US11540393B2 - Multilayer substrate, multilayer substrate mounting structure, method of manufacturing multilayer substrate, and method of manufacturing electronic device - Google Patents

Multilayer substrate, multilayer substrate mounting structure, method of manufacturing multilayer substrate, and method of manufacturing electronic device Download PDF

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US11540393B2
US11540393B2 US16/879,815 US202016879815A US11540393B2 US 11540393 B2 US11540393 B2 US 11540393B2 US 202016879815 A US202016879815 A US 202016879815A US 11540393 B2 US11540393 B2 US 11540393B2
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mounting
multilayer substrate
pattern
mounting electrode
auxiliary pattern
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US20200288574A1 (en
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Shingo Ito
Naoki GOUCHI
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a multilayer substrate, and more particularly to a multilayer substrate including a stacked body including a plurality of insulating base material layers made of a resin as a main material and stacked on one another, and an electrode provided on the stacked body.
  • the present invention relates to a multilayer substrate mounting structure, and an electronic device including the multilayer substrate.
  • various multilayer substrates including a stacked body obtained by stacking a plurality of insulating base material layers, and an electrode provided on the stacked body are known.
  • International Publication No. 2015/079773 discloses a multilayer substrate including a stacked body obtained by stacking a plurality of insulating base material layers made of a resin as a main material and stacked on one another, a coil provided in the stacked body, and an electrode provided on a surface of the stacked body.
  • the insulating base material layers made of a resin as a main material may flow, which may cause a positional shift of the electrode.
  • a vicinity of a surface layer of the stacked body is easily affected by heat by a pressing machine at the time of heating and pressing, and an electrode provided on the surface of the stacked body tends to cause a positional shift. Therefore, in a case in which other mounted components are mounted on a multilayer substrate, or in a case in which a multilayer substrate is mounted on a different mounting substrate, a bonding failure or a positional shift of a mounting position may occur.
  • Preferred embodiments of the present invention provide multilayer substrates in each of which a positional shift of an electrode when a stacked body is formed is significantly reduced or prevented while providing the electrode on a surface of the stacked body including a plurality of insulating base material layers made of a resin as a main material, and methods of manufacturing such multilayer substrates.
  • Preferred embodiments of the present invention also provide multilayer substrate mounting structures and methods of mounting multilayer substrates that significantly reduce or prevent a bonding failure, a positional shift of a mounting position, or the like, due to a positional shift of a mounting electrode.
  • a multilayer substrate includes a stacked body including a plurality of insulating base material layers made of a resin as a main material and stacked on one another, and including a main surface, and a conductor pattern including a mounting electrode provided on the main surface, and a first auxiliary pattern provided on the main surface and located adjacent to or in a vicinity of the mounting electrode, and the mounting electrode, in a plan view of the main surface, is interposed between the first auxiliary pattern or a different conductor pattern, and the first auxiliary pattern, and three out of four directions of the mounting electrode are surrounded by the first auxiliary pattern, the four directions being perpendicular or substantially perpendicular to a radial direction from the mounting electrode.
  • the mounting electrode positioned on a surface of the stacked body, in particular, easily causes a positional shift with a flow of the insulating base material layers at the time of heating and pressing.
  • the mounting electrode is interposed between a first auxiliary pattern and a different conductor pattern, so that an excessive flow of the insulating base material layers adjacent to or in a vicinity of the mounting electrode at the time of heating and pressing is significantly reduced or prevented, and a positional shift of the mounting electrode at the time of heating and pressing is significantly reduced or prevented.
  • the mounting electrode in a plan view of the main surface, three out of four directions of the mounting electrode are surrounded by the first auxiliary pattern, the four directions being perpendicular or substantially perpendicular to a radial direction from the mounting electrode. Accordingly, it is possible to further increase a significant reduction effect of the flow of the insulating base material layers adjacent to or in a vicinity of the mounting electrode by the first auxiliary pattern at the time of heating and pressing. Therefore, the positional shift of the mounting electrode at the time of heating and pressing is able to be further significantly reduced or prevented.
  • the first auxiliary pattern preferably includes a portion facing the mounting electrode, and the portion preferably has a shape along an outer shape of the mounting electrode. Accordingly, a flow of the insulating base material layers adjacent to or in a vicinity of the mounting electrode at the time of heating and pressing is significantly reduced or prevented, so that the positional shift of the mounting electrode at the time of heating and pressing is able to be significantly reduced or prevented.
  • an area of the first auxiliary pattern is preferably larger than an area of the mounting electrode.
  • a conductor pattern with a small area easily causes a positional shift due to a flow of the insulating base material layers at the time of heating and pressing. Therefore, the occurrence of a positional shift of the first auxiliary pattern itself at the time of heating and pressing is able to be significantly reduced or prevented.
  • a width of the first auxiliary pattern in a first direction that crosses the mounting electrode and the first auxiliary pattern is preferably larger than a width of the mounting electrode in the first direction. Accordingly, the occurrence of a positional shift of the first auxiliary pattern itself in the first direction at the time of heating and pressing is able to be significantly reduced or prevented. Therefore, the positional shift (the positional shift of the mounting electrode in the first direction, in particular) of the mounting electrode at the time of heating and pressing is significantly reduced or prevented.
  • a distance between the mounting electrode and the first auxiliary pattern in a first direction that crosses the mounting electrode and the first auxiliary pattern is preferably smaller than a width of the first auxiliary pattern in the first direction.
  • a flow of the insulating base material layers at the time of heating and pressing is significantly reduced or prevented, and the positional shift of the mounting electrode is significantly reduced or prevented. Accordingly, the positional shift of the mounting electrode at the time of heating and pressing is able to be significantly reduced or prevented, compared to a case in which the distance between the mounting electrode and a first auxiliary pattern is large.
  • the mounting electrode in the plan view of the main surface, preferably includes a portion partially surrounded by only the first auxiliary pattern.
  • the structure of the mounting electrode interposed between the first auxiliary patterns adjacent to or in a vicinity of the mounting electrode, compared to the mounting electrode interposed between the first auxiliary pattern and a different conductor pattern, is able to significantly reduce or prevent a flow of the insulating base material layers adjacent to or in a vicinity of the mounting electrode at the time of heating and pressing. Therefore, the positional shift of the mounting electrode at the time of heating and pressing is able to be significantly reduced or prevented.
  • the conductor pattern preferably includes an inner layer pattern provided inside the stacked body, and a second auxiliary pattern provided inside the stacked body and surrounding the inner layer pattern in the plan view of the main surface. Accordingly, an excessive flow of the insulating base material layers inside the stacked body at the time of heating and pressing is able to be significantly reduced or prevented by the second auxiliary pattern. Therefore, a positional shift of the inner layer pattern at the time of heating and pressing is significantly reduced or prevented, and the change in stray capacitance or the change in characteristics due to the positional shift of the inner layer pattern is able to be significantly reduced or prevented.
  • the multilayer substrate preferably includes an interlayer connection conductor provided inside the stacked body, and the first auxiliary pattern and the second auxiliary pattern are connected to each other through the interlayer connection conductor. Accordingly, compared to a case in which the first auxiliary pattern and the second auxiliary pattern are not connected by the interlayer connection conductor, the positional shift of the first auxiliary pattern and the second auxiliary pattern at the time of heating and pressing is able to be further significantly reduced or prevented. Therefore, the positional shift of the mounting electrode and the inner layer pattern at the time of heating and pressing is able to be further significantly reduced or prevented.
  • the multilayer substrate may include a protective layer provided on the main surface, and the protective layer, in the plan view of the main surface, may not overlap with the first auxiliary pattern.
  • the four directions of the mounting electrode, in the plan view of the main surface, are surrounded by the first auxiliary pattern. Accordingly, compared to a case in which the three out of the four directions of the mounting electrode are surrounded by the first auxiliary pattern, a significant reduction effect of a flow of the insulating base material layers adjacent to or in a vicinity of the mounting electrode by the first auxiliary pattern at the time of heating and pressing is further increased.
  • the mounting electrode preferably includes a plurality of mounting electrodes
  • the first auxiliary pattern preferably includes a plurality of first auxiliary patterns
  • the plurality of first auxiliary patterns are preferably located adjacent to or in a vicinity of different mounting electrodes, respectively.
