03-22 2020-09-29 宁波舜宇光电信息有限公司 摄像模组和其镜头组件及带有摄像模组的电子设备
CN111726485A (zh) * 2019-03-22 2020-09-29 宁波舜宇光电信息有限公司 摄像模组及其镜头组件和组装方法
CN112666776B (zh) * 2019-09-29 2022-09-02 宁波舜宇光电信息有限公司 发射模组及其制造方法、深度信息获取模组以及电子设备
CN115086507B (zh) * 2021-03-10 2023-08-22 宁波舜宇光电信息有限公司 可伸缩式摄像模组和电子设备
CN115480327A (zh) * 2021-05-31 2022-12-16 宁波舜宇光电信息有限公司 摄像模组及其光学镜头和变焦方法
CN116170674A (zh) * 2021-11-22 2023-05-26 余姚舜宇智能光学技术有限公司 镜座、镜头组件和摄像模组
CN115348371A (zh) * 2022-07-28 2022-11-15 诚瑞光学(南宁)有限公司 摄像头模组及其支架的制作方法
TWI819941B (zh) * 2022-12-30 2023-10-21 新煒科技有限公司 相機模組

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205176454U (zh) * 2015-10-28 2016-04-20 南昌欧菲光电技术有限公司 双摄像头模组及具有其的摄像装置
CN105611135A (zh) * 2015-11-13 2016-05-25 宁波舜宇光电信息有限公司 系统级摄像模组及其电气支架和制造方法
US20160313520A1 (en) * 2013-12-12 2016-10-27 Hitachi Maxell, Ltd. Lens member, method of manufacturing the same, communication module, lens array, and light-source module
CN106131386A (zh) * 2016-08-10 2016-11-16 北京小米移动软件有限公司 摄像头模组和电子设备
CN206302476U (zh) * 2016-08-01 2017-07-04 宁波舜宇光电信息有限公司 摄像模组及其模塑电路板组件和成型模具及电子设备
CN106973210A (zh) * 2017-05-16 2017-07-21 昆山丘钛微电子科技有限公司 塑封加支架式小型化摄像头装置及其制作方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004032141A (ja) * 2002-06-24 2004-01-29 Toko Inc カメラモジュール
JP2006148473A (ja) 2004-11-18 2006-06-08 Shinko Electric Ind Co Ltd カメラモジュール及びその製造方法
KR100884962B1 (ko) * 2007-07-30 2009-02-23 자화전자 주식회사 휴대폰용 카메라 렌즈 어셈블리
KR20090116479A (ko) 2008-05-07 2009-11-11 삼성테크윈 주식회사 이미지 센서 모듈 및 그 제조 방법
JP5825482B2 (ja) 2011-11-08 2015-12-02 福井めがね工業株式会社 白色系Ａｕ合金
KR101285393B1 (ko) * 2011-12-01 2013-07-10 주식회사 팬택 카메라 모듈을 포함하는 이동통신 단말기
TW201408060A (zh) * 2012-08-06 2014-02-16 Hon Hai Prec Ind Co Ltd 相機模組及相機模組的製造方法
US8806743B2 (en) * 2012-08-07 2014-08-19 Excelitas Technologies Singapore Pte. Ltd Panelized process for SMT sensor devices
JP2014103458A (ja) * 2012-11-16 2014-06-05 Sharp Corp カメラモジュールおよび表示装置
CN103296043B (zh) * 2013-05-31 2015-11-18 格科微电子（上海）有限公司 图像传感器封装方法及结构、图像传感器模组及形成方法
KR102166329B1 (ko) 2013-08-19 2020-10-15 삼성전자주식회사 카메라 모듈
TWI650016B (zh) * 2013-08-22 2019-02-01 新力股份有限公司 成像裝置、製造方法及電子設備
KR102171366B1 (ko) * 2013-09-13 2020-10-29 엘지이노텍 주식회사 카메라 모듈
CN203674205U (zh) * 2013-12-30 2014-06-25 湖北三赢兴电子科技有限公司 高端摄像模组的晶元封装结构
JP2016100573A (ja) 2014-11-26 2016-05-30 株式会社東芝 電子モジュール、及びカメラモジュール
CN104836943B (zh) * 2015-01-30 2018-01-30 中国科学技术大学 一种平面分布的多摄像头全景图拍摄系统及其实现方法
CN105187697B (zh) * 2015-08-04 2019-12-31 宁波舜宇光电信息有限公司 多镜头摄像模组连体支架和多镜头摄像模组及其应用
CN105467550B (zh) * 2015-12-16 2019-03-12 宁波舜宇光电信息有限公司 集成对焦机构的可调光学镜头和摄像模组及其组装方法
CN105516565A (zh) 2015-12-31 2016-04-20 杭州雄迈信息技术有限公司 一种安防摄像头模组及其封装工艺
CN105847645B (zh) 2016-05-11 2020-03-10 宁波舜宇光电信息有限公司 基于一体封装工艺的摄像模组及其一体基座组件及制造方法
CN105721749B (zh) * 2016-02-24 2020-07-24 宁波舜宇光电信息有限公司 摄像模组及其电气支架和线路板组件及制造方法
CN205792874U (zh) * 2016-03-12 2016-12-07 宁波舜宇光电信息有限公司 摄像模组及其感光组件
CN110708454B (zh) * 2016-04-21 2021-10-08 宁波舜宇光电信息有限公司 基于模塑工艺的摄像模组
US10477088B2 (en) * 2016-04-21 2019-11-12 Ningbo Sunny Opotech Co., Ltd. Camera module and array camera module based on integral packaging technology
US10659664B2 (en) 2016-08-01 2020-05-19 Ningbo Sunny Opotech Co., Ltd. Camera module and molded circuit board assembly and manufacturing method thereof
CN206074975U (zh) 2016-08-29 2017-04-05 昆山丘钛微电子科技有限公司 摄像头模组用滤光片与基座一体成型结构
CN108322574B (zh) * 2018-03-30 2020-01-14 Oppo广东移动通信有限公司 显示屏、终端显示屏组件及移动终端