  • one first auxiliary pattern is adjacent to or in a vicinity of a plurality of mounting electrodes, and short-circuiting between the one first auxiliary pattern and each of the plurality of mounting electrodes occurs, short-circuiting between the plurality of mounting electrodes occurs.
  • a multilayer substrate mounting structure includes a multilayer substrate, and a mounting substrate on which the multilayer substrate is mounted, the mounting substrate including a mounting surface and a bonding electrode on the mounting surface;
  • the multilayer substrate includes a stacked body including a plurality of insulating base material layers made of a resin as a main material and stacked on one another, and including a main surface, and a conductor pattern including a mounting electrode provided on the main surface, and a first auxiliary pattern provided on the main surface and located adjacent to or in a vicinity of the mounting electrode;
  • the mounting electrode in a plan view of the main surface, is interposed between the first auxiliary pattern or a different conductor pattern, and the first auxiliary pattern; three out of four directions of the mounting electrode are surrounded by the first auxiliary pattern, the four directions being perpendicular or substantially perpendicular to a radial direction from the mounting electrode;
  • the first auxiliary pattern is not electrically connected to the bonding electrode; and the mounting electrode is electrically connected to the bond
  • a multilayer substrate mounting structure that significantly reduces or prevents a bonding failure, a positional shift of a mounting position, or the like, due to the positional shift of the mounting electrode, is able to be provided.
  • the mounting substrate preferably includes a portion of the mounting surface on which the bonding electrode is provided, the portion is preferably a convex portion protruding farther than other portions, the mounting electrode and the bonding electrode preferably face each other, and the multilayer substrate and the mounting substrate are preferably connected to each other while interposing an insulating anisotropic conductive film between the multilayer substrate and the mounting substrate. Accordingly, a portion of the insulating anisotropic conductive film interposed between the mounting electrode and the bonding electrode is electrically conducted by the pressure applied when the mounting substrate, the insulating anisotropic conductive film, and the multilayer substrate are stacked and pressurized. Therefore, it is easy to electrically connect the mounting electrode and the bonding electrode.
  • a method of manufacturing a multilayer substrate is a method of manufacturing a multilayer substrate including a stacked body including a plurality of insulating base material layers made of a resin as a main material and stacked on one another, and including a main surface; and a conductor pattern including a mounting electrode provided on the main surface; and a first auxiliary pattern provided on the main surface, the method includes a conductor pattern forming step of forming the mounting electrode, and the first auxiliary pattern located adjacent to or in a vicinity of the mounting electrode, on a surface of an insulating base material layer defining and functioning as the main surface, among the plurality of insulating base material layers; and a stacked body forming step of forming the stacked body by stacking the plurality of insulating base material layers and heating and pressing the stacked insulating base material layers, after the conductor pattern forming step; the mounting electrode is interposed between the first auxiliary pattern or a different conductor pattern, and the first auxiliary pattern; and three out of
  • a multilayer substrate that significantly reduces or prevents the positional shift of the mounting electrode at the time of forming the stacked body is able to be easily manufactured.
  • a method of manufacturing an electronic device is a method of manufacturing an electronic device including a multilayer substrate, and a mounting substrate including a mounting surface and a bonding electrode on the mounting surface
  • the multilayer substrate includes a stacked body including a plurality of insulating base material layers made of a resin as a main material and stacked on one another, and including a main surface; and a conductor pattern including a mounting electrode provided on the main surface; and a first auxiliary pattern provided on the main surface and located adjacent to or in a vicinity of the mounting electrode; the mounting electrode, in a plan view of the main surface, is interposed between the first auxiliary pattern or a different conductor pattern, and the first auxiliary pattern; three out of four directions of the mounting electrode are surrounded by the first auxiliary pattern, the four directions being perpendicular or substantially perpendicular to a radial direction from the mounting electrode, and the method includes an anisotropic element placing step of placing an insulating anisotropic conductive film on a surface
  • the manufacturing method it is possible to easily provide an electronic device in which a bonding failure, a positional shift of a mounting position, or the like, due to the positional shift of the mounting electrode, is significantly reduced or prevented when the multilayer substrate is mounted on the mounting substrate.
  • the multilayer substrate in multilayer substrates in each of which an electrode is provided on a surface of a stacked body including a plurality of insulating base material layers made of a resin as a main material, the multilayer substrate that significantly reduces or prevents a positional shift of the electrode at the time of forming the stacked body is able to be provided.
  • structures in each of which a multilayer substrate including an electrode provided on a surface of a stacked body including a plurality of insulating base material layers made of a resin as a main material is mounted with respect to a different substrate is able to be provided.
  • FIG. 1 A is a plan view of a multilayer substrate 101 according to a first preferred embodiment of the present invention
  • FIG. 1 B is an A-A cross-sectional view in FIG. 1 A .
  • FIG. 2 is an exploded perspective view of a stacked body 10 included in the multilayer substrate 101 .
  • FIG. 3 is a cross-sectional view showing a portion in which the multilayer substrate 101 and a mounting substrate 201 are bonded, the portion being included in an electronic device 301 according to the first preferred embodiment of the present invention.
  • FIG. 4 A is a plan view of a multilayer substrate 102 A according to a second preferred embodiment of the present invention
  • FIG. 4 B is a plan view of a multilayer substrate 102 B according to the second preferred embodiment of the present invention
  • FIG. 4 C is a plan view of a multilayer substrate 102 C according to the second preferred embodiment of the present invention.
  • FIG. 5 A is a plan view of a multilayer substrate 103 A according to a third preferred embodiment of the present invention
  • FIG. 5 B is a plan view of a multilayer substrate 103 B according to the third preferred embodiment of the present invention.
  • FIG. 6 A is a plan view of a multilayer substrate 104 according to a fourth preferred embodiment of the present invention
  • FIG. 6 B is a B-B cross-sectional view in FIG. 6 A .
  • FIG. 7 is an exploded perspective view of a stacked body 10 included in the multilayer substrate 104 .
  • FIG. 8 A is a plan view of a multilayer substrate 105 A according to a fifth preferred embodiment of the present invention
  • FIG. 8 B is a plan view of a multilayer substrate 105 B according to the fifth preferred embodiment of the present invention.
  • FIG. 9 A is a plan view of a multilayer substrate 106 according to a sixth preferred embodiment of the present invention
  • FIG. 9 B is a C-C cross-sectional view in FIG. 9 A .
  • FIG. 10 is an exploded perspective view of a stacked body 10 included in the multilayer substrate 106 .
  • FIG. 1 A is a plan view of a multilayer substrate 101 according to a first preferred embodiment of the present invention
  • FIG. 1 B is an A-A cross-sectional view in FIG. 1 A
  • FIG. 2 is an exploded perspective view of a stacked body 10 included in the multilayer substrate 101 .
  • first auxiliary patterns 41 A and 41 B are indicated by a dot pattern.
  • the multilayer substrate 101 includes a stacked body 10 , a conductor pattern (mounting electrodes P 1 and P 2 , first auxiliary patterns 41 A and 41 B, coil conductors 31 , 32 , and 33 ), and interlayer connection conductors V 1 , V 2 , V 3 , and V 4 .
  • the stacked body 10 is an insulator having a rectangular parallelepiped shape or a substantially rectangular parallelepiped shape of which the longitudinal direction coincides with an X-axis direction, and includes a first main surface VS 1 and a second main surface VS 2 that face each other.
  • the mounting electrodes P 1 and P 2 are conductor patterns provided on the first main surface VS 1 of the stacked body 10 .
  • the first auxiliary patterns 41 A and 41 B are conductor patterns provided on the first main surface VS 1 and located adjacent to or in a vicinity of the mounting electrodes P 1 and P 2 .
  • the coil conductors 31 , 32 , and 33 are conductor patterns provided inside the stacked body 10 .
  • the mounting electrodes P 1 and P 2 , the first auxiliary patterns 41 A and 41 B, and the coil conductors 31 , 32 , and 33 are conductor patterns preferably made of a material such as Cu, for example.
  • the coil conductors 31 , 32 , and 33 correspond to the “inner layer patterns”.
  • the description of “located adjacent to or in a vicinity of the mounting electrodes” means that the first auxiliary patterns are located adjacent to or in a vicinity of the mounting electrodes at a distance smaller than the shortest distance (W 0 ) from the outer shape of the mounting electrode to the outer edge of the stacked body 10 , in a plan view of the first main surface VS 1 (when viewed in a Z-axis direction).
  • the first auxiliary pattern is defined to be “located adjacent to or in a vicinity of the mounting electrode.”
  • the stacked body 10 includes a plurality of insulating base material layers 14 , 13 , 12 , and 11 made of a resin as a main material and stacked in this order.
  • Each of the plurality of insulating base material layers 11 , 12 , 13 , and 14 is a rectangular flat plate or a substantially rectangular flat plate that has flexibility.
  • the plurality of insulating base material layers 11 , 12 , 13 , and 14 are preferably thermoplastic resin sheets including a liquid crystal polymer (LCP) or a polyether ether ketone (PEEK), for example, as a main material.
  • LCP liquid crystal polymer
  • PEEK polyether ether ketone
  • the mounting electrodes P 1 and P 2 and the first auxiliary patterns 41 A and 41 B are provided on a surface of the insulating base material layer 11 .
  • the mounting electrodes P 1 and P 2 are rectangular or substantially rectangular conductor patterns of which the longitudinal direction coincides with a Y-axis direction.
  • the first auxiliary patterns 41 A and 41 B are linear or substantially linear conductor patterns extending in the Y-axis direction.
  • the mounting electrode P 1 and the first auxiliary pattern 41 A are located adjacent to or in a vicinity of a first side (a left side of the insulating base material layer 11 in FIG. 2 ) of the insulating base material layer 11 .
  • the mounting electrode P 2 and the first auxiliary pattern 41 B are located adjacent to or in a vicinity of a second side (a right side of the insulating base material layer 11 in FIG. 2 ) of the insulating base material layer 11 .
  • the first auxiliary patterns 41 A and 41 B are dummy patterns.
  • the “dummy pattern” used herein refers to a pattern that does not have a main function on a circuit, such as a conductor pattern that is not electrically connected to the mounting electrode, for example.
  • the coil conductor 31 is provided on a surface of the insulating base material layer 12 .
  • the coil conductor 31 is a rectangular or substantially rectangular loop-shaped conductor pattern of about 0.75 turn wound along the outer periphery of the insulating base material layer 12 .
  • the coil conductor 32 is provided on a surface of the insulating base material layer 13 .
  • the coil conductor 32 is a rectangular or substantially rectangular loop-shaped conductor pattern of about 0.75 turn wound along the outer periphery of the insulating base material layer 13 .
  • the coil conductor 33 is provided on a surface of the insulating base material layer 14 .
  • the coil conductor 33 is a rectangular or substantially rectangular loop-shaped conductor pattern of about 0.75 turn wound along the outer periphery of the insulating base material layer 14 .
  • the mounting electrode P 1 is connected to one end of the coil conductor 31 through the interlayer connection conductor V 1 provided in the insulating base material layer 11 .
  • the other end of the coil conductors 31 is connected to one end of the coil conductor 32 through the interlayer connection conductor V 2 provided in the insulating base material layer 12 .
  • the other end of the coil conductors 32 is connected to one end of the coil conductor 33 through the interlayer connection conductor V 3 provided in the insulating base material layer 13 .
  • the other end of the coil conductors 33 is connected to the mounting electrode P 2 through the interlayer connection conductor V 4 provided in the insulating base material layers 11 , 12 , and 13 .
  • the coil conductors 31 , 32 , and 33 and the interlayer connection conductors V 2 and V 3 define a coil 3 having a rectangular helical shape or a substantially rectangular helical shape of more than about two turns.
  • the coil 3 is provided in contact with the stacked body 10 , and includes a winding axis AX in the stacking direction (the Z-axis direction) of the plurality of insulating base material layers 11 , 12 , 13 , and 14 .
  • one end of the coil 3 is connected to the mounting electrode P 1
  • the other end of the coil 3 is connected to the mounting electrode P 2 .
  • the first auxiliary patterns 41 A and 41 B are located adjacent to or in a vicinity of different mounting electrodes, respectively. Specifically, the first auxiliary pattern 41 A is located adjacent to or in a vicinity of the mounting electrode P 1 , and the first auxiliary pattern 41 B is located adjacent to or in a vicinity of the mounting electrode P 2 .
  • a portion (a right side of the first auxiliary pattern 41 A in FIG. 1 A ) of the first auxiliary pattern 41 A that faces the mounting electrode P 1 has a shape along the outer shape of the mounting electrode P 1 .
  • a portion (a left side of the first auxiliary pattern 41 B in FIG. 1 A ) of the first auxiliary pattern 41 B that faces the mounting electrode P 2 has a shape along the outer shape of the mounting electrode P 2 .
  • the “shape along the outer shape of the mounting electrode” means that the portion (the outer shape) of the first auxiliary pattern that faces the mounting electrode and the outer shape of the mounting electrode are approximately similar to each other. More specifically, the description of “a portion of the first auxiliary pattern that faces the mounting electrode has a shape along the outer shape of the mounting electrode” means, for example, that an angle between the portion (the outer shape) of the first auxiliary pattern that faces the mounting electrode and the outer shape of the mounting electrode is in a range from about minus 30 degrees to about plus 30 degrees.
  • the mounting electrode P 1 in a plan view of the first main surface VS 1 (when viewed in the Z-axis direction), is interposed between the first auxiliary pattern 41 A and a different conductor pattern (a conductor pattern other than the first auxiliary pattern: the mounting electrode P 2 ) in the X-axis direction.
  • the mounting electrode P 2 when viewed in the Z-axis direction, is interposed between the first auxiliary pattern 41 B and a different conductor pattern (the mounting electrode P 1 ) in the X-axis direction.
  • the distance (W 1 ) between the mounting electrode P 1 and the first auxiliary pattern 41 A in the first direction (the X-axis direction, for example) that crosses the mounting electrode P 1 and the first auxiliary pattern 41 A is smaller than a width (W 2 ) of the first auxiliary pattern 41 A in the first direction (the X-axis direction).
  • a distance between the mounting electrode P 2 and the first auxiliary pattern 41 B in the first direction is smaller than a width of the first auxiliary pattern 41 B in the first direction (not shown).
  • the insulating base material layers may flow due to heat generated when the stacked insulating base material layers are heated and pressed, which may cause a positional shift of a conductor pattern provided on the stacked body.
  • a vicinity of the surface of the stacked body is easily affected by heat by a pressing machine at the time of heating and pressing, and a flow of the insulating base material layers is easily greater in the vicinity than the inside of the stacked body.
  • the mounting electrode positioned on the surface of the stacked body in particular, easily causes a positional shift.
  • the first auxiliary patterns 41 A and 41 B located adjacent to or in a vicinity of the mounting electrodes P 1 and P 2 are provided, and the mounting electrode is interposed between the first auxiliary pattern and a different conductor pattern.
  • the stress is easily concentrated on a portion in which the inner layer patterns (the coil conductors 31 , 32 , and 33 ) provided on each of the plurality of insulating base material layers 12 , 13 , and 14 overlap with each other in the stacking direction (the Z-axis direction), at the time of heating and pressing.
  • the uneven stress is applied to an overlapping portion in which the plurality of inner layer patterns overlap with each other in the stacking direction and a portion other than the overlapping portion at the time of heating and pressing, so that the flow of the insulating base material layers is easily caused.
  • the positional shift of the mounting electrode in particular, is easily caused. Accordingly, the advantageous functions and effects by the above-described features are particularly effective in the case in which the mounting electrodes and the plurality of inner layer patterns overlap with each other in the stacking direction.
  • the portion of the first auxiliary pattern 41 A that faces the mounting electrode P 1 has a shape along the outer shape of the mounting electrode P 1 .
  • the portion of the first auxiliary pattern 41 B that faces the mounting electrode P 2 has a shape along the outer shape of the mounting electrode P 2 .
  • the distance (W 1 ) between the mounting electrode P 1 and the first auxiliary pattern 41 A in the first direction is smaller than the width (W 2 ) of the first auxiliary pattern 41 A in the first direction.
  • the distance between the mounting electrode P 2 and the first auxiliary pattern 41 B in the first direction is smaller than the width of the first auxiliary pattern 41 B in the first direction.
  • first direction indicates the X-axis direction in the first preferred embodiment
  • present invention is not limited to such a structural arrangement.