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160313520A1 (en) * 2013-12-12 2016-10-27 Hitachi Maxell, Ltd. Lens member, method of manufacturing the same, communication module, lens array, and light-source module
CN205176454U (zh) * 2015-10-28 2016-04-20 南昌欧菲光电技术有限公司 双摄像头模组及具有其的摄像装置
CN105611135A (zh) * 2015-11-13 2016-05-25 宁波舜宇光电信息有限公司 系统级摄像模组及其电气支架和制造方法
CN206302476U (zh) * 2016-08-01 2017-07-04 宁波舜宇光电信息有限公司 摄像模组及其模塑电路板组件和成型模具及电子设备
CN106131386A (zh) * 2016-08-10 2016-11-16 北京小米移动软件有限公司 摄像头模组和电子设备
CN106973210A (zh) * 2017-05-16 2017-07-21 昆山丘钛微电子科技有限公司 塑封加支架式小型化摄像头装置及其制作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111665602A (zh) * 2019-03-05 2020-09-15 三赢科技（深圳）有限公司 镜头模组及电子装置

Also Published As

Publication number Publication date
CN110832835B (zh) 2021-11-05
JP2020528583A (ja) 2020-09-24
US11785325B2 (en) 2023-10-10
US20200162648A1 (en) 2020-05-21
KR102321747B1 (ko) 2021-11-05
JP6913817B2 (ja) 2021-08-04
EP3644596B1 (en) 2023-07-26
KR20200036876A (ko) 2020-04-07
EP3644596A1 (en) 2020-04-29
EP3644596A4 (en) 2020-04-29
CN109391750B (zh) 2023-05-12
JP2021179621A (ja) 2021-11-18
CN110832835A (zh) 2020-02-21
CN109391750A (zh) 2019-02-26

Similar Documents

Publication Publication Date Title
WO2019029450A1 (zh) 摄像模组和具有摄像模组的电子设备及摄像模组制备方法
US12041335B2 (en) Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module
US12007583B2 (en) Lens, camera module and manufacturing method thereof
US20080297645A1 (en) Camera module with compact packaging of image sensor chip and method of manufacturing the same
US8248514B1 (en) Camera module having image sensing module with passive components
US8203647B2 (en) Image sensor module and method for manufacturing the same
US20190089884A1 (en) Camera module and photosensitive assembly thereof
WO2016180378A2 (zh) 摄像模组及其组装方法
WO2018113794A2 (zh) 摄像模组及其电路板组件和制造方法以及带有摄像模组的电子设备
EP3672220B1 (en) Photosensitive assembly, imaging module, intelligent terminal, and method and mould for manufacturing photosensitive assembly
TWI564610B (zh) 攝像模組及其製造方法
WO2019158061A1 (zh) 一体感光模块、感光组件、摄像模组及制备方法
WO2021114908A1 (zh) 滤光组件、摄像模组及多摄模组
WO2021139481A1 (zh) 滤光组件、摄像模组及多摄模组
WO2018130172A1 (zh) 线路板和模塑感光组件及其制造方法以及摄像模组和电子设备
WO2021031732A1 (zh) 分体式镜头及其组装方法、摄像模组和终端设备
TWI394436B (zh) 數位相機模組及其組裝方法
WO2019029332A1 (zh) 摄像模组及其制作方法以及相应的智能终端
KR20040100729A (ko) 집적 화상 센서 모듈
TWM454052U (zh) 具一體成型透鏡模組之影像感測器結構及其透鏡模組

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18843164

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2020504414

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 2018843164

Country of ref document: EP

Effective date: 20200122

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20207004560

Country of ref document: KR

Kind code of ref document: A