  • the “first direction” may be a direction other than the X-axis direction as long as the direction crosses the mounting electrode and the first auxiliary pattern on a straight line.
  • the “first direction” may be a direction inclined at about 20 degrees on the X-Y plane with respect to the X-axis direction, for example, or may be the Y-axis direction, for example.
  • the stacked body 10 includes a plurality of insulating base material layers that include a thermoplastic resin and are stacked on one another. Accordingly, as will be described below, since the stacked body 10 is able to be easily formed by collectively pressing the stacked insulating base material layers, the number of manufacturing steps of the multilayer substrate 101 is reduced, and the cost is able to be reduced to a low level. In addition, a multilayer substrate that is able to be easily plastically deformed and that maintains (holds) a predetermined shape is able to be provided.
  • the plurality of first auxiliary patterns 41 A and 41 B are located adjacent to or in a vicinity of different mounting electrodes P 1 and P 2 , respectively.
  • one first auxiliary pattern is located adjacent to or in a vicinity of a plurality of mounting electrodes (see a multilayer substrate 104 according to a fourth preferred embodiment or a multilayer substrate 105 according to a fifth preferred embodiment to be described below), when short-circuiting between the one first auxiliary pattern and each of the plurality of mounting electrodes occurs, short-circuiting between the plurality of mounting electrodes occurs.
  • the multilayer substrate 101 according to the first preferred embodiment is manufactured by, for example, the following manufacturing method.
  • a plurality of insulating base material layers 11 , 12 , 13 , and 14 made of a resin as a main material are prepared, and a conductor pattern (the mounting electrodes P 1 and P 2 , the first auxiliary patterns 41 A and 41 B, and coil conductors 31 , 32 , and 33 ) is provided on each of the plurality of insulating base material layers 11 , 12 , 13 , and 14 .
  • the insulating base material layers 11 , 12 , 13 , and 14 are thermoplastic resin sheets made of polyimide (PI) or a liquid crystal polymer (LCP), for example, as a main material.
  • a metal foil (a Cu foil, for example) is preferably laminated on one of the main surfaces of the insulating base material layers 11 , 12 , 13 , and 14 in a collective substrate state, and the metal foil is patterned by photolithography, for example.
  • the mounting electrodes P 1 and P 2 and the first auxiliary patterns 41 A and 41 B are provided on the surface of the insulating base material layer 11
  • the coil conductor 31 is provided on the surface of the insulating base material layer 12
  • the coil conductor 32 is provided on the surface of the insulating base material layer 13
  • the coil conductor 33 is provided on the surface of the insulating base material layer 14 .
  • a step of forming the mounting electrodes P 1 and P 2 and the first auxiliary patterns 41 A and 41 B on the surface (the surface of the insulating base material layer as the first main surface of the stacked body) of the insulating base material layer 11 is an example of the “conductor pattern forming step”.
  • the plurality of insulating base material layers 11 , 12 , and 13 include interlayer connection conductors V 1 , V 2 , V 3 , and V 4 , respectively.
  • the interlayer connection conductors V 1 , V 2 , V 3 , and V 4 are provided by forming a through hole in the insulating base material layers 11 to 13 with a laser or any other suitable method, for example, then providing the through hole with a conductive paste preferably including, for example, one or more of Cu, Sn, and the like or an alloy including one or more of Cu, Sn, and the like, and then curing the conductive paste through the subsequent heating and pressing. Therefore, the interlayer connection conductors V 1 to V 4 are preferably made of a material having a melting point (a melting temperature) lower than the temperature of the subsequent heating and pressing, for example.
  • the insulating base material layers 14 , 13 , 12 , and 11 are stacked in this order. Subsequently, the stacked insulating base material layers 11 to 14 are heated and pressed (collectively pressed) in a stacking direction (the Z-axis direction) in which the plurality of insulating base material layers 11 , 12 , 13 , and 14 are stacked to form a stacked body 10 in the collective substrate state.
  • a step of forming a stacked body 10 by stacking the plurality of insulating base material layers 11 to 14 and heating and pressing the stacked insulating base material layers 11 to 14 after the “conductor pattern forming step” is an example of the “stacked body forming step”.
  • a multilayer substrate that significantly reduces or prevents the positional shift of the mounting electrode at the time of forming the stacked body is able to be easily manufactured.
  • the stacked body 10 is able to be easily formed by collectively pressing the stacked insulating base material layers 11 , 12 , 13 , and 14 . Therefore, the number of steps of manufacturing the multilayer substrate 101 is reduced, and the cost is able to be reduced to a low level.
  • FIG. 3 is a cross-sectional view showing a portion in which the multilayer substrate 101 and a mounting substrate 201 are bonded, the portion being included in an electronic device 301 according to the first preferred embodiment.
  • the electronic device 301 includes a multilayer substrate 101 , a mounting substrate 201 , and an insulating anisotropic conductive film 1 .
  • the multilayer substrate 101 and other components are mounted on a mounting surface S 1 of the mounting substrate 201 .
  • Other chip components and the like are also mounted on the mounting surface S 1 of the mounting substrate 201 , although the illustration is omitted.
  • the first main surface VS 1 of the multilayer substrate 101 faces the mounting surface S 1 of the mounting substrate 201 while interposing the insulating anisotropic conductive film 1 between the multilayer substrate 101 and the mounting substrate 201 .
  • the mounting substrate 201 is preferably a glass epoxy substrate, for example.
  • the insulating anisotropic conductive film (Anisotropic Conductive Film: ACF) 1 is provided by forming, into a film shape, a semi-cured prepreg resin sheet in which fine conductive particles are dispersed.
  • the insulating anisotropic conductive film 1 has conductivity in a thickness direction at a portion to which a pressure greater than or equal to a predetermined pressure is applied at the time of pressurizing and of which the film thickness is reduced.
  • a plurality of bonding electrodes 61 and 62 are provided on the mounting surface S 1 of the mounting substrate 201 .
  • a portion of the mounting surface S 1 of the mounting substrate 201 , the portion including the bonding electrodes 61 and 62 is a convex portion protruding farther than other portions.
  • a portion of the first main surface VS 1 of the stacked body 10 , the portion including the mounting electrodes P 1 and P 2 and the first auxiliary patterns 41 A and 41 B, is a convex portion protruding farther than other portions.
  • the mounting electrode P 1 and the bonding electrode 61 face each other, and the mounting electrode P 2 and the bonding electrode 62 face each other.
  • the multilayer substrate 101 and the mounting substrate 201 are connected to each other while interposing the insulating anisotropic conductive film 1 between the multilayer substrate 101 and the mounting substrate 201 .
  • the mounting electrode P 1 is electrically connected to the bonding electrode 61 through a connection conductor CL 1
  • the mounting electrode P 2 is electrically connected to the bonding electrode 62 through a connection conductor CL 2 .
  • the connection conductor CL 1 is a portion interposed between the mounting electrode (a portion projecting from the first main surface VS 1 ) P 1 and the bonding electrode (a portion projecting from the mounting surface S 1 ) 61 and electrically conducted when the insulating anisotropic conductive film 1 is partially pressurized.
  • the connection conductor CL 2 is a portion interposed between the mounting electrode P 2 and the bonding electrode 62 and electrically conducted when the insulating anisotropic conductive film 1 is partially pressurized.
  • the electronic device 301 (the structure in which the multilayer substrate 101 is mounted) according to the first preferred embodiment of the present invention, the following advantageous effects are obtained.
  • the mounting electrodes P 1 and P 2 provided on the first main surface VS 1 and the bonding electrodes 61 and 62 provided on the mounting surface S 1 of the mounting substrate 201 are connected to each other through the insulating anisotropic conductive film 1 .
  • a portion of the insulating anisotropic conductive film 1 interposed between the mounting electrode (P 1 , P 2 ) and the bonding electrode ( 61 , 62 ) is electrically conducted by the pressure applied when the mounting substrate 201 , the insulating anisotropic conductive film 1 , and the multilayer substrate 101 are stacked and pressurized, so that the mounting electrode and the bonding electrode are easily electrically connected to each other.
  • the conductive bonding material is wetly spread, so that the mounting electrode and the first auxiliary pattern adjacent to or in a vicinity of the mounting electrode are short-circuited (electrically connected), and a change in characteristics may occur.
  • the first preferred embodiment only the portion of the insulating anisotropic conductive film 1 interposed between the mounting electrode (a portion projecting from the first main surface VS 1 ) and the bonding electrode (a portion projecting from the mounting surface S 1 ) is electrically conducted, so that the insulation between the mounting electrode and the first auxiliary pattern that are adjacent to or in a vicinity of each other is easy.
  • the present invention is not limited to such a structural arrangement.
  • the multilayer substrate 101 may be connected to the mounting substrate 201 through the conductive bonding material (solder, for example).
  • a protective layer for example, a cover lay film or a solder resist film may be provided on the first main surface VS 1 or the second main surface VS 2 of the stacked body 10 .
  • the protective film in a case in which a protective film is provided on the first main surface VS 1 of the stacked body 10 , in a plan view of the first main surface VS 1 (when viewed in the Z-axis direction), the protective film preferably does not overlap with the first auxiliary patterns 41 A and 41 B.
  • a portion in which the first auxiliary patterns 41 A and 42 B and the protective film are provided may become a convex portion protruding farther than the mounting electrodes P 1 and P 2 , and connection between the multilayer substrate 101 using the insulating anisotropic conductive film 1 and the mounting substrate 201 becomes difficult.
  • the electronic device 301 (the structure in which the multilayer substrate 101 is mounted) according to the first preferred embodiment is manufactured by, for example, the following manufacturing method.
  • a mounting substrate 201 including a mounting surface S 1 on which bonding electrodes 61 and 62 are provided is prepared.
  • a portion on which the bonding electrodes 61 and 62 are provided is a convex portion protruding farther than other portions of the mounting surface S 1 .
  • an insulating anisotropic conductive film 1 is stacked on the mounting surface S 1 (at least on the bonding electrodes 61 and 62 ) of the mounting substrate 201 .
  • a step of placing the insulating anisotropic conductive film 1 on a surface of the bonding electrode 61 , 62 being a convex portion protruding farther than at least other portions of the mounting surface S 1 is an example of the “anisotropic element placing step”.
  • a multilayer substrate 101 is prepared. Then, the multilayer substrate 101 is stacked on the mounting surface S 1 of the mounting substrate 201 so that the mounting electrode (P 1 , P 2 ) may face the bonding electrode ( 61 , 62 ) while interposing the insulating anisotropic conductive film 1 between the multilayer substrate 101 and the mounting substrate 201 .
  • a step of stacking the multilayer substrate 101 on the mounting surface S 1 of the mounting substrate 201 so that the mounting electrodes may face the bonding electrodes while interposing the insulating anisotropic conductive film 1 between the multilayer substrate 101 and the mounting substrate 201 after the “anisotropic element placing step” is an example of the “multilayer substrate placing step”.
  • the multilayer substrate 101 and the mounting substrate 201 are heated and pressed in a stacking direction (the Z-axis direction in FIG. 3 ) in which the multilayer substrate 101 and the mounting substrate 201 are stacked on each other.
  • a stacking direction the Z-axis direction in FIG. 3
  • the multilayer substrate 101 and the mounting substrate 201 are stacked on each other.
  • a step of heating and pressing the multilayer substrate 101 and the mounting substrate 201 in the stacking direction and causing the mounting electrode and the bonding electrode to be electrically connected to each other after the “multilayer substrate placing step” is an example of the “heating and pressing step”.
  • a second preferred embodiment of the present invention provides an example in which the shape and number of first auxiliary patterns are different.
  • FIG. 4 A is a plan view of a multilayer substrate 102 A according to the second preferred embodiment of the present invention
  • FIG. 4 B is a plan view of a multilayer substrate 102 B according to the second preferred embodiment of the present invention
  • FIG. 4 C is a plan view of a multilayer substrate 102 C according to the second preferred embodiment of the present invention.
  • first auxiliary patterns 41 A, 41 B, 41 C, 41 D, 41 E, 41 F, 42 A, 42 B, 42 C, and 42 D are indicated by a dot pattern.
  • the multilayer substrate 102 A is different from the multilayer substrate 101 according to the first preferred embodiment in that the multilayer substrate 102 A further includes first auxiliary patterns 41 C and 41 D.
  • first auxiliary patterns 41 C and 41 D first auxiliary patterns
  • the first auxiliary patterns 41 C and 41 D are provided on the first main surface of the stacked body 10 and located adjacent to or in a vicinity of the mounting electrodes P 1 and P 2 .
  • the first auxiliary patterns 41 C and 41 D are linear or substantially linear conductor patterns extending in the X-axis direction.
  • the first auxiliary pattern 41 C is located adjacent to or in a vicinity of a third side (the upper side of the stacked body 10 in FIG. 4 A ) of the stacked body 10
  • the first auxiliary pattern 41 D is located adjacent to or in a vicinity of a fourth side (the lower side of the stacked body 10 in FIG. 4 A ) of the stacked body 10 .
  • a portion (the lower side of the first auxiliary pattern 41 C in FIG. 4 A ) of the first auxiliary pattern 41 C that faces the mounting electrodes P 1 and P 2 has a shape along the outer shape of the mounting electrodes P 1 and P 2 .
  • a portion (the upper side of the first auxiliary pattern 41 D in FIG. 4 A ) of the first auxiliary pattern 41 D that faces the mounting electrodes P 1 and P 2 has a shape along the outer shape of the mounting electrodes P 1 and P 2 .
  • the mounting electrodes P 1 and P 2 includes a portion interposed only between the first auxiliary patterns 41 C and 41 D in the Y-axis direction, when viewed in the Z-axis direction.
  • the multilayer substrate 102 A of the second preferred embodiment of the present invention the following advantageous effects in addition to the advantageous effects described in the first preferred embodiment are obtained.
  • the mounting electrode P 1 is interposed between the first auxiliary pattern 41 A and a different conductor pattern (the mounting electrode P 2 ) in the X-axis direction, and is also interposed between the first auxiliary patterns 41 C and 41 D in the Y-axis direction.
  • the mounting electrode P 2 is interposed between the first auxiliary pattern 41 B and a different conductor pattern (the mounting electrode P 1 ) in the X-axis direction, and is also interposed between the first auxiliary patterns 41 C and 41 D in the Y-axis direction. Therefore, the positional shift of the mounting electrodes P 1 and P 2 at the time of heating and pressing is able to be further significantly reduced or prevented.
  • the mounting electrode preferably includes, for example, a portion interposed only between the first auxiliary patterns.
  • the structure of the mounting electrode being interposed between the first auxiliary patterns adjacent to or in a vicinity of the mounting electrode, compared to the mounting electrode being interposed between the first auxiliary pattern and a different conductor pattern, is able to significantly reduce or prevent a flow of the insulating base material layers adjacent to or in a vicinity of the mounting electrode at the time of heating and pressing. Therefore, the positional shift of the mounting electrode at the time of heating and pressing is able to be significantly reduced or prevented.
  • the multilayer substrate 102 B is different from the multilayer substrate 101 according to the first preferred embodiment in that the multilayer substrate 102 B further includes first auxiliary patterns 41 E and 41 F.
  • first auxiliary patterns 41 E and 41 F the differences from the multilayer substrate 101 according to the first preferred embodiment will be described.
  • the first auxiliary patterns 41 E and 41 F are provided on the first main surface of the stacked body 10 and located adjacent to or in a vicinity of the mounting electrode P 1 .
  • the first auxiliary patterns 41 E and 41 F are linear conductor patterns extending in the Y-axis direction.
  • the first auxiliary pattern 41 E is located on an opposite side (the positive X direction of the mounting electrode P 1 ) of the first auxiliary pattern 41 A while interposing the mounting electrode P 1 between the first auxiliary pattern 41 E and the first auxiliary pattern 41 A.
  • the first auxiliary pattern 41 F is located on an opposite side (the negative X direction of the mounting electrode P 2 ) of the first auxiliary pattern 41 B while interposing the mounting electrode P 2 between the first auxiliary pattern 41 F and the first auxiliary pattern 41 B.
  • a portion (a left side of the first auxiliary pattern 41 E in FIG. 4 B ) of the first auxiliary pattern 41 E that faces the mounting electrode P 1 has a shape along the outer shape of the mounting electrode P 1 .
  • a portion (a right side of the first auxiliary pattern 41 F in FIG. 4 B ) of the first auxiliary pattern 41 F that faces the mounting electrode P 2 has a shape along the outer shape of the mounting electrode P 2 .
  • the mounting electrode P 1 includes a portion interposed only between the first auxiliary patterns 41 A and 41 E in the X-axis direction, when viewed in the Z-axis direction.
  • the mounting electrode P 2 includes a portion interposed only between the first auxiliary patterns 41 B and 41 F in the Y-axis direction, when viewed in the Z-axis direction.
  • the multilayer substrate 102 C is different from the multilayer substrate 101 according to the first preferred embodiment in that the multilayer substrate 102 C includes first auxiliary patterns 42 A, 42 B, 42 C, and 42 D instead of the first auxiliary patterns 41 A and 41 B.
  • first auxiliary patterns 42 A, 42 B, 42 C, and 42 D instead of the first auxiliary patterns 41 A and 41 B.
  • the first auxiliary patterns 42 A and 42 B are conductor patterns that are located adjacent to or in a vicinity of the mounting electrode P 1 and bent in an L shape.
  • the first auxiliary pattern 42 A is located adjacent to or in a vicinity of a first corner portion (an upper left corner of the stacked body 10 in FIG. 4 C ) of the stacked body 10
  • the first auxiliary pattern 42 B is located adjacent to or in a vicinity of a second corner portion (a lower left corner of the stacked body 10 in FIG. 4 C ) of the stacked body 10 .
  • the first auxiliary patterns 42 C and 42 D are conductor patterns that are located adjacent to or in a vicinity of the mounting electrode P 2 and bent in an L shape.
  • the first auxiliary pattern 42 C is located adjacent to or in a vicinity of a third corner portion (an upper right corner of the stacked body 10 in FIG. 4 C ) of the stacked body 10
  • the first auxiliary pattern 42 C is located adjacent to or in a vicinity of a fourth corner portion (a lower right corner of the stacked body 10 in FIG. 4 C ) of the stacked body 10 .
  • the mounting electrode P 1 when viewed in the Z-axis direction, is interposed between the first auxiliary patterns 42 A and 42 B and a different conductor pattern (the mounting electrode P 2 ) in the X-axis direction.
  • the mounting electrode P 1 includes a portion interposed only between the first auxiliary patterns 42 A and 42 B in the Y-axis direction.
  • the mounting electrode P 2 when viewed in the Z-axis direction, is interposed between the first auxiliary patterns 42 C and 42 D and a different conductor pattern (the mounting electrode P 1 ) in the X-axis direction.
  • the mounting electrode P 2 includes a portion interposed only between the first auxiliary patterns 42 C and 42 D in the Y-axis direction.
  • the multilayer substrate 102 C of the second preferred embodiment of the present invention the following advantageous effects in addition to the above-described advantageous effects are obtained.
  • the multilayer substrate 102 C includes first auxiliary patterns 42 A, 42 B, 42 C, and 42 D being conductor patterns bent in an L shape. Accordingly, since the first auxiliary pattern includes a bent portion (a position extending in a plurality of directions), the occurrence of a positional shift of the first auxiliary pattern itself in the plurality of directions at the time of heating and pressing is able to be significantly reduced or prevented.
  • a plurality of first auxiliary patterns may surround a mounting electrode.
  • a plurality of first auxiliary patterns may surround the mounting electrodes P 1 and P 2 .
  • a plurality of first auxiliary patterns may surround the mounting electrodes P 1 and P 2 .
  • the shape of a bent first auxiliary pattern is not limited to an L shape.
  • the shape of the bent first auxiliary pattern may be a C shape, a T shape, a Y shape, a crank shape, or any suitable shape.
  • a third preferred embodiment of the present invention provides an example in which the shape of the mounting electrode and the first auxiliary pattern is different.
  • FIG. 5 A is a plan view of a multilayer substrate 103 A according to the third preferred embodiment of the present invention
  • FIG. 5 B is a plan view of a multilayer substrate 103 B according to the third preferred embodiment.
  • first auxiliary patterns 43 A, 43 B, and 43 C are indicated by a dot pattern.
  • the multilayer substrate 103 A is different from the multilayer substrate 101 according to the first preferred embodiment in that the multilayer substrate 103 A includes mounting electrodes P 1 A and P 2 A and first auxiliary patterns 43 A and 43 B.
  • the differences from the multilayer substrate 101 according to the first preferred embodiment will be described.
  • the mounting electrodes P 1 A and P 2 A are circular conductor patterns provided on the first main surface of the stacked body 10 .
  • the first auxiliary patterns 43 A and 43 B are C-shaped (arc-shaped) conductor patterns provided on the first main surface of the stacked body 10 .
  • the mounting electrode P 1 A and the first auxiliary pattern 43 A are located adjacent to or in a vicinity of a first side (a left side of the stacked body 10 in FIG. 5 A ) of the stacked body 10 .
  • the mounting electrode P 2 A and the first auxiliary pattern 43 B are located adjacent to or in a vicinity of a second side (a right side of the stacked body 10 in FIG. 5 A ) of the stacked body 10 .
  • a portion (a right peripheral end of the first auxiliary pattern 43 A in FIG. 5 A ) of the first auxiliary pattern 43 A that faces the mounting electrode P 1 A has a shape along the outer shape of the mounting electrode P 1 A.
  • a portion (a left peripheral end of the first auxiliary pattern 43 B in FIG. 5 A ) of the first auxiliary pattern 43 B that faces the mounting electrode P 2 A has a shape along the outer shape of the mounting electrode P 2 A.
  • the mounting electrode P 1 A when viewed in the Z-axis direction, is interposed between the first auxiliary pattern 43 A and a different conductor pattern (the mounting electrode P 2 A) in the X-axis direction.
  • the mounting electrode P 1 A includes a portion partially surrounded by only the first auxiliary pattern 43 A in the Y-axis direction.
  • the mounting electrode P 2 A when viewed in the Z-axis direction, is interposed between the first auxiliary pattern 43 B and a different conductor pattern (the mounting electrode P 1 A) in the X-axis direction.
  • the mounting electrode P 2 A includes a portion partially surrounded by only the first auxiliary pattern 43 B in the Y-axis direction.
  • the basic features of the multilayer substrate 103 A are the same as or similar to the features of the multilayer substrate 102 A according to the second preferred embodiment, and the advantageous functions and effects of the multilayer substrate 103 A are the same as or similar to the advantageous functions and effects of the multilayer substrate 102 A.
  • a mounting electrode provided region (the mounting electrodes P 1 A and P 2 A, and a portion interposed between the mounting electrode P 1 A and the mounting electrode P 2 A) including the mounting electrodes P 1 A and P 2 A is interposed between the first auxiliary patterns 43 A and 43 B.
  • the multilayer substrate 103 B is different from the above-described multilayer substrate 103 A in that the multilayer substrate 103 B includes the first auxiliary pattern 43 C instead of the first auxiliary pattern 43 B.
  • the differences from the multilayer substrate 103 A will be described.
  • the first auxiliary pattern 43 C is an arc-shaped conductor pattern provided on the first main surface of the stacked body 10 .
  • the first auxiliary pattern 43 C is located adjacent to or in a vicinity of the second side (the right side of the stacked body 10 in FIG. 5 B ) of the stacked body 10 .
  • a portion (the right peripheral end of the first auxiliary pattern 43 C in FIG. 5 B ) of the first auxiliary pattern 43 C that faces the mounting electrode P 2 A has a shape along the outer shape of the mounting electrode P 2 A.
  • the mounting electrode P 1 A when viewed in the Z-axis direction, includes a portion interposed only between the first auxiliary patterns 43 A and 43 C in the X-axis direction, and includes a portion partially surrounded by only the first auxiliary pattern 43 A in the Y-axis direction.
  • the mounting electrode P 2 A when viewed in the Z-axis direction, includes a portion partially surrounded by only the first auxiliary pattern 43 C in the Y-axis direction.
  • a fourth preferred embodiment of the present invention provides an example in which a single first auxiliary pattern is provided.
  • FIG. 6 A is a plan view of a multilayer substrate 104 according to the fourth preferred embodiment of the present invention
  • FIG. 6 B is a B-B cross-sectional view in FIG. 6 A
  • FIG. 7 is an exploded perspective view of a stacked body 10 included in the multilayer substrate 104 .
  • a first auxiliary pattern 44 is indicated by a dot pattern.
  • the multilayer substrate 104 is different from the multilayer substrate 101 according to the first preferred embodiment in that the multilayer substrate 104 includes a first auxiliary pattern 44 instead of the first auxiliary patterns 41 A and 41 B.
  • first auxiliary pattern 44 instead of the first auxiliary patterns 41 A and 41 B.
  • the first auxiliary pattern 44 is a ring-shaped conductor pattern provided along the outer periphery of the first main surface of the stacked body 10 and surrounding the mounting electrodes P 1 and P 2 .
  • the first auxiliary pattern 44 is located adjacent to or in a vicinity of the mounting electrodes P 1 and P 2 .
  • a portion (an inner peripheral end on the left side of the first auxiliary pattern 44 in FIG. 6 A ) of the first auxiliary pattern that faces the mounting electrode P 1 has a shape along the outer shape of the mounting electrode P 1 .
  • a portion (an inner peripheral end on the right side of the first auxiliary pattern 44 in FIG. 6 A ) of the first auxiliary pattern 44 that faces the mounting electrode P 2 has a shape along the outer shape of the mounting electrode P 2 .
  • the three directions (the negative X direction, the positive Y direction, and the negative Y direction) of the four directions (the positive X direction, the negative X direction, the positive Y direction, and the negative Y direction) of the mounting electrode P 1 are surrounded by the first auxiliary pattern 44 , the four directions being perpendicular or substantially perpendicular to a radial direction from the mounting electrode P 1 .
  • the three directions (the positive X direction, the positive Y direction, and the negative Y direction) of the four directions of the mounting electrode P 2 are surrounded by the first auxiliary pattern 44 , the four directions being perpendicular or substantially perpendicular to a radial direction from the mounting electrode P 2 .
  • the description of “the mounting electrode is surrounded by the first auxiliary pattern” means that one continuous first auxiliary pattern is provided along the outer shape of the mounting electrode.
  • the description of the “three directions of the four directions of the mounting electrode are surrounded by the first auxiliary pattern, the four directions being perpendicular or substantially perpendicular to a radial direction from the mounting electrode” means that one continuous first auxiliary pattern is provided along the outer shape of the mounting electrode over the three directions of the mounting electrode.
  • the multilayer substrate 104 of the fourth preferred embodiment of the present invention the following advantageous effects in addition to the above-described advantageous effects are obtained.
  • the three out of the four directions of the mounting electrodes P 1 and P 2 according to the fourth preferred embodiment are surrounded by the first auxiliary pattern 44 , the four directions being perpendicular or substantially perpendicular to a radial direction from the mounting electrodes P 1 and P 2 .
  • the first auxiliary pattern 44 it is possible to further increase a significant reduction effect of the flow of the insulating base material layers adjacent to or in a vicinity of the mounting electrodes P 1 and P 2 by the first auxiliary pattern at the time of heating and pressing. Therefore, with this structure, the positional shift of the mounting electrodes P 1 and P 2 at the time of heating and pressing is able to be further significantly reduced or prevented.
  • the first auxiliary pattern 44 continuously surrounds the mounting electrodes P 1 and P 2 , so that a flow of the insulating base material layers of the entire mounting surface (the first main surface, the mounting region), in particular, at the time of heating and pressing is significantly reduced or prevented.
  • a fifth preferred embodiment of the present invention provides an example in which all of the four directions of a mounting electrode perpendicular or substantially perpendicular to a radial direction from the mounting electrode are surrounded by a first auxiliary pattern.
  • FIG. 8 A is a plan view of a multilayer substrate 105 A according to the fifth preferred embodiment of the present invention
  • FIG. 8 B is a plan view of a multilayer substrate 105 B according to the fifth preferred embodiment.
  • first auxiliary patterns 44 A, 45 A, and 45 B are indicated by a dot pattern.
  • the multilayer substrate 105 A is different from the multilayer substrate 104 according to the fourth preferred embodiment in that the multilayer substrate 105 A includes a first auxiliary pattern 44 A instead of the first auxiliary pattern 44 .
  • the differences from the multilayer substrate 104 according to the fourth preferred embodiment will be described.
  • the first auxiliary pattern 44 A is a planar conductor pattern provided on the substantially entire first main surface of the stacked body 10 and surrounding the mounting electrodes P 1 and P 2 .
  • the first auxiliary pattern 44 A is located adjacent to or in a vicinity of the mounting electrodes P 1 and P 2 .
  • the first auxiliary pattern 44 A includes a rectangular or substantially rectangular opening at a position corresponding to each of the mounting electrodes P 1 and P 2 .
  • the mounting electrodes P 1 and P 2 are located inside the opening of the first auxiliary pattern 44 A.
  • an area of the first auxiliary pattern 44 A is larger than an area of each mounting electrode (the mounting electrode P 1 or the mounting electrode P 2 ).
  • a width (W 2 ) of the first auxiliary pattern 44 A in the first direction (the X-axis direction) that crosses the mounting electrode P 1 and the first auxiliary pattern 44 A is larger than a width (W 3 ) of the mounting electrode P 1 in the first direction (the X-axis direction).
  • the width of the first auxiliary pattern 44 A in the first direction is larger than the width of the mounting electrode P 2 in the first direction.
  • the multilayer substrate 105 A of the fifth preferred embodiment of the present invention the following advantageous effects in addition to the advantageous effects described in the fourth preferred embodiment are obtained.
  • the area of the first auxiliary pattern 44 A is larger than the area of each mounting electrode.
  • a conductor pattern with a small area easily causes a positional shift due to a flow of the insulating base material layers at the time of heating and pressing. Therefore, according to this structure, the occurrence of a positional shift of the first auxiliary pattern itself at the time of heating and pressing is able to be significantly reduced or prevented.
  • the width (W 2 ) of the first auxiliary pattern 44 A in the first direction is larger than the width (W 3 ) of the mounting electrode P 1 in the first direction (the X-axis direction).
  • the width of the first auxiliary pattern 44 A in the first direction is larger than the width of the mounting electrode P 2 in the first direction.
  • the multilayer substrate 105 B is different from the multilayer substrate 104 according to the fourth preferred embodiment in that the multilayer substrate 105 B includes first auxiliary patterns 45 A and 45 B instead of the first auxiliary pattern 44 .
  • first auxiliary patterns 45 A and 45 B instead of the first auxiliary pattern 44 .
  • the first auxiliary pattern 45 A is a ring-shaped conductor pattern provided on the first main surface of the stacked body 10 and surrounding the mounting electrode P 1 .
  • the first auxiliary pattern 45 A is located adjacent to or in a vicinity of the mounting electrode P 1 .
  • the first auxiliary pattern 45 B is a ring-shaped conductor pattern provided on the first main surface of the stacked body 10 and surrounding the mounting electrode P 2 .
  • the first auxiliary pattern 45 B is located adjacent to or in a vicinity of the mounting electrode P 2 .
  • the first auxiliary pattern 45 A that surrounds the mounting electrode P 1 and the first auxiliary pattern 45 B that surrounds the mounting electrode P 2 are electrically independent from each other, so that, even when the mounting electrode P 1 and the first auxiliary pattern 45 A, or the mounting electrode P 2 and the first auxiliary pattern 45 B, are accidentally electrically connected to each other, short-circuiting hardly occurs.
  • a sixth preferred embodiment of the present invention provides an example of a multilayer substrate further including a second auxiliary pattern.
  • FIG. 9 A is a plan view of a multilayer substrate 106 according to the sixth preferred embodiment of the present invention
  • FIG. 9 B is a C-C cross-sectional view in FIG. 9 A
  • FIG. 10 is an exploded perspective view of a stacked body 10 included in the multilayer substrate 106 .
  • a first auxiliary pattern 44 and second auxiliary patterns 51 , 52 , and 53 are indicated by a dot pattern.
  • the multilayer substrate 106 is different from the multilayer substrate 104 according to the fourth preferred embodiment in that the multilayer substrate 106 further includes second auxiliary patterns 51 , 52 , and 53 , and interlayer connection conductors V 11 , V 12 , and V 13 .
  • the differences from the multilayer substrate 104 according to the fourth preferred embodiment will be described.
  • the second auxiliary patterns 51 , 52 , and 53 are conductor patterns provided inside the stacked body 10 .
  • the interlayer connection conductors V 11 , V 12 , and V 13 are conductors provided inside the stacked body 10 .
  • the second auxiliary patterns 51 , 52 , and 53 are preferably conductor patterns such as Cu foil, for example. It is to be noted that the second auxiliary patterns 51 , 52 , and 53 as well as the first auxiliary pattern 44 are not electrically connected to the mounting electrodes P 1 and P 2 .
  • the stacked body 10 includes a plurality of insulating base material layers 14 , 13 , 12 , and 11 made of a resin as a main material and stacked in this order.
  • the mounting electrodes P 1 and P 2 and the first auxiliary pattern 44 are provided on a surface of the insulating base material layer 11 .
  • the mounting electrodes P 1 and P 2 are the same or substantially the same as the mounting electrodes described in the first preferred embodiment, and the first auxiliary pattern 44 is the same or substantially the same as the first auxiliary pattern described in the fourth preferred embodiment.
  • the coil conductor 31 and the second auxiliary pattern 51 are provided on a surface of the insulating base material layer 12 .
  • the second auxiliary pattern 51 is a ring-shaped conductor pattern provided along the outer periphery of the insulating base material layer 12 and surrounding the coil conductor 31 .
  • the coil conductor 31 is the same or substantially the same as the coil conductor described in the first preferred embodiment.
  • the coil conductor 32 and the second auxiliary pattern 52 are provided on a surface of the insulating base material layer 13 .
  • the second auxiliary pattern 52 is a ring-shaped conductor pattern provided along the outer periphery of the insulating base material layer 13 and surrounding the coil conductor 32 .
  • the coil conductor 32 is the same or substantially the same as the coil conductor described in the first preferred embodiment.
  • the coil conductor 33 and the second auxiliary pattern 53 are provided on a surface of the insulating base material layer 14 .
  • the second auxiliary pattern 53 is a ring-shaped conductor pattern provided along the outer periphery of the insulating base material layer 14 and surrounding the coil conductor 33 .
  • the coil conductor 33 is the same or substantially the same as the coil conductor described in the first preferred embodiment.
  • the first auxiliary pattern 44 is connected to the second auxiliary patterns 51 , 52 , and 53 through the interlayer connection conductors V 11 , V 12 , and V 13 .
  • the first auxiliary pattern 44 is connected to the second auxiliary pattern 51 through the interlayer connection conductor V 11 provided in the insulating base material layer 11 .
  • the second auxiliary pattern 51 is connected to the second auxiliary pattern 52 through the interlayer connection conductor V 12 provided in the insulating base material layer 12 .
  • the second auxiliary pattern 52 is connected to the second auxiliary pattern 53 through the interlayer connection conductor V 13 provided in the insulating base material layer 13 .
  • the second auxiliary patterns 51 , 52 , and 53 when viewed in the Z-axis direction, surround an inner layer pattern (the coil conductors 31 , 32 , and 33 ).
  • the multilayer substrate 106 of the sixth preferred embodiment of the present invention the following advantageous effects in addition to the advantageous effects described in the fourth preferred embodiment are obtained.
  • the second auxiliary patterns 51 , 52 , and 53 surround an inner layer pattern (the coil conductors 31 , 32 , and 33 ) are provided inside the stacked body 10 .
  • an excessive flow of the insulating base material layers inside the stacked body at the time of heating and pressing is able to be significantly reduced or prevented by the second auxiliary pattern. Therefore, the positional shift of the inner layer pattern at the time of heating and pressing is significantly reduced or prevented, and the change in stray capacitance or the change in characteristics due to the positional shift of the inner layer pattern is able to be significantly reduced or prevented.
  • the second auxiliary patterns 51 , 52 , and 53 respectively provided in the plurality of insulating base material layers 12 , 13 , and 14 are connected by the interlayer connection conductors V 12 and V 13 . According to this structure, a positional shift of the second auxiliary patterns 51 , 52 , and 53 themselves at the time of heating and pressing is able to be significantly reduced or prevented, so that the positional shift of the inner layer pattern at the time of heating and pressing is further significantly reduced or prevented.
  • the first auxiliary pattern 44 and the second auxiliary patterns 51 , 52 , and 53 are connected by the interlayer connection conductors V 11 , V 12 , and V 13 .
  • the positional shift of the first auxiliary pattern 44 and the second auxiliary patterns 51 , 52 , and 53 at the time of heating and pressing is able to be further significantly reduced or prevented. Therefore, the positional shift of the mounting electrodes P 1 and P 2 and the inner layer pattern at the time of heating and pressing is able to be further significantly reduced or prevented.
  • the structure in which the first auxiliary pattern 44 surrounds the mounting electrodes P 1 and P 2 are connected to the second auxiliary patterns 51 , 52 , and 53 surrounding the inner layer pattern is preferable, for example.
  • the shape of the second auxiliary pattern is not limited to this structure.
  • the shape of the second auxiliary pattern is able to be appropriately changed within the scope of advantageous functions and effects of the preferred embodiments of the present invention, and may be a linear or substantially linear shape, a C shape, a Y shape, a T shape, a circle, an ellipse shape, a polygon, or the like, for example.
  • the second auxiliary pattern is preferably, for example, a ring-shaped conductor pattern surrounding the inner layer pattern.
  • the present invention is not limited to this structure.
  • the shape of the stacked body 10 is able to be appropriately changed within the scope of advantageous functions and effects of the preferred embodiments of the present invention.
  • the planar shape of the stacked body 10 may be a polygon, a circle, an ellipse, a crank shape, a T shape, a Y shape, or the like, for example.
  • each of the above described preferred embodiments of the present invention provides an example of the stacked body 10 provided by stacking four insulating base material layers 11 , 12 , 13 , and 14 on one another, the present invention is not limited to this structure.
  • the number of layers of the insulating base material layers to provide the stacked body 10 is able to be appropriately changed within the scope of advantageous functions and effects of the preferred embodiments of the present invention.
  • the present invention is not limited to this structure.
  • the plurality of insulating base material layers may be a thermosetting resin.
  • the stacked body is easily provided by collectively pressing, so that the number of steps of manufacturing a multilayer substrate is reduced, and the cost is able to be reduced to a low level.
  • the arrangement, the shape, the size, the number, and other parameters of the mounting electrode and the first auxiliary pattern are not limited to the example in each of the above described preferred embodiments, and are able to be appropriately changed within the scope of advantageous functions and effects of the present invention.
  • each of the above described preferred embodiments of the present invention provides an example in which the coil 3 having a rectangular helical shape or a substantially rectangular helical shape of more than about two turns including the winding axis AX in the stacking direction (the Z-axis direction) of the plurality of insulating base material layers is provided, the shape, the number of turns, and other parameters of the coil are not limited to this structure.
  • the outer shape, the specific structural features, and the number of turns of the coil are able to be appropriately changed within the scope of advantageous functions and effects of the preferred embodiments of the present invention.
  • the outer shape (the outer shape of the coil viewed in the direction of the winding axis AX) of the coil may not be limited to a rectangle, and may be a circle, an ellipse, or the like, for example.
  • the winding axis AX of the coil does not necessarily extend in the stacking direction (the Z-axis direction), and may extend in the X-axis direction or in the Y-axis direction, for example.
  • the stacked body 10 may include a capacitor defined by a conductor pattern, various types of transmission lines (a strip line, a microstrip line, a coplanar line, for example), or various types of filters (a low pass filter, a high pass filter, a band pass filter, a band elimination filter, for example).
  • the “inner layer pattern” according to the present invention is not limited only to the coil conductor.
  • a conductor pattern other than the mounting electrode and the first auxiliary pattern may be provided on the surface of the stacked body 10 .
  • a chip component such as a chip inductor or a chip capacitor may be mounted in contact with the stacked body 10 . Further, the chip component may be embedded inside the stacked body 10 .

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Coils Or Transformers For Communication (AREA)
US16/879,815 2017-11-30 2020-05-21 Multilayer substrate, multilayer substrate mounting structure, method of manufacturing multilayer substrate, and method of manufacturing electronic device Active 2038-12-11 US11540393B2 (en)

